Automatic glue brushing equipment and method

Abstract

The invention discloses automatic glue brushing equipment and method, and the equipment comprises a machine table which is provided with an annular guide rail, a material preparation station, a first gluing station, an overturning station, and a second gluing station; a plurality of stages; the material taking mechanism is arranged on the machine table; the material taking mechanism is used for placing the cooling fins into or out of the carrying table. The material preparation station is provided with a material preparation mechanism for accommodating a plurality of cooling fins; the first gluing station is provided with a first gluing mechanism and is used for carrying out gluing treatment on the to-be-glued surface, exposed on the carrying table, of the cooling fin; the overturning station is provided with an overturning mechanism used for overturning the cooling fins. The second gluing station is provided with a second gluing mechanism used for conducting gluing treatment on the other surface of the cooling fin. According to the automatic glue brushing equipment, feeding, first surface gluing, overturning and second surface gluing are automatically executed along the annular guide rail, and different procedures can be executed at the same time, so that the glue brushing efficiency of the cooling fins is greatly improved, and the user experience is improved.

Description

Technical Field

[0001] This invention relates to the field of equipment processing technology, specifically to an automatic glue application device and method. Background Technology

[0002] To improve the heat dissipation efficiency of equipment, related technologies typically involve attaching ceramic or metal heat sinks to the equipment. Before attaching the heat sinks, thermal adhesive needs to be applied to at least two opposing sides. However, these processes are usually performed manually, involving steps such as loading, applying adhesive, flipping, applying adhesive to the back side, and unloading. This high level of complexity leads to low production efficiency. Summary of the Invention

[0003] The main technical problem solved by this invention is the low production efficiency of heat sinks caused by manual double-sided glue application in related technologies.

[0004] To address the aforementioned technical problems, this application provides an automatic adhesive application device, comprising:

[0005] The machine is equipped with a circular guide rail connected end to end, and a material preparation station, a first gluing station, a flipping station, and a second gluing station arranged sequentially along the circular guide rail.

[0006] Multiple platforms are provided, each platform being disposed on the annular guide rail. The platforms move along the extension direction of the annular guide rail under the drive of the annular guide rail. The top of each platform has an upward-opening receiving groove for supporting and fixing a heat sink. The heat sink has multiple surfaces, and at least two different surfaces are the surfaces to be coated with adhesive.

[0007] A material handling mechanism is provided on the machine base; the material handling mechanism is used to place the heat sink into or out of the carrier.

[0008] The material preparation station is equipped with a material preparation mechanism that can accommodate multiple heat sinks; the first gluing station is equipped with a first gluing mechanism for applying glue to the surface of the heat sink that is exposed on the carrier; the flipping station is equipped with a flipping mechanism for flipping the heat sink; and the second gluing station is equipped with a second gluing mechanism for applying glue to the other surface of the heat sink.

[0009] In one embodiment, the material preparation mechanism includes a material preparation bin and a support mechanism. The top of the material preparation bin is open, and the heat sinks are stacked sequentially in the material preparation bin along the height direction of the material preparation bin. The support mechanism supports the heat sinks at the bottom of the material preparation bin, and the support mechanism is used to control the heat sinks located at the top of the material preparation bin to be in a preset position.

[0010] In one embodiment, the number of the material preparation bins includes at least two, and the material preparation bins are arranged side by side.

[0011] In one embodiment, a negative pressure mechanism is further included, which is disposed on the platform and used to fix the heat sink to the platform.

[0012] In one embodiment, the flipping mechanism includes a support and a gripper, the gripper being rotatably connected to the support; the gripper is used to hold and flip the heat sink located within the platform.

[0013] In one embodiment, the system further includes a testing mechanism and a storage compartment. The testing mechanism is used to test the heat sink and screen out defective products. The storage compartment is used to store the defective products.

[0014] In one embodiment, the detection mechanism includes an area detection component and / or a thickness detection component, respectively used to detect the area and / or thickness of the adhesive layer coated on the heat sink.

[0015] In one embodiment, the first adhesive application mechanism includes a first screen plate and a first adhesive scraper assembly. The first screen plate is located above the platform and has a plurality of first mesh holes extending vertically through it. The first adhesive scraper assembly is disposed above the first screen plate and is used to apply the adhesive to the upper surface of the first screen plate, and to scrape the adhesive through the first mesh holes to cover the heat sink on the platform; and / or,

[0016] The second adhesive application mechanism includes a second screen plate and a second adhesive scraping assembly. The second screen plate is located above the platform and has a plurality of second mesh holes that extend vertically through it. The second adhesive scraping assembly is located above the second screen plate and is used to place the adhesive to be coated on the upper surface of the second screen plate. By scraping the adhesive, the adhesive is made to pass through the second mesh holes and cover the heat sink on the platform.

[0017] In one embodiment, the material handling mechanism includes a negative pressure material handling component and a motion mechanism connected to each other. The motion mechanism is connected to the negative pressure material handling component, the negative pressure material handling component is detachably connected to the heat sink, and the motion mechanism is used to control the movement of the negative pressure material handling component.

[0018] This application also provides an automatic glue application method, applied in the aforementioned automatic glue application equipment; the automatic glue application method includes:

[0019] The material handling mechanism extracts the heat sink from the material preparation mechanism and places it into the receiving slot;

[0020] The first gluing mechanism applies glue to the surface of the heat sink that is exposed on the carrier.

[0021] The flipping mechanism flips the heat sink to expose the un-adhesive-coated surface of the heat sink on the carrier.

[0022] The second adhesive application mechanism applies adhesive to the other surface of the heat sink.

[0023] According to the automatic glue application equipment and method of the above embodiments, since the feeding, first-side glue application, flipping and second-side glue application of the automatic glue application equipment are all automatically performed along the annular guide rail, and different processes can be performed simultaneously, the glue application efficiency of the heat sink is greatly improved and the user experience is enhanced. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the automatic glue application device in the embodiments of this application;

[0025] Figure 2 This is a top view of the automatic glue application device in the embodiments of this application;

[0026] Figure 3 This is a schematic diagram of the annular guide rail structure in an embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the platform structure in an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of the material preparation mechanism in an embodiment of this application;

[0029] Figure 6 This is a schematic diagram of the flipping mechanism structure in an embodiment of this application;

[0030] Figure 7 This is a schematic diagram of the first gluing mechanism in an embodiment of this application;

[0031] Figure 8 This is a schematic diagram of the material handling mechanism in an embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1-Machine base; 11-Circular guide rail; 12-Material preparation station; 13-First gluing station; 14-Tilting station; 15-Second gluing station; 16-Inspection station; 17-Idle station;

[0034] 2-Stage; 21-Receiving groove; 22-Negative pressure mechanism;

[0035] 3-Material handling mechanism; 31-Negative pressure material handling component; 32-Motion mechanism;

[0036] 4-Material preparation mechanism; 41-Material preparation bin; 42-Supporting mechanism;

[0037] 5-First gluing mechanism; 51-First screen plate; 52-First glue scraping assembly; 53-First mesh;

[0038] 6-Tilting mechanism; 61-Bracket; 62-Gripper;

[0039] 7-Heat sink. Detailed Implementation

[0040] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0041] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0042] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0043] This application provides an automatic glue application device. Please refer to [link / reference]. Figures 1 to 4 The automatic glue application equipment includes:

[0044] Machine 1, with a circular guide rail 11 connected end to end, and a material preparation station 12, a first gluing station 13, a flipping station 14, and a second gluing station 15 arranged sequentially along the circular guide rail 11.

[0045] Multiple platforms 2 are provided on an annular guide rail 11. The platforms 2 move along the extension direction of the annular guide rail 11 under the drive of the annular guide rail 11. The top of the platform 2 has an upward-opening receiving groove 21, which is used to support and fix the heat sink. The heat sink has multiple surfaces, and at least two different surfaces are the surfaces to be coated with adhesive.

[0046] Material handling mechanism 3 is installed on machine base 1; material handling mechanism 3 is used to place heat sinks into or out of carrier 2.

[0047] The material preparation station 12 is equipped with a material preparation mechanism 4 that can accommodate multiple heat sinks; the first gluing station 13 is equipped with a first gluing mechanism 5, which is used to apply glue to the surface of the heat sink exposed on the carrier 2; the flipping station 14 is equipped with a flipping mechanism 6, which is used to flip the heat sink so that the surface of the heat sink that has not been glued is exposed on the carrier 2; the second gluing station 15 is equipped with a second gluing mechanism 5, which is used to apply glue to the surface of the heat sink exposed on the carrier 2.

[0048] The automatic glue-applying device in this embodiment is used to automatically apply glue to heat sinks with multiple surfaces to be glued. To achieve a fully automated glue-applying process, a ring-shaped guide rail 11 is formed on the machine base 1 of the automatic glue-applying device in this embodiment. The ring-shaped guide rail 11 refers to a guide rail whose ends are connected to each other, allowing the guide rail to move continuously along its extension direction. In this embodiment, the ring-shaped guide rail 11 is described as having its ends connected; however, there is no specific limitation on the overall shape of the ring-shaped guide rail 11. In this embodiment, the ring-shaped guide rail 11 can be set to various standard or non-standard shapes such as rectangles, elongated shapes, ellipses, and circles, depending on the specific structure of the machine base 1 or business requirements.

[0049] To facilitate the glue application operation of the automatic glue application equipment, in this embodiment, the machine base 1 is equipped with multiple workstations along the annular guide rail 11. Each workstation corresponds to an operation performed on the heat sink in the automatic glue application production process. The workstations may include at least a material preparation workstation 12, a first glue application workstation 13, a flipping workstation 14, and a second glue application workstation 15. The material preparation workstation 12 prepares the heat sink to be coated, so that subsequent glue application operations can be performed on it. The first glue application workstation 13 applies glue to one of the surfaces of the heat sink to be coated, while the flipping workstation 14 and the second glue application workstation 15 each apply glue to the other surfaces of the heat sink that have not yet been coated, thus enabling the glue application process on two or more surfaces of the heat sink.

[0050] To achieve the above objectives, the automatic glue application equipment in this embodiment includes multiple platforms 2, which are mounted on an annular guide rail 11. Therefore, the platforms 2 move along the direction of the annular guide rail 11 under its influence. In this application, the annular guide rail 11 can move in a step-by-step manner, including but not limited to moving the distance between adjacent workstations and then stopping for a certain period to perform the operation. In this embodiment, based on different positions on the annular guide rail 11, each workstation performs different processes simultaneously for different heat sinks, thereby improving operational efficiency. To easily adapt to the differences in the time spent on the processes at different workstations, several idle workstations 17 can also be set on the machine 1 in this embodiment.

[0051] The platform 2 serves to hold the heat sink. To facilitate the adhesive application process, in this embodiment, the platform 2 has an open receiving groove 21 at its top. Since the opening of the receiving groove 21 is located at the top of the platform 2, when the heat sink is placed in the receiving groove 21, at least one of the two surfaces of the heat sink to be coated with adhesive can be exposed on the platform 2 through the receiving groove 21. Because the surface to be coated with adhesive is exposed on the platform 2, this exposed surface can be coated with adhesive through the first adhesive application station 13, thereby achieving the purpose of coating one of the surfaces of the heat sink with adhesive.

[0052] Since the heat sink in this embodiment has two different surfaces that are to be coated with adhesive, it is not possible to directly apply adhesive to the two different surfaces in a single application process. Therefore, this embodiment provides a flipping station 14 and a second adhesive application station 15. The flipping station 14 is used to flip the heat sink so that the surface of the heat sink that is not coated with adhesive is exposed on the platform 2. The second adhesive application station 15 is similar to the first adhesive application station 13, and it performs the adhesive application operation based on the surface of the heat sink exposed on the platform 2.

[0053] In order to perform the loading and unloading operations of the carrier 2, the automatic glue application equipment in this embodiment of the application also includes a material picking mechanism 3, which is set on the machine base 1 and is used to place the heat sink into the carrier 2 or remove the heat sink from the carrier 2. Placing the heat sink into the carrier 2 is done at the material preparation station 12, and the heat sink contained in the material preparation mechanism 4 is removed and moved to the carrier 2.

[0054] The first gluing station 13 is equipped with a first gluing mechanism 5, used to apply glue to the surface of the heat sink exposed on the carrier 2. Similarly, the second gluing station 15 is also equipped with a second gluing mechanism, used to apply glue to the surface of the heat sink that has not yet been glued after the first gluing station 13, thereby achieving the purpose of applying glue to at least two sides. During this process, the flipping mechanism 6 set in the flipping station 14 enables the different surfaces of the heat sink to be exposed on the carrier 2 in turn.

[0055] In some alternative embodiments, for ease of handling, please refer to... Figure 5 The material preparation mechanism 4 includes a material preparation bin 41 and a supporting mechanism 42. The top of the material preparation bin 41 is open, and heat sinks are stacked sequentially in the material preparation bin 41 along its height direction. The supporting mechanism 42 supports the heat sinks at the bottom of the material preparation bin 41 and is used to control the heat sinks at the top of the material preparation bin 41 to be in a preset position. In this embodiment, the material picking mechanism 3 picks up the heat sinks from the material preparation mechanism 4 in a top-to-bottom order. To reduce the movement of the material preparation mechanism 4, the supporting mechanism 42 is provided below the material preparation bin 41. By supporting the heat sinks, the position of the heat sinks at the top of the material preparation bin 41 can be adjusted accordingly, keeping them in a relatively constant position. In this way, the material picking mechanism 3 can pick up the heat sinks at the same operating height. In other words, whenever the material picking mechanism 3 picks up a top heat sink, the supporting mechanism 42 moves upward by the height of one heat sink. Specifically, the supporting mechanism 42 can achieve the above purpose through stepper drive.

[0056] In some optional embodiments, to facilitate the automated glue application process, including but not limited to non-stop program execution, the number of material preparation bins 41 includes at least two, arranged side by side. When multiple material preparation bins 41 are set, if the number of heat sinks in one material preparation bin 41 is insufficient, the process can be switched to another material preparation bin 41, and then heat sinks can be added to the material preparation bin 41 with insufficient heat sinks, or a new material preparation bin 41 can be directly replaced as a backup. This method of updating the material preparation bins 41 can effectively achieve the continuity of the material preparation process.

[0057] In some alternative embodiments, to ensure that the heat sink can be fixed to the stage 2 on the one hand, and to facilitate the flipping and removal of the heat sink on the stage 2 on the other hand, please refer to [reference needed]. Figure 4 It may also include a negative pressure mechanism 22, which is disposed on the platform 2 and is used to fix the heat sink to the platform 2 by drawing negative pressure. In other words, in this embodiment, the heat sink is fixed to the platform 2 by negative pressure adsorption. Therefore, if the negative pressure is removed, the fixed connection between the heat sink and the platform 2 can be easily released. This method does not require a specific material for the heat sink itself and can easily achieve the positioning and locking of the heat sink.

[0058] In some alternative embodiments, to expose the remaining uncoated surfaces of the heat sink to be coated with adhesive on stage 2, please refer to... Figure 6 The flipping mechanism 6 may specifically include a bracket 61 and a gripper 52, with the gripper 52 rotatably connected to the bracket 61. The gripper 52 is used to hold the heat sink located in the platform 2, and after flipping the heat sink 180°, it is placed back into the platform 2. In this embodiment, at least its opposite front and back sides are the surfaces to be coated with adhesive. Therefore, after the adhesive is applied to the front side at the first adhesive application station 13, the heat sink can be held by the gripper 52, rotated 180° to adjust it so that the back side is facing up, and then the heat sink is placed back into the platform 2. Then, the adhesive is applied to the back side at the second adhesive application station 15.

[0059] In some alternative embodiments, the adhesive application result on the heat sink may not necessarily meet product requirements; therefore, a testing mechanism and a storage bin may also be included. The testing mechanism is used to test the heat sink and screen out qualified and unqualified products; the storage bin is used to store unqualified products. The testing station 16 corresponding to the testing mechanism can be located after the first adhesive application station 13, or after the second adhesive application station 16. The testing mechanism and the storage bin can be located after the first adhesive application station 13, after the second adhesive application station 15, or both. Unqualified products can be stored in the storage bin.

[0060] In some optional embodiments, to ensure the reasonableness of the test results, the testing mechanism may specifically include an area detection component and / or a thickness detection component, used to detect the area and / or thickness of the adhesive layer coated on the heat sink, respectively. Specifically, a high-precision camera and sensor can be used to detect the area and thickness of the adhesive application, thereby determining whether the heat sink is qualified.

[0061] In some alternative embodiments, for ease of adhesive application, please refer to... Figure 7 The first gluing mechanism 5 may specifically include a first screen plate 51 and a first glue scraper assembly 52. ​​The first screen plate 51 is located above the stage 2 and has a plurality of first mesh holes 53 extending vertically. The first glue scraper assembly 52 is located above the first screen plate 51 and is used to place the glue to be coated on the upper surface of the first screen plate 51, and scrape the glue to make it pass through the first mesh holes 53 and cover the heat sink on the stage 2; and / or,

[0062] The second coating mechanism includes a second screen plate and a second coating assembly. The second screen plate is located above the stage 2 and has a number of second mesh holes that run vertically through it. The second coating assembly is located above the second screen plate and is used to place the coating material to be coated on the upper surface of the second screen plate. By scraping the coating material, the coating material is made to pass through the second mesh holes and cover the heat sink on the stage 2. The first gluing mechanism 5 and the second gluing mechanism can use the same or similar structures for applying glue. Taking the first gluing mechanism 5 as an example, it includes a first screen plate 51 and a first glue scraper assembly 52. ​​The first screen plate 51 has a through-hole 53, so the upper and lower surfaces of the first screen plate 51 can be connected through the through-hole 53. The first screen plate 51 is positioned above the stage 2, and the first glue scraper assembly 52 is positioned above the first screen plate 51. The first glue scraper assembly 52 places the glue to be applied on the upper surface of the first screen plate 51, and then, based on a direction parallel to the plane of the screen plate, scrapes the glue to allow it to pass through the through-hole 53 and cover the heat sink on the stage 2, completing the glue application operation. During this process, the first screen plate 51 can be set in close contact with the heat sink to improve the glue application effect.

[0063] In some optional embodiments, please refer to the following for easier loading and unloading operations. Figure 8 The material handling mechanism 3 specifically includes a negative pressure material handling component 31 and a motion mechanism 32 connected to each other. The motion mechanism 32 is connected to the negative pressure material handling component 31, which is detachably connected to the heat sink. The motion mechanism 32 controls the movement of the negative pressure material handling component 31. The negative pressure material handling component 31 performs the picking and placing operation of the heat sink by drawing negative pressure, while the motion mechanism 32 moves the negative pressure material handling component 31 to the corresponding position. Thus, the negative pressure material handling component 31 can achieve both material loading and unloading. Furthermore, in this embodiment, visual positioning can be used to perform the heat sink mounting operation on the device after the adhesive application is completed.

[0064] In addition, the automatic glue application equipment in this application embodiment may also include a cleaning mechanism, which can be used to clean the front and / or back of the heat sink before the first glue application station 13 and / or the second glue application station 15, respectively, to facilitate subsequent glue application and avoid dirt.

[0065] According to the automatic glue application equipment in this application embodiment, since the feeding, first-side glue application, flipping and second-side glue application of the automatic glue application equipment are all automatically executed along the annular guide rail 11, and different processes can be executed simultaneously, the glue application efficiency of the heat sink is greatly improved and the user experience is enhanced.

[0066] This application also provides an automatic glue application method, applied to the automatic glue application equipment described in the above embodiments; the automatic glue application method specifically includes:

[0067] The material handling mechanism 3 extracts the heat sink from the material preparation mechanism 4 and places it into the receiving slot 21;

[0068] The first gluing mechanism 5 applies glue to the surface of the heat sink exposed on the carrier 2.

[0069] The flipping mechanism 6 flips the heat sink so that the un-applied adhesive side of the heat sink is exposed on the carrier 2.

[0070] The second gluing mechanism applies glue to the other surface of the heat sink that is exposed on the carrier 2.

[0071] The material handling mechanism 3 picks up the heat sink that has been coated with adhesive from the carrier 2 and discharges it.

[0072] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. An automatic glue-applying device, characterized in that, include: The machine is equipped with a circular guide rail connected end to end, and a material preparation station, a first gluing station, a flipping station, and a second gluing station arranged sequentially along the circular guide rail. Multiple platforms are provided, each platform being disposed on the annular guide rail. The platforms move along the extension direction of the annular guide rail under the drive of the annular guide rail. The top of each platform has an upward-opening receiving groove for supporting and fixing a heat sink. The heat sink has multiple surfaces, and at least two different surfaces are the surfaces to be coated with adhesive. A material handling mechanism is provided on the machine base; the material handling mechanism is used to place the heat sink into or out of the carrier. The material preparation station is equipped with a material preparation mechanism that can accommodate multiple heat sinks; the first gluing station is equipped with a first gluing mechanism for applying glue to the surface of the heat sink that is exposed on the carrier; the flipping station is equipped with a flipping mechanism for flipping the heat sink; and the second gluing station is equipped with a second gluing mechanism for applying glue to the other surface of the heat sink.

2. The automatic glue application equipment as described in claim 1, characterized in that, The material preparation mechanism includes a material preparation bin and a support mechanism. The top of the material preparation bin is open. The heat sinks are stacked sequentially in the material preparation bin along the height direction of the material preparation bin. The support mechanism supports the heat sinks at the bottom of the material preparation bin and is used to control the heat sinks at the top of the material preparation bin to be in a preset position.

3. The automatic glue application equipment as described in claim 2, characterized in that, The number of material preparation bins includes at least two, and each material preparation bin is arranged in parallel.

4. The automatic glue application equipment as described in claim 1, characterized in that, It also includes a negative pressure mechanism, which is disposed on the platform and is used to fix the heat sink to the platform.

5. The automatic glue application equipment as described in claim 1, characterized in that, The flipping mechanism includes a support and a gripper, the gripper being rotatably connected to the support; the gripper is used to hold and flip the heat sink located in the platform.

6. The automatic glue-applying equipment as described in any one of claims 1-5, characterized in that, It also includes a testing agency and a storage compartment. The testing agency is used to test the heat sink and screen out defective products. The storage compartment is used to store the defective products.

7. The automatic glue application equipment as described in claim 6, characterized in that, The detection mechanism includes an area detection component and / or a thickness detection component, which are used to detect the area and / or thickness of the adhesive layer coated on the heat sink, respectively.

8. The automatic glue-applying equipment as described in any one of claims 1-5, characterized in that, The first adhesive application mechanism includes a first screen plate and a first adhesive scraper assembly. The first screen plate is located above the platform and has a plurality of first mesh holes extending vertically through it. The first adhesive scraper assembly is located above the first screen plate and is used to place the adhesive to be coated onto the upper surface of the first screen plate. By scraping the adhesive, the adhesive is forced through the first mesh holes to cover the heat sink on the platform; and / or, The second adhesive application mechanism includes a second screen plate and a second adhesive scraping assembly. The second screen plate is located above the platform and has a plurality of second mesh holes that extend vertically through it. The second adhesive scraping assembly is located above the second screen plate and is used to place the adhesive to be coated on the upper surface of the second screen plate. By scraping the adhesive, the adhesive is made to pass through the second mesh holes and cover the heat sink on the platform.

9. The automatic glue-applying equipment as described in any one of claims 1-5, characterized in that, The material handling mechanism includes a negative pressure material handling component and a motion mechanism connected to each other. The motion mechanism is connected to the negative pressure material handling component, which is detachably connected to the heat sink. The motion mechanism is used to control the movement of the negative pressure material handling component.

10. An automatic glue application method, applied in the automatic glue application equipment as described in any one of claims 1-9; The automatic glue application method includes: The material handling mechanism extracts the heat sink from the material preparation mechanism and places it into the receiving slot; The first gluing mechanism applies glue to the surface of the heat sink that is exposed on the carrier. The flipping mechanism flips the heat sink to expose the un-applied adhesive side of the heat sink on the carrier. The second adhesive application mechanism applies adhesive to the surface of the heat sink that is exposed on the carrier.

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