Sensor device and associated manufacturing method

Abstract

The invention relates to a sensor device and an associated manufacturing method. The sensor device comprises a current conductor having a recess, the current conductor being designed to conduct a current. The sensor device further comprises a magnetic field sensor chip which is arranged on the mounting surface of the current conductor in the recess and is designed to detect a magnetic field generated by the current. The current conductor and the magnetic field sensor chip are electrically isolated from each other.

Description

TECHNICAL FIELD

[0001] The present invention relates to a sensor device and to a method for manufacturing a sensor device. BACKGROUND

[0002] Magnetic field sensors can be used to measure the strength of a current flowing through an electrically conductive track (or current conductor). In some cases, the electrically conductive track can be part of a conductor frame in which the magnetic field sensor is arranged. The electrically conductive track and the magnetic field sensor can here be embedded in a packaging material.

[0003] Manufacturers and developers of sensor devices are continuously striving to improve their products. It can be of interest here to provide a smaller and less expensive solution than is known. It can also be of interest to provide a suitable method for manufacturing such a sensor device. SUMMARY

[0004] Various aspects relate to a sensor device. The sensor device comprises an electric current conductor having a recess, wherein the electric current conductor is designed for guiding an electric current. The sensor device further comprises a magnetic field sensor chip arranged in the recess on a mounting face of the electric current conductor and designed for detecting a magnetic field generated by the electric current. The electric current conductor and the magnetic field sensor chip are electrically isolated from each other.

[0005] Various aspects relate to a method for manufacturing a sensor device. The method comprises forming an electric current conductor having a recess, wherein the electric current conductor is designed for guiding an electric current. The method further comprises arranging a magnetic field sensor chip in the recess on a mounting face of the electric current conductor, wherein the magnetic field sensor chip is designed for detecting a magnetic field generated by the electric current. The electric current conductor and the magnetic field sensor chip are electrically isolated from each other.

[0006] Further features and advantages of the present invention will become apparent to those skilled in the art from a review of the following detailed description and the appended claims, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0007] The present invention is illustrated schematically and non-limitingly in the accompanying drawings. Like numerals refer to like or similar elements throughout. The elements in the drawings are not necessarily to scale with each other. Features of the various examples shown can be combined, unless they are mutually exclusive.

[0008] Figure 1 A cross-sectional view showing a side of a sensor device 100 according to the present invention is shown.

[0009] Figure 2 A top view of a sensor device 200 according to the present invention is shown.

[0010] Figure 3 A top view of a sensor device 300 according to the present invention is shown.

[0011] Figure 4 A perspective view of a sensor device 400 according to the application is shown.

[0012] Figure 5 A cross-sectional view of a side of a sensor device 500 according to the application is shown.

[0013] Fig. 6 comprises Figure 6A and Figure 6B which show a top view or a bottom view of a sensor device 600 according to the application.

[0014] Fig. 7 comprises Figure 7A and Figure 7B which show a top view or a bottom view of a sensor device 700 according to the application.

[0015] Fig. 8 comprises Figure 8A and Figure 8B which show a top view or a bottom view of a sensor device 800 according to the application.

[0016] Fig. 9 comprises Figure 9A and Figure 9B which show a top view or a bottom view of a sensor device 900 according to the application.

[0017] Figure 10 A concept for measuring an electric current by means of a sensor device 1000 according to the application is illustrated.

[0018] Figure 11 A flow chart of a method for manufacturing a sensor device according to the application is shown. DETAILED DESCRIPTION

[0019] Figure 1 The sensor device 100 of Fig. 1 can have a current conductor 2 with a recess 4, wherein the current conductor 2 can be designed for conducting an electric current (or a measurement current) 6. The current conductor 2 can also be referred to as a conductive track in some cases. Furthermore, the sensor device 100 can have a magnetic field sensor chip 8 which is arranged on a mounting face 10 of the current conductor 2 in the recess 4 and can be designed for detecting a magnetic field generated by the electric current 6. The current conductor 2 and the magnetic field sensor chip 8 can be electrically isolated from each other. The sensor device 100 can be designed for measuring an intensity of the electric current 6. An exemplary non-limiting measurement concept is described in connection with Fig. 2. Figure 10

[0020] ​The magnetic field sensor chip 8 can comprise any semiconductor material, such as silicon or made therefrom. The magnetic field sensor chip 8 can be an integrated circuit, and thus may also be referred to as a magnetic field sensor IC. In the example shown, the magnetic field sensor chip 8 can be, in particular, an unpackaged bare die, which is not necessarily disposed in a housing, but can be used without such a housing. In this specification, the terms "bare die," "chip," "semiconductor bare die," and "semiconductor chip" are used interchangeably. In the example shown, the magnetic field sensor chip 8 can be secured to the mounting surface 10 of the current conductor 2 by an adhesive layer 18. The adhesive layer 18 can be electrically insulating to provide electrical isolation between the current conductor 2 and the magnetic field sensor chip 8. In the example, the adhesive layer 18 can be implemented as an adhesive layer or an adhesive film.

[0021] The magnetic field sensor chip 8 may have one or more electrical contacts 12, which may be arranged on a first surface 14A of the magnetic field sensor chip 8. In some examples, the first surface 14A may be referred to as the front side of the magnetic field sensor chip 8. In the illustrated case, the first surface 14A with the electrical contacts 12 arranged therein may face away from the mounting surface 10 of the current conductor 2. The electrical contacts 12 may be electrically coupled to the internal electronic structure of the magnetic field sensor chip 8, that is, the electronic structure may be electrically contacted through the electrical contacts 12. Furthermore, in the illustrated case, the magnetic field sensor chip 8 may not have electrical contacts on a second surface 14B facing the mounting surface 10. In some examples, the second surface 14B may be referred to as the rear side of the magnetic field sensor chip 8.

[0022] The magnetic field sensor chip 8 may have one or more sensor elements 16 disposed on its first surface 14A. In the illustrated case, an exemplary and non-limiting number of two sensor elements 16 is shown. Here, the magnetic field sensor chip 8 may, for example, be a differential magnetic field sensor chip, whose functional combination Figure 10The magnetic field sensor chip 8 or its sensor element 16 is described. Each sensor element 16 can be designed to detect the magnetic field present at the location of the corresponding sensor element 16. It should be noted that the magnetic field sensor chip 8 or its sensor element 16 is not necessarily limited to a specific or single sensor technology. The sensor element 16 can be implemented, for example, as a Hall sensor element, a magnetoresistive sensor element, a vertical Hall sensor element, or a fluxgate sensor element. The magnetoresistive xMR sensor element can be an AMR (anisotropic magnetoresistive) sensor element, a GMR (giant magnetoresistive) sensor element, or a TMR (tunneling magnetoresistive) sensor element. In the example shown, the corresponding sensor element 16 can be specifically designed to detect the magnetic field component extending perpendicular to the front side 14A of the magnetic field sensor chip 8. In this case, the corresponding sensor element 16 can be sensitive in the z-direction, for example, that is, it can be designed to detect the magnetic field component in the z-direction. Alternatively, the sensor element 16 can also be sensitive with respect to other spatial directions. The measurement signal based on the detected magnetic field component can be output by the sensor device 100 to an external component (not shown), for example, via electrical contact 12.

[0023] In the example shown, the electrical contact 12 and sensor element 16 can be arranged on a first surface 14A facing away from the mounting surface 10. In another example, at least one (or all) of the sensor elements 16 can be arranged on a second surface 14B of the magnetic field sensor chip 8 facing the mounting surface 10. In this case, the magnetic field sensor chip 8 can have one or more electrical connections (not shown) extending from the first surface 14A to the second surface 14B, and the sensor element 16 on the rear side 14B can be electrically connected to the electrical contact 12 on the front side 14A. Thus, the measurement signal provided by the sensor element 16 can be guided downward to the electrical contact 12 via the electrical connection. Such an electrical connection can be, for example, a TSV (Through Silicon Via), which can extend through the semiconductor material of the magnetic field sensor chip 8. If the magnetic field sensor chip 8 is embedded in a package material, then the electrical connection can at least partially extend through the package material. When the sensor element 16 is arranged on the rear side 14B, the sensor element 16 can be arranged closer to the current conductor 2, where the magnetic field generated by the current 6 can have a stronger value, thereby obtaining improved measurement results. On the other hand, the additional necessary electrical connections (e.g., TSV) can make the manufacture of the sensor device 100 more complex and / or more expensive.

[0024] The current conductor 2 can be made of a material that, on the one hand, has good electrical conductivity so as to conduct the current 6 sufficiently well. On the other hand, the material of the current conductor 2 can also be suitable for promoting the low-cost and efficient manufacture of the recess 4. The current conductor 2 can, for example, be deep-drawn and / or punched to form the recess 4, that is, the material can, for example, provide suitable elasticity for performing this method step. In some examples, the current conductor 2 can comprise copper, copper alloys, aluminum, aluminum alloys, neosilver, etc., or be made of them.

[0025] The current conductor 2 may have the shape of a bowl or basin, wherein the magnetic field sensor chip 8 may be arranged on the bottom surface of the bowl or basin. In the example shown, the aforementioned bottom surface of the bowl or basin may correspond to or include the mounting surface 10 of the current conductor 2. The magnetic field sensor chip 8 may be completely arranged in the recess 4 of the current conductor 2. The magnetic field sensor chip 8 may be recessed into the recess 4 along its entire height in the z-direction. The dimension of the recess 4 in the z-direction may be larger than the dimension of the magnetic field sensor chip 8 (with or without electrical contacts 12) in the z-direction. The current conductor 2 may extend to and at least partially cover the rear side 14B of the magnetic field sensor chip 8. In this context, the current conductor 2 may also be referred to as a cover or a lid. At least one side of the magnetic field sensor chip 8 and the current conductor 2 may be spaced apart from each other, especially to prevent arcing between these components. Optionally, an electrically insulating material (in Figure 1 (Not shown) can be arranged between at least one side of the magnetic field sensor chip 8 in the recess 4 and the current conductor 2 in order to minimize the risk of electric arc.

[0026] The electrical contacts 12 of the current conductor 2 and the magnetic field sensor chip 8 can be arranged substantially in a common plane, which can also be referred to as the mounting plane (or mounting surface) of the sensor device 100. Specifically, the current input terminal 20 of the current conductor 2, the current output terminal 22 of the current conductor 2, and at least one electrical contact 12 of the magnetic field sensor chip 8 are arranged substantially in the same plane. In this case, the sensor device 100 can be, in particular, an SMD device (surface mount device). In the example shown, the sensor device 100 (or the current conductor 2 and / or the electrical contact 12) can be mechanically and electrically connected to a circuit board (PCB) 24. More precisely, the current input terminal 20 of the current conductor 2, the current output terminal 22 of the current conductor 2, and at least one electrical contact 12 of the magnetic field sensor chip 8 can be mechanically and electrically connected to the conductive structure 26 on the upper side of the circuit board 24. In the non-limiting example shown, soldering material 28 can be used for mechanical or electrical connections. At the respective contact points, the current conductor 2 and / or the electrical contact 12 can be solderable or have solderable surfaces.

[0027] Figure 2 The sensor device 200 can haveFigure 1 Some or all of the features of the sensor device 100. For simplicity, in Figure 2 Not all components of the sensor device 200 are shown, such as those in... Figure 1 The magnetic field sensor chip 8 is shown in the example shown. In the example shown, the magnetic field sensor chip 8 may be a differential magnetic field sensor chip with a first Hall sensor element 16A and a second Hall sensor element 16B. In the non-limiting example shown, sensor elements 16A and 16B may be arranged on the surface of the magnetic field sensor chip 8 facing the mounting surface of the conductive rail 2. In another example, sensor elements 16A and 16B may be arranged on the surface of the magnetic field sensor chip 8 opposite to the mounting surface of the conductive rail 2, for example, in combination with... Figure 1 The following are shown and described. Two Hall sensor elements 16A, 16B can be sensitive in a direction perpendicular to the mounting surface 10 of the current conductor 2 (i.e., in the z-direction, for example, perpendicular to the chip surface). The current conductor 2 can have two slots 30A, 30B in opposite sides of the current conductor 2. The two Hall sensor elements 16A, 16B can be at least partially (and particularly completely) not covered by the current conductor 2 in the locations of the two slots 30A, 30B. In the example shown, the two slots 30A, 30B can be arranged offset from each other (e.g., with respect to the x-direction). Therefore, the current conductor 2 can be constructed in an S-shape, and the current flowing through the current conductor 2 can have an S-shaped trajectory.

[0028] Figure 3 The sensor device 300 may have some or all of the features of the sensor device described above. For simplicity, in Figure 3 Not all components of the sensor device 300 are shown, such as those in... Figure 1 It is shown in the middle. With Figure 2 Unlike other examples, the two slots 30A and 30B of the sensor device 300 can be arranged aligned with each other (e.g., about the x-direction). The current conductor 2 can be constructed in an I-shape, and the current flowing through the current conductor 2 can have a substantially straight direction (e.g., in the x-direction).

[0029] Figure 4 The sensor device 400 may have some or all of the features of the sensor device described above. For simplicity, in Figure 4 Not all components of the sensor device 400 are shown, such as those in... Figure 1The magnetic field sensor chip 8 is shown in the example. In the example shown, the magnetic field sensor chip 8 can be a differential magnetic field sensor chip with a first Hall sensor element 16A and a second Hall sensor element 16B. The two Hall sensor elements 16A and 16B can be sensitive in the vertical direction (i.e., in the z-direction, for example, perpendicular to the chip surface). A current conductor 2 can extend between the two Hall sensor elements 16A and 16B. The current conductor 2 can be configured in a U-shape and extends around the first Hall sensor element 16A. Accordingly, the current 6 flowing through the current conductor 2 can also have a U-shaped orientation.

[0030] Figure 5 The sensor device 500 may have some or all of the features of the sensor device described above. In particular, the sensor device 500 may be at least partially similar to... Figure 1 The sensor device 100 has corresponding components. Accordingly, Figure 1 The implementation plan can also be applied to Figure 5 And for simplicity, this will not be repeated here. In the example shown, the magnetic field sensor chip 8 can be encapsulated in a housing (or package) 32. The surface 14A of the magnetic field sensor chip 8 facing away from the mounting surface 10 of the current conductor 2 may not be covered by the housing 32 or its material. In the example shown, the lower surface of the magnetic field sensor chip 8 and the lower surface of the housing 32 can be substantially in a common plane. The housing 32 with the magnetic field sensor chip 8 embedded therein can be arranged or fixed to the mounting surface 10 of the current conductor 2. Optionally for this purpose, an adhesive layer (not shown) can be arranged between the housing 32 and the mounting surface 10, such as, for example, bonding. Figure 1 As described.

[0031] The housing or encapsulation material 32 may, in particular, comprise or be made of an electrically insulating material. The housing 32 may, for example, comprise or be made of at least one of molding compounds, epoxides, filled epoxides, glass fiber-filled epoxides, imides, thermoplastics, thermosetting polymers, polymer blends, laminates, etc. The housing 32 may be constructed, for example, based on at least one of compression molding, injection molding, powder molding, liquid molding, mapping, lamination, etc. The housing 32 may be designed to protect the components of the sensor device 500 encapsulated within the housing from hazards such as mechanical impact, chemical contamination, and light exposure. The electrically insulating material of the housing 32 may be at least partially disposed between one or more surfaces (especially one or more sides) of the magnetic field sensor chip 8 and the current conductor 2, particularly to prevent arcing between these components. The sensor device 500 may also be referred to as a sensor package.

[0032] The sensor device 600 of Figure 6 may have some or all of the features of the sensor device described above. The sensor device 600 may, for example, be similar to...Figure 1 and Figure 5 One of the sensor devices 100 and 500. Figure 6A and Figure 6B A top or bottom view of the sensor device 600 is shown. In the example shown, the magnetic field sensor chip 8 may be a differential magnetic field sensor chip having a first Hall sensor element 16A and a second Hall sensor element 16B. In the non-limiting example shown, sensor elements 16A and 16B may be arranged on the surface of the magnetic field sensor chip 8 facing the mounting surface of the conductive rail 2. In another example, sensor elements 16A and 16B may be arranged on the surface of the magnetic field sensor chip 8 opposite to the mounting surface of the conductive rail 2, for example, in combination with... Figure 1 and Figure 5 The following are shown and described. Two Hall sensor elements 16A, 16B may be sensitive in a direction perpendicular to the mounting surface 10 of the current conductor 2 (i.e., in the z-direction, for example, perpendicular to the chip surface). The current conductor 2 may have two slots 30A, 30B in opposite sides of the current conductor 2. The two Hall sensor elements 16A, 16B may be at least partially (and especially completely) uncovered by the current conductor 2 in the locations of the two slots 30A, 30B. In the example shown, the two slots 30A, 30B may be arranged aligned with each other (e.g., about the x-direction). The current conductor 2 may be configured as I-shaped, and the current 6 flowing through the current conductor 2 may have a substantially straight direction (e.g., in the x-direction). The current conductor 2 may, for example, be similar to... Figure 3 2. Current-carrying conductor.

[0033] exist Figure 6B The bottom view shows an exemplary and non-limiting number of the three electrical contacts 12 of the magnetic field sensor chip 8. One of the electrical contacts 12 may be designed, for example, to output a (particularly analog) measurement signal of the magnetic field sensor chip 8. The other two electrical contacts may provide, for example, a connector for supplying power and a ground connector. However, it should be noted that in other examples, the number and function of the electrical contacts 12 may be different and may depend on the individual design of the magnetic field sensor chip 8 considered separately.

[0034] The sensor device 700 in Figure 7 may have some or all of the features of the sensor device described above. Figure 7A and Figure 7B A top or bottom view of the sensor device 700 is shown. Unlike the example in Figure 6, the two slots 30A and 30B formed in the current conductor 2 of the sensor device 700 can be arranged offset from each other (e.g., about the x-direction). Therefore, the current conductor 2 can be constructed in an S-shape, and the current 6 flowing through the current conductor 2 can have an S-shaped trajectory. The current conductor 2 can, for example, be similar to... Figure 22. Current-carrying conductor.

[0035] The sensor device 800 in Figure 8 may have some or all of the features of the sensor device described above. Figure 8A and 8B A top or bottom view of the sensor device 800 is shown. In the example shown, the magnetic field sensor chip 8 may contain a single magnetoresistive sensor element 16 (e.g., an AMR sensor element, a GMR sensor element, or a TMR sensor element). The magnetoresistive sensor element 16 may be sensitive in a direction parallel to the mounting surface 10 of the current conductor 2 (e.g., on the side of the chip surface in the xy plane). Figure 8A In the top view, the magnetoresistive sensor element 16 can be (especially completely) covered by the current conductor 2, and is therefore shown in dashed lines.

[0036] The sensor device 900 in Figure 9 may have some or all of the features of the sensor device described above. Figure 9A and 9B A top or bottom view of the sensor device 900 is shown. In the example shown, the magnetic field sensor chip 8 may be a differential magnetic field sensor chip having a first magnetoresistive sensor element 16A and a second magnetoresistive sensor element 16B (e.g., an AMR sensor element, a GMR sensor element, or a TMR sensor element). The magnetoresistive sensor elements 16A and 16B may be sensitive in a direction parallel to the mounting surface 10 of the current conductor 2 (e.g., on the side of the chip surface in the xy plane). Figure 9A As can be seen from the top view, the first magnetoresistive sensor element 16A can be completely covered by the current conductor 2. The second magnetoresistive sensor element 16B may not be completely covered by the current conductor 2.

[0037] Sensor element 16A, positioned below current conductor 2, can measure a relatively large value of the magnetic field component of the side to be detected, while sensor element 16B, positioned beside or not covered by current conductor 2, can measure a very small value of the magnetic field component of the side to be detected. Therefore, the measurement by sensor element 16B contributes relatively little to the overall measurement result. However, when the difference between the two values ​​detected by sensor elements 16A and 16B is formed, a uniform stray magnetic field can be eliminated from the overall measurement result. For example, combining... Figure 10 As described.

[0038] Figure 10An exemplary, non-limiting concept for measuring current using a sensor device 1000 according to the invention is shown. The sensor device 1000 may have a current conductor 2 and a magnetic field sensor chip 8 with two sensor elements 16A, 16B. A magnetic field Hc can be generated in the xz plane by a current 6 flowing in the y-direction. In the example shown, only the induced magnetic field H is shown for simplicity. c A single field line 34. Besides the induced magnetic field H c In addition, stray magnetic fields H may also appear. s (Not shown). Here, the stray magnetic field can in particular be a uniform (or spatially uniform) stray magnetic field H. s Due to its uniformity, the stray magnetic field can be substantially the same at the positions of the two sensor elements 16A and 16B. At the positions of the first sensor element 16A and the second sensor element 16B, a first magnetic field H1 or a second magnetic field H2 can be effectively present, the first magnetic field or the second magnetic field being respectively induced by the magnetic field H through the current 6. c and stray magnetic field H s The vector sum is generated.

[0039] The first sensor element 16A can be designed to detect the z component H of the first magnetic field H1. 1z And output the corresponding signal. In this case, it may be applicable to...

[0040] H 1z =H cz +H sz (1)

[0041] In a similar manner, the second sensor element 16B can be designed to detect the z component H of the second magnetic field H2. 2z And output the corresponding signal. In this case, it may be applicable to...

[0042] H 2z =-H cz +H sz (2)

[0043] It is important to note here that the induced magnetic field H c The z-component is considered with a negative sign in formula (2) (see the upward or downward arrows in sensor elements 16A and 16B). The two sensor elements 16A and 16B can be designed to detect the magnetic field component H. 1z or H 2z The numerical values ​​and symbols.

[0044] By generating the difference between the detected components or the difference between the two output signals, it can be concluded that:

[0045] H 1z -H2z =H cz +H sz -(-H cz +H sz )=2H cz (3)

[0046] As can be seen from formula (3), the uniform stray magnetic field H s For the two detected first components H 1z and H 2z The effect can be seen in the first component H detected in both samples. 1z and H 2z The difference is compensated when it is formed.

[0047] The following ratio can be applied between the intensity I of current 6 and the resulting difference.

[0048] I~H cz (4)

[0049] Therefore, the measured current I can be formed based on the difference between the two detected magnetic field components and determined by the sensor device 1000. Thus, the sensor device 1000 can also be referred to as a current sensor. The required proportionality coefficient can be obtained and considered, for example, when calibrating the sensor device 1000.

[0050] The sensor device described herein according to the invention is technically superior to conventional sensor devices and further provides the features described below.

[0051] The sensor device according to the invention can be constructed in a simple manner from a current conductor and a magnetic field sensor chip mounted therein. Some components used in conventional sensor devices (e.g., bonding wires) can be omitted. Furthermore, in the case of an unpackaged die, additional packaging of the magnetic field sensor chip is not required. Therefore, the design of the sensor device described herein can be greatly simplified compared to conventional sensor devices, thereby reducing production costs.

[0052] As illustrated in the examples above, there is a great deal of freedom in the design of current conductors. Different geometries of current conductors can be achieved in a simple way, for example, through deep drawing and / or punching processes.

[0053] The sensor device according to the present invention is not limited to a specific sensor technology, but can be implemented using different types of magnetic field sensor chips (e.g., xMR, Hall effect).

[0054] The magnetic field sensor chip included in the sensor device described herein can, in particular, have a low structural height, thereby enabling a small distance between the current conductor and the sensor element of the magnetic field sensor chip. Therefore, the sensor element can be placed at a location with high magnetic field strength, allowing for improved measurement results through the sensor device according to the invention.

[0055] Figure 11 A method for manufacturing a sensor device according to the present invention is shown. The method can be used, for example, to manufacture the sensor device described above. The method is described in a general manner to qualitatively illustrate various aspects of the invention. The method can be extended with one or more aspects described in conjunction with other examples discussed herein.

[0056] In step 36, the current conductor may be configured with a recess, wherein the current conductor may be designed to guide current. In step 38, a magnetic field sensor chip may be disposed in the recess on the mounting surface of the current conductor, wherein the magnetic field sensor chip may be designed to detect the magnetic field generated by the current. The current conductor and the magnetic field sensor chip may be electrically isolated from each other.

[0057] Example

[0058] The sensor device and related manufacturing method according to the present invention are then described with reference to examples.

[0059] Example 1 is a sensor device comprising: a current conductor with a recess, wherein the current conductor is designed to conduct current; and a magnetic field sensor chip disposed in the recess on the mounting surface of the current conductor and designed to detect a magnetic field generated by the current, wherein the current conductor and the magnetic field sensor chip are electrically isolated from each other.

[0060] Example 2 is a sensor device according to Example 1, wherein the current conductor has the shape of a bowl or basin, and the magnetic field sensor chip is arranged on the bottom surface of the bowl or basin.

[0061] Example 3 is a sensor device according to Example 1 or 2, wherein the magnetic field sensor chip is completely arranged in the recess of the current conductor.

[0062] Example 4 is a sensor device according to one of the examples above, wherein the current conductor is deep-drawn and / or punched.

[0063] Example 5 is a sensor device according to one of the examples above, wherein the magnetic field sensor chip includes at least one electrical contact disposed on a first surface of the magnetic field sensor chip opposite to the mounting surface, and the magnetic field sensor chip has no electrical contacts on a second surface of the magnetic field sensor chip facing the mounting surface.

[0064] Example 6 is a sensor device according to one of the examples above, wherein the magnetic field sensor chip includes at least one sensor element disposed on a first surface of the magnetic field sensor chip opposite to the mounting surface.

[0065] Example 7 is a sensor device according to one of Examples 1 to 5, wherein the magnetic field sensor chip includes at least one sensor element disposed on a second surface of the magnetic field sensor chip facing the mounting surface.

[0066] Example 8 is a sensor device according to Examples 5 and 7, which further includes: an electrical connection extending from a first surface of the magnetic field sensor chip to a second surface of the magnetic field sensor chip and electrically connecting at least one sensor element to at least one electrical contact.

[0067] Example 9 is a sensor device according to one of the examples above, wherein the current input terminal of the current conductor, the current output terminal of the current conductor, and at least one electrical contact of the magnetic field sensor chip are arranged in the same plane.

[0068] Example 10 is a sensor device according to Example 9, further comprising: a circuit board, wherein at least one electrical contact of a current input terminal of a current conductor, a current output terminal of a current conductor, and a magnetic field sensor chip is mechanically and electrically connected to the circuit board.

[0069] Example 11 is a sensor device according to one of the examples above, wherein the sensor device is an SMD device.

[0070] Example 12 is a sensor device according to one of the examples above, wherein at least one side of the magnetic field sensor chip and the current conductor are spaced apart from each other.

[0071] Example 13 is a sensor device according to one of the examples above, wherein the magnetic field sensor chip is an unpackaged bare die.

[0072] Example 14 is a sensor device according to one of Examples 1 to 12, wherein a magnetic field sensor chip is encapsulated in a housing, the surface of the magnetic field sensor chip facing away from the mounting surface is not covered by the housing, and the housing is arranged on the mounting surface of the current conductor.

[0073] Example 15 is a sensor device according to one of the examples above, wherein the magnetic field sensor chip is a differential magnetic field sensor chip with a first Hall sensor element and a second Hall sensor element, wherein the two Hall sensor elements are sensitive in a direction perpendicular to the mounting surface, the current conductor has two slots in the opposite side of the current conductor, and the two Hall sensor elements are at least partially not covered by the current conductor in the positions of the two slots.

[0074] Example 16 is a sensor device according to Example 15, wherein two slots are arranged aligned with each other and the current conductor is configured in an I-shape.

[0075] Example 17 is a sensor device according to Example 15, wherein two slots are arranged staggered from each other and the current conductor is constructed in an S-shape.

[0076] Example 18 is a sensor device according to one of Examples 1 to 14, wherein the magnetic field sensor chip is a differential magnetic field sensor chip with a first Hall sensor element and a second Hall sensor element, the two Hall sensor elements being sensitive in a direction perpendicular to the mounting surface, and the current conductor being constructed in a U-shape and extending around one of the two Hall sensor elements.

[0077] Example 19 is a sensor device according to one of Examples 1 to 14, wherein the magnetic field sensor chip includes a single magnetoresistive sensor element that is sensitive in a direction parallel to the mounting surface and is completely covered by a current conductor.

[0078] Example 20 is a sensor device according to one of Examples 1 to 14, wherein the magnetic field sensor chip is a differential magnetic field sensor chip with a first magnetoresistive sensor element and a second magnetoresistive sensor element, wherein the two magnetoresistive sensor elements are sensitive in a direction parallel to the mounting surface, the first magnetoresistive sensor element is covered by a current conductor, and the second magnetoresistive sensor element is not covered by a current conductor.

[0079] Example 21 is a method for manufacturing a sensor device, wherein the method includes: forming a current conductor having a recess, wherein the current conductor is designed to conduct current; and arranging a magnetic field sensor chip in the recess on a mounting surface of the current conductor, wherein the magnetic field sensor chip is designed to detect a magnetic field generated by the current, wherein the current conductor and the magnetic field sensor chip are electrically isolated from each other.

[0080] It should be noted that the specification and drawings only illustrate the principles of the proposed methods and apparatus. Those skilled in the art will be able to implement various arrangements (although not explicitly described or shown herein) that embody the principles of the invention and are included within its scope. Furthermore, all examples and embodiments outlined in this document are substantially and explicitly for illustrative purposes only, in order to assist the reader in understanding the principles of the proposed methods and apparatus. In addition, all statements in this document describing the principles, aspects, and embodiments of the invention, as well as specific examples thereof, also include their equivalents.

Claims

1. A sensor arrangement, comprising: a current conductor (2) having a recess (4), wherein the current conductor (2) is designed for conducting an electric current; and a magnetic field sensor chip (8) arranged on a mounting face (10) of the current conductor (2) in the recess (4) and designed for detecting a magnetic field generated by the electric current, wherein the current conductor (2) and the magnetic field sensor chip (8) are electrically isolated from each other.

2. The sensor device of claim 1, wherein, The current conductor (2) has the shape of a bowl or a basin and the magnetic field sensor chip (8) is arranged on a bottom face of the bowl or the basin.

3. The sensor device of claim 1 or 2, wherein, The magnetic field sensor chip (8) is arranged completely in the recess (4) of the current conductor (2).

4. The sensor device according to any one of the preceding claims, wherein, The current conductor (2) is deep-drawn and / or punched.

5. The sensor arrangement according to any one of the preceding claims, wherein the magnetic field sensor chip (8) comprises at least one electrical contact (12) arranged on a first surface (14A) of the magnetic field sensor chip (8) facing away from the mounting face (10), and the magnetic field sensor chip (8) is free of electrical contacts on a second surface (14B) of the magnetic field sensor chip (8) facing the mounting face (10).

6. The sensor device according to any one of the preceding claims, wherein, The magnetic field sensor chip (8) comprises at least one sensor element (16) arranged at a first surface (14A) of the magnetic field sensor chip (8) facing away from the mounting face (10).

7. The sensor device according to any one of claims 1 to 5, wherein, The magnetic field sensor chip (8) comprises at least one sensor element (16) arranged at a second surface (14B) of the magnetic field sensor chip (8) facing the mounting face (10).

8. The sensor device of claims 5 and 7, further comprising: an electrical connection extending from the first surface (14A) of the magnetic field sensor chip (8) to the second surface (14B) of the magnetic field sensor chip (8) and electrically connecting the at least one sensor element (16) with the at least one electrical contact (12).

9. The sensor device according to any one of the preceding claims, wherein, A current input (20) of the current conductor (2), a current output (22) of the current conductor (2) and the at least one electrical contact (12) of the magnetic field sensor chip (8) are arranged in the same plane.

10. The sensor device of claim 9, further comprising: a circuit board (24), wherein the current input (20) of the current conductor (2), the current output (22) of the current conductor (2) and the at least one electrical contact (12) of the magnetic field sensor chip (8) are mechanically and electrically connected with the circuit board (24).

11. The sensor device according to any one of the preceding claims, wherein, The sensor arrangement is an SMD arrangement.

12. The sensor device according to any one of the preceding claims, wherein, At least one side face of the magnetic field sensor chip (8) and the current conductor (2) are spaced apart from each other.

13. The sensor device according to any one of the preceding claims, wherein, The magnetic field sensor chip (8) is an unpackaged die.

14. The sensor device according to any one of claims 1 to 12, wherein, The magnetic field sensor chip (8) is packaged in a housing (32), a surface (14A) of the magnetic field sensor chip (8) facing away from the mounting face (10) is not covered by the housing (32), and the housing (32) is arranged on the mounting face (10) of the current conductor (2).

15. The sensor arrangement according to any of the preceding claims, wherein: the magnetic field sensor chip (8) is a differential magnetic field sensor chip with a first Hall sensor element (16A) and a second Hall sensor element (16B), wherein both the Hall sensor elements (16A, 16B) are sensitive in a direction perpendicular to the mounting face (10), the current conductor (2) has two slots (30A, 30B) at opposite sides of the current conductor (2), and both the Hall sensor elements (16A, 16B) are at least partially uncovered by the current conductor (2) in the position of both the slots (30A, 30B).

16. The sensor device of claim 15, wherein, Both the slots (30A, 30B) are arranged in line with each other, and the current conductor (2) is configured I-shaped.

17. The sensor device of claim 15, wherein, Both the slots (30A, 30B) are arranged staggered with respect to each other, and the current conductor (2) is configured S-shaped.

18. The sensor arrangement according to any of claims 1 to 14, wherein: the magnetic field sensor chip (8) is a differential magnetic field sensor chip with a first Hall sensor element (16A) and a second Hall sensor element (16B), both the Hall sensor elements (16A, 16B) are sensitive in a direction perpendicular to the mounting face (10), and the current conductor (2) is configured U-shaped and extends around one of both the Hall sensor elements (16A, 16B).

19. The sensor device according to any one of claims 1 to 14, wherein, the magnetic field sensor chip (8) comprises a single magnetoresistive sensor element (16) which is sensitive in a direction parallel to the mounting face (10) and is completely covered by the current conductor (2).

20. The sensor arrangement according to any of claims 1 to 14, wherein: the magnetic field sensor chip (8) is a differential magnetic field sensor chip with a first magnetoresistive sensor element (16A) and a second magnetoresistive sensor element (16B), wherein both the magnetoresistive sensor elements (16A, 16B) are sensitive in a direction parallel to the mounting face (10), the first magnetoresistive sensor element (16A) is covered by the current conductor (2), and the second magnetoresistive sensor element (16B) is uncovered by the current conductor (2).

21. A method for manufacturing a sensor device, wherein, The method comprises: forming a current conductor (2) with a recess (4), wherein the current conductor (2) is designed for conducting an electric current; and arranging a magnetic field sensor chip (8) on a mounting face (10) of the current conductor (2) in the recess (4), wherein the magnetic field sensor chip (8) is designed for detecting a magnetic field generated by the electric current, wherein the current conductor (2) and the magnetic field sensor chip (8) are electrically isolated from each other.

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