Film layer thickness uniformity detection method and system

Abstract

The invention provides a film layer thickness uniformity detection method and system, and the method comprises the steps: providing a substrate which is provided with a to-be-detected film layer; scanning the thickness of the to-be-detected film layer and generating detection information; the thickness uniformity of the to-be-detected film layer is detected in a multi-azimuth mode according to various data obtained from the detection information, and the method comprises the steps that at least two thickness curves of the to-be-detected film layer are obtained according to the detection information, and the thickness curves are parallel to the scanning direction; and comparing the plurality of obtained thickness curves, and judging whether the thickness uniformity of the to-be-detected film layer reaches the standard or not according to a comparison result. According to the film layer thickness uniformity detection method and system provided by the invention, micron-sized defects in the transparent material film layer can be detected, and meanwhile, the spraying state of the film layer can be confirmed and judged according to the detected defects.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a method and system for detecting the uniformity of film thickness. Background Technology

[0002] During the preparation of optical adhesives, streaks are generated in the direction of movement, so the thickness uniformity of the adhesive layer prepared from optical adhesives needs to be carefully managed. However, since optical adhesives are usually transparent materials and the final adhesive layer is relatively thin, the defects that need to be avoided are also very small, resulting in low accuracy of current detection methods when testing their thickness uniformity.

[0003] Therefore, existing detection methods need to be improved. Summary of the Invention

[0004] The purpose of this invention is to provide a method and system for detecting the uniformity of film thickness, so as to solve the problem of low accuracy in existing film detection methods when detecting the uniformity of optical adhesive layers.

[0005] To achieve the above objectives, the present invention provides a method for detecting the uniformity of film thickness. The method includes: providing a substrate on which a film layer to be tested is disposed; scanning the thickness of the film layer to be tested and generating detection information; and detecting the uniformity of the thickness of the film layer to be tested from multiple perspectives based on various data obtained from the detection information, including: acquiring at least two thickness curves of the film layer to be tested based on the detection information, wherein the scanning directions of the thickness curves are parallel to each other; comparing the positions and heights of corresponding peaks in the at least two acquired thickness curves and the heights of multiple peaks in the same thickness curve; if the positions and heights of the peaks in the thickness curves are the same, and the heights of multiple peaks in the same thickness curve are the same, then the uniformity of the thickness of the film layer to be tested meets the standard; if the positions and heights of the peaks in the thickness curves or the heights of multiple peaks in the same thickness curve are different in at least one aspect, then the uniformity of the thickness of the film layer to be tested does not meet the standard.

[0006] Furthermore, the step of detecting the thickness uniformity of the film layer under test from multiple perspectives based on various data obtained from the detection information further includes: identifying the defect location in the film layer under test; obtaining the thickness curve corresponding to the defect location from the detection information; obtaining the thickness peak value and thickness trough value at the defect location from the thickness curve, and calculating the difference between the thickness peak value and the thickness trough value; and determining whether the thickness uniformity of the film layer under test meets the standard based on the magnitude of the difference. Preferably, if the difference is less than or equal to a preset threshold, the thickness uniformity of the film layer under test meets the standard; if the difference is greater than the preset threshold, the thickness uniformity of the film layer under test does not meet the standard.

[0007] Furthermore, identifying the defect location in the film layer to be detected includes: acquiring surface image information of the film layer to be detected, and obtaining the defect location from the surface image information.

[0008] Preferably, the substrate includes a first detection area and a second detection area disposed around the first detection area, and the step of identifying the defect location in the film layer to be detected includes: obtaining the defect location located in the first detection area from the surface image information.

[0009] Furthermore, the step of detecting the thickness uniformity of the film layer under test from multiple perspectives based on various data obtained from the detection information further includes: presetting multiple reference points; obtaining the thickness corresponding to the multiple reference points in the detection information and generating a thickness set; obtaining the maximum thickness value and the minimum thickness value in the thickness set, and calculating the uniformity of the film layer under test using the maximum thickness value and the minimum thickness value; and determining whether the uniformity of the film layer under test meets the standard based on the magnitude of the uniformity. Preferably, if the uniformity is greater than or equal to a preset standard value, the thickness uniformity of the film layer under test meets the standard; if the uniformity is less than the preset standard value, the thickness uniformity of the film layer under test does not meet the standard.

[0010] Furthermore, the step of scanning the thickness of the film layer to be tested and generating detection information includes: the measuring mechanism moving along multiple parallel scanning paths to scan the film layer to be tested.

[0011] Preferably, the scanning path is perpendicular to the spraying path of the film to be tested during preparation. Preferably, the spacing between two adjacent scanning paths is 0.5-1 mm.

[0012] Furthermore, in the step of comparing the position and height of the corresponding peaks in at least two obtained thickness curves and the heights of multiple peaks in the same thickness curve, the peaks correspond to the second detection area of ​​the substrate.

[0013] This invention also provides a film thickness uniformity detection system, comprising a support device, a detection device, and a central control device. The support device has a worktable for supporting a substrate on which a film layer to be detected is disposed. The detection device is disposed on one side of the support device and includes at least one measuring mechanism with a scanning area, at least a portion of the worktable being located within the scanning area. The central control device includes a processing module electrically connected to the detection device, and the processing module is used to generate detection information based on the information measured by the detection device.

[0014] Furthermore, the measuring mechanism includes an optical thickness gauge, which is disposed on one side of the support device and electrically connected to the processing module. Preferably, the optical thickness gauge includes a confocal displacement thickness gauge.

[0015] Furthermore, the processing module includes a memory and a first computing unit. The memory is used to store the detection information. The first computing unit determines whether the thickness uniformity of the film to be detected meets the standard by comparing at least two thickness curves of the film to be detected.

[0016] Preferably, the processing module further includes a second calculation unit, which is used to calculate the difference between the thickness peak value and the thickness trough value of the corresponding thickness curve at the defect location in the film layer to be tested, and to determine whether the thickness uniformity of the film layer to be tested meets the standard based on the magnitude of the difference.

[0017] Preferably, the processing module further includes a third calculation unit, which is used to obtain the maximum thickness value and the minimum thickness value among multiple reference points, calculate the uniformity of the film layer to be tested using the maximum thickness value and the minimum thickness value, and determine whether the uniformity of the film layer to be tested meets the standard based on the calculation result.

[0018] Furthermore, the detection system also includes a transmission device, which is electrically connected to the central control device and transports the substrate under the control of the central control device, and the transmission device is located on one side of the carrier device.

[0019] Preferably, the central control device includes a control module, and the transmission device is electrically connected to the control module.

[0020] Preferably, the detection device further includes a moving mechanism, the measuring mechanism is movably mounted on the moving mechanism, and the moving mechanism is electrically connected to the control module and moves the measuring mechanism under the control of the control module.

[0021] The advantages of this invention are: The film thickness uniformity detection method and system of this invention improves the thickness detection accuracy of thin, transparent films by employing an optical thickness gauge, enabling the detection of even micron-level defects on the surface of the film. Furthermore, this invention utilizes different detection methods to perform multi-directional detection of the film thickness uniformity, which not only improves the accuracy of the detection method but also allows for precise adjustment of subsequent film preparation parameters based on the detection results, thereby enhancing the thickness uniformity of subsequent films. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a film thickness uniformity detection system according to one embodiment of the present invention;

[0024] Figure 2 This is a connection diagram of the central control device in one embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the scanning path of the measuring mechanism in one embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the spraying path of the film layer to be tested in one embodiment of the present invention;

[0027] Figure 5 This is a schematic flowchart of a film thickness uniformity detection method according to one embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the judgment process of the first calculation unit in one embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the first calculation unit acquiring two thickness curves in the film layer to be detected in one embodiment of the present invention;

[0030] Figure 8a This is a schematic diagram showing the comparison of two thickness curves obtained by the first calculation unit in one embodiment of the present invention;

[0031] Figure 8b This is a schematic diagram showing the comparison of two thickness curves obtained by the first calculation unit in one embodiment of the present invention;

[0032] Figure 9 This is a schematic diagram of the judgment process of the second calculation unit in one embodiment of the present invention;

[0033] Figure 10 This is a schematic diagram of the second calculation unit obtaining the corresponding thickness curve through the defect location in one embodiment of the present invention;

[0034] Figure 11 This is a schematic diagram of the thickness curve obtained by the second calculation unit in one embodiment of the present invention;

[0035] Figure 12 This is a schematic diagram of the judgment process of the third calculation unit in one embodiment of the present invention. Detailed Implementation

[0036] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0037] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0038] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0040] In related display technologies, optical adhesives are often used to bond adjacent modules together, or to planarize the surface of the film layer by coating with optical adhesive. Among the optical adhesive coating methods, Inkjet OCR (Optical Clear Resin, or liquid optical adhesive) is commonly used. Liquid optical adhesive has a fast flow rate after spraying, and during the spraying process, the adhesive layer will also produce streaks as the spraying head moves. Therefore, managing the thickness uniformity of the adhesive layer prepared using liquid optical adhesive has become a key focus in panel manufacturing. However, since the liquid optical adhesive used in panels is mostly transparent and only 0.05-0.15 mm thick, the defect sizes that must be avoided in the adhesive layer are all at the micrometer level, making them difficult to detect using conventional measuring instruments.

[0041] To address the technical problems raised in the aforementioned display technologies, one embodiment of the present invention provides a film thickness uniformity detection system. This system can detect micron-level defects in transparent film layers and confirm the coating state of the film layer based on the detected defects. Furthermore, it can adjust the preparation parameters of subsequent film layers based on the determined coating state, thereby improving the uniformity of the film layers prepared in subsequent processes.

[0042] like Figure 1 and Figure 2 As shown, the film thickness uniformity detection system includes a carrier device 11, a detection device 12, a central control device 13, and a transmission device 14.

[0043] The support device 11 has a worktable for supporting a substrate 20 on which a film layer 21 to be tested is disposed. In one embodiment, the film layer 21 to be tested is a cured liquid optical adhesive layer, and the liquid crystal optical adhesive layer can be prepared by an adhesive application process.

[0044] The detection device 12 is disposed on one side of the support device 11. The detection device 12 includes at least one measuring mechanism 121, which is movably mounted above the worktable of the support device 11. The measuring mechanism 121 has a scanning area, and items located within the scanning area can be scanned by the measuring mechanism 121. At least a portion of the worktable is located within the scanning area of ​​the measuring mechanism 121, and when the substrate 20 on which the film layer 21 to be detected is placed on the worktable, it is also located within the scanning area of ​​the measuring mechanism 121, so as to ensure that the film layer 21 to be measured can be scanned by the measuring mechanism 121. Preferably, the measuring mechanism 121 includes an optical thickness gauge, thereby improving the measurement accuracy of the film layer thickness uniformity detection system and preventing micron-level defects on the surface of the film layer 21 to be detected from going undetected; optionally, the optical thickness gauge can be a confocal displacement thickness gauge.

[0045] Furthermore, the detection device 12 also includes a moving mechanism 122, on which the measuring mechanism 121 is movably mounted. The moving mechanism 122 can drive the measuring mechanism 121 to scan and measure the film layer 21 to be detected according to a preset scanning path. Specifically, as shown... Figure 3 As shown, the moving mechanism 122 in the detection device 12 can drive the measuring mechanism 121 to move sequentially along multiple parallel scanning paths to achieve a comprehensive scan and measurement of the film layer 21 to be tested. In the multiple scanning paths of the measuring mechanism 121, the travel directions of adjacent scanning paths are opposite; that is, the measuring mechanism 121 achieves a comprehensive scan of the film layer 21 to be tested by moving back and forth above it. Optionally, the spacing between two adjacent scanning paths is 0.5-1 mm, for example, the spacing between two adjacent scanning paths can be one of 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm.

[0046] In one implementation, such as Figure 4 As shown, when the film layer 21 to be tested is sprayed onto the surface of the substrate 20 through a glue application process, it needs to be moved by multiple glue application heads along a first direction X parallel to the plane of the substrate 20. That is, the spraying path of the film layer 21 to be tested during preparation is parallel to the first direction X. The traveling direction of the measuring mechanism 121 in the detection device 12 is parallel to the second direction Y, which is perpendicular to the first direction X. That is, the scanning path of the measuring mechanism 121 in the detection device 12 is perpendicular to the spraying path of the film layer 21 to be tested during preparation.

[0047] The transfer device 14 is used to transport the substrate 20 on which the film layer 21 to be tested is applied. Before testing, the transfer device 14 can move the substrate 20 from the preparation equipment to the worktable of the carrier device 11, and accurately place the substrate 20 within the scanning range of the testing device 12 by alignment. After testing, the substrate 20 on the worktable can be transferred to the next process via the transfer device 14. Optionally, the transfer device 14 can be at least one of a conveyor belt, conveyor, or robotic arm.

[0048] The central control device 13 includes a control module and a processing module. The moving mechanism 122 and the transmission device 14 in the detection device 12 are both electrically connected to the central control device 13, and both the moving mechanism 122 and the transmission device 14 can move the carried item under the command control of the control module. The processing module is electrically connected to the measuring mechanism 121 in the detection device 12, and the processing module can generate detection information based on the information measured by the measuring mechanism 121. Optionally, the detection information can be a two-dimensional image of the film layer 21 to be detected facing away from the surface of the substrate 20 or a three-dimensional image of the film layer 21 to be detected.

[0049] Furthermore, the processing module includes a memory, a first calculation unit, a second calculation unit, and a third calculation unit. The memory stores various information and preset information, and the first, second, and third calculation units can all retrieve corresponding information from the memory. The first calculation unit can determine whether the thickness uniformity of the film layer 21 under test meets the standard by comparing at least two thickness curves of the film layer 21 under test. The second calculation unit can calculate the difference between the thickness peak value and the thickness trough value of the corresponding thickness curve at the defect location in the film layer 21 under test, and determine whether the thickness uniformity of the film layer 21 under test meets the standard based on the magnitude of the difference. The third calculation unit can obtain the maximum and minimum thickness values ​​among multiple reference points, calculate the uniformity of the film layer 21 under test using the maximum and minimum thickness values, and determine whether the uniformity of the film layer 21 under test meets the standard based on the calculation results.

[0050] Furthermore, in one embodiment of the present invention, the film thickness uniformity detection system can be electrically connected to the film preparation equipment. Specifically, in the film thickness uniformity detection system, the processing module of the control device 13 is electrically connected to the control module. The first calculation unit, second calculation unit, and third calculation unit in the processing module are electrically connected to the control module, and can respectively calculate the deviation value at the defect location of the film 21 to be tested based on their judgment result of the thickness uniformity of the film 21 to be tested, generate a corresponding compensation value based on the deviation value, and feed the compensation value back to the control module. The control module precisely controls the preparation data in the film preparation equipment (the preparation parameters can be various parameters for spraying liquid optical adhesives, such as the temperature, amount of adhesive dispensed, moving speed, and angle of the adhesive applicator in the film preparation equipment) based on the compensation value, thereby preventing the generation of the same defects in subsequent film preparation processes.

[0051] In one embodiment of the present invention, a method for detecting film thickness uniformity is also provided, the flow of which is as follows: Figure 5 As shown, it includes steps S10-S40.

[0052] Step S10) Prepare a substrate:

[0053] A test film 21 is fabricated on the substrate 20. In one embodiment, the test film 21 is a cured liquid optical adhesive layer, and the liquid optical adhesive layer can be prepared by an adhesive application process; specifically, for example... Figure 4As shown, the film layer 21 to be tested can be sprayed with liquid optical adhesive onto the surface of the substrate simultaneously by multiple dispensing heads. After the spraying is completed, the liquid optical adhesive on the substrate 20 is cured by a curing process, thereby obtaining an optical adhesive layer with high light transmittance, high elongation and high adhesion on the surface of the substrate. This is the film layer to be tested that needs to be tested by this film layer thickness uniformity testing method. During the process of spraying liquid adhesive, multiple dispensing heads move along a first direction X parallel to the plane where the substrate 20 is located. That is, the spraying path of the film layer 21 to be tested during preparation is parallel to the first direction X.

[0054] After the film layer 21 to be tested on the substrate 20 is cured, the substrate 20 with the film layer 21 to be tested on its surface is moved to the worktable of the carrier device 11 by the transfer device 14, and the substrate 20 is placed on the worktable located in the scanning area of ​​the measuring mechanism 121 in the detection device 12.

[0055] Step S20) Scan the thickness of the film to be tested and generate detection information:

[0056] The measuring mechanism 121 in the detection device 12 moves along multiple parallel scanning paths to perform a comprehensive scan of the film layer 21 to be detected. Specifically, the measuring mechanism 121 moves to the edge of the film layer 21 to be detected under the action of the moving mechanism 122 in the detection device 12. Then, the moving mechanism 122 moves the measuring mechanism 121 back and forth according to the preset scanning path, so that the measuring mechanism 121 can scan from one edge of the film layer 21 to the other edge of the film layer 21 to achieve a comprehensive scan and measurement of the film layer 21 to be detected. The measured data information is then fed back to the processing module of the central control device 13. The processing module can integrate all the data information measured by the measuring mechanism 121 to form detection information.

[0057] Among them, such as Figure 3 As shown, the moving mechanism 122 can drive the measuring mechanism 121 to move sequentially along multiple parallel scanning paths to achieve a comprehensive scan and measurement of the film layer to be tested. In the multiple scanning paths of the measuring mechanism 121, the travel directions of adjacent scanning paths are opposite; that is, the measuring mechanism 121 achieves a comprehensive scan of the film layer 21 to be tested by moving back and forth above it. Optionally, the spacing between two adjacent scanning paths is 0.5-1 mm, for example, the spacing between two adjacent scanning paths can be one of 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm.

[0058] Step S30) Detect the thickness uniformity of the film layer under test from multiple perspectives based on various data obtained from the detection information:

[0059] The processing module in the central control device obtains the corresponding content in the detection information through different detection methods and makes judgments and comparisons. Specifically, this step includes steps S31-S33.

[0060] Step S31) The thickness uniformity of the film to be tested is determined by comparing at least two thickness curves parallel to the same direction. The determination process is as follows: Figure 6 The specific steps are as follows:

[0061] Based on the detection information, at least two thickness curves of the film layer 21 to be detected are obtained, and the scanning directions (i.e., scanning paths) of the obtained thickness curves are parallel to each other; optionally, as follows... Figure 7 As shown, the first calculation unit in the processing module can obtain two thickness curves of the film layer 21 to be detected parallel to the second direction Y from the detection information, and the two thickness curves are located at different positions in the first direction X.

[0062] The positions and heights of the peaks in the multiple thickness curves obtained are compared with the heights of multiple peaks in the same thickness curve, and the thickness uniformity of the film layer to be tested is judged based on the comparison results. If the positions and heights of the peaks in the multiple thickness curves are the same, and the heights of multiple peaks in the same thickness curve are the same, then the thickness uniformity of the film layer 21 to be tested meets the standard. If the positions and heights of the peaks in the thickness curves or the heights of multiple peaks in the same thickness curve are different, then the thickness uniformity of the film layer to be tested does not meet the standard.

[0063] For example: Figure 8a As shown in the figure, when the edge peaks of the two thickness curves are higher on one side and lower on the other, and the peak heights are not roughly the same, it indicates that the angle of the glue applicator has shifted during glue application; as shown in the figure. Figure 8b As shown, when the edge peaks of the two thickness curves are higher on one side and lower on the other, and the peak heights are roughly the same, it indicates that the adhesive application is offset in the second direction Y. Both of these situations indicate that the thickness uniformity of the film layer to be tested does not meet the standard. However, when the heights of all edge peaks of the two thickness curves are the same and the peak positions are roughly the same, it indicates that the thickness uniformity of the film layer to be tested meets the standard.

[0064] Step S32) Calculate the difference between the peak and trough values ​​of the thickness curve corresponding to the defect location in the film to be tested, and determine whether the thickness uniformity of the film to be tested meets the standard based on the magnitude of the difference. The judgment process is as follows: Figure 9 The specific steps are as follows:

[0065] The defect locations in the film layer 21 to be inspected are identified. Specifically, the second calculation unit in the processing module generates surface image information of the film layer to be inspected based on the detection information, and obtains the defect locations from the surface image information. The substrate 20 includes a first detection area and a second detection area surrounding the first detection area. When the substrate is applied to a display panel, the first detection area corresponds to the display area in the display panel, and the second detection area corresponds to the border area in the display panel. In this step, since the patterns located in the second detection area are covered by light-shielding ink or other films in the display panel during actual application, the patterns located in the second detection area do not affect the actual application of the film layer to be inspected. Therefore, the defect locations obtained from the surface image information in this step are all located in the first detection area.

[0066] Obtain the thickness curve corresponding to the defect location from the detection information; such as Figure 10 As shown, the second calculation unit obtains the thickness curve corresponding to the defect location in the detection information by using the coordinates of the defect location.

[0067] Obtain the peak and trough values ​​of the thickness wave at the defect location from the thickness curve, and calculate the difference between the peak and trough values; for example Figure 11 As shown, the second calculation unit obtains the thickness peak value corresponding to the protrusion and the thickness valley value corresponding to the depression in the thickness curve, and calculates the difference between the thickness peak value and the thickness valley value.

[0068] The thickness uniformity of the film under test is determined based on the magnitude of the difference. For example, if the difference between the peak and trough thickness values ​​is greater than a preset threshold, the thickness uniformity of the film under test is considered substandard; conversely, if the difference is less than or equal to the preset threshold, the thickness uniformity of the film under test is considered satisfactory. Specifically, the preset threshold can be pre-set and stored in memory, and the second calculation unit can retrieve the preset threshold from memory when comparing the differences. Optionally, the preset threshold can be one of 5 micrometers, 10 micrometers, 15 micrometers, or 20 micrometers.

[0069] Step S33) Obtain the maximum and minimum thickness values ​​among multiple reference points, and calculate the uniformity of the film layer to be tested using the maximum and minimum thickness values. Determine whether the uniformity of the film layer to be tested meets the standard based on the calculation results. The determination process is as follows: Figure 12 The specific steps are as follows:

[0070] Multiple reference points are preset; specifically, the coordinates of the multiple reference points can be pre-stored in the memory, and the positions of the multiple reference points do not overlap and are evenly distributed in the film layer to be detected; during detection, the third calculation unit can obtain the coordinates of the multiple reference points from the memory.

[0071] The thickness corresponding to multiple reference points is obtained from the detection information, and a thickness set is generated. For example, taking 9 reference points as an example, the third calculation unit obtains the thickness at these 9 reference points from the detection information based on the coordinates of these 9 reference points, and aggregates these 9 thicknesses to form a thickness set.

[0072] The maximum and minimum thickness values ​​are obtained from the thickness set, and the uniformity of the film layer to be tested is calculated using the maximum and minimum thickness values. For example, the third calculation unit compares the thicknesses of 9 reference points to form a thickness set to find the maximum and minimum thickness values ​​among these 9 thicknesses. The maximum and minimum thickness values ​​are then substituted into the uniformity calculation formula to calculate the thickness uniformity of the film layer to be tested. The calculated actual uniformity value is compared with the preset standard value stored in the memory. If the actual uniformity value is greater than the preset standard value, it means that the thickness uniformity of the film layer to be tested does not meet the standard. If the actual uniformity value is less than or equal to the preset standard value, it means that the thickness uniformity of the film layer to be tested meets the standard.

[0073] The formula for calculating uniformity can be one of the following: the standard deviation formula, the average value formula, or the ratio formula of the maximum thickness value to the minimum thickness value. A preset standard value can also be pre-set and stored in memory, and the third calculation unit can retrieve this preset standard value from memory when performing numerical comparisons.

[0074] The uniformity of the film layer under test is determined by the magnitude of its uniformity.

[0075] Furthermore, in this invention, the implementation order of different detection methods used by the processing modules in the central control device to obtain the corresponding content in the detection information is not limited; that is, the implementation order of steps S31-S33 is not limited. In some embodiments of this invention, steps S31-S33 can be performed simultaneously, that is, the first calculation unit, the second calculation unit, and the third calculation unit in the processing module can perform detection simultaneously. In other embodiments of this invention, steps S31-S33 can be performed sequentially, that is, the first calculation unit, the second calculation unit, and the third calculation unit in the processing module can perform detection sequentially. In other embodiments of this invention, step S33 can be performed first, then step S32, and finally step S31; that is, the third calculation unit performs detection first, the second calculation unit performs detection subsequently, and the first calculation unit performs detection last. It is understood that regardless of the implementation order of steps S31-S33, the judgment results of the first calculation unit, the second calculation unit, and the third calculation unit do not interfere with each other.

[0076] Furthermore, in one embodiment of the present invention, step S40 is also included: adjusting the preparation data of subsequent film layers based on the judgment result.

[0077] Specifically, in step S40, the first calculation unit, the second calculation unit, and the third calculation unit in the processing module are electrically connected to the control module. The first calculation unit, the second calculation unit, and the third calculation unit can further calculate the deviation value at the defect of the film layer 21 to be tested based on their judgment results on the thickness uniformity of the film layer 21 to be tested, generate the corresponding compensation value based on the deviation value, and feed the compensation value back to the control module. The control module adjusts the preparation data in the film preparation equipment based on the compensation value.

[0078] When the first calculation unit finds that the edge peaks of the two thickness curves are higher on one side and lower on the other, and the peak heights are not roughly the same, it indicates that the angle of the glue applicator has shifted during glue application. The first calculation unit can then adjust the rotation axis of the bearing device based on the comparison results of the two thickness curves. When the first calculation unit finds that the edge peaks of the two thickness curves are higher on one side and lower on the other, and the peak heights are also roughly the same, it indicates that the glue application path has shifted in the second direction Y. The first calculation unit can then adjust the compensation value of the glue applicator in the second direction Y.

[0079] In step S31, the peaks compared by the first calculation unit in the thickness curve correspond to the second detection area of ​​the substrate. That is, the peak positions obtained in step S31 are located in the edge area of ​​the substrate and are located at both ends of the substrate. In the adhesive application process, in order to speed up the adhesive spraying efficiency, multiple adhesive application heads are usually installed and arranged sequentially along a direction perpendicular to the adhesive spraying path (i.e., the second direction Y), so that the entire panel can be sprayed at once when applying adhesive. In step S31, if the angle or the spacing between the adhesive application heads changes during spraying, the thickness peaks of the film layer to be tested located at both ends of the substrate have the most obvious abnormal contrast due to the long spacing between them, which can more quickly identify and compare abnormal parameters during spraying.

[0080] It is understood that, in one embodiment of the present invention, after the first calculation unit determines whether the thickness uniformity of the film to be tested meets the standard by comparing at least two thickness curves of the film to be tested, it can also adjust the preparation parameters of the whole row of glue applicators when preparing the film to be tested (such as adjusting the angle between the whole row of glue applicators and the substrate, adjusting the spacing between two adjacent glue applicators in the whole row of glue applicators, etc.) based on the position difference and height difference of the corresponding peaks in multiple thickness curves and the height difference between multiple peaks in the same thickness curve, so as to improve the uniformity of the entire film to be tested.

[0081] When the second calculation unit determines that the difference between the maximum and minimum peak values ​​at the defect location exceeds a preset threshold, it can adjust the preparation parameters (such as temperature, glue output, and spraying speed) of the corresponding glue applicator at the defect location during spraying. It is understood that, in one embodiment of the present invention, after determining whether the thickness uniformity of the film layer under test meets the standard based on the difference between the thickness peak and thickness trough values ​​at the defect location, the second calculation unit can also precisely adjust the preparation parameters of the corresponding individual glue applicator during spraying based on the magnitude of this difference. When the third calculation unit determines that the calculated uniformity of the film layer under test exceeds a preset standard value, it can determine the distribution of the glue based on the coordinates of multiple reference points and their corresponding thicknesses.

[0082] As described above, the first, second, and third calculation units employ different detection methods and have different detection directions. The first calculation unit primarily detects the spraying condition of the entire row of adhesive applicators, the second unit primarily detects the spraying condition of a single adhesive applicator, and the third unit primarily detects the leveling and distribution of the adhesive material in the film layer before curing. Each calculation unit can adjust the preparation data for subsequent film layers based on its detected results. When all three calculation units determine that the uniformity of the film layer meets the standard, the film layer can be directly released without adjusting the preparation parameters for subsequent film layers.

[0083] In this embodiment of the invention, the use of an optical thickness gauge improves the accuracy of thickness detection for thin, transparent films, enabling the detection of even micron-level defects on the film surface. Furthermore, this embodiment employs different detection methods to assess the thickness uniformity of the film. These multi-faceted methods not only enhance the accuracy of the detection methods but also allow for the determination of the adhesive application status during the coating process. Based on the detection results, subsequent film preparation parameters can be adjusted to improve the thickness uniformity of the final film.

[0084] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A method for detecting the uniformity of film thickness, characterized in that, include: A substrate is provided, on which a film layer to be tested is disposed; The thickness of the film to be tested is scanned and detection information is generated; The thickness uniformity of the film layer under test is detected from multiple perspectives based on various data obtained from the detection information, including: At least two thickness curves of the film to be tested are obtained based on the detection information, and the scanning directions of the thickness curves are parallel to each other; The positions and heights of the peaks in at least two of the obtained thickness curves, as well as the heights of multiple peaks in the same thickness curve, are compared. If the position and height of the peaks in the thickness curve are the same, and the height of multiple peaks in the same thickness curve is the same, then the thickness uniformity of the film layer to be tested meets the standard. If the position or height of the peak in the thickness curve, or the height of multiple peaks in the same thickness curve, is different at least once, then the thickness uniformity of the film layer to be tested does not meet the standard.

2. The method for detecting film thickness uniformity as described in claim 1, characterized in that, The step of detecting the thickness uniformity of the film layer under test from multiple perspectives based on various data obtained from the detection information further includes: Identify the location of defects in the film layer to be tested; Obtain the thickness curve corresponding to the defect location from the detection information; Obtain the peak and trough values ​​of the thickness wave at the defect location in the thickness curve, and calculate the difference between the peak and trough values ​​of the thickness wave. The thickness uniformity of the film layer to be tested is determined based on the magnitude of the difference. Preferably, if the difference is less than or equal to a preset threshold, the thickness uniformity of the film layer to be tested meets the standard; if the difference is greater than the preset threshold, the thickness uniformity of the film layer to be tested does not meet the standard.

3. The method for detecting film thickness uniformity as described in claim 2, characterized in that, The identification of the defect location in the film layer to be detected includes: Obtain surface image information of the film layer to be inspected, and obtain the location of the defect from the surface image information; Preferably, the substrate includes a first detection area and a second detection area disposed around the first detection area, and the step of identifying the defect location in the film layer to be detected includes: obtaining the defect location located in the first detection area from the surface image information.

4. The method for detecting film thickness uniformity as described in claim 1, characterized in that, The step of detecting the thickness uniformity of the film layer under test from multiple perspectives based on various data obtained from the detection information further includes: Multiple reference points are preset; The thicknesses corresponding to multiple reference points are obtained from the detection information, and a thickness set is generated; The maximum and minimum thickness values ​​are obtained from the thickness set, and the uniformity of the film layer to be tested is calculated using the maximum and minimum thickness values. The uniformity of the film layer to be tested is determined based on the magnitude of the uniformity. Preferably, if the uniformity is greater than or equal to a preset standard value, the thickness uniformity of the film layer to be tested meets the standard; if the uniformity is less than the preset standard value, the thickness uniformity of the film layer to be tested does not meet the standard.

5. The method for detecting film thickness uniformity as described in claim 1, characterized in that, The step of scanning the thickness of the film layer to be tested and generating detection information includes: The measuring mechanism moves along multiple parallel scanning paths to scan the film layer to be tested; Preferably, the scanning path is perpendicular to the spraying path of the film to be tested during preparation; Preferably, the spacing between two adjacent scanning paths is 0.5-1 mm.

6. The method for detecting film thickness uniformity as described in claim 3, characterized in that, In the step of comparing the position and height of the corresponding peaks in at least two obtained thickness curves and the heights of multiple peaks in the same thickness curve, the peaks correspond to the second detection area of ​​the substrate.

7. A film thickness uniformity detection system, characterized in that, include: A carrier device having a worktable for supporting a substrate on which a film layer to be tested is disposed; A detection device is disposed on one side of the support device, the detection device including at least one measuring mechanism having a scanning area, and at least a portion of the worktable surface being located within the scanning area; A central control device includes a processing module, which is electrically connected to the detection device and is used to generate detection information based on the information measured by the detection device.

8. The film thickness uniformity detection system as described in claim 7, characterized in that, The measuring mechanism includes an optical thickness gauge, which is disposed on one side of the bearing device and electrically connected to the processing module. Preferably, the optical thickness gauge includes a confocal displacement thickness gauge.

9. The film thickness uniformity detection system as described in claim 7, characterized in that, The processing module includes: The memory is used to store the detection information; The first calculation unit determines whether the thickness uniformity of the film layer to be tested meets the standard by comparing at least two thickness curves of the film layer to be tested. Preferably, the processing module further includes a second calculation unit, which is used to calculate the difference between the thickness peak value and the thickness trough value of the corresponding thickness curve at the defect location in the film layer to be tested, and to determine whether the thickness uniformity of the film layer to be tested meets the standard based on the magnitude of the difference. Preferably, the processing module further includes a third calculation unit, which is used to obtain the maximum thickness value and the minimum thickness value among multiple reference points, calculate the uniformity of the film layer to be tested using the maximum thickness value and the minimum thickness value, and determine whether the uniformity of the film layer to be tested meets the standard based on the calculation result.

10. The film thickness uniformity detection system as described in claim 7, characterized in that, Also includes: A transmission device is electrically connected to the central control device and transports the substrate under the control of the central control device, and the transmission device is located on one side of the carrier device; Preferably, the central control device includes a control module, and the transmission device is electrically connected to the control module; Preferably, the detection device further includes a moving mechanism, the measuring mechanism is movably mounted on the moving mechanism, and the moving mechanism is electrically connected to the control module and moves the measuring mechanism under the control of the control module.

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