Circuit board, display module and display device

Abstract

The invention discloses a circuit board, a display module and a display device, and relates to the technical field of display. In the circuit board, the distance between the first touch golden finger and the touch chip is relatively long, and the first type of touch wires in the touch wires are wound from the second board body part to one side, far away from the first touch golden finger, of the display golden finger and then extend into the first board body part, so that the wiring length of the first type of touch wires on the first board body part can be reduced. The distance between the second touch golden finger and the touch chip is close, and the wiring length of the second type of touch wires in the touch wires on the first plate body part is not too long. In other words, the wiring length of the touch wires on the first plate body part is short, wiring design of the display wires is facilitated, orthographic projection overlapping of the touch wires and the display wires is avoided, mutual interference of display signals transmitted by the display wires and touch signals transmitted by the touch wires is avoided, and the yield of the display module is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a circuit board, a display module and a display device. BACKGROUND

[0002] With the increasing demand of users on display products, a display module with flexible multi-layer on cell (FMLOC) structure is widely used.

[0003] In some embodiments, the display module includes a display panel and a circuit board which is connected to the display panel. In order to realize the dual functions of display and touch of the display module, the circuit board can include display driving lines and touch driving lines. The display driving lines can provide display signals for the display panel to drive the display panel to realize display. The touch driving lines can provide touch signals for the display panel to enable the display panel to realize touch. Generally, in order to avoid direct contact between the display signal lines and the touch signal lines, the display driving lines and the touch driving lines are located in different conductive layers of the circuit board. Further, in order to realize the thinning of the circuit board, the circuit board usually includes two conductive layers and an insulating layer located between the two conductive layers.

[0004] However, the display driving lines and the touch driving lines can cause signal interference at the projection overlapping position, thereby resulting in a low yield of the display module. SUMMARY

[0005] The present application provides a circuit board, a display module and a display device, which can solve the problems of signal interference and low yield of the display module. The technical solution is as follows:

[0006] In one aspect, a circuit board is provided, which includes:

[0007] a first board body part;

[0008] a gold finger part located on one side of a first side edge of the first board body part, the gold finger part including a plurality of first touch gold fingers, a plurality of display gold fingers and a plurality of second touch gold fingers, the plurality of display gold fingers being located between the plurality of first touch gold fingers and the plurality of second touch gold fingers;

[0009] a second board body part located on a side of the gold finger part away from the first side edge;

[0010] a touch chip located on the first board body part, and a distance between the touch chip and the plurality of second touch gold fingers being less than a distance between the touch chip and the plurality of first touch gold fingers.

[0011] touch wires, the touch wires comprising a plurality of first type touch wires corresponding to the plurality of first touch fingers, and a plurality of second type touch wires corresponding to the plurality of second touch fingers; one end of the first type touch wires is connected with the first touch fingers, the other end of the first type touch wires is extended from the plurality of display fingers away from the plurality of first touch fingers to the first plate body portion and connected with the touch chip, the part between the two ends of the first type touch wires is located on the second plate body portion; one end of the second type touch wires is connected with the second touch fingers, the other end is connected with the touch chip, the second type touch wires are located on the first plate body portion;

[0012] and display wires, the display wires are located on the first plate body portion, and the display wires are connected with the display fingers;

[0013] wherein the orthographic projection of the display wires on the first plate body portion and the orthographic projection of the touch wires on the first plate body portion do not overlap.

[0014] Optionally, one end of the second plate body portion is connected with the first area of the finger portion, the other end of the second plate body portion is connected with the second area of the finger portion, and the part between the two ends of the second plate body portion has a first hollow area with the finger portion;

[0015] The first area is an area where at least part of the first touch fingers are located, and the second area is an area where at least part of the second touch fingers are located.

[0016] Optionally, the second plate body portion further has a second hollow area;

[0017] The part between the two ends of a part of the first type touch wires is located on the first part of the second hollow area close to the first plate body portion in the second plate body portion;

[0018] The part between the two ends of another part of the first type touch wires is located on the second part of the second hollow area away from the first plate body portion in the second plate body portion.

[0019] Optionally, the circuit board further comprises:

[0020] a connecting plate body portion, the connecting plate body portion is connected with the first plate body portion, and the display wires are also located on the connecting plate body portion;

[0021] and a connector located on a side of the connecting plate body part away from the first plate body part, and the connector is connected with the display wire, and the connector is also used for connecting a power supply component of the display module.

[0022] Optionally, the connecting plate body part is connected with a second side of the first plate body part, and the second side and the first side are different sides of the first plate body part.

[0023] The first plate body part has a third hollow region, and the connecting plate body part and the connector are located in the third hollow region, and the connecting plate body part is connected with a side of the third hollow region.

[0024] Optionally, a shape of an orthogonal projection of the connecting plate body part on a reference plane is a rectangle, an L shape, or a curved shape.

[0025] The reference plane is parallel to a surface of the connecting plate body part on which the display wire is arranged.

[0026] Optionally, the first plate body part comprises a first shielding layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer, and a second shielding layer which are sequentially stacked.

[0027] The touch wire is located on the first conductive layer, and the display wire is located on the second conductive layer.

[0028] The circuit board further comprises a grounding part located in the first conductive layer and the second conductive layer, the grounding part located in the first conductive layer is arranged in a spaced manner with the touch wire, and the grounding part located in the second conductive layer is arranged in a spaced manner with the display wire.

[0029] Optionally, the grounding part located in the first conductive layer is connected with the first shielding layer through a via hole of the first insulating layer, and the grounding part located in the second conductive layer is connected with the second shielding layer through a via hole of the third insulating layer.

[0030] Optionally, the second plate body part comprises a third shielding layer, a fourth insulating layer, a third conductive layer, a fifth insulating layer, and a fourth shielding layer, and the gold finger part comprises a fourth conductive layer and a sixth insulating layer.

[0031] The first type of touch wire is also located on the third conductive layer, the first touch gold finger, the plurality of display gold fingers, and the plurality of second touch gold fingers are all located on the fourth conductive layer.

[0032] The third conductive layer and the fourth conductive layer are both located in the same layer as the first conductive layer.

[0033] Optionally, the second plate body part further comprises a fifth conductive layer and a seventh insulating layer between the fifth insulating layer and the fourth shielding layer.

[0034] The grounding part is further located on the fifth conductive layer, and the fifth conductive layer and the second conductive layer are in the same layer.

[0035] In another aspect, a display module is provided, comprising a display panel, a driving chip and a circuit board as described in the above aspect.

[0036] The display panel has a display area and a peripheral area surrounding the display area, the peripheral area comprises a bending area and a binding area, and the bending area is closer to the display area than the binding area.

[0037] The driving chip is located between the bending area and the binding area and connected with the display panel.

[0038] The gold finger part of the circuit board is connected with the binding area of the display panel, and the first plate body part of the circuit board is farther away from the bending area than the second plate body part.

[0039] Optionally, the driving chip is located on the side of the second plate body part of the circuit board away from the gold finger part.

[0040] Optionally, the display module further comprises a first buffer part.

[0041] The first buffer part is located on the side of the second plate body part close to the driving chip and between the second plate body part and the display panel.

[0042] Optionally, the orthographic projection of the driving chip on the display panel is located within the orthographic projection on the display panel of the first hollow area between the second plate body part and the first plate body part of the circuit board.

[0043] Optionally, the display module further comprises a second buffer part.

[0044] The first buffer part is located on the side of the first hollow area of the second plate body part and between the second plate body part and the display panel.

[0045] Optionally, the orthographic projection of the driving chip on the display panel is located within the orthographic projection on the display panel of the second hollow area of the second plate body part of the circuit board.

[0046] Optionally, the display module further comprises a third buffer part.

[0047] The third buffer section is located on the side of the second hollow area of ​​the second plate part, and is located between the second plate part and the display panel.

[0048] In another aspect, a display device is provided, the display device comprising: a power supply component, and a display module as described above;

[0049] The power supply component is connected to the display module and is used to supply power to the display module.

[0050] The beneficial effects of the technical solution provided in this application include at least the following:

[0051] This application provides a circuit board, a display module, and a display device. The circuit board includes a first board body, a gold finger portion, a second board body, a touch chip, touch traces, and display traces. Since the distance between the first touch gold finger and the touch chip is relatively large, the first type of touch traces in the touch traces can be routed from the second board body to the side of the display gold finger furthest from the first touch gold finger before extending into the first board body, thus reducing the wiring length of the first type of touch traces on the first board body. Furthermore, since the distance between the second touch gold finger and the touch chip is relatively large, the wiring length of the second type of touch traces in the touch traces on the first board body will not be too long. That is, the wiring length of the touch traces on the first board body is relatively short. Therefore, through the wiring design of the display traces, the overlapping of the orthographic projections of the touch traces and the display traces can be avoided, thereby preventing interference between the display signals transmitted in the display traces and the touch signals transmitted in the touch traces, and improving the yield of the display module. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a schematic diagram of a circuit board in related technologies;

[0054] Figure 2 This is a schematic diagram of another type of circuit board in related technologies;

[0055] Figure 3 This is a schematic diagram of a circuit board provided in an embodiment of this application;

[0056] Figure 4 This is a partial schematic diagram of a display module provided in an embodiment of this application;

[0057] Figure 5 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0058] Figure 6 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0059] Figure 7 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0060] Figure 8 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0061] Figure 9 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0062] Figure 10 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0063] Figure 11 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0064] Figure 12 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0065] Figure 13 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0066] Figure 14 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0067] Figure 15 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0068] Figure 16 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0069] Figure 17 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0070] Figure 18 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0071] Figure 19 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0072] Figure 20 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0073] Figure 21This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0074] Figure 22 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0075] Figure 23 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0076] Figure 24 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0077] Figure 25 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0078] Figure 26 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0079] Figure 27 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0080] Figure 28 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0081] Figure 29 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0082] Figure 30 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0083] Figure 31 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0084] Figure 32 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0085] Figure 33 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0086] Figure 34 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0087] Figure 35 This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0088] Figure 36 This is a schematic diagram of another circuit board provided in an embodiment of this application;

[0089] Figure 37This is a partial schematic diagram of another display module provided in an embodiment of this application;

[0090] Figure 38 This is a partial cross-sectional schematic diagram of a circuit board provided in an embodiment of this application;

[0091] Figure 39 This is a partial cross-sectional schematic diagram of another circuit board provided in an embodiment of this application;

[0092] Figure 40 This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0093] Figure 41 This is a top view of a display panel provided in an embodiment of this application;

[0094] Figure 42 This is a partial cross-sectional schematic diagram of another display module provided in an embodiment of this application;

[0095] Figure 43 This is a partial cross-sectional schematic diagram of another display module provided in the embodiments of this application;

[0096] Figure 44 This is a schematic diagram of a display device provided in an embodiment of this application. Detailed Implementation

[0097] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0098] Organic light-emitting diode (OLED) display technology has been widely used in small and medium-sized products (such as mobile phones and wearable devices). As people's requirements for display products become higher and higher, display modules with FMLOC structure are widely used.

[0099] In the process of illuminating the display panel in a display module, two crucial materials are the driver integrated circuit (DIC) and the flexible printed circuit (FPC). The driver chip, also known as the driver IC, can be purchased directly, while the flexible printed circuit needs to be designed according to the specific requirements of the product. Currently, all flexible printed circuits are adapted to display modules with an FMLOC structure. Simply put, the display module needs to simultaneously perform display and touch functions; therefore, the flexible printed circuit includes both display and touch signals. Since both display and touch signals are high-frequency signals, interference may occur.

[0100] Therefore, to reduce interference between display and touch signals while enabling the display module to simultaneously perform touch and display functions, the flexible printed circuit (FPC) included in the display module can be made of multiple conductive layers. In traditional designs, display traces and touch traces in the FPC are distributed in different conductive layers, with an intermediate conductive layer for grounding to separate the display and touch traces and reduce mutual interference. However, this design increases the number of conductive layers in the flexible circuit board, correspondingly increasing manufacturing difficulty and cost. In other words, existing multi-layered flexible circuit boards present technical challenges due to their high manufacturing difficulty and cost.

[0101] Currently, to reduce the manufacturing difficulty and cost of flexible circuit boards, they can be made to include two conductive layers. However, referring to... Figure 1 The orthographic projections of the display traces and touch traces intersect in area A. In the two-layer conductive layer scheme, the display traces and touch traces cannot be grounded through the conductive layer, which will cause mutual interference between the display traces and touch traces.

[0102] For details, please refer to Figure 1 The flexible circuit board 00 includes a main board 01, multiple bonding pins 02 disposed on one side of the main board 01, a touch IC (TIC) 03 disposed on the main board 01, a connecting board 04 connected to the main board 01, and a connector 05 connected to the connecting board 04. The connector 05 extends from the side of the main board 01 relative to it and is used to connect to external power supply components or the entire terminal device, enabling the flexible circuit board to obtain signals from the outside to illuminate the display panel of the display module.

[0103] The connector transmits display signals and touch signals. The corresponding flexible circuit board includes display traces and touch traces connected to the connector (the touch traces connected to the connector will not interfere with the touch traces connected to the gold fingers, so they will not be described in detail below). Additionally, the display traces connected to the connector need to connect to the gold finger located in the middle of the multiple gold fingers. This middle gold finger can be bonded to the display panel and then connected to the driver chip used to drive the display. Furthermore, the flexible circuit board also includes touch traces connected to the gold fingers located at both ends of the multiple gold fingers. The touch traces connected to these two ends of the gold fingers also need to connect to the touch chip.

[0104] Figure 1In the middle, connector 05 extends from the left side, and touch chip 03 is closer to the right end. Therefore, the touch trace connected to the gold finger on the left end will inevitably intersect the orthographic projection of the display trace connected to connector 05 in the vertical direction. Figure 1 (Area A in the text). Figure 2 In the middle, connector 05 extends from the bottom, and touch chip 03 is closer to the right end. Therefore, the touch trace connected to the gold finger on the left end will inevitably intersect the orthographic projection of the display trace connected to connector 05 in the horizontal direction. Figure 2 (Region B in the text).

[0105] That is to say, in Figure 1 and Figure 2 In this proposed solution, if the flexible circuit board includes two conductive layers, grounding between the display traces and touch traces cannot be achieved through these conductive layers. Therefore, to reduce interference between the display traces and touch traces, their projected orthographic projections must intersect perpendicularly to minimize the intersection area. However, this design still cannot completely eliminate the interference problem between the display traces and touch traces.

[0106] Figure 3 This is a schematic diagram of a circuit board structure provided in an embodiment of this application. (Reference) Figure 3 The circuit board 001 includes: a first board body portion 101, a gold finger portion 102, a second board body portion 103, a touch chip 104, touch traces 105, and display traces 106.

[0107] refer to Figure 3 The gold finger portion 102 is located on one side of the first side 101a of the first plate portion 101. The gold finger portion 102 includes a plurality of first touch gold fingers 1021, a plurality of display gold fingers 1022, and a plurality of second touch gold fingers 1023 spaced apart along the extending direction of the first side 101a. The plurality of display gold fingers 1022 are located between the plurality of first touch gold fingers 1021 and the plurality of second touch gold fingers 1023. The display gold fingers 1022 in the circuit board 001 are used for bonding with the bonding area of ​​the display panel in the display module. The display gold fingers can be gold fingers used for transmitting display signals. The first touch gold fingers 1021 and the second touch gold fingers 1023 can be collectively referred to as touch gold fingers. The touch gold fingers can be gold fingers used for transmitting touch signals. The touch gold fingers in the circuit board 001 are used for bonding with the bonding area of ​​the display panel in the display module.

[0108] The second plate portion 103 is located on the side of the gold finger portion 102 away from the first side 101a. Alternatively, it can be understood that the first plate portion 101 and the second plate portion 103 are located on opposite sides of the gold finger portion 102.

[0109] The touch chip 104 is located on the first plate portion 101, and the distance between the touch chip 104 and the plurality of second touch gold fingers 1023 is less than the distance between the touch chip 104 and the plurality of first touch gold fingers 1021. For example Figure 3 In this design, the touch chip 104 can be disposed on the underside of multiple second touch fingers 1023. The touch chip 104 is an electronic component that senses human-computer interaction behavior, enabling functions such as touch screen operation, gesture control, and handwriting input by sensing various signals such as human muscle activity, capacitive magnetic fields, and pressure.

[0110] The touch trace 105 is used to transmit touch signals. The touch trace 105 includes multiple first-type touch traces 1051 and multiple second-type touch traces 1052.

[0111] Multiple first-type touch traces 1051 and multiple first-type touch gold fingers 1021 are correspondingly arranged. One end of the first-type touch trace 1051 is connected to the first-type touch gold finger 1021, and the other end of the first-type touch trace 1051 extends from the side of the multiple display gold fingers 1022 away from the multiple first-type touch gold fingers 1021 into the first board portion 101 and is connected to the touch chip 104. The portion between the two ends of the first-type touch trace 1051 is located on the second board portion 103. That is, the portion between the two ends of the first-type touch trace 1051 can be located on the side of the gold finger portion 102 away from the touch chip 104. The first-type touch trace 1051 can be wired on the second board portion 103, and only a small section of the trace is set on the first board portion 101 to connect with the touch chip 104.

[0112] Multiple second-type touch traces 1052 and multiple second-type touch gold fingers 1023 are correspondingly arranged. One end of the second-type touch trace 1052 is connected to the second-type touch gold finger 1023, and the other end is connected to the touch chip 104. The second-type touch traces 1052 are located on the first board portion 101.

[0113] The display trace 106 is located on the first board portion 101 and is connected to the display gold finger 1022. The display trace 106 is used to transmit display signals. Display signals typically include communication signals (high-frequency signals), power signals, and other signals such as digital and analog signals.

[0114] In this embodiment, since the touch chip 104 and the second touch gold finger 1023 are close together, even if the second type of touch trace 1052 is placed on the first board portion 101, the wiring length of the second type of touch trace 1052 on the first board portion 101 will not be too long, and it will not have a significant impact on the wiring of the display trace 106. Therefore, through the wiring design of the display trace 106, the orthographic projection of the second type of touch trace 1052 on the first board portion 101 can be made to not overlap with the orthographic projection of the display trace 106 on the first board portion 101.

[0115] Furthermore, since the distance between the touch chip 104 and the first touch gold finger 1021 is relatively large, if the first type of touch trace 1051 is directly placed on the first board portion 101, the wiring length of the first type of touch trace 1051 on the first board portion 101 will be too long, which will increase the possibility of the first type of touch trace 1051 and the display trace 106 overlapping in their orthographic projections. Therefore, in this embodiment, the first type of touch trace 1051 is routed from the second board portion 103 to the side of the plurality of display gold fingers 1022 away from the plurality of first touch gold fingers 1023 before extending into the first board portion 101. This can reduce the wiring length of the first type of touch trace 1051 on the first board portion 101, and thus, through the wiring design of the display trace 106, the overlap of the orthographic projections of the first type of touch trace 1051 and the display trace 106 can be avoided.

[0116] This embodiment of the application implements the wiring design of the first type of touch trace 1051 through an additionally provided second board portion 103, which can reduce the wiring length of the first type of touch trace 1051 on the first board portion 101. Furthermore, the wiring length of the second type of touch trace 1052 on the first board portion 101 is inherently shorter. Therefore, the wiring length of the touch trace 105 on the first board portion 101 can be reduced, and the wiring design of the display trace 106 can prevent the overlapping of the orthographic projections of the touch trace 105 and the display trace 106. That is, the orthographic projections of the display trace 106 and the touch trace 105 on the first board portion 101 do not overlap. The wiring length of the touch trace 105 on the first board portion 101 can refer to the path length of the portion of the touch trace 105 located on the first board portion 101.

[0117] Optionally, since the orthographic projections of the display trace 106 and the touch trace 105 on the first board portion 101 do not overlap, even if the circuit board includes two conductive layers, interference between the display signals transmitted in the display trace 106 and the touch signals transmitted in the touch trace 105 can be avoided, thereby improving the yield of the display module. Furthermore, including two conductive layers in the circuit board reduces the number of conductive layers and lowers the cost.

[0118] In summary, this application provides a circuit board including a first board body, a gold finger portion, a second board body, a touch chip, touch traces, and display traces. Since the first touch gold finger and the touch chip are relatively far apart, the first type of touch traces in the touch traces can be routed from the second board body to the side of the display gold finger furthest from the first touch gold finger before extending into the first board body, thus reducing the wiring length of the first type of touch traces on the first board body. Furthermore, since the second touch gold finger and the touch chip are relatively far apart, the wiring length of the second type of touch traces on the first board body will not be too long. That is, the wiring length of the touch traces on the first board body is relatively short. Therefore, through the wiring design of the display traces, the overlapping of the orthographic projections of the touch traces and the display traces can be avoided, thereby preventing interference between the display signals transmitted in the display traces and the touch signals transmitted in the touch traces, and improving the yield of the display module.

[0119] In this embodiment, the touch signal may include a transmit (TX) signal and a receive (RX) signal. Accordingly, the trace transmitting the TX signal in the touch trace 105 can be called the TX trace, and the trace transmitting the RX signal in the touch trace 105 can be called the RX trace. The TX trace can be a transmitting end, used to send information or data, and the RX trace is used to receive information and data from the transmitting end.

[0120] Optionally, each type of touch trace in the first type of touch trace 1051 and the second type of touch trace 1052 can include TX traces and RX traces. For example, a portion of the multiple first type touch traces 1051 may be TX traces, and another portion may be RX traces. Similarly, a portion of the multiple second type touch traces 1052 may be TX traces, and another portion may be RX traces.

[0121] Optionally, each first-type touch trace 1051 can extend directly into the first board portion 101 from the gap between adjacent second touch gold fingers 1023 in the area where the second touch gold fingers 1023 are located. Alternatively, each first-type touch trace 1051 can extend directly into the first board portion 101 from the side of the second touch gold fingers 1023 away from the display gold fingers. Alternatively, the gold finger portion 102 may also include multiple third touch gold fingers (not shown in the figure), each third touch gold finger located between adjacent second touch gold fingers 1023 (e.g., multiple third touch gold fingers and multiple second touch gold fingers 1023 can be arranged alternately) or located on the side of the second touch gold fingers 1023 away from the display gold fingers 1022. In this case, each first-type touch trace 1051 can be connected to a third touch gold finger before extending into the first board portion 101.

[0122] In the embodiments of this application, reference is made to Figure 3 One end of the second board portion 103 is connected to the first region Q1 of the gold finger portion 102, and the other end of the second board portion 103 is connected to the second region Q2 of the gold finger portion 102. A first hollow region L1 is formed between the two ends of the second board portion 103 and the gold finger portion 102. The first region Q1 is the area where at least a portion of the plurality of first touch gold fingers 1021 are located, and the second region Q2 is the area where at least a portion of the plurality of second touch gold fingers 1023 are located. The first hollow region L1 between the two ends of the second board portion 103 and the gold finger portion 102 can include the following two cases.

[0123] As one possible scenario, refer to Figure 4 After the circuit board 001 is bonded to the display panel 002 to form the display module 1000, the driver chip 003 connected to the display panel 002 can be located on the side of the second board portion 103 away from the first board portion 101. In this case, the presence of the first cutout area L1 between the two ends of the second board portion 103 and the gold finger portion 102 can prevent the first type of touch trace 1051 on the second board portion 103 from affecting the gold fingers on the gold finger portion 102.

[0124] As another possible scenario, see reference Figure 5 After the circuit board 001 is bonded to the display panel 002 to form the display module 1000, the driver chip 003 connected to the display panel 002 can be located within the first cutout area L1. Alternatively, it can be understood that the first cutout area L1 is a cutout area that avoids the driver chip 003. In this case, the second board portion 103 is located on the side of the driver chip 003 away from the first board portion 101.

[0125] In the embodiments of this application, reference is made to Figure 6 The second board portion 103 also has a second cutout area L2. Because the second board portion 103 has the second cutout area L2, multiple first-type touch traces 1051 need to avoid the second cutout area L2 when routing on the second board portion 103. Optionally, a portion of the multiple first-type touch traces 1051, between their two ends, is located on the first portion 1031 of the second board portion 103 near the second cutout area L2. Another portion of the multiple first-type touch traces 1051, between their two ends, is located on the second portion 1032 of the second board portion 103 away from the first board portion 101.

[0126] refer to Figure 7 After the circuit board 001 is bonded to the display panel 002 to form the display module 1000, the driver chip 003 connected to the display panel 002 can be located within the second cutout area L2. In this case, the portion between the two ends of the second board portion 103 and the gold finger portion 102 can also have a first cutout area L1. The presence of the first cutout area L1 can prevent the first type of touch trace 1051 located on the second board portion 103 from affecting the gold fingers on the gold finger portion 102.

[0127] Optionally, the second hollow area L2 in the second plate portion 103 is farther away from the first plate portion 101 than the first hollow area L1, and the hollow area of ​​the second hollow area L2 in the second plate portion 103 is larger than that of the first hollow area L1.

[0128] In the embodiments of this application, reference is made to Figures 3 to 7 The circuit board 001 also includes a connecting board portion 107 and a connector 108. The connecting board portion 107 is connected to the first board portion 101, and the display trace 106 is also located on the connecting board portion 107. The connector 108 is located on the side of the connecting board portion 107 away from the first board portion 101, and the connector 108 is connected to the display trace 106. The connector 108 is also used to connect the power supply components of the display device.

[0129] Optionally, the connecting plate portion 107 can be connected to the second side 101b of the first plate portion 101. The second side 101b and the first side 101a can be two different sides of the first plate portion 101. For example, see reference... Figures 3 to 7 The second side 101b and the first side 101a can be two adjacent sides, or the second side 101b can be a side in the first plate part 101 that corresponds to the first side 101a.

[0130] Optional, see reference Figures 3 to 7 ,as well as Figures 8 to 12 The first plate portion 101 has four sides, which roughly form a rectangular shape. Figures 3 to 7 In this context, the first side 101a can be the upper side of the first plate portion 101, and the second side 101b can be the left side of the first plate portion 101. Alternatively, refer to... Figures 8 to 12 The first side 101a can be the upper side of the first plate portion 101, and the second side 101b can be the lower side of the first plate portion 101. Alternatively, the first side 101a can be the upper side of the first plate portion 101, and the second side 101b can be the right side of the first plate portion 101. Of course, the first plate portion 101 can also have other shapes, and this embodiment does not specifically limit the shape of the first plate portion 101.

[0131] Or, refer to Figures 13 to 17 The first plate portion 101 has a third hollow area L3. The connecting plate portion 107 and the connector 108 are both located within the third hollow area L3, and the connecting plate portion 107 is connected to the side of the third hollow area L3. Optionally, the third hollow area L3 has four sides. Figures 13 to 17 In the middle, the connecting plate part 107 can be connected to the upper side of the third hollow area L3.

[0132] Optionally, the shape of the third cutout area L3 is approximately rectangular. Alternatively, the third cutout area L3 can be any shape provided that wiring requirements are met; this embodiment does not impose specific limitations on the shape of the third cutout area L3.

[0133] In this embodiment of the application, the first board body portion 101 of the circuit board may include other functional cutout areas, and the shape of each cutout area may be square, circular, rectangular, or irregular, etc. For example Figures 3 to 7 The first board portion 101 of the circuit board 001 may include two cutout areas (L4 and L5).

[0134] Optionally, the connecting board portion 107 can be referred to as the long neck portion of the circuit board. The long neck portion can extend from any position of the first board portion 101 and connect to the first board portion 101. For example... Figures 8 to 12 The connecting plate portion 107 can extend from the middle of the lower side of the first plate portion 101. Or Figures 18 to 22 The connecting plate portion 107 can extend from the left end of the lower side of the first plate portion 101. The connection position between the connecting plate portion 107 and the first plate portion 101, as well as the length of the connecting plate portion 107 along the extension direction, can be determined according to the specific product project.

[0135] In the embodiments of this application, reference is made to Figures 3 to 22 The shape of the orthographic projection of the connecting plate portion 107 onto the reference plane is rectangular. Alternatively, the reference... Figures 23 to 32 The shape of the orthographic projection of the connecting plate portion 107 onto the reference plane is L-shaped. Alternatively, the reference... Figures 33 to 37 The shape of the orthographic projection of the connecting plate portion 107 onto the reference plane is curved. This embodiment does not specifically limit the shape of the connecting plate portion 107, as long as it ensures that display traces 106 that can connect to the connector 108 can be provided on the connecting plate portion 107. The reference plane is parallel to the surface of the connecting plate portion 107 where the display traces 106 are provided.

[0136] Optionally, if the shape of the orthographic projection of the connecting plate portion 107 on the reference plane is L-shaped, the L-shape can be an L-shape that bends to the left (e.g., Figures 23 to 27 ), or an L-shape that bends to the right (e.g. Figures 28 to 32 ).

[0137] In this embodiment, connector 108 has a power interface that can provide power signals to circuit board 100 and a MIPI interface that provides mobile industry processor interface (MIPI) signals. Accordingly, some of the display traces connected to connector 108 can be used to transmit power signals, and other traces can be used to transmit MIPI signals.

[0138] The power supply components in the display device can transmit power signals to the circuit board 100 via a power interface. The purpose of MIPI is to standardize interfaces within electronic devices (such as display devices), including cameras, display screen interfaces, and radio frequency / interfaces, thereby reducing the complexity of electronic device design and increasing design flexibility. The benefit of standardization is that electronic device manufacturers can flexibly and uniformly select different chips and modules from the market as needed, making design and functional changes faster and more convenient. MIPI signals are high-frequency signals.

[0139] Figure 38 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this application. (Reference) Figure 38 The first plate portion 101 includes a first shielding layer m1, a first insulating layer m2, a first conductive layer m3, a second insulating layer m4, a second conductive layer m5, a third insulating layer m6, and a second shielding layer m7, which are stacked sequentially.

[0140] The first shielding layer m1 and the second shielding layer m7 can be electromagnetic interference (EMI) shielding layers used to shield electromagnetic signals. The first insulating layer m2 is used to protect the first conductive layer m3, the second insulating layer m4 is used to insulate the first conductive layer m3 and the second conductive layer m5, and the third insulating layer m6 is used to protect the second conductive layer m5.

[0141] from Figure 38 As can be seen, the first board portion 101 can be a board portion with a double conductive layer design, or it can be understood that the circuit board 001 has a double conductive layer design. Optionally, the touch trace 105 can be located on the first conductive layer m3, and the display trace 106 can be located on the second conductive layer m5. That is, the touch trace 105 and the display trace 106 can be located on different conductive layers in the first board portion 101.

[0142] Optionally, the circuit board 001 also includes a grounding portion located in the first conductive layer m3 and the second conductive layer m5, which can be used to receive a ground (GND) signal. Grounding portions can be provided in all areas of the first conductive layer m3 and the second conductive layer m5 except for the areas where traces are set. For example, the grounding portion located in the first conductive layer m3 is spaced apart from the touch trace 105, and the grounding portion located in the second conductive layer m5 is spaced apart from the display trace 106.

[0143] In this embodiment, to achieve better grounding performance for circuit board 001, the following two methods can be adopted. Method 1: The grounding portion located on the first conductive layer m3 is connected to the first shielding layer m1 through a via in the first insulating layer m2, and the grounding portion located on the second conductive layer m5 is connected to the second shielding layer m7 through a via in the third insulating layer m6. Method 2: The first insulating layer m2 and the first shielding layer m1 above the grounding portion of the first conductive layer m3 are hollowed out, exposing the grounding portion of the first conductive layer m3; the second insulating layer m4 and the second shielding layer m7 above the grounding portion of the second conductive layer m5 are hollowed out, exposing the grounding portion of the second conductive layer m5. After the module process, a cover film can be attached to circuit board 001, and the cover film can contact and connect with the grounding portion.

[0144] In this embodiment, the first type of touch trace 1051 is led out from the first touch gold finger 1021 and then the second type of touch trace 1052 is brought together to the same side of the display gold finger 1022 via the second board portion 103. This allows the first type of touch trace 1051 and the second type of touch trace 1052 to be introduced together from the side of the display gold finger 1022 away from the first touch gold finger 1021 and connected to the touch chip 104. Figures 3 to 37 Related technologiesFigure 1 In comparison, Figure 1 The original location where touch control wiring needed to be set was in Figures 3 to 37 The proposed solution eliminates the need for touch traces 105 (area C in the diagram). This area can then be equipped with a grounding section, which can be connected to the shielding layer, thereby enhancing the electromagnetic shielding effect of the shielding layer on the circuit board.

[0145] exist Figures 3 to 12 as well as Figures 18 to 37 In the illustrated scheme, since the first type of touch trace 1051 is routed on the second board portion 103, the size of the first board portion 101 can be reduced (wherein...). Figures 3 to 12 as well as Figures 18 to 37 The lower middle dashed line indicates the size of the circuit board according to the conventional design, which reduces the area of ​​the main board body and is beneficial to the design of modules and the whole machine.

[0146] refer to Figure 38 The second plate portion 103 may include a third shielding layer m8, a fourth insulating layer m9, a third conductive layer m10, a fifth insulating layer m11, and a fourth shielding layer m12. That is, the second plate portion 103 may include a conductive layer. The gold finger portion 102 may include a fourth conductive layer m13 and a sixth insulating layer m14.

[0147] The first type of touch trace 1051 is also located in the third conductive layer m10. That is, the TX trace and RX trace included in the first type of touch trace 1051 are both located in the third conductive layer m10. The first touch gold finger 1021, multiple display gold fingers 1022 and multiple second touch gold fingers 1023 are all located in the fourth conductive layer m13.

[0148] Optionally, the first shielding layer m1 and the third shielding layer m8 are located in the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located in the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located in the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located in the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located in the same layer. Here, "located in the same layer" can mean that they are made of the same material and manufactured in a single process.

[0149] Figure 39 This is a cross-sectional schematic diagram of another circuit board provided in an embodiment of this application. (Reference) Figure 39 The second plate portion 103 further includes a fifth conductive layer m15 and a seventh insulating layer m16 located between the fifth insulating layer m11 and the fourth shielding layer m12. The fifth conductive layer m15 and the second conductive layer m16 are located in the same layer. That is, the second plate portion 103 may include two conductive layers.

[0150] Optionally, when the second plate portion 103 includes two conductive layers, the first shielding layer m1 and the third shielding layer m8 are located in the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located in the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located in the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located in the same layer. The second conductive layer m5 and the fifth conductive layer m15 are located in the same layer. The third insulating layer m6 and the seventh insulating layer m16 are located in the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located in the same layer. Here, "located in the same layer" can mean that they are made of the same material and prepared by a single process.

[0151] Optionally, when the second board portion 103 includes two conductive layers, the TX and RX traces included in the first type of touch trace 1051 can be located in the same conductive layer of the second board portion 103, or they can be located in different conductive layers.

[0152] For example, the TX and RX traces included in the first type of touch trace 1051 can both be located in the third conductive layer m10, and the fifth conductive layer m15 can be used to set the ground portion. Alternatively, the TX and RX traces included in the first type of touch trace 1051 can be located in different conductive layers, and the orthographic projections of the TX and RX traces do not need to overlap. For example, if the TX trace is located in the third conductive layer m10 and the RX trace is located in the fifth conductive layer m15, then the position in the fifth conductive layer m15 that overlaps with the TX trace is the ground portion, and the position in the third conductive layer m10 that overlaps with the RX trace is the ground portion.

[0153] In the embodiments of this application, Figure 38 The second board portion 103 of the circuit board shown has a conductive layer. Figure 39 The second board portion 103 of the circuit board shown has two conductive layers. In fact, when designing the second board portion 103, both one and two conductive layers are acceptable designs, and the choice can be made based on the specific circumstances of different products.

[0154] for Figure 38 and Figure 39 The circuit board shown has no insulating layer on the underside of the fourth conductive layer m13 in the circuit board 001. Therefore, the underside of the gold fingers (first touch gold fingers 1021, multiple display gold fingers 1022 and multiple second touch gold fingers 1023) in the circuit board 001 can be bonded to the display panel bonding area 002b2 included in the display module.

[0155] In the embodiments of this application, the shielding layers included in the circuit board 001 can be electromagnetic shielding films (a type of electronic material film). These films, made of special materials, block or attenuate the propagation of electromagnetic energy between the shielded area and the outside world, thereby limiting electromagnetic waves to a certain range and suppressing or attenuating their electromagnetic radiation, thus effectively blocking electromagnetic interference.

[0156] Optionally, the material of each conductive layer included in circuit board 001 may include copper (Cu). Correspondingly, the material of each trace located on the conductive layer may include copper.

[0157] Optionally, the material of the second insulating layer m4 located between the first conductive layer m3 and the second conductive layer m5 may include polyimide (PI). Since PI is a high-temperature resistant organic polymer material with good flexibility, it is commonly used between conductive layers to achieve insulation. For films on a circuit board where the second insulating layer m4 is located in the same layer, its material can also be PI.

[0158] Optionally, the first insulating layer m2 located on the side of the first conductive layer m3 away from the second conductive layer m5, and the third insulating layer m6 located on the side of the second conductive layer m5 away from the first conductive layer m3, can be cover films. The cover film can be made of a material that combines insulating material and adhesive, primarily to protect the circuitry from short circuits and to act as a solder resist. The film layer in circuit board 001 that is on the same layer as the first insulating layer m2 and the third insulating layer m6 can also be a cover film.

[0159] In this embodiment, by providing a second board portion 103 in the circuit board 001 (the second board portion 103 and the driver chip are located on the same side of the gold finger portion 102), the area of ​​the circuit board 001 is increased to lead out the first type of touch trace 1051 (i.e., the first type of touch trace 1051 is led out separately through the second board portion 103), thereby avoiding the touch trace 105 and the display trace 106 from intersecting. Thus, in the case where the circuit board 001 is a double-layer conductive circuit board, mutual interference between the touch signals transmitted in the touch trace 105 and the display signals transmitted in the display trace 106 can be avoided, thereby reducing the interference problem of the circuit board 001 and improving the signal quality of the circuit board 001.

[0160] In this embodiment, the circuit board 001 can be a flexible printed circuit board (FPC). Other functional devices can also be disposed on the first board portion 101 of the circuit board 001, such as... Figures 3 to 37 Other components are represented by small rectangles. These other components may include at least one of resistors, capacitors, and diodes.

[0161] In summary, this application provides a circuit board including a first board body, a gold finger portion, a second board body, a touch chip, touch traces, and display traces. Since the first touch gold finger and the touch chip are relatively far apart, the first type of touch traces in the touch traces can be routed from the second board body to the side of the display gold finger furthest from the first touch gold finger before extending into the first board body, thus reducing the wiring length of the first type of touch traces on the first board body. Furthermore, since the second touch gold finger and the touch chip are relatively far apart, the wiring length of the second type of touch traces on the first board body will not be too long. That is, the wiring length of the touch traces on the first board body is relatively short. Therefore, through the wiring design of the display traces, the overlapping of the orthographic projections of the touch traces and the display traces can be avoided, thereby preventing interference between the display signals transmitted in the display traces and the touch signals transmitted in the touch traces, and improving the yield of the display module.

[0162] Figure 40 This is a partial cross-sectional schematic diagram of a display module provided in an embodiment of this application. (Reference) Figure 40 The display module 1000 includes: a display panel 002, a driver chip 003, and a circuit board 001 as described in the above embodiments. Figure 41 This is a top view of a display panel provided in an embodiment of this application. (Reference) Figure 41 The display panel 002 has a display area 200a and a peripheral area 200b surrounding the display area 200a. The peripheral area 200b includes a bending area 002b1 and a bonding area 002b2. The bending area 002b1 is closer to the display area 200a than the bonding area 002b2.

[0163] Combination Figure 40 and Figure 41 The driver chip 003 is located between the bending area 002b1 and the bonding area 002b2, and is connected to the display panel 002. The driver chip 003 can be used to drive the display panel 002 to achieve display.

[0164] The gold finger portion 102 of the circuit board 001 is connected to the bonding area 002b2 of the display panel 002. The first board portion 101 of the circuit board 001 is further away from the bending area 002b1 than the second board portion 103. That is, after the gold finger portion 102 of the circuit board 001 and the bonding area 002b2 of the display panel 002 are connected, the second board portion 103 of the circuit board 001 and the display panel can overlap in projection, while the first board portion 101 of the circuit board 001 and the display panel 002 do not need to overlap in projection.

[0165] In summary, this application provides a display module. The display module includes a circuit board comprising a first board body, a gold finger portion, a second board body, a touch chip, touch traces, and display traces. Since the distance between the first touch gold finger and the touch chip is relatively large, the first type of touch traces in the touch traces can be routed from the second board body to the side of the display gold finger furthest from the first touch gold finger before extending into the first board body, thus reducing the wiring length of the first type of touch traces on the first board body. Furthermore, since the distance between the second touch gold finger and the touch chip is relatively large, the wiring length of the second type of touch traces on the first board body will not be too long. That is, the wiring length of the touch traces on the first board body is relatively short. Therefore, through the wiring design of the display traces, the overlapping of the orthographic projections of the touch traces and the display traces can be avoided, thereby preventing interference between the display signals transmitted in the display traces and the touch signals transmitted in the touch traces, and improving the yield of the display module.

[0166] refer to Figure 4 , Figure 9 , Figure 14 , Figure 19 , Figure 24 , Figure 29 , Figure 34 And reference Figure 40 The driver chip 003 can be located on the side of the second board portion 103 of the circuit board 001 away from the gold finger portion 102. In this case, the second board portion 103 and the first board portion 101 of the circuit board 001 may or may not have a first cutout area L1, and the embodiments of this application do not specifically limit this.

[0167] In this embodiment, since the second board portion 103 of the circuit board 001 and the display panel 002 overlap in projection, they may collide with each other. Furthermore, since the driver chip 003 is located on the side of the second board portion 103 away from the gold finger portion 102, the sides of the second board portion 103 away from the gold finger portion 102 may also collide. Therefore, a certain safe distance is required between the driver chip 003 and the second board portion 103.

[0168] Optionally, to further improve the collision prevention of the second board portion 103, display panel 002, and driver chip 100, refer to Figure 40The display module 1000 further includes a first buffer section 004 (also referred to as a type film). The first buffer section 004 is located on the side of the second plate portion 103 near the driver chip, and is located between the second plate portion 103 and the display panel. The first buffer section 004 can buffer the mutual collisions between the second plate portion 103 and the display panel 002, as well as the mutual collisions between the second plate portion 103 and the driver chip 003, to avoid the design of the second plate portion 103 affecting the driver chip 003 and the display panel 002, and to ensure the yield of the second plate portion 103, the driver chip 003, and the display panel 002.

[0169] Figure 42 This is a partial cross-sectional schematic diagram of another display module provided in an embodiment of this application. (Reference) Figure 5 , Figure 10 , Figure 15 , Figure 20 , Figure 25 , Figure 30 , Figure 35 as well as Figure 42 The orthographic projection of the driver chip 003 on the display panel 002 is located within the first cutout area L1 between the second board portion 103 and the first board portion 101 of the circuit board 001. Alternatively, it can be understood that the driver chip 003 is located within the first cutout area L1. In this case, the driver chip 003 can be located on the side of the second board portion 103 closer to the gold finger portion 102.

[0170] In this embodiment, since the second board portion 103 of the circuit board 001 and the display panel 002 overlap in projection, they may collide with each other. Furthermore, since the driver chip 003 is located within the first cutout area L1, the driver chip 003 and the side of the first cutout area L1 may also collide. Therefore, a certain safe distance needs to be maintained between the driver chip 003 and the second board portion 103.

[0171] Optionally, to further improve the collision prevention of the second board portion 103, display panel 002, and driver chip 003, refer to Figure 42The display module 1000 further includes a second buffer section 005 (also referred to as a type film). The second buffer section 005 is located on the side of the first hollow area L1 and between the second plate portion 103 and the display panel 002. The second buffer section 005 can buffer the mutual collisions between the second plate portion 103 and the display panel 002, as well as the mutual collisions between the second plate portion 103 and the driver chip 003, to avoid the design of the second plate portion 103 affecting the driver chip 003 and the display panel 002, and to ensure the yield of the second plate portion 103, the driver chip 003, and the display panel 002.

[0172] Figure 43 This is a partial cross-sectional schematic diagram of another display module provided in an embodiment of this application. (Reference) Figure 7 , Figure 12 , Figure 17 , Figure 22 , Figure 27 , Figure 32 , Figure 37 as well as Figure 43 The orthographic projection of the driver chip 003 onto the display panel 002 is located within the orthographic projection of the second cutout area L2 of the second board portion 103 of the circuit board 001 onto the display panel 002. Alternatively, it can be understood that the driver chip 003 is located within the second cutout area L2. In this case, a portion of the second board portion 103 is located on the side of the driver chip 003 closer to the gold finger portion 102, and another portion is located on the side of the driver chip 003 away from the gold finger portion 102.

[0173] In this embodiment, since the second board portion 103 of the circuit board 001 and the display panel 002 overlap in projection, they may collide with each other. Furthermore, since the driver chip 003 is located within the second cutout area L2, the sides of the driver chip 003 and the second cutout area L2 may also collide. Therefore, a certain safe distance is required between the driver chip 003 and the second board portion 103.

[0174] Optionally, to further improve the collision prevention of the second board portion 103, display panel 002, and driver chip 003, refer to Figure 43The display module 1000 also includes a third buffer section 006 (also referred to as a type film). The third buffer section 006 is located on the side of the first hollow area L1 and between the second plate portion 103 and the display panel 002. The third buffer section 006 can buffer the mutual collisions between the second plate portion 103 and the display panel 002, as well as the mutual collisions between the second plate portion 103 and the driver chip 003, to avoid the design of the second plate portion 103 affecting the driver chip 003 and the display panel 002, and to ensure the yield of the second plate portion 103, the driver chip 003, and the display panel 002.

[0175] refer to Figure 40 , Figure 42 and Figure 43 As can be seen, the display module 1000 also includes: cover plate 007, adhesive layer 008, polarizer (POL) layer 009, panel bottom film (U-film) 010, heat dissipation film 011, gasket 012 and bending protection layer 013.

[0176] Optionally, the cover plate 007 can be a glass cover (CG) 007, the adhesive layer 008 can be made of optical adhesive (OC), and the panel back film 010 (also called the panel back film) is used to protect the back side of the display panel 022. The panel back film 010 is bonded to the back side of the display panel 002 in the cutting process (EAC). The main function of the heat dissipation film 011 (surface conductive film, SCF) is for heat dissipation. The spacer 012 can be coated between the panel back film 010 on the bonding area of ​​the display panel 002 and the heat dissipation film 011 in the display area of ​​the display panel 002 to protect the display panel and also to adjust the bending stress of the bending area 002b1 of the display panel 002. The bending protection layer 013 can be located in the bending area 002b1 of the display panel 002 to protect the bending area 002b1 and ensure the bending reliability of the bending area 022b.

[0177] Optional, see reference Figure 40 , Figure 42 and Figure 43 It can be seen that the gold finger portion 102 of the circuit board 001 can be bonded to the bonding area 002b2 of the display panel 002 through anisotropic conductive film (ACF) 014.

[0178] In summary, this application provides a display module. The display module includes a circuit board comprising a first board body, a gold finger portion, a second board body, a touch chip, touch traces, and display traces. Since the distance between the first touch gold finger and the touch chip is relatively large, the first type of touch traces in the touch traces can be routed from the second board body to the side of the display gold finger furthest from the first touch gold finger before extending into the first board body, thus reducing the wiring length of the first type of touch traces on the first board body. Furthermore, since the distance between the second touch gold finger and the touch chip is relatively large, the wiring length of the second type of touch traces on the first board body will not be too long. That is, the wiring length of the touch traces on the first board body is relatively short. Therefore, through the wiring design of the display traces, the overlapping of the orthographic projections of the touch traces and the display traces can be avoided, thereby preventing interference between the display signals transmitted in the display traces and the touch signals transmitted in the touch traces, and improving the yield of the display module.

[0179] Figure 44 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. (Reference) Figure 44 The display device includes a power supply component 2000 and a display module 1000 as provided in the above embodiment. The power supply component 2000 is connected to the display module 1000 and is used to supply power to the display module 1000.

[0180] Optionally, the display device can be an organic light-emitting diode (OLED) display device. The display device can be any suitable display device, including but not limited to mobile phones, tablets, televisions, monitors, laptops, digital photo frames, car navigation systems, and e-readers, as well as any product or component with display functionality.

[0181] Since the display device can have essentially the same technical effects as the circuit board described in the previous embodiments, the technical effects of the circuit board will not be repeated here for the sake of brevity.

[0182] The terminology used in the embodiments section of this application is for explaining the embodiments of this application only and is not intended to limit this application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains.

[0183] The terminology used in the embodiments section of this application is for illustrative purposes only and is not intended to limit the application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in the patent application specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. The terms "connected," "linked," and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0184] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board, characterized in that, The circuit board includes: First plate section; The gold finger portion is located on one side of the first side of the first plate portion. The gold finger portion includes a plurality of first touch gold fingers, a plurality of display gold fingers, and a plurality of second touch gold fingers that are spaced apart along the extending direction of the first side. The plurality of display gold fingers are located between the plurality of first touch gold fingers and the plurality of second touch gold fingers. The second plate portion is located on the side of the gold finger portion away from the first side; A touch chip is located on the first board portion, and the distance between the touch chip and the plurality of second touch fingers is less than the distance between the touch chip and the plurality of first touch fingers; The touch traces include multiple first-type touch traces corresponding to the multiple first touch gold fingers, and multiple second-type touch traces corresponding to the multiple second touch gold fingers. One end of each first-type touch trace is connected to a first touch gold finger, and the other end of each first-type touch trace extends from the side of the multiple display gold fingers away from the multiple first touch gold fingers into the first board portion and is connected to the touch chip. The portion between the two ends of the first-type touch trace is located on the second board portion. One end of each second-type touch trace is connected to a second touch gold finger, and the other end is connected to the touch chip. The second-type touch trace is located on the first board portion. And display traces, the display traces are located on the first board portion, and the display traces are connected to the display gold fingers; The orthographic projections of the display traces on the first board portion and the orthographic projections of the touch traces on the first board portion do not overlap.

2. The circuit board according to claim 1, characterized in that, One end of the second plate portion is connected to the first region of the gold finger portion, and the other end of the second plate portion is connected to the second region of the gold finger portion. A first hollow area is formed between the two ends of the second plate portion and the gold finger portion. The first region is at least a portion of the area where the first touch gold finger is located, and the second region is at least a portion of the area where the second touch gold finger is located.

3. The circuit board according to claim 1, characterized in that, The second plate portion also has a second hollow area; A portion of the multiple first-type touch traces is located between the two ends of the first-type touch traces in the second plate portion on the first portion of the second hollow area near the first plate portion; Another portion of the plurality of first-type touch traces, the portion between the two ends of the first-type touch traces, is located on the second portion of the second cutout area in the second plate portion, away from the first plate portion.

4. The circuit board according to any one of claims 1 to 3, characterized in that, The circuit board also includes: A connecting plate portion is connected to the first plate portion, and the display trace is also located on the connecting plate portion; The connector is located on the side of the connecting plate portion away from the first plate portion and is connected to the display trace. The connector is also used to connect the power supply component of the display module.

5. The circuit board according to claim 4, characterized in that, The connecting plate portion is connected to the second side of the first plate portion, and the second side and the first side are two different sides of the first plate portion; or... The first plate portion has a third hollow area, and both the connecting plate portion and the connector are located within the third hollow area. The connecting plate portion and the side of the third hollow area are connected.

6. The circuit board according to claim 4, characterized in that, The shape of the orthographic projection of the connecting plate portion on the reference plane is rectangular, L-shaped, or curved. The reference plane is parallel to the surface of the connecting plate where the display traces are located.

7. The circuit board according to any one of claims 1 to 3, characterized in that, The first plate portion includes a first shielding layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer, and a second shielding layer stacked sequentially. The touch traces are located in the first conductive layer, and the display traces are located in the second conductive layer; The circuit board also includes ground portions located in the first conductive layer and the second conductive layer, wherein the ground portion located in the first conductive layer is spaced apart from the touch trace, and the ground portion located in the second conductive layer is spaced apart from the display trace.

8. The circuit board according to claim 7, characterized in that, The grounding portion located in the first conductive layer is connected to the first shielding layer through a via in the first insulating layer, and the grounding portion located in the second conductive layer is connected to the second shielding layer through a via in the third insulating layer.

9. The circuit board according to claim 7, characterized in that, The second plate portion includes a third shielding layer, a fourth insulating layer, a third conductive layer, a fifth insulating layer, and a fourth shielding layer; the gold finger portion includes a fourth conductive layer and a sixth insulating layer; The first type of touch trace is also located in the third conductive layer, and the first touch gold finger, the plurality of display gold fingers and the plurality of second touch gold fingers are all located in the fourth conductive layer; The third conductive layer and the fourth conductive layer are both located in the same layer as the first conductive layer.

10. The circuit board according to claim 9, characterized in that, The second plate portion also includes a fifth conductive layer and a seventh insulating layer located between the fifth insulating layer and the fourth shielding layer; The grounding part is also located in the fifth conductive layer, and the fifth conductive layer and the second conductive layer are in the same layer.

11. A display module, characterized in that, The display module includes: a display panel, a driver chip, and a circuit board as described in any one of claims 1 to 10; The display panel has a display area and a peripheral area surrounding the display area. The peripheral area includes a bending area and a bonding area, wherein the bending area is closer to the display area relative to the bonding area. The driver chip is located between the bending area and the bonding area, and is connected to the display panel; The gold finger portion of the circuit board is connected to the bonding area of ​​the display panel, and the first board portion of the circuit board is further away from the bending area relative to the second board portion.

12. The display module according to claim 11, characterized in that, The driver chip is located on the side of the second board portion of the circuit board away from the gold finger portion.

13. The display module according to claim 12, characterized in that, The display module further includes: a first buffer section; The first buffer portion is located on the side of the second plate portion near the driving chip, and is located between the second plate portion and the display panel.

14. The display module according to claim 11, characterized in that, The orthographic projection of the driver chip on the display panel is located within the first cutout area between the second and first plate portions of the circuit board on the display panel.

15. The display module according to claim 14, characterized in that, The display module further includes: a second buffer section; The first buffer portion is located on the side of the first hollow area of ​​the second plate portion, and is located between the second plate portion and the display panel.

16. The display module according to claim 11, characterized in that, The orthographic projection of the driver chip on the display panel is located within the second cutout area of ​​the second plate portion of the circuit board on the display panel.

17. The display module according to claim 16, characterized in that, The display module further includes: a third buffer section; The third buffer section is located on the side of the second hollow area of ​​the second plate part, and is located between the second plate part and the display panel.

18. A display device, characterized in that, The display device includes: a power supply component, and a display module as described in any one of claims 11 to 17; The power supply component is connected to the display module and is used to supply power to the display module.

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