Packaging process and packaging equipment for ceramic identification card

Abstract

The invention discloses a packaging process and packaging equipment for a ceramic identification card, the packaging equipment comprises a first positioning platform, a second positioning platform, a silk-screen glue scraping mechanism, a glue brushing platform and a first moving module, the first positioning platform and the second positioning platform are used for positioning an upper ceramic substrate and a lower ceramic substrate respectively; then, after the first moving module drives the upper ceramic substrate to be attached to the bottom face of the silk-screen screen plate, glue scraping is conducted through a silk-screen glue scraping mechanism, a first shielding part is arranged at the position, corresponding to a chip hole of the upper ceramic substrate, of the silk-screen screen plate, so that a reserved area not coated with glue is formed on the upper ceramic substrate; a gap is formed between the edge of the reserved area and the edge of the chip hole, and finally carrying out semi-curing, surface degumming and natural air-drying curing on the identification card to complete all operations. According to the invention, automatic assembly of the identification card is realized, the production efficiency is improved, and the problems that the identification card is heated unevenly and excessive glue is not easy to clean are solved.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor device technology, and specifically relates to a packaging process and packaging equipment for ceramic identification cards. Background Technology

[0002] Identification cards are media used to identify individuals and store their information. Various identification cards (such as work permits, ID cards, various financial transaction cards, membership cards, campus cards, etc.) are widely used in people's lives.

[0003] Contactless ceramic identification cards require an induction coil to be embedded inside the card. However, due to the extreme thinness of the identification card, a hollow embedded design is not feasible. Figures 1-2 As shown, only a layered design of lower ceramic substrate 1, induction coil, and upper ceramic substrate 2 can be made. Therefore, the packaging process combining these three components becomes crucial. In addition to the lower ceramic substrate 1, induction coil, and upper ceramic substrate 2, the contactless bank card also requires the installation of a chip 3. The lower ceramic substrate 1 has a coil groove 11 and a chip groove 12, and the upper ceramic substrate has a chip hole 21. In the traditional method of packaging the identification card, glue is first applied to the lower ceramic substrate 1, then the induction coil is installed into the coil groove 11 on the lower ceramic substrate 1, and then the upper ceramic substrate is placed on the lower ceramic substrate 1. Next, the chip 3 is embedded into the chip hole 21 on the upper ceramic substrate, so that the integrated circuit part of the chip 3 is embedded into the chip groove 12 on the lower ceramic substrate 1 and connected to the induction coil. Then, the assembled identification card needs to be placed in a curing device for pressure packaging to press the upper and lower ceramic substrates tightly together and squeeze out excess glue.

[0004] Traditional packaging processes involve manual operation, including applying adhesive to the surface of the lower ceramic substrate using a scraper, manually sealing the upper and lower ceramic substrates, and applying pressure using a simple pneumatic fixture. This process has the following significant drawbacks: 1. Low level of automation: The identification card is small in size and extremely thin, requiring high precision during packaging. However, traditional glue application, capping, and curing all rely on manual operation, resulting in high labor costs, low production efficiency, and easy overflow of glue, broken cards, or substrate misalignment due to misalignment.

[0005] 2. Poor glue control: The glue is applied unevenly with a scraper, and glue is applied to the entire surface of the ceramic substrate without leaving an area around the chip slot where no glue is applied. This results in too much glue overflowing and completely covering the chip surface. The overflowing glue is not easy to clean and requires a long wiping time. During the wiping process, the glue will harden and needs to be scraped with a soft rubber strip, which can easily scratch the chip.

[0006] 3. Uneven curing: The curing fixture only pneumatically presses down the identification card without a heating device to semi-cur the adhesive. The adhesive takes 18-24 hours to cure naturally, resulting in low production efficiency. Furthermore, the upper and lower ceramic substrates are prone to relative displacement and misalignment during the time the adhesive is not cured. Alternatively, the curing fixture only heats and semi-cures one surface of the identification card, which can easily cause the upper and lower ceramic substrates to bend and deform due to stress release caused by uneven heating, reducing the yield rate. Summary of the Invention

[0007] The purpose of this invention is to provide a packaging process and equipment for ceramic identification cards, which enables automated packaging of identification cards, improves production efficiency, and solves the problems of uneven heating of identification cards and difficulty in cleaning excess adhesive.

[0008] To achieve the above objectives, the present invention provides a packaging process for a ceramic identification card, which uses a packaging device for packaging. The packaging device includes a first positioning platform, a second positioning platform, a screen printing and adhesive scraping mechanism, an adhesive brushing platform, and a first moving module. The first positioning platform is used to load and position the upper ceramic substrate, and is mounted on the first moving module and driven by the first moving module to move up and down, horizontally, and rotate; the glue application platform is located above the first positioning platform, and has a vertically penetrating glue application position, with a screen printing stencil inside the glue application position, and the screen printing glue scraping mechanism is located above the glue application platform; the second positioning platform is used to load and position the lower ceramic substrate, and is located on one side of the first positioning platform; The packaging process includes the following steps: S1. Loading and positioning the ceramic substrate: Place the upper ceramic substrate with its bottom surface facing up on the first positioning platform to position the upper ceramic substrate. At the same time, install the induction coil and the chip on the lower ceramic substrate, so that the induction coil is installed in the coil groove of the lower ceramic substrate, and the integrated circuit part at the bottom of the chip is embedded in the chip slot and connected to the induction coil. Then, place the lower ceramic substrate with its top surface facing up on the second positioning platform to position the lower ceramic substrate. S2. Automatic glue application: The first moving module drives the first positioning platform to move, so that the upper ceramic substrate is attached to the bottom surface of the screen printing stencil. Then, the screen printing glue scraping mechanism scrapes the glue onto the screen printing stencil to apply glue to the bottom surface of the upper ceramic substrate. The screen printing stencil is provided with a first blocking part corresponding to the chip hole position of the upper ceramic substrate. The first blocking part forms a reserved area on the upper ceramic substrate where no glue is applied. There is a gap between the edge of the reserved area and the edge of the chip hole. S3. Automatic assembly and covering: After the screen printing and adhesive application are completed, the first moving module drives the first positioning platform to move, so that the upper ceramic substrate flips to the bottom face down, and then moves down to cover the lower ceramic substrate to form an identification card. At the same time, the chip is embedded in the chip hole of the upper ceramic substrate. Then the identification card is removed and the chip is covered with high temperature tape. S4. Semi-curing: The assembled identification card is semi-cured using a curing device. The curing device includes a lower punching platform and an upper punching plate. The upper punching plate is raised and lowered above the lower punching platform. The lower punching platform has a placement position for placing the identification card. Both the upper punching plate and the lower punching platform are equipped with heating devices. The chip is covered on the identification card with high-temperature tape. Then the identification card is placed on the lower punching platform. Next, the upper punching plate moves down to press down the identification card. At the same time as pressing down, the upper punching plate and the lower punching platform heat the identification card to semi-cur it. S5. Surface adhesive removal: After semi-curing, remove the high-temperature tape and wipe the adhesive off the surface of the chip and the identification card. S6. Natural air drying and curing: After removing the adhesive, place the identification card in a room temperature environment to air dry naturally for 4 hours to allow the adhesive to fully cure.

[0009] Furthermore, a horizontally movable first positioning cylinder is provided on one side of the first positioning platform, and a vacuum suction cup and a positioning side are provided on the first positioning platform. The structure of the second positioning platform is the same as that of the first positioning platform, and a second positioning cylinder is provided on one side of the second positioning platform. The structure of the second positioning cylinder is the same as that of the first positioning cylinder. Thus, in step S1, after the upper ceramic substrate is placed on the first positioning platform, the first positioning cylinder pushes the upper ceramic substrate to abut against the positioning side, and then the vacuum suction cup is opened to adsorb and position the upper ceramic substrate. The adsorption and positioning steps of the lower ceramic substrate are the same as those of the upper ceramic substrate.

[0010] Furthermore, in step S1, the first positioning cylinder is provided with a first push plate, and the first push plate is provided with a positioning notch at a 90° angle. The positioning notch cooperates with a corner of the upper ceramic substrate to push the upper ceramic substrate to move to abut against the positioning side.

[0011] Furthermore, in step S2, the chip hole is a rectangular hole with a length of 11.25 mm and a width of 8.5 mm. The reserved area is rectangular, and the distance between each side of the reserved area and the corresponding side of the chip hole is 2.5 mm to 3.5 mm.

[0012] Furthermore, in step S2, the length of the upper and lower ceramic substrates is 85.6 mm and the width is 43.98 mm. After screen printing and squeegeeing, an adhesive layer is formed on the bottom surface of the upper ceramic substrate. A second shielding part is provided at the edge of the screen printing stencil, or the size of the screen printing stencil is set smaller than that of the upper ceramic substrate, so that the distance between the edge of the adhesive layer and the edge of the upper ceramic substrate is 0.5 mm.

[0013] Further, in step S5, the thickness of the upper ceramic substrate is 0.33mm, the thickness of the lower ceramic substrate is 0.47mm, the upper punch plate is driven to rise and fall by a lower pressure cylinder to place the identification card chip facing upward on the lower punch platform, the air pressure of the lower pressure cylinder is controlled at 0.3MPa-0.7MPa, the heating temperature of the identification card by the upper punch plate is the upper punch temperature, which is 90℃-110℃, the heating temperature of the identification card by the lower punch platform is the lower punch temperature, which is 95℃-120℃, and the upper punch temperature is 5℃-10℃ lower than the lower punch temperature, and the heating time is 60s-110s.

[0014] Furthermore, in step S3, the chip is covered with high-temperature resistant tape that can withstand 300°C and has a length and width dimension that are 6mm greater than or equal to the chip's length and width dimension. The chip is positioned in the center of the high-temperature tape, ensuring that the area 3mm away from the outer edge of the chip is covered.

[0015] Furthermore, in step S4, the curing device also includes a second moving module. The lower punching platform is disposed on the second moving module and is driven by the second moving module to move horizontally. After the identification card is placed in the placement position, the second moving module drives the lower punching platform to move directly below the upper punching plate, and then the upper punching plate presses down to perform semi-curing.

[0016] This application also provides a packaging device for ceramic identification cards, which, in applying the above-mentioned packaging process, is characterized by including a first positioning platform, a second positioning platform, a screen printing adhesive scraping mechanism, an adhesive brushing platform, and a first moving module; The first positioning platform is used to load and position the upper ceramic substrate, and is mounted on the first moving module and driven by the first moving module to move up and down, horizontally, and rotate. The glue application platform is located above the first positioning platform, and has a vertically penetrating glue application position. A screen printing stencil is located within the glue application position, and a screen printing glue scraping mechanism is located above the glue application platform. After the moving module drives the upper ceramic substrate to adhere to the bottom surface of the screen printing stencil, the screen printing glue scraping mechanism scrapes the screen printing stencil to apply glue to the bottom surface of the upper ceramic substrate. A first blocking part is provided on the screen printing stencil corresponding to the chip hole position of the upper ceramic substrate. The first blocking part forms a reserved area on the upper ceramic substrate where no glue is applied, and there is a gap between the edge of the reserved area and the edge of the chip hole. The second positioning platform is used to load and position the lower ceramic substrate, and the second positioning platform is located on one side of the first positioning platform. The upper ceramic substrate after being coated with adhesive is driven by the first moving module to flip and cover the lower ceramic substrate.

[0017] Furthermore, a horizontally movable first positioning cylinder is provided on one side of the first positioning platform. The first positioning cylinder is provided with a first push plate, and the first push plate is provided with a positioning notch at a 90° angle. The positioning notch cooperates with a corner of the upper ceramic substrate to push the upper ceramic substrate for positioning. The first positioning platform is provided with a vacuum suction cup for adsorbing and fixing the upper ceramic substrate and a positioning side for abutting and positioning the upper ceramic substrate. The structure of the second positioning platform is the same as that of the first positioning platform, and a second positioning cylinder is provided on one side of the second positioning platform. The structure of the second positioning cylinder is the same as that of the first positioning cylinder.

[0018] After adopting the above solution, the beneficial effects of the present invention are as follows: 1. Achieving fully automated packaging, improving accuracy and efficiency: The packaging equipment of this application is equipped with a screen printing and adhesive scraping mechanism for automatic adhesive application and a first moving module for driving the first positioning platform. Driven by the first moving module, the adhesive application, flipping, and capping actions of the upper ceramic substrate can be automatically realized, achieving automated packaging. The entire process only requires placing the upper and lower ceramic substrates on the first and second positioning platforms respectively. This step can also be operated by mechanical equipment, further automating the packaging of identification cards, greatly improving production efficiency and reducing labor costs. Furthermore, the first and second positioning platforms can respectively position the upper and lower ceramic substrates to prevent misalignment, ensuring packaging accuracy (packaging accuracy reaches 0.01-0.03mm) and improving yield.

[0019] 2. Precise control of adhesive overflow for easy cleaning and chip protection: This application also provides a first shielding part on the screen printing plate. The first shielding part creates a reserved area on the lower ceramic substrate without adhesive coating when applying adhesive. There is a gap between the edge of the reserved area and the edge of the chip hole. When the upper ceramic substrate covers the lower ceramic substrate, there is a certain distance between the adhesive layer and the chip hole. This allows the adhesive to overflow into the reserved area when the identification card is pressed down to cure, without causing the risk of hollowing. Moreover, the adhesive will not overflow too much from the chip hole. The overflowing adhesive will only cover the edge of the chip at most, which is easy to wipe clean. It only takes 1 to 2 minutes to wipe away the overflowing adhesive. There is no need to scrape the chip with a soft adhesive strip, which will not damage the chip and improve the production efficiency and yield of identification card manufacturing.

[0020] 3. Dual-sided independent temperature control heating ensures uniform heating: The curing equipment used in this application is equipped with heating devices in both the upper punch plate and the lower punch platform. When the identification card is pressed down, the upper punch plate and the lower punch platform heat the identification card simultaneously, that is, heat both the upper and lower sides of the identification card at the same time. This ensures uniform heating of the identification card, reduces bending of the identification card, and improves the yield rate. Moreover, the two heating devices can independently control the heating temperature, which can be controlled at different heating temperatures to cope with the heating differences of the upper and lower ceramic substrates of different thicknesses. This ensures that the temperature is transferred to the bonding interface at a consistent speed, making the identification card heatd uniformly and further improving the yield rate.

[0021] 4. Optimize semi-curing parameters to balance curing and wipeability: This application selects appropriate heating temperature and heating time, namely, the upper punch temperature is 90℃-110℃ and the lower punch temperature is 95℃-120℃, with the upper punch temperature being 5℃-10℃ lower than the lower punch temperature, and the heating time is 60s-110s. This allows the adhesive to be semi-cured while the adhesive overflowing onto the surface of the identification card is not fully cured. This not only allows the overflowing adhesive to be wiped off easily, but also ensures that the upper and lower ceramic substrates will not move or misalign at this semi-cured stage. Furthermore, subsequent natural air drying for 4 hours is sufficient to complete curing, shortening the curing time and improving production efficiency. Attached Figure Description

[0022] Figure 1 This is an exploded view of the identification card of the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of the ceramic substrate of the present invention.

[0024] Figure 3 This is a schematic diagram of the structure of the identification card of the present invention.

[0025] Figure 4 This is a schematic diagram of the packaging device of the present invention in standby mode.

[0026] Figure 5 This is a schematic diagram of the encapsulation device of the present invention in the state of applying adhesive.

[0027] Figure 6 This is a schematic diagram of the structure of the packaging device of the present invention covering the upper and lower ceramic substrates.

[0028] Figure 7 This is a schematic diagram of the curing device of the present invention in standby mode.

[0029] Figure 8 This is a schematic diagram of the structure of the curing device of the present invention under pressure curing state.

[0030] Figure 9 This is a flowchart of the method of the present invention.

[0031] Label Explanation: 1. Lower ceramic substrate; 11. Coil groove; 12. Chip slot; 2. Upper ceramic substrate; 21. Chip hole; 22. Reserved area; 3. Chip; 4. Packaging equipment; 41. First positioning platform; 42. Second positioning platform; 43. Screen printing squeegee mechanism; 431. Squeegee; 432. Guide shaft; 433. Second forward / backward cylinder; 434. Second lifting cylinder; 435. Fixing plate; 44. Glue application platform; 441. Glue application position; 442. Screen printing stencil; 45. First moving module; 451. First forward / reverse cylinder; 452. First lifting cylinder; 453. Swing cylinder; 46. First positioning cylinder; 461. First push plate; 47. Second positioning cylinder; 48. First frame; 481. Base plate; 482. Vertical plate; 49. Start button; 5. Curing equipment; 51. Second frame; 52. Lower punch platform; 521. Placement position; 53. Upper punch plate; 54. Lower pressing cylinder; 55. Second moving module; 56. Temperature sensor; 57. Temperature controller; 58. Digital pressure gauge. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application, and the range values ​​mentioned in this application all include endpoint values.

[0033] Key references Figures 4-6 This invention provides a packaging device for a ceramic identification card, including a first positioning platform 41, a second positioning platform 42, a screen printing adhesive scraping mechanism 43, an adhesive brushing platform 44, and a first moving module 45. The first positioning platform 41 is used to load and position the upper ceramic substrate 2. Specifically, a horizontally movable first positioning cylinder 46 is provided on one side of the first positioning platform 41, and a vacuum suction cup and a positioning side are provided on the first positioning platform 41. After the upper ceramic substrate 2 is placed on the first positioning platform 41, the first positioning cylinder 46 will push the upper ceramic substrate 2 to move against the positioning side, and then the vacuum suction cup will open to adsorb and position the upper ceramic substrate 2, thus fixing the upper ceramic substrate 2. During the subsequent movement of the first positioning platform 41, the upper ceramic substrate 2 will not shift.

[0034] Key references Figures 4-5The first positioning cylinder 46 is provided with a first push plate 461, and the first push plate 461 is provided with a positioning notch at a 90° angle. The positioning notch can cooperate with one corner of the upper ceramic substrate 2. That is, the first positioning cylinder 46 is a diagonal positioning cylinder. After the upper ceramic substrate 2 is placed on the first positioning platform 41, the first positioning cylinder 46 is pushed out horizontally from the diagonal direction of the upper ceramic substrate 2, which can push the upper ceramic substrate 2 to abut against the positioning side without the need for other structures to assist in positioning.

[0035] The second positioning platform 42 is used to load and position the lower ceramic substrate 1. The structure of the second positioning platform 42 is the same as that of the first positioning platform 41. Both are equipped with a vacuum suction cup and a positioning side, and a second positioning cylinder 47 is provided on one side. The structure of the second positioning cylinder 47 is the same as that of the first positioning cylinder 46. After the lower ceramic substrate 1 is placed on the second positioning platform 42, the lower ceramic substrate 1 can be positioned.

[0036] The first positioning platform 41 is mounted on the first moving module 45 and driven by the first moving module 45 to move up and down, move horizontally, and rotate. The first moving module 45 specifically includes a first forward and backward cylinder 451, a first lifting cylinder 452, and a swing cylinder 453. The first lifting cylinder 452 is mounted on the first forward and backward cylinder 451. The first positioning platform 41 is rotatably mounted on the first lifting cylinder 452 via the swing cylinder 453. The first forward and backward cylinder 451 and the first lifting cylinder 452 can drive the first positioning platform 41 to move forward and backward and up and down, respectively. The swing cylinder 453 can drive the first positioning platform 41 to flip.

[0037] The glue application platform 44 is positioned above the first positioning platform 41, and has a vertically extending glue application position 441. A screen printing stencil 442 with a mesh size of 150 is installed within the glue application position 441. The screen printing squeegee mechanism 43 is positioned above the glue application platform 44. Driven by the first moving module 45, the upper ceramic substrate 2 moves to a position where it is in contact with the bottom surface of the screen printing stencil 442. The screen printing squeegee mechanism 43 then applies glue to the screen printing stencil 442, thereby applying the glue to the bottom surface of the upper ceramic substrate 2, achieving automatic glue application. The glue application process is as follows: Figure 5 As shown. After the adhesive is applied, the first moving module 45 drives the upper ceramic substrate 2 to move above the lower ceramic substrate 1 on the second positioning platform 42. Then, it drives the upper ceramic substrate 2 to flip so that its bottom surface faces down. Finally, it drives the upper ceramic substrate 2 to move downwards until it covers the lower ceramic substrate 1, thus completing the automatic encapsulation of the identification card. The covered state is as shown. Figure 6 As shown. After assembly, the vacuum suction cup is closed, and the identification card can be removed for the subsequent curing process.

[0038] Preferably, the second positioning platform 42 is located to one side of the first positioning platform 41, specifically in front of the first positioning platform 41. The first positioning platform 41, the second positioning platform 42, and the adhesive application position 441 are aligned on a straight line. The first moving module 45 drives the upper ceramic substrate 2 to move back and forth and lift and lower to complete the adhesive application and assembly actions. The second positioning platform 42 is also preferably an XYR three-axis platform, capable of forward, backward, left, right, and rotational movement, allowing for more precise adjustment of the position and angle of the lower ceramic substrate 1 to ensure vertical alignment with the upper ceramic substrate 2 and improve packaging accuracy. Through the positioning of the above structure, the packaging accuracy of the upper and lower ceramic substrates 1 can be controlled within 0.01mm-0.03mm.

[0039] Furthermore, a first shielding portion is provided on the screen printing stencil 442 corresponding to the chip hole 21 of the upper ceramic substrate 2, and the first shielding portion forms a reserved area 22 on the upper ceramic substrate 2 where no adhesive is applied; Figure 1 As shown, there is a gap between the edge of the reserved area 22 and the edge of the chip hole 21. Taking the chip hole 21 as a rectangular hole with a length of 11.25mm and a width of 8.5mm as an example, the reserved area 22 is rectangular, and the distance between each side of the reserved area 22 and the corresponding side of the chip hole 21 is 2.5mm-3.5mm. By setting the reserved area 22, when the semi-cured identification card is pressed down, the glue will overflow into the reserved area 22 without causing the risk of hollowing, and the glue will not overflow too much from the chip hole 21. The overflowing glue will only cover the edge of the chip 3 at most, which is easy to wipe clean.

[0040] Except for the reserved area 22, the part of the upper ceramic substrate 2 near the edge is not coated with glue. The length of the upper and lower ceramic substrates 1 is 85.6mm and the width is 43.98mm. After screen printing and squeegeeing, an glue layer is formed on the bottom surface of the upper ceramic substrate 2. The distance between the glue layer and the edge of the upper ceramic substrate 2 is controlled to be about 0.5mm. That is, a second shielding part with a width of 0.5mm is set at the edge of the screen printing plate 442, or the length and width of the screen printing plate 442 are set to be 0.5mm smaller than the upper ceramic substrate 2, so that no glue is sprayed on the edge area of ​​the upper ceramic substrate 2, and the glue overflows too much from the periphery of the identification card and is not easy to clean.

[0041] Key references Figures 4-6The packaging device 4 also includes a first frame 48, which includes a base plate 481 and a vertical plate 482. The vertical plate 482 is vertically arranged on the base plate 481. The first moving module 45, the second positioning platform 42, the first positioning cylinder 46 and the second positioning cylinder 47 are all arranged on the base plate 481. The base plate 481 is also provided with a start button 49 for starting the positioning operation of the ceramic substrate. The glue application platform 44 is mounted on the vertical plate 482. The screen printing glue scraping mechanism 43 includes a scraper 431, a guide shaft 432, a second forward / backward cylinder 433, a second lifting cylinder 434, and a fixed plate 435. The fixed plate 435 is mounted on the vertical plate 482 by moving back and forth through the second forward / backward cylinder 433. The second lifting cylinder 434 is mounted on the fixed plate 435. The scraper 431 is mounted below the fixed plate 435. The guide shaft 432 passes through the fixed plate 435 and connects the second lifting cylinder 434 and the scraper 431. The scraper 431 is driven to move up and down and back and forth by the second forward / backward cylinder 433 and the second lifting cylinder 434 to achieve glue scraping.

[0042] Key references Figures 7-8 This application also provides a card curing device. The curing device 5 includes a second frame 51, a lower punching platform 52, an upper punching plate 53, and a lowering cylinder 54. The second frame 51 is mounted above the lower punching platform 52. The upper punching plate 53 is scissor-mounted on the second frame 51 and located above the lower punching platform 52. The lowering cylinder 54 is mounted on the second frame 51 to drive the upper punching plate 53 to move up and down. The lower punching platform 52 is provided with a placement position 521 for placing the card. Both the upper punching plate 53 and the lower punching platform 52 are provided with heating devices (not shown in the figure). The heating devices can be resistance wires, ceramic heating plates, heating rods, or other devices that can control the heating temperature.

[0043] After the assembled identification card is placed on the placement position 521 of the lower punching platform 52, the upper punching plate 53 moves downward to press down on the identification card. Simultaneously, the upper punching plate 53 and the lower punching platform 52 heat and semi-cur the identification card, completing the packaging and curing process. The heating devices in both the upper punching plate 53 and the lower punching platform 52 heat the identification card, ensuring uniform heating, reducing bending, and improving yield. Furthermore, the two heating devices can independently control their heating temperatures to address the heating differences between the upper and lower ceramic substrates 1 of varying thicknesses. This ensures consistent heat transfer to the bonding interface, further improving yield. For example, if the lower ceramic substrate 1 requires a coil groove 11, its thickness will be greater than that of the upper ceramic substrate 2. Greater thickness results in a larger heat capacity, requiring a higher temperature for rapid heat transfer to the bonding interface. Therefore, the heating temperature of the lower punching platform 52 needs to be slightly higher than that of the upper punching plate 53 to ensure consistent heat transfer to the bonding interface.

[0044] Preferably, to facilitate the placement of the identification card, a second moving module 55 is provided below the second frame 51. The lower punching platform 52 is mounted on the second moving module 55. The second moving module 55 can drive the lower punching platform 52 to move away from the upper punching plate 53 to facilitate the placement of the identification card, and then drive the lower punching platform 52 to move directly below the upper punching plate 53 for curing. Specifically, the second moving module 55 can be a forward / reverse cylinder that can drive the lower punching platform 52 to move back and forth. In addition, temperature sensors 56 are provided on both the upper and lower punching plates, and a temperature controller 57 is provided on the second frame 51 to facilitate the control and monitoring of the upper and lower punching temperatures. A digital pressure gauge 58 is also provided on the second frame 51 to facilitate the monitoring of the pressure of the upper punching plate 53.

[0045] Key references Figure 7 The lower punching platform 52 is provided with multiple positioning pins, which surround each other to form a placement position 521 for the identification card. The positioning pins have a positioning function and can prevent the upper and lower ceramic substrates 1 from shifting relative to each other.

[0046] like Figure 9 As shown, the present invention also provides a packaging process for a ceramic identification card, comprising the following steps: S1. Loading and positioning the ceramic substrate: Place the upper ceramic substrate 2 with its bottom surface facing up on the first positioning platform 41. The first positioning cylinder 46 extends and pushes the upper ceramic substrate 2 to move to the side of the positioning. Then, the vacuum suction cup is opened to adsorb and position the upper ceramic substrate 2. At the same time, install the induction coil and the chip 3 on the lower ceramic substrate 1. The induction coil is installed in the coil groove 11 of the lower ceramic substrate 1. The integrated circuit part at the bottom of the chip 3 is embedded in the chip slot 12 and connected to the induction coil. Specifically, glue can be applied to the coil groove 11 and the chip slot 12 first, and then the induction coil and the chip 3 can be embedded to ensure the strong adhesion of the induction coil and the chip 3. In addition, the induction coil will lead out two leads to the chip slot 12 and connect to the integrated circuit part at the bottom of the chip 3. This is the prior art. For details, please refer to patent CN115401767A. It will not be described in detail here. The induction coil is an FPC coil with a thickness of 0.06mm-0.07mm and a groove depth of 0.09mm-0.11mm in the coil groove 11. Then, the lower ceramic substrate 1 is placed on the second positioning platform 42 with its top surface facing up, and the lower ceramic substrate 1 is adsorbed and positioned. The adsorption and positioning steps are the same as those for the upper ceramic substrate.

[0047] S2. Automatic Adhesive Application: The first moving module 45 drives the first positioning platform 41 to move, causing the upper ceramic substrate 2 to move until it is in contact with the bottom surface of the screen printing stencil 442. Then, the screen printing adhesive scraping mechanism 43 scrapes adhesive onto the screen printing stencil 442 to apply adhesive to the bottom surface of the upper ceramic substrate 2. A first blocking part is provided on the screen printing stencil 442 corresponding to the chip hole 21 position of the upper ceramic substrate 2. The first blocking part forms a reserved area 22 on the upper ceramic substrate 2 where no adhesive is applied. There is a gap between the edge of the reserved area 22 and the edge of the chip hole 21. The chip hole 21 in this application is a rectangular hole with a length of 11.2 mm. The reserved area 22 is rectangular, with a length of 5mm and a width of 8.5mm. The distance between each side of the reserved area 22 and the corresponding side of the chip hole 21 is 2.5mm-3.5mm. Therefore, the length of the reserved area 22 ranges from 13.75mm to 14.75mm, and the width ranges from 11mm to 12mm. This size of the reserved area 22 ensures that when the semi-cured identification card is pressed down, the adhesive will overflow into the reserved area 22 without causing any hollow areas. Furthermore, the adhesive will not overflow excessively from the chip hole 21; the overflowing adhesive will only cover the edge of the chip 3, making it easy to wipe clean. In addition to the reserved area 22, the portion of the upper ceramic substrate 2 near the edge is also not coated with adhesive to prevent excessive adhesive overflow from around the identification card, which would be difficult to clean.

[0048] S3. Automatic Assembly and Closing: After the screen printing and adhesive application are completed, the first moving module 45 drives the first positioning platform 41 to move, causing the upper ceramic substrate 2 to move above the lower ceramic substrate 1. Then, the first moving module 45 drives the first positioning platform 41 to flip, causing the upper ceramic substrate 2 to flip so that its bottom surface faces down. Figure 6 As shown, the upper ceramic substrate 2 is then driven downwards to combine with the lower ceramic substrate 1 to form an identification card. Simultaneously, the chip 3 is embedded in the chip hole 21 of the upper ceramic substrate 2. It should be noted that the adhesive used in this application is a relatively viscous AB adhesive, which is paste-like. At room temperature (25°C), the adhesive viscosity reaches 100,000-120,000 mPA·s. The thickness applied to the upper ceramic substrate using a screen printing plate does not exceed 0.1 mm. Therefore, when the upper ceramic substrate is flipped to face down after applying the adhesive, the adhesive on the upper ceramic substrate will not drip or shift due to gravity.

[0049] S4. Semi-curing: Before the curing process, the chip 3 needs to be covered with high-temperature tape. First, control the vacuum suction cups on the first positioning platform 41 and the second positioning platform 42 to close, remove the identification card, and cover the chip 3 on the identification card with high-temperature tape that can withstand 300℃ and whose length and width are respectively greater than or equal to the length and width of the chip 3 by 6mm. The chip 3 must be located in the center of the high-temperature tape, ensuring that the area 3mm away from the outer edge of the chip 3 is covered. The high-temperature tape has the function of heat insulation and protecting the chip 3 from scratches, and can also absorb some of the excess adhesive. When the high-temperature tape is removed later, some of the adhesive can also be removed.

[0050] The assembled identification card is semi-cured using curing device 5, with particular attention to... Figure 7 Specifically, the assembled identification card is placed on the placement position 521 of the lower punching platform 52. Then, the second moving module 55 drives the lower punching platform 52 to move directly below the upper punching plate 53. Then, the lowering cylinder 54 is activated, causing the upper punching plate 53 to press down on the identification card. Simultaneously, the upper punching plate 53 and the lower punching platform 52 heat and semi-cur the identification card, ensuring uniform heating and completing the semi-curing process. During this process, the simultaneous heating and semi-curing of the identification card by the upper punching plate 53 and the lower punching platform 52 ensures uniform heating, reduces card bending, and improves the yield rate.

[0051] Specifically, the thickness of the upper ceramic substrate 2 is 0.33mm, the thickness of the lower ceramic substrate 1 is 0.47mm, and the depth of the chip slot 12 is 0.3mm. The identification card chip 3 is placed face up on the lower punching platform 52. The heating temperature of the identification card by the upper punching plate 53 is the upper punching temperature, which is 90℃-110℃. The heating temperature of the identification card by the lower punching platform 52 is the lower punching temperature, which is 95℃-120℃. Since the thickness of the upper ceramic substrate 2 is smaller than that of the lower ceramic substrate 1, the upper punching temperature is 5℃-10℃ lower than the lower punching temperature. The heating time is 60s-110s.

[0052] Furthermore, during the pressing of the identification card, if the air pressure of the pressing cylinder 54 is too low, the identification card cannot be pressed tightly; if it is too high, the identification card will be damaged. Therefore, it is necessary to select an appropriate air pressure to ensure that the identification card is pressed tightly without damaging it. To this end, the assembled identification card was subjected to a pressing air pressure adjustment test. The identification card was placed in the curing device 5, and different cylinder pressures were set to press the identification card. The test results are shown in Table 1.

[0053] Table 1 - Test Parameters for Pressure Adjustment of the Lower Cylinder of the Curing Equipment

[0054] As shown in Table 1, when the air pressure of the lower cylinder 54 is less than 0.3 MPa, the adhesive cannot be properly squeezed out of the identification card, resulting in an excessively thick overall thickness of the identification card and gaps at the bonding point of the upper and lower ceramic substrates, indicating that the cards are not fully compressed. While the air pressure is greater than 0.7 MPa, although the identification card can be compressed, the excessive pressure will damage the card. Therefore, the optimal air pressure is 0.3 MPa-0.7 MPa, which can properly squeeze out the adhesive and ensure a seamless connection between the upper and lower ceramic substrates.

[0055] To verify the rationality of the heating temperature and heating time, the assembled identification cards were tested in a curing device at a pressure of 0.5 MPa for different heating temperatures and heating times. First, the heating time was tested. Since the adhesive used is resistant to temperatures above 100°C, to ensure rapid curing, an upper and lower pressure temperature of 110°C was used to test the adhesive curing effect at different heating times. During testing, the assembled identification card samples were placed in the packaging device, with each identification card representing one sample. Under otherwise unchanged conditions, multiple samples could be tested using different heating times to increase the accuracy of the test. In this embodiment, three samples were specifically used for testing, and the test results are shown in Table 2.

[0056] Table 2 - Test parameters for curing heating time

[0057] As shown in Table 2, setting a heating time of 50 seconds or more can make the upper and lower ceramic substrates fit together without gaps, allowing the adhesive to cure and achieve bonding. To further select a suitable heating time and temperature, tests were conducted using different heating times and temperatures. During the tests, except for the heating time and temperature, other conditions were the same as those for the heating time test (i.e., using a cylinder air pressure of 0.5 MPa). The test results are shown in Table 3.

[0058] Table 3 - Test parameters for curing heating temperature and time

[0059] As shown in Table 3, the heating time and temperature are most suitable when the heating time is 60s-110s, the upper punch temperature is 90℃-110℃, and the lower punch temperature is 95℃-120℃ (if the thickness difference between the upper and lower ceramic substrates is not considered, the upper punch temperature and the lower punch temperature are most suitable when both are controlled within the range of 110±15℃). Within this time and temperature range, the adhesive can be semi-cured, and the adhesive overflowing onto the surface of the identification card is not completely cured. In the subsequent step S5, the overflowing adhesive can be easily wiped off, and it can also be ensured that the upper and lower ceramic substrates will not move or misalign at this semi-cured state.

[0060] S5. Surface Adhesive Removal: After semi-curing, remove the high-temperature tape and check around chip 3 for any card body breakage, protrusions, chip 3 centering, exposed core wires, or exposed white areas. After checking and finding no problems, wipe the adhesive on chip 3 clean with a lint-free cloth dampened with anhydrous ethanol. Since a small amount of adhesive has overflowed onto the chip edge, wiping for 1-2 minutes is sufficient to remove the adhesive. Then, use a lint-free cloth dampened with alcohol to wipe the remaining adhesive on the surface of the identification card. Finally, apply protective film to the top and bottom surfaces of the identification card.

[0061] S6. Natural air drying and curing: After removing the adhesive, place the identification card in a room temperature environment to air dry naturally for 4 hours to allow the adhesive to fully cure and complete the encapsulation process. After completion, the identification card can be subjected to appearance inspection and electrical testing to obtain the final good product.

[0062] Furthermore, to verify the area range of the reserved area 22 in step S2, the present invention conducted experimental tests on the reserved area 22 of different sizes of the identification card, using a cylinder air pressure of about 0.5MPa, and controlling the upper and lower stroke temperatures at about 110℃. The test results are shown in Table 4.

[0063] Table 4 - Test Parameters for Package Reserved Area Range

[0064] In Table 4, the distance reserved on one side around the chip hole 21 is the distance between each side of the reserved area 22 and the corresponding side of the chip hole 21. This distance is referred to as the reserved distance. As shown in Table 4, when the allowance is less than or equal to 2mm, too much adhesive overflows and covers the chip, making it difficult to clean. It takes 2 to 8 minutes to clean, and the adhesive hardens during the cleaning process, requiring a soft rubber strip to scrape it off, which can scratch the chip. When the allowance is greater than or equal to 4.5mm, no adhesive overflow is visible at the edge of the chip hole 21, meaning the adhesive does not overflow from the chip hole 21. There may be some areas between the upper and lower ceramic substrates without adhesive, posing a risk of voids. While no void risk is detected when the allowance is 4mm, 4mm is a critical value. To completely avoid void risks, a allowance of less than or equal to 3.5mm is the safest. Therefore, the optimal allowance range is 2.5mm-3.5mm, which ensures no voids while controlling a small amount of adhesive overflow, facilitating subsequent cleaning. Only 1 to 2 minutes of cleaning is needed to remove the adhesive, improving production efficiency.

[0065] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0066] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A packaging process for a ceramic identification card, characterized in that: A packaging device (4) is used for packaging. The packaging device (4) includes a first positioning platform (41), a second positioning platform (42), a screen printing glue scraping mechanism (43), a glue brushing platform (44), and a first moving module (45). The first positioning platform (41) is used to load and position the upper ceramic substrate (2), and the first positioning platform (41) is set on the first moving module (45) and driven by the first moving module (45) to move up and down, move horizontally and rotate; the glue application platform (44) is set above the first positioning platform (41), and the glue application platform (44) is provided with a vertically penetrating glue application position (441), the glue application position (441) is provided with a screen printing stencil (442), and the screen printing glue scraping mechanism (43) is set above the glue application platform (44); the second positioning platform (42) is used to load and position the lower ceramic substrate (1), and the second positioning platform (42) is located on one side of the first positioning platform (41); The packaging process includes the following steps: S1. Loading and positioning the ceramic substrate: Place the upper ceramic substrate (2) with its bottom surface facing up on the first positioning platform (41) to position the upper ceramic substrate. At the same time, install the induction coil and the chip (3) on the lower ceramic substrate (1), so that the induction coil is inserted into the coil groove (11) of the lower ceramic substrate, and the integrated circuit part at the bottom of the chip (3) is embedded in the chip slot (12) and connected to the induction coil. Then, place the lower ceramic substrate with its top surface facing up on the second positioning platform (42) to position the lower ceramic substrate. S2, Automatic Glue Application: The first moving module (45) drives the first positioning platform (41) to move, so that the upper ceramic substrate (2) is attached to the bottom surface of the screen printing stencil (442). Then the screen printing glue scraping mechanism (43) scrapes the glue onto the screen printing stencil to apply the glue to the bottom surface of the upper ceramic substrate. A first shielding part is provided on the screen printing stencil corresponding to the chip hole (21) of the upper ceramic substrate. The first shielding part forms a reserved area (22) on the upper ceramic substrate that is not coated with glue. There is a gap between the edge of the reserved area (22) and the edge of the chip hole (21). S3. Automatic assembly and sealing: After the screen printing and adhesive application are completed, the first moving module (45) drives the first positioning platform (41) to move, so that the upper ceramic substrate (2) flips to the bottom face down, and then moves down to seal with the lower ceramic substrate (1) to form an identification card. At the same time, the chip (3) is embedded in the chip hole (21) of the upper ceramic substrate. S4, semi-curing: The assembled identification card is semi-cured by a curing device (5). The curing device (5) includes a lower punching platform (52) and an upper punching plate (53). The upper punching plate (53) is raised and lowered above the lower punching platform (52). The lower punching platform (52) is provided with a placement position (521) for placing the identification card. Both the upper punching plate (53) and the lower punching platform (52) are provided with heating devices. The chip (3) is covered on the identification card with high temperature tape. Then the identification card is placed on the placement position (521) of the lower punching platform (52). Then the upper punching plate (53) moves down to press down the identification card. At the same time as pressing down, the upper punching plate (53) and the lower punching platform (52) heat the identification card to semi-cur it. S5. Surface adhesive removal: After semi-curing, remove the high-temperature tape and wipe the adhesive off the chip (3) and the surface of the identification card. S6. Natural air drying and curing: After removing the adhesive, place the identification card in a room temperature environment to air dry naturally for 4 hours to allow the adhesive to fully cure.

2. The packaging process for a ceramic identification card as described in claim 1, characterized in that: The first positioning platform (41) is provided with a horizontally movable first positioning cylinder (46) on one side. The first positioning platform (41) is provided with a vacuum suction cup and a positioning side. The structure of the second positioning platform (42) is the same as that of the first positioning platform (41), and a second positioning cylinder (47) is provided on one side of the second positioning platform (42). The structure of the second positioning cylinder (47) is the same as that of the first positioning cylinder (46). Thus, in step S1, after the upper ceramic substrate (2) is placed on the first positioning platform (41), the first positioning cylinder (46) pushes the upper ceramic substrate (2) to abut against the positioning side. Then the vacuum suction cup is opened to adsorb and position the upper ceramic substrate (2). The adsorption and positioning steps of the lower ceramic substrate (1) are the same as those of the upper ceramic substrate (2).

3. The packaging process for a ceramic identification card as described in claim 2, characterized in that: In step S1, the first positioning cylinder (46) is provided with a first push plate (461), and the first push plate (461) is provided with a positioning notch at a 90° angle. The positioning notch cooperates with a corner of the upper ceramic substrate (2) to push the upper ceramic substrate (2) to move to the side of the positioning.

4. The packaging process for a ceramic identification card as described in claim 1, characterized in that: In step S2, the chip hole (21) is a rectangular hole with a length of 11.25 mm and a width of 8.5 mm. The reserved area (22) is rectangular, and the distance between each side of the reserved area (22) and the corresponding side of the chip hole (21) is 2.5 mm to 3.5 mm.

5. The packaging process for a ceramic identification card as described in claim 4, characterized in that: In step S2, the length of the upper and lower ceramic substrates (1) is 85.6 mm and the width is 43.98 mm. After screen printing and squeegeeing, an adhesive layer is formed on the bottom surface of the upper ceramic substrate (2). A second shielding part is provided at the edge of the screen printing stencil (442), or the size of the screen printing stencil (442) is set smaller than that of the upper ceramic substrate (2), so that the distance between the edge of the adhesive layer and the edge of the upper ceramic substrate (2) is 0.5 mm.

6. The packaging process for a ceramic identification card as described in claim 1, characterized in that: In step S5, the thickness of the upper ceramic substrate (2) is 0.33 mm, the thickness of the lower ceramic substrate (1) is 0.47 mm, the upper punch plate (53) is driven to rise and fall by a lower pressure cylinder (54) to place the identification card chip (3) facing upward on the lower punch platform (52), the air pressure of the lower pressure cylinder (54) is controlled at 0.3 MPa-0.7 MPa, the heating temperature of the identification card by the upper punch plate (53) is the upper punch temperature, which is 90℃-110℃, the heating temperature of the identification card by the lower punch platform (52) is the lower punch temperature, which is 95℃-120℃, and the upper punch temperature is 5℃-10℃ lower than the lower punch temperature, and the heating time is 60s-110s.

7. The packaging process for a ceramic identification card as described in claim 1, characterized in that: In step S3, the chip (3) is covered with a high-temperature resistant tape that can withstand 300°C and has a length and width that are greater than or equal to the length and width of the chip (3) by 6 mm. The chip (3) is located in the center of the high-temperature tape, ensuring that the area 3 mm away from the outer edge of the chip (3) is covered.

8. The packaging process for a ceramic identification card as described in claim 1, characterized in that: In step S4, the curing device (5) further includes a second moving module (55). The lower punching platform (52) is set on the second moving module (55) and is driven by the second moving module (55) to move horizontally. After the identification card is placed in the placement position (521), the second moving module (55) drives the lower punching platform (52) to move directly below the upper punching plate (53), and then the upper punching plate (53) presses down to perform semi-curing.

9. A ceramic identification card packaging device (4), applied in the packaging process described in any one of claims 1-8, characterized in that: Includes a first positioning platform (41), a second positioning platform (42), a screen printing glue scraping mechanism (43), a glue application platform (44), and a first moving module (45). The first positioning platform (41) is used to load and position the ceramic substrate (2), and the first positioning platform (41) is set on the first moving module (45) and driven by the first moving module (45) to move up and down, move horizontally and rotate; the glue application platform (44) is set above the first positioning platform (41), and the glue application platform (44) is provided with a vertically penetrating glue application position (441), the glue application position (441) is provided with a screen printing stencil (442), and the screen printing glue scraping mechanism (43) is set on the glue application platform (44). Above; after the moving module drives the upper ceramic substrate (2) to be attached to the bottom surface of the screen printing plate (442), the screen printing squeegee mechanism (43) scrapes the screen printing plate (442) to apply glue to the bottom surface of the upper ceramic substrate (2). A first shielding part is provided on the screen printing plate (442) corresponding to the chip hole (21) of the upper ceramic substrate (2). The first shielding part forms a reserved area (22) on the upper ceramic substrate (2) without glue coating. There is a gap between the edge of the reserved area (22) and the edge of the chip hole (21). The second positioning platform (42) is used to load and position the lower ceramic substrate (1), and the second positioning platform (42) is located on one side of the first positioning platform (41). The upper ceramic substrate (2) after being coated with adhesive is driven by the first moving module (45) to flip and cover the lower ceramic substrate (1) from top to bottom.

10. The packaging device (4) for a ceramic identification card as described in claim 9, characterized in that: The first positioning platform (41) is provided with a horizontally movable first positioning cylinder (46) on one side. The first positioning cylinder (46) is provided with a first push plate (461). The first push plate (461) is provided with a positioning notch at a 90° angle. The positioning notch cooperates with a corner of the upper ceramic substrate (2) to push the upper ceramic substrate (2) for positioning. The first positioning platform (41) is provided with a vacuum suction cup for adsorbing and fixing the upper ceramic substrate (2) and a positioning side for abutting and positioning the upper ceramic substrate (2). The structure of the second positioning platform (42) is the same as that of the first positioning platform (41), and a second positioning cylinder (47) is provided on one side of the second positioning platform (42). The structure of the second positioning cylinder (47) is the same as that of the first positioning cylinder (46).

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