Preparation method of special light-weight TPcon solder strip alloy base material

By using a copper-clad aluminum composite structure and refined processing, a special solder ribbon alloy substrate for TPcon was prepared, which solved the problems of high cost, heavy weight and unstable performance of TPcon solder ribbon substrate. It achieved a solder ribbon substrate with reduced cost, lighter weight and excellent performance, which can meet the high requirements of TPcon modules.

CN121715740APending Publication Date: 2026-03-24TAICANG JUREN PV MATERIAL
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Patent Information

Application Number
CN202511982255.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-25
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing TPcon-specific solder ribbon substrates suffer from high cost, heavy weight, weak interface bonding, unstable conductivity, poor solderability, and insufficient aging resistance, failing to meet the high requirements of photovoltaic and display modules.

Method used

By employing a copper-clad aluminum composite structure and through processes such as precise proportioning, micro-roughening treatment, interface diffusion, gradient annealing, surface passivation, and laser micro-engraving, a solder strip alloy substrate with a strong copper-aluminum interface and uniform performance is prepared to meet the application requirements of TPcon modules.

Benefits of technology

Significantly reduces cost and weight, improves interface stability and conductivity, ensures welding reliability and aging resistance, adapts to the long-term use requirements of TPcon modules, reduces transportation and assembly costs, and extends module life.

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Abstract

The invention discloses a preparation method of a light-weight TPcon special solder strip alloy base material, and particularly relates to the technical field of photovoltaic new energy, and the method comprises the steps of base material type selection and proportion design, copper-clad aluminum composite molding and interface diffusion treatment, gradient annealing treatment, surface adaptability treatment, comprehensive performance detection and the like. The core is that a copper-clad aluminum composite structure with the mass ratio of 60: 40 is selected, the copper-aluminum bonding force is improved through aluminum core micro-roughening and interface diffusion treatment, the performance uniformity is guaranteed through a gradient annealing process, and the welding adaptability is optimized through surface passivation and laser micro-etching. The technical problems that an existing pure copper welding strip base material is high in cost and large in weight, and a traditional copper-clad aluminum base material is poor in interface bonding, unstable in performance and poor in welding adaptability are solved, the prepared base material is low in cost and light in weight, has excellent aging resistance and welding reliability, can accurately meet the use requirement of a TPcon assembly, and has the good application prospect. The method has obvious economic value and application prospect.
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