Single-sided integrated packaging structure of LED module and display device

Abstract

The invention relates to a single-sided integrated packaging structure of an LED module and a display device. The single-sided integrated packaging structure of the LED module comprises a substrate, at least one LED lamp bead is arranged on the substrate, a driving IC is arranged on the substrate, the driving IC and the LED lamp bead are located on the same face of the substrate, the driving IC is electrically connected with the LED lamp bead, and one driving IC controls at least one LED lamp bead; the substrate is further provided with a VCC port and a GND port, the VCC port and the GND port are both electrically connected to the driving IC, and the VCC port is configured to supply power to the driving IC and transmit signals. The LED lamp beads and the driving IC are arranged on the same face of the substrate, the single-face design of the module is achieved, the manufacturing process is simplified, the production cost is reduced, meanwhile, the thickness of the module is reduced, and the heat dissipation performance is improved; power supply and signal transmission of the driving IC can be realized through the VCC port and the GND port, and the utilization rate of the IO port is greatly improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a single-sided integrated packaging structure for an LED module and a display device. Background Technology

[0002] With the development of display technology, the market demand for ultra-thin and highly reliable LED modules continues to increase.

[0003] In related technologies, LED modules currently typically employ a double-sided arrangement structure, where LED chips are mounted on the front of the module, and driver ICs and related capacitors, resistors, and other components are mounted on the back. While this design can meet basic display requirements, it still has shortcomings in terms of thickness control, heat dissipation performance, and assembly process.

[0004] In traditional double-sided layouts, the larger number of components on the back increases the overall thickness of the module, hindering product thinning and lightness. Simultaneously, these back-side components can impede the bonding between the module and the system's heat dissipation substrate, reducing heat dissipation efficiency and leading to excessively high localized temperatures, affecting component consistency and lifespan. Furthermore, double-sided layouts require double-sided SMT processes, increasing manufacturing complexity and cost, and are prone to stress concentration during assembly, impacting module reliability. Finally, in terms of signal transmission, conventional three-input or four-input methods are relatively wasteful of resources.

[0005] Therefore, it is necessary to design a new single-sided integrated packaging structure for LED modules to overcome the above problems. Summary of the Invention

[0006] This application provides a single-sided integrated packaging structure and display device for LED modules, which can solve the technical problems of thickness, heat dissipation, cost and waste of resources in the double-sided arrangement of related technologies.

[0007] In a first aspect, embodiments of this application provide a single-sided integrated packaging structure for an LED module, comprising: a substrate, on which at least one LED bead is arranged, and a driver IC is disposed on the substrate, the driver IC and the LED bead being located on the same side of the substrate, the driver IC being electrically connected to the LED bead, and one driver IC controlling at least one LED bead; the substrate further comprises a VCC port and a GND port, both the VCC port and the GND port being electrically connected to the driver IC, and the VCC port being configured to supply power to the driver IC and transmit signals.

[0008] In conjunction with the first aspect, in one embodiment, the LED beads are arranged in at least one row along a first direction and in multiple rows along a second direction, wherein the first direction is perpendicular to the second direction; the driving IC is located between two adjacent rows of LED beads along the first direction and between two adjacent rows of LED beads along the second direction.

[0009] In conjunction with the first aspect, in one embodiment, a first gap channel is formed between the first row and the second row of LED beads arranged along the second direction, and a second gap channel is formed between the last row and the penultimate row of LED beads; a third gap channel is formed between the first row and the second row of LED beads arranged along the first direction, and a fourth gap channel is formed between the last row and the penultimate row of LED beads; all of the driver ICs are arranged within the first gap channel, the second gap channel, the third gap channel, and the fourth gap channel.

[0010] In conjunction with the first aspect, in one embodiment, one of the driver ICs is electrically connected to at least two of the LED beads.

[0011] In conjunction with the first aspect, in one embodiment, a third gap channel is formed between the first row and the second row of LED beads arranged along the first direction, and a fourth gap channel is formed between the last row and the penultimate row of LED beads; all of the driver ICs are arranged within the third gap channel and the fourth gap channel.

[0012] In conjunction with the first aspect, in one embodiment, the top surface of the driver IC is lower than the top surface of the LED bead.

[0013] In conjunction with the first aspect, in one embodiment, the VCC port is electrically connected to the driver IC via a first connection line, and the VCC port is electrically connected to an energy storage circuit via a second connection line, the energy storage circuit being electrically connected to the driver IC.

[0014] In conjunction with the first aspect, in one embodiment, the substrate is further provided with a microcontroller unit, which is electrically connected to the energy storage circuit. The microcontroller unit is used to control the VCC port to connect to the energy storage circuit when it is determined to be in power mode based on a preset program; and to control the VCC port to connect to the driver IC when it is determined to be in signal output mode based on a preset program.

[0015] In conjunction with the first aspect, in one embodiment, the VCC port and the GND port are located on the same side of all the LED beads, and the distance between the VCC port and the GND port is 5mm to 12.5mm.

[0016] Secondly, embodiments of this application provide a display device, which includes the above-described single-sided integrated packaging structure of an LED module and a heat sink, wherein the heat sink is attached to the back side of the substrate.

[0017] The beneficial effects of the technical solutions provided in this application include: By placing the LED chips and driver IC on the same side of the substrate, a single-sided module design is achieved. This not only simplifies the manufacturing process and reduces production costs, but also reduces the module thickness, which is beneficial for thinner and lighter designs. In addition, since there are no protruding components on the back of the substrate, the module can be fully bonded to the heat dissipation substrate, improving heat dissipation performance and overall reliability. Furthermore, the driver IC can be powered and signals can be transmitted through just two ports: a VCC port and a GND port. This greatly improves the utilization rate of I / O ports and solves the technical problems of thickness, heat dissipation, cost, and resource waste associated with double-sided arrangements in related technologies. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the single-sided integrated packaging structure of the first type of LED module provided in this application embodiment; Figure 2 A schematic diagram of the single-sided integrated packaging structure of the second type of LED module provided in this application embodiment; Figure 3 This is a schematic diagram of a third type of LED module single-sided integrated packaging structure provided in the embodiments of this application.

[0020] In the picture: 1. Substrate; 2. LED beads; 3. Driver IC; 4. VCC port; 5. GND port; 6. First gap channel; 7. Second gap channel; 8. Third gap channel; 9. Fourth gap channel; 10. Connecting wires. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0022] This application provides a single-sided integrated packaging structure for LED modules, which can solve the technical problems of thickness, heat dissipation, cost, and resource waste in double-sided arrangements in related technologies.

[0023] See Figure 1 As shown, a single-sided integrated packaging structure for an LED module provided in this application embodiment may include: a substrate 1, on which at least one LED bead 2 is arranged, and a driver IC 3 is disposed on the substrate 1. The driver IC 3 and the LED bead 2 are located on the same side of the substrate 1, and the driver IC 3 is electrically connected to the LED bead 2, and one driver IC 3 controls at least one LED bead 2; the substrate 1 is also provided with a VCC port 4 and a GND port 5, both of which are electrically connected to the driver IC 3, and the VCC port 4 is configured to supply power to the driver IC 3 and transmit signals.

[0024] See Figure 1 As shown, Figure 1 The diagram shows 5 rows of LED beads 2 arranged on the front side of substrate 1, with 4 LED beads 2 in each row, for a total of 20 LED beads 2 arranged in 5 rows and 4 columns; at the same time, multiple driver ICs 3 are also arranged on the front side of substrate 1. Figure 1 There are 15 driver ICs 3 in total, and the driver ICs 3 are arranged between two adjacent LED beads 2. See also Figure 2 As shown, the driver IC3 and the LED beads 2 are electrically connected through the connecting line 10 to form a control link, ensuring stable data transmission. One driver IC3 can connect to one LED bead 2, two LED beads 2, or more LED beads 2, so that one driver IC3 can control one LED bead 2, two LED beads 2, or more LED beads 2.

[0025] See Figure 1As shown, two signal points are also provided near the edge of the front side of substrate 1. These two signal points are spaced apart; one is VCC port 4, and the other is GND port 5. The positions of the two ports can be switched arbitrarily. Both VCC port 4 and GND port 5 are electrically connected to all driver ICs 3 (the connecting wires are not shown in the figure). A special circuit is designed inside the VCC port, which can both supply power to the driver IC 3 and transmit signals to the driver IC 3 as a high-level signal line. Simultaneously, a low-level signal is connected in parallel to GND port 5, forming a complete binary signal encoding with the high-level signal line, realizing a 0 / 1 digital signal to illuminate the LED bead 2. In this embodiment, substrate 1 can be a conventional PCB board, which can be made of BT material or FPC (Flexible Printed Circuit) material, ensuring structural stability and facilitating heat dissipation. In this embodiment, the wiring on substrate 1 is kept as short as possible to ensure impedance matching and reduce signal interference.

[0026] This embodiment achieves a single-sided module design by arranging all LED beads 2 and all driver ICs 3 on the front side of the substrate 1. During manufacturing, only the front side of the substrate 1 needs to be processed using SMT technology, eliminating the need for SMT processing on both sides of the substrate 1. This simplifies the manufacturing process and reduces production costs. Simultaneously, with all components located on the front side of the substrate 1 and no protruding components on the back, the module thickness is reduced, contributing to a thinner and lighter design. Furthermore, the absence of protruding components on the back of the substrate 1 allows for a more seamless fit between the module and the heat dissipation substrate 1, improving heat dissipation performance and overall reliability. Moreover, power supply and signal transmission for the driver IC 3 can be achieved through just one VCC port 4 and one GND port 5, eliminating the need for three or four ports and significantly improving I / O port utilization. This solves the technical problems of thickness, heat dissipation, cost, and resource waste associated with double-sided arrangements in related technologies, enhancing the integration and stability of the LED module and meeting the application requirements of high-performance, thin and light display products.

[0027] Further, in one embodiment, the LED beads 2 are arranged in at least one row along a first direction and in multiple rows along a second direction, wherein the first direction is perpendicular to the second direction; the driving IC 3 is located between two adjacent rows of LED beads 2 along the first direction and between two adjacent rows of LED beads 2 along the second direction. See also Figure 2 As shown, the first direction is defined as horizontal, and the second direction is defined as vertical. Figure 2Four LED beads 2 are arranged in a horizontal row, and five rows of LED beads 2 are arranged vertically. The driver IC 3 is distributed between the two rows of horizontally arranged LED beads 2, and also between adjacent rows of vertically arranged LED beads 2. That is, in this embodiment, when the driver IC 3 is arranged between the LED beads 2, it is not directly flush with the LED beads 2, but is arranged between two LED beads 2, and there is a certain distance between it and each LED bead 2. See Figure 1 As shown, in this embodiment, the driver IC3 is flush with the LED bead 2, which causes the driver IC3 to block the light emitted from the LED bead 2 over a wide viewing angle; while Figure 2 In the embodiment shown, the driver IC3 is positioned between the two LED beads 2, not flush with them. This reduces the impact of the driver IC3 on the light output of the display module at a wide viewing angle, while also maximizing heat dissipation efficiency.

[0028] Furthermore, in some embodiments, a first gap channel 6 is formed between the first row and the second row of LED beads 2 arranged along the second direction, and a second gap channel 7 is formed between the last row and the second-to-last row of LED beads 2; a third gap channel 8 is formed between the first row and the second row of LED beads 2 arranged along the first direction, and a fourth gap channel 9 is formed between the last row and the second-to-last row of LED beads 2; all of the driving ICs 3 are arranged within the first gap channel 6, the second gap channel 7, the third gap channel 8, and the fourth gap channel 9.

[0029] See Figure 2 As shown, a first gap channel 6 is formed between the first row of LED beads 2 and the second row of LED beads 2, a second gap channel 7 is formed between the fifth row of LED beads 2 and the fourth row of LED beads 2, a third gap channel 8 is formed between the first column of LED beads 2 and the second column of LED beads 2, and a fourth gap channel 9 is formed between the fourth column of LED beads 2 and the third column of LED beads 2. Figure 2 The illustrated embodiment shows 10 driver ICs 3, all of which are distributed in the first gap channel 6, the second gap channel 7, the third gap channel 8, and the fourth gap channel 9. Within the area enclosed by the first gap channel 6, the second gap channel 7, the third gap channel 8, and the fourth gap channel 9, only the LED beads 2 are not provided with driver ICs 3. This arrangement ensures that the driver ICs 3 on the substrate 1 are distributed towards the outer edge, and there are no driver ICs 3 in the middle area of ​​the substrate 1, which is more conducive to heat dissipation in the middle area.

[0030] Of course, in other embodiments, the driver IC3 can also be provided in various regions of the substrate 1, for example... Figure 1 As shown.

[0031] Based on the above technical solution, preferably, one driver IC3 is electrically connected to at least two LED beads 2. See also Figure 2 As shown, a driver IC3 is electrically connected to two LED beads 2; Figure 3 The diagram shows one driver IC3 electrically connecting four LED beads 2. Of course, it can also be configured to have one driver IC3 electrically connecting three or more LED beads 2, depending on the requirements; there are no restrictions here.

[0032] Furthermore, in one embodiment, a third gap channel 8 is formed between the first row and the second row of LED beads 2 arranged along the first direction, and a fourth gap channel 9 is formed between the last row and the penultimate row of LED beads 2; all the driver ICs 3 are arranged within the third gap channel 8 and the fourth gap channel 9. See also Figure 3 As shown, a third gap channel 8 is formed between the first column of LED beads 2 and the second column of LED beads 2, and a fourth gap channel 9 is formed between the fourth column of LED beads 2 and the third column of LED beads 2. Figure 3 The illustrated embodiment shows six driver ICs 3 and six rows of LED beads 2. All six driver ICs 3 are distributed in the third gap channel 8 and the fourth gap channel 9. No driver ICs 3 are placed in the gap between the second and third rows of LED beads 2. This arrangement ensures that the driver ICs 3 on the substrate 1 are distributed towards the left and right edges. In this embodiment, each driver IC 3 is located at the intersection of the diagonals of four LED beads 2 arranged in a matrix, and one driver IC 3 can control four LED beads 2. The number of driver ICs 3 is smaller, making heat dissipation easier. Furthermore, there are no driver ICs 3 in the central area of ​​the substrate 1, which is more conducive to heat dissipation in the central area.

[0033] Furthermore, in one embodiment, the top surface of the driver IC3 is lower than the top surface of the LED bead 2. This embodiment minimizes the height of the driver IC3, ensuring its top surface is lower than the top surface of the LED bead 2. This reduces the impact of the driver IC3 on the wide-angle light emission of the LED bead 2, while the lower height of the driver IC3 also maximizes the heat dissipation performance of the substrate 1. The thickness of the driver IC3 can be set to be less than the thickness of the LED bead 2, or a groove can be provided on the substrate 1 to place the driver IC3 within it, further reducing the height of the top surface of the driver IC3 so that its top surface is lower than the top surface of the LED bead 2.

[0034] Furthermore, in some optional embodiments, the VCC port 4 is electrically connected to the driver IC3 via a first connection line, and the VCC port 4 is electrically connected to an energy storage circuit via a second connection line, which is also electrically connected to the driver IC3. This embodiment incorporates a special circuit at the VCC port 4, connecting it to the driver IC3 via the first connection line, the energy storage circuit via the second connection line, and the driver IC3 via the energy storage circuit. When the VCC port 4 is connected, energy flows into the energy storage circuit for a certain period. This energy storage circuit can be a conventional capacitor or other circuit. The energy storage circuit collects a portion of the VCC high level using the capacitor, using the remaining time as the high level of the signal source. This time can be freely controlled according to the data source requirements and the coordination with the capacitor. The connection to GND follows the same principle. Therefore, only a special circuit capable of inputting VCC and GND signals is needed to achieve this function. This reduces the requirements for external lighting devices; generally, only two power lines are needed.

[0035] In this embodiment, VCC port 4 has dual functions: Mode 1: as a power input, providing operating voltage to driver IC3. Mode 2: as a signal input, used to transmit high-level encoded signals. GND port 5 serves as a low-level input, combining with the high-level VCC to form a complete binary signal. Core circuit principle: After external VCC is connected, some current flows into the energy storage circuit (such as a capacitor or other energy storage structure), storing energy for a certain period. After energy storage is complete, when outputting voltage, VCC port 4 switches to a high-level signal source for driver IC3 to recognize the signal. GND port 5 is simultaneously connected, forming a complete 0 / 1 binary code. Driver IC3 internally decodes the signal and controls the corresponding LED bead 2 to light up.

[0036] The free switching logic (VCC port 4 function switching) in this embodiment detects the external input mode: Mode 1: External VCC port 4 directly serves as power supply, and the energy storage circuit assists the driver IC3 in stable operation. Mode 2: External VCC port 4 serves as a signal, the energy storage circuit continues to maintain power to the driver IC3, and the driver IC3 interprets the signal to control the LED beads 2. Through this special circuit, the entire LED module only requires two wires to complete power supply and signal transmission, simplifying wiring and reducing the requirements for external lighting equipment. Two-wire control enables power and signal multiplexing, and the circuit can be freely switched to adapt to different signal source inputs, improving the module's versatility and reliability.

[0037] Preferably, the substrate 1 is further provided with a microcontroller unit, which is electrically connected to the energy storage circuit. The microcontroller unit is used to control the VCC port 4 to connect to the energy storage circuit when it is determined to be in power mode based on a preset program; and to control the VCC port 4 to connect to the driver IC3 when it is determined to be in signal output mode based on a preset program. In this embodiment, when in power mode, the VCC port 4 is connected to the energy storage circuit, continuously charging the energy storage circuit, and the energy storage circuit can also supply power to the driver IC3; when in signal output mode, the VCC port 4 is connected to the driver IC3, transmitting signals to the driver IC3, while the energy storage circuit continues to maintain power to the driver IC3, ensuring that the driver IC3 does not lose power in signal mode.

[0038] In this embodiment, the principle of the control signals between VCC port 4 and GND port 5 is as follows: (1) VCC access External power is connected to VCC port 4. A high level is input to the power input of the energy storage circuit and the microcontroller unit (MCU). GND is connected as a low-level reference.

[0039] (2) Energy storage stage (power mode) VCC initially operates in default power mode (during this phase, the energy storage circuit is continuously charged and the MCU is initialized). The energy storage capacitor C_store charges rapidly, providing a stable power supply to the MCU and driver IC3. The MCU powers on and completes internal initialization, including GPIO, timers, and I / O port status. GND remains low, providing a reference voltage for the IC.

[0040] (3) Signal mode switching determination The MCU's internal program determines that energy storage is complete (the energy storage circuit has reached the set voltage). The MCU then decides whether VCC is in power mode or signal output mode. According to the pre-programmed settings, VCC switches modes as required by the program, achieving a high signal level. When in power mode, it continuously charges the energy storage circuit. GND works on the same principle as VCC, using a parallel connection to maintain a low level while forming a 1 / 0 logic signal with VCC according to the program. The energy storage circuit continues to maintain power for driver IC3, ensuring that driver IC3 does not lose power in signal mode.

[0041] (4) Signal output and control of driver IC3 The control logic of driver IC3 is as follows: high level → driver IC3 receives logic "1"; low level → driver IC3 receives logic "0". Driver IC3 drives the corresponding LED bead 2 to light up or turn off according to the received binary data.

[0042] (5) Loop output The MCU cycles through VCC mode according to the program to achieve continuous display or animation effects. The energy storage circuit ensures that the driver IC3 is powered stably in each signal cycle, while the MCU operates stably. GND continuously provides a low-level reference.

[0043] (6) End / Power off When the external VCC is disconnected, the energy storage circuit discharges, and the driver IC3 and MCU shut down. The module then waits for the next power supply.

[0044] Furthermore, in one embodiment, the VCC port 4 and the GND port 5 are located on the same side of all the LED beads 2, and the distance between the VCC port 4 and the GND port 5 is 5mm to 12.5mm. In this embodiment, the distance between the VCC port 4 and the GND port 5 is generally 5mm to 12.5mm, and can be adjusted according to product requirements.

[0045] This application embodiment also provides a display device, which includes the above-described single-sided integrated packaging structure of the LED module and a heat sink, wherein the heat sink is attached to the back side of the substrate 1.

[0046] This application proposes an LED module structure solution that integrates LED beads 2 and driver IC 3 on the same side, solving the technical problems of increased thickness, limited heat dissipation, high manufacturing complexity, and insufficient reliability caused by the arrangement of modules on both sides in related technologies. This application realizes a single-sided design of the module, simplifies the production process, reduces the module thickness, and improves heat dissipation efficiency and structural reliability, thereby meeting the application requirements of high-performance, thin and light LED display products.

[0047] The specific problems solved are as follows: 1. The module is thick, which is not conducive to making it thinner and lighter.

[0048] Existing problem: LED chips are arranged on the front of the LED module, and ICs and components are arranged on the back, which increases the overall thickness of the module.

[0049] This application's solution integrates the LED beads 2 and the driver IC 3 on the same side, reducing back-side components, decreasing module thickness, and achieving a thinner and lighter design.

[0050] 2: The heat dissipation path is blocked, resulting in insufficient reliability.

[0051] Existing problem: The presence of numerous components on the back side prevents the module from fully fitting with the heat dissipation substrate 1, reducing heat dissipation efficiency, making it prone to localized overheating, and affecting lifespan and display consistency.

[0052] The solution proposed in this application adopts a single-sided integration scheme, which makes the back side flat without any protruding components, allowing for full contact with the heat dissipation substrate 1, thus significantly improving heat dissipation performance and device reliability.

[0053] 3. The manufacturing process is complex and the cost is high.

[0054] Existing problem: Double-sided layout requires double-sided SMT process, which increases the number of placement, soldering and inspection steps, resulting in limited yield and high manufacturing cost.

[0055] This application's solution eliminates the double-sided SMT step by using a single-sided mounting process, simplifying the manufacturing process, improving production efficiency, and reducing costs.

[0056] 4. Assembly is limited and structural compatibility is poor.

[0057] Existing problem: Back-side components can easily interfere with system assembly, increasing design complexity.

[0058] This application's solution: The single-sided design makes the back flat, allowing it to be directly attached to various heat sinks and backplates, improving assembly compatibility.

[0059] 5: Poor reliability and stress concentration issues.

[0060] Existing problem: During welding and application, double-sided arrangement is prone to incomplete welding or cracking due to uneven stress on the front and back sides.

[0061] This application's solution: Single-sided arrangement reduces the risk of stress concentration and improves the reliability of welding and long-term use.

[0062] 6. Module consistency and appearance are affected.

[0063] Existing problem: The protrusion of components on the back causes inconsistent appearance, and there are gaps and tolerance issues when stacking or splicing.

[0064] This application's solution: After single-sided integration, the back of the module is flat, ensuring consistent appearance and splicing effect.

[0065] 7: The module signal line typically has at least 3 input pins.

[0066] Existing problem: Three-wire or four-wire input cannot achieve the simplest signal lines and cannot achieve further utilization of resources.

[0067] This application's solution: By specially processing the VCC pin, it enables signal input while supplying power.

[0068] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0069] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0070] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A single-sided integrated packaging structure for an LED module, characterized in that, It includes: A substrate (1) is provided with at least one LED bead (2) arranged on the substrate (1) and a driver IC (3) is provided on the substrate (1). The driver IC (3) and the LED bead (2) are located on the same side of the substrate (1). The driver IC (3) is electrically connected to the LED bead (2) and one driver IC (3) controls at least one LED bead (2). The substrate (1) is also provided with a VCC port (4) and a GND port (5), both of which are electrically connected to the driver IC (3), and the VCC port (4) is configured to supply power to the driver IC (3) and transmit signals.

2. The single-sided integrated packaging structure of the LED module as described in claim 1, characterized in that, The LED beads (2) are arranged in at least one row along the first direction and in multiple rows along the second direction, wherein the first direction is perpendicular to the second direction; The driver IC (3) is located between two adjacent rows of LED beads (2) along the first direction and between two adjacent rows of LED beads (2) along the second direction.

3. The single-sided integrated packaging structure of the LED module as described in claim 2, characterized in that, A first gap channel (6) is formed between the first row and the second row of LED beads (2) arranged along the second direction, and a second gap channel (7) is formed between the last row and the second-to-last row of LED beads (2). A third gap channel (8) is formed between the first row and the second row of LED beads (2) arranged along the first direction, and a fourth gap channel (9) is formed between the last row and the second-to-last row of LED beads (2). All of the driver ICs (3) are arranged in the first gap channel (6), the second gap channel (7), the third gap channel (8) and the fourth gap channel (9).

4. The single-sided integrated packaging structure of the LED module as described in claim 3, characterized in that, One of the driver ICs (3) is electrically connected to at least two of the LED beads (2).

5. The single-sided integrated packaging structure of the LED module as described in claim 2, characterized in that, A third gap channel (8) is formed between the first row and the second row of LED beads (2) arranged along the first direction, and a fourth gap channel (9) is formed between the last row and the second-to-last row of LED beads (2). All of the driver ICs (3) are arranged in the third gap channel (8) and the fourth gap channel (9).

6. The single-sided integrated packaging structure of the LED module as described in claim 1, characterized in that, The top surface of the driver IC (3) is lower than the top surface of the LED bead (2).

7. The single-sided integrated packaging structure of the LED module as described in claim 1, characterized in that, The VCC port (4) is electrically connected to the driver IC (3) via a first connection line, and the VCC port (4) is electrically connected to an energy storage circuit via a second connection line, and the energy storage circuit is electrically connected to the driver IC (3).

8. The single-sided integrated packaging structure of the LED module as described in claim 7, characterized in that, The substrate (1) is also provided with a microcontroller unit, which is electrically connected to the energy storage circuit. The microcontroller unit is used to control the VCC port (4) to connect to the energy storage circuit when it is determined to be in power mode based on a preset program; and to control the VCC port (4) to connect to the driver IC (3) when it is determined to be in signal output mode based on a preset program.

9. The single-sided integrated packaging structure of the LED module as described in claim 1, characterized in that, The VCC port (4) and the GND port (5) are located on the same side of all the LED beads (2), and the distance between the VCC port (4) and the GND port (5) is 5mm to 12.5mm.

10. A display device, characterized in that, It includes a single-sided integrated packaging structure of the LED module as described in claim 1 and a heat sink, wherein the heat sink is attached to the back side of the substrate (1).

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