Display panel, manufacturing method thereof and display device

Abstract

The invention provides a display panel, a manufacturing method thereof and a display device. The display panel comprises a driving backboard and a light-emitting device arranged on the driving backboard, the light-emitting device comprises at least two sub-devices, and the at least two sub-devices are sequentially arranged in a stacked mode in the direction away from the driving backboard; at least part of the dielectric layer is located between two adjacent sub-devices, the transmittance of the dielectric layer to light rays emitted by the first part of the sub-devices is larger than that of the dielectric layer to light rays emitted by the second part of the sub-devices, the first part of the sub-devices is located between the dielectric layer and the driving backboard, and the second part of the sub-devices is located between the driving backboard and the driving backboard. And the second part of sub-devices are positioned on one side of the dielectric layer back to the driving backboard.

Description

Display panel and its manufacturing method, display device Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] With the continuous development of display technology, the application fields of display products are becoming increasingly wide, and users have increasingly higher requirements for the display quality of display products. Light-emitting diodes (LEDs), as the next generation of display technology, can efficiently convert electrical energy into light energy and have a wide range of applications in modern society, such as lighting, flat panel displays, and medical devices.

[0003] Summary of the Invention

[0004] The purpose of this disclosure is to provide a display panel, a method for manufacturing the same, and a display device.

[0005] To achieve the above objectives, this disclosure provides the following technical solution:

[0006] A first aspect of this disclosure provides a display panel, including: a driving backplate and a light-emitting device disposed on the driving backplate, the light-emitting device comprising:

[0007] At least two sub-devices are stacked sequentially along a direction away from the drive backplane;

[0008] At least one dielectric layer, at least a portion of which is located between two adjacent sub-devices, wherein the transmittance of the dielectric layer to light emitted by a first portion of the sub-devices is greater than its transmittance to light emitted by a second portion of the sub-devices, wherein the first portion of the sub-devices is located between the dielectric layer and the drive backplane, and the second portion of the sub-devices is located on the side of the dielectric layer facing away from the drive backplane.

[0009] Optionally, the dielectric layer includes multiple sub-film layers stacked sequentially along a direction perpendicular to the drive backplate, with adjacent sub-film layers having different refractive indices.

[0010] Optionally, in the multilayer sub-film layers, at least two sub-film layers have different thicknesses.

[0011] Optionally, in two adjacent sub-devices, the light-emitting portion of the sub-device farther from the driving backplane is projected onto the driving backplane in a positive projection, which is located inside the light-emitting portion of the sub-device closer to the driving backplane in a positive projection.

[0012] Optionally, in two adjacent sub-devices, the boundary of the orthographic projection of the light-emitting portion of the sub-device closer to the driving backplane on the driving backplane surrounds the orthographic projection of the light-emitting portion of the sub-device farther from the driving backplane on the driving backplane.

[0013] Optionally, the dielectric layer includes a first dielectric portion, a first bonded film layer, and a second dielectric portion, which are sequentially stacked along a direction away from the drive backplate.

[0014] The first medium portion includes a first sub-film layer and a second sub-film layer alternately arranged along a direction perpendicular to the drive backplate, wherein the refractive index of the first sub-film layer is greater than the refractive index of the second sub-film layer;

[0015] The second medium portion includes a third sub-film layer and a fourth sub-film layer alternately arranged in a direction perpendicular to the drive backplate, wherein the refractive index of the third sub-film layer is greater than the refractive index of the fourth sub-film layer;

[0016] The first bonded sub-film layer is located between the adjacent second sub-film layer and the fourth sub-film layer.

[0017] Optionally, the sub-device includes a first electrode layer and a light-emitting functional portion stacked sequentially along a direction away from the driving backplane. The light-emitting functional portion includes a first carrier injection layer, a light-emitting functional layer, and a second carrier injection layer stacked sequentially along a direction away from the driving backplane.

[0018] The sub-device also includes a second electrode layer, which is in contact with the side of the second carrier injection layer.

[0019] Optionally, the thickness of the second carrier injection layer is greater than the thickness of the first carrier injection layer.

[0020] Optionally, the orthographic projection of the second electrode layer on the drive backplane surrounds the second carrier injection layer; the second electrode layer is in contact with each side of the second carrier injection layer.

[0021] Optionally, in two adjacent sub-devices, the second electrode layer in the sub-device closer to the drive backplane is coupled to the first electrode layer in the sub-device farther from the drive backplane.

[0022] Optionally, the drive backplane may also include multiple signal input terminals;

[0023] The display panel further includes at least two planarization layers, which are located around the corresponding sub-devices. The planarization layers at least cover the side of the first carrier injection layer and the side of the light-emitting functional layer in the corresponding sub-devices.

[0024] At least a portion of the planarization layer is located between the second electrode layer in the corresponding sub-device and the driving backplane; the second electrode layer in each sub-device penetrates at least one layer of the planarization layer and is coupled to the corresponding signal input terminal.

[0025] Optionally, the display panel further includes an encapsulation layer located on the side of the at least two sub-devices facing away from the driving backplate.

[0026] Optionally, the dielectric layer includes a third dielectric portion, an insulator film layer, and a second bonding film layer, which are sequentially stacked in a direction away from the drive backplate.

[0027] The third medium portion includes a fifth sub-film layer and a sixth sub-film layer alternately arranged in a direction perpendicular to the drive backplate, wherein the refractive index of the fifth sub-film layer is greater than that of the sixth sub-film layer.

[0028] Optionally, the driving backplane further includes multiple signal input terminals; the sub-device includes a first electrode layer, a light-emitting functional portion, and a second electrode layer sequentially stacked along a direction away from the driving backplane, the light-emitting functional portion including a first carrier injection layer, a light-emitting functional layer, and a second carrier injection layer sequentially stacked along a direction away from the driving backplane; the first electrode layer and / or the second electrode layer in each sub-device are coupled to the corresponding signal input terminal through corresponding connection electrodes; the insulator film layer extends between adjacent connection electrodes.

[0029] Optionally, the display panel further includes: at least one spacer insulating layer, the spacer insulating layer being in contact with the side of the corresponding sub-device, at least a portion of the spacer insulating layer being located between the two connection electrodes to which the corresponding sub-device is connected, and / or, at least a portion of the spacer insulating layer being located between the side of the corresponding sub-device and the connection electrode to which the sub-device is connected.

[0030] Optionally, the display panel further includes an encapsulation layer that completely encapsulates the at least two sub-devices and the at least one dielectric layer; the outer surface of the encapsulation layer facing away from the driving backplate has a partially spherical shape.

[0031] Optionally, the orthographic projection of each of the sub-devices on the drive backplane is located inside the orthographic projection of the dielectric layer on the drive backplane.

[0032] Optionally, the at least two sub-devices include a first sub-device, a second sub-device, and a third sub-device that are sequentially stacked along a direction away from the drive backplane;

[0033] The at least one dielectric layer includes a first dielectric layer and a second dielectric layer, wherein the first dielectric layer is located between the first sub-device and the second sub-device, and the second dielectric layer is located between the second sub-device and the third sub-device;

[0034] The transmittance of the first dielectric layer to light emitted by the first sub-device is greater than its transmittance to light emitted by the second and third sub-devices.

[0035] The transmittance of the second dielectric layer to light emitted by the first and second sub-devices is greater than its transmittance to light emitted by the third sub-device.

[0036] Optionally, the first sub-device includes a red sub-device, the second sub-device includes a green sub-device, and the third sub-device includes a blue sub-device.

[0037] Based on the above-described display panel technical solution, a second aspect of this disclosure provides a display device including the above-described display panel.

[0038] Based on the above-described technical solution for the display panel, a third aspect of this disclosure provides a method for manufacturing a display panel, the method comprising:

[0039] Provide a drive backplane;

[0040] At least two sub-devices and at least one dielectric layer are fabricated on the drive backplane; the at least two sub-devices are stacked sequentially in a direction away from the drive backplane; at least a portion of the dielectric layer is located between two adjacent sub-devices, and the transmittance of the dielectric layer to light emitted by the first portion of the sub-devices is greater than its transmittance to light emitted by the second portion of the sub-devices, the first portion of the sub-devices is located between the dielectric layer and the drive backplane, and the second portion of the sub-devices is located on the side of the dielectric layer facing away from the drive backplane.

[0041] Optionally, the step of fabricating the first sub-device and the first dielectric layer closest to the drive backplane specifically includes:

[0042] The first sub-device formed on the first temporary substrate includes a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer, and a first electrode layer that are sequentially stacked along a direction away from the first temporary substrate.

[0043] The first electrode layer of the first sub-device is bonded to the bonding electrode layer on the driving backplane, and then the first temporary substrate is removed.

[0044] Fabricate a second electrode layer for the first sub-device, the second electrode layer being in contact with the side of the second carrier injection layer of the first sub-device;

[0045] A first dielectric portion is fabricated in the first dielectric layer, the first dielectric portion being located on the side of the first sub-device facing away from the drive backplane;

[0046] The second sub-device formed on the second temporary substrate includes a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer, and a first electrode layer that are sequentially stacked along a direction away from the second temporary substrate.

[0047] On the side of the first electrode layer of the second sub-device facing away from the second temporary substrate, the second dielectric portion and the first bonding sub-film layer in the first dielectric layer are sequentially fabricated and stacked.

[0048] The first bonding subfilm in the first dielectric layer is bonded to the first dielectric portion in the first dielectric layer, and then the second temporary substrate is removed.

[0049] Optionally, the steps for fabricating the second sub-device, the second dielectric layer, and the third sub-device specifically include:

[0050] Fabricate a second electrode layer for the second sub-device, the second electrode layer being in contact with the side of the second carrier injection layer of the second sub-device;

[0051] Fabricate a first dielectric portion in the second dielectric layer, the first dielectric portion being located on the side of the second sub-device facing away from the drive backplane;

[0052] The third sub-device formed on the third temporary substrate includes a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer, and a first electrode layer that are sequentially stacked in a direction away from the third temporary substrate.

[0053] On the side of the first electrode layer of the third sub-device facing away from the third temporary substrate, the second dielectric portion and the first bonding sub-film layer of the second dielectric layer are sequentially fabricated in a stacked manner.

[0054] The first bonding sub-film layer in the second dielectric layer is bonded to the first dielectric portion in the second dielectric layer, and then the third temporary substrate is removed.

[0055] A second electrode layer of the third sub-device is fabricated, which is in side contact with the second carrier injection layer of the third sub-device.

[0056] Alternatively, the methods for manufacturing the display panel may also include:

[0057] Before fabricating the second electrode layer of the first sub-device, a first planarization layer is fabricated. The first planarization layer is located around the corresponding first sub-device. The first planarization layer at least covers the side of the first carrier injection layer and the side of the light-emitting functional layer in the corresponding first sub-device. At least a portion of the first planarization layer is located between the second electrode layer in the corresponding first sub-device and the driving backplane. The second electrode layer in the first sub-device is coupled to the corresponding signal input terminal in the driving backplane through the first planarization layer.

[0058] Before fabricating the second electrode layer of the second sub-device, a second planarization layer is fabricated. The second planarization layer is located around the corresponding second sub-device. The second planarization layer at least covers the side of the first carrier injection layer and the side of the light-emitting functional layer in the corresponding second sub-device. At least a portion of the second planarization layer is located between the second electrode layer in the corresponding second sub-device and the driving backplane. The second electrode layer in the second sub-device is coupled to the corresponding signal input terminal in the driving backplane through the second planarization layer.

[0059] Before fabricating the second electrode layer of the third sub-device, a third planarization layer is fabricated. The third planarization layer is located around the corresponding third sub-device. The third planarization layer at least covers the side of the first carrier injection layer and the side of the light-emitting functional layer in the corresponding third sub-device. At least a portion of the third planarization layer is located between the second electrode layer in the corresponding third sub-device and the driving backplane. The second electrode layer in the third sub-device is coupled to the corresponding signal input terminal in the driving backplane through the third planarization layer.

[0060] Optionally, the step of fabricating the first sub-device and the first dielectric layer closest to the drive backplane specifically includes:

[0061] The third dielectric portion of the first dielectric layer is formed on the first temporary substrate, and the first sub-device includes a second electrode layer, a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer that are sequentially stacked in a direction away from the first temporary substrate.

[0062] The first electrode layer of the first sub-device is bonded to the bonding electrode layer on the driving backplane, and then the first temporary substrate is removed.

[0063] A first spacer insulating layer is fabricated, which covers the side surface of the first sub-device and the side surface of the third dielectric portion included in the first dielectric layer.

[0064] A first connecting electrode is fabricated, and a second electrode layer in the first sub-device is coupled to a corresponding signal input terminal in the driving backplane through the first connecting electrode; at least a portion of the first spacer insulating layer is located between the first connecting electrode and the first sub-device.

[0065] The first dielectric layer is fabricated by an insulating film layer that covers the third dielectric portion, the first connecting electrode, and the first spacer insulating layer.

[0066] The second dielectric layer is formed on the second temporary substrate, including the third dielectric portion, and the second sub-device includes a second electrode layer, a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer, which are sequentially stacked in a direction away from the second temporary substrate, and the first dielectric layer includes a second bonding film layer.

[0067] The second bonding sub-film layer in the first dielectric layer is bonded to the insulator film layer in the first dielectric layer, and then the second temporary substrate is removed.

[0068] Optionally, the steps for fabricating the second sub-device, the second dielectric layer, and the third sub-device specifically include:

[0069] A second connection electrode is fabricated, which is coupled to the first electrode layer and the corresponding signal input terminal in the second sub-device, respectively.

[0070] A second spacer insulating layer is fabricated, which covers the side surface of the second sub-device, the side surface of the third dielectric portion of the second dielectric layer, and the second connection electrode.

[0071] A third connection electrode is fabricated, which is coupled to the second electrode layer and the corresponding signal input terminal in the second sub-device, respectively.

[0072] The second dielectric layer includes an insulating film layer that covers the third dielectric portion of the second dielectric layer, the third connecting electrode, and the second spacer insulating layer.

[0073] The third sub-device formed on the third temporary substrate includes a second electrode layer, a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer stacked sequentially in a direction away from the third temporary substrate, and the second dielectric layer includes a second bonding film layer.

[0074] The second bonding sub-film layer in the second dielectric layer is bonded to the insulator film layer in the second dielectric layer, and then the third temporary substrate is removed;

[0075] A fourth connection electrode is fabricated, which is coupled to the first electrode layer and the corresponding signal input terminal in the third sub-device.

[0076] A third spacer insulating layer is fabricated, which covers the side surface of the third sub-device and the fourth connecting electrode;

[0077] A fifth connection electrode is fabricated, which is coupled to the second electrode layer of the third sub-device and the corresponding signal input terminal, respectively.

[0078] Optionally, the manufacturing method further includes:

[0079] After removing the second temporary substrate, an etching process is performed on the second sub-device so that the orthographic projection of the light-emitting part in the second sub-device onto the driving backplane is located inside the orthographic projection of the light-emitting part in the first sub-device onto the driving backplane.

[0080] After removing the third temporary substrate, an etching process is performed on the third sub-device so that the orthographic projection of the light-emitting part of the third sub-device on the driving backplane is located inside the orthographic projection of the light-emitting part of the second sub-device on the driving backplane.

[0081] The light-emitting functional part includes the second carrier injection layer, the light-emitting functional layer, and the first carrier injection layer. Attached Figure Description

[0082] The accompanying drawings, which are included to provide a further understanding of this disclosure and form part of this disclosure, illustrate exemplary embodiments of the present disclosure and are used to explain the disclosure, but do not constitute an undue limitation of the disclosure. In the drawings:

[0083] Figure 1 is a schematic diagram of the reflectance curves of the first dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0084] Figure 2 is a schematic diagram of the transmittance curves of the first dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0085] Figure 3 is a schematic diagram of the reflectivity curves of the second dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0086] Figure 4 is a schematic diagram of the transmittance curves of the second dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0087] Figure 5 is a schematic diagram of the first layout of the display panel provided in an embodiment of this disclosure;

[0088] Figure 6 is a first schematic diagram of the distribution of the light-emitting device array provided in an embodiment of this disclosure;

[0089] Figure 7 is a first schematic diagram of the dielectric layer provided in an embodiment of this disclosure;

[0090] Figures 8-34 are schematic diagrams illustrating a fabrication process of a light-emitting device provided in an embodiment of this disclosure;

[0091] Figure 35 is a schematic diagram of the reflectivity curves of the first dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0092] Figure 36 is a schematic diagram of the transmittance curves of the first dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0093] Figure 37 is a schematic diagram of the reflectivity curves of the second dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0094] Figure 38 is a schematic diagram of the transmittance curves of the second dielectric layer for different wavelengths of light provided in the embodiments of this disclosure;

[0095] Figure 39 is a schematic diagram of a second layout of a display panel provided in an embodiment of this disclosure;

[0096] Figure 40 is a second schematic diagram of the distribution of the light-emitting device array provided in an embodiment of this disclosure;

[0097] Figure 41 is a second schematic diagram of the dielectric layer provided in an embodiment of this disclosure;

[0098] Figures 42-59 are schematic diagrams illustrating a manufacturing process of a light-emitting device provided in an embodiment of this disclosure. Detailed Implementation

[0099] To further illustrate the display panel, its manufacturing method, and the display device provided in the embodiments of this disclosure, a detailed description is provided below with reference to the accompanying drawings.

[0100] In related technologies, the light-emitting devices used in display products cannot achieve high brightness and high color gamut color display; moreover, the light emitted by the sub-devices can easily excite other sub-devices of different colors, resulting in photoluminescence and affecting the display yield of the display products.

[0101] Please refer to Figures 5, 6, 34, 39, 40, and 59. This disclosure provides a display panel, including: a driving backplate 14 and a light-emitting device 60 disposed on the driving backplate 14. The light-emitting device 60 includes:

[0102] At least two sub-devices (such as a red sub-device, a blue sub-device, and a green sub-device) are stacked sequentially along a direction away from the drive backplate 14;

[0103] At least one dielectric layer (such as a first dielectric layer 31 and a second dielectric layer 32) is provided, at least a portion of which is located between two adjacent sub-devices. The dielectric layer has a higher transmittance of light emitted from the first sub-device than it has a higher transmittance of light emitted from the second sub-device. The first sub-device is located between the dielectric layer and the drive backplate 14, and the second sub-device is located on the side of the dielectric layer facing away from the drive backplate 14.

[0104] For example, the display panel includes a plurality of light-emitting devices 60, which are arranged in an array on the driving backplate 14.

[0105] For example, the at least two sub-devices include a first sub-device, a second sub-device, and a third sub-device stacked sequentially in a direction away from the drive backplane 14; the at least one dielectric layer includes a first dielectric layer 31 and a second dielectric layer 32, wherein the first dielectric layer 31 is located between the first sub-device and the second sub-device, and the second dielectric layer 32 is located between the second sub-device and the third sub-device; the transmittance of the first dielectric layer 31 to the light emitted by the first sub-device is greater than its transmittance to the light emitted by the second and third sub-devices; the transmittance of the second dielectric layer 32 to the light emitted by the first and second sub-devices is greater than its transmittance to the light emitted by the third sub-device.

[0106] For example, the first sub-device includes a red sub-device, the second sub-device includes a green sub-device, and the third sub-device includes a blue sub-device; the red sub-device emits red light, the green sub-device emits green light, and the blue sub-device emits blue light. For example, the first dielectric layer 31 is capable of reflecting green light and transmitting red light; the second dielectric layer 32 is capable of reflecting blue light and transmitting both red and green light.

[0107] For example, the dielectric layer is designed to maximize the transmittance of the light it transmits and the reflectivity of the light it reflects. The thickness of the dielectric layer can be set to no more than 1.2 μm to better accommodate etching processes and effectively reduce the risk of etching residue.

[0108] For example, the light-emitting device 60 includes micro LED devices, and each sub-device can form a micro LED sub-device, but is not limited thereto. For example, the size of the sub-device is less than 50 μm, which is particularly suitable for display panel designs with a size of less than 10 μm and a pixel PPI greater than 2000. A silicon-based driving backplane is the best choice for the driving backplane.

[0109] More specifically, when the light-emitting device 60 is disposed on a silicon-based driving backplane, the circuit traces are located in a multilayer structure below the light-emitting device 60. From a top view, the arrangement of the light-emitting device 60 is shown in Figures 6 and 40, respectively. Below the projected area of ​​the light-emitting device 60 is a signal input terminal 142 of the driving backplane, used to provide driving signals to the light-emitting device 60. Figures 6 and 40 also illustrate the bonding region Q1 of the light-emitting device 60.

[0110] When the light-emitting device 60 is disposed on the glass-based driving backplane, the circuit traces are located on the surface of the glass-based driving backplane. From the top view, the arrangement of the light-emitting device 60 is shown in Figures 5 and 39. It can be simply divided into the bonding area Q1 of the light-emitting device 60 and the driving trace area. Below the bonding area Q1 is the signal input terminal 142 fabricated on the driving backplane. The signal input terminal 142 provides driving signals for the light-emitting device 60. The driving trace area includes, but is not limited to, the first power line VDD, the second power line VSS, the gate line GA, and the data line DA, as well as several to a dozen transistor structures required to drive the light-emitting device 60.

[0111] As can be seen from the specific structure of the display panel described above, in the display panel provided in this embodiment, the light-emitting device 60 includes at least two sub-devices stacked together, with a dielectric layer disposed between adjacent sub-devices. The dielectric layer has bandpass characteristics, and the transmittance of the dielectric layer for light emitted by the sub-devices on the side of the dielectric layer facing the driving backplate 14 is greater than the transmittance of the dielectric layer for light emitted by the sub-devices on the side of the dielectric layer facing away from the driving backplate 14. This arrangement allows light emitted by the sub-devices on the side of the dielectric layer facing the driving backplate 14 to pass through the dielectric layer better, while light emitted by the sub-devices on the side of the dielectric layer facing away from the driving backplate 14 can be reflected by the dielectric layer and emitted better from the light-emitting side of the light-emitting device 60, thereby better realizing high brightness and high color gamut color display of the light-emitting device 60. At the same time, the above arrangement avoids the sub-devices near the driving backplate 14 from being excited by light emitted by the sub-devices far from the driving backplate 14, thereby avoiding photoluminescence phenomenon in the sub-devices near the driving backplate 14.

[0112] More specifically, when the light-emitting device 60 includes a red sub-device, a first dielectric layer 31, a green sub-device, a second dielectric layer 32, and a blue sub-device stacked sequentially along a direction away from the driving backplate 14, the wavelength of the blue light emitted by the blue sub-device is shorter than the wavelength of the green light emitted by the green sub-device, and the wavelength of the green light emitted by the green sub-device is shorter than the wavelength of the red light emitted by the red sub-device. This arrangement not only ensures that the forward light emitted by the sub-devices near the driving backplate 14 does not excite the sub-devices far from the driving backplate 14, but also effectively prevents the short-wavelength blue light from exciting the green and red sub-devices, and effectively prevents the short-wavelength green light from exciting the red sub-device, thus avoiding adverse effects on the color gamut of the light-emitting device 60. Therefore, this arrangement improves the forward light emission brightness of the light-emitting device 60, ensures color purity, and enhances the display color gamut.

[0113] As shown in Figures 7 and 41, in some embodiments, the dielectric layer includes multiple sub-film layers (e.g., first sub-film layer Z1, second sub-film layer Z2, third sub-film layer Z3, fourth sub-film layer Z4, fifth sub-film layer Z5, and sixth sub-film layer Z6) stacked sequentially along a direction perpendicular to the drive backplate 14, with adjacent sub-film layers having different refractive indices.

[0114] For example, the multilayer subfilm layer includes multiple high-refractive-index subfilm layers and multiple low-refractive-index subfilm layers, wherein the high-refractive-index subfilm layers and the low-refractive-index subfilm layers are alternately arranged in a direction perpendicular to the drive backplate 14. For example, in the multilayer subfilm layer, at least two subfilm layers have different thicknesses.

[0115] For example, the high refractive index sub-film layer can be made of high refractive index materials such as niobium oxide and titanium oxide, and the low refractive index sub-film layer can be made of low refractive index materials such as magnesium fluoride and silicon oxide, but is not limited to these.

[0116] By configuring the dielectric layer with the above structure, the dielectric layer can better realize the function of reflecting or transmitting light in different wavelength ranges.

[0117] As shown in Figures 34 and 59, in some embodiments, in two adjacent sub-devices, the orthographic projection of the light-emitting functional portion (including: first carrier injection layers R-220, G-220, B-220; light-emitting functional layers R-230, G-230, B-230; second carrier injection layers R-240, G-240, B-240) of the sub-device farther from the driving backplate 14 onto the driving backplate 14 at least partially overlaps with the orthographic projection of the light-emitting functional portion of the sub-device closer to the driving backplate 14 onto the driving backplate 14.

[0118] For example, in two adjacent sub-devices, the light-emitting portion of the sub-device closer to the driving backplate 14 is projected onto the driving backplate 14, while the light-emitting portion of the sub-device farther from the driving backplate 14 is projected onto the driving backplate 14.

[0119] For example, in two adjacent sub-devices, the orthographic projection of the light-emitting portion of the sub-device farther from the driving backplate 14 onto the driving backplate 14 is located inside the orthographic projection of the light-emitting portion of the sub-device closer to the driving backplate 14 onto the driving backplate 14. Further, in two adjacent sub-devices, the boundary of the orthographic projection of the light-emitting portion of the sub-device closer to the driving backplate 14 onto the driving backplate 14 may surround the orthographic projection of the light-emitting portion of the sub-device farther from the driving backplate 14 onto the driving backplate 14.

[0120] After stacking adjacent sub-devices together, the sub-devices far from the driving backplane 14 can be etched a second time to make the light-emitting part of the sub-device have a suitable size, thereby improving the alignment accuracy when bonding and aligning the sub-devices.

[0121] As shown in FIG7, in some embodiments, the dielectric layer includes a first dielectric portion 301, a first bonded membrane layer 302 and a second dielectric portion 303 sequentially stacked in a direction away from the drive backplate 14.

[0122] The first medium portion 301 includes a first sub-film layer Z1 and a second sub-film layer Z2 alternately arranged along a direction perpendicular to the drive back plate 14, wherein the refractive index of the first sub-film layer Z1 is greater than the refractive index of the second sub-film layer Z2.

[0123] The second medium portion 303 includes a third sub-film layer Z3 and a fourth sub-film layer Z4 alternately arranged along a direction perpendicular to the drive back plate 14, wherein the refractive index of the third sub-film layer Z3 is greater than the refractive index of the fourth sub-film layer Z4;

[0124] The first bonded sub-film layer 302 is located between the adjacent second sub-film layer Z2 and the fourth sub-film layer Z4.

[0125] For example, at least one of the first sub-film layer Z1 and the third sub-film layer Z3 is made of niobium oxide or titanium oxide; at least one of the second sub-film layer Z2 and the fourth sub-film layer Z4 is made of magnesium fluoride or silicon oxide; the first bonding sub-film layer 302 is made of transparent organic adhesive (bonding adhesive), but is not limited thereto.

[0126] For example, the refractive index of the first bonded sub-film layer 302 is between 1.4 and 1.6, and may include endpoint values. For instance, the refractive index of the first bonded sub-film layer 302 is 1.5. The thickness of the first bonded sub-film layer 302 is between 0.8 μm and 1.2 μm, and may include endpoint values. For instance, the thickness of the first bonded sub-film layer 302 may be 0.9 μm, 1.0 μm, 1.1 μm, etc. The above thickness range is beneficial for improving the bonding strength between the first dielectric portion 301, the first bonded sub-film layer 302, and the second dielectric portion 303, and for preventing cracking of the dielectric layer.

[0127] The thickness of each sub-film layer included in the dielectric layer (such as the first bonded sub-film layer 302, and the sub-film layers in the first dielectric portion 301 and the second dielectric portion 303) may not be completely consistent, and it is not necessary to strictly satisfy n*d=λ / 4, where n*d represents the optical path, d represents the thickness of the sub-film layer, n represents the refractive index of the sub-film layer, and λ represents the wavelength of the light.

[0128] For example, the first dielectric layer 31 and the second dielectric layer 32 of the light-emitting device 60 can be set according to the thickness of each sub-film layer shown in Table 1, where the unit of the data in Table 1 is nm.

[0129] Table 1

[0130] As shown in Figures 1 to 4, the first dielectric layer 31 and the second dielectric layer 32 can achieve a reflectivity of over 99% and a transmittance of over 90% for the target wavelength band.

[0131] By configuring the dielectric layer with the above structure, it is possible not only to ensure that the dielectric layer achieves the corresponding transmittance and reflectance for different light, but also to ensure the bonding yield of the dielectric layer itself, as well as the bonding yield between the dielectric layer and its adjacent film layers.

[0132] As shown in Figures 34 and 59, in some embodiments, the sub-device includes a first electrode layer (R-210, G-210, B-210) and a light-emitting functional portion, which are sequentially stacked along a direction away from the driving backplate 14. The light-emitting functional portion includes a first carrier injection layer (R-220, G-220, B-220), a light-emitting functional layer (R-230, G-230, B-230), and a second carrier injection layer (R-240, G-240, B-240) sequentially stacked along a direction away from the driving backplate 14.

[0133] The sub-device also includes a second electrode layer (R-250, G-250, B-250), which is in contact with the side of the second carrier injection layer.

[0134] For example, the first carrier injection layer includes a P-doped layer, the light-emitting functional layer includes a multi-quantum well (MQW) layer, and the second carrier injection layer includes an N-doped layer.

[0135] For example, the first electrode layer and / or the second electrode layer may be transparent electrode layers, but are not limited to this.

[0136] For example, the thickness of the second carrier injection layer is greater than the thickness of the first carrier injection layer. For instance, the thickness of the first carrier injection layer is between 100 nm and 200 nm, and the thickness of the second carrier injection layer is between 1 μm and 2 μm, which may include endpoint values.

[0137] For example, the orthographic projection of the second electrode layer on the drive backplate 14 surrounds the second carrier injection layer; the second electrode layer is in contact with each side of the second carrier injection layer.

[0138] The aforementioned configuration of transparent electrodes for the first and second electrode layers improves the light extraction efficiency of the light-emitting device 60 and reduces light absorption losses by the first and second electrode layers. Furthermore, by laterally contacting the second electrode layer with the second carrier injection layer, coupling between the two layers is achieved, preventing the second electrode layer from blocking the emitted light and further improving the light extraction efficiency of the light-emitting device 60 while reducing light absorption losses by the second electrode layer.

[0139] The aforementioned setting of the thickness of the second carrier injection layer being greater than that of the first carrier injection layer results in a larger surface area on the side of the second carrier injection layer. This allows for electrical conduction by setting the second electrode layer to contact the side of the second carrier injection layer, thus better ensuring electrical conduction performance.

[0140] Especially for small-sized micro-LED light-emitting devices 60, due to the smaller chip size (i.e., the size of the light-emitting functional part in each sub-device), the perimeter-to-area ratio of the chip's orthographic projection on the driving backplane 14 is larger. Therefore, the electrical conduction characteristics achieved by setting the second electrode layer to contact all sides of the second carrier injection layer are superior. More specifically, taking a square as an example where the chip's orthographic projection on the driving backplane 14 is a square with side length 'a', the perimeter-to-area ratio is 4a / a. 2 =4 / a. For a chip with a top surface size of 4μm, the front overlap area is 16μm. 2 The maximum side overlap area is 4*4μm*2μm=32μm 2 .

[0141] As shown in Figures 34 and 59, in some embodiments, in two adjacent sub-devices, the second electrode layer (R-250, G-250, B-250) in the sub-device closer to the drive backplane 14 is coupled to the first electrode layer (R-210, G-210, B-210) in the sub-device farther from the drive backplane 14.

[0142] For example, the second electrode layer of the first sub-device is coupled to the first electrode layer of the second sub-device through a third conductive connection portion X3, and the second electrode layer of the second sub-device is coupled to the first electrode layer of the third sub-device through a fifth conductive connection portion X5.

[0143] A driving signal V1 is applied to the first electrode layer of the first sub-device; a driving signal V2 is applied to the second electrode layer of the first sub-device and the first electrode layer of the second sub-device; a driving signal V3 is applied to the second electrode layer of the second sub-device and the first electrode layer of the third sub-device; and a driving signal V4 is applied to the second electrode layer of the third sub-device. The voltage values ​​must satisfy V1 ≥ V2 ≥ V3 ≥ V4 to ensure that each sub-device is subjected to a positive voltage signal and can operate normally. The electrode voltage difference of the first sub-device is V1 - V2, the electrode voltage difference of the second sub-device is V2 - V3, and the electrode voltage difference of the third sub-device is V3 - V4.

[0144] The above configuration helps reduce the number of signal input terminals 142 on the driver backplane 14, simplifying the layout complexity of the driver backplane 14. Simultaneously, the shared electrical signal design reduces the area ratio of non-light-emitting areas, increasing the product's aperture ratio.

[0145] As shown in FIG34, in some embodiments, the drive backplane 14 further includes a plurality of signal input terminals 142;

[0146] The display panel further includes at least two planarization layers, which are located around the corresponding sub-devices. The planarization layers at least cover the side of the first carrier injection layer and the side of the light-emitting functional layer in the corresponding sub-devices.

[0147] At least a portion of the planarization layer is located between the second electrode layer in the corresponding sub-device and the drive backplane 14; the second electrode layer in each sub-device penetrates at least one layer of the planarization layer and is coupled to the corresponding signal input terminal 142.

[0148] For example, the display panel further includes an encapsulation layer 50 located on the side of the at least two sub-devices facing away from the driving backplate 14.

[0149] For example, the driving backplane 14 includes a bonding electrode layer 141, which is bonded to the first electrode layer of the first sub-device and is used to provide a driving signal to the first electrode layer of the first sub-device.

[0150] For example, the bonding electrode layer 141 and the plurality of signal input terminals 142 are disposed in the same layer and made of the same material, and can be formed simultaneously in a single patterning process. The bonding electrode layer 141 and the signal input terminals 142 can be made of copper, but are not limited to this.

[0151] For example, the display panel includes a first planarization layer PLN1, a second planarization layer PLN2, and a third planarization layer PLN3.

[0152] The first planarization layer PLN1 is located around the corresponding first sub-device. The first planarization layer PLN1 covers the sides of the first electrode layer, the first carrier injection layer, and the light-emitting functional layer in the first sub-device. The first planarization layer PLN1 also covers the sides of the bonding electrode layer 141 and each signal input terminal 142. At least a portion of the first planarization layer PLN1 is located between the second electrode layer in the first sub-device and the driving backplane 14. The second electrode layer in the first sub-device penetrates the first planarization layer PLN1 and is coupled to the corresponding signal input terminal 142.

[0153] The second planarization layer PLN2 is located around the corresponding second sub-device. The second planarization layer PLN2 covers the sides of the first electrode layer, the first carrier injection layer, and the light-emitting functional layer in the second sub-device. At least a portion of the second planarization layer PLN2 is located between the second electrode layer in the second sub-device and the driving backplate 14. The second electrode layer in the second sub-device penetrates the second planarization layer PLN2 and is coupled to the corresponding signal input terminal 142 through the first conductive connection portion X1.

[0154] The third planarization layer PLN3 is located around the corresponding third sub-device. The third planarization layer PLN3 covers the sides of the first electrode layer, the first carrier injection layer, the light-emitting functional layer, and the second electrode layer in the third sub-device. At least a portion of the third planarization layer PLN3 is located between the second electrode layer in the third sub-device and the driving backplane 14. The second electrode layer in the third sub-device penetrates the third planarization layer PLN3 and is coupled to the corresponding signal input terminal 142 via the fourth conductive connection X4 and the second conductive connection X2.

[0155] For example, the first conductive connection X1 and the second conductive connection X2 are formed simultaneously with the second electrode layer of the first sub-device in the same patterning process. The fourth conductive connection X4 is formed simultaneously with the second electrode layer of the second sub-device in the same patterning process.

[0156] The planarization layer described above, including the first conductive connection X1, the second conductive connection X2, and the fourth conductive connection X4, not only ensures the stability of the device but also meets the etching process requirements for the etching depth of the film layer, ensuring the yield of the electrical connection between the electrode layer and the signal input terminal 142 and reducing the connection difficulty between the electrode layer and the signal input terminal 142.

[0157] As shown in FIG41, in some embodiments, the dielectric layer includes a third dielectric portion 304, an insulator film layer 305, and a second bonding film layer 306 sequentially stacked in a direction away from the drive backplate 14.

[0158] The third medium portion 304 includes a fifth sub-film layer Z5 and a sixth sub-film layer Z6 alternately arranged in a direction perpendicular to the drive backplate 14, wherein the refractive index of the fifth sub-film layer Z5 is greater than the refractive index of the sixth sub-film layer Z6.

[0159] For example, the refractive index of the second bonding sub-film layer 306 is between 1.4 and 1.6, and may include endpoint values. For instance, the refractive index of the second bonding sub-film layer 306 is 1.5. The thickness of the second bonding sub-film layer 306 is between 0.8 μm and 1.2 μm, and may include endpoint values. For instance, the thickness of the second bonding sub-film layer 306 may be 0.9 μm, 1.0 μm, 1.1 μm, etc. The above thickness range is beneficial for improving the bonding strength between the third dielectric portion 304, the second bonding sub-film layer 306, and the insulator film layer 305, and preventing cracking of the dielectric layer.

[0160] For example, the material of the insulator film layer 305 can be silicon oxide, silicon nitride, or other materials; for example, silicon oxide with a low refractive index can be selected, but it is not limited to this.

[0161] For example, the fifth sub-film layer Z5 is made of niobium oxide or titanium oxide; the sixth sub-film layer Z6 is made of magnesium fluoride or silicon oxide; and the second bonding sub-film layer 306 is made of transparent organic adhesive, but is not limited to these.

[0162] For example, the thickness of each sub-film layer included in the dielectric layer (such as the second bonding sub-film layer 306, the insulator sub-film layer 305, and the sub-film layer in the third dielectric portion 304) may not be completely consistent, and it is not necessary to strictly satisfy n*d=λ / 4, where n*d represents the optical path.

[0163] For example, the first dielectric layer 31 and the second dielectric layer 32 of the light-emitting device 60 can be set according to the thickness of each sub-film layer shown in Table 2, where the unit of the data in Table 2 is nm. The insulating layer included in the first dielectric layer 31 and the second dielectric layer 32 in Table 2 is the corresponding insulating sub-film layer 305.

[0164] Table 2

[0165] As shown in Figures 35 to 38, the first dielectric layer 31 and the second dielectric layer 32 can achieve a reflectivity of over 99% and a transmittance of over 90% for the target wavelength band.

[0166] By configuring the dielectric layer with the above structure, it is possible not only to ensure that the dielectric layer achieves the corresponding transmittance and reflectance for different light, but also to ensure the bonding yield of the dielectric layer itself, as well as the bonding yield between the dielectric layer and its adjacent film layers.

[0167] As shown in Figure 59, in some embodiments, the driving backplane 14 further includes a plurality of signal input terminals 142; the sub-device includes a first electrode layer (R-210, G-210, B-210), a light-emitting functional portion, and a second electrode layer (R-250, G-250, B-250) stacked sequentially along a direction away from the driving backplane 14; the light-emitting functional portion includes a first carrier injection layer (R-220, G-220, B-220), a light-emitting functional layer (R-230, G-230, B-230), and a second carrier injection layer (R-240, G-240, B-240) stacked sequentially along a direction away from the driving backplane 14; the first electrode layer and / or the second electrode layer in each sub-device are coupled to the corresponding signal input terminal 142 through corresponding connection electrodes; the insulator film layer 305 extends between adjacent connection electrodes.

[0168] For example, the second electrode layer and the second carrier injection layer are configured to make contact with the surface of the drive backplate 14 facing away from each other. With this configuration, the thickness of the second carrier injection layer can be reduced without affecting the electrical connection between the second electrode layer and the second carrier injection layer, and it also helps to reduce the overall thickness of the display panel.

[0169] For example, the first electrode layer in the first sub-device is coupled to the bonding electrode layer 141 on the driving backplane 14, and the second electrode layer in the first sub-device is coupled to the corresponding signal input terminal 142 via a first connecting electrode 41. The first electrode layer in the second sub-device is coupled to the corresponding signal input terminal 142 via a second connecting electrode 42, and the second electrode layer in the second sub-device is coupled to the corresponding signal input terminal 142 via a third connecting electrode 43. The first electrode layer in the third sub-device is coupled to the corresponding signal input terminal 142 via a fourth connecting electrode 44, and the second electrode layer in the third sub-device is coupled to the corresponding signal input terminal 142 via a fifth connecting electrode 45. This configuration allows each sub-device to be driven independently without voltage dependence.

[0170] For example, the display panel further includes: at least one spacer insulating layer, the spacer insulating layer being in contact with the side of the corresponding sub-device, at least a portion of the spacer insulating layer being located between the two connection electrodes to which the corresponding sub-device is connected, and / or, at least a portion of the spacer insulating layer being located between the side of the corresponding sub-device and the connection electrode to which the sub-device is connected.

[0171] For example, the display panel includes a first spacer insulating layer GI1, a second spacer insulating layer GI2, and a third spacer insulating layer GI3; the first spacer insulating layer GI1 covers the side surface of the first sub-device and the side surface of the third dielectric portion 304 included in the first dielectric layer 31; the second spacer insulating layer GI2 covers the side surface of the second sub-device and the side surface of the third dielectric portion 304 included in the second dielectric layer 32, as well as the second connection electrode 42; the third spacer insulating layer GI3 covers the side surface of the third sub-device and the fourth connection electrode 44.

[0172] The display panel described above includes a spacer insulating layer, which not only ensures the stability of the device and meets the etching process requirements for the etching depth of the film layer, but also ensures the yield of the electrical connection between the electrode layer and the signal input terminal 142, and avoids the risk of panel warping caused by the accumulation of planarization layer thickness.

[0173] As shown in Figure 59, in some embodiments, the display panel further includes an encapsulation layer 50, which completely encapsulates the at least two sub-devices and the at least one dielectric layer; the outer surface of the encapsulation layer 50 facing away from the driving backplate 14 is partially spherical.

[0174] The above configuration allows the encapsulation layer 50 to completely enclose the light-emitting device 60, and forms a lens-like spherical shape on the outer surface of the encapsulation layer 50 facing away from the driving backplate 14, thereby improving the light emission efficiency of the light-emitting device 60.

[0175] As shown in Figures 34 and 59, in some embodiments, the orthographic projection of each of the sub-devices on the drive backplane 14 is located inside the orthographic projection of the dielectric layer on the drive backplane 14.

[0176] For example, the size of the first dielectric layer 31 is larger than the size of the second dielectric layer 32.

[0177] It should be noted that the transmission and reflection characteristics of the dielectric layer are only applicable to the LED light emission spectrum range. For other wavelength ranges, no requirements are imposed, and the light emission effect will not be affected.

[0178] The above arrangement better ensures that light emitted from the sub-devices located on the side of the dielectric layer facing the driving backplate 14 can pass through the dielectric layer better, and light emitted from the sub-devices located on the side of the dielectric layer away from the driving backplate 14 can be reflected by the dielectric layer and better emitted from the light-emitting side of the light-emitting device 60, thereby better realizing the high brightness and high color gamut color display of the light-emitting device 60; at the same time, the above arrangement better avoids the sub-devices close to the driving backplate 14 being excited by light emitted from the sub-devices far from the driving backplate 14, thereby avoiding photoluminescence phenomenon in the sub-devices close to the driving backplate 14.

[0179] This disclosure also provides a display device, including the display panel provided in the above embodiments.

[0180] It should be noted that the display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer, but is not limited to these; the display device also includes flexible circuit boards, printed circuit boards, and backplanes, etc.

[0181] In the display panel provided in the above embodiment, the light-emitting device 60 includes at least two sub-devices stacked together, with a dielectric layer disposed between adjacent sub-devices. The dielectric layer has bandpass characteristics, and the transmittance of the dielectric layer for light emitted by the sub-devices on the side of the dielectric layer facing the driving backplate 14 is greater than the transmittance of the dielectric layer for light emitted by the sub-devices on the side of the dielectric layer facing away from the driving backplate 14. This arrangement allows light emitted by the sub-devices on the side of the dielectric layer facing the driving backplate 14 to pass through the dielectric layer better, while light emitted by the sub-devices on the side of the dielectric layer facing away from the driving backplate 14 can be reflected by the dielectric layer and emitted better from the light-emitting side of the light-emitting device 60, thereby better achieving high brightness and high color gamut color display of the light-emitting device 60. At the same time, the above arrangement avoids the sub-devices near the driving backplate 14 from being excited by light emitted by the sub-devices far from the driving backplate 14, thereby avoiding photoluminescence phenomenon in the sub-devices near the driving backplate 14.

[0182] Therefore, the display device provided in this embodiment of the present disclosure also has the above-mentioned beneficial effects when including the above-described display panel, which will not be repeated here.

[0183] As shown in Figures 8 to 34 and Figures 42 to 59, this disclosure also provides a method for manufacturing a display panel, used to manufacture the display panel provided in the above embodiments. The manufacturing method includes:

[0184] Provide a drive backplane 14;

[0185] At least two sub-devices and at least one dielectric layer are fabricated on the drive backplane 14; the at least two sub-devices are stacked sequentially in a direction away from the drive backplane 14; at least a portion of the dielectric layer is located between two adjacent sub-devices, and the transmittance of the dielectric layer to light emitted by the first portion of the sub-devices is greater than its transmittance to light emitted by the second portion of the sub-devices, the first portion of the sub-devices is located between the dielectric layer and the drive backplane 14, and the second portion of the sub-devices is located on the side of the dielectric layer facing away from the drive backplane 14.

[0186] For example, the provided drive backplane 14 has a bonding electrode layer 141 and a plurality of signal input terminals 142 formed thereon, but is not limited thereto.

[0187] In the display panel manufactured using the embodiments of this disclosure, the light-emitting device 60 includes at least two sub-devices stacked together, with a dielectric layer disposed between adjacent sub-devices. The dielectric layer has bandpass characteristics, and the transmittance of the dielectric layer for light emitted from the sub-devices on the side of the dielectric layer facing the driving backplate 14 is greater than the transmittance of the dielectric layer for light emitted from the sub-devices on the side of the dielectric layer facing away from the driving backplate 14. This arrangement allows light emitted from the sub-devices on the side of the dielectric layer facing the driving backplate 14 to pass through the dielectric layer better, while light emitted from the sub-devices on the side of the dielectric layer facing away from the driving backplate 14 can be reflected by the dielectric layer and emitted more effectively from the light-emitting side of the light-emitting device 60. This better achieves high brightness and high color gamut color display of the light-emitting device 60. At the same time, the above arrangement avoids the sub-devices near the driving backplate 14 from being excited by light emitted from the sub-devices far from the driving backplate 14, thereby avoiding photoluminescence in the sub-devices near the driving backplate 14.

[0188] In some embodiments, the step of fabricating the first sub-device and the first dielectric layer 31 closest to the driving backplate 14 on the driving backplate 14 specifically includes: as shown in FIG8, for example, sequentially fabricating the second carrier material layer R-24, the light-emitting functional material layer R-23, the first carrier material layer R-22, and the first electrode material layer R-21 on the first transition substrate 11.

[0189] As shown in Figure 9, the second carrier material layer R-24, the light-emitting functional material layer R-23, the first carrier material layer R-22, and the first electrode material layer R-21 are transferred onto the second transition substrate 12, and then a patterning process is performed to achieve pixelation, forming the second carrier injection layer R-240, the light-emitting functional layer R-230, the first carrier injection layer R-220, and the first electrode layer R-210.

[0190] As shown in Figure 10, the second carrier injection layer R-240, the light-emitting functional layer R-230, the first carrier injection layer R-220, and the first electrode layer R-210 are transitioned onto the first temporary substrate 13. That is, the first sub-device, comprising the second carrier injection layer R-240, the light-emitting functional layer R-230, the first carrier injection layer R-220, and the first electrode layer R-210, which are sequentially stacked along a direction away from the first temporary substrate 13, is formed on the first temporary substrate.

[0191] As shown in Figures 11 and 12, the first electrode layer R-210 of the first sub-device is bonded to the bonding electrode layer 141 on the driving backplate 14, and then the first temporary substrate 13 is removed.

[0192] As shown in Figure 14, a second electrode layer R-250 of the first sub-device is fabricated, which is in contact with the side of the second carrier injection layer R-240 of the first sub-device; in the same patterning process, a first conductive connection X1 and a second conductive connection X2 are formed simultaneously.

[0193] As shown in Figure 15, a first dielectric portion 301 is fabricated in the first dielectric layer 31. The first dielectric portion 301 is located on the side of the first sub-device facing away from the drive backplate 14. A via is formed on the first dielectric portion 301 to expose the second electrode layer R-250 of the first sub-device.

[0194] As shown in Figure 16, by way of example, a second carrier material layer G-24, a light-emitting functional material layer G-23, a first carrier material layer G-22, and a first electrode material layer G-21 are sequentially fabricated on the first transition substrate 11.

[0195] As shown in Figure 17, the second carrier material layer G-24, the light-emitting functional material layer G-23, the first carrier material layer G-22, and the first electrode material layer G-21 are transferred onto the second transition substrate 12, and then a patterning process is performed to achieve pixelation, forming the second carrier injection layer G-240, the light-emitting functional layer G-230, the first carrier injection layer G-220, and the first electrode layer G-210.

[0196] As shown in Figure 18, the second carrier injection layer G-240, the light-emitting functional layer G-230, the first carrier injection layer G-220, and the first electrode layer G-210 are transitioned onto the second temporary substrate 15. That is, the second sub-device, comprising the second carrier injection layer G-240, the light-emitting functional layer G-230, the first carrier injection layer G-220, and the first electrode layer G-210, sequentially stacked along a direction away from the second temporary substrate 15, is formed on the second temporary substrate 15.

[0197] As shown in Figure 18, on the side of the first electrode layer G-210 of the second sub-device facing away from the second temporary substrate 15, the second dielectric portion 303 and the first bonding sub-film layer 302 of the first dielectric layer 31 are sequentially fabricated.

[0198] As shown in Figures 19 and 20, the first bonding sub-film layer 302 in the first dielectric layer 31 is bonded to the first dielectric portion 301 in the first dielectric layer 31, and then the second temporary substrate 15 is removed.

[0199] As shown in Figure 22, a third conductive connection part X3 is fabricated, which is coupled to the first electrode layer G-210 and the second electrode layer R-250 respectively.

[0200] The specific steps for fabricating the second sub-device, the second dielectric layer 32, and the third sub-device include:

[0201] As shown in Figure 24, a second electrode layer G-250 of the second sub-device is fabricated, which is in contact with the side of the second carrier injection layer G-240 of the second sub-device; in the same patterning process, a fourth conductive connection X4 is formed simultaneously, which is coupled to the second conductive connection X2.

[0202] As shown in Figure 25, a first dielectric portion 301 is fabricated in the second dielectric layer 32. The first dielectric portion 301 is located on the side of the second sub-device facing away from the drive backplate 14. A via is formed on the second dielectric portion 303 to expose the second electrode layer G-250 of the second sub-device.

[0203] As shown in Figure 26, by way of example, a second carrier material layer B-24, a light-emitting functional material layer B-23, a first carrier material layer B-22, and a first electrode material layer B-21 are sequentially fabricated on the first transition substrate 11.

[0204] As shown in Figure 27, the second carrier material layer B-24, the light-emitting functional material layer B-23, the first carrier material layer B-22, and the first electrode material layer B-21 are transferred onto the second transition substrate 12, and then a patterning process is performed to achieve pixelation, forming the second carrier injection layer B-240, the light-emitting functional layer B-230, the first carrier injection layer B-220, and the first electrode layer B-210.

[0205] As shown in Figure 28, the second carrier injection layer B-240, the light-emitting functional layer B-230, the first carrier injection layer B-220, and the first electrode layer B-210 are transitioned onto the third temporary substrate 16. That is, a third sub-device is formed on the third temporary substrate 16 comprising the second carrier injection layer B-240, the light-emitting functional layer B-230, the first carrier injection layer B-220, and the first electrode layer B-210, which are sequentially stacked along a direction away from the third temporary substrate 16.

[0206] As shown in Figure 28, on the side of the first electrode layer B-210 of the third sub-device facing away from the third temporary substrate 16, the second dielectric portion 303 and the first bonding sub-film layer 302 of the second dielectric layer 32 are sequentially fabricated.

[0207] As shown in Figures 29 and 30, the first bonding sub-film layer 302 in the second dielectric layer 32 is bonded to the first dielectric portion 301 in the second dielectric layer 32, and then the third temporary substrate 16 is removed.

[0208] As shown in Figure 32, a fifth conductive connection part X5 is fabricated, which is coupled to the first electrode layer B-210 and the second electrode layer G-250 respectively.

[0209] As shown in Figure 33, a second electrode layer B-250 of the third sub-device is fabricated, which is in contact with the side of the second carrier injection layer of the third sub-device.

[0210] In some embodiments, the method of manufacturing the display panel further includes:

[0211] As shown in Figure 13, before fabricating the second electrode layer R-250 of the first sub-device, a first planarization layer PLN1 is fabricated. The first planarization layer PLN1 is located around the corresponding first sub-device. The first planarization layer PLN1 at least covers the side of the first carrier injection layer R-220 and the side of the light-emitting functional layer R-230 in the corresponding first sub-device. At least a portion of the first planarization layer PLN1 is located between the second electrode layer R-250 in the corresponding first sub-device and the driving backplate 14. A via is formed on the first planarization layer PLN1 to expose the signal input terminal 142. The second electrode layer R-250 in the first sub-device is coupled to the corresponding signal input terminal 142 in the driving backplate 14 through the via on the first planarization layer PLN1.

[0212] As shown in Figure 23, before fabricating the second electrode layer G-250 of the second sub-device, a second planarization layer PLN2 is fabricated. The second planarization layer PLN2 is located around the corresponding second sub-device. The second planarization layer PLN2 at least covers the side of the first carrier injection layer G-220 and the side of the light-emitting functional layer G-230 in the corresponding second sub-device. At least a portion of the second planarization layer PLN2 is located between the second electrode layer G-250 in the corresponding second sub-device and the driving backplate 14. A via exposing the first conductive connection portion X1 and a via exposing the second conductive connection portion X2 are formed on the second planarization layer PLN2. The second electrode layer G-250 in the second sub-device passes through the via on the second planarization layer PLN2 and is coupled to the corresponding signal input terminal 142 in the driving backplate 14 through the first conductive connection portion X1.

[0213] As shown in Figure 32, before fabricating the second electrode layer B-250 of the third sub-device, a third planarization layer PLN3 is fabricated. The third planarization layer PLN3 is located around the corresponding third sub-device. The third planarization layer PLN3 at least covers the side of the first carrier injection layer B-220 and the side of the light-emitting functional layer B-230 in the corresponding third sub-device. At least a portion of the third planarization layer PLN3 is located between the second electrode layer B-250 in the corresponding third sub-device and the driving backplate 14. A via is formed on the third planarization layer PLN3 to expose the fourth conductive connection portion X4. The second electrode layer B-250 in the third sub-device passes through the via on the third planarization layer PLN3 and is coupled to the corresponding signal input terminal 142 in the driving backplate 14 through the fourth conductive connection portion X4 and the second conductive connection portion X2.

[0214] By adopting the above chip-level bonding process, bonding is achieved using a bonding sub-film layer (bonding adhesive), which avoids large-area wafer bonding, significantly improves bonding yield, and effectively avoids the problems of severe bonding voids, large void areas, and low bonding yield that are prone to occur in wafer-level bonding processes.

[0215] In some embodiments, the step of fabricating the first sub-device and the first dielectric layer 31 closest to the driving backplane 14 on the driving backplane 14 specifically includes:

[0216] As shown in Figure 8, by way of example, a second carrier material layer R-24, a light-emitting functional material layer R-23, a first carrier material layer R-22, and a first electrode material layer R-21 are sequentially fabricated on the first transition substrate 11.

[0217] As shown in Figure 42, the second carrier material layer R-24, the light-emitting functional material layer R-23, the first carrier material layer R-22, and the first electrode material layer R-21 are transferred onto the second transition substrate 12. On the side of the second carrier material layer R-24 facing away from the second transition substrate 12, the second electrode material layer and the third dielectric material layer are sequentially fabricated. Then, a patterning process is performed to achieve pixelation, forming the third dielectric portion 304, the second electrode layer R-250, the second carrier injection layer R-240, the light-emitting functional layer R-230, the first carrier injection layer R-220, and the first electrode layer R-210.

[0218] As shown in Figure 43, the third dielectric portion 304, the second electrode layer R-250, the second carrier injection layer R-240, the light-emitting functional layer R-230, the first carrier injection layer R-220, and the first electrode layer R-210 are transitioned onto the first temporary substrate 13. That is, the third dielectric portion 304, which is included in the first dielectric layer 31, and the second electrode layer R-250, the second carrier injection layer R-240, the light-emitting functional layer R-230, the first carrier injection layer R-220, and the first electrode layer R-210, which are sequentially stacked along a direction away from the first temporary substrate 13, are formed on the first temporary substrate 13.

[0219] As shown in Figures 44 and 45, the first electrode layer R-210 of the first sub-device is bonded to the bonding electrode layer 141 on the driving backplate 14, and then the first temporary substrate 13 is removed.

[0220] As shown in Figure 46, a first spacer insulating layer GI1 is fabricated, which covers the side surface of the first sub-device and the side surface of the third dielectric portion 304 included in the first dielectric layer 31.

[0221] As shown in Figure 46, a first connecting electrode 41 is fabricated, and the second electrode layer R-250 in the first sub-device is coupled to the corresponding signal input terminal 142 in the drive backplane 14 through the first connecting electrode 41; at least a portion of the first spacer insulating layer GI1 is located between the first connecting electrode 41 and the first sub-device.

[0222] As shown in FIG46, the first dielectric layer 31 includes an insulating film layer 305, which covers the third dielectric portion 304, the first connecting electrode 41, and the first spacer insulating layer GI1.

[0223] As shown in Figure 16, by way of example, a second carrier material layer G-24, a light-emitting functional material layer G-23, a first carrier material layer G-22, and a first electrode material layer G-21 are sequentially fabricated on the first transition substrate 11.

[0224] As shown in Figure 47, the second carrier material layer G-24, the light-emitting functional material layer G-23, the first carrier material layer G-22, and the first electrode material layer G-21 are transitioned onto the second transition substrate 12. On the side of the second carrier material layer G-24 facing away from the second transition substrate 12, the second electrode material layer and the third dielectric material layer are sequentially fabricated. Then, a patterning process is performed to achieve pixelation, forming the third dielectric portion 304, the second electrode layer G-250, the second carrier injection layer G-240, the light-emitting functional layer G-230, the first carrier injection layer G-220, and the first electrode layer G-210.

[0225] As shown in Figure 48, the third dielectric portion 304, the second electrode layer G-250, the second carrier injection layer G-240, the light-emitting functional layer G-230, the first carrier injection layer G-220, and the first electrode layer G-210 are transitioned onto the second temporary substrate 15, and a second bonded film layer 306 is formed on the side of the first electrode layer G-210 facing away from the second temporary substrate 15. That is, the third dielectric portion 304 of the second dielectric layer 32 is formed on the second temporary substrate 15, and the second sub-device includes the second electrode layer G-250, the second carrier injection layer G-240, the light-emitting functional layer G-230, the first carrier injection layer G-220, and the first electrode layer G-210, which are sequentially stacked along a direction away from the second temporary substrate, and the second bonded film layer 306 of the first dielectric layer 31.

[0226] As shown in Figures 49 and 50, the second bonding sub-film layer 306 in the first dielectric layer 31 is bonded to the insulator film layer 305 in the first dielectric layer 31, and then the second temporary substrate 15 is removed.

[0227] The specific steps for fabricating the second sub-device, the second dielectric layer 32, and the third sub-device include:

[0228] As shown in Figure 52, a second connecting electrode 42 is fabricated, which is coupled to the first electrode layer G-210 and the corresponding signal input terminal 142 in the second sub-device.

[0229] As shown in Figure 52, a second spacer insulating layer GI2 is fabricated, which covers the side surface of the second sub-device, the side surface of the third dielectric portion 304 included in the second dielectric layer 32, and the second connecting electrode 42.

[0230] As shown in Figure 53, a third connecting electrode 43 is fabricated, which is coupled to the second electrode layer G-250 and the corresponding signal input terminal 142 in the second sub-device.

[0231] As shown in Figure 53, the second dielectric layer 32 includes an insulating film layer 305, which covers the third dielectric portion 304, the third connecting electrode 43, and the second spacer insulating layer GI2 included in the second dielectric layer 32.

[0232] As shown in Figure 26, by way of example, a second carrier material layer B-24, a light-emitting functional material layer B-23, a first carrier material layer B-22, and a first electrode material layer B-21 are sequentially fabricated on the first transition substrate 11.

[0233] As shown in Figure 54, the second carrier material layer B-24, the light-emitting functional material layer B-23, the first carrier material layer B-22, and the first electrode material layer B-21 are transitioned onto the second transition substrate 12. The second electrode material layer is then sequentially fabricated on the side of the second carrier material layer B-24 facing away from the second transition substrate 12. Then, a patterning process is performed to achieve pixelation, forming the second electrode layer B-250, the second carrier injection layer B-240, the light-emitting functional layer B-230, the first carrier injection layer B-220, and the first electrode layer B-210.

[0234] As shown in Figure 55, the second electrode layer B-250, the second carrier injection layer B-240, the light-emitting functional layer B-230, the first carrier injection layer B-220, and the first electrode layer B-210 are transitioned onto the third temporary substrate 16, and a second bonding layer 306 is formed on the side of the first electrode layer B-210 facing away from the third temporary substrate 16. That is, the third sub-device, comprising the second electrode layer B-250, the second carrier injection layer B-240, the light-emitting functional layer B-230, the first carrier injection layer B-220, and the first electrode layer B-210, which are sequentially stacked in a direction away from the third temporary substrate 16, and the second bonding layer 306 included in the second dielectric layer 32, are formed on the third temporary substrate 16.

[0235] As shown in Figures 56 and 57, the second bonding sub-film layer 306 in the second dielectric layer 32 is bonded to the insulator film layer 305 in the second dielectric layer 32, and then the third temporary substrate 16 is removed.

[0236] As shown in Figure 57, a fourth connecting electrode 44 is fabricated, which is coupled to the first electrode layer B-210 and the corresponding signal input terminal 142 in the third sub-device.

[0237] As shown in Figure 58, a third spacer insulating layer GI3 is fabricated, which covers the side surface of the third sub-device and the fourth connecting electrode 44.

[0238] As shown in Figure 59, a fifth connecting electrode 45 is fabricated, which is coupled to the second electrode layer B-250 of the third sub-device and the corresponding signal input terminal 142.

[0239] By employing the aforementioned chip-level bonding process, bonding is achieved using a bonding sub-film layer (bonding adhesive), avoiding large-area wafer bonding and significantly improving bonding yield. This effectively avoids the problems of severe bonding voids, large void areas, and low bonding yield that are prone to occur in wafer-level bonding processes. Moreover, display panels manufactured using this method do not use a planarization layer, reducing the risk of display panel warping.

[0240] In some embodiments, the manufacturing method further includes:

[0241] As shown in Figures 21 and 51, after removing the second temporary substrate 15, an etching process is performed on the second sub-device so that the orthogonal projection of the light-emitting part in the second sub-device onto the driving backplate 14 is located inside the orthogonal projection of the light-emitting part in the first sub-device onto the driving backplate 14.

[0242] As shown in Figures 31 and 57, after removing the third temporary substrate 16, the third sub-device is etched so that the orthogonal projection of the light-emitting functional part of the third sub-device onto the driving backplate 14 is located inside the orthogonal projection of the light-emitting functional part of the second sub-device onto the driving backplate 14; the light-emitting functional part includes the second carrier injection layer, the light-emitting functional layer and the first carrier injection layer.

[0243] In the above manufacturing method, after stacking adjacent sub-devices together, the sub-devices far from the driving backplate 14 are etched a second time so that the light-emitting part of the sub-device has a suitable size, thereby improving the alignment accuracy when bonding and aligning the sub-devices and avoiding the influence of bonding alignment errors.

[0244] It should be noted that, in the embodiments of this disclosure, "same layer" can refer to film layers located on the same structural layer. Alternatively, for example, film layers located on the same layer can be layer structures formed by using the same film deposition process to form a specific pattern, and then patterning the film layer using the same photomask through a single patterning process. Depending on the specific pattern, the single patterning process may include multiple exposure, development, or etching processes, and the specific pattern in the formed layer structure can be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0245] In the various method embodiments of this disclosure, the sequence numbers of the steps are not intended to limit the order of the steps. For those skilled in the art, variations in the order of the steps are also within the scope of protection of this disclosure without creative effort. It should be noted that the various embodiments in this specification are described in a progressive manner, and similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for method embodiments, since they are basically similar to product embodiments, the description is relatively simple, and relevant parts can be referred to the description of the product embodiments. Unless otherwise defined, the technical or scientific terms used in this disclosure should have the ordinary meaning understood by those skilled in the art to which this disclosure pertains. The terms "first," "second," and similar words used in this disclosure do not indicate any order, quantity, or importance, but are only used to distinguish different components. Words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Terms such as “connection,” “coupling,” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms like “up,” “down,” “left,” and “right” are used only to indicate relative positional relationships; these relationships may change when the absolute position of the described object changes. It is understood that when an element such as a layer, film, region, or substrate is referred to as being “up” or “down” of another element, the element may be “directly” located “up” or “down” of the other element, or there may be intermediate elements. In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples. The above descriptions are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, comprising: A driving backboard and a light emitting device disposed on the driving backboard, the light emitting device comprising: at least two sub-devices, which are sequentially stacked in a direction away from the driving backboard; at least one medium layer, at least part of which is located between two adjacent sub-devices, the medium layer having a transmittance to light emitted by a first part of the sub-devices greater than a transmittance to light emitted by a second part of the sub-devices, the first part of the sub-devices being located between the medium layer and the driving backboard, and the second part of the sub-devices being located on a side of the medium layer away from the driving backboard.

2. The display panel of claim 1, wherein, The medium layer comprises a plurality of sub-film layers which are sequentially stacked in a direction perpendicular to the driving backboard, and adjacent sub-film layers have different refractive indexes.

3. The display panel of claim 2, wherein, In the plurality of sub-film layers, at least two sub-film layers have different thicknesses.

4. The display panel of claim 1, wherein, In the two adjacent sub-devices, a normal projection of a light emitting functional part of the sub-device away from the driving backboard on the driving backboard is located inside a normal projection of a light emitting functional part of the sub-device close to the driving backboard on the driving backboard.

5. The display panel of claim 4, wherein, In the two adjacent sub-devices, a boundary of the normal projection of the light emitting functional part of the sub-device close to the driving backboard on the driving backboard encloses the normal projection of the light emitting functional part of the sub-device away from the driving backboard on the driving backboard.

6. The display panel of claim 1, wherein, The medium layer comprises a first medium part, a first bonding sub-film layer and a second medium part which are sequentially stacked in a direction away from the driving backboard. The first medium part comprises first sub-film layers and second sub-film layers which are alternately arranged in a direction perpendicular to the driving backboard, the first sub-film layers having a refractive index greater than a refractive index of the second sub-film layers. The second medium part comprises third sub-film layers and fourth sub-film layers which are alternately arranged in a direction perpendicular to the driving backboard, the third sub-film layers having a refractive index greater than a refractive index of the fourth sub-film layers. The first bonding sub-film layer is located between adjacent second sub-film layers and fourth sub-film layers.

7. The display panel of claim 6, wherein, The sub-device comprises a first electrode layer and a light emitting functional part which are sequentially stacked in a direction away from the driving backboard, the light emitting functional part comprising a first carrier injection layer, a light emitting functional layer and a second carrier injection layer which are sequentially stacked in a direction away from the driving backboard. The sub-device further comprises a second electrode layer, which is in contact with a side surface of the second carrier injection layer.

8. The display panel of claim 7, wherein, The second carrier injection layer has a thickness greater than a thickness of the first carrier injection layer.

9. The display panel of claim 7, wherein, A normal projection of the second electrode layer on the driving backboard encloses the second carrier injection layer, and the second electrode layer is in contact with each side surface of the second carrier injection layer.

10. The display panel of claim 7, wherein, In the two adjacent sub-devices, the second electrode layer in the sub-device close to the driving backboard is coupled to the first electrode layer in the sub-device away from the driving backboard.

11. The display panel of claim 7, wherein, The driving backboard further comprises a plurality of signal input ends. The display panel further comprises at least two planar layers, the planar layers are located at the periphery of the corresponding sub-devices, the planar layers cover at least the side surface of the first carrier injection layer in the corresponding sub-devices and the side surface of the light-emitting functional layer; At least part of the planar layers is located between the second electrode layer in the corresponding sub-device and the driving backplane; the second electrode layer in each sub-device is coupled with the corresponding signal input end through at least one planar layer.

12. The display panel of claim 7, wherein, The display panel further comprises an encapsulation layer, the encapsulation layer is located on the side of the at least two sub-devices away from the driving backplane.

13. The display panel of claim 1, wherein, The medium layer comprises a third medium part, an insulating sub-film layer and a second bonding sub-film layer which are sequentially stacked in the direction away from the driving backplane; The third medium part comprises a fifth sub-film layer and a sixth sub-film layer which are alternately arranged in the direction perpendicular to the driving backplane, the refractive index of the fifth sub-film layer is greater than that of the sixth sub-film layer.

14. The display panel of claim 13, wherein, The driving backplane further comprises a plurality of signal input ends; the sub-device comprises a first electrode layer, a light-emitting functional part and a second electrode layer which are sequentially stacked in the direction away from the driving backplane, the light-emitting functional part comprises a first carrier injection layer, a light-emitting functional layer and a second carrier injection layer which are sequentially stacked in the direction away from the driving backplane; the first electrode layer and / or the second electrode layer in each sub-device is coupled with the corresponding signal input end through a corresponding connecting electrode; the insulating sub-film layer extends to between adjacent connecting electrodes.

15. The display panel of claim 14, wherein, The display panel further comprises at least one spacing insulating layer, the spacing insulating layer is in contact with the side surface of the corresponding sub-device, at least part of the spacing insulating layer is located between two connecting electrodes connected to the corresponding sub-device, and / or at least part of the spacing insulating layer is located between the side surface of the corresponding sub-device and the connecting electrode connected to the sub-device.

16. The display panel of claim 13, wherein, The display panel further comprises an encapsulation layer, the encapsulation layer completely wraps the at least two sub-devices and the at least one medium layer; the outer surface of the encapsulation layer away from the driving backplane is partially spherical.

17. The display panel according to any one of claims 1 to 16, wherein, The orthographic projection of each sub-device on the driving backplane is located inside the orthographic projection of the medium layer on the driving backplane.

18. The display panel according to any one of claims 1 to 16, wherein, The at least two sub-devices comprise a first sub-device, a second sub-device and a third sub-device which are sequentially stacked in the direction away from the driving backplane; the at least one medium layer comprises a first medium layer and a second medium layer, the first medium layer is located between the first sub-device and the second sub-device, and the second medium layer is located between the second sub-device and the third sub-device; The transmittance of the first medium layer to the light emitted by the first sub-device is greater than that to the light emitted by the second sub-device and the third sub-device; The transmittance of the second medium layer to the light emitted by the first sub-device and the second sub-device is greater than that to the light emitted by the third sub-device.

19. The display panel of claim 18, wherein, The first sub-device comprises a red sub-device, the second sub-device comprises a green sub-device, and the third sub-device comprises a blue sub-device.

20. A display device comprising the display panel according to any one of claims 1 to 19.

21. A method for manufacturing a display panel, the method comprising: providing a driving backplane; forming at least two sub-devices and at least one dielectric layer on the driving backplane; the at least two sub-devices are sequentially stacked in a direction away from the driving backplane; at least part of the dielectric layer is located between two adjacent sub-devices, the dielectric layer has a higher transmittance to light emitted by a first portion of the sub-devices than to light emitted by a second portion of the sub-devices, the first portion of the sub-devices is located between the dielectric layer and the driving backplane, and the second portion of the sub-devices is located on a side of the dielectric layer away from the driving backplane; 22. The method of manufacturing a display panel according to claim 21, wherein, forming a first sub-device and a first dielectric layer closest to the driving backplane on the driving backplane comprises: forming a first sub-device comprising a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer sequentially stacked in a direction away from a first temporary substrate on the first temporary substrate; bonding the first electrode layer of the first sub-device to a bonding electrode layer on the driving backplane, and then removing the first temporary substrate; forming a second electrode layer of the first sub-device, the second electrode layer being in contact with a side surface of the second carrier injection layer of the first sub-device; forming a first dielectric portion in the first dielectric layer, the first dielectric portion being located on a side of the first sub-device away from the driving backplane; forming a second sub-device comprising a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer sequentially stacked in a direction away from a second temporary substrate on the second temporary substrate; forming a second dielectric portion in the first dielectric layer and a first bonding sub-film layer sequentially stacked on a side of the first electrode layer of the second sub-device away from the second temporary substrate; bonding the first bonding sub-film layer in the first dielectric layer to the first dielectric portion in the first dielectric layer, and then removing the second temporary substrate.

23. The method of manufacturing a display panel according to claim 22, wherein, forming a second sub-device, a second dielectric layer and a third sub-device comprises: forming a second electrode layer of the second sub-device, the second electrode layer being in contact with a side surface of the second carrier injection layer of the second sub-device; forming a first dielectric portion in the second dielectric layer, the first dielectric portion being located on a side of the second sub-device away from the driving backplane; forming a third sub-device comprising a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer sequentially stacked in a direction away from a third temporary substrate on the third temporary substrate; forming a second dielectric portion in the second dielectric layer and a first bonding sub-film layer sequentially stacked on a side of the first electrode layer of the third sub-device away from the third temporary substrate; bonding the first bonding sub-film layer in the second dielectric layer to the first dielectric portion in the second dielectric layer, and then removing the third temporary substrate; forming a second electrode layer of the third sub-device, the second electrode layer being in contact with a side surface of the second carrier injection layer of the third sub-device.

24. The method of manufacturing a display panel according to claim 23, wherein, The manufacturing method of the display panel further comprises: Before manufacturing the second electrode layer of the first sub-device, a first planar layer is manufactured, the first planar layer is located at the periphery of the corresponding first sub-device, the first planar layer covers at least the side surface of the first carrier injection layer and the side surface of the light-emitting functional layer in the corresponding first sub-device, at least part of the first planar layer is located between the second electrode layer in the corresponding first sub-device and the driving backplate, and the second electrode layer in the first sub-device is coupled with the corresponding signal input end in the driving backplate through the first planar layer; Before manufacturing the second electrode layer of the second sub-device, a second planar layer is manufactured, the second planar layer is located at the periphery of the corresponding second sub-device, the second planar layer covers at least the side surface of the first carrier injection layer and the side surface of the light-emitting functional layer in the corresponding second sub-device, at least part of the second planar layer is located between the second electrode layer in the corresponding second sub-device and the driving backplate, and the second electrode layer in the second sub-device is coupled with the corresponding signal input end in the driving backplate through the second planar layer; Before manufacturing the second electrode layer of the third sub-device, a third planar layer is manufactured, the third planar layer is located at the periphery of the corresponding third sub-device, the third planar layer covers at least the side surface of the first carrier injection layer and the side surface of the light-emitting functional layer in the corresponding third sub-device, at least part of the third planar layer is located between the second electrode layer in the corresponding third sub-device and the driving backplate, and the second electrode layer in the third sub-device is coupled with the corresponding signal input end in the driving backplate through the third planar layer.

25. The method of manufacturing a display panel according to claim 21, wherein, The step of manufacturing the first sub-device and the first dielectric layer closest to the driving backplate on the driving backplate specifically comprises: forming a third dielectric part included in the first dielectric layer and a second electrode layer, a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer included in the first sub-device are sequentially stacked in a direction away from the first temporary substrate on the first temporary substrate; bonding the first electrode layer of the first sub-device with the bonding electrode layer on the driving backplate, and then removing the first temporary substrate; manufacturing a first spacing insulating layer, the first spacing insulating layer covers the side surface of the first sub-device and the side surface of the third dielectric part included in the first dielectric layer; manufacturing a first connecting electrode, the second electrode layer in the first sub-device is coupled with the corresponding signal input end in the driving backplate through the first connecting electrode, and at least part of the first spacing insulating layer is located between the first connecting electrode and the first sub-device; manufacturing an insulating sub-film layer included in the first dielectric layer, the insulating sub-film layer covers the third dielectric part, the first connecting electrode and the first spacing insulating layer. forming a second dielectric layer including a third dielectric part on the second temporary substrate, and a second sub-device including a second electrode layer, a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer which are sequentially stacked in a direction away from the second temporary substrate, and a first dielectric layer including a second bonding sub-film layer; bonding the second bonding sub-film layer in the first dielectric layer with an insulating sub-film layer in the first dielectric layer, and then removing the second temporary substrate.

26. The method of manufacturing a display panel according to claim 25, wherein, The steps of manufacturing the second sub-device, the second dielectric layer and the third sub-device specifically include: manufacturing a second connecting electrode which is coupled with the first electrode layer in the second sub-device and a corresponding signal input end respectively; manufacturing a second interval insulating layer which covers a side surface of the second sub-device, a side surface of the third dielectric part included in the second dielectric layer, and the second connecting electrode; manufacturing a third connecting electrode which is coupled with the second electrode layer in the second sub-device and a corresponding signal input end respectively; manufacturing an insulating sub-film layer included in the second dielectric layer which covers the third dielectric part included in the second dielectric layer, the third connecting electrode, and the second interval insulating layer; forming a third sub-device including a second electrode layer, a second carrier injection layer, a light-emitting functional layer, a first carrier injection layer and a first electrode layer which are sequentially stacked in a direction away from a third temporary substrate, and a second dielectric layer including a second bonding sub-film layer on the third temporary substrate; bonding the second bonding sub-film layer in the second dielectric layer with an insulating sub-film layer in the second dielectric layer, and then removing the third temporary substrate; manufacturing a fourth connecting electrode which is coupled with the first electrode layer in the third sub-device and a corresponding signal input end respectively; manufacturing a third interval insulating layer which covers a side surface of the third sub-device, and the fourth connecting electrode; manufacturing a fifth connecting electrode which is coupled with the second electrode layer in the third sub-device and a corresponding signal input end respectively. The manufacturing method further includes:

27. The method of manufacturing a display panel according to claim 23 or 26, wherein, after removing the second temporary substrate, performing etching process on the second sub-device, so that a normal projection of a light-emitting functional part in the second sub-device on the driving backboard is located inside a normal projection of a light-emitting functional part in the first sub-device on the driving backboard; after removing the third temporary substrate, performing etching process on the third sub-device, so that a normal projection of a light-emitting functional part in the third sub-device on the driving backboard is located inside a normal projection of a light-emitting functional part in the second sub-device on the driving backboard; the light-emitting functional part includes the second carrier injection layer, the light-emitting functional layer and the first carrier injection layer. ​

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