Silicon photon gyroscope suitable for wide-temperature-range self-adaptive power control and control method thereof

Abstract

The invention provides a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control and a control method thereof. The silicon photonic gyroscope comprises an optical chip, an optical fiber loop and an integrated circuit, the optical chip comprises a light source, a coupler, a first detector, a second detector, a modulator and a thermistor; the integrated circuit comprises a half-wave voltage control module, a light source intelligent temperature control module, a driving temperature control module and a signal demodulation module; a thermistor is integrated on a silicon photon chip to measure the working temperature of the chip in real time, meanwhile, the magnitude and direction of TEC current are measured in real time to sense refrigeration / thermal power, the magnitude of the current TEC current is comprehensively designed according to the power derating level, and the driving power of a light source is precisely regulated and controlled by adopting an advanced intelligent algorithm; the temperature and the power consumption are considered to achieve the optimal control strategy of the optical chip, and the gyro output real-time compensation is performed in the signal demodulation module aiming at the current temperature and the driving current, so that the gyro output error caused by the dynamic temperature adjustment and the unsteady state of the driving current is avoided.

Description

Technical Field

[0001] This invention relates to the field of optical gyroscope technology, and in particular to a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control and its control method. Background Technology

[0002] When GPS is unavailable for extended periods, optical gyroscopes are the preferred sensors for inertial navigation systems. Since their invention, millions of optical gyroscopes have been manufactured and applied in specific high-performance applications where their high cost is affordable. Traditional inertial navigation systems often use fiber optic gyroscopes and ring laser gyroscopes, but these suffer from large size, high power consumption, and high cost. This is mainly because traditional fiber optic gyroscopes are built using discrete components, all of which are independently packaged optoelectronic devices. Furthermore, multiple components require optical path splicing and tray mounting, making it difficult to control size and cost, thus hindering miniaturization and low-cost development.

[0003] In recent years, silicon photonic gyroscopes, which integrate multiple materials on a silicon substrate, have gradually become an important development direction in the industry. Utilizing integrated silicon photonics technology, they achieve on-chip integration of multiple discrete functional devices, offering significant advantages such as high integration density, small size, low power consumption, and cost-effectiveness. They can be directly integrated onto PCBs and are suitable for applications in autonomous vehicles, trucking, construction, drones, aerospace, defense, and consumer electronics. However, the small size of silicon photonic gyroscopes also presents challenges to performance improvement. First, as the gyroscope size decreases, the power density increases significantly to 3-5 times the previous level. This leads to a significant temperature rise in the gyroscope, causing a rapid increase in the load on the TEC cooler responsible for stabilizing the temperature of the silicon photonic chip. This results in a rapid increase in temperature control current and cooling power, further increasing the power consumption of the silicon photonic gyroscope. Second, the increased temperature significantly increases the temperature shock to the photosensitive components responsible for speed measurement. The symmetry of the miniaturized ring is inherently difficult to guarantee effectively, and such large temperature changes cause significant zero-position shifts in the gyroscope, thus degrading its performance. The aforementioned two issues lead to significant problems when applied in the fields of land, sea, air, and space. Therefore, ensuring stable power consumption of the gyroscope over a wide temperature range is the main challenge we currently face. Summary of the Invention

[0004] This invention provides a silicon photonic gyroscope and its control method suitable for wide-temperature-range adaptive power control, which can solve the technical problem that existing silicon photonic gyroscopes cannot ensure stable power consumption over a wide temperature range.

[0005] According to one aspect of the present invention, a silicon photonic gyroscope suitable for wide temperature range adaptive power control is provided. The silicon photonic gyroscope includes an optical chip, an optical fiber loop, and an integrated circuit. The optical chip includes a light source, a coupler, a first detector, a second detector, a modulator, and a thermistor. The integrated circuit includes a half-wave voltage control module, a light source intelligent temperature control module, a drive temperature control module, and a signal demodulation module.

[0006] The light source generates laser light with corresponding optical power based on the driving current and TEC current, and the laser light enters the coupler. The coupler splits the laser light into two paths, which enter the modulator and the second detector respectively. It also outputs interference light to the first detector. The modulator modulates the laser light according to the modulation voltage and splits the modulated laser light into two paths, which enter the fiber loop. The two laser lights rotate within the fiber loop, generating a Sagnac phase difference, and return to the modulator to form interference light. The first detector converts the interference light into an electrical signal and outputs it to the signal demodulation module. The second detector measures the power of the light source.

[0007] The half-wave voltage control module is used to generate a modulation voltage at the current operating temperature and output it to the modulator; the drive temperature control module is used to generate a drive current and receive the TEC current output by the intelligent temperature control module of the light source, and output the drive current and TEC current to the light source, and output the TEC current to the signal demodulation module; the intelligent temperature control module of the light source is electrically connected to the thermistor, and is used to obtain the current operating temperature of the optical chip, and determine the power derating level corresponding to the temperature difference between the current operating temperature and the set temperature based on the current operating temperature and the set temperature, thereby obtaining the power adjustment amount; it is also used to obtain the TEC current based on the power adjustment amount, and perform temperature adjustment on the optical chip based on the TEC current; the signal demodulation module is used to obtain the compensated angular velocity based on the demodulation sensitivity coefficient related to the electrical signal, the demodulation voltage related to the TEC current, the preamplifier gain compensation factor related to the current operating temperature, and the correction function of photoelectric conversion efficiency changing with temperature.

[0008] Preferably, the intelligent temperature control module for the light source includes a temperature acquisition module, a power setting module, and a temperature calculation module;

[0009] The temperature acquisition module is used to obtain the current operating temperature of the optical chip and send it to the temperature calculation module;

[0010] The power setting module is used to obtain the power adjustment coefficient based on the maximum power consumption allowed for each power derating level and the set power consumption, and output it to the temperature calculation module;

[0011] The temperature calculation module is used to determine the temperature threshold corresponding to different power derating levels, obtain the temperature difference between the current operating temperature and the set temperature, determine the power derating level corresponding to the temperature difference between the current operating temperature and the set temperature, and obtain the power adjustment coefficient corresponding to the current power derating level.

[0012] Used to obtain the power adjustment amount based on the power adjustment coefficient corresponding to the current power derating level, and by setting the power consumption and power action nonlinear function;

[0013] The TEC current is obtained based on the power consumption adjustment, proportional gain coefficient, and integral gain coefficient. If the TEC current is less than zero, the optical chip is heated; if the TEC current is greater than zero, the optical chip is cooled to achieve constant temperature control of the optical chip.

[0014] The power consumption is adjusted based on the power consumption adjustment amount and the set power consumption. If the adjusted power consumption is greater than the maximum power consumption allowed by the current power derating level, the set temperature is updated, and the temperature difference between the current operating temperature and the updated set temperature is obtained for the next round of constant temperature control. If the adjusted power consumption is less than or equal to the maximum power consumption allowed by the current power derating level, the next round of constant temperature control is performed directly.

[0015] Preferably, the power consumption adjustment coefficient is obtained by the following formula:

[0016]

[0017] The power derating level corresponding to the temperature difference between the current operating temperature and the set temperature is determined by the following formula:

[0018] T thi -1 < ΔT ≤ T thi

[0019] Where, ΔT=T-T0,

[0020] The power consumption adjustment amount is obtained using the following formula:

[0021] ΔP=k i ×P0×f(ΔT)

[0022] in,

[0023] The TEC current is obtained using the following formula:

[0024] i TEC =K p ΔP+K i ΔTdt

[0025] The adjusted power consumption is obtained using the following formula:

[0026] P = P0 - ΔP

[0027] The set temperature is updated using the following formula:

[0028] T0′=T0-αΔT

[0029] In the formula, k i P is the power adjustment coefficient corresponding to the i-th power derating level. max_i P0 is the maximum allowable power consumption for the i-th power derating level, where P0 is the set power consumption, and T is the maximum allowable power consumption for the derating level. thi Let ΔT be the temperature threshold corresponding to the i-th power derating level, ΔT be the temperature difference between the current operating temperature and the set temperature, T be the current operating temperature, T0 be the set temperature, ΔP be the power adjustment amount, and f(ΔT) be the power action nonlinear function. ref For reference temperature difference, i TEC For TEC current, K p K is the proportional gain coefficient. i dt is the integral gain coefficient, P is the temperature gain variable over time, T0′ is the adjusted power consumption, and α is the temperature adjustment coefficient.

[0030] Preferably, the compensated angular velocity is obtained by the following formula:

[0031]

[0032] In the formula, ω comp For the compensated angular velocity, V det K is the demodulation voltage related to the TEC current. d η is the demodulation sensitivity coefficient related to the electrical signal; G(T) is the preamplifier gain compensation factor related to the current operating temperature; η(T) is the correction function for the photoelectric conversion efficiency as a function of temperature.

[0033] According to another aspect of the present invention, a control method for a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control is provided, the control method performing temperature control on any of the aforementioned silicon photonic gyroscopes, the control method comprising:

[0034] S10. The temperature acquisition module obtains the current operating temperature of the optical chip and sends it to the temperature calculation module.

[0035] S20: The power setting module obtains the power adjustment coefficient based on the maximum power consumption allowed for each power derating level and the set power consumption, and outputs it to the temperature calculation module.

[0036] S30. The temperature calculation module determines the temperature threshold corresponding to different power derating levels, obtains the temperature difference between the current operating temperature and the set temperature, determines the power derating level corresponding to the temperature difference between the current operating temperature and the set temperature, and obtains the power adjustment coefficient corresponding to the current power derating level.

[0037] S40, the temperature calculation module obtains the power adjustment amount based on the power adjustment coefficient corresponding to the current power derating level, the set power consumption and power action nonlinear function;

[0038] The S50 temperature calculation module obtains the TEC current based on the power consumption adjustment, proportional gain coefficient, and integral gain coefficient. If the TEC current is less than zero, the optical chip is heated; if the TEC current is greater than zero, the optical chip is cooled to achieve constant temperature control of the optical chip.

[0039] S60: The temperature calculation module obtains the adjusted power consumption based on the power consumption adjustment amount and the set power consumption. If the adjusted power consumption is greater than the maximum power consumption allowed by the current power derating level, the set temperature is updated and the process proceeds to S30. If the adjusted power consumption is less than or equal to the maximum power consumption allowed by the current power derating level, the process proceeds directly to S30.

[0040] By integrating a high-precision thermistor onto a silicon photonic chip to measure the chip's operating temperature in real time, and simultaneously measuring the magnitude and direction of the TEC current on the ASIC circuit to sense cooling / heating power, the current magnitude of the TEC current is designed based on the power derating level. An advanced intelligent algorithm is used to precisely regulate the light source drive power, taking into account both temperature and power consumption to achieve the optimal control strategy for the photonic chip. Furthermore, based on the current temperature and drive current magnitude, real-time compensation of the gyroscope output is performed in the signal demodulation module to avoid gyroscope output errors introduced by dynamic temperature adjustment and unsteady drive current. This invention ensures that the silicon photonic gyroscope maintains stable output over a wide temperature range while dynamically reducing steady-state power consumption, exhibiting high precision, high stability, and significant power reduction effects. Attached Figure Description

[0041] The accompanying drawings, which form part of this specification, are provided to further illustrate embodiments of the invention and, together with the textual description, explain the principles of the invention. It is obvious that the drawings described below are merely some embodiments of the invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0042] Figure 1 A schematic diagram of a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control is shown according to an embodiment of the present invention;

[0043] Figure 2 It shows Figure 1 A schematic diagram of the intelligent temperature control module for the light source of the silicon photonic gyroscope. Detailed Implementation

[0044] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0046] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0047] like Figure 1 As shown, the present invention provides a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control. The silicon photonic gyroscope includes an optical chip, an optical fiber loop, and an integrated circuit. The optical chip includes a light source, a coupler, a first detector, a second detector, a modulator, and a thermistor. The integrated circuit includes a half-wave voltage control module, a light source intelligent temperature control module, a drive temperature control module, and a signal demodulation module.

[0048] The light source generates laser light with corresponding optical power based on the driving current and TEC current, and the laser light enters the coupler. The coupler splits the laser light into two paths, which enter the modulator and the second detector respectively. It also outputs interference light to the first detector. The modulator modulates the laser light according to the modulation voltage and splits the modulated laser light into two paths, which enter the fiber loop. The two laser lights rotate within the fiber loop, generating a Sagnac phase difference, and return to the modulator to form interference light. The first detector converts the interference light into an electrical signal and outputs it to the signal demodulation module. The second detector measures the power of the light source.

[0049] The half-wave voltage control module is used to generate a modulation voltage at the current operating temperature and output it to the modulator; the drive temperature control module is used to generate a drive current and receive the TEC current output by the intelligent temperature control module of the light source, and output the drive current and TEC current to the light source, and output the TEC current to the signal demodulation module; the intelligent temperature control module of the light source is electrically connected to the thermistor, and is used to obtain the current operating temperature of the optical chip, and determine the power derating level corresponding to the temperature difference between the current operating temperature and the set temperature based on the current operating temperature and the set temperature, thereby obtaining the power adjustment amount; it is also used to obtain the TEC current based on the power adjustment amount, and perform temperature adjustment on the optical chip based on the TEC current; the signal demodulation module is used to obtain the compensated angular velocity based on the demodulation sensitivity coefficient related to the electrical signal, the demodulation voltage related to the TEC current, the preamplifier gain compensation factor related to the current operating temperature, and the correction function of photoelectric conversion efficiency changing with temperature.

[0050] According to one embodiment of the present invention, such as Figure 2 As shown, the intelligent temperature control module for the light source includes a temperature acquisition module, a power setting module, and a temperature calculation module;

[0051] The temperature acquisition module is used to obtain the current operating temperature of the optical chip and send it to the temperature calculation module;

[0052] The power setting module is used to obtain the power adjustment coefficient based on the maximum power consumption allowed for each power derating level and the set power consumption, and output it to the temperature calculation module;

[0053] The temperature calculation module is used to determine the temperature threshold corresponding to different power derating levels, obtain the temperature difference between the current operating temperature and the set temperature, determine the power derating level corresponding to the temperature difference between the current operating temperature and the set temperature, and obtain the power adjustment coefficient corresponding to the current power derating level.

[0054] Used to obtain the power adjustment amount based on the power adjustment coefficient corresponding to the current power derating level, and by setting the power consumption and power action nonlinear function;

[0055] The TEC current is obtained based on the power consumption adjustment, proportional gain coefficient, and integral gain coefficient. If the TEC current is less than zero, the optical chip is heated; if the TEC current is greater than zero, the optical chip is cooled to achieve constant temperature control of the optical chip.

[0056] The power consumption is adjusted based on the power consumption adjustment amount and the set power consumption. If the adjusted power consumption is greater than the maximum power consumption allowed by the current power derating level, the set temperature is updated, and the temperature difference between the current operating temperature and the updated set temperature is obtained for the next round of constant temperature control. If the adjusted power consumption is less than or equal to the maximum power consumption allowed by the current power derating level, the next round of constant temperature control is performed directly.

[0057] Specifically, the power consumption adjustment coefficient is obtained using the following formula:

[0058]

[0059] The power derating level corresponding to the temperature difference between the current operating temperature and the set temperature is determined by the following formula:

[0060] T thi -1 < ΔT ≤ T thi

[0061] Where, ΔT=T-T0,

[0062] The power consumption adjustment amount is obtained using the following formula:

[0063] ΔP=k i ×P0×f(ΔT)

[0064] in,

[0065] The TEC current is obtained using the following formula:

[0066] i TEC =K p ΔP+K i ΔTdt

[0067] The adjusted power consumption is obtained using the following formula:

[0068] P = P0 - ΔP

[0069] The set temperature is updated using the following formula:

[0070] T0′=T0-αΔT

[0071] In the formula, k i P is the power adjustment coefficient corresponding to the i-th power derating level. max_iP0 is the maximum allowable power consumption for the i-th power derating level, where P0 is the set power consumption, and T is the maximum allowable power consumption for the derating level. thi Let ΔT be the temperature threshold corresponding to the i-th power derating level, ΔT be the temperature difference between the current operating temperature and the set temperature, T be the current operating temperature, T0 be the set temperature, ΔP be the power adjustment amount, and f(ΔT) be the power action nonlinear function. ref For reference temperature difference, i TEC For TEC current, K p K is the proportional gain coefficient. i dt is the integral gain coefficient, P is the temperature gain variable over time, T0′ is the adjusted power consumption, and α is the temperature adjustment coefficient.

[0072] According to one embodiment of the present invention, the compensated angular velocity is obtained by the following formula:

[0073]

[0074] In the formula, ω comp For the compensated angular velocity, V det K is the demodulation voltage related to the TEC current. d η is the demodulation sensitivity coefficient related to the electrical signal; G(T) is the preamplifier gain compensation factor related to the current operating temperature; η(T) is the correction function for the photoelectric conversion efficiency as a function of temperature.

[0075] The demodulation voltage is obtained from the TEC current, the demodulation sensitivity coefficient is obtained from the electrical signal, and the preamplifier gain compensation factor and correction function are obtained from silicon photonic gyroscope calibration experiments.

[0076] This invention also provides a control method for a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control. The control method performs temperature control on any of the aforementioned silicon photonic gyroscopes, and includes:

[0077] S10. The temperature acquisition module obtains the current operating temperature of the optical chip and sends it to the temperature calculation module.

[0078] S20: The power setting module obtains the power adjustment coefficient based on the maximum power consumption allowed for each power derating level and the set power consumption, and outputs it to the temperature calculation module.

[0079] S30. The temperature calculation module determines the temperature threshold corresponding to different power derating levels, obtains the temperature difference between the current operating temperature and the set temperature, determines the power derating level corresponding to the temperature difference between the current operating temperature and the set temperature, and obtains the power adjustment coefficient corresponding to the current power derating level.

[0080] S40, the temperature calculation module obtains the power adjustment amount based on the power adjustment coefficient corresponding to the current power derating level, the set power consumption and power action nonlinear function;

[0081] The S50 temperature calculation module obtains the TEC current based on the power consumption adjustment, proportional gain coefficient, and integral gain coefficient. If the TEC current is less than zero, the optical chip is heated; if the TEC current is greater than zero, the optical chip is cooled to achieve constant temperature control of the optical chip.

[0082] S60: The temperature calculation module obtains the adjusted power consumption based on the power consumption adjustment amount and the set power consumption. If the adjusted power consumption is greater than the maximum power consumption allowed by the current power derating level, the set temperature is updated and the process proceeds to S30. If the adjusted power consumption is less than or equal to the maximum power consumption allowed by the current power derating level, the process proceeds directly to S30.

[0083] To gain a further understanding of the present invention, the following description is provided in conjunction with... Figure 1 and Figure 2 The present invention provides a detailed description of the silicon photonic gyroscope and its control method applicable to wide temperature range adaptive power control.

[0084] In this embodiment, the overall structure of the silicon photonic gyroscope is as follows: Figure 1 As shown, the gyroscope optical path consists of an optical chip and an optical fiber loop. The optical chip realizes the emission, transmission, coupling, modulation, and detection of light, and integrates optical devices such as a light source, coupler, modulator, and detector. The first detector is mainly used to measure angular velocity and generate a corresponding electrical signal, which is input to the signal demodulation module to realize the detection of the phase difference signal intensity introduced by rotation. The second detector mainly realizes the online monitoring of the light source power. The optical fiber loop realizes the angular velocity sensitivity of the optical signal. A thermistor is installed on the silicon photonic gyroscope optical chip to monitor the operating temperature T of the silicon photonic gyroscope in real time. The integrated circuit realizes the sampling, demodulation, and constant current driving of the light source chip of the electrical signal. Dynamic and constant temperature control, especially based on real-time temperature data from the optical chip being transmitted to the intelligent temperature control module of the light source, integrates advanced intelligent algorithms into the integrated circuit for temperature control of the light source chip. It receives the temperature signal collected by the thermistor, the current set temperature, and calculates an appropriate power consumption adjustment amount using relevant formulas based on a preset power derating level, thus adaptively adjusting the temperature of the light source chip to regulate the power consumption P of the silicon photonic gyroscope. Furthermore, it adjusts the drive current according to temperature, and compensates in real-time for the optical power attenuation caused by temperature changes in the signal demodulation module, thereby balancing the stable operation of the silicon photonic gyroscope with its power consumption. Temperature changes cause variations in the modulator half-wave voltage. To reduce the impact of light source chip temperature adjustment on the half-wave voltage, a half-wave voltage stabilization control module is integrated into the half-wave voltage control stage to compensate for the slow drift of the phase modulator half-wave voltage caused by full-temperature variations.

[0085] The optical signal transmission process is as follows: The light source emits laser light, which is split into two paths by the coupler and modulator and enters the optical fiber loop. When rotating, a Sagnac phase difference is generated, and after returning, interference light is formed at the coupler end. The interference light is converted into an electrical signal by the first detector and sent to the signal demodulation module to extract angular velocity information. The second detector monitors the output power of the light source in real time and is used for real-time feedback compensation of the light source power. The thermistor collects the temperature of the optical chip and transmits it to the integrated circuit.

[0086] Power closed-loop control process: The integrated circuit calculates the power consumption adjustment amount through intelligent algorithms based on temperature and preset power consumption derating level, and dynamically adjusts the light source drive current or temperature control unit to achieve adaptive power consumption and constant temperature control; in the demodulation module, the optical power attenuation is compensated in real time in combination with temperature to ensure signal stability; at the same time, the half-wave voltage stabilization control module compensates for the modulator drift caused by temperature to ensure modulation accuracy.

[0087] like Figure 2 The diagram shows an intelligent temperature control module for the light source, which mainly includes a temperature acquisition module, a power setting module, and a temperature calculation module. The temperature control module controls the temperature of the optical chip, specifically through the following steps:

[0088] Step 1: Set initial parameters. Initially design the initial set temperature T0 of the silicon photonic gyroscope output in the module, and the temperature threshold T corresponding to different power derating levels. th1 T th2 ... T thn The power design module establishes power regulation coefficients k1, k2, ..., k based on the temperature setpoint TSET and power derating design parameters. n .

[0089]

[0090] Where i = 1, 2, ..., n, and n is the number of power derating levels.

[0091] The above parameters are synchronously transmitted to the temperature calculation module.

[0092] Step 2: Real-time temperature measurement. The temperature acquisition module collects the current operating temperature T of the thermistor on the silicon photonic gyroscope chip in real time and transmits the temperature signal to the temperature calculation module.

[0093] Step 3: Calculate the temperature difference between the current operating temperature T and the initial set temperature T0: ΔT = T - T0;

[0094] Step 4: Determine the power derating level. Based on the temperature difference ΔT, determine the current power derating level i, which must satisfy T. thi -1 < ΔT ≤ T thi ;

[0095] Step 5: Calculate the power consumption adjustment amount and look up the corresponding adjustment coefficient k in the table. i By combining the nonlinear function f(ΔT) of the power effect, the power consumption adjustment is calculated:

[0096] ΔP=k i ×P0×f(ΔT)

[0097] in,

[0098] T ref A reference temperature difference (e.g., 10°C) is used to characterize the nonlinear growth trend of the effect of temperature.

[0099] Step Six: The control module generates an adjustment command based on the calculated power consumption adjustment amount ΔP, adjusts the light source drive current, and achieves power consumption derating. Specifically, the adjusted power consumption P is obtained through the following formula:

[0100] P = P0 - ΔP

[0101] At the same time, activate the TEC temperature control. The specific steps are as follows:

[0102] 1. Calculate the required TEC drive current i based on ΔT and T0. TEC :

[0103] i TEC =K p ΔP+K i ΔTdt

[0104] The temperature control scheme employs a PI control algorithm, K P and K i are the proportional and integral gain coefficients of the control system, respectively.

[0105] 2. i TEC The input is sent to the TEC drive circuit to heat the light source chip (i TEC >0) or cooling (i TEC <0), to achieve constant temperature control and suppress temperature drift. Where i TEC This function is crucial throughout this process and is the key execution method to achieve "adaptive temperature control + low power consumption".

[0106] Step 7: Update the set temperature. If the adjusted power consumption P is still greater than the preset maximum allowable power consumption P... max Then update the set temperature:

[0107] T0′=T0-αΔT

[0108] Here, α is a temperature adjustment coefficient (e.g., 0.1) to prevent overshoot.

[0109] Step 8: Speed ​​Signal Compensation

[0110] The raw signal output by the first detector includes the phase ΔΦ caused by angular velocity, but it is affected by the optical power attenuation due to temperature. Therefore, a rotational speed compensation mechanism is introduced into the signal demodulation module, and the compensated angular velocity output ω comp Represented as:

[0111]

[0112] In summary, this invention provides a silicon photonic gyroscope and its control method suitable for wide-temperature-range adaptive power control. By integrating a high-precision thermistor onto the silicon photonic chip to measure the chip's operating temperature in real time, and simultaneously measuring the magnitude and direction of the TEC current on the ASIC circuit to sense cooling / heating power, the current magnitude of the TEC current is designed based on the power derating level. An advanced intelligent algorithm is used to precisely regulate the light source drive power, balancing temperature and power consumption to achieve the optimal control strategy for the photonic chip. Furthermore, based on the current temperature and drive current magnitude, real-time compensation of the gyroscope output is performed in the signal demodulation module to avoid gyroscope output errors introduced by dynamic temperature adjustment and unsteady drive current. This invention ensures that the silicon photonic gyroscope maintains stable output over a wide temperature range while dynamically reducing steady-state power consumption, exhibiting high precision, high stability, and significant power reduction effects.

[0113] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0114] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0115] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A silicon photonic gyroscope suitable for wide temperature range adaptive power control, characterized in that, The silicon photon gyroscope comprises an optical chip, an optical fiber ring and an integrated circuit; the optical chip comprises a light source, a coupler, a first detector, a second detector, a modulator and a thermistor; the integrated circuit comprises a half-wave voltage control module, a light source intelligent temperature control module, a driving temperature control module and a signal demodulation module; The light source is configured to generate laser with corresponding optical power according to a driving current and a TEC current, and enter the coupler; the coupler is configured to divide the laser into two paths to enter the modulator and the second detector respectively, and output interference light to the first detector; the modulator is configured to modulate the laser according to a modulation voltage, and divide the modulated laser into two paths to enter the optical fiber ring; the two paths of laser rotate in the optical fiber ring to generate a Sagnac phase difference, and return to the modulator to form interference light; The first detector is configured to convert the interference light into an electrical signal and output to the signal demodulation module; The second detector is configured to measure the power of the light source; The half-wave voltage control module is configured to generate the modulation voltage at the current working temperature and output to the modulator; The driving temperature control module is configured to generate the driving current and receive the TEC current output by the light source intelligent temperature control module, and output the driving current and the TEC current to the light source and the signal demodulation module; the light source intelligent temperature control module is electrically connected with the thermistor, configured to obtain the current working temperature of the optical chip, and determine the power consumption reduction level corresponding to the temperature difference between the current working temperature and the set temperature based on the current working temperature and the set temperature, so as to obtain the power consumption adjustment amount; and configured to obtain the TEC current based on the power consumption adjustment amount, and adjust the temperature of the optical chip based on the TEC current; the signal demodulation module is configured to obtain the compensated angular velocity based on the demodulation sensitivity coefficient related to the electrical signal, the demodulation voltage related to the TEC current, the preamplifier gain compensation factor related to the current working temperature and the correction function of the photoelectric conversion efficiency changing with temperature.

2. The silicon photonics gyro as claimed in claim 1, wherein, The light source intelligent temperature control module comprises a temperature acquisition module, a power setting module and a temperature calculation module; The temperature acquisition module is configured to obtain the current working temperature of the optical chip and send to the temperature calculation module; The power setting module is configured to obtain the power consumption adjustment coefficient based on the maximum power consumption allowed by each power consumption reduction level and the set power consumption, and output to the temperature calculation module; The temperature calculation module is configured to determine the temperature threshold corresponding to different power consumption reduction levels, obtain the temperature difference between the current working temperature and the set temperature, determine the power consumption reduction level corresponding to the temperature difference between the current working temperature and the set temperature, and obtain the power consumption adjustment coefficient corresponding to the current power consumption reduction level; configured to obtain the power consumption adjustment amount based on the power consumption adjustment coefficient corresponding to the current power consumption reduction level, the set power consumption and the power acting nonlinear function; configured to obtain the TEC current based on the power consumption adjustment amount, the proportional gain coefficient and the integral gain coefficient, and heat the optical chip if the TEC current is less than zero. If the TEC current is greater than zero, the optical chip is cooled to achieve constant temperature control of the optical chip; If the adjusted power consumption is greater than the maximum power consumption allowed by the current power consumption derating level, the set temperature is updated, and the temperature difference between the current operating temperature and the updated set temperature is obtained for the next round of constant temperature control; if the adjusted power consumption is less than or equal to the maximum power consumption allowed by the current power consumption derating level, the next round of constant temperature control is directly performed.

3. The silicon photonics gyro according to claim 1 or 2, characterized in that, The power consumption adjustment coefficient is obtained by the following formula: The power consumption derating level corresponding to the temperature difference between the current operating temperature and the set temperature is determined by the following formula: T thi -1 < ΔT ≤ T thi Wherein, ΔT = T - T0, The power consumption adjustment amount is obtained by the following formula: ΔP = k i x P0 x f(ΔT) wherein The TEC current is obtained by the following formula: i TEC = K p ΔP + K i ΔTdt The adjusted power consumption is obtained by the following formula: P = P0- ΔP The set temperature is updated by the following formula: T0' = T0- αΔT In the formula, k i is the power consumption adjustment coefficient corresponding to the i th power consumption reduction level, P max_i is the maximum power consumption allowed by the i th power consumption reduction level, P0 is the set power consumption, T thi is the temperature threshold corresponding to the i th power consumption reduction level, ΔT is the temperature difference between the current working temperature and the set temperature, T is the current working temperature, T0 is the set temperature, ΔP is the power consumption adjustment amount, f(ΔT) is the power action nonlinear function, T ref is the reference temperature difference, i TEC is the TEC current, K p is the proportional gain coefficient, K i is the integral gain coefficient, dt is the temperature gain variable with time, P is the adjusted power consumption, T0' is the updated set temperature, and α is the temperature adjustment coefficient.

4. The silicon photonics gyro according to any one of claims 1-3, wherein, The compensated angular velocity is obtained by the following formula: In the formula, ω comp is the compensated angular velocity, V det is the demodulation voltage related to the TEC current, K d is the demodulation sensitivity coefficient related to the electrical signal; G(T) is the preamplification gain compensation factor related to the current working temperature; and η(T) is the correction function of the photoelectric conversion efficiency with temperature change.

5. A control method of a silicon photonic gyroscope suitable for wide-temperature-range adaptive power control, characterized in that, The control method is used for temperature control of the silicon optical gyroscope of any one of claims 1-4, and the control method comprises: S10, the temperature acquisition module obtains the current operating temperature of the optical chip and sends it to the temperature calculation module; S20, the power setting module obtains the power consumption adjustment coefficient based on the maximum power consumption allowed by each power consumption derating level and the set power consumption, and outputs it to the temperature calculation module; S30, the temperature calculation module determines the temperature threshold corresponding to different power consumption derating levels, obtains the temperature difference between the current operating temperature and the set temperature, determines the power consumption derating level corresponding to the temperature difference between the current operating temperature and the set temperature, and obtains the power consumption adjustment coefficient corresponding to the current power consumption derating level; S40, the temperature calculation module obtains the power consumption adjustment amount based on the power consumption adjustment coefficient corresponding to the current power consumption derating level, the set power consumption and the power acting nonlinear function; S50, the temperature calculation module obtains the TEC current based on the power consumption adjustment amount, the proportional gain coefficient and the integral gain coefficient, if the TEC current is less than zero, the optical chip is heated; if the TEC current is greater than zero, the optical chip is cooled to achieve constant temperature control of the optical chip; S60, the temperature calculation module obtains the adjusted power consumption based on the power consumption adjustment amount and the set power consumption, if the adjusted power consumption is greater than the maximum power consumption allowed by the current power consumption derating level, the set temperature is updated, and the temperature difference between the current operating temperature and the updated set temperature is obtained for the next round of constant temperature control; if the adjusted power consumption is less than or equal to the maximum power consumption allowed by the current power consumption derating level, the next round of constant temperature control is directly performed.

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