A graphene pore metalization pretreatment whole pore device

By designing a pretreatment device for graphene hole metallization, the problems of synchronous belt/gear contamination in the hole-forming liquid and complex sealing structure were solved. This achieved zero leakage and zero wear of the drive shaft, accurate liquid level detection, adaptability to various PCB specifications, and improved hole-forming consistency and graphene coverage.

CN121645718BActive Publication Date: 2026-07-21YIYANG MINGZHENGHONG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
YIYANG MINGZHENGHONG ELECTRONICS CO LTD
Filing Date
2025-12-15
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing PCB substrate hole-forming devices, the long-term immersion of moving parts such as synchronous belts/gears in the hole-forming liquid causes plasticizer precipitation, rubber swelling and shedding, resulting in secondary adsorption and contamination of the PCB. In addition, the sealing structure is complex, costly, and prone to corrosion and leakage.

Method used

A pretreatment device for metallizing graphene holes is designed, which adopts a horizontal feeding mechanism, a liquid circulation mechanism, a limiting mechanism and an ultrasonic array. The synchronous pulley-synchronous belt group is externally mounted. Liquid leakage is prevented by a liquid baffle and a liquid level detection component. The ultrasonic and oblique liquid spray work together. The limiting mechanism is adapted to PCBs of different specifications.

Benefits of technology

It achieves zero leakage and zero wear in the drive shaft, uniform adsorption of the hole-forming agent, accurate liquid level detection, adaptability to various PCB specifications, avoids pollution and corrosion, improves hole-forming consistency, and provides a good foundation for graphene coverage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application discloses a graphene hole metalizing pretreatment whole hole device, and particularly relates to the technical field of PCB substrate manufacturing, which comprises a whole hole box, two liquid collecting cavities are arranged in the whole hole box, a feeding cavity, a whole hole cavity and a discharging cavity are sequentially arranged between the two liquid collecting cavities along the conveying direction of the PCB substrate; the horizontal material conveying mechanism comprises a plurality of conveying rollers which are sequentially arranged horizontally in the feeding cavity, the whole hole cavity and the discharging cavity, transmission shafts are fixed to the front and back ends of the conveying rollers, the shaft bodies of the transmission shafts in the liquid collecting cavities are sleeved with liquid blocking discs, and a synchronous wheel-synchronous belt set is arranged between the adjacent two transmission shafts. The synchronous wheel-synchronous belt set is installed outside the whole hole box, so that the whole hole liquid in the whole hole cavity is prevented from being polluted, meanwhile, the liquid level difference of the cavity is generated, the liquid is blocked by cooperating with the liquid blocking discs on the transmission shafts, the transmission shafts are zero-leakage and zero-wear, and the corrosion leakage problem is completely solved.
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