Turret type wafer sorting machine and sorting method thereof

Abstract

The invention provides a turret type wafer sorting machine and a sorting method thereof. The turret type wafer sorting machine comprises a rack and further comprises a turret, a feeding module, a clamping and transferring module, an XY theta adjusting module, an ejector pin module, an overturning module, an X-axis deviation rectifying module, a Y-axis deviation rectifying module, a testing station, a laser marking module, a 4S VISION, a BOTTOM VISION, an Aligner visual deviation rectifying module and a braiding module. The rotating tower and the feeding module are located at the two ends of the machine frame respectively. The sorting method comprises the following steps: A, feeding; b, conveying; and C, intermittent sorting operation. The turret type wafer sorting machine is compact in structure, and the sorting method is high in automation degree.

Description

Technical Field

[0001] This invention relates to the field of mechanical technology, and more specifically to a turret-type wafer sorter and its sorting method. Background Technology

[0002] Wafer-level chip packaging (WLCSP), as a packaging process that completes all packaging and testing directly on the wafer, places more stringent requirements on the overall performance of wafer testing and sorting equipment, encompassing key indicators such as dustproof rating, force control accuracy, positioning accuracy, and overall production efficiency. It is important to note that the die structure formed after WLCSP dicing is extremely fragile, lacking the physical protection of traditional packaging shells, and is highly sensitive to external forces and contact methods during sorting and transport.

[0003] Most wafer sorting equipment currently on the market adopts a translational structure. Although it has a certain degree of accuracy, its production efficiency is limited. In addition, in the picking, placing, and positioning processes, inaccurate force control or mechanical interference can easily cause scratches, chipping, and other cosmetic damage to the bare wafers, thereby affecting the product yield.

[0004] While some turret-type sorting equipment has improved in efficiency, it has significant shortcomings in functional integration, making it difficult to meet the high-efficiency and high-precision sorting and packaging requirements of WLCSP packaging. It also lacks a non-destructive processing mechanism for bare dies.

[0005] In addition, existing equipment generally suffers from low functional integration, such as the lack of integrated chip laser marking function, lack of defective product retesting mechanism, and insufficient automatic compensation capability during tape feeding process, which restricts the overall efficiency and intelligence level of the equipment.

[0006] To address the aforementioned industry challenges, our organization is dedicated to improving existing turret-type wafer sorters, making them suitable for efficient testing, sorting, and tape-and-reel packaging of CSP-packaged wafers. The equipment's structural design and control strategy prioritize non-destructive handling of bare dies, effectively avoiding surface damage through optimized force control and transport paths. The equipment uses wafers carried by a blue film as input and ultimately achieves industry-standard tape and reel output, striving for comprehensive optimization in accuracy, efficiency, reliability, and functional completeness. Summary of the Invention

[0007] The first objective of this invention is to provide a compact turret-type wafer sorter to address the aforementioned problems in the existing technology.

[0008] The second objective of this invention is to provide a sorting method using the aforementioned turret-type wafer sorter.

[0009] To achieve the first objective mentioned above, the present invention can be implemented through the following technical solutions: A turret-type wafer sorting machine includes a frame, characterized in that it further includes a turret, a feeding module, a clamping and transfer module, an XYθ adjustment module, a ejector pin module, a flipping module, an X-axis correction module, a Y-axis correction module, a testing station, a laser marking module, 4S VISION, BOTTOM VISION, an Aligner vision correction module, and a tape and reel module. Along the projection direction perpendicular to the upper part of the frame, the aforementioned turret and feeding module are located at both ends of the frame. The feeding module is connected to the frame and is used to store wafer boxes, which are used to store wafer workpieces. The aforementioned turret is axially fixed to the upper part of the frame and has several suction nozzles on its side for adsorbing wafer workpieces. The lower part of the turret is used to connect to a drive component that can drive its intermittent rotation. The XYθ adjustment module, ejector pin module, flipping module, X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape-and-reel module are circumferentially distributed on the connecting frame centered on the turret. The clamping and transfer module is located between the feeding module and the XYθ adjustment module. The clamping and transfer module can grip the wafer workpiece at the feeding module and place it at the XYθ adjustment module, which is used to adjust the position of the wafer workpiece. The ejector pin module is used to push the wafer workpiece at the XYθ adjustment module into the flipping module. The flipping module is used to flip the wafer workpiece. Each time the turret moves intermittently, it positions the wafer workpiece at the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module, respectively.

[0010] In the aforementioned turret-type wafer sorter, an overflow bin is also fixedly connected to the frame, and the overflow bin is adjacent to the ejector pin module.

[0011] To achieve the second objective mentioned above, the present invention can be implemented through the following technical solutions: A sorting method using a turret-type wafer sorter, characterized in that the method includes the following steps: A. Feeding: Place a set number of wafer boxes equipped with wafer workpieces at the feeding module. B. Conveying: The wafer workpiece is sent to the XYθ adjustment module by the clamping and transfer module. After the XYθ adjustment module adjusts the position of the wafer workpiece entering the module, the ejector module sends the adjusted wafer workpiece to the flipping module. The flipping module flips the wafer workpiece and waits for adsorption. C. Intermittent sorting operation: Wafer workpieces are adsorbed by the suction nozzles on the turret. The turret with the wafer workpieces rotates intermittently, allowing the adsorbed wafer workpieces to sequentially enter the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module. The X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module perform corresponding processing operations on the wafer workpieces entering the station in sequence.

[0012] In the sorting method using the turret-type wafer sorter described above, there are two tape and reel modules. In step C, one tape and reel module is used for operation, while the other tape and reel module has sorted wafer workpieces on it and can be used as a feeding module in reverse.

[0013] When another tape module reverses and feeds material, the material is not supplied from the flipping module, but directly from the tape module. In this process, the workpiece is fed through the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module and tape module in sequence. The X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION and Aligner vision correction module are then processed.

[0014] In the sorting method using a turret-type wafer sorter described above, unqualified wafer workpieces are rejected after being tested at the testing station.

[0015] In the sorting method using a turret-type wafer sorter described above, there are several test stations, and each test station performs tests on the corresponding inspection items of the wafer workpiece.

[0016] In the sorting method using a turret-type wafer sorter described above, the laser marking module is used to laser mark the wafer workpiece.

[0017] In the sorting method using a turret-type wafer sorter described above, the 4SVISION is used to perform optical inspection on the upper surface and side surfaces of the wafer workpiece after it has been marked.

[0018] In the sorting method using a turret-type wafer sorter described above, BOTTOMVISION is used to perform optical inspection on the bottom of the wafer workpiece after it has been marked.

[0019] In the sorting method using a turret-type wafer sorter described above, the Aligner vision correction module is used to correct the position of the wafer workpiece.

[0020] Compared with existing technologies, this turret-type wafer sorter addresses industry challenges such as the susceptibility of bare dies to damage during WLCSP packaging and the high requirements for testing and sorting accuracy. In terms of structural design, it adopts flexible suction nozzles, non-grooved turntables, and non-contact positioning to fundamentally avoid damage caused by mechanical hard contact.

[0021] In terms of motion control, high-precision actuators such as linear motors and voice coil motors are introduced, and a closed-loop force control strategy is implemented, which greatly improves the flexibility and precision of the equipment in key processes such as picking, placing, lifting, and positioning, and achieves non-destructive processing of the bare wafers.

[0022] This equipment improves sorting efficiency and accuracy while integrating multiple functions such as laser marking, multi-station testing, and defective product retesting, demonstrating high integration and intelligence.

[0023] The tape and reel module supports bidirectional operation, enhancing the equipment's flexibility and retesting efficiency. Overall, this equipment represents a significant advancement in structural design, force control strategy, and functional configuration, meeting the modern semiconductor packaging industry's demands for high-yield, high-efficiency, and high-reliability sorting equipment, and possesses broad application prospects and market promotion value. Attached Figure Description

[0024] Figure 1 This is a top view schematic diagram of the structure of this turret-type wafer sorter.

[0025] In the picture: 1. Frame; 2. Turret; 3. Feeding module; 4. Clamping and transfer module; 5. XYθ adjustment module; 6. Ejector pin module; 7. Tilting module; 8. X-axis correction module; 9. Y-axis correction module; 10. Test station; 11. Laser marking module; 12. 4S VISION; 13. BOTTOM VISION; 14. Aligner vision correction module; 15. Tape and reel module; 16. Overflow bin. Detailed Implementation

[0026] The following are specific embodiments of the present invention, which, together with the accompanying drawings, will further describe the technical solution of the present invention.

[0027] like Figure 1As shown, this turret-type wafer sorting machine includes a frame, a turret, a feeding module, a clamping and transfer module, an XYθ adjustment module, a ejector pin module, a flipping module, an X-axis correction module, a Y-axis correction module, a testing station, a laser marking module, 4S VISION, BOTTOM VISION, an Aligner vision correction module, and a tape and reel module. Along the projection direction perpendicular to the upper part of the frame, the aforementioned turret and feeding module are located at both ends of the frame. The feeding module is connected to the frame and is used to store wafer boxes, which are used to store wafer workpieces. The aforementioned turret is axially fixed to the upper part of the frame and has several suction nozzles on its side for adsorbing wafer workpieces. The lower part of the turret is used to connect to a drive component that can drive its intermittent rotation. The XYθ adjustment module, ejector pin module, flipping module, X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape-and-reel module are circumferentially distributed on the connecting frame centered on the turret. The clamping and transfer module is located between the feeding module and the XYθ adjustment module. The clamping and transfer module can grip the wafer workpiece at the feeding module and place it at the XYθ adjustment module, which is used to adjust the position of the wafer workpiece. The ejector pin module is used to push the wafer workpiece at the XYθ adjustment module into the flipping module. The flipping module is used to flip the wafer workpiece. Each time the turret moves intermittently, it positions the wafer workpiece at the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module, respectively.

[0028] An overflow tank is also fixedly connected to the frame, and the overflow tank is adjacent to the ejector pin module.

[0029] This sorting method using a turret-type wafer sorter is characterized by the following steps: A. Feeding: Place a set number of wafer boxes equipped with wafer workpieces at the feeding module. B. Conveying: The wafer workpiece is sent to the XYθ adjustment module by the clamping and transfer module. After the XYθ adjustment module adjusts the position of the wafer workpiece entering the module, the ejector module sends the adjusted wafer workpiece to the flipping module. The flipping module flips the wafer workpiece and waits for adsorption. C. Intermittent sorting operation: Wafer workpieces are adsorbed by the suction nozzles on the turret. The turret with the wafer workpieces rotates intermittently, allowing the adsorbed wafer workpieces to sequentially enter the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module. The X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module perform corresponding processing operations on the wafer workpieces entering the station in sequence.

[0030] The number of tape and reel modules is two. In step C, one tape and reel module is used for operation, while the other tape and reel module has sorted wafer workpieces and can be used as a feeding module in reverse.

[0031] Defective wafer workpieces are rejected after being tested at the testing station.

[0032] The number of test stations is several, and each test station performs tests on the corresponding inspection items of the wafer workpiece.

[0033] Laser marking modules are used for laser marking on wafer workpieces.

[0034] The 4SVISION is used for optical inspection of the upper surface and side surfaces of the wafer workpiece after it has been marked.

[0035] The BOTTOMVISION is used for optical inspection of the bottom of the wafer workpiece after it has been marked.

[0036] The Aligner vision correction module is used to correct the position of wafer workpieces.

[0037] The turret-type wafer sorter addresses industry challenges such as the susceptibility of bare dies to damage and the high precision requirements for testing and sorting during WLCSP packaging. In terms of structural design, it adopts flexible suction nozzles, non-grooved turntables, and non-contact positioning to fundamentally avoid damage caused by mechanical hard contact.

[0038] In terms of motion control, high-precision actuators such as linear motors and voice coil motors are introduced, and a closed-loop force control strategy is implemented, which greatly improves the flexibility and precision of the equipment in key processes such as picking, placing, lifting, and positioning, and achieves non-destructive processing of the bare wafers.

[0039] This equipment improves sorting efficiency and accuracy while integrating multiple functions such as laser marking, multi-station testing, and defective product retesting, demonstrating high integration and intelligence.

[0040] The tape and reel module supports bidirectional operation, enhancing the equipment's flexibility and retesting efficiency. Overall, this equipment represents a significant advancement in structural design, force control strategy, and functional configuration, meeting the modern semiconductor packaging industry's demands for high-yield, high-efficiency, and high-reliability sorting equipment, and possesses broad application prospects and market promotion value.

[0041] The structural technical features of each module in this patent application have been disclosed in a prior patent application, patent application number 2025110705524. Therefore, the structural technical features of each module will not be described again in this embodiment.

[0042] The technical solutions of the present invention described above provide solutions that are significantly different from those of the prior art, addressing the problem that existing technical solutions are too simplistic. The parts not covered in this application are the same as or can be implemented using existing technologies, and will not be described in detail here.

[0043] The technical solutions in the above embodiments have clearly and completely described the content of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

Claims

1. A turret-type wafer sorting machine, comprising a frame, characterized in that, It also includes a turret, feeding module, clamping and transfer module, XYθ adjustment module, ejector pin module, flipping module, X-axis correction module, Y-axis correction module, testing station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module. Along the projection direction perpendicular to the upper part of the frame, the aforementioned turret and feeding module are located at both ends of the frame. The feeding module is connected to the frame and is used to store wafer boxes, which are used to store wafer workpieces. The aforementioned turret is axially fixed to the upper part of the frame and has several suction nozzles on its side for adsorbing wafer workpieces. The lower part of the turret is used to connect to a drive component that can drive its intermittent rotation. The XYθ adjustment module, ejector pin module, flipping module, X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape-and-reel module are circumferentially distributed on the connecting frame centered on the turret. The clamping and transfer module is located between the feeding module and the XYθ adjustment module. The clamping and transfer module can grip the wafer workpiece at the feeding module and place it at the XYθ adjustment module, which is used to adjust the position of the wafer workpiece. The ejector pin module is used to push the wafer workpiece at the XYθ adjustment module into the flipping module. The flipping module is used to flip the wafer workpiece. Each time the turret moves intermittently, it positions the wafer workpiece at the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module, respectively.

2. The turret-type wafer sorter according to claim 1, characterized in that, An overflow tank is also fixedly connected to the frame, and the overflow tank is adjacent to the ejector pin module.

3. A sorting method using a turret-type wafer sorter as described in claim 1 or 2, characterized in that, The method includes the following steps: A. Feeding: Place a set number of wafer boxes equipped with wafer workpieces at the feeding module. B. Conveying: The wafer workpiece is sent to the XYθ adjustment module by the clamping and transfer module. After the XYθ adjustment module adjusts the position of the wafer workpiece entering the module, the ejector module sends the adjusted wafer workpiece to the flipping module. The flipping module flips the wafer workpiece and waits for adsorption. C. Intermittent sorting operation: Wafer workpieces are adsorbed by the suction nozzles on the turret. The turret with the wafer workpieces rotates intermittently, allowing the adsorbed wafer workpieces to sequentially enter the X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module. The X-axis correction module, Y-axis correction module, test station, laser marking module, 4S VISION, BOTTOM VISION, Aligner vision correction module, and tape and reel module perform corresponding processing operations on the wafer workpieces entering the station in sequence.

4. The sorting method according to claim 3, characterized in that, The number of tape and reel modules is two. In step C, one tape and reel module is used for operation, while the other tape and reel module has sorted wafer workpieces and can be used as a feeding module in reverse.

5. The sorting method according to claim 3, characterized in that, Defective wafer workpieces are rejected after being tested at the testing station.

6. The sorting method according to claim 3, characterized in that, The number of test stations is several, and each test station performs tests on the corresponding inspection items of the wafer workpiece.

7. The sorting method according to claim 3, characterized in that, Laser marking modules are used for laser marking on wafer workpieces.

8. The sorting method according to claim 3, characterized in that, The 4SVISION is used for optical inspection of the upper surface and side surfaces of the wafer workpiece after it has been marked.

9. The sorting method according to claim 3, characterized in that, The BOTTOMVISION is used for optical inspection of the bottom of the wafer workpiece after it has been marked.

10. The sorting method according to claim 3, characterized in that, The Aligner vision correction module is used to correct the position of wafer workpieces.

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