Multi-layer circuit board structure
The vertical plug-in design of the multi-layer circuit board structure solves the problems of large space occupation, low heat dissipation efficiency and low modularity of traditional circuit boards, achieving space saving, improved electrical performance and heat dissipation, supporting high-speed data transmission, and simplifying the maintenance and upgrade process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-05
- Publication Date
- 2026-03-10
AI Technical Summary
Traditional circuit boards occupy a large space, have low heat dissipation efficiency, poor signal integrity, low modularity, and are inconvenient to maintain and upgrade.
It adopts a multi-layer circuit board structure, with the motherboard and function daughter cards vertically inserted and fixed by gold fingers to form a three-dimensional assembly. The vertical slots meet the high-speed signal standard, and signals are transmitted through the vertical slots. The function daughter cards are pluggable and modular.
It saves space, increases modularity, improves electrical performance and heat dissipation, supports high-speed data transmission, is easy to maintain and upgrade, and reduces maintenance costs.
Smart Images
Figure CN121645666A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of multi-layer circuit board, in particular to a multi-layer circuit board structure. BACKGROUND
[0002] With the development of electronic devices towards miniaturization and high performance, the design of printed circuit board (PCB) faces the challenge of space limitation. In traditional circuit board, functional modules (such as solid state disk slot, main chip, etc.) are usually horizontally installed on the mainboard 1, occupying a large area of plane, leading to the increase of the size of the mainboard, which is not conducive to the compact design of the device. In addition, the horizontal installation method has low heat dissipation efficiency, poor signal integrity, and low modularization, which is not convenient for maintenance and upgrading. In the prior art, there are ways of connecting the sub-board by wire or welding, but the wire connection may introduce signal loss, and the welding connection is not conducive to module replacement. Therefore, there is an urgent need for a new circuit board structure that can save space, improve modularity, improve electrical performance and heat dissipation. SUMMARY
[0003] 1. Technical problems solved In view of the defects of the prior art, the present application provides a multi-layer circuit board structure, which has the advantages of saving plane space, modular design, improving electrical performance, improving heat dissipation, simplifying production and assembly, etc., and solves the problems raised in the background art.
[0004] (II) Technical solutions To achieve the above object, the present application provides the following technical solutions: a multi-layer circuit board structure, comprising a mainboard and a functional sub-card, the mainboard is a multi-layer printed circuit board, having a predetermined layered structure, the functional sub-card is a multi-layer printed circuit board, having a predetermined layered structure, characterized in that: the board body of the mainboard is provided with a vertical slot, the bottom edge of the functional sub-card is fixedly connected with a gold finger, the functional sub-card is vertically inserted into the vertical slot of the mainboard through the gold finger, so that the functional sub-card and the mainboard are vertically arranged, forming a three-dimensional assembly structure, thereby saving the plane space of the mainboard; wherein the layered structure of the mainboard comprises at least four conductive layers, the layered structure of the functional sub-card comprises at least four conductive layers, the vertical slot is welded at the front edge of the top surface of the mainboard, and conforms to the industrial standard interface specification.
[0005] The working principle of the device is based on three-dimensional assembly and modular connection. The mainboard serves as the core carrier, providing mechanical and electrical interfaces through the vertical slots on it. The functional daughter card serves as a functional module, inserted into the vertical slot through the bottom gold finger, achieving vertical fixation. In terms of electrical connection, signals are transmitted from the inner signal layer of the mainboard to the gold finger of the functional daughter card through the vertical slot, and then distributed to the main chip and other components. Since the vertical slot meets the high-speed standard (such as PCIe), the signal path is short and impedance-matched, ensuring high-speed data transmission. Mechanically, the top of the functional daughter card is connected to the external support structure through the fixing hole with a screw, forming an "L" or "T" three-dimensional structure to enhance stability. During heat dissipation, air naturally convects along the vertical structure, and the larger surface area of the functional daughter card accelerates heat diffusion. The modular design allows the functional daughter card to be tested and replaced independently, improving overall reliability.
[0006] Preferably, the mainboard is a six-layer circuit board, and its layered structure includes, from top to bottom, a top element layer, a first inner signal layer, a second inner power layer, a third inner ground layer, a fourth inner signal layer, and a bottom solder layer; wherein the top element layer is used to fixedly connect a plurality of external elements, the bottom solder layer is used to provide a soldering interface, the first inner signal layer and the fourth inner signal layer are used to lay high-speed signal lines, and the second inner power layer and the third inner ground layer are used to provide power distribution and reference ground plane, respectively, to enhance electrical performance.
[0007] Preferably, the functional daughter card is a four-layer circuit board, and its layered structure includes, from top to bottom, a top element layer, an inner power layer, an inner ground layer, and a bottom solder layer; wherein the top element layer is used to fixedly connect a main chip and a solid state disk slot, the inner power layer and the inner ground layer are used to provide a complete power and ground network, and the bottom solder layer is used to lay connection points of the gold finger to support modular functional integration.
[0008] Preferably, the vertical slot meets the PCIe standard or the MXM standard, and it is a high-strength board-to-board connector, welded to the edge area of the mainboard and configured to support high-speed signal transmission; the gold finger is inserted into the vertical slot to achieve electrical connection and mechanical fixation.
[0009] Preferably, the top of the functional daughter card is provided with at least one fixing hole, and the top end of the functional daughter card is detachably fixedly connected to an external support structure through a screw, thereby forming a stable "L" or "T" three-dimensional structure.
[0010] Preferably, the plate body of the functional sub-card is densely installed with a plurality of functional elements, including a main chip, a solid state disk slot and a plurality of small elements; wherein the main chip is fixed in the middle of the top surface of the functional sub-card, the solid state disk slot is arranged at the top end of the side surface of the functional sub-card for receiving a solid state disk module, and the plurality of small elements are distributed on the plate surface of the functional sub-card to realize complete functional integration.
[0011] Preferably, the three-dimensional assembly structure forms a natural air duct between the functional sub-card and the main board, increasing the heat dissipation surface area.
[0012] Preferably, the functional sub-card is connected to the vertical slot through the gold finger to realize modular design; wherein the vertical slot supports the compatible interfaces of a plurality of functional sub-cards.
[0013] Preferably, the connection interface of the vertical slot and the gold finger optimizes the high-speed signal transmission path, supporting a data transmission rate reaching the PCIe standard requirement.
[0014] Preferably, the main board and the functional sub-card can be independently produced and tested, wherein the main board completes functional verification before the vertical slot is installed, and the functional sub-card completes module testing before being inserted into the vertical slot.
[0015] The core design of the device is: saving plane space: by vertically inserting the functional sub-card into the main board, a three-dimensional assembly structure is formed, which "stands up" the functional modules originally occupying a large area horizontally, greatly saving the plane space of the main board, freeing up valuable area for the main board, which can be used to place a larger heat sink, more interfaces, or make the main board itself smaller and more compact, suitable for compact devices.
[0016] Modular design: the functional sub-card is connected to the vertical slot through the gold finger to realize modularization. Easy to maintain and upgrade, if the solid state disk slot or the main chip on the functional sub-card is damaged, only the functional sub-card needs to be replaced without replacing the entire main board, reducing maintenance cost and difficulty. At the same time, the platform design allows functional sub-cards with different functions (such as network cards, graphics cards, etc.) to be compatible with the same vertical slot, realizing rapid iteration and customization of products.
[0017] Improved electrical performance: the vertical slot meets the high-speed signal standard (such as PCIe), optimizes the high-speed signal transmission path, and reduces signal loss; combined with the multi-layer structure of the main board and the functional sub-card (such as the inner power layer and the ground layer), a complete reference plane is provided to enhance signal integrity and support high-speed data transmission rate reaching the PCIe standard requirement.
[0018] Improved heat dissipation: the functional sub-card and the main board are arranged vertically to form a natural air duct, increasing the heat dissipation surface area, promoting air convection, and facilitating heat dissipation of the main chip and the solid state disk, improving system stability.
[0019] Simplification of production and assembly: the mainboard and the functional subcard can be produced and tested independently, the mainboard is functionally verified before being installed in the vertical slot, and the functional subcard is module tested before being inserted, which improves production efficiency and reduces overall failure rate.
[0020] (Three) beneficial effects Compared with the prior art, the present application provides a multi-layer circuit board structure with the following beneficial effects: The multi-layer circuit board structure vertically inserts the functional subcard into the mainboard to form a three-dimensional assembly structure, which greatly saves the plane space of the mainboard, frees up valuable area for the mainboard, and can be used to place a larger heat sink, more interfaces, or make the mainboard itself smaller and more compact, suitable for compact devices. The functional subcard is modularized through the pluggable connection of the gold finger and the vertical slot. It is easy to maintain and upgrade. If the solid state disk slot or main chip on the functional subcard is damaged, only the functional subcard needs to be replaced without replacing the entire mainboard, reducing maintenance cost and difficulty. At the same time, the platform design allows different functional subcards (such as network cards, graphics cards, etc.) to be compatible with the same vertical slot, realizing product rapid iteration and customization.
[0021] The circuit board structure is improved in electrical performance, the vertical slot meets the high-speed signal standard, optimizes the high-speed signal transmission path, and reduces signal loss; in combination with the multi-layer structure of the mainboard and the functional subcard, a complete reference plane is provided to enhance signal integrity and support high-speed data transmission rate up to PCIe standard requirements. The functional subcard and the mainboard are vertically arranged to form a natural air duct, increase the surface area of the heat sink, promote air convection, facilitate heat dissipation of the main chip and the solid state disk, and improve system stability. The mainboard and the functional subcard can be produced and tested independently, the mainboard is functionally verified before being installed in the vertical slot, and the functional subcard is module tested before being inserted, which improves production efficiency and reduces overall failure rate. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 A structure schematic diagram of a multi-layer circuit board from a first perspective is provided for the present application; Figure 2 A structure schematic diagram of a multi-layer circuit board from a second perspective is provided for the present application; Figure 3 A structure schematic diagram of a multi-layer circuit board from a third perspective is provided for the present application; Figure 4 A structure schematic diagram of a multi-layer circuit board at the gold finger is provided for the present application.
[0023] In the figure: 1-mainboard, 2-functional subcard, 3-vertical slot, 4-gold finger, 5-main chip, 6-solid state disk slot, 7-fixing hole, 9-small element. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
[0025] Please refer to Figures 1-4 , including a mainboard 1 and a functional daughter card 2, the mainboard 1 is a multi-layer printed circuit board with a predetermined layered structure, and the functional daughter card 2 is a multi-layer printed circuit board with a predetermined layered structure, characterized in that: a vertical slot 3 is arranged on the board body of the mainboard 1, a gold finger 4 is fixedly connected to the bottom edge of the functional daughter card 2, and the functional daughter card 2 is vertically inserted into the vertical slot 3 of the mainboard 1 through the gold finger 4, so that the functional daughter card 2 is vertically arranged with the mainboard 1 to form a three-dimensional assembly structure, thereby saving the plane space of the mainboard 1; wherein the layered structure of the mainboard 1 includes at least four conductive layers, the layered structure of the functional daughter card 2 includes at least four conductive layers, and the vertical slot 3 is welded at the front edge of the top surface of the mainboard 1 and conforms to the industrial standard interface specification.
[0026] The mainboard 1 is a six-layer circuit board, and its layered structure includes a top element layer, a first inner signal layer, a second inner power supply layer, a third inner ground layer, a fourth inner signal layer and a bottom welding layer from top to bottom; wherein the top element layer is used for fixedly connecting a plurality of external elements, the bottom welding layer is used for providing a welding interface, the first inner signal layer and the fourth inner signal layer are used for laying high-speed signal lines, and the second inner power supply layer and the third inner ground layer are respectively used for providing power distribution and reference ground plane to enhance electrical performance. The functional daughter card 2 is a four-layer circuit board, and its layered structure includes a top element layer, an inner power supply layer, an inner ground layer and a bottom welding layer from top to bottom; wherein the top element layer is used for fixedly connecting a main chip 5 and a solid state disk slot 6, the inner power supply layer and the inner ground layer are used for providing a complete power supply and ground network, and the bottom welding layer is used for laying connection points of the gold finger 4 to support modular functional integration. The vertical slot 3 conforms to the PCIe standard or the MXM standard, which is a high-strength board-to-board connector welded in the edge area of the mainboard 1 and configured to support high-speed signal transmission; the gold finger 4 is plugged into the vertical slot 3 to realize electrical connection and mechanical fixation.
[0027] The top of the functional daughter card 2 has at least one fixing hole 7, allowing for detachable connection of the top of the functional daughter card 2 to the external support structure via screws, thus forming a stable "L" or "T" shaped three-dimensional structure. Several functional components are densely mounted on the board of the functional daughter card 2, including a main chip 5, a solid-state drive slot 6, and multiple small components 9. The main chip 5 is fixed to the center of the top surface of the functional daughter card 2, the solid-state drive slot 6 is located at the top side of the functional daughter card 2 to receive the solid-state drive module, and the multiple small components 9 are distributed across the board surface of the functional daughter card 2, achieving complete functional integration. This three-dimensional assembly structure creates a natural airflow channel between the functional daughter card 2 and the motherboard 1, increasing the heat dissipation surface area. The functional daughter card 2 achieves a modular design through a pluggable connection between the gold fingers 4 and the vertical slot 3; the vertical slot 3 supports multiple compatible interfaces of the functional daughter card 2. The connection interface between the vertical slot 3 and the gold fingers 4 optimizes the high-speed signal transmission path, supporting data transfer rates that meet PCIe standard requirements. The motherboard 1 and the functional daughter card 2 can be manufactured and tested separately. The motherboard 1 completes functional verification before installing the vertical slot 3, and the functional daughter card 2 completes module testing before being inserted into the vertical slot 3.
[0028] The working principle of this device is based on three-dimensional assembly and modular connection. The motherboard 1 serves as the core carrier, providing mechanical and electrical interfaces through its vertical slot 3. The functional daughter card 2, as a functional module, is vertically fixed by inserting into the vertical slot 3 via its bottom gold fingers 4. Electrically, signals are transmitted from the inner signal layer of the motherboard 1 through the vertical slot 3 to the gold fingers 4 of the functional daughter card 2, and then distributed to components such as the main chip 5. Because the vertical slot 3 conforms to high-speed standards (such as PCIe), the signal path is short and impedance matched, ensuring high-speed data transmission. Mechanically, the top of the functional daughter card 2 is connected to an external support with screws through fixing holes 7, forming an "L" or "T" shaped three-dimensional structure, enhancing stability. During heat dissipation, air naturally convects along the vertical structure, and the large surface area of the functional daughter card 2 accelerates heat dissipation. The modular design allows the functional daughter card 2 to be independently tested and replaced, improving overall reliability.
[0029] Example 1: Motherboard 1 is a six-layer circuit board. The layered structure from top to bottom is as follows: top component layer (for fixing external components), first inner signal layer (for high-speed signal lines), second inner power layer (for power distribution), third inner ground layer (for a reference ground plane), fourth inner signal layer (for high-speed signal lines), and bottom solder layer (for soldering interfaces). Functional daughter card 2 is a four-layer circuit board. The layered structure from top to bottom is as follows: top component layer (for fixing the main chip 5 and the solid-state drive slot 6), inner power layer (for providing a power network), inner ground layer (for providing a ground network), and bottom solder layer (for the gold finger 4 connection points). The vertical slot 3 conforms to the PCIe standard and is soldered to the edge area of motherboard 1, supporting high-speed signal transmission. The gold fingers 4 are inserted into the vertical slot 3. Functional daughter card 2 has a mounting hole 7 on its top, which is used to fix it to the device chassis with screws, forming an "L" shape. The main chip 5 (located in the middle of the top surface), the solid-state drive slot 6 (located at the top of the side), and multiple small components 9 (distributed on the board surface) are densely installed on functional daughter card 2. This embodiment is applicable to mini PCs or embedded storage systems. The functional daughter card 2 integrates solid-state drive functionality, and vertical installation saves space on the motherboard 1. At the same time, the PCIe interface provides high-speed data access.
[0030] Example 2: Motherboard 1 is a four-layer circuit board with a layered structure including a top component layer, an inner signal layer, an inner power layer, and a bottom solder layer, used for basic computing devices. Functional daughter card 2 is a six-layer circuit board with a layered structure from top to bottom including a top component layer (for mounting the GPU main chip 5), a first inner signal layer, a second inner power layer, a third inner ground layer, a fourth inner signal layer, and a bottom solder layer (for mounting gold fingers 4), to support high-performance graphics processing. The vertical slot 3 conforms to the MXM standard (Mobile PCIe Module) and is soldered to the motherboard 1 near the CPU to reduce signal latency. After the gold fingers 4 are inserted into the vertical slot 3, the top of functional daughter card 2 is fixed to the support frame with screws through two fixing holes 7, forming a "T"-shaped three-dimensional structure to enhance vibration resistance. Functional daughter card 2 also integrates a solid-state drive slot 6 (for storage) and multiple small components 9 (such as video memory). This example is used in gaming laptops or workstations. Users can replace functional daughter card 2 to upgrade graphics performance, and the modular design simplifies maintenance.
[0031] In summary, this multi-layer circuit board structure vertically inserts the functional daughter card 2 into the motherboard 1, forming a three-dimensional assembly structure. This "standing up" functional modules that originally occupied a large horizontal area significantly saves the planar space of the motherboard 1, freeing up valuable space for larger heatsinks, more interfaces, or making the motherboard 1 itself more compact, suitable for compact devices. The functional daughter card 2 achieves modularity through a pluggable connection between its gold fingers 4 and the vertical slot 3. This facilitates maintenance and upgrades; if the solid-state drive slot 6 or the main chip 5 on the functional daughter card 2 is damaged, only the functional daughter card 2 needs to be replaced without replacing the entire motherboard 1, reducing repair costs and difficulty. Simultaneously, the platform design allows functional daughter cards 2 with different functions (such as network cards, graphics cards, etc.) to be compatible with the same vertical slot 3, enabling rapid product iteration and customization.
[0032] The circuit board structure features improved electrical performance. Vertical slot 3 conforms to high-speed signal standards, optimizing high-speed signal transmission paths and reducing signal loss. Combined with the multi-layered structure of motherboard 1 and functional daughter card 2, it provides a complete reference plane, enhancing signal integrity and supporting high-speed data transfer rates to meet PCIe standard requirements. The vertical arrangement of functional daughter card 2 with motherboard 1 creates a natural airflow channel, increasing the heat dissipation surface area, promoting air convection, and facilitating heat dissipation from the main chip 5 and the solid-state drive, thus improving system stability. Motherboard 1 and functional daughter card 2 can be manufactured and tested independently. Motherboard 1 undergoes functional verification before installing vertical slot 3, and functional daughter card 2 undergoes module testing before insertion, improving production efficiency and reducing the overall failure rate.
[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A multi-layer wiring board structure comprising a main board (1) and a functional daughter card (2), said main board (1) being a multi-layer printed wiring board having a predetermined layer structure, said functional daughter card (2) being a multi-layer printed wiring board having a predetermined layer structure, characterized in that: The plate body of the mainboard (1) is provided with a vertical slot (3), the bottom edge of the functional daughter card (2) is fixedly connected with a golden finger (4), the functional daughter card (2) is vertically inserted into the vertical slot (3) of the mainboard (1) through the golden finger (4), so that the functional daughter card (2) is vertically arranged with the mainboard (1), forming a three-dimensional assembly structure, thereby saving the plane space of the mainboard (1); wherein the layered structure of the mainboard (1) includes at least four conductive layers, the layered structure of the functional daughter card (2) includes at least four conductive layers, the vertical slot (3) is welded at the front edge of the top surface of the mainboard (1) and conforms to the industrial standard interface specification.
2. The multilayer wiring board structure according to claim 1, wherein: The mainboard (1) is a six-layer circuit board, and its layered structure includes a top element layer, a first inner layer signal layer, a second inner layer power supply layer, a third inner layer ground layer, a fourth inner layer signal layer and a bottom welding layer from top to bottom; wherein the top element layer is used for fixedly connecting a plurality of external elements, the bottom welding layer is used for providing a welding interface, the first inner layer signal layer and the fourth inner layer signal layer are used for laying high-speed signal lines, and the second inner layer power supply layer and the third inner layer ground layer are respectively used for providing power distribution and reference ground plane to enhance electrical performance.
3. The multilayer wiring board structure according to claim 1, wherein: The functional daughter card (2) is a four-layer circuit board, and its layered structure includes a top element layer, an inner layer power supply layer, an inner layer ground layer and a bottom welding layer from top to bottom; wherein the top element layer is used for fixedly connecting a main chip (5) and a solid state disk slot (6), the inner layer power supply layer and the inner layer ground layer are used for providing a complete power supply and ground network, and the bottom welding layer is used for laying connection points of the golden finger (4) to support modular function integration.
4. The multilayer wiring board structure according to claim 1, wherein: The vertical slot (3) conforms to the PCIe standard or the MXM standard, is a high-strength board-to-board connector, is welded in the edge area of the mainboard (1), and is configured to support high-speed signal transmission; the golden finger (4) is plugged with the vertical slot (3) to realize electrical connection and mechanical fixation.
5. The multilayer wiring board structure according to claim 1, wherein: The top of the functional daughter card (2) is provided with at least one fixing hole (7), and the top end of the functional daughter card (2) is detachably fixedly connected with an external support structure by a screw, thereby forming a stable "L" shaped or "T" shaped three-dimensional structure.
6. The multilayer wiring board structure according to claim 1, wherein: The plate body of the functional daughter card (2) is densely installed with a plurality of functional elements, including a main chip (5), a solid state disk slot (6) and a plurality of small elements (9); wherein the main chip (5) is fixed in the middle of the top surface of the functional daughter card (2), the solid state disk slot (6) is arranged at the top end of the side surface of the functional daughter card (2) and is used for receiving a solid state disk module, and the plurality of small elements (9) are distributed on the plate surface of the functional daughter card (2) to realize complete function integration.
7. The multilayer wiring board structure according to claim 1, wherein: The three-dimensional assembly structure forms a natural air duct between the functional daughter card (2) and the mainboard (1), thereby increasing the heat dissipation surface area.
8. The multilayer wiring board structure according to claim 1, wherein: The functional sub-card (2) is connected with the vertical slot (3) through the golden finger (4) to realize modular design, wherein the vertical slot (3) supports compatible interfaces of multiple functional sub-cards (2).
9. The multilayer wiring board structure according to claim 1, wherein: The connection interface of the vertical slot (3) and the golden finger (4) optimizes a high-speed signal transmission path and supports a data transmission rate reaching a PCIe standard requirement.
10. The multilayer wiring board structure of Claim 1, wherein: The mainboard (1) and the functional sub-card (2) can be independently produced and tested, wherein the mainboard (1) is functionally verified before the vertical slot (3) is installed, and the functional sub-card (2) is module tested before being inserted into the vertical slot (3).