Vehicle-mounted super computer equipment based on resonance heat transfer cold plate
By incorporating heat dissipation fin assemblies, resonant buffer assemblies, and flow regulation assemblies into the vehicle-mounted supercomputer equipment, the problems of uneven cold plate bonding gaps and insufficient heat transfer fluid supply were solved, achieving efficient resonant heat transfer and stable heat dissipation, thus extending the equipment's lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-04
- Publication Date
- 2026-03-10
AI Technical Summary
Existing resonant heat transfer cold plates are prone to uneven bonding gaps in densely arranged automotive computing modules with varying heights, resulting in low resonant heat transfer efficiency. Furthermore, under harsh operating conditions such as sharp turns and sudden braking, the heat transfer fluid cannot evenly cover the chip heat source, leading to insufficient gaps and heat transfer fluid supply, which affects the resonant heat transfer efficiency of the cold plate.
By setting up heat dissipation fin assemblies, resonant buffer assemblies, and flow stabilization assemblies, and utilizing structures such as heat dissipation chamber vents, butterfly springs, and elastic support columns, smooth airflow, vibration buffering, and uniform heat transfer fluid distribution are ensured. Combined with internal heat transfer plates and loop flow tubes, stable contact and uniform heat transfer are achieved.
It improves the fit between the resonant cold plate and the chip, increases the heat dissipation area, ensures a uniform supply of heat transfer fluid, enhances the resonant heat transfer efficiency and the heat dissipation reliability of the equipment, avoids vibration damage, and extends the equipment life.
Smart Images
Figure CN121635641A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of vehicle-mounted computer cooling plate equipment technology, and in particular to a vehicle-mounted supercomputer equipment based on a resonant heat transfer cooling plate. Background Technology
[0002] In-vehicle supercomputers are high-performance computing platforms integrated inside automobiles. Based on chip technologies from Qualcomm, Horizon Robotics, and others, they integrate multiple functions such as ADAS, autonomous driving, smart cockpit, and infotainment through a central electronic and electrical architecture.
[0003] Resonant heat transfer cold plates are liquid cooling devices that enhance heat transfer efficiency through resonance technology. They are mainly used for active cooling of supercomputer equipment, data center heat dissipation systems, and high-power electronic devices. Their core lies in using microchannel structures and resonance principles to optimize the heat transfer path, improve heat dissipation efficiency, achieve more efficient temperature control, and extend equipment life.
[0004] Most existing resonant heat transfer cold plates directly cover the chip. Due to the height difference and dense layout of the vehicle computing modules, the gap between the cold plates is uneven, resulting in low resonant heat transfer conversion efficiency. At the same time, under harsh conditions such as sharp turns and sudden braking, the heat transfer fluid is difficult to evenly cover the heat source above the chip, resulting in gaps and insufficient supply of heat transfer fluid, which affects the efficiency of resonant heat transfer of the cold plate.
[0005] Therefore, this application provides a vehicle-mounted supercomputer device based on a resonant heat transfer cold plate to meet the requirements. Summary of the Invention
[0006] The technical problem to be solved by this invention is to provide an on-board supercomputer device based on a resonant heat transfer cold plate. This addresses the issue that most existing resonant heat transfer cold plates directly cover the chip, which can easily lead to uneven gaps in the cold plate bonding due to the dense layout of the on-board computing modules at varying heights. This results in low resonant heat transfer conversion efficiency. Furthermore, under harsh operating conditions such as sharp turns and sudden braking, the heat transfer fluid may not be able to evenly cover the heat source above the chip, resulting in gaps and insufficient supply of heat transfer fluid, thus affecting the efficiency of resonant heat transfer of the cold plate.
[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: A vehicle-mounted supercomputer device based on a resonant heat transfer cooling plate includes a computer base, characterized in that a vehicle-mounted base is fixedly connected to the top of the computer base, a front panel is fixedly connected to the front end of the vehicle-mounted base, a rear panel is fixedly connected to the other end of the vehicle-mounted base, a cover plate is provided on the top of the vehicle-mounted base, a heat sink assembly is fixedly connected to the top of the vehicle-mounted base for airflow of the device, and the heat sink assembly is connected to the vehicle-mounted base; a resonant buffer assembly is used to buffer and protect the chip when the device vibrates, and the resonant buffer assembly is connected to the heat sink assembly; and a flow stabilization assembly is used to ensure the stability of heat transfer fluid under resonant conditions, and the flow stabilization assembly is connected to the resonant buffer assembly.
[0008] Optionally, the heat dissipation fin assembly includes a heat dissipation chamber fixedly connected to the top of the vehicle base, the heat dissipation chamber having multiple ventilation holes inside, and multiple heat dissipation fins fixedly connected to both ends of the heat dissipation chamber.
[0009] Optionally, a base plate is movably connected to the bottom of the heat dissipation chamber, locking plates are inserted into both ends of the base plate, and multiple base sleeves are fixedly connected to the top surface of the base plate.
[0010] Optionally, a bolt post is sleeved inside the plurality of base sleeves, a plurality of butterfly springs are sleeved on the surface of the bolt post, a metal plate is inserted into the top of the bolt post, a suspension frame is movably connected to the bottom of the metal plate, a rubber layer is provided on the inner wall of the suspension frame, and the butterfly springs are fixedly connected to the bottom of the suspension frame.
[0011] Optionally, the resonant buffer assembly includes a fixing frame inserted into the surface of the bolt column, the fixing frame having a rectangular hole at its center, a top plate fixedly connected to the center of the fixing frame, and multiple elastic support columns fixedly connected to the bottom of the top plate.
[0012] Optionally, a resonant cold plate is fixedly connected to the bottom of the plurality of elastic support columns, a loop flow tube is provided inside the resonant cold plate, a plurality of metal springs are fixedly connected to the bottom of the resonant cold plate, and a silicone thermal pad is fixedly connected to the bottom of the plurality of metal springs.
[0013] Optionally, an inner heat transfer plate is also inserted into the surface of the bolt column, and a chip is fixedly connected to the top of the inner heat transfer plate. The fixing frame is located at the top of the inside of the suspension frame, and the inner heat transfer plate is located at the bottom of the inside of the suspension frame.
[0014] Optionally, the flow stabilization and adjustment assembly includes multiple connecting brackets fixedly connected inside the loop flow tube, the connecting brackets being arranged one-to-one at both ends inside each pipe of the loop flow tube.
[0015] Optionally, a sleeve is fixedly connected to the end of each of the multiple connecting brackets, a spring is fixedly connected inside the multiple sleeves, and a connecting seat is fixedly connected to the other end of each of the multiple springs.
[0016] Optionally, a sealing tube is sleeved on the surface of the spring, the sealing tube is disposed between the sleeve and the connecting seat, and a flow divider is fixedly connected to the other end of the connecting seat. The surface of the flow divider is provided with multiple fluid holes, and multiple rollers are rotatably connected to the end of the flow divider.
[0017] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: In this embodiment of the invention, by setting up a heat dissipation fin assembly and utilizing multiple ventilation holes inside the heat dissipation chamber, airflow inside the device is ensured. Combined with multiple heat dissipation fins fixed at both ends, the heat dissipation area is increased, accelerating the transfer of heat generated during chip operation to the surrounding air, rapidly reducing the device temperature, and providing heat dissipation assurance for the stable operation of the supercomputer. Simultaneously, the base plate inside the heat dissipation chamber is securely installed via a locking plate. The base sleeve at the top of the base plate engages with the bolt post, and combined with the disc spring fitted onto the surface of the bolt post, the slight loosening gaps in the bolt post can be automatically compensated by the expansion and contraction of the disc spring when the vehicle vibrates. This absorbs and buffers the vibration impact of the vehicle environment, preventing vibration stress from being directly transmitted to the internal chip and other precision components, thus avoiding damage. At the same time, it maintains a stable fit between the metal plate and the suspension frame, laying a stable installation foundation for the efficient operation of the subsequent resonant heat transfer structure.
[0018] By setting up a resonant buffer assembly and using a fixing frame and bolt columns to achieve stable installation, multiple elastic support columns at the bottom of the top plate can provide elastic support for the resonant cold plate, maintaining a stable contact pressure between the resonant cold plate and the chip at all times. This avoids a sharp increase in contact thermal resistance caused by uneven contact pressure, ensuring a smooth resonant heat transfer path. At the same time, multiple metal springs at the bottom of the resonant cold plate can automatically adjust the contact distance according to the unevenness of the chip surface. Combined with a silicone thermal pad, this further fills the tiny gaps, significantly improving the adhesion between the resonant cold plate and the chip surface, ensuring the pressure uniformity of the resonant heat transfer contact surface, and effectively optimizing the resonant heat transfer conversion efficiency. In addition, the inner heat transfer plate is fixedly connected to the chip, which can help absorb the chip's heat and transfer it to the surrounding heat dissipation structure, forming a dual heat transfer guarantee with the resonant cold plate, further improving the reliability of the equipment's heat dissipation.
[0019] By setting up a flow stabilization and adjustment component, and utilizing the connecting frames arranged at opposite ends inside each pipe of the loop flow tube, along with the sleeve, spring, and flow divider plate to form an elastic adjustment structure, when the heat transfer fluid moves in a certain direction due to inertial impact, the flow divider plate can first guide part of the fluid through multiple fluid holes on its surface. At the same time, the rollers at the end roll along the inner wall of the loop flow tube, reducing the frictional resistance between the flow divider plate and the inner wall of the pipe, and avoiding excessive obstruction to the fluid flow. Subsequently, under the impact of the fluid, the flow divider plate drives the connecting seat to compress the spring, and the impact energy is absorbed through the elastic deformation of the spring. After the impact weakens, the spring pushes the flow divider plate with its own elastic force to push the deviated heat transfer fluid back to the original working area, ensuring that the heat transfer fluid in the loop flow tube inside the resonant cold plate is always evenly distributed, ensuring a sufficient supply of heat transfer fluid in the evaporation zone, and guaranteeing the high heat transfer efficiency of the resonant cold plate. Attached Figure Description
[0020] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the invention and, together with the specification, further serve to explain the principles of the invention and enable those skilled in the art to practice and use the invention.
[0021] Figure 1 This is a first-person perspective three-dimensional structural diagram of an onboard supercomputer device based on a resonant heat transfer cold plate.
[0022] Figure 2 This is a second-view three-dimensional structural diagram of an onboard supercomputer device based on a resonant heat transfer cold plate.
[0023] Figure 3 This is a three-dimensional structural diagram of the heat dissipation chamber and heat dissipation fins.
[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the vehicle-mounted base and the base plate.
[0025] Figure 5 This is a magnified three-dimensional structural diagram of the heat sink fin assembly.
[0026] Figure 6 This is a schematic diagram of the three-dimensional structure of the bolt column and the butterfly spring.
[0027] Figure 7 This is a magnified three-dimensional schematic diagram of the resonant buffer component.
[0028] Figure 8 This is a schematic diagram of the three-dimensional structure of the chip and the internal heat transfer plate.
[0029] Figure 9 This is a schematic diagram of the three-dimensional structure of the resonant cold plate and the loop flow tube.
[0030] Figure 10 for Figure 9 A magnified view of A in the middle.
[0031] Figure 11 This is a schematic diagram of a three-dimensional structure consisting of an elastic support column and a resonant cold plate.
[0032] Figure 12 This is a schematic diagram of the three-dimensional structure of the top plate and the elastic support column.
[0033] Figure 13 This is a schematic diagram of the three-dimensional structure of the connecting frame and the loop flow tube.
[0034] Figure 14 This is a magnified three-dimensional structural diagram of the current stabilization and regulation component.
[0035] Reference numerals: 1. Computer base; 2. Vehicle base; 3. Front panel; 4. Rear panel; 5. Cover plate; 6. Heat sink assembly; 61. Heat sink compartment; 62. Heat sink fins; 63. Floating frame; 64. Locking plate; 65. Base plate; 66. Base sleeve; 67. Bolt post; 68. Butterfly spring; 69. Metal plate; 7. Resonance buffer assembly; 71. Fixing bracket; 72. Top plate; 73. Elastic support column; 74. Resonance cold plate; 75. Loop flow tube; 76. Metal spring; 77. Silicone thermal pad; 78. Chip; 79. Internal heat transfer plate; 8. Flow stabilization assembly; 81. Connecting bracket; 82. Sleeve; 83. Spring; 84. Connecting seat; 85. Sealing tube; 86. Diverter plate; 87. Fluid orifice; 88. Roller.
[0036] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation
[0037] The following is a detailed description of a vehicle-mounted supercomputer device based on a resonant heat transfer cold plate provided by the present invention, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments; those skilled in the art can also use other alternative methods to implement some known technologies; and the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.
[0038] like Figures 1 to 14As shown, an embodiment of the present invention provides a vehicle-mounted supercomputer device based on a resonant heat transfer cold plate, including a computer base 1, a vehicle-mounted base 2 fixedly connected to the top of the computer base 1, a front panel 3 fixedly connected to the front end of the vehicle-mounted base 2, a rear panel 4 fixedly connected to the other end of the vehicle-mounted base 2, a cover plate 5 disposed on the top of the vehicle-mounted base 2, a heat sink assembly 6 fixedly connected to the top of the vehicle-mounted base 2, the heat sink assembly 6 being used for airflow of the device, and the heat sink assembly 6 being connected to the vehicle-mounted base 2; a resonant buffer assembly 7, the resonant buffer assembly 7 being used to buffer and protect the chip 78 when the device vibrates, the resonant buffer assembly 7 being connected to the heat sink assembly 6; and a flow stabilization assembly 8, the flow stabilization assembly 8 being used to ensure the stability of the heat transfer fluid under resonant conditions, the flow stabilization assembly 8 being connected to the resonant buffer assembly 7.
[0039] As an implementation method in this embodiment, such as Figures 3 to 6 As shown, the heat dissipation fin assembly 6 includes a heat dissipation chamber 61 fixedly connected to the top of the vehicle base 2. The heat dissipation chamber 61 has multiple ventilation holes inside. Multiple heat dissipation fins 62 are fixedly connected to both ends of the heat dissipation chamber 61. A base plate 65 is movably connected to the bottom of the heat dissipation chamber 61. Locking plates 64 are inserted into both ends of the base plate 65. Multiple base sleeves 66 are fixedly connected to the top surface of the base plate 65. Bolt posts 67 are sleeved inside the multiple base sleeves 66. Multiple butterfly springs 68 are sleeved on the surface of the bolt posts 67. A metal plate 69 is inserted into the top of the bolt posts 67. A suspension frame 63 is movably connected to the bottom of the metal plate 69. A rubber layer is provided on the inner wall of the suspension frame 63. The bottom of the suspension frame 63 is fixedly connected to the butterfly springs 68. The multiple ventilation holes inside the heat dissipation chamber 61 ensure airflow within the equipment. With multiple heat dissipation fins 62 fixed at both ends, the heat dissipation area is increased, accelerating the transfer of heat generated by the chip 78 to the surrounding air during operation, rapidly reducing the device temperature, and providing heat dissipation guarantee for the stable operation of the supercomputer. At the same time, the base plate 65 inside the heat dissipation chamber 61 is securely installed through the locking plate 64. The base sleeve 66 on the top of the base plate 65 cooperates with the bolt post 67, and combined with the butterfly spring 68 sleeved on the surface of the bolt post 67, when the vehicle vibrates, the deformation of the butterfly spring 68 can automatically compensate for the slight loose gap of the bolt post 67, absorb and buffer the vibration impact of the vehicle environment, and avoid the vibration stress being directly transmitted to the internal chip 78 and other precision components, causing damage. At the same time, it maintains the stable fit between the metal plate 69 and the suspension frame 63, laying a stable installation foundation for the efficient operation of the subsequent resonant heat transfer structure.
[0040] As an implementation method in this embodiment, such as Figures 5 to 11As shown, the resonant buffer assembly 7 includes a fixing frame 71 inserted into the surface of the bolt post 67. The center of the fixing frame 71 is a rectangular hole. A top plate 72 is fixedly connected to the center of the fixing frame 71. Multiple elastic support columns 73 are fixedly connected to the bottom of the top plate 72. A resonant cold plate 74 is fixedly connected to the bottom of the multiple elastic support columns 73. A loop flow pipe 75 is provided inside the resonant cold plate 74. Multiple metal springs 76 are fixedly connected to the bottom of the resonant cold plate 74. A silicone thermal pad 77 is fixedly connected to the bottom of the multiple metal springs 76. An inner heat transfer plate 79 is also inserted into the surface of the bolt post 67. A chip 78 is fixedly connected to the top of the inner heat transfer plate 79. The fixing frame 71 is located at the top of the inside of the suspension frame 63, and the inner heat transfer plate 79 is located at the bottom of the inside of the suspension frame 63. The fixing frame 71 and the bolt post 67 cooperate to achieve stability. With fixed installation, multiple elastic support columns 73 at the bottom of the top plate 72 can provide elastic support for the resonant cold plate 74, maintaining a stable contact pressure between the resonant cold plate 74 and the chip 78 at all times. This avoids a sharp increase in contact thermal resistance caused by uneven contact pressure, ensuring a smooth resonant heat transfer path. At the same time, multiple metal springs 76 at the bottom of the resonant cold plate 74 can automatically adjust the contact distance according to the unevenness of the chip 78 surface. Together with the silicone thermal pad 77, they further fill the tiny gaps, greatly improving the adhesion between the resonant cold plate 74 and the chip 78 surface, ensuring the pressure uniformity of the resonant heat transfer contact surface, and effectively optimizing the resonant heat transfer conversion efficiency. In addition, the inner heat transfer plate 79 is fixedly connected to the chip 78, which can help absorb the heat of the chip 78 and transfer it to the surrounding heat dissipation structure, forming a dual heat transfer guarantee with the resonant cold plate 74, further improving the reliability of the equipment's heat dissipation.
[0041] As an implementation method in this embodiment, such as Figures 12 to 14As shown, the flow stabilization and regulation assembly 8 includes multiple connecting frames 81 fixedly connected inside the loop flow pipe 75. The connecting frames 81 are arranged one-to-one at both ends inside each pipe of the loop flow pipe 75. Sleeves 82 are fixedly connected to the ends of the multiple connecting frames 81. Springs 83 are fixedly connected inside the multiple sleeves 82. Connecting seats 84 are fixedly connected to the other ends of the multiple springs 83. Sealing tubes 85 are sleeved on the surface of the springs 83, and are positioned between the sleeves 82 and the connecting seats 84. A flow divider plate 86 is fixedly connected to the other end of the connecting seat 84. Multiple fluid holes 87 are opened on the surface of the flow divider plate 86. Multiple rollers 88 are rotatably connected to the end of the flow divider plate 86. The connecting frames 81 arranged one-to-one inside each pipe of the loop flow pipe 75, in conjunction with the sleeves 82, springs 83, and flow divider plate, provide a smooth flow. The plate 86 forms an elastic adjustment structure. When the heat transfer fluid moves in a certain direction due to inertial impact, the diverter plate 86 can first guide part of the fluid through multiple fluid holes 87 on its surface. At the same time, the rollers 88 at the end roll along the inner wall of the loop flow tube 75 to reduce the frictional resistance between the diverter plate 86 and the inner wall of the pipe, thus avoiding excessive obstruction to the fluid flow. Subsequently, under the impact of the fluid, the diverter plate 86 drives the connecting seat 84 to compress the spring 83. The spring 83 absorbs the impact energy through its elastic deformation. After the impact weakens, the spring 83 pushes the diverter plate 86 with its own elastic force to push the deviated heat transfer fluid back to the original working area, ensuring that the heat transfer fluid in the loop flow tube 75 inside the resonant cold plate 74 is always evenly distributed, ensuring that there is a sufficient supply of heat transfer fluid in the evaporation zone, and ensuring the high heat transfer efficiency of the resonant cold plate 74.
[0042] The working principle of the technical solution provided by this invention is as follows: In use, the device is first placed in the heat dissipation chamber 61 fixed to the top of the vehicle-mounted base 2 via the base plate 65. The base plate 65 is then inserted into the locking plate 64, and the locking plate 64 is locked to the base plate 65. After the cover plate 5 is threadedly connected to the top of the heat dissipation chamber 61, the vehicle-mounted supercomputer device is started. At this time, as the computer device starts, the heat dissipation fin assembly 6 begins to operate. When the vehicle is in motion, the vibration of the vehicle causes the bolt post 67 at the top of the base sleeve 66 to show a slight loosening tendency. The disc spring 68 sleeved on the surface of the bolt post 67 begins to retract and expand, automatically releasing the deformation of the bolt post 67. During operation, vibrations and loosening are dynamically compensated for, resulting in small gaps. This effectively absorbs and buffers vibrations and impacts from the vehicle environment, preventing stress from being directly transmitted to the chip 78. It also maintains the fit between the metal plate 69 inserted at the top of the bolt column 67 and the suspension frame 63, and constantly maintains the fit between the resonant cold plate 74 in the suspension frame 63 and the chip 78, keeping the clamping force stable. At the same time, when the chip 78 is transferring heat, the heat dissipation chamber 61 can effectively transfer heat, and the heat dissipation area is increased by the heat dissipation fins 62, accelerating the transfer of heat from the device to the surrounding air, thereby reducing the temperature of the device chip 78 and improving the heat dissipation effect.
[0043] When the disc spring 68 effectively absorbs and buffers vibrations and impacts from the vehicle environment, the resonant buffer assembly 7 begins to operate. At this time, the top plate 72, which is inserted into the fixing bracket 71 on the surface of the bolt column 67, works in conjunction with the elastic support column 73 to keep the resonant cold plate 74 in contact with the chip 78 at all times, maintaining contact pressure under the relative environment and avoiding uneven contact pressure that would lead to a sharp increase in contact thermal resistance. At the same time, as the resonant cold plate 74 and the chip 78 are in contact, the multiple metal springs 76 fixedly connected to the bottom of the resonant cold plate 74 drive the silicone thermal pad 77 fixedly connected to the bottom to automatically adjust the contact distance according to the unevenness of the chip 78 surface, thereby improving the degree of contact between the resonant cold plate 74 and the chip 78 surface and ensuring the pressure uniformity of the resonant heat transfer contact surface. Meanwhile, the heat transfer fluid in the loop flow tube 75 inside the resonant cold plate 74 improves the heat transfer efficiency of the equipment. In addition, the inner heat transfer plate 79 also transfers heat from the equipment at all times, providing good heat dissipation. The coordinated operation of multiple heat dissipation components avoids the occurrence of sudden situations and improves the service life of the equipment.
[0044] When the heat transfer fluid in the loop flow tube 75 undergoes a sharp turn or sudden braking, the flow stabilization and regulation component 8 in the equipment starts to operate. The liquid heat transfer fluid in the loop flow tube 75 is subjected to the inertial force generated during vehicle movement, causing the heat transfer fluid to move within the loop flow tube 75. At this time, the liquid fluid in the impact direction comes into contact with the flow divider plate 86 and is then impacted. Multiple rollers 88 at the end of the flow divider plate 86 begin to roll along the inner wall of the loop flow tube 75. Simultaneously, the fluid holes 87 in the moving flow divider plate 86 guide some of the liquid. The fluid flows through the diverter plate 86, which then moves the connecting seat 84 toward the connecting frame 81. As the connecting seat 84 moves, the spring 83 and the sealing tube 85 fitted onto the surface of the spring 83 begin to contract within the sleeve 82. After contraction, the spring 83, based on its own elastic pressure, pushes the heat transfer fluid flowing to this end back to its original operating position through the diverter plate 86. This ensures that the heat transfer fluid in the loop flow tube 75 inside the resonant cold plate 74 remains in good operating condition at all times, ensuring a sufficient supply of heat transfer fluid in the evaporation zone and guaranteeing the reliability of phase change heat transfer.
[0045] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.
[0046] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.
Claims
1. A vehicle-mounted supercomputer device based on a resonance heat transfer cold plate, comprising a computer base (1), characterized in that, The top of the computer base (1) is fixedly connected with a vehicle base (2), the front end of the vehicle base (2) is fixedly connected with a front panel (3), the other end of the vehicle base (2) is fixedly connected with a rear panel (4), the top of the vehicle base (2) is provided with a cover plate (5), the top of the vehicle base (2) is fixedly connected with a heat dissipation fin assembly (6), the heat dissipation fin assembly (6) is used for air flow circulation of the equipment, and the heat dissipation fin assembly (6) is connected with the vehicle base (2); A resonance buffering assembly (7) is used for buffering and protecting the chip (78) when the equipment vibrates, and the resonance buffering assembly (7) is connected with the heat dissipation fin assembly (6); A stable flow adjusting assembly (8) is used for ensuring the stability of the heat transfer fluid in the resonance environment, and the stable flow adjusting assembly (8) is connected with the resonance buffering assembly (7).
2. The in-vehicle supercomputer apparatus based on a resonance heat transfer cold plate according to claim 1, characterized by, The heat dissipation fin assembly (6) comprises a heat dissipation bin (61) fixedly connected to the top of the vehicle base (2), a plurality of air holes are formed in the heat dissipation bin (61), and a plurality of heat dissipation fins (62) are fixedly connected to the two ends of the heat dissipation bin (61).
3. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 2, characterized by, The inside bottom end of the heat dissipation bin (61) is movably connected with a bottom plate (65), the two ends of the bottom plate (65) are inserted with locking plates (64), and the top surface of the bottom plate (65) is fixedly connected with a plurality of base sleeves (66).
4. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 3, characterized by, A plurality of bolt columns (67) are sleeved in the base sleeves (66), a plurality of butterfly springs (68) are sleeved on the surface of the bolt column (67), a metal plate (69) is inserted into the top of the bolt column (67), a suspension frame (63) is movably connected to the bottom of the metal plate (69), a rubber layer is arranged on the inner wall of the suspension frame (63), and the bottom of the suspension frame (63) is fixedly connected with the butterfly spring (68).
5. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 4, characterized by, The resonance buffering assembly (7) comprises a fixing frame (71) inserted on the surface of the bolt column (67), the center of the fixing frame (71) is a rectangular hole, a top plate (72) is fixedly connected to the center of the fixing frame (71), and a plurality of elastic support columns (73) are fixedly connected to the bottom of the top plate (72).
6. The in-vehicle supercomputer apparatus based on the resonance heat transfer cold plate according to claim 5, characterized by, A resonance cold plate (74) is fixedly connected to the bottom of the elastic support column (73), a loop flow pipe (75) is arranged in the resonance cold plate (74), a plurality of metal springs (76) are fixedly connected to the bottom of the resonance cold plate (74), and a silica gel heat-conducting pad (77) is fixedly connected to the bottom of the metal spring (76).
7. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 6, characterized by, An inner heat transfer plate (79) is also inserted into the surface of the bolt column (67), a chip (78) is fixedly connected to the top of the inner heat transfer plate (79), the fixing frame (71) is arranged at the top end in the suspension frame (63), and the inner heat transfer plate (79) is arranged at the bottom end in the suspension frame (63).
8. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 7, characterized by, The steady flow adjusting assembly (8) comprises a plurality of connecting frames (81) fixedly connected inside the loop flow pipe (75), and the connecting frames (81) are arranged in pairs at both ends of each pipeline inside the loop flow pipe (75).
9. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 8, characterized by, Ends of the connecting frames (81) are fixedly connected with sleeve pipes (82), interiors of the sleeve pipes (82) are fixedly connected with springs (83), and the other ends of the springs (83) are fixedly connected with connecting seats (84).
10. The in-vehicle supercomputer device based on a resonance heat transfer cold plate according to claim 9, characterized by, Surfaces of the springs (83) are sleeved with sealing pipes (85), the sealing pipes (85) are arranged between the sleeve pipes (82) and the connecting seats (84), the other ends of the connecting seats (84) are fixedly connected with shunt plates (86), surfaces of the shunt plates (86) are provided with a plurality of liquid holes (87), and ends of the shunt plates (86) are rotatably connected with a plurality of rollers (88).