Bioimplantable device and method of manufacturing the same

Abstract

The invention provides a bioimplantable device and a manufacturing method thereof. The bioimplantable device includes a flexible circuit board, a sensor, an elastic conductive layer, an electrode structure, and an elastic insulating layer. The flexible circuit board comprises a circuit layer. The sensor is arranged on the circuit layer. The elastic conductive layer covers the sensor. The electrode structure is disposed on the resilient conductive layer and is configured to collect electrical signals from a living being. The electrode structure is electrically connected with the sensor through the elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the elastic conductive layer. The bioimplantable device improves the integrity of the signal by reducing the distance between the electrode and the sensor to shorten the signal transmission path.

Description

TECHNICAL FIELD

[0001] The present application relates to a bio-implantable device and a manufacturing method thereof. BACKGROUND

[0002] A brain computer interface (BCI) is used to establish a link between a brain of a living being (e.g. a human or an animal) and an external device (e.g. a computer) to allow information exchange between the brain and the external device. The brain computer interface can be classified into an invasive brain computer interface, a semi-invasive brain computer interface and a non-invasive brain computer interface. For example, the invasive brain computer interface is implanted into the cerebral cortex in the cranial cavity by penetrating the skull, and an electrode directly contacts the cerebral cortex to obtain brain neural signals and transmits the brain neural signals to the external device. The semi-invasive brain computer interface is implanted into the cranial cavity but does not reach the cerebral cortex. The non-invasive brain computer interface does not need to be implanted into the living being and contacts the brain by an electrode to obtain brain neural signals.

[0003] Generally, the invasive brain computer interface can obtain higher quality brain neural signals. However, the elements of the current invasive brain computer interface increase with the diversification of functions, so that the size of the invasive brain computer interface becomes larger, which not only affects the signal integrity by increasing the signal transmission path, but also easily causes discomfort to the implanted person. SUMMARY

[0004] At least one embodiment of the present application provides a bio-implantable device and a manufacturing method thereof, wherein the bio-implantable device improves the integrity of the signal by shortening the signal transmission path by reducing the distance between the electrode and the sensor.

[0005] The bio-implantable device provided by at least one embodiment of the present application comprises a flexible circuit board, a sensor, a first elastic conductive layer, an electrode structure and an elastic insulating layer. The flexible circuit board comprises a circuit layer. The sensor is disposed on the circuit layer. The first elastic conductive layer covers the sensor. The electrode structure is disposed on the first elastic conductive layer and is used to collect electrical signals from the living being. The electrode structure is electrically connected to the sensor through the first elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the first elastic conductive layer.

[0006] In at least one embodiment of the present application, the bio-implantable device further comprises a processor. The processor is disposed in the flexible circuit board and is electrically connected to the sensor.

[0007] In at least one embodiment of the present application, the bio-implantable device further comprises a transceiver. The transceiver is disposed on the flexible circuit board and is electrically connected to the processor.

[0008] In at least one embodiment of the present application, the bio-implantable device further comprises a second elastic conductive layer. The transceiver comprises a radio frequency element and an antenna. The radio frequency element is disposed on the circuit layer. The second elastic conductive layer covers the radio frequency element. The antenna is disposed on the second elastic conductive layer. The antenna is electrically connected to the radio frequency element via the second elastic conductive layer.

[0009] In at least one embodiment of the present application, the material of the first elastic conductive layer comprises an electroactive polymer. The material of the elastic insulating layer comprises a polymer.

[0010] In at least one embodiment of the present application, the bio-implantable device further comprises a conductive adhesive layer. The conductive adhesive layer is disposed between the electrode structure and the first elastic conductive layer, so that the electrode structure and the first elastic conductive layer are connected and electrically conductive.

[0011] In at least one embodiment of the present application, the method for manufacturing the bio-implantable device comprises: providing a flexible circuit board, wherein the flexible circuit board comprises a circuit layer; disposing a sensor on the circuit layer; after disposing the sensor, forming a first elastic conductive layer to cover the sensor; after forming the first elastic conductive layer, forming an elastic insulating layer to cover the flexible circuit board and expose the first elastic conductive layer; and after forming the first elastic conductive layer, disposing an electrode structure on the first elastic conductive layer, wherein the electrode structure is electrically connected to the sensor via the first elastic conductive layer.

[0012] In at least one embodiment of the present application, providing the flexible circuit board comprises: providing a first flexible substrate, wherein the first flexible substrate comprises a metal layer; patterning the metal layer to form the circuit layer; providing a second flexible substrate; forming a recess in the second flexible substrate; disposing a processor in the recess; and after disposing the processor and forming the circuit layer, combining the first flexible substrate and the second flexible substrate to form the flexible circuit board, wherein the first flexible substrate covers the processor so that the processor is located in the flexible circuit board.

[0013] In at least one embodiment of the present application, the method for manufacturing the bio-implantable device further comprises: before forming the elastic insulating layer, disposing a radio frequency element on the circuit layer; after disposing the radio frequency element and before forming the elastic insulating layer, forming a second elastic conductive layer on the radio frequency element, wherein the second elastic conductive layer covers the radio frequency element; and disposing an antenna on the second elastic conductive layer, wherein the antenna is electrically connected to the radio frequency element via the second elastic conductive layer, and the elastic insulating layer is exposed to the second elastic conductive layer and the antenna.

[0014] In at least one embodiment of the present application, the method for manufacturing the bio-implantable device further comprises: before disposing the electrode structure on the first elastic conductive layer, forming a conductive adhesive layer on the first elastic conductive layer. The conductive adhesive layer connects the first elastic conductive layer and the electrode structure, and electrically conducts the first elastic conductive layer and the electrode structure.

[0015] Based on the above, in the bio-implantable device disclosed in the above embodiments, the electrode structure is directly electrically connected to the sensor via the first elastic conductive layer, thereby shortening the signal transmission path and improving signal integrity. BRIEF DESCRIPTION OF DRAWINGS

[0016] For a more complete understanding of the embodiments and their advantages, reference is now made to the following description taken in conjunction with the accompanying drawings in which:

[0017] Figure 1 is a partial cross-sectional schematic view of a bio-implantable device according to at least one embodiment of the present disclosure;

[0018] Figure 2 is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure;

[0019] Figure 3A is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0020] Figure 3B is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0021] Figure 4A is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0022] Figure 4B is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0023] Figure 5 is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0024] Figure 6 is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0025] Figure 7 is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0026] Figure 8 is a partial cross-sectional schematic view of a bio-implantable device according to another embodiment of the present disclosure; Figure 1

[0027] Figure 9 ​​​​​​​​yes Figure 1 A cross-sectional schematic diagram of the step of forming an elastic insulating layer in the manufacturing method of a bio-implantable device; and

[0028] Figure 10 yes Figure 1 A cross-sectional schematic diagram of the step of forming a conductive adhesive layer in the manufacturing method of a bio-implantable device. Detailed Implementation

[0029] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the dimensions and shapes presented by the elements, but should cover dimensions, shapes, and deviations from both due to actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the accompanying drawings are primarily for illustrative purposes and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of this application.

[0030] Secondly, the terms "approximately," "approximately," or "substantially" used in this document not only cover explicitly stated numerical values ​​and ranges, but also the permissible deviation range understood by those skilled in the art, whereby such deviation range can be determined by errors generated during measurement, which may arise from limitations of the measurement system or process conditions, for example. Furthermore, "approximately" can indicate a deviation within one or more standard deviations of the aforementioned numerical values, such as ±30%, ±20%, ±10%, or ±5%. The terms "approximately," "approximately," or "substantially" used in this document can be chosen based on optical, etching, mechanical, or other properties to select an acceptable deviation range or standard deviation, and are not applied to all optical, etching, mechanical, and other properties using a single standard deviation. Additionally, for clarity in the following embodiments, components with the same or similar functions are indicated by the same designation.

[0031] Figure 1 This is a partial cross-sectional schematic diagram of a bio-implantable device 100A according to at least one embodiment of this application. (See also...) Figure 1The bio-implantable device 100A can be used to capture neural signals from the brain of an organism, such as those from the human brain. The bio-implantable device 100A is, for example, an invasive brain-computer interface, but is not limited to this. The bio-implantable device 100A can also be used to capture other biologically associated electrical signals, such as visual prostheses or cochlear implants. The bio-implantable device 100A includes a flexible circuit board 200, a sensor 310, an electrode structure 320, a transceiver 330, a processor 340, elastic conductive layers 410 and 420, multiple conductive adhesive layers 500, and an elastic insulating layer 600.

[0032] The flexible circuit board 200 includes at least two circuit layers (e.g., circuit layers 211-213), multiple dielectric layers 221 and 222, multiple conductive structures 230, and multiple cover layers 241 and 242. In this example, the flexible circuit board 200 includes three circuit layers 211-213, two dielectric layers 221 and 222, and two cover layers 241 and 242, but is not limited thereto. The circuit layers 211-213 are stacked with the dielectric layers 221 and 222. The dielectric layer 221 is sandwiched between adjacent circuit layers 211 and 212. The dielectric layer 222 is sandwiched between adjacent circuit layers 212 and 213.

[0033] These conductive structures 230 contact the circuit layer 211 and extend through the dielectric layer 221 to contact the circuit layer 212. These conductive structures 230 electrically connect the circuit layers 211 and 212. These conductive structures 230 can be conductive blind vias. Cover layers 241 and 242 are located on the upper and lower sides of the flexible circuit board 200, respectively, wherein cover layers 241 and 242 cover circuit layers 211 and 213, respectively, and the circuit layers 211 and 213 are located between cover layers 241 and 242. Figure 1 In the example, cover layer 241 exposes the component pads (not shown) of circuit layer 211.

[0034] The material of circuit layers 211-213 can be copper. The material of dielectric layers 221 and 222 can be polyimide (PI), modified polyimide (MPI), liquid crystal polymer (LCP), or polytetrafluoroethylene (PTFE). The material of capping layers 241 and 242 can be polyimide.

[0035] Sensor 310 may be disposed on the circuit layer 211 exposed from cover layer 241. Electrode structure 320 is disposed on flexible circuit board 200 and located on sensor 310. Transceiver 330 is disposed on flexible circuit board 200 and includes radio frequency element 331 and antenna 332. Radio frequency element 331 may be disposed on the circuit layer 211 exposed from cover layer 241. Antenna 332 is disposed on flexible circuit board 200 and located on radio frequency element 331.

[0036] The processor 340 can be housed within the flexible circuit board 200. Figure 1 In the example, processor 340 is disposed between line layers 212 and 213 and is electrically connected to the radio frequency components 331 of sensor 310 and transceiver 330 via multiple conductive structures 230. The electrode structure 320 may be made of a conductive material and be biocompatible, such as gold, platinum, or titanium.

[0037] An elastic conductive layer 410 covers the sensor 310 and is disposed between the electrode structure 320 and the sensor 310. The electrode structure 320 is electrically connected to the sensor 310 via the elastic conductive layer 410. The elastic conductive layer 420 covers the radio frequency element 331 and is disposed between the antenna 332 and the radio frequency element 331. The antenna 332 is electrically connected to the radio frequency element 331 via the elastic conductive layer 420.

[0038] Furthermore, the materials of the elastic conductive layers 410 and 420 include electroactive polymers or conductive polymers. The electroactive polymer is a composite material comprising a polymer with a conjugated structure and conductive particles. The polymer can be polyimide, epoxy resin, polyurethane (PU), poly(methyl methacrylate) (PMMA), polyvinyl chloride (PVC), or polyethylene terephthalate. In particular, the elastic conductive layers 410 and 420 simultaneously possess conductivity and elasticity.

[0039] For example, the polymer of the elastic conductive layers 410 and 420 can be polyurethane with a conjugated structure of siloxane. That is, the polyurethane can be modified with siloxane. The conductive particles can be graphene. Conductivity tests show that the conductivity of the elastic conductive layers 410 and 420 increases with increasing weight percentage concentration of the conductive particles. Mechanical property tests show that the elastic conductive layers 410 and 420 possess a certain tensile strength. Furthermore, in vitro cell viability assays demonstrate that the elastic conductive layers 410 and 420 do not exhibit toxicity to living cells and thus possess good biocompatibility.

[0040] It is worth mentioning that the elastic conductive layer 410 covers the upper surface and sides of the sensor 310 to enclose the sensor 310, and the elastic conductive layer 420 covers the upper surface and sides of the radio frequency element 331 to enclose the radio frequency element 331. In this way, the sensor 310 and the radio frequency element 331 will not come into direct contact with the living organism. When the elastic conductive layers 410 and 420 come into contact with the living organism, biocompatibility can prevent any adverse effects on the organism. The elastic conductive layer 410 also increases the contact area between the electrode structure 320 and the living organism, and the elastic conductive layer 410 can help collect electrical signals.

[0041] Multiple conductive adhesive layers 500 are respectively disposed between the electrode structure 320 and the elastic conductive layer 410, and between the antenna 332 and the elastic conductive layer 420, such that the electrode structure 320 is connected to and electrically connected to the elastic conductive layer 410, and the antenna 332 is connected to and electrically connected to the elastic conductive layer 420. For example, the conductive adhesive layer 500 may be disposed between the contacts of the electrode structure 320 and the elastic conductive layer 410, or between the input / output portion of the antenna 332 and the elastic conductive layer 420. The conductive adhesive layer 500 may be a conductive adhesive.

[0042] A flexible insulating layer 600 covers the flexible circuit board 200, exposing the electrode structure 320 and the flexible conductive layer 410. Furthermore, the flexible insulating layer 600 also exposes the antenna 332 and the flexible conductive layer 420. The flexible insulating layer 600 can cover both the surface and sides of the flexible circuit board 200. Specifically, the flexible insulating layer 600 completely covers the flexible circuit board 200, but only exposes the electrode structure 320, the antenna 332, and the flexible conductive layers 410 and 420. The thickness of the flexible insulating layer 600 and the flexible conductive layers 410 and 420 can be the same. That is, the surface of the flexible insulating layer 600 is flush with the surfaces of the flexible conductive layers 410 and 420.

[0043] The elastic insulating layer 600 is made of a polymer. The material of the elastic insulating layer 600 can be a non-conductive polymer, such as polyurethane, polyimide, epoxy resin, polyethylene (PE), or polypropylene (PP). The elastic insulating layer 600 prevents short circuits between components of the bio-implantable device 100A. Furthermore, the elastic insulating layer 600 is biocompatible and can directly contact living organisms.

[0044] The bio-implantable device 100A can establish a link with an external device via a sensor 310, an electrode structure 320, a transceiver 330, and a processor 340. For example, the electrode structure 320 is used to collect electrical signals from a living organism. The sensor 310 receives the electrical signals from the electrode structure 320 and converts them into digital signals. The processor 340 receives the digital signals from the sensor 310, analyzes the digital signals, and transmits the analysis results to a radio frequency (RF) element 331. The RF element 331 converts the analysis results into high-frequency electrical signals and transmits them to an antenna 332. The antenna 332 converts the high-frequency electrical signals into electromagnetic waves to transmit the electromagnetic waves to the external device. The external device can be an electronic device with an antenna to receive or transmit electromagnetic waves, such as a computer. Thus, the external device can exchange signals with the bio-implantable device 100A, thereby establishing a link with the living organism.

[0045] Furthermore, the bio-implantable device 100A, due to its expanded functionality, can also include multiple electronic components 350. These electronic components 350 can be logic chips. Figure 1 In one example, the electronic components 350 are disposed on the circuit layer 211 exposed from the cover layer 241 and covered by the resilient insulating layer 600. In other embodiments, the electronic components 350 may be disposed within the flexible circuit board 200 and not exposed by the cover layers 241, 242.

[0046] As described above, in the bio-implantable device 100A, the electrode structure 320 is directly electrically connected to the sensor 310 via the elastic conductive layer 410, thereby shortening the signal transmission path and improving signal integrity, reducing the thickness and volume of the bio-implantable device 100A, and reducing discomfort for the implantee. Furthermore, since the elastic conductive layers 410 and 420 or the elastic insulating layer 600 covering the flexible circuit board 200, sensor 310, radio frequency component 331, and electronic component 350 are elastic and have good biocompatibility, the safety and comfort of bio-use are improved, and external interference is also avoided for the covered flexible circuit board 200, sensor 310, radio frequency component 331, and electronic component 350.

[0047] It should be noted that, in Figure 1In the example, antenna 332 is exposed within the elastic insulating layer 600 and flexible circuit board 200 to achieve good signal transmission and reception, but is not limited thereto. In other embodiments, antenna 332 and / or radio frequency component 331 may be disposed within flexible circuit board 200 and not exposed by elastic insulating layer 600 or covering layers 241, 242. Furthermore, flexible circuit board 200 may also contain only two circuit layers, such as circuit layers 211 and 212, with processor 340 disposed between circuit layers 211 and 212, which can also reduce the thickness and volume of bio-implantable device 100A.

[0048] Figure 2 This is a partial cross-sectional schematic diagram of a bio-implantable device 100B according to another embodiment of this application. (See also...) Figure 2 The bio-implantable device 100B is similar to Figure 1 The bio-implantable device 100A differs from the bio-implantable device 100B in that the thickness of the elastic insulating layer 600 can be greater than the thickness of the elastic conductive layers 410 and 420, and the elastic insulating layer 600 covers the boundaries of the elastic conductive layers 410 and 420. The bio-implantable device 100B avoids gaps at the junction between the elastic insulating layer 600 and the elastic conductive layers 410 and 420; that is, the elastic insulating layer 600 more completely covers the flexible circuit board 200.

[0049] then, Figure 1 The manufacturing method of the bio-implantable device 100A is as follows. Figure 3A yes Figure 1 A cross-sectional schematic diagram of the step of providing a flexible substrate 700A in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 3A A flexible substrate 700A is provided, wherein the flexible substrate 700A includes a metal layer 710 and a dielectric layer 221. The metal layer 710 is disposed on the dielectric layer 221. The flexible substrate 700A can be a single-layer board. The metal layer 710 can be a copper layer.

[0050] Figure 3B yes Figure 1 A cross-sectional schematic diagram of the steps for forming the circuit layer 211 and the conductive structure 230 in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 3BA patterned metal layer 710 is formed to create a circuit layer 211, for example, by etching. Furthermore, a plurality of vias 720 are formed in the dielectric layer 221, and these vias 720 expose the circuit layer 211. In other words, these vias 720 do not penetrate the circuit layer 211. The vias 720 can be formed using laser drilling or mechanical drilling. Next, a plurality of conductive structures 230 are formed in the vias 720 to form a flexible substrate 700B, wherein the conductive structures 230 are electrically connected to the circuit layer 211. These conductive structures 230 can be formed using electroplating.

[0051] Figure 4A yes Figure 1 A cross-sectional schematic diagram of the step of providing a flexible substrate 800A in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 4A A flexible substrate 800A is provided, wherein the flexible substrate 800A includes metal layers 810 and 820 and a dielectric layer 222. The dielectric layer 222 is sandwiched between the metal layers 810 and 820. The flexible substrate 800A can be a double-layer board. The metal layers 810 and 820 can be copper layers.

[0052] Figure 4B yes Figure 1 A cross-sectional schematic diagram of the steps in the manufacturing method of the bio-implantable device 100A, including forming circuit layers 212 and 213, a cover layer 242, and setting a processor 340. (See also...) Figure 4A and Figure 4B First, the cover layer 242 is bonded to the metal layer 820. The cover layer 242 can be bonded to the metal layer 820 using thermal bonding. Next, a groove 830 is formed in the metal layers 810, 820 and the dielectric layer 222, and the metal layer 810 is patterned to form the flexible substrate 800B. It should be noted that if the metal layer 820 needs to be patterned, it should be patterned before the cover layer 242 is bonded.

[0053] In the flexible substrate 800B, the dielectric layer 222 is sandwiched between the circuit layers 212 and 213. A recess 830 extends from the circuit layer 212 to the dielectric layer 222 and then to the circuit layer 213 to expose the capping layer 242. In other words, the recess 830 does not penetrate the capping layer 242. The patterned metal layer 810 can be formed using etching. The recess 830 can be formed using laser cutting. Next, a processor 340 is disposed in the recess 830.

[0054] Figure 5 yes Figure 1 A cross-sectional schematic diagram of the step of combining flexible substrates 700B and 800B in the manufacturing method of the bio-implantable device 100A. (See attached diagram.) Figure 5Flexible substrates 700B and 800B are bonded together to form a flexible circuit board 200. Flexible substrate 700B covers processor 340, so that processor 340 is located within the flexible circuit board 200 and is not exposed. Flexible substrates 700B and 800B can be bonded by thermoforming. Processor 340 is aligned with the position of the electrically connected conductive structure 230, so that processor 340 can be electrically connected to the sensor pad 211a and the radio frequency component pad 211b of the circuit layer 211 via the conductive structure 230.

[0055] Figure 6 yes Figure 1 A cross-sectional schematic diagram of the step of forming the capping layer 241 in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 6 The cover layer 241 is then bonded to the circuit layer 211. The cover layer 241 can also be bonded to the circuit layer 211 using a thermoforming method. Solder is then applied to the circuit layer 211 exposed from the cover layer 241. For example, solder paste can be applied to the circuit layer 211 using a printing method.

[0056] Figure 7 yes Figure 1 A cross-sectional schematic diagram of the step of setting elements in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 7 A sensor 310, an RF component 331, and an electronic component 350 are disposed on a circuit layer 211 exposed from the cover layer 241. The sensor 310, the RF component 331, and the electronic component 350 can be electrically connected to the circuit layer 211 by soldering.

[0057] Figure 8 yes Figure 1 A cross-sectional schematic diagram of the steps for forming the elastic conductive layers 410 and 420 in the manufacturing method of the bio-implantable device 100A. (See attached diagram.) Figure 8 Elastic conductive layers 410 and 420 are formed on the sensor 310 and the radio frequency element 331, respectively. The elastic conductive layers 410 and 420 can cover the sensor 310 and the radio frequency element 331 by coating or thermo-pressing, such that the elastic conductive layers 410 and 420 cover the sensor 310 and the radio frequency element 331 exposed from the cover layer 241.

[0058] Figure 9 yes Figure 1 A cross-sectional schematic diagram of the step of forming the elastic insulating layer 600 in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 9 An elastic insulating layer 600 is formed on the flexible circuit board 200. Similar to the formation of elastic conductive layers 410 and 420, the elastic insulating layer 600 can also cover the flexible circuit board 200 by coating or thermo-pressing, exposing the elastic conductive layers 410 and 420. It should be noted that during the formation...Figure 1 When the elastic insulating layer 600 is used, the thickness of the elastic insulating layer 600 on the cover layer 241 is the same as the thickness of the elastic conductive layers 410 and 420, and the surface of the elastic insulating layer 600 is flush with the surface of the elastic conductive layers 410 and 420. At the junction of the elastic insulating layer 600 and the elastic conductive layers 410 and 420, their boundaries can be close to each other.

[0059] Figure 10 yes Figure 1 A cross-sectional schematic diagram of the step of forming the conductive adhesive layer 500 in the manufacturing method of the bio-implantable device 100A. (See also...) Figure 10 A conductive adhesive layer 500 is formed on the elastic conductive layers 410 and 420. The conductive adhesive layer 500 can be formed by coating. Then, an electrode structure 320 is disposed on the elastic conductive layer 410, and the electrode structure 320 is connected to and electrically connected to the elastic conductive layer 410 via the conductive adhesive layer 500. An antenna 332 is disposed on the elastic conductive layer 420, and the antenna 332 is connected to and electrically connected to the elastic conductive layer 420 via the conductive adhesive layer 500. Thus, the manufacturing of the bio-implantable device 100A is essentially completed.

[0060] It should be noted that, Figure 2 The manufacturing method of the bio-implantable device 100B is similar to Figure 1 The manufacturing method of the bio-implantable device 100A, the difference between the two manufacturing methods lies in the formation Figure 2 600 elastic insulating layer Figure 9 When the elastic insulating layer 600 is on the cover layer 241, its thickness is greater than that of the elastic conductive layers 410 and 420, and the elastic insulating layer 600 covers the boundaries of the elastic conductive layers 410 and 420. It is worth noting that in the manufacturing methods of the bio-implantable devices 100A and 100B, the step of forming the elastic insulating layer 600 must be after the step of forming the elastic conductive layers 410 and 420 to avoid short circuits caused by forming the elastic conductive layers 410 and 420 on the elastic insulating layer 600.

[0061] In summary, in the bio-implantable devices 100A and 100B disclosed in the above embodiments, the electrode structure 320 is directly electrically connected to the sensor 310 via the elastic conductive layer 410, thereby shortening the signal transmission path and improving signal integrity. It also reduces the thickness and volume of the bio-implantable devices 100A and 100B, and reduces discomfort for the implantee. Furthermore, since the elastic conductive layers 410 and 420 or the elastic insulating layer 600 covering the flexible circuit board 200, sensor 310, radio frequency component 331, and electronic component 350 are elastic and have good biocompatibility, the safety and comfort of bio-use are improved, and the covered flexible circuit board 200, sensor 310, radio frequency component 331, and electronic component 350 are protected from external interference.

[0062] Furthermore, in the bio-implantable device 100B, the elastic insulating layer 600 also covers the boundaries of the elastic conductive layers 410 and 420, thereby avoiding gaps at the junction between the elastic insulating layer 600 and the elastic conductive layers 410 and 420. The elastic insulating layer 600 more completely covers the flexible circuit board 200.

[0063] Although this application has been disclosed above with reference to embodiments, it is not intended to limit this application. Those skilled in the art to which this application pertains may make some modifications and refinements without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be determined by the appended claims.

[0064] [Symbol Explanation]

[0065] 100A, 100B: Bio-implantable devices

[0066] 200: Flexible Circuit Board

[0067] 211~213: Line Layer

[0068] 211a: Sensor pad

[0069] 211b: RF component pad

[0070] 221, 222: Dielectric layer

[0071] 230: Conductive structure

[0072] 241, 242: Overlay layer

[0073] 310: Sensor

[0074] 320: Electrode Structure

[0075] 330: Transceiver

[0076] 331: Radio Frequency Components

[0077] 332: Antenna

[0078] 340: Processor

[0079] 350: Electronic Components

[0080] 410, 420: Elastic conductive layer

[0081] 500: Conductive adhesive layer

[0082] 600: Elastic insulation layer

[0083] 700A, 700B: Flexible substrate

[0084] 710: Metal layer

[0085] 720: Through hole

[0086] 800A, 800B: Flexible substrate

[0087] 810, 820: Metal layer

[0088] 830: Groove.

Claims

1. A bio-implantable device, characterized in that, Include: Flexible printed circuit board, including a circuit layer; The sensor is disposed on the circuit layer; A first elastic conductive layer covers the sensor; An electrode structure is disposed on the first elastic conductive layer and is used to collect electrical signals from a biological source, wherein the electrode structure is electrically connected to the sensor via the first elastic conductive layer. and An elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the first elastic conductive layer.

2. The bio-implantable device according to claim 1, characterized in that, Also includes: The processor is disposed within the flexible circuit board and is electrically connected to the sensor.

3. The bio-implantable device according to claim 2, characterized in that, Also includes: A transceiver is disposed on the flexible circuit board and electrically connected to the processor.

4. The bio-implantable device according to claim 3, characterized in that, Also includes: A second elastic conductive layer; and The transceiver includes: A radio frequency (RF) element is disposed on the circuit layer, wherein the second elastic conductive layer covers the RF element; and An antenna is disposed on the second elastic conductive layer, wherein the antenna is electrically connected to the radio frequency element via the second elastic conductive layer.

5. The bio-implantable device according to claim 1, characterized in that, The material of the first elastic conductive layer comprises an electroactive polymer; The material of the elastic insulating layer comprises a polymer.

6. The bio-implantable device according to claim 1, characterized in that, Also includes: A conductive adhesive layer is disposed between the electrode structure and the first elastic conductive layer to connect the electrode structure and the first elastic conductive layer and make them electrically conductive.

7. A method for manufacturing a bio-implantable device, characterized in that, Include: A flexible circuit board is provided, wherein the flexible circuit board includes a circuit layer; The sensor is mounted on the circuit layer; After the sensor is installed, a first elastic conductive layer is formed to cover the sensor; After forming the first elastic conductive layer, an elastic insulating layer is formed to cover the flexible circuit board, exposing the first elastic conductive layer; and After the first elastic conductive layer is formed, an electrode structure is disposed on the first elastic conductive layer, wherein the electrode structure is electrically connected to the sensor via the first elastic conductive layer.

8. The manufacturing method according to claim 7, characterized in that, The flexible circuit board includes: A first flexible substrate is provided, wherein the first flexible substrate includes a metal layer; Pattern the metal layer to form the circuit layer; Provide a second flexible substrate; A groove is formed in the second flexible substrate; The processor is positioned in the groove; and After the processor is configured and the circuit layer is formed, the first flexible substrate and the second flexible substrate are combined to form the flexible circuit board, wherein the first flexible substrate covers the processor so that the processor is located within the flexible circuit board.

9. The manufacturing method according to claim 7, characterized in that, Also includes: Before forming the elastic insulating layer, radio frequency components are disposed on the circuit layer; After the radio frequency element is disposed and before the elastic insulating layer is formed, a second elastic conductive layer is formed on the radio frequency element, wherein the second elastic conductive layer covers the radio frequency element; and An antenna is disposed on the second elastic conductive layer, wherein the antenna is electrically connected to the radio frequency element via the second elastic conductive layer, and the elastic insulating layer is exposed on the second elastic conductive layer and the antenna.

10. The manufacturing method according to claim 7, characterized in that, Also includes: Before the electrode structure is disposed on the first elastic conductive layer, a conductive adhesive layer is formed on the first elastic conductive layer, wherein the conductive adhesive layer connects the first elastic conductive layer and the electrode structure, and is electrically conductive between the first elastic conductive layer and the electrode structure.

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