Ultrasonic welding substrate fixing device and qualification detection method thereof

Abstract

The invention provides an ultrasonic welding substrate fixing device which comprises a lifting part, a fixing part and a fixing part. The plurality of adsorption parts are arranged and are positioned below the base plate; when the adsorption piece is in an adsorption state, negative pressure is generated between the substrate and the adsorption cavity, and the lifting piece abuts against the bottom surface of the substrate; when the adsorption part is in the release state, the negative pressure between the substrate and the adsorption cavity disappears, and the lifting part is far away from the bottom surface of the substrate. The method has the beneficial effects that high-speed and high-reliability automatic production is realized, positive arcs and reverse arcs can be compatible, and the radian range of a welded substrate is expanded; the substrate fixing position is accurate, the substrate cannot move in the welding process, the pin welding position is accurate, and the shearing force is improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of ultrasonic welding, in particular to an ultrasonic welding substrate fixing device and a qualification detection method thereof. BACKGROUND

[0002] In the ultrasonic welding process, the design of a good and reliable clamping tool is a prerequisite for success or failure.

[0003] The prior art has the following deficiencies: There is only one vacuum point, and if the substrate has a slightly large curvature, it is easy to cause adsorption alarm and cannot be welded, and the curvature range of the substrate that can be normally welded is small. Generally, when designing the hole of the substrate fixing device, a certain tolerance is set, and the substrate is fixed by the action of first suction and then clamping. The suction position is not necessarily the final position after the clamping jaw clamps, so the substrate is easy to move during ultrasonic welding, thereby causing: energy transmission loss, insufficient welding strength; the welding position deviates from the preset position, and cannot match the cover plate or the butt joint; during the welding process, a harsh and unstable "squeal" or "impact" sound is emitted, which can shorten the service life of the transducer or cause damage to it. SUMMARY

[0004] Therefore, the present application aims to provide an ultrasonic welding substrate fixing device and a qualification detection method thereof, so as to solve at least one of the above technical problems.

[0005] To achieve the above-mentioned purpose, the technical scheme of the present application is as follows: The present application provides an ultrasonic welding substrate fixing device, which comprises: a lifting member, which is located below the substrate; a plurality of suction members, which are located below the substrate; When the suction members are in the adsorption state, negative pressure is generated between the substrate and the adsorption cavity, and the lifting member tightly presses the bottom surface of the substrate; when the suction members are in the release state, the negative pressure between the substrate and the adsorption cavity disappears, and the lifting member moves away from the bottom surface of the substrate.

[0006] Further, it further comprises clamping members located at both ends of the substrate, a clamping position for clamping the substrate is formed between the two clamping members, a horizontal driving member is fixedly arranged at the bottom of the suction member, and the power output end of the horizontal driving member is fixedly connected with the clamping member.

[0007] Further, a vertical driving member and a pressure sensor are fixedly arranged at the bottom of the lifting member, the vertical driving member is used to adjust the position of the lifting member in the vertical direction, and the pressure sensor is used to detect the position of the lifting member in the vertical direction.

[0008] Furthermore, the adsorption element is provided with an adsorption chamber, the bottom surface of the adsorption chamber has an adsorption hole, the end of the adsorption hole away from the adsorption chamber is connected to a vacuum pump, and the substrate covers and adheres to the top of the adsorption chamber.

[0009] Furthermore, the adsorbed state working process includes: After the substrate falls into the adsorption position, the two clamping members hold the substrate. After the clamping component is clamped, the vacuum pump is started, and the substrate is adsorbed to the top of the adsorption chamber. At the same time, the clamping component moves away from the substrate. After the clamping component releases the substrate, the lifting component rises and presses against the bottom surface of the substrate until the pressure value monitored by the pressure sensor reaches the preset value. Then the lifting component stops moving, and the vacuum sensor in the adsorption chamber monitors whether the vacuum pressure in the adsorption chamber meets the vacuum threshold. If the conditions are met, the clamping device will clamp the substrate again and start the ultrasonic welding process; otherwise, the adsorption is deemed to have failed and an alarm will be triggered.

[0010] Furthermore, the release state working process includes: After ultrasonic welding is completed, the vacuum pump is turned off, the negative pressure in the adsorption chamber disappears, the clamping component moves away from the substrate, the substrate is removed, and the lifting component moves down.

[0011] Furthermore, a sealing ring is provided at the top of the adsorption chamber, and the sealing ring is pressed tightly against the bottom surface of the substrate.

[0012] The second aspect of this invention provides a conformity testing method, applied to the ultrasonic welding substrate fixing device described in the first aspect, comprising: Calculate the reverse arc and the forward arc that the fixing device can adsorb, respectively; If both the reverse and forward arcs that can be adsorbed meet the adsorption requirements for the substrate, then the fixing device is qualified; otherwise, the fixing device is unqualified.

[0013] Furthermore, the calculation process for the absorbable reverse arc radius and positive arc radius includes: Based on the bending direction of the substrate, determine the most dangerous point of the adsorption cavity affected by the substrate deformation; By calculating the planar distance between the most dangerous point and the center of substrate bending, the deformation influence range of the most dangerous point when the substrate is bent can be obtained. Calculate the minimum radius of curvature at the most dangerous point based on the maximum allowable compression change.

[0014] The maximum allowable deformation of the substrate is calculated based on the half span of the substrate and the calculated minimum radius of curvature.

[0015] Furthermore, the maximum compression change is a physical characteristic of the adsorption chamber sealing ring; The most dangerous point of the reverse arc is located at the edge of the bending direction, and the most dangerous point of the positive arc is located at the point farthest from the center of downward pressure.

[0016] Compared with the prior art, the ultrasonic welding substrate fixing device and its qualification detection method described in this invention have the following advantages: It achieves high-speed, high-reliability automated production, is compatible with both positive and negative arcs, and expands the range of arc of the substrate to be welded; The substrate is accurately fixed in position and will not move during the soldering process. The pins are accurately soldered, and the shearing force is improved. Attached Figure Description

[0017] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic diagram of the overall structure of the ultrasonic welding substrate fixing device according to an embodiment of the present invention.

[0018] Explanation of reference numerals in the attached figures: 1. Lifting component; 11. Vertical drive component; 12. Pressure sensor; 2. Adsorption component; 21. Adsorption chamber; 22. Adsorption hole; 3. Clamping component; 31. Horizontal drive component; 4. Sealing ring. Detailed Implementation

[0019] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0020] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] An ultrasonic welding substrate fixing device includes: Lifting component 1, which is located below the base plate; Adsorption element 2, wherein multiple adsorption elements 2 are provided and located below the substrate; When the adsorption member 2 is in the adsorption state, a negative pressure is generated between the substrate and the adsorption cavity 21, and the lifting member 1 presses against the bottom surface of the substrate; when the adsorption member 2 is in the release state, the negative pressure between the substrate and the adsorption cavity 21 disappears, and the lifting member 1 moves away from the bottom surface of the substrate.

[0024] It also includes clamping members 3 located at both ends of the substrate, and a clamping position for clamping the substrate is formed between the two clamping members 3. A horizontal driving member 31 is fixedly provided at the bottom of the adsorption member 2, and the power output end of the horizontal driving member 31 is fixedly connected to the clamping member 3.

[0025] The bottom of the lifting component 1 is fixed with a vertical drive component 11 and a pressure sensor 12. The vertical drive component 11 is used to adjust the position of the lifting component 1 in the vertical direction, and the pressure sensor 12 is used to detect the position of the lifting component 1 in the vertical direction.

[0026] The adsorption component 2 is provided with an adsorption cavity 21, and an adsorption hole 22 is opened on the bottom surface of the adsorption cavity 21. The end of the adsorption hole 22 away from the adsorption cavity 21 is connected to a vacuum pump, and the substrate covers and adheres to the top of the adsorption cavity 21.

[0027] The adsorption state working process includes: After the substrate falls into the position of the adsorption member 2, the two clamping members 3 clamp the substrate. After clamping member 3 clamps, vacuum pump starts, substrate is adsorbed on top of adsorption chamber 21, and clamping member 3 moves away from substrate. After the clamping member 3 releases the substrate, the lifting member 1 rises and presses against the bottom surface of the substrate until the pressure value monitored by the pressure sensor 12 reaches the preset value. Then the lifting member 1 stops moving, and the vacuum sensor in the adsorption chamber 21 monitors whether the vacuum pressure in the adsorption chamber 21 meets the vacuum threshold. If the conditions are met, clamping member 3 will clamp the substrate again and start the ultrasonic welding process; otherwise, the adsorption will be deemed to have failed and an alarm will be triggered.

[0028] In some embodiments, the preset value of the pressure value is specifically: Ten substrates were selected and subjected to adsorption tests on a vacuum fixture. The vacuum value of the adsorbable substrates was above 85 kPa, while the vacuum value of the non-adsorbable substrates was 0 Pa. Therefore, the qualified vacuum value was set to 80 kPa.

[0029] The calculation process for the vacuum pressure that satisfies the vacuum threshold is as follows: The effective adsorption area per acupoint is calculated based on the sealing ring size: ; There are a total of 2 vacuum acupoints, with a total effective adsorption area of: ; The positive pressure (vacuum threshold) generated by a vacuum is: ; In summary, the pressure value of the lifting component can be set to 100N (which is less than the positive pressure generated by a vacuum). The release state working process includes: After ultrasonic welding is completed, the vacuum pump is turned off, the negative pressure in the adsorption chamber 21 disappears, the clamping member 3 moves away from the substrate, the substrate is removed, and the lifting member 1 moves down.

[0030] A sealing ring 4 is provided at the top of the adsorption chamber 21, and the sealing ring 4 is pressed against the bottom surface of the substrate.

[0031] The conformity testing method, applied to the above-mentioned ultrasonic welding substrate fixing device, includes: Calculate the reverse arc and the forward arc that the fixing device can adsorb, respectively; If both the reverse and forward arcs that can be adsorbed meet the adsorption requirements for the substrate, then the fixing device is qualified; otherwise, the fixing device is unqualified.

[0032] The calculation process for the absorbable reverse arc radius and positive arc radius includes: Based on the bending direction of the substrate, determine the most dangerous point of the adsorption cavity 21 affected by the substrate deformation; By calculating the planar distance between the most dangerous point and the center of substrate bending, the deformation influence range of the most dangerous point when the substrate is bent can be obtained. Calculate the minimum radius of curvature at the most dangerous point based on the maximum allowable compression change; The maximum allowable deformation of the substrate is calculated based on the half span of the substrate and the calculated minimum radius of curvature.

[0033] The maximum compression change is a physical property of the sealing ring 4 of the adsorption chamber 21; The most dangerous point of the reverse arc is located at the edge of the bending direction, and the most dangerous point of the positive arc is located at the point farthest from the center of downward pressure.

[0034] In some embodiments, a specific working process of the above-described conformity testing method is as follows: Calculation of the absorbable reverse arc radius (middle convexity): The substrate dimensions are L=152mm in length and W=92mm in width. The newly designed fixture has two vacuum cavities. The coordinates of the center points of the four corners of the sealing ring are shown in the figure. The length of the sealing ring is... ,Width With a wire diameter d = 2mm and a groove depth of 1.4mm, the height of the sealing ring protruding from the groove surface is h = 0.6mm. The sealing ring can still seal even when the compression is reduced to 0.1mm (i.e., the maximum allowable compression of the sealing ring). =0.5mm); When bending in reverse arc, for double rectangular acupoints, the most dangerous point is located at the midpoint of the long side of each acupoint, i.e., in the y-axis direction; Calculated = According to curvature Calculate the allowable substrate curvature for adsorption. ,get That is, when the substrate is bent in reverse arc, the maximum arch height should not exceed 0.864mm to ensure that the compression of the sealing ring meets the requirements.

[0035] Calculation of the absorbable positive arc radius (with a central depression): When bending in a positive arc, the central region of the substrate is pressed down, and the most dangerous point is the corner of the sealing ring rectangle (farthest from the center). The coordinates of the center of the vacuum cavity on the left are (28, 46). The distance from any corner point (4, 11) to the center is... , Then based on curvature Calculate the allowable substrate curvature for adsorption. ,get That is, when the substrate is bent in a positive arc, the maximum indentation should not exceed 0.587mm to ensure that the compression of the sealing ring meets the requirements.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An ultrasonic welding substrate fixing device, characterized in that, include: Lifting component (1), which is located below the substrate; Adsorption element (2), wherein multiple adsorption elements (2) are provided and located below the substrate; When the adsorption member (2) is in the adsorption state, a negative pressure is generated between the substrate and the adsorption chamber (21), and the lifting member (1) presses against the bottom surface of the substrate; when the adsorption member (2) is in the release state, the negative pressure between the substrate and the adsorption chamber (21) disappears, and the lifting member (1) moves away from the bottom surface of the substrate.

2. The ultrasonic welding substrate fixing device according to claim 1, characterized in that: It also includes clamping members (3) located at both ends of the substrate, and a clamping position for clamping the substrate is formed between the two clamping members (3). A horizontal driving member (31) is fixedly provided at the bottom of the adsorption member (2), and the power output end of the horizontal driving member (31) is fixedly connected to the clamping member (3).

3. The ultrasonic welding substrate fixing device according to claim 2, characterized in that: The bottom of the lifting component (1) is fixed with a vertical drive component (11) and a pressure sensor (12). The vertical drive component (11) is used to adjust the position of the lifting component (1) in the vertical direction, and the pressure sensor (12) is used to detect the position of the lifting component (1) in the vertical direction.

4. The ultrasonic welding substrate fixing device according to claim 3, characterized in that: The adsorption component (2) is provided with an adsorption chamber (21), and an adsorption hole (22) is opened on the bottom surface of the adsorption chamber (21). The end of the adsorption hole (22) away from the adsorption chamber (21) is connected to a vacuum pump, and the substrate covers and adheres to the top of the adsorption chamber (21).

5. The ultrasonic welding substrate fixing device according to claim 4, characterized in that, The adsorption state working process includes: After the substrate falls into the position of the adsorption member (2), the two clamping members (3) clamp the substrate; After the clamping member (3) clamps, the vacuum pump is started, and the substrate is adsorbed on the top of the adsorption chamber (21). At the same time, the clamping member (3) moves away from the substrate. After the clamping member (3) releases the substrate, the lifting member (1) rises and presses against the bottom surface of the substrate until the pressure value monitored by the pressure sensor (12) reaches the preset value. Then the lifting member (1) stops moving, and the vacuum sensor in the adsorption chamber (21) monitors whether the vacuum pressure in the adsorption chamber (21) meets the vacuum threshold. If the conditions are met, the clamping component (3) clamps the substrate again and starts the ultrasonic welding process; otherwise, the adsorption is deemed to have failed and an alarm is triggered.

6. The ultrasonic welding substrate fixing device according to claim 4, characterized in that, The release state working process includes: After ultrasonic welding is completed, the vacuum pump is turned off, the negative pressure in the adsorption chamber (21) disappears, the clamping part (3) moves away from the substrate, the substrate is removed, and the lifting part (1) moves down.

7. The conformity testing method according to claim 1, characterized in that: A sealing ring (4) is provided at the top of the adsorption chamber (21), and the sealing ring (4) is pressed against the bottom surface of the substrate.

8. A conformity testing method, applied to the ultrasonic welding substrate fixing device according to claim 1, characterized in that, include: Calculate the reverse arc and the forward arc that the fixing device can adsorb, respectively; If both the reverse and forward arcs that can be adsorbed meet the adsorption requirements for the substrate, then the fixing device is qualified. Otherwise, the fixing device is unqualified.

9. The conformity testing method according to claim 8, characterized in that, The calculation process for the absorbable reverse arc radius and positive arc radius includes: Based on the bending direction of the substrate, determine the most dangerous point of the adsorption cavity (21) affected by the substrate deformation; By calculating the planar distance between the most dangerous point and the center of substrate bending, the deformation influence range of the most dangerous point when the substrate is bent can be obtained. Calculate the minimum radius of curvature at the most dangerous point based on the maximum allowable compression change; The maximum allowable deformation of the substrate is calculated based on the half span of the substrate and the calculated minimum radius of curvature.

10. The conformity testing method according to claim 9, characterized in that: The maximum compression change is a physical property of the sealing ring (4) of the adsorption chamber (21); The most dangerous point of the reverse arc is located at the edge of the bending direction, and the most dangerous point of the positive arc is located at the point farthest from the center of downward pressure.

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