Card pad, card forming method, card set, and cutter set

Abstract

The invention provides a card pad, a card forming method, a card suite and a cutting machine suite. The card pad provided by the invention is provided with a main body and a first bonding layer, the main body is provided with a through hole penetrating through the thickness direction, and the length of the through hole in the first direction is larger than that in the second direction; in a second direction perpendicular to the first direction, the card pad is sequentially provided with a first area, a through hole, a second area and a third area; and a first bonding layer is arranged on the second area. The card forming method comprises the steps that the card penetrates through the through hole; placing the second part below the second area, placing the first part above the second area, and bonding the first part and the second area by a first bonding layer; and placing the card pad and the card into a cutting machine. The card suite comprises a card and a card pad. The cutting machine set comprises a cutting machine and a card pad. Raw material input is reduced, manufacturing difficulty is reduced, raw material cost and time cost are reduced, and economic benefits are benefited.

Description

Technical Field

[0001] This invention relates to card forming tools and methods, specifically to a card pad, a card forming method, a card kit, and a cutting machine kit. Background Technology

[0002] Chinese invention patent CN114929488B discloses a card pad and a card forming method. The card pad is used to assist in the folding of cards when they are cut by an electronic cutter.

[0003] A folding card consists of two folded parts. If the card is cut with these two parts in an open state, the width of the electronic cutter will increase significantly in order to accommodate the open card. Therefore, it is generally preferred to cut the two parts of the folding card in a folded state, especially in non-industrial, small-volume electronic cutters that require the folding card to be cut in a folded state.

[0004] The blade of an electronic cutter has strong piercing force, sufficient to pierce both folded parts of a card. Therefore, without assistance, an electronic cutter cannot cut only one part of a card in its folded state. To address this, the card pad and its usage method provided in CN114929488B solve the problem of electronic cutters being unable to cut a single part of a card in its folded state.

[0005] The card pad provided by CN114929488B includes an upper layer and a lower layer, with an entrance between the upper and lower layers. This entrance allows a portion of a folded card to be inserted into the interlayer space between the upper and lower layers. When a portion of the folded card is inserted into the interlayer space, folding it allows the other portion of the folded card to be positioned on top of the upper layer. During cutting, the folded card assembled in this state, along with the card pad, is placed into an electronic cutting machine. During the cutting process, the portion of the folded card positioned in the interlayer space between the upper and lower layers is protected from contact by the upper layer from above, thus enabling the cutting of only one portion of the folded card.

[0006] In addition, in order to transport the card and card pad along the infeed direction, the electronic cutting machine is equipped with two rubber rollers that are arranged opposite each other in the width direction perpendicular to the infeed direction. The width of the lower layer of the card pad is greater than that of the upper layer. The two sides of the width of the lower layer form a part that is not covered by the upper layer. The two rubber rollers press down on the two parts of the lower layer and drive the card pad and card along the infeed direction through friction.

[0007] However, the existing card pads have failed to achieve better economic benefits. Summary of the Invention

[0008] The primary objective of this invention is to provide a card pad that reduces manufacturing costs and manufacturing difficulty to achieve better economic benefits.

[0009] A second objective of the present invention is a card forming method based on the card pad of the present invention.

[0010] A third objective of the present invention is to provide a card kit comprising the card pad of the present invention.

[0011] A fourth objective of this invention is to provide a cutting machine kit comprising the card pad of this invention.

[0012] To achieve the first objective of the present invention, the card pad provided by the present invention has a main body and a first adhesive layer; the main body is provided with a through hole penetrating the thickness direction, and the length of the through hole in the first direction is greater than the length in the second direction; in the second direction perpendicular to the first direction, the card pad is sequentially provided with a first region, a through hole, a second region and a third region; the second region is provided with the first adhesive layer.

[0013] As can be seen from the above solution, the current card pad uses a three-sided "U"-shaped bonding area between the upper and lower plates to form a space similar to a sandwich structure, with a single-sided entrance resembling a bag opening. The uncut portion of the folded card that needs to be blocked is inserted into this sandwich space through this single-sided entrance. Testing revealed that during the card pad's assistance in cutting the folded card, the lower plate, except for small areas on its two sides that need to contact the rollers of the electronic cutting machine, has almost no practical function. For example, the area of ​​the lower plate directly below the upper plate, although supporting the portion of the folded card that needs to be blocked, is already adequately supported by the cutting machine's support surface. Therefore, this current card pad, due to its double-layer structure, unnecessarily increases material usage and requires a complex manufacturing process involving precise positioning of the upper and lower layers and bonding in a "U"-shaped area. This results in higher manufacturing costs and greater material and time costs, hindering better economic efficiency. Therefore, the card pad of this invention is completely different from the double-layer structure. Its main body is a single-layer structure, eliminating the unnecessary lower layer. A long through-hole is provided on the main body, replacing the original single-sided entrance. After the folded card passes through the through-hole and is folded, the two parts of the folded card are positioned on the front and rear sides of the main body respectively. Furthermore, the through-hole is offset to the side in the second direction from the first side, thus forming a larger second area between the through-hole and the second side, serving as a blocking area. After the folded card passes through the through-hole and is folded, the part to be cut is on top and the part to be blocked is on the bottom. The part to be cut is bonded to the second area through the first adhesive layer on the upper surface of the second area, or the part to be blocked is bonded to the second area through the first adhesive layer on the lower surface of the second area. In this case, the folded card is effectively fixed. Under the weight of the folded card and the card pad, the part to be blocked is stably below the second area and supported by the cutting machine support surface. When the cutter cuts the part to be cut, the second area blocks the part from above. Therefore, it can be seen that, firstly, the card pad of the present invention can also assist in folding cards to cut individual parts in a folded state; more importantly, the main body of the card pad of the present invention only includes a single-layer structure, saving the material of the second layer structure, and eliminating the more complex process of accurately positioning the upper and lower layers and bonding the "U"-shaped adhesive area, thus reducing material costs and time costs, which is beneficial to economic benefits.

[0014] A further embodiment includes a first adhesive layer on the upper surface of the second region; and a second adhesive layer disposed on the lower surface of the second region.

[0015] As can be seen from the above, the upper and lower surfaces of the second region are respectively provided with a first adhesive layer and a second adhesive layer. This prevents the card pad and the folded card from becoming uncuttable due to the card's recovery deformation after folding. The second adhesive layer effectively adheres to the portion of the card that needs to be blocked, ensuring the card remains folded before cutting is completed and guaranteeing smooth cutting. It should be noted that the bonding process between the second adhesive layer and the main body is the same as that between the first adhesive layer and the main body. Therefore, the bonding process of the second adhesive layer does not increase the manufacturing difficulty of the card pad of this invention. Furthermore, existing double-layer card pads also have adhesive layers on the upper and lower surfaces of the interlayer space. Therefore, compared to existing double-layer card pads, the card pad of this invention with a second adhesive layer still has a significant time cost advantage. Additionally, in the thickness direction of the main body, the projection of the second adhesive layer is entirely within the projection of the first adhesive layer. Since the areas of the two folded parts of most folded cards are the same, this configuration ensures that when the first adhesive layer adheres to the portion to be cut, the second adhesive layer can also successfully adhere to the portion that needs to be blocked.

[0016] A further step is to make the area of ​​the second adhesive layer smaller than the area of ​​the first adhesive layer.

[0017] As can be seen above, to ensure the support of cards up to the largest size supported by this card pad, the first adhesive layer has a large area, almost covering the second area. This ensures that the first adhesive layer can adhere to the outer edges of the cut portion of the largest card, preventing it from lifting. Generally, the second adhesive layer is similar to the first; the larger the area of ​​the second adhesive layer, the better its adhesion to the portion that needs to be blocked. However, this general consideration ignores the orientation of the second adhesive layer. When the second adhesive layer is large enough and the card size to be cut is small, a portion of the downward-facing second adhesive layer will protrude beyond the portion to be blocked and face the support surface of the cutting machine below. When the cutting machine's roller presses down on the card pad and moves it forward or backward, the downward-protruding second adhesive layer will adhere to the cutting machine's support surface, preventing the card pad from moving, leading to card cutting failure and card damage. Therefore, although both are adhesive layers, the second adhesive layer, unlike the first adhesive layer, does not necessarily need to be larger. Therefore, more preferably, the area of ​​the second adhesive layer is smaller than that of the first adhesive layer. Furthermore, it is preferable that the area of ​​the second adhesive layer is smaller than or equal to the smallest foreseeable size of the card to be cut, to ensure that the portion of the card to be blocked can cover the second adhesive layer to prevent its exposure and thus prevent problems with the adhesive-cutting machine support surface, ensuring smooth card cutting. Of course, even if the area of ​​the second adhesive layer is small, the restoring force of the folded card can be well overcome by the downward pressure of the card and card pad's own weight. A further approach is to place the second adhesive layer closer to the downstream end in the first direction.

[0018] As can be seen from the above, in order to avoid the card shifting along the length of the through hole, the card is generally positioned by the end of the through hole along its length after it is inserted. Therefore, half of the card after placement will be close to one end of the through hole in the first direction. For this reason, the second adhesive layer is closer to the downstream end in the first direction, so that smaller cards can also cooperate with and cover the second adhesive layer.

[0019] Another further option is to include a first protective layer and a second protective layer, which respectively cover the first adhesive layer and the second adhesive layer.

[0020] As can be seen from the above, the first and second protective layers are protective films that can be repeatedly peeled off or covered. When the card pad is not in use, the protective film can be reapplied to ensure that the adhesion of the first and second adhesive layers lasts for a longer period of time.

[0021] Another further option is that, in the second direction, the first region is located between the through hole and the first side; the second region is located between the first region and the second side.

[0022] A further proposed solution is that the first area is used to contact the first roller of the cutting machine, and the third area is used to contact the second roller of the cutting machine.

[0023] As can be seen from the above, under this setting, through the contact and cooperation between the first area and the third area and the rubber roller of the cutting machine, the card pad and the card can be smoothly driven to move forward or backward in the infeed direction, thereby cooperating to complete the card cutting, avoiding the rubber roller pressing on the card to damage the card or affect the cutting.

[0024] A further step is to include a reinforcing strip, which is disposed at the upstream end and / or downstream end of the upper surface of the main body in a first direction.

[0025] As can be seen from the above, since the second adhesive layer and the portion to be blocked are located below the second region, the main body is lifted, causing a certain gap to form between the first and third regions and the cutting machine support surface. When the two rollers press down on the first and third regions, the first and third regions deform downwards in the gap. Conversely, the middle part of the main body, i.e., the blocking region, deforms upwards, which affects card cutting. To address this, the present invention also provides a reinforcing strip. The reinforcing strip is located at the upstream and / or downstream end of the upper surface of the main body in the first direction. The reinforcing strip has an extension in the second direction and can resist the bending deformation of the blocking region, ensuring the cutting effect. The reinforcing strip is connected to the upper surface of the main body. Since the thickness of the reinforcing strip is relatively large, if it is located on the lower surface of the main body, it may raise one side of the card pad, affecting the card's levelness and normal cutting. Therefore, by connecting the reinforcing strip to the upper surface of the main body, the card's levelness is avoided, and the thickness of the reinforcing strip is not too restricted, allowing for greater freedom in material selection and making it easier to meet the deformation resistance requirements.

[0026] To achieve the second objective of the present invention, in the card forming method provided by the present invention, the card pad adopts the above-mentioned card pad; the card includes a first part and a second part that can be stacked; the card forming method includes: passing the card through a through hole; placing the second part below the second region and placing the first part above the second region, the first part or the second part being bonded by a first adhesive layer; and placing the card pad and the card into a cutting machine.

[0027] As can be seen from the above solution, the card pad of the present invention can also assist in folding cards to cut individual parts in a folded state; more importantly, the main body of the card pad of the present invention only includes a single-layer structure, saving the material of the second layer structure, and eliminating the more complex process of accurately positioning the upper and lower layers and bonding the "C"-shaped bonding area, thus reducing material costs and time costs, which is beneficial to economic benefits.

[0028] To achieve the third objective of the present invention, the card kit provided by the present invention includes a combinable card and a card pad. The card includes a first part and a second part that can be stacked. The card pad adopts the aforementioned card pad. When the card and the card pad are in a combined state, the card passes through a through hole, the second part is placed below the second region, the first part is placed above the second region, and the first part or the second part is bonded by a first adhesive layer.

[0029] To achieve the fourth objective of the present invention, the cutting machine kit provided by the present invention includes a cutting machine and a card pad, with the card pad shell placed inside the cutting machine; the card pad is the aforementioned card pad. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the card pad embodiment of the present invention with the front side facing upwards.

[0031] Figure 2 This is a schematic diagram of the card pad embodiment of the present invention with the back side facing upwards.

[0032] Figure 3 This is a schematic cross-sectional view of the first state of the card pad embodiment of the present invention.

[0033] Figure 4 This is a schematic diagram of the main body of an embodiment of the card pad of the present invention.

[0034] Figure 5 This is a schematic cross-sectional view of the second state of the card pad embodiment of the present invention.

[0035] Figure 6 This is a schematic diagram of a card in an embodiment of the card kit of the present invention.

[0036] Figure 7 This is a schematic cross-sectional view of the first process state of an embodiment of the card kit of the present invention.

[0037] Figure 8 This is a schematic cross-sectional view of the second process state of an embodiment of the card kit of the present invention.

[0038] Figure 9 This is a schematic cross-sectional view of the assembled state of an embodiment of the card kit of the present invention.

[0039] Figure 10 This is a schematic diagram of the assembled state of the card kit embodiment of the present invention, with the front side facing upwards.

[0040] Figure 11 This is a schematic diagram of the assembled state of the card kit embodiment of the present invention with the back side facing up.

[0041] Figure 12 This is a schematic diagram showing the portion to be blocked being blocked in an embodiment of the card forming method of the present invention.

[0042] Figure 13 This is a schematic diagram illustrating the bending deformation of the main body in an embodiment of the card forming method of the present invention, assuming that no reinforcing strip is provided.

[0043] Figure 14 This is a schematic diagram of the reinforcing strip in an embodiment of the card forming method of the present invention. Detailed Implementation

[0044] Examples of card pads, card kits, cutting machine kits, and card forming methods Referring to the accompanying drawings, a unified spatial rectangular coordinate system is established in each drawing. In the coordinate system, the x-axis direction is the first direction of the present invention, the y-axis direction indicates the second direction of the present invention, and the z-axis direction indicates the thickness direction of the main body 1 of the present invention. The first direction indicated by the x-axis direction is the in-and-out direction of the card pad in the cutting machine.

[0045] See Figures 1 to 3 , Figure 1 and Figure 2 The front and back sides of the card pad in this embodiment are shown respectively. The front and back sides of the card pad are opposite sides in the z-axis direction. When the card pad and the card assembled to the card pad are fed into the cutting machine for cutting, the front side of the card pad is facing up and the back side is facing down.

[0046] The card pad in this embodiment includes a main body 1, a first adhesive layer 21, a second adhesive layer 22, a reinforcing strip 3, a first protective layer 41, and a second protective layer 42. The thickness direction of the main body 1 is consistent with the thickness direction of the card pad. The main body 1 includes an upper surface 1a facing the front of the card pad and a lower surface 1b facing the back of the card pad. The upper surface 1a and the lower surface 1b are two opposite surfaces in the thickness direction of the card pad. The first adhesive layer 21 and the reinforcing strip 3 are disposed on the upper surface 1a, and the second adhesive layer 22 is disposed on the lower surface 1b. Figure 3 As shown, the first protective layer 41 covers the first adhesive layer 21, and the second protective layer 42 covers the second adhesive layer 22.

[0047] Main body 1 is a single-layer structure. It should be noted that the single-layer structure of main body 1 is different from the double-layer structure with an upper layer, a lower layer, and a sandwich space formed between the upper and lower plates in the Chinese invention patent with publication number CN114929488B. Main body 1 is only a single-layer plate entity. The single-layer structure does not limit the main body to a structure with a single material layer. For example, the main body may use two different material layers that are stacked and fixed together. For another example, the main body may include a core layer and a wrapping layer that wraps around the core layer. Although these examples all have more than two material layers, they still constitute a single-layer plate entity. The specific configuration of these main bodies all belong to the single-layer structure of this invention.

[0048] The body 1 can be formed of polyvinyl chloride (PVC) or other similar plastics, polymers, or other polymeric materials. The thickness of the body 1 can be greater or less depending on one or both of the hardness and thickness of the card to be mated and cut. In some embodiments, the body 1 is made of PVC material, and when the cutter is configured to apply a downward force of about 400 grams to the card, the thickness of the body 1 can be selected to be in the range of about 0.30 mm to about 0.45 mm.

[0049] The first adhesive layer 21 and the second adhesive layer 22 refer to the description of pressure-sensitive adhesive layer 21A disclosed in Chinese invention patent publication number CN114929488B, and the first protective layer 41 and the second protective layer 42 refer to the description of membrane material 21 disclosed in Chinese invention patent publication number CN114929488B. The protective layer covering the surface of the adhesive layers can be repeatedly peeled off or covered. In this embodiment, the outer contours of the first adhesive layer 21, the second adhesive layer 22, and the reinforcing strip 3 are all square, and the reinforcing strip 3 can be made of plastic, wood, or metal.

[0050] See Figure 1 and Figure 4 In this embodiment, the main body 1 is a rectangular plate with rounded corners. The first direction is the length direction of the main body 1, the second direction is the width direction of the main body 1, and the z-axis direction indicates the thickness direction of the main body 1. The main body 1 is provided with through holes 10 extending through both sides of its thickness, through holes 10 for cards to pass through. Further, the through holes 10 are set as elongated holes extending along the first direction of the main body (the x-axis direction in the figure). More specifically, in this embodiment, the through holes 10 are straight holes, and the straight direction of the through holes 10 is the first direction. More specifically, as shown in the figure... Figure 1 and Figure 4 On the projection of the thickness direction of the main body 1, the hole outline of the through hole 10 is a rectangle with a large length-to-width ratio. The length direction of the through hole 10 is the first direction, and the width direction is the second direction. That is, the size of the through hole 10 in the first direction is much larger than the size in the second direction.

[0051] In this invention, "elongated hole" refers to a through-hole projected along its penetrating direction (the thickness direction of the main body). The length of the through-hole extending along the first direction is greater than its width in the second direction. However, the hole's outline is not required to be rectangular or approximately rectangular. As long as the through-hole allows the card to pass through and does not affect the card's folding along the preset folding line, it falls under the category of an elongated hole extending along the first direction of the main body in this invention. For example, for aesthetic purposes, the inner outline of the through-hole may be set as a continuous wavy line, but this does not affect the card's insertion or folding along its preset folding line; the through-hole still conforms to the elongated hole definition of this invention.

[0052] In the second direction, the main body 1 includes a first side 11 and a second side 12 that are arranged opposite to each other.

[0053] In the second direction, the through hole 10 is located very close to the first side 11.

[0054] In the second direction, on the main body 1, the area located between the first side 11 and the through hole 10 is defined as the first region 191. The first region 191 extends along the first direction between the two ends of the length of the main body 1, and the width of the first region 191 in the second direction is smaller.

[0055] In the second direction, on the main body 1, the area between the second side 12 and the through hole 10 is set as a second area 199 and a third area 192. The second area 199 is the area closer to the through hole 10 relative to the third area 192, and the second area 199 is a larger blocking area used to block the part of the card that needs to be blocked from above.

[0056] In the second direction, a third region 192 is disposed between the second region 199 and the second side 12. The third region 192 extends along the first direction between the two ends of the length of the main body 1, and the second region 191 has a smaller width in the second direction. The width of the third region 192 in the second direction is similar to or equal to that of the first region 191. The upper surface of the first region 191 is used to contact the first roller 83 of the cutting machine. Figure 13 (shown) contact, the upper surface of the third region 192 is used to contact the second roller 84 of the cutting machine (shown) Figure 13 (Show) Contact.

[0057] In addition, in the second direction, an interval region 195 is formed between the through hole 10 and the second region 199 on the main body 1.

[0058] In this embodiment, in the first direction, the length of the second region 199 is consistent with the length of the through hole 10, and the beginning and end ends of the second region 199 are consistent with the beginning and end ends of the through hole 10. Of course, in other embodiments, in the first direction, the length of the second region 199 may be shorter than that of the through hole 10.

[0059] In the first direction, the main body 1 includes a third side 13 and a fourth side 14 disposed opposite to each other. The third side 13 is the downstream end of the upper surface of the main body 1 in the first direction, and correspondingly, the fourth side 14 is the upstream end of the upper surface of the main body 1 in the first direction.

[0060] The main body 1 includes a downstream region 193 disposed between the third side 13 and the second region 199, and the main body 1 includes an upstream region 194 disposed between the fourth side 14 and the second region 199.

[0061] See Figure 1 and Figure 3 On the upper surface 1a, a first adhesive layer 21 is disposed on the upper surface of the second region 199 and covers the second region 199, and a first protective layer 41 covers the first adhesive layer 21. In fact, the region where the first adhesive layer 21 is located can also be considered as the second region 199. Furthermore, a reinforcing strip 3 is disposed in the downstream region 193, the length direction of the reinforcing strip 3 is the second direction, and in the second direction, the beginning and end ends of the reinforcing strip 3 coincide with the beginning and end ends of the second region 199. Additionally, as... Figure 1 As shown, the first adhesive layer 21 is not provided in the interval region 195.

[0062] See Figure 2 and Figure 3 On the lower surface 1b, a second adhesive layer 22 is disposed on the lower surface of the second region 199, and a second protective layer 42 covers the second adhesive layer 22. The second adhesive layer 22 does not cover the second region 199, and the area of ​​the second adhesive layer 22 is much smaller than the area of ​​the first adhesive layer 21. Specifically, as... Figure 2 As shown, in the thickness direction of the main body 1, the projection of the second adhesive layer 22 is entirely within the projection of the first adhesive layer 21, and in the second direction, the distance between the second adhesive layer 22 and the through hole 10 is less than the distance between the second adhesive layer 22 and the second side 12; in the first direction, the second adhesive layer 22 is offset to the third side 13 more closely than the center line L of the second region.

[0063] See and compare Figure 3 and Figure 5 Before using the card pad, the first protective layer 41 and the second protective layer 42 need to be torn off to expose the surfaces of the first adhesive layer 21 and the second adhesive layer 22.

[0064] See Figure 6 The card kit of this embodiment includes a card pad and a card 9. The card 9 is a foldable card that can be folded along a fold line 901. The card 9 includes a first portion 91 and a second portion 92 located on opposite sides of the fold line 901. In this embodiment, the first portion 91 serves as the part of the invention to be cut, and the second portion 92 serves as the part of the invention to be blocked from being cut. In this embodiment, the card 9 is a paper card; as a specific example, the card 9 is a greeting card.

[0065] The card forming method of the present invention uses a card pad of this embodiment to assist the card 9 in completing the cutting process of the first part 91. The card forming method includes: See Figure 7 First, the card 9 is passed through the through hole 10. In this embodiment, a spacer area 195 is provided to prevent the first adhesive layer 21, which has adhesive force, from getting too close to the through hole 10, thus preventing the first adhesive layer 21 from contacting, adhering to, and obstructing the card 9 as it passes through the through hole 10. Then, combined with... Figure 10 During the process of passing the card 9 through the through hole 10, the end 10a of the through hole 10 in the length direction is used as a positioning tool for the card 9 in the first direction. The card 9 in the through hole 10 is pushed towards the end 10a in the first direction until the card 9 is restricted by the end 10a and cannot continue to the previous stage. Combined with... Figure 11 The aforementioned end 10a is not any end in the length direction of the through hole 10, but rather the end in the length direction of the through hole 10 that is closer to the second adhesive layer 22.

[0066] See next Figure 8 and Figure 11 Then, a first bending process is performed to place the second part 92 below the second region 199 and bond it with the second adhesive layer 22.

[0067] See next Figure 9 and Figure 10 Then, a second bending process is performed to place the first part 91 above the second region 199 and bond it with the first adhesive layer 21. At this point, the card 9 is successfully assembled onto the card pad.

[0068] See next Figure 12 At this point, the card pad and card 9 are placed into the cutting machine. After the card pad and card 9 are placed into the cutting machine, under the action of gravity and the adhesive force of the second adhesive layer 22, the second part 92 is stabilized below the second region 199 and supported by the cutting machine support surface 82. When the cutter 81 cuts the first part 91, the second region 199 blocks the second part 92 from above to prevent the second part 92 from being cut by the cutter 81.

[0069] See Figure 13 The cutting machine includes a first roller 83 and a second roller 84 arranged in a straight line opposite each other along a second direction, such as... Figure 13 As shown, during the cutting process and when the cutting machine feeds out or feeds in the card pad, the first roller 83 and the second roller 84 contact the first region 191 and the third region 192 respectively and exert a certain downward pressure on them.

[0070] like Figure 13 As shown, assuming that the reinforcing strip 3 is not provided on the main body 1, since the second adhesive layer 22 and the second part 92 are located below the second region 199, the main body 1 is lifted, causing the first region 191 and the third region 192 to form a certain gap with the cutting machine support surface 82. When the first roller 83 and the second roller 84 press down on the first region 191 and the third region 192 respectively, the first region 191 and the third region 192 bend downward to the gap. Relatively speaking, the middle part of the main body 1, that is, the second region 199, will bulge upward (as shown). Figure 13 The deformation (shown by the dashed line) affects card cutting in this case. See also... Figure 14 Therefore, the reinforcing strip 3 is set upstream or downstream of the cutting machine in the blocking area. The reinforcing strip 3 has an extension in the second direction and can resist the bending deformation of the second area 199 to ensure the cutting effect.

[0071] Furthermore, this invention also claims protection for a cutting machine kit, which includes a conventional cutting machine and the card pad of this embodiment. The conventional cutting machine is described in publication numbers CN115213976B and CN114929488B.

[0072] Mainly, see Figures 7 to 12 The card pad of the present invention can also assist in folding cards to cut individual parts in a folded state. More importantly, see [link to related document]. Figures 1 to 3 The card pad of the present invention has a single-layer structure. Compared with the existing double-layer card pad, it saves the material of the second layer structure and eliminates the more complicated process of accurately positioning the upper and lower layers and bonding the "U"-shaped bonding area. The material cost and time cost are reduced, which is beneficial to economic benefits.

[0073] In other card pad embodiments, the main body does not have a second adhesive layer.

[0074] In other card pad embodiments, the area of ​​the second adhesive layer is equal to the area of ​​the first adhesive layer.

[0075] In other card pad embodiments, in the thickness direction of the main body, a portion of the projection of the second adhesive layer lies outside the projection of the first adhesive layer. Since not all folded cards have two parts of equal area, for some specially designed folded cards, this arrangement of the card pad can ensure that the portion of the card that needs to be blocked completely covers the second adhesive layer.

[0076] In other card pad embodiments, no reinforcing strip is provided.

[0077] Finally, it should be emphasized that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A card pad, characterized in that: It has a main body and a first adhesive layer; The main body is provided with a through hole that extends through the thickness direction, and the length of the through hole in the first direction is greater than the length in the second direction; In a second direction perpendicular to the first direction, a first region, a through hole, a second region, and a third region are sequentially provided; The second region has a first adhesive layer.

2. The card pad according to claim 1, characterized in that: The upper surface of the second region is provided with a first adhesive layer; It also includes a second adhesive layer, which is disposed on the lower surface of the second region.

3. The card pad according to claim 2, characterized in that: The area of ​​the second adhesive layer is smaller than the area of ​​the first adhesive layer.

4. The card pad according to claim 3, characterized in that: The second adhesive layer is closer to the downstream end in the first direction.

5. The card pad according to claim 2, characterized in that: It also includes a first protective layer and a second protective layer, which respectively cover the first adhesive layer and the second adhesive layer.

6. The card pad according to any one of claims 1 to 5, characterized in that: In the second direction, the first region is located between the through hole and the first side, and the second region is located between the first region and the second side.

7. The card pad according to claim 6, characterized in that: The first area is used to contact the first roller of the cutting machine; The third area is used for contact with the second roller of the cutting machine.

8. The card pad according to claims 1 to 5, characterized in that: It also includes reinforcing strips, which are disposed at the upstream end and / or downstream end of the upper surface of the body in a first direction.

9. A card forming method, characterized in that: The card pad is any one of the card pads described in claims 1 to 8 above; The card consists of a first part and a second part that can be stacked; Card formation methods include: Pass the card through the hole; The second part is placed below the second region, and the first part is placed above the second region, wherein the first part or the second part is bonded by the first adhesive layer; Place the card pad and the card into the cutting machine.

10. A card kit comprising combinable cards and a card pad, the cards comprising a first part and a second part that can be stacked; Its features are: The card pad is any one of the card pads described in claims 1 to 8 above; The card and card pad are in a combined state, with the card passing through the through hole, the second part placed below the second area, and the first part placed above the second area, and the first part or the second part is bonded by a first adhesive layer.

11. A cutting machine kit, including a cutting machine and a card pad, with the card pad housing inserted into the cutting machine; Its features are: The card pad is any one of the card pads described in claims 1 to 8.

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