Semiconductor device film tearing mechanism and processing equipment

Abstract

The application relates to a film tearing mechanism for semiconductor devices and processing equipment, and the film tearing mechanism comprises a rack, a winding assembly comprising a feeding roller and a receiving roller, a glue pressing assembly capable of moving up and down to contact or be away from the semiconductor devices, and a buffer assembly comprising a fixed rod and a buffer roller. The buffer roller comprises a mounting seat mounted on the rack, a rotating shaft penetrating through the mounting seat, a rotating rod fixedly connected with the rotating shaft, a rotating shaft sleeve sleeved outside the rotating rod, and an elastic piece connecting the rotating rod and the fixed rod. The rotating rod is arranged in parallel with the rotating shaft. In the height direction, the rotating rod is arranged below the feeding roller, and the fixed rod is arranged below the rotating rod. The adhesive film is stretched from the feeding roller and wound outside the rotating shaft sleeve. When the adhesive film has tension fluctuation, the elastic piece can drive the rotating rod to rotate around the rotating shaft flexibly, rapidly offset the influence of the tension mutation, and avoid wrinkles or tensile deformation of the adhesive film due to relaxation or excessive tension.

Description

Technical Field

[0001] This application relates to the field of semiconductor device processing technology, specifically to a semiconductor device film peeling mechanism and processing equipment. Background Technology

[0002] In semiconductor device manufacturing, after the wafer and carrier are debonded, the residual bonding adhesive on the surface needs to be removed by a film-peeling mechanism. That is, the adhesive film is applied and peeled off to remove the residual adhesive, preparing for subsequent processes. The stability of the film-peeling mechanism and the adhesion effect of the adhesive film directly affect the efficiency of residual adhesive removal and product yield.

[0003] Existing film-peeling mechanisms mainly include feeding / receiving rollers and adhesive pressing components. After the adhesive film is released by the feeding rollers and pressed onto the surface of the bonding device by the adhesive pressing components, it is then wound up by the receiving rollers to complete the film peeling. However, in practical applications, the adhesive film released by the feeding rollers is prone to wrinkles due to tension fluctuations, resulting in uneven film adhesion, reduced bonding accuracy with the wafer surface, and incomplete removal of residual adhesive.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Summary of the Invention

[0005] In view of this, this application provides a semiconductor device film-peeling mechanism to solve at least one problem existing in the prior art. The semiconductor device includes an iron ring, a wafer located above the iron ring, and a carrier wafer bonded to the wafer. The film-peeling mechanism includes:

[0006] frame;

[0007] A winding assembly includes a feed roller and a take-up roller mounted on the frame. The winding assembly is configured such that the feed roller and the take-up roller rotate in opposite directions simultaneously, the feed roller releases the adhesive film, and the take-up roller winds up the adhesive film.

[0008] A pressure bonding assembly is located between the feeding roller and the receiving roller. The adhesive film is wound around the bottom of the pressure bonding assembly, and the adhesive layer of the adhesive film faces the semiconductor device. The pressure bonding assembly can move up and down to contact or move away from the semiconductor device.

[0009] The buffer assembly includes a fixed rod and a buffer roller mounted on the frame. The buffer roller includes a mounting base mounted on the frame, a rotating shaft passing through the mounting base, a rotating rod fixedly connected to the rotating shaft, a rotating sleeve sleeved on the outside of the rotating rod, and an elastic element connecting the rotating rod and the fixed rod. The rotating rod is arranged parallel to the rotating shaft. In the height direction, the rotating rod is lower than the feeding roller, the fixed rod is lower than the rotating rod, and the adhesive film extends from the feeding roller and wraps around the outside of the rotating sleeve.

[0010] Optionally, in the above-mentioned semiconductor device film-peeling mechanism, the frame is further provided with an arc-shaped groove, the arc-shaped groove is located on one side of the mounting base, and the end of the rotating rod is inserted into the arc-shaped groove to rotate along the arc-shaped groove.

[0011] Optionally, the above-mentioned semiconductor device film-peeling mechanism further includes an ion air bar mounted on the frame, the ion air bar being used to blow ion air onto the adhesive film discharged from the feeding roller.

[0012] Optionally, in the above-mentioned semiconductor device film-peeling mechanism, the adhesive pressing assembly includes a first driving member mounted on the frame and an adhesive pressing roller connected to the first driving member. The adhesive pressing roller is located between the feeding roller and the receiving roller. The adhesive film is wound around the underside of the adhesive pressing roller, and the adhesive layer of the adhesive film faces the semiconductor device. The first driving member can drive the adhesive pressing roller to move up and down to contact or move away from the semiconductor device.

[0013] Optionally, in the above-mentioned semiconductor device film peeling mechanism, the adhesive pressing assembly further includes a first mounting plate, a second mounting plate, and a connecting rod. The connecting rod connects the frame and the second mounting plate. The output shaft of the first drive unit passes through the second mounting plate and is connected to the first mounting plate. A connecting block is connected below the first mounting plate, and the adhesive pressing roller is rotatably connected to the connecting block.

[0014] Optionally, in the above-described semiconductor device film-peeling mechanism, the adhesive bonding assembly further includes a pressure sensor connecting the output shaft and the first mounting plate.

[0015] Optionally, the above-mentioned semiconductor device film-removing mechanism further includes a guide sleeve mounted on the second mounting plate and the frame, and a guide rod passing through the guide sleeve, wherein the adhesive bonding assembly can move up and down along the guide sleeve via the guide rod.

[0016] Optionally, in the above-mentioned semiconductor device film-peeling mechanism, the adhesive pressing assembly further includes an angle adjustment block located between the receiving roller and the adhesive pressing roller. The angle adjustment block includes a transition surface near the adhesive pressing roller, a bottom surface, and an adjustment surface away from the adhesive pressing roller. An arc-shaped surface is provided between the bottom surface and the adjustment surface. The adhesive film passes sequentially from the adhesive pressing roller through the bottom surface, the arc-shaped surface, and the adjustment surface. The included angle formed between the adjustment surface and the bottom surface is an acute angle.

[0017] Optionally, the above-mentioned semiconductor device film-peeling mechanism further includes an optical detection element mounted on the frame, the optical detection element being disposed toward the semiconductor device.

[0018] This application also provides a semiconductor device processing apparatus, including the semiconductor device film peeling mechanism described in any one of the above-mentioned methods.

[0019] Compared with the prior art, this application has the following beneficial effects: By setting a fixed rod, a buffer roller, and an elastic element on the frame, and with the rotating rod of the buffer roller connected to the fixed rod through the elastic element, and the rotating rod being lower than the feeding roller and the fixed rod being lower than the rotating rod, a reasonable bonding tension is maintained during the film winding. When the film tension fluctuates, the elastic element can drive the rotating rod to rotate flexibly around the axis, quickly offsetting the effect of sudden tension changes and preventing the film from wrinkling or stretching due to slack or excessive tension. In addition, the rotating shaft sleeve of the buffer assembly is sleeved on the outside of the rotating rod, which can reduce frictional damage during the film conveying process and ensure the integrity of the film surface adhesion. At the same time, the stable tension-adjustable conveying path ensures that the film can be evenly bonded to the debonded wafer surface after being pressed by the pressing assembly, improving the bonding accuracy and thus completely removing residual bonding adhesive from the wafer surface, avoiding the problem of incomplete peeling caused by uneven bonding. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the semiconductor device film-peeling mechanism shown in this embodiment;

[0021] Figure 2 for Figure 1 A schematic diagram of the semiconductor device film-peeling mechanism from another direction;

[0022] Figure 3 for Figure 1 A cross-sectional schematic diagram of the semiconductor device film-peeling mechanism is shown.

[0023] Figure 4 This is a magnified view of point A in the semiconductor device film-peeling mechanism shown in Figure 3;

[0024] Figure 5 for Figure 1The diagram shows a buffer assembly of the semiconductor device film-peeling mechanism.

[0025] Reference numerals: 1-Frame; 11-Arc groove; 2-Winding assembly; 21-Feeding roller; 22-Receiving roller; 3-Pressure bonding assembly; 30-Angle adjusting block; 301-Transition surface; 302-Bottom surface; 303-Adjusting surface; 304-Arc surface; 31-Pressure bonding roller; 32-First driving component; 321-Output shaft; 33-First mounting plate; 34-Second mounting plate; 341-Through hole; 35-Connecting rod; 36-Connecting block; 37-Pressure sensor; 38-Guide sleeve; 39-Guide rod; 4-Buffer assembly; 41-Fixing rod; 42-Buffer roller; 421-Mounting base; 422-Rotating shaft; 423-Rotating rod; 424-Rotating bushing; 425-Elastic component; 5-Adhesive film; 6-Ionizing air bar; 7-Optical detection component. Detailed Implementation

[0026] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0027] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0028] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0029] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0030] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0031] refer to Figures 1-5 As shown, a preferred embodiment of this application provides a semiconductor device adhesive peeling mechanism. This mechanism is mounted on a semiconductor device processing equipment used for debonding semiconductor devices. Specifically, the semiconductor device includes an iron ring, a wafer located above the iron ring, and a carrier wafer bonded to the wafer. After the wafer and carrier wafer are debonded, the carrier wafer is removed, leaving bonding adhesive residue on the wafer. The adhesive peeling mechanism is used to clean the remaining bonding adhesive from the wafer. In this embodiment, the adhesive peeling mechanism removes the bonding adhesive, and its physical peeling method avoids damage from rigid contact with the wafer.

[0032] In this embodiment, the film-tearing mechanism includes: a frame 1, a winding assembly 2, a pressing assembly 3, and a buffer assembly 4.

[0033] Specifically, the winding assembly 2 includes a feed roller 21 and a take-up roller 22 mounted on the frame 1. The winding assembly 2 is configured such that the feed roller 21 and the take-up roller 22 rotate simultaneously in opposite directions, with the feed roller 21 releasing the adhesive film 5 and the take-up roller 22 winding up the adhesive film 5. This configuration enables continuous and stable conveying of the adhesive film 5, ensuring the continuity of the film-tearing operation and preventing interruptions in the conveying of the adhesive film 5 from affecting operational efficiency.

[0034] The adhesive pressing assembly 3 is located between the unloading roller 21 and the take-up roller 22. The adhesive film 5 is wound around the underside of the adhesive pressing roller 31, with the adhesive layer of the adhesive film 5 facing the semiconductor device. The adhesive pressing assembly 3 can move up and down to contact or move away from the semiconductor device. When the adhesive pressing assembly 3 contacts the wafer surface of the semiconductor device, the adhesive film 5 can adhere to residual bonding adhesive on the wafer and be wound up by the take-up roller 22.

[0035] The buffer assembly 4 includes a fixed rod 41 and a buffer roller 42 mounted on the frame 1. The buffer roller 42 includes a mounting base 421 mounted on the frame 1, a rotating shaft 422 passing through the mounting base 421, a rotating rod 423 fixedly connected to the rotating shaft 422, a rotating bushing 424 sleeved on the outside of the rotating rod 423, and an elastic element 425 connecting the rotating rod 423 and the fixed rod 41. The rotating rod 423 is arranged parallel to the rotating shaft 422. In the height direction, the rotating rod 423 is set lower than the feeding roller 21, and the fixed rod 41 is lower than the rotating rod 423. The adhesive film 5 extends from the feeding roller 21 and wraps around the outside of the rotating bushing 424.

[0036] In this embodiment, the mounting base 421 has a rotating shaft mounting hole. The rotating shaft 422 passes horizontally through the mounting hole and is rotatably connected to the mounting base 421 through a deep groove ball bearing, ensuring smooth rotation of the rotating shaft 422. The rotating rod 423 is fixedly connected to the rotating shaft 422 and the two are set parallel to each other. The length of the rotating rod 423 is adapted to the inner width of the frame 1. The rotating bushing 424 is made of wear-resistant polytetrafluoroethylene material and can rotate freely around the rotating rod 423. Its outer diameter is slightly larger than the diameter of the rotating rod 423. When the adhesive film 5 is wound, it only contacts the rotating bushing 424, which can effectively reduce the friction loss of the adhesive film 5 during the conveying process and avoid damage or static electricity accumulation of the adhesive film 5 due to friction. The elastic element 425 is a high-precision tension spring. One end of it is hooked to the end of the rotating rod 423 through a hanging ring, and the other end is hooked to the fixed rod 41. The spring is initially in a slightly stretched state and always provides a constant downward tension to the rotating rod 423. In the height direction, the rotating rod 423 is set lower than the feeding roller 21, and the fixed rod 41 is lower than the rotating rod 423. The film 5 extends from the feeding roller 21 and is wrapped around the outside of the rotating bushing 424. When the film 5 is conveyed, the tension changes due to factors such as slight fluctuations in the feeding / receiving speed and uneven thickness of the film 5. The rotating rod 423 will make an adaptive small-amplitude rotation around the rotating shaft 422 to quickly offset the effect of sudden tension changes. The elastic element 425 will stretch or contract synchronously to buffer the tension fluctuations in real time, so as to prevent the film 5 from being torn due to excessive tension or from becoming loose and wrinkled due to insufficient tension, and ensure that the film 5 always maintains a flat conveying state.

[0037] Furthermore, the frame 1 is also provided with an arc-shaped groove 11, which is located on one side of the mounting base 421. The end of the rotating rod 423 is inserted into the arc-shaped groove 11 to rotate along the arc-shaped groove 11. The arc-shaped groove 11 is formed on the side plate of the frame 1 corresponding to the mounting base 421. Its arc-shaped trajectory is perfectly matched with the rotation trajectory of the rotating rod 423 around the rotating shaft 422. The groove width is slightly larger than the diameter of the end of the rotating rod 423. The end of the rotating rod 423 away from the rotating shaft 422 extends towards the arc-shaped groove 11 and inserts into the groove, forming a rotation limiting structure. The beneficial effect of this arc-shaped groove 11 structure is that it can accurately limit the rotation angle of the rotating rod 423, avoid fatigue failure of the elastic element 425 due to excessive stretching or contraction, extend the service life of the buffer assembly 4, and effectively prevent the film 5 from deviating from the preset conveying path due to excessive rotation angle of the rotating rod 423, further improving the working stability of the buffer assembly 4.

[0038] When the tension of the adhesive film 5 fluctuates significantly, the rotating rod 423 rotates around the rotating shaft 422, and its end slides in an arc along the groove of the arc-shaped groove 11. The two ends of the arc-shaped groove 11 are the maximum rotation limit positions of the rotating rod 423, ensuring that the buffering action is smooth and controllable, and avoiding the impact of structural failure on the continuity of the film tearing operation.

[0039] Furthermore, the pressure bonding assembly 3 includes a first drive member 32 mounted on the frame 1 and a pressure bonding roller 31 connected to the first drive member 32. The pressure bonding roller 31 is located between the feeding roller 21 and the receiving roller 22. The adhesive film 5 is wound around the pressure bonding roller 31 from below, and the adhesive layer of the adhesive film 5 faces the semiconductor device. The first drive member 32 can drive the pressure bonding roller 31 to move up and down to contact or move away from the semiconductor device.

[0040] The beneficial effects of this structure are that the first driving component 32 can achieve precise control of the up-and-down movement of the pressure roller 31, ensuring accurate alignment between the pressure roller 31 and the surface of the semiconductor device; the setting of the pressure roller 31 allows the adhesive film 5 to make uniform contact with the wafer surface, improving the bonding tightness and thus ensuring the thorough removal of residual adhesive. At the same time, compared with a rigid pressing structure, the roller pressing can reduce the risk of damage to the adhesive film 5. In this embodiment, the first driving component 32 is a high-precision servo electric cylinder, which is vertically mounted on the crossbeam at the top of the frame 1, and its output shaft 321 is set downward and connected to the mounting structure of the pressure roller 31.

[0041] Furthermore, the pressure bonding assembly 3 also includes a first mounting plate 33, a second mounting plate 34, and a connecting rod 35. The connecting rod 35 connects the frame 1 and the second mounting plate 34. The output shaft 321 of the first drive member 32 passes through the second mounting plate 34 and is connected to the first mounting plate 33. A connecting block 36 is connected below the first mounting plate 33, and the pressure bonding roller 31 is rotatably connected to the connecting block 36.

[0042] Understandably, the cooperation of the first mounting plate 33, the second mounting plate 34 and the connecting rod 35 can achieve stable installation of the pressure roller 31, improve the overall structural rigidity of the pressure assembly 3, and avoid uneven pressure due to structural deformation during the pressing process; at the same time, it can ensure that the driving force of the first driving component 32 is accurately transmitted to the pressure roller 31. The first mounting plate 33 is located below the second mounting plate 34, and the two are arranged in parallel. The output shaft 321 of the first drive component 32 passes through the through hole 341 in the center of the second mounting plate 34 and is fixedly connected to the center of the top surface of the first mounting plate 33. A connecting block 36 is connected below the first mounting plate 33. The pressure roller 31 is rotatably connected to the connecting block 36 and fixedly connected to the bottom of the first mounting plate 33 through the connecting block 36, so that the pressure roller 31 can rotate around its own axis. After the adhesive film 5 is wrapped around the pressure roller 31 from below, it is smoothly conveyed with the rotation of the pressure roller 31. At the same time, the rotation of the pressure roller 31 can evenly press the adhesive film 5 onto the wafer surface, avoiding local poor adhesion.

[0043] To precisely control the pressure application force and avoid excessive pressure damaging the wafer or insufficient pressure resulting in loose bonding, the pressure application assembly 3 also includes a pressure sensor 37 connecting the output shaft 321 and the first mounting plate 33. This sensor can detect the pressure value output by the first drive component 32 in real time, achieving closed-loop control of the pressure application force. This ensures a constant pressure application force, preventing excessive pressure from damaging the wafer surface and affecting product yield, while insufficient pressure will prevent the adhesive film 5 from bonding tightly with the residual adhesive, resulting in incomplete removal of the residual adhesive.

[0044] To ensure the smoothness and accuracy of the up-and-down movement of the adhesive pressing assembly 3 and to prevent the adhesive pressing roller 31 from shifting and causing misalignment of the adhesive film 5, the film peeling mechanism also includes a guide sleeve 38 mounted on the second mounting plate 34 and the frame 1 and a guide rod 39 passing through the guide sleeve 38. The adhesive pressing assembly 3 can move up and down along the guide sleeve 38 via the guide rod 39, thereby providing precise guidance for the up-and-down movement of the adhesive pressing assembly 3, limiting the lateral displacement of the first mounting plate 33, preventing the first mounting plate 33 from tilting or shifting, and ensuring that the adhesive pressing roller 31 always moves along the preset vertical trajectory.

[0045] To further optimize the peeling angle of the adhesive film 5 after it is bonded to the wafer surface and improve the residual adhesive peeling effect, the adhesive pressing assembly 3 also includes an angle adjustment block 30 located between the receiving roller 22 and the adhesive pressing roller 31. The angle adjustment block 30 includes a transition surface 301 close to the adhesive pressing roller 31, a bottom surface 302, and an adjustment surface 303 away from the adhesive pressing roller 31. An arc-shaped surface 304 is provided between the bottom surface 302 and the adjustment surface 303. The adhesive film 5 passes through the bottom surface 302, the arc-shaped surface 304, and the adjustment surface 303 in sequence from the adhesive pressing roller 31. The included angle formed between the adjustment surface 303 and the bottom surface 302 is an acute angle.

[0046] Understandably, the curved surface 304 reduces frictional loss during the bending of the adhesive film 5, while preventing damage due to severe bending. The acute angle formed by the adjusting surface 303 and the bottom surface 302 allows the adhesive film 5 to release its peeling force against residual bonding adhesive along the horizontal direction of the bonding surface between the adhesive layer and the wafer surface, rather than as a vertical impact. This maximizes the use of the adhesive film 5's bonding force to peel the residual adhesive from the wafer surface, rather than tearing it off. Simultaneously, it avoids excessive peeling angles that could damage the wafer edges, balancing peeling effectiveness and product safety.

[0047] In this embodiment, the angle adjustment block 30 adopts an integrated structure and is fixed to the connecting block 36 by bolts.

[0048] In this embodiment, the arc-shaped surface 304 is positioned higher than the bottom end of the pressure roller 31. This prevents the adhesive film 5 from prematurely lifting off the wafer after being bonded by the pressure roller 31 due to the arc-shaped surface being too low. This ensures that the adhesive film 5 adheres fully and tightly to the residual bonding adhesive on the wafer surface under the pressing action of the pressure roller 31, preventing incomplete peeling of the residual adhesive due to poor adhesion. Furthermore, this height setting allows the acute angle of the tear-off formed by the adjusting surface 303 and the bottom surface 302 to remain at the designed preset value. This ensures that the peeling force of the adhesive film 5 on the residual bonding adhesive is always released horizontally along the bonding surface between the adhesive layer and the wafer surface, rather than as an impact force perpendicular to the wafer surface. This maximizes the use of the adhesive force of the adhesive film 5 to horizontally tear the residual adhesive from the wafer surface, rather than vertically pulling it off, effectively improving the thoroughness of residual adhesive peeling.

[0049] The film-peeling mechanism also includes an ionizer 6 mounted on the frame 1. The ionizer 6 is used to blow ionized air onto the film 5 discharged from the feed roller 21. The ionizer 6 is horizontally mounted on the frame 1, located above the film 5 conveying path between the feed roller 21 and the buffer roller 42. Its air outlet faces the surface of the film 5. The ionizer 6 is powered by a high-voltage power module and can continuously blow positive and negative ion air onto the surface of the film 5 during operation. This can effectively neutralize the static charge generated on the surface of the film 5 due to friction and eliminate the effects of static electricity. At the same time, the ionized air can also blow away the dust near the film 5, preventing the dust from being adsorbed on the film 5 and causing uneven bonding between the film 5 and the wafer, thus further ensuring the bonding effect of the film 5.

[0050] To monitor the film-peeling effect in real time and promptly identify defective products with incomplete removal of residual adhesive, the film-peeling mechanism also includes an optical detection element 7 mounted on the frame 1, with the optical detection element 7 facing the semiconductor device.

[0051] The optical inspection component 7 is based on the principle of chromatographic detection to detect the film peeling effect. It utilizes the difference in chromatographic characteristics between the clean area and the residual bonding adhesive area on the wafer surface to achieve accurate, non-contact online detection of residual adhesive. The detection accuracy is high and will not cause any secondary contact damage to the wafer surface. It can capture the chromatographic signal on the wafer surface in real time, quickly distinguish the standard chromatogram of the clean wafer from the abnormal chromatogram of the residual adhesive, and realize the real-time online judgment of the film peeling effect. No manual offline detection is required, which greatly improves the work efficiency.

[0052] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A semiconductor device film-peeling mechanism, characterized in that, The semiconductor device includes an iron ring, a wafer located above the iron ring, and a carrier wafer bonded to the wafer; the film-peeling mechanism includes: frame; A winding assembly includes a feed roller and a take-up roller mounted on the frame. The winding assembly is configured such that the feed roller and the take-up roller rotate in opposite directions simultaneously, the feed roller releases the adhesive film, and the take-up roller winds up the adhesive film. A pressure bonding assembly is located between the feeding roller and the receiving roller. The adhesive film is wound around the bottom of the pressure bonding assembly, and the adhesive layer of the adhesive film faces the semiconductor device. The pressure bonding assembly can move up and down to contact or move away from the semiconductor device. The buffer assembly includes a fixed rod and a buffer roller mounted on the frame. The buffer roller includes a mounting base mounted on the frame, a rotating shaft passing through the mounting base, a rotating rod fixedly connected to the rotating shaft, a rotating sleeve sleeved on the outside of the rotating rod, and an elastic element connecting the rotating rod and the fixed rod. The rotating rod is arranged parallel to the rotating shaft. In the height direction, the rotating rod is lower than the feeding roller, the fixed rod is lower than the rotating rod, and the adhesive film extends from the feeding roller and wraps around the outside of the rotating sleeve.

2. The semiconductor device film-peeling mechanism according to claim 1, characterized in that, The frame is also provided with an arc-shaped groove, which is located on one side of the mounting base. The end of the rotating rod is inserted into the arc-shaped groove to rotate along the arc-shaped groove.

3. The semiconductor device film-peeling mechanism according to claim 1, characterized in that, The film-tearing mechanism also includes an ion air bar mounted on the frame, which is used to blow ion air onto the film discharged from the feed roller.

4. The semiconductor device film-peeling mechanism according to claim 1, characterized in that, The adhesive pressing assembly includes a first drive unit mounted on the frame and an adhesive pressing roller connected to the first drive unit. The adhesive pressing roller is located between the feeding roller and the receiving roller. The adhesive film is wound around the bottom of the adhesive pressing roller, and the adhesive layer of the adhesive film faces the semiconductor device. The first drive unit can drive the adhesive pressing roller to move up and down to contact or move away from the semiconductor device.

5. The semiconductor device film-peeling mechanism according to claim 4, characterized in that, The adhesive pressing assembly also includes a first mounting plate, a second mounting plate, and a connecting rod. The connecting rod connects the frame to the second mounting plate. The output shaft of the first drive unit passes through the second mounting plate and is connected to the first mounting plate. A connecting block is connected below the first mounting plate. The adhesive pressing roller is rotatably connected to the connecting block.

6. The semiconductor device film-peeling mechanism according to claim 5, characterized in that, The adhesive bonding assembly also includes a pressure sensor that connects the output shaft to the first mounting plate.

7. The semiconductor device film-peeling mechanism according to claim 5, characterized in that, The film-peeling mechanism also includes a guide sleeve mounted on the second mounting plate and the frame, and a guide rod passing through the guide sleeve. The adhesive-pressing assembly can move up and down along the guide sleeve via the guide rod.

8. The semiconductor device film-peeling mechanism according to claim 4, characterized in that, The pressing assembly further includes an angle adjustment block located between the receiving roller and the pressing roller. The angle adjustment block includes a transition surface near the pressing roller, a bottom surface, and an adjustment surface away from the pressing roller. An arc-shaped surface is provided between the bottom surface and the adjustment surface. The adhesive film passes sequentially from the pressing roller through the bottom surface, the arc-shaped surface, and the adjustment surface. The included angle formed between the adjustment surface and the bottom surface is an acute angle.

9. The semiconductor device film-peeling mechanism according to claim 1, characterized in that, The film-tearing mechanism also includes an optical detection element mounted on the frame, the optical detection element being positioned toward the semiconductor device.

10. A semiconductor device processing apparatus, characterized in that, The semiconductor device film-peeling mechanism includes any one of claims 1-9.

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