Wireless circuit with reconfigurable signal coupler

Abstract

The invention relates to a wireless circuit with a reconfigurable signal coupler. An electronic device may include a transmit path carrying a signal. A reconfigurable signal coupler may be disposed on a transmit path and may include a signal path and a coupling path. Measurement circuitry may measure a power of a signal using a signal coupler. The signal path may be formed by at least a first winding in the first metallization layer. The coupling path may be formed from at least a stack of a second winding in the second metallization layer, a third winding in the third metallization layer, and an additional winding surrounded by the first winding, the second winding, and the third winding. The signal coupler may include first and second conductors and a switch between the first and second conductors. The control circuit may adjust the switch in the signal coupler to switch between using the first conductor and the second conductor in the coupling path or using only the second conductor in the coupling path.

Description

[0001] This application claims priority to U.S. Patent Application No. 18 / 826,796, filed September 6, 2024, and U.S. Patent Application No. 18 / 826,859, filed September 6, 2024, which are hereby incorporated by reference in their entirety. TECHNICAL FIELD

[0002] The present disclosure relates generally to electronic devices, including electronic devices having circuitry for transmitting radio frequency signals. BACKGROUND

[0003] Electronic devices often have signal transmission capability, in which a signal is transmitted onto an output load. Electronic devices with signal transmission capability include wireless electronic devices having a wireless transmitter that transmits a radio frequency signal onto an output load, such as an antenna.

[0004] It is often desirable to be able to measure one or more characteristics of an output load by measuring the power of a transmitted signal at the output load. Care must be taken that the circuitry used to measure the power of the transmitted signal does not occupy too much space in the device, does not cause undesirable loss of the transmitted signal, does not exhibit insufficient accuracy, and / or does not exhibit insufficient dynamic range. SUMMARY

[0005] An electronic device can include a transmit path coupled between an input node and an output node. A signal source can generate a signal at the input node of the transmit path. A reconfigurable signal coupler can be disposed on the transmit path. The reconfigurable signal coupler can include a signal path and a coupling path coextensive with the signal path. A measurement circuit can be coupled to a coupling node of the reconfigurable signal coupler. The measurement circuit can use the reconfigurable signal coupler to measure a power of the signal on the transmit path.

[0006] The signal path can be formed at least by a first winding in a first metallization layer of a substrate. The coupling path can be formed at least by a second winding in a second metallization layer overlapping the first winding, a third winding in a third metallization layer overlapping the first winding and the second winding, and a stack of additional windings encircled by the first winding, the second winding, and the third winding. The second winding, the third winding, and the stack of additional windings can be coupled in series. This can increase the amount of coupling between the signal path and the coupling path while minimizing the footprint of the reconfigurable signal coupler on the substrate.

[0007] The coupling path can include a first conductor, a second conductor, and a first switch coupling the first conductor to the second conductor. In some implementations, a second switch can couple the first conductor and the second conductor to the coupling node, and a third switch can couple the second conductor to a first impedance termination and a second impedance termination. In other implementations, the first conductor can be coupled in series between the first impedance termination and the first switch. A third switch can couple a second impedance termination to the second conductor, the second conductor being coupled in series between the coupling node and both the first switch and the third switch. A control circuit can adjust the switches to adjust the reconfigurable signal coupler between a high coupling mode and a low coupling mode. In the high coupling mode, both the first conductor and the second conductor form the coupling path. In the low coupling mode, only the second conductor forms the coupling path. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a schematic diagram of an exemplary electronic device having wireless circuitry in accordance with some embodiments.

[0009] Figure 2 is a schematic diagram of an exemplary wireless circuit in accordance with some embodiments.

[0010] Figure 3 is a diagram of an exemplary transmit path having a reconfigurable signal coupler for measuring radio frequency signals on the transmit path in accordance with some embodiments.

[0011] Figure 4 is a circuit diagram of an exemplary reconfigurable signal coupler configured in a high coupling mode in accordance with some embodiments.

[0012] Figure 5 is a circuit diagram of an exemplary reconfigurable signal coupler configured in a low coupling mode in accordance with some embodiments.

[0013] Figure 6 is a circuit diagram of another exemplary reconfigurable signal coupler configured in a high coupling mode in accordance with some embodiments.

[0014] Figure 7 is a circuit diagram of another exemplary reconfigurable signal coupler configured in a low coupling mode in accordance with some embodiments.

[0015] Figure 8 is a flowchart of exemplary operations involved in transmitting a radio frequency signal on a transmit path including a reconfigurable signal coupler in accordance with some embodiments.

[0016] Figure 9 is a cross-sectional side view of an exemplary reconfigurable signal coupler in accordance with some embodiments.

[0017] Figure 10This is a layout diagram of the first conductive layer in an exemplary reconfigurable signal coupler based on some implementation schemes.

[0018] Figure 11 This is a layout diagram of the second conductive layer in an exemplary reconfigurable signal coupler based on some implementation schemes.

[0019] Figure 12 This is a layout diagram of the third conductive layer in an exemplary reconfigurable signal coupler based on some implementation schemes.

[0020] Figure 13 This is a graph illustrating how an exemplary reconfigurable signal coupler, according to some implementations, can exhibit a higher dynamic range for measuring the power level of an RF signal than a fixed signal coupler. Detailed Implementation

[0021] Figure 1 The electronic device 10 may be: a computing device, such as a laptop computer, desktop computer, computer monitor containing an embedded computer, tablet computer, cellular phone, media player, or other handheld or portable electronic device; a smaller device, such as a wristwatch, a wristband, a headset or handset, a device embedded in glasses, goggles, a helmet, or other equipment worn on a user's head (e.g., an augmented reality, virtual reality, or mixed reality head-mounted display); or another wearable or micro device, a television, a computer monitor without an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which electronic equipment with a display is installed in a kiosk or a car), a voice-controlled speaker connected to the wireless Internet, a home entertainment device, a remote control device, a game controller, a peripheral user input device, a wireless base station or access point, equipment that enables the functionality of two or more of these devices; or other electronic equipment.

[0022] like Figure 1 As illustrated in the schematic diagram, device 10 may include components located on or within an electronic device housing, such as housing 12. Housing 12 (sometimes referred to as a shell) may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, metal alloys, etc.), other suitable materials, or combinations thereof. In some cases, housing 12 may be partially or entirely formed of a dielectric or other low-conductivity material (e.g., glass, ceramic, plastic, sapphire, etc.). In other cases, housing 12, or at least some of the structures constituting housing 12, may be formed of metallic elements.

[0023] Device 10 may include control circuitry 14. Control circuitry 14 may include storage devices, such as storage device circuitry 16. Storage device circuitry 16 may include hard disk drive storage devices, non-volatile memory (e.g., flash memory configured to form a solid-state drive or other electrically programmable read-only memory), volatile memory (e.g., static random access memory or dynamic random access memory), etc. Storage device circuitry 16 may include storage devices integrated within device 10, and / or removable storage media.

[0024] Control circuitry 14 may include processing circuitry, such as processing circuitry 18. Processing circuitry 18 may be used to control the operation of device 10. Processing circuitry 18 may include one or more processors, such as a microprocessor, microcontroller, digital signal processor, host processor, baseband processor integrated circuit, application-specific integrated circuit, central processing unit (CPU), graphics processing unit (GPU), etc. Control circuitry 14 may be configured to perform operations in device 10 using hardware (e.g., dedicated hardware or circuitry), firmware, and / or software. Software code for performing operations in device 10 may be stored on storage device circuitry 16 (e.g., storage device circuitry 16 may include a non-transitory (tangible) computer-readable storage medium storing software code). This software code may sometimes be referred to as program instructions, software, data, commands, or code. The software code stored on storage device circuitry 16 may be executed by processing circuitry 18.

[0025] Control circuitry 14 can be used to run software on device 10, such as satellite navigation applications, internet browsing applications, Voice over Internet Protocol (VoIP) telephone calling applications, email applications, media playback applications, operating system functions, etc. To support interaction with external equipment, control circuitry 14 can be used to implement communication protocols. Communication protocols that can be implemented using control circuitry 14 include Internet Protocol, Wireless Local Area Network (WLAN) protocols (e.g., IEEE 802.11 protocol—sometimes referred to as...). ), such as Protocols such as those used for other short-range wireless communication links, including protocols such as other Wireless Personal Area Network (WPAN) protocols, IEEE 802.11ad protocols (e.g., ultra-wideband protocols), cellular phone protocols (e.g., 3G protocols, 4G (LTE) protocols, 3GPP fifth-generation (5G) new radio (NR) protocols, sixth-generation (6G) protocols, sub-THz protocols, THz protocols, etc.), antenna diversity protocols, satellite navigation system protocols (e.g., Global Positioning System (GPS) protocols, Global Navigation Satellite System (GLONASS) protocols, etc.), antenna-based spatial ranging protocols, optical communication protocols, or any other desired communication protocol. Each communication protocol may be associated with a corresponding Radio Access Technology (RAT), which specifies the physical connection method used to implement the protocol.

[0026] Device 10 may include input-output circuitry 20. Input-output circuitry 20 may include input-output devices 22. Input-output devices 22 may be used to allow data to be supplied to device 10 and to allow data to be provided from device 10 to external devices. Input-output devices 22 may include user interface devices, data port devices, and other input-output components. For example, input-output devices 22 may include touch sensors, displays, light-emitting components such as displays without touch sensor capability, buttons (mechanical, capacitive, optical, etc.), scroll wheels, touchpads, keypads, keyboards, microphones, cameras, buttons, speakers, status indicators, audio jacks and other audio port components, digital data port devices, motion sensors (accelerometers, gyroscopes, and / or compasses that detect motion), capacitive sensors, proximity sensors, magnetic sensors, force sensors (e.g., force sensors coupled to a display to detect pressure applied to the display), etc. In some configurations, keyboards, headphones, displays, pointing devices such as touchpads, mice and joysticks, and other input-output devices can be coupled to device 10 using wired or wireless connections (e.g., some of the input-output devices 22 may be peripherals of the main processing unit or other parts of device 10 coupled via wired or wireless links).

[0027] Input-output circuitry 20 may include wireless circuitry 24 to support wireless communication. Wireless circuitry 24 (sometimes referred to herein as wireless communication circuitry 24) may include one or more antennas. Wireless circuitry 24 may also include baseband processor circuitry, transceiver circuitry, amplifier circuitry, filter circuitry, switching circuitry, RF transmission lines, RF front-end circuitry, and / or any other circuitry for transmitting and / or receiving RF signals using antennas.

[0028] Wireless circuit 24 can transmit and / or receive wireless signals within a corresponding frequency band of the electromagnetic spectrum (sometimes referred to herein as the communication band or simply the "band"). The frequency band handled by wireless circuit 24 may include the wireless local area network (WLAN) band (e.g., (IEEE 802.11) or other WLAN communication bands), such as the 2.4 GHz WLAN band (e.g., 2400 MHz to 2480 MHz), the 5 GHz WLAN band (e.g., 5180 MHz to 5825 MHz), 6E band (e.g., 5925MHz to 7125MHz), 7-band and / or other Frequency bands (e.g., 1875MHz to 5160MHz); Wireless Personal Area Network (WPAN) frequency bands, such as 2.4GHz. Frequency bands or other WPAN communication bands; cellular phone bands (e.g., bands from approximately 600 MHz to approximately 5 GHz, 3G bands, 4G LTE bands, 5G New Radio Frequency Range 1 (FR1) band below 10 GHz, 5G New Radio Frequency Range 2 (FR2) band between 20 GHz and 60 GHz, etc.); other centimeter or millimeter wave bands between 10 GHz and 100 GHz; sub-THz bands between approximately 100 GHz and 10 THz (e.g., 6G bands); near field communication (NFC) bands (e.g., at 13.56 MHz); satellite navigation bands (e.g., GPS bands from 1565 MHz to 1610 MHz, Global Navigation Satellite System (GLONASS) bands, BeiDou Navigation Satellite System (BDS) bands, etc.); ultra-wideband bands operating under the IEEE 802.15.4 protocol and / or other ultra-wideband (UWB) communication protocols; communication bands under the 3GPP wireless communication standards family; in IEEE Communication bands under the 802.XX standard family; and / or any other desired bands of interest.

[0029] Figure 2 This is a diagram showing exemplary components within wireless circuit 24. (Example...) Figure 2 As shown, wireless circuitry 24 may include one or more processors such as processor 26, radio frequency (RF) transceiver circuitry such as RF transceiver 28, RF front-end circuitry such as RF front-end module (FEM) 40, and antenna 42. Processor 26 may include baseband circuitry (e.g., one or more baseband processing circuits), application processor, digital signal processor, microcontroller, microprocessor, central processing unit (CPU), programmable device, combinations and / or of these circuits. Figure 1One or more processors are located within the processing circuitry 18. Processor 26 can be configured to generate digital (transmit or baseband) signals. Processor 26 can be coupled to transceiver 28 via path 34 (sometimes referred to as the baseband path). Transceiver 28 can be coupled to antenna 42 via RF transmit line path 36. If desired, one or more RF front-end modules (such as RF front-end module 40) can be disposed between transceiver 28 and antenna 42 along RF transmit line path 36.

[0030] Wireless circuit 24 may include one or more antennas, such as antenna 42. Antenna 42 can be formed using any desired antenna structure. For example, antenna 42 may be an antenna with a resonant element, formed from a loop antenna structure, patch antenna structure, inverted F-shaped antenna (IFA) structure, slot antenna structure, planar inverted F-shaped antenna (PIFA) structure, helical antenna structure, monopole antenna, dipole, dielectric resonator antenna (DRA) structure, waveguide antenna structure, bowtie antenna structure, or a combination of these designs. If desired, two or more antennas 42 may be arranged in one or more phased antenna arrays (e.g., for transmitting radio frequency signals at millimeter-wave frequencies). If desired, parasitic elements may be included in antenna 42 to adjust antenna performance. If desired, antenna 42 may be provided with a conductive cavity that supports the antenna resonant element of antenna 42 (e.g., antenna 42 may be a cavity-backed antenna, such as a cavity-backed slot antenna).

[0031] exist Figure 2 In the example, for clarity, wireless circuit 24 is illustrated as including only a single processor 26, a single transceiver 28, a single front-end module 40, and a single antenna 42. Generally, wireless circuit 24 may include any desired number of processors 26, any desired number of transceivers 28, any desired number of front-end modules 40, and any desired number of antennas 42. Each processor 26 may be coupled to one or more transceivers 28 via a corresponding path 34. Each transceiver 28 may include transmitter circuitry configured to output uplink signals to antenna 42, may include receiver circuitry configured to receive downlink signals from antenna 42, and may be coupled to one or more antennas 42 via a corresponding RF transmit line path 36. Each RF transmit line path 36 may have a corresponding front-end module 40 disposed thereon. If desired, two or more front-end modules 40 may be disposed on the same RF transmit line path 36. If desired, one or more RF transmit line paths 36 in wireless circuit 24 may be implemented without any front-end modules disposed thereon.

[0032] The front-end module (FEM) 40 may include radio frequency front-end circuitry that operates on radio frequency signals transmitted (transmitted and / or received) via radio frequency transmission line path 36. The front-end module may include, for example, front-end module (FEM) components such as radio frequency filter circuitry 44 (e.g., low-pass filter, high-pass filter, notch filter, band-pass filter, multiplexing circuitry, duplexer circuitry, dual-signal circuitry, triplexer circuitry, etc.), switching circuitry 46 (e.g., one or more radio frequency switches), radio frequency amplifier circuitry 48 (e.g., one or more power amplifiers and one or more low-noise amplifiers), impedance matching circuitry (e.g., circuitry that helps match the impedance of antenna 42 to the impedance of radio frequency transmission line 36), antenna tuning circuitry (e.g., a network of capacitors, resistors, inductors, and / or switches that adjust the frequency response of antenna 42), radio frequency coupler circuitry, charge pump circuitry, power management circuitry, digital control and interface circuitry, and / or any other desired circuitry that operates on the radio frequency signals transmitted and / or received by antenna 42. Each of the front-end module components may be mounted on a common (shared) substrate, such as a rigid printed circuit board substrate or a flexible printed circuit board substrate. If needed, various front-end module components can also be integrated into a single integrated circuit chip.

[0033] Filter circuit 44, switching circuit 46, amplifier circuit 48, and other circuits may be disposed along RF transmission line path 36, may be incorporated into FEM 40, and / or may be incorporated into antenna 42 (e.g., to support antenna tuning, to support operation in a desired frequency band, etc.). These components (sometimes referred to herein as antenna tuning components) may be adjusted (e.g., using control circuit 14) to adjust the frequency response and wireless performance of antenna 42 over time.

[0034] The RF transmit line path 36 may be coupled to an antenna feed section on the antenna 42. The antenna feed section may, for example, include a positive antenna feed terminal and a ground antenna feed terminal. The RF transmit line path 36 may have a positive transmit line signal path coupled to a positive antenna feed terminal on the antenna 42. The RF transmit line path 36 may also have a ground transmit line signal path coupled to a ground antenna feed terminal on the antenna 42. This example is illustrative, and in general, the antenna 42 may be fed using any desired antenna feeding scheme. If desired, the antenna 42 may have multiple antenna feed sections coupled to one or more RF transmit line paths 36.

[0035] RF transmission path 36 may include a means for communication with device 10 ( Figure 1The device 10 comprises one or more transmission lines that guide radio frequency (RF) signals within it. Transmission lines in device 10 may include coaxial cables, microstrip transmission lines, stripline transmission lines, edge-coupled microstrip transmission lines, edge-coupled stripline transmission lines, and combinations thereof. Transmission lines in device 10 (such as those in RF transmission line path 36) may be integrated into rigid and / or flexible printed circuit boards. In a suitable embodiment, the RF transmission line path (such as RF transmission line path 36) may also include transmission line conductors integrated within a multilayer laminate (e.g., layers of conductive materials (such as copper) and dielectric materials (such as resin) laminated together without the intervention of an adhesive). If desired, the multilayer laminate may be folded or bent in multiple dimensions (e.g., two-dimensional or three-dimensional) and may retain its bent or folded shape after bending (e.g., the multilayer laminate may be folded into a specific three-dimensional structural shape to wire around other device components and may be rigid enough to retain its shape after folding without the need for reinforcements or other structures to hold it in place). All the multiple layers of a laminated structure can be laminated together in batches without adhesive (e.g., in a single pressing process) (e.g., in contrast to performing multiple pressing processes to laminate multiple layers together with adhesive).

[0036] Transceiver 28 may include a wireless local area network communication band (e.g., (IEEE 802.11) or other WLAN communication bands, such as the 2.4 GHz WLAN band (e.g., 2400 MHz to 2480 MHz), the 5 GHz WLAN band (e.g., 5180 MHz to 5825 MHz), 6E band (e.g., 5925MHz to 7125MHz) and / or others WLAN transceiver circuitry for frequency bands (e.g., 1875MHz to 5160MHz); handling 2.4GHz. WPAN transceiver circuits for frequency bands or other wireless personal area network communication bands; cellular transceiver circuits for cellular telephone bands (e.g., bands from approximately 600 MHz to approximately 5 GHz, 3G bands, 4G LTE bands, 5G New Radio Frequency Range 1 (FR1) band below 10 GHz, 5G New Radio Frequency Range 2 (FR2) band between 20 GHz and 60 GHz, 6G bands above 100 GHz, etc.); near-field communication transceiver circuits for near-field communication (NFC) bands (e.g., at 13.56 MHz); satellite navigation receiver circuits for satellite navigation bands (e.g., GPS band from 1565 MHz to 1610 MHz, GLONASS band, BeiDou Navigation Satellite System (BDS) band, etc.); using IEEE Ultra-wideband transceiver circuitry for handling communications using the 802.15.4 protocol and / or other ultra-wideband (UWB) communication protocols; and / or any other desired radio frequency transceiver circuitry for covering any other desired communication frequency band of interest.

[0037] As used herein, the term "transmitting radio frequency signals" means the transmission and / or reception of radio frequency signals (e.g., for performing one-way and / or two-way wireless communication with external wireless communication equipment). In performing wireless transmission, processor 26 may provide digital signals to transceiver 28 via path 34. Transceiver 28 may also include circuitry for converting baseband signals received from processor 26 into corresponding intermediate frequency (IF) or radio frequency (RF) signals. For example, transceiver 28 may include mixer circuitry 45 that upconverts (or modulates) the baseband signal to an IF (e.g., as an IF signal), upconverts the baseband signal to a higher IF (e.g., as a radio frequency (RF) signal), and / or upconverts the IF signal to RF before transmission via antenna 42. Transceiver 28 may also include digital-to-analog converter (DAC) circuitry and / or analog-to-digital converter (ADC) circuitry for converting signals between the digital and analog domains. Transceiver 28 may include amplifier circuitry 41 (e.g., one or more power amplifiers) for amplifying the RF signal for transmission. Additionally or alternatively, one or more power amplifiers in amplifier circuit 48 may amplify the radio frequency signal for transmission. Transceiver 28 may include a transmitter that transmits the radio frequency signal via antenna 42 through radio frequency transmission line path 36 and front-end module 40. Antenna 42 may transmit the radio frequency signal to external wireless equipment by radiating the radio frequency signal into free space (or through a dielectric overlay on device 10).

[0038] During wireless reception, antenna 42 may receive radio frequency (RF) signals from external wireless equipment (e.g., from free space). The received RF signals may be transmitted to transceiver 28 via RF transmission line path 36 and front-end module 40. One or more low-noise amplifiers in amplifier circuit 41 and / or amplifier circuit 48 may amplify the received signals. Transceiver 28 may include circuitry for converting the received RF signals into corresponding intermediate frequency (IF) or baseband signals. For example, transceiver 28 may use mixer circuitry 45 to downconvert (or demodulate) the received RF signals to an IF, downconvert the received RF signals to a baseband frequency (e.g., as a baseband signal or baseband data), and / or downconvert the IF signal to a baseband frequency, and then transmit the received signals to processor 26 via path 34. Mixer circuitry 45 may include local oscillator circuitry, such as local oscillator (LO) circuitry 43. The local oscillator circuit 43 can generate an oscillator signal, and the mixer circuit 45 can use the oscillator signal to modulate the transmitted signal from the baseband frequency to the radio frequency and / or demodulate the received signal from the radio frequency to the baseband frequency.

[0039] Electronic devices such as device 10 may include circuitry for transmitting electrical signals along a transmission path. This circuitry includes a signal source, which can be modeled as an arbitrary source impedance with source power, coupled to an output node via the transmission path. The output node may be coupled to an output load with output impedance. In signal transmission systems such as these, it may be desirable to be able to perform measurements of the transmitted signal at the output node. For example, measuring the output power level of the transmitted signal at the output node can be used to characterize the performance of the output load, which can then be used to calibrate subsequent signal transmissions, adjust circuitry in device 10, or perform other actions.

[0040] Figure 3 This is a diagram illustrating an exemplary transmission path 50 in device 10. For example... Figure 3 As shown, the transmission path 50 may be coupled between the input node 52 and the output node N. The transmission path 50 may include a signal source 54 coupled between the input node 52 and the output node N. The transmission path 50 is sometimes also referred to herein as a signal path 50, a transmission signal path 50, a transmission chain 50, a signal transmission circuit 50, or a transmission signal circuit 50.

[0041] Transmission path 50 can, for example, form wireless circuit 24 ( Figure 1 Part of the signal source 54. In this example, transmit path 50 may include RF transmit line path 36 that couples input node 52 to output node N. As an example, signal source 54 may be an amplifier, such as a power amplifier (PA) (e.g., in...). Figure 2 (In the transceiver circuit 28). Node N can be coupled to the output load, such as the corresponding antenna 42 ( Figure 2), front-end module 40 ( Figure 2 The component or other radio frequency circuitry. Transmit path 50 can carry, transmit, propagate, and / or send radio frequency signals from signal source 54 (or input node 52) to output node N. The radio frequency signal can be located in any desired frequency band. If desired, the radio frequency signal can carry wireless data (e.g., data generated by...). Figure 2 The transceiver circuit 28 contains one or more mixers that modulate a stream of data packets, symbols, frames, datagrams, etc., onto a carrier. Alternatively, the radio frequency signal may not contain radio data (e.g., it may carry a reference signal waveform, a spatial ranging signal such as a radar waveform, etc.).

[0042] While a specific implementation in which the transmission path 50 forms part of the wireless circuit 24 for transmitting radio frequency signals via the corresponding antenna 42 is described herein as an example, the transmission path 50 generally may include any desired signal transmission circuitry within the device 10 (e.g., for transmitting signals at any frequency between different boards, packages, nodes, chips, integrated circuits, processors, components, accessories, devices such as the device 10, etc.). When the transmission path 50 forms part of the wireless circuit 24 for transmitting radio frequency signals via the antenna 42, as described herein, systems and methods for measuring power levels and otherwise characterizing the performance of the output node N can be similarly applied in any of these signal transmission contexts.

[0043] The output load (e.g., antenna 42) coupled to the output node N may have a corresponding impedance. Due to one or more operating characteristics of the output load and / or variations in environmental conditions around the output load, such as when an external object approaches the output load, the impedance of the output load may change (e.g., at a given frequency). In the example where the output load is an antenna, an external object (e.g., a user's hand or other body part) may externally load the antenna, causing it to become detuned and creating an impedance discontinuity between the output node N and the RF transmission line path 36. This impedance discontinuity may cause a relatively large amount of transmitted signal power to be reflected back to the signal source 54 from the output node N, thereby reducing the overall efficiency of the antenna.

[0044] If needed, measurement circuit 58 can be operatively coupled to transmit path 50. Measurement circuit 58 can measure the output power of transmit path 50 by measuring the power level of the RF signal output from transmit path 50 to output node N. Control circuit 14 ( Figure 1The control circuit 14 may be communicatively coupled to the measurement circuit 58 and / or may include one or more processors forming part of the measurement circuit 58. The control circuit 14 may identify (e.g., measure, detect, generate, calculate, estimate, determine, compute, etc.) the complex impedance of the output load coupled to the output node N (e.g., affected by an external load such as external object 54) based on the measured output power of the transmit path 50. The control circuit 14 may use this information to adjust the impedance matching circuitry of the antenna, adjust the tuning of the antenna, reduce the transmit power level of the signal source 54 (e.g., to comply with regulatory limits on radio frequency energy exposure or absorption), and / or perform any other desired operations or adjustments on subsequent signal transmissions on the transmit path 50 and / or other signal paths in the device 10.

[0045] The transmission path 50 may include a signal coupler disposed along the radio frequency transmission line path 36 and operatively coupled to the measurement circuit 58. This signal coupler may couple a portion of the radio frequency signal propagating along the radio frequency transmission line path 36 (e.g., along the signal path of the signal coupler) out of the radio frequency transmission line path (e.g., onto the coupling path coupled to the signal coupler) and toward the measurement circuit 58. The measurement circuit 58 may measure the power of the radio frequency signal based on the portion of the radio frequency signal coupled out of the radio frequency transmission line path 36 by the signal coupler. The measurement circuit 58 may include a voltage detector (sensor), a power detector (sensor), a feedback receiver, and / or any other desired circuitry for measuring the power of the portion of the radio frequency signal coupled out of the radio frequency transmission line path 36 by the signal coupler.

[0046] In some implementations, the measurement circuitry includes a voltage detector and a squaring circuit that utilizes an impedance assumption to detect power and convert voltage to a power formula. However, in reality, due to variations in on-chip devices or external interconnect reflections (such as cable voltage standing wave ratio (VSWR)), the interface impedance may differ significantly from this impedance assumption. In some implementations, the signal coupler is a fixed (non-reconfigurable) and symmetrical coupler with equal-length, time-invariant signal and coupling paths. However, these types of couplers may exhibit excessive coupling losses, potentially resulting in excessive power loss, and / or may limit the dynamic range utilized by the measurement circuitry to measure the power of the RF signal.

[0047] To mitigate these problems, the transmit path 50 may include an asymmetric reconfigurable signal coupler, such as a reconfigurable signal coupler 56 disposed on the RF transmit line path 36. The reconfigurable signal coupler 56 may couple a portion of the RF signal out of the RF transmit line path 36 and toward the measurement circuit 58. The measurement circuit 58 may include a power detector and / or any other desired circuitry for receiving and / or measuring the portion of the RF transmit line path 36 coupled out by the reconfigurable signal coupler 56. The RF signal coupled out of the RF transmit line path 36 may exhibit a voltage at the power detector in the measurement circuit 58. The power detector may measure the voltage and / or the power associated with the voltage (e.g., the power detector may convert the RF voltage waveform to a DC voltage). Control circuit 14 ( Figure 1 It can process the voltage and / or power measured by the power detector to measure (e.g., estimate, determine, identify, calculate, measure, generate, sense, etc.) the signal or power wave at the output node N, which may be a characteristic of the output power level of the radio frequency signal output by the transmission path 50 at the output node N (e.g., without the need to place the power detector directly at the output node N, thus accommodating the presence of additional circuit blocks along the transmission path 50).

[0048] If desired, the reconfigurable signal coupler 56 can be a four-port signal coupler having at least a first node 60, a second node 62, a third node 64, and a fourth node 66. Nodes 60-66 are sometimes also referred to herein as ports of the reconfigurable signal coupler 56. The fourth node 66 is coupled to one or more impedance terminations, and for clarity, in Figure 3 Not illustrated. The fourth node 66 is sometimes referred to herein as the isolation node 66 or isolation port 66 of the reconfigurable signal coupler 56.

[0049] Node 60 is communicatively coupled to input node 52 and the output of signal source 54 via the first portion of RF transmission path 36. Node 60 is sometimes referred to herein as input node 60 or input port 60. Node 62 is communicatively coupled to output node N via the second portion of RF transmission path 36. Node 62 is sometimes referred to herein as output node 62 or output port 62. In a specific implementation where the antenna is coupled to output node N, output node 62 is sometimes referred to herein as antenna node 62 or antenna port 62. Node 64 is communicatively coupled to the input of measurement circuit 58. Node 64 is sometimes referred to herein as coupling node 64 or coupling port 64.

[0050] Additional circuit blocks or components may be added if necessary (for clarity). Figure 2(Not shown) A signal source 54 may be located on the RF transmit line path 36, between the input node 52 and the signal source 54, and / or between the signal source 54 and the reconfigurable signal coupler 56. In some embodiments, the signal source 54 may be a differential power amplifier, and a balun may be located on the RF transmit line path 36, between the differential power amplifier and the reconfigurable signal coupler 56, to convert the RF signal on the RF transmit line path 36 between a differential signal (e.g., as output by the differential power amplifier) ​​and a single-ended signal (e.g., as provided to the reconfigurable signal coupler 56). If desired, the reconfigurable signal coupler 56 may include one or more switches that configure the signal coupler to couple a forward wave signal or a reverse wave (e.g., a reflected) signal out of the RF transmit line path 36 toward the measurement circuit 58 (e.g., the reconfigurable signal coupler 56 may form a switch coupler or a reflector).

[0051] The reconfigurable signal coupler 56 includes a signal path formed by a segment of the radio frequency transmission line path 36. The reconfigurable signal coupler 56 also includes a coupling path extending along (e.g., parallel to or coexisting with) the signal path. This coupling path electromagnetically couples to the signal path at the frequency of the radio frequency signal on the radio frequency transmission line path 36 (e.g., via near-field electromagnetic coupling, such as one or more capacitive couplings and / or one or more inductive couplings). The strength or amount of this electromagnetic coupling can be characterized by a corresponding coupling factor, constant, or coefficient.

[0052] Unlike a fixed signal coupler (which has a fixed-length coupling path, the fixed length of which is equal to the fixed length of the signal path), the reconfigurable signal coupler 56 includes a variable-length coupling path. The reconfigurable signal coupler 56 may include (e.g., from...) Figure 1 The control circuit 14 receives a control signal CTRL that controls one or more switches to effectively change the length of the coupling path over time. For example, the reconfigurable signal coupler 56 can switch between at least a first operating mode or state (sometimes referred to herein as a high-coupling mode or state) and a second operating mode or state (sometimes referred to herein as a low-coupling mode or state).

[0053] In the high-coupling mode, the switch in the reconfigurable signal coupler 56 configures the coupling path in the reconfigurable signal coupler 56 to have a relatively long length (e.g., a length equal to the length of the signal path). In the low-coupling mode, the switch in the reconfigurable signal coupler 56 configures the coupling path in the reconfigurable signal coupler 56 to have a relatively short length (e.g., a length less than the length of the signal path). A control signal CTRL can be provided to the switch in the reconfigurable signal coupler 56 to place the signal coupler in a selected one of the low-coupling mode or the high-coupling mode at a given time, and to switch between the low-coupling mode and the high-coupling mode over time. The measurement circuit 58 can measure different ranges of power levels based on whether the reconfigurable signal coupler 56 is in the low-coupling mode or the high-coupling mode. By switching the reconfigurable signal coupler 56 between the low-coupling mode and the high-coupling mode over time, the device 10 can increase the dynamic range used by the measurement circuit 58 to measure the power of the RF signal on the RF transmit line path 36.

[0054] Figure 4 This is the circuit diagram of the reconfigurable signal coupler 56 when in high-coupling mode. (Example) Figure 4 As shown, the reconfigurable signal coupler 56 may include a signal path 68 on the radio frequency transmit line path 36. The signal path 68 may have a first end coupled to the input node 60 and a corresponding second end coupled to the output node 62 of the reconfigurable signal coupler 56.

[0055] Signal path 68 may include, for example, a segment of a signal conductor, such as in the transmission line of radio frequency transmission line path 36. Although for simplicity... Figure 4 While illustrated as a linear path, signal path 68 may include one or more windings or turns of conductive material (e.g., conductive traces) around a central axis. This can be used to extend the length of signal path 68, which increases the amount of coupling between the signal path 68 of the reconfigurable signal coupler 56 and the coupling path, without substantially increasing the area occupied by the reconfigurable signal coupler 56 on the underlying substrate. Signal path 68 is sometimes also referred to herein as signal conductor 68 of the reconfigurable signal coupler 56.

[0056] The reconfigurable signal coupler 56 may also include a coupling path 71 extending along the signal path 68. The coupling path 71 may be coupled between the coupling node 64 and the isolation node 66 of the reconfigurable signal coupler 56. The coupling path 71 may be electromagnetically coupled to the signal path 68 along its length (e.g., via near-field electromagnetic coupling characterized by a corresponding coupling factor).

[0057] The coupling path 71 can be a reconfigurable coupling path with adjustable, reconfigurable, and / or variable length. For example, the coupling path 71 may include at least a first conductor 70 and a second conductor 72, the second conductor being coupled to conductor 70 via a switching circuit such as switch 82. Switch 82 is sometimes referred to herein as coupling path switch 82. Conductors 70, switch 82, and conductor 72 may be coupled in series between the coupling node and the isolation node (e.g., where switch 82 is coupled in series between conductors 70 and 72). Conductors 70 and 72 are sometimes referred to herein as coupling path conductors or portions or segments of coupling path 71. An example in which coupling path 71 includes two conductors is described herein as an example. If desired, coupling path 71 may include more than two conductors coupled in series with corresponding switches between the coupling node and the isolation node of the reconfigurable signal coupler 56. In these specific implementations, the reconfigurable signal coupler 56 may have more than two operating modes and may have different corresponding coupling factors in each of these operating modes.

[0058] Although for the sake of simplicity Figure 4 While illustrated as a linear path, conductor 70 may include one or more windings or turns of conductive material (e.g., conductive traces) around a central axis on the substrate of the reconfigurable signal coupler 56. Additionally or alternatively, conductor 72 may include one or more windings or turns of conductive material (e.g., conductive traces) around a central axis on the substrate of the reconfigurable signal coupler 56. This can be used to extend the length of conductors 70 and / or 72, increasing the amount of coupling between signal path 68 and coupling path 71 without substantially increasing the area occupied by the reconfigurable signal coupler 56 on the underlying substrate. If desired, conductors 70 and / or 72 may include a portion of a winding or turn on the underlying substrate.

[0059] exist Figure 4 In the example, conductor 70 is longer than conductor 72. This is illustrative and not limiting. Conductor 72 may be longer than conductor 70 if desired, or conductors 72 and 70 may have the same length. The cumulative length of conductors 70 and 72 may be equal to the fixed length of signal path 68 if desired. Coupling path 71 is sometimes also referred to herein as coupling conductor 71 of reconfigurable signal coupler 56.

[0060] Conductor 70 extends from the first end to the second end opposite to the first end. Conductor 72 extends from the first end to the second end opposite to the first end. Switch 82 couples terminal 76 at the second end of conductor 70 to terminal 78 at the first end of conductor 72. Isolation node 66 of reconfigurable signal coupler 56 can be coupled to the second end of conductor 72 at terminal 80.

[0061] Switch 82 may be, for example, a single-pole single-throw (SPST) switch. Switch 82 may have a first switching state in which it couples terminal 76 of conductor 70 to terminal 78 of conductor 72 (e.g., forming a short-circuit path, zero impedance, less than threshold impedance, or greater than threshold transconductance between terminals 76 and 78). Switch 82 may have a second switching state in which it decouples terminal 76 of conductor 70 from terminal 78 of conductor 72 (e.g., forming an open-circuit path, infinite impedance, greater than threshold impedance, or less than threshold transconductance between terminals 76 and 78). Figure 4 In the example, switch 82 is shown to be in its first switching state.

[0062] In one example, switch 82 may include a transistor having source / drain terminals coupled between terminals 76 and 78. Switch 82 may receive a gate voltage (e.g., in...). Figure 3 The gate voltage (in the control signal CTRL) places switch 82 in a first switching state or a second switching state, or toggles switch 82 between the first and second switching states. The gate voltage can, for example, be asserted to be high to turn on, activate, enable, or close switch 82, thereby placing switch 82 in the first switching state. The gate voltage can be deasserted to turn off, deactivate, disable, or open switch 82, thereby placing switch 82 in the second switching state.

[0063] The reconfigurable signal coupler 56 may include additional switching circuitry, such as a switch 86 coupled to coupling node 64 of the reconfigurable signal coupler 56. Switch 86 is sometimes also referred to herein as coupling node switch 86. Coupling node 64 is coupled to measurement circuit 58. Figure 3 The switch 86 may have a first terminal coupled to the coupling node 64, a second terminal coupled to a terminal 74 at a first end of the conductor 70, and a third terminal coupled to a terminal 78 at a first end of the conductor 72 (or another terminal at the first end of the conductor 72 and an adjacent terminal 78). The switch 86 may be, for example, a single-pole double-throw (SPDT) switch.

[0064] Switch 86 may have a first switching state in which switch 86 couples its first terminal, and thus coupling node 64, to its second terminal, and thus to terminal 74 on conductor 70 (e.g., forming a short-circuit path, zero impedance, less than threshold impedance, or greater than threshold transconductance between coupling node 64 and terminal 74, while forming an open-circuit path, infinite impedance, greater than threshold impedance, or greater than threshold transconductance between coupling node 64 and terminal 78). Switch 82 may have a second switching state in which switch 86 couples its first terminal, and thus coupling node 64, to its third terminal, and thus to terminal 78 on conductor 70 (e.g., bypassing conductor 70 from the perspective of the coupling node). In the second switching state, switch 82 may form a short-circuit path, zero impedance, less than threshold impedance, or greater than threshold transconductance between coupling node 64 and terminal 78, while forming an open-circuit path, infinite impedance, greater than threshold impedance, or greater than threshold transconductance between coupling node 64 and terminal 74. Figure 4 In the example, switch 86 is shown as being in its first switching state.

[0065] The reconfigurable signal coupler 56 may include additional switching circuitry, such as switch 84. Switch 84 may switchably couple isolation node 66 to two or more impedance terminals Z. Switch 84 is sometimes referred to herein as isolation node switch 84. For example, switch 84 may have a first terminal coupled to isolation node 66, a second terminal coupled to a first impedance terminal Z1, and a third terminal coupled to a second impedance terminal Z2. Switch 84 may be, for example, an SPDT switch.

[0066] Switch 84 may have a first switching state, in which switch 84 couples its first terminal, and thus the isolation node 66, to its second terminal, and thus to the impedance terminal Z1. Switch 84 may have a second switching state, in which switch 84 couples its first terminal, and thus the isolation node 66, to its second terminal, and thus to the impedance terminal Z2. Figure 4 In the example, switch 84 is shown to be in its first switching state.

[0067] Impedance terminal Z1 may include any desired number of inductors, resistors, capacitors, and / or switches, connected in series, parallel, and / or in any other desired manner, coupled between the second terminal of switch 84 and ground. Impedance terminal Z2 may include any desired number of inductors, resistors, capacitors, and / or switches, connected in series, parallel, and / or in any other desired manner, coupled between the third terminal of switch 84 and ground. The inductors, resistors, and / or capacitors in impedance terminals Z1 and Z2 may be fixed components or may be adjustable (e.g., impedance terminals Z1 and Z2 may be fixed or adjustable). Impedance terminal Z1 may exhibit a different impedance than impedance terminal Z2. Active impedance terminals may determine the isolation node impedance of reconfigurable signal coupler 56 and, if desired, may be selected to maximize the resilience of power measurements performed across different VSWRs of the output load using the reconfigurable signal coupler. More generally, switch 84 may switchably couple isolation node 66 to any desired number of one or more impedance terminals Z.

[0068] Control signal CTRL( Figure 3 The states of switches 82, 86, and 84 can be controlled to switch the reconfigurable signal coupler 56 between a high-coupling mode and a low-coupling mode. For example, the control signal CTRL can place the reconfigurable signal coupler 56 in the high-coupling mode by placing switch 86 in its first switching state (coupling terminal 74 to coupling node 64), switch 82 in its first switching state (coupling terminal 76 to terminal 78), and switch 84 in its first switching state (coupling terminal 80 to impedance terminal Z1). Figure 4 (as shown in the image).

[0069] This configures the reconfigurable signal coupler 56 to include both conductors 70 and 72 in the coupling path 71, wherein switch 86, conductor 70, switch 82, and conductor 72 are coupled in series between coupling node 64 and isolation node 66. Simultaneously, switch 84 applies an impedance termination Z1 to isolation node 66. When the RF transmit line path 36 transmits an RF signal, the signal is transmitted along signal path 68 from input node 60 to output node 62. A portion of this RF signal is coupled off signal path 68 and coupled along the entire length 88 of coupling path 71 to signal conductors 70 and 72. This maximizes the amount of electromagnetic coupling (e.g., coupling factor) between signal path 68 and coupling path 71, thereby coupling as much of the RF signal off signal transmit line path 36 and providing it to the measurement circuit as possible, taking into account the geometry of signal path 68 and coupling path 71. The coupled signal is transmitted to coupling node 64 and provided to the measurement circuit via conductor 72, switch 82, conductor 70, and terminal 74.

[0070] Figure 5 This is the circuit diagram of the reconfigurable signal coupler 56 when placed in this low-coupling mode. (Example) Figure 5 As shown, the control signal CTRL can put the reconfigurable signal coupler 56 into this low-coupling mode by setting switch 86 to its second switching state (coupling terminal 78 on conductor 72 to coupling node 64), setting switch 82 to its second switching state (decoupling terminal 76 from terminal 78), and setting switch 84 to its second switching state (coupling terminal 80 to impedance terminal Z2).

[0071] This configures the reconfigurable signal coupler 56 to include conductor 72 but exclude conductor 70 in the coupling path 71 (e.g., conductor 70 is floating or isolated relative to coupling node 64 and removed from coupling path 71). Switch 86 and conductor 72 are coupled in series between coupling node 64 and isolation node 66. Simultaneously, switch 84 applies an impedance termination Z2 to isolation node 66.

[0072] A portion of the RF signal is coupled off from signal path 68 and coupled only along length 90 of coupling path 71 to conductor 72, a length less than the entire length of coupling path 71 (e.g., where length 90 is given by the length of conductor 72 between terminals 78 and 80). The RF signal is not coupled from signal path 68 to conductor 70. This reduces the amount of electromagnetic coupling (e.g., coupling factor) between signal path 68 and coupling path 71, resulting in less of the RF signal being coupled off RF transmit line path 36 and supplied to the measurement circuit compared to when reconfigurable signal coupler 56 operates in this high-power mode.

[0073] The control circuit can place the reconfigurable signal coupler 56 into a selected one of the high-power mode or the low-power mode at a given time (e.g., based on...). Figure 3 The current output power level of signal source 54. This can be used to effectively extend the dynamic range by which the measurement circuit can measure the power of the RF signal. Meanwhile, there is no switch in signal path 68 of reconfigurable signal path 56. This is used to reduce insertion loss, which would otherwise be applied to the transmitted RF signal by the signal coupler and / or by a power detector directly connected to the RF transmission line path.

[0074] If necessary, the number of switches in the reconfigurable signal coupler 56 can be reduced to further reduce the loss applied to the RF signal by the signal coupler. Figure 6 and Figure 7 Another example of a reconfigurable signal coupler 56 is shown, which has a higher... Figure 4 and Figure 5 The specific implementation shown uses fewer switches.

[0075] like Figure 6 As shown, the positions of input node 60 and output node 62 on signal path 68 are interchangeable. Coupling node 64 can be coupled to terminal 80 of conductor 72. Terminal 74 on conductor 70 can be coupled to impedance termination Z1. Terminal 78 on conductor 72 can be coupled to impedance termination Z2 via switch 92 (e.g., SPST). Switch 92 is sometimes referred to herein as isolation node switch 92 or impedance termination switch 92. In this specific embodiment, there is no switch between coupling node 64 and coupling path 71 (e.g., reducing insertion loss that would otherwise be caused by such a switch to the coupled signal supplied to the measurement circuit).

[0076] exist Figure 6 In the example, the reconfigurable signal coupler 56 is shown in its high-coupling mode. In this high-coupling mode, switch 82 is closed and switch 92 is open. This couples conductor 70, switch 82, and conductor 72 in series between impedance terminal Z1 and coupling node 64 (e.g., terminal 74 may form isolation node 66 of reconfigurable signal coupler 56).

[0077] A portion of the radio frequency (RF) signal propagating along signal path 68 is coupled out of signal path 68 and coupled along the entire length 88 of coupling path 71 to signal conductors 70 and 72. This portion of the RF signal coupled to conductors 70 and 72 is transmitted to the measurement circuit via terminal 80 and coupling node 64. This maximizes the amount of electromagnetic coupling between signal path 68 and coupling path 71, thereby coupling out as much of the RF signal as possible from the RF transmission line path 36 and providing it to the measurement circuit, taking into account the geometry of signal path 68 and coupling path 71.

[0078] Figure 7 An example is shown when it is in its low-coupling mode. Figure 5 56. Reconfigurable signal coupler. Figure 7 As shown, in this low-coupling mode, switch 92 is closed and switch 82 is open. This configures the reconfigurable signal coupler 56 to include conductor 72 but not conductor 70 in the coupling path 71 (e.g., conductor 70 is floating or isolated relative to coupling node 64 and removed from coupling path 71). Switch 92 and conductor 72 are coupled in series between coupling node 64 and impedance termination Z2. Simultaneously, switch 92 applies impedance termination Z2 to this isolated node.

[0079] A portion of the RF signal is coupled off signal path 68 and coupled to conductor 72 along the entire length 90 of coupling path 71. The RF signal is not coupled off signal path 68 to conductor 70. This reduces the amount of electromagnetic coupling between signal path 68 and coupling path 71, resulting in less of the RF signal being coupled off RF transmission line path 36 and supplied to the measurement circuit compared to when reconfigurable signal coupler 56 operates in this high-power mode. Figure 4 to Figure 7 The examples are illustrative and not limiting, and in practice, the reconfigurable signal coupler 56 may have other architectures and may include additional components, etc.

[0080] Figure 8 This is a flowchart illustrating an exemplary operation that can be performed by device 10 to transmit radio frequency signals via radio frequency transmission line path 36. At operation 100, control circuit 14 ( Figure 1 The transmit (TX) power level of the radio frequency signal can be identified. This transmit power level can be, for example, the output power level of the signal source 54 used to transmit the radio frequency signal, taking into account the current operating / environmental conditions of device 10, the radio resources allocated to device 10, etc.

[0081] At operation 102, control circuit 14 can adjust switch 82 based on the identified transmit power level. Figure 4 to Figure 7 ), switch 86 ( Figure 4 and Figure 5 ), switch 84 ( Figure 4 and Figure 5 ) and / or switch 92 ( Figure 6 and Figure 7 The control circuit 14 can place the reconfigurable signal coupler 56 in a selected one of a high coupling mode (e.g., with a relatively high coupling factor) or a low coupling mode (e.g., with a relatively low coupling factor). For example, if / when the identified transmit power level is within a first range of transmit power levels, the control circuit 14 can place the reconfigurable signal coupler 56 in the high coupling mode. If / when the identified transmit power level is within a second range of transmit power levels, the control circuit 14 can place the reconfigurable signal coupler 56 in the low coupling mode.

[0082] If / when control circuitry 14 places reconfigurable signal coupler 56 in this high-coupling mode, processing can proceed via path 106 to operation 112. At operation 112 (e.g., in response to control circuitry 14 placing reconfigurable signal coupler 56 in this high-coupling mode), signal source 54 can begin transmitting radio frequency (RF) signals at the identified transmit power level via RF transmit line path 36.

[0083] At operation 114, the reconfigurable signal coupler 56 can couple a portion of the radio frequency signal transmitted by the signal source 54 from its signal path 68 and couple it along the entire length 88 of the coupling path 71 to conductors 70 and 72 (e.g., with maximum coupling between signal path 68 and coupling path 71). The reconfigurable signal coupler 56 can then transmit this portion of the radio frequency signal, separated from signal path 68, to the measurement circuit 58 via coupling node 64. Figure 3 ).

[0084] If / when control circuitry 14 places reconfigurable signal coupler 56 in this low-coupling mode, processing can proceed from operation 102 to operation 108 via path 104. At operation 108 (e.g., in response to control circuitry 14 placing reconfigurable signal coupler 56 in this low-coupling mode), signal source 54 can begin transmitting radio frequency (RF) signals via RF transmission line path 36 at the identified transmit power level.

[0085] At operation 110, the reconfigurable signal coupler 56 can couple a portion of the radio frequency signal transmitted by the signal source 54 from its signal path 68 and couple it only to conductor 72 along the length 90 of conductor 72 (e.g., with reduced coupling between signal path 68 and coupling path 71, and no signal is coupled to conductor 70). The reconfigurable signal coupler 56 can then transmit this portion of the radio frequency signal, separated from signal path 68, to the measurement circuit 58 via coupling node 64. Figure 3 ).

[0086] At operation 116, measurement circuitry 58 can perform one or more measurements on that portion of the RF signal received from coupling node 64 of reconfigurable signal coupler 56. This may include voltage level measurement, power level measurement, power wave measurement, complex scattering parameter measurement, impedance measurement, VSWR measurement, forward wave measurement, reverse wave measurement, current measurement, magnitude measurement, phase measurement, and / or any other desired measurement.

[0087] At operation 118, control circuitry 14 may identify (e.g., generate, measure, calculate, determine, estimate, etc.) one or more characteristics associated with one or more components (e.g., output load coupled to output node N) along or coupled to transmit path 50 based on the measurement performed by measurement circuitry 58. Additionally or alternatively, control circuitry 14 may perform one or more actions in device 10 based on the measurement performed by measurement circuitry 58 and / or based on the one or more characteristics. For example, control circuitry 14 may adjust the output power level of signal source 54 (e.g., in open-loop or closed-loop power control schemes), the power supply voltage or bias supplied to signal source 54, the tuning or matching of the antenna coupled to output node N or another antenna in device 10, one or more filters coupled to output N, beamforming by a phased antenna array on device 10, calibration of one or more components along or coupled to transmit path 50, etc., based on the measurement and / or the characteristics. The processing can loop back to operation 100 via path 120 (e.g., to adjust the coupling factor of coupling path 71 relative to signal path 68 over time via selective activation or deactivation of conductor 70).

[0088] If desired, the signal path 68, conductor 70, and conductor 72 in the reconfigurable signal coupler 56 may each include one or more windings on the underlying substrate. The windings of signal path 68, conductor 70, and / or conductor 72 may each be formed from a single layer of conductive traces, or may each be formed from multiple layers of conductive traces on the substrate. This can be used to maximize the coupling length of the reconfigurable signal coupler 56, and thus maximize the performance of the measurement circuit 58, without increasing the footprint of the reconfigurable signal coupler 56, which can help save space in device 10.

[0089] Figure 9 This is a cross-sectional side view illustrating an example of how a reconfigurable signal coupler 56 may include multiple conductive windings with different metallization layer distributions on a substrate 122. Figure 9 As shown, substrate 122 may include a set of stacked layers 124. Layers 124 may be insulating layers (e.g., dielectric layers, such as epoxy layers, resin layers, ceramic layers, polyimide layers, glass fiber layers, etc.) or semiconductor layers (e.g., silicon layers). Substrate 122 may also include metallization layers 138 (sometimes referred to herein as metal layer 138 or conductive layer 138) interleaved with layers 124. Metallization layers 138 may include conductive materials such as aluminum, copper, gold, etc. As three examples, substrate 122 may be a printed circuit board, a packaging substrate, or a semiconductor integrated circuit chip.

[0090] The reconfigurable signal coupler 56 may include at least a first winding 128 and a second winding 130 formed in a metallization layer 138-1 (e.g., a first layer of conductive traces on substrate 122), at least a first winding 139 and a second winding 132 formed in a metallization layer 138-2 (e.g., a second layer of conductive traces on substrate 122), and at least a first winding 136 and a second winding 134 formed in a metallization layer 138-3 (e.g., a third layer of conductive traces on substrate 122). The metallization layer 138-2 may be vertically inserted between the metallization layers 138-1 and 138-3. The windings 128, 130, 139, 132, 136, and 134 are sometimes also referred to herein as coils or turns of the conductive traces.

[0091] Windings 127, 130, 132, 134, 136, and 139 may each be laterally wound, extended, or coiled around the central opening 142 (e.g., when viewed in the -Z direction). Winding 128 may be laterally wound, extended, or coiled around winding 130. Winding 139 may be laterally wound, extended, or coiled around winding 132. Winding 136 may be laterally wound, extended, or coiled around winding 134. The conductive material of winding 128 may overlap with the conductive material of windings 139 and 136 (e.g., when viewed in the -Z direction). The conductive material of winding 130 may overlap with the conductive material of windings 132 and 134 (e.g., when viewed in the -Z direction).

[0092] The winding 139 can form a signal path 68 for the reconfigurable signal coupler 56. In this way, the input node 60 of the reconfigurable signal coupler 56 can be coupled to one end of the winding 139. Figure 9 The examples are illustrative, and if desired, signal path 68 may include more than one winding 139 in metallization layer 138-2, and / or may include a portion of a winding, a winding, or more than one winding in metallization layer 138-1, metallization layer 138-2, and / or additional metallization layer of substrate 122.

[0093] Windings 128, 130, 132, 134, and 136 can be coupled in series between the coupling node and the isolation node of the reconfigurable signal coupler 56. Conductive vias 140 extending through the substrate 122 (e.g., between metallization layers 138) can couple the windings in different metallization layers together. Windings 128, 130, 132, 134, and 136 can collectively form the coupling path 71 of the reconfigurable signal coupler 56. For example, windings 128, 130, 132, and 134 can collectively form conductor 70 (…). Figure 4 to Figure 7 The winding 136 can form the conductor 72 of the reconfigurable signal coupler 56.

[0094] Terminal 74 of conductor 70 can be coupled to a first end of winding 128. Winding 128 can extend from the first end to a second end, which is coupled to a first end of winding 130. Winding 130 can extend from the first end to a second end. The second end of winding 130 can be coupled to a first end of winding 132 through a corresponding conductive via 140. Winding 132 can extend from the first end to a second end. The second end of winding 132 can be coupled to a first end of winding 134 through a corresponding conductive via 140. Winding 134 can extend from the first end to the opposite second end. The second end of winding 134 (e.g., Figure 4 to Figure 7 Terminal 76) can be accessed Figure 4 to Figure 7 The switch 82 (e.g., at terminal 78) is coupled to a first end of winding 136. Winding 136 may extend from this first end to the opposite second end (e.g., Figure 4 to Figure 7 Terminal 80). This second end of winding 136 can be coupled to coupling node 64 ( Figure 6 and Figure 7 ) or isolated node 66 ( Figure 4 and Figure 5 For example, windings 128 to 136 can collectively realize coupling path 71 as a reconfigurable multilayer three-dimensional solenoid structure.

[0095] Figure 9 The examples are illustrative and non-limiting. Coupling path 71 may include more than two windings in metallization layer 138-1, more than one winding in metallization layer 138-2, more than two windings in metallization layer 138-3, and / or may include additional windings in additional metallization layers. Conductors 70 and 72 may be distributed in windings 128, 130, 132, 134, and 136 in any desired manner.

[0096] Winding 139 may be vertically inserted between windings 128 and 136 to form a first vertical stack (column) 137 of windings. Windings 130, 132, and 134 may form a second vertical stack 135 of windings adjacent to stack 137 (e.g., where the windings in stack 137 laterally surround the windings in stack 135). The windings of coupling path 71 may be coupled together in a manner that configures current to flow in the same direction through each winding in stacks 137 and 135 (e.g., entering as indicated by arrow 126). Figure 9 (in the plane of the page). This prevents the currents of different windings in the coupling path 71 from canceling each other out, and prevents radio frequency signals from coupling from the signal path to the coupling path.

[0097] Clamping the signal path 68 between windings 128 and 136 and placing it laterally next to stack 135 can maximize the amount of electromagnetic coupling between the signal path 68 and coupling path 71. For example, when the reconfigurable signal coupler 56 is operated in its high-coupling mode, the electromagnetic coupling may include a first vertical capacitive coupling between windings 139 and 128, a second vertical capacitive coupling between windings 139 and 136, and additional lateral capacitive coupling between winding 139 and the windings in stack 135. When the reconfigurable signal coupler 56 is operated in its low-coupling mode, windings 128 to 134 and therefore conductor 70 are switched off, such that the radio frequency signal is coupled only from winding 139 to winding 136.

[0098] Metallization layers 138-1, 138-2, and 138-3 may be continuous metallization layers of substrate 122, or, if desired, one or more metallization layers of substrate 122 may be interposed between metallization layers 138-2 and 138-3 and / or between metallization layers 138-1 and 138-2. Metallization layers 138-3, 138-2, and 138-1 may be formed of the same conductive material, or, if desired, two or more of metallization layers 138-1, 138-2, and 138-3 may be formed of different conductive materials.

[0099] Figure 10 This is a layout diagram illustrating an example of how windings 128 and 130 of conductor 70 can be formed in metallization layer 138-1. (See diagram for example.) Figure 10 As shown, winding 130 may laterally surround the central opening 142 of all windings in the reconfigurable signal coupler 56. Winding 128 may laterally surround winding 130. Winding 128 may have a first end coupled to (e.g., at a first end of conductor 70) a terminal 74. Terminal 74 may be coupled to impedance termination Z1 ( Figure 6 and Figure 7 ) or switch 86 ( Figure 4 and Figure 5 ).

[0100] Winding 128 may extend around central opening 142 and winding 130 to a second end of winding 128. Winding 130 may have a first end coupled to this second end of winding 128. Winding 130 may extend from its first end around central opening 142 to the second end of winding 130 (at conductive via 140). Conductive via 140 may allow metallization layer 138-1 ( Figure 9 The second end of the winding 130 in the winding is coupled to the metallization layer 138-2. Figure 9The first end of winding 132 in the winding 134. Winding 132 may extend around the central opening 142 and overlap with winding 134, and may be coupled to metallization layer 138-3 via additional conductive vias. Figure 9 The conductor 70 is located in the winding 130 below. Terminal 76 of conductor 70 can be coupled to this end of winding 134 in metallization layer 138-3. Terminal 76 on winding 134 can be connected via switch 82. Figure 4 to Figure 7 Conductor 72 (e.g., coupled to metallization layer 138-3) is coupled to the metallization layer 138-3. Figure 9 Terminal 78 of winding 136. Windings 130, 132, and 134 may overlap each other to form a vertical stack 135. Winding 128 may be connected to windings 139 and 136 ( Figure 9 ) overlap to form a vertical stack 137.

[0101] Figure 11 This shows how the winding 139 of signal path 68 can... Figure 9 An example layout diagram of the metallization layer 138-2 formed. For clarity, in Figure 11 The example omits Figure 9 The stacked 135 windings 132. For example... Figure 11 As shown, winding 139 extends from its first end at input node 60 to its second end at output node 62 around central opening 142. Figure 11 In the example, signal path 68 includes one and a half turns of winding 139. If needed, conductive via 140 can be used to form one or more crosses, such as cross 141, to accommodate more than one turn of winding 139. Winding 139 can be laterally wrapped. Figure 9 Winding 132 ( Figure 11 (not shown in the image), and can be stacked vertically with 137 ( Figure 9 The windings 128 and 136 in the signal path 68 overlap to maximize the coupling between the signal path 68 and the coupling path 71.

[0102] Figure 12 This illustrates how the winding 136 of conductor 72 can be formed in Figure 9 A layout diagram of an example of metallization layer 138-3. For clarity, in Figure 12 The example omits Figure 9 The stacked 135 windings 134. For example... Figure 12 As shown, winding 136 extends from a first end at terminal 78 to a second end at terminal 80 around a central opening 142. Winding 136 can be laterally wound around... Figure 9 and Figure 10 Winding 134 ( Figure 11 (not shown in the diagram), and can be vertically overlapped with windings 139 and 128 in stack 135. Terminal 78 can be accessed via switch 82 (Figure 4 to Figure 7 Coupled to winding 134 ( Figure 10 Terminal 76 on the winding 136. Placing both terminal 78 of winding 136 and terminal 76 of winding 10 on the same side of the signal coupler helps facilitate the placement of switch 82 on substrate 122. Placing both terminal 78 and terminal 74 on the same side of the signal coupler helps minimize wiring complexity to the coupling node (e.g., with minimal physical layout constraints). Terminal 80 can be coupled to isolation node 66 ( Figure 4 and Figure 5 ) or coupled node 64 ( Figure 6 and Figure 7 ).

[0103] When implemented in this way, the reconfigurable signal coupler 56 can exhibit a very high level of electromagnetic coupling between the coupling path and the signal path, while also being reconfigurable to adjust the coupling factor, while consuming a minimum amount of area on the substrate 122. Figure 10 to Figure 12 The examples are illustrative and not limiting. Conductor 70 may include any desired number of windings in any desired number of metallization layers. Conductor 72 may include any desired number of windings in any desired number of metallization layers. Signal path 68 may include any desired number of windings in any desired number of layers. Windings 128 to 136 and winding 139 may have any desired shape and any desired number of straight and / or curved segments that extend relative to each other at any desired angle and have any desired number of curved and / or straight edges.

[0104] Figure 13 The measured power of the radio frequency signal along signal path 68 was plotted as... Figure 3 The measured power is a function of the output power level of the signal source 54 (e.g., a power amplifier (PA)), which is measured by the measurement circuit 58 using the reconfigurable signal coupler 56. Curve 150 plots the measured power when the reconfigurable signal coupler 56 is in this low-coupling mode. Curve 152 plots the measured power when the reconfigurable signal coupler 56 is in this high-coupling mode.

[0105] When in this low-power mode, the measurement circuit measures power within range 156. By switching the reconfigurable signal coupler 56 to this high-coupling mode, the measurement circuit can extend the power level measured using the reconfigurable signal coupler 56 by a margin 154 (e.g., linearly extending the power detection range of the measurement circuit without nonlinear effects). By switching between this high-coupling mode and this low-coupling mode as needed over time (e.g., based on the output power level of the signal source), the measurement circuit can measure power levels within a much wider total effective dynamic range 158 (e.g., up to 30 dB or higher) than a specific implementation using a fixed signal coupler. Curves 150 and 152 may have other shapes in practice.

[0106] Switching the reconfigurable signal coupler 56 from the high-coupling mode to the low-coupling mode can reduce the coupling factor between the signal path 68 and the coupling path 71 by, for example, up to 5 dB to 10 dB or more. (For example, since there is no switch on the signal path 68.) Switching the reconfigurable signal coupler 56 can exhibit low insertion loss (e.g., less than 0.5 dB) in both the high-coupling mode and the low-coupling mode. In some cases, the low-coupling mode may introduce slightly less insertion loss. Impedance termination Z2 may have a higher impedance than impedance termination Z1 ( Figure 4 to Figure 7 Lower impedance. As an example, Figure 4 and Figure 5 The impedance termination Z1 can be approximately 25 ohms to 35 ohms, and Figure 4 and Figure 5 The impedance termination Z2 can be approximately 5 ohms to 15 ohms. As another example, Figure 6 and Figure 7 The impedance termination Z1 can be approximately 32 ohms to 35 ohms, and Figure 6 and Figure 7 The impedance termination Z2 can be approximately 28 ohms to 32 ohms. Using a reconfigurable signal coupler 56 to measure the power level produces a smaller measurement error (e.g., a reduction of up to 3 dB or more) compared to a specific implementation that uses a power detector directly connected to the RF transmit line path 36 to measure power.

[0107] As used herein, the term "concurrent" means at least partially overlapping in time. In other words, the first and second events are referred to herein as "concurrent" if at least some of the first events occur simultaneously with at least some of the second events (e.g., if at least some of the first events occur during, concurrently with, or when at least some of the second events occur). The first and second events can be concurrent if they are synchronized (e.g., if the entire duration of the first event overlaps with the entire duration of the second event in time), but they can also be concurrent if they are asynchronous (e.g., if the first event begins before or after the second event, ends before or after the second event, or if they do not partially overlap in time). As used herein, the term "at" is synonymous with "concurrent".

[0108] The methods and operations described above can be performed by components of device 10 using software, firmware, and / or hardware (e.g., dedicated circuitry or hardware). The software code used to perform these operations can be stored on a non-transitory computer-readable storage medium (e.g., a tangible computer-readable storage medium) stored on one or more components of device 10 (e.g., ...). Figure 1 The storage circuit 16). This software code may sometimes be referred to as software, data, instructions, program instructions, or code. Non-transitory computer-readable storage media may include drives, non-volatile memory such as non-volatile random access memory (NVRAM), removable flash drives or other removable media, other types of random access memory, etc. The software stored on the non-transitory computer-readable storage medium may be processed by processing circuitry on one or more components of device 10 (e.g., Figure 1 The processing circuitry (e.g., 18) performs the execution. The processing circuitry may include a microprocessor, a central processing unit (CPU), an application-specific integrated circuit (ASIC) with processing circuitry, or other processing circuitry.

[0109] For one or more aspects, at least one of the components depicted in one or more of the foregoing figures may be configured to perform one or more operations, techniques, processes or methods as described in the following embodiments section.

[0110] Example

[0111] Further exemplary aspects are provided in the following sections.

[0112] Example 1 includes a circuit comprising: a signal source; an output node; a transmission line coupled between the signal source and the output node; a signal coupler disposed on the transmission line, wherein the signal coupler has a coupling node and an isolation node, and includes: a signal path located in the transmission line; a first conductor and a second conductor extending along the signal path; a first switch coupling the first conductor to the second conductor; a second switch coupling the first conductor and the second conductor to the coupling node; and a measurement circuit communicatively coupled to the coupling node and configured to measure radio frequency signals on the transmission line using the signal coupler.

[0113] Example 2 includes the circuit according to Example 1, wherein the first conductor extends from a first end to a second end opposite to the first end, the second conductor extends from a third end to a fourth end opposite to the third end, the second switch optionally couples the coupling node to a first terminal at the first end of the first conductor, and the second switch optionally couples the coupling node to a second terminal at the third end of the second conductor.

[0114] Example 3 includes the circuit according to Example 2, wherein the first switch optionally couples a third terminal at the second end of the first conductor to a second terminal at the third end of the second conductor.

[0115] Example 4 includes the circuit according to Example 3, wherein the isolation node is optionally coupled to a fourth terminal at the fourth end of the second conductor.

[0116] Example 5 includes the circuit according to Example 4, the circuit optionally further including: a first impedance terminal; a second impedance terminal different from the first impedance terminal; and a third switch that couples the isolation node to the first impedance terminal and the second impedance terminal.

[0117] Example 6 includes the circuit according to Example 5, wherein the first switch optionally includes a single-pole single-throw switch, the second switch includes a first single-pole double-throw (SPDT) switch, and the third switch includes a second SPDT switch.

[0118] Example 7 includes the circuit according to Example 5, the circuit optionally further including: one or more processors configured to adjust the coupling factor of the signal coupler by adjusting the first switch, the second switch and the third switch.

[0119] Example 8 includes the circuit according to Example 1, the circuit optionally further including: a substrate having at least a first metallization layer, a second metallization layer and a third metallization layer, wherein the signal path includes a first winding of a conductive trace on the second metallization layer.

[0120] Example 9 includes the circuit according to Example 8, wherein the first conductor optionally includes a second winding of a conductive trace on the first metallization layer, the second winding optionally overlapping the first winding, the second conductor optionally includes a third winding of a conductive trace on the third metallization layer, and the third winding optionally overlapping the first winding and the second winding.

[0121] Example 10 includes the circuit according to Example 9, wherein the first conductor optionally further includes: a fourth winding of a conductive trace on the first metallization layer; a fifth winding of a conductive trace on the second metallization layer; and a sixth winding of a conductive trace on the third metallization layer.

[0122] Example 11 includes the circuit according to Example 10, wherein the first winding optionally extends laterally around the fifth winding, the second winding optionally extends laterally around the fourth winding, the third winding optionally extends laterally around the sixth winding, and current flows through the second winding, the third winding, the fourth winding, the fifth winding, and the sixth winding in the same direction.

[0123] Example 12 includes the circuit according to Example 1, the circuit optionally further including: one or more processors configured to adjust the first switch and the second switch between a first switch state and a second switch state, wherein when the first switch and the second switch are in the first switch state, the first conductor and the second conductor form a coupling path of the signal coupler and are electromagnetically coupled to the signal path, and when the first switch and the second switch are in the second switch state, the second conductor forms the coupling path of the signal coupler and is electromagnetically coupled to the signal path.

[0124] Example 13 includes a signal coupler disposed on a substrate and comprising: a signal path including a first winding in a first metallization layer of the substrate, the first winding being coupled between an input node and an output node of the signal coupler; a coupling path electromagnetically coupled to the signal path and comprising: a second winding located in a second metallization layer of the substrate and overlapping the first winding; a third winding located in the first metallization layer, the first winding extending laterally around the third winding; and a fourth winding located in a third metallization layer of the substrate and overlapping the first winding and the second winding; and a switch coupling a coupling node of the signal conductor to a first terminal on the second winding and a second terminal on the fourth winding.

[0125] Example 14 includes the signal coupler according to Example 13, the coupling path optionally including: a fifth winding located in the third metallization layer and overlapping the third winding, wherein the fourth winding extends laterally around the fifth winding.

[0126] Example 15 includes the signal coupler according to Example 14, the signal coupler optionally further including: an additional switch that couples a third terminal on the fourth winding to a fourth terminal on the fifth winding.

[0127] Example 16 includes the signal coupler according to Example 14, the coupling path optionally including: a sixth winding located in the first metallization layer and overlapping the third winding and the fifth winding, wherein the second winding extends laterally around the sixth winding.

[0128] Example 17 includes a signal coupler according to Example 16, wherein the sixth winding, the third winding, the fifth winding, and the fourth winding are optionally coupled in series between the first terminal on the second winding and the isolation node of the signal coupler.

[0129] Example 18 includes a method of operating a wireless circuit, the method comprising: transmitting a signal along a signal path of a signal coupler, the signal coupler including a first conductor and a second conductor extending along the signal path; placing the signal coupler in a first state by adjusting a first switch and a second switch to configure the first conductor and the second conductor to form a coupling path of the signal coupler, the first switch coupling the first conductor to the second conductor, and the second switch coupling the first conductor and the second conductor to a coupling node of the signal conductor; when the signal coupler is in the first state, transmitting a first portion of the signal to a power detector using the first conductor and the second conductor; placing the signal coupler in a second state by adjusting the first switch and the second switch to remove the first conductor from the coupling path; when the signal coupler is in the second state, transmitting a second portion of the signal to the power detector using the second conductor; and measuring the power levels of the first portion and the second portion of the signal using the power detector.

[0130] Example 19 includes the method according to Example 18, wherein when the signal coupler is in the second state, the first conductor optionally does not form part of the coupling path.

[0131] Example 20 includes the method according to Example 18, the method optionally further including: when the signal coupler is in the first state, using a third switch to couple the second conductor to a first impedance terminal; and when the signal coupler is in the second state, using the third switch to couple the second conductor to a second impedance terminal.

[0132] Example 21 includes a circuit comprising: a signal source; an output node; a transmission line coupled between the signal source and the output node; a signal coupler disposed on the transmission line, wherein the signal coupler has a coupling node and includes a signal path in the transmission line; a first conductor and a second conductor extending along the signal path, wherein the second conductor is coupled to the coupling node; a first switch coupling the first conductor to the second conductor; a first impedance termination coupled to the first conductor; a second impedance termination; a second switch coupling the second impedance termination to the second conductor; and a measurement circuit communicatively coupled to the coupling node and configured to measure a radio frequency signal on the transmission line using the signal coupler.

[0133] Example 22 includes the circuit according to Example 21, wherein the first conductor extends from a first end to a second end opposite to the first end, the second conductor extends from a third end to a fourth end opposite to the third end, and the first impedance terminal is optionally coupled to a first terminal at the first end of the first conductor.

[0134] Example 23 includes the circuit according to Example 22, wherein the first switch optionally couples a second terminal at the second end of the first conductor to a third terminal at the third end of the second conductor.

[0135] Example 24 includes the circuit according to Example 23, wherein the second switch optionally couples the second impedance terminal to the third end of the third conductor.

[0136] Example 25 includes the circuit according to Example 24, wherein the coupling node is optionally coupled to a fourth terminal at the fourth end of the second conductor.

[0137] Example 26 includes the circuit according to Example 25, wherein the first conductor is optionally coupled in series between the first impedance terminal and the first switch, the first switch is optionally coupled in series between the first conductor and the second conductor, and the second conductor is optionally coupled in series between the first switch and the coupling node.

[0138] Example 27 includes the circuit according to Example 26, wherein the first switch optionally includes a first single-pole single-throw (SPST) switch, and the second switch optionally includes a second SPST switch.

[0139] Example 28 includes the circuit according to Example 21, the circuit optionally further including: one or more processors configured to adjust the coupling factor of the signal coupler by adjusting the first switch and the second switch.

[0140] Example 29 includes the circuit according to Example 21, the circuit optionally further including: a substrate having at least a first metallization layer, a second metallization layer and a third metallization layer, wherein the signal path includes a first winding of a conductive trace on the second metallization layer.

[0141] Example 30 includes the circuit according to Example 29, wherein the first conductor optionally includes a second winding of a conductive trace on the first metallization layer, the second winding optionally overlapping the first winding, the second conductor optionally includes a third winding of a conductive trace on the third metallization layer, and the third winding optionally overlapping the first winding and the second winding.

[0142] Example 31 includes the circuit according to Example 30, wherein the first conductor optionally further includes: a fourth winding of a conductive trace on the first metallization layer; a fifth winding of a conductive trace on the second metallization layer; and a sixth winding of a conductive trace on the third metallization layer, wherein the first winding extends laterally around the fifth winding, the second winding extends laterally around the fourth winding, the third winding extends laterally around the sixth winding, and current flows through the second winding, the third winding, the fourth winding, the fifth winding, and the sixth winding in the same direction.

[0143] Example 32 includes the circuit according to Example 31, the circuit optionally further including: one or more processors configured to adjust the first switch and the second switch between a first switch state and a second switch state, wherein in the first switch state, the first switch is closed and the second switch is open, and in the second switch state, the first switch is open and the second switch is closed, the first conductor and the second conductor form a coupling path of the signal coupler and are electromagnetically coupled to the signal path when the first switch and the second switch are in the first switch state, and the second conductor forms the coupling path of the signal coupler and is electromagnetically coupled to the signal path when the first switch and the second switch are in the second switch state.

[0144] Example 33 includes a signal coupler disposed on a substrate and comprising: a signal path including a first winding in a first metallization layer of the substrate, the first winding being coupled between an input node and an output node of the signal coupler; a coupling path electromagnetically coupled to the signal path and comprising: a second winding located in a second metallization layer of the substrate and overlapping the first winding; a third winding located in the first metallization layer, the first winding extending laterally around the third winding; and a fourth winding located in a third metallization layer of the substrate and overlapping the first winding and the second winding; an impedance termination; and a switch coupling the fourth winding to the impedance termination, the fourth winding being series coupled between the switch and the coupling node of the signal conductor.

[0145] Example 34 includes the signal coupler according to Example 33, the coupling path optionally including: a fifth winding located in the third metallization layer and overlapping the third winding, wherein the fourth winding extends laterally around the fifth winding.

[0146] Example 35 includes the signal coupler according to Example 34, the signal coupler optionally further including: an additional switch that couples the fourth winding to the fifth winding, the fourth winding being coupled in series between the additional switch and the coupling node.

[0147] Example 36 includes the signal coupler according to Example 14, the coupling path optionally including: a sixth winding located in the first metallization layer and overlapping the third winding and the fifth winding, wherein the second winding extends laterally around the sixth winding.

[0148] Example 37 includes the signal coupler according to Example 16, the signal coupler optionally further including: an additional impedance terminal coupled to the second winding, wherein the second winding, the sixth winding, the third winding, the fifth winding and the fourth winding are coupled in series between the additional impedance terminal and the coupling node.

[0149] Example 38 includes a method of operating a wireless circuit, the method comprising: transmitting a signal along a signal path of a signal coupler, the signal coupler including a first conductor and a second conductor extending along the signal path; placing the signal coupler in a first state by adjusting a first switch and a second switch, thereby configuring the first conductor and the second conductor to form a coupling path of the signal coupler, wherein the first switch couples the first conductor to the second conductor, the second conductor is coupled in series between the first switch and a coupling node of the signal conductor, the second switch couples a first impedance termination to the second conductor, and the first conductor is coupled to a second impedance termination; when the signal coupler is in the first state, transmitting a first portion of the signal to a power detector using the first conductor and the second conductor; placing the signal coupler in a second state by adjusting the first switch and the second switch, thereby removing the first conductor from the coupling path; when the signal coupler is in the second state, transmitting a second portion of the signal to the power detector using the second conductor; and measuring the power levels of the first portion and the second portion of the signal using the power detector.

[0150] Example 39 includes the method according to Example 38, wherein when the signal coupler is in the second state, the first conductor optionally does not form part of the coupling path.

[0151] Example 40 includes the method according to Example 38, wherein: when the signal coupler is in the first switching state, the first switch is optionally closed and the second switch is optionally open; and when the signal coupler is in the second switching state, the first switch is open and the second switch is closed.

[0152] As is widely recognized, the use of personally identifiable information should comply with privacy policies and practices that are generally accepted to meet or exceed industry or governmental requirements for protecting user privacy. Specifically, personally identifiable information data should be managed and disposed of to minimize the risk of unintentional or unauthorized access or use, and the nature of authorized use should be clearly explained to users.

[0153] The foregoing is illustrative and various modifications can be made to the described implementation scheme. The foregoing implementation scheme can be implemented individually or in any combination.

Claims

1. A circuit comprising: a signal source; an output node; a transmission line coupled between the signal source and the output node; a signal coupler disposed on the transmission line, wherein the signal coupler has a coupled node and an isolated node, and comprises: a signal path in the transmission line, a first conductor and a second conductor extending along the signal path, a first switch coupling the first conductor to the second conductor, and a second switch coupling the first conductor and the second conductor to the coupled node; and a measurement circuit communicatively coupled to the coupled node and configured to measure a radio frequency signal on the transmission line using the signal coupler.

2. The circuit of claim 1, wherein the first conductor extends from a first end to a second end opposite the first end, the second conductor extends from a third end to a fourth end opposite the third end, the second switch couples the coupled node to a first terminal at the first end of the first conductor, and the second switch couples the coupled node to a second terminal at the third end of the second conductor.

3. The circuit of claim 2, wherein the first switch couples a third terminal at the second end of the first conductor to the second terminal at the third end of the second conductor.

4. The circuit of claim 3, wherein the isolated node is coupled to a fourth terminal at the fourth end of the second conductor.

5. The circuit of claim 4, further comprising: a first impedance termination; a second impedance termination different from the first impedance termination; and a third switch coupling the isolated node to the first impedance termination and the second impedance termination.

6. The circuit of claim 5, wherein the first switch comprises a single-pole single-throw switch, the second switch comprises a first single-pole double-throw (SPDT) switch, and the third switch comprises a second SPDT switch.

7. The circuit of claim 5, further comprising: one or more processors configured to adjust a coupling factor of the signal coupler by adjusting the first switch, the second switch, and the third switch.

8. The circuit of claim 1, further comprising: a substrate having at least a first metallization layer, a second metallization layer, and a third metallization layer, wherein the signal path comprises a first winding of conductive traces on the second metallization layer.

9. The circuit of claim 8, wherein the first conductor comprises a second winding of conductive traces on the first metallization layer, the second winding overlapping the first winding, the second conductor comprises a third winding of conductive traces on the third metallization layer, and the third winding overlaps the first winding and the second winding.

10. The circuit of claim 9, wherein the first conductor further comprises: ​ a fourth winding of conductive traces on the first metallization layer; a fifth winding of conductive traces on the second metallization layer; and a sixth winding of conductive traces on the third metallization layer.

11. The circuit of claim 10, wherein the first winding extends laterally around the fifth winding, the second winding extends laterally around the fourth winding, the third winding extends laterally around the sixth winding, and current flows in the same direction through the second winding, the third winding, the fourth winding, the fifth winding, and the sixth winding.

12. The circuit of claim 1, further comprising: one or more processors configured to adjust the first switch and the second switch between a first switch state and a second switch state, wherein when the first switch and the second switch are in the first switch state, the first conductor and the second conductor form a coupling path of the signal coupler, and are electromagnetically coupled to the signal path, and when the first switch and the second switch are in the second switch state, the second conductor forms the coupling path of the signal coupler, and is electromagnetically coupled to the signal path.

13. A signal coupler disposed on a substrate and comprising: a signal path comprising a first winding in a first metallization layer of the substrate, the first winding coupled between an input node and an output node of the signal coupler; a coupling path electromagnetically coupled to the signal path and comprising: a second winding in a second metallization layer of the substrate and overlapping the first winding, a third winding in the first metallization layer, the first winding extending laterally around the third winding, and a fourth winding in a third metallization layer of the substrate and overlapping the first winding and the second winding; and a switch coupling a coupling node of the signal conductor to a first terminal on the second winding and a second terminal on the fourth winding.

14. The signal coupler of claim 13, the coupling path further comprising: a fifth winding in the third metallization layer and overlapping the third winding, wherein the fourth winding extends laterally around the fifth winding.

15. The signal coupler of claim 14, further comprising: an additional switch coupling a third terminal on the fourth winding to a fourth terminal on the fifth winding.

16. The signal coupler of claim 14, the coupling path further comprising: a sixth winding in the first metallization layer and overlapping the third winding and the fifth winding, wherein the second winding extends laterally around the sixth winding.

17. The signal coupler of claim 16, wherein the sixth winding, the third winding, the fifth winding, and the fourth winding are coupled in series between the first terminal on the second winding and an isolation node of the signal coupler.

18. A method of operating a wireless circuit, the method comprising: sending a signal along a signal path of a signal coupler, the signal coupler including a first conductor and a second conductor that coextend with the signal path; placing the signal coupler in a first state by adjusting a first switch and a second switch to configure the first conductor and the second conductor to form a coupling path of the signal coupler, the first switch coupling the first conductor to the second conductor, and the second switch coupling the first conductor and the second conductor to a coupling node of the signal conductor; passing a first portion of the signal to a power detector using the first conductor and the second conductor when the signal coupler is in the first state; placing the signal coupler in a second state by adjusting the first switch and the second switch to remove the first conductor from the coupling path; passing a second portion of the signal to the power detector using the second conductor when the signal coupler is in the second state; and measuring power levels of the first portion and the second portion of the signal using the power detector.

19. The method of claim 18, wherein the first conductor does not form a part of the coupling path when the signal coupler is in the second state.

20. The method of claim 18, further comprising: coupling the second conductor to a first impedance termination using a third switch when the signal coupler is in the first state; and coupling the second conductor to a second impedance termination using the third switch when the signal coupler is in the second state. ​

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