A semiconductor component packaging device

Abstract

This invention relates to the field of component packaging equipment technology, specifically a semiconductor component packaging equipment, including a frame, a molding mechanism, a loading mechanism, and a unloading mechanism mounted on the frame. The coordinated installation of the molding mechanism and the loading mechanism facilitates batch molding of chips. Furthermore, the rotation of the loading mechanism enables continuous loading and unloading operations, improving efficiency. The unloading mechanism allows the chip to be unloaded after molding by rotating the loading mechanism at a certain angle, causing it to slide against the loading mechanism. A collection mechanism facilitates the collection and storage of the unloaded chips, ensuring slow chip introduction and reducing damage from impacts. The operation of the molding mechanism also enables a dust removal mechanism to clean the loaded chips of dust and debris, ensuring the quality of subsequent molding.

Description

Technical Field

[0001] This invention relates to the field of component packaging equipment technology, specifically to a semiconductor component packaging equipment. Background Technology

[0002] In the semiconductor component manufacturing process, the packaging stage is a key process to ensure stable chip performance, achieve electrical connection and provide physical protection. During chip manufacturing, the produced chips need to be bonded, and after bonding, they are encapsulated by a molding machine to protect the outside of the chip. As electronic devices develop towards miniaturization and high density, higher requirements are placed on the precision, efficiency and automation of semiconductor packaging.

[0003] A search revealed the following patent number: 202123106093.0. This patent describes a high-power chip encapsulation device that uses a lead screw to drive an encapsulation stage. When the stage moves directly below the encapsulation mechanism, a first drive cylinder lowers the bottom encapsulation mechanism to a certain position. Finally, the encapsulation mechanism performs the encapsulation operation on the chip, thereby improving overall automation and making the equipment more efficient.

[0004] However, after the chip encapsulation process is complete, the device requires the machine to stop operating before each chip can be removed from the tray. Furthermore, after unloading, the device must wait for reloading to complete before encapsulation can begin again. This process is time-consuming and labor-intensive, and the machine remains idle during this time, resulting in wasted time and reduced production efficiency. Additionally, manual operation from the bottom of the machine is required during loading and unloading, which can pose safety hazards. Moreover, the encapsulation trays are mounted to the machine with numerous bolts. When encapsulating different chip models, the trays must be changed, and the bolts must be removed and reinstalled, a cumbersome and inefficient process. Furthermore, the lack of a dust removal and cleaning component during chip encapsulation means that some chips undergo numerous processes before encapsulation, inevitably resulting in small dust particles or debris falling onto the chips. If not cleaned promptly, this can affect the chip's performance after encapsulation.

[0005] Therefore, developing a semiconductor component packaging equipment with fast loading and unloading operations and a high safety factor has become an important direction for improving packaging efficiency and product quality. Summary of the Invention

[0006] To address the problems in the prior art, the present invention provides a semiconductor component packaging device.

[0007] The technical solution adopted by the present invention to solve its technical problem is: a semiconductor component packaging equipment, including a frame, a molding mechanism mounted on the frame, a feeding mechanism mounted on the frame, and a unloading mechanism mounted on the frame.

[0008] Specifically, the sealing mechanism includes a support frame, on which the support frame is mounted. A heating plate is provided at the bottom of the support frame, and two hydraulic cylinders are mounted on the support frame. The bottom output shafts of the two hydraulic cylinders are respectively vertically connected to the top of the heating plate.

[0009] Specifically, the feeding mechanism includes a rotating block, which is rotatably connected to the frame. Four material trays are installed on the outside of the rotating block, and the material trays are rotatably connected to the top of the frame through the rotating block. Each of the four material trays is provided with a feeding trough.

[0010] Specifically, a drive motor is installed on the inner side of the bottom of the frame, a drive shaft is installed on the bottom of the rotating block, the drive shaft is rotatably connected to the inside of the frame, the top output shaft of the drive motor is connected to the bottom of the drive shaft, and one end of the material tray is connected to the rotating block through a connecting plate.

[0011] Specifically, the feeding mechanism includes a drive block, which is fixedly connected to the frame and located outside the rotating block. Multiple material trays are slidably connected to a sliding plate via compression springs. The sliding plate has multiple through slots, and the bottom of each material tray has a feeding groove that communicates with the discharge groove. One end of the bottom of the material tray has a movable groove, and a guide wheel is slidably connected inside the movable groove. The top of the guide wheel is rotatably connected to the bottom of the push plate, and the outer side of the bottom of the guide wheel is located at one end of the drive block.

[0012] Specifically, a collection mechanism is installed on the frame, the collection mechanism includes a collection box, the collection box is slidably connected to the inner side of one end of the frame, one end of the collection box extends to the outer side of the frame, a feeding trough is provided on the top side of the frame, the feeding trough is located on the top of the collection box, and a handle is installed on one end of the collection box.

[0013] Specifically, the feed trough is provided with two guide plates, which are arranged vertically. The opposite ends of the two guide plates are rotatably connected to the inner side of the frame through connecting shafts. The connecting shafts are fixedly connected to the guide plates, and the connecting shafts are connected to the inside of the frame through torsion springs. The angle between the guide plates and the side wall of the feed trough is 45 degrees.

[0014] Specifically, a vibration mechanism is installed inside the frame. The vibration mechanism includes protrusions. Multiple protrusions are provided on the outside of the drive shaft. A push rod is slidably connected inside the frame via a return spring. One end of the push rod abuts against the protrusions, and the other end of the push rod extends into the feed chute. The other end of the push rod is vertically connected to a top plate. Pressure rollers are rotatably connected to both ends of the top plate. The pressure rollers abut against two guide plates. The protrusions and one end of the push rod are both hemispherical structures.

[0015] Specifically, the material tray is equipped with a connecting mechanism, which includes slots. The outer side of the rotating block has four slots, and the inner side of the rotating block has multiple sets of slots. The slots communicate with the slots. One end of the four material trays is slidably connected to the inside of the four slots through a connecting plate. The inside of both sides of the connecting plate is equipped with protrusions. The protrusions are slidably connected to the inner side of the connecting plate through abutment springs. The protrusions extend to the outer side of the connecting plate and engage with the slots. The protrusions have a trapezoidal structure.

[0016] Specifically, a dust removal mechanism is installed on the frame. The dust removal mechanism includes a tray, which is mounted on the heating plate. The tray has an "L" shape. A base plate is installed at one end of the tray. A guide groove is provided on the inner side of the base plate. Multiple protective nets are installed at the bottom of the base plate. A dust suction pipe is installed on the base plate. One end of the dust suction pipe extends into the guide groove. Multiple servo motors are installed on the base plate. The output shaft of the servo motor extends to the outer side of the bottom of the base plate. A brush is installed on the bottom output shaft of the servo motor.

[0017] Specifically, the base plate and the support plate are connected by two telescopic springs, and two guide rods are vertically connected to the top of the base plate. The tops of the two guide rods pass through the two telescopic springs and are slidably connected to the support plate.

[0018] The beneficial effects of this invention are:

[0019] (1) The semiconductor component packaging equipment described in this invention facilitates the batch packaging of chips through the cooperation of the molding mechanism and the feeding mechanism. Furthermore, the feeding mechanism enables non-stop loading and unloading operations, thereby improving efficiency. At the same time, the feeding mechanism is easy to disassemble and maintain through the cooperation of the connecting mechanism.

[0020] (2) The semiconductor component packaging equipment of the present invention, by installing the unloading mechanism, facilitates the chip to be unloaded after the chip is encapsulated. After the chip is encapsulated, the loading mechanism rotates at a certain angle, and the unloading mechanism is resisted and slid, thereby enabling the encapsulated chip to be unloaded.

[0021] (3) The semiconductor component packaging equipment described in this invention facilitates the collection and storage of the unloaded chips through the installation of the collection mechanism, and allows the chips to be slowly introduced to reduce damage from bumps. Through the repeated contact between the feeding mechanism and the shaking mechanism, the material can be smoothly discharged.

[0022] (4) The semiconductor component packaging equipment described in this invention enables the dust removal mechanism to remove dust and debris from the chip after it has been loaded, thereby ensuring the quality of subsequent plastic packaging. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the connection structure between the heating plate and the frame of the present invention;

[0026] Figure 3 This is a schematic diagram of the connection structure between the connecting plate and the material tray of the present invention;

[0027] Figure 4 This is a schematic diagram of the connection structure between the guide wheel and the slide plate of the present invention;

[0028] Figure 5 This is a schematic diagram of the connection structure between the slide plate and the tray of the present invention;

[0029] Figure 6 This is a schematic diagram of the connection structure between the feeding trough, the material tray, and the sliding plate of the present invention;

[0030] Figure 7 This is a schematic diagram of the connection structure of the slot, card slot and rotating block of the present invention;

[0031] Figure 8 This is a schematic diagram of the connection structure between the protrusion and the connecting plate of the present invention;

[0032] Figure 9 This is a schematic diagram of the connection structure between the base plate and the support plate of the present invention;

[0033] Figure 10 This is a schematic diagram of the connection structure between the brush and the base plate of the present invention;

[0034] Figure 11 This is a schematic diagram of the connection structure between the protective net and the base plate of the present invention;

[0035] Figure 12 This is a schematic diagram of the connection structure between the top rod and the two guide plates of the present invention;

[0036] Figure 13 This is a schematic diagram of the connection structure between the torsion spring and the connecting shaft of the present invention;

[0037] Figure 14 This is a schematic diagram of the connection structure between the top plate and the top rod of the present invention;

[0038] Figure 15 This is a schematic diagram of the connection structure between the protrusion and the drive shaft of the present invention.

[0039] In the diagram: 1. Frame; 2. Sealing mechanism; 201. Support frame; 202. Hydraulic cylinder; 203. Heating plate; 3. Feeding mechanism; 301. Rotating block; 302. Material tray; 303. Connecting plate; 304. Discharge chute; 305. Drive motor; 306. Drive shaft; 4. Connecting mechanism; 401. Slot; 402. Protrusion; 403. Slot; 404. Contact spring; 5. Unloading mechanism; 501. Drive block; 502. Slide plate; 503. Push plate; 504. Guide wheel; 505. Through slot; 506. Movable slot; 507. 508. Feeding chute; 6. Compression spring; 7. Collection mechanism; 801. Collection box; 902. Handle; 103. Feeding chute; 11. Guide plate; 12. Connecting shaft; 13. Torsion spring; 14. Vibration mechanism; 15. Top rod; 16. Return spring; 17. Top plate; 18. Pressure roller; 19. Protrusion; 10. Dust removal mechanism; 11. Support plate; 12. Suction pipe; 13. Bottom plate; 14. Guide rod; 15. Telescopic spring; 16. Servo motor; 17. Brush; 18. Protective net; 19. Guide chute. Detailed Implementation

[0040] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0041] like Figure 1 , Figure 3 and Figure 4 As shown, the semiconductor component packaging equipment of the present invention includes a frame 1, a molding mechanism 2 mounted on the frame 1, a feeding mechanism 3 mounted on the frame 1, and a discharging mechanism 5 mounted on the frame 1.

[0042] Specifically, such as Figure 1 and Figure 2 As shown, the encapsulation mechanism 2 includes a support frame 201, which is mounted on the frame 1. A heating plate 203 is provided at the bottom of the support frame 201, and two hydraulic cylinders 202 are mounted on the support frame 201. The bottom output shafts of the two hydraulic cylinders 202 are vertically connected to the top of the heating plate 203. The installation of the support frame 201 facilitates the support and connection of the hydraulic cylinders 202, and facilitates the connection of the heating plate 203, as well as the drive and control of the heating plate 203, so as to realize the downward sliding of the heating plate 203 to encapsulate the chip.

[0043] Specifically, such as Figure 1 , Figure 2 and Figure 3As shown, the feeding mechanism 3 includes a rotating block 301, which is rotatably connected to the frame 1. Four material trays 302 are mounted on the outside of the rotating block 301. The material trays 302 are rotatably connected to the top of the frame 1 through the rotating block 301. Each of the four material trays 302 is provided with a feeding slot 304. The installation of the rotating block 301 facilitates the connection of the four material trays 302. The opening of the feeding slots 304 facilitates the storage of the bonded chips. The rotation of the rotating block 301 facilitates the feeding of the material trays 302 after feeding into the bottom of the heating plate 203 for plastic sealing. At the same time, the plastic-sealed chips can be unloaded, and the empty material trays 302 can be pre-loaded, thereby improving production efficiency.

[0044] Specifically, such as Figure 2 , Figure 3 and Figure 15 As shown, a drive motor 305 is installed on the inner bottom side of the frame 1, and a drive shaft 306 is installed on the bottom of the rotating block 301. The drive shaft 306 is rotatably connected to the inside of the frame 1. The top output shaft of the drive motor 305 is connected to the bottom of the drive shaft 306. One end of the material tray 302 is connected to the rotating block 301 through a connecting plate 303. The drive motor 305 drives the drive shaft 306 to rotate 90 degrees, thereby realizing the rotation of the four material trays 302. This facilitates material feeding without stopping the machine, improving production efficiency. The installation of the connecting plate 303 ensures the stable installation of the material trays 302 and the rotating block 301.

[0045] Specifically, such as Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the feeding mechanism 5 includes a drive block 501, which is fixedly connected to the frame 1. The drive block 501 is located outside the rotating block 301. Multiple material trays 302 are slidably connected to a slide plate 502 via compression springs 508. The slide plate 502 has multiple through slots 505. The bottom of each material tray 302 has a feeding groove 507, which communicates with a discharge groove 304. One bottom end of each material tray 302 has a movable groove 506, inside which a guide wheel 504 is slidably connected. The top of the guide wheel 504 is rotatably connected to the bottom of the push plate 503. The outer side of the bottom of the guide wheel 504 is located at one end of the drive block 501. Through the installation of the slide plate 502, under the abutment of the compression springs 508, the slide plate 502... 02. Multiple feeding slots 304 are blocked, preventing communication between the feeding slots 304 and the unloading slots 507, facilitating the molding process. After molding, the tray 302 rotates to a certain position, causing the guide wheel 504 to be abutted by the drive block 501. The guide wheel 504 drives the push plate 503 to press against the slide plate 502, causing the slide plate 502 to slide free from the elastic force of the compression spring 508, connecting the through groove 505 on the slide plate 502 with the feeding slot 304, thus connecting the feeding slot 304 with the unloading slot 507. This allows the molded chip to fall out and be unloaded. The tray 302 then rotates to a certain angle again, separating the guide wheel 504 from the drive block 501, and the slide plate 502 resets, facilitating loading.

[0046] Specifically, such as Figure 1 and Figure 2 As shown, a collection mechanism 6 is installed on the frame 1. The collection mechanism 6 includes a collection box 601. The collection box 601 is slidably connected to the inner side of one end of the frame 1. One end of the collection box 601 extends to the outer side of the frame 1. A feeding groove 603 is provided on the top side of the frame 1. The feeding groove 603 is located on the top of the collection box 601. A handle 602 is installed on one end of the collection box 601. The opening of the feeding groove 603 facilitates the introduction of chips that fall during unloading into the collection box 601 for storage. By pulling the handle 602, the collection box 601 can be easily pulled out, realizing the recycling of the encapsulated chips.

[0047] Specifically, such as Figure 2 , Figure 12 and Figure 13As shown, the feed trough 603 is equipped with two guide plates 604, which are arranged vertically. The opposite ends of the two guide plates 604 are rotatably connected to the inner side of the frame 1 via connecting shafts 605. The connecting shafts 605 are fixedly connected to the guide plates 604, and the connecting shafts 605 are connected to the inside of the frame 1 via torsion springs 606. The angle between the guide plates 604 and the side wall of the feed trough 603 is 45 degrees. The installation of the two guide plates 604 facilitates the flow of fallen chips through the first guide plate 604 onto the second guide plate 604, and then into the collection box 601 for storage. This prevents the chips from being damaged when they fall. With the cooperation of the torsion springs 606, the guide plates 604 have elastic rotation, which can buffer and dissipate force when the chips fall, preventing the chips from bouncing out.

[0048] Specifically, such as Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, a vibration mechanism 7 is installed inside the frame 1. The vibration mechanism 7 includes protrusions 705. Multiple protrusions 705 are provided on the outer side of the drive shaft 306. A push rod 701 is slidably connected inside the frame 1 via a return spring 702. One end of the push rod 701 abuts against the protrusions 705, and the other end of the push rod 701 extends into the feed chute 603. The other end of the push rod 701 is vertically connected to a top plate 703. Pressure rollers 704 are rotatably connected to both ends of the top plate 703. The pressure rollers 704 abut against two guide plates 604. The protrusions 705 and one end of the push rod 701 are both hemispherical structures. Through the installation of the protrusions 705, the vibration mechanism 7 can be used to achieve the desired vibration effect. When the drive shaft 306 rotates, it can drive multiple protrusions 705 to rotate, so that multiple protrusions 705 take turns abutting against the top rod 701. After being abutted, the top rod 701 is freed from the elastic force of the return spring 702 and slides. The top rod 701 drives the top plate 703 to abut against the two guide plates 604, so that the guide plates 604 swing at a certain angle. With the cooperation of the pressure roller 704, the top plate and the guide plate 604 slide smoothly, reducing wear. Through the repeated abutting of the top rod 701, the two guide plates 604 can be repeatedly vibrated, so that the encapsulated chip can be smoothly introduced into the collection box 601 for storage.

[0049] Specifically, such as Figure 2 , Figure 3 , Figure 6 , Figure 7 and Figure 8As shown, a connecting mechanism 4 is installed on the material tray 302. The connecting mechanism 4 includes slots 401. Four slots 401 are provided on the outer side of the rotating block 301, and multiple sets of slots 403 are provided on the inner side of the rotating block 301. The slots 403 communicate with the slots 401. One end of the four material trays 302 is slidably connected to the inside of the four slots 401 through a connecting plate 303. Protrusions 402 are respectively installed on the inner sides of the connecting plate 303. The protrusions 402 are slidably connected to the inner side of the connecting plate 303 through a contact spring 404. The protrusions 402 extend to the outer side of the connecting plate 303 and engage with the slots 403. The protrusions 402 have a trapezoidal structure and are connected through the slots 401. The opening allows the tray 302 to be detachably connected to the rotating block 301 via the connecting plate 303, facilitating the subsequent replacement of trays 302 with different specifications. Simultaneously, the slot 403 allows the abutment spring 404 to drive the protrusion 402 to abut against the inside of the slot 403, thus limiting the position of the connecting plate 303. By pulling the tray 302 with a certain force, the tray 302 causes the connecting plate 303 to slide. Since the protrusion 402 on the connecting plate 303 has a trapezoidal structure, it will break free from the elastic force of the abutment spring 404 after being compressed with a certain force, thereby enabling the connecting plate 303 to be detachably connected to the slot 401.

[0050] Specifically, such as Figure 1 , Figure 2 , Figure 9 , Figure 10 and Figure 11 As shown, a dust removal mechanism 8 is installed on the frame 1. The dust removal mechanism 8 includes a support plate 801, which is mounted on the heating plate 203. The support plate 801 has an "L"-shaped structure. A base plate 803 is installed at one end of the support plate 801. A guide groove 809 is provided on the inner side of the base plate 803. Multiple protective nets 808 are installed at the bottom of the base plate 803. A suction pipe 802 is installed on the base plate 803, with one end extending into the guide groove 809. Multiple servo motors 806 are installed on the base plate 803, with the output shaft of the servo motor 806 extending to the outer bottom of the base plate 803. A brush 807 is mounted on the bottom output shaft of the servo motor 806. The mounting of the support plate 801 facilitates connection to the base plate 803, allowing the base plate 803 to move along with the heating plate 203. During the plastic sealing process, the base plate 803 also slides down to a certain position. The operation of multiple servo motors 806 causes multiple brushes 807 to rotate, cleaning dust. Simultaneously, the suction pipe 802 connects to an external vacuum cleaner to remove the cleaned dust, thus cleaning debris from the pre-sealed chip and ensuring the quality of subsequent plastic sealing.

[0051] Specifically, such as Figure 9 and Figure 10 As shown, the base plate 803 and the support plate 801 are connected by two telescopic springs 805. Two guide rods 804 are vertically connected to the top of the base plate 803. The tops of the two guide rods 804 pass through the two telescopic springs 805 and are slidably connected to the support plate 801. The installation of the telescopic springs 805 facilitates elastic sliding between the base plate 803 and the support plate 801, preventing the brush 807 from causing excessive damage to the material tray 302 and providing a buffering effect. At the same time, the installation of the guide rods 804 provides a guiding effect, ensuring smooth sliding of the base plate 803 and preventing the telescopic springs 805 from bending or deforming when squeezed.

[0052] In use, the frame 1 is first stably placed in the designated position. Then, the support frame 201 facilitates the connection of the hydraulic cylinder 202. The hydraulic cylinder 202 facilitates the connection of the heating plate 203 and drives and controls the heating plate 203 to slide down for chip encapsulation. Before loading, a robotic arm places the bonded chips onto the foremost tray 302, and the feeding slot 304 ensures stable chip placement and positioning. After all the bonded chips are placed, the tray 801 facilitates the connection of the base plate 803, allowing the base plate 803 to move with the heating plate 203. During the encapsulation process, the heating plate 203 moves along with the base plate 803. The 03 plate will also slide down to a certain position. Multiple servo motors 806 will rotate multiple brushes 807 to clean the dust. Simultaneously, the suction pipe 802 connects to an external vacuum cleaner to remove the cleaned dust, cleaning debris from the pre-sealed chips and ensuring the quality of subsequent sealing. The installation of the telescopic spring 805 facilitates elastic sliding between the base plate 803 and the support plate 801, preventing excessive force from the brushes 807 against the material tray 302 and providing a buffer. After chip cleaning, the drive motor 305 rotates the rotating block 301, facilitating the feeding of the material tray 302 into the bottom of the heating plate 203 for sealing. Simultaneously, the sealed chips can be unloaded, and the empty material tray 302 can be lifted. Front-loading improves production efficiency. The drive motor 305 drives the drive shaft 306, which in turn rotates the rotating block 301 by 90 degrees, allowing the four trays 302 to switch alternately. This facilitates loading operations without stopping the machine, further improving efficiency. The connecting plate 303 ensures stable installation of the trays 302 and the rotating block 301. The slot 401 allows for detachable connection between the trays 302 and the rotating block 301 via the connecting plate 303, facilitating the replacement of trays 302 with different specifications. Simultaneously, the slot 403, driven by the contact spring 404, causes the protrusion 402 to engage with the inside of the slot 403, limiting the connection plate 303. A certain force is then applied to pull the trays 302. The tray 302 drives the connecting plate 303 to slide. The protrusion 402 on the connecting plate 303, being trapezoidal, will retract under pressure from the spring force of the resisting spring 404, thus allowing the connecting plate 303 to be detached from the slot 401. Through the installation of the sliding plate 502, under the resistance of the compression spring 508, the sliding plate 502 blocks multiple material discharge slots 304, preventing communication between the material discharge slots 304 and the unloading slot 507, facilitating the sealing process. After sealing, the tray 302 rotates to a certain position, causing the guide wheel 504 to be abutted by the driving block 501. The guide wheel 504 drives the push plate 503 to press against the sliding plate 502, causing the sliding plate 502 to slide under the resistance of the compression spring 508, connecting the through slot 505 on the sliding plate 502 with the material discharge slot 304.This causes the feeding trough 304 to connect with the unloading trough 507, allowing the encapsulated chips to fall and be discharged, thus achieving chip unloading. The tray 302 rotates again at a certain angle, the guide wheel 504 separates from the drive block 501, and the slide plate 502 resets, facilitating loading. The opening of the feeding trough 603 facilitates the flow of chips that fall during unloading into the collection box 601 for storage. Pulling the handle 602 makes it easy to remove the collection box 601, enabling the recycling of the encapsulated chips. The installation of two guide plates 604 facilitates the flow of fallen chips through the first guide plate 604 onto the second guide plate 604 before entering the collection box 601 for storage, preventing damage from impacts during the fall. The torsion spring 606 assists in ensuring the guide plates... 604 has elastic rotation, which can buffer and dissipate force when the chip falls, preventing the chip from bouncing out. The installation of protrusions 705 facilitates the rotation of multiple protrusions 705 when the drive shaft 306 rotates, allowing multiple protrusions 705 to alternately contact the push rod 701. After being contacted, the push rod 701 releases the elastic force of the return spring 702 and slides. The push rod 701 drives the top plate 703 to contact the two guide plates 604, causing the guide plates 604 to swing at a certain angle. With the cooperation of the pressure roller 704, the sliding between the top plate 703 and the guide plates 604 is smooth, reducing wear. Through the repeated contact of the push rod 701, the two guide plates 604 can be repeatedly vibrated, allowing the encapsulated chip to be smoothly introduced into the collection box 601 for storage.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0054] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor component packaging device, characterized in that: Includes a frame (1), on which a sealing mechanism (2) is installed, a feeding mechanism (3) is installed, and a discharging mechanism (5) is installed. The feeding mechanism (3) includes a rotating block (301), which is rotatably connected to the frame (1). Four material trays (302) are installed on the outside of the rotating block (301). The material trays (302) are rotatably connected to the top of the frame (1) through the rotating block (301). Each of the four material trays (302) is provided with a feeding groove (304). The feeding mechanism (5) includes a drive block (501). The drive block (501) is fixedly connected to the frame (1). The drive block (501) is located outside the rotating block (301). The slide plate (502) is slidably connected to the inside of the multiple material trays (302) through the compression spring (508). The slide plate (502) is provided with multiple through grooves (505). The bottom of the multiple material trays (302) is provided with feeding grooves (507). The feeding grooves (507) are connected to the discharge grooves (304). The bottom end of the material tray (302) is provided with a movable groove (506). The movable groove (506) is slidably connected to a guide wheel (504). The top of the guide wheel (504) is rotatably connected to the bottom of the push plate (503). The bottom outer side of the guide wheel (504) is located at one end of the drive block (501).

2. The semiconductor component packaging equipment according to claim 1, characterized in that: A drive motor (305) is installed on the inner bottom side of the frame (1), and a drive shaft (306) is installed on the bottom of the rotating block (301). The drive shaft (306) is rotatably connected to the inside of the frame (1). The top output shaft of the drive motor (305) is connected to the bottom of the drive shaft (306). One end of the material tray (302) is connected to the rotating block (301) through a connecting plate (303).

3. The semiconductor component packaging equipment according to claim 1, characterized in that: The sealing mechanism (2) includes a support frame (201). The support frame (201) is mounted on the frame (1). The bottom of the support frame (201) is provided with a heating plate (203). Two hydraulic cylinders (202) are mounted on the support frame (201). The bottom output shafts of the two hydraulic cylinders (202) are respectively vertically connected to the top of the heating plate (203).

4. The semiconductor component packaging equipment according to claim 2, characterized in that: A collection mechanism (6) is installed on the frame (1). The collection mechanism (6) includes a collection box (601). The collection box (601) is slidably connected to the inner side of one end of the frame (1). One end of the collection box (601) extends to the outer side of the frame (1). A feed chute (603) is provided on the top side of the frame (1). The feed chute (603) is located on the top of the collection box (601). A handle (602) is installed on one end of the collection box (601).

5. A semiconductor component packaging device according to claim 4, characterized in that: The feed trough (603) is provided with two guide plates (604) inside. The two guide plates (604) are arranged vertically. The opposite ends of the two guide plates (604) are rotatably connected to the inner side of the frame (1) through connecting shafts (605). The connecting shafts (605) are fixedly connected to the guide plates (604). The connecting shafts (605) are connected to the inside of the frame (1) through torsion springs (606). The included angle between the guide plates (604) and the side wall of the feed trough (603) is 45 degrees.

6. The semiconductor component packaging equipment according to claim 5, characterized in that: The frame (1) is equipped with a shaking mechanism (7), which includes a protrusion (705). The drive shaft (306) has multiple protrusions (705) on its outer side. The frame (1) is slidably connected to a push rod (701) through a return spring (702). One end of the push rod (701) abuts against the protrusion (705), and the other end of the push rod (701) extends into the feed trough (603). The other end of the push rod (701) is vertically connected to a top plate (703).

7. A semiconductor component packaging device according to claim 6, characterized in that: The top plate (703) is rotatably connected to two pressure rollers (704) at both ends. The pressure rollers (704) abut against two guide plates (604). The protrusion (705) and one end of the top rod (701) are both hemispherical structures.

8. A semiconductor component packaging device according to claim 1, characterized in that: A connecting mechanism (4) is installed on the material tray (302). The connecting mechanism (4) includes a slot (401). Four slots (401) are provided on the outer side of the rotating block (301). Multiple sets of slots (403) are provided on the inner side of the rotating block (301). The slots (403) are connected to the slots (401). One end of the four material trays (302) is slidably connected to the inside of the four slots (401) through the connecting plate (303). Protrusions (402) are respectively installed on the inner sides of the connecting plate (303). The protrusions (402) are slidably connected to the inner side of the connecting plate (303) through the contact spring (404). The protrusions (402) extend to the outer side of the connecting plate (303) and engage with the slots (403). The protrusions (402) are trapezoidal structures.

9. A semiconductor component packaging device according to claim 3, characterized in that: A dust removal mechanism (8) is installed on the frame (1). The dust removal mechanism (8) includes a tray (801). The tray (801) is installed on the heating plate (203). The tray (801) has an "L" shaped structure. A base plate (803) is installed at one end of the tray (801). A guide groove (809) is provided on the inner side of the base plate (803). Multiple protective nets (808) are installed at the bottom of the base plate (803). A suction pipe (802) is installed on the base plate (803). One end of the suction pipe (802) extends into the guide groove (809). Multiple servo motors (806) are installed on the base plate (803). The output shaft of the servo motor (806) extends to the outer side of the bottom of the base plate (803). A brush (807) is installed on the bottom output shaft of the servo motor (806).

10. A semiconductor component packaging device according to claim 9, characterized in that: The base plate (803) and the support plate (801) are connected by two telescopic springs (805). Two guide rods (804) are vertically connected to the top of the base plate (803). The top of the two guide rods (804) are slidably connected to the support plate (801) through the two telescopic springs (805).

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