Electronic device
By setting up a shielding component in the electronic device and using a connecting conductor to achieve an electrical connection between the shielding component and the grounding terminal, the problem of weak grounding of the shielding component is solved, the influence of external electromagnetic fields is reduced, and the attenuation effect is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-13
- Publication Date
- 2026-03-10
AI Technical Summary
In electronic devices, existing technologies struggle to effectively enhance the grounding of shielding components, resulting in significant impacts from external electromagnetic fields on the devices.
By setting a shield on the body of the electronic device and using a first connecting conductor to electrically connect the shield to the grounding terminal to form an electrical path, the shield is grounded in a reinforced manner.
This achieves effective grounding of the shielding component, reduces the impact of external electromagnetic fields on electronic devices, improves attenuation in the high-frequency band, and alleviates attenuation caused by magnetic coupling.
Smart Images

Figure CN121643684A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to an electronic device. Background Technology
[0002] Japanese Patent Application Publication No. 2016-12770 discloses an electronic device comprising: an input terminal; a first output terminal; a ground terminal; a first capacitor and a second capacitor connected in series in a path between the input terminal and the first output terminal; a first inductor connected between any part of the path between the input terminal and the first output terminal and the ground terminal; a second inductor connected in parallel with respect to the second capacitor; and a first auxiliary circuit, wherein the second inductor and the first auxiliary circuit constitute a first directional coupler by electromagnetic coupling. Summary of the Invention
[0003] (a) Technical problems to be solved
[0004] In electronic devices, to reduce the influence of external electromagnetic fields and other factors on the device's characteristics, a shielding component (shielding layer) is placed on the outer surface of the device. The shielding component is electrically connected to a grounding terminal that is connected to a grounding component. In electronic devices, it is necessary to strengthen the grounding of the shielding component.
[0005] One aspect of this disclosure is to provide an electronic device capable of enhancing the grounding of a shield.
[0006] (II) Technical Solution
[0007] (1) An electronic device according to one aspect of the present disclosure comprises: a body having: a mounting surface and a main surface opposite to each other, and four side surfaces connecting a pair of main surfaces; a shield covering the four side surfaces of the body; a ground terminal disposed on the mounting surface and connected to the grounding component; an inductor conductor and a capacitor conductor disposed within the body; a first connecting conductor electrically connecting the shield disposed on one of the four side surfaces to shields disposed on other side surfaces different from the one side surface; and a second connecting conductor electrically connecting the first connecting conductor to the ground terminal.
[0008] One aspect of the electronic device disclosed herein includes a first connecting conductor that electrically connects a shield disposed on one of four sides to shields disposed on other sides. The first connecting conductor is electrically connected to a ground terminal via a second connecting conductor. Thus, in the electronic device, since the shields disposed on the sides are electrically connected via the first connecting conductor, the first connecting conductor forms an electrical path between the ground terminal and the shields. Consequently, the grounding of the shields can be strengthened in the electronic device.
[0009] (2) In the electronic device described in (1) above, one side may be arranged opposite to the other side, and the first connecting conductor is electrically connected to the shielding of the pair of opposite sides. In this structure, the first connecting conductor is electrically connected to the shielding of the pair of separate (non-adjacent) sides. Thus, in the electronic device, the shieldings arranged on the pair of sides are directly electrically connected through the first connecting conductor. Therefore, in the electronic device, the grounding of the shielding can be strengthened.
[0010] (3) In the electronic device described in (1) or (2) above, the first connecting conductor may be electrically connected to each of the shields disposed on at least three of the four sides. In this structure, grounding reinforcement can be further achieved.
[0011] (4) In any of the electronic devices described in (1) to (3) above, the portion in which the capacitor conductor overlaps with the first connecting conductor can be viewed from the opposite direction of the mounting surface and the main surface. In this structure, the capacitance of the capacitor, which includes the capacitor conductor, can be adjusted.
[0012] (5) In any of the electronic devices described in (1) to (4) above, the first connecting conductor may be disposed between the inductor conductor and the capacitor conductor in a direction opposite to the mounting surface and the main surface, and the distance between the inductor conductor and the first connecting conductor in the opposite direction is longer than the distance between the capacitor conductor and the first connecting conductor in the opposite direction. In this structure, the capacitance of the capacitor, which includes the capacitor conductor, can be adjusted. In addition, since the distance between the inductor conductor and the first connecting conductor is ensured, electrical interference between the inductor conductor and the first connecting conductor can be suppressed.
[0013] (6) In any of the electronic devices described in (1) to (4) above, the first connecting conductor may be disposed between the main surface and the inductor conductor in a direction opposite to the mounting surface and the main surface. In this structure, electrical interference between the first connecting conductor and other conductors can be suppressed.
[0014] (7) In any of the electronic devices described in (1) to (6) above, it is also possible to have multiple inductor conductors, and the first connecting conductor has: a first portion that electrically connects a shield disposed on one side to a shield disposed on another side, and is electrically connected to an inductor conductor; a second portion that electrically connects a shield disposed on one side to a shield disposed on another side, and is electrically connected to other inductor conductors; and a third portion that electrically connects the first portion and the second portion. In this structure, in a structure provided with multiple resonators comprising inductors, the grounding of the shield can be strengthened.
[0015] (8) In any of the electronic devices described in (1) to (7) above, multiple first connecting conductors may be configured. In this structure, the grounding of the shielding component can be strengthened.
[0016] (III) Beneficial Effects
[0017] According to one aspect of this disclosure, it is possible to enhance the grounding of the shielding component. Attached Figure Description
[0018] Figure 1 This is a perspective view of the electronic device according to the first embodiment.
[0019] Figure 2 yes Figure 1 A 3D view of the electronic device shown.
[0020] Figure 3 Viewed from the main side Figure 1 The diagram shows the electronic components.
[0021] Figure 4 Viewed from the side Figure 1 The diagram shows the electronic components.
[0022] Figure 5 Viewed from one end face side Figure 1 The diagram shows the electronic components.
[0023] Figure 6 Viewed from the other end face side Figure 1 The diagram shows the electronic components.
[0024] Figure 7 yes Figure 1 An exploded 3D view of the electronic device shown.
[0025] Figure 8 This is a top view showing the shield connecting the conductor.
[0026] Figure 9 yes Figure 1 The equivalent circuit diagram of the electronic device is shown.
[0027] Figure 10 It is a graph showing the relationship between frequency and attenuation.
[0028] Figure 11 This is a perspective view of the electronic device according to the second embodiment.
[0029] Figure 12 yes Figure 11 A 3D view of the electronic device shown.
[0030] Figure 13 Viewed from the side Figure 11 The diagram shows the electronic components.
[0031] Figure 14 Viewed from one end face side Figure 11 The diagram shows the electronic components.
[0032] Figure 15 Viewed from the other end face side Figure 11 The diagram shows the electronic components.
[0033] Figure 16 This is a perspective view of the electronic device according to the third embodiment.
[0034] Figure 17 yes Figure 16 A 3D view of the electronic device shown.
[0035] Figure 18 Viewed from the side Figure 16 The diagram shows the electronic components.
[0036] Figure 19 Viewed from one end face side Figure 16 The diagram shows the electronic components.
[0037] Figure 20 Viewed from the other end face side Figure 16 The diagram shows the electronic components. Detailed Implementation
[0038] The preferred embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, in the description of the drawings, the same or equivalent elements are labeled with the same reference numerals, and repeated descriptions are omitted.
[0039] [First Implementation]
[0040] Figure 1 This is a perspective view of the electronic device according to the first embodiment. Figure 2 yes Figure 1 A 3D view of the electronic device shown. Figure 3 Viewed from the main side Figure 1 The diagram shows the electronic components. Figure 4 Viewed from the side Figure 1 The diagram shows the electronic components. Figure 5 Viewed from one end face side Figure 1 The diagram shows the electronic components. Figure 6 Viewed from the other end face side Figure 1 A diagram of the electronic components is shown. (As shown) Figures 1-6 As shown, electronic device 1 includes: a body 2, a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, and a sixth terminal electrode 8, a resonator 9, and a shielding component E. Figures 1-3The diagram of shielding component E is omitted in the text.
[0041] Substance 2 is rectangular parallelepiped in shape. The rectangular parallelepiped shape includes a cuboid with chamfered corners and edges, and a cuboid with rounded corners and edges. Substance 2 has a pair of end faces (side faces) 2a and 2b, a pair of main faces 2c and 2d, and a pair of side faces 2e and 2f as its outer surfaces. End faces 2a and 2b are opposite each other. Main faces 2c and 2d are opposite each other. Side faces 2e and 2f are opposite each other. Hereinafter, the opposing direction of end faces 2a and 2b is designated as the first direction D1, the opposing direction of main faces 2c and 2d as the second direction D2, and the opposing direction of side faces 2e and 2f as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately orthogonal to each other.
[0042] End faces 2a and 2b extend in the second direction D2, connecting to main faces 2c and 2d. End faces 2a and 2b also extend in the third direction D3, connecting to side faces 2e and 2f. Main faces 2c and 2d extend in the first direction D1, connecting to end faces 2a and 2b. Main faces 2c and 2d also extend in the third direction D3, connecting to side faces 2e and 2f. Side faces 2e and 2f extend in the first direction D1, connecting to end faces 2a and 2b. Side faces 2e and 2f also extend in the second direction D2, connecting to main faces 2c and 2d.
[0043] Main surface 2d is a mounting surface, for example, when mounting electronic device 1 onto other electronic devices (e.g., circuit substrates or stacked electronic devices), it is the surface opposite to other electronic devices. End surfaces 2a and 2b are surfaces that are continuous from the mounting surface (i.e., main surface 2d).
[0044] The length of the base body 2 in the first direction D1 is longer than the length of the base body 2 in the second direction D2 and the length of the base body 2 in the third direction D3. The length of the base body 2 in the second direction D2 is shorter than the length of the base body 2 in the third direction D3. That is, in this embodiment, the end faces 2a and 2b, the main faces 2c and 2d, and the side faces 2e and 2f are rectangular. The length of the base body 2 in the second direction D2 can also be equal to or longer than the length of the base body 2 in the third direction D3.
[0045] Furthermore, in this embodiment, "equal" can mean not only equal, but also values that include minor differences or manufacturing errors within a predetermined range. For example, multiple values are considered equal as long as they are within ±5% of the average of the multiple values.
[0046] The base body 2 consists of multiple insulating layers 10 (see reference). Figure 7It is formed by stacking layers in the second direction D2. That is, the stacking direction of the base body 2 is the second direction D2. In the actual base body 2, multiple insulating layers 10 can be integrated to the extent that the boundaries between the layers are not visually discernible, or they can be integrated in a way that the boundaries between the layers are visually discernible.
[0047] The insulating layer 10 is, for example, composed of a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, at least one selected from BaTiO3-based materials, Ba(Ti,Zr)O3-based materials, (Ba,Ca)TiO3-based materials, glass materials, or alumina materials.
[0048] First terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are respectively disposed on the body 2. First terminal electrode 3, second terminal electrode 4, third terminal electrode 5, fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are respectively disposed on the main surface 2d of the body 2. First terminal electrode 3, second terminal electrode 4, and third terminal electrode 5 are disposed near the side surface 2e. Fourth terminal electrode 6, fifth terminal electrode 7, and sixth terminal electrode 8 are disposed near the side surface 2f.
[0049] The first terminal electrode 3 is located on the end face 2a side, and the third terminal electrode 5 is located on the end face 2b side. The second terminal electrode 4 is located between the first terminal electrode 3 and the third terminal electrode 5 in the first direction D1. The fourth terminal electrode 6 is located on the end face 2a side, and the sixth terminal electrode 8 is located on the end face 2b side. The fifth terminal electrode 7 is located between the fourth terminal electrode 6 and the sixth terminal electrode 8 in the first direction D1. The first terminal electrode 3 and the fourth terminal electrode 6 are arranged opposite each other in the third direction D3. The second terminal electrode 4 and the fifth terminal electrode 7 are arranged opposite each other in the third direction D3. The third terminal electrode 5 and the sixth terminal electrode 8 are arranged opposite each other in the third direction D3.
[0050] The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are all rectangular in shape. The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are respectively configured such that each side is along a first direction D1 or a third direction D3. The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 protrude beyond the main surface 2d. That is, in this embodiment, the surfaces of each of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are not flush with the main surface 2d. The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 are made of a conductive material (e.g., Cu).
[0051] Electroplating or electroless plating can be performed to form a plating layer (not shown) containing, for example, Ni, Sn, Au, etc., on each of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8. The plating layer may, for example, be a Ni plating film containing Ni and covering the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8, and an Au plating film containing Au and covering the Ni plating film.
[0052] The shielding element E is provided to reduce the influence of external electromagnetic fields on the electronic device 1. The shielding element E is disposed on end faces 2a, 2b, main face 2c, and side faces 2e, 2f. The shielding element E integrally covers the entire surface of each of the end faces 2a, 2b, main face 2c, and side faces 2e, 2f. The shielding element E is made of a conductive material (e.g., Cu). The shielding element E can be a single layer or a multilayer structure. The thickness of the shielding element E can, for example, be in the range of 0.1–10 μm.
[0053] Figure 7 yes Figure 1 An exploded perspective view of electronic device 1 is shown. (As shown...) Figures 1 to 7As shown, the resonator 9 includes: a first conductor 11, a second conductor 12, a third conductor 13, a fourth conductor 14, an inductor conductor 15, an inductor conductor 16, an inductor conductor 17, an inductor conductor 18, a shielding connecting conductor (first connecting conductor) 19, a connecting conductor (second connecting conductor) 20, a connecting conductor (second connecting conductor) 21, a connecting conductor (second connecting conductor) 22, a connecting conductor (second connecting conductor) 23, a capacitor conductor 24, a connecting conductor (second connecting conductor) 25, a connecting conductor (second connecting conductor) 26, a connecting conductor (second connecting conductor) 27, a connecting conductor (second connecting conductor) 28, a capacitor conductor 29, a capacitor conductor 30, a capacitor conductor 31, a capacitor conductor 32, a connecting conductor (second connecting conductor) 33, a connecting conductor (second connecting conductor) 34, and a connecting conductor (second connecting conductor) 36. The following conductors are included: capacitor conductor 37, capacitor conductor 38, connecting conductor (second connecting conductor) 39, connecting conductor (second connecting conductor) 40, connecting conductor 41, connecting conductor 42, connecting conductor (second connecting conductor) 43, connecting conductor (second connecting conductor) 44, inductor conductor 45, inductor conductor 46, capacitor conductor 47, capacitor conductor 48, connecting conductor 49, connecting conductor 50, connecting conductor (second connecting conductor) 51, connecting conductor (second connecting conductor) 52, connecting conductor (second connecting conductor) 53, connecting conductor (second connecting conductor) 54, grounding conductor 55, inductor conductor 56, inductor conductor 57, connecting conductor 58, connecting conductor 59, connecting conductor 60, connecting conductor 61, connecting conductor 62, connecting conductor 63, connecting conductor 64, connecting conductor 65, connecting conductor 66, and connecting conductor 67. In this embodiment, the resonator 9 includes two resonators.
[0054] Each conductor may contain a conductive material (e.g., Ag or Pd). Each conductor may be configured as a sintered body containing a conductive paste containing a conductive material (e.g., Ag powder or Pd powder).
[0055] The first conductor 11 extends along the second direction D2. The first conductor 11 can be composed of multiple via conductors B1. One end of the first conductor 11 (the end on the main surface 2c side) is connected to the inductor conductor 15 and the inductor conductor 17. The other end of the first conductor 11 (the end on the main surface 2d side) is connected to the capacitor conductor 29.
[0056] The second conductor 12 extends along the second direction D2. The second conductor 12 can be composed of multiple via conductors B2. One end of the second conductor 12 (the end on the main surface 2c side) is connected to the inductor conductor 15 and the inductor conductor 17. The other end of the second conductor 12 (the end on the main surface 2d side) is connected to the shielding connection conductor 19.
[0057] The third conductor 13 extends along the second direction D2. The third conductor 13 can be composed of multiple via conductors B3. One end of the third conductor 13 (the end on the main surface 2c side) is connected to the inductor conductor 16 and the inductor conductor 18. The other end of the third conductor 13 (the end on the main surface 2d side) is connected to the capacitor conductor 30.
[0058] The fourth conductor 14 extends along the second direction D2. The fourth conductor 14 can be composed of multiple via conductors B4. One end of the fourth conductor 14 (the end on the main surface 2c side) is connected to inductor conductors 16 and 18. The other end of the fourth conductor 14 (the end on the main surface 2d side) is connected to the shielding connection conductor 19.
[0059] Connecting conductors 20, 25, 33, 39, and 51 electrically connect the shielding connecting conductor 19 to the grounding conductor 55. Connecting conductors 21, 26, 34, 40, and 52 electrically connect the shielding connecting conductor 19 to the grounding conductor 55.
[0060] Connecting conductors 22, 27, 35, 43, and 53 electrically connect the shielding connecting conductor 19 to the grounding conductor 55. Connecting conductors 23, 28, 36, 44, and 54 electrically connect the shielding connecting conductor 19 to the grounding conductor 55.
[0061] Connecting conductor 41 electrically connects capacitor conductor 29 and capacitor conductor 47. Connecting conductor 42 electrically connects capacitor conductor 30 and capacitor conductor 48.
[0062] Connecting conductor 49 is electrically connected to grounding conductor 55. Connecting conductor 49 is approximately L-shaped. One end of connecting conductor 49 is exposed at end face 2a and connected to shielding component E. The other end of connecting conductor 49 is exposed at side face 2f and connected to shielding component E. Connecting conductor 50 is electrically connected to grounding conductor 55. Connecting conductor 50 is approximately L-shaped. One end of connecting conductor 50 is exposed at end face 2b and connected to shielding component E. The other end of connecting conductor 50 is exposed at side face 2f and connected to shielding component E.
[0063] Inductor conductor 45 is electrically connected to inductor conductor 56. Inductor conductor 46 is electrically connected to inductor conductor 57.
[0064] Connecting conductor 58 electrically connects inductor conductor 56 to the first terminal electrode 3. Connecting conductors 59 and 60 electrically connect ground conductor 55 to the second terminal electrode 4. Connecting conductor 61 electrically connects inductor conductor 57 to the third terminal electrode 5.
[0065] Connecting conductors 62 and 63 electrically connect the grounding conductor 55 to the fourth terminal electrode 6. Connecting conductors 64 and 65 electrically connect the grounding conductor 55 to the fifth terminal electrode 7. Connecting conductors 66 and 67 electrically connect the grounding conductor 55 to the sixth terminal electrode 8.
[0066] Figure 8 This is a top view showing the shield connecting conductor 19. (Example) Figure 8 As shown, the shielding connecting conductor 19 has a first portion 19A, a second portion 19B, and a third portion 19C. The first portion 19A, the second portion 19B, and the third portion 19C can be integrally formed. The first portion 19A extends in the third direction D3. The second portion 19B extends in the third direction D3. The first portion 19A and the second portion 19B are spaced apart in the first direction D1.
[0067] One end of the first part 19A is exposed on side 2e and connected to the shielding member E. The other end of the first part 19A is exposed on side 2f and connected to the shielding member E. The first part 19A electrically connects the shielding member E disposed on side 2e and the shielding member E disposed on side 2f. That is, the first part 19A forms an electrical path between the shielding member E disposed on side 2e and the shielding member E disposed on side 2f. A second conductor 12 is connected to the first part 19A.
[0068] One end of the second part 19B is exposed on side 2e and connected to the shielding member E. The other end of the second part 19B is exposed on side 2f and connected to the shielding member E. A fourth conductor 14 is connected to the second part 19B. That is, the second part 19B forms an electrical path between the shielding member E disposed on side 2e and the shielding member E disposed on side 2f.
[0069] The third part 19C extends in the first direction D1. The third part 19C connects the first part 19A and the second part 19B.
[0070] Viewed from the second direction D2, a portion of the shielding connection conductor 19 overlaps with the capacitor conductor 24. That is, viewed from the second direction D2, the shielding connection conductor 19 and the capacitor conductor 24 have an overlapping portion.
[0071] like Figure 4 and Figure 7 As shown, the shielding connecting conductor 19 is positioned between the inductor conductors 17 and 18 and the capacitor conductor 24. The distance K1 between the shielding connecting conductor 19 and the inductor conductor 17 is longer than the distance K2 between the shielding connecting conductor 19 and the capacitor conductor 24 (K1 > K2). In other words, the distance K2 between the shielding connecting conductor 19 and the capacitor conductor 24 is shorter than the distance K1 between the shielding connecting conductor 19 and the inductor conductor 17.
[0072] Figure 9 yes Figure 1 The equivalent circuit diagram of electronic device 1 is shown. Figure 9 As shown, the electronic device 1 includes: an input port P1, an output port P2, a grounding device Gnd, an inductor L1, an inductor L2, an inductor L3, an inductor L4, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, and a capacitor C8.
[0073] Input port P1 is formed by the third terminal electrode 5. Output port P2 is formed by the first terminal electrode 3. Grounding component Gnd is formed by the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8.
[0074] Inductor L1 is configured to include inductor conductor 45 and inductor conductor 56. Inductor L2 is configured to include inductor conductor 46 and inductor conductor 57. Inductor L3 is configured to include inductor conductor 15 and inductor conductor 17. Inductor L4 is configured to include inductor conductor 16 and inductor conductor 18.
[0075] Capacitor C1 is configured to include capacitor conductor 29 and capacitor conductor 37. Capacitor C2 is configured to include capacitor conductor 24 and capacitor conductor 29. Capacitor C3 is configured to include capacitor conductor 24 and capacitor conductor 31.
[0076] Capacitor C4 is configured to include capacitor conductor 30 and capacitor conductor 38. Capacitor C5 is configured to include capacitor conductor 24 and capacitor conductor 30. Capacitor C6 is configured to include capacitor conductor 24 and capacitor conductor 32.
[0077] Capacitor C7 is configured to include capacitor conductor 47 and ground conductor 55. Capacitor C8 is configured to include capacitor conductor 48 and ground conductor 55.
[0078] As described above, the electronic device 1 of this embodiment includes a shielding member connecting conductor 19 that electrically connects a shielding member E disposed on side 2e to a shielding member E disposed on side 2f. The shielding member connecting conductor 19 is electrically connected to the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 via a grounding conductor 55 through connecting conductors 20, 21, 22, 23, 25, 26, 27, 28, 33, 34, 35, 36, 39, 40, 43, 44, 51, 52, 53, and 54. Thus, in the electronic device 1, since the shielding members E disposed on sides 2e and 2f are electrically connected through the shielding member connecting conductor 19, the shielding member connecting conductor 19 forms the electrical path between the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 (grounding terminal) and the shielding member E. Therefore, the grounding of the shielding component E can be strengthened in electronic device 1. As a result, the influence of external electromagnetic fields on electronic device 1 can be reduced.
[0079] Figure 10 This is a graph showing the relationship between frequency and attenuation. In Figure 10 In the diagram, the horizontal axis represents the frequency band [MHz], and the vertical axis represents the attenuation [dB]. Figure 10 In the diagram, solid line G1 represents the result of electronic device 1, and dashed line G2 represents the result of the electronic device in the comparative example that does not have a shielded connection conductor 19. For example... Figure 10 As shown, in electronic device 1, by strengthening the grounding of the shielding member E, the attenuation in the high-frequency band (the part surrounded by the dashed line) is improved compared to the electronic device of the comparative example. Furthermore, in electronic device 1, by strengthening the grounding of the shielding member E, the attenuation caused by the reduction of magnetic coupling (the part surrounded by the double-dotted line) is improved compared to the electronic device of the comparative example.
[0080] In the electronic device 1 of this embodiment, the shielding member connecting conductor 19 electrically connects the shielding members E disposed on opposite sides 2e and 2f. Thus, in the electronic device 1, the shielding member connecting conductor 19 electrically connects the shielding members E disposed on separate (non-adjacent) sides 2e and 2f. Consequently, in the electronic device 1, the shielding members E disposed on sides 2e and 2f are directly electrically connected via the shielding member connecting conductor 19. Therefore, in the electronic device 1, the grounding of the shielding members E can be strengthened.
[0081] In the electronic device 1 of this embodiment, the shielding connecting conductor 19 has a first portion 19A, a second portion 19B, and a third portion 19C. The first portion 19A and the second portion 19B electrically connect the shielding member E disposed on the side 2e to the shielding member E disposed on the side 2f, respectively. The third portion 19C connects the first portion 19A and the second portion 19B. In this structure, the first portion 19A and the second portion 19B form the electrical path between the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 and the shielding member E. Therefore, in the electronic device 1, grounding reinforcement can be further achieved.
[0082] In the electronic device 1 of this embodiment, when viewed from the second direction D2, the shielding connecting conductor 19 overlaps with the capacitor conductor 24. That is, in the electronic device 1, when viewed from the second direction D2, the shielding connecting conductor 19 and the capacitor conductor 24 have an overlapping portion. In this structure, the capacitance of the capacitor comprising the capacitor conductor 24 can be adjusted.
[0083] In the electronic device 1 of this embodiment, the shielding connection conductor 19 is disposed between the inductor conductors 17 and 18 and the capacitor conductor 24. The distance K1 between the shielding connection conductor 19 and the inductor conductor 17 is longer than the distance K2 between the shielding connection conductor 19 and the capacitor conductor 24 (K1 > K2). In other words, the distance K2 between the shielding connection conductor 19 and the capacitor conductor 24 is shorter than the distance K1 between the shielding connection conductor 19 and the inductor conductor 17. In this structure, the capacitance of the capacitor including the capacitor conductor 24 can be adjusted. In addition, since the distance between the inductor conductors 17 and 18 and the shielding connection conductor 19 is ensured, electrical interference generated between the inductor conductors 17 and 18 and the shielding connection conductor 19 can be suppressed.
[0084] [Second Implementation]
[0085] Next, the second embodiment will be described. Figure 11 This is a perspective view of the electronic device according to the second embodiment. Figure 12 yes Figure 11 A 3D view of the electronic device shown. Figure 13 Viewed from the side Figure 11 The diagram shows the electronic components. Figure 14 It is represented from one end face side. Figure 11 The diagram shows the electronic components. Figure 15 Represented from the other end face side Figure 11 The diagram shows the electronic components.
[0086] like Figures 11-15As shown, the electronic device 1A includes: a body 2; a first terminal electrode 68, a second terminal electrode 69, a third terminal electrode 70, a fourth terminal electrode 71, a fifth terminal electrode 72, a sixth terminal electrode 73, a seventh terminal electrode 74, an eighth terminal electrode 75, and a ninth terminal electrode 76; a resonator 77; and a shielding member E. Figure 11 The diagram of shielding component E is omitted in the text.
[0087] First terminal electrode 68, second terminal electrode 69, third terminal electrode 70, fourth terminal electrode 71, fifth terminal electrode 72, sixth terminal electrode 73, seventh terminal electrode 74, eighth terminal electrode 75, and ninth terminal electrode 76 are respectively disposed on the base body 2. First terminal electrode 68, second terminal electrode 69, third terminal electrode 70, fourth terminal electrode 71, fifth terminal electrode 72, sixth terminal electrode 73, seventh terminal electrode 74, eighth terminal electrode 75, and ninth terminal electrode 76 are respectively disposed on the main surface 2d of the base body 2.
[0088] The first terminal electrode 68 constitutes the input terminal for signal input. The seventh terminal electrode 74 and the ninth terminal electrode 76 constitute the output terminal for signal output. The second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75 constitute the ground terminal.
[0089] like Figure 11 , Figures 13-15 As shown, the resonator 77 includes: a first conductor (second connecting conductor) 78, a second conductor (second connecting conductor) 79, a third conductor (second connecting conductor) 80, a fourth conductor (second connecting conductor) 81, a fifth conductor (second connecting conductor) 82, a sixth conductor (second connecting conductor) 83, and a shielding connecting conductor (first connecting conductor) 84. The resonator 77 also includes multiple inductor conductors and multiple capacitor conductors.
[0090] A shielding connection conductor 84 is disposed in the second direction D2 between the main surface 2c and the inductor conductor. The shielding connection conductor 84 has a portion extending along the first direction D1 and a portion extending along the third direction D3. The shielding connection conductor 84 is exposed at each of the end faces 2a, 2b, side faces 2e, and 2f, and is connected to the shielding element E. The shielding connection conductor 84 electrically connects the shielding element E disposed at the end faces 2a, 2b, side faces 2e, and side faces 2f, respectively.
[0091] The first conductor 78, the second conductor 79, the third conductor 80, the fourth conductor 81, the fifth conductor 82, and the sixth conductor 83 electrically connect the shielding connecting conductor 84 to the second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75.
[0092] As described above, in the electronic device 1A of this embodiment, a shielding connection conductor 84 is provided, which electrically connects the shielding member E disposed on end face 2a, the shielding member E disposed on end face 2b, the shielding member E disposed on side face 2e, and the shielding member E disposed on side face 2f. The shielding connection conductor 84 is electrically connected to the second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75 through the first conductor 78, the second conductor 79, the third conductor 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75. Thus, in the electronic device 1A, since the shielding members E disposed on end faces 2a, 2b and sides 2e, 2f are electrically connected through the shielding connection conductor 84, the shielding connection conductor 84 forms the electrical path between the second terminal electrode 69, the third terminal electrode 70, the fourth terminal electrode 71, the fifth terminal electrode 72, the sixth terminal electrode 73, and the eighth terminal electrode 75 (ground terminal) and the shielding member E. Therefore, the grounding of the shielding component E can be strengthened in electronic device 1A. As a result, the influence of external electromagnetic fields on electronic device 1A can be reduced.
[0093] In the electronic device 1A of this embodiment, the shielding connection conductor 84 is disposed on the second direction D2 between the main surface 2c and the inductor conductor. In this structure, electrical interference between the shielding connection conductor 84 and other conductors can be suppressed.
[0094] [Third Implementation]
[0095] Next, the third embodiment will be described. Figure 16 This is a perspective view of the electronic device according to the third embodiment. Figure 17 yes Figure 16 A 3D view of the electronic device shown. Figure 18 Viewed from the side Figure 16 The diagram shows the electronic components. Figure 19 Viewed from one end face side Figure 16 The diagram shows the electronic components. Figure 20 Viewed from the other end face side Figure 16 A diagram of the electronic components is shown. (As shown) Figures 16-20As shown, electronic device 1B includes: a body 2; a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6, a fifth terminal electrode 7, and a sixth terminal electrode 8; a resonator 9A; and a shielding member E. Figure 16 as well as Figure 17 The diagram of shielding component E is omitted.
[0096] The resonator 9A includes a shielding connection conductor (first connection conductor) 90. The shielding connection conductor 90 has a first conductor 90A, a second conductor 90B, and a third conductor 90C. The first conductor 90A, the second conductor 90B, and the third conductor 90C can be integrally formed. The shielding connection conductor 90 forms an electrical path between the shielding member E disposed on end face 2a, the shielding member E disposed on end face 2b, the shielding member E disposed on side face 2e, and the shielding member E disposed on side face 2f.
[0097] The first conductor 90A is configured to include a first portion 90Aa, a second portion 90Ab, a third portion 90Ac, and a fourth portion 90Ad. The first portion 90Aa, the second portion 90Ab, the third portion 90Ac, and the fourth portion 90Ad can be integrally formed. Viewed from the second direction D2, the first conductor 90A is frame-shaped.
[0098] The first part 90Aa extends along the third side towards D3. One end of the first part 90Aa is exposed on side 2e and connected to the shielding member E. The other end of the first part 90Aa is exposed on side 2f and connected to the shielding member E. The second part 90Ab extends along the third side towards D3. One end of the second part 90Ab is exposed on side 2e and connected to the shielding member E. The other end of the second part 90Ab is exposed on side 2f and connected to the shielding member E. The end of the second part 90Ab on end face 2a is exposed on end face 2a and connected to the shielding member E.
[0099] The third part 90Ac connects the first part 90Aa and the second part 90Ab. The end of the third part 90Ac on side 2e is exposed on side 2e and connected to the shielding member E. The fourth part 90Ad connects the first part 90Aa and the second part 90Ab. The end of the fourth part 90Ad on side 2f is exposed on side 2f and connected to the shielding member E.
[0100] The second conductor 90B is configured to include a first portion 90Ba, a second portion 90Bb, a third portion 90Bc, and a fourth portion 90Bd. The first portion 90Ba, the second portion 90Bb, the third portion 90Bc, and the fourth portion 90Bd can be integrally formed. Viewed from the second direction D2, the second conductor 90B is frame-shaped.
[0101] The first part 90Ba extends along the third side towards D3. One end of the first part 90Ba is exposed on side 2e and connected to the shielding member E. The other end of the first part 90Ba is exposed on side 2f and connected to the shielding member E. The second part 90Bb extends along the third side towards D3. One end of the second part 90Bb is exposed on side 2e and connected to the shielding member E. The other end of the second part 90Bb is exposed on side 2f and connected to the shielding member E. The end of the second part 90Bb on end face 2b is exposed on end face 2b and connected to the shielding member E.
[0102] The third part 90Bc connects the first part 90Ba and the second part 90Bb. The end of the third part 90Bc on side 2e is exposed on side 2e and connected to the shielding member E. The fourth part 90Bd connects the first part 90Ba and the second part 90Bb. The end of the fourth part 90Bd on side 2f is exposed on side 2f and connected to the shielding member E.
[0103] The third conductor 90C extends in the first direction D1. The third conductor 90C connects the first conductor 90A and the second conductor 90B.
[0104] As described above, the electronic device 1B of this embodiment includes a shielding connection conductor 90, which electrically connects the shielding member E disposed on end face 2a, the shielding member E disposed on end face 2b, the shielding member E disposed on side face 2e, and the shielding member E disposed on side face 2f. The shielding connection conductor 90 is electrically connected to the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 via a grounding conductor 55 through connecting conductors 20, 21, 22, 23, 25, 26, 27, 28, 33, 34, 35, 36, 39, 40, 43, 44, 51, 52, 53, and 54. Thus, in electronic device 1B, since the shielding member E disposed on end faces 2a, 2b and sides 2e, 2f is electrically connected via shielding member connecting conductor 90, the shielding member connecting conductor 90 forms the electrical path between the second terminal electrode 4, the fourth terminal electrode 6, the fifth terminal electrode 7, and the sixth terminal electrode 8 (grounding terminal) and the shielding member E. Therefore, in electronic device 1B, the grounding of the shielding member E can be strengthened. As a result, in electronic device 1B, the influence of external electromagnetic fields on electronic device 1B can be reduced.
[0105] The embodiments of this disclosure have been described above. However, this disclosure is not limited to the embodiments described above, and various modifications can be made without departing from its spirit.
[0106] In the above embodiment, the shielding connecting conductor 19, shielding connecting conductor 84, and shielding connecting conductor 90 are described as an example. However, multiple shielding connecting conductors may also be provided.
[0107] In the above embodiment, the example described is that the shielding member E is disposed on the end faces 2a and 2b, the main face 2c, and the sides 2e and 2f of the body 2. However, it is sufficient that the shielding member is disposed on at least the end faces 2a and 2b and the sides 2e and 2f.
[0108] In the first embodiment described above, the method of electrically connecting the shielding member E disposed on side 2e to the shielding member E disposed on side 2f using the shielding member connecting conductor 19 is described as an example. However, the shielding member connecting conductor only needs to connect the shielding members E disposed on two of the four sides: end faces 2a and 2b, and sides 2e and 2f.
[0109] In the second embodiment described above, the shielding member E disposed on end face 2a, shielding member E disposed on end face 2b, shielding member E disposed on side face 2e, and shielding member E disposed on side face 2f are described as an example. However, the shielding member connecting conductor 84 may also electrically connect shielding member E disposed on end face 2a or end face 2b, shielding member E disposed on side face 2e, and shielding member E disposed on side face 2f, i.e., shielding member E disposed on all three faces.
Claims
1. An electronic device comprising: a bulk body having mounting surfaces opposing each other and main surfaces, and four side surfaces connecting a pair of the main surfaces; shielding members covering the four side surfaces of the bulk body; a ground terminal disposed on the mounting surface and connected to a ground member; an inductor conductor and a capacitor conductor disposed in the bulk body; a first connection conductor electrically connecting the shielding member disposed on one of the four side surfaces to the shielding member disposed on another side surface different from the one side surface; and a second connection conductor electrically connecting the first connection conductor to the ground terminal.
2. The electronic device according to claim 1, wherein one of the side surfaces is disposed opposite to another of the side surfaces, the first connection conductor electrically connects the shielding members disposed on a pair of the side surfaces disposed opposite to each other.
3. The electronic device according to claim 1 or 2, wherein the first connection conductor electrically connects each of the shielding members disposed on at least three of the four side surfaces.
4. The electronic device according to claim 1 or 2, wherein a portion in which the capacitor conductor overlaps the first connection conductor is present as viewed in a direction in which the mounting surface and the main surface oppose each other.
5. The electronic device according to claim 1 or 2, wherein the first connection conductor is disposed between the inductor conductor and the capacitor conductor in a direction in which the mounting surface and the main surface oppose each other, a distance between the inductor conductor and the first connection conductor in the direction in which the mounting surface and the main surface oppose each other is longer than a distance between the capacitor conductor and the first connection conductor in the direction in which the mounting surface and the main surface oppose each other.
6. The electronic device according to claim 1 or 2, wherein the first connection conductor is disposed between the main surface and the inductor conductor in a direction in which the mounting surface and the main surface oppose each other.
7. The electronic device according to claim 1 or 2, comprising: a plurality of the inductor conductors, the first connection conductor has: a first portion electrically connecting the shielding member disposed on one of the side surfaces to the shielding member disposed on another of the side surfaces and electrically connected to one of the inductor conductors; a second portion electrically connecting the shielding member disposed on one of the side surfaces to the shielding member disposed on another of the side surfaces and electrically connected to another of the inductor conductors; and a third portion electrically connecting the first portion to the second portion.
8. The electronic device according to claim 1 or 2, wherein a plurality of the first connection conductors are disposed.
Citation Information
Patent Citations
Electronic component
JP2016012770A