Punching die setting machine for flexible circuit board

Abstract

The invention discloses a flexible circuit board punching and setting machine. Comprising a machine table, a first lower die assembly, a second lower die assembly, a third lower die assembly, a first upper punching die mechanism located above the first lower die assembly, a turning and pressing die mechanism located on one side of the first lower die assembly and a Z-shaped punching die mechanism located on one side of the second lower die assembly, the third upper punching die mechanism is positioned obliquely above the third lower die assembly; and the shifting mechanism is positioned on one side of the three lower die assemblies. According to the flexible circuit board formed by the stamping die, extension recovery can be avoided, the appearance integrity is ensured, the forming durability is long, the forming effect is good, and the forming efficiency is high; the flexible circuit board shaping machine effectively solves the problems that the flexible circuit board is easy to scratch when the flexible circuit board is shaped by a traditional shaping machine in a flat pushing and bending mode, and the circuit board is often inaccurate in installation and alignment and easy to cause short circuit when the circuit board is applied and installed due to the fact that the shaped flexible circuit board slowly extends and recovers.

Description

Technical Field

[0001] This invention relates to the field of die forming machines, and more particularly to a die forming machine for flexible circuit boards. Background Technology

[0002] In the field of new energy batteries, FDC is a flexible circuit board that uses polyimide (PI) or polyester (PET) film as the substrate and forms circuit lines through a die-cutting process (rather than the etching process of traditional FPC). In the CCS (integrated power busbar) of new energy batteries (especially power batteries and energy storage batteries), FDC acts as a signal acquisition component, responsible for connecting the battery cells, collecting data such as voltage and temperature, and transmitting them to the battery management system (BMS).

[0003] Die-cutting is a non-contact process, reducing material waste and energy consumption, and is more environmentally friendly. Compared to the complex process of FPC, FDC's die-cutting process is simpler and has a shorter processing cycle, reportedly reducing process costs by about 30%. Like FPC, FDC is also lightweight, thin, and flexible, which helps save space in battery packs. In the cost-sensitive field of energy storage batteries, FDC has outstanding application potential. However, in the field of new energy vehicle power batteries, where reliability requirements are extremely high, FPC is still the mainstream, but FDC is rapidly penetrating the market and is regarded as an important cost-reduction alternative to FPC.

[0004] In order to meet the spatial layout requirements, FDC flexible circuit boards are usually bent into various shapes during application. Due to the release of internal stress, thermal effects and material structural characteristics, FDC flexible circuit boards slowly stretch (i.e., deformation recovery) after bending and shaping. FDC flexible circuit boards that have stretched and recovered are prone to misalignment and circuit breakage during application and installation, and may even cause short circuits and fire risks, which is not conducive to the needs of industrial development. How to prevent stretching and recovery of FDC flexible circuit boards after shaping and improve the yield and stability of application products has become the primary problem to be solved. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a flexible circuit board punching and shaping machine.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The flexible circuit board punching and shaping machine includes a machine base, a first lower die assembly, a second lower die assembly, a third lower die assembly, a flipping die mechanism, a first upper punching die mechanism, a second upper punching die mechanism, a Z-shaped punching die mechanism, a third upper punching die mechanism, and a conveying mechanism. A punching die bracket is mounted on the machine base. The first lower die assembly, the second lower die assembly, and the third lower die assembly are sequentially and horizontally mounted on the machine base and are respectively used to support the flexible circuit board. The punching die bracket is located on one side of the first lower die assembly and the second lower die assembly. The first upper punching die mechanism is mounted on the punching die bracket and is located above the first lower die assembly. The first upper punching die mechanism bends one side edge of the flexible circuit board on the first lower die assembly gradually towards its center to form a first right angle and a second right angle. The flipping die mechanism is mounted on the machine base and is located on one side of the first lower die assembly. The flipping die mechanism bends the other side edge of the flexible circuit board fixed on the first lower die assembly upwards. The flexible circuit board on the second lower die assembly is folded into a third right-angled portion. The second upper die mechanism is mounted on the die support and located above the second lower die assembly. The second upper die mechanism bends the other side of the flexible circuit board on the second lower die assembly downwards into a fourth right-angled portion. The Z-shaped die mechanism is mounted on the machine base and located on one side of the second lower die assembly. The Z-shaped die mechanism punches the first and second right-angled portions of the flexible circuit board into a Z-shape. The third upper die mechanism is mounted on the machine base and located diagonally above the third lower die assembly. The third lower die assembly punches and shapes the third and fourth right-angled portions on the other side of the flexible circuit board, and punches the first and second protrusions on the third and fourth right-angled portions of the flexible circuit board respectively. The feeding mechanism is mounted on the machine base and located on one side of the first, second, and third lower die assemblies. The feeding mechanism pushes the flexible circuit board from the first lower die assembly to the second and third lower die assemblies in sequence, and finally pushes it out of the third lower die assembly for material collection.

[0007] Furthermore, the first lower die assembly includes a first lower limit seat, a second lower limit seat, and a first floating lower die head. The first lower limit seat and the second lower limit seat are mounted side by side on the machine base. The first floating lower die head is movably mounted between the first lower limit seat and the second lower limit seat. A first reference plate is mounted on the end of the first floating lower die head away from the second lower die assembly, and a second reference plate is mounted on the side of the second lower limit seat away from the first floating lower die head. A first right-angle groove is provided on the top of the first floating lower die head near the second lower limit seat, and at least two first lower limit grooves are provided on the bottom of the second lower limit seat. The bottom of the first floating lower die head faces the second lower limit seat. A first lower stop arm is provided on one side of the seat and is adapted to be installed in the first lower limit groove; the first lower limit groove guides and limits the lifting and lowering movement of the first floating lower die head by guiding and limiting the lifting and lowering movement of the first lower stop arm; the bottom surface of the first floating lower die head is provided with at least one first lower mounting hole, and a first lower elastic element is installed in the first lower mounting hole. The upper and lower ends of the first lower elastic element abut against the corresponding first lower mounting hole and the machine base to lift the first floating lower die head. A first negative pressure communication hole is provided through the first floating lower die head laterally. At least one first air suction hole is provided on the top of the first floating lower die head, and at least one first air suction hole is connected to the first negative pressure communication hole.

[0008] Furthermore, the first upper die mechanism includes at least two first linear guides, a first upper die drive device, a first upper die platform, a first upper limit seat, a second upper limit seat, and a first floating upper die head. The first upper die drive device is mounted on the die support. The at least two first linear guides are parallel to each other and longitudinally mounted on the die support. The first upper die platform is slidably mounted on the at least two first linear guides. The first upper die platform is located below the first upper die drive device and is fixedly connected to the output end of the first upper die drive device. The first upper die drive device drives the first upper die platform to slide up and down on the at least two first linear guides. The first upper limit seat and the second upper limit seat are respectively mounted side by side on both sides of the bottom of the first upper die platform. The first floating upper die head is movably mounted between the first upper limit seat and the second upper limit seat and is used to press the flexible circuit board. The top of the first upper limit seat... The device is provided with at least two first upper limit slots, and at least two second upper limit slots on the top of the second upper limit seat. At least two first upper stop arms adapted to the first upper limit slots and at least two second upper stop arms adapted to the second upper limit slots are respectively provided on both sides of the top of the first floating upper die head. The first upper limit slots guide and limit the lifting and lowering movement of the first upper stop arms, and the second upper limit slots guide and limit the lifting and lowering movement of the second upper stop arms, thereby realizing the guiding and limiting of the lifting and lowering movement of the first floating upper die head. At least one first upper mounting hole is provided on the top of the first floating upper die head. A first upper elastic element is installed in the first upper mounting hole. The upper and lower ends of the first upper elastic element abut against the bottom surface of the first upper die table and the corresponding first upper mounting hole, respectively. The longitudinal interface of the second upper limit seat is wedge-shaped, and the bottom of the second upper limit seat is provided with a pointed part on one side near the first floating upper die head.

[0009] Furthermore, the flipping mold mechanism includes a gearbox, a flipping plate drive device, a rack, a gear shaft, bearings, a coupling, two flipping seats, and a flipping plate. The two flipping seats are mounted side by side on the machine base, and each flipping seat has a rotating shaft rotatably mounted on its top. The two ends of the flipping plate are respectively fixedly connected to the rotating shafts of the two flipping seats. The gearbox is mounted on the machine base, and the flipping plate drive device is mounted on the gearbox. The rack is fixedly mounted on the output end of the flipping plate drive device. Bearings are respectively sleeved on both ends of the gear shaft. The gear shaft is rotatably mounted in the gearbox through the bearings. The gear shaft and the rack are perpendicular to each other and meshed. The gear shaft is fixedly connected to the nearest rotating shaft through the coupling.

[0010] Furthermore, the feeding mechanism includes a feeding bracket, a first lever drive device, a second lever drive device, a third lever drive device, a mounting frame, and at least one lever. The feeding bracket is mounted on the machine base. The first lever drive device is mounted on the feeding bracket. The second lever drive device is mounted on the output end of the first lever drive device. The first lever drive device drives the second lever drive device to move left and right. The third lever drive device is mounted on the output end of the second lever drive device. The second lever drive device drives the third lever drive device to move back and forth. The mounting frame is mounted on the output end of the third lever drive device. The third lever drive device drives the mounting frame to move up and down. At least one lever is longitudinally mounted at the bottom of the mounting frame and is used to feed the flexible circuit board.

[0011] Furthermore, the second lower die assembly includes a second floating lower die head, a third lower limit seat, and a fourth lower limit seat. The third and fourth lower limit seats are mounted side by side on the machine base. The second floating lower die head is movably mounted between the third and fourth lower limit seats and is used to support the flexible circuit board. A first V-groove is provided on the top side of the second floating lower die head near the fourth lower limit seat. At least two second lower limit grooves are provided on the bottom of the fourth lower limit seat. At least two second lower stop arms are provided on the bottom side of the second floating lower die head facing the fourth lower limit seat, and each second lower stop arm is movable. Installed in the corresponding second lower limit groove, the second lower limit groove guides and limits the lifting and lowering of the second lower stop arm, thereby guiding and limiting the lifting and lowering of the second floating lower die head. The bottom of the second floating lower die head is provided with at least one second lower mounting hole, and a second lower elastic element is installed in the second lower mounting hole. The upper and lower ends of the second lower elastic element abut against the corresponding second lower mounting hole and the machine base, respectively. A second negative pressure communication hole is provided through the second floating lower die head laterally. The top of the second floating lower die head is provided with at least one second air suction hole, and at least one second air suction hole is connected to the second negative pressure communication hole.

[0012] Furthermore, the second upper die mechanism includes a second upper die drive device, at least two second linear guides, a second upper die platform, a third upper limit seat, a fourth upper limit seat, a downward pressure limiting plate, and a second floating upper die head. The second upper die drive device is longitudinally mounted on the die support. The at least two second linear guides are parallel to each other and longitudinally mounted on the die support. The second upper die platform is lifted and slidably mounted on the at least two second linear guides. The second upper die platform is located below the second upper die drive device and is fixedly connected to the output end of the second upper die drive device. The third upper limit seat and the fourth upper limit seat are arranged side by side and mounted on the two sides of the bottom of the second upper die platform. The downward pressure limiting plate is mounted on the bottom surface of the fourth upper limit seat and is used to press against one side of the flexible circuit board. On the side, the bottom of the pressure limiting plate is provided with at least two clearance grooves. The second floating upper die head is movably installed between the third upper limit seat and the fourth upper limit seat and is used to press the flexible circuit board. The top of the fourth upper limit seat is provided with at least two third upper limit grooves. The side of the top of the second floating upper die head facing the fourth upper limit seat is provided with at least two third upper stop arms that are adapted to the third upper limit grooves. The third upper limit grooves guide and limit the lifting and lowering of the third upper stop arms, thereby guiding and limiting the lifting and lowering of the second floating upper die head. The top of the second floating upper die head is provided with at least one second upper mounting hole. A second upper elastic element is installed in the second upper mounting hole. The upper and lower ends of the second upper elastic element abut against the second upper die table and the corresponding second upper mounting hole, respectively.

[0013] Furthermore, the Z-type punching die mechanism includes a Z-type punching die base plate, at least two third linear guide rails, a Z-type punching die slide, a Z-type template, and a Z-type template driving device. The Z-type punching die base plate is mounted on the machine base. The at least two third linear guide rails are parallel to each other and laterally mounted on the Z-type punching die base plate. The Z-type punching die slide is laterally slidably mounted on the at least two third linear guide rails. The Z-type template is mounted on the Z-type punching die slide. The Z-type template driving device is mounted on the Z-type punching die base plate, and the output end of the Z-type template driving device is fixedly connected to the Z-type punching die slide. The Z-type template includes a Z-type die head connecting plate and at least two punching Z-type dies mounted on the Z-type die head connecting plate. The end face of the punching Z-type die facing the second lower die assembly is provided with a second V-shaped groove. The second V-shaped groove and the first V-shaped groove of the second floating lower die head are vertically offset and face each other.

[0014] Furthermore, the third lower die assembly includes a lower die base, a bump die head assembly, a right-angle shaping lower die head, and a bottom die limiting block. The lower die base is mounted on the machine base, and a lower die head mounting groove is provided on one side of the top of the lower die base. The right-angle shaping lower die head is movably mounted in the lower die head mounting groove and is used to support the other side of the flexible circuit board. The bump die head assembly is mounted in the lower die head mounting groove, and the bump die head assembly movably passes through the right-angle shaping lower die head and performs bump punching on the third right-angle portion and the fourth right-angle portion of the flexible circuit board. The bottom die limiting block is mounted on the machine base. The lower die head is installed in a groove and used to limit the right-angle shaping lower die head; the bottom of the right-angle shaping lower die head is provided with a movable groove for accommodating the protruding die head assembly; a retaining strip is provided on one side of the bottom of the right-angle shaping lower die head; a first right-angle protrusion and a second right-angle groove are arranged side by side on the top of the right-angle shaping lower die head; at least two first sliding holes are provided through the bottom of the movable groove and the second right-angle groove; at least two second sliding holes are provided through the tip of the movable groove and the first right-angle protrusion; a third negative pressure connecting hole is provided transversely through the right-angle shaping lower die head. At least one third suction hole is provided on the side of the right-angled protrusion away from the second right-angled groove. The at least one third suction hole is connected to a third negative pressure communication hole. At least two first alignment holes are provided at the bottom of the movable groove and the second right-angled groove. The protrusion mold head assembly includes a protrusion mold head base. At least two first protrusion mold heads and at least two second protrusion mold heads are respectively provided on the top two sides of the protrusion mold head base. The top of the first protrusion mold head is flat. The first protrusion mold head is movably installed in the first sliding hole and is used to align the third right-angled portion. The second punching die has a rounded chamfered top and is movably mounted in the second sliding hole for punching the fourth right-angle part. The top of the punching die base has at least one third lower mounting hole, and a third lower elastic element is installed in the third lower mounting hole. The upper and lower ends of the third lower elastic element abut against the movable groove of the right-angle shaping lower die and the corresponding third lower mounting hole, respectively. The bottom of the bottom die limiting block has a limiting groove on the side near the center of the lower die base that is adapted to the fastener of the right-angle shaping lower die.

[0015] Specifically, the third upper punch mechanism includes an inclined platform, at least two fourth linear guides, a right-angle shaping upper die head, and a right-angle shaping die head drive device. The inclined platform is mounted on the machine base, the right-angle shaping die head drive device is mounted on the top of the inclined platform, the at least two fourth linear guides are parallel to each other and obliquely mounted on the inclined platform, the right-angle shaping upper die head is lifted and slidably mounted on the at least two fourth linear guides, the right-angle shaping upper die head is located obliquely below the right-angle shaping die head drive device and is fixedly connected to the output end of the right-angle shaping die head drive device; the bottom of the right-angle shaping upper die head is provided with a third right-angle groove and a second right-angle protrusion in parallel, the tip of the second right-angle protrusion is provided with at least two first dies adapted to the shape of the first protrusion die head, the third right-angle groove is provided with at least two second dies adapted to the shape of the second protrusion die head, and the tip of the second right-angle protrusion is also provided with at least two second alignment holes opposite to the first alignment holes.

[0016] Furthermore, a controller or control system is provided for signal control of the first upper die mechanism, the second upper die mechanism, the Z-type die mechanism, the third upper die mechanism, and the feeding mechanism, respectively. The controller is a PLC programmable logic controller. The PLC programmable logic controller can be a programmable logic controller of model XDS-40T-D, but is not limited to this.

[0017] Compared with existing technologies, the beneficial effects of this invention are as follows: 1. By designing the positional relationship and structure of the first upper punching die mechanism, the first lower die assembly, and the flipping die mechanism, the first lower die assembly can perform reference positioning on the flexible circuit board placed on it. The first upper punching die mechanism can automatically complete the stamping of the flexible circuit board from one side towards its center to form the first right-angle portion and the second right-angle portion. This has the advantages of good right-angle bending effect, strong right-angle bending durability, and high right-angle bending efficiency, making the flexible circuit board suitable for installation in narrow corner spaces and with good installation adaptability. At the same time, the flipping die mechanism can automatically bend the other side of the flexible circuit board upward to form the third right-angle portion by using a pressing bending method instead of the traditional flat-push bending method of the shaping machine. This avoids the easy scratching of the flexible circuit board by the flat-push bending method, thus protecting the integrity of the appearance of the flexible circuit board and greatly reducing the defect rate of the flexible circuit board.

[0018] 2. By designing the positional relationships and structures of the second upper die mechanism, the second lower die assembly, the Z-shaped die mechanism, and the feeding mechanism, the feeding mechanism can transfer the flexible circuit board from the first lower die assembly to the second lower die assembly, where the second lower die assembly adsorbs and positions the flexible circuit board. The second upper die mechanism automatically completes the right-angle bending and anti-warping fixation of the flexible circuit board. The Z-shaped die mechanism automatically performs Z-shaped stamping and shaping on the first and second right-angle portions of one side of the flexible circuit board to prevent the shaped flexible circuit board from stretching and recovering. This achieves stable stamping and shaping of the flexible circuit board with good shaping effect. It not only avoids the problem of inaccurate installation caused by the stretching and recovery of the shaped flexible circuit board in traditional methods, but also avoids short circuits caused by the stretching and recovery of the flexible circuit board.

[0019] 3. By designing the positional relationship and structure of the third upper die mechanism and the third lower die assembly, the third lower die assembly can fix and position the flexible circuit board that is pushed onto it by the feeding mechanism. The third upper die mechanism automatically punches the first and second protrusions on the third and fourth right-angled parts of the flexible circuit board to strengthen the shaping of the flexible circuit board and prevent the third and fourth right-angled parts of the flexible circuit board from naturally extending and recovering. This ensures that the third and fourth right-angled parts of the flexible circuit board are permanently shaped, thereby guaranteeing the stability of the circuit.

[0020] 4. Its overall structural design has the advantages of high shaping efficiency, good shaping effect, good shaping stability and high shaping yield for flexible circuit boards. The finished products shaped by the stamping die of this invention avoid stretching and recovery, and ensure the integrity of the appearance. It effectively solves the problems of traditional shaping machines using flat push bending to shape flexible circuit boards, which easily scratch the flexible circuit boards and cause them to stretch and recover after shaping, resulting in inaccurate installation and short circuits during application and installation. Attached Figure Description

[0021] For ease of explanation, the present invention will be described in detail below with reference to the preferred embodiments and accompanying drawings.

[0022] Figure 1 This is a perspective view of the flexible circuit board stamping and shaping machine of the present invention.

[0023] Figure 2 The flexible circuit board punching and shaping machine of the present invention Figure 1 3D images from different angles.

[0024] Figure 3 This is a side view of a flexible circuit board after it has been shaped using the flexible circuit board stamping and shaping machine of the present invention.

[0025] Figure 4 This is a perspective view of the first lower die assembly of the flexible circuit board stamping and shaping machine of the present invention.

[0026] Figure 5 The flexible circuit board punching and shaping machine of the present invention Figure 4 3D images from different angles.

[0027] Figure 6 This is a perspective view of the first upper punching die mechanism of the flexible circuit board punching die shaping machine of the present invention.

[0028] Figure 7 This is a perspective view of the components of the flexible circuit board punching and shaping machine of the present invention installed under the bottom surface of the first upper die table in the first upper punching mechanism.

[0029] Figure 8 This is a cross-sectional view of the first upper die table and its components under the bottom surface of the flexible circuit board stamping and shaping machine of the present invention when they are pressed together with the first lower die assembly.

[0030] Figure 9 This is a perspective view of the assembly of the flipping die mechanism and the first lower die assembly of the flexible circuit board punching die shaping machine of the present invention.

[0031] Figure 10 This is a perspective view of the gearbox being removed from the flipping mold mechanism of the flexible circuit board stamping and shaping machine of the present invention.

[0032] Figure 11 This is a perspective view of the feeding mechanism of the flexible circuit board punching and shaping machine of the present invention.

[0033] Figure 12 This is a perspective view of the mounting frame and multiple levers in the feeding mechanism of the flexible circuit board punching die shaping machine of the present invention.

[0034] Figure 13 This is a perspective view of the second lower die assembly of the flexible circuit board stamping and shaping machine of the present invention.

[0035] Figure 14 The flexible circuit board punching and shaping machine of the present invention Figure 13 3D images from different angles.

[0036] Figure 15 This is a side view of the second upper punching die mechanism of the flexible circuit board punching die shaping machine of the present invention.

[0037] Figure 16 This is a perspective view of the components under the bottom surface of the second upper die table in the second upper die mechanism of the flexible circuit board punching and shaping machine of the present invention.

[0038] Figure 17This is a schematic diagram showing the Z-shaped punching die mechanism of the flexible circuit board punching die shaping machine of the present invention and its relationship with the second floating lower die head.

[0039] Figure 18 This is a perspective view of the Z-shaped template in the Z-shaped punching mechanism of the flexible circuit board punching die shaping machine of the present invention.

[0040] Figure 19 This is a perspective view of the pressing state of the third upper die mechanism and the third lower die assembly of the flexible circuit board punching and shaping machine of the present invention.

[0041] Figure 20 This is a perspective view of the third lower die assembly of the flexible circuit board stamping and shaping machine of the present invention.

[0042] Figure 21 This is a side view of the lower die base and bottom die limiting block of the flexible circuit board punching and shaping machine of the present invention.

[0043] Figure 22 This is a perspective view of the right-angle shaping lower die head of the flexible circuit board punching and shaping machine of the present invention.

[0044] Figure 23 This is a perspective view of the protrusion die head assembly of the flexible circuit board punching and shaping machine of the present invention.

[0045] Figure 24 This is a perspective view of the third upper punching die mechanism of the flexible circuit board punching die shaping machine of the present invention.

[0046] Figure 25 This is a perspective view of the right-angle upper die head of the flexible circuit board punching and shaping machine of the present invention. Detailed Implementation

[0047] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0049] Reference Figures 1 to 3As shown, the flexible circuit board stamping and shaping machine of the present invention includes a machine base 1, a first lower die assembly 2, a second lower die assembly 3, a third lower die assembly 4, a flipping die mechanism 5, a first upper die mechanism 6, a second upper die mechanism 7, a Z-shaped die mechanism 8, a third upper die mechanism 9, and a conveying mechanism 10. A die support 11 is mounted on the machine base 1. The first lower die assembly 2, the second lower die assembly 3, and the third lower die assembly 4 are sequentially and horizontally mounted on the machine base 1 and are respectively used to support flexible circuit boards. The die support 11 is located between the first lower die assembly 2 and... On one side of the second lower die assembly 3, the first upper die mechanism 6 is mounted on the die support 11 and located above the first lower die assembly 2. The first upper die mechanism 6 bends one edge of the flexible circuit board on the first lower die assembly 2 gradually towards its center to form a first right angle 12 and a second right angle 13. The flipping die mechanism 5 is mounted on the machine base 1 and located on one side of the first lower die assembly 2. The flipping die mechanism 5 flips the other edge of the flexible circuit board fixed on the first lower die assembly 2 upward to form a third right angle 14. The second upper die mechanism 7 is mounted on the die support 11 and located above the second lower die assembly 3. The second upper die mechanism 7 bends the other side of the flexible circuit board on the second lower die assembly 3 downward to form a fourth right angle portion 15. The Z-shaped die mechanism 8 is mounted on the machine base 1 and located on one side of the second lower die assembly 3. The Z-shaped die mechanism 8 punches the first right angle portion 12 and the second right angle portion 13 of the flexible circuit board into a Z shape. The third upper die mechanism 9 is mounted on the machine base 1 and located diagonally above the third lower die assembly 4. The third lower die assembly 4... The third right-angle portion 14 and the fourth right-angle portion 15 on the other side of the flexible circuit board are stamped and shaped, and the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board are respectively punched with the first protrusion 16 and the second protrusion 17. The feeding mechanism 10 is installed on the machine base 1 and is located on one side of the first lower mold assembly 2, the second lower mold assembly 3 and the third lower mold assembly 4. The feeding mechanism 10 pushes the flexible circuit board from the first lower mold assembly 2 to the second lower mold assembly 3 and the third lower mold assembly 4 in sequence, and finally pushes it out of the third lower mold assembly 4 for unloading and collection.

[0050] Reference Figure 4 and Figure 5As shown, the first lower die assembly 2 includes a first lower limit seat 21, a second lower limit seat 22, and a first floating lower die head 23. The first lower limit seat 21 and the second lower limit seat 22 are mounted side by side on the machine base 1. The first floating lower die head 23 is movably mounted between the first lower limit seat 21 and the second lower limit seat 22. A first reference plate 24 is mounted on the end of the first floating lower die head 23 away from the second lower die assembly 3, and a second reference plate 25 is mounted on the side of the second lower limit seat 22 away from the first floating lower die head 23. A first right-angle groove 26 is provided on the top of the first floating lower die head 23 near the second lower limit seat 22, and at least two first lower limit grooves 27 are provided on the bottom of the second lower limit seat 22. The bottom of the first floating lower die head 23 faces the second lower limit seat 22. A first lower stop arm 28 is provided on one side of 2 to be adapted to the first lower limit groove 27; the first lower limit groove 27 guides and limits the first floating lower die head 23 by guiding and limiting the first lower stop arm 28 to move up and down; the bottom surface of the first floating lower die head 23 is provided with at least one first lower mounting hole 29, and a first lower elastic element 20 is installed in the first lower mounting hole 29. The upper and lower ends of the first lower elastic element 20 abut against the corresponding first lower mounting hole 29 and the machine base 1 to lift the first floating lower die head 23. A first negative pressure communication hole 201 is provided through the first floating lower die head 23 laterally. At least one first suction hole 202 is provided on the top of the first floating lower die head 23, and at least one first suction hole 202 is connected to the first negative pressure communication hole 201.

[0051] By adopting the above technical solution, when the flexible circuit board is placed on the first floating lower mold head 23 and positioned horizontally with the first reference plate 24 and the second reference plate 25 as references, since the first negative pressure connecting hole 201 is connected to a vacuum system, the first suction hole 202 on the first floating lower mold head 23 clamps the flexible circuit board with negative pressure, thus realizing the stable positioning of the flexible circuit board on the first floating lower mold head 23.

[0052] In this embodiment, the first lower elastic element 20 is preferably a spring.

[0053] Reference Figures 6 to 8As shown, the first upper die mechanism 6 includes at least two first linear guide rails 61, a first upper die drive device 62, a first upper die platform 63, a first upper limit seat 64, a second upper limit seat 65, and a first floating upper die head 66. The first upper die drive device 62 is mounted on the die support 11. The at least two first linear guide rails 61 are parallel to each other and longitudinally mounted on the die support 11. The first upper die platform 63 is slidably mounted on the at least two first linear guide rails 61. The first upper die platform 63 is located below the first upper die drive device 62 and is fixedly connected to the output end of the first upper die drive device 62. The first upper die drive device 62 drives the first upper die platform 63 to slide up and down on the at least two first linear guide rails 61. The first upper limit seat 64 and the second upper limit seat 65 are respectively mounted side by side on both sides of the bottom of the first upper die platform 63. The first floating upper die head 66 is movably mounted between the first upper limit seat 64 and the second upper limit seat 65 and is used to press the flexible circuit board. The top of the first upper limit seat 64 is provided with At least two first upper limit grooves 67 are provided, and at least two second upper limit grooves 68 are provided on the top of the second upper limit seat 65. At least two first upper stop arms 69 adapted to the first upper limit grooves 67 and at least two second upper stop arms 60 adapted to the second upper limit grooves 68 are respectively provided on both sides of the top of the first floating upper die head 66. The first upper limit grooves 67 guide and limit the lifting and lowering movement of the first upper stop arms 69, and the second upper limit grooves 68 guide and limit the lifting and lowering movement of the second upper stop arms 60, thus realizing the... The first floating upper die head 66 moves up and down to guide and limit movement. The top of the first floating upper die head 66 is provided with at least one first upper mounting hole 601. The first upper mounting hole 601 is provided with a first upper elastic member 602. The upper and lower ends of the first upper elastic member 602 abut against the bottom surface of the first upper die table 63 and the corresponding first upper mounting hole 601, respectively. The longitudinal interface of the second upper limit seat 65 is wedge-shaped. The bottom of the second upper limit seat 65 is provided with a pointed part 603 on one side near the first floating upper die head 66.

[0054] By adopting the above technical solution, when the first upper mold driving device 62 drives the first upper mold platform 63 to move downward, the first upper mold platform 63 drives the first upper limit seat 64, the second upper limit seat 65, and the first floating upper mold head 66 to move downward. The first floating upper mold head 66 first contacts the flexible circuit board on the first floating lower mold head 23, and the first floating upper mold head 66 presses the flexible circuit board onto the first floating lower mold head 23. The first lower elastic member 20 and the first upper elastic member 602 are pressed to buffer the downward movement of the first floating lower mold head 23 and the first floating upper mold head 66, respectively. During the process of the first floating upper mold head 66 pressing the flexible circuit board, the first upper limit seat 64 and the second upper limit seat 65 continue to move downward together. The tip 603 at the lower end of the second upper limit seat 65 pushes one side of the flexible circuit board downward and presses the flexible circuit board down. On the bottom surface of the first right-angle groove 26, during the downward bending of the flexible circuit board, the edge of the same side of the flexible circuit board is blocked by the first right-angle groove 26 of the first floating lower die head 23. When the second upper limit seat 65 presses one side of the flexible circuit board on the first right-angle groove 26, the first right-angle portion 12 and the second right-angle portion 13 are punched sequentially on one side of the flexible circuit board towards the center. This achieves automated completion of the first right-angle portion 12 and the second right-angle portion 13 being punched sequentially on one side of the flexible circuit board towards its center. Since the second upper limit seat 65 is wedge-shaped, the tip 603 at the lower end of the second upper limit seat 65 is used to bend the flexible circuit board at the first right angle. The range of the first right angle arc is small, which makes the bending effect of the flexible circuit board good and the bending efficiency high. It can also be installed in narrow corner spaces, and has good installation adaptability.

[0055] In this embodiment, the first upper mold driving device 62 is preferably a cylinder. The first upper elastic element 602 is preferably a spring.

[0056] Reference Figures 8 to 10 As shown, the flipping mold mechanism 5 includes a gearbox 50, a flipping plate drive device 51, a rack 52, a gear shaft 53, a bearing 54, a coupling 55, two flipping seats 56, and a flipping plate 57. The two flipping seats 56 are mounted side by side on the machine base 1. Each flipping seat 56 has a rotating shaft 58 rotatably mounted on its top. The two ends of the flipping plate 57 are fixedly connected to the rotating shafts 58 of the two flipping seats 56, respectively. The gearbox 50 is mounted on the machine base 1, and the flipping plate drive device 51 is mounted on the gearbox 50. The rack 52 is fixedly mounted on the output end of the flipping plate drive device 51. Bearings 54 are respectively sleeved on both ends of the gear shaft 53. The gear shaft 53 is rotatably mounted in the gearbox 50 through the bearings 54. The gear shaft 53 and the rack 52 are perpendicular to each other and meshed. The gear shaft 53 is fixedly connected to the nearest rotating shaft 58 through the coupling 55.

[0057] By adopting the above technical solution, the output end of the flipping plate drive device 51 drives the rack 52 to extend and retract within the gearbox 50. The rack 52 drives the gear shaft 53 to reciprocate within the gearbox 50. The gear shaft 53 drives the rotating shaft 58 to reciprocate through the coupling 55, thereby driving the flipping plate 57 to flip upwards or downwards. When the flexible circuit board is placed on the first floating lower die head 23, the other side of the flexible circuit board is flatly placed on the plane of the flipping plate 57. When the first floating upper die head 66 descends and presses the flexible circuit board, the flipping plate drive device 51 drives the flipping plate 57 to flip upwards or downwards. The rotating plate 57 flips upward, and during the upward flipping process, the other side of the flexible circuit board is pressed against the side of the first floating upper mold head 66, thereby bending the other side of the flexible circuit board upward to form the third right angle part 14. This achieves automated upward bending of the other side of the flexible circuit board. The flipping mold mechanism uses a pressing bending method instead of the traditional flat pushing bending method, which avoids scratching the flexible circuit board by the flat pushing fixture. It protects the appearance integrity of parts with strict requirements for appearance integrity, and effectively reduces the defect rate of the flexible circuit board.

[0058] In this embodiment, the flip plate driving device 51 is preferably a cylinder.

[0059] Reference Figure 11 and Figure 12 As shown, the feeding mechanism 10 includes a feeding bracket 100, a first lever drive device 101, a second lever drive device 102, a third lever drive device 103, a mounting frame 104, and at least one lever 105. The feeding bracket 100 is mounted on the machine base 1. The first lever drive device 101 is mounted on the feeding bracket 100. The second lever drive device 102 is mounted on the output end of the first lever drive device 101. The first lever drive device 101 drives the second lever drive device 102 to move left and right. The third lever drive device 103 is mounted on the output end of the second lever drive device 102. The second lever drive device 102 drives the third lever drive device 103 to move back and forth. The mounting frame 104 is mounted on the output end of the third lever drive device 103. The third lever drive device 103 drives the mounting frame 104 to move up and down. At least one lever 105 is longitudinally mounted on the bottom of the mounting frame 104 and is used to feed the flexible circuit board.

[0060] By adopting the above technical solution, the first lever drive device 101, the second lever drive device 102, and the third lever drive device 103 cooperate to drive the mounting frame 104 and the lever 105 on it to move. When the second lever drive device 102 drives the lever 105 to move above the flexible circuit board, the third lever drive device 103 drives the lever 105 to lower into the flexible circuit board. Then, the first lever drive device 101 drives the lever 105 to move laterally to move the flexible circuit board to the next adjacent workstation, realizing fully automatic and efficient moving of the flexible circuit board. The lever 105 is made of soft rubber, which avoids scratching the surface of the flexible circuit board, the first lower mold assembly 2, the second lower mold assembly 3, and the third lower mold assembly 4, protecting the integrity of the appearance of the flexible circuit board and ensuring a high yield rate of the flexible circuit board.

[0061] In this embodiment, the first lever driving device 101 is preferably a rodless cylinder, and the second lever driving device 102 and the third lever driving device 103 are both preferably slide cylinders.

[0062] Reference Figure 13 and Figure 14 As shown, the second lower mold assembly 3 includes a second floating lower mold head 31, a third lower limit seat 32, and a fourth lower limit seat 33. The third lower limit seat 32 and the fourth lower limit seat 33 are mounted side by side on the machine base 1. The second floating lower mold head 31 is movably mounted between the third lower limit seat 32 and the fourth lower limit seat 33 and is used to support the flexible circuit board. The top of the second floating lower mold head 31 is provided with a first V-groove 34 on the side near the fourth lower limit seat 33. The bottom of the fourth lower limit seat 33 is provided with at least two second lower limit grooves 35. The bottom of the second floating lower mold head 31 facing the fourth lower limit seat 33 is provided with at least two second lower stop arms 36. Each second lower stop arm 36 is movably mounted. The actuator is installed in the corresponding second lower limit groove 35. The second lower limit groove 35 guides and limits the second lower stop arm 36 by raising and lowering it, thereby guiding and limiting the second floating lower die head 31. The bottom of the second floating lower die head 31 is provided with at least one second lower mounting hole 37. The second lower mounting hole 37 is provided with a second lower elastic member 38. The upper and lower ends of the second lower elastic member 38 abut against the corresponding second lower mounting hole 37 and the machine base 1, respectively. The second floating lower die head 31 is provided with a second negative pressure communication hole 39 that runs horizontally through it. The top of the second floating lower die head 31 is provided with at least one second suction hole 30. The at least one second suction hole 30 communicates with the second negative pressure communication hole 39.

[0063] By adopting the above technical solution, when the conveying mechanism 10 conveys the flexible circuit board from the previous station to the second floating lower die head 31, since the second negative pressure connecting hole 39 is connected to the first negative pressure connecting hole 201 and is connected to an external vacuum system, the second suction hole 30 can hold the flexible circuit board tightly through negative pressure, so that the flexible circuit board is stably adsorbed on the second floating lower die head 31, thus realizing the positioning of the flexible circuit board on the second floating lower die head 31.

[0064] Reference Figure 15 and Figure 16 As shown, the second upper die mechanism 7 includes a second upper die drive device 71, at least two second linear guide rails 72, a second upper die platform 73, a third upper limit seat 74, a fourth upper limit seat 75, a downward pressure limiting plate 76, and a second floating upper die head 77. The second upper die drive device 71 is longitudinally mounted on the die support 11. The at least two second linear guide rails 72 are parallel to each other and longitudinally mounted on the die support 11. The second upper die platform 73 is slidably mounted on the at least two second linear guide rails 72. The second upper die platform 73 is located below the second upper die drive device 71 and is fixedly connected to the output end of the second upper die drive device 71. The third upper limit seat 74 and the fourth upper limit seat 75 are arranged side by side and mounted on the two sides of the bottom of the second upper die platform 73. The downward pressure limiting plate 76 is mounted on the bottom surface of the fourth upper limit seat 75 and is used to press one side of the flexible circuit board. The bottom of the pressure limiting plate 76 is provided with at least two clearance grooves 78. The second floating upper mold head 77 is movably installed between the third upper limit seat 74 and the fourth upper limit seat 75 and is used to press the flexible circuit board. The top of the fourth upper limit seat 75 is provided with at least two third upper limit grooves 79. The top of the second floating upper mold head 77 facing the fourth upper limit seat 75 is provided with at least two third upper stop arms 70 that are adapted to the third upper limit grooves 79. The third upper limit grooves 79 guide and limit the lifting and lowering of the third upper stop arms 70, thereby guiding and limiting the lifting and lowering of the second floating upper mold head 77. The top of the second floating upper mold head 77 is provided with at least one second upper mounting hole 701. The second upper mounting hole 701 is provided with a second upper elastic member 702. The upper and lower ends of the second upper elastic member 702 abut against the second upper mold table 73 and the corresponding second upper mounting hole 701, respectively.

[0065] By adopting the above technical solution, when the second upper mold drive device 71 drives the second upper mold platform 73 to slide downward on at least two second linear guide rails 72, the second upper mold platform 73 drives the third upper limit seat 74, the fourth upper limit seat 75, the lower pressure limit plate 76, and the second floating upper mold head 77 to move downward. The second floating upper mold head 77 first contacts the flexible circuit board on the second floating lower mold head 31 and presses the flexible circuit board onto the second floating lower mold head 31. The second upper elastic member 702 and the second lower elastic member 38 are pressed to buffer the second floating upper mold head 77 and the second floating lower mold head 31 respectively. The third upper limit seat 74 presses and pushes the other side of the flexible circuit board to bend downward to form the fourth right angle part 15. At the same time, the fourth upper limit seat 75 presses one side of the flexible circuit board to prevent it from tilting up, thus realizing the automatic completion of bending the flexible circuit board to a right angle and fixing it to prevent tilting. It has the advantages of high bending efficiency and good bending effect.

[0066] In this embodiment, the second upper mold driving device 71 is preferably a cylinder, and the second upper elastic element 702 is preferably a spring.

[0067] Reference Figure 17 As shown, the Z-type punching die mechanism 8 includes a Z-type punching die base plate 81, at least two third linear guide rails 82, a Z-type punching die slide 83, a Z-type template 84, and a Z-type template driving device 85. The Z-type punching die base plate 81 is mounted on the machine base 1. The at least two third linear guide rails 82 are parallel to each other and horizontally mounted on the Z-type punching die base plate 81. The Z-type punching die slide 83 is horizontally slidably mounted on the at least two third linear guide rails 82. The Z-type template 84 is mounted on the Z-type punching die slide 83. The Z-type template driving device 85 is mounted on the Z-type punching die base plate 81, and the output end of the Z-type template driving device 85 is fixedly connected to the Z-type punching die slide 83.

[0068] Reference Figure 18 As shown, the Z-shaped template 84 includes a Z-shaped die head connecting plate 86 and at least two punching Z-shaped dies 87 mounted on the Z-shaped die head connecting plate 86. The punching Z-shaped die head 87 has a second V-shaped groove 88 on its end face facing the second lower die assembly 3. The second V-shaped groove 88 and the first V-shaped groove 34 of the second floating lower die head 31 are vertically offset and face each other.

[0069] By adopting the above technical solution, when the Z-type template driving device 85 drives the Z-type punching slide 83 to move towards the second floating lower die head 31 on at least two third linear guide rails 82, the Z-type punching slide 83 drives the punching Z-type die head 87 of the Z-type template 84 to insert into the clearance groove 78 of the lower pressure limiting plate 76 and punch the flexible circuit board portion corresponding to the first V-shaped groove 34 of the second floating lower die head 31. The first V-shaped groove 34 of the second floating lower die head 31 and the second V-shaped groove 88 of the punching Z-type die head 87 are misaligned and engaged, thereby performing Z-type punching and shaping on the first right-angle portion 12 and the second right-angle portion 13 on one side of the flexible circuit board. After the flexible circuit board is Z-shaped punched and shaped, it can avoid stretching and recovery. It has the advantages of stable punching and shaping and good shaping effect, which greatly improves the stability rate and yield of flexible circuit board punching and shaping, and solves the problem of short circuit caused by stretching and recovery of flexible circuit board.

[0070] In this embodiment, the Z-type template driving device 85 is preferably a cylinder.

[0071] Reference Figures 19 to 21 As shown, the third lower mold assembly 4 includes a lower mold base 41, a protrusion mold head assembly 42, a right-angle shaping lower mold head 43, and a bottom mold limiting block 44. The lower mold base 41 is mounted on the machine base 1. A lower mold head mounting groove 45 is provided on one side of the top of the lower mold base 41. The right-angle shaping lower mold head 43 is movably mounted in the lower mold head mounting groove 45 and is used to support the other side of the flexible circuit board. The protrusion mold head assembly 42 is mounted in the lower mold head mounting groove 45. The protrusion mold head assembly 42 movably passes through the right-angle shaping lower mold head 43 and performs protrusion punching on the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board. The bottom mold limiting block 44 is mounted in the lower mold head mounting groove 45 and is used to limit the right-angle shaping lower mold head 43.

[0072] Reference Figure 22 As shown, the bottom of the right-angle shaping lower mold head 43 is provided with a movable groove 431 for accommodating the protrusion mold head assembly 42. A fastening strip 432 is provided on one side of the bottom of the right-angle shaping lower mold head 43. The top of the right-angle shaping lower mold head 43 is provided with a first right-angle protrusion 433 and a second right-angle groove 434 side by side. At least two first sliding holes 435 are provided through the bottom of the movable groove 431 and the second right-angle groove 434. At least two second sliding holes 436 are provided through the tip of the movable groove 431 and the first right-angle protrusion 433. A third negative pressure connecting hole 437 is provided through the right-angle shaping lower mold head 43 laterally. At least one third air suction hole 438 is provided on the side of the first right-angle protrusion 433 away from the second right-angle groove 434. At least one third air suction hole 438 is connected to the third negative pressure connecting hole 437. At least two first alignment holes 439 are provided through the bottom of the movable groove 431 and the second right-angle groove 434.

[0073] ReferenceFigure 23 As shown, the convex dot die assembly 42 includes a convex dot die base 420. At least two first convex dot dies 421 and at least two second convex dot dies 422 are respectively provided on the top two sides of the convex dot die base 420. The top of the first convex dot die 421 is flat and is movably installed in the first sliding hole 435 for punching convex dots on the third right-angle portion 14. The top of the second convex dot die 422 is chamfered in an arc shape and is movably installed in the second sliding hole 436 for punching convex dots on the fourth right-angle portion 15. The top of the convex dot die base 420 is provided with at least one third lower mounting hole 423. A third lower elastic member 424 is installed in the third lower mounting hole 423. The upper and lower ends of the third lower elastic member 424 abut against the movable groove 431 of the right-angle shaping lower die 43 and the corresponding third lower mounting hole 423, respectively.

[0074] Reference Figure 21 As shown, the bottom of the bottom mold limiting block 44 is provided with a limiting groove 425 on one side near the center of the lower mold base 41, which is adapted to the fastener 432 of the right-angle shaping lower mold head 43.

[0075] Reference Figure 24 As shown, the third upper punch mechanism 9 includes an inclined platform 91, at least two fourth linear guide rails 92, a right-angle shaping upper die head 93, and a right-angle shaping die head driving device 94. The inclined platform 91 is mounted on the machine base 1, and the right-angle shaping die head driving device 94 is mounted on the top of the inclined platform 91. The at least two fourth linear guide rails 92 are parallel to each other and obliquely mounted on the inclined platform 91. The right-angle shaping upper die head 93 is slidably mounted on the at least two fourth linear guide rails 92. The right-angle shaping upper die head 93 is located obliquely below the right-angle shaping die head driving device 94 and is fixedly connected to the output end of the right-angle shaping die head driving device 94.

[0076] Reference Figure 25 As shown, the bottom of the right-angle shaping upper mold head 93 is provided with a third right-angle groove 931 and a second right-angle protrusion 932 arranged side by side. The tip of the second right-angle protrusion 932 is provided with at least two first concave molds 933 that are adapted to the shape of the first protrusion mold head 421. The third right-angle groove 931 is provided with at least two second concave molds 934 that are adapted to the shape of the second protrusion mold head 422. The tip of the second right-angle protrusion 932 is also provided with at least two second alignment holes 935 that are opposite to the first alignment hole 439.

[0077] By adopting the above technical solution, since the third negative pressure connecting hole 437 is connected to the second negative pressure connecting hole 39, when the feeding mechanism 10 feeds the flexible circuit board onto the right-angle shaping lower die head 43, the third suction hole 438 uses negative pressure to firmly hold the flexible circuit board onto the right-angle shaping lower die head 43. The third right-angle portion 14 and the fourth right-angle portion 15 on the other side of the flexible circuit board are respectively placed on the second right-angle groove 434 and the first right-angle protrusion 433. The third lower elastic member 424 in the third lower mounting hole 423 pushes the flexible circuit board with its elasticity. The right-angle shaping lower die head 43 is positioned so that the bottom die limiting block 44 limits the right-angle shaping lower die head 43 by interlocking the limiting groove 425 of the bottom die limiting block 44 with the fastening strip 432 of the right-angle shaping lower die head 43, thus preventing the right-angle shaping lower die head 43 from disengaging from the lower die base 41. When the right-angle shaping upper die head 93 is driven by the right-angle shaping die head driving device 94 to move obliquely downward and press against the other side of the flexible circuit board on the right-angle shaping lower die head 43, the second right-angle protrusion 932 presses against the third right-angle portion 14 of the flexible circuit board. On the second right-angle groove 434 of the right-angle shaping lower die head 43, the third right-angle groove 931 presses the fourth right-angle portion 15 of the flexible circuit board onto the first right-angle protrusion 433 of the right-angle shaping lower die head 43. As the right-angle shaping upper die head 93 continues to descend and press against the right-angle shaping lower die head 43, the first protrusion die head 421 and the second protrusion die head 422 pass through the first sliding hole 435 and the second sliding hole 436 respectively, and punch the first protrusion 16 and the second protrusion 17 onto the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board respectively. The shape of the first protrusion 16 matches the concave shape of the first concave mold 933, and the shape of the second protrusion 17 matches the concave shape of the second concave mold 934. The first concave point reinforces the third right-angle portion 14 of the flexible circuit board, and the second concave point reinforces the fourth right-angle portion 15 of the flexible circuit board. This prevents the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board from naturally extending and recovering, ensuring that the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board are permanently fixed, thereby ensuring the stability of the circuit. During installation, the lower right-angle mold head 43 and the upper right-angle mold head 93 can quickly connect the first protrusion mold head 421 with the first concave mold 933 and the second protrusion mold head 422 with the second concave mold 934 by inserting pins into the first alignment hole 439 and the second alignment hole 935. This gives them the advantages of high installation efficiency, good installation effect, and simple installation.

[0078] In this embodiment, the third lower elastic element 424 is preferably a spring. The right-angle shaping die head drive device 94 is preferably a cylinder.

[0079] This invention also provides a forming process for a flexible circuit board stamping die forming machine: First, the flexible circuit board is placed on the first lower die assembly 2 for reference positioning. The first upper die mechanism 6 gradually bends one side edge of the flexible circuit board on the first lower die assembly 2 towards its center to form a first right angle 12 and a second right angle 13. The flipping die mechanism 5 uses a pressing bending method instead of the traditional flat pushing bending method to flip the other side edge of the flexible circuit board upward to form a third right angle 14, avoiding scratching the flexible circuit board by the flat pushing fixture. This protects the appearance integrity of the flexible circuit board and ensures a high yield rate. Then, the conveying mechanism 10 conveys the flexible circuit board from the first lower die assembly 2 to the second lower die assembly 3. After positioning the flexible circuit board, the second upper die mechanism 7 bends the other side of the flexible circuit board on the second lower die assembly 3 downward to form a fourth right angle portion 15, and presses one side of the flexible circuit board with the fourth upper limit seat 75 to prevent it from warping. When the Z-shaped die mechanism 8 descends, it can punch the first right angle portion 12 and the second right angle portion 13 of the flexible circuit board into a Z shape, so that one side of the flexible circuit board is prevented from stretching and recovering after being shaped by the Z-shaped punching. Then, the feeding mechanism 10 feeds the flexible circuit board from the second lower die assembly 3 to the third lower die assembly 4. The third lower die assembly 4 first adsorbs and positions the flexible circuit board on it. Then, the third upper die mechanism 9 presses the third right angle portion 14 on the other side of the flexible circuit board. The fourth right-angle portion 15 is stamped and shaped, and the first protrusion 16 and the second protrusion 17 are punched out on the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board, respectively, to achieve shaping and reinforcement of the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board, preventing the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board from naturally extending and recovering. Finally, the feeding mechanism 10 feeds out the flexible circuit board after reinforcement and shaping, which realizes the automated completion of the reference limit and positioning of the flexible circuit board at each station on one machine, bending one side of the flexible circuit board to form the first right-angle portion 12 and the second right-angle portion 13, folding the other side of the flexible circuit board upward to form the third right-angle portion 14, and folding the other side of the flexible circuit board downward. The process involves a series of operations, including bending the fourth right-angle portion 15 to prevent one side of the flexible circuit board from warping, stamping the first right-angle portion 12 and the second right-angle portion 13 of the flexible circuit board into a Z-shape, stamping and shaping the third right-angle portion 14 and the fourth right-angle portion 15 on the other side of the flexible circuit board, stamping the first protrusion 16 and the second protrusion 17 on the third right-angle portion 14 and the fourth right-angle portion 15 of the flexible circuit board respectively, and transferring the flexible circuit board between adjacent workstations. The flexible circuit board formed using the structure and shaping process of this invention has advantages such as good shaping stability, long shaping durability, good shaping effect, high shaping efficiency, and high finished product yield. The shaped flexible circuit board avoids stretching and recovery, and ensures the integrity of the flexible circuit board's appearance.It effectively solves the problems of traditional shaping machines, which use a flat-push bending method to shape flexible circuit boards, easily scratching the boards and causing them to stretch and recover after shaping, leading to frequent misalignment and short circuits during application and installation.

[0080] The above embodiments are merely examples of the present invention and are not intended to limit the implementation and scope of the present invention. All technical solutions that are the same as or equivalent to the contents described in the claims of the present invention should be included within the protection scope of the present invention.

Claims

1. A flexible circuit board punching and shaping machine, comprising a machine base, wherein a punching die support is mounted on the machine base, characterized in that: It also includes a first lower die assembly, a second lower die assembly, a third lower die assembly, a flipping die mechanism, a first upper punching die mechanism, a second upper punching die mechanism, a Z-shaped punching die mechanism, a third upper punching die mechanism, and a feeding mechanism. The first lower die assembly, the second lower die assembly, and the third lower die assembly are sequentially and horizontally mounted on the machine base and are used to support the flexible circuit board respectively. The punching die bracket is located on one side of the first lower die assembly and the second lower die assembly. The first upper punching die mechanism is mounted on the punching die bracket and located above the first lower die assembly. The first upper punching die mechanism bends one side edge of the flexible circuit board on the first lower die assembly into a first right-angled part and a second right-angled part in sequence, gradually approaching its center direction. The flipping die mechanism is mounted on the machine base and located on one side of the first lower die assembly. The flipping die mechanism flips the other side of the flexible circuit board fixed on the first lower die assembly upward to form a third right angle. The second upper die mechanism is mounted on the die support and located above the second lower die assembly. The second upper die mechanism bends the other side of the flexible circuit board on the second lower die assembly downward to form a fourth right angle. The Z-shaped punching mechanism is mounted on the machine base and located on one side of the second lower die assembly. The Z-shaped punching mechanism punches the first right-angle portion and the second right-angle portion of the flexible circuit board into a Z shape. The third upper die mechanism is mounted on the machine base and located diagonally above the third lower die assembly. The third lower die assembly punches and shapes the third right-angle portion and the fourth right-angle portion on the other side of the flexible circuit board, and punches the first protrusion and the second protrusion on the third right-angle portion and the fourth right-angle portion of the flexible circuit board respectively. The feeding mechanism is installed on the machine platform and located on one side of the first lower mold assembly, the second lower mold assembly, and the third lower mold assembly. The feeding mechanism pushes the flexible circuit board from the first lower mold assembly to the second lower mold assembly and the third lower mold assembly in sequence, and finally pushes it out of the third lower mold assembly for material collection.

2. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The first lower die assembly includes a first lower limit seat, a second lower limit seat, and a first floating lower die head. The first lower limit seat and the second lower limit seat are mounted side by side on the machine base. The first floating lower die head is movably mounted between the first lower limit seat and the second lower limit seat. A first reference plate is mounted on the end of the first floating lower die head away from the second lower die assembly, and a second reference plate is mounted on the side of the second lower limit seat away from the first floating lower die head. The first floating lower die head has a first right-angle groove on the side of the top of the first floating lower die head near the second lower limit seat, and the bottom of the second lower limit seat has at least two first lower limit grooves. The bottom of the first floating lower die head has a first lower stop arm that is adapted to be installed in the first lower limit groove on the side of the bottom of the first floating lower die head facing the second lower limit seat. The first lower limit groove guides and limits the lifting and lowering movement of the first floating lower die head by guiding and limiting the lifting and lowering movement of the first lower stop arm; The bottom surface of the first floating lower die head is provided with at least one first lower mounting hole, and a first lower elastic element is installed in the first lower mounting hole. The upper and lower ends of the first lower elastic element abut against the corresponding first lower mounting hole and the machine base to lift the first floating lower die head. A first negative pressure communication hole is provided through the first floating lower die head laterally. The top of the first floating lower die head is provided with at least one first suction hole, and the at least one first suction hole is connected to the first negative pressure communication hole.

3. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The first upper die mechanism includes at least two first linear guides, a first upper die drive device, a first upper die platform, a first upper limit seat, a second upper limit seat, and a first floating upper die head. The first upper die drive device is mounted on the die support. The at least two first linear guides are parallel to each other and longitudinally mounted on the die support. The first upper die platform is slidably mounted on the at least two first linear guides. The first upper die platform is located below the first upper die drive device and is fixedly connected to the output end of the first upper die drive device. The first upper die drive device drives the first upper die platform to slide up and down on the at least two first linear guides. The first upper limit seat and the second upper limit seat are respectively mounted side by side on both sides of the bottom of the first upper die platform. The first floating upper die head is movably mounted between the first upper limit seat and the second upper limit seat and is used to press the flexible circuit board. The top of the first upper limit seat is provided with at least two first upper limit slots, and the top of the second upper limit seat is provided with at least two second upper limit slots. The top sides of the first floating upper die head are respectively provided with at least two first upper stop arms adapted to the first upper limit slots and at least two second upper stop arms adapted to the second upper limit slots. The first upper limit slots guide and limit the lifting and lowering movement of the first upper stop arms, and the second upper limit slots guide and limit the lifting and lowering movement of the second upper stop arms, thereby realizing the guiding and limiting of the lifting and lowering movement of the first floating upper die head. The top of the first floating upper die head is provided with at least one first upper mounting hole, and a first upper elastic element is installed in the first upper mounting hole. The upper and lower ends of the first upper elastic element abut against the bottom surface of the first upper die table and the corresponding first upper mounting hole, respectively. The longitudinal interface of the second upper limit seat is wedge-shaped, and the bottom of the second upper limit seat is provided with a pointed part on one side near the first floating upper die head.

4. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The flipping mold mechanism includes a gearbox, a flipping plate drive device, a rack, a gear shaft, bearings, a coupling, two flipping seats, and a flipping plate. The two flipping seats are mounted side by side on the machine base, and each flipping seat has a rotating shaft mounted on its top. The two ends of the flipping plate are fixedly connected to the rotating shafts of the two flipping seats, respectively. The gearbox is mounted on the machine base, and the flipping plate drive device is mounted on the gearbox. The rack is fixedly mounted on the output end of the flipping plate drive device. Bearings are fitted on both ends of the gear shaft, and the gear shaft is rotatably mounted in the gearbox through the bearings. The gear shaft and the rack are perpendicular to each other and meshed. The gear shaft is fixedly connected to the nearest rotating shaft through the coupling.

5. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The feeding mechanism includes a feeding bracket, a first lever drive device, a second lever drive device, a third lever drive device, a mounting frame, and at least one lever. The feeding bracket is mounted on the machine base. The first lever drive device is mounted on the feeding bracket. The second lever drive device is mounted on the output end of the first lever drive device. The first lever drive device drives the second lever drive device to move left and right. The third lever drive device is mounted on the output end of the second lever drive device. The second lever drive device drives the third lever drive device to move back and forth. The mounting frame is mounted on the output end of the third lever drive device. The third lever drive device drives the mounting frame to move up and down. At least one lever is longitudinally mounted at the bottom of the mounting frame and is used to feed the flexible circuit board.

6. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The second lower die assembly includes a second floating lower die head, a third lower limit seat, and a fourth lower limit seat. The third and fourth lower limit seats are mounted side by side on the machine base. The second floating lower die head is movably mounted between the third and fourth lower limit seats and is used to support the flexible circuit board. The top of the second floating lower die head has a first V-groove on the side near the fourth lower limit seat. The bottom of the fourth lower limit seat has at least two second lower limit grooves. The bottom of the second floating lower die head facing the fourth lower limit seat has at least two second lower stop arms, each of which is movably mounted. Within the corresponding second lower limit groove, the second lower limit groove guides and limits the lifting and lowering movement of the second lower stop arm, thereby guiding and limiting the lifting and lowering of the second floating lower die head. The bottom of the second floating lower die head is provided with at least one second lower mounting hole, and a second lower elastic element is installed in the second lower mounting hole. The upper and lower ends of the second lower elastic element abut against the corresponding second lower mounting hole and the machine base, respectively. A second negative pressure communication hole is provided transversely through the second floating lower die head, and the top of the second floating lower die head is provided with at least one second suction hole, which is connected to the second negative pressure communication hole.

7. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The second upper die mechanism includes a second upper die drive device, at least two second linear guides, a second upper die platform, a third upper limit seat, a fourth upper limit seat, a lower pressure limit plate, and a second floating upper die head. The second upper die drive device is longitudinally mounted on the die support. The at least two second linear guides are parallel to each other and longitudinally mounted on the die support. The second upper die platform is lifted and slidably mounted on the at least two second linear guides. The second upper die platform is located below the second upper die drive device and is fixedly connected to the output end of the second upper die drive device. The third upper limit seat and the fourth upper limit seat are arranged side by side and mounted on the two sides of the bottom of the second upper die platform. The lower pressure limit plate is mounted on the bottom surface of the fourth upper limit seat and is used to press one side of the flexible circuit board. The bottom of the lower pressure limit plate is provided with at least two clearance grooves. The second floating upper die head is movably mounted between the third upper limit seat and the fourth upper limit seat and is used to press the flexible circuit board. The top of the fourth upper limit seat is provided with at least two third upper limit slots. The top of the second floating upper die head facing the fourth upper limit seat is provided with at least two third upper stop arms that are adapted to be installed in the third upper limit slots. The third upper limit slots guide and limit the lifting and lowering of the second floating upper die head by guiding and limiting the lifting and lowering of the third upper stop arms. The top of the second floating upper die head is provided with at least one second upper mounting hole. A second upper elastic element is installed in the second upper mounting hole. The upper and lower ends of the second upper elastic element abut against the second upper die table and the corresponding second upper mounting hole, respectively.

8. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The Z-type punching die mechanism includes a Z-type punching die base plate, at least two third linear guide rails, a Z-type punching die slide, a Z-type template, and a Z-type template driving device. The Z-type punching die base plate is mounted on the machine base. The at least two third linear guide rails are parallel to each other and horizontally mounted on the Z-type punching die base plate. The Z-type punching die slide is horizontally slidably mounted on the at least two third linear guide rails. The Z-type template is mounted on the Z-type punching die slide. The Z-type template driving device is mounted on the Z-type punching die base plate, and the output end of the Z-type template driving device is fixedly connected to the Z-type punching die slide. The Z-shaped template includes a Z-shaped die head connecting plate and at least two punching Z-shaped dies mounted on the Z-shaped die head connecting plate. The end face of the punching Z-shaped die head facing the second lower die assembly is provided with a second V-shaped groove. The second V-shaped groove is vertically offset from the first V-shaped groove of the second floating lower die head and is arranged facing each other.

9. The flexible circuit board punching and shaping machine according to claim 1, characterized in that: The third lower die assembly includes a lower die base, a bump die head assembly, a right-angle shaping lower die head, and a bottom die limiting block. The lower die base is mounted on the machine base, and a lower die head mounting groove is provided on one side of the top of the lower die base. The right-angle shaping lower die head is movably mounted in the lower die head mounting groove and is used to support the other side of the flexible circuit board. The bump die head assembly is mounted in the lower die head mounting groove and movably passes through the right-angle shaping lower die head to perform bump punching on the third right-angle portion and the fourth right-angle portion of the flexible circuit board. The bottom die limiting block is mounted in the lower die head mounting groove and is used to limit the right-angle shaping lower die head. The bottom of the right-angle shaping lower die head is provided with a movable groove for accommodating the protrusion die head assembly. A fastening strip is provided on one side of the bottom of the right-angle shaping lower die head. A first right-angle protrusion and a second right-angle groove are provided side by side on the top of the right-angle shaping lower die head. At least two first sliding holes are provided through the bottom of the movable groove and the second right-angle groove. At least two second sliding holes are provided at the tip of the movable groove and the first right-angle protrusion. A third negative pressure communication hole is provided transversely through the right-angle shaping lower die head. At least one third air suction hole is provided on the side of the first right-angle protrusion away from the second right-angle groove. At least one third air suction hole is connected to the third negative pressure communication hole. At least two first alignment holes are provided through the bottom of the movable groove and the second right-angle groove. The convex dot die assembly includes a convex dot die base. At least two first convex dot dies and at least two second convex dot dies are respectively provided on the top two sides of the convex dot die base. The top of the first convex dot die is flat and is movably installed in the first sliding hole for punching convex dots on the third right-angle portion. The top of the second convex dot die is chamfered in an arc shape and is movably installed in the second sliding hole for punching convex dots on the fourth right-angle portion. The top of the convex dot die base is provided with at least one third lower mounting hole. A third lower elastic member is installed in the third lower mounting hole. The upper and lower ends of the third lower elastic member abut against the movable groove of the right-angle shaping lower die and the corresponding third lower mounting hole, respectively. The bottom of the bottom mold limiting block is provided with a limiting groove on one side near the center of the lower mold base, which is adapted to the fastener strip of the right-angle shaped lower mold head.

10. The flexible circuit board punching and shaping machine according to claim 9, characterized in that: The third upper punching mechanism includes an inclined platform, at least two fourth linear guides, a right-angle shaping upper die head, and a right-angle shaping die head driving device. The inclined platform is mounted on the machine base, the right-angle shaping die head driving device is mounted on the top of the inclined platform, the at least two fourth linear guides are parallel to each other and obliquely mounted on the inclined platform, the right-angle shaping upper die head is lifted and slidably mounted on the at least two fourth linear guides, and the right-angle shaping upper die head is located obliquely below the right-angle shaping die head driving device and is fixedly connected to the output end of the right-angle shaping die head driving device. The bottom of the right-angle shaping upper mold head is provided with a third right-angle groove and a second right-angle protrusion. The tip of the second right-angle protrusion is provided with at least two first concave molds that are adapted to the shape of the first protrusion mold head. The third right-angle groove is provided with at least two second concave molds that are adapted to the shape of the second protrusion mold head. The tip of the second right-angle protrusion is also provided with at least two second alignment holes that are opposite to the first alignment holes.

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