Vacuum glue injection process

Abstract

The invention provides a glue vacuum injection process which comprises the following steps: S1, controlling a frame to move to a bottom position in a pick-and-place chamber, and placing a circuit board in the frame; s2, the frame is controlled to carry the circuit board to be lifted by a preset height into the vacuum operation cavity, and glue is injected to the surface of the circuit board; s3, the frame is controlled to carry the circuit board subjected to glue injection to descend by a preset height into the pick-and-place cavity to achieve replacement of the circuit board; wherein the interior of the vacuum operation cavity is continuously in a negative pressure state in the lifting and moving process of the frame, and the frame and the shell are continuously in a sealed sliding connection state. According to the circuit board glue injection device, the efficiency of circuit board glue injection operation is greatly improved, meanwhile, pollutants are prevented from entering the vacuum operation cavity to affect the glue injection quality, and the product quality and economic benefits are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of adhesive injection technology, and more particularly to a vacuum adhesive injection process. Background Technology

[0002] Encapsulating and protecting electronic components on the surface of a circuit board with adhesive is a common method. Some circuit boards with special requirements have high encapsulation requirements and need to be encapsulated in a negative pressure environment to minimize air bubbles, impurities, etc. in the adhesive.

[0003] Existing technologies require frequent handling of circuit boards during the encapsulation process, necessitating frequent opening of the negative pressure encapsulation area for board replacement. Each handling operation disrupts the vacuum environment, requiring repeated negative pressure extraction during subsequent encapsulation processes. This increases energy consumption, prolongs the cycle of a single circuit board vacuum encapsulation, and significantly reduces the efficiency of vacuum encapsulation. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a vacuum adhesive dispensing process. This invention significantly improves the efficiency of circuit board dispensing operations while also preventing contaminants from entering the vacuum operating chamber and affecting the quality of the dispensing, thereby greatly improving product quality and economic benefits.

[0005] To solve the above problems, the technical solution adopted by the present invention is as follows:

[0006] A vacuum adhesive dispensing process utilizes an adhesive vacuum dispensing device, including a vacuum operating chamber and a pick-and-place chamber. The device incorporates an automatic loading and unloading mechanism that penetrates both the vacuum operating chamber and the pick-and-place chamber to lift and transport circuit boards. The loading and unloading mechanism includes a housing and a frame with an opening only on the front. The frame is located within the housing and is sealed and slidably connected. Both the upper and lower front sides of the housing have through-holes on the same side as the frame opening. A closed area is formed between the two through-holes, and the thickness of this closed area is greater than the thickness of the frame. The process includes the following steps: S1, controlling the frame to move to its bottom position within the pick-and-place chamber and placing the circuit board inside the frame; S2, controlling the frame to lift the circuit board to a predetermined height within the vacuum operating chamber and inject adhesive onto the circuit board surface; S3, controlling the frame to lower the dispensing circuit board to a predetermined height within the pick-and-place chamber to replace the circuit board. During the lifting and lowering of the frame, the vacuum operating chamber remains under negative pressure, and the frame and housing remain in a sealed and slidably connected state.

[0007] Preferably, a lifting platform is provided inside the frame, and a folding telescopic rod is provided inside the lifting platform. The circuit board is placed on the upper surface of the lifting platform, and the lifting platform is controlled to move linearly by the folding telescopic rod. The lifting platform is controlled to move outward and extend outward to offset the frame to complete the glue injection and loading / unloading. After the lifting platform is controlled to move inward into the frame, the frame is controlled to move up and down.

[0008] Preferably, the bottom of the frame is also provided with a hydraulic telescopic rod for controlling the lifting and lowering of the frame. The hydraulic telescopic rod is linked with the folding telescopic rod for control. After the hydraulic telescopic rod lifts the frame to the limit position, the lifting platform is extended outward by controlling the folding telescopic rod.

[0009] Preferably, an air bladder is provided at the top of the inside of the hydraulic telescopic rod, and the air bladder is connected to the folding telescopic rod.

[0010] Preferably, the hydraulic telescopic rod is provided with two sets of position control pistons, and a time-delay elastic component is provided between the two sets of position control pistons. The airbag is located between the two sets of position control pistons and communicates with the folding telescopic rod.

[0011] Preferably, the folding telescopic rod includes at least two rods that are rotatably connected to each other, and a hydraulic rotating joint is provided at the rotating joint of the two rods. The airbag is connected to the hydraulic rotating joint of the folding telescopic rod.

[0012] Preferably, the airbag has an expansion elasticity, which can drive the folding telescopic rod to rotate and extend through pressure changes. After the airbag is compressed, the control oil inside is squeezed into the folding telescopic rod to control the folding telescopic rod to deflect and unfold. After the airbag expands elastically, it extracts the oil from the folding telescopic rod to control the folding telescopic rod to deflect and fold.

[0013] Preferably, the top of the outer shell is also provided with a separately controlled sealing structure and a gas guiding structure. After the frame descends to a position below the sealing structure, the sealing structure moves to the path of the frame's lifting and lowering to isolate the vacuum operating chamber from the frame. At the same time, gas is introduced into the chamber between the sealing structure and the top of the frame through the gas guiding structure to reduce the negative pressure at the top during the frame's descent. During the frame's ascent, the gas between the top of the frame and the sealing structure is gradually extracted through the gas guiding structure to ensure the normal lifting of the frame.

[0014] The beneficial effects of this invention are as follows:

[0015] Compared with existing technologies, by setting up a frame and shell structure, the circuit board can be replaced and glued during the sliding process of the frame, without disrupting the vacuum environment in the vacuum operating chamber. During each circuit board replacement and glued application, it is not necessary to fully open the vacuum operating chamber or perform a vacuuming operation before each glued application, which greatly improves the efficiency of circuit board glued application. At the same time, it also avoids contaminants from entering the vacuum operating chamber and affecting the quality of glued application, thus greatly improving product quality and economic benefits. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 This is a front view structural diagram of the present invention.

[0018] Figure 3 This is a three-dimensional structural diagram of the loading and unloading device of the present invention.

[0019] Figure 4 This is a schematic diagram of the frame and hydraulic telescopic rod structure of the present invention.

[0020] Figure 5 This is a schematic diagram of the lifting platform and folding telescopic rod structure of the present invention.

[0021] Figure 6 This is a process flow diagram of the present invention.

[0022] In the diagram: 1. Glue injection equipment; 2. Vacuum operating chamber; 3. Picking and placing chamber; 4. Loading and unloading mechanism; 401. Injection hole; 402. Hydraulic telescopic rod; 403. Frame; 404. Lifting platform; 405. Folding telescopic rod; 406. Outer shell. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] See attached document Figure 1 -Appendix Figure 5 An automatic loading and unloading device for vacuum glue dispensing is disclosed. This device is a glue dispensing device that operates in a vacuum environment. It can automatically lift and lower the circuit board into the vacuum chamber for glue dispensing, and then return to wait for the next lifting and lowering operation after the dispensing is completed.

[0025] The device includes a glue-dispensing device 1, a vacuum operating chamber 2, and a pick-and-place chamber 3. The glue-dispensing device 1 is equipped with an automatic loading and unloading mechanism 4. The vacuum operating chamber 2 is a closed vacuum space (with a closed window on the outside, not shown). The loading and unloading mechanism 4 passes through the vacuum operating chamber 2 and the pick-and-place chamber 3 to realize the lifting and conveying of the circuit board. The loading and unloading mechanism 4 is equipped with a baffle to ensure that the vacuum environment inside the vacuum operating chamber 2 is not affected during the lifting and transporting of the circuit board. During operation, the circuit board is lifted into the vacuum operating chamber 2 for glue dispensing and encapsulation. After glue dispensing is completed, the loading and unloading mechanism 4 drives the circuit board to descend and move it out of the vacuum operating chamber 2 to realize the unloading of the circuit board after glue dispensing.

[0026] The invention features a telescopic structure at the bottom of the loading / unloading mechanism 4. This telescopic structure consists of the upper and lower ends of a hydraulic telescopic rod 402. The lower end of the hydraulic telescopic rod 402 has an injection hole 401, into which control oil is injected to control the lifting and lowering movement of the hydraulic telescopic rod 402. A frame 403 is connected to the top of the upper end of the hydraulic telescopic rod 402. A lifting platform 404 is located within the frame 403, which has only a front opening. A housing 406 surrounds the frame 403, penetrating the vacuum operating chamber 2 and the loading / unloading chamber 3. Because the internal frame 403 has only a front opening for loading and unloading circuit boards, the top and bottom of the frame 403 are in a sealed sliding connection with the inner wall of the housing 406. During lifting, the frame moves along with the lifting platform 404, minimizing the impact on the vacuum environment within the vacuum operating chamber 2.

[0027] A folding telescopic rod 405 is further installed on the lifting platform 404. One end of the folding telescopic rod 405 is rotatably connected to the lifting platform 404, and the other end is rotatably connected to the bottom of the frame 403. When the platform is lifted to the vacuum operating chamber 2, the folding telescopic rod 405 controls the lifting platform 404 to move outward. After the glue injection is completed, the folding telescopic rod 405 controls the lifting platform 404 to move inward, retracting back to the original position to wait for descent.

[0028] Furthermore, the folding telescopic rod 405 can be linked with the hydraulic telescopic rod 402. An airbag is installed at the top of the hydraulic telescopic rod 402 and connected to the folding telescopic rod 405. The airbag contains control oil. When liquid is injected into the injection hole 401, it pushes the internal support rod of the hydraulic telescopic rod 402 to move upward. When the internal support rod of the hydraulic telescopic rod 402 rises to its highest point, its bottom end will squeeze the airbag, causing the oil in the airbag to flow into the folding telescopic rod 405, controlling the extension of the folding telescopic rod 405. After the injection is completed, the injection hole 401 retracts the liquid outward, and the liquid in the airbag flows back into the folding telescopic rod 405, causing it to contract accordingly.

[0029] The airbag mentioned above is an elastic airbag. During the retraction of the hydraulic telescopic rod 402, the elastic airbag expands under its own elasticity, extracting the control oil in the folding telescopic rod 405, controlling the folding telescopic rod 405 to fold and retract, thereby pulling the lifting platform 404 back to its initial position.

[0030] The folding telescopic rod 405 here includes at least two rods that are rotatably connected to each other. A hydraulic rotary joint is provided at the joint of the two rods. The hydraulic rotary joint is connected to the aforementioned elastic airbag. The flow of oil between the two is controlled to realize the rotation drive control of the hydraulic rotary joint, thereby adjusting the included angle between the two rods to achieve drive control.

[0031] It should also be noted that a separately controlled sealing structure and a gas guiding structure can be provided on the top of the outer shell 406. After the frame 403 descends to the position below the sealing structure, the sealing structure moves to the path of the frame 403's rise and fall to isolate the vacuum operation chamber 2 from the frame 403. At the same time, gas is introduced into the chamber between the sealing structure and the top of the frame 403 through the gas guiding structure to reduce the negative pressure at the top of the frame 403 during its descent, thereby reducing the traction force during the descent of the frame 403.

[0032] Similarly, during the rising process of frame 403, the gas between the top of frame 403 and the closed structure is gradually extracted through the air guiding structure to prevent the internal air pressure from gradually increasing and affecting the normal lifting of frame 403. At the same time, it also prevents air from entering the vacuum operating chamber 2 and affecting the vacuum environment inside the vacuum operating chamber 2. Subsequently, the closed structure is opened, and the frame 403 continues to rise through the hydraulic telescopic rod 402 to realize the feeding and conveying of circuit boards.

[0033] In summary, when this invention is used, the circuit board is raised and lowered by controlling the hydraulic telescopic rod 402 within the semi-enclosed frame structure, and the circuit board is injected with glue by controlling the folding telescopic rod 405. Through the above structural design, the impact on the vacuum operation chamber 2 is minimized, the number of vacuuming operations is reduced, production costs are reduced, and production efficiency is greatly improved.

[0034] The invention will be further explained below with reference to specific injection molding processes.

[0035] See attached document Figure 6 A vacuum dispensing process for adhesives, using the aforementioned equipment, includes the following steps:

[0036] S1. The control frame 403 moves to the bottom position inside the pick-and-place chamber 3 and places the circuit board that needs to be glued inside the frame 403; at this time, the frame 403 is at the bottom position and the top of the frame 403 is in a sealed sliding connection with the inner wall of the outer shell 406.

[0037] S2. The control frame 403 carries the circuit board to a predetermined height into the vacuum operating chamber 2 and injects glue onto the surface of the circuit board; at this time, the frame 403 is in the top position, and the bottom of the frame 403 is in a sealed sliding connection with the inner wall of the outer shell 406.

[0038] S3, the control frame 403 lowers the circuit board after glue application to a predetermined height into the pick-and-place chamber 3 to replace the circuit board; after the glue application is completed, the circuit board is taken out, and then the circuit board that needs to be glued is placed in a predetermined position. The above action process is repeated to achieve continuous glue application to the circuit board.

[0039] During the lifting and moving of the frame 403, the vacuum operating chamber 2 remains under negative pressure, and the frame 403 and the outer shell 406 remain in a sealed sliding connection. As the frame 403 slides up and down, the circuit board can be replaced and glued without disrupting the vacuum environment within the vacuum operating chamber 2. Each time the circuit board is replaced and glued, the vacuum operating chamber 2 does not need to be fully opened, and there is no need to perform a vacuuming operation before each glue application. This greatly improves the efficiency of the circuit board glue application operation and also prevents contaminants from entering the vacuum operating chamber 2 and affecting the glue application quality, thus significantly improving product quality and economic benefits.

[0040] A lifting platform 404 is provided inside the frame 403, and a folding telescopic rod 405 is provided inside the lifting platform 404. The circuit board is placed on the upper surface of the lifting platform 404, and the lifting platform 404 is controlled to move linearly by the folding telescopic rod 405. The lifting platform 404 is controlled to move outward and extend to be offset from the frame 403 to complete the glue injection and loading / unloading. The lifting platform 404 is controlled to move inward into the frame 403, and then the frame 403 is controlled to move up and down. Through the above design, the lifting platform 404 can be telescopically moved. The lifting platform 404 is controlled to move to the outer position to facilitate the glue injection equipment 1 at the top to inject glue. The lifting platform 404 is controlled to move to the inner position to be offset from the relevant structure and move up and down together with the frame 403.

[0041] A hydraulic telescopic rod 402 for controlling the lifting and lowering of the frame 403 is also provided at the bottom of the frame 403. The hydraulic telescopic rod 402 is linked with the folding telescopic rod 405. After the hydraulic telescopic rod 402 lifts the frame 403 to its limit position, the lifting platform 404 is extended outward by the folding telescopic rod 405. Through the above structural design, the hydraulic telescopic rod 402 can realize the lifting and lowering control of the frame 403 to realize the conveying of the circuit board. At the same time, the hydraulic telescopic rod 402 and the folding telescopic rod 405 are linked. After the hydraulic telescopic rod 402 lifts the frame 403 to the top position, the lifting platform 404 inside the frame 403 is then pushed outward by the folding telescopic rod 405. Pushing it outward facilitates the completion of the glue injection work, simplifies the operation, and further improves the efficiency of glue injection.

[0042] An air bladder is installed at the top of the hydraulic telescopic rod 402. The air bladder is connected to the folding telescopic rod 405. The folding telescopic rod 405 can be adjusted and controlled through the air bladder. The air bladder is filled with control oil as the driving medium to achieve driving control.

[0043] Two sets of position-control pistons are installed inside the hydraulic telescopic rod 402, and a time-delay elastic component is installed between the two sets of position-control pistons. An airbag is located between the two sets of position-control pistons and communicates with the folding telescopic rod 405. The aforementioned time-delay elastic component can be a spring or a columnar elastic component. The airbag is located on the outer side. In the initial stage before the hydraulic telescopic rod 402 is lifted to the top position, the time-delay elastic component is in the deployed state, and the airbag is in the inflated state. After the hydraulic telescopic rod 402 is lifted to the top position where the position-control piston is in the top position, the time-delay elastic component begins to be compressed. During this process, the airbag between the two position-control pistons is compressed, squeezing the control oil inside into the folding telescopic rod 405 to control the folding telescopic rod 405 to unfold, thereby realizing drive control.

[0044] Conversely, as the hydraulic telescopic rod 402 descends, the time-delayed elastic component gradually extends first. During this process, the airbag gradually expands and draws back the control oil squeezed out in the previous step. At this time, the folding telescopic rod 405 folds and retracts in the opposite direction.

[0045] The folding telescopic rod 405 includes at least two rods that are rotatably connected to each other. A hydraulic rotary joint is provided at the joint of the two rods. The airbag is connected to the hydraulic rotary joint of the folding telescopic rod 405. The base of the hydraulic rotary joint is fixed to the first rod, and the rotating end of the hydraulic rotary joint is fixed to the second rod. During the clockwise or counterclockwise rotation of the hydraulic rotary joint, the included angle between the two rods is gradually increased or decreased. When the rod assembly is in a limited state on both sides, linear drive control of the lifting platform 404 is realized.

[0046] The airbag has an expansion elasticity and can drive the rod of the folding telescopic rod 405 to rotate and extend through pressure changes. When the airbag is compressed, the control oil inside is squeezed into the folding telescopic rod 405 to control the folding telescopic rod 405 to deflect and unfold. After the airbag expands elastically, it extracts the oil inside the folding telescopic rod 405 to control the folding telescopic rod 405 to deflect and fold.

[0047] A separately controlled sealing structure and a gas guiding structure are also provided on the top of the outer shell 406. After the frame 403 descends to the position below the sealing structure, the sealing structure moves into the path of the frame 403's rise and fall to isolate the vacuum operating chamber 2 from the frame 403. At the same time, gas is introduced into the chamber between the sealing structure and the top of the frame 403 through the gas guiding structure to reduce the negative pressure at the top of the frame 403 during its descent. During the rise of the frame 403, the gas between the top of the frame 403 and the sealing structure is gradually extracted through the gas guiding structure to ensure the normal lifting of the frame 403.

[0048] Through the above structural design, the negative pressure environment in the vacuum operating chamber 2 can reduce the impact on the lifting and moving of the frame 403, reduce the lifting and moving rate of the frame 403, ensure the stability of the lifting and moving of the frame 403, and realize the stable loading and unloading of circuit boards; at the same time, the closed structure here can seal and isolate the only opening at the bottom of the vacuum operating chamber 2, which can ensure that the negative pressure state in the vacuum operating chamber 2 is in a stable state.

[0049] The aforementioned enclosed structure can be a rotating sealing plate or a gate, which can be moved onto the moving path of the frame 403 to achieve closed control, and is staggered from the moving path of the frame 403 to ensure the lifting and lowering movement of the frame 403; the aforementioned air guiding structure is an air guiding pipe with a built-in valve, located near the gate, or it can be set at the bottom of the gate, and the outside of the air guiding pipe is connected to a pumping device to realize the pumping and extraction of gas.

[0050] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A vacuum glue dispensing process, using a vacuum glue dispensing device, including a vacuum operating chamber (2) and a loading / unloading chamber (3), wherein the dispensing device (1) is equipped with an automatic loading / unloading mechanism (4), characterized in that: The loading and unloading mechanism (4) passes through the vacuum operation chamber (2) and the pick-and-place chamber (3) to realize the lifting and conveying of the circuit board. The loading and unloading mechanism (4) includes a shell (406) and a frame (403) with only a front opening. The frame (403) is located inside the shell (406) and is sealed and slidably connected. The upper and lower front sides of the shell (406) are provided with through notches located on the same side as the opening of the frame (403). The shell (406) forms a closed area between the two through notches. The thickness of the closed area is greater than the thickness of the frame (403). Includes the following steps: S1. The control frame (403) moves to the bottom position inside the pick-and-place chamber (3) and places the circuit board inside the frame (403); S2, The control frame (403) lifts the circuit board to a predetermined height into the vacuum operating chamber (2) and injects glue onto the surface of the circuit board; S3. The control frame (403) lowers the circuit board with the glue applied to a predetermined height into the pick-and-place chamber (3) to replace the circuit board; during the lifting and moving of the frame (403), the vacuum operation chamber (2) is continuously under negative pressure, and the frame (403) and the outer shell (406) are continuously in a sealed sliding connection state.

2. The vacuum dispensing process for adhesives according to claim 1, characterized in that, A lifting platform (404) is provided inside the frame (403), and a folding telescopic rod (405) is provided inside the lifting platform (404). The circuit board is placed on the upper surface of the lifting platform (404), and the lifting platform (404) is controlled to move linearly by the folding telescopic rod (405). The lifting platform (404) is controlled to move outward and extend outward to offset the frame (403) to complete the glue injection and loading / unloading. After the lifting platform (404) is controlled to move inward into the frame (403), the frame (403) is controlled to move up and down.

3. The vacuum dispensing process for adhesives according to claim 2, characterized in that, The bottom of the frame (403) is also provided with a hydraulic telescopic rod (402) for controlling the lifting and lowering of the frame (403). The hydraulic telescopic rod (402) is linked with the folding telescopic rod (405). After the hydraulic telescopic rod (402) lifts the frame (403) to the limit position, the folding telescopic rod (405) controls the lifting platform (404) to extend outward.

4. The vacuum dispensing process for adhesives according to claim 3, characterized in that, An air bladder is provided at the top of the inside of the hydraulic telescopic rod (402), and the air bladder is connected to the folding telescopic rod (405).

5. The vacuum dispensing process for adhesives according to claim 4, characterized in that, The hydraulic telescopic rod (402) is equipped with two sets of position control pistons, and a time-delay elastic component is provided between the two sets of position control pistons. The airbag is located between the two sets of position control pistons and communicates with the folding telescopic rod (405).

6. The vacuum dispensing process for adhesives according to claim 4, characterized in that, The folding telescopic rod (405) includes at least two rods that are rotatably connected to each other. A hydraulic rotating joint is provided at the rotating joint of the two rods. The airbag is connected to the hydraulic rotating joint of the folding telescopic rod (405).

7. The vacuum dispensing process for adhesives according to claim 4, characterized in that, The airbag has an expansion elasticity and can drive the rod of the folding telescopic rod (405) to rotate and extend through pressure changes. After the airbag is compressed, the control oil inside is squeezed into the folding telescopic rod (405) to control the folding telescopic rod (405) to deflect and unfold. After the airbag expands elastically, it extracts the oil inside the folding telescopic rod (405) to control the folding telescopic rod (405) to deflect and fold.

8. The vacuum dispensing process for adhesives according to claim 1, characterized in that, The top of the outer shell (406) is also provided with a separately controlled sealing structure and a gas guiding structure. After the frame (403) descends to the position below the sealing structure, the sealing structure moves to the path of the frame (403) to isolate the vacuum operation chamber (2) from the frame (403). At the same time, gas is introduced into the chamber between the sealing structure and the top of the frame (403) through the gas guiding structure to reduce the negative pressure effect at the top of the frame (403) during the descent. During the rise of the frame (403), the gas between the top of the frame (403) and the sealing structure is gradually extracted through the gas guiding structure to ensure the normal lifting of the frame (403).

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