Resin composition, prepreg, film with resin, metal foil with resin, metal foil-clad laminate, and wiring board

By attaching polydopamine to the surface of boron nitride filler to improve its adhesion to resin, the problem of insufficient adhesion of resin composition when improving thermal conductivity is solved, resulting in cured products with low dielectric properties and high thermal conductivity, which are suitable for prepregs, resin-coated films, resin-coated metal foils, metal foil laminates and wiring boards.

CN121729458APending Publication Date: 2026-03-24PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
CN202480054689.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-08-31
Filing Date
2024-08-02
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

While existing resin compositions improve thermal conductivity, they lack sufficient adhesion, leading to easy breakage of the cured product, especially in metal foil-coated laminates where the adhesion to the metal foil is poor.

Method used

A resin composition containing boron nitride filler is used. Polydopamine is attached to the surface of the boron nitride filler. Polydopamine has functional groups that can react with free radical polymerizable compounds, thereby improving the adhesion between boron nitride and the resin.

Benefits of technology

It achieves cured materials with low dielectric properties, high thermal conductivity and excellent adhesion, and is suitable for prepregs, resin-coated films, resin-coated metal foils, metal foil laminates and wiring boards.

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Abstract

One aspect of the present invention relates to a resin composition containing a thermosetting compound (A) and an inorganic filler (B), the thermosetting compound (A) contains at least one radical polymerizable compound (A1) selected from the group consisting of a polyphenylene ether compound having a reactive unsaturated group, a hydrocarbon compound having a reactive unsaturated group, and a maleimide compound having two or more maleimide groups. The inorganic filler (B) contains a boron nitride filler (B1), and a polydopamine (C) having a functional group (X) that reacts with the radically polymerizable compound (A1) adheres to the surface of the boron nitride filler (B1).
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