Chip prism assembly method and camera module assembly method

Abstract

The embodiment of the invention discloses a chip prism assembly method and a camera module assembly method, and the method comprises the steps: synchronously executing a first step and a second step in a state that the polishing surface of a prism assembly is opposite to the light-sensitive surface of a chip assembly; the first step comprises the steps of adjusting a prism assembly to enable the inclination degree between a polishing surface and a first reference plane to meet a first preset inclination requirement; the second step comprises the steps of adjusting the chip assembly to enable the inclination degree between the light-sensitive surface and a second reference plane to meet a second preset inclination requirement; and assembling the prism assembly and the chip assembly in a state that the prism assembly meets the first preset inclination requirement and the chip assembly meets the second preset inclination requirement to obtain the chip prism assembly. According to the embodiment of the invention, the inclined state between the light-sensitive surface and the reference plane and the inclined state between the polished surface and the reference plane are adjusted, so that the light-sensitive surface is basically parallel to the polished surface, and the assembling efficiency of the prism assembly and the chip assembly is improved.

Description

Technical Field

[0001] This invention relates to the field of optical technology, and in particular to a chip prism assembly method and a camera module assembly method. Background Technology

[0002] In the camera module industry, the tilt calculation and adjustment between the image sensor (or simply chip), prism, and lens is typically achieved by scanning the image of the image sensor at different heights, calculating the Spatial Frequency Response (SFR) score between the center and the perimeter (0.8 field of view), and then adjusting the tilt of the image sensor, prism, and lens based on the SFR score. However, this process is time-consuming, particularly in adjusting the tilt of the image sensor and prism, resulting in low assembly efficiency. Therefore, improving the assembly efficiency of the chip and prism is a pressing issue that needs to be addressed. Summary of the Invention

[0003] This application provides a chip prism assembly method and a camera module assembly method, which solves the technical problem in the prior art that the tilt adjustment between the photosensitive chip and the prism takes a long time and results in low assembly efficiency, and achieves the technical effect of improving the assembly efficiency of the chip and the prism.

[0004] In a first aspect, this application provides a chip prism assembly method, the method comprising: With the polished surface of the prism assembly and the photosensitive surface of the chip assembly facing each other, the first step and the second step are executed simultaneously. The first step includes: adjusting the prism assembly according to the distance between at least three points on the polished surface and the first reference plane, so that the tilt of the polished surface and the first reference plane meets a first preset tilt requirement. The second step includes: adjusting the chip assembly according to the distance between at least three points on the photosensitive surface and the second reference plane, so that the tilt of the photosensitive surface and the second reference plane meets a second preset tilt requirement. When the prism assembly meets the first preset tilt requirement and the chip assembly meets the second preset tilt requirement, the prism assembly and the chip assembly are assembled to obtain a chip prism assembly.

[0005] Further, adjusting the prism assembly based on the distance between at least three points on the polished surface and the first reference plane, so that the tilt of the polished surface relative to the first reference plane meets a first preset tilt requirement, includes: Based on the first height between the first point in the polished surface and the first reference plane, the second height between the second point in the polished surface and the first reference plane, and the first distance between the projections of the first point and the second point on the first reference plane, a first angle between the line connecting the first point and the second point and the first reference plane is determined. Based on the third height between the third point on the polished surface and the first reference plane, the average of the first height and the second height, and the second distance projected onto the first reference plane by the line connecting the third point and the first midpoint, a second angle is determined between the line connecting the third point and the first midpoint and the first reference plane; the first midpoint refers to the midpoint of the line connecting the first point and the second point; the at least three points on the polished surface include the first point, the second point, and the third point; If at least one of the first included angle and the second included angle does not meet the first preset tilt requirement, the prism assembly is adjusted until the tilt between the polished surface and the first reference plane meets the first preset tilt requirement.

[0006] Further, adjusting the chip assembly based on the distance between at least three points on the photosensitive surface and the second reference plane, so that the tilt of the photosensitive surface and the second reference plane meets a second preset tilt requirement, includes: Based on the fourth height between the fourth point in the photosensitive surface and the second reference plane, the fifth height between the fifth point in the photosensitive surface and the second reference plane, and the third distance between the projections of the fourth point and the fifth point on the second reference plane, the third angle between the line connecting the fourth point and the fifth point and the second reference plane is determined. Based on the sixth height between the sixth point on the photosensitive surface and the second reference plane, the average of the fourth and fifth heights, and the fourth distance projected onto the second reference plane by the line connecting the sixth point and the second midpoint, a fourth angle is determined between the line connecting the sixth point and the second midpoint and the second reference plane; the second midpoint refers to the midpoint of the line connecting the fourth point and the fifth point; the at least three points on the photosensitive surface include the fourth point, the fifth point, and the sixth point; If at least one of the included angles, the third and the fourth, does not meet the second preset tilt requirement, the chip assembly is adjusted until the tilt between the photosensitive surface and the second reference plane meets the second preset tilt requirement.

[0007] Furthermore, the spacing between at least three points on the polished surface tends to be maximized and they are not collinear; the spacing between at least three points on the photosensitive surface tends to be maximized and they are not collinear.

[0008] Furthermore, the distance between at least three points on the polished surface and the first reference plane is detected by a first laser lithography device; the distance between at least three points on the photosensitive surface and the second reference plane is detected by a second laser lithography device; the light emission orientation of the first laser lithography device and the light emission orientation of the second laser lithography device are opposite to each other.

[0009] Furthermore, the performance of the first laser lithography device and the second laser lithography device meets the following requirements: repeatability accuracy less than 1µm, laser spot diameter less than 50µm, linear error less than 2µm, measurement range within 35mm, and working wavelength in the visible light band of 380nm-780nm.

[0010] Further, the first preset tilt requirement includes that the angle between the first line connecting at least three points on the polished surface and the first reference plane is less than a preset angle threshold, and the angle between the second line connecting at least three points on the polished surface and the first reference plane is less than a preset angle threshold; the first line is the line connecting the first point and the second point among the at least three points; the second line is the line connecting the third point among the at least three points and the first midpoint, and the first midpoint refers to the midpoint of the line connecting the first point and the second point; The second preset tilt requirement includes that the angle between the third line connecting at least three points on the photosensitive surface and the second reference plane is less than a preset angle threshold, and the angle between the fourth line connecting at least three points on the photosensitive surface and the second reference plane is less than a preset angle threshold; the third line is the line connecting the fourth and fifth points among the at least three points; the fourth line is the line connecting the sixth point among the at least three points and the second midpoint, where the second midpoint is the midpoint of the line connecting the fourth and fifth points.

[0011] Furthermore, the first preset tilt requirement includes at least two different connecting lines corresponding to at least three points on the polished surface, each with an angle less than a preset angle threshold between itself and the first reference plane, and each connecting line is a connecting line between two of the at least three points. The second preset tilt requirement includes at least two different connecting lines corresponding to at least three points on the photosensitive surface, each with an angle less than a preset angle threshold between itself and the second reference plane, and each connecting line is a connection between two of the at least three points.

[0012] Furthermore, the preset angle threshold is 0.1 degrees or a value less than 0.1 degrees.

[0013] Secondly, this application provides a method for assembling a camera module, the method comprising: The chip prism assembly is obtained by performing a chip prism assembly method as provided in the first aspect; The pre-assembled lens motor assembly is combined with the chip prism assembly to obtain the target camera module.

[0014] Thirdly, this application provides a camera module, including the target camera module assembled by the camera module assembly method provided in the second aspect.

[0015] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages: In this embodiment, the prism assembly is adjusted based on the distance between at least three points on the polished surface of the prism assembly and the first reference plane, such that the tilt of the polished surface relative to the first reference plane meets a first preset tilt requirement. Similarly, the chip assembly is adjusted based on the distance between at least three points on the photosensitive surface of the chip assembly and the second reference plane, such that the tilt of the photosensitive surface relative to the second reference plane meets a second preset tilt requirement. The prism assembly and the chip assembly are then assembled while maintaining the preset tilt requirements to obtain a chip prism assembly. Therefore, this embodiment adjusts the prism assembly and the chip assembly based on the tilt states of the photosensitive surface and the polished surface relative to the corresponding reference planes, ensuring that the photosensitive surface and the polished surface are substantially parallel, thus improving the assembly efficiency of the prism assembly and the chip assembly.

[0016] In related technologies, tilt adjustment between the photosensitive chip and the prism based on SFR (Surface Reflectance Fraction) is time-consuming. This method typically takes 10 seconds to complete the tilt correction of a set of photosensitive chips and prisms, impacting overall unit-per-hour (UPH) output and equipment capacity. However, the chip prism assembly method of this application reduces the time to 8 seconds, representing a 25% increase in efficiency. Therefore, the chip prism assembly method provided in this application improves assembly efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced one by one below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic flowchart illustrating a chip prism assembly method provided in an embodiment of this application; Figure 2 This is a schematic diagram of the architecture of a periscope telephoto lens module. Figure 3 This is a schematic diagram illustrating the measurement of the distance between polished surfaces in a prism assembly using a first laser lithography device in an embodiment of this application. Figure 4 This is a schematic diagram illustrating the measurement of the distance between photosensitive surfaces in a chip assembly using a second laser lithography device, as described in an embodiment of this application. Figure 5 A schematic diagram showing the determination of the first included angle and the second included angle at three points on the polished surface of the prism assembly provided in the embodiments of this application; Figure 6 A schematic diagram showing the determination of the first and second included angles at three points on the photosensitive surface of the chip assembly provided in this application embodiment.

[0019] Figure label: 1-Prism body, 2-Photosensitive chip, 3-Lens, 4-Prism slot, 5-Filter, 6-Prism support, 7-First laser engraving device, 8-First laser engraving device. Detailed Implementation

[0020] This application provides a chip prism assembly method, which solves the technical problem in the prior art that the tilt adjustment between the photosensitive chip and the prism takes a long time, resulting in low assembly efficiency.

[0021] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows: In this embodiment, the prism assembly is adjusted based on the distance between at least three points on the polished surface of the prism assembly and the first reference plane, so that the tilt of the polished surface and the first reference plane meets a first preset tilt requirement. Similarly, the chip assembly is adjusted based on the distance between at least three points on the photosensitive surface of the chip assembly and the first reference plane, so that the tilt of the photosensitive surface and the second reference plane meets a second preset tilt requirement. The prism assembly and the chip assembly are then assembled while maintaining the second preset tilt requirement to obtain a chip prism assembly. Therefore, this embodiment adjusts the prism assembly and the chip assembly based on the tilt states of the photosensitive surface and the polished surface relative to the corresponding reference planes, making the photosensitive surface and the polished surface essentially parallel, thus improving the assembly efficiency of the prism assembly and the chip assembly.

[0022] In related technologies, tilt adjustment between the photosensitive chip and the prism based on SFR (Surface Reflectance Fraction) is time-consuming. This method typically takes 10 seconds to complete the tilt correction of a set of photosensitive chips and prisms, impacting overall unit-per-hour (UPH) output and equipment capacity. However, the chip prism assembly method of this application reduces the time to 8 seconds, representing a 25% increase in efficiency. Therefore, the chip prism assembly method provided in this application improves assembly efficiency.

[0023] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0024] First, it should be clarified that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0025] This application provides a chip prism assembly method, which includes steps S11-S12, for details of which can be found in the following embodiments. Figure 1 .

[0026] Step S11: With the polished surface of the prism assembly and the photosensitive surface of the chip assembly facing each other, the first step and the second step are executed simultaneously. The first step includes: adjusting the prism assembly according to the distance between at least three points of the polished surface and the first reference plane, so that the tilt degree between the polished surface and the first reference plane meets a first preset tilt requirement. The second step includes: adjusting the chip assembly according to the distance between at least three points of the photosensitive surface and the second reference plane, so that the tilt degree between the photosensitive surface and the second reference plane meets a second preset tilt requirement. Step S12: When the prism assembly meets the first preset tilt requirement and the chip assembly meets the second preset tilt requirement, the prism assembly and the chip assembly are assembled to obtain a chip prism assembly.

[0027] The chip prism assembly method provided in this application embodiment can be executed by relevant equipment capable of assembling chips and prisms, and this application embodiment does not limit this.

[0028] Regarding step S11, with the polished surface of the prism assembly and the photosensitive surface of the chip assembly facing each other, the first step and the second step are executed simultaneously. The first step includes: adjusting the prism assembly according to the distance between at least three points of the polished surface and the first reference plane, so that the tilt degree between the polished surface and the first reference plane meets a first preset tilt requirement. The second step includes: adjusting the chip assembly according to the distance between at least three points of the photosensitive surface and the second reference plane, so that the tilt degree between the photosensitive surface and the second reference plane meets a second preset tilt requirement.

[0029] The prism assembly can refer to the component corresponding to the assembled prism body 1 and prism support 6, or it can refer to the prism body 1 itself. The structure of the prism body 1 is not limited, such as a slotted prism, a cemented prism, a triangular prism, etc. That is, in this embodiment, step S11 can be performed based on the prism body 1, first ensuring the tilt of the polished surface of the prism body 1 meets a first preset tilt requirement, and then assembling the prism body 1 and prism support 6 based on the prism body 1 meeting the first preset tilt requirement, to obtain an assembly of prism body 1 and prism support 6 that meets the first preset tilt requirement. Further, in this embodiment, the first step in step S11 can be performed after the prism body 1 and prism support 6 are assembled, ensuring the tilt of the polished surface of the prism assembly meets the first preset tilt requirement, to obtain an assembly of prism body 1 and prism support 6 that meets the first preset tilt requirement. The assembly method of the prism body 1 and prism support 6 can be referred to in related technologies, and will not be elaborated upon in this embodiment.

[0030] The chip assembly includes a photosensitive chip 2 and a filter 5. The assembly method of the photosensitive chip 2 and the filter 5 can be referred to in related technologies, and will not be described in detail in this embodiment.

[0031] like Figure 2 The diagram shown is a schematic of the architecture of a periscope telephoto lens module. Figure 2 The arrows representing the light path entering from lens 3, being reflected inside prism body 1, and then transmitted to chip 2 indicate the light path. The polished surfaces of prism body 1 refer to the surfaces from which the light enters and exits prism body 1, based on... Figure 2 In this context, the polished surface of the prism body 1 refers to its upper surface. The photosensitive surface of the chip assembly refers to the surface of the photosensitive chip 2 that receives the light transmitted from the prism body 1, based on... Figure 2 In this context, the photosensitive surface of the chip assembly refers to the lower surface of chip 2.

[0032] The spacing between at least three points on the polished surface tends to be maximized and they are not collinear. The following explanation uses only three points as examples, including point P11, point P12, and point P13. Similarly, the spacing between at least three points on the photosensitive surface tends to be maximized and they are not collinear. The following explanation uses only three points as examples, including point P21, point P22, and point P23. In other words, the three points on the polished surface only need to be on the polished surface, and the greater the distance between them, the better. The three points on the photosensitive surface only need to be on the photosensitive surface, and the greater the distance between them, the better.

[0033] One of the purposes of step S11 in this embodiment is to adjust the polished surface to be substantially parallel to the first reference plane, ideally parallel to it. Based on three points on the polished surface, it can be determined whether the first reference plane and the polished surface are substantially parallel. The greater the distance between the three points, the smaller the impact of measurement error on determining whether they are substantially parallel. In other words, the greater the distance between the three points selected on the polished surface, the higher the accuracy of determining whether they are substantially parallel, which is more conducive to improving the assembly precision between the chip and the prism.

[0034] Whether the polished surface and the first reference plane are basically parallel is determined by whether the degree of inclination between the polished surface and the first reference plane meets the first preset inclination requirement. If the first preset inclination requirement is met, the polished surface and the first reference plane are considered to be basically parallel. If the first preset inclination requirement is not met, the polished surface and the first reference plane are considered to be non-parallel.

[0035] The second objective of step S11 in this embodiment is to adjust the photosensitive surface to be substantially parallel to the second reference plane, ideally parallel to it. Based on three points on the photosensitive surface, it can be determined whether the second reference plane and the photosensitive surface are substantially parallel. The greater the distance between the three points, the smaller the impact of measurement error on determining whether they are substantially parallel. In other words, the greater the distance between the three points selected on the photosensitive surface, the higher the accuracy of determining whether they are substantially parallel, which is more conducive to improving the assembly precision between the chip and the prism.

[0036] Whether the photosensitive surface and the second reference plane are substantially parallel is determined by whether the degree of inclination between the photosensitive surface and the second reference plane meets the second preset inclination requirement. If the second preset inclination requirement is met, the photosensitive surface and the second reference plane are considered to be substantially parallel. If the second preset inclination requirement is not met, the photosensitive surface and the second reference plane are considered to be non-parallel.

[0037] Then, regarding the first and second reference planes, provided they are parallel, they can be selected according to the actual situation. They can be horizontal planes, vertical planes, or other planes that form an angle with either the horizontal or vertical planes. This application embodiment does not impose any limitations on this. For ease of description, this application embodiment will only use a horizontal plane as an example for subsequent explanation.

[0038] The distance between at least three points on the polished surface and the first reference plane is detected by a first laser lithography device 7; the distance between at least three points on the photosensitive surface and the second reference plane is detected by a second laser lithography device 8; the light emission orientation of the first laser lithography device 7 and the light emission orientation of the second laser lithography device 8 are opposite. For example, as... Figure 3 and Figure 4 As shown, the first reference plane can be the lower surface of the first laser engraving device 7, and the second reference plane can be the upper surface of the second laser engraving device 8.

[0039] The performance of the first laser laser device 7 and the second laser laser device 8 meets the following requirements: repeatability accuracy less than 1µm, laser spot diameter less than 50µm, linear error less than 2µm, measurement range within 35mm, and working wavelength in the visible light band of 380nm-780nm.

[0040] In specific implementation, the first laser lithography device 7 can be fixed, and then the prism assembly can be moved to allow the first laser lithography device 7 to detect the distance between itself and at least three points. Alternatively, while keeping the prism assembly stationary, the first laser lithography device 7 can be moved on a fixed horizontal plane to allow it to detect the distance between itself and at least three points. The horizontal plane on which the first laser lithography device 7 is located is the first reference plane described in this embodiment. The following description will use the method of fixing the first laser lithography device 7 as an example.

[0041] Similarly, the second laser lithography device 8 can be fixed, and then the chip assembly can be moved to allow the second laser lithography device 8 to detect the distance between itself and at least three points. Alternatively, the chip assembly can be kept stationary while the second laser lithography device 8 is moved on a fixed horizontal plane, allowing it to detect the distance between itself and at least three points. The horizontal plane on which the second laser lithography device 8 is located is the second reference plane described in this embodiment. The following description will use the method of fixing the second laser lithography device 8 as an example.

[0042] The reason why the light emission directions of the first laser device 7 and the second laser device 8 are opposite is that: Figure 2 As shown, the photosensitive surface of chip 2 faces downwards, and the polished surface of prism body 1 faces upwards. The purpose of step S11 is to make the photosensitive surface and the polished surface as parallel as possible, that is, both the photosensitive surface and the polished surface are considered to be basically parallel if they meet the corresponding preset tilt requirements. Therefore, when the photosensitive surface meets the second preset tilt requirement and the polished surface meets the first preset tilt requirement, the orientations of the photosensitive surface and the polished surface must be opposite, for example, as shown in the diagram. Figure 2 As shown, the photosensitive surface faces down, and the polished surface faces up. To achieve this, the photosensitive and polished surfaces need to be adjusted with their orientations opposite. Since the photosensitive and polished surfaces are facing opposite directions, the laser directions of the two laser measuring devices used to measure them are also opposite.

[0043] It is important to note that if the same laser measuring device is used to measure the distance between the photosensitive surface and the polished surface, then, with the laser measuring device facing a first direction, after first determining the distance between the first surface of the photosensitive surface and the polished surface and adjusting the first surface to meet the preset tilt requirement, the laser measuring device needs to be adjusted to a second direction opposite to the first direction to determine the distance between the second surface of the photosensitive surface and the polished surface, and the second surface needs to be adjusted to meet the preset tilt requirement. In other words, this process involves adjusting the laser measuring device from the first direction to the second direction. Since errors are inevitable in actual operation, this introduces new, uncertain adjustment errors, affecting the accuracy of meeting the preset tilt requirement for the photosensitive surface and the polished surface. Therefore, this embodiment uses two laser measuring devices to measure the distance between the photosensitive surface and the polished surface separately to reduce the introduction of errors and ensure the assembly accuracy between the prism and the chip.

[0044] In addition, by using two laser devices to measure the distance between the photosensitive surface and the polished surface, the adjustment process of the photosensitive surface and the polished surface can be carried out simultaneously. That is, step S11 is executed simultaneously for the photosensitive surface and the polished surface, which can improve the assembly efficiency between the prism and the chip.

[0045] For example, such as Figure 3 The diagram shown illustrates the use of a first laser lithography device 7 to measure the distance between polished surfaces in a prism assembly according to an embodiment of this application. The first laser lithography device 7 is fixed at a certain position with the laser emission direction pointing downwards. The prism body 1 is placed below the first laser lithography device 7. By moving the prism body 1, the distance between the polished surfaces of the prism body 1 is measured using the first laser lithography device 7.

[0046] like Figure 4 The diagram illustrates the use of a second laser lithography device 8 to measure the distance between photosensitive surfaces in a chip assembly according to an embodiment of this application. The second laser lithography device 8 is fixed at a certain position with the laser emission direction facing upwards. The chip assembly is placed on top of the second laser lithography device 8. By moving the chip assembly, the distance between the photosensitive surfaces of the chip assembly is measured using the second laser lithography device 8.

[0047] Figure 3 and Figure 4 The states shown can be executed simultaneously to improve the assembly efficiency between the chip and the prism.

[0048] Finally, the process of the first and second steps in step S11 will be explained.

[0049] Regarding the first step, which is to adjust the prism assembly according to the distance between at least three points on the polished surface and the first reference plane, so that the degree of inclination between the polished surface and the first reference plane meets the first preset inclination requirement, this includes steps S1111-S1113.

[0050] Step S1111: Based on the first height between the first point P11 in the polished surface and the first reference plane, the second height between the second point P12 in the polished surface and the first reference plane, and the first distance between the projections of the first point P11 and the second point P12 on the first reference plane, determine the first angle between the line connecting the first point P11 and the second point P12 and the first reference plane. Step S1112: Based on the third height between the third point P13 on the polished surface and the first reference plane, the average of the first height and the second height, and the second distance projected onto the first reference plane by the line connecting the third point P13 and the first midpoint Z1, determine the second angle between the line connecting the third point P13 and the first midpoint Z1 and the first reference plane; the first midpoint Z1 refers to the midpoint of the line connecting the first point P11 and the second point P12; the at least three points on the polished surface include the first point P11, the second point P12, and the third point P13; Step S1113: If at least one of the first included angle and the second included angle does not meet the first preset tilt requirement, adjust the prism assembly until the tilt between the polished surface and the first reference plane meets the first preset tilt requirement.

[0051] Now combined Figure 5 The following explanation is given for steps S1111-S1113.

[0052] Regarding step S1111, the three points on the polished surface are designated as point 1 P11, point 2 P12, and point 3 P13. The distance between the horizontal plane where the first laser polishing device 7 is located (i.e., the first reference plane) and point 1 P11, point 2 P12, and point 3 P13 can be measured using the first laser polishing device 7. As mentioned earlier, the first laser polishing device 7 faces downwards, so the distance between the horizontal plane where the first laser polishing device 7 is located and point 1 P11, point 2 P12, and point 3 P13 can also be referred to as height. The heights corresponding to point 1 P11, point 2 P12, and point 3 P13 are designated as the first height, the second height, and the third height, respectively.

[0053] The distance between the projections of the first point P11 and the second point P12 onto the first reference plane reflects the horizontal distance between them, which is the first distance d11. Then, based on the first height and the second height, the height difference h11 between the first point P11 and the second point P12 can be determined. This height difference reflects the vertical distance between them. Based on the first horizontal distance and the height difference, combined with the arctangent function, the angle ∠P12 between the line connecting the first point P11 and the second point P12 and the first reference plane can be calculated, denoted as the first angle.

[0054] Regarding step S1112, the average of the first height and the second height, which is the height distance between the first midpoint Z1 of the line connecting the first point P11 and the second point P12 and the first laser device 7, is calculated. The height distance (the average) between the third height of the third point P13 and the corresponding height of the first midpoint Z1 reflects the vertical distance h12 between the third point P13 and the first midpoint Z1. The distance between the projections of the third point P13 and the first midpoint Z1 onto the first reference plane reflects the horizontal distance (the second distance d12) between the third point P13 and the first midpoint Z1. Based on the second horizontal distance d12 and the height distance h12 (the average), combined with the arctangent function, the angle ∠P13 between the line connecting the third point P13 and the first midpoint Z1 and the first reference plane can be calculated and denoted as the second angle.

[0055] Regarding step S1113, this application embodiment provides two different first preset tilt requirements. One of the first preset tilt requirements includes that the angle between the first line connecting at least three points of the polished surface and the first reference plane is less than a preset angle threshold, and the angle between the second line connecting at least three points of the polished surface and the first reference plane is less than a preset angle threshold. The first line is the line connecting the first point P11 and the second point P12 among the at least three points. The second line is the line connecting the third point P13 among the at least three points and the first midpoint Z1, where the first midpoint Z1 refers to the midpoint of the line connecting the first point P11 and the second point P12.

[0056] Another first preset tilt requirement includes at least two different connecting lines corresponding to at least three points on the polished surface, each with an angle less than a preset angle threshold between itself and the first reference plane, wherein each connecting line is a connection between two of the at least three points.

[0057] The preset angle threshold can be 0.1 degrees or a value less than 0.1 degrees. The specific value can be selected according to the assembly accuracy requirements. If the assembly accuracy requirement is high, a value much smaller than 0.1 degrees can be selected as the preset angle threshold. If the assembly accuracy requirement is low, a value close to 0.1 degrees can be selected as the preset angle threshold, or 0.1 degrees can be selected as the preset angle threshold.

[0058] In actual operation, the corresponding first preset tilt requirement can be selected according to the actual assembly requirements, and this application embodiment does not limit this. The following description of this application embodiment will only take the first type of first preset tilt requirement as an example.

[0059] Determine whether the first included angle ∠P12 and the second included angle ∠P13 meet the first preset tilt requirement. If at least one included angle does not meet the first preset tilt requirement, adjust the prism assembly until the tilt between the polished surface and the first reference plane meets the first preset tilt requirement, and keep the prism assembly in a state that meets the first preset tilt requirement.

[0060] The process of steps S1111-S1113 corresponding to the prism assembly is explained as follows.

[0061] Combination Figure 5 The measurement process of the first included angle ∠P12 and the second included angle ∠P13 of the prism assembly is explained.

[0062] like Figure 5 As shown, the first laser lithography device 77 emits a laser from top to bottom to measure the height data of three points P11, P12, and P13 on the polished surface of the prism assembly. P11 is designated as the first point, P12 as the second point, and P13 as the third point. The height difference between P11 and P12 is h11. The distance between the projections of P11 and P12 onto the horizontal plane where the first laser lithography device 77 is located can be equivalent to... Figure 5 In the equation d11. Based on the arctangent function and d11, h11, and combined with the following formula 1, the angle ∠P12 between the line connecting P11 and P12 and the first reference plane can be determined and denoted as the first angle.

[0063] Formula 1 The average height of P11 and P12 is the height distance between the first midpoint Z1 and the horizontal plane where the first laser device 77 is located. The height difference between the first midpoint Z1 and the third point P13 is h12. The distance between the projections of Z1 and P13 onto the horizontal plane where the first laser device 77 is located can be equivalent to... Figure 5 d12 in the equation. Based on the arctangent function and d12, h12, and combined with the following formula 2, the angle ∠P13 between the line connecting P13 and Z1 and the first reference plane can be determined and denoted as the second angle.

[0064] Formula 2 Then, with ∠P12 and ∠P13 not less than the preset angle threshold, the tilt of the prism assembly is adjusted until the tilt between the polished surface and the first reference plane meets the first preset tilt requirement.

[0065] The second step, which is to adjust the chip assembly according to the distance between at least three points on the photosensitive surface and the second reference plane, so that the tilt of the photosensitive surface and the second reference plane meets the second preset tilt requirement, includes steps S1121-S1123.

[0066] Step S1121: Based on the fourth height between the fourth point P21 in the photosensitive surface and the second reference plane, the fifth height between the fifth point P22 in the photosensitive surface and the second reference plane, and the third distance between the projections of the fourth point P21 and the fifth point P22 on the second reference plane, determine the third angle between the line connecting the fourth point P21 and the fifth point P22 and the second reference plane. Step S1122: Based on the sixth height between the sixth point P23 on the photosensitive surface and the second reference plane, the average of the fourth height and the fifth height, and the fourth distance projected onto the second reference plane by the line connecting the sixth point P23 and the second midpoint Z2, determine the fourth angle between the line connecting the sixth point P23 and the second midpoint Z2 and the second reference plane; the second midpoint Z2 refers to the midpoint of the line connecting the fourth point P21 and the fifth point P22; the at least three points on the photosensitive surface include the fourth point P21, the fifth point P22, and the sixth point P23; Step S1123: If at least one of the included angles, the third included angle and the fourth included angle, does not meet the second preset tilt requirement, adjust the chip assembly until the tilt between the photosensitive surface and the second reference plane meets the second preset tilt requirement.

[0067] Now combined Figure 6 The following explanation is given for steps S1121-S1123.

[0068] Regarding step S1121, the three points on the photosensitive surface are designated as point 4 P21, point 5 P22, and point 6 P23. The distance between the horizontal plane where the second laser device 8 is located (i.e., the second reference plane) and points 4 P21, 5 P22, and 6 P23 can be measured using the second laser device 8. As mentioned earlier, the second laser device 8 faces upwards, so the distance between the horizontal plane where the second laser device 8 is located and points 4 P21, 5 P22, and 6 P23 can also be referred to as height. The heights corresponding to points 4 P21, 5 P22, and 6 P23 are designated as the fourth height, fifth height, and sixth height, respectively.

[0069] The distance between the projections of the fourth point P21 and the fifth point P22 onto the second reference plane reflects the horizontal distance between them, which is the third distance d21. Then, based on the fourth and fifth heights, the height difference h21 between the fourth point P21 and the fifth point P22 can be determined. This height difference reflects the vertical distance between them. Based on the third horizontal distance and the height difference, combined with the arctangent function, the angle ∠P22 between the line connecting the fourth point P21 and the fifth point P22 and the second reference plane can be calculated, denoted as the third angle.

[0070] Regarding step S1122, the average of the fourth and fifth heights, which is the height distance between the second midpoint Z2 of the line connecting the fourth point P21 and the fifth point P22 and the second laser device 8, is calculated. The average height distance (the sixth height of the sixth point P23) corresponds to the height distance between the sixth point P23 and the second midpoint Z2, reflecting the vertical distance h22 between the sixth point P23 and the second midpoint Z2. The horizontal distance (the fourth distance d22) between the sixth point P23 and the second midpoint Z2, projected onto the second reference plane, reflects the horizontal distance between them. Based on the horizontal fourth distance d22 and the height distance h22 (the average height), combined with the arctangent function, the angle ∠P23 between the line connecting the sixth point P23 and the second midpoint Z2 and the second reference plane can be calculated and denoted as the fourth angle.

[0071] Regarding step S1123, this application embodiment provides two different second preset tilt requirements. One second preset tilt requirement includes that the angle between the third line connecting at least three points of the photosensitive surface and the second reference plane is less than a preset angle threshold, and the angle between the fourth line connecting at least three points of the photosensitive surface and the second reference plane is less than a preset angle threshold. The third line is the line connecting the fourth point P21 and the fifth point P22 among the at least three points. The fourth line is the line connecting the sixth point P23 among the at least three points and the second midpoint Z2, where the second midpoint Z2 refers to the midpoint of the line connecting the fourth point P21 and the fifth point P22.

[0072] Another second preset tilt requirement includes at least two different connecting lines corresponding to at least three points on the photosensitive surface, each with an angle less than a preset angle threshold between itself and the second reference plane, wherein each connecting line is a connection between two of the at least three points.

[0073] The preset angle threshold can be 0.1 degrees or a value less than 0.1 degrees. The specific value can be selected according to the assembly accuracy requirements. If the assembly accuracy requirement is high, a value much smaller than 0.1 degrees can be selected as the preset angle threshold. If the assembly accuracy requirement is low, a value close to 0.1 degrees can be selected as the preset angle threshold, or 0.1 degrees can be selected as the preset angle threshold.

[0074] In actual operation, the corresponding second preset tilt requirement can be selected according to the actual assembly requirements, and this application embodiment does not limit this. The following description of this application embodiment will only take the first type of second preset tilt requirement as an example.

[0075] Determine whether the third included angle ∠P22 and the fourth included angle ∠P23 meet the second preset tilt requirement. If at least one included angle does not meet the second preset tilt requirement, adjust the chip assembly until the tilt between the photosensitive surface and the second reference plane meets the second preset tilt requirement, and keep the chip assembly in a state that meets the second preset tilt requirement.

[0076] Combination Figure 6 The measurement process of the third included angle ∠P22 and the fourth included angle ∠P23 of the chip assembly is explained.

[0077] like Figure 6 As shown, the second laser lithography device 88 emits a laser from bottom to top to measure the height data of three points P21, P22, and P23 on the photosensitive surface of the chip assembly. P21 is designated as the fourth point, P22 as the fifth point, and P23 as the sixth point. The height difference between P21 and P22 is h21. The distance between the projections of P21 and P22 onto the horizontal plane where the second laser lithography device 88 is located can be equivalent to... Figure 6 d21 in the equation. Based on the arctangent function and d21, h21, and combined with the following formula 3, the angle ∠P22 between the line connecting P21 and P22 and the second reference plane can be determined and denoted as the third angle.

[0078] Formula 3 The average height of P21 and P22 is the height distance between the second midpoint Z2 and the horizontal plane where the second laser device 88 is located. The height difference between the second midpoint Z2 and the sixth point P23 is h22. The distance between the projections of Z2 and P23 onto the horizontal plane where the second laser device 88 is located can be equivalent to... Figure 6 In the equation d22. Based on the arctangent function and d22, h22, and combined with the following formula 4, the angle ∠P23 between the line connecting P23 and Z2 and the second reference plane can be determined and denoted as the fourth angle.

[0079] Formula 4 Then, with ∠P22 and ∠P23 not less than the preset angle threshold, the tilt of the chip assembly is adjusted until the tilt between the photosensitive surface and the second reference plane meets the second preset tilt requirement.

[0080] After adjusting the chip assembly and prism assembly to meet the preset tilt requirements, step S12 can be executed.

[0081] Regarding step S12, under the condition that the prism assembly meets the first preset tilt requirement and the chip assembly meets the second preset tilt requirement, the prism assembly and the chip assembly are assembled to obtain a chip prism assembly.

[0082] With the prism assembly satisfying the first preset tilt requirement and the chip assembly satisfying the second preset tilt requirement, the prism assembly and the chip assembly are assembled so that the photosensitive surface and the polished surface are basically parallel, to obtain the chip prism assembly, which is used to combine with components such as lenses and motors to obtain a camera module.

[0083] In summary, this embodiment adjusts the prism assembly based on the distance between at least three points on the polished surface of the prism assembly and the first reference plane, ensuring that the tilt of the polished surface relative to the first reference plane meets a first preset tilt requirement. Similarly, it adjusts the chip assembly based on the distance between at least three points on the photosensitive surface of the chip assembly and the second reference plane, ensuring that the tilt of the photosensitive surface relative to the second reference plane meets a second preset tilt requirement. The prism assembly and the chip assembly are then assembled while maintaining the corresponding preset tilt requirements to obtain a chip prism assembly. Therefore, this embodiment adjusts the prism assembly and the chip assembly based on the tilt states of the photosensitive surface and the polished surface relative to the corresponding reference planes, ensuring that the photosensitive surface and the polished surface are substantially parallel, thus improving the assembly efficiency of the prism assembly and the chip assembly.

[0084] In actual operation, one possible assembly process of the prism chip assembly method provided in this application embodiment is as follows: Place the prism assembly on the assembly platform and use a fixture to hold the chip assembly, ensuring that the polished surface of the prism assembly faces away from the photosensitive surface of the chip assembly. The prism assembly refers to the component corresponding to the prism body 1 and the prism support 6 after assembly; the specific assembly method can be found in relevant technologies. The chip assembly refers to the component consisting of the photosensitive chip 2 and the filter 5 after assembly; the assembly method of the photosensitive chip 2 and the filter 5 can be found in relevant technologies.

[0085] Execute steps three and four simultaneously; The third step includes: using a calibration camera to identify the position of the prism body 1 in the prism assembly on the assembly platform and adjusting the position of the prism assembly so that the prism body 1 and the sample template are aligned with a preset position on the assembly platform. The sample template is used to indicate the relative positional relationship between the three points projected by the first laser device 7 on the sample template. In this embodiment, aligning the preset position of the prism body 1 with the sample template on the assembly platform ensures that the three points projected by the first laser device 7 are projected at the same position on each prism assembly of the same type. Based on the distance between at least three points on the polished surface of the prism body 1 in the prism assembly and the horizontal plane (i.e., the first reference plane), the prism assembly is adjusted so that the tilt of the polished surface relative to the horizontal plane meets a first preset tilt requirement; then, the calibration camera is used to identify the position of the prism body 1 in the prism assembly on the assembly platform and adjust the position of the prism assembly so that the prism body 1 and the sample template are aligned with a preset position on the assembly platform. The assembly platform is moved to the glue application position, carrying the prism assembly. Glue is applied to the prism support 6. After glue application, the assembly platform is moved to the preset bonding position, carrying the glued prism assembly.

[0086] The fourth step includes: using a calibration camera to identify the center position of the photosensitive chip 2 in the chip assembly, so that the photosensitive chip 2 is consistent with the preset position of the sample template. The sample template is used to indicate the relative positional relationship between the three points projected by the second laser lithography device 8 on the sample template. In this embodiment, ensuring the preset position of the photosensitive chip 2 is consistent with the sample template is to facilitate the identical projection positions of the three points projected by the second laser lithography device 8 on each chip assembly of the same type. Based on the distance between at least three points on the photosensitive surface of the chip assembly and the horizontal plane, the chip assembly is adjusted so that the tilt of the photosensitive surface relative to the horizontal plane meets a second preset tilt requirement, and the moving fixture carries the chip assembly to a preset fitting position.

[0087] After performing steps three and four, that is, after the prism assembly and chip assembly are moved to the mating position, the brightness difference at the four corners or the brightness difference between the top, bottom, left, and right sides is checked through the imaging screen to see if it meets the specifications. If it is not within the specifications, the prism assembly is adjusted by moving it horizontally until the brightness difference is adjusted to within the specifications. Specifically, after the two core optical components, prism body 1 and photosensitive chip 2, are moved to a position very close to each other by the mechanical device (including assembly platform and fixture), the image projected or displayed after the prism assembly and chip assembly are pre-assembled is observed through a camera or imaging device. At this time, the focus of the evaluation is the uniformity of the image brightness, that is, it is necessary to confirm whether the brightness difference in the four corner areas of the screen, or the brightness contrast between the top, bottom, left, and right areas, is controlled within a pre-set acceptable standard (specification). If the detection finds that these brightness differences exceed the allowable range, it means that the optical path has not been aligned to the ideal state. To solve this problem, the next key adjustment step is to finely move the position of the prism assembly on the horizontal plane (i.e., in the X and Y axis directions). This precise horizontal displacement alters the path of light, thus affecting the brightness distribution of the final image. This adjustment process is typically repeated—moving a point, checking the image, until the brightness differences across different areas of the screen are corrected and stabilized within specifications—ensuring a uniform, high-quality display in the final product.

[0088] UV curing is used to cure the adhesive in the prism assembly and the chip assembly to obtain the chip prism assembly.

[0089] The tilt adjustment between the photosensitive chip 2 and the prism based on the SFR score in the related technology is time-consuming. It usually takes 10 seconds to complete the tilt correction of a set of photosensitive chips 2 and prisms, which affects the overall hourly output (Units Per Hour, or UPH) and equipment capacity. The average UPH is around 100pcs.

[0090] Specifically, adjusting the tilt between the photosensitive chip 2 and the prism based on the SFR (Spatial Frequency Response) score is a method to optimize optical alignment through image quality assessment. This process typically includes the following steps: First, the prism and photosensitive chip 2 are initially placed in the assembly equipment, and then a test pattern (such as a bevel or sinusoidal grating) is projected onto the photosensitive chip 2, and an image is captured. Second, the SFR score of the captured image is analyzed using software; this score reflects the image's sharpness and detail retention, and is used to quantify tilt error. Next, based on the calculated SFR score, the tilt angle of the prism or photosensitive chip 2 is adjusted, usually through a fine-tuning mechanical platform (such as a six-axis adjustment stage). After each adjustment, the image needs to be recaptured and the SFR score recalculated to evaluate the adjustment effect. This process often requires multiple iterations because the SFR score is very sensitive to minute tilts and must be repeatedly adjusted until a predetermined SFR threshold or optimal value is reached.

[0091] The main reasons for the long time consumption of this method are as follows: First, SFR measurement itself requires high-precision image capture and calculation, and each measurement involves data transmission and processing, which takes up a lot of time. Second, the adjustment process is sequential and iterative, that is, one component (such as the prism) is adjusted first, and then another component (such as the photosensitive chip 2) is adjusted. Moreover, the SFR score must be re-verified after each adjustment, which prolongs the overall process. Third, the mechanical adjustment requires high precision, and even small movements need to be handled carefully to avoid over-adjustment or under-adjustment, which further increases the time consumption. Therefore, it usually takes 10 seconds to complete the tilt correction of a set of photosensitive chips 2 and prisms, which becomes a production bottleneck and limits the output per hour (UPH) to an average of only 100 pieces.

[0092] The chip prism assembly method of this application reduces the chip prism assembly time efficiency from 36s / pcs to 27.7s / pcs and increases the UPH efficiency from 100pcs to 130pcs. In other words, the assembly efficiency of the prism chip assembly using this application is improved by 23%. It can be seen that the chip prism assembly method provided by this application improves the assembly efficiency.

[0093] The chip prism assembly method of this application significantly improves assembly efficiency through process optimization and synchronous operation. Unlike the sequential adjustment based on SFR scores in related technologies, this application simultaneously executes the first and second steps when the polished surface of the prism assembly and the photosensitive surface of the chip assembly are facing each other: the first step adjusts the prism assembly according to the distance between at least three points on the polished surface and the first reference plane, so that the polished surface meets a first preset tilt requirement; the second step adjusts the chip assembly according to the distance between at least three points on the photosensitive surface and the second reference plane, so that the photosensitive surface meets a second preset tilt requirement. This synchronous adjustment allows the tilt correction of the two components to be performed simultaneously, eliminating the waiting time of sequential adjustment in related technologies and reducing the need for iterative measurement. After both meet the tilt requirements, assembly is performed directly to obtain the chip prism assembly.

[0094] In contrast, related technologies rely on iterative measurement and adjustment of SFR scores, a cumbersome and time-consuming process. This application's embodiment simplifies the process by directly measuring physical distance and synchronous operation, avoiding repetitive image capture and calculation. As a result, this application's embodiment reduces chip prism assembly time from 36 seconds to 27.7 seconds and increases UPH from 100pcs to 130pcs, a 23% efficiency improvement. This clearly demonstrates that this application's embodiment, through parallel processing and direct physical measurement, effectively reduces adjustment time, improves overall equipment productivity, and solves the problem of low UPH in related technologies.

[0095] Based on the same inventive concept, this application provides a method for assembling a camera module, the method comprising: The chip prism assembly is obtained by performing a chip prism assembly method as described above; The pre-assembled lens motor assembly is combined with the chip prism assembly to obtain the target camera module.

[0096] As can be seen, the camera module assembly method provided in this application first assembles the chip 2 and the filter 5 to obtain a chip assembly, and then assembles the prism body 1 and the prism support 6 to obtain a prism assembly; and finally assembles the lens and the motor to obtain a lens motor assembly. Then, the prism assembly and the chip assembly are assembled to obtain a chip-prism assembly; finally, the chip-prism assembly and the lens motor assembly are assembled to obtain the target camera module. The camera module assembly method provided in this application adjusts the assembly sequence of the various components of the camera module and shortens the assembly time of the chip assembly and the prism assembly, thus improving the assembly efficiency of the camera module.

[0097] The assembly method of the lens and motor can refer to relevant technologies. For example, the lens and motor can be assembled using an automatic focusing process (Active alignment, abbreviated as AA). This application embodiment will not elaborate on this.

[0098] Based on the same inventive concept, embodiments of this application provide a camera module, including the target camera module assembled by the camera module assembly method provided above.

[0099] Since the electronic device described in this embodiment is an electronic device used to implement the information processing method in the embodiments of this application, those skilled in the art can understand the specific implementation methods and various variations of the electronic device in this embodiment based on the information processing method described in the embodiments of this application. Therefore, how the electronic device implements the method in the embodiments of this application will not be described in detail here. Any electronic device used by those skilled in the art to implement the information processing method in the embodiments of this application falls within the scope of protection of this application.

[0100] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0101] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0102] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1The function specified in one or more boxes.

[0103] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0104] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0105] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A chip prism assembly method, characterized by, The method comprises: The first step and the second step are synchronously executed in a state that a polished surface of a prism assembly and a photosensitive surface of a chip assembly face each other; The first step comprises: adjusting the prism assembly according to distances between at least three point positions of the polished surface and a first reference plane, so that a degree of inclination between the polished surface and the first reference plane meets a first preset inclination requirement; The second step comprises: adjusting the chip assembly according to distances between at least three point positions of the photosensitive surface and a second reference plane, so that a degree of inclination between the photosensitive surface and the second reference plane meets a second preset inclination requirement; In a state that the prism assembly meets the first preset inclination requirement and the chip assembly meets the second preset inclination requirement, the prism assembly and the chip assembly are assembled to obtain a chip-prism assembly.

2. A chip prism assembly method as claimed in claim 1, characterized in that, The first step comprises: determining a first included angle between a line connecting the first point position and the second point position and the first reference plane according to a first height between the first point position in the polished surface and the first reference plane, a second height between the second point position in the polished surface and the first reference plane, and a first distance between projections of the first point position and the second point position on the first reference plane respectively; determining a second included angle between a line connecting the third point position and a first midpoint and the first reference plane according to a third height between the third point position in the polished surface and the first reference plane, an average value of the first height and the second height, and a second distance of a projection of the line connecting the third point position and the first midpoint on the first reference plane; the first midpoint refers to a midpoint of the line connecting the first point position and the second point position; the at least three point positions of the polished surface comprise the first point position, the second point position and the third point position; in a case that at least one of the first included angle and the second included angle does not meet the first preset inclination requirement, adjusting the prism assembly until the degree of inclination between the polished surface and the first reference plane meets the first preset inclination requirement.

3. A chip prism assembly method as claimed in claim 1, wherein, The second step comprises: determining a third included angle between a line connecting the fourth point position and the fifth point position and the second reference plane according to a fourth height between the fourth point position in the photosensitive surface and the second reference plane, a fifth height between the fifth point position in the photosensitive surface and the second reference plane, and a third distance between projections of the fourth point position and the fifth point position on the second reference plane respectively; A fourth angle between a line connecting the sixth point on the photosensitive surface and the second midpoint and the second reference plane is determined according to a sixth height between the sixth point on the photosensitive surface and the second reference plane, an average of the fourth height and the fifth height, and a fourth distance of a projection of the line connecting the sixth point and the second midpoint on the second reference plane; the second midpoint refers to a midpoint of a line connecting the fourth point and the fifth point; the at least three points on the photosensitive surface include the fourth point, the fifth point, and the sixth point; In a case where at least one of the third angle and the fourth angle does not satisfy the second preset inclination requirement, the chip assembly is adjusted until the inclination between the photosensitive surface and the second reference plane satisfies the second preset inclination requirement.

4. The chip prism assembly method of claim 1, wherein, The distances between the at least three points on the polishing surface and the first reference plane are detected by the first laser emitting device; the distances between the at least three points on the photosensitive surface and the second reference plane are detected by the second laser emitting device; the light emitting direction of the first laser emitting device and the light emitting direction of the second laser emitting device are opposite.

5. The chip prism assembly method of claim 1, wherein, The performances of the first laser emitting device and the second laser emitting device satisfy the following requirements: a repeatability accuracy is less than 1 um, a laser spot diameter is less than 50 um, a linear error is less than 2 um, a measurement range is within 35 mm, and a working waveband is a visible light waveband of 380 nm-780 nm.

6. A chip prism assembly method as claimed in claim 5, wherein, The first preset inclination requirement includes that an angle between a first line connecting first and second points of the at least three points on the polishing surface and the first reference plane is less than a preset angle threshold, and an angle between a second line connecting a third point of the at least three points and a first midpoint and the first reference plane is less than the preset angle threshold; the first midpoint refers to a midpoint of a line connecting the first point and the second point; 7. The chip prism assembly method of claim 1, wherein, The second preset inclination requirement includes that an angle between a third line connecting a fourth point and a fifth point of the at least three points on the photosensitive surface and the second reference plane is less than a preset angle threshold, and an angle between a fourth line connecting a sixth point of the at least three points and a second midpoint and the second reference plane is less than the preset angle threshold; the second midpoint refers to a midpoint of a line connecting the fourth point and the fifth point. The first preset inclination requirement includes that angles between at least two different lines respectively connecting the at least three points on the polishing surface and the first reference plane are less than a preset angle threshold; each line is a line connecting two points of the at least three points; and 8. The chip prism assembly method of claim 1, wherein, The first preset inclination requirement includes that angles between at least two different lines respectively connecting the at least three points on the polishing surface and the first reference plane are less than a preset angle threshold; each line is a line connecting two points of the at least three points; and The second preset inclination requirement comprises that the included angle between each of at least two different lines corresponding to at least three point positions on the photosensitive surface and the second reference plane is less than a preset angle threshold, and each line is a line between two point positions in the at least three point positions.

9. A chip prism assembly method according to claim 7 or 8, wherein, The preset angle threshold is 0.1 degrees or a value less than 0.1 degrees.

10. A camera module assembly method, comprising: The method comprises: performing a chip prism assembly method as claimed in any one of claims 1 to 9 to obtain the chip prism assembly; assembling the preassembled lens motor assembly and the chip prism assembly to obtain a target camera module.

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