Organic light emitting display device

Abstract

The organic light emitting display device may include: a plurality of anode electrodes at a plurality of sub-pixels; a plurality of organic light emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light emitting layers; a plurality of first banks located between the plurality of sub-pixels in a second direction intersecting the first direction; a plurality of first power supply wires located under the plurality of first banks in the first direction; a plurality of connection structures located in the first grooves disposed in some of the first banks among the plurality of first banks; and a plurality of undercut structures located on the lower side of a portion of the first bank in contact with the plurality of first grooves. Wherein the organic light-emitting layer and the cathode electrode may be disposed across a portion of the first bank, and the connection structure may electrically connect the cathode electrode to the first power supply wiring in the undercut structure.

Description

Technical Field

[0001] The embodiments relate to an organic light-emitting display device. Background Technology

[0002] With the increasing demand for portable information media, attempts to further apply organic light-emitting diode (OLED) displays to various lightweight and thin information electronic devices are expanding. Recently, the application trend of OLEDs in product groups such as laptops and automobiles has surpassed that of televisions and mobile phones. Since OLEDs used in laptops and automobiles are driven as static images for extended periods, long lifespans are required. To extend lifespan, it is necessary to maximize light extraction from the organic light-emitting elements (OLEDs) within the OLED. Furthermore, to reduce costs, it is necessary to expand the technology for producing OLEDs not only on 8.5-generation (2200×2500mm) substrates but also on 10.5-generation (3370×2940mm) substrates. To produce long-life OLEDs, it is necessary to implement a top-emission structure while simultaneously implementing a side-by-side structure where sub-pixels are each constructed using two or more stacked OLEDs.

[0003] The structure of this organic light-emitting element (OLED) can be obtained using a fine metal mask (FMM) deposition apparatus. However, the production process using the FMM deposition method can only be carried out using a cluster method rather than an in-line method, resulting in low production efficiency. Furthermore, there is a reduction in the pixel position accuracy (PPA) of the sub-pixel unit between the FMM and the substrate. Consequently, the emission area ratio (EAR) is low, limiting product lifespan. EAR is the value of the emission area of ​​a sub-pixel divided by the total area of ​​the sub-pixels.

[0004] Therefore, there is an urgent need to develop new deposition methods to solve the aforementioned problems, as well as organic light-emitting display devices with new organic light-emitting elements using new deposition methods. Summary of the Invention

[0005] Technical problems to be solved The purpose of these embodiments is to solve the aforementioned problems and other issues.

[0006] Another objective of this embodiment is to provide an organic light-emitting display device with a novel structure.

[0007] Another objective of the embodiments is to provide an organic light-emitting display device that can improve lifespan.

[0008] Another objective of the embodiments is to provide an organic light-emitting display device that can improve production efficiency and yield.

[0009] Another objective of the embodiments is to provide an organic light-emitting display device that can improve image quality.

[0010] The technical problems to be solved by the embodiments are not limited to those described in this project, but include those that can be understood through the invention.

[0011] Technical solution To achieve the above and other objectives, according to one aspect of an embodiment, an organic light-emitting display device includes: a plurality of sub-pixels having different colors along a first direction and the same color along a second direction intersecting the first direction; a plurality of anode electrodes located at the plurality of sub-pixels; a plurality of organic light-emitting layers located on the plurality of anode electrodes; a plurality of cathode electrodes located on the plurality of organic light-emitting layers; a plurality of first dikes located between the plurality of sub-pixels in the second direction; a plurality of first power wirings located below the plurality of first dikes along the first direction; a plurality of connection structures disposed in a first groove of a portion of the plurality of first dikes; and a plurality of undercut structures located on the underside of the portion of the first dikes adjacent to the plurality of first grooves, wherein the organic light-emitting layers and the cathode electrodes are disposed transversely through the portion of the first dikes, and the connection structures electrically connect the cathode electrodes to the first power wirings at the undercut structures.

[0012] The organic light-emitting display device further includes: an intermediate insulating layer located below the dike, wherein the undercut structure can be formed by recessing the side portion of the interlayer insulating layer connected to the first groove from the inside to the outside of the first dike.

[0013] The connection structure may include: an auxiliary electrode extending from the first power supply wiring, wherein the organic light-emitting layer may be cut off by the undercut structure to expose a portion of the auxiliary electrode, and the cathode electrode may be connected to the portion of the auxiliary electrode exposed at the undercut structure.

[0014] The organic light-emitting display device may include: a plurality of inorganic insulating layers located on the plurality of cathode electrodes; a plurality of second dikes having second grooves, the second grooves being arranged elongated along the second direction between the plurality of sub-pixels in the first direction; and a plurality of waterproof structures located on the plurality of second dikes.

[0015] The plurality of waterproof structures may include: a first waterproof structure located on the second dike; a second waterproof structure located on the first side of the second channel of the second dike; and a third waterproof structure located on the second side of the second channel of the second dike.

[0016] The first waterproof structure can be formed by overlapping at least two of the plurality of inorganic insulating layers onto the second dike.

[0017] The second waterproof structure can be formed by one of the plurality of inorganic insulating layers through a first undercut structure forming a curved shape, and the third waterproof structure can be formed by another of the plurality of inorganic insulating layers through a second undercut structure forming a curved shape. The first undercut structure and the second undercut structure can be formed on the underside of the second dike, which is connected to the second groove of the second dike.

[0018] The waterproof structure may surround at least one of a plurality of sub-pixels in the second direction.

[0019] The organic light-emitting display device may further include: a plurality of second power supply wirings located along the second direction at the plurality of second trenches of the plurality of second trenches, and at least two of the inorganic insulating layers may be disposed on the second power supply wirings.

[0020] The plurality of undercut structures can be located at different positions in the plurality of first grooves.

[0021] The cathode electrode may include: a first conductive layer; and a second conductive layer located on the first conductive layer.

[0022] The organic light-emitting display device may further include: a blocking structure located at the edge region of at least one of the first and second dikes, wherein the hole injection layer or charge generation layer of the organic light-emitting layer can be cut off by the blocking structure.

[0023] The organic light-emitting display device may further include: a plurality of strip-shaped virtual sub-pixels located in a non-display area along the first direction; and a plurality of waterproof structures located between the plurality of virtual sub-pixels in the second direction.

[0024] Beneficial effects The effects of the organic light-emitting display device according to the embodiment are explained below.

[0025] According to at least one of the embodiments, no FMM is required, thus simplifying the process and reducing process costs.

[0026] According to at least one of the embodiments, FMM is not required, thus increasing the EAR within the subpixel and improving lifetime.

[0027] According to at least one of the embodiments, in a tandem deposition system, organic light-emitting elements are deposited on a large-area substrate, thereby improving production efficiency, yield, and material utilization efficiency.

[0028] According to at least one of the embodiments, such as Figure 1 and Figure 2 As shown, a connection structure 130 can be configured at the first slot 131-1 of multiple first dikes 111-1 between multiple sub-pixels SPr, SPg, SPb of the same color along the second direction Y. This facilitates the electrical connection between the cathode electrodes 123r, 123g of the multiple sub-pixels SPr, SPg, SPb and the first power supply wiring PL1, preventing wire breakage and ensuring reliable operation and light emission of the sub-pixels SPr, SPg, SPb.

[0029] According to at least one of the embodiments, such as Figures 1 to 4 As shown, multiple first dikes 111-1 and / or multiple second dikes 111-2 can each be configured with multiple waterproof structures 143 to 145. Thus, moisture, oxygen, etc., that permeate along the second direction Y do not penetrate to the multiple sub-pixels SPr, SPg, SPb, thereby preventing malfunctions or poor light emission of the sub-pixels SPr, SPg, SPb and improving reliability.

[0030] According to at least one of the embodiments, such as Figure 2 and Figure 3 As shown, the hole injection layer, charge generation layer, etc. of multiple sub-pixels SPr, SPg, SPb are truncated by blocking structures 134-1 and 134-2, thereby blocking the leakage current flowing to the hole injection layer, charge generation layer, etc., and preventing poor image quality.

[0031] According to at least one of the embodiments, such as Figures 7 to 9 As shown, among the multiple connection structures 130 along the multiple rows of the second direction Y, multiple undercut structures 138 can be formed in different positions within the multiple first dikes 111-1 and / or the first grooves 104, 131-1 of the interlayer insulating layer 103. Thus, the cathode electrode can be formed on the multiple auxiliary electrodes 132 by the multiple undercut structures 138 formed in different positions.

[0032] like Figures 7 to 9 As shown, four connecting structures 130 can be provided by undercuts 138 formed at different positions. Two of the four sides of the first groove 104, 131-1 can form undercut structures 138, while the other two sides can not form undercut structures 138.

[0033] In the deposition apparatus, organic light-emitting materials evaporated in a certain direction and at a certain angle do not deposit on a portion of the auxiliary electrode 132 due to the shadow effect in the undercut structure 138, and the corresponding area can be exposed. Subsequently, when the green cathode electrode material is deposited, the corresponding green cathode electrode material can continuously connect to the auxiliary electrode 132 in the area where the undercut structure 138 is not formed, while simultaneously connecting to the auxiliary electrode 132 through the exposed portion.

[0034] Depending on the direction of travel of the substrate 110 during deposition and the angle and position of the evaporation source, at least one of the four connection structures 130 is electrically connected to the green cathode electrode 123g and the auxiliary electrode 132 of the connection structure 130, which can improve reliability.

[0035] Therefore, by preventing poor electrical connection between the cathode electrode and the first power supply wiring PL1 through the connection structure 130, poor light emission or malfunction can be prevented, thereby improving reliability.

[0036] The additional scope of application possibilities of the embodiments will become apparent from the following detailed description. However, those skilled in the art will clearly understand that various modifications and alterations are possible within the spirit and scope of the embodiments; therefore, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are provided only as examples. Attached Figure Description

[0037] Figure 1 A plan view of the organic light-emitting display device according to the first embodiment is shown for schematic purposes.

[0038] Figure 2 A cross-sectional view of the organic light-emitting display device according to the first embodiment is shown.

[0039] Figure 3 A cross-sectional view of the organic light-emitting display device according to the second embodiment is shown.

[0040] Figure 4 A cross-sectional view of the organic light-emitting display device according to the third embodiment is shown.

[0041] Figures 5a to 5k Show Figure 1 The manufacturing process of organic light-emitting display devices in the A-A' line.

[0042] Figures 6a to 6k Show Figure 1 The manufacturing process of organic light-emitting display devices in D-D' lines.

[0043] Figure 7 This shows how the grooves of the photosensitive pattern are located at different points along the second direction Y relative to the grooves of the interlayer insulating layer.

[0044] Figure 8 The arrangement of the grooves in the interlayer insulating layer and the grooves in the photosensitive pattern is shown.

[0045] Figure 9 This shows how the grooves of the photosensitive pattern are arranged on different sides of the grooves in the interlayer insulating layer.

[0046] Figure 10 A cross-sectional view of the organic light-emitting display device according to the fourth embodiment is shown.

[0047] Figure 11 A waterproof structure according to the first embodiment is shown.

[0048] Figure 12 A waterproof structure according to the second embodiment is shown.

[0049] Figure 13 A waterproof structure according to the third embodiment is shown.

[0050] Figure 14 A plan view of the organic light-emitting display device according to the second embodiment is shown for schematic purposes.

[0051] Figure 15 A cross-sectional view of the organic light-emitting display device according to the fifth embodiment is shown.

[0052] The size, shape, and values ​​of the components shown in the accompanying drawings may differ from the actual dimensions. Furthermore, even if the same component is shown in different sizes, shapes, and values ​​in the accompanying drawings, this is merely an example; for the same component, the sizes, shapes, and values ​​may be the same across different drawings. Detailed Implementation

[0053] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the accompanying drawings. Regardless of the drawing numbers, the same or similar constituent elements will be given the same reference numerals, and repeated descriptions of them will be omitted. The suffixes "module" and "part" used for constituent elements in the following description are assigned or used interchangeably for the sake of simplicity in writing the specification, and do not necessarily have different meanings or functions. Furthermore, the accompanying drawings are provided to facilitate a clearer understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the drawings. Additionally, when an element such as a layer, region, or substrate is described as existing "on" other constituent elements, this includes elements that can exist directly on other elements or where there are other intermediate elements between them.

[0054] The following discloses an organic light-emitting display device with a side-by-side structure fabricated using photolithography. This structure is called Ph-SbS (Side by side structure by photolithography). By using photolithography, the use of a fine-mesh matrix (FMM) is eliminated, thus simplifying the process and reducing costs. Furthermore, the increased EAR within the sub-pixels improves lifetime. Moreover, the organic light-emitting elements are deposited on a large-area substrate in a tandem deposition system, thereby improving production efficiency, yield, and material utilization efficiency.

[0055] Hereinafter, the red subpixel SPr can be named the 1st subpixel, the green subpixel SPg can be named the 2nd subpixel, and the blue subpixel SPb can be named the 3rd subpixel. Additionally, the red organic light-emitting element can be named the 1st organic light-emitting element, the green organic light-emitting element can be named the 2nd organic light-emitting element, and the blue organic light-emitting element can be named the 3rd organic light-emitting element.

[0056] Hereinafter, the organic light-emitting display device is an upper light-emitting method that emits light toward the upper part of the substrate to display an image, but the lower light-emitting method that emits light toward the lower part of the substrate to display an image is also included in the technical concept of the present invention.

[0057] Figure 1 A plan view of the organic light-emitting display device according to the first embodiment is shown for schematic purposes.

[0058] Reference Figure 1 The organic light-emitting display device according to the first embodiment may include a plurality of pixels P arranged in a matrix. The plurality of pixels P may be arranged in a display area AA. The remaining area other than the display area AA may be defined as a non-display area NAA.

[0059] For example, each pixel P may include multiple red sub-pixels SPr, multiple green sub-pixels SPg, and multiple blue sub-pixels SPb, etc. The multiple sub-pixels SPr, SPg, and SPb may have different colors along the first direction X and the same color along the second direction Y intersecting the first direction X, but this is not limited. That is, the multiple sub-pixels SPr, SPg, and SPb may have the same color and a relatively long striped pattern along the second direction Y.

[0060] As described below, the organic light-emitting layers and cathode electrodes of the plurality of organic light-emitting elements 120r, 120g, and 120b can each have the same color and a long, arranged stripe pattern along the second direction Y. For example, a plurality of red sub-pixels SPr emitting red light can be arranged in stripes along the second direction Y. For example, a plurality of green sub-pixels SPg emitting green light can be arranged in stripes along the second direction Y. For example, a plurality of blue sub-pixels SPb emitting blue light can be arranged in stripes along the second direction Y.

[0061] Red sub-pixels SPr, green sub-pixels SPg, and blue sub-pixels SPb are arranged alternately along the first direction X in column-line units, thereby realizing an organic light-emitting display device with a side-by-side structure. For example, the red sub-pixels SPr, green sub-pixels SPg, and blue sub-pixels SPb can be arranged alternately along the first direction X, but this is not limited.

[0062] For example, a red organic light-emitting element 120r can be configured in a red sub-pixel SPr, a green organic light-emitting element 120g can be configured in a green sub-pixel SPg, and a blue organic light-emitting element 120b can be configured in a blue sub-pixel SPb.

[0063] For example, the luminous efficiency of the blue organic light-emitting element 120b in the blue sub-pixel SPb can be less than that of the red organic light-emitting element 120r in the red sub-pixel SPr or the green organic light-emitting element 120g in the green sub-pixel SPg. In this case, the area of ​​the blue sub-pixel SPb is designed to be larger than the area of ​​the red sub-pixel SPr or the area of ​​the green sub-pixel SPg, thereby making the luminous efficiency uniform among the multiple sub-pixels SPr, SPg, and SPb, which can improve image quality.

[0064] Multiple sub-pixels SPr, SPg, and SPb can each include a light-emitting region EA and a non-light-emitting region NEA. The light-emitting region EA can be defined as the area where organic light-emitting elements 120r, 120g, and 120b are configured, and the non-light-emitting region NEA can be defined as the remaining area excluding the light-emitting region EA.

[0065] The red organic light-emitting element 120r, green organic light-emitting element 120g, and blue organic light-emitting element 120b may each include an anode electrode, an organic light-emitting layer, and a cathode electrode. The organic light-emitting layer may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, and a charge generation layer. The red organic light-emitting element 120r, green organic light-emitting element 120g, and blue organic light-emitting element 120b may each include at least two stacked structures. Each stacked structure may include an organic light-emitting layer that emits light.

[0066] The organic light-emitting layer and cathode electrode can be disposed only in each of the plurality of sub-pixels SPr, SPg, SPb along the first direction X. That is, the organic light-emitting layer and cathode electrode can be separated from each other and not disposed continuously along the first direction X. In contrast, as described above, the organic light-emitting layer and cathode electrode of each of the plurality of organic light-emitting elements 120r, 120g, 120b can have the same color and a longer striped pattern along the second direction Y. That is, the organic light-emitting layer and cathode electrode can each be disposed across the plurality of sub-pixels SPr, SPg, SPb along the second direction Y. In other words, the organic light-emitting layer and cathode electrode can not only be disposed in the plurality of sub-pixels SPr, SPg, SPb along the second direction Y, but can also be disposed continuously in the region between the plurality of sub-pixels SPr, SPg, SPb.

[0067] Although not illustrated, the organic light-emitting layer and the cathode electrode can be separated along the second direction Y in at least two sub-pixel units or in at least two row-line units.

[0068] The anode electrode can be disposed only within the multiple sub-pixels SPr, SPg, and SPb along the first direction X and the second direction Y. That is, the anode electrode can be disposed not along the first direction X and the second direction Y among the multiple sub-pixels SPr, SPg, and SPb. Thus, by having anode electrodes separately located in the multiple sub-pixels SPr, SPg, and SPb, the light-emitting region EA of each of the multiple sub-pixels SPr, SPg, and SPb can be distinguished.

[0069] On one hand, in order to provide power to each sub-pixel SPr, SPg, SPb, multiple power supply wirings PL1 to PL3 can be provided. Power supply terminal 101 can be electrically connected to the third power supply wiring PL3 to receive the first potential voltage from the power supply unit (not shown).

[0070] Multiple power supply lines PL1 to PL3 can be configured in the non-display area NAA and the display area AA. The first power supply line PL1 and the second power supply line PL2 can be configured in the display area AA between multiple sub-pixels SPr, SPg, and SPb, and electrically connected to the multiple sub-pixels SPr, SPg, and SPb. The first power supply line PL1 and the second power supply line PL2 can be electrically connected to the multiple cathode electrodes of the multiple organic light-emitting elements 120r, 120g, and 120b located in the multiple sub-pixels SPr, SPg, and SPb.

[0071] Multiple first power lines PL1 and multiple second power lines PL2 can intersect and be interconnected. Multiple first power lines PL1 and multiple second power lines PL2 can have a matrix structure.

[0072] The third power supply line PL3 can be configured in the non-display area NAA, for example, it can be electrically connected to multiple second power supply lines PL2.

[0073] Although not illustrated, additional power supply wiring may be provided to supply a second potential voltage greater than the first potential voltage. These additional power supply wirings may be electrically connected to the driving transistors of each sub-pixel SPr, SPg, SPb, but are not limited thereto.

[0074] Multiple sub-pixels SPr, SPg, and SPb can each include a driving circuit including a driving transistor, etc.

[0075] When a specific sub-pixel is selected by a scanning transistor in response to a scanning signal, light with a luminance corresponding to the current flowing through the driving transistor can be emitted from the specific sub-pixel using the first potential voltage of the first power supply wiring PL1 and the second power supply wiring PL2 and the second potential voltage of the other power supply wiring.

[0076] On the one hand, multiple connection structures 130, multiple waterproof structures, and multiple blocking structures can be configured between multiple sub-pixels SPr, SPg, and SPb.

[0077] Multiple connection structures 130 can be configured between multiple sub-pixels SPr, SPg, SPb in the second direction Y.

[0078] The connection structure 130 can electrically connect the second power supply wiring PL2 between the multiple sub-pixels SPr, SPg, SPb arranged in the second direction Y to the multiple cathode electrodes of the multiple organic light-emitting elements 120r, 120g, 120b of the multiple sub-pixels SPr, SPg, SPb.

[0079] Multiple blocking structures can be configured between multiple sub-pixels SPr, SPg, SPb in the first direction X and / or the second direction Y.

[0080] The blocking structure can be a structure that separates the layers of low-resistance organic light-emitting materials (e.g., hole injection layer, charge generation layer, etc.) of each organic light-emitting element 120r, 120g, 120b, prevents electrical short circuits between the anode electrode and the cathode electrode, and reduces leakage current between sub-pixels.

[0081] As described below, a blocking structure can be used to prevent lateral or longitudinal leakage current between multiple sub-pixels SPr, SPg, and SPb. The lateral leakage current can be a leakage current flowing along a first direction X between adjacent sub-pixels SPr, SPg, and SPb, and the longitudinal leakage current can be a leakage current flowing along a second direction Y between adjacent sub-pixels SPr, SPg, and SPb. Furthermore, the blocking structure can prevent short circuits between the anode and cathode electrodes in the corresponding sub-pixels SPr, SPg, and SPb. Therefore, by utilizing the blocking structure, color spots caused by leakage current can be improved, and luminous efficiency and brightness can be significantly enhanced.

[0082] Multiple waterproof structures can be configured in the non-display area NAA and the display area AA. For example, multiple waterproof structures can be configured between multiple sub-pixels SPr, SPg, SPb in the first direction X and / or the second direction Y of the non-display area NAA and the display area AA. Multiple waterproof structures can also be configured only in the non-light-emitting area NEA of each of the multiple sub-pixels SPr, SPg, SPb in the first direction X and / or the second direction Y.

[0083] On the one hand, organic light-emitting layers are susceptible to the effects of moisture and oxygen. Therefore, if the organic light-emitting layer is damaged by moisture or oxygen, the corresponding sub-pixels SPr, SPg, and SPb may malfunction, resulting in poor light emission. When moisture or oxygen causes multiple sub-pixels SPr, SPg, and SPb to malfunction, display defects such as point light emission defects or area light emission defects may occur, reducing product reliability.

[0084] However, the multiple waterproof structures in the embodiments prevent moisture, oxygen, etc., from penetrating into the non-display area NAA or the display area AA, thus preventing malfunctions or poor light emission of multiple sub-pixels SPr, SPg, and SPb. As a result, the organic light-emitting layers of each sub-pixel SPr, SPg, and SPb are not affected by moisture, oxygen, etc., and reliability can be significantly improved.

[0085] Figure 2 A cross-sectional view of the organic light-emitting display device according to the first embodiment is shown. Figure 3 A cross-sectional view of the organic light-emitting display device according to the second embodiment is shown. Figure 4 A cross-sectional view of the organic light-emitting display device according to the third embodiment is shown. Figures 2 to 4 They are respectively Figure 1 Cross-sectional views taken along lines A-A', B-B', and C-C'.

[0086] Reference Figures 1 to 4The organic light-emitting display device according to the embodiment may include a plurality of dams 111-1, 111-2; a plurality of power wirings PL1 to PL3; a plurality of organic light-emitting elements 120r, 120g; and a plurality of connection structures 130, etc.

[0087] Multiple dams 111-1, 111-2, multiple power wirings PL1 to PL3, multiple organic light-emitting elements 120r, 120g, and multiple connection structures 130 can be disposed on substrate 110.

[0088] Interlayer insulating layer 103 can be disposed on substrate 110; multiple dams 111-1, 111-2, multiple organic light-emitting elements 120r, 120g and multiple connection structures 130 can be disposed on interlayer insulating layer 103.

[0089] Multiple driving circuits can be formed on the substrate 110. These multiple driving circuits can be respectively provided on multiple sub-pixels SPr, SPg, and SPb. The multiple driving circuits may include multiple transistors, at least one capacitor, etc. The multiple transistors may include scanning transistors, driving transistors, and sensing transistors, etc.

[0090] The interlayer insulating layer 103 can be disposed on multiple drive circuits. The interlayer insulating layer 103 can be a planarization layer with a plane on it.

[0091] On one hand, multiple power lines PL1 to PL3 can be disposed on the substrate 110. The multiple power lines may include multiple first power lines PL1, multiple second power lines PL2, and a third power line PL3, etc.

[0092] The third power supply line PL3 can be electrically connected to the power supply terminal 101. The first power supply line PL1 and the second power supply line PL2 can electrically connect the third power supply line PL3 to multiple sub-pixels SPr, SPg, and SPb on the display area AA.

[0093] The third power routing PL3 can be configured on a different layer than the first power routing PL1 and the second power routing PL2. The first power routing PL1 and the second power routing PL2 can be configured on the same layer, but there is no limitation on this.

[0094] Power supply lines PL1 and PL2 can be electrically connected to power supply line PL3 using contact pads. For example, power supply line PL2 can be configured to extend from display area AA toward non-display area NAA, and in non-display area NAA, it can be electrically connected to power supply line PL3 using contact pads. Contact pads can be configured in non-display area NAA, but this is not limited.

[0095] For example, the first power supply line PL1 and the second power supply line PL2 can be formed together with the source and drain electrodes of the driving transistor. That is, the source and drain electrodes of the driving transistor, as well as the first power supply line PL1 and the second power supply line PL2, can be formed on the same layer using the same process and the same material.

[0096] For example, the third power supply wiring PL3 can be formed together with the cathode electrode. That is, the cathode electrode and the third power supply wiring PL3 can be formed on the same layer using the same process and the same material.

[0097] On the other hand, multiple first power supply lines PL1 can be configured between multiple sub-pixels SPr, SPg, and SPb in the second direction Y, and multiple second power supply lines PL2 can be configured between multiple sub-pixels SPr, SPg, and SPb in the first direction X. The multiple first power supply lines PL1 can be configured along the first direction X for an extended period between the multiple sub-pixels SPr, SPg, and SPb in the second direction Y. The multiple second power supply lines PL2 can be configured along the second direction Y for an extended period between the multiple sub-pixels SPr, SPg, and SPb in the first direction X.

[0098] Multiple dikes can include multiple first dikes 111-1 and multiple second dikes 111-2. First dikes 111-1 and second dikes 111-2 can intersect and be connected to each other. Multiple first dikes 111-1 and multiple second dikes 111-2 can have a matrix structure.

[0099] Multiple first-level dikes 111-1 can be configured to correspond to multiple first-level power lines PL1, and multiple second-level dikes 111-2 can be configured to correspond to multiple second-level power lines PL2. That is, multiple first-level dikes 111-1 can be configured on multiple first-level power lines PL1, and multiple second-level dikes 111-2 can be configured on multiple second-level power lines PL2.

[0100] Multiple first dikes 111-1 can be configured among multiple sub-pixels SPr, SPg, and SPb in the second direction Y, and multiple second dikes 111-2 can be configured among multiple sub-pixels SPr, SPg, and SPb in the first direction X. Multiple first dikes 111-1 can be configured along the first direction X for an extended period among multiple sub-pixels SPr, SPg, and SPb in the second direction Y. Multiple second dikes 111-2 can be configured along the second direction Y for an extended period among multiple sub-pixels SPr, SPg, and SPb in the first direction X.

[0101] Multiple sub-pixels SPr, SPg, and SPb can each include a light-emitting region EA and a non-light-emitting region NEA.

[0102] As an example, the luminescent region EA can be separated by the first dike 111-1 and the second dike 111-2. The luminescent region EA can be surrounded by the first dike 111-1 and the second dike 111-2.

[0103] As another example, the light-emitting region EA can be separated by anode electrodes 121r and 121g, which are separately provided in sub-pixels SPr, SPg, and SPb, respectively.

[0104] As yet another example, the luminescent region EA can be defined by the organic luminescent layers 122r and 122g exposed through the first dike 111-1 and the second dike 111-2.

[0105] On one hand, the regions corresponding to the first dam 111-1 and the second dam 111-2 can be defined as non-luminous regions (NEA). In this case, the first dam 111-1 and the second dam 111-2 can be shared by adjacent sub-pixels. That is, a portion of the first dam 111-1 and the second dam 111-2 can be included in a single sub-pixel, and another portion of the first dam 111-1 and the second dam 111-2 can be included in another sub-pixel adjacent to that sub-pixel.

[0106] Multiple organic light-emitting elements 120r and 120g can be configured on multiple sub-pixels SPr, SPg, and SPb. The multiple organic light-emitting elements 120r and 120g may include multiple anode electrodes 121r and 121g; multiple organic light-emitting layers 122r and 122g; and multiple cathode electrodes 123r and 123g.

[0107] Anode electrodes 121r and 121g can be disposed only in each sub-pixel SPr, SPg, and SPb along the first direction X and the second direction Y. Red anode electrode 121r can be disposed only in multiple red sub-pixels SPr along the second direction Y, and green anode electrode 121g can be disposed only in multiple green sub-pixels SPg along the second direction Y. Although not shown, blue anode electrode can be disposed only in multiple blue sub-pixels SPb along the second direction Y.

[0108] Although the organic light-emitting layers 122r and 122g can be separated from each other along the first direction X, they can be configured along the second direction Y. The red organic light-emitting layer 122r can be configured not only along the second direction Y on multiple red sub-pixels SPr, but also on multiple first ridges 111-1. The green organic light-emitting layer 122g can be configured not only along the second direction Y on multiple green sub-pixels SPg, but also on multiple first ridges 111-1. The blue organic light-emitting layer (not shown) can be configured not only along the second direction Y on multiple sub-pixels SPr, SPg, and SPb, but also on multiple first ridges 111-1. The red organic light-emitting layer 122r, the green organic light-emitting layer 122g, and the blue organic light-emitting layer can be referred to as the first organic light-emitting layer, the second organic light-emitting layer, and the third organic light-emitting layer, respectively.

[0109] Cathode electrodes 123r and 123g can be separated from each other along the first direction X, but can be arranged along the second direction Y. The red cathode electrode 123r can be arranged not only along the second direction Y on multiple sub-pixels SPr, SPg, and SPb, but also on multiple first embankments 111-1. The green cathode electrode 123g can be arranged not only along the second direction Y on multiple green sub-pixels SPg, but also on multiple first embankments 111-1. Although not shown, the blue cathode electrode can be arranged not only along the second direction Y on multiple sub-pixels SPr, SPg, and SPb, but also on multiple first embankments 111-1. The red cathode electrode 123r, the green cathode electrode 123g, and the blue cathode electrode can be referred to as the first cathode electrode, the second cathode electrode, and the third cathode electrode, respectively.

[0110] Multiple connection structures 130 can be configured on multiple first dikes 111-1. The figure shows that the connection structure 130 is configured on all of the multiple first dikes 111-1, but it is also possible that it is not configured on all of the multiple first dikes 111-1. That is, the connection structure 130 can be configured on some of the multiple first dikes 111-1.

[0111] Multiple first dikes 111-1 can have multiple first slots 131-1. A first slot 131-1 can be locally formed in a portion of the first dike 111-1 between multiple sub-pixels SPr, SPg, and SPb in the second direction Y. That is, the first slot 131-1 can have a point shape. Viewed from above, the first slot 131-1 can be circular or quadrilateral, but this is not limited. The first slot 131-1 can be formed by penetrating from the top to the bottom of the first dike 111-1, but this is not limited.

[0112] like Figure 2As shown, the connection structure 130 can be configured in the first slot 131-1 of the first dike 111-1. The connection structure 130 can electrically connect the green cathode electrode 123g to the first power supply wiring PL1 in the first slot 131-1 of the first dike 111-1.

[0113] The green organic light-emitting layer 122g and the green cathode electrode 123g can be disposed transversely through the first embankment 111-1 along the second direction Y. In this case, the green organic light-emitting layer 122g and the green cathode electrode 123g can be separated from each other in the first groove 131-1 of the first embankment 111-1. That is, the green organic light-emitting layer 122g on the upper side of the first embankment 111-1 and the green organic light-emitting layer 122g in the first groove 131-1 can be separated from each other. The green cathode electrode 123g on the upper side of the first embankment 111-1 and the green cathode electrode 123g in the first groove 131-1 can be separated from each other. In this case, the green cathode electrode 123g can be electrically connected to the connection structure 130 through the green organic light-emitting layer 122g separated from the first groove 131-1.

[0114] Although not shown, the red cathode electrode 123r and the blue cathode electrode can be electrically connected to the connection structure 130 in the first slot 131-1, respectively.

[0115] The undercut structure 138 can be formed on the underside of the first dam 111-1 connected to the first groove 131-1. For example, the undercut structure 138 can be formed by the side portion of the interlayer insulating layer 103 connected to the first groove 131-1 being recessed from the inner side portion of the first dam 111-1 toward the outer side.

[0116] The connection structure 130 may include an auxiliary electrode 132 extending from the first power supply wiring PL1. In the first power supply wiring PL1, which is arranged relatively long along the first direction X, the first power supply wiring PL1 corresponding to the first groove 131-1 of the first embankment 111-1 can be formed as the auxiliary electrode 132. Therefore, the auxiliary electrode 132 can be a part of the first power supply wiring PL1. The width of the auxiliary electrode 132 may be greater than the width of the first power supply wiring PL1, but this is not limited.

[0117] Figure 2 The diagram shows multiple connection structures 130 between multiple green sub-pixels SPg in the second direction Y. However, the multiple connection structures 130 between multiple red sub-pixels SPr in the second direction Y and the multiple connection structures 130 between multiple blue sub-pixels SPb in the second direction Y can also be the same as the multiple connection structures 130 between multiple green sub-pixels SPg.

[0118] The green organic light-emitting layer 122g is cut off by the undercut structure 138, thereby exposing a portion of the auxiliary electrode 132. Thus, the green cathode electrode 123g can be connected within the undercut structure 138 to the exposed portion of the auxiliary electrode 132. In other words, the green cathode electrode 123g can be electrically connected to the first power supply wiring PL1 via the connection structure 130.

[0119] Since the undercut structure 138 cuts off the green organic light-emitting layer 122g and connects the green cathode electrode 123g to the auxiliary electrode 132, the undercut structure 138 can also be included in the connection structure 130, but this is not limited.

[0120] The interlayer insulating layer 103 may have a first groove 104 corresponding to the first groove 131-1 of the first dam 111-1. The first groove 104 of the interlayer insulating layer 103 may be formed between a plurality of green sub-pixels SPg in the second direction Y, corresponding to the first groove 131-1 of the first dam 111-1.

[0121] The undercut structure 138 can be connected to the first layer 131-1 of the first dam 111-1 and the first groove 104 of the interlayer insulating layer 103. In this case, the auxiliary electrode 132 of the connecting structure 130 can be exposed in the undercut structure 138, and the green cathode electrode 123g can be connected to a portion of the exposed auxiliary electrode 132.

[0122] On the other hand, such as Figure 4 As shown, multiple second dikes 111-2 can be disposed between multiple sub-pixels SPr, SPg, and SPb in the first direction X. The multiple second dikes 111-2 can be disposed elongated along the second direction Y between the multiple sub-pixels SPr, SPg, and SPb in the first direction X. Multiple second slots 131-2 can be formed on the multiple second dikes 111-2. The multiple second slots 131-2 can be disposed elongated along the second direction Y between the multiple sub-pixels SPr, SPg, and SPb in the first direction X, but this is not limited. The second slots 131-2 can be formed by penetrating from the top to the bottom of the second dikes 111-2, but this is not limited.

[0123] The interlayer insulating layer 103 may have a second groove 105 corresponding to the second groove 131-2 of the second dike 111-2. The second groove 105 of the interlayer insulating layer 103 may be formed between the red sub-pixel SPr and the green sub-pixel SPg, corresponding to the second groove 131-2 of the second dike 11-2.

[0124] On the one hand, refer to Figures 1 to 4The organic light-emitting display device according to the embodiment may include a plurality of inorganic insulating layers 135-1, 135-2, 135-4; an organic insulating layer 141-4; a plurality of waterproof structures 143 to 145, etc.

[0125] The plurality of inorganic insulating layers may include a first inorganic insulating layer 135-1, a second inorganic insulating layer 135-2, a third inorganic insulating layer 135-3, and a fourth inorganic insulating layer 135-4. The first inorganic insulating layer 135-1, the second inorganic insulating layer 135-2, the third inorganic insulating layer 135-3, and the fourth inorganic insulating layer 135-4 may each include at least one inorganic insulating film.

[0126] The first inorganic insulating layer 135-1 can be disposed in the green sub-pixel SPg on the green cathode electrode 123g of the green organic light-emitting element 120g, and the second inorganic insulating layer 135-2 can be disposed in the red sub-pixel SPr on the red cathode electrode 123r of the red organic light-emitting element 120r. Although not shown, the third inorganic insulating layer 135-3 can be disposed in the blue sub-pixel SPb on the blue cathode electrode of the blue organic light-emitting element 120b.

[0127] The first inorganic insulating layer 135-1, the second inorganic insulating layer 135-2, and the third inorganic insulating layer 135-3 can be composed of a double layer including a silicon oxide layer and a silicon nitride layer. The silicon nitride layer can be disposed on the silicon oxide layer. For example, the silicon oxide layer can be formed using an ALD (atomic layer deposition) process, and the silicon nitride layer can be formed using a CVD (chemical vapor deposition) process.

[0128] When the first inorganic insulating layer 135-1, the second inorganic insulating layer 135-2, and the third inorganic insulating layer 135-3 are each composed of double layers, the first inorganic insulating layer 135-1, the second inorganic insulating layer 135-2, and the third inorganic insulating layer 135-3 can be continuously formed at the first undercut structure 151 and the second undercut structure 152 on the lower side of the second embankment 111-2, the side of the interlayer insulating layer 103, and the upper side of the second power wiring PL2.

[0129] The first waterproof structure 143 is formed by overlapping two or more inorganic insulating layers, namely the first inorganic insulating layer 135-1, the second inorganic insulating layer 135-2, and the third inorganic insulating layer 135-3, onto the second groove 131-2 of the second dike 111-2. The waterproof performance of the first waterproof structure 143 is enhanced by the fact that each of the first, second, and third inorganic insulating layers is composed of a double layer, and that two or more of these inorganic insulating layers overlap.

[0130] The first inorganic insulating layer 135-1, the second inorganic insulating layer 135-2, and the third inorganic insulating layer 135-3 can be formed in a bent shape at the first undercut structure 151 and the second undercut structure 152, respectively.

[0131] The second waterproof structure 144 can be formed by bending the first inorganic insulating layer 135-1 formed on the first undercut structure 151. The third waterproof structure 145 can be formed by bending the second inorganic insulating layer 135-2 formed on the second undercut structure 152. By bending the first inorganic insulating layer 135-1 or the second inorganic insulating layer 135-2, the penetration paths of moisture, oxygen, etc. are further increased, thus enhancing the waterproof performance of both the second waterproof structure 144 and the third waterproof structure 145. Therefore, by preventing the penetration of moisture, oxygen, etc. through the second waterproof structure 144 and the third waterproof structure 145, the organic light-emitting layers 122r, 122g and the cathode electrodes 123r, 123g can be protected from the influence of moisture, oxygen, etc. Thus, malfunction or poor light emission of the red sub-pixel SPr and the green sub-pixel SPg can be prevented, improving reliability.

[0132] Although not illustrated, the waterproof structure formed by the third inorganic insulating layer 135-3 can prevent malfunction or poor light emission of the blue sub-pixel SPb.

[0133] The fourth inorganic insulating layer 135-4 may be disposed over the entire area of ​​the substrate 110. The fourth inorganic insulating layer 135-4 may include at least one inorganic insulating film.

[0134] Thus, multiple inorganic insulating layers 135-1, 135-2, and 135-4 are disposed on each of the multiple sub-pixels SPr, SPg, and SPb or on the entire area of ​​the substrate 110, thereby completely blocking the penetration of moisture, oxygen, etc.

[0135] On the other hand, such as Figure 4As shown, multiple waterproof structures 143 to 145 can be configured in the second groove 131-2 of the second dike 111-2 between the red sub-pixel SPr and the green sub-pixel SPg.

[0136] By configuring multiple waterproof structures at the second trench 131-2 of the second dike 111-2, namely the first waterproof structure 143, the second waterproof structure and the third waterproof structure 145, the penetration of moisture, oxygen and other substances can be completely blocked.

[0137] The first waterproof structure 143 can be formed by overlapping two or more inorganic insulating layers 135-1 and 135-2 onto the second dike 111-2.

[0138] like Figure 4 As shown, a first waterproof structure 143 can be constructed by overlapping a first inorganic insulating layer 135-1, a second inorganic insulating layer 135-2, and a third inorganic insulating layer 135-3 onto a second groove 131-2 disposed between a second embankment 111-2 and a green sub-pixel SPg. For example, the second inorganic insulating layer 135-2 can be disposed on the first inorganic insulating layer 135-1, and the third inorganic insulating layer 135-3 can be disposed on the second inorganic insulating layer 135-2. The uppermost third inorganic insulating layer 135-3 can be an island-shaped insulating pattern. The island-shaped insulating pattern is a portion of the third inorganic insulating layer 135-3 disposed on the blue cathode electrode of the blue sub-pixel SPb, and can be spaced apart from the third inorganic insulating layer 135-3. Since the island-shaped insulating pattern includes the first waterproof structure 143, the waterproof performance can be further improved.

[0139] Although not shown, the second slot 131-2 of the second dike 111-2 located between the blue sub-pixel SPb and the red sub-pixel SPr can be configured with multiple waterproof structures 143 to 145. Additionally, multiple waterproof structures 143 to 145 can be configured at the second slot 131-2 of the second dike 111-2 located between the green sub-pixel SPg and the blue sub-pixel SPb.

[0140] On the one hand, such as Figure 4As shown, one of the multiple inorganic insulating layers 135-1 and 135-2 is formed in a curved shape through the first undercut structure 151 and the second undercut structure 152, thereby constituting the second waterproof structure and the third waterproof structure 145. The first undercut structure 151 and the second undercut structure 152 can be formed on the underside of the second dam 111-2 adjacent to the second groove 131-2 of the second dam 111-2. The first undercut structure 151 and the second undercut structure 152 can be formed by removing the interlayer insulating layer 103 located on the underside of the second dam 111-2 adjacent to the second groove 131-2 of the second dam 111-2. That is, the first undercut structure 151 and the second undercut structure 152 can be formed by recessing the side portion of the interlayer insulation layer 103 from the inside to the outside of the second groove 131-2 connected to the second dike 111-2. The second waterproof structure and the third waterproof structure 145 can be disposed on the second power wiring PL2 located in the second groove 131-2 of the second dike 111-2.

[0141] On the other hand, multiple second power supply lines PL2 can be disposed under multiple second dikes 111-2. The multiple second power supply lines PL2 can be exposed through multiple second slots 131-2 of the multiple second dikes 111-2. In this case, a first waterproof structure 143 formed by overlapping at least two of the multiple inorganic insulating layers 135-1, 135-2 can be located on the multiple second power supply lines PL2. The first waterproof structure 143 composed of at least two inorganic insulating layers can be disposed on the second power supply lines PL2 located in the second slots 131-2 of the second dikes 111-2. In this case, the second power supply lines PL2 can be omitted. If the second power supply lines PL2 are omitted, at least one of the multiple first power supply lines PL1 can extend to the non-display area NAA and be electrically connected to the power terminal 101.

[0142] According to the embodiment, the connection structure 130 is disposed between a plurality of sub-pixels SPr, SPg, SPb having the same color along the second direction Y, so that the power supply can be smooth and supply failures such as voltage drop can be prevented, thereby improving image quality and reliability.

[0143] According to the embodiment, at least two or more waterproof structures are configured on the first dike 111-1, so that water, oxygen and other substances that permeate along the second direction Y will not penetrate into the multiple sub-pixels SPr, SPg and SPb, thereby preventing sub-pixel malfunction or poor light emission and improving reliability.

[0144] On the one hand, refer to Figures 1 to 3The organic light-emitting display device according to the embodiment may include blocking structures 134-1 and 134-2. The blocking structures 134-1 and 134-2 may have undercut structures 115 and 116 formed in the edge region of the first dam 111-1. For example, the blocking structures 134-1 and 134-2 may be disposed in the lower edge region of each of the plurality of dams 111-1 and 111-2, but this is not limited.

[0145] The blocking structures 134-1 and 134-2 may include at least one blocking layer 113 for forming undercut structures 115 and 116 recessed from the side of the first dike 111-1 toward the inward side. The first undercut structure 151 and the second undercut structure 152 may be formed in the edge region of the first dike 111-1 through the blocking layer 113. The blocking layer 113 may include silicon-based inorganic materials, metals, etc. Aluminum (Al), molybdenum (Mo), molybdenum alloys, etc., may be used as metals, but this is not limited.

[0146] Although Figure 4 As not shown, the blocking structures 134-1 and 134-2 can be configured in the edge region of the second dike 111-2, but can also be omitted.

[0147] The following is for reference Figures 5a to 5k as well as Figures 6a to 6k This describes the process of sequentially manufacturing a green organic light-emitting element 120g and a red organic light-emitting element 120r. Although not shown, a blue organic light-emitting element 120b can be manufactured after the red organic light-emitting element 120r.

[0148] Figures 5a to 5k Show Figure 1 The manufacturing process of organic light-emitting display devices in the A-A' line. Figures 6a to 6k Show Figure 1 The manufacturing process of organic light-emitting display devices in D-D lines. This can be achieved through... Figures 5a to 5k The manufacturing process shown is used to manufacture 120g of green organic light-emitting elements, through... Figures 6a to 6k The manufacturing process shown is used to manufacture the red organic light-emitting element 120r. The manufacturing process for the blue organic light-emitting element 120b can be achieved through... Figures 6a to 6k The manufacturing process of the red organic light-emitting element 120r shown is easy to understand.

[0149] Figures 5a to 5k and Figures 6a to 6k The image shows a manufacturing process with green organic light-emitting element 120g, red organic light-emitting element 120r, and blue organic light-emitting element 120b in that order, but the order can be changed.

[0150] like Figure 1 , Figure 5a and Figure 6aAs shown, the driving circuit, the first power supply wiring PL1, the second power supply wiring PL2, the auxiliary electrode 132, and the interlayer insulating layer 103 can be formed on the substrate 110.

[0151] The substrate 110 may include materials with excellent insulating properties. For example, the substrate 110 may include plastic materials, resin materials, glass, etc. The substrate 110 may include rigid materials or flexible materials.

[0152] The driving circuit may include: multiple transistors, including driving transistors, at least one capacitor, etc. The driving circuit may be formed on substrate 110 using semiconductor processes. The multiple transistors may each include a gate electrode, a source electrode, and a drain electrode.

[0153] The first power supply wiring PL1, the second power supply wiring PL2, and the auxiliary electrode 132 can be formed of the same material as the source electrode and the drain electrode.

[0154] An auxiliary electrode 132 extends from the first power supply wiring PL1 and can form part of the first power supply wiring PL1. The auxiliary electrode 132 can be formed between a plurality of green sub-pixels SPg in the second direction Y. Although not shown, the auxiliary electrode 132 can be formed between a plurality of red sub-pixels SPr in the second direction Y and / or between a plurality of blue sub-pixels SPb in the second direction Y.

[0155] Interlayer insulating layer 103 may be formed on the first power supply wiring PL1, the second power supply wiring PL2, and the auxiliary electrode 132. Subsequently, the interlayer insulating layer 103 is removed to expose the auxiliary electrode 132, thereby allowing the first trench 104 to be formed on the interlayer insulating layer 103.

[0156] The interlayer insulation layer 103 may include a single organic insulating film or multiple insulating films, wherein the multiple insulating films include organic insulating films and inorganic insulating films.

[0157] The interlayer insulating layer 103 between multiple sub-pixels SPr, SPg, and SPb in the second direction Y is removed by an etching process, thereby forming the first trench 104. The top of the auxiliary electrode 132 can be exposed through the first trench 104. The connection structure 130 can be formed through the auxiliary electrode 132.

[0158] like Figure 5b and Figure 6b As shown, the green anode electrode 121g and the red anode electrode 121r can be formed on the interlayer insulating layer 103. The red anode electrode 121r can be formed on the red sub-pixel SPr, and the green anode electrode 121g can be formed on the green sub-pixel SPg. Although not shown, the blue anode electrode can be formed on the blue sub-pixel SPb.

[0159] The blocking layer 113 can be formed on the green anode electrode 121g and the red anode electrode 121r.

[0160] For example, a conductive film and a blocking film can be formed on a substrate and patterned to form a green anode electrode 121g, a red anode electrode 121r, and a blocking layer 113. When the conductive film and the blocking film are etched using the same photosensitive pattern, the side surfaces of the patterned green anode electrode 121g and the patterned blocking layer 113 can be located on the same vertical line or diagonal, and the side surfaces of the patterned red anode electrode 121r and the patterned blocking layer 113 can be located on the same vertical line or diagonal.

[0161] like Figure 5c and Figure 6c As shown, the inorganic film 111a can be formed on the interlayer insulating layer 103.

[0162] like Figure 5d and Figure 6d As shown, the first photosensitive pattern 210 and the second photosensitive pattern 212 can be formed on the inorganic film 111a.

[0163] The first photosensitive pattern 210 may have a groove 215 on an auxiliary electrode 132 between a plurality of green sub-pixels SPg in the second direction Y. The top surface of the inorganic film 111a may be exposed through the groove 215.

[0164] The second photosensitive pattern 212 can be formed not only on multiple red sub-pixels SPr in the second direction Y, but also on the auxiliary electrode 132 between the multiple red sub-pixels SPr. In this case, the thickness of the second photosensitive pattern 212 on the auxiliary electrode 132 can be formed such that it is thicker than the thickness on the red sub-pixels SPr by half a mask.

[0165] like Figure 5e and Figure 6e As shown, the inorganic film 111a can be removed by performing an etching process using the first photosensitive pattern 210 and the second photosensitive pattern 212.

[0166] The inorganic film 111a exposed by the first photosensitive pattern 210 is removed, exposing the blocking layer 113 and the auxiliary electrode 132. Specifically, the inorganic film 111a on the green anode electrode 121g can be removed, and the inorganic film 111a on the auxiliary electrode 132 between the green sub-pixels SPg can also be removed. By removing the inorganic film 111a on the auxiliary electrode 132 between the green sub-pixels SPg, a first dam 111-1 with a first groove 131-1 can be formed. The first groove 131-1 can be formed only locally between adjacent green sub-pixels SPg in the second direction Y.

[0167] In contrast, the inorganic film 111a is protected by the second photosensitive pattern 212, so the inorganic film 111a on the multiple red sub-pixels SPr and auxiliary electrode 132 does not need to be removed.

[0168] On one hand, by performing a dry etching process, the second photosensitive pattern 212 can be removed from the area surrounding the auxiliary electrode 132 between the multiple red sub-pixels SPr. By removing the second photosensitive pattern 212 from the remaining area, the top surface of the inorganic film 111a can be exposed. The removal of the exposed top surface of the inorganic film 111a by the dry etching process can reduce the thickness of the inorganic film 111a, but this is not a limitation.

[0169] Next, a wet etching process can be performed using the first photosensitive pattern 210 and the second photosensitive pattern 212.

[0170] like Figure 5f As shown, the blocking layer 113 in the green sub-pixel SPg can be removed by a wet etching process. By continuously performing the wet etching process to remove the blocking layer 113 located under the first dam 111-1, undercut structures 115 and 116 can be formed. That is, the side portion of the blocking layer 113 is recessed from the outer portion of the first dam 111-1 toward the inner portion, thereby forming blocking structures 134-1 and 134-2 with undercut structures 115 and 116.

[0171] Next, another etching process is performed, exposing the interlayer insulating layer 103 of the first trench 131-1 in the first dike 111-1, which is recessed from the lower side of the first dike 111-1 toward the outside, thereby forming an undercut structure 138. The connection structure 130 may include the undercut structure 138 as well as the auxiliary electrode 132, but this is not limited.

[0172] In contrast, such as Figure 6e and Figure 6f As shown, the inorganic film 111a is removed by a wet etching process, thereby exposing the blocking layer 113 in the red sub-pixel SPr, forming a first dam 111-1 with a first trench 131-1. The auxiliary electrode 132 can be exposed through the first trench 131-1.

[0173] like Figure 5g and Figure 6g As shown, after the first photosensitive pattern 210 and the second photosensitive pattern 212 are removed, a cleaning process can be performed.

[0174] like Figures 5h to 5j as well as Figure 6hAs shown, the green organic light-emitting layer 122g, the green cathode electrode 123g, and the first inorganic insulating layer 135-1 can be formed on the entire area of ​​the substrate 110 or on the display area AA of the substrate 110.

[0175] First, such as Figure 5h As shown, the green organic light-emitting layer 122g can be deposited on the entire area of ​​the substrate 110 or on the display area AA of the substrate 110. The green organic light-emitting layer 122g can be deposited on the red sub-pixel SPr, the green sub-pixel SPg, the blue sub-pixel SPb, the first layer 111-1, and the second layer 111-2.

[0176] The green organic light-emitting layer 122g can have at least two or more stacked structures. The green organic light-emitting layer 122g may include a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, and a charge generation layer, etc.

[0177] The green organic light-emitting layer 122g can be separated by the undercut structure 138. That is, the green organic light-emitting layer 122g formed in the first groove 131-1 of the first dam 111-1 and the green organic light-emitting layer 122g formed on the upper side of the first dam 111-1 can be separated from each other by the undercut structure 138.

[0178] Parts of the green organic light-emitting layer 122g, such as the hole injection layer and / or charge generation layer, can be cut off by the undercut structures 115 and 116 of the blocking structures 134-1 and 134-2, thereby blocking the leakage current flowing to the hole injection layer, charge generation layer, etc., and preventing poor image quality.

[0179] like Figure 5i As shown, a green cathode electrode 123g can be deposited on a green organic light-emitting layer 122g. The green organic light-emitting layer 122g and the green cathode electrode 123g can be deposited using different deposition angles θ1 and θ2. The deposition angle can be defined with a vertical line as a reference.

[0180] The deposition angle θ2 for depositing the green cathode electrode 123g can be greater than the deposition angle θ1 for depositing the green organic light-emitting layer 122g. In this case, the green organic light-emitting layer 122g can be deposited at the entrance of the undercut structure 138. Conversely, the green cathode electrode 123g can be deposited into the interior of the undercut structure 138, in a portion of the undercut structure 138 that is adjacent to the upper part of the auxiliary electrode 132.

[0181] like Figure 5j As shown, the first inorganic insulating layer 135-1 can be formed on the green cathode electrode 123g.

[0182] like Figure 6hAs shown, a green organic light-emitting layer 122g, a green cathode electrode 123g, and a first inorganic insulating layer 135-1 can be formed on the red sub-pixel SPr. Although not shown, the green organic light-emitting layer 122g, the green cathode electrode 123g, and the first inorganic insulating layer 135-1 can also be formed on the blue sub-pixel SPb.

[0183] The first inorganic insulating layer 135-1 may be composed of a double layer comprising a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer may be formed using an ALD process, and the silicon nitride layer may be formed using a CVD process.

[0184] like Figure 6i As shown, the green organic light-emitting layer 122g, the green cathode electrode 123g, and the first inorganic insulating layer 135-1 formed on the plurality of red sub-pixels SPr in the second direction Y can be removed. That is, the green organic light-emitting layer 122g, the green cathode electrode 123g, and the first inorganic insulating layer 135-1 can be formed only on the plurality of green sub-pixels SPg and the plurality of auxiliary electrodes 130 between the plurality of green sub-pixels SPg in the second direction Y.

[0185] This exposes the blocking layer 113 formed on the red sub-pixel SPr and the auxiliary electrode 132 formed on the first trench 131-1 of the first embankment 111-1. Although not shown, the green organic light-emitting layer 122g, the green cathode electrode 123g, and the first inorganic insulating layer 135-1 formed on the plurality of blue sub-pixels SPb in the second direction Y can be removed. Therefore, the green organic light-emitting layer 122g, the green cathode electrode 123g, and the first inorganic insulating layer 135-1 can be formed only on the plurality of auxiliary electrodes 132 formed on the plurality of green sub-pixels SPg and between the plurality of green sub-pixels SPg in the second direction Y. Thus, a plurality of green organic light-emitting elements 120 can be fabricated on the plurality of green sub-pixels SPg in the second direction Y, and the green cathode electrode 123g of the green organic light-emitting element 120 can be electrically connected to the first power supply wiring PL1 through the connection structure 130.

[0186] The steps to complete the deposition of 123g of green cathode electrode ( Figure 5i In the diagram, the cross-sectional structure of the connection structure 130 of the red sub-pixel SPr can be as follows: Figure 6h As shown.

[0187] contrast Figure 5i The diagram shown and Figure 6h As can be seen from the cross-sectional structure of the figure shown, the green organic light-emitting element 120g is formed in the state of the red sub-pixel SPr, and there is no undercut structure or blocking structure in the red sub-pixel SPr.

[0188] Although not illustrated, the steps to complete the fabrication of the green sub-pixel SPg are as follows ( Figure 5k In the red sub-pixel SPr, an organic insulating layer is also formed before being removed (and) Figure 6h (with the same structure), the first inorganic insulating layer 135-1 and organic light-emitting elements 122g and 123g at the green sub-pixel SPg are removed by dry etching process.

[0189] Due to the absence of an undercut structure ( Figure 6h By performing the aforementioned process, residual film that may occur in the undercut structure can be blocked at its source.

[0190] On the other hand, undercut structures and blocking structures can be formed before the red organic light-emitting element 120r is formed before the red sub-pixel Pr. Figure 6j ).

[0191] After manufacturing 120g of green organic light-emitting elements, as follows: Figures 6j to 6k As shown, a red organic light-emitting element 120r can be manufactured. Although not shown, after manufacturing the red organic light-emitting element 120r, a blue organic light-emitting element 120b can be manufactured. Thereafter, as... Figure 5k As shown, an organic light-emitting display device according to the embodiment can be manufactured by forming an organic insulating layer 141-4 and a fourth inorganic insulating layer 135-4.

[0192] The following is for reference Figures 6j to 6k Explain the manufacturing process of the red organic light-emitting element 120r.

[0193] As mentioned earlier, the final process for patterning the green sub-pixel SPg involves forming connection structures, blocking structures, etc., on the red sub-pixel SPr. Additional photolithography processes may be required to form these connection and blocking structures, but this is not a limitation.

[0194] like Figure 6j As shown, the photosensitive pattern can be formed in the remaining area except for the multiple red sub-pixels SPr in the second direction Y, that is, on the multiple green sub-pixels SPg and the multiple blue sub-pixels SPb in the second direction Y.

[0195] Subsequently, by performing a wet etching process using a photosensitive pattern, the blocking layer 113 exposed on multiple red sub-pixels SPr is removed. The blocking layer 113 located under the first dam 111-1 can thus form undercut structures 115 and 116. That is, the side of the blocking layer 113 is recessed from the outer side of the first dam 111-1 toward the inner side, thereby forming blocking structures 134-1 and 134-2 with undercut structures 115 and 116.

[0196] Next, another etching process is performed, exposing the interlayer insulating layer 103 of the first trench 131-1 exposed on the first dike 111-1, which is recessed from the lower side of the first dike 111-1 toward the outside, thereby forming an undercut structure 138. The connection structure 130 may include the undercut structure 138 while including the auxiliary electrode 132, but this is not limited.

[0197] like Figure 6k As shown, the red organic light-emitting layer 122r, the red cathode electrode 123r, and the second inorganic insulating layer 135-2 can be formed on the entire area of ​​the substrate 110 or on the display area AA of the substrate 110. That is, the red organic light-emitting layer 122r, the red cathode electrode 123r, and the second inorganic insulating layer 135-2 can be formed on multiple red sub-pixels SPr, multiple green sub-pixels SPg, and multiple blue sub-pixels SPb.

[0198] The second inorganic insulating layer 135-2 can be composed of a double layer including a silicon oxide layer and a silicon nitride layer on the silicon oxide layer. For example, the silicon oxide layer can be formed using an ALD process, and the silicon nitride layer can be formed using a CVD process.

[0199] After the photosensitive pattern is formed on multiple red sub-pixels SPr in the second direction Y, the photosensitive pattern can be used to perform an etching process.

[0200] Apart from the multiple red sub-pixels SPr, the red organic light-emitting layer 122r, the red cathode electrode 123r, and the second inorganic insulating layer 135-2 on the remaining areas, namely the multiple green sub-pixels SPg and the multiple blue sub-pixels SPb, can be removed by an etching process. Therefore, the red organic light-emitting layer 122r, the red cathode electrode 123r, and the second inorganic insulating layer 135-2 can be formed only on the multiple red sub-pixels SPr in the second direction Y, thereby enabling the fabrication of multiple red organic light-emitting elements 120r on the multiple green sub-pixels SPg in the second direction Y.

[0201] Although not illustrated, the blue organic light-emitting element 120b can be manufactured using a process similar to that used for manufacturing multiple red organic light-emitting elements 120r. That is, the blue organic light-emitting element can be manufactured by stacking and patterning a blue-green light-emitting layer, a blue cathode electrode, and a third inorganic insulating layer 135-3.

[0202] As described above, a green organic light-emitting element 120g, a red organic light-emitting element 120r, and a blue organic light-emitting element can be manufactured sequentially.

[0203] After that, as Figure 5kAs shown, after manufacturing the blue organic light-emitting element, the organic insulating layer 141-4 can be formed on the entire area of ​​the substrate 110 or on the display area AA of the substrate 110, and the fourth inorganic insulating layer 135-4 can be formed on the organic insulating layer 141-4.

[0204] Although not illustrated, at least one inorganic insulating film may be formed beneath the organic insulating layer 141-4.

[0205] The organic insulating layer 141-4 can be formed using inkjet printing, but there is no limitation on this. The fourth inorganic insulating layer 135-4 can be formed using PECVD as an inorganic material such as silicon nitride (SiNx), but there is no limitation on this.

[0206] Figure 7 This shows the state in which the groove of the photosensitive pattern is located at a different position relative to the groove of the interlayer insulating layer along the second direction Y. Figure 8 The arrangement of the grooves in the interlayer insulating layer and the grooves in the photosensitive pattern is shown. Figure 9 This shows the state in which the grooves of the photosensitive pattern are arranged on different sides of the grooves in the interlayer insulating layer.

[0207] Multiple undercut structures 138 can be located at different locations in multiple first grooves 131-1 of multiple first dikes 111-1.

[0208] like Figures 7 to 9 As shown, the configuration positions of the multiple undercut structures 138 can be different depending on the position of the groove of the first photosensitive pattern 210 relative to the first groove 104 of the interlayer insulating layer 103.

[0209] For example, when viewed from above, the first groove 104 of the interlayer insulating layer 103 and the groove of the first photosensitive pattern 210 may each have a quadrangular shape, but this is not limited.

[0210] like Figure 7 As shown, in the connection structure 130 on the m-th row, the groove of the first photosensitive pattern 210 can be formed by offset to the right and rear sides relative to the first groove 104 of the interlayer insulating layer 103. When the etching process is performed using the first photosensitive pattern 210, the undercut structure 138 can be formed below the first embankment 111-1 on the right and rear sides of the first groove 104.

[0211] In the connection structure 130 on the (m+1)th row line, the groove of the first photosensitive pattern 210 can be formed by offsetting the first groove 104 of the interlayer insulating layer 103 towards the rear and left. When the etching process is performed using the first photosensitive pattern 210, the undercut structure 138 can be formed below the first embankment 111-1 on the rear and left sides of the first groove 104.

[0212] In the connection structure 130 on the (m+2)th row line, the groove of the first photosensitive pattern 210 can be formed by offset to the left and front relative to the first groove 104 of the interlayer insulating layer 103. When the etching process is performed using the first photosensitive pattern 210, the undercut structure 138 can be formed below the first embankment 111-1 on the left and front sides of the first groove 104.

[0213] In the connection structure 130 on the (m+3)th row line, the groove of the first photosensitive pattern 210 can be formed by offset from the first groove 104 of the interlayer insulating layer 103 towards the front and right sides. When the etching process is performed using the first photosensitive pattern 210, the undercut structure 138 can be formed below the first embankment 111-1 on the front and right sides of the first groove 104.

[0214] To show Figure 7 The four connection structures on the left side will be explained in detail. For example, as Figures 7 to 9 As shown, of the four sides of the first groove 104 and 131-1, two sides can form an undercut structure 138, while the other two sides may not form an undercut structure 138.

[0215] In the deposition equipment, organic light-emitting materials can be deposited through an angle limiting plate at a certain direction and angle. Figure 5i Evaporation. The region where the undercut structure 138 is formed can be shaded to prevent the organic light-emitting material from depositing on a portion of the undercut structure 138, thereby exposing a portion of the auxiliary electrode 132. Furthermore, in the regions where the undercut structure 138 is not formed, the organic light-emitting material can continue uninterruptedly.

[0216] Thus, the organic light-emitting material can be deposited in the same first trench 104, 131-1 to maintain a state in which a portion of the auxiliary electrode 132 is exposed. Subsequently, in the next deposition apparatus, the cathode electrode material can be deposited in the undercut structure 138 to be adjacent to the exposed portion of the auxiliary electrode 132, continuing uninterruptedly in the area where the undercut structure 138 is not formed.

[0217] Depending on the direction of travel of the substrate 110 during deposition and the angle and position of the evaporation source, at least one of the four connection structures 130 can be electrically connected to the green cathode electrode 123g and the auxiliary electrode 132 of the connection structure 130, thereby improving reliability.

[0218] like Figure 5i As shown, the green cathode electrode 123g can be electrically connected to the auxiliary electrode 132 of the connection structure 130 in the undercut structure 138.

[0219] Thus, the undercut structure 138 can be configured differently in the multiple connection structures 130 on the multiple row lines in the second direction Y. Consequently, the green cathode electrode 123g, which is configured to traverse multiple green sub-pixels SPg along the second direction Y, can be electrically connected to different regions of the multiple auxiliary electrodes 132 in the multiple connection structures 130 on the multiple row lines in the second direction Y.

[0220] For example, the green cathode electrode 123g can be electrically connected to the auxiliary electrode 132 in the connection structure 130 on the m-th row line, via the undercut structure 138, on the right and rear sides of the first trench 104, 131-1 of the first dam 111-1 and the interlayer insulating layer 103. For example, the green cathode electrode 123g can be electrically connected to the auxiliary electrode 132 at the connection structure 130 on the (m+1)-th row line, via the undercut structure 138, on the rear and left sides of the first trench 104, 131-1 of the interlayer insulating layer 103. For example, the green cathode electrode 123g can be electrically connected to the auxiliary electrode 132 at the connection structure 130 on the (m+2)-th row line, via the undercut structure 138, on the left and front sides of the first trench 104, 131-1 of the interlayer insulating layer 103. For example, the green cathode electrode 123g can be electrically connected to the auxiliary electrode 132 at the connection structure 130 on the m+3 row line, through the undercut structure 138, on the front and right sides of the first groove 104, 131-1 of the interlayer insulating layer 103.

[0221] On the other hand, relative to the first groove 104 of the interlayer insulating layer 103, the groove of the first photosensitive pattern 210 may be offset toward at least one or more sides. For example, as Figure 9 As shown in diagram a, the groove of the first photosensitive pattern 210 can be formed by offsetting only to the left relative to the first groove 104 of the interlayer insulating layer 103. For example, as Figure 9 As shown in b, the groove of the first photosensitive pattern 210 can be formed by offset to the right and rear sides relative to the first groove 104 of the interlayer insulating layer 103. For example... Figure 9 As shown in c, the groove of the first photosensitive pattern 210 is formed by offset from the first groove 104 of the interlayer insulating layer 103 towards the front, right and rear sides.

[0222] According to an embodiment, in a plurality of connection structures 130 along a plurality of rows along the second direction Y, a plurality of undercut structures 138 are formed at different locations in a plurality of first dams 111-1 and the first grooves 104, 131-1 of the interlayer insulating layer 103, so that the cathode electrode can be formed on a plurality of auxiliary electrodes 132 of the plurality of connection structures 130 through the plurality of undercut structures 138 formed at different locations. This prevents poor electrical connection between the cathode electrode of the connection structure 130 and the first power supply wiring PL1, preventing poor light emission or malfunction, and improving reliability.

[0223] Figure 10 A cross-sectional view of the organic light-emitting display device according to the fourth embodiment is shown. Except for the green cathode electrode 123g, which is composed of a double layer, the fourth embodiment and the first embodiment ( Figure 2 The fourth embodiment is the same as the first embodiment. Figure 2 Elements with the same shape, structure and / or function are given the same reference numerals, and detailed descriptions are omitted.

[0224] Although the figure shows multiple green cathode electrodes 123g for multiple green sub-pixels SPg in the second direction Y, the same can be used for multiple red cathode electrodes 123r for multiple red sub-pixels SPr in the second direction Y and / or multiple blue cathode electrodes for multiple blue sub-pixels SPb in the second direction Y.

[0225] Reference Figure 1 and Figure 10 The organic light-emitting display device according to the embodiment may include a first dam 111-1, a green organic light-emitting element 120g, and a connection structure 130, etc.

[0226] The first dam 111-1 can be configured between adjacent green sub-pixels SPg. The first slot 131-1 can be formed on the first dam 111-1 and connected to the first slot 131-1. An undercut structure 138 can be formed on the lower side of the first dam 111-1.

[0227] The green organic light-emitting element 120g may include a green anode electrode 121g, a green organic light-emitting layer 122g, and a green cathode electrode 123g.

[0228] The green cathode electrode 123g can be electrically connected to the first power supply wiring PL1 through the connection structure 130. For example, the green cathode electrode 123g can be connected to the auxiliary electrode 132 of the connection structure 130 in the undercut structure 138.

[0229] In this embodiment, the green cathode electrode 123g may include a first conductive layer 123-1 and a second conductive layer 123-2. The second conductive layer 123-2 may be disposed on the first conductive layer 123-1.

[0230] The first conductive layer 123-1 may include a material with excellent electrical conductivity, such as Mg:Ag. The step coverage of the first conductive layer 123-1, including materials such as Mg:Ag, may be poor. When the first conductive layer 123-1 is deposited on the substrate 110, the first conductive layer 123-1 at the first trench 131-1 and the first conductive layer 123-1 on the upper side of the first embankment 111-1 may be separated and discontinuous. Furthermore, at the first trench 131-1, the first conductive layer 123-1 may not be connected to the top of the auxiliary electrode 132 at the undercut structure 138. In this case, the first power supply wiring PL1 is disconnected from the green cathode electrode 123g on the green sub-pixel SPg through the connection structure 130; therefore, the green organic light-emitting element 120g on the green sub-pixel SPg may not operate or emit light, potentially reducing product reliability. Furthermore, when the first conductive layer 123-1 is formed with a very thin thickness of about 10 nm, the step coverage performance is poor, which may lead to increased resistance or wire breakage.

[0231] To address this issue, a second conductive layer 123-2 with excellent step coverage is formed on the first conductive layer 123-1, thereby forming a green cathode electrode 123g composed of the first conductive layer 123-1 and the second conductive layer 123-2. The second conductive layer 123-2 may include a conductive oxide material with excellent step coverage, such as ITO.

[0232] Due to the excellent step coverage performance of the second conductive layer 123-2, the second conductive layer 123-2 at the first groove 131-1 and the second conductive layer 123-2 on the upper side of the first embankment 111-1 can be continuous without being broken. Since the second conductive layer 123-2 is formed in the undercut structure 138, the second conductive layer 123-2 can be connected to the upper part of the auxiliary electrode 132 in the undercut structure 138.

[0233] According to the embodiment, by having a green cathode electrode 123g that includes a first conductive layer 123-1 and a second conductive layer 123-2 with excellent step coverage, poor connection between the green cathode electrode 123g and the connection structure 130 can be prevented, thereby improving reliability.

[0234] Figure 11 A waterproof structure according to the first embodiment is shown. Figure 12 A waterproof structure according to the second embodiment is shown. Figure 13 A waterproof structure according to the third embodiment is shown. Figure 14 A plan view of the organic light-emitting display device according to the second embodiment is shown for schematic purposes.

[0235] according to Figures 11 to 13As shown, the waterproof structure can surround at least one of the multiple sub-pixels SPr, SPg, and SPb in the second direction Y. Therefore, moisture, oxygen, and other substances cannot penetrate the organic light-emitting element of the at least one sub-pixel surrounded by the waterproof structure, thus preventing sub-pixel malfunction and improving reliability.

[0236] For example, the connecting structure 130 and the waterproof structure can be disposed between multiple sub-pixels SPr, SPg, and SPb in the second direction Y. For example, the waterproof structure can be disposed relatively long along the first direction X between multiple sub-pixels SPr, SPg, and SPb in the second direction Y, and the connecting structure 130 can be partially disposed in the region between multiple sub-pixels SPr, SPg, and SPb in the second direction Y. For example, the waterproof structure can also be formed in the region where the connecting structure 130 is formed, but this is not limited.

[0237] As an example, the waterproof structure can be arranged around multiple sub-pixels SPr, SPg, SPb in the second direction Y. Figure 11 ).

[0238] As another example, multiple sub-pixels SPr, SPg, and SPb in the second direction Y are grouped in units of two sub-pixels, and multiple groups of sub-pixels SPr, SPg, and SPb can be defined. In this case, the waterproof structure can be arranged around multiple groups of sub-pixels SPr, SPg, and SPb respectively. Figure 12 ).

[0239] As another example, multiple sub-pixels SPr, SPg, and SPb in the second direction Y are grouped in units of four sub-pixels, and multiple groups of sub-pixels SPr, SPg, and SPb can be defined. In this case, the waterproof structure can be arranged around multiple groups of sub-pixels SPr, SPg, and SPb respectively. Figure 13 ).

[0240] Figure 14 A plan view of the organic light-emitting display device according to the second embodiment is shown for schematic purposes.

[0241] like Figure 14 As shown, multiple sub-pixels SPr, SPg, and SPb can be arranged in a strip along the second direction Y on the display area AA, and multiple virtual sub-pixels SPrd, SPgd, and SPbd can be arranged in a strip along the first direction X on the non-display area NAA. The non-display area NAA may include a bezel area.

[0242] Multiple waterproof structures 146-1 to 146-3 can be configured between multiple virtual sub-pixels SPrd, SPgd, and SPbd in the second direction Y.

[0243] On the other hand, since this is an area where no image is displayed, the non-display area NAA or border area may not be equipped with red organic light-emitting elements 120r, green organic light-emitting elements 120g, and blue organic light-emitting elements 120b. For example, as Figure 15 As shown, the red organic light-emitting element 120r may not be configured in the red virtual sub-pixel SPrd, and the green organic light-emitting element 120g may not be configured in the green virtual sub-pixel SPgd. That is, at least one of the anode electrode, organic light-emitting layer, and cathode electrode constituting the red organic light-emitting element 120r or the green organic light-emitting element 120g may not be configured in the green virtual sub-pixel SPgd or the red virtual sub-pixel SPrd.

[0244] Although not illustrated, the blue organic light-emitting element 120b may not be configured in the blue virtual sub-pixel SPbd.

[0245] The third dam 111-3 can be configured between the red virtual sub-pixel SPrd and the red virtual sub-pixel SPrd, and the third groove 131-3 can be formed on the third dam 111-3. Multiple undercut structures 153 and 154 can be formed on the underside of the third dam 111-3 connected to the third groove 131-3.

[0246] Multiple waterproof structures 146-1 to 146-3 may each include two or more waterproof structures 144-4 and 145-4.

[0247] For example, the first waterproof structure 144-4 can be formed by the bending shape of the first inorganic insulating layer 135-1 disposed in the first undercut structure 153, and the second waterproof structure 145-4 can be formed by the bending shape of the second inorganic insulating layer 135-2 disposed in the second undercut structure 154.

[0248] Waterproof structures 144-4 and 145-4 can be used in the third embodiment ( Figure 4 The second waterproof structure 144 and the third waterproof structure 145 shown in the figure are the same.

[0249] Thus, multiple waterproof structures 146-1 to 146-3 can be formed between multiple virtual sub-pixels SPrd, SPgd, and SPbd on the non-display area NAA, thereby preventing moisture, oxygen, etc., from penetrating from the non-display area NAA to the display area AA. Even if moisture, oxygen, etc., penetrate from the non-display area NAA to the display area AA, multiple waterproof structures formed along the second direction Y between multiple sub-pixels SPr, SPg, and SPb in the first direction X of the display area AA can be blocked. Figure 4The elements 143 to 145 are used to block moisture, oxygen, etc., so as not to penetrate into the multiple organic light-emitting elements 120r, 120g, and 120b of the multiple sub-pixels SPr, SPg, and SPb. As a result, the penetration blocking performance of moisture, oxygen, etc. can be significantly improved, preventing malfunction or poor light emission of the sub-pixels SPr, SPg, and SPb, and improving reliability.

[0250] The detailed description above should be construed as exemplary and not restrictive in all respects. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and the scope of the embodiments includes all variations within the equivalent scope of the embodiments.

Claims

1. An organic light emitting display device, wherein, The organic light emitting display device comprises: a plurality of sub-pixels having different colors in a first direction and having the same color in a second direction intersecting the first direction; a plurality of anode electrodes at the plurality of sub-pixels; a plurality of organic light emitting layers on the plurality of anode electrodes; a plurality of cathode electrodes on the plurality of organic light emitting layers; a plurality of first banks between the plurality of sub-pixels in the second direction; a plurality of first power supply wirings under the plurality of first banks in the first direction; a plurality of connection structures in a plurality of first grooves of some of the plurality of first banks; and a plurality of undercut structures on the lower side of the some of the first banks adjoining the plurality of first grooves, the organic light emitting layers and the cathode electrodes being arranged across the some of the first banks, the connection structures electrically connecting the cathode electrodes to the first power supply wirings at the undercut structures. The organic light emitting display device further comprises:

2. The organic light emitting display device according to claim 1, wherein, an interlayer insulating layer under the banks, the undercut structures being formed by recessing from the inner side of the first banks to the outer side direction through the side of the interlayer insulating layer adjoining the first grooves.

3. The organic light emitting display device according to claim 1, wherein the connection structures comprise auxiliary electrodes extending from the first power supply wirings, the organic light emitting layers being cut off by the undercut structures to expose a partial area of the auxiliary electrodes, the cathode electrodes adjoining the partial area of the auxiliary electrodes exposed at the undercut structures. The organic light emitting display device comprises:

4. The organic light emitting display device according to claim 1, wherein, a plurality of inorganic insulating layers on the plurality of cathode electrodes; a plurality of second banks having second grooves arranged longer in the second direction between the plurality of sub-pixels in the first direction; and a plurality of waterproof structures respectively at the plurality of second banks. The plurality of waterproof structures comprises: a first waterproof structure on the second bank; 5. The organic light emitting display device according to claim 4, wherein, a second waterproof structure at a first side of the second groove of the second bank; and a third waterproof structure at a second side of the second groove of the second bank.

6. The organic light emitting display device according to claim 5, wherein the first waterproof structure is formed by overlapping at least two or more of the plurality of inorganic insulating layers on the second bank.

7. The organic light emitting display device according to claim 6, wherein the second waterproof structure is formed by a first undercut structure by one of the plurality of inorganic insulating layers, the third waterproof structure is formed by a second undercut structure by another of the plurality of inorganic insulating layers, the first undercut structure and the second undercut structure are formed on the lower side of the second bank adjoining the second groove of the second bank.

8. The organic light emitting display device according to claim 4, wherein the waterproof structure surrounds at least one or more of the plurality of sub-pixels in the second direction. The organic light emitting display device further comprises: a plurality of second power supply wirings at the plurality of second grooves of the plurality of second banks in the second direction, 9. The organic light emitting display device according to claim 1, wherein, at least two or more of the inorganic insulating layers are arranged on the second power supply wirings. ​ ​ 10. The organic light emitting display device according to claim 1, wherein the plurality of undercut structures are located at mutually different positions at the plurality of first grooves.

11. The organic light emitting display device according to claim 1, wherein the cathode electrode comprises: a first conductive layer; and a second conductive layer located on the first conductive layer.

12. The organic light emitting display device according to claim 1, wherein, further comprising: a blocking structure located at an edge region of at least one or more banks of the first bank and the second bank, a hole injection layer or a charge generation layer of the organic light emitting layer is cut off by the blocking structure.

13. The organic light emitting display device according to claim 1, further comprising: a plurality of dummy sub-pixels located in a non-display region along the first direction and having a bar shape; and a plurality of waterproof structures located between the plurality of dummy sub-pixels in the second direction. ​

Images