Cleaning method, electronic equipment, computer storage medium and cleaning system

Abstract

The invention discloses a cleaning method and a cleaning system. The cleaning method comprises the following steps: determining contour complexity of each area of a to-be-cleaned rubber cylinder; the cleaning pressure of each area is determined according to the contour complexity, and the cleaning pressure is in direct proportion to the contour complexity; according to the determined cleaning pressure, each area of the rubber cylinder is subjected to primary cleaning correspondingly; detecting the reflectivity of each area of the glue cylinder; when there is a region having a reflectance lower than a set reflectance, the cleaning pressure of the region having a reflectance lower than the set reflectance is increased, and secondary cleaning is performed. The cleaning quality of the rubber cylinder can be improved.

Description

Technical Field

[0001] This invention relates to the field of glue tank cleaning technology, specifically to cleaning methods, electronic devices, computer storage media, and cleaning systems. Background Technology

[0002] An important step in cigarette production is rolling and bonding cigarette paper. This usually involves applying adhesive to specific areas of the cigarette paper to achieve bonding. In this process, a glue cylinder is needed to supply adhesive to the glue rollers. Due to the characteristics of the adhesive, the glue cylinder needs to be cleaned in a timely manner after the equipment is stopped or after a period of operation to ensure production efficiency and quality.

[0003] In related technologies, the cleaning quality in the cleaning of glue tank equipment is difficult to standardize, and the cleaning effect is poor. Summary of the Invention

[0004] This invention aims to address one of the technical problems in related technologies to a certain extent. Therefore, this invention provides a cleaning method and cleaning system that can improve the cleaning effect.

[0005] To achieve the above objectives, a first aspect of the present invention discloses a cleaning method, the cleaning method comprising the following steps: Determine the contour complexity of each area of ​​the glue tank to be cleaned; The cleaning pressure for each region is determined based on the contour complexity, where the cleaning pressure is directly proportional to the contour complexity. The initial cleaning of each area of ​​the glue tank is performed according to the determined cleaning pressure. The reflectivity of each area after the glue tank was cleaned was measured. If there are areas with reflectivity lower than the set reflectivity, increase the cleaning pressure on those areas and perform a second cleaning.

[0006] In this technical solution, by inspecting the contour of the glue tank before cleaning, different cleaning procedures can be adopted according to the different complexities of the glue tank surface contour. This not only solves the water resource problem but also improves the cleaning effect of the glue tank. In addition, the glue tank is inspected after cleaning. If the cleaning is not up to standard, the cleaning pressure can be adjusted again to ensure a better cleaning effect.

[0007] Furthermore, based on the determined contour complexity of each area of ​​the glue tank to be cleaned, including: A surface image of the glue cylinder is obtained, and the obtained surface image is divided into multiple regions. For each region, the corresponding contour complexity index is obtained by looking up a table in the database. The cleaning pressure for each region is determined based on the contour complexity, including: The corresponding cleaning pressure is obtained by looking up the corresponding contour complexity index in the database.

[0008] Furthermore, the database stores multi-level contour complexity indices and corresponding multi-level cleaning pressures, with the increase in cleaning pressure from low to high at each level satisfying the following formula: 20% < Pn - Pn-1 < 40%.

[0009] Furthermore, the reflectivity of each area of ​​the glue tank is detected; if there is an area with a reflectivity lower than the set reflectivity, the cleaning pressure of the area with a reflectivity lower than the set reflectivity is increased, and a second cleaning is performed, including: Obtain the actual reflection values ​​of various areas on the surface of the glue tank to be cleaned; Obtain the actual reflection values ​​of each area after the glue tank is cleaned; The actual reflectance is determined by the following formula: A = (M2 - M1) / M, where M1 is the actual reflectance value of the surface of the glue tank to be cleaned, M2 is the actual reflectance value of the surface of the glue tank after cleaning, and M is the standard reflectance value of the glue tank surface. When the actual reflectivity A is lower than a set ratio value, obtain the actual area of ​​the region where the actual reflectivity A is lower than the set ratio value; When the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio; Increase the cleaning pressure in the area where the reflectivity is lower than the set reflectivity, and perform a second cleaning.

[0010] Furthermore, the set ratio value is between 80% and 90%, and the preset area ratio is between 1% and 8%.

[0011] Furthermore, if the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio, a pressure adjustment signal is sent to the spray module to increase the cleaning pressure of the area with a reflectivity lower than the set reflectivity by 10% to 20% before performing a secondary cleaning.

[0012] Furthermore, the cleaning method also includes: The surface brightness of each area after cleaning the glue tank was measured. When the difference in brightness exceeds the set difference, Increase the cleaning pressure in areas with low brightness values ​​and clean the corresponding areas again.

[0013] Furthermore, the cleaning method further includes: when the actual reflectivity A is lower than a set ratio value, obtaining the actual area of ​​the region where the actual reflectivity A is lower than the set ratio value; When the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio; Increase the soaking time and ultrasonic vibration frequency of the soaking module.

[0014] A second aspect of this application discloses an electronic device, comprising: one or more processors; A memory having stored one or more computer programs that, when executed by one or more processors, cause the one or more processors to implement the cleaning method described in the first aspect.

[0015] A third aspect of this application discloses a computer-readable medium having a computer program stored thereon, which, when executed by a processor, implements the cleaning method according to the first aspect.

[0016] The fourth aspect of this application discloses a cleaning system, which includes a chassis and a spray module disposed therein. The cleaning system further includes a scanning module, a detection module, and the electronic device described in the second aspect. The scanning module, detection module, and spray module are electrically connected to a main control module. The electronic device is used to receive scanning and detection information from the scanning and detection modules and to send a pressure adjustment signal to the spray module.

[0017] These features and advantages of the present invention will be disclosed in detail in the following specific embodiments and accompanying drawings. The preferred embodiments or means of the present invention will be shown in detail in conjunction with the accompanying drawings, but this is not intended to limit the technical solutions of the present invention. In addition, each of these features, elements and components appearing in the following text and drawings is a plurality of, and different symbols or numbers are used for convenience of representation, but all represent parts with the same or similar construction or function. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a flowchart of a cleaning method according to one embodiment of the present invention; Figure 2 This is a flowchart of a cleaning method according to one embodiment of the present invention; Figure 3 This is a schematic diagram of the internal structure of a cleaning system according to one embodiment of the present invention; Figure 4 This is a schematic diagram of the overall shape of the cleaning system according to one embodiment of the present invention; Figure 5 A flowchart illustrating one embodiment of the electronic device provided by the present invention; Figure 6A flowchart illustrating one embodiment of the computer-readable medium provided by the present invention.

[0019] in; 10. Chassis; 11. Glue cylinder inlet and outlet; 12. Tooling basket; 131. Nozzle; 14. Immersion module; 151. Guide rod; 152. Drive cylinder; 16. Horizontal moving guide rail; 20. Diagram of a glue cylinder; 101. Processor; 102. Memory; 103. I / O interface; 104. Bus. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain the present invention and should not be construed as limiting the invention.

[0021] The terms "an embodiment," "example," or "trademark" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this invention. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0022] See appendix Figure 1 The first aspect of the present invention discloses a cleaning method, the cleaning method comprising the following steps: S1. Determine the contour complexity of each area of ​​the glue tank to be cleaned; S2. Determine the cleaning pressure for each region based on the contour complexity, where the cleaning pressure is directly proportional to the contour complexity. S3. Perform initial cleaning on each area of ​​the glue tank according to the determined cleaning pressure. S4. Detect the reflectivity of each area after the glue tank is cleaned; If the reflectivity is lower than the set reflectivity, increase the cleaning pressure in the area where the reflectivity is lower than the set reflectivity and perform a second cleaning.

[0023] The cleaning method described in this embodiment is mainly used in the cigarette manufacturing industry and can generally be used to clean the surface of glue cylinder equipment.

[0024] The cleaning method in this embodiment is used in the main control module of the cleaning system. The cleaning system also includes a scanning module, a conveying module, and a spraying module. The conveying module includes a conveying mechanism and a tooling basket. The conveying mechanism is used to move the tooling basket (i.e., the glue cylinder) between different cleaning stations to meet different cleaning needs. The conveying module also includes a tooling basket. In this embodiment, the glue cylinder device is generally placed on the tooling basket of the glue cylinder conveying module before cleaning. The glue cylinder is generally fixed by suspension to facilitate cleaning the surface of the parts.

[0025] In this embodiment, the scanning module sets the position of the cleaning station in the chassis. After the glue cylinder to be cleaned arrives at the cleaning station with the conveying mechanism, the main control module first sends a scanning signal to the scanning module. In this embodiment, the scanning module can generally scan the outline of the glue cylinder using a 3D scanner or a 3D camera. During the cleaning process, the difficulty of cleaning different parts of the glue cylinder varies. Especially for glue cylinder equipment, the adhesive adhesion makes it more difficult to clean than ordinary components. Simply using the same cleaning method will hardly meet the requirements.

[0026] The cleaning method in this embodiment classifies different areas of the glue tank according to the complexity of their contours. For areas with low contour complexity, such as smooth planes and curved surfaces, lower water pressure can be used for cleaning. For areas with high contour complexity, such as grooves and corners, higher water pressure can be used for cleaning. It should be noted that the water pressure cleaning mentioned in this embodiment is carried out after the soaking module. That is, the glue tank is first soaked in hot water and cleaned by ultrasonic vibration in the soaking module (which can make the adhesive adhering to the surface of the glue tank easier to clean) before it reaches the spray module for water pressure rinsing.

[0027] In this embodiment, the complexity of the glue cylinder contour can be pre-classified based on the contours of different regions of different components in the glue cylinder equipment. The structures of the same component in the glue cylinder equipment are mostly consistent, such as protective covers and glue rollers. For example, component A in the glue cylinder equipment can be divided into different regions A1, A2, A3… based on its specific structural shape, and each region A1, A2, A3… can be defined as having a different contour complexity level. This complexity level can be determined based on cleaning results from past cleaning experience. It should be noted that the contour complexity of each region on the glue cylinder is not necessarily continuous, nor can it be limited to a single region (for example, regions A1 and A2 can have the same complexity level). These complexity level classifications and definitions are pre-written into the main control module. During operation, after scanning the contour of the glue cylinder by the scanning module, the contour complexity of each region is determined based on the actual position of the glue cylinder (due to the glue cylinder suspension settings, the suspension positions of different glue cylinders are inconsistent, and the specific positions of the corresponding glue cylinders are also different).

[0028] The scanning module in this embodiment can accurately determine the actual position of the glue cylinder and precisely determine the contour complexity of the areas facing the glue cylinder in various directions. In addition, it can reduce the requirements for the installation of the glue cylinder. The spraying module in this embodiment includes multiple nozzles, which are respectively set in different positions of the glue cylinder to be cleaned. For areas with low contour complexity, a smaller water pressure can be used to meet the cleaning requirements, while for areas with high contour complexity, a higher water pressure is used for cleaning.

[0029] As one embodiment of the present invention, the preset contour complexity includes multiple contour complexity indices L1, L2...Ln; the multiple contour complexity indices L1, L2...Ln are arranged in order from low to high, and correspond to cleaning pressures P1, P2...Pn respectively; The actual contour complexity of different areas of the glue tank to be cleaned is obtained based on the contour distribution information of the glue tank to be cleaned, and the contour complexity is compared with the preset contour complexity, including: obtaining the actual contour complexity index corresponding to the actual contour complexity, comparing the actual contour complexity index with multiple contour complexity indices L1, L2...Ln, and matching the corresponding cleaning pressures P1, P2...Pn.

[0030] In this embodiment, the contour complexity of the glue cylinder surface is classified into levels, from low to high. Multiple cleaning pressures corresponding to these contour complexities are set in the spray module. For example, when the contour complexity of the glue cylinder is L1, pressure P1 is used for cleaning; when the contour complexity is L2, pressure P2 is used, and so on. This allows for the selection of a more suitable cleaning pressure based on the different contour complexities of different parts of the glue cylinder during actual cleaning, making the cleaning more targeted and avoiding the waste of water resources or the inability to achieve satisfactory cleaning results with the same cleaning pressure.

[0031] In this embodiment, the cleaning pressures P1, P2...Pn increase progressively from low to high, with the increase between each level ranging from 20% to 40%.

[0032] As one embodiment of the present invention, see Appendix Figure 2 Step S4 further includes: The reflectivity of each area of ​​the glue tank is detected; if the reflectivity is lower than the set reflectivity, the cleaning pressure of the area with the lower reflectivity is increased, and a second cleaning is performed, including: S41. Obtain the actual reflection value M1 of each area of ​​the surface of the glue tank to be cleaned; S42. Obtain the actual emission value M2 of each area after the glue tank is cleaned; S43. Based on the actual reflection value M1 and the actual reflection value M2, the actual reflectivity A = (M2 - M1) / M is obtained, where M is the standard reflection value of the surface of the glue cylinder. S44. If the actual reflectivity A is lower than the set ratio value, obtain the actual area where the actual reflectivity A is lower than the set ratio value. When the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio; Increase the cleaning pressure in the area where the reflectivity is lower than the set reflectivity, and perform a second cleaning.

[0033] The cleaning method in this embodiment can inspect the cleaned rubber tank and provide feedback on the cleaning parameters based on the inspection results, thereby improving the cleaning quality. The cleaning method in this embodiment judges the cleaning effect of the glue tank component from two aspects. The first aspect is to compare the actual reflectivity of the glue tank before and after cleaning. If the actual reflectivity is lower than the set ratio, it indicates that the brightness difference of the surface before and after cleaning is not significant, and the surface area has not been completely cleaned. The set ratio value is between 80% and 90%.

[0034] However, in actual operation, the actual reflectivity of some spots and very small areas may not meet the requirements. In this case, it is inappropriate to judge the cleaning as unqualified.

[0035] To improve the accuracy of the cleaning quality assessment, the cleaning method in this embodiment adds a second judgment principle: the determination is made by judging the area ratio of the area where the actual reflectivity does not meet the standard. When the ratio of the area of ​​the area where the actual reflectivity does not meet the standard to the surface area of ​​the glue cylinder is greater than the preset area ratio (1% to 8%), it indicates that the area of ​​the area where the actual reflectivity does not meet the standard is large, and the cleaning parameters need to be adjusted.

[0036] When the ratio of the area where the actual reflectivity does not meet the standard to the surface area of ​​the glue cylinder is lower than the preset area ratio, In this embodiment, by combining "reflectivity difference + area ratio" into a dual-threshold judgment standard, the accuracy of the cleaning effect of the glue tank can be improved. Compared with some related technologies that only use a single threshold for judgment, this embodiment can greatly avoid the possibility of misjudgment and improve cleaning efficiency.

[0037] It should be noted that in this embodiment, the standard reflection value is the reflection data of the surface brightness of a completely clean plastic cylinder component. This standard reflection value is pre-processed data. Different components may have different standard reflection values. These standard reflection values ​​are written into the database of the main control module and can be retrieved from the data of the main control module when in use.

[0038] As one embodiment of the present invention, when the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio, a pressure adjustment signal is sent to the spray module to increase the cleaning pressure of the spray module and the nozzles at the corresponding positions of the areas where the actual reflectivity A is lower than the set ratio value by 10% to 20%.

[0039] The adjustment of cleaning pressure mentioned in this embodiment is different from the selection of corresponding cleaning pressure based on the contour complexity of the glue cylinder surface mentioned above. The cleaning pressures P1, P2...Pn mentioned above correspond to contour complexity indices L1, L2...Ln, respectively. For ease of understanding, let's take an example. The contour complexity of region A2 of glue cylinder A corresponds to the cleaning pressure P2. When the cleaning effect of region A2 is not good according to the dual threshold in this embodiment, the cleaning pressure P2 of region A2 can be increased. The increase here refers to the increase within the range of P2 to P3. As mentioned above, the increase between each level is between 20% and 40%, that is, P3 = (1 + (20%~40%))P2. However, the increase in cleaning pressure mentioned in this embodiment is 10% to 20% on the basis of P2, but does not reach the pressure of P3. That is, a more precise adjustment is made. This allows for more targeted cleaning, improving the cleaning effect while reducing water waste.

[0040] In one embodiment of the present invention, the cleaning system includes multiple nozzles, each nozzle corresponding to a different area of ​​the glue tank, and the cleaning method further includes: The surface brightness of each area after cleaning the glue tank was measured. When the difference in brightness exceeds the set difference, Increase the cleaning pressure in areas with low brightness values ​​and clean the corresponding areas again.

[0041] This embodiment adds another method to determine whether the glue tank has been thoroughly cleaned. It compares the brightness of different areas of the glue tank after cleaning to determine if there are any areas where the cleaning effect is inadequate. Under normal circumstances, if the cleaning effect is consistent, the brightness values ​​of various areas on the glue tank surface are basically the same. When the brightness of a certain area differs significantly from that of other areas (is lower than other areas), it is determined that the cleaning is incomplete. Of course, in actual operation, to ensure the accuracy of the determination, when there is a large difference in brightness values, more areas can be compared for verification to ensure the accuracy of the determination. It is also necessary to consider whether the area with the lower brightness value is a small area, which can also be determined by the ratio of the area to the total area of ​​the glue tank, as mentioned above.

[0042] To further improve the cleaning effect, one embodiment of the cleaning method of the present invention further includes: when the actual reflectivity A is lower than a set ratio value, obtaining the actual area of ​​the set area based on the detection result of the detection module; When the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio; A second adjustment signal is sent to the soaking module to increase the soaking time and ultrasonic vibration frequency.

[0043] In this embodiment, if the cleaning effect of the glue tank is not up to standard, in addition to adjusting the cleaning effect by adjusting the pressure, the soaking time and the vibration frequency and cleaning time of the ultrasonic waves can be increased by using the soaking module to improve the cleaning effect.

[0044] It should be noted that in actual operation, this embodiment uses hot water immersion to clean the glue cylinder equipment, which makes it easier to remove the adhesive from the surface of the glue cylinder.

[0045] One embodiment of the present invention also provides an electronic device, wherein, as Figure 5 As shown, the electronic device includes: One or more processors 101; The memory 102 stores one or more computer programs that, when executed by the one or more processors 102, cause the one or more processors 102 to implement the cleaning method provided in the first aspect of the present invention.

[0046] The electronic device may also include one or more I / O interfaces 103 connected between the processor 101 and the memory 102, configured to enable information interaction between the processor 101 and the memory 102.

[0047] The processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU); the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and flash memory (FLASH); the I / O interface (read-write interface) is connected between the processor and the memory, enabling information exchange between the processor and the memory, including but not limited to a data bus (Bus).

[0048] In some embodiments, the processor 101, memory 102, and I / O interface 103 are interconnected via bus 104, and thus connected to other components of the electronic device.

[0049] like Figure 6 As shown, one aspect of the present invention provides a computer-readable medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the cleaning method described above provided by the present invention.

[0050] The second aspect of this application discloses a cleaning system, see appendix. Figure 3 , 4The cleaning system includes a chassis, within which are housed a glue cylinder conveying module, a spraying module, and a main control module. The glue cylinder conveying module and the spraying module are electrically connected to the main control module. The cleaning system also includes a scanning module and the main control module, with the scanning module electrically connected to the main control module. The glue cylinder conveying module includes a conveying component and a tooling basket, with the tooling basket disposed on the conveying component. The spraying module includes multiple nozzles, each positioned at a different circumferential location on the tooling basket at the spraying position. The main control module is used to implement the cleaning method described in the first aspect. The main control module receives control signals from the scanning module and sends a first cleaning signal and a second cleaning signal to the spraying module. The cleaning system also includes an immersion module, a drying module, and a detection module, all of which are electrically connected to the main control module.

[0051] In this embodiment, the cleaning system has a glue cylinder inlet / outlet 11 formed on the housing 10. The glue cylinder conveying module includes a conveying mechanism, which includes a lifting component and a horizontal moving guide rail 16 to drive the horizontal and vertical movement of the glue cylinder 20. The tooling basket 12 is slidably mounted on the horizontal moving guide rail 16, which is used to feed the glue cylinder from the glue cylinder inlet / outlet 11 into or out of the housing 10. In this embodiment, the cleaning path of the glue cylinder is set along the height direction. The immersion module 14 includes an immersion tank (not shown in the figure) located on the bottom side inside the housing 10. The glue cylinder is moved by the lifting mechanism (such as...) Figure 3 As described above, the lifting mechanism includes multiple guide rods 151 and a drive cylinder 152. In this embodiment, the horizontal moving guide rail 16 is slidably mounted on the guide rod 151 along the height direction via a sliding seat. The tooling basket 12 is slidably mounted on the horizontal moving guide rail 16, thereby realizing movement in both the horizontal and vertical directions. Driven by this movement, the basket first descends to the immersion tank for immersion treatment. After immersion, the lifting mechanism drives the rubber cylinder to rise to the spray module. The spray module is located on the top side of the immersion tank and includes multiple nozzles 131, as shown in the attached diagram. Figure 3 As shown, multiple nozzles 131 are respectively arranged in different positions, and the area between the multiple nozzles 131 is the area for lifting and cleaning the glue cylinder.

[0052] See appendix Figure 3 In the figure, the area between line A and line B is the spraying area. Multiple rows of nozzles 131 can be set along the height direction in this area. Each row of nozzles 131 faces a different direction, thereby achieving full coverage of the surface of the glue tank. The area below line B is the immersion area, and the area above line A can be set as the drying area.

[0053] The scanning module in this embodiment includes multiple scanning elements (not shown in the figure), which are also positioned at different locations. This allows for a better scanning of the overall outline of the glue tank during actual operation. To achieve a better cleaning effect, the spray head 131 in the spray module of this embodiment can also be equipped with a movable structure. During actual operation, the angle can be adjusted appropriately according to needs to clean the glue tank from different directions.

[0054] In this embodiment, the drying component is located on the top side of the spray module. Alternatively, it can be located between the multiple rows of spray nozzles 131 in the spray module. In conjunction with the lifting mechanism, it can dry the surface of the glue cylinder and improve the accuracy of the detection module.

[0055] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of the present invention will be included within the scope of the claims.

Claims

1. A cleaning method, characterized in that, The cleaning method includes the following steps: Determine the contour complexity of each area of ​​the glue tank to be cleaned; The cleaning pressure for each region is determined based on the contour complexity, where the cleaning pressure is directly proportional to the contour complexity. The initial cleaning of each area of ​​the glue tank is performed according to the determined cleaning pressure. The reflectivity of each area after the glue tank was cleaned was measured. If there are areas with reflectivity lower than the set reflectivity, increase the cleaning pressure on those areas and perform a second cleaning.

2. The cleaning method according to claim 1, characterized in that, Based on the determined contour complexity of each area of ​​the glue tank to be cleaned, including: A surface image of the glue cylinder is obtained, and the obtained surface image is divided into multiple regions. For each region, the corresponding contour complexity index is obtained by looking up a table in the database. The cleaning pressure for each region is determined based on the contour complexity, including: The corresponding cleaning pressure is obtained by looking up the corresponding contour complexity index in the database.

3. The cleaning method according to claim 2, characterized in that, The database stores multi-level contour complexity indices and corresponding multi-level cleaning pressures. The increase in cleaning pressure from low to high at each level satisfies the following formula: 20%<P n -P n-1 <40%。 4. The cleaning method according to any one of claims 1 to 3, characterized in that, The reflectivity of each area of ​​the glue tank is detected; if there is an area with a reflectivity lower than the set reflectivity, the cleaning pressure of the area with a reflectivity lower than the set reflectivity is increased, and a second cleaning is performed, including: Obtain the actual reflection values ​​of various areas on the surface of the glue tank to be cleaned; Obtain the actual reflection values ​​of each area after the glue tank is cleaned; The actual reflectance is determined by the following formula: A = (M2 - M1) / M, where M1 is the actual reflectance value of the surface of the glue tank to be cleaned, M2 is the actual reflectance value of the surface of the glue tank after cleaning, and M is the standard reflectance value of the glue tank surface. When the actual reflectivity A is lower than a set ratio value, obtain the actual area of ​​the region where the actual reflectivity A is lower than the set ratio value; When the actual area ratio of the total surface area of ​​the glue cylinder is greater than the preset area ratio; Increase the cleaning pressure in the area where the reflectivity is lower than the set reflectivity, and perform a second cleaning.

5. The cleaning method according to claim 4, characterized in that, The set ratio value is between 80% and 90%, and the preset area ratio is between 1% and 8%.

6. The cleaning method according to claim 4, characterized in that, If the actual area ratio of the total surface area of ​​the glue tank is greater than the preset area ratio, the cleaning pressure of the area with a reflectivity lower than the set reflectivity is increased by 10% to 20% before a second cleaning is performed.

7. The cleaning method according to claim 4, characterized in that, The cleaning method further includes: The surface brightness of each area after cleaning the glue tank was measured. In the case where there are areas where the brightness difference is greater than the set difference, Increase the cleaning pressure in areas with low brightness values ​​and clean the corresponding areas again.

8. An electronic device, characterized in that, include: One or more processors; A memory having stored one or more computer programs thereon, which, when executed by the one or more processors, cause the one or more processors to implement the cleaning method according to any one of claims 1 to 7.

9. A computer-readable medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the cleaning method according to any one of claims 1 to 7.

10. A cleaning system, the cleaning system comprising a chassis, wherein a spray module is disposed within the chassis, characterized in that, The cleaning system further includes a scanning module, a detection module, and the electronic device described in claim 8. The scanning module, the detection module, and the spray module are electrically connected to the main control module. The electronic device is used to receive scanning information and detection information sent by the scanning module and the detection module, and to send a pressure adjustment signal to the spray module.

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