Method, device and system for automatically expanding, shrinking and stacking circuit boards

Abstract

The invention provides a method, a device and a system for automatically expanding and dividing a circuit board into piles. The method for automatically expanding and dividing the circuit board into the piles comprises the following steps: acquiring targeting data and circuit board thickness measurement data; matching the targeting data with the circuit board thickness measurement data to form a data set; calculating the size expansion and shrinkage value of the circuit board according to the data set; then, according to the size expansion and shrinkage value of the circuit board, pile data of the circuit board is determined; next, each stack of circuit boards is divided into batches, and the batch number of each batch is determined; and finally, forming a stacking formula according to the stacking number, the batch number and the ID number of the circuit board, so that the stacking machine performs stacking on the circuit board according to the stacking formula. Precise and consistent circuit board stacking is ensured, the production efficiency is improved, meanwhile, process information is rapidly transmitted in a closed loop mode, manual errors are avoided, the data processing precision and the response speed are improved, convenience is provided for follow-up whole-process data tracing, and associated information is conveniently and rapidly positioned.

Description

Technical Field

[0001] This invention relates to the field of automatic expansion and contraction stacking technology, and in particular to a method, apparatus and system for automatic expansion and contraction stacking of circuit boards. Background Technology

[0002] As printed circuit boards (PCBs) develop towards higher density, miniaturization, and multilayering, the requirements for dimensional accuracy of PCBs are becoming increasingly stringent. In the PCB production process, the substrate is affected by material properties and production processes, and PCBs are prone to dimensional expansion and contraction. To solve the interference of expansion and contraction on production accuracy, PCBs need to be stacked according to the degree of expansion and contraction. The traditional manual expansion and contraction stacking method is inefficient, has large errors, and cannot trace information. Summary of the Invention

[0003] This invention provides an automatic expansion and contraction stacking method, apparatus, and system for circuit boards, which ensures accurate and consistent stacking of circuit boards, improves production efficiency, enables rapid closed-loop transmission of process information, avoids human error, improves data processing accuracy and response speed, facilitates subsequent full-process data traceability, and makes it easy to quickly locate related information.

[0004] According to one aspect of the present invention, an automatic expansion and contraction stacking method for circuit boards is provided, the method comprising:

[0005] Acquire target data and circuit board thickness measurement data; wherein, the target data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance and the actual target distance measurement value of the circuit board.

[0006] The target data and the circuit board thickness measurement data are matched to form a dataset.

[0007] Calculate the dimensional expansion / contraction values ​​of the circuit board based on the dataset.

[0008] The stacking data of the circuit boards is determined based on the dimensional expansion and contraction values ​​of the circuit boards; wherein, the stacking data includes the stack number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards including the circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards, wherein, the dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack of circuit boards and the preset target distance value.

[0009] Divide each batch of circuit boards into batches and determine the batch number for each batch.

[0010] A stacking recipe is formed based on the stacking number, the batch number, and the circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking recipe.

[0011] Optionally, the target shooting data and the circuit board thickness measurement data are matched to form a dataset, including:

[0012] The target shooting time and the thickness measurement time are sorted.

[0013] The target shooting data is matched with the ID number of the circuit board using a time window algorithm to form the dataset.

[0014] Optionally, calculating the dimensional expansion / contraction values ​​of the circuit board based on the dataset includes:

[0015] Calculate the expansion / contraction values ​​of the circuit board's dimensions along the X direction and / or the expansion / contraction values ​​of the circuit board's dimensions along the Y direction based on the dataset.

[0016] When calculating the expansion / contraction value of the circuit board's dimensions along the X direction based on the dataset, the stacking data of the circuit board is determined based on the expansion / contraction value of the circuit board's dimensions, including:

[0017] The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction.

[0018] When calculating the expansion / contraction value of the circuit board's dimensions along the Y direction based on the dataset, the stacking data of the circuit board is determined based on the expansion / contraction value of the circuit board's dimensions, including:

[0019] The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the Y direction.

[0020] When calculating the expansion / contraction values ​​of the circuit board's dimensions along the X direction and along the Y direction based on the dataset, the stacking data of the circuit board is determined based on the expansion / contraction values ​​of the circuit board's dimensions, including:

[0021] The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction and the expansion and contraction values ​​of the circuit board dimensions along the Y direction.

[0022] Optionally, the stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board's dimensions along the X direction, including:

[0023] Circuit boards whose expansion or contraction values ​​along the X direction are within the same first size range are grouped into the same stack.

[0024] The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the Y direction, including:

[0025] Circuit boards whose expansion or contraction values ​​along the Y direction are within the same second size range are grouped into the same stack.

[0026] The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction and the expansion and contraction values ​​of the circuit board dimensions along the Y direction, including:

[0027] Circuit boards whose expansion or contraction values ​​along the X direction are within the same first size range and whose expansion or contraction values ​​along the Y direction are within the same second size range are grouped into the same stack.

[0028] Optionally, target values ​​for dimensional expansion and contraction of the circuit board along the X direction and target values ​​for dimensional expansion and contraction of the circuit board along the Y direction can be set.

[0029] The expansion and contraction values ​​of the dimension along the X direction are within the same first dimension range, that is, the difference between the expansion and contraction values ​​of the dimension along the X direction and the target expansion and contraction values ​​of the dimension along the X direction are within the same deviation threshold range.

[0030] The expansion and contraction values ​​of the dimension along the Y direction are within the same second dimension range, that is, the difference between the expansion and contraction values ​​of the dimension along the Y direction and the target expansion and contraction values ​​of the dimension along the Y direction are within the same deviation threshold range.

[0031] Optionally, calculating the dimensional expansion / contraction values ​​of the circuit board based on the dataset includes:

[0032] The dimensional expansion / contraction of the circuit board is calculated based on the preset target distance value and the actual target distance value of the circuit board.

[0033] Optionally, the stacking data of the circuit boards is determined based on the dimensional expansion and contraction values ​​of the circuit boards, including:

[0034] After stacking, obtain the actual target distance measurement value of all the circuit boards in each stack, calculate the average value of the actual target distance measurement value of each stack of circuit boards based on the actual target distance measurement value of the circuit boards, and use the ratio of the average value of the actual target distance measurement value of each stack of circuit boards to the preset target distance value of the circuit boards as the dimensional expansion and contraction coefficient of each stack of circuit boards.

[0035] Optionally, the automatic expansion and contraction stacking method for circuit boards also includes:

[0036] After the circuit boards are sorted by the sorting machine, the relationship between the ID number of the circuit board and the batch number is updated.

[0037] According to another aspect of the present invention, an automatic expansion and contraction stacking device for circuit boards is provided, the automatic expansion and contraction stacking device for circuit boards comprising:

[0038] The data acquisition module is used to acquire target data and circuit board thickness measurement data; wherein, the target data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance and the actual target distance measurement value of the circuit board.

[0039] The dataset forming module is used to match the target shooting data and the circuit board thickness measurement data to form a dataset.

[0040] The circuit board dimensional expansion / contraction calculation module is used to calculate the dimensional expansion / contraction value of the circuit board based on the dataset.

[0041] The circuit board stacking data determination module is used to determine the stacking data of the circuit boards based on the dimensional expansion and contraction values ​​of the circuit boards; wherein, the stacking data includes the stacking number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards including the circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards; wherein, the dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack of circuit boards and the preset target distance value.

[0042] The batch number determination module is used to divide each stack of circuit boards into batches and determine the batch number of each batch.

[0043] The batching recipe generation module is used to generate a batching recipe based on the batch number, the batch number, and the circuit board ID number, so that the batching machine can batch the circuit boards according to the batching recipe.

[0044] According to another aspect of the present invention, an automatic expansion and contraction stacking system for circuit boards is provided, the automatic expansion and contraction stacking system for circuit boards includes a stacker and the automatic expansion and contraction stacking device for circuit boards.

[0045] The automatic expansion and contraction stacking method for circuit boards in this invention first acquires target data and circuit board thickness measurement data; then, it matches the target data and circuit board thickness measurement data to form a dataset; next, it calculates the dimensional expansion and contraction values ​​of the circuit boards based on the dataset; then, it determines the stacking data of the circuit boards based on the dimensional expansion and contraction values; next, it divides each stack of circuit boards into batches and determines the batch number for each batch; finally, it generates a stacking formula based on the stacking number, batch number, and circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking formula. By stacking the circuit boards according to their dimensional expansion and contraction values, it ensures accurate and consistent stacking, improving production efficiency. The stacking formula generated based on the stacking number, batch number, and circuit board ID number enables rapid closed-loop transmission of process information, avoids human error, improves data processing accuracy and response speed, facilitates subsequent full-process data traceability, and facilitates rapid location of related information.

[0046] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is a flowchart of an automatic expansion and contraction stacking method for circuit boards provided in an embodiment of the present invention;

[0049] Figure 2 This is a flowchart of another automatic expansion and contraction stacking method for circuit boards provided in an embodiment of the present invention;

[0050] Figure 3 This is a flowchart of another automatic expansion and contraction stacking method for circuit boards provided in an embodiment of the present invention;

[0051] Figure 4 This is a schematic diagram of an automatic expansion and contraction stacking device module for circuit boards provided in an embodiment of the present invention. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0054] This invention provides an automatic expansion and contraction stacking method for circuit boards. Figure 1 A flowchart of an automatic expansion and contraction stacking method for circuit boards provided in an embodiment of the present invention is shown below. Figure 1 The automatic expansion and contraction stacking method for circuit boards includes:

[0055] S110. Acquire target data and circuit board thickness measurement data; wherein, the target data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance of the circuit board and the actual target distance measurement value of the circuit board.

[0056] Specifically, the drilling data refers to the data generated during the circuit board manufacturing process after the drilling machine performs drilling operations on the circuit board; the circuit board thickness measurement data is obtained by measuring the circuit board thickness using a thickness gauge. Each circuit board corresponds to a unique ID number.

[0057] S120. Match the target data and circuit board thickness measurement data to form a dataset.

[0058] Specifically, during the production process, the circuit board is first targeted and then its thickness is measured. The obtained targeting data and circuit board thickness measurement data are sorted and matched in chronological order to form a dataset. Matching the targeting data and circuit board thickness measurement data to form a dataset improves production efficiency, shortens the production cycle, and improves the accuracy of data matching, further saving labor costs.

[0059] S130. Calculate the dimensional expansion and contraction values ​​of the circuit board based on the dataset.

[0060] Specifically, expansion and contraction value refers to the dimensional change of a circuit board during the manufacturing process due to factors such as temperature and stress. Automatically calculating the dimensional expansion and contraction value of the circuit board based on datasets improves data processing accuracy and response speed. Specifically, it can be calculated based on target measurement values, that is, the preset target distance and the actual target distance measurement of the circuit board.

[0061] S140. Determine the stacking data of the circuit boards based on the dimensional expansion and contraction values ​​of the circuit boards; wherein, the stacking data includes the stack number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards including the circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards, wherein, the dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack of circuit boards and the preset target distance value.

[0062] Specifically, the size expansion and contraction values ​​of the circuit boards within each stack are within the same size range, each stack of circuit boards has only one sub-stack number, and each stack of circuit boards includes multiple circuit boards. Therefore, the sub-stack data of each stack of circuit boards includes the ID numbers corresponding to multiple circuit boards.

[0063] S150. Divide each batch of circuit boards into batches and determine the batch number for each batch.

[0064] Specifically, each stack of circuit boards comprises multiple batches, and each batch has only one batch number. The maximum number of circuit boards in each batch is fixed, and the circuit boards can be divided into batches based on the maximum number of circuit boards in each batch and the number of circuit boards in each stack. For example, if a stack of circuit boards contains 120 circuit boards, and the maximum number of circuit boards in each batch is 48, then the stack of circuit boards can be divided into three batches.

[0065] S160. A stacking recipe is generated based on the stacking number, batch number, and circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking recipe.

[0066] Specifically, a stacking recipe is formed based on the stack number, batch number, and circuit board ID number. The stacking recipe includes the stack number, batch number, and the corresponding circuit board ID number for each stack. Then, the stacking machine stacks the circuit boards according to the stacking recipe, enabling rapid closed-loop transmission of process information, avoiding human error, facilitating subsequent full-process data traceability, and making it easy to quickly locate related information.

[0067] The automatic expansion and contraction stacking method for circuit boards in this invention first acquires target data and circuit board thickness measurement data; then, it matches the target data and circuit board thickness measurement data to form a dataset; next, it calculates the dimensional expansion and contraction values ​​of the circuit boards based on the dataset; then, it determines the stacking data of the circuit boards based on the dimensional expansion and contraction values; next, it divides each stack of circuit boards into batches and determines the batch number for each batch; finally, it generates a stacking formula based on the stacking number, batch number, and circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking formula. By stacking the circuit boards according to their dimensional expansion and contraction values, it ensures accurate and consistent stacking, improving production efficiency. The stacking formula generated based on the stacking number, batch number, and circuit board ID number enables rapid closed-loop transmission of process information, avoids human error, improves data processing accuracy and response speed, facilitates subsequent full-process data traceability, and facilitates rapid location of related information.

[0068] Figure 2 A flowchart of another automatic expansion and contraction stacking method for circuit boards provided in an embodiment of the present invention is shown below. Figure 1 and Figure 2 Based on the above embodiments, the automatic expansion and contraction stacking method of circuit boards is further refined. Specifically, the matching of target data and circuit board thickness measurement data to form a dataset is refined as follows: S221, sorting the target time and thickness measurement time; S222, matching the target data with the ID number through a time window algorithm to form a dataset.

[0069] The refined automatic expansion and contraction stacking method for circuit boards is as follows:

[0070] S210. Acquire target data and circuit board thickness measurement data; wherein, the target data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance of the circuit board and the actual target distance measurement value of the circuit board.

[0071] S221. Sort the target firing time and thickness measurement time.

[0072] Specifically, the target firing time and thickness measurement time are sorted in chronological order to facilitate subsequent data matching.

[0073] S222. Match the target shooting data with the circuit board ID number using a time window algorithm to form a dataset.

[0074] Specifically, in the production process, circuit boards are first targeted sequentially, and then their thickness is measured in the same order. The targeting and measurement times are then sorted chronologically to accurately match the targeting data with the circuit board's ID number. A time window algorithm divides the sorted targeting and measurement times into multiple independent time intervals, and then matches the targeting data within each time interval with the circuit board's ID number. This ensures the correlation and accuracy of the production data, providing a data foundation for subsequent automatic expansion and contraction stacking of circuit boards.

[0075] S230. Calculate the dimensional expansion and contraction values ​​of the circuit board based on the dataset.

[0076] S240. Determine the stacking data of the circuit boards based on the dimensional expansion and contraction values ​​of the circuit boards; wherein, the stacking data includes the stack number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards including the circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards, wherein, the dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack of circuit boards and the preset target distance value.

[0077] S250. Divide each batch of circuit boards into batches and determine the batch number for each batch.

[0078] S260. A stacking recipe is generated based on the stacking number, batch number, and circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking recipe.

[0079] In this embodiment of the invention, the target firing time and thickness measurement time are first sorted to facilitate subsequent data matching. Then, the target firing data is matched with the ID number through a time window algorithm to form a dataset, which ensures the correlation and accuracy of production data and provides a data foundation for the subsequent automatic expansion and contraction stacking of circuit boards.

[0080] Figure 3 A flowchart of another automatic expansion and contraction stacking method for circuit boards provided in an embodiment of the present invention is shown below. Figures 1-3 Based on the above embodiments, the automatic expansion and contraction stacking method for circuit boards is further refined. The refined automatic expansion and contraction stacking method for circuit boards is as follows:

[0081] S310. Acquire target data and circuit board thickness measurement data; wherein, the target data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance of the circuit board and the actual target distance measurement value of the circuit board.

[0082] S320: Match the target data and circuit board thickness measurement data to form a dataset.

[0083] S330. Calculate the expansion / contraction value of the circuit board's dimensions along the X direction and / or the expansion / contraction value of the circuit board's dimensions along the Y direction based on the dataset.

[0084] Specifically, the expansion or contraction of the circuit board's dimensions along the X direction or along the Y direction can be calculated separately based on the dataset; alternatively, the expansion or contraction of the circuit board's dimensions along the X direction and along the Y direction can be calculated simultaneously based on the dataset.

[0085] If only the dimensional expansion / contraction value of the circuit board along the X direction is calculated, S341 can be executed. If only the dimensional expansion / contraction value of the board along the Y direction is calculated, then S342 is executed. If both the dimensional expansion / contraction value of the circuit board along the X direction and the dimensional expansion / contraction value of the circuit board along the Y direction are calculated, then S343 is executed.

[0086] S341. Determine the stacking data of the circuit board based on the expansion and contraction values ​​of the circuit board dimensions along the X direction.

[0087] Specifically, the dimensional expansion and contraction values ​​of the circuit boards in each pile along the X direction are within the same dimensional range. After calculating the dimensional expansion and contraction values ​​of the circuit boards along the X direction based on the dataset, the circuit boards are piled up according to the range of dimensional expansion and contraction values ​​along the X direction to obtain the pile data of the circuit boards along the X direction.

[0088] S342. Determine the stacking data of the circuit board based on the expansion and contraction values ​​of the circuit board's dimensions along the Y direction.

[0089] Specifically, the dimensional expansion and contraction values ​​of the circuit boards in each pile along the Y direction are within the same dimensional range. After calculating the dimensional expansion and contraction values ​​of the circuit boards along the Y direction based on the dataset, the circuit boards are piled up according to the range of dimensional expansion and contraction values ​​along the Y direction to obtain the pile data of the circuit boards along the Y direction.

[0090] S343. Determine the stacking data of the circuit board based on the expansion and contraction values ​​of the circuit board's dimensions along the X direction and the Y direction.

[0091] Specifically, after simultaneously calculating the expansion / contraction value of the circuit board's dimensions along the X direction or the Y direction based on the dataset, the circuit boards are stacked according to the range of the expansion / contraction values ​​along the X and Y directions to obtain the stacking data of the circuit boards along the X and Y directions.

[0092] S350. Divide each batch of circuit boards into batches and determine the batch number for each batch.

[0093] S360: A stacking recipe is generated based on the stacking number, batch number, and circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking recipe.

[0094] This invention embodiment calculates the expansion / contraction values ​​of the circuit board's dimensions along the X-direction and / or along the Y-direction based on a dataset; determines the circuit board's stacking data based on the expansion / contraction values ​​along the X-direction; further determines the circuit board's stacking data along both the X and Y directions based on the expansion / contraction values ​​along the X and Y directions. This invention embodiment supports multi-dimensional stacking of circuit boards, allowing for flexible setting of stacking logic while ensuring accurate and consistent stacking.

[0095] Optionally, the stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction, including:

[0096] Circuit boards whose expansion or contraction values ​​along the X direction are within the same first size range are grouped into the same stack;

[0097] The stacking data for the circuit boards, determined based on the expansion and contraction values ​​of the circuit board dimensions along the Y direction, includes:

[0098] Circuit boards whose expansion or contraction values ​​along the Y direction are within the same second size range are grouped into the same stack.

[0099] The stacking data for the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction and the Y direction.

[0100] Circuit boards whose expansion or contraction values ​​along the X direction are within the same first size range and whose expansion or contraction values ​​along the Y direction are within the same second size range are grouped into the same stack.

[0101] Specifically, circuit boards whose dimensional expansion / contraction values ​​along the X-direction fall within the same first dimensional range are grouped into the same stack; circuit boards whose dimensional expansion / contraction values ​​along the Y-direction fall within the same second dimensional range are grouped into the same stack; and circuit boards whose dimensional expansion / contraction values ​​along both the X-direction and Y-direction fall within the same first and second dimensional ranges are grouped into the same stack. This ensures accurate and consistent circuit board grouping, improving production efficiency. The first and second dimensional ranges are determined by process parameters.

[0102] Optionally, target values ​​for dimensional expansion and contraction of the circuit board along the X direction and target values ​​for dimensional expansion and contraction of the circuit board along the Y direction can be set.

[0103] The expansion and contraction values ​​of the dimension along the X direction are within the same first dimension range, that is, the difference between the expansion and contraction values ​​of the dimension along the X direction and the target expansion and contraction values ​​of the dimension along the X direction are within the same deviation threshold range.

[0104] The expansion and contraction values ​​of the dimension along the Y direction are within the same second dimension range, that is, the difference between the expansion and contraction values ​​of the dimension along the Y direction and the target expansion and contraction values ​​of the dimension along the Y direction are within the same deviation threshold range.

[0105] Specifically, the target values ​​for dimensional expansion and contraction of the circuit board along the X and Y directions are set according to process parameters and user requirements. The first and second deviation interval thresholds are also set according to process parameters and user requirements. The circuit boards are classified along the X and Y directions respectively to facilitate subsequent drilling correction, while reducing cost losses and improving the efficiency of circuit board stacking.

[0106] Optionally, the dimensional expansion / contraction value of the circuit board is calculated based on the dataset, including: calculating the dimensional expansion / contraction value of the circuit board based on the preset target distance of the circuit board and the actual target distance measurement value of the circuit board.

[0107] Specifically, the dimensional expansion / contraction value of the circuit board is the difference between the preset target distance of the circuit board and the actual target distance measurement value of the circuit board. The dimensional expansion / contraction value of the circuit board can be positive, negative, or 0.

[0108] Optionally, the stacking data of the circuit boards can be determined based on the dimensional expansion and contraction values ​​of the circuit boards, including:

[0109] After stacking, obtain the actual target distance measurement value of all circuit boards in each stack, calculate the average value of the actual target distance measurement value of each stack of circuit boards based on the actual target distance measurement value of the circuit boards, and use the ratio of the average value of the actual target distance measurement value of each stack of circuit boards to the preset target distance value of the circuit boards as the dimensional expansion and contraction coefficient of each stack of circuit boards.

[0110] Specifically, the ratio of the average actual target distance measurement value of each stack of circuit boards to the preset target distance value of the circuit boards is used as the expansion and contraction coefficient of each stack. This can compensate for the difference in the expansion and contraction values ​​of the dimensions of each stack of circuit boards, thereby improving processing efficiency.

[0111] Optionally, the automatic expansion and contraction stacking method for circuit boards also includes: updating the relationship between the circuit board ID number and the batch number after the stacking machine stacks the circuit boards.

[0112] Specifically, after each batch is sorted, the stacker reports the batch and then updates the relationship between the circuit board ID number and the batch number, preparing the data source for subsequent reports, queries, and dashboards.

[0113] This invention provides an automatic expansion and contraction stacking device for circuit boards. Figure 4 This is a schematic diagram of an automatic expansion and contraction stacking device module for circuit boards provided in an embodiment of the present invention. (Refer to...) Figure 4 The automatic expansion and contraction stacking device for circuit boards includes:

[0114] The data acquisition module 410 is used to acquire target data and circuit board thickness measurement data. The target data includes the target shooting time and target measurement value of the circuit board. The circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number. The target measurement value includes the preset target distance and the actual target distance measurement value of the circuit board.

[0115] The dataset forming module 420 is used to match the target shooting data and the circuit board thickness measurement data to form a dataset.

[0116] The circuit board dimensional expansion / contraction calculation module 430 is used to calculate the dimensional expansion / contraction value of the circuit board based on the dataset.

[0117] The circuit board stacking data determination module 440 is used to determine the stacking data of the circuit boards based on the dimensional expansion and contraction values ​​of the circuit boards. The stacking data includes the stacking number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards. The dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack and the preset target distance value.

[0118] The batch number determination module 450 is used to divide each stack of circuit boards into batches and determine the batch number of each batch.

[0119] The stacking recipe forming module 460 is used to form a stacking recipe based on the stacking number, batch number and circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking recipe.

[0120] The automatic expansion and contraction stacking device for circuit boards in this embodiment of the invention improves the efficiency of automatic expansion and contraction stacking of circuit boards and ensures the consistency of stacking data through the interaction of various modules, providing convenience for subsequent full-process data traceability, facilitating the rapid location of related information, and avoiding human error.

[0121] This invention provides an automatic expansion and contraction stacking system for circuit boards, which includes a stacker and an automatic expansion and contraction stacking device for circuit boards according to any embodiment. The automatic expansion and contraction stacking system for circuit boards has the same beneficial effects as the automatic expansion and contraction stacking device, and will not be described again here.

[0122] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0123] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for automatically expanding and shrinking circuit boards in a stack, characterized in that, include: Acquire target data and circuit board thickness measurement data; wherein, the target data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance value of the circuit board and the actual target distance measurement value of the circuit board; The target shooting data and the circuit board thickness measurement data are matched to form a dataset; Calculate the dimensional expansion / contraction values ​​of the circuit board based on the dataset; The stacking data of the circuit boards is determined based on the dimensional expansion and contraction values ​​of the circuit boards; wherein, the stacking data includes the stack number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards, wherein, the dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack of circuit boards and the preset target distance value. Divide each batch of circuit boards into batches and determine the batch number for each batch; A stacking recipe is formed based on the stacking number, the batch number, and the circuit board ID number, so that the stacking machine can stack the circuit boards according to the stacking recipe.

2. The automatic expansion and contraction stacking method for circuit boards according to claim 1, characterized in that, The target data and the circuit board thickness measurement data are matched to form a dataset, including: Sort the target firing time and the thickness measurement time; The target shooting data is matched with the ID number of the circuit board using a time window algorithm to form the dataset.

3. The automatic expansion and contraction stacking method for circuit boards according to claim 1, characterized in that, Calculate the dimensional expansion / contraction values ​​of the circuit board based on the dataset, including: Calculate the expansion / contraction values ​​of the circuit board's dimensions along the X direction and / or the expansion / contraction values ​​of the circuit board's dimensions along the Y direction based on the dataset. When calculating the expansion / contraction value of the circuit board's dimensions along the X direction based on the dataset, the stacking data of the circuit board is determined based on the expansion / contraction value of the circuit board's dimensions, including: The stacking data of the circuit boards are determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction; When calculating the expansion / contraction value of the circuit board's dimensions along the Y direction based on the dataset, the stacking data of the circuit board is determined based on the expansion / contraction value of the circuit board's dimensions, including: The stacking data of the circuit boards are determined based on the expansion and contraction values ​​of the circuit board dimensions along the Y direction; When calculating the expansion / contraction values ​​of the circuit board's dimensions along the X direction and along the Y direction based on the dataset, the stacking data of the circuit board is determined based on the expansion / contraction values ​​of the circuit board's dimensions, including: The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction and the expansion and contraction values ​​of the circuit board dimensions along the Y direction.

4. The automatic expansion and contraction stacking method for circuit boards according to claim 3, characterized in that: The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction, including: Circuit boards whose expansion or contraction values ​​along the X direction are within the same first size range are grouped into the same stack; The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the Y direction, including: Circuit boards whose expansion or contraction values ​​along the Y direction are within the same second size range are grouped into the same stack; The stacking data of the circuit boards is determined based on the expansion and contraction values ​​of the circuit board dimensions along the X direction and the expansion and contraction values ​​of the circuit board dimensions along the Y direction, including: Circuit boards whose expansion or contraction values ​​along the X direction are within the same first size range and whose expansion or contraction values ​​along the Y direction are within the same second size range are grouped into the same stack.

5. The automatic expansion and contraction stacking method for circuit boards according to claim 4, characterized in that: Set the target values ​​for the dimensional expansion and contraction of the circuit board along the X direction and the target values ​​for the dimensional expansion and contraction of the circuit board along the Y direction; The expansion and contraction values ​​of the dimension along the X direction are within the same first dimension range, that is, the difference between the expansion and contraction values ​​of the dimension along the X direction and the target expansion and contraction values ​​of the dimension along the X direction are within the same deviation threshold range; The expansion and contraction values ​​of the dimension along the Y direction are within the same second dimension range, that is, the difference between the expansion and contraction values ​​of the dimension along the Y direction and the target expansion and contraction values ​​of the dimension along the Y direction are within the same deviation threshold range.

6. The automatic expansion and contraction stacking method for circuit boards according to claim 1, characterized in that, Calculate the dimensional expansion / contraction values ​​of the circuit board based on the dataset, including: The dimensional expansion / contraction of the circuit board is calculated based on the preset target distance value and the actual target distance value of the circuit board.

7. The automatic expansion and contraction stacking method for circuit boards according to claim 1, characterized in that, The stacking data of the circuit boards is determined based on the dimensional expansion and contraction values ​​of the circuit boards, including: After stacking, obtain the actual target distance measurement value of all the circuit boards in each stack, calculate the average value of the actual target distance measurement value of each stack of circuit boards based on the actual target distance measurement value of the circuit boards, and use the ratio of the average value of the actual target distance measurement value of each stack of circuit boards to the preset target distance value of the circuit boards as the dimensional expansion and contraction coefficient of each stack of circuit boards.

8. The automatic expansion and contraction stacking method for circuit boards according to claim 1, characterized in that, Also includes: After the circuit boards are sorted by the sorting machine, the relationship between the ID number of the circuit board and the batch number is updated.

9. An automatic expansion and contraction stacking device for circuit boards, characterized in that, include: The data acquisition module is used to acquire target shooting data and circuit board thickness measurement data; wherein, the target shooting data includes the target shooting time and target measurement value of the circuit board; the circuit board thickness measurement data includes the thickness measurement time and the circuit board ID number; the target measurement value includes the preset target distance value of the circuit board and the actual target distance measurement value of the circuit board. A dataset forming module is used to match the target shooting data and the circuit board thickness measurement data to form a dataset; The circuit board dimensional expansion / contraction value calculation module is used to calculate the dimensional expansion / contraction value of the circuit board based on the dataset. The circuit board stacking data determination module is used to determine the stacking data of the circuit boards based on the dimensional expansion and contraction values ​​of the circuit boards; wherein, the stacking data includes the stacking number corresponding to each stack of circuit boards, the ID number of each stack of circuit boards, and the dimensional expansion and contraction coefficient of each stack of circuit boards; wherein, the dimensional expansion and contraction coefficient is determined based on the actual target distance measurement value of each circuit board in each stack of circuit boards and the preset target distance value. The batch number determination module is used to divide each pile of circuit boards into batches and determine the batch number of each batch. The batching recipe generation module is used to generate a batching recipe based on the batch number, the batch number, and the circuit board ID number, so that the batching machine can batch the circuit boards according to the batching recipe.

10. An automatic expansion and contraction stacking system for circuit boards, characterized in that, include: The stacker and the automatic expansion and contraction stacking device for circuit boards as described in claim 9.

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