Temperature self-adaptive adjusting method and system of eMMC memory
By monitoring the temperature change rate of the eMMC memory in real time and adjusting the voltage, frequency, and signal timing in stages, the problem of insufficient performance and reliability of eMMC memory under extreme temperatures is solved, achieving higher operational reliability and stability.
Patent Information
- Application Number
- CN202511815029.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-04
- Publication Date
- 2026-03-24
AI Technical Summary
Existing eMMC memories suffer from insufficient performance and reliability when operating at extreme temperatures. They lack real-time adaptive adjustment mechanisms, leading to problems such as signal latch position offset, insufficient data retention time, high bit error rate, and abnormal power supply ripple.
By monitoring the rate of temperature change in real time through temperature sensors and ADC modules, voltage, frequency, IO drive capability, and signal timing are adjusted in segments. Combined with diagnostic testing and a fast response mechanism, the parameters are adaptively adjusted to prevent thermal shock damage.
This improves the reliability and performance stability of eMMC memory over a wide temperature range, reduces high-temperature failure rate and low-temperature data error rate, extends temperature cycle life, and achieves the best balance between performance and power consumption.