A silicon nitride ceramic composition, a ceramic body, an electrostatic chuck, a method of manufacturing, and a semiconductor manufacturing apparatus

By introducing a silicon nitride ceramic composition of metal fluorides and transition metal oxides, the problems of untunable resistivity and poor corrosion resistance of Si3N4 ceramic materials in semiconductor devices are solved, and a silicon nitride ceramic body with high corrosion resistance and high thermal conductivity is prepared, which is suitable for electrostatic chucks and improves the stability and reliability of semiconductor manufacturing equipment.

CN121673068BActive Publication Date: 2026-06-16SINOMA ADVANCED NITRIDE CERAMICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SINOMA ADVANCED NITRIDE CERAMICS CO LTD
Filing Date
2026-02-10
Publication Date
2026-06-16

AI Technical Summary

Technical Problem

Existing Si3N4 ceramic materials have high and uncontrollable resistivity in semiconductor equipment, and are unstable in plasma environments, failing to meet the resistivity control requirements of electrostatic chucks. Furthermore, existing Si3N4 ceramic materials are not corrosion resistant in highly corrosive gases, affecting wafer adsorption stability and equipment reliability.

Method used

A silicon nitride ceramic composition containing Si3N4, metal fluoride sintering aids, and transition metal oxides was used to prepare a silicon nitride ceramic body with high corrosion resistance and high thermal conductivity by controlling the resistivity and forming a stable grain boundary phase during sintering, combined with optimized preparation methods such as tape casting-temperature isostatic pressing-gas pressure sintering process.

Benefits of technology

Stable control of the resistivity of Si3N4 ceramic material within the range of 108~1013 Ω·cm was achieved, the corrosion resistance was improved by 8 times, the thermal conductivity was increased to over 75 W·m-1·K-1, and the mechanical properties were excellent. It is suitable for high-performance electrostatic chucks and improves the long-term stability and reliability of semiconductor manufacturing equipment.

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Abstract

The application relates to the technical field of semiconductor ceramic materials, and discloses a silicon nitride ceramic composition, a ceramic body, an electrostatic chuck, a preparation method and a semiconductor manufacturing device. The silicon nitride ceramic composition provided by the application contains, in terms of molar parts, raw materials including 85-95 parts of Si3N4, 2-10 parts of a sintering aid and 2-5 parts of a transition metal oxide, wherein the sintering aid includes a metal fluoride sintering aid. The synergistic effect of the base components of the silicon nitride ceramic composition provided by the application improves the thermal conductivity (>75 W.m ‑1 ·K ‑1 ) and the mechanical properties (bending strength >900 MPa, fracture toughness >6.0 MPa.m 1 / 2 ) of the material, and realizes the synergistic improvement of corrosion resistance, thermal conductivity and electrical properties.
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