Air-cooled laser heat dissipation device based on semiconductor refrigeration air

Abstract

The invention provides an air-cooled laser heat dissipation device based on semiconductor refrigeration air, and the device comprises a laser body, the left front side of the laser body is provided with a first semiconductor refrigeration assembly, the right front side of the laser body is provided with a second semiconductor refrigeration assembly, and the rear end of the laser body is provided with a fan module used for air draft and heat dissipation. A cold air dispersing assembly is installed in the front side of the laser device body and used for dispersing cold air into the whole laser device body so as to cool all parts in the laser device body. Compared with the prior art, the laser device has the following beneficial effects that the semiconductor refrigeration assembly I, the semiconductor refrigeration assembly II, the fan module and the cold air dispersion assembly are arranged, and an air-cooling and liquid-cooling double-cooling structure is adopted, so that the temperature influence caused by the external environment and long-time working of the laser device body can be quickly and effectively reduced; and the laser body can work for a long time in a relatively proper temperature environment.

Description

Technical Field

[0001] This invention belongs to the field of laser heat dissipation technology, and specifically relates to a heat dissipation device for air-cooled lasers based on semiconductor cooling air. Background Technology

[0002] Using air cooling for semiconductor lasers in high-temperature environments has several significant drawbacks. First, the cooling effect of the air cooling system is greatly affected by the ambient temperature. During high-temperature and high-power discharge, the cooling efficiency may be insufficient, leading to increased laser chip temperature and consequently affecting performance. Second, in extreme weather conditions, when the laser is parked and charging, the air cooling system is prone to overheating and inability to dissipate heat in time, triggering thermal protection mechanisms, reducing charging power, or even stopping charging altogether. This is mainly because air cooling relies on airflow to remove heat, but in high-temperature environments, the air itself is already hot, resulting in poor heat dissipation.

[0003] Conventional solutions include using higher-power fans, increasing heat sink area, or optimizing heat dissipation structure design, but these methods also have drawbacks. For example, increasing fan power increases energy consumption and generates more noise, and long-term operation may shorten fan life; increasing heat sink area can improve heat dissipation efficiency, but it increases the size and weight of the device, which is not conducive to miniaturization design; optimizing heat dissipation structure design requires high technical requirements and cost investment, and may not completely solve the heat dissipation problem in high-temperature environments. Therefore, we hope to design a laser heat dissipation device with a novel structure to solve this problem. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a heat dissipation device for air-cooled lasers based on semiconductor cooling air, thereby solving the problems mentioned in the background art.

[0005] This invention is achieved through the following technical solution: a heat dissipation device for a wind-cooled laser based on semiconductor cooling air, comprising: a laser body, a semiconductor cooling component one installed on the left front side of the laser body, a semiconductor cooling component two installed on the right front side of the laser body, a fan module for exhausting heat dissipation installed at the rear end of the laser body, a cold air dispersion component installed inside the front side of the laser body for dispersing cold air to the entire interior of the laser body to cool its internal components, a reflux component installed inside the front side of the laser body for driving coolant circulation, and a liquid cooling component installed at the bottom of the laser body for liquid cooling to improve the cooling effect. The left side of the cold gas dispersion component is connected to the first semiconductor cooling component, and the right side of the cold gas dispersion component is connected to the second semiconductor cooling component. The cold gas dispersion component is located in front of the reflux component. The left side of the reflux component is connected to the first semiconductor cooling component, and the right side of the reflux component is connected to the second semiconductor cooling component. The left side of the liquid cooling component is connected to the first semiconductor cooling component, and the right side of the liquid cooling component is connected to the second semiconductor cooling component. The liquid cooling component is located behind the reflux component, and the rear side of the liquid cooling component is connected to the heat dissipation component. The liquid cooling component is located in front of the heat dissipation component, and the heat dissipation component is located in front of the fan module. In actual use, the laser body contains basic laser components, including an active region, an optical resonant cavity, and an electric pump source. All of the above components can be installed on the upper side of the liquid cooling component, which can be fixedly connected to the inner wall of the laser body shell through a fixing bracket. The specific installation can be set according to the actual use requirements. The liquid cooling component located at the bottom can quickly cool the components inside the laser body, thereby assisting the air cooling system in heat dissipation and cooling.

[0006] In a preferred embodiment, a liquid return pipe is provided at the upper end of the semiconductor cooling component near the laser body, a liquid inlet pipe is provided at the lower side of the semiconductor cooling component near the laser body, and an air outlet pipe is provided at the bottom of the semiconductor cooling component near the laser body.

[0007] In a preferred embodiment, the structure of the second semiconductor cooling component is the same as that of the first semiconductor cooling component, and the two are arranged in a mirror image structure. The second semiconductor cooling component includes a housing, and a cooling box for cooling air and liquid is installed inside the housing. A coolant viewing window is provided on the front part of the housing for observing the height of the coolant inside the cooling box. A semiconductor cooling module is installed on the side of the cooling box away from the laser body. The semiconductor cooling module is composed of multiple semiconductor cooling chips in a matrix structure, and it is in contact with the outer wall of the cooling box through thermally conductive silicone grease.

[0008] In a preferred embodiment, a cooling fan is installed on the side of the outer shell away from the laser body to dissipate the heat generated by the semiconductor cooling module installed on the outer wall of the cooling box. Multiple air inlets are installed on the top of the cooling box, and the multiple air inlets pass through the top of the outer shell through a preset hole. Each of the air intake cylinders has multiple annularly distributed strip-shaped through holes on its outer wall for air intake. Each air intake cylinder has a filter cap movably inserted at its upper end. The bottom of the filter cap has a cylindrical filter cylinder with its outer wall in contact with the inner wall of the air intake cylinder. In actual use, the material of the filter cap, the filter screen pore size, and the temperature resistance can be selected according to requirements. The filter cap can be cleaned or replaced regularly to keep it unobstructed and avoid insufficient air intake.

[0009] In a preferred embodiment, the top of the cooling box is provided with a liquid injection pipe for injecting coolant, and the bottom is provided with a drain hole and a sealing plug is installed for draining coolant. The liquid injection pipe passes through the top of the outer shell through a pre-set hole 2 on the top of the outer shell. The cooling box has a gas cooling chamber located on the side near the laser body. The gas cooling chamber has multiple equally spaced partitions that divide the gas cooling chamber into multiple independent chambers. The partitions are spaced apart in the front-back direction and have connecting holes to connect the multiple independent chambers in a serpentine structure. The top of the gas cooling chamber is connected to the bottom of multiple air inlets. The cooling box has a liquid cooling chamber inside on the side away from the laser body. The outer wall of the cooling box on the side of the liquid cooling chamber is recessed inward to form an inner concave plate. The outer wall of the inner concave plate abuts against the cooling surface of the semiconductor cooling module. The inner wall surface of the concave plate is provided with a plurality of equally spaced fins to accelerate the cooling rate of the liquid inside the liquid cooling chamber. All of the fins are placed inside the liquid cooling chamber. The bottom rear end of the cooling box near the laser body is provided with a gas outlet pipe, which is connected to the bottom of the gas cooling chamber. The bottom front end of the cooling box near the laser body is provided with a liquid outlet pipe, which is connected to the bottom of the liquid cooling chamber. The upper end of the cooling box near the laser body is provided with a guide pipe, which is connected to the upper interior of the liquid cooling chamber and penetrates through the gas cooling chamber.

[0010] In a preferred embodiment, the liquid cooling assembly includes a serpentine tube. An L-shaped connector is provided on the front end of the serpentine tube near the semiconductor cooling assembly 2. The connector is fixedly connected to the liquid outlet pipe for conveying coolant into the serpentine tube. A connector is provided at the rear end of the serpentine tube away from the connector 1. The connector is S-shaped. A connecting pipe is also provided on the side of the serpentine tube away from the connector 1. An S-shaped connector is provided at the rear of the connecting pipe. A Z-shaped connector is provided at the front end of the connecting pipe. The connector 4 (522) is fixedly connected to the liquid return pipe (220) of the semiconductor cooling assembly 1 (200). The serpentine tube and the connecting pipe are fixedly connected by multiple equally spaced fins 2.

[0011] In a preferred embodiment, the heat dissipation assembly includes a liquid box. A sealing plate is horizontally arranged in the middle of the liquid box to divide the interior of the liquid box into a flow cavity. The sealing plate extends downward from one end away from the second connector, connecting the upper and lower sides of the liquid box to form a horizontal U-shaped structure. The upper side of the flow cavity near the connecting pipe is connected to the second connector, and the lower side of the flow cavity near the connecting pipe is connected to the third connector. The rear side of the liquid box is provided with multiple fins three evenly distributed. The lower side of the liquid box has multiple through holes with a waist-shaped structure extending from front to back. In actual use, the heat dissipation assembly is used to disperse the heat in the liquid after it has absorbed heat in the liquid cooling assembly, so that the rear fan module can dissipate the dissipated heat.

[0012] In a preferred embodiment, the reflux assembly includes a micropump. A bent pipe is installed on the side of the micropump near the first semiconductor refrigeration assembly, which is fixedly connected to the liquid inlet pipe on the first semiconductor refrigeration assembly for conveying the coolant refluxed into the first semiconductor refrigeration assembly to the micropump. A straight pipe is provided on the right side of the micropump, which is fixedly connected to the guide pipe on the second semiconductor refrigeration assembly for guiding the refluxed liquid into the second semiconductor refrigeration assembly for secondary cooling.

[0013] In a preferred embodiment, the cold air dispersion component includes an air box. An inverted V-shaped vertical plate is provided on the front side of the air box, dividing the cross-section of the rear space inside the air box into a structure that gradually increases in size from both ends to the middle. Multiple vertical strip-shaped air holes are opened forward on the rear side of the air box, arranged in a structure that is sparse at both ends and dense in the middle. An air pipe is provided on the left and right sides of the air box. The left side of the air box is connected to an air outlet pipe on a semiconductor refrigeration component one via an air pipe, and the left side of the air box is connected to an air outlet pipe on a semiconductor refrigeration component two via an air pipe. In actual use, the air outlet pipe one and air outlet pipe two have the same structure (not shown or labeled in the figure due to obstruction).

[0014] After adopting the above technical solution, the beneficial effects of the present invention are as follows: by setting up a semiconductor cooling component one, a semiconductor cooling component two, a liquid cooling component, a heat dissipation component, and a reflux component, the coolant that has absorbed heat will be cooled for the first time after entering the semiconductor cooling component one, and then will be cooled for the second time after entering the semiconductor cooling component two. After double cooling, the temperature of the coolant is lower, which can meet the requirement of rapid cooling of the laser body. The purpose of setting the liquid cooling component at the bottom of the laser body is to avoid excessive impact on the installation of the components inside the laser body, and at the same time, it can quickly cool the components, assist the air cooling system of the whole device to cool the equipment, and help improve the heat dissipation and cooling effect of the entire laser body.

[0015] 2. By setting up semiconductor cooling component one, semiconductor cooling component two, a fan module, and a cold air dispersion component, the air inside the gas box flows into the laser body through multiple air holes. Under the action of the vertical plate, the cross-section at both ends of the box is narrow, and the air flows faster towards the middle, thereby reducing the air output from the air holes at both ends. This ensures that most of the gas enters the laser body from the middle of the gas box. At the same time, the gas box draws in the cooled air from semiconductor cooling component one and semiconductor cooling component two through the air pipes on both sides. A through hole is set at the bottom of the liquid box to facilitate the backward movement of the cooled air. The entire heat dissipation component is horizontally placed in front of the fan module, which can further reduce the speed of the cooled air moving backward inside the laser body, allowing it more time to cool the components inside the laser body and remove heat. By setting up semiconductor cooling air and coolant, and adopting a dual cooling structure of air cooling and liquid cooling, the temperature influence caused by the external environment and the laser body during long-term operation can be quickly and effectively reduced, ensuring that the laser body can operate for a long time in a more suitable temperature environment. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device for a wind-cooled laser based on semiconductor cooling air according to the present invention.

[0018] Figure 2 This is a schematic diagram of the connection structure between the fan module and the laser body of a wind-cooled laser heat dissipation device based on semiconductor cooling air according to the present invention.

[0019] Figure 3 This is a schematic diagram of the internal connection structure between the liquid cooling component and the laser body of a heat dissipation device for a wind-cooled laser based on semiconductor cooling air according to the present invention.

[0020] Figure 4 This is a schematic diagram of the connection structure between the liquid cooling component and the heat dissipation component of a wind-cooled laser heat dissipation device based on semiconductor cooling air according to the present invention.

[0021] Figure 5 This is a schematic diagram of the recirculation component structure of a heat dissipation device for a wind-cooled laser based on semiconductor cooling air according to the present invention.

[0022] Figure 6This is a schematic diagram of the cold air dispersion component structure of a wind-cooled laser heat dissipation device based on semiconductor cooling air according to the present invention.

[0023] Figure 7 This is a schematic diagram of the structure of a semiconductor cooling component in a wind-cooled laser heat dissipation device based on semiconductor cooling air according to the present invention.

[0024] Figure 8 This is a schematic diagram of the dispersed structure of the semiconductor cooling component in a wind-cooled laser heat dissipation device based on semiconductor cooling air according to the present invention.

[0025] Figure 9 for Figure 8 A schematic diagram of the enlarged structure at point A in the middle.

[0026] In the image, 100 represents the laser body; 200-Semiconductor refrigeration component 1, 210-Liquid inlet pipe, 220-Liquid return pipe; 300-Semiconductor refrigeration component II, 310-Housing, 320-Cooling fan, 330-Filter cap, 340-Inlet cylinder, 350-Liquid injection pipe, 360-Refrigeration box, 361-Gas cooling chamber, 362-Baffle, 363-Liquid cooling chamber, 364-Inner concave plate, 365-Fin I, 370-Outlet pipe II, 380-Liquid outlet pipe, 390-Guide pipe; 400-fan module; 500-Liquid cooling assembly, 510-Serpentine tube, 511-Connector 1, 512-Connector 2, 520-Connecting tube, 521-Connector 3, 522-Connector 4, 530-Fin 2; 600-Heat dissipation component, 610-Liquid tank, 611-Through hole, 620-Fin three; 700 - Reflux assembly, 710 - elbow, 720 - micro pump, 730 - straight pipe; 800-Cold air dispersion component, 810-Air box, 811-Air hole, 820-Vertical plate, 830-Air pipe. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] As the first embodiment of the present invention: Please see Figures 1 to 9A heat dissipation device for a wind-cooled laser based on semiconductor cooling air includes: a laser body 100; a semiconductor cooling component 200 installed on the left front side of the laser body 100; a semiconductor cooling component 300 installed on the right front side of the laser body 100; a fan module 400 for exhausting heat dissipation installed at the rear end of the laser body 100; a cold air dispersion component 800 installed inside the front side of the laser body 100 to disperse cold air into the entire interior of the laser body 100, thereby cooling the internal components; a reflux component 700 installed inside the front side of the laser body 100 to drive the circulation of coolant; and a liquid cooling component 500 installed at the bottom of the laser body 100 to perform liquid cooling to improve the cooling effect. The left side of the cold air dispersion component 800 is connected to the first semiconductor refrigeration component 200, and the right side of the cold air dispersion component 800 is connected to the second semiconductor refrigeration component 300. The cold air dispersion component 800 is positioned in front of the return flow component 700. The left side of the return flow component 700 is connected to the first semiconductor refrigeration component 200, and the right side of the return flow component 700 is connected to the second semiconductor refrigeration component 300. The left side of the liquid cooling component 500 is connected to the first semiconductor refrigeration component 200, and the right side of the liquid cooling component 500 is connected to the second semiconductor refrigeration component 300. The liquid cooling component 500 is positioned behind the return flow component 700, and the rear side of the liquid cooling component 500 is connected to the heat dissipation component 6. The liquid cooling component 500 is placed in front of the heat dissipation component 600, which is in front of the fan module 400. In actual use, the laser body 100 contains basic laser components, including an active region, an optical resonant cavity, and an electric pump source. All of these components can be installed on the upper side of the liquid cooling component 500, which can be fixedly connected to the inner wall of the laser body 100 housing through a mounting bracket. The specific installation can be set according to the actual usage requirements. The liquid cooling component 500 located at the bottom can quickly cool the components inside the laser body 100, thereby assisting the air cooling system in heat dissipation and cooling.

[0029] A liquid return pipe 220 is provided on the upper end of the semiconductor cooling component 200 near the laser body 100, a liquid inlet pipe 210 is provided on the lower side of the semiconductor cooling component 200 near the laser body 100, and an air outlet pipe 1 is provided at the bottom of the semiconductor cooling component 200 near the laser body 100.

[0030] The structure of the second semiconductor cooling component 300 is the same as that of the first semiconductor cooling component 200 and the two are arranged in a mirror structure. The second semiconductor cooling component 300 includes a housing 310, and a cooling box 360 for cooling air and liquid is installed inside the housing 310. A coolant viewing window is provided on the front part of the housing 310 for observing the level of coolant inside the cooling box 360. A semiconductor cooling module is installed on the side of the cooling box 360 away from the laser body 100. The semiconductor cooling module is composed of multiple semiconductor cooling chips in a matrix structure, and it is in contact with the outer wall of the cooling box 360 through thermal grease.

[0031] A cooling fan 320 is installed on the side of the outer shell 310 away from the laser body 100 to dissipate the heat generated by the semiconductor cooling module installed on the outer wall of the cooling box 360. Multiple air inlets 340 are installed on the top of the cooling box 360, and the multiple air inlets 340 pass through the preset hole on the top of the outer shell 310. Each air intake cylinder 340 has multiple annularly distributed strip-shaped through holes on its outer wall for air intake. Each air intake cylinder 340 has a filter cap 330 movably inserted at its upper end. The bottom of the filter cap 330 is provided with a cylindrical filter cylinder, the outer wall of which movably abuts against the inner wall of the air intake cylinder 340.

[0032] The top of the cooling box 360 is also provided with a liquid injection pipe 350 for injecting coolant, and the bottom is also provided with a drain hole and a sealing plug for draining coolant. The liquid injection pipe 350 passes through the pre-set hole 2 at the top of the outer shell 310. A gas cooling chamber 361 is provided inside the cooling box 360 on the side near the laser body 100. The gas cooling chamber 361 is provided with multiple equally spaced partitions 362, which divide the gas cooling chamber 361 into multiple independent chambers. The partitions 362 are provided with connecting holes in the front-back direction to connect the multiple independent chambers in a serpentine structure. The top of the gas cooling chamber 361 is connected to the bottom of multiple air inlets 340. A liquid cooling chamber 363 is provided inside the cooling box 360 on the side away from the laser body 100. The outer wall of the cooling box 360 on the side of the liquid cooling chamber 363 is recessed inward to form an inner concave plate 364. The outer wall of the inner concave plate 364 abuts against the cooling surface of the semiconductor cooling module. The inner wall surface of the concave plate 364 is provided with multiple fins 365 distributed at equal intervals to accelerate the cooling speed of the liquid inside the liquid cooling chamber 363. The multiple fins 365 are all placed inside the liquid cooling chamber 363. The cooling box 360 is provided with a gas outlet pipe 370 at the rear end of the bottom of the side near the laser body 100, which is connected to the bottom of the gas cooling chamber 361. The cooling box 360 is provided with a liquid outlet pipe 380 at the front end of the bottom of the side near the laser body 100, which is connected to the bottom of the liquid cooling chamber 363. The cooling box 360 is provided with a guide pipe 390 at the upper end of the side near the laser body 100, which is connected to the upper interior of the liquid cooling chamber 363 and passes through the gas cooling chamber 361.

[0033] The liquid cooling assembly 500 includes a serpentine tube 510. An L-shaped connector 511 is provided on the front end of the serpentine tube 510 near the semiconductor cooling assembly 200. The connector 511 is fixedly connected to the liquid outlet pipe 380 for delivering coolant into the serpentine tube 510. A connector 512 is provided at the rear end of the serpentine tube 510 away from the connector 511. The connector 512 is S-shaped. A connecting pipe 520 is also provided on the side of the serpentine tube 510 away from the connector 511. An S-shaped connector 521 is provided at the rear side of the connecting pipe 520. A Z-shaped connector 522 is provided at the front end of the connecting pipe 520. The connector 522 is fixedly connected to the liquid return pipe 220 of the semiconductor cooling assembly 200. The serpentine tube 510 and the connecting pipe 520 are fixedly connected by multiple equally spaced fins 530.

[0034] The heat dissipation assembly 600 includes a liquid box 610. A sealing plate is horizontally arranged in the middle of the liquid box 610 to divide the interior of the liquid box 610 into a flow cavity. The end of the sealing plate away from the second connector 512 extends downward to connect the upper and lower sides of the interior of the liquid box 610 to form a horizontal U-shaped structure. The upper side of the flow cavity near the connecting pipe 520 is connected to the second connector 512, and the lower side of the flow cavity near the connecting pipe 520 is connected to the third connector 521. Multiple fins 620 are arranged at equal intervals on the rear side of the liquid box 610. Multiple through holes 611 with waist-shaped structures are formed from front to back on the lower side of the liquid box 610. In actual use, the heat dissipation assembly 600 is used to disperse the heat in the liquid after the liquid cooler 500 has absorbed heat, so that the fan module 400 on the rear side can dissipate the heat.

[0035] The reflux assembly 700 includes a micro pump 720. A bent pipe 710 is installed on the side of the micro pump 720 near the semiconductor refrigeration assembly 200. The bent pipe 710 is fixedly connected to the liquid inlet pipe 210 on the semiconductor refrigeration assembly 200 to deliver the coolant refluxed back into the semiconductor refrigeration assembly 200 to the micro pump 720. A straight pipe 730 is provided on the right side of the micro pump 720. The straight pipe 730 is fixedly connected to the guide pipe 390 on the semiconductor refrigeration assembly 300 to guide the refluxed liquid into the interior of the semiconductor refrigeration assembly 300 for secondary cooling.

[0036] Specifically, by setting up a semiconductor cooling component 200, a semiconductor cooling component 300, a liquid cooling component 500, a heat dissipation component 600, and a reflux component 700, in actual use, after the laser body 100 is turned on, the micro pump 720 in the reflux component 700 is activated. The micro pump 720 draws coolant from the semiconductor cooling component 200 through its bent pipe 710 and the liquid inlet pipe 210 on the semiconductor cooling component 200, and delivers it through its straight pipe 730 and guide pipe 390. The liquid cooling chamber 363 in the second semiconductor cooling assembly 300 is cooled by the semiconductor cooling module installed in the concave plate 364 on the outside of the cooling box 360 in the second semiconductor cooling assembly 300, and continuously cools the concave plate 364 and the fins 365 on it. The fins 365 are placed inside the liquid cooling chamber, which can continuously cool the coolant inside the liquid cooling chamber. The cooled coolant enters the serpentine tube 510 through the liquid outlet pipe 380 and the connector 511 on the lower side of the cooling box 360. Meanwhile, multiple fins 530 on the liquid cooling assembly 500 synchronously absorb the heat emitted from inside the laser body 100 and continuously transfer the heat to the serpentine tube 510. The coolant, after being doubly cooled, can continuously absorb the heat from the serpentine tube 510 and, after meandering inside the serpentine tube 510, enter the upper side of the liquid tank 610 of the heat dissipation assembly 600 through the connector 512. After entering the U-shaped flow cavity, the coolant flows horizontally from top to bottom in a U-shape. During this process, the coolant continuously absorbs heat from the liquid tank 610. The heat transferred by the rear fin 3 620 is transferred to the rear part of the entire laser body 100, and finally flows into the connecting pipe 520 through the connector 3 521. Then, it is transported to the semiconductor cooling assembly 1 200 through the connector 4 522 on the connecting pipe 520 and the liquid inlet pipe 210. Since the structure of the semiconductor cooling assembly 1 200 is the same as that of the semiconductor cooling assembly 2 300, the coolant after absorbing heat will be cooled for the first time after entering the semiconductor cooling assembly 1 200. Then, secondary cooling is performed inside the second semiconductor cooling component 300. This dual cooling results in a lower coolant temperature (a temperature sensor can be installed inside the laser body 100 to monitor the temperature. When the temperature drops below a certain set value, power to the micro pump 720 is stopped, thus stopping the coolant flow and preventing water vapor liquefaction that could damage the equipment due to excessively low internal temperature of the laser body 100. Temperature sensors can also be installed inside the first semiconductor cooling component 200 and the second semiconductor cooling component 300 to monitor the temperature and prevent the coolant inside the liquid cooling chamber 363 from freezing due to temperature drop. In actual use, either salt water or cooling oil can be used as the coolant, depending on the specific application requirements). This meets the need for rapid cooling of the laser body 100. The purpose of placing the liquid cooling component 500 at the bottom of the laser body 100 is to avoid excessive impact on the installation of the components inside the laser body 100, while also allowing for rapid cooling of the components. This assists the air cooling system of the entire device in cooling the equipment and helps improve the overall heat dissipation and cooling effect of the laser body 100.

[0037] As a second embodiment of the present invention: Please see Figures 1 to 9 The cold air dispersion component 800 includes an air box 810. The front side of the air box 810 is provided with a vertical plate 820 in an inverted V-shape, which divides the cross-section of the rear space inside the air box 810 into a structure that gradually increases from both ends to the middle. The rear side of the air box 810 has multiple vertical strip-shaped air holes 811, which are arranged in a structure that is sparse at both ends and dense in the middle. An air pipe 830 is provided on the left and right sides of the air box 810. The left side of the air box 810 is connected to the first air outlet pipe on the semiconductor cooling component 200 through the air pipe 830, and the left side of the air box 810 is connected to the second air outlet pipe 370 on the semiconductor cooling component 300 through the air pipe 830.

[0038] Based on the first embodiment described above, further, by setting up a semiconductor cooling component 200, a semiconductor cooling component 300, a fan module 400, and a cooling air dispersion component 800, in actual use, when the fan module 400 is activated, multiple fan modules on it rotate synchronously, drawing air from inside the laser body 100 to the outside. (In actual use, the installation of the laser body 100 housing can be sealed to reduce the possibility of air entering areas other than the semiconductor cooling component 200 and the semiconductor cooling component 300, ensuring that external air can pass through the semiconductor cooling component 200 and the semiconductor cooling component 300.) (Component 2 300 enters the laser body 100). After the air pressure inside the laser body 100 decreases, the air inside the air box 810 surges into the laser body 100 through multiple air holes 811. Under the action of the vertical plate 820, the cross-section at both ends of the box is narrower, and it flows faster towards the middle, thereby reducing the air output of the air holes 811 at both ends, ensuring that most of the gas enters the laser body 100 from the middle position of the air box 810. At the same time, the air box 810 draws in the air in the semiconductor cooling component 200 and the semiconductor cooling component 300, as well as the cooled air, through the air pipes 830 on both sides. Specifically, under negative pressure, external air enters through multiple air inlets 340 at the top of the refrigeration box 360 and is filtered by the filter cap 330, blocking impurities. After entering the gas cooling chamber 361 of the refrigeration box 360, multiple partitions 362 divide the interior of the gas cooling chamber 361 into multiple independent chambers. The partitions 362 are spaced apart in the front-to-back direction with connecting holes to connect the multiple independent chambers in a serpentine structure. This causes the gas to move in a serpentine structure inside the gas cooling chamber 361, thereby increasing the residence time of the gas in the gas cooling chamber 361. This allows the liquid cooling chamber 363 to continuously cool the gas. The gas in the gas cooling chamber 361 is cooled down (the purpose of indirect cooling is to avoid water vapor condensation caused by excessive cooling of the gas, which may damage the equipment). After cooling, the gas enters the gas box 810 through the gas outlet pipe 2 370 and the gas pipe 830. On the other side, the semiconductor cooling component 1 200 and the semiconductor cooling component 2 300 simultaneously cool the air and deliver the air into the gas box 810. The cold air entering the laser body 100 from the gas box 810 will continuously move towards the rear of the laser body 100 under the suction of the rear fan module 400, thereby cooling all components that can be cooled by gas flow. A through hole 611 is provided at the bottom of the liquid box 610 to facilitate the backward movement of cold air. The entire heat dissipation assembly 600 is horizontally placed in front of the fan module 400, which can also reduce the speed of the backward movement of cold air inside the laser body 100, allowing it to have more time to cool the components inside the laser body 100 and remove heat. By setting semiconductor cooling air and coolant, and adopting a dual cooling structure of air cooling and liquid cooling, the temperature influence caused by the external environment and the long-term operation of the laser body 100 can be quickly and effectively reduced, ensuring that the laser body 100 can work for a long time in a more suitable temperature environment.

[0039] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A semiconductor refrigeration-based air-cooled laser heat dissipation device, comprising: The laser body (100) is characterized in that a semiconductor refrigeration assembly one (200) is mounted on the left front side of the laser body (100), a semiconductor refrigeration assembly two (300) is mounted on the right front side of the laser body (100), a fan module (400) for air exhaust and heat dissipation is mounted at the rear end of the laser body (100), a cold air dispersion assembly (800) is mounted inside the front side of the laser body (100) for dispersing cold air to the entire inside of the laser body (100) to cool the components inside, a backflow assembly (700) is mounted inside the front side of the laser body (100) for driving the circulation of cooling liquid, and a liquid cooling assembly (500) is mounted at the bottom of the laser body (100) for liquid cooling inside the laser body (100) to improve the cooling effect. The left side of the cold air dispersion assembly (800) is connected with the semiconductor refrigeration assembly one (200), the right side of the cold air dispersion assembly (800) is connected with the semiconductor refrigeration assembly two (300), the cold air dispersion assembly (800) is arranged on the front side of the backflow assembly (700), the left side of the backflow assembly (700) is connected with the semiconductor refrigeration assembly one (200), the right side of the backflow assembly (700) is connected with the semiconductor refrigeration assembly two (300), the left side of the liquid cooling assembly (500) is connected with the semiconductor refrigeration assembly one (200), the right side of the liquid cooling assembly (500) is connected with the semiconductor refrigeration assembly two (300), the liquid cooling assembly (500) is arranged on the rear side of the backflow assembly (700), the rear side of the liquid cooling assembly (500) is connected with the heat dissipation assembly (600), and the liquid cooling assembly (500) is arranged on the front side of the heat dissipation assembly (600), and the heat dissipation assembly (600) is arranged on the front side of the fan module (400).

2. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 1, characterized in that: The semiconductor refrigeration assembly one (200) is provided with a liquid return connecting pipe (220) at the upper end of one side of the laser body (100), is provided with a liquid inlet connecting pipe (210) at the lower side of one side of the laser body (100), and is provided with an air outlet connecting pipe one at the bottom of one side of the laser body (100).

3. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 1, characterized in that: The semiconductor refrigeration assembly two (300) has the same structure as the semiconductor refrigeration assembly one (200) and is arranged in a mirror image structure, and the semiconductor refrigeration assembly two (300) comprises a shell (310), the shell (310) is internally provided with a refrigeration box (360) for cooling air and liquid, and a cooling liquid viewing window is arranged on the front side of the shell (310) for observing the height of the cooling liquid inside the refrigeration box (360). The refrigeration box (360) is provided with a semiconductor refrigeration module away from the laser body (100), and the semiconductor refrigeration module is composed of a plurality of semiconductor refrigeration pieces in a matrix structure and abuts against the outer wall of the refrigeration box (360) through heat-conducting silicone grease.

4. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 3, characterized in that: The shell (310) is installed with a heat dissipation fan (320) on the side away from the laser body (100) for dissipating the heat generated by the semiconductor refrigeration module installed on the outer wall of the refrigeration box (360), and the refrigeration box (360) is installed with a plurality of air inlet cylinders (340) on the top, the plurality of air inlet cylinders (340) pass through the top of the shell (310) through the preset holes in the top of the shell (310); The outer wall of each air inlet cylinder (340) is provided with a plurality of strip-shaped through holes in a ring structure for air inlet, and each air inlet cylinder (340) is movably inserted with a filter cap (330) at the upper end, and the filter cap (330) is provided with a filter cylinder in a cylindrical structure at the bottom, and the outer wall thereof movably abuts against the inner wall of the air inlet cylinder (340).

5. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 4, characterized in that: The refrigeration box (360) is further provided with a liquid injection pipe (350) on the top for injecting cooling liquid, and is further provided with a liquid discharge hole and a sealing plug for discharging cooling liquid, and the liquid injection pipe (350) passes through the top of the shell (310) through the preset hole two in the top of the shell (310); The refrigeration box (360) is provided with a gas cooling cavity (361) near the side of the laser body (100) inside, and a plurality of equally spaced partition plates (362) are arranged in the gas cooling cavity (361), and the plurality of partition plates (362) separate the gas cooling cavity (361) into a plurality of independent chambers, and the plurality of partition plates (362) are spaced apart in the front and back directions and provided with communication holes for connecting the plurality of independent chambers in a snakelike structure, and the top of the gas cooling cavity (361) is communicated with the bottoms of the plurality of air inlet cylinders (340); The refrigeration box (360) is provided with a liquid cooling cavity (363) inside away from the side of the laser body (100), and the outer wall of the refrigeration box (360) on one side of the liquid cooling cavity (363) is recessed to form an inner recessed plate (364), and the outer wall of the inner recessed plate (364) abuts against the refrigeration surface of the semiconductor refrigeration module; The inner wall surface of the inner recessed plate (364) is provided with a plurality of equally spaced fins (365) for accelerating the cooling speed of the liquid in the liquid cooling cavity (363), and the plurality of fins (365) are arranged in the liquid cooling cavity (363), and the refrigeration box (360) is provided with an air outlet connection pipe two (370) on the bottom rear end of the side close to the laser body (100), which is communicated with the bottom of the gas cooling cavity (361), and the refrigeration box (360) is provided with a liquid outlet connection pipe (380) on the bottom front end of the side close to the laser body (100), which is communicated with the bottom of the liquid cooling cavity (363), and the refrigeration box (360) is provided with a flow guide pipe (390) on the upper end of the side close to the laser body (100), which is communicated with the upper end of the liquid cooling cavity (363) and penetrates the gas cooling cavity (361).

6. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 5, characterized in that: The liquid cooling assembly (500) comprises a serpentine tube (510), an L-shaped connector I (511) is arranged at the front end of the serpentine tube (510) and close to one side of the semiconductor refrigeration assembly II (300), the connector I (511) is fixedly connected with the liquid outlet pipe (380) for conveying the cooling liquid into the serpentine tube (510), an S-shaped connector II (512) is arranged at the rear end of the side of the serpentine tube (510) away from the connector I (511), a connecting pipe (520) is further arranged at the side of the serpentine tube (510) away from the connector I (511), an S-shaped connector III (521) is arranged at the rear side of the connecting pipe (520), a Z-shaped connector IV (522) is arranged at the front end of the connecting pipe (520), the connector IV (522) is fixedly connected with the liquid return pipe (220) of the semiconductor refrigeration assembly I (200), and the serpentine tube (510) and the connecting pipe (520) are fixedly connected through a plurality of equally spaced fins II (530).

7. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 1, characterized in that: The heat dissipation assembly (600) comprises a liquid box (610), a sealing plate is arranged at the middle of the inside of the liquid box (610) and transversely, so as to divide the inside of the liquid box (610) into a flow cavity, the sealing plate is penetrated downward at one end away from the connector II (512), so as to communicate the upper side and the lower side of the inside of the liquid box (610) and form a transversely arranged U-shaped structure, the upper side of the flow cavity close to one end of the connecting pipe (520) is connected with the connector II (512), the lower side of the flow cavity close to one end of the connecting pipe (520) is connected with the connector III (521), a plurality of equally spaced fins III (620) are arranged at the rear side of the liquid box (610), and a plurality of waist hole-shaped through holes (611) are formed by penetrating the lower side of the liquid box (610) from front to back.

8. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 1, characterized in that: The reflux assembly (700) comprises a micro pump (720), a bend pipe (710) is mounted at the side close to the semiconductor refrigeration assembly I (200), the bend pipe (710) is fixedly connected with the liquid inlet pipe (210) of the semiconductor refrigeration assembly I (200) for conveying the cooling liquid returned into the semiconductor refrigeration assembly I (200) to the micro pump (720), a straight pipe (730) is arranged at the right side of the micro pump (720) and is fixedly connected with the flow guide pipe (390) of the semiconductor refrigeration assembly II (300) for guiding the returned liquid into the semiconductor refrigeration assembly II (300) for secondary cooling.

9. The air-cooled laser heat sink based on semiconductor refrigeration according to claim 5, characterized in that: The cold air dispersion assembly (800) comprises a gas box (810), a vertical plate (820) in an inverted V-shaped structure is arranged on the inner front side of the gas box (810), so as to divide the cross section of the space on the rear side of the gas box (810) into a structure gradually increasing from both ends to the middle, a plurality of gas holes (811) in a vertical strip-shaped structure are arranged on the rear side of the gas box (810) and opened forward, the plurality of gas holes (811) are arranged in a structure of being sparse at both ends and dense in the middle, and one gas pipe (830) is arranged on the left side and the right side of the gas box (810) respectively, the left side of the gas box (810) is connected with the gas outlet connecting pipe one on the semiconductor refrigeration assembly one (200) through the gas pipe (830), and the left side of the gas box (810) is connected with the gas outlet connecting pipe two (370) on the semiconductor refrigeration assembly two (300) through the gas pipe (830).

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