Semiconductor wire mesh film coating machine and film coating method

Abstract

The invention discloses a semiconductor silk screen coating machine which comprises a working table, a vacuum assembly arranged on the working table, a film carrying seat arranged on the vacuum assembly, a controller arranged on the working table and a moving module, a coating scraper assembly and a screen plate assembly are arranged on the moving module, and a plurality of silk screen discharging openings are formed in the screen plate assembly. The film coating scraper assembly and the screen plate assembly are moved through the moving module, the bottom of a semiconductor placed on the film carrying base is adsorbed through the vacuum assembly, and paint located on the screen plate assembly is moved to a silk screen discharging opening through the film coating scraper assembly to coat the upper surface of the semiconductor. The problem that a plurality of small-size brittle materials cannot be coated in batches by using a specific-viscosity coating at the same time can be solved, so that the small-size brittle materials cannot be damaged due to stress change in the intermittent blade coating process for crossing a plurality of independent semiconductors.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of film coating machines, in particular to a semiconductor screen film coating machine and a film coating method. BACKGROUND

[0002] Semiconductor is a key component in the radioisotope battery, which is often used to convert the energy generated by radioactive decay into electrical energy. During its manufacturing process, it is usually necessary to perform film coating treatment on the surface of the semiconductor to form a functional coating (such as a transduction material, an electrode or a passivation layer). The film coating process has very high requirements for the uniformity, consistency and integrity of the coating, and the difference in film coating effect directly determines the output performance, conversion efficiency and long-term stability of the final nuclear battery. In the field of radioisotope battery manufacturing, uniform coating of functional coating on semiconductor substrates is a major technical difficulty. Because in the film coating process of the semiconductor, the semiconductor must be firmly and stably fixed to prevent displacement or vibration during the film coating process, thereby ensuring the precision of the film coating.

[0003] At present, the commonly used fixing method in the market is to use a mechanical tray clamp or a vacuum chuck clamp. For example, there are some automatic film coating equipment at present, such as the full-automatic glass film coating machine described in CN102000648A. Although the equipment has an adjustable rack, a sliding rail system and a PLC controller, it can realize continuous automatic coating of large-area planar substrates. However, when coating small-area single silicon wafers, the silicon wafers are thin and small in area, and the material itself has high brittleness and low mechanical strength, which leads to obvious deficiencies when the existing film coating machine is directly applied to single silicon wafers for coating, thereby causing the existing equipment to be unable to meet the requirements of high-quality silicon wafer coating. The specific problems are as follows: 1. For functional coatings with specific viscosity, conventional brushing methods cannot guarantee the uniformity and surface flatness of the coating, especially when coating multiple small-size brittle materials with specific viscosity coatings in batches. Since the semiconductor is fragile, the coating tool is easy to cause damage to the substrate, and in the intermittent coating process across multiple independent semiconductors, it is more likely to be damaged due to stress changes.

[0004] 2. Since the semiconductor is fragile, the traditional rigid coating tool is easy to cause damage to the substrate, and in the intermittent coating process across multiple independent semiconductors, it is more likely to be damaged due to stress changes.

[0005] 3. The existing mechanical clamping method is easy to cause the edge of the semiconductor to crack due to stress concentration, and even directly break. The vacuum suction method using a chuck structure and other vacuum suction methods are easy to cause uneven suction force distribution or excessive instantaneous suction force, which causes invisible micro-damage to the wafer, reduces the yield of the product, and increases the production cost.

[0006] Four, after the semiconductor is coated with fluorescent enhancement material or film on both sides, the adsorption is too tight when using the structure such as suction cup to adsorb and fix, which may cause mechanical damage or interface peeling of the coated material layer; the adsorption is too loose, which may cause displacement or vibration of the semiconductor during coating, leading to uneven coating, edge defects or thickness fluctuation, and seriously affecting the coating quality and device performance; and when the adsorption force is within the allowable range, there is a problem that the adsorption position is easy to form a mark, and the mark is obvious with the increase of the adsorption force. Therefore, a film coating equipment capable of batch coating of multiple small-size brittle materials with specific viscosity is needed. SUMMARY

[0007] In order to solve the technical problems existing in the prior art, one of the purposes of the present application is to provide a semiconductor screen coating machine, which can solve the problem of unable to simultaneously batch coat multiple small-size brittle materials with specific viscosity, and will not be damaged due to stress change in the intermittent blade coating process for multiple independent semiconductors.

[0008] The second purpose of the present application is to provide a semiconductor screen coating method, which can simultaneously coat multiple small-size brittle materials with specific viscosity functional coating without damaging the semiconductor.

[0009] To solve the above-mentioned existing technical problems, one of the purposes of the present application is achieved by using the following technical scheme: A semiconductor screen coating machine, comprising a workbench, a vacuum assembly arranged on the workbench, a film carrier seat detachably arranged on the vacuum assembly, a controller arranged on the workbench, and a moving module, wherein the moving module is provided with a film coating blade assembly and a screen plate assembly, the screen plate assembly is provided with a plurality of screen discharge ports, the moving module is controlled by the controller, the film coating blade assembly and the screen plate assembly are moved in position by the moving module, the bottom of the semiconductor placed on the film carrier seat is adsorbed by the vacuum assembly, and the functional coating on the screen plate assembly is coated onto the upper surface of the semiconductor along the screen discharge port through the transverse movement of the film coating blade assembly.

[0010] Preferably, the moving module comprises a longitudinal slide rail vertically arranged on the workbench, a slide seat slidably connected to the longitudinal slide rail, an electric slide table transversely arranged on the slide seat, and a driver for controlling the slide seat to slide up and down, the screen plate assembly is mounted on the slide seat, and the film coating blade assembly is mounted on the electric slide table.

[0011] Preferably, the driver adopts a cylinder structure and is arranged between the workbench and the slide seat.

[0012] Preferably, both sides of the sliding base are provided with L-shaped connecting arms, and both ends of the screen plate assembly are fixed on the L-shaped connecting arms.

[0013] Preferably, the bottom of the L-shaped connecting arm is provided with a supporting plate, and the upper end surface of the L-shaped connecting arm is provided with a detachable pressing plate, and the two ends of the screen plate assembly are detachably fixed on the L-shaped connecting arms through the pressing plate.

[0014] Preferably, the screen plate assembly comprises a fixed frame and a wire mesh film arranged in the fixed frame, and an opening upward material groove is formed between the wire mesh film and the fixed frame, and the wire mesh blanking port is located in the wire mesh film. Preferably, the film coating scraper assembly comprises a lifting cylinder arranged on the electric sliding table and a film scraping knife arranged on the piston rod of the lifting cylinder.

[0015] Preferably, a knife seat is arranged between the film scraping knife and the lifting cylinder, and the blade of the film scraping knife is fixed in the knife seat and is arranged in an inclined manner.

[0016] Preferably, two groups of the film coating scraper assembly are symmetrically arranged on the electric sliding table, and the film scraping knives of the two groups of the film coating scraper assembly are arranged in an eight-shaped inclined manner.

[0017] Preferably, the vacuum assembly comprises a vacuum plate arranged on the workbench, a vacuum pipeline arranged in the vacuum plate, a plurality of suction cup assemblies with self-adaptive function arranged on the vacuum plate, and a flow regulating valve connected with the vacuum pipeline through a pipeline, and the semiconductor is adsorbed on the film carrier by the suction cup assembly, and the vacuum degree of the suction cup assembly is controlled by the flow regulating valve.

[0018] Preferably, a plurality of limiting grooves for placing the semiconductor are arranged on the film carrier in a spaced manner, and a receiving hole for passing through the suction cup assembly is arranged in each limiting groove, and the top of the suction cup assembly is located in the limiting groove, and the semiconductor is adsorbed on the suction cup assembly by the vacuum assembly after vacuumizing the bottom.

[0019] Preferably, a plurality of mounting holes in communication with the vacuum pipeline are arranged on the vacuum plate, and the suction cup assembly is detachably arranged in the mounting hole.

[0020] Preferably, the suction cup assembly comprises a fixed suction cup detachably fixed in the mounting hole and a soft air-permeable pad arranged on the fixed suction cup.

[0021] Preferably, the top of the soft air-permeable pad is located in the limiting groove after passing through the receiving hole, and the semiconductor in the receiving groove is adsorbed on the fixed suction cup after being supported by the soft air-permeable pad.

[0022] Preferably, the fixing suction disc is hollow and closed around, and is made of soft material, and the strength of the fixing suction disc is greater than that of the soft air-permeable pad.

[0023] Preferably, the vacuum pipeline comprises a plurality of air flow channels arranged transversely, a plurality of series holes arranged longitudinally, and a suction hole, and the vacuum pipeline is connected with the flow regulating valve through the suction hole.

[0024] Preferably, the air flow channels are in the form of counterbores, the series holes are in the form of counterbores or through holes, the plurality of air flow channels are communicated through the series holes, one end of the suction hole is communicated with the series hole, and the end of the series hole is provided with a plug, and a plurality of mounting holes are communicated on each of the shunt pipelines.

[0025] Preferably, the bottom of the film carrier seat is provided with a plurality of supporting feet, and the upper end surface of the film carrier seat is provided with a plurality of grooves, and the grooves are distributed on both sides of the limiting groove.

[0026] Preferably, the corners of the film carrier seat are each provided with an H-shaped positioning hole, one end of the supporting foot is fixed at the bottom of the H-shaped positioning hole, and the top of the H-shaped positioning hole is used for limiting the supporting foot when the film carrier seats are stacked.

[0027] Preferably, the side surface of the vacuum plate is provided with a limiting clamping groove, and at least one supporting foot of the film carrier seat is limited through the limiting clamping groove.

[0028] Preferably, the two side ends of the vacuum plate are further provided with an upwardly protruding limiting block, and the limiting block is provided with a guide surface.

[0029] Preferably, the workbench is further provided with a base, the base comprises a bottom plate, a plurality of supporting blocks arranged on the bottom plate and used for fixing the vacuum assembly, four fixing holes arranged on the bottom plate, and fixing bolts arranged in the fixing holes, and the diameter of the fixing bolts is smaller than that of the fixing holes.

[0030] Preferably, the workbench is further provided with an adjusting mechanism for limiting the horizontal position of the base.

[0031] Preferably, the adjusting mechanism comprises an L-shaped adjusting seat arranged outside the corner of the bottom plate, and two adjusting bolts arranged on the L-shaped adjusting seat.

[0032] The second purpose of the application is achieved by the following technical scheme: A semiconductor screen coating method, the coating method comprising: S1. Fix the carrier film holder onto the vacuum assembly, install the vacuum assembly onto the worktable, and adjust the relative position of the semiconductor limiting groove on the carrier film holder and the wire mesh feeding port on the stencil assembly through the adjustment mechanism installed on the worktable. After fixing the vacuum assembly, remove the carrier film holder. S2. Take a carrier film holder and place the semiconductor into the storage slot; S3. Start the vacuum system to put the suction cup assembly on the vacuum assembly into a negative pressure state, assemble the carrier film seat with semiconductor onto the vacuum assembly and position it, so that the bottom of the semiconductor can be adaptively adsorbed and supported by multiple soft and breathable pads. S4. Start the controller to move the coating scraper assembly and stencil assembly to the set initial position via the moving module; S5. Start the coating process. Move the coating squeegee assembly and stencil assembly downwards by moving the module, so that the stencil assembly presses the upper surface of the semiconductor. S6. Pour the functional coating into the material tank, so that the functional coating is on one side of the scraper blade; S7. Control the coating blade assembly to move down to the upper surface of the stencil assembly, and then control the coating blade assembly to move laterally so that the functional coating material can penetrate and be pressed into the upper surface of the semiconductor through the wire mesh feeding port on the stencil assembly. S8. After the coating blade assembly has finished moving, the coating blade assembly and stencil assembly are moved to their initial positions by the moving module; the vacuum system is turned off and started, and the carrier film is removed from the vacuum assembly and dried; the single-sided coating operation of the semiconductor is completed. S9. Repeat steps S2 to S8 to perform a double-layer coating on the semiconductor.

[0033] Preferably, the coating scraper assembly in step S7 reciprocates at least once to ensure that the semiconductor surface is coated with functional coating twice.

[0034] Preferably, the thickness of the semiconductor is greater than the depth of the limiting groove.

[0035] Preferably, the suction cup assembly applies a negative pressure of 15-30 kPa to the semiconductor.

[0036] Preferably, the screen membrane is made of 100-300 mesh, and the viscosity of the functional coating is 10-150 Pas.

[0037] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The combination of a coating scraper assembly and a screen assembly is used to scrape and feed functional coatings to designated areas, enabling the brushing of functional coatings with specific viscosities. After brushing, the uniformity of the coating and the smoothness of the surface are guaranteed.

[0038] 2. By combining vacuum components and a vacuum pumping system, semiconductors can be firmly and stably fixed on the surface of the substrate. At the same time, the stencil assembly provides secondary pressure and fixation to the upper surface of the semiconductor to prevent displacement or vibration during the coating process, thereby ensuring the accuracy of the coating.

[0039] 3. By supporting the semiconductor with a carrier substrate and an adaptive chuck assembly, the problem of invisible microscopic damage caused by uneven suction distribution or excessive instantaneous suction force during conventional vacuum chuck adsorption can be reduced. It is also less likely to cause semiconductor damage or breakage, and avoids stress concentration at the wafer edges due to uneven or excessive clamping force.

[0040] 4. It enables simultaneous, intermittent coating of multiple independent, spaced semiconductor wafers, especially when coating functional coatings with specific viscosities. This ensures coating uniformity and surface smoothness on the semiconductor surface, while also addressing the fragility issue inherent in traditional scraping coating methods. When coating thin and brittle sheet materials such as semiconductors with functional layers, it effectively avoids the substrate damage easily caused by direct contact with rigid coating tools. Furthermore, it prevents breakage due to stress changes during intermittent scraping coating across multiple independent semiconductor wafers. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the combined structure of the present invention; Figure 2 This is a schematic diagram of the structure of the workbench and the moving module in this invention; Figure 3 This is a schematic diagram of the coating scraper assembly in this invention; Figure 4 This is a schematic diagram of the suction cup assembly in this invention; Figure 5 This is an exploded view of the carrier film holder and vacuum assembly in this invention; Figure 6 This is a schematic diagram of the internal structure of the vacuum pumping pipeline inside the vacuum plate in this invention; Figure 7 This is a schematic diagram of the combined structure of the vacuum component and the carrier film seat mounted on the base in this invention, which are limited by an adjustment mechanism. Figure 8 This is an exploded structural diagram of the vacuum assembly and the carrier film seat mounted on the base in this invention, which are limited by an adjustment mechanism. In the diagram: 1. Workbench; 2. Film carrier; 21. Groove; 22. Limiting groove; 23. Storage hole; 3. Coating scraper assembly; 31. Scraper; 32. Lifting cylinder; 33. Scraper holder; 4. Moving module; 41. Driver; 42. Longitudinal slide rail; 43. Slide base; 44. Electric slide table; 5. Controller; 6. Screen assembly; 61. Material trough; 62. Fixing frame; 63. Screen film; 7. Screen film feeding port; 8. Vacuum assembly; 81. Vacuum plate; 82. Suction cup assembly; 821. Fixed suction cup; 822. Flexible... 83. Ventilation pad; 831. Vacuuming pipe; 832. Air extraction port; 833. Series connection port; 834. Airflow channel; 85. Flow regulating valve; 9. Mounting hole; 9. Adjustment mechanism; 91. Adjustment bolt; 92. L-shaped adjustment seat; 10. Pressure plate; 11. L-shaped connecting arm; 12. Support plate; 13. Plug; 14. Limiting slot; 15. Support foot; 16. H-shaped positioning hole; 17. Guide surface; 18. Limiting block; 19. Base; 191. Base plate; 192. Support block; 194. Fixing hole; 193. Fixing bolt. Detailed Implementation

[0042] The present application will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0043] In the description of this application, it should be understood that the terms "horizontal", "vertical", "up", "down", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0044] The terms "first," "second," etc., used in this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class, without limiting the number of objects; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0045] Example 1: As Figure 1As shown, a semiconductor screen coating machine includes a worktable 1, a vacuum assembly 8 mounted on the worktable 1, a film carrier 2 mounted on the vacuum assembly 8, a controller 5 mounted on the worktable 1, and a moving module 4. The moving module 4 is equipped with a coating scraper assembly 3 and a screen assembly 6. The screen assembly 6 has a plurality of screen feeding ports 7. The moving module 4 is controlled by the controller 5. The coating scraper assembly 3 and the screen assembly 6 move in position through the moving module 4. The bottom of a semiconductor 100 placed on the film carrier 2 is adsorbed by the vacuum assembly 8. The functional coating material located on the screen assembly 6 is coated onto the upper surface of the semiconductor 100 along the screen feeding ports 7 by the lateral movement of the coating scraper assembly 3.

[0046] like Figure 1In the screen coating machine shown, the vacuum assembly 8 is mounted on the worktable 1. The screen assembly 6 and the coating blade assembly 3 are mounted on the worktable 1 via the moving module 4 and are sequentially located above the vacuum assembly 8. The controller 5, equipped with a PLC or other control system, is mounted on the top or bottom of the worktable 1. The controller 5 can control the moving module 4 and the vacuum assembly 8, that is, it can control the moving module 4 to move the coating blade assembly 3 and the screen assembly 6 up and down relative to the film carrier 2, and it can also move the coating blade assembly 3 left and right. The vacuum assembly 8 can be vacuumed by the controller 5. The film carrier 2 is an independent component that is detachably mounted on the vacuum assembly 8. During the coating process, after several semiconductors 100 to be coated are placed on the carrier 2, the carrier 2 with the semiconductors 100 is assembled into the vacuum assembly 8. It is then adsorbed onto the carrier 2 by negative pressure. The PLC system within the controller 5 controls the moving module 4, enabling the stencil assembly 6 to move up and down. As the stencil assembly 6 moves downwards, it presses the semiconductors 100 tightly against the carrier 2. Then, the coating scraper assembly 3 is controlled to move left and right, allowing the functional coating to flow along the stencil assembly 6 and downwards through the screen feed port 7 to coat the surface of the semiconductors 100. During coating, the use of the coating scraper assembly 3 for scraping and designated area feeding allows for the brushing of functional coatings with specific viscosities, ensuring uniformity and surface smoothness of the coating after application. In this coating process, the vacuum assembly 8 is connected to an external vacuum system. The combination of the vacuum assembly 8 and the vacuum system securely and stably fixes the semiconductor 100 onto the surface of the substrate 2. Simultaneously, the stencil assembly 6 provides secondary clamping and fixation to the upper surface of the semiconductor 100, preventing displacement or vibration during coating and ensuring coating accuracy. The planar structure of the area on the substrate 2 supporting the semiconductor 100 reduces the risk of invisible microscopic damage caused by uneven suction distribution or excessive instantaneous suction force, common with conventional vacuum chucks. It also reduces the likelihood of semiconductor 100 breakage and prevents stress concentration at wafer edges due to uneven or excessive clamping force. When coating thin and brittle sheet materials such as semiconductor 100 with functional layers, it effectively avoids the substrate damage easily caused by direct contact with rigid coating tools. Especially during intermittent scraping coating across multiple independent semiconductors 100, it prevents breakage due to stress changes.

[0047] Further improvements include, for example Figure 2As shown, the moving module 4 includes a longitudinal slide rail 42 vertically arranged on the worktable 1, a slide block 43 slidably connected to the longitudinal slide rail 42, an electric slide table 44 horizontally arranged on the slide block 43, and a driver 41 for controlling the slide block 43 to slide up and down. The screen plate assembly 6 is mounted on the slide block 43, and the coating scraper assembly 3 is mounted on the electric slide table 44. The driver 41 adopts a cylinder structure and is located between the worktable 1 and the slide block 43.

[0048] The moving module 4 consists of a longitudinal slide rail 42, a slide block 43, an electric slide table 44, and a driver 41. The longitudinal slide rail 42 is typically two rails, vertically mounted on the worktable 1. The slide block 43 slides laterally on the longitudinal slide rail 42. The driver 41 enables the slide block 43 to move up and down along the longitudinal slide rail 42, thereby driving the electric slide table 44 and the screen assembly 6 to move up and down. The coating scraper assembly 3 is mounted on the laterally positioned electric slide table 44. The electric slide table 44 enables the coating scraper assembly 3 to move laterally, thus achieving lateral coating of functional coatings in a simple manner. When the slide block 43 moves up and down, the driver 41 uses a cylinder structure and is installed between the worktable 1 and the slide block 43. This provides higher precision in controlling the up and down movement of the slide block 43, preventing problems such as insufficient or excessive clamping, and also resulting in higher movement efficiency. The lifting cylinder 32 is fixed on the electric slide table 44, which enables precise left and right movement of the lifting cylinder 32. The electric slide table 44 is used to move the coating scraper assembly 3. When setting the position of the coating scraper assembly 3, it can be set to any horizontal position as needed. A further improvement is that L-shaped connecting arms 11 are provided on both sides of the slide block 43, and the two ends of the mesh plate assembly 6 are fixed on the L-shaped connecting arms 11.

[0049] The stencil assembly 6 needs to be installed horizontally above the vacuum assembly 8. In order to facilitate operation, it is also necessary to ensure that the film carrier 2 has sufficient operating space. Therefore, the vacuum assembly 8 and the stencil assembly 6 need to be in a forward-protruding state. In order to facilitate the fixing of the stencil assembly 6 and the adjustment of its front and rear positions, two forward-protruding L-shaped connecting arms 11 are formed on both sides of the slide 43. After the two ends of the stencil assembly 6 are fixed on the L-shaped connecting arms 11, the operating space on both sides of the film carrier 2 can be larger.

[0050] The L-shaped connecting arm 11 has a support plate 12 at its bottom and a detachable pressure plate 10 on its upper surface. Both ends of the mesh plate assembly 6 are detachably fixed to the L-shaped connecting arm 11 via the pressure plate 10.

[0051] After installation, the mesh panel assembly 6 is prone to problems such as inaccurate left and right positioning and secondary deviations in the adjusted left and right positions during front-back adjustments. Therefore, the fixing structure on the L-shaped connecting arm 11 has been improved. An inwardly extending support plate 12 is fixed at the bottom of the L-shaped connecting arm 11, so that when installing the mesh panel assembly 6, both ends only need to be placed on the support plate 12 to achieve flatness limiting support. With the L-shaped connecting arm 11 limiting both ends of the mesh panel assembly 6, left and right limiting can be achieved, so that it always maintains horizontal front-back movement during front-back adjustments. During the movement, in order to ensure quick fixing after moving into position, a detachable pressure plate 10 is bolted to the upper end face of the L-shaped connecting arm 11. During adjustment, the mesh panel assembly 6 can be adjusted under pressure through the pressure plate 10, so that after moving into position, there will be no secondary movement during the downward locking process. Meanwhile, this structure also facilitates the disassembly and cleaning of the mesh panel assembly 6. In particular, when the L-shaped connecting arm 11 forms a limiting structure, it can be quickly assembled and positioned and clamped, effectively solving the problem of needing to readjust its position when it is disassembled, cleaned and reinstalled.

[0052] Based on the above technical solution, further improvements are made as follows: Figure 2 As shown, the screen assembly 6 includes a fixed frame 62 and a wire mesh 63 disposed within the fixed frame 62. A material trough 61 with an upward opening is formed between the wire mesh 63 and the fixed frame 62. The wire mesh feed port 7 is located within the wire mesh 63.

[0053] The stencil assembly 6 consists of a fixed frame 62 with a production-oriented frame structure and a screen mesh 63 located at the bottom of the fixed frame 62. The internal contour of the fixed frame 62 is generally larger than the area of ​​the substrate 2, ensuring that the screen mesh 63 can press all the semiconductors 100 on the substrate 2 firmly. Simultaneously, it forms an upward-opening material trough 61 with the fixed frame 62, facilitating the storage of functional coatings during coating. When the screen mesh 63 uses a filter structure, the area outside the screen mesh feed port 7 is treated with a sealing structure, such as forming a barrier area with silicone. When the screen mesh 63 uses a sealing material, the screen mesh feed port 7 is formed inside through a filter structure. The shape and position of the screen mesh feed port 7 correspond to the position of the semiconductors 100 to be coated, so that when the coating scraper assembly 3 moves the functional coating along the material trough 61, the material can be fed and coated along the designated screen mesh feed port 7, ensuring the cleanliness of areas where coating penetration is not required.

[0054] Based on the above technical solution, further improvements are made as follows: Figure 3As shown, the coating blade assembly 3 includes a lifting cylinder 32 mounted on the electric slide table 44 and a coating blade 31 mounted on the piston rod of the lifting cylinder 32; a blade holder 33 is provided between the coating blade 31 and the lifting cylinder 32, and the blade of the coating blade 31 is inclined after being fixed by the blade holder 33.

[0055] The coating squeegee assembly 3 consists of a lifting cylinder 32 and a squeegee 31. When coating is not required, the squeegee 31 retracts via the lifting cylinder 32, creating a certain distance between itself and the stencil assembly 6, facilitating disassembly and cleaning of the stencil assembly 6. When coating is required on the stencil assembly 6, the squeegee 31 can be quickly and precisely controlled to move onto the screen film 63 and apply pressure. Since the semiconductor 100 to be coated is a fragile material, the squeegee 31 is made of silicone, which provides cushioning during coating. The flexibility of the silicone squeegee 31 ensures that it does not "bump" or "bounce" due to instantaneous stress release when crossing small gaps between wafers. At the same time, the silicone squeegee 31 has good elasticity, which can gently smooth out any minor unevenness on the coating surface without scratching the deposited coating or removing too much coating like a rigid squeegee 31, thus achieving a smoother and more uniform surface morphology. The scraper blade 31 is made of PU0-0 material. The blade of the scraper blade 31 has an inclination angle of 30-0°, or the entire scraper blade 31 is tilted at 30-0°. The blade of the scraper blade 31 is fixed at an inclination after being fixed by the blade holder 33. This allows for better flow when scraping the coating horizontally, and it is less likely to cause a large accumulation of coating in the direction of the blade edge.

[0056] A further improvement is made in that two sets of coating scraper assemblies 3 are symmetrically arranged on the electric slide table 44, and the scraper blades 31 of the two sets of coating scraper assemblies 3 are arranged in a V-shape at an angle.

[0057] When coating the semiconductor 100, the coating blade assembly 3 on the electric slide table 44 is composed of two sets and the blades 31 are arranged in a V-shape. When it is necessary to coat the functional coating from left to right, the operation can be achieved by simply switching the blades 31, so that the functional coating accumulated at one end can be coated and utilized more efficiently.

[0058] Further improvements include, for example Figure 4 As shown, the vacuum assembly 8 includes a vacuum plate 81 disposed on the worktable 1, a vacuum extraction pipeline 83 disposed within the vacuum plate 81, a plurality of self-adaptive suction cup assemblies 82 disposed on the vacuum plate 81, and a flow regulating valve 84 connected to the vacuum extraction pipeline 83 via a pipe. The semiconductor 100 is adsorbed onto the film carrier 2 by the suction cup assembly 82, and the vacuum degree of the suction cup assembly 82 is controlled by the flow regulating valve 84.

[0059] Vacuum plate 81 is fixed on worktable 1. Suction cup assembly 82 evacuates and introduces air through vacuum pipe 83 within vacuum plate 81. Vacuum pipe 83 is connected to flow regulating valve 84 via a pipe. Flow regulating valve 84 is connected to external vacuum equipment. When the external vacuum equipment is activated, the flow regulating valve 84 controls the amount of air pumped, thereby adjusting the negative pressure. Suction cup assembly 82 extends into the carrier film holder 2, allowing the bottom of the semiconductor 100 to be adsorbed onto the carrier film holder 2 under negative pressure. Because existing single-crystal semiconductors 100 may have microscopic undulations or warpage on their surface during fabrication or pre-processing, they are not perfectly flat. Existing rigid fixtures (whether trays or suction cups) cannot adaptively conform to such uneven surfaces. When fixing such wafers, local gaps exist between the fixture and the back of the wafer, causing internal stress or slight deformation of the wafer itself in the fixed state. During coating, this uneven, fixed state directly leads to regional differences in coating thickness, resulting in a mottled or uneven film. This uneven coating can cause problems such as uneven current distribution, localized overheating, or efficiency degradation, severely degrading the overall performance and lifespan of the nuclear battery. Therefore, the suction cup assembly 82 on the vacuum assembly 8, used to adsorb the semiconductor 100, has an adaptive function. When the semiconductor 100 contacts and is adsorbed by the suction cup assembly 82, it can adaptively expand and contract based on the surface flatness of the semiconductor 100. This forms a rigid support surface for the bottom of the semiconductor 100, and a flexible support surface through the contact area of ​​the suction cup assembly 82. The area in contact with the suction cup assembly 82 can adaptively adjust according to the flatness of the semiconductor 100, thus providing stable support for the bottom of the semiconductor 100 without damaging it. This improves the product yield, reduces the presence of adsorption marks, and ensures uniform coating thickness distribution during double-sided coating, preventing the formation of mottled or uneven films. This effectively avoids the problem of uneven coating caused by the difficulty of adapting existing adsorption structures to uneven surfaces.

[0060] Further improvements include, for example Figure 4 As shown, the carrier film seat 2 is provided with a plurality of limiting grooves 22 for placing semiconductors 100 at intervals. Each limiting groove 22 is provided with a receiving hole 23 for passing through the suction cup assembly 82. The top of the suction cup assembly 82 is located in the limiting groove 22. The bottom of the semiconductor 100 is vacuumed by the vacuum assembly 8 and then adsorbed onto the suction cup assembly 82 under negative pressure.

[0061] Since the film carrier 2 is mounted on the vacuum assembly 8, the adsorption portion of the vacuum assembly 8 can extend into the limiting groove 22 through the receiving hole 23. When it is necessary to coat the semiconductor 100, the semiconductor 100 is placed in the limiting groove 22 and horizontally limited by the limiting groove 22. Then, the vacuum degree of the vacuum assembly 8 is controlled so that the bottom surface of the semiconductor 100 is stably attached to the plane formed by the limiting groove 22 and the vacuum assembly 8 for coating. After the coating is completed, the coated semiconductor 100 is directly separated from the vacuum assembly 8 by the film carrier 2 for drying, and the next group of semiconductor 100 is fixed by coating through a new film carrier 2. Throughout the operation, the adsorption area of ​​the vacuum component 8 is supported by the upward protrusion of the receiving hole 23. This solves both the problem of easy damage to the semiconductor 100 after it is fixed by the fixture and the problem of uneven bottom adhesion when using a suction cup structure for adsorption. This enables the semiconductor 100 to achieve reliable fixation without damage and self-adaptive adhesion to ensure flatness during coating, resulting in higher coating precision for the semiconductor 100.

[0062] Because vacuum suction cups are prone to sealing problems during long-term use, resulting in the inability to form negative pressure during adsorption and making it difficult to replace the fixing structure, several mounting holes 85 communicating with the vacuum pipe 83 are provided on the vacuum plate 81 to facilitate the replacement of damaged vacuum suction cups. The suction cup assembly 82 is detachably installed in the mounting holes 85. The suction cup assembly 82 is detachably connected in the mounting holes 85, making it easier and cheaper to replace when the suction cup assembly 82 is damaged.

[0063] Further improvements include, for example Figure 5 As shown, the suction cup assembly 82 includes a detachable fixed suction cup 821 fixed in the mounting hole 85 and a soft breathable pad 822 disposed on the fixed suction cup 821; the top of the soft breathable pad 822 passes through the storage hole 23 and is located in the limiting groove 22, and the semiconductor 100 in the storage groove is supported by the soft breathable pad 822 and then adsorbed on the fixed suction cup 821.

[0064] The suction cup assembly 82 consists of a fixed suction cup 821 and a soft, breathable pad 822. The bottom of the fixed suction cup 821 is inserted into the mounting hole 85 for fixation, and a soft silicone sleeve can be used to form a sealed connection between the two. A soft, breathable pad 822 is installed on the fixed suction cup 821, so that when the suction cup assembly 82 is inserted into the receiving hole 23, the top surface of the soft, breathable pad 822 is slightly convex to the limiting groove 22. The soft, breathable pad 822 and the receiving hole 23 are in a clearance fit. When the semiconductor 100 is inserted, the bottom is supported by the soft, breathable pad 822 and limited by the limiting groove 22. The suction cup assembly 82 uses the fixed suction cup 821 to seal and maintain the structure, and the soft, breathable pad 822 to provide ventilation and adaptive fit. The two materials each perform their respective functions, working together to achieve safe and reliable fixation. When coating is required, the semiconductor 100 is vacuumed by the suction cup assembly 82, then adsorbed and pressed firmly against the bottom of the limiting groove 22. Simultaneously, the downward pressure of the semiconductor 100 causes the soft, breathable pad 822 to self-adjust, thus creating a stable planar support effect for the bottom of the semiconductor 100 through the soft, breathable pad 822 and the limiting groove 22. The suction force generated by the fixed suction cup 821 stably adsorbs and fixes the semiconductor 100, ensuring that there are no suction marks on the surface of the semiconductor 100, and preventing stress damage to the semiconductor 100 due to height differences in the suction cup area.

[0065] A further improvement is made in that the fixed suction cup 821 is a hollow and sealed soft material, and the strength of the fixed suction cup 821 is greater than the strength of the soft breathable pad 822.

[0066] The combination of a fixed suction cup 821 and a soft, breathable pad 822, made of a soft material, enables the suction cup assembly 82 to have an adaptive function. The strength of the fixed suction cup 821 is greater than that of the soft, breathable pad 822, allowing the suction cup assembly 82 to adaptively expand and contract according to the thickness and flatness of the semiconductor 100, ensuring that the bottom of the semiconductor 100 is flatly attached within the limiting groove 22. The soft, breathable pad 822 is preferably made of sponge, and the fixed suction cup 821 is preferably made of silicone. Under the action of negative pressure adsorption, the microstructure of the soft, breathable pad 822 will compress and deform, perfectly conforming to any minor unevenness that may exist on the back of the semiconductor 100, resulting in a more uniform distribution of adsorption force. This avoids damage to the workpiece (such as the semiconductor 100) caused by localized stress concentration points during the coating process. The deformation of the silicone fixed suction cup 821 to adapt to the unevenness of the vacuum assembly 8 and eliminate stress concentration better protects brittle workpieces such as the semiconductor 100. The strength of the fixed suction cup 821 is greater than that of the soft, breathable pad 822, which facilitates support and also improves the service life of the suction cup assembly 82. Simultaneously, it solves the two core challenges of reliable fixation without damage and self-adaptive fit to ensure flatness, thus meeting the precision manufacturing requirements of the high-performance semiconductor 100.

[0067] Further improvements include, for example Figure 6 As shown, the vacuum pipeline 83 includes several horizontally arranged airflow channels 833, a longitudinally arranged series hole 832, and an air extraction hole 831. The vacuum pipeline 83 is connected to the flow regulating valve 84 through the air extraction hole 831. The airflow channels 833 adopt a countersunk hole structure, and the series hole 832 adopts a countersunk hole or through hole structure. Several airflow channels 833 are connected through the series hole 832. One end of the air extraction hole 831 is connected to the series hole 832. The end of the series hole 832 is provided with a plug 13. Several mounting holes 85 are connected to each of the branch pipelines.

[0068] The airflow channels 833 and the series holes 832 are arranged in a crisscross pattern. Multiple airflow channels 833 can be interconnected through the series holes 832, and their ends are sealed with plugs 13. Therefore, when the suction port 831 is used for suction, only one suction pipe needs to be connected to the flow regulating valve 84 to quickly suction all suction cup assemblies 82 and create a specified negative pressure. The structure for creating the new negative pressure is simple. The airflow channels 833 adopt a countersunk hole structure. When suction is performed, the internal airflow can enter the suction port 831 along the series holes 832 and be extracted, thus achieving the adsorption effect of the installed suction cup assemblies 82. When suction stops, each airflow channel 833 can be quickly inflated through an opening at one end to create normal pressure, allowing the semiconductor 100 to release immediately upon stopping suction. This achieves stable air pressure within the suction cup assembly 82 without active inflation, preventing the semiconductor 100 from failing to detach in time.

[0069] The series hole 832 is located in the middle of the vacuum plate 81 along its length. When the vacuum plate 81 is relatively short and easy to drill, a countersunk hole is preferred. When the channel is long, a through-hole structure can be formed by opening holes at both ends. The airflow channel 833 extends along its width, with multiple airflow channels 833 distributed in parallel. This allows the airflow channel 833 to intersect and connect with the series hole 832 after being opened, facilitating airflow. Its countersunk hole structure reduces the vacuum pressure required for evacuation. The evacuation hole 831 is located near the middle and connects with the series hole 832. During evacuation, it allows for more uniform airflow extraction from the airflow channels 833 on both sides. To ensure evacuation efficiency, the ends of the series hole 832 are sealed with plugs 13. Generally, one airflow channel 833 corresponds to 2 to 4 mounting holes 85, and each limiting groove 22 has an airflow channel 833 at its bottom. When adsorbing and fixing the semiconductor 100, multiple suction cup components 82 are used for adsorption and fixing, which can effectively ensure the adsorption firmness and has a wider adaptive range for the support area at the bottom of the semiconductor 100.

[0070] Further improvements include, for example Figure 4 As shown, the bottom of the carrier film seat 2 is provided with several support feet 15, and the upper end surface of the carrier film seat 2 is provided with several grooves 21, which are distributed on both sides of the limiting groove 22.

[0071] To facilitate handling by operators when inserting and removing the semiconductor 100, downward-facing recesses 21 are formed on both sides of each limiting groove 22. These recesses 21 allow for easy gripping of both sides of the semiconductor 100, facilitating temporary replacement. This effectively solves the problem of difficulty in removing a damaged semiconductor 100 after it has been placed in the limiting groove 22. Furthermore, several support feet 15 are symmetrically provided at the bottom of the film carrier 2. After disassembly, the support feet 15 allow the film carrier 2 to be suspended in the air, making it easier to handle, especially after subsequent drying.

[0072] The corners of the carrier film holder 2 are provided with H-shaped positioning holes 16. One end of the support foot 15 is fixed to the bottom of the H-shaped positioning hole 16, and the top of the H-shaped positioning hole 16 is used to limit the support foot 15 when the carrier film holder 2 is stacked.

[0073] H-shaped positioning holes are formed at the four corners of the carrier film holder 2. The top of the support foot 15 is inserted into the bottom of the H-shaped positioning hole for fixation. The bottom can adopt a threaded hole structure. The support foot 15 is more secure after being connected by threads. The top of the H-shaped positioning hole is recessed and can be used as a limit. When multiple carrier film holders 2 are stacked, the support foot 15 can be inserted to achieve a firm fixation and avoid the problem of tipping over during the stacking process.

[0074] A further improvement is that the side of the vacuum plate 81 is provided with a limiting groove 14, and at least one of the support feet 15 of the carrier film seat 2 is limited by the limiting groove 14.

[0075] When the carrier film holder 2 is installed on the vacuum plate 81, it can be quickly positioned by inserting the support feet 15 into the limiting slots 14. The vacuum plate 81 has a recessed limiting slot 14 on each side, with the limiting slot 14 located in the middle. The bottom of the carrier film holder 2 has three support feet 15, which are inserted into the limiting slots 14 on both sides for quick positioning.

[0076] The vacuum plate 81 is further provided with an upwardly protruding limiting block 18 at both ends, and the limiting block 18 is provided with a guide surface 17. When the carrier film seat 2 is installed, the middle support foot 15 is inserted along the limiting slot 14. When it is inserted to a certain height, the two sides can be quickly guided by the guide surface 1711 and accurately stacked on the vacuum plate 81. After installation, the limiting blocks 18 on both sides can be used for positioning to avoid shaking or displacement.

[0077] Further improvements include, for example Figure 7 and Figure 8As shown, the workbench 1 is also provided with a base 19, the base 19 including a base plate 191, a plurality of support blocks 192 provided on the base plate 191 for fixing the vacuum assembly 8, four fixing holes 194 provided on the base plate 191, and fixing bolts 193 provided in the fixing holes 194, the diameter of the fixing bolts 193 being smaller than the diameter of the fixing holes 194.

[0078] Vacuum plate 81 is mounted on support block 192, while base 19 is pressed and fixed on coating machine worktable 1 by fixing bolt 193. Since the diameter of fixing bolt 193 is smaller than the diameter of fixing hole 194, base 19 can be finely adjusted on coating machine worktable 1, making semiconductor 100 position adjustment more convenient and avoiding uneven coating caused by semiconductor 100 being placed tilted.

[0079] A further improvement is made by providing an adjustment mechanism 9 on the workbench 1 to limit the horizontal position of the base 19; the adjustment mechanism 9 includes an L-shaped adjustment seat 92 located on the outer side of the corner of the base plate 191 and two adjustment bolts 91 located on the L-shaped adjustment seat 92.

[0080] L-shaped adjusting seats 92 are fixed to the coating machine worktable 1 by screws, etc. The base plate 191 is installed between the four L-shaped adjusting seats 92. The adjusting bolts 91 on both sides abut against the sides of the base plate 191. By adjusting the adjusting bolts 91, the position of the base plate 191 can be finely adjusted. When the base plate 191 is moved into position, the horizontal direction of the base plate 191 can be limited by tightening the adjusting bolts 91. And the upper and lower limits can be achieved by pressing the fixing bolts 193, so that it is firmly and accurately installed on the coating machine worktable 1.

[0081] In actual production, the vacuum assembly 8 is precisely mounted on the worktable 1 via the base 19 and the adjustment mechanism 9. The base 19 allows for rapid horizontal adjustment within a certain range, while the adjustment mechanism 9 allows for fine-tuning of the base 19's position (front, back, left, and right) under a certain clamping force, ensuring the accuracy of the installation position. The combination of the adjustment mechanism 9 and the base 19 allows for precise adjustment and fixation of the vacuum assembly 8 and the film carrier 2 on the coating machine's worktable 1, ensuring the semiconductor 100 maintains accurate coating position during coating. Even when subjected to horizontal forces or vertical vibrations, there will be no positional shift. The vacuum assembly 8 is mounted on the base 19, which is connected to a pump or other suction power equipment. The film carrier 2 is mounted on the vacuum assembly 8, with the suction portion of the vacuum assembly 8 extending into the limiting groove 22 through the receiving hole 23. When coating semiconductor 100 is required, semiconductor 100 is placed in limiting groove 22 for horizontal positioning. The vacuum level of vacuum component 8 is then controlled to ensure the bottom surface of semiconductor 100 is stably adhered to the plane formed by limiting groove 22 and vacuum component 8 for coating. After coating, the coated semiconductor 100 is directly detached from vacuum component 8 via film carrier 2 for drying. A new film carrier 2 is then used to fix the coating of semiconductor 100. Throughout the operation, the adsorption area of ​​vacuum component 8 protrudes upwards through receiving hole 23 to support the adsorption area. This solves both the problem of potential damage to semiconductor 100 after clamping and the problem of uneven bottom adhesion when using a suction cup structure for adsorption. This allows for reliable, damage-free fixation and self-adaptive adhesion to ensure flatness during coating, resulting in higher precision in semiconductor 100 coating.

[0082] Example 2: A method for coating semiconductors using a semiconductor screen coating machine, the coating method comprising: S1. Fix the carrier film holder 2 onto the vacuum assembly 8, install the vacuum assembly 8 onto the worktable 1, and adjust the relative position of the semiconductor 100 limiting groove 22 on the carrier film holder 2 and the wire mesh feeding port 7 on the stencil assembly 6 by adjusting the adjusting mechanism 9 installed on the worktable 1. After the vacuum assembly 8 is fixed, remove the carrier film holder 2. S2. Take a carrier film holder 2 and place the semiconductor 100 into the storage slot; S3. Start the vacuum system to put the suction cup assembly 82 on the vacuum assembly 8 into a negative pressure state, assemble the carrier film seat 2 with semiconductor 100 onto the vacuum assembly 8 and position it so that the bottom of semiconductor 100 is adaptively adsorbed and supported by multiple soft and breathable pads 822. S4. Start the controller 5, and move the coating scraper assembly 3 and the screen assembly 6 to the set initial position through the moving module 4; S5. Start the coating process. Move the coating scraper assembly 3 and the stencil assembly 6 downward by moving the module 4, so that the stencil assembly 6 presses the upper surface of the semiconductor 100. S6. Pour the functional coating into the material tank 61, so that the functional coating is on one side of the scraper blade 31. S7. Control the coating scraper assembly 3 to move down to the upper surface of the screen assembly 6, and then control the coating scraper assembly 3 to move laterally so that the functional coating material can penetrate and be pressed into the upper surface of the semiconductor 100 through the wire mesh feeding port 7 on the screen assembly 6. S8. After the coating blade assembly 3 has finished moving, the coating blade assembly 3 and the stencil assembly 6 are moved to their initial positions by the moving module 4; the vacuum system is turned off and started, and the film carrier 2 is removed from the vacuum assembly 8 and dried; the single-sided coating operation of the semiconductor 100 is completed. S9. Repeat steps S2 to S8 to perform a double-layer coating on semiconductor 100.

[0083] Taking eight limiting grooves 22 on the carrier film holder 2 as an example, the eight limiting grooves 22 are arranged in parallel and equidistant intervals. Each limiting groove 22 has three receiving holes 23 at its bottom. Before coating, the position of the vacuum assembly 8 with the carrier film holder 2 on the worktable 1 is directly adjusted and fixed by the adjustment mechanism 9. Thus, during the coating operation, only the carrier film holder 2 needs to be replaced to achieve precise positioning of each semiconductor 100 to be coated. When coating begins, the entire vacuum system is activated after the external vacuum equipment is started, so that the suction cup assembly 82 on the vacuum assembly 8 is in a negative pressure state. When the carrier film holder 2 with the semiconductor 100 is assembled onto the vacuum assembly 8 and positioned, after the bottom of the semiconductor 100 contacts the suction cup assembly 82, it can be adaptively adsorbed and supported by multiple soft and breathable pads 822. When the stencil assembly 6 moves downward and presses the semiconductor 100 under the control of the controller 5, the area where its bottom contacts the soft, breathable pad 822 can achieve adaptive height adjustment. Simultaneously, with the bottom support of the limiting groove 22, this effectively solves the problem of damage to the semiconductor 100 after it is fixed and subjected to pressure. The controller 5 can arbitrarily set the initial position of the coating scraper assembly 3, typically the upper middle of the stencil assembly 6. When coating begins, it can move to any end of the stencil assembly 6, and with the scraper, coating operations in any direction can be achieved. Functional coatings can be poured into the material tank 61 by the operator, placing the functional coating on one side of the scraper 31; during the coating process, coatings can be added at any time when insufficient. During the coating process, the coating blade 31 on the coating blade assembly 3 is pushed downward by the lifting cylinder 32 to contact the stencil assembly 6, and appropriate pressure is applied to make the screen film 63 contact the semiconductor 100. Finally, the coating blade assembly 3 evenly coats the mixed functional coating onto the upper surface of the semiconductor 100. After the coating blade assembly 3 finishes moving, the moving module 4 moves the coating blade assembly 3 and the stencil assembly 6 back to their initial positions. The vacuum system is then turned off and the film carrier 2 is removed from the vacuum assembly 8 and dried. This completes the single-sided coating operation of the semiconductor 100. A new set of film carriers 2 with semiconductors 100 can be assembled and coated in a timely manner. When the semiconductor 100 is coated with two layers, after drying, the side of the semiconductor 100 that needs to be coated is placed back into the limiting groove 22 and positioned on top, thus achieving coating treatment on the other side. The entire operation is simple and convenient, and the semiconductor 100 is not easily damaged during the coating process. The coating area is precise and highly uniform.

[0084] A further improvement is made so that the coating scraper assembly 3 performs at least two unidirectional movements to ensure that the surface of the semiconductor 100 is coated with functional coating twice.

[0085] The main purpose of the first coat is to force a sufficient amount of paint into the mesh opening 7 of the screen printing plate 63 under greater pressure, and to ensure that it is in full contact with the surface of the semiconductor 100, thus overcoming surface tension and achieving initial coverage. At the same time, under the pressure of the squeegee 31, the air trapped between the paint and the substrate can be squeezed out, reducing the generation of problems such as bubbles and pinholes. The second coat can precisely remove the excess paint left from the first coat, and at the same time smooth the coating surface, which is a key step to achieve uniform and precise coating thickness.

[0086] A further improvement is made in that the thickness of the semiconductor 100 is greater than the depth of the limiting groove 22. When the screen film 63 contacts the upper surface of the semiconductor 100, it can effectively ensure the contact area and adhesion effect, and avoid the problem that the coating penetrates into the non-coated area during the coating process and causes it to solidify and stick during the later drying process, thus preventing the semiconductor 100 from being removed from the limiting groove 22.

[0087] A further improvement is made to the suction cup assembly 82, which applies a negative pressure of 15-30 kPa to the semiconductor 100; the screen feed port 7 on the screen membrane 63 uses a 100-300 mesh filter, and the viscosity of the functional coating is 10-150 Pas. This avoids stress damage to the semiconductor 100 during the adsorption process and allows the twisted functional coating to pass through the screen membrane 63 for coating. Multiple semiconductors 100 can be precisely accommodated by the carrier 2, with a specific spacing between them. To effectively prevent coating contamination of the equipment during the coating process and to ensure coating accuracy, the matching fixing frame 62 adopts an opening design that perfectly corresponds to the carrier 2. This collaborative design not only allows the fixing frame 62 to achieve precise alignment with the semiconductors 100 on the carrier 2 but also effectively controls the coating area through physical isolation, significantly improving the consistency and reliability of the coating process.

[0088] The above embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of protection of this application. Any non-substantial changes and substitutions made by those skilled in the art based on this application shall fall within the scope of protection claimed by this application.

Claims

1. A semiconductor screen coating machine, characterized in that: The system includes a worktable (1), a vacuum assembly (8) mounted on the worktable (1), a film carrier (2) mounted on the vacuum assembly (8), a controller (5) mounted on the worktable (1), and a moving module (4). The moving module (4) is equipped with a coating scraper assembly (3) and a stencil assembly (6). The stencil assembly (6) is equipped with a plurality of screen feeding ports (7). The coating scraper assembly (3) and the stencil assembly (6) move through the moving module (4). The bottom of the semiconductor (100) placed on the film carrier (2) is adsorbed by the vacuum assembly (8). The coating material on the stencil assembly (6) is moved by the coating scraper assembly (3) to the screen feeding ports (7) to coat the upper surface of the semiconductor (100).

2. A semiconductor screen coating machine according to claim 1, characterized in that: The mesh assembly (6) includes a fixed frame (62) and a wire mesh (63) disposed in the fixed frame (62). The wire mesh (63) and the fixed frame (62) form an upward-facing material trough (61). The wire mesh feed port (7) is located inside the wire mesh (63).

3. A semiconductor screen coating machine according to claim 2, characterized in that: The coating scraper assembly (3) includes a lifting cylinder (32) and a scraper (31) mounted on the piston rod of the lifting cylinder (32).

4. A semiconductor screen coating machine according to claim 3, characterized in that: A blade holder (33) is provided between the scraper (31) and the lifting cylinder (32), and the blade of the scraper (31) is fixed by the blade holder (33) and is set at an angle.

5. A semiconductor screen coating machine according to claim 4, characterized in that: The moving module (4) includes a longitudinal slide rail (42) vertically arranged on the worktable (1), a slide block (43) slidably connected to the longitudinal slide rail (42), an electric slide table (44) arranged laterally on the slide block (43), and a driver (41) for controlling the slide block (43) to slide up and down. The screen assembly (6) is mounted on the slide block (43), and the coating scraper assembly (3) is mounted on the electric slide table (44).

6. A semiconductor screen coating machine according to claims 1-5, characterized in that: The vacuum assembly (8) includes a vacuum plate (81) on the workbench (1), a vacuum pumping pipeline (83) inside the vacuum plate (81), a plurality of suction cup assemblies (82) with adaptive function on the vacuum plate (81), and a flow regulating valve (84) connected to the vacuum pumping pipeline (83) through a pipe. The semiconductor (100) is adsorbed onto the film carrier (2) through the suction cup assembly (82), and the vacuum degree of the suction cup assembly (82) is controlled by the flow regulating valve (84).

7. A semiconductor screen coating machine according to claim 6, characterized in that: The suction cup assembly (82) includes a detachable fixed suction cup (821) fixed in the mounting hole (85) and a soft breathable pad (822) provided on the fixed suction cup (821).

8. A semiconductor screen coating machine according to claim 1, characterized in that: The carrier film seat (2) is provided with a plurality of limiting grooves (22) for placing semiconductors (100) at intervals. Each limiting groove (22) is provided with a receiving hole (23) for passing through the suction cup assembly (82). The top of the suction cup assembly (82) is located in the limiting groove (22). The bottom of the semiconductor (100) is vacuumed by the vacuum assembly (8) and then adsorbed onto the suction cup assembly (82) under negative pressure.

9. A semiconductor coating method, characterized in that: Including a semiconductor screen coating machine as described in any one of claims 1 to 8, the coating method includes: S1. Fix the carrier film holder (2) onto the vacuum assembly (8), install the vacuum assembly (8) onto the worktable (1), and adjust the relative position of the semiconductor (100) limiting groove (22) on the carrier film holder (2) and the wire mesh feeding port (7) on the stencil assembly (6) by adjusting the adjustment mechanism (9) installed on the worktable (1). After fixing the vacuum assembly (8), remove the carrier film holder (2). S2. Take a carrier film holder (2) and place the semiconductor (100) into the storage slot; S3. Start the vacuum system to put the suction cup assembly (82) on the vacuum assembly (8) into a negative pressure state, assemble the carrier film seat (2) with semiconductor (100) onto the vacuum assembly (8) and position it so that the bottom of the semiconductor (100) is adaptively adsorbed and supported by multiple soft breathable pads (822). S4. Start the controller (5) and move the coating scraper assembly (3) and the screen assembly (6) to the set initial position through the moving module (4); S5. Start the coating process. Move the coating scraper assembly (3) and the stencil assembly (6) downward by moving the module (4) so ​​that the stencil assembly (6) presses the upper surface of the semiconductor (100). S6. Pour the paint into the material tank (61) so that the paint is on one side of the scraper (31); S7. Control the coating blade assembly (3) to move down to the upper surface of the stencil assembly (6) and then control the coating blade assembly (3) to move laterally so that the coating material can penetrate and be pressed into the upper surface of the semiconductor (100) through the wire mesh feeding port (7) on the stencil assembly (6). S8. After the coating blade assembly (3) has finished moving, the coating blade assembly (3) and the stencil assembly (6) are moved to their initial positions by the moving module (4); the film carrier (2) is removed from the vacuum assembly (8) and dried; the single-sided coating operation of the semiconductor (100) is completed. S9. Repeat steps S2 to S8 to perform a double-layer coating on the semiconductor (100).

10. A semiconductor screen coating machine according to claim 9, characterized in that: In step S7, the coating scraper assembly (3) moves back and forth at least once to ensure that the semiconductor (100) surface is coated with coating twice.

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