Vehicle-mounted charger shell and vehicle-mounted charger

Abstract

The invention relates to a vehicle-mounted charger shell, and belongs to the technical field of vehicle charging, the vehicle-mounted charger shell comprises a bottom shell, a circulating liquid channel is arranged in the bottom shell, the circulating liquid channel and the bottom shell are jointly connected with a plurality of shielding plates, and the shielding plates, the bottom shell and the circulating liquid channel jointly divide a filtering unit mounting area and a power unit mounting area; a magnetic device mounting area is defined by the circulating liquid channel and the bottom shell; an upper cover and a plurality of shielding covers are further included, the shielding covers are arranged corresponding to the filtering unit installation areas so as to seal the filtering unit installation areas, and the upper cover and the bottom shell are matched to form a closed shell. The vehicle-mounted charger has the advantages that the occupied space of the vehicle-mounted charger is further reduced, the power density is improved, the heat dissipation effect is improved, and electromagnetic interference is reduced.

Description

Technical Field

[0001] This application relates to the field of automotive charging technology, and in particular to an on-board charger housing and an on-board charger. Background Technology

[0002] With the rapid development of new energy vehicle technology, on-board chargers, as important power conversion components in new energy vehicles, are constantly evolving towards higher power density, miniaturization, and integration. To meet the space constraints of vehicle layout, how to further reduce the overall size of on-board chargers while ensuring electrical performance and electromagnetic compatibility has become a pressing technical problem for those skilled in the art.

[0003] Publication number CN118201345A discloses an on-board charger that reduces signal interference by employing an independently designed filter module and a metal substrate with surface-mount switching transistors, achieving effective isolation and shielding, reducing product size, and improving heat dissipation. However, this solution still has shortcomings: Each filter module needs to be configured with an independent shielding shell. There are often at least two layers of shielding structure between adjacent filter modules, and space must also be reserved for the coolant flow channel, resulting in a relatively large overall volume. Summary of the Invention

[0004] To further reduce the space occupied by the on-board charger and further improve its heat dissipation, this application provides an on-board charger housing and an on-board charger.

[0005] The on-board charger housing provided in this application adopts the following technical solution: A vehicle-mounted charger housing includes a bottom shell, a circulating liquid channel is provided inside the bottom shell, the circulating liquid channel and the bottom shell are connected to a plurality of shielding plates, the shielding plates, the bottom shell and the circulating liquid channel together separate a filter unit installation area and a power unit installation area, and the circulating liquid channel and the bottom shell together enclose a magnetic device installation area. It also includes a top cover and several shielding covers, the shielding covers being configured corresponding to the installation area of ​​the filter unit to enclose the installation area of ​​the filter unit, and the top cover and the bottom shell cooperating to form a closed shell.

[0006] By adopting the above technical solution, the circulating fluid channel, the shielding plate and the inner side wall of the bottom shell work together to form the shielding boundary of the filter unit installation area. There is no need to set up an independent shielding shell for each filter module, thereby avoiding the formation of multiple layers of repeated shielding structures between adjacent filter modules, which helps to reduce the overall size of the on-board charger. By directly using the circulating fluid channel as one of the structural boundaries of the filter unit installation area, the arrangement of the filter module and the coolant channel can be closely matched. While meeting the electromagnetic shielding requirements, there is no need to reserve an additional independent space for the coolant channel, further improving the compactness of the overall layout. Furthermore, to ensure reliable grounding of the filter module, a stable electrical contact is formed between the filter module and the housing, shielding plate, and shielding cover. Some components in the filter module can also contact the outer wall of the circulating fluid channel. Since the housing, shielding plate, and circulating fluid channel are usually made of metal materials with good thermal conductivity, the heat generated by the filter module during operation can be conducted to the circulating fluid channel through the above structure and carried away by the coolant while achieving reliable grounding and electromagnetic shielding. Compared to existing technologies where the filter module relies solely on air convection for heat dissipation, or uses a completely enclosed structure to ensure shielding effectiveness, resulting in limited heat dissipation, the technical solution of this application achieves effective cooling of the filter module while ensuring good electromagnetic shielding performance. This helps to reduce the operating temperature of the components in the filter module and extend its service life.

[0007] Optionally, the circulating liquid channel includes two main liquid channel pipes, which are connected by a connecting pipe. The ends and opposite sides of the two main liquid channel pipes are connected to the shielding plate, and the opposite sides of the two main liquid channel pipes are also connected to a shielding plate. The filter unit installation area includes an AC filter area, an LV filter area, and a DC filter area. Several shielding covers correspond one-to-one with the AC filter area, the LV filter area, and the DC filter area. The power unit installation area includes an AC power area and a DC power area. The AC filtering region and the AC power region are formed by one of the liquid channel mains and their corresponding shielding plates, the DC filtering region and the DC power region are formed by another liquid channel main and its corresponding shielding plate, and the LV filtering region and the magnetic device mounting region are formed by the shielding plate between the two liquid channel mains and the liquid channel mains.

[0008] By adopting the above technical solution, the AC filtering area is set adjacent to the AC power area, and the DC filtering area is set adjacent to the DC power area, which shortens the connection path between the filtering module and the corresponding power module, which helps to reduce parasitic parameters and reduce the area of ​​high-frequency current loop, thereby improving electromagnetic compatibility performance. Meanwhile, the magnetic device mounting area and LV filter area are set between the AC area and the DC area. By utilizing the structural and functional isolation effect of the magnetic device, the mutual interference between the AC side and the DC side is reduced, and the LV power supply is filtered nearby after being led out from the magnetic device, thereby improving the stability of low-voltage power supply. Furthermore, one liquid channel main pipe exchanges heat with the components in the AC power area and the AC filter area, while the other liquid channel main pipe exchanges heat with the components in the DC power area and the DC filter area. The two liquid channel main pipes can also exchange heat with the central magnetic components, thereby improving the cooling utilization rate of the liquid channel main pipes.

[0009] Optionally, the top of the main fluid channel is provided with a fluid channel boss, which is disposed opposite to the power transistor of the main board.

[0010] By adopting the above technical solution, the liquid channel boss makes the outer wall of the liquid channel main pipe closer to the power transistor on the motherboard in space. Under the premise of ensuring electrical insulation, the heat conduction path between the power transistor and the liquid channel main pipe is shortened, so that the heat generated by the power transistor on the motherboard can be effectively conducted to the liquid channel main pipe and carried away by the coolant, thereby realizing liquid cooling heat dissipation of the power transistor on the motherboard and further improving the utilization efficiency of the cooling capacity of the liquid channel main pipe.

[0011] Optionally, the upper cover is recessed to form a cover body protrusion, and the cover body protrusion is disposed opposite to the liquid channel protrusion.

[0012] By adopting the above technical solution, the design of the cover protrusion allows some of the heat generated by the motherboard power transistors to be conducted to the top cover and dissipated outward through the top cover, forming a coordinated heat dissipation path with the main liquid channel, further improving the overall heat dissipation capacity.

[0013] Optionally, both the drain end and the inlet end of the circulating fluid channel are connected to a connector, the filter unit mounting area is located inside one end of the bottom shell, and the connector is connected to the end of the bottom shell away from the filter unit mounting area.

[0014] By adopting the above technical solution, the drain and inlet ends of the circulating fluid channel are located at one end of the housing, while the filter unit installation area is located at the other end of the housing, thus separating the water interface and the output interface. Compared with the crowded interface arrangement caused by the water interface and output interface being located at the same end of the housing in traditional designs, the layout described in this application can ensure sufficient space for socket connection and is conducive to reducing the size of the housing.

[0015] Optionally, the shielding cover is provided with a first claw and a second claw. The first claw can be locked with the bottom shell, and the second claw can be locked with the shielding plate, so that the shielding cover is in close contact with the shielding plate, the bottom shell and the circulating water channel.

[0016] By adopting the above technical solution, the first claw engages with the bottom shell, and the second claw engages with the shielding plate, so that the shielding cover, shielding plate, bottom shell and circulating liquid channel form a tight contact, thereby avoiding electromagnetic shielding failure caused by narrow gaps.

[0017] The on-board charger provided in this application adopts the following technical solution: An on-board charger, using the above-mentioned on-board charger housing, further includes a filter module, a magnetic device module, a power module, and a main control module. The filter module is installed in the filter unit mounting area, the magnetic device module is installed in the magnetic device mounting area, the power module is installed in the power unit mounting area, and the main control module is connected to the bottom shell. The power module includes a first PCB board, which is arranged vertically. A first top heat dissipation power tube is installed on one side of the first PCB board, and a driver chip is installed on the other side of the first PCB board. An insulating heat-conducting plate is connected to the sidewall of the circulating fluid channel through thermally conductive adhesive, and the insulating heat-conducting plate is connected to the first top heat dissipation power tube through thermally conductive adhesive.

[0018] By adopting the above technical solution, the heat dissipation surface of the power transistor is tightly connected to the insulating heat-conducting plate through thermally conductive adhesive, and the insulating heat-conducting plate is in turn thermally connected to the side wall of the circulating liquid channel. Compared with the traditional bottom-heat-dissipating power transistor with a single-layer aluminum substrate structure, this solution shortens the wiring path between the power transistor and the drive circuit, significantly reduces the PCB board area, and improves space utilization.

[0019] Meanwhile, the top heat dissipation power tube forms a direct heat conduction path with the liquid channel and thermally conductive insulation plate, enabling the heat from the power tube to be quickly transferred to the liquid channel and cooled, significantly improving heat dissipation efficiency.

[0020] Optionally, the main control module includes a second PCB board, which is arranged horizontally and connected to the base. The second PCB board is located above the filter module, the magnetic device module, and the power module. A second top heat dissipation power pipe is connected to the side of the second PCB board away from the top cover. The second top heat dissipation power pipe faces the liquid channel boss. An insulating space is left between the second top heat dissipation power pipe and the liquid channel boss, and the insulating space is filled with thermally conductive adhesive.

[0021] By adopting the above technical solution, the second PCB board is arranged horizontally above the filter module, magnetic device module and power module, which significantly shortens the connection path between the second PCB board and the magnetic device module and power module, which helps to reduce signal interference and improve power transmission efficiency.

[0022] Meanwhile, the second top heat dissipation power tube forms a direct heat conduction path through the liquid channel protrusion, and achieves auxiliary heat dissipation through the cover protrusion of the top cover, so that the sides, top, and top of the water channel all participate in the heat dissipation of the power tube. This layout makes full use of space, achieves a modular and compact arrangement, and is conducive to reducing the size of the charger and increasing power density.

[0023] Optionally, the top of the first PCB board is provided with a plug-in part, and the second PCB board is provided with a plug-in slot. The plug-in slot corresponds one-to-one with the plug-in part, and the plug-in slot is inserted into the corresponding plug-in part and soldered.

[0024] By adopting the above technical solution, the connector of the first PCB board is inserted into the connector slot of the second PCB board and soldered, realizing the power and signal connection between the first and second PCB boards. Simultaneously, the connector structure, the thermally conductive adhesive, and the fixation of the second PCB board to the base shell work together to firmly fix the first PCB board within the base shell, eliminating the need for additional support components. Compared to the existing technology that uses independent frames or fasteners to fix the PCB board, this solution not only ensures the stability of the first PCB board but also further reduces the space occupied by the base shell, improving space utilization.

[0025] Optionally, the filtering module includes an AC filter board, a DC filter board, and an LV filter board. The top and bottom layers of the AC filter board, the DC filter board, and the LV filter board are all grounded. The bottom layers of the AC filter board, the DC filter board, and the LV filter board are in contact with the corresponding shielding plates, and the top layers of the AC filter board, the DC filter board, and the LV filter board are in contact with the corresponding shielding covers.

[0026] By adopting the above technical solution, the bottom surface of the filter board is in direct contact with the shielding plate, and the top surface is in direct contact with the shielding cover. Furthermore, grounding layers are laid on both the upper and lower layers of the filter board, thereby ensuring the sealing and reliable grounding of the shielding cavity and effectively preventing electromagnetic interference from the filter module or the outside.

[0027] In summary, this application includes at least one of the following beneficial technical effects: 1. The circulating fluid channel, shielding plate, and inner wall of the bottom shell work together to form the shielding boundary of the filter unit installation area. There is no need to set up an independent shielding shell for each filter module, thereby avoiding the formation of multiple layers of repeated shielding structures between adjacent filter modules, which helps to reduce the overall size of the on-board charger. 2. The design of the liquid channel boss brings the outer wall of the liquid channel main pipe closer to the power transistor on the motherboard. While ensuring electrical insulation, it shortens the heat conduction path between the power transistor and the liquid channel main pipe, so that the heat generated by the power transistor on the motherboard can be effectively conducted to the liquid channel main pipe and carried away by the coolant, thereby realizing liquid cooling heat dissipation of the power transistor on the motherboard and further improving the utilization efficiency of the cooling capacity of the liquid channel main pipe. 3. The first claw engages with the bottom shell, and the second claw engages with the shielding plate, so that the shielding cover, shielding plate, bottom shell and circulating liquid channel form a tight contact, thereby avoiding electromagnetic shielding failure caused by narrow gaps; 4. The heat dissipation surface of the power transistor is tightly connected to the insulating heat-conducting plate via thermally conductive adhesive, and the insulating heat-conducting plate is in turn thermally connected to the side wall of the circulating liquid channel. Compared with the traditional bottom-heat-dissipating power transistor with a single-layer aluminum substrate structure, this solution shortens the wiring path between the power transistor and the drive circuit, significantly reduces the PCB board area, and improves space utilization. 5. The bottom surface of the filter board is in direct contact with the shielding plate, and the top surface is in direct contact with the shielding cover. Furthermore, grounding layers are laid on both the upper and lower layers of the filter board to ensure the sealing and reliable grounding of the shielding cavity, effectively preventing electromagnetic interference from the filter module or external sources. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating the overall structure of the charger housing in an embodiment of this application.

[0029] Figure 2 This is a schematic diagram illustrating the structure of the shielding cover in an embodiment of this application.

[0030] Figure 3 This is a schematic diagram illustrating the overall structure of the charger in an embodiment of this application.

[0031] Figure 4 This is a schematic diagram illustrating the structure of the filter capacitor and filter inductor in an embodiment of this application. Figure 5 This is a schematic diagram illustrating the structure of the first PCB board and the insulating heat-conducting plate in an embodiment of this application.

[0032] Figure 6 This is a schematic diagram illustrating the first type of top heat dissipation power tube packaging method in an embodiment of this application.

[0033] Figure 7 This is a schematic diagram illustrating the second type of first top heat dissipation power transistor packaging method in an embodiment of this application.

[0034] Figure 8 This is a schematic diagram illustrating the structure of the second top heat dissipation power tube in an embodiment of this application.

[0035] Explanation of reference numerals in the attached drawings: 1. Bottom shell; 11. Shielding plate; 12. Top cover; 121. Cover boss; 13. Shielding cover; 131. First claw; 132. Second claw; 2. Circulating fluid channel; 21. Main fluid channel; 211. Fluid channel boss; 22. Connecting pipe; 23. Connector; 3. Filter unit mounting area; 31. AC filter area; 32. LV filter area; 33. DC filter area; 4. Power unit mounting area; 41. AC power area; 42. DC power area 5. Magnetic device mounting area; 6. Filtering module; 61. AC filter board; 62. DC filter board; 63. LV filter board; 64. Filter capacitor; 65. Filter inductor; 7. Power module; 71. First PCB board; 711. Connector; 72. First top heat dissipation power tube; 73. Insulating heat-conducting plate; 8. Main control module; 81. Second PCB board; 811. Connector slot; 82. Second top heat dissipation power tube; 83. Insulation space; 9. Magnetic device module. Detailed Implementation

[0036] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0037] This application discloses a vehicle-mounted charger housing.

[0038] like Figure 1 The on-board charger housing includes a bottom shell 1, and a circulating fluid channel 2 is provided inside the bottom shell 1; In this embodiment, the circulating liquid channel 2 includes two main liquid channel 21 and a connecting pipe 22. Both the main liquid channel 21 and the connecting pipe 22 are rectangular hollow tubes. The height of the connecting pipe 22 is less than the height of the main liquid channel 21. The connecting pipe 22 is located between the two main liquid channel 21. The connecting pipe 22 is connected to the main liquid channel 21 and is located near one end of the main liquid channel 21. The end of the main liquid channel 21 away from the connecting pipe 22 extends to one end of the bottom shell 1 and is connected to a connector 23. There is a gap between the end of the main liquid channel 21 away from its connector 23 and the bottom shell 1.

[0039] The circulating liquid channel 2 and the bottom shell 1 are connected to several shielding plates 11. The shielding plates 11, the bottom shell 1 and the circulating liquid channel 2 together separate the filter unit installation area 3 and the power unit installation area 4. The circulating liquid channel 2 and the bottom shell 1 together enclose the magnetic device installation area 5. In this embodiment, the filter unit mounting area 3 includes an AC filter area 31, an LV filter area 32, and a DC filter area 33, and the power unit mounting area 4 includes an AC power area 41 and a DC power area 42. The specific enclosure method is as follows: A shielding plate 11 is connected to the end of the main liquid channel 21 away from its connector 23. The shielding plate 11 is connected to the inner wall of the bottom shell 1. A shielding plate 11 is connected to each side of the two main liquid channel 21 that are opposite to each other. The shielding plate 11 is connected to the inner wall of the bottom shell 1. The two main liquid channel 21 share a shielding plate 11 on the opposite side. The shielding plate 11 on the opposite side of the two main liquid channel 21 is located away from the connector 23. Thus, the outer wall of a liquid channel main pipe 21, the shielding plate 11 of the outer wall of the liquid channel main pipe 21, the shielding plate 11 at the end of the liquid channel main pipe 21 and the bottom shell 1 together enclose the AC filter area 31, and the outer wall of the liquid channel main pipe 21, the shielding plate 11 of the outer wall of the liquid channel main pipe 21 and the bottom shell 1 together enclose the AC power area 41. The outer wall of another liquid channel main pipe 21, the shielding plate 11 of the outer wall of the liquid channel main pipe 21, the shielding plate 11 at the end of the liquid channel main pipe 21 and the bottom shell 1 together enclose the DC filter area 33, and the outer wall of the liquid channel main pipe 21, the shielding plate 11 of the outer wall of the liquid channel main pipe 21 and the bottom shell 1 together enclose the DC power area 42. The shielding plates 11 at the ends of the two liquid channel main pipes 21, the shielding plate 11 between the two liquid channel main pipes 21, and the housing together enclose the LV filter area 32. The shielding plate 11 between the two liquid channel mains 21 and the housing together enclose the magnetic device mounting area 5.

[0040] That is, the left front side of the bottom shell 1 is the DC filter area 33, the left rear side of the bottom shell 1 is the DC power area 42, the middle front side of the bottom shell 1 is the LV filter area 32, the middle rear side of the bottom shell 1 is the magnetic device mounting area 5, the right front side of the bottom shell 1 is the AC filter area 31, and the right rear side of the bottom shell 1 is the AC power area 41.

[0041] like Figure 2 and Figure 3 It also includes an upper cover 12 and several shielding covers 13. The shielding covers 13 are correspondingly set with the filter unit installation area 3 to close the filter unit installation area 3. The upper cover 12 and the bottom shell 1 cooperate to form a closed shell.

[0042] In this embodiment, there are three shielding covers 13. The three shielding covers 13 correspond one-to-one with the AC filter area 31, the DC filter area 33 and the LV filter area 32 respectively. Referring to Figure X, taking the shielding cover 13 corresponding to the DC filter area 33 as an example, the others are similar. The shielding cover 13 is provided with a first claw 131 and a second claw 132. The first claw 131 can be locked with the bottom shell 1, and the second claw 132 can be locked with the shielding plate 11, so that the shielding cover 13 is in close contact with the shielding plate 11, the bottom shell 1 and the liquid channel main pipe 21. The shielding cover 13 is also bolted to the bottom shell 1.

[0043] In this embodiment, the top cover 12 is sealed to the bottom shell 1 by screws and sealant. The top cover 12 has two recessed cover protrusions 121, and the top of the liquid channel main pipe 21 is provided with a liquid channel protrusion 211. The liquid channel protrusion 211 is disposed opposite to the power tube of the main board, and the cover protrusion 121 is disposed opposite to the liquid channel protrusion 211.

[0044] The implementation principle of this application embodiment is as follows: the liquid channel main pipe 21, the shielding plate 11 and the inner side wall of the bottom shell 1 work together to form the shielding boundary of the filter unit installation area 3. There is no need to set up an independent shielding shell for each filter module 6, thereby avoiding the formation of multiple layers of repeated shielding structures between adjacent filter modules 6, which is conducive to reducing the overall volume of the on-board charger. The AC filter region 31 is arranged adjacent to the AC power region 41, and the DC filter region 33 is arranged adjacent to the DC power region 42. This shortens the connection path between the filter module 6 and the corresponding power module 7, which helps to reduce parasitic parameters and reduce the area of ​​high-frequency current loops, thereby improving electromagnetic compatibility performance. Meanwhile, the magnetic device mounting area 5 and the LV filter area 32 are set between the AC filter area 31 and the DC filter area 33. By utilizing the structural and functional isolation of the magnetic device module 9, the mutual interference between the AC side and the DC side is reduced, and the LV power supply is filtered nearby after being led out from the magnetic device module 9, thereby improving the stability of low-voltage power supply. Furthermore, one liquid channel main pipe 21 exchanges heat with the components in the AC power area 41 and the AC filter area 31, while the other liquid channel main pipe 21 exchanges heat with the components in the DC power area 42 and the DC filter area 33. The two liquid channel main pipes 21 can also exchange heat with the central magnetic components. In addition, the liquid channel boss 211 makes the outer wall of the liquid channel main pipe 21 closer to the power transistor on the motherboard in space. Under the premise of ensuring electrical insulation, the heat conduction path between the power transistor and the liquid channel main pipe 21 is shortened, so that the heat generated by the power transistor on the motherboard can be effectively conducted to the liquid channel main pipe 21 and carried away by the coolant, thereby realizing liquid cooling heat dissipation of the power transistor on the motherboard and improving the cooling utilization rate of the liquid channel main pipe 21.

[0045] This application also discloses an on-board charger, which uses the on-board charger housing of this application embodiment.

[0046] like Figure 3 and Figure 4 The on-board charger includes a filter module 6, a magnetic device module 9, a power module 7, and a main control module 8. The filter module 6 is installed in the filter unit installation area 3, the magnetic device module 9 is installed in the magnetic device installation area 5, the power module 7 is installed in the power unit installation area 4, and the main control module 8 is connected to the bottom shell 1.

[0047] In this embodiment, the filtering module 6 includes an AC filter board 61, a DC filter board 62, and an LV filter board 63. The bottom of the AC filter board 61, DC filter board 62, and LV filter board 63 are all connected to a filter capacitor 64 and a filter inductor 65. The AC filter board 61, DC filter board 62, and LV filter board 63 all include multi-layer PCB boards, and the top and bottom layers of the AC filter board 61, DC filter board 62, and LV filter board 63 are all grounded, that is, a grounded copper foil layer is formed by continuously laying a large area on the top and bottom layers of the AC filter board 61, DC filter board 62, and LV filter board 63. The bottom layers of AC filter board 61, DC filter board 62 and LV filter board 63 are in contact with the corresponding shielding plate 11, that is, the corresponding shielding plate 11 supports AC filter board 61, DC filter board 62 and LV filter board 63. The top layers of AC filter board 61, DC filter board 62 and LV filter board 63 are in contact with the corresponding shielding cover 13, that is, the bottom edges of the three shielding covers 13 press against AC filter board 61, DC filter board 62 and LV filter board 63 respectively.

[0048] like Figure 3 and Figure 5 The power module 7 includes a first PCB board 71, which is arranged vertically, i.e., the first PCB board 71 is a vertical board. A first top heat dissipation power pipe 72 is installed on one side of the first PCB board 71, and a driver chip is installed on the other side of the first PCB board 71. An insulating heat-conducting plate 73 is connected to the side wall of the circulating liquid channel 2 through thermally conductive adhesive. The insulating heat-conducting plate 73 is connected to the first top heat dissipation power pipe 72 through thermally conductive adhesive.

[0049] In this embodiment, there are two first PCB boards 71, each comprising 4-6 layers. One first PCB board 71 is located within the AC power region 41, and the other is located within the DC power region 42. The first top heat dissipation power transistor 72 specifically adopts packages such as T2PAK, QDPAK, and TOLT. With the multi-layer PCB board, the power transistor and driving circuit are respectively arranged on both sides of the PCB board, shortening the wiring path while significantly reducing the board area and improving space utilization. (Refer to...) Figure 6 and Figure 7 Specifically, two packaging forms of the first top heat dissipation power tube 72 are provided; In this embodiment, the insulating heat-conducting plate 73 is specifically a ceramic sheet. In other embodiments, it can also be a composite insulating heat-conducting plate 73. The outer wall of the liquid channel main pipe 21 is fixed to the ceramic sheet with thermally conductive adhesive. The first top heat dissipation power pipe 72 is fixed to the ceramic sheet with thermally conductive adhesive, so that the ceramic sheet is close to the liquid channel main pipe 21 and the heat dissipation surface of the first top heat dissipation power pipe 72 is close to the ceramic sheet. The ceramic sheet has a thickness of 1-3 mm and a thermal conductivity of approximately 25 W / m·K. The side wall of the water channel has a thickness of 2-4 mm, and its die-cast aluminum alloy has a thermal conductivity of approximately 130 W / m·K. The overall thermal resistance is low, the heat dissipation efficiency is high, and it helps to improve power.

[0050] like Figure 3 and Figure 8 The main control module 8 includes a second PCB board 81, which is horizontally arranged, i.e., the second PCB board 81 is the main board. The second PCB board 81 is connected to the base and is located above the filter module 6, the magnetic device module 9 and the power module 7. A second top heat dissipation power pipe 82 is connected to the side of the second PCB board 81 away from the top cover 12. The second top heat dissipation power pipe 82 is directly opposite the liquid channel boss 211. An insulating space 83 is left between the second top heat dissipation power pipe 82 and the liquid channel boss 211, and the insulating space 83 is filled with thermally conductive adhesive.

[0051] In this embodiment, the second PCB board 81 includes 4-6 layers of PCB boards. The second PCB board 81 is located above the magnetic device module 9, the two first PCB boards 71, the AC filter board 61, the DC filter board 62, and the LV filter board 63. The top of the first PCB board 71 is provided with several insertion parts 711, and the second PCB board 81 is provided with several insertion slots 811. The insertion parts 711 and the insertion slots 811 correspond one-to-one, so that the first PCB board 71 and the second PCB board 81 are plugged and soldered to achieve power and signal connection. The pins of the components in the magnetic device module 9 are connected to the second PCB board 81 by soldering, and the AC filter board 61, DC filter board 62, and LV filter board 63 are connected to the second PCB board 81 by copper pillars. Two second top heat dissipation power pipes 82 are mounted on the bottom surface of the second PCB board 81. One second top heat dissipation power pipe 82 is a top heat dissipation low-voltage power pipe on the secondary side of the DC-DC converter, and the other second top heat dissipation power pipe 82 is a top heat dissipation high-voltage power pipe on the primary side of the DC-DC converter. The two second top heat dissipation power pipes 82 correspond one-to-one with the two liquid channel bosses 211 and are arranged opposite each other. The gap between the second top heat dissipation power pipes 82 and the liquid channel bosses 211 is controlled to be 0.3-1mm, thereby forming an insulating space 83. The insulating space 83 is filled with thermally conductive gel, thereby enabling the second top heat dissipation power pipes 82 to connect and conduct heat to the main liquid channel 21. On the other hand, the gap between the cover bosses 121 and the second PCB board 81 is controlled to be 0.5-2mm. The two cover bosses 121 correspond one-to-one with the second top heat dissipation power pipes 82, and the gap is filled with thermally conductive gel, allowing some of the heat from the second top heat dissipation power pipes 82 to be transferred to the upper cover 12 for dissipation.

[0052] The implementation principle of this application embodiment is as follows: the heat dissipation surface of the first top heat dissipation power tube 72 is tightly connected to the insulating heat-conducting plate 73 through thermally conductive adhesive, and the insulating heat-conducting plate 73 is thermally connected to the side wall of the circulating liquid channel 2. Compared with the traditional bottom heat dissipation power tube combined with a single-layer aluminum substrate structure, this solution shortens the wiring path between the power tube and the drive circuit, significantly reduces the PCB board area, and improves space utilization. The second top heat dissipation power tube 82 forms a direct heat conduction path through the liquid channel protrusion 211, and achieves auxiliary heat dissipation through the cover protrusion 121 of the upper cover 12, so that the side and top of the liquid channel main tube 21 and the upper cover 12 all participate in the heat dissipation of the power tube. This layout makes full use of space, achieves modular and compact arrangement, and is conducive to reducing the size of the charger and increasing power density; The bottom surface of the filter board is in direct contact with the shielding plate 11, and the top surface is in direct contact with the shielding cover 13. Furthermore, grounding layers are laid on both the upper and lower layers of the filter board to ensure the sealing and reliable grounding of the shielding cavity, effectively preventing electromagnetic interference from the filter module 6 or the outside.

[0053] In other embodiments, for different on-board chargers, such as chargers with only AC and DC sides, or chargers with only AC and LV sides, the circulating fluid channel 2 may also include a liquid cooling pipe. The liquid cooling pipe has a circulating pipeline that is connected vertically, so that coolant is discharged into the lower pipeline and then discharged from the upper pipeline.

[0054] If there is a DC side, shielding plates 11 are connected to one end and both sides of the liquid cooling pipe. The filter unit installation area 3 includes a DC filter area 33 and an AC filter area 31. The power unit installation area 4 includes a DC power area 42 and an AC power area 41. That is, the shielding plate 11 at the end of the liquid cooling pipe, the shielding plate 11 on one side of the liquid cooling pipe and the bottom shell 1 enclose the DC filter area 33. The shielding plate 11 at the end of the liquid cooling pipe, the shielding plate 11 on the other side of the liquid cooling pipe and the bottom shell 1 enclose the AC filter area 31. The shielding plate 11 on one side of the liquid cooling pipe and the bottom shell 1 enclose the DC power area 42. The shielding plate 11 on the other side of the liquid cooling pipe and the bottom shell 1 enclose the AC power area 41. Furthermore, the DC power region 42 and the AC power region 41 can be separated by a space to serve as the magnetic device mounting area 5. That is, the front left side of the bottom shell 1 is the DC filter region 33, the front right side is the AC filter region 31, the middle left side of the bottom shell 1 is the DC power region 42, the rear right side is the AC power region 41, and the rear left side of the bottom shell 1 is the magnetic device mounting area 5.

[0055] If there is no DC side, the filter unit mounting area 3 includes an LV filter area 32 and an AC filter area 31, and the power unit mounting area 4 includes an AC power area 41. Specifically, the LV filter area 32 is enclosed by the shielding plate 11 at the end of the liquid cooling pipe, the shielding plate 11 on one side of the liquid cooling pipe, and the bottom shell 1; the AC filter area 31 is enclosed by the shielding plate 11 at the end of the liquid cooling pipe, the shielding plate 11 on the other side of the liquid cooling pipe, and the bottom shell 1; the magnetic device mounting area 5 is enclosed by the shielding plate 11 on one side of the liquid cooling pipe and the bottom shell 1; and the AC power area 41 is enclosed by the shielding plate 11 on the other side of the liquid cooling pipe and the bottom shell 1. In other words, the LV filter area 32 can be located on the front left side of the bottom shell 1, the AC filter area 31 on the front right side, the magnetic device mounting area 5 on the rear left side of the bottom shell 1, and the AC power area 41 on the rear right side. The filter module 6, magnetic device module 9, power module 7, and main control module 8 can be configured according to their corresponding functional areas.

[0056] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A vehicle-mounted charger housing, characterized in that: Includes a bottom shell (1), in which a circulating liquid channel (2) is provided, and the circulating liquid channel (2) and the bottom shell (1) are connected to a plurality of shielding plates (11). The shielding plates (11), the bottom shell (1) and the circulating liquid channel (2) together separate a filter unit installation area (3) and a power unit installation area (4). The circulating liquid channel (2) and the bottom shell (1) together enclose a magnetic device installation area (5). It also includes an upper cover (12) and several shielding covers (13), the shielding covers (13) being arranged corresponding to the filter unit mounting area (3) to close the filter unit mounting area (3), and the upper cover (12) and the bottom shell (1) cooperating to form a closed shell.

2. The on-board charger housing according to claim 1, characterized in that: The circulating liquid channel (2) includes two main liquid channel pipes (21), which are connected by a connecting pipe (22). The ends and opposite sides of the two main liquid channel pipes (21) are connected to the shielding plate (11), and the opposite sides of the two main liquid channel pipes (21) are also connected to a shielding plate (11). The filter unit installation area (3) includes an AC filter area (31), an LV filter area (32) and a DC filter area (33), and a plurality of shielding covers (13) correspond one-to-one with the AC filter area (31), the LV filter area (32) and the DC filter area (33). The power unit installation area (4) includes an AC power area (41) and a DC power area (42). The AC filter region (31) and the AC power region (41) are formed by one of the liquid channel mains (21) and its corresponding shielding plate (11), the DC filter region (33) and the DC power region (42) are formed by another liquid channel main (21) and its corresponding shielding plate (11), and the LV filter region (32) and the magnetic device mounting region (5) are formed by the shielding plate (11) between the two liquid channel mains (21) and the liquid channel mains (21).

3. The on-board charger housing according to claim 2, characterized in that: The top of the main liquid channel (21) is provided with a liquid channel boss (211), which is disposed opposite to the power transistor of the main board.

4. The on-board charger housing according to claim 3, characterized in that: The upper cover (12) has a recessed cover protrusion (121), which is disposed opposite to the liquid channel protrusion (211).

5. The on-board charger housing according to claim 1, characterized in that: The drain end and the inlet end of the circulating liquid channel (2) are both connected to a connector (23). The filter unit installation area (3) is located inside one end of the bottom shell (1). The connector (23) is connected to the end of the bottom shell (1) away from the filter unit installation area (3).

6. The on-board charger housing according to claim 1, characterized in that: The shielding cover (13) is provided with a first claw (131) and a second claw (132). The first claw (131) can be clamped with the bottom shell (1), and the second claw (132) can be clamped with the shielding plate (11), so that the shielding cover (13) is in close contact with the shielding plate (11), the bottom shell (1) and the circulating liquid channel (2).

7. An on-board charger, characterized in that: The on-board charger housing according to any one of claims 3 or 4 further includes a filter module (6), a magnetic device module (9), a power module (7), and a main control module (8). The filter module (6) is installed in the filter unit mounting area (3), the magnetic device module (9) is installed in the magnetic device mounting area (5), the power module (7) is installed in the power unit mounting area (4), and the main control module (8) is connected to the bottom shell (1). The power module (7) includes a first PCB board (71), which is arranged vertically. A first top heat dissipation power pipe (72) is installed on one side of the first PCB board (71), and a driver chip is installed on the other side of the first PCB board (71). An insulating heat-conducting plate (73) is connected to the side wall of the circulating liquid channel (2) through thermally conductive adhesive. The insulating heat-conducting plate (73) is connected to the first top heat dissipation power pipe (72) through thermally conductive adhesive. The first PCB board (71) includes a multilayer PCB board.

8. The on-board charger according to claim 7, characterized in that: The main control module (8) includes a second PCB board (81), which is arranged horizontally and connected to the bottom shell (1). The second PCB board (81) is located above the filter module (6), the magnetic device module (9), and the power module (7). A second top heat dissipation power pipe (82) is connected to the side of the second PCB board (81) away from the top cover (12). The second top heat dissipation power pipe (82) is directly opposite the liquid channel boss (211). An insulating space (83) is left between the second top heat dissipation power pipe (82) and the liquid channel boss (211). The insulating space (83) is filled with thermally conductive adhesive. The second PCB board (81) includes a multilayer PCB board.

9. The on-board charger according to claim 8, characterized in that: The first PCB board (71) has a plug-in part (711) on its top, and the second PCB board (81) has a plug-in slot (811) on its top. The plug-in slot (811) corresponds to the plug-in part (711) one by one. The plug-in slot (811) is inserted into the corresponding plug-in part (711) and soldered.

10. The on-board charger according to claim 7, characterized in that: The filtering module (6) includes an AC filter board (61), a DC filter board (62), and an LV filter board (63). The top and bottom layers of the AC filter board (61), the DC filter board (62), and the LV filter board (63) are all grounded. The bottom layers of the AC filter board (61), the DC filter board (62), and the LV filter board (63) are in contact with the corresponding shielding plate (11), and the top layers of the AC filter board (61), the DC filter board (62), and the LV filter board (63) are in contact with the corresponding shielding cover (13).

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