Manufacturing method of display panel, display panel and electronic equipment

Abstract

The invention provides a manufacturing method of a display panel, the display panel and electronic equipment, and relates to the technical field of display panels, and the method comprises the steps that a driving backboard is provided, and one side of the driving backboard comprises at least one bonding pad; an insulating layer is formed on the side, provided with the bonding pad, of the driving backboard; forming a first groove exposing the bonding pad and at least one second groove adjacent to the first groove on the insulating layer; transferring the light-emitting device into the second groove, wherein at least one pin of the light-emitting device is located on the side, away from the driving backboard, of the light-emitting device; and forming a connecting layer which extends into the first groove from one side, far away from the driving back plate, of the light-emitting device, and connecting the pin and the bonding pad of the light-emitting device by the connecting layer, so that the light-emitting device can be transferred into the second groove in a mass transfer process, and the transfer success rate of the light-emitting device is improved. The pins of the light-emitting device are arranged on the side far away from the driving back plate, so that the bonding cost can be reduced, and the transfer yield can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display panels, in particular to a display panel manufacturing method, a display panel and an electronic device. BACKGROUND

[0002] With the development of display device manufacturing technology, mini light emitting devices (Mini LED) and micro light emitting devices (Micro-LED) are widely used because of their advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability.

[0003] However, the transfer yield is low and the transfer cost is high when performing massive transfer of Mini LED or Micro-LED. SUMMARY

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a display panel manufacturing method, which comprises:

[0005] A driving backplate is provided, one side of the driving backplate comprising at least one pad;

[0006] An insulating layer is formed on the side of the driving backplate provided with the pad;

[0007] A first groove exposing the pad and at least one second groove adjacent to the first groove are formed on the insulating layer;

[0008] A light emitting device is transferred into the second groove, at least one pin of the light emitting device being located on the side of the light emitting device away from the driving backplate;

[0009] A connecting layer extending from the side of the light emitting device away from the driving backplate to the first groove is formed, the connecting layer connecting the pin of the light emitting device and the pad.

[0010] In one possible implementation, the step of forming a first groove exposing the pad and at least one second groove adjacent to the first groove on the insulating layer comprises:

[0011] The insulating layer is etched to form the first groove and the second groove, wherein the first groove adjacent to the first side wall of the second groove comprises a first end close to the driving backplate and a second end away from the driving backplate, and the orthographic projection of the first end on the driving backplate is located on the side of the orthographic projection of the second end on the driving backplate close to the first groove.

[0012] In a possible implementation, the step of forming the connection layer extending from the side of the light emitting device away from the driving backboard into the first recess comprises:

[0013] forming the connection layer extending from the side of the light emitting device away from the driving backboard along the first sidewall into the first recess.

[0014] In a possible implementation, the angle range of the first sidewall is 50°-70°.

[0015] In a possible implementation, the step of etching the insulating layer to form the first recess and the second recess comprises:

[0016] adopting a half-tone mask to etch the insulating layer to form the first recess and the second recess;

[0017] wherein at least part of the first recess corresponds to a half-transparent area of the half-tone mask.

[0018] In a possible implementation, before the step of forming the insulating layer on the side of the driving backboard provided with the pads, the method further comprises:

[0019] forming a reflective layer on the side of the driving backboard provided with the pads;

[0020] Preferably, the material of the reflective layer comprises indium tin oxide-silver-indium tin oxide.

[0021] the step of forming the first recess exposing the pads and at least one second recess adjacent to the first recess on the insulating layer comprises:

[0022] the step of forming the first recess exposing the pads and at least one second recess adjacent to the first recess and exposing the reflective layer on the insulating layer.

[0023] In a possible implementation, after the step of forming the connection layer extending from the side of the light emitting device away from the driving backboard into the first recess, the method further comprises:

[0024] forming a protective layer on the side of the connection layer away from the driving backboard.

[0025] In a possible implementation, the step of forming the connection layer extending from the side of the light emitting device away from the driving backboard into the first recess comprises:

[0026] A layer of transparent conductive material is formed on the side of the light emitting device and the insulating layer away from the driving backboard, and the layer of transparent conductive material is etched to form a connecting layer extending from the side of the light emitting device away from the driving backboard into the first recess;

[0027] Preferably, the material of the connecting layer comprises indium tin oxide.

[0028] In a possible implementation, the material of the insulating layer comprises an opaque material.

[0029] Another object of the present application is to provide a display panel manufactured by the manufacturing method of the display panel.

[0030] Compared with the prior art, the present application has the following beneficial effects:

[0031] The embodiments of the present application provide a manufacturing method of a display panel, a display panel and an electronic device. The light emitting device is transferred into the second recess in the process of mass transfer, so that the transfer success rate of the light emitting device is improved. In addition, the pin of the light emitting device is arranged on the side away from the driving backboard, so that the pin of the light emitting device is directly electrically connected with the pad by using the connecting layer, thereby reducing the bonding cost and improving the transfer yield. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0033] Figure 1 A flowchart of the manufacturing method of the display panel provided by the embodiments of the present application is shown in the figure;

[0034] Figure 2 A structure diagram of the insulating layer provided by the embodiments of the present application is shown in the figure;

[0035] Figure 3 A structure diagram of the first recess and the second recess provided by the embodiments of the present application is shown in the figure;

[0036] Figure 4 A structure diagram of the first recess and the second recess provided by the embodiments of the present application is shown in the figure;

[0037] Figure 5 A placement diagram of the light emitting device provided by the embodiments of the present application is shown in the figure;

[0038] Figure 6This is one of the structural schematic diagrams of the display panel provided in the embodiments of this application;

[0039] Figure 7 This is a second schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0040] Figure 8 Schematic diagrams of the first and second sidewalls provided in the embodiments of this application;

[0041] Figure 9 This is the third schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0042] Figure 10 Fourth schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0043] Figure 11 Fifth schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0044] Figure 12 One of the top views of the display panel provided in the embodiments of this application;

[0045] Figure 13 A second top view of the display panel provided in an embodiment of this application;

[0046] Figure 14 This application provides a second schematic diagram of the insulating layer structure.

[0047] Icons: 100 - Driver backplane; 110 - Pad; 200 - Insulating layer; 210 - First groove; 220 - Second groove; 201 - First sidewall; 300 - Light-emitting device; 310 - Pin; 400 - Connection layer; 500 - Reflective layer; 600 - Protective layer. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0049] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0050] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0051] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0052] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0053] The inventors discovered that during mass transfer, bonding of light-emitting devices (such as Mini LEDs or Micro-LEDs) to a driver backplane is required. Since the driver backplane has a large number of small pads, the transfer of light-emitting devices (such as Mini LEDs or Micro-LEDs) to the driver backplane may lead to increased bonding costs and reduced transfer yield.

[0054] Currently, anisotropic conductive film (ACF) or metal is commonly used for bonding light-emitting devices (such as Mini LEDs or Micro-LEDs) to the driver backplane. However, using anisotropic conductive film for bonding is costly and can easily lead to separation of the light-emitting device from the pads. Using metal for bonding reduces transfer yield and results in insufficient process precision.

[0055] In view of this, this embodiment provides a solution that can solve the above problems. The specific implementation of this application will be described in detail below with reference to the accompanying drawings.

[0056] Please refer to Figure 1 , Figure 1 Example: A flowchart illustrating the manufacturing method of the display panel provided in this embodiment. The manufacturing method of the display panel may include the following steps.

[0057] Step S110: A drive backplane 100 is provided, one side of which includes at least one pad 110.

[0058] In this embodiment, the driving backplane 100 may include multiple film layer structures, such as a substrate, a buffer layer, an active layer, multiple metal layers, multiple insulating layers, and a planarization layer. One side of the driving backplane 100 may include one or more pads 110, wherein two oppositely arranged pads 110 may form a pad group, and the two pads 110 of a pad group may be a P electrode and an N electrode, respectively.

[0059] In step S120, an insulating layer 200 is formed on the side of the drive backplate 100 where the pads 110 are provided.

[0060] In this embodiment, please refer to Figure 2 An insulating layer 200 that completely covers the driving backplate 100 can be formed on the side of the driving backplate 100 where the pads 110 are provided. The thickness of the insulating layer 200 can be less than or equal to the thickness of the light-emitting device 300.

[0061] In some cases, when the thickness of the light-emitting device 300 is 10 micrometers, the thickness of the insulating layer 200 can be less than or equal to 10 micrometers.

[0062] In step S130, a first groove 210 is formed on the insulating layer 200 to expose the pad 110 and at least one second groove 220 adjacent to the first groove 210.

[0063] In this embodiment, please refer to Figure 3 The insulating layer 200 that completely covers the drive backplane 100 can be etched to form a first groove 210 that exposes the pads 110 and a second groove 220 adjacent to the first groove 210. The second groove 220 can be used to place the light-emitting device 300, and the size of the second groove 220 can be greater than or equal to the size of the light-emitting device 300.

[0064] Specifically, please refer to Figure 4 The first groove 210 can be adjacent to two oppositely arranged second grooves 220. The orthographic projection of the first groove 210 and the second groove 220 on the drive back plate 100 can both be rectangular. The extension direction of the first groove 210 can be perpendicular to the extension direction of the second groove 220.

[0065] In step S140, the light-emitting device 300 is transferred into the second groove 220, and at least one pin 310 of the light-emitting device 300 is located on the side of the light-emitting device 300 away from the driving backplate 100.

[0066] In this embodiment, please refer to Figure 5Mass transfer technology can be used to transfer multiple light-emitting devices 300 into multiple second grooves 220 respectively. At least one pin 310 of the multiple light-emitting devices 300 can be located on the side of the light-emitting device 300 away from the driving backplate 100. In this way, the second grooves 220 can fix the light-emitting devices 300 after transfer, reduce the possibility of misalignment of the light-emitting devices 300 after transfer, and thus improve the transfer success rate.

[0067] In addition, after the light-emitting device 300 is transferred into the second groove 220, the light-emitting device 300 can be inspected and repaired.

[0068] In step S150, a connection layer 400 is formed extending from the side of the light-emitting device 300 away from the driving backplate 100 into the first groove 210, the connection layer 400 connecting the pin 310 of the light-emitting device 300 and the pad 110.

[0069] In this embodiment, please refer to Figure 6 A thin film can be deposited on the surfaces of the light-emitting device 300 and the pad 110 using a plasma process and a physical vapor deposition (PVD) device to form a connection layer 400. The connection layer 400 can be used to realize the electrical connection between the pin 310 of the light-emitting device 300 and the pad 110. Furthermore, forming the connection layer 400 using a plasma process can improve the adhesion between the connection layer 400 and the pad 110.

[0070] In the above design, by setting a second groove in the insulating layer, the light-emitting device can be transferred into the second groove during the mass transfer process, thereby improving the transfer success rate of the light-emitting device. In addition, by setting the pins of the light-emitting device on the side away from the driving backplane, the pins of the light-emitting device can be directly electrically connected to the pads using the connection layer, thereby reducing bonding costs and improving transfer yield.

[0071] In one possible implementation, please refer to Figure 7 In step S130, when forming a first groove 210 exposing the pad 110 and at least one second groove 220 adjacent to the first groove 210 on the insulating layer 200, the insulating layer 200 can be etched to form the first groove 210 and the second groove 220. The first sidewall 201 of the first groove 210 near the second groove 220 includes a first end 201a near the drive back plate 100 and a second end 201b away from the drive back plate 100. The orthographic projection of the first end 201a on the drive back plate 100 is located on the side of the orthographic projection of the second end 201b on the drive back plate 100 that is close to the first groove 210.

[0072] In this embodiment, please refer to Figure 8The insulating layer 200 located between the first groove 210 and the second groove 220 may include a first sidewall 201 facing the first groove 210 and a second sidewall 202 disposed away from the driving backplate 100. The connecting layer 400 may extend into the first groove 210 along the second sidewall 202 and the first sidewall 201. The second sidewall 202 may extend in a direction parallel to the driving backplate 100. The first sidewall 201 may extend obliquely in the direction from the light-emitting device 300 to the first groove 210, so that the opening width of the first groove 210 on the side close to the driving backplate 100 is smaller than the opening width of the first groove 210 on the side away from the driving backplate 100.

[0073] In step S150, when forming the connecting layer 400 extending from the side of the light-emitting device 300 away from the driving back plate 100 into the first groove 210, the connecting layer 400 extending from the side of the light-emitting device 300 away from the driving back plate 100 along the first sidewall 201 into the first groove 210 can be formed.

[0074] In this embodiment, a connection layer 400 can be formed extending from the side of the light-emitting device 300 away from the driving backplate 100 along the second sidewall 202 and the first sidewall 201 into the first groove 210. The connection layer 400 can completely cover the pin 310 of the light-emitting device 300 and the pad 110 connected to the pin 310. The connection layer 400 can be used to realize the electrical connection between the pin 310 and the pad 110.

[0075] In the above structure, by setting the first sidewall 201 to extend obliquely along the direction from the light-emitting device 300 to the first groove 210, the continuity of the connection layer 400 can be ensured, so that the pin 310 of the light-emitting device 300 can be electrically connected to the pad 110.

[0076] In one possible implementation, the tilt angle of the first sidewall 201 is in the range of 50°-70°.

[0077] In this embodiment, when the first sidewall 201 is a slope, the angle between the straight line extending in the direction of the first sidewall 201 and the straight line extending in the direction of the drive backplate 100 can be 50°-70°. In this way, the connection layer 400 can be prevented from breaking, and the pins 310 of the light-emitting device 300 can be connected to the pads 110 through the connection layer 400.

[0078] In one possible implementation, when etching the insulating layer 200 to form the first groove 210 and the second groove 220, a halftone mask (HTM) can be used to etch the insulating layer 200 to form the first groove 210 and the second groove 220. At least a portion of the first groove 210 corresponds to a semi-transparent area of ​​the halftone mask. Optionally, the second groove 220 may correspond to a fully transparent area of ​​the halftone mask, and the portion between the first groove 210 and the second groove 220 may correspond to an opaque area of ​​the halftone mask.

[0079] In this embodiment, the locations of the insulating layer 200 that need to be etched can be exposed, and different etching depths can be determined according to the exposure time and intensity. For example, the exposure time and exposure amount can be the longest at the locations where the first groove 210 and the second groove 220 are formed, while the exposure time and exposure amount can be the shortest at the locations where the first sidewall 201 is formed. Locations that do not need to be etched can be left unexposed.

[0080] In one possible implementation, please refer to Figure 9 Before forming an insulating layer 200 on the side of the drive backplate 100 where the pads 110 are provided, a reflective layer 500 may also be formed on the side of the drive backplate 100 where the pads 110 are provided.

[0081] In this embodiment, a reflective material that completely covers the driving backplate 100 can be coated on the side of the driving backplate 100 where the pads 110 are provided, and then the reflective material is etched to form a reflective layer 500 at the position where the light-emitting device 300 needs to be placed.

[0082] The material of the reflective layer 500 can be titanium-aluminum-titanium. To improve the reflectivity, the material of the reflective layer 500 is preferably indium tin oxide-silver-indium tin oxide.

[0083] When forming a first groove 210 exposing the pad 110 and at least one second groove 220 adjacent to the first groove 210 on the insulating layer 200, the first groove 210 exposing the pad 110 and at least one second groove 220 adjacent to the first groove 210 and exposing the reflective layer 500 can be formed on the insulating layer 200.

[0084] In this embodiment, when the light-emitting device 300 is placed in the second groove 220, the light-emitting surface of the light-emitting device 300 faces upward, the reflective layer 500 can be located directly below the light-emitting device 300, the orthogonal projection of the emitting layer on the driving back plate 100 can completely cover the orthogonal projection of the light-emitting device 300 on the driving back plate 100, and the orthogonal projection area of ​​the emitting layer on the driving back plate 100 can be greater than or equal to the orthogonal projection area of ​​the light-emitting device 300 on the driving back plate 100.

[0085] In the above design, by setting a reflective layer 500 on the side of the light-emitting device 300 away from the light-emitting surface, the amount of light emitted by the light-emitting device 300 can be increased, thereby improving the display effect of the display panel.

[0086] In one possible implementation, please refer to Figure 10 After forming the connecting layer 400 extending from the side of the light-emitting device 300 away from the driving backplate 100 into the first groove 210, a protective layer 600 may also be formed on the side of the connecting layer 400 away from the driving backplate 100.

[0087] In this embodiment, an insulating material can be deposited on the side of the connecting layer 400 away from the driving backplate 100 to form a protective layer 600. The protective layer 600 can completely cover the insulating layer 200 and the connecting layer 400 on one side of the driving backplate 100. For example, the material of the protective layer 600 can be PVX material, which is a thermoplastic material based on polyvinyl chloride. PVX material can protect the connecting layer 400, effectively preventing external water and oxygen from contacting the connecting layer 400 and improving the reliability of the display panel.

[0088] In one possible implementation, when forming the connection layer 400 extending from the side of the light-emitting device 300 away from the driving backplate 100 into the first groove 210, a transparent conductive material layer can be formed on the side of the light-emitting device 300 and the insulating layer 200 away from the driving backplate 100, and the transparent conductive material layer is etched to form the connection layer 400 extending from the side of the light-emitting device 300 away from the driving backplate 100 into the first groove 210.

[0089] In this embodiment, a physical vapor deposition (PVD) device can be used to deposit a thin film on the side of the light-emitting device 300 and the insulating layer 200 away from the driving backplate 100 to form a transparent conductive material layer. By etching the transparent conductive material layer, a connection layer 400 can be formed extending from the side of the light-emitting device 300 away from the driving backplate 100 into the first groove 210. The connection layer 400 can be used to connect a pin 310 of the light-emitting device 300 and a pad 110.

[0090] When etching the transparent conductive material layer, either a dry etching process or a wet etching process can be used. In this embodiment, the dry etching process is preferred.

[0091] In the above design, by depositing a thin film on the surface of the light-emitting device 300 and the pad 110 to form a transparent conductive material layer, and then etching to form a connection layer 400 for connecting the pin 310 of the light-emitting device 300 and the pad 110, the process cost can be reduced and the transfer yield can be improved.

[0092] Preferably, the material of the connecting layer 400 may include indium tin oxide (ITO), which is a transparent conductive oxide with excellent transparency. It can improve the light output efficiency of the light-emitting device 300 while realizing the electrical connection between the light-emitting device 300 and the pad 110.

[0093] It should be noted that the material of the connecting layer 400 can also be other conductive materials, such as copper, titanium-aluminum-titanium three-layer structure, etc., without specific limitations.

[0094] In one possible implementation, the material of the insulating layer 200 may include an opaque material. For example, the insulating layer 200 may be formed by printing with black ink or by using materials such as black resin. The insulating layer 200, i.e., the black matrix (BM), is formed on one side of the drive backplate 100. In this way, the light emitted by the light-emitting device 300 can be absorbed, effectively reducing light reflection, improving the black state of the package, and also avoiding light interference between the light-emitting devices 300.

[0095] This embodiment also provides a display panel, which is manufactured using the method described in this embodiment. Please refer again to... Figure 6 , Figure 6 This embodiment provides a schematic structural diagram of a display panel. In this embodiment, the display panel may include a driving backplane 100, pads 110, an insulating layer 200, a light-emitting device 300, and a connecting layer 400. The light-emitting device 300 may be a Micro-LED or Mini LED chip. In this embodiment, the size of the light-emitting device 300 is not specifically limited.

[0096] The number of pads 110 can be one or more, and the pads 110 can be located on one side of the drive backplane 100.

[0097] In this embodiment, two oppositely arranged pads 110 can be arranged into a pad group. Optionally, the two pads 110 in the same pad group can both be rectangular in shape, and have the same size and shape. The material of the pads 110 can be metal.

[0098] Please refer to this again. Figure 4 The insulating layer 200 may be located on one side of the drive backplate 100. The insulating layer 200 may include a first groove 210 exposing the pad 110 and at least one second groove 220 adjacent to the first groove 210.

[0099] In this embodiment, the size and shape of the first groove 210 can be the same as the size and shape of the pad 110, and the size and shape of the second groove 220 can be the same as the size and shape of the light-emitting device 300. The depth of the second groove 220 can be less than the thickness of the insulating layer 200, and the second groove 220 may not expose the driving substrate. The shapes of both the first groove 210 and the second groove 220 can be rectangular, and the extension direction of the first groove 210 can be perpendicular to the extension direction of the second groove 220. One second groove 220 can be located between two adjacent pad groups, and the second groove 220 can be used to fix the light-emitting device 300 to prevent the light-emitting device 300 from shifting.

[0100] It should be noted that the size of the second groove 220 can be larger than the size of the light-emitting device 300. In this way, if a deviation occurs during the transfer of the light-emitting device 300, the electrical connection between the light-emitting device 300 and the pad 110 can still be achieved, thus improving the yield.

[0101] The light-emitting device 300 can be disposed in the second groove 220, and the pin 310 of the light-emitting device 300 is located on the side of the light-emitting device 300 away from the driving back plate 100.

[0102] In this embodiment, the insulating layer 200 may include a plurality of second grooves 220, each of which accommodates a plurality of light-emitting devices 300. The side of the light-emitting device 300 away from the driving backplate 100 is the light-emitting surface, and the pins 310 of the light-emitting device 300 are also located on the side away from the driving backplate 100.

[0103] The light-emitting device 300 may include a first-color light-emitting device, a second-color light-emitting device, and a third-color light-emitting device. The first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device may be different from each other. For example, the light-emitting colors of the first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device may be one of red, green, and blue, respectively.

[0104] Please refer to this again. Figure 6 The connection layer 400 can extend from the side of the light-emitting device 300 away from the driving backplate 100 into the first groove 210, and the connection layer 400 can connect the pin 310 and the pad 110 of the light-emitting device 300.

[0105] In this embodiment, the orthographic projection of the connection layer 400 on the driving backplate 100 can completely cover the orthographic projections of the pins 310 and pads 110 of the light-emitting device 300 on the driving backplate 100. The connection layer 400 can extend from the pins 310 of the light-emitting device 300 away from the driving backplate 100 through the sidewall of the insulating layer 200 away from the driving backplate 100 into the first groove 210, realizing the electrical connection between the pins 310 of the light-emitting device 300 and the pads 110. Specifically, one light-emitting device 300 can be connected to two pads 110 respectively through two connection layers 400.

[0106] In the above structure, by providing a second groove 220 in the insulating layer 200, the light-emitting device 300 can be transferred into the second groove 220 during the mass transfer process, thereby improving the transfer success rate of the light-emitting device 300. In addition, by setting the pins 310 of the light-emitting device 300 on the side away from the driving backplate 100, the pins 310 of the light-emitting device 300 can be directly electrically connected to the pads 110 using the connection layer 400, thereby reducing bonding costs and improving transfer yield.

[0107] In one possible implementation, the insulating layer 200 may include a first sidewall 201 located at least partially between the first groove 210 and the second groove 220 and facing the second groove 220. The first sidewall 201 may include a first end 201a near the drive back plate 100 and a second end 201b away from the drive back plate 100. The orthographic projection of the first end 201a on the drive back plate 100 is located on the side of the orthographic projection of the second end 201b on the drive back plate 100 near the first groove 210.

[0108] In one possible implementation, please refer again. Figure 7 The insulating layer 200 may further include a second sidewall 202 located between the first groove 210 and the second groove 220 and away from the drive backplate 100. The connecting layer 400 may extend along the first sidewall 201 and the second sidewall 202 into the first groove 210. The second sidewall 202 may be a plane, and the first sidewall 201 may be a slope. In the extending direction of the second groove 220, the length of the first sidewall 201 may be greater than the length of the second groove 220. The first sidewall 201 may extend directly into the first groove 210, such that the opening width of the first groove 210 on the side near the drive backplate 100 is smaller than the opening width of the first groove 210 on the side away from the drive backplate 100.

[0109] In another possible implementation, please refer to Figure 11The insulating layer 200 may also include a second sidewall 202 located between the first groove 210 and the second groove 220 and away from the drive backplate 100. The connecting layer 400 may extend along the first sidewall 201 and the second sidewall 202 into the first groove 210. The second sidewall 202 may be a plane, and the shape of the first sidewall 201 may be stepped. In the extension direction of the second groove 220, the length of the first sidewall 201 may be greater than the length of the second groove 220. The first sidewall 201 may extend directly into the first groove 210, so that the opening width of the first groove 210 on the side close to the drive backplate 100 is smaller than the opening width of the first groove 210 on the side away from the drive backplate 100.

[0110] In the above structure, by setting the first sidewall 201 of the insulating layer 200 toward the first groove 210 as a slope or step, the continuity of the connection layer 400 can be ensured, so that the pin 310 of the light-emitting device 300 can be electrically connected to the pad 110.

[0111] It should be noted that the first sidewall 201 can also be of other shapes, as long as the continuity of the connecting layer 400 can be guaranteed, and no specific limitation is made here.

[0112] In one possible implementation, the light-emitting device 300 may include two pins 310 located on the side of the light-emitting device 300 away from the driving backplane 100, and the two pins 310 may be connected to two different pads 110 through different connection layers 400 respectively.

[0113] In this embodiment, the two pins 310 of the light-emitting device 300 can be electrically connected to the two pads 110 through two connection layers 400 respectively. The two pins 310 of the light-emitting device 300 can be positive electrodes and negative electrodes respectively. The two pads 110 connected to the two pins 310 of the light-emitting device 300 can be P electrodes and N electrodes respectively. The positive electrode of the light-emitting device 300 can be electrically connected to the P electrode through one connection layer 400, and the negative electrode of the light-emitting device 300 can be electrically connected to the N electrode through another connection layer 400.

[0114] In one possible implementation, the orthographic projections of the two pads 110, which are respectively connected to the two pins 310 of the light-emitting device 300, on the drive backplane 100 are located on the same side of the orthographic projection of the light-emitting device 300 on the drive backplane 100.

[0115] In this embodiment, please refer to Figure 12The display panel may include multiple light-emitting devices 300, which may be arranged into multiple light-emitting device rows and multiple light-emitting device columns. In the multiple light-emitting device rows, the pads 110 located between two adjacent light-emitting devices 300 may be on the same straight line as the pins 310 of the adjacent light-emitting device 300. Two oppositely arranged pads 110 may be arranged into a pad group. The two pads 110 of a pad group may be connected to the two pins 310 of the same light-emitting device 300 respectively. The two pads 110 of the same pad group may be located on the same side of the light-emitting device 300 to which they are connected. At this time, the multiple connection layers 400 may be arranged in an array.

[0116] Please refer to this again. Figure 7 When two pads 110 of the same pad group are respectively connected to two pins 310 of the same light-emitting device 300, and the first sidewall 201 is a slope, the insulating layer 200 may include a first sidewall 201 located between the first groove 210 and the second groove 220 and facing the first groove 210. At this time, a first sidewall 201 located between the first groove 210 and the second groove 220 may be included between two adjacent light-emitting devices 300.

[0117] In another possible implementation, please refer to Figure 13 The display panel may include multiple light-emitting devices 300, which may be arranged in multiple rows and columns. In the multiple rows, the pads 110 located between two adjacent light-emitting devices 300 may be on the same straight line as the pins 310 of the adjacent light-emitting devices 300. Two oppositely arranged pads 110 may be arranged into a pad group. The two pads 110 of the same pad group may be located between two adjacent light-emitting devices 300 and connected to the two light-emitting devices 300 respectively. For example, the P electrode of a pad group may be connected to the positive electrode of an adjacent light-emitting device 300, and the N electrode may be connected to the negative electrode of another adjacent light-emitting device 300.

[0118] Please refer to Figure 14 When two pads 110 of the same pad group are respectively connected to two adjacent light-emitting devices 300, and the first sidewall 201 is inclined, the insulating layer 200 may include a first sidewall 201 located between any first groove 210 and second groove 220 and facing the first groove 210. At this time, two first sidewalls 201 located between the first groove 210 and second groove 220 may be included between two adjacent light-emitting devices 300.

[0119] It should be noted that, depending on different needs, the pad 110 can be set in different positions relative to the light-emitting device 300, as long as the pin 310 of the light-emitting device 300 can be connected to the pad 110 through the connection layer 400.

[0120] This embodiment also provides an electronic device, which may include the display panel provided in this embodiment or a display panel manufactured by the above method. The electronic device may include devices with display functions such as monitors, video wall displays, mobile phones, tablets, laptops, and televisions.

[0121] In summary, the embodiments of this application provide a method for manufacturing a display panel, a display panel, and an electronic device. By providing a second groove in the insulating layer, the light-emitting device can be transferred into the second groove during the mass transfer process, thereby improving the transfer success rate of the light-emitting device. In addition, by setting the pins of the light-emitting device on the side away from the driving backplate, the pins of the light-emitting device can be directly electrically connected to the pads using the connection layer, thereby reducing bonding costs and improving the transfer yield.

[0122] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The method includes: A drive backplane is provided, one side of which includes at least one pad; An insulating layer is formed on the side of the drive backplate where the solder pads are located; A first groove exposing the pads and at least one second groove adjacent to the first groove are formed on the insulating layer; The light-emitting device is transferred into the second groove, with at least one pin of the light-emitting device located on the side of the light-emitting device away from the driving backplate; A connection layer is formed extending from the side of the light-emitting device away from the driving backplate into the first groove, the connection layer connecting the pins and pads of the light-emitting device.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming a first recess on the insulating layer that exposes the pads and at least one second recess adjacent to the first recess includes: The insulating layer is etched to form the first groove and the second groove, wherein the first sidewall of the first groove near the second groove includes a first end near the drive back plate and a second end away from the drive back plate, and the orthographic projection of the first end on the drive back plate is located on the side of the orthographic projection of the second end on the drive back plate near the first groove.

3. The method for manufacturing a display panel according to claim 1 or 2, characterized in that, The step of forming a connection layer extending from the side of the light-emitting device away from the driving backplate into the first groove includes: A connecting layer is formed extending from the side of the light-emitting device away from the driving backplate along the first sidewall into the first groove.

4. The method for manufacturing a display panel according to claim 2, characterized in that, The inclination angle of the first sidewall ranges from 50° to 70°.

5. The method for manufacturing a display panel according to claim 2, characterized in that, The step of etching the insulating layer to form the first groove and the second groove includes: The insulating layer is etched using a halftone mask to form the first groove and the second groove; At least a portion of the first groove corresponds to a semi-transparent area of ​​the halftone mask.

6. The method for manufacturing a display panel according to claim 1, characterized in that, Before the step of forming an insulating layer on the side of the drive backplate where the pads are located, the method further includes: A reflective layer is formed on the side of the drive backplate where the pads are located; Preferably, the material of the reflective layer includes indium tin oxide-silver-indium tin oxide; The step of forming a first recess on the insulating layer that exposes the pads and at least one second recess adjacent to the first recess includes: A first groove exposing the pads and at least one second groove adjacent to the first groove and exposing the reflective layer are formed on the insulating layer.

7. The method for manufacturing a display panel according to claim 1, characterized in that, After the step of forming a connection layer extending from the side of the light-emitting device away from the driving backplate into the first groove, the method further includes: A protective layer is formed on the side of the connection layer away from the drive backplate.

8. The method for manufacturing a display panel according to claim 1, characterized in that, The step of forming a connection layer extending from the side of the light-emitting device away from the driving backplate into the first groove includes: A transparent conductive material layer is formed on the side of the light-emitting device and the insulating layer away from the driving back plate, and the transparent conductive material layer is etched to form a connection layer extending from the side of the light-emitting device away from the driving back plate into the first groove. Preferably, the material of the connecting layer includes indium tin oxide.

9. The method for manufacturing a display panel according to claim 1, characterized in that, The insulating layer is made of an opaque material.

10. A display panel, characterized in that, The display panel is manufactured by the method of manufacturing the display panel according to any one of claims 1-9.

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