Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a first conductive layer, a blocking part, a first insulating layer, an isolation structure and a light-emitting layer, the first conductive layer is arranged on one side of the substrate, and the first conductive layer comprises a first conductive part located in the non-display area; the blocking part is arranged on the side, away from the substrate, of the first conductive part, a receding hole is formed in the blocking part, and at least part of the first conductive part is exposed out of the receding hole; the first insulating layer is arranged on the side, away from the substrate, of the first conducting layer, a first opening is formed in the first insulating layer, and the orthographic projection of the first opening on the substrate and the orthographic projection of the receding hole on the substrate are at least partially overlapped; the isolation structure is arranged on the side, away from the substrate, of the first insulation layer, and the isolation structure encloses a plurality of isolation openings in the display area; the light-emitting layer comprises a plurality of light-emitting units, and the light-emitting units are at least partially located in the isolation openings. The reliability and the use performance of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the reliability of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the same, and a display device, aiming to improve the reliability of OLED display products.

[0005] A first aspect of this application provides a display panel having a display area and a non-display area located on at least one side of the display area. The display panel includes a substrate, a first conductive layer, a blocking portion, a first insulating layer, an isolation structure, and a light-emitting layer. The first conductive layer is disposed on one side of the substrate and includes a first conductive portion located in the non-display area. The blocking portion is disposed on the side of the first conductive portion away from the substrate and has a clearance hole that exposes at least a portion of the first conductive portion. The first insulating layer is disposed on the side of the first conductive layer away from the substrate and has a first opening that at least partially overlaps the orthographic projection of the first opening onto the substrate with the orthographic projection of the clearance hole onto the substrate. The isolation structure is disposed on the side of the first insulating layer away from the substrate and encloses a plurality of isolation openings in the display area. The light-emitting layer includes a plurality of light-emitting units, at least a portion of which are located within the isolation openings.

[0006] According to an embodiment of the first aspect of this application, the orthographic projection of the blocking portion on the substrate is located within the orthographic projection of the first conductive portion on the substrate.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the material of the blocking portion includes a metal oxide.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the metal oxide includes at least one of IGZO, IAZO, ITZO, IATZO, and IGO.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the blocking portion on the substrate and the orthographic projection of the first insulating layer on the substrate at least partially overlap.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the blocking portion on the substrate is located within the orthographic projection of the first insulating layer on the substrate.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the first insulating layer includes a planarization layer and a pixel definition layer disposed on the side of the planarization layer away from the substrate. The first opening includes a first sub-opening and a second sub-opening. The planarization layer forms the first sub-opening, and the pixel definition layer forms the second sub-opening. The orthographic projection of the first sub-opening onto the substrate and the orthographic projection of the second sub-opening onto the substrate at least partially overlap.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the second sub-opening onto the substrate is located within the orthographic projection of the first sub-opening onto the substrate.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure is located on the side of the pixel definition layer away from the substrate, or a clearance opening is provided on the pixel definition layer, and the isolation structure is located within the clearance opening.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the planarization layer includes a first sidewall facing the first sub-opening, and the pixel definition layer includes a covering portion located on the side of the first sidewall facing the first sub-opening, the covering portion at least covering a portion of the first sidewall.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the covering portion encloses to form a second sub-opening.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the end of the covering portion facing the substrate is connected to the blocking portion.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the first insulating layer further includes a protective portion, at least a portion of which is disposed between the planarization layer and the first conductive portion.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the protective portion on the substrate and the orthographic projection of the covering portion on the substrate at least partially overlap.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the first conductive portion has a first bottom surface facing the substrate, a first top surface facing away from the first bottom surface, and a first side surface connecting the first top surface and the first bottom surface, and the protective portion at least covers at least a portion of the first side surface of the first conductive portion.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the protective portion includes a vertical segment and a horizontal segment connected to each other, the vertical segment being disposed between the planarization layer and the first conductive portion, and the horizontal segment being disposed on the side of the blocking portion away from the substrate.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the side surface of the horizontal segment facing away from the substrate is connected to the cover portion.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the material of the protection part includes inorganic materials.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the first opening further includes a third sub-opening, the protective portion forming the third sub-opening, and the orthographic projection of the third sub-opening onto the substrate at least partially overlaps with the orthographic projection of the second sub-opening onto the substrate.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the third sub-opening onto the substrate is located within the orthographic projection of the second sub-opening onto the substrate.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the orthogonal projection of the blocking portion onto the substrate is located within the orthogonal projection of the protective portion onto the substrate.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a first electrode layer disposed between the pixel definition layer and the planarization layer. The first electrode layer includes a first electrode located in the display area. The pixel definition layer surrounds and forms a pixel opening. The first electrode is exposed to the pixel opening. The orthographic projection of the isolation opening on the substrate and the orthographic projection of the pixel opening on the substrate at least partially overlap.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the first conductive layer includes a second conductive portion located within the display area, wherein the orthographic projection of the second conductive portion onto the substrate at least partially overlaps with the orthographic projection of the first electrode onto the substrate.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the second conductive portion is electrically connected to the first electrode.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the light-emitting layer is located on the side of the first electrode layer away from the substrate, and the light-emitting unit is at least partially disposed within the pixel opening.

[0030] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second electrode layer located on the side of the light-emitting layer away from the substrate, the second electrode layer including a second electrode disposed within an isolation opening.

[0031] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a conductive structure, and the second electrode is electrically connected to the conductive structure.

[0032] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0033] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

[0034] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a first encapsulation layer located on the side of the light-emitting layer away from the substrate, the first encapsulation layer including an encapsulation portion for encapsulating the light-emitting unit.

[0035] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer facing away from the substrate.

[0036] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes inorganic materials, and / or the material of the second encapsulation layer includes organic materials.

[0037] The first aspect of this application also provides a display panel having a display area and a non-display area located on at least one side of the display area. The display panel includes a substrate, a first conductive layer, a planarization layer, a pixel definition layer, and an isolation structure. The first conductive layer is disposed on one side of the substrate and includes a first conductive portion located in the non-display area. The planarization layer is disposed on the side of the first conductive layer away from the substrate and has a first sub-opening for exposing at least a portion of the first conductive layer. The pixel definition layer is disposed on the side of the planarization layer away from the substrate and has a second sub-opening. The orthographic projection of the first sub-opening onto the substrate and the orthographic projection of the second sub-opening onto the substrate at least partially overlap. The isolation structure is disposed on one side of the substrate and encloses a plurality of isolation openings in the display area. The planarization layer includes a first sidewall facing the first sub-opening, and the pixel definition layer includes a covering portion located on the side of the first sidewall facing the first sub-opening, and the covering portion at least partially covers the first sidewall.

[0038] According to an embodiment of the first aspect of this application, the orthographic projection of the second sub-opening onto the substrate is located within the orthographic projection of the first sub-opening onto the substrate.

[0039] According to any of the foregoing embodiments of the first aspect of this application, the covering portion encloses to form a second sub-opening.

[0040] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a protective portion, at least a portion of which is disposed between the planarization layer and the first conductive portion.

[0041] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the protective portion on the substrate and the orthographic projection of the covering portion on the substrate at least partially overlap.

[0042] According to any of the foregoing embodiments of the first aspect of this application, the first conductive portion has a first bottom surface facing the substrate, a first top surface facing away from the first bottom surface, and a first side surface connecting the first top surface and the first bottom surface, and the protective portion at least covers at least a portion of the first side surface of the first conductive portion.

[0043] According to any of the foregoing embodiments of the first aspect of this application, the protective portion includes a vertical segment and a horizontal segment connected to each other, the vertical segment being disposed between the planarization layer and the first conductive portion, and the horizontal segment being disposed on the side of the first conductive portion away from the substrate.

[0044] According to any of the foregoing embodiments of the first aspect of this application, the side surface of the horizontal segment facing away from the substrate is connected to the cover portion.

[0045] According to any of the foregoing embodiments of the first aspect of this application, the material of the protection part includes inorganic materials.

[0046] According to any of the foregoing embodiments of the first aspect of this application, the protective portion is formed with a third sub-opening, and the orthographic projection of the third sub-opening onto the substrate at least partially overlaps with the orthographic projection of the second sub-opening onto the substrate.

[0047] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the third sub-opening onto the substrate is located within the orthographic projection of the second sub-opening onto the substrate.

[0048] A second aspect of this application also provides a method for manufacturing a display panel, the display panel having a display area and a non-display area located on at least one side of the display area, the manufacturing method comprising:

[0049] A first conductive layer is formed on one side of the substrate, the first conductive layer including a first conductive portion located in the non-display area;

[0050] A barrier material layer is formed on the side of the first conductive layer that faces away from the substrate;

[0051] A first insulating material layer is formed on the side of the barrier material layer away from the first conductive layer, and the first insulating material layer is patterned to form a first opening located in the non-display area.

[0052] An isolation structure is fabricated on the side of the first insulating material layer away from the substrate, and the isolation structure encloses and forms multiple isolation openings located in the display area;

[0053] A fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the fabrication material layer and the barrier material layer are patterned so that the fabrication material layer forms a light-emitting unit and an encapsulation portion, the barrier material layer forms a barrier portion, the barrier portion forms a clearance hole, the clearance hole exposes at least a portion of the first conductive portion, and the first opening communicates with the clearance hole.

[0054] According to an embodiment of the second aspect of this application, the fabrication material layer includes a first fabrication material layer, a second fabrication material layer, and a third fabrication material layer. The fabrication material layer is formed on the side of the isolation structure and the isolation opening facing away from the substrate. The fabrication material layer and the barrier material layer are patterned to form a light-emitting unit and an encapsulation portion in the fabrication material layer, a barrier portion in the barrier material layer, and a clearance hole in the barrier portion, exposing at least a portion of the first conductive portion. The first opening communicates with the clearance hole. The steps include:

[0055] A first fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the first fabrication material layer is patterned to form a first light-emitting unit and a first encapsulation part;

[0056] A second fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the second fabrication material layer is patterned to form a second light-emitting unit and a second encapsulation part;

[0057] A third fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the third fabrication material layer and the barrier material layer are patterned so that the third fabrication material layer forms a third light-emitting unit and a third encapsulation part, the barrier material layer forms a barrier part, the barrier part forms a clearance hole, the clearance hole exposes at least a portion of the first conductive part, and the first opening communicates with the clearance hole.

[0058] According to any of the foregoing embodiments of the second aspect of this application, the third fabrication material layer includes a third light-emitting material layer and a third encapsulation material layer. The third fabrication material layer is formed on the side of the isolation structure and isolation opening facing away from the substrate. The third fabrication material layer and the barrier material layer are patterned to form a third light-emitting unit and a third encapsulation portion in the third fabrication material layer, and a barrier portion in the barrier material layer. The barrier portion forms a clearance hole, and the clearance hole exposes at least a portion of the first conductive portion. The first opening communicates with the clearance hole. The steps include:

[0059] The third encapsulation material layer is patterned to form the third encapsulation part;

[0060] The third light-emitting material layer and the blocking material layer are patterned so that the third light-emitting material layer forms a third light-emitting unit, the blocking material layer forms a blocking portion, the blocking portion forms a clearance hole, and the clearance hole exposes at least a portion of the first conductive portion.

[0061] According to any of the foregoing embodiments of the second aspect of this application, the process of patterning the third encapsulation material layer to form the third encapsulation portion includes a dry etching process.

[0062] According to any of the foregoing embodiments of the second aspect of this application, the process for patterning the third luminescent material layer and the blocking material layer includes a dry etching process.

[0063] An embodiment of the third aspect of this application provides a display device, which includes the display panel provided in any of the first aspect embodiments described above.

[0064] According to an embodiment of this application, the display panel includes a substrate, a first conductive layer, a barrier portion, a first insulating layer, an isolation structure, and a light-emitting layer. The barrier material layer used to fabricate the barrier portion can prevent damage to the first conductive portion from the etching process during the fabrication of the light-emitting layer. Furthermore, after the etching process, the barrier material layer is etched through to form the barrier portion and clearance holes, facilitating electrical connection between the first conductive portion and other conductive structures. This protects the integrity of the first conductive layer structure and reduces damage to the first conductive portion. In this embodiment, the first conductive portion is covered and shielded by the barrier material layer used to fabricate the barrier portion. In subsequent etching processes, the barrier material layer can protect the first conductive portion, thereby reducing the risk of etching damage and improving the integrity of the first conductive portion, ultimately enhancing the reliability and performance of the display panel. Attached Figure Description

[0065] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0066] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0067] Figure 2 yes Figure 1 Enlarged view of section A;

[0068] Figure 3 This is a schematic cross-sectional view of the display area of ​​a display panel provided in an embodiment of this application;

[0069] Figure 4 This is one of the cross-sectional structural diagrams of the non-display area of ​​a display panel provided in the embodiments of this application;

[0070] Figure 5 This is a schematic cross-sectional view of the display area of ​​a display panel when no light-emitting unit is fabricated, according to an embodiment of this application.

[0071] Figure 6 This is one of the schematic cross-sectional views of the non-display area of ​​a display panel when no light-emitting unit is fabricated, provided in an embodiment of this application.

[0072] Figure 7 This is a second schematic cross-sectional view of the non-display area of ​​a display panel provided in an embodiment of this application;

[0073] Figure 8 This is the second schematic diagram of the cross-sectional structure of the non-display area of ​​a display panel when no light-emitting unit is fabricated, provided in an embodiment of this application;

[0074] Figure 9 This is a partial cross-sectional structural diagram of the display area and non-display area of ​​a display panel when no light-emitting unit is fabricated, provided in an embodiment of this application;

[0075] Figure 10 This is a partial cross-sectional structural diagram of the display area and non-display area of ​​a display panel provided in an embodiment of this application;

[0076] Figure 11 This is a cross-sectional structural diagram of the display area of ​​a display panel provided in another embodiment of this application;

[0077] Figure 12 This is a cross-sectional structural diagram of the display area of ​​a display panel provided in another embodiment of this application;

[0078] Figure 13 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0079] Explanation of reference numerals in the attached figures:

[0080] 100. Display area; 200. Non-display area;

[0081] 1. Substrate; 11. First conductive layer; 111. First conductive portion; 112. Second conductive portion;

[0082] 2. First insulating layer; 20. First opening; 201. First sub-opening; 202. Second sub-opening; 203. Third sub-opening; 12. Blocking portion; 120. Blocking material layer; 121. Clearance hole; 21. Planarization layer; 211. First sidewall; 22. Pixel definition layer; 220. Pixel opening; 221. Covering portion; 23. Protective portion; 231. Vertical segment; 232. Horizontal segment;

[0083] 3. Isolation structure; 30. Isolation opening; 31. First isolation section; 32. Second isolation section; 33. Third isolation section;

[0084] 41. Light-emitting layer; 411. Light-emitting unit; 42. First electrode layer; 421. First electrode; 43. Second electrode layer; 431. Second electrode;

[0085] 5. First encapsulation layer; 51. Encapsulation part; 7. Second encapsulation layer; 8. Third encapsulation layer. Detailed Implementation

[0086] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0087] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0088] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0089] In some display panels, due to the presence of isolation structures, precision masks can be eliminated during the fabrication of light-emitting units (LEDs). These isolation structures separate the light-emitting material into LEDs. When fabricating LEDs of different colors, the first color of light-emitting material is first deposited across the entire surface, allowing it to fall into multiple isolation openings and be encapsulated. Then, a portion of the encapsulation material and the first color of light-emitting material in some isolation openings are etched away, leaving the first color of light-emitting material in some openings and the encapsulation material covering those openings, forming LEDs of the first color. This process is repeated to form LEDs of the second and third colors. However, the etching process, particularly the removal of some encapsulation material and the first color of light-emitting material from some isolation openings, can affect the film layer and conductive structure in non-display areas. This effect is further exacerbated during the subsequent fabrication of other color LEDs by repeating the etching steps, leading to damage to the conductive structure, reduced reliability, and ultimately, impacting the performance of the display panel.

[0090] To address the aforementioned issues, this application provides a display panel, a method for manufacturing the same, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, its manufacturing method, and the display device.

[0091] Please refer to the following: Figures 1 to 6 The first aspect of this application provides a display panel having a display area 100 and a non-display area 200 located on at least one side of the display area 100. The display panel includes a substrate 1, a first conductive layer 11, a blocking portion 12, a first insulating layer 2, an isolation structure 3, and a light-emitting layer 41. The first conductive layer 11 is disposed on one side of the substrate 1 and includes a first conductive portion 111 located in the non-display area 200. The blocking portion 12 is disposed on the side of the first conductive portion 111 facing away from the substrate 1, and the blocking portion 12 has a clearance hole 121. The clearance hole 121 exposes at least a portion of the first conductive portion 111; the first insulating layer 2 is disposed on the side of the first conductive layer 11 away from the substrate 1, and the first insulating layer 2 has a first opening 20, the orthographic projection of the first opening 20 on the substrate 1 and the orthographic projection of the clearance hole 121 on the substrate 1 at least partially overlap; the isolation structure 3 is disposed on the side of the first insulating layer 2 away from the substrate 1, and the isolation structure 3 encloses and forms a plurality of isolation openings 30 in the display area 100; the light-emitting layer 41 includes a plurality of light-emitting units 411, and the light-emitting units 411 are at least partially located in the isolation openings 30.

[0092] Optionally, the above structure can be referenced in the orthogonal projection direction of substrate 1. Figure 3 The Z-axis direction can also be the thickness direction of the display panel.

[0093] Reference Figure 4The first conductive layer 11 is a film layer disposed on one side of the substrate 1 and comprising a conductive material. The first conductive layer 11 includes a first conductive portion 111 located within the non-display area 200. The first conductive portion 111 is a conductive structure used to achieve electrical connection. It should be noted that the first conductive layer 11 may only include the first conductive portion 111, that is, the first conductive layer 11 is completely located within the non-display area 200 and outside the display area 100. Alternatively, in addition to including the first conductive portion 111 located within the non-display area 200, the first conductive layer 11 may also include other conductive structures located within the display area 100. The specific layout of the conductive structures within the first conductive layer 11 is not limited in the embodiments of this application.

[0094] Optionally, the first conductive layer 11 may include an anode layer, that is, an anode structure may be provided within the first conductive layer 11. Alternatively, the first conductive layer 11 may also be another conductive layer located on the side of the anode layer facing the substrate 1.

[0095] Optionally, the first conductive portion 111 is used for electrical connection with other signal lines, including power supply voltage signal lines, data voltage signal lines, etc., or the first conductive portion 111 serves as a pin for electrical connection with a flexible circuit board or integrated circuit. The first opening 20 and the clearance hole 121 are formed to facilitate electrical connection between the first conductive portion 111 and other conductive structures.

[0096] Optionally, the first conductive part 111 can be a Ti / Al / Ti (titanium / aluminum / titanium) three-layer metal composite material. If the Ti on the top is damaged, Al will combine with oxygen in the environment to form Al2O3, which will result in high contact resistance when the first conductive part 111 is electrically connected. This may lead to wire burn due to electrochemical reaction, or even corrosion causing wire breakage, and vertical bright lines on the display panel.

[0097] In a display panel provided in this application embodiment, the display panel includes a substrate 1, a first conductive layer 11, a blocking portion 12, a first insulating layer 2, an isolation structure 3, and a light-emitting layer 41. Figure 3 The image shows the display area structure after the light-emitting layer 41 has been fabricated. Figure 4 The diagram shows the structure of the blocking portion 12 after the light-emitting layer 41 has been fabricated. Figure 5 The diagram shows the structure of the display area before the fabrication of the light-emitting layer 41. Figure 6The diagram shows the structure of the barrier material layer 120 before the fabrication of the light-emitting layer 41. The barrier material layer 120, used to fabricate the barrier portion 12, can prevent damage to the first conductive portion 111 during the etching process of fabricating the light-emitting layer 41. Furthermore, after the etching process, the barrier material layer 120 is etched through to replace the first conductive layer 11, forming the barrier portion 12 and the clearance hole 121 to facilitate electrical connection between the first conductive portion 111 and other conductive structures. This protects the integrity of the first conductive layer 11 structure and reduces damage to the first conductive portion 111. Even if slight damage to the top Ti occurs, it can still prevent oxygen in the air from reacting with Al to form Al2O3. In this embodiment, the first conductive portion 111 is covered and shielded by the barrier material layer 120 used to fabricate the barrier portion 12. In subsequent etching processes, the barrier material layer 120 can protect the first conductive portion 111, thereby reducing the risk of etching damage to the first conductive portion 111, improving its integrity, and ultimately enhancing the reliability and performance of the display panel.

[0098] Optional, such as Figure 2 As shown, the isolation structure 3 can be in the form of a grid to facilitate the division of sub-pixels in the display panel. The hollowed-out areas in the grid-shaped isolation structure 3 can be isolation openings 30.

[0099] Optional, refer to Figure 3 The display panel includes a light-emitting layer 41, which includes multiple light-emitting units 411. The light-emitting units 411 are used to realize the light-emitting display of the display panel.

[0100] An isolation structure 3 is disposed on one side of the substrate 1 and encloses an isolation opening 30. The isolation opening 30 is used to accommodate the light-emitting unit 411. The isolation structure 3 can be used to divide the sub-pixels of the display panel. The isolation structure 3 is disposed on the substrate 1 and encloses multiple isolation openings 30, which can isolate the light-emitting layer 41 to form mutually disconnected light-emitting units 411, thereby reducing crosstalk of charge carriers in the light-emitting layer 41, improving the display effect of the display panel, and eliminating the need for a precision mask to fabricate the light-emitting unit 411, thus reducing the development and use of precision masks and lowering the fabrication cost.

[0101] The composition and preparation of the isolation structure 3 are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 for reference.

[0102] Reference Figure 4 or Figure 7In some embodiments, the orthographic projection of the blocking portion 12 onto the substrate 1 lies within the orthographic projection of the first conductive portion 111 onto the substrate 1. In these embodiments, the blocking material layer 120 for fabricating the blocking portion 12 is formed only on the side of the first conductive portion 111 facing away from the substrate 1 during fabrication, protecting the top surface of the first conductive portion 111, improving the problem of etching damage to the top surface of the first conductive portion 111, and simultaneously simplifying the fabrication process and saving fabrication materials.

[0103] Optionally, the outer edge of the orthographic projection of the blocking portion 12 onto the substrate 1 can coincide with the outer edge of the orthographic projection of the first conductive portion 111 onto the substrate 1, which allows the blocking portion 12 and the first conductive portion 111 to use the same set of photomasks, further simplifying the process steps and saving manufacturing costs.

[0104] Optionally, the material of the blocking portion 12 includes a metal oxide. Metal oxides have better resistance to dry etching and provide better protection for the first conductive portion 111. For example, the metal oxide may include at least one of IGZO (indium gallium zinc oxide), IAZO (indium aluminum zinc oxide), ITZO (indium tin zinc oxide), IATZO (indium aluminum tin zinc oxide), and IGO (indium gallium oxide).

[0105] Reference Figure 4 or Figure 7 In some embodiments, the orthographic projection of the blocking portion 12 onto the substrate 1 at least partially overlaps with the orthographic projection of the first insulating layer 2 onto the substrate 1. That is, at least a portion of the first insulating layer 2 covers directly above the blocking portion 12, and the blocking portion 12 can maintain good integrity in the areas covered by the first insulating layer 2. In this embodiment, the blocking portion 12 can protect the sides of the first insulating layer 2, thereby improving the integrity of the sides of the first insulating layer 2 and making its coverage and protection effect on the sides of the first conductive layer 11 better.

[0106] Optionally, the orthographic projection of the blocking portion 12 onto the substrate 1 lies within the orthographic projection of the first insulating layer 2 onto the substrate 1. That is, the first insulating layer 2 covers the blocking portion 12 directly above it, enabling the blocking portion 12 to maintain better integrity. In the thickness direction at this location, a multi-protective structure of the blocking portion 12 and the first insulating layer 2 is formed, thereby reducing the risk of the first conductive portion 111 being etched and damaged, and improving the reliability of the display panel.

[0107] Reference Figure 3In some embodiments, the display panel further includes a first electrode layer 42 and a second electrode layer 43. The first electrode layer 42 includes a first electrode 421 disposed between the substrate 1 and the light-emitting unit 411. The second electrode layer 43 includes a second electrode 431 located between the light-emitting unit 411 and the encapsulation portion 51. One of the first electrode 421 and the second electrode 431 can serve as an anode, and the other can serve as a cathode to drive the light-emitting unit 411 to emit light. In this embodiment, the first electrode 421 is used as the anode of the display panel, and the second electrode 431 is used as the cathode of the display panel for illustrative purposes.

[0108] Optionally, the orthographic projection of the first electrode 421 onto the substrate 1 at least partially overlaps with the orthographic projection of the isolation opening 30 onto the substrate 1. By fabricating the light-emitting unit 411 and the second electrode 431 within the isolation opening 30, the light-emitting unit 411 can be driven to emit light through the first electrode 421 and the second electrode 431.

[0109] Optionally, the light-emitting unit 411 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).

[0110] Optionally, the material of the isolation structure 3 includes a conductive material, and the second electrode 431 is connected to the isolation structure 3. The isolation structure 3 separates the second electrode layer 43 to form mutually spaced second electrodes 431. The mutually spaced second electrodes 431 are electrically connected through the isolation structure 3 to form a full-surface electrode, ensuring the normal light emission of the light-emitting unit 411.

[0111] Optionally, the isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 located on the side of the first isolation portion 31 facing away from the substrate 1. The orthographic projection of the first isolation portion 31 onto the substrate 1 lies within the orthographic projection of the second isolation portion 32 onto the substrate 1. The orthographic projection area of ​​the second isolation portion 32 is larger than that of the first isolation portion 31. The second isolation portion 32 covers the surface of the first isolation portion 31 near the second isolation portion 32. At this time, the first isolation portion 31 is recessed relative to the second isolation portion 32 in a direction away from the isolation opening 30. When the light-emitting layer 41 is fabricated, the light-emitting layer 41 has a large drop at the edge of the isolation opening 30, and the first isolation portion 31 is recessed relative to the second isolation portion 32. The light-emitting layer 41 is difficult to connect at the edge of the isolation opening 30, resulting in breakage. The breakage of the light-emitting layer 41 forms mutually disconnected light-emitting units 411.

[0112] Optionally, the material of the first isolation portion 31 may include a conductive material, and the second electrode 431 may be connected to the first isolation portion 31, so that the second electrodes 431 of adjacent sub-pixels can be electrically connected through the first isolation portion 31.

[0113] Optionally, when depositing the light-emitting layer 41 and the second electrode layer 43 of the display panel, the second sub-layer can block at least part of the material used to prepare the light-emitting layer 41 and the second electrode layer 43, so as to isolate the light-emitting layer 41 and the second electrode layer 43 between adjacent sub-pixels, and facilitate the formation of multiple spaced light-emitting units 411 located in the isolation opening 30 and multiple spaced second electrodes 431 located in the isolation opening 30. This eliminates the need to set a high-precision mask when depositing the light-emitting layer 41 and the second electrode layer 43 of the display panel. For example, it eliminates the need to set a high-precision metal mask (FMM) when depositing the light-emitting layer 41 and the second electrode layer 43, thereby reducing the production cost of the display panel.

[0114] In some embodiments, such as Figure 11 As shown, the isolation structure 3 also includes a third isolation portion 33 located on the side of the first isolation portion 31 facing the substrate 1. The orthographic projection of the first isolation portion 31 onto the substrate 1 lies within the orthographic projection of the third isolation portion 33 onto the substrate 1. The third isolation portion 33 protrudes from the first isolation portion 31 toward the isolation opening 30. Optionally, the material of the third isolation portion 33 may include a conductive material, and the second electrode 431 may be connected to the third isolation portion 33, so that the second electrodes 431 of adjacent sub-pixels can be electrically connected through the third isolation portion 33. By setting the third isolation portion 33 to protrude from the first isolation portion 31 toward the isolation opening 30, the third isolation portion 33 can have a larger size to facilitate connection with the second electrode 431.

[0115] Combined with reference Figure 3 and Figure 4 In some embodiments, the first insulating layer 2 includes a planarization layer 21 and a pixel definition layer 22 disposed on the side of the planarization layer 21 away from the substrate 1. The first opening 20 includes a first sub-opening 201 and a second sub-opening 202. The planarization layer 21 forms the first sub-opening 201, and the pixel definition layer 22 forms the second sub-opening 202. The orthographic projection of the first sub-opening 201 on the substrate 1 and the orthographic projection of the second sub-opening 202 on the substrate 1 at least partially overlap.

[0116] Optionally, the pixel defining layer 22 encloses a pixel opening 220, the orthographic projection of the pixel opening 220 onto the substrate 1 at least partially overlaps with the orthographic projection of the isolation opening 30 onto the substrate 1, and the light-emitting unit 411 is at least partially located within the pixel opening 220. The pixel opening 220 exposes the first electrode 421, so that the light-emitting unit 411 formed within the pixel opening 220 can be electrically connected to the first electrode 421. The relative positional relationship between the isolation structure 3 and the pixel defining layer 22 can be configured in various ways. For example, the isolation structure 3 can be located on the side of the pixel defining layer 22 facing away from the substrate 1, or the pixel defining layer 22 has a clearance opening, and the isolation structure 3 can be located within the clearance opening.

[0117] In these embodiments, by providing a planarization layer 21 under the pixel definition layer 22, the flatness of the pixel definition layer 22 can be improved, which is beneficial for the fabrication of the light-emitting unit 411. The orthographic projection of the first sub-opening 201 on the substrate 1 and the orthographic projection of the second sub-opening 202 on the substrate 1 at least partially overlap. This can be understood as follows: the orthographic projection of the first sub-opening 201 on the substrate 1 is located within the orthographic projection of the second sub-opening 202 on the substrate 1; or the orthographic projection of the second sub-opening 202 on the substrate 1 is located within the orthographic projection of the first sub-opening 201 on the substrate 1; or, there is a non-overlapping portion between the orthographic projections of the first sub-opening 201 on the substrate 1 and the orthographic projection of the second sub-opening 202 on the substrate 1. In this embodiment, the first sub-opening 201 and the second sub-opening 202 are connected to expose the clearance hole 121 so that the first conductive part 111 can be electrically connected to other conductive structures.

[0118] Reference Figure 4 In some embodiments, the orthographic projection of the second sub-opening 202 onto the substrate 1 lies within the orthographic projection of the first sub-opening 201 onto the substrate 1. That is, at least a portion of the pixel definition layer 22 covers the sidewall of the planarization layer 21 facing the first sub-opening 201, allowing the pixel definition layer 22 to protect the planarization layer 21 from its top surface and sidewalls, thereby preventing etching damage to the planarization layer 21 and reducing gaps in the planarization layer 21. Optionally, the pixel definition layer 22 may be made of inorganic materials. This embodiment increases the ability to encapsulate the planarization layer 21 without layers, reduces water and oxygen intrusion into the planarization layer 21, and improves the reliability of the display panel.

[0119] Optionally, the planarization layer 21 includes a first sidewall 211 facing the first sub-opening 201, and the pixel definition layer 22 includes a cover portion 221 located on the side of the first sidewall 211 facing the first sub-opening 201, with the cover portion 221 at least partially covering the first sidewall 211. The cover portion 221, by at least partially covering the first sidewall 211, can protect the planarization layer 21 at the first sidewall 211, preventing etching damage to the first sidewall 211 and improving encapsulation capabilities, while reducing the intrusion of water and oxygen from the first sidewall 211 into the planarization layer 21.

[0120] Optionally, the cover portion 221 encloses to form a second sub-opening 202. The second sub-opening 202 is formed by the cover portion 221, so that the cover portion 221 can more completely surround and cover the first sidewall 211, further improving the protective effect of the pixel definition layer 22.

[0121] Optionally, the end of the cover portion 221 facing the substrate 1 is connected to the blocking portion 12. That is, the bottom of the cover portion 221 is connected to the blocking portion 12 to jointly protect the first sidewall 211 and improve the protection effect.

[0122] See Figure 7 and Figure 8 , Figure 7 This is a second schematic cross-sectional view of the non-display area of ​​a display panel provided in an embodiment of this application; Figure 8 This is the second schematic diagram of the cross-sectional structure of the non-display area of ​​a display panel when no light-emitting unit is fabricated, provided in an embodiment of this application.

[0123] like Figure 7 As shown, in some embodiments, the first insulating layer 2 further includes a protective portion 23, at least partially disposed between the planarization layer 21 and the first conductive portion 111. The protective portion 23 can protect the sidewalls of the planarization layer 21 and the first conductive portion 111 respectively, preventing etching damage to the planarization layer 21 and reducing gaps in the planarization layer 21. Optionally, the material of the protective portion 23 includes inorganic materials, thereby increasing the layerless encapsulation capability of the planarization layer 21, reducing the intrusion of water and oxygen from the sidewalls of the planarization layer 21, and improving the reliability of the display panel. Optionally, the inorganic material can be a silicon nitride compound or a silicon oxide compound, such as silicon oxide, silicon nitride, etc.

[0124] Optionally, the orthographic projection of the protective portion 23 onto the substrate 1 and the orthographic projection of the covering portion 221 onto the substrate 1 at least partially overlap. In the thickness direction of the display panel, the protective portion 23 and the covering portion 221 are in the same vertical plane, so that the protective portion 23 and the covering portion 221 can jointly protect the first sidewall 211 of the planarization layer 21, improve the protection effect, and improve the etching damage and water and oxygen intrusion problems of the planarization layer 21.

[0125] Optionally, the first conductive portion 111 has a first bottom surface facing the substrate 1, a first top surface facing away from the first bottom surface, and a first side surface connecting the first top surface and the first bottom surface. The protective portion 23 at least covers at least a portion of the first side surface of the first conductive portion 111. When the isolation structure 3 and the light-emitting unit 411 are patterned after the first conductive layer 11, the shape of the first side surface of the first conductive portion 111 may be affected. The etching deformation of the first side surface affects the yield of the first conductive portion 111. In this embodiment, a protective portion 23 is also provided on the substrate 1. The protective portion 23 also covers at least a portion of the first side surface. The protective portion 23 can provide protection to the first side surface, improve the yield of the first conductive portion 111, and thus improve the process performance and reliability of the display panel.

[0126] Optionally, the protective portion 23 includes a vertical segment 231 and a horizontal segment 232 connected to each other. The vertical segment 231 is disposed between the planarization layer 21 and the first conductive portion 111, and the horizontal segment 232 is disposed on the side of the blocking portion 12 facing away from the substrate 1. The vertical segment 231 can protect the sides of the first conductive portion 111 and the planarization layer 21 respectively, and the horizontal segment 232 can protect the top surface of the first conductive portion 111 and the blocking portion 12.

[0127] Optionally, the side surface of the horizontal segment 232 facing away from the substrate 1 is connected to the cover portion 221. The connection between the protective portion 23 and the cover portion 221, which are both inorganic materials, is tighter, with fewer blind spots in protection. The interconnection of the horizontal segment 232 and the cover portion 221 can further improve the protective effect on the first sidewall 211.

[0128] Optionally, the first opening 20 further includes a third sub-opening 203, formed by the protective portion 23. The orthographic projection of the third sub-opening 203 onto the substrate 1 at least partially overlaps with the orthographic projection of the second sub-opening 202 onto the substrate 1. The formation process of the third sub-opening 203 can be the same as the formation process of the clearance hole 121 of the blocking portion 12, which is after the etching process. The protective portion 23 and the blocking portion 12 are etched through to replace the first conductive layer 11 to form the third sub-opening 203 and the clearance hole 121 so that the first conductive portion 111 can be electrically connected to other conductive structures, thereby further protecting the integrity of the structure of the first conductive layer 11. Alternatively, it can be formed before etching the encapsulation material and the light-emitting material. For example, it can be directly patterned during the preparation of the protective portion 23, or the third sub-opening 203 of the protective portion 23 can be formed after the formation of the first sub-opening 201 and the second sub-opening 202, by patterning the protective material layer.

[0129] Optionally, the orthographic projection of the third sub-opening 203 onto the substrate 1 is located within the orthographic projection of the second sub-opening 202 onto the substrate 1. That is, a portion of the protective portion 23 protrudes relative to the covering portion 221 toward the second sub-opening 202, thereby increasing the protective area of ​​the protective portion 23 and improving the protection range.

[0130] Optionally, the orthographic projection of the blocking portion 12 onto the substrate 1 is located within the orthographic projection of the protective portion 23 onto the substrate 1. The protective portion 23 can provide etching protection for the blocking portion 12, and the blocking portion 12 remaining after etching is located in the gap between the protective portion 23 and the first conductive portion 111.

[0131] See Figure 9 and Figure 10 , Figure 9 This is a partial cross-sectional structural diagram of the display area and non-display area of ​​a display panel when no light-emitting unit is fabricated, provided in an embodiment of this application; Figure 10 This is a partial cross-sectional structural diagram of the display area and non-display area of ​​a display panel provided in an embodiment of this application.

[0132] Reference Figure 9 and Figure 10 Optionally, the first conductive layer 11 includes a second conductive portion 112 located within the display area 100. The orthographic projection of the second conductive portion 112 onto the substrate 1 at least partially overlaps with the orthographic projection of the first electrode 421 onto the substrate 1. Optionally, the second conductive portion 112 is electrically connected to the first electrode 421. The second conductive portion 112 is used to electrically connect to the first electrode 421 and can be electrically connected to a driving circuit disposed between the substrate 1 and the first electrode layer 42, thereby realizing the control of the first electrode 421 and the light-emitting unit 411.

[0133] The second conductive portion 112 may be a conductive layer directly electrically connected to the first electrode 421. For example, a second conductive layer and a third conductive layer may be disposed between the first conductive layer 11 and the substrate 1, arranged sequentially along the direction close to the substrate 1. An insulating layer is disposed between adjacent conductive layers. Exemplarily, the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode and a second electrode.

[0134] Reference Figure 12 In some embodiments, the display panel further includes a first encapsulation layer 5, which includes an encapsulation portion 51 for encapsulating the light-emitting units 411. There are multiple light-emitting units 411, and the multiple encapsulation portions 51 can be configured one-to-one with the multiple light-emitting units 411.

[0135] Optionally, the first encapsulation layer 5 can be made of inorganic materials. Inorganic materials have good density and water vapor resistance, and even a thin layer can provide good encapsulation. The first encapsulation layer 5 can be prepared by chemical vapor deposition (CVD).

[0136] Optionally, the display panel further includes a second encapsulation layer 7 and a third encapsulation layer 8 disposed on the side of the first encapsulation layer 5 facing away from the substrate 1. The material of the second encapsulation layer 7 may include an organic material to give it good flowability and make the surface of the second encapsulation layer 7 facing away from the substrate 1 relatively flat. The material of the third encapsulation layer 8 may include an inorganic material to further improve the encapsulation effect of the display panel. Optionally, the second encapsulation layer 7 can be prepared by inkjet printing (IJP) technology; the third encapsulation layer 8 can be prepared by chemical vapor deposition.

[0137] Optionally, the display panel also includes a touch layer, a polarizing layer, and a cover plate disposed on the third encapsulation layer 8. The touch layer is used to enable touch operation of the display panel, the polarizing layer is used to filter light to improve the display effect of the display panel, and the cover plate is used to protect the underlying film layer to improve the strength of the display panel.

[0138] Please refer to the following: Figures 1 to 12 The first aspect of this application also provides a display panel having a display area 100 and a non-display area 200 located on at least one side of the display area 100. The display panel includes a substrate 1, a first conductive layer 11, a planarization layer 21, a pixel definition layer 22, and an isolation structure 3. The first conductive layer 11 is disposed on one side of the substrate 1 and includes a first conductive portion 111 located in the non-display area 200. The planarization layer 21 is disposed on the side of the first conductive layer 11 facing away from the substrate 1 and has a first sub-opening 201 for exposing at least a portion of the first conductive layer 11. The pixel definition layer 22... 2 is disposed on the side of the planarization layer 21 away from the substrate 1, and the pixel definition layer 22 has a second sub-opening 202 formed thereon. The orthographic projection of the first sub-opening 201 on the substrate 1 and the orthographic projection of the second sub-opening 202 on the substrate 1 at least partially overlap. The isolation structure 3 is disposed on one side of the substrate 1 and the isolation structure 3 encloses and forms a plurality of isolation openings 30 in the display area 100. The planarization layer 21 includes a first sidewall 211 facing the first sub-opening 201, and the pixel definition layer 22 includes a covering portion 221. The covering portion 221 is located on the side of the first sidewall 211 facing the first sub-opening 201, and the covering portion 221 at least covers a portion of the first sidewall 211.

[0139] In a display panel provided in this application embodiment, the display panel includes a substrate 1, a first conductive layer 11, a planarization layer 21, a pixel definition layer 22, and an isolation structure 3. The isolation structure 3 is disposed on one side of the substrate 1 and forms an isolation opening 30. The isolation opening 30 is used to accommodate light-emitting units 411, and the isolation structure 3 can be used to divide the sub-pixels of the display panel. The isolation structure 3 is disposed on the substrate 1 and forms multiple isolation openings 30, which can isolate the light-emitting layer 41 to form mutually disconnected light-emitting units 411, thereby reducing crosstalk of charge carriers in the light-emitting layer 41, improving the display effect of the display panel, and eliminating the need for a precision mask to fabricate the light-emitting units 411, thus reducing the development and use of precision masks and lowering the manufacturing cost. In this embodiment, the covering portion 221 covers at least a portion of the first sidewall 211, which can protect the planarization layer 21 at the first sidewall 211. This can prevent etching damage to the first sidewall 211 and improve the encapsulation capability, reducing the intrusion of water and oxygen from the first sidewall 211 into the planarization layer 21. This allows the pixel definition layer 22 to protect the planarization layer 21 from the top surface and sidewalls of the planarization layer 21, thereby preventing etching damage to the planarization layer 21 and reducing the gaps that appear in the planarization layer 21.

[0140] Optionally, the pixel definition layer 22 may be made of inorganic materials. This embodiment can increase the ability to encapsulate the planarization layer 21 without layers, reduce water and oxygen intrusion into the planarization layer 21, and improve the reliability of the display panel.

[0141] Optionally, the orthographic projection of the second sub-opening 202 onto the substrate 1 is located within the orthographic projection of the first sub-opening 201 onto the substrate 1. Since the orthographic projection of the second sub-opening 202 onto the substrate 1 is located within the orthographic projection of the first sub-opening 201 onto the substrate 1, at least a portion of the pixel definition layer 22 is located on the first sidewall 211 of the planarization layer 21 facing the first sub-opening 201. That is, the covering portion 221 at least covers a portion of the first sidewall 211, which can protect the planarization layer 21 at the first sidewall 211, preventing etching damage to the first sidewall 211 and improving encapsulation capability, reducing the intrusion of water and oxygen from the first sidewall 211 into the planarization layer 21.

[0142] Optionally, the cover portion 221 encloses to form a second sub-opening 202. The second sub-opening 202 is formed by the cover portion 221, so that the cover portion 221 can more completely surround and cover the first sidewall 211, further improving the protective effect of the pixel definition layer 22.

[0143] In some embodiments, the display panel further includes a protective portion 23, at least partially disposed between the planarization layer 21 and the first conductive portion 111. The protective portion 23 can protect the sidewalls of the planarization layer 21 and the first conductive portion 111 respectively, preventing etching damage to the planarization layer 21 and reducing gaps in the planarization layer 21. Optionally, the material of the protective portion 23 includes inorganic materials, thereby increasing the ability to encapsulate the planarization layer 21 without layers, reducing the intrusion of water and oxygen from the sidewalls of the planarization layer 21, and improving the reliability of the display panel.

[0144] Optionally, the display panel provided in the first aspect of this application may be the display panel in any of the foregoing embodiments. Therefore, the display panel provided in the embodiments of this application may have the beneficial effects of the display panel in any of the foregoing embodiments, and this application will not elaborate further on it. For example, the substrate 1 may be the substrate 1 in any of the foregoing embodiments. For example, the protective portion 23 may be the protective portion 23 in any of the foregoing embodiments. For example, the display panel may also include the first electrode layer 42 and the second electrode layer 43 in any of the foregoing embodiments. For example, the first electrode 421 and the second electrode 431 may respectively serve as the anode and cathode of the display panel. For example, the isolation structure 3 may be the isolation structure 3 in any of the foregoing embodiments. The isolation structure 3 may include the first isolation portion 31 and the second isolation portion 32 in any of the foregoing embodiments, so that the isolation structure 3 can be used to isolate the materials of the light-emitting layer 41 and the second electrode layer 43 when preparing the light-emitting layer 41 and the second electrode layer 43.

[0145] Figure 13 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0146] Please refer to the above as well. Figures 1 to 13 The second aspect of this application also provides a method for manufacturing a display panel, the display panel having a display area and a non-display area located on at least one side of the display area, the manufacturing method comprising:

[0147] S10, a first conductive layer is formed on one side of the substrate, the first conductive layer including a first conductive portion located in the non-display area.

[0148] S20, a barrier material layer is formed on the side of the first conductive layer away from the substrate.

[0149] S30, a first insulating material layer is formed on the side of the barrier material layer away from the first conductive layer, and the first insulating material layer is patterned to form a first opening including a non-display area.

[0150] S40, an isolation structure is prepared on the side of the first insulating material layer away from the substrate, and the isolation structure encloses and forms multiple isolation openings located in the display area.

[0151] S50, a fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the fabrication material layer and the barrier material layer are patterned so that the fabrication material layer forms a light-emitting unit and an encapsulation part, the barrier material layer forms a barrier part, the barrier part forms a clearance hole, the clearance hole exposes at least a portion of the first conductive part, and the first opening communicates with the clearance hole.

[0152] In this embodiment, the barrier material layer can prevent the patterning process in step S50 from damaging the first conductive portion. Furthermore, after the etching process is completed, the barrier material layer replaces the first conductive layer and is etched through to form a barrier portion and a clearance hole, facilitating electrical connection between the first conductive portion and other conductive structures. This protects the integrity of the first conductive layer structure and reduces damage to the first conductive portion. In this embodiment, the first conductive portion is covered and shielded by the barrier material layer. During the etching process of the patterning treatment, the barrier material layer can protect the first conductive portion, thereby reducing the risk of etching damage to the first conductive portion, improving its integrity, and ultimately enhancing the reliability and performance of the display panel.

[0153] In some embodiments, the preparation of the material layer includes a first preparation material layer, a second preparation material layer, and a third preparation material layer, and step S50 includes:

[0154] A first fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the first fabrication material layer is patterned to form a first light-emitting unit and a first encapsulation part.

[0155] A second fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the second fabrication material layer is patterned to form a second light-emitting unit and a second encapsulation part.

[0156] A third fabrication material layer is formed on the side of the isolation structure and isolation opening away from the substrate, and the third fabrication material layer and the barrier material layer are patterned so that the third fabrication material layer forms a third light-emitting unit and a third encapsulation part, the barrier material layer forms a barrier part, the barrier part forms a clearance hole, the clearance hole exposes at least a portion of the first conductive part, and the first opening communicates with the clearance hole.

[0157] In these embodiments, the blocking portion is formed simultaneously with the final patterning process. The first two patterning processes may also cause some damage to the blocking material layer. By providing the blocking material layer, the first conductive portion, which could be damaged in the third patterning process, is effectively protected. Alternatively, in other embodiments, the blocking portion and the clearance hole can also be formed simultaneously during the patterning process of the second fabrication material layer, which also provides some protection for the first conductive portion.

[0158] Optionally, the third fabrication material layer includes a third light-emitting material layer and a third encapsulation material layer. The third fabrication material layer is formed on the side of the isolation structure and isolation opening facing away from the substrate. The third fabrication material layer and the barrier material layer are patterned so that the third fabrication material layer forms the third light-emitting unit and the third encapsulation portion, the barrier material layer forms the barrier portion, the barrier portion forms a clearance hole, and the clearance hole exposes at least a portion of the first conductive portion. The first opening communicates with the clearance hole. The steps include:

[0159] The third encapsulation material layer is patterned to form the third encapsulation part.

[0160] The third light-emitting material layer and the blocking material layer are patterned so that the third light-emitting material layer forms a third light-emitting unit, the blocking material layer forms a blocking portion, the blocking portion forms a clearance hole, and the clearance hole exposes at least a portion of the first conductive portion.

[0161] Optionally, the process of patterning the third packaging material layer to form the third package includes dry etching. The etching of the third packaging material layer can be performed using a dry etching process.

[0162] Optionally, the patterning process for the third luminescent material layer and the barrier material layer includes dry etching. The etching of the third luminescent material layer can also be performed using a dry etching process. The dry etching process simultaneously etches the barrier material layer in the non-display area.

[0163] In these embodiments, the blocking portion is formed during the patterning process of the third prefabricated material layer and the blocking material layer, specifically during the patterning process of the third light-emitting material layer. Exemplarily, the patterning process of the third light-emitting material layer includes a dry etching process. This dry etching process simultaneously removes excess third encapsulation material layer in the display area and the third encapsulation material layer in the non-display area, and also etches away a portion of the blocking material layer, forming a blocking portion. This blocking portion forms a clearance hole, exposing at least a portion of the first conductive portion. The blocking portion is formed simultaneously during the final dry etching process of the third light-emitting material layer to form the third light-emitting unit, effectively protecting the first conductive portion from damage during the dry etching process.

[0164] An embodiment of the third aspect of this application provides a display device that includes the display panel provided in any of the embodiments of the first aspect. Since the display device provided in the third aspect of this application includes the display panel provided in any of the embodiments of the first aspect, it possesses the beneficial effects of the display panel in any of the embodiments of the first aspect, which will not be elaborated further here.

[0165] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0166] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area located on at least one side of the display area, the display panel comprising: Substrate; A first conductive layer is disposed on one side of the substrate, and the first conductive layer includes a first conductive portion located in the non-display area; A blocking portion is disposed on the side of the first conductive portion away from the substrate, and the blocking portion is formed with a clearance hole, the clearance hole exposing at least a portion of the first conductive portion; A first insulating layer is disposed on the side of the first conductive layer opposite to the substrate. The first insulating layer has a first opening, and the orthographic projection of the first opening on the substrate at least partially overlaps with the orthographic projection of the clearance hole on the substrate. An isolation structure is disposed on the side of the first insulating layer away from the substrate, and the isolation structure encloses a plurality of isolation openings in the display area; The light-emitting layer includes a plurality of light-emitting units, wherein the light-emitting units are at least partially located within the isolation opening.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the blocking portion onto the substrate is located within the orthographic projection of the first conductive portion onto the substrate. Preferably, the material of the blocking portion includes metal oxide; Preferably, the metal oxide includes at least one of IGZO, IAZO, ITZO, IATZO, and IGO; Preferably, the orthographic projection of the blocking portion onto the substrate at least partially overlaps with the orthographic projection of the first insulating layer onto the substrate; Preferably, the orthographic projection of the blocking portion onto the substrate is located within the orthographic projection of the first insulating layer onto the substrate.

3. The display panel according to claim 1, characterized in that, The first insulating layer includes a planarization layer and a pixel definition layer disposed on the side of the planarization layer opposite to the substrate. The first opening includes a first sub-opening and a second sub-opening. The planarization layer forms the first sub-opening, and the pixel definition layer forms the second sub-opening. The orthographic projection of the first sub-opening on the substrate and the orthographic projection of the second sub-opening on the substrate at least partially overlap. Preferably, the orthographic projection of the second sub-opening onto the substrate is located within the orthographic projection of the first sub-opening onto the substrate; Preferably, the isolation structure is located on the side of the pixel definition layer opposite to the substrate, or the pixel definition layer has a clearance opening, and the isolation structure is located within the clearance opening.

4. The display panel according to claim 3, characterized in that, The planarization layer includes a first sidewall facing the first sub-opening, and the pixel definition layer includes a cover portion located on the side of the first sidewall facing the first sub-opening, the cover portion at least covering a portion of the first sidewall; Preferably, the covering portion encloses and forms the second sub-opening; Preferably, the end of the covering portion facing the substrate is connected to the blocking portion.

5. The display panel according to claim 4, characterized in that, The first insulating layer further includes a protective portion, at least a portion of which is disposed between the planarization layer and the first conductive portion; Preferably, the orthographic projection of the protective portion onto the substrate and the orthographic projection of the covering portion onto the substrate at least partially overlap; Preferably, the first conductive portion has a first bottom surface facing the substrate, a first top surface facing away from the first bottom surface, and a first side surface connecting the first top surface and the first bottom surface, and the protective portion at least covers at least a portion of the first side surface of the first conductive portion; Preferably, the protective portion includes a vertical segment and a horizontal segment connected to each other, the vertical segment being disposed between the planarization layer and the first conductive portion, and the horizontal segment being disposed on the side of the blocking portion away from the substrate; Preferably, the side surface of the horizontal segment facing away from the substrate is connected to the cover portion; Preferably, the material of the protective part includes inorganic materials.

6. The display panel according to claim 5, characterized in that, The first opening further includes a third sub-opening, the protective portion forming the third sub-opening, and the orthographic projection of the third sub-opening on the substrate at least partially overlaps with the orthographic projection of the second sub-opening on the substrate; Preferably, the orthographic projection of the third sub-opening onto the substrate is located within the orthographic projection of the second sub-opening onto the substrate; Preferably, the orthographic projection of the blocking portion onto the substrate is located within the orthographic projection of the protective portion onto the substrate.

7. The display panel according to claim 3, characterized in that, It also includes a first electrode layer disposed between the pixel definition layer and the planarization layer, the first electrode layer including a first electrode located in the display area, the pixel definition layer enclosing to form a pixel opening, the first electrode being exposed to the pixel opening, and the orthographic projection of the isolation opening on the substrate at least partially overlapping the orthographic projection of the pixel opening on the substrate; Preferably, the first conductive layer includes a second conductive portion located within the display area, wherein the orthographic projection of the second conductive portion onto the substrate at least partially overlaps with the orthographic projection of the first electrode onto the substrate; Preferably, the second conductive part is electrically connected to the first electrode; Preferably, the light-emitting layer is located on the side of the first electrode layer opposite to the substrate, and the light-emitting unit is at least partially disposed within the pixel opening; Preferably, the display panel further includes a second electrode layer located on the side of the light-emitting layer opposite to the substrate, the second electrode layer including a second electrode disposed within the isolation opening; Preferably, the isolation structure includes a conductive structure, and the second electrode is electrically connected to the conductive structure.

8. The display panel according to any one of claims 1 to 7, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, wherein the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate.

9. The display panel according to any one of claims 1 to 7, characterized in that, It also includes a first encapsulation layer located on the side of the light-emitting layer opposite to the substrate, the first encapsulation layer including an encapsulation portion for encapsulating the light-emitting unit; Preferably, the display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer opposite to the substrate; Preferably, the material of the first encapsulation layer includes inorganic materials, and / or the material of the second encapsulation layer includes organic materials.

10. A display panel, characterized in that, The display panel has a display area and a non-display area located on at least one side of the display area, the display panel comprising: Substrate; A first conductive layer is disposed on one side of the substrate, and the first conductive layer includes a first conductive portion located in the non-display area; A planarization layer is disposed on the side of the first conductive layer opposite to the substrate, and the planarization layer has a first sub-opening for exposing at least a portion of the first conductive layer. A pixel definition layer is disposed on the side of the planarization layer opposite to the substrate. The pixel definition layer has a second sub-opening. The orthographic projection of the first sub-opening on the substrate and the orthographic projection of the second sub-opening on the substrate at least partially overlap. An isolation structure is disposed on one side of the substrate, and the isolation structure encloses a plurality of isolation openings in the display area; The planarization layer includes a first sidewall facing the first sub-opening, and the pixel definition layer includes a covering portion located on the side of the first sidewall facing the first sub-opening, the covering portion at least partially covering the first sidewall.

11. The display panel according to claim 10, characterized in that, The second sub-opening is projected onto the substrate in the same direction as the first sub-opening in the same direction as the substrate. Preferably, the covering portion encloses to form the second sub-opening.

12. The display panel according to claim 11, characterized in that, The display panel further includes a protective portion, at least a portion of which is disposed between the planarization layer and the first conductive portion; Preferably, the orthographic projection of the protective portion onto the substrate and the orthographic projection of the covering portion onto the substrate at least partially overlap; Preferably, the first conductive portion has a first bottom surface facing the substrate, a first top surface facing away from the first bottom surface, and a first side surface connecting the first top surface and the first bottom surface, and the protective portion at least covers at least a portion of the first side surface of the first conductive portion; Preferably, the protective portion includes a vertical segment and a horizontal segment connected to each other, the vertical segment being disposed between the planarization layer and the first conductive portion, and the horizontal segment being disposed on the side of the first conductive portion away from the substrate; Preferably, the side surface of the horizontal segment facing away from the substrate is connected to the cover portion; Preferably, the material of the protective part includes inorganic materials; Preferably, the protective portion has a third sub-opening, the orthographic projection of the third sub-opening onto the substrate at least partially overlapping the orthographic projection of the second sub-opening onto the substrate; Preferably, the orthographic projection of the third sub-opening onto the substrate is located within the orthographic projection of the second sub-opening onto the substrate.

13. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area located on at least one side of the display area, and the manufacturing method includes: A first conductive layer is formed on one side of the substrate, the first conductive layer including a first conductive portion located in the non-display area; A barrier material layer is formed on the side of the first conductive layer that is away from the substrate; A first insulating material layer is formed on the side of the barrier material layer opposite to the first conductive layer, and the first insulating material layer is patterned to form a first opening located in the non-display area. An isolation structure is prepared on the side of the first insulating material layer away from the substrate, and the isolation structure encloses and forms a plurality of isolation openings located in the display area; A fabrication material layer is formed on the side of the isolation structure and the isolation opening away from the substrate, and the fabrication material layer and the barrier material layer are patterned so that the fabrication material layer forms a light-emitting unit and an encapsulation portion, the barrier material layer forms a barrier portion, the barrier portion forms a clearance hole, the clearance hole exposes at least a portion of the first conductive portion, and the first opening communicates with the clearance hole.

14. The preparation method according to claim 13, characterized in that, The fabrication material layer includes a first fabrication material layer, a second fabrication material layer, and a third fabrication material layer. The fabrication material layer is formed on the side of the isolation structure and the isolation opening opposite to the substrate. The fabrication material layer and the barrier material layer are patterned to form a light-emitting unit and an encapsulation portion in the fabrication material layer, a barrier portion in the barrier material layer, and a clearance hole in the barrier portion. The clearance hole exposes at least a portion of the first conductive portion. The first opening communicates with the clearance hole. A first fabrication material layer is formed on the side of the isolation structure and the isolation opening opposite to the substrate, and the first fabrication material layer is patterned to form a first light-emitting unit and a first encapsulation part; A second fabrication material layer is formed on the side of the isolation structure and the isolation opening opposite to the substrate, and the second fabrication material layer is patterned to form a second light-emitting unit and a second encapsulation part; A third fabrication material layer is formed on the side of the isolation structure and the isolation opening away from the substrate, and the third fabrication material layer and the barrier material layer are patterned so that the third fabrication material layer forms a third light-emitting unit and a third encapsulation portion, the barrier material layer forms a barrier portion, the barrier portion forms a clearance hole, the clearance hole exposes at least a portion of the first conductive portion, and the first opening communicates with the clearance hole; Preferably, the third fabrication material layer includes a third light-emitting material layer and a third encapsulation material layer. The third fabrication material layer is formed on the side of the isolation structure and the isolation opening opposite to the substrate. The third fabrication material layer and the barrier material layer are patterned so that the third fabrication material layer forms a third light-emitting unit and a third encapsulation portion, the barrier material layer forms a barrier portion, the barrier portion forms a clearance hole, the clearance hole exposes at least a portion of the first conductive portion, and the first opening communicates with the clearance hole. The steps include: The third encapsulation material layer is patterned to form the third encapsulation portion; The third light-emitting material layer and the blocking material layer are patterned so that the third light-emitting material layer forms a third light-emitting unit, the blocking material layer forms a blocking portion, the blocking portion forms a clearance hole, and the clearance hole exposes at least a portion of the first conductive portion; Preferably, the process of patterning the third encapsulation material layer to form the third encapsulation portion includes a dry etching process; Preferably, the process of patterning the third luminescent material layer and the blocking material layer includes a dry etching process.

15. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 12.

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