High-temperature-resistant adhesive tape for SMT (Surface Mount Technology), adhesive

Abstract

The invention relates to a high-temperature-resistant adhesive tape for SMT (Surface Mount Technology), adhesive tape glue and a preparation method of the adhesive tape glue. The high-temperature-resistant adhesive tape glue for SMT comprises an acrylic pressure-sensitive adhesive copolymer, a curing agent and a first solvent, the acrylic acid pressure-sensitive adhesive copolymer is formed by copolymerization of acrylic ester monomers and hydroxyl-containing or functional acrylic acid monomers through a polymerization reaction of free radicals in a solution. The curing agent is formed by modification, and the curing agent is composed of polyether amine, bismaleimide and a second solvent. The SMT high-temperature-resistant adhesive tape and the adhesive tape glue have excellent bonding force, high-temperature resistance and stress relaxation capability, have excellent capability of avoiding residues after being heated, and are simple and convenient in preparation method and relatively low in cost. The method is particularly suitable for application scenes such as automobiles, electronic circuit boards, military equipment and the like which have strict requirements on contact reliability.

Description

Technical Field

[0001] This invention relates to the field of chemical materials in thick and thin film materials for electronic component PCBs (printed circuit boards), particularly to the field of polymer materials in thick and thin film materials for electronic component PCBs, and especially to an adhesive tape for thick and thin film materials for electronic component PCBs; this invention also relates to a method for preparing the adhesive tape. Background Technology

[0002] As SMT (Surface Mount Technology) rapidly advances towards higher density and precision, reflow soldering, as a core process for ensuring reliable connections between components and PCBs, faces increasingly stringent requirements for processing accuracy and stability. Gold fingers, as critical conductive contacts for external electrical connections on PCBs, face multiple process risks in the high-temperature environment (peak temperatures often reaching 240–260°C) and chemically active atmosphere of reflow soldering. For example, molten solder can easily cause lateral flow leading to short circuits; high-temperature oxidation significantly reduces contact reliability; and flux residue can trigger electrochemical corrosion. Traditional shielding materials such as ordinary high-temperature tapes and silicone sheets are no longer suitable for the stringent requirements of precision protection for gold fingers in modern high-density SMT packaging due to insufficient temperature resistance (usually below 230°C), easy residue formation from adhesive thermal decomposition, and adhesive contamination after peeling. Summary of the Invention

[0003] The technical problem this invention aims to solve is to overcome the shortcomings of the prior art by providing a high-temperature resistant tape, tape adhesive, and its preparation method for SMT (Surface Mount Technology). This tape possesses excellent adhesion, high-temperature resistance, and stress relaxation ability, as well as excellent "heat-free residue" capability. Furthermore, the preparation method is simple and low-cost. This invention is particularly suitable for applications with stringent requirements for contact reliability, such as automotive, electronic circuit boards, and military equipment, for example, in SMT applications. The high temperature referred to in this invention is a temperature not lower than 260°C.

[0004] The technical solution adopted by the present invention to solve the aforementioned technical problem is as follows:

[0005] A high-temperature resistant adhesive for SMT tape is provided, comprising an acrylic pressure-sensitive adhesive copolymer, a curing agent, and a first solvent; the mass ratio of the acrylic pressure-sensitive adhesive copolymer, curing agent, and first solvent is 100:(0.5-15):(20-40). The acrylic pressure-sensitive adhesive copolymer is copolymerized from acrylate monomers and hydroxyl-containing or functional acrylic monomers through a free radical polymerization reaction in solution. The curing agent is modified and comprises a polyetheramine, bismaleimide, and a second solvent; the polyetheramine has a linear structure with both ends capped with primary amines; the polyetheramine is polyetheramine of type D230; the bismaleimide is bismaleimide of type BMI5100; the second solvent includes one or more of ethyl acetate, toluene, and isopropanol. The solid content of the high-temperature resistant adhesive for SMT tape is 10%-60%.

[0006] The acrylate monomers are one or more of isooctyl acrylate, butyl acrylate, lauryl acrylate, and methyl acrylate; in particular, the acrylate monomers are two, three, or four of isooctyl acrylate, butyl acrylate, lauryl acrylate, and methyl acrylate.

[0007] The hydroxyl-containing or functional acrylic monomer is one or more of acrylic acid, hydroxybutyl acrylate, and glycidyl methacrylate; in particular, the hydroxyl-containing or functional acrylic monomer is two or three of acrylic acid, hydroxybutyl acrylate, and glycidyl methacrylate.

[0008] The acrylate monomers account for 5-30% of the total weight of all added reactants, and the hydroxyl-containing or functional acrylic monomers account for 5-30% of the total weight of all added reactants.

[0009] This invention also provides a method for preparing a high-temperature resistant adhesive for SMT tapes, namely, a method for preparing the above-mentioned high-temperature resistant adhesive for SMT tapes, comprising the following steps:

[0010] Step A, Preparation of acrylic pressure-sensitive adhesive copolymer:

[0011] Step A1: A certain amount of acrylic monomers, a certain amount of hydroxyl-containing or functional acrylic monomers, and a certain amount of a third solvent are placed in a reaction vessel and mixed evenly to form a first mixed solution; the third solvent includes one or more of ethyl acetate, toluene, isopropanol, and methanol;

[0012] Step A2: Add a certain amount of initiator to an Erlenmeyer flask and add a certain amount of a third solvent to dissolve it, thus preparing an initiator solution of a specific concentration; divide the initiator solution into 5 to 15 portions and place them into drop containers respectively; the initiator includes one or more of azobisisobutyronitrile, benzoyl peroxide, and tert-butyl peroxide.

[0013] Step A3: Under a nitrogen atmosphere, heat the first mixture to 90-100°C. When the first mixture in the reactor exhibits reflux and foaming, add the first portion of initiator solution. Then, add the initiator solution every 28-32 minutes to carry out the segmented free radical polymerization reaction in the solution until only three portions of initiator solution remain, resulting in a polyacrylate solution with a wide molecular weight distribution. Continuously monitor and record the reaction temperature, the initial dropping time, and the temperature peak during the initial dropping phase throughout the entire process.

[0014] Step A4: After the dropwise addition is completed, adjust the newly formed polyacrylate solution in step A3 to 80-90°C and carry out the first heat preservation reaction for 0.5-2 hours;

[0015] Step A5: Then add the remaining three portions of initiator solution in three more portions. After each addition of initiator solution, maintain the temperature range for 0.5 to 2 hours. The holding time after the last addition of initiator solution is 0.5 to 3 hours.

[0016] Step A6: Finally, cool the newly formed third mixed solution in step A5 to below 40°C, then add a certain amount of third solvent to dilute it so that its solid content reaches a certain value, which is 30% to 50%. After stirring and filtering, the acrylic pressure-sensitive adhesive copolymer is obtained.

[0017] Step B: Prepare a curing agent, the curing agent comprising polyetheramine, bismaleimide, and a second solvent, the second solvent comprising ethyl acetate and isopropanol, the curing agent being modified by the following steps:

[0018] Step B1: Add a certain amount of polyetheramine to a four-necked flask, add a certain amount of ethyl acetate to dissolve it, and stir in a water bath at a certain temperature of 50-100°C for a period of time to obtain the ninth mixed solution; the polyetheramine is polyetheramine of type D230.

[0019] Step B2: A certain amount of bismaleimide is added to a beaker, and a certain amount of ethyl acetate is added to dissolve it. The mixture is stirred and reacted for a period of time to obtain the eighth mixed solution. The bismaleimide is BMI5100 bismaleimide. In this step B2, the mass ratio of the bismaleimide to the polyetheramine is (0.5-15):100; the mass ratio of the ethyl acetate to the polyetheramine is (30-40):100.

[0020] Step B3: Next, add the eighth mixed solution obtained in step B2 to the ninth mixed solution in step B1, and continue to add and stir under the temperature conditions of step B1 until the eighth mixed solution is completely added to obtain the seventh mixed solution.

[0021] Step B4: Rinse the beaker used in step B3 with a certain amount of isopropanol. In step B4, the mass ratio of isopropanol to polyetheramine is (40-50):100. Add the rinse solution to the seventh mixed solution in step B3 and continue to stir and react for another period of time under the temperature conditions in step B1 above to obtain the curing agent. After bottling, seal and store in a refrigerator.

[0022] Step C, preparing the adhesive for SMT high-temperature resistant tape:

[0023] Step C1: First, weigh out a certain amount of the acrylic pressure-sensitive adhesive copolymer from step A, a certain amount of the curing agent from step B, and a certain amount of the first solvent;

[0024] Step C2: Add the acrylic pressure-sensitive adhesive copolymer to the reaction vessel, then add the first solvent to dilute it, and stir until homogeneous;

[0025] Step C3: Next, add the curing agent and continue stirring for a period of time, which is 20 to 40 minutes; ensure that the system is fully dispersed, and you will get the adhesive for SMT high-temperature resistant tape.

[0026] This invention also provides a method for preparing SMT high-temperature resistant tape, which, after obtaining the SMT high-temperature resistant tape adhesive according to the above-described method, further includes the following steps:

[0027] Step D: Apply the SMT high-temperature resistant tape adhesive prepared in step C3 to any surface of a PI film of a certain thickness to form an adhesive layer with a thickness of 10-30 micrometers. Add a release film of a certain thickness on the adhesive layer, with the release face of the release film facing the adhesive surface of the adhesive layer, to obtain a semi-finished product of SMT high-temperature resistant tape. Place the semi-finished product of SMT high-temperature resistant tape in an oven and cure it at a certain temperature for a period of time. Then take it out and cool it to room temperature to obtain the SMT high-temperature resistant tape.

[0028] The present invention also provides a high-temperature resistant tape for SMT, which is obtained by the above-described preparation method for the high-temperature resistant tape for SMT.

[0029] Compared with existing technologies, the advantages of this invention for SMT high-temperature resistant tape, tape adhesive, and its preparation method are as follows:

[0030] I. This invention utilizes an acrylate copolymer with specific side chain functional groups (alkyl, hydroxy, carboxyl, alkylamino or amide groups) mixed with a polyetheramine and a bismaleimide curing agent to prepare a high-temperature resistant tape for SMT.

[0031] II. In the acrylic pressure-sensitive adhesive copolymer of the present invention, the acrylate monomers have long-chain alkyl acrylates (such as lauryl acrylate) with flexible aliphatic long side chains, which are used as the main skeleton of the copolymer, giving the adhesive layer excellent adhesion and high-temperature creep resistance.

[0032] Third, the active functional groups of the acrylic pressure-sensitive adhesive copolymer of the present invention, which contain hydroxyl or functional acrylic monomers (such as acrylic acid, methacrylic acid, glycidyl methacrylate), form dense reactive group sites on the side chain of the copolymer, which not only significantly enhances the interfacial adhesion between the adhesive layer and the substrate, but also provides active sites for efficient curing and crosslinking.

[0033] IV. The curing agent of this invention adopts a synergistic curing system of polyetheramine and bismaleimide, which can undergo multiple cross-linking reactions with the hydroxyl, carboxyl and epoxy groups of the copolymer side chain under high temperature to construct a high-density, high-thermal-stability three-dimensional network structure.

[0034] V. The polyetheramine in the curing agent of this invention, as a type of amine curing agent with a flexible long-chain structure, significantly optimizes the performance of the acrylate system. The abundant ether bond structure in its molecular chain not only provides excellent flexibility and internal plasticizing effect, but also effectively absorbs impact energy and stress, thereby greatly improving the impact resistance and peel strength of the cured adhesive layer, successfully overcoming the brittleness problem that may exist in traditional acrylate adhesive layers, and also improving the compatibility of the curing agent in acrylate adhesives. At the same time, the inherent chemical stability of the polyetheramine backbone helps to reduce the shrinkage stress of the adhesive layer and gives it better creep resistance. Its low color and colorfastness characteristics also ensure that the bonded parts can maintain a good appearance for a long time.

[0035] VI. The introduction of bismaleimide into the curing agent of this invention can bring breakthrough high-temperature resistance and mechanical strength to the acrylate system. By increasing the imide ring, the poor temperature resistance of polyetheramine is improved. The bismaleimide monomer structure contains highly reactive maleimide double bonds, which can react efficiently with the free radicals of acrylate during the curing process to form a highly cross-linked and dense network structure. This structure not only greatly improves the glass transition temperature and heat distortion temperature of the system, enabling it to maintain excellent mechanical properties and adhesive strength under harsh high-temperature environments, but also the bismaleimide cross-linking points themselves have extremely high thermal stability and rigidity, thereby significantly enhancing the rigidity, modulus, heat oxidation stability and solvent erosion resistance of the adhesive layer.

[0036] 7. The curing agent of this invention has good initial adhesion after being added to the adhesive and is easy to bond with the object being bonded.

[0037] 8. The curing agent of this invention does not degrade under high temperature and high pressure after being added to the adhesive and is cured, and its viscosity is greatly reduced, making it easy to tear after high temperature.

[0038] 9. The adhesive prepared using the curing agent of this invention can significantly reduce its tackiness at high temperatures. This results in the acrylic adhesive having a relatively high peel strength at room temperature (180° tensile test), but reducing its tackiness at high temperatures, achieving a peel strength of less than 30 gf / inch.

[0039] In summary, the high-temperature resistant adhesive for SMT tapes of this invention exhibits excellent high-temperature resistance. This high-temperature resistant adhesive possesses multiple strengthening mechanisms (cohesive reinforcement, interfacial reinforcement, and cross-linking curing), significantly reducing tackiness at high temperatures. The adhesive effectively inhibits high-temperature decomposition reactions, eliminating residue generation at the source and ensuring cleanliness in high-temperature environments. Its special formulation design also endows the adhesive with excellent peel properties. This results in tapes made with this adhesive maintaining high peel strength at room temperature (180° tensile test), providing stable and reliable adhesion at room temperature, while reducing tackiness at high temperatures, achieving a peel strength of up to 30°C. With a peel force of less than gf / inch, it can peel smoothly after high-temperature processing, keeping the peeled surface clean. It is particularly suitable for applications with stringent requirements for contact reliability, such as automotive, electronic circuit boards, and military equipment. For example, when used in SMT, it can effectively protect sensitive components and significantly improve the yield of SMT processes. The high-temperature resistant tape of this invention for SMT has comprehensive advantages such as excellent high-temperature holding power (resistance to shear creep), excellent thermal stability (resistance to high-temperature aging), strong substrate adhesion, and good process adaptability (suitable for a wide range of solid content). It meets the stringent requirements of tape adhesion reliability and clean peeling in the high-temperature environment of SMT without causing damage to the SMT. It provides highly reliable adhesion and protection, fundamentally solving the pain points of traditional tapes or protective films in the high-temperature and peeling process, and perfectly meeting the stringent requirements of modern SMT high-density packaging for the protection of critical components. Attached Figure Description

[0040] Figure 1 This is a summary table of performance tests for SMT high-temperature resistant tapes in various embodiments and comparative examples of the present invention. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings.

[0042] A high-temperature resistant adhesive for SMT tapes, comprising an acrylic pressure-sensitive adhesive copolymer, a curing agent, and a first solvent; the mass ratio of the acrylic pressure-sensitive adhesive copolymer, curing agent, and first solvent is 100:(0.5-15):(20-40); the first solvent includes one or more of ethyl acetate, toluene, isopropanol, and methanol. The acrylic pressure-sensitive adhesive copolymer is copolymerized from acrylate monomers and hydroxyl-containing or functional acrylic monomers through a free radical polymerization reaction in solution; or it can be described as follows: the acrylic pressure-sensitive adhesive copolymer comprises acrylate monomers, hydroxyl-containing or functional acrylic monomers, an initiator, and a third solvent, wherein the third solvent includes one or more of ethyl acetate, toluene, isopropanol, and methanol; the initiator includes one or more of azobisisobutyronitrile, benzoyl peroxide, and tert-butyl peroxide. The curing agent is modified and consists of polyetheramine, bismaleimide, and a second solvent. The polyetheramine has a linear structure with both ends capped with primary amines. The polyetheramine is type D230. The bismaleimide is type BMI5100. The second solvent includes one or more of ethyl acetate, toluene, and isopropanol. The solid content of the adhesive used for SMT high-temperature resistant tape is 10%–60%.

[0043] The acrylate monomers are one or more of isooctyl acrylate, butyl acrylate, lauryl acrylate, and methyl acrylate; in particular, the acrylate monomers are two, three, or four of isooctyl acrylate, butyl acrylate, lauryl acrylate, and methyl acrylate.

[0044] The hydroxyl-containing or functional acrylic monomer is one or more of acrylic acid, hydroxybutyl acrylate, and glycidyl methacrylate; in particular, the hydroxyl-containing or functional acrylic monomer is two or three of acrylic acid, hydroxybutyl acrylate, and glycidyl methacrylate.

[0045] The acrylate monomers constitute 5-30% of the total weight of all added reactants, and the hydroxyl-containing or functional acrylic monomers constitute 5-30% of the total weight of all added reactants. The remainder consists of the weight of the initiator and the third solvent. The total weight of all added reactants in this invention = weight of acrylate monomers + weight of hydroxyl-containing or functional acrylic monomers + weight of initiator + weight of the third solvent.

[0046] This invention also provides a method for preparing a high-temperature resistant adhesive for SMT tapes, namely, a method for preparing the above-mentioned high-temperature resistant adhesive for SMT tapes, comprising the following steps:

[0047] Step A, Preparation of acrylic pressure-sensitive adhesive copolymer:

[0048] Step A1: A certain amount of acrylic monomers, a certain amount of hydroxyl-containing or functional acrylic monomers, and a certain amount of a third solvent are placed in a reaction vessel and mixed evenly to form a first mixed solution; the third solvent includes one or more of ethyl acetate, toluene, isopropanol, and methanol; the acrylate monomers account for 5-30% of the total weight of all added reactants, and the hydroxyl-containing or functional acrylic monomers account for 5-30% of the total weight of all added reactants;

[0049] Step A2: Add a certain amount of initiator to an Erlenmeyer flask and add a certain amount of a third solvent to dissolve it, preparing an initiator solution of a specific concentration, such as an initiator solution with a concentration of 0.5% to 2%, especially an initiator solution with a concentration of 1%; divide the initiator solution into 5 to 15 portions and place them into dropping containers respectively; the initiator includes one or more of azobisisobutyronitrile, benzoyl peroxide, and tert-butyl peroxide-2-ethylhexanoate;

[0050] Step A3: Under a nitrogen atmosphere, heat the first mixture to 90-100°C. When the first mixture in the reactor exhibits reflux and foaming, add the first portion of initiator solution. Then, add the initiator solution every 28-32 minutes to carry out the segmented free radical polymerization reaction in the solution until only three portions of initiator solution remain, resulting in a polyacrylate solution with a wide molecular weight distribution. This polyacrylate solution can also be called the second mixture solution. Continuously monitor and record the reaction temperature, the initial dropping time, and the temperature peak during the initial dropping phase throughout the entire process.

[0051] Step A4: After the dropwise addition is completed, adjust the newly formed polyacrylate solution in step A3 to 80-90°C and carry out the first heat preservation reaction for 0.5-2 hours;

[0052] Step A5: Then add the remaining three portions of initiator solution in three more portions. After each addition of initiator solution, maintain the temperature range for 0.5 to 2 hours. The holding time after the last addition of initiator solution is 0.5 to 3 hours. The temperature in step A5 is the same as the temperature in step A4.

[0053] Step A6: Finally, cool the newly formed third mixed solution in step A5 to below 40°C, then add a certain amount of third solvent to dilute it so that its solid content reaches a certain value, which is 30% to 50%. After stirring and filtering, the acrylic pressure-sensitive adhesive copolymer is obtained.

[0054] Step B: Prepare a curing agent, the curing agent comprising polyetheramine, bismaleimide, and a second solvent, the second solvent comprising ethyl acetate and isopropanol, the curing agent being modified by the following steps:

[0055] Step B1: Add a certain amount of polyetheramine to a four-necked flask, add a certain amount of ethyl acetate to dissolve it, and stir in a water bath at a certain temperature (50-100°C, for example, maintaining the temperature at 60°C). Stir for a period of time, allowing the polyetheramine to fully dissolve, which is 4-10 minutes, for example, 5 minutes, to obtain the ninth mixed solution. In Step B1, the polyetheramines are all linear structures with primary amine end caps, for example, the polyetheramine is type D230. In Step B1, the mass ratio of polyetheramine to ethyl acetate is 100:(60-70).

[0056] Step B2: Add a certain amount of bismaleimide to a beaker, add a certain amount of ethyl acetate to dissolve it, and stir the reaction for a period of time, which is 5-10 minutes, for example, 8 minutes, to obtain the eighth mixed solution; in step B2, the bismaleimide can be BMI5100 type bismaleimide; in step B2, the mass ratio of bismaleimide to polyetheramine is (0.5-15):100; the mass ratio of ethyl acetate to polyetheramine is (30-40):100;

[0057] Dissolving polyetheramine and bismaleimide separately before adding them together is to ensure that the polyetheramine and bismaleimide react fully after contact, rather than reacting locally.

[0058] Step B3: Next, add the eighth mixed solution obtained in step B2 to the ninth mixed solution in step B1, and continue to add and stir under the temperature conditions of step B1 until the eighth mixed solution is completely added to obtain the seventh mixed solution.

[0059] Step B4: Rinse the beaker used in Step B3 with a certain amount of isopropanol. In Step B4, the mass ratio of isopropanol to polyetheramine is (40-50):100. Add the rinsing solution to the seventh mixed solution from Step B3, and continue stirring and reacting at the temperature conditions described in Step B1 for a period of time. The stirring time should be sufficient for the polyetheramine and bismaleimide to react fully, generally 18-30 hours. For example, stirring and reacting for 24 hours will yield the curing agent. After bottling, seal and refrigerate. The role of isopropanol is to rinse the beaker, ensuring no residual bismaleimide remains on the inner wall; isopropanol also acts as a reaction initiator.

[0060] Step C, preparing the adhesive for SMT high-temperature resistant tape:

[0061] Step C1: First, weigh out a certain amount of the acrylic pressure-sensitive adhesive copolymer from step A, a certain amount of the curing agent from step B, and a certain amount of the first solvent; in step C1, the mass ratio of the acrylic pressure-sensitive adhesive copolymer, the curing agent, and the first solvent is 100: (0.5-15): (20-40); the first solvent includes one or more of ethyl acetate, toluene, isopropanol, and methanol;

[0062] Step C2: Add the acrylic pressure-sensitive adhesive copolymer to the reaction vessel, then add the first solvent to dilute it, and stir until homogeneous;

[0063] Step C3: Next, add the curing agent and continue stirring for a period of time, which is 20 to 40 minutes; ensure that the system is fully dispersed, and you will get the adhesive for SMT high-temperature resistant tape.

[0064] This invention also provides a method for preparing SMT high-temperature resistant tape, which, after obtaining the SMT high-temperature resistant tape adhesive according to the above-described method, further includes the following steps:

[0065] Step D: Apply the SMT high-temperature resistant tape adhesive prepared in step C3 to any surface of a PI film of a certain thickness. The thickness of the PI film is generally 11.5 to 13.5 micrometers, forming an adhesive layer with a thickness of 10 to 30 micrometers. Add a release film of a certain thickness on the adhesive layer, with the release surface of the release film facing the adhesive surface of the adhesive layer. The thickness of the release film is generally 12.5 to 75 micrometers. The applicant generally uses release films with thicknesses of 25 micrometers, 36 micrometers, or 50 micrometers. For example, the thickness of the release film is 36 micrometers, resulting in a semi-finished product of the SMT high-temperature resistant tape. Place the semi-finished product of the SMT high-temperature resistant tape in an oven and cure it for a period of time at a certain temperature, generally 70 to 150°C. For example, cure it in an oven at 80°C for 48 hours. Since the oven temperature is low, the curing time needs to be longer. Then remove it and cool it to room temperature to obtain the SMT high-temperature resistant tape.

[0066] The present invention also provides a high-temperature resistant tape for SMT, which is obtained by the above-described preparation method for the high-temperature resistant tape for SMT.

[0067] Example 1

[0068] A method for preparing high-temperature resistant tape for SMT, comprising the following steps:

[0069] Step A: Prepare acrylic pressure-sensitive adhesive copolymer. In this Example 1, the acrylate monomers are butyl acrylate, isooctyl acrylate, and lauryl acrylate, and the hydroxyl-containing or functional acrylic monomers are hydroxybutyl acrylate and glycidyl methacrylate.

[0070] Step A1: Place 20g of butyl acrylate, 20g of isooctyl acrylate, 30g of lauryl acrylate, 70g of hydroxybutyl acrylate, 30g of glycidyl methacrylate, and 125g of ethyl acetate into a reaction vessel and mix thoroughly to form the first mixed solution;

[0071] Step A2: Add 0.11 g of azobisisobutyronitrile to an Erlenmeyer flask and dissolve it in ethyl acetate to prepare a 1% initiator solution; divide the initiator solution into 11 equal portions and place them into separate dropping containers.

[0072] Step A3: Under a nitrogen atmosphere, heat the first mixture to 95°C. When the first mixture in the reactor exhibits reflux and foaming, add the first portion of initiator solution. Then, add initiator solution every 30 minutes to carry out the segmented free radical polymerization reaction in the solution until only three portions of initiator solution remain, resulting in a polyacrylate solution with a wide molecular weight distribution. Continuously monitor and record the reaction temperature, the initial dropping time, and the temperature peak during the initial dropping phase throughout the entire process.

[0073] Step A4: After the dropwise addition is completed, adjust the newly formed polyacrylate solution in step A3 to 85°C and carry out the first heat preservation reaction for 1.5 hours;

[0074] Step A5: Then add the remaining three portions of initiator solution in three more portions. After each addition of initiator solution, maintain the temperature at 85°C for 1.5 hours. After the last addition of initiator solution, maintain the temperature at 85°C for 2.5 hours.

[0075] Step A6: Finally, the newly formed third mixed solution in step A5 is cooled to 25°C, and then 89 grams of ethyl acetate is added to dilute it so that its solid content is about 43%. After stirring and filtering, the acrylic pressure-sensitive adhesive copolymer is prepared.

[0076] Step B, Preparation of curing agent:

[0077] Step B1: Take 90 grams of polyetheramine of type D230 and add it to a four-necked flask equipped with a reflux condenser, a constant pressure dropping funnel, a stirring device and a thermometer. The four-necked flask has a capacity of 500 ml. Add 54 grams of ethyl acetate and stir to dissolve in a water bath at 60°C for 5 minutes to obtain the ninth mixed solution. The polyetheramine of type D230 used in this Example 1 has a linear structure with both ends capped with primary amines and a molecular weight of approximately 230.

[0078] Step B2: Take 7.2 g of BMI5000 bismaleimide and put it into a 250 mL beaker. Add 27 g of ethyl acetate to dissolve it. Stir with a glass rod to fully dissolve the bismaleimide to obtain the eighth mixed solution.

[0079] Step B3: Next, add the eighth mixed solution obtained in step B2 to the ninth mixed solution in step B1, and continue to add and stir under the conditions of a water bath at 60°C until the eighth mixed solution is completely added, thus obtaining the seventh mixed solution.

[0080] Step B4: Rinse the beaker used in step B3 with 36g of isopropanol. Add the rinsing solution to the seventh mixed solution in step B3 through a constant pressure dropping funnel. Continue stirring and reacting in a water bath at 60°C for 24 hours to obtain the curing agent. After bottling, seal and refrigerate.

[0081] Step C, preparing the adhesive for SMT high-temperature resistant tape:

[0082] Step C1: First, weigh out 100g of the acrylic pressure-sensitive adhesive copolymer from step A, 10g of the curing agent from step B, and 30g of ethyl acetate;

[0083] Step C2: Add 100g of acrylic pressure-sensitive adhesive copolymer to the reaction vessel, then add 30g of ethyl acetate to dilute, and stir until homogeneous;

[0084] Step C3: Next, add 10 grams of curing agent and continue stirring for 30 minutes to ensure the system is fully dispersed, and you will get the adhesive for SMT high-temperature tape.

[0085] Step D: Apply the SMT high-temperature resistant tape adhesive prepared in step C3 to any surface of a 12.5-micron PI film within 30 minutes to form an adhesive layer with a thickness of 15 microns. Then, add a 36-micron release film on the adhesive layer, with the release face of the release film aligned with the adhesive surface of the adhesive layer, to obtain a semi-finished product of SMT high-temperature resistant tape. Place the semi-finished product of SMT high-temperature resistant tape in an oven and cure it at 130°C for 12 hours. Then, remove it and cool it to room temperature to obtain the SMT high-temperature resistant tape.

[0086] Figure 1 This is a summary table of various performance tests for SMT high-temperature resistant tape using Embodiment 1 of the present invention.

[0087] The experimental results, from this Figure 1 It can be seen that:

[0088] The high-temperature aging resistance is "no residue" and the damp heat aging resistance is also "no residue", indicating that after the SMT high-temperature tape of Example 1 is peeled off from the copper plate, no residue will remain on the surface.

[0089] The peel force at 180°C is 30 gf / inch, indicating that the SMT high-temperature resistant tape of Example 1 can provide stable and reliable adhesion at room temperature.

[0090] The peel force at a high temperature of 190°C and a peel strength of 180°C is 22 gf / inch, indicating that the SMT high-temperature resistant tape of Example 1 can reduce tackiness at high temperatures, peel off smoothly after high-temperature processing, and keep the peeled surface clean.

[0091] Example 2

[0092] A method for preparing high-temperature resistant SMT tape is basically the same as that in Example 1, the main difference being the substance and amount of acrylate monomers used in step A, and the substance and amount of hydroxyl-containing or functional acrylic monomers. Specifically:

[0093] In Example 2, the acrylate monomers are 40 grams of butyl acrylate and 70 grams of methyl acrylate, and the hydroxyl-containing or functional acrylic monomers are 30 grams of hydroxyethyl acrylate and 30 grams of acrylic acid.

[0094] Figure 1 This is a summary table of various performance tests for SMT high-temperature resistant tape using Embodiment 2 of the present invention.

[0095] The experimental results, from this Figure 1 It can be seen that:

[0096] The high-temperature aging resistance is "no residue" and the damp heat aging resistance is also "no residue", indicating that after the SMT high-temperature tape used in Example 2 is peeled off from the copper plate, no residue will remain on the surface.

[0097] The peel strength at 180°C is 28 gf / inch, indicating that the SMT high-temperature resistant tape of Example 2 can provide stable and reliable adhesion at room temperature.

[0098] The peel force at a high temperature of 190°C and a peel strength of 180°C is 15 gf / inch, indicating that the SMT high-temperature resistant tape of Example 2 can significantly reduce tackiness at high temperatures, can be easily peeled off after high-temperature processing, and keep the peeled surface clean.

[0099] Comparative Example 1

[0100] The preparation method of the tape in Comparative Example 1 is basically the same as that in Example 1, the main difference being that the curing agent in step C is directly polyetheramine of type D230, therefore step B is omitted. Specifically:

[0101] Comparative Example 1 uses polyetheramine of type D230 as a curing agent, and the amount of polyetheramine is 10 grams.

[0102] Figure 1 This is a summary table of various performance tests of SMT high-temperature resistant tape using Comparative Example 1 of the present invention.

[0103] The experimental results, from this Figure 1 It can be seen that:

[0104] High-temperature aging resistance is referred to as "residue," and damp heat aging resistance is also referred to as "residue." This indicates that after the SMT high-temperature resistant tape used in Comparative Example 1 is peeled off from the copper plate, residue will remain on the surface.

[0105] The peel strength at 180°C is 35 gf / inch, indicating that Comparative Example 1, used for SMT high-temperature resistant tape, can provide stable and reliable adhesion at room temperature.

[0106] The peel force at 180°C and 190°C is 62 gf / inch, indicating that the adhesive strength of the SMT high-temperature tape used in Comparative Example 1 is significantly enhanced at high temperatures, making peeling more difficult after high-temperature processing, and leaving adhesive residue on the peeled surface.

[0107] As can be seen from Comparative Example 1, only polyetheramine of type D230 was used as the curing agent. While the peel strength was enhanced at high temperatures, peeling became more difficult after the high-temperature process, leaving adhesive residue on the peeled surface. This demonstrates that the curing agent plays a crucial role in this invention, and using polyetheramine alone as the curing agent is insufficient.

[0108] Comparative Example 2

[0109] The preparation method of the tape in Comparative Example 2 is basically the same as that in Example 1, the main difference being that the curing agent in step C is directly bismaleimide, therefore step B is omitted. Specifically:

[0110] Comparative Example 2 uses BMI5000 bismaleimide as a curing agent, and the amount of bismaleimide is 10 grams.

[0111] Figure 1 This is a summary table of various performance tests of SMT high-temperature resistant tape using Comparative Example 2 of the present invention.

[0112] The experimental results, from this Figure 1 It can be seen that:

[0113] High-temperature aging resistance is described as "residue," and damp heat aging resistance is described as "no residue." This means that after the SMT high-temperature tape used in Comparative Example 2 was peeled off from the copper plate at high temperatures, residue would remain on the surface.

[0114] The peel strength at 180°C is 32 gf / inch, indicating that Comparative Example 2, used for SMT high-temperature resistant tape, can provide stable and reliable adhesion at room temperature.

[0115] The peel force at 180°C and 190°C is 50 gf / inch. This means that the adhesive strength of the SMT high-temperature tape used in Comparative Example 2 is greatly enhanced at high temperatures, but peeling will be more difficult after the high-temperature process, and residual adhesive will be left on the peeled surface.

[0116] As can be seen from Comparative Example 2, only BMI5000 bismaleimide was used as the curing agent. While the peel strength was enhanced at high temperatures, peeling became more difficult after the high-temperature process, leaving residue on the peeled surface. This demonstrates that the curing agent plays a crucial role in this invention, and using bismaleimide alone as the curing agent is insufficient.

[0117] Comparative Example 3

[0118] The preparation method of the tape in Comparative Example 3 is basically the same as that in Example 1, the main difference being that the curing agent in step C is a commercially available curing agent, and therefore step B is omitted. Specifically:

[0119] Comparative Example 3 used Ron Company's polyamide curing agent (650) as the curing agent, and the amount of this commercial curing agent was 10 grams.

[0120] Figure 1 This is a summary table of various performance tests of SMT high-temperature resistant tape using Comparative Example 3 of the present invention.

[0121] The experimental results, from this Figure 1 It can be seen that:

[0122] High-temperature aging resistance is referred to as "residue," and damp heat aging resistance is also referred to as "residue." This indicates that after the SMT high-temperature resistant tape used in Comparative Example 3 was peeled off from the copper plate, residue remained on the surface.

[0123] The peel strength at 180°C is 31 gf / inch, indicating that Comparative Example 3, used for SMT high-temperature resistant tape, can provide stable and reliable adhesion at room temperature.

[0124] The peel force at 180°C and 190°C is 76 gf / inch, indicating that the adhesive strength of the SMT high-temperature tape used in Comparative Example 3 is significantly enhanced at high temperatures, making peeling more difficult after high-temperature processing, and leaving adhesive residue on the peeled surface.

[0125] As can be seen from Comparative Example 3, a commercially available curing agent was used, which increased the peel strength at high temperatures. However, peeling became more difficult after the high-temperature process, leaving residual adhesive on the peeled surface. This demonstrates that the curing agent plays a crucial role in this invention, and using a commercially available curing agent is not advisable.

[0126] Comparative Example 4

[0127] The preparation method of the tape in Comparative Example 4 is basically the same as that in Example 2, the main difference being that the curing agent in step C is a commercially available curing agent, and therefore step B is omitted. Specifically:

[0128] Comparative Example 4 used Ron Company's polyamide curing agent (650) as the curing agent, and the amount of this commercial curing agent was 10 grams.

[0129] Figure 1 This is a summary table of various performance tests of SMT high-temperature resistant tape using Comparative Example 4 of the present invention.

[0130] The experimental results, from this Figure 1 It can be seen that:

[0131] High-temperature aging resistance is referred to as "residue," and damp heat aging resistance is also referred to as "residue." This indicates that after the SMT high-temperature resistant tape used in Comparative Example 4 was peeled off from the copper plate, residue remained on the surface.

[0132] The peel strength at 180°C is 25 gf / inch, indicating that Comparative Example 4, used for SMT high-temperature resistant tape, can provide stable and reliable adhesion at room temperature.

[0133] The peel force at 180°C and 190°C is 68 gf / inch, indicating that the adhesive strength of the SMT high-temperature tape used in Comparative Example 4 is significantly enhanced at high temperatures, making peeling more difficult after high-temperature processing, and leaving adhesive residue on the peeled surface.

[0134] As can be seen from Comparative Example 4, a commercially available curing agent was used, which increased the peel strength at high temperatures. However, peeling became more difficult after the high-temperature process, leaving residual adhesive on the peeled surface. This demonstrates that the curing agent plays a crucial role in this invention, and using a commercially available curing agent is not advisable.

[0135] Comparative Example 5

[0136] The preparation method of the tape in Comparative Example 5 is basically the same as that in Example 1, the main difference being the different substances and amounts of acrylate monomers used in step A, and the use of borneol acrylate as the synthetic monomer. Specifically:

[0137] The acrylate monomers in Comparative Example 5 consist of 40 grams of butyl acrylate, 30 grams of isooctyl acrylate, and 40 grams of borneol acrylate.

[0138] Figure 1 This is a summary table of various performance tests of SMT high-temperature resistant tape using Comparative Example 5 of the present invention.

[0139] The experimental results, from this Figure 1 It can be seen that:

[0140] High-temperature aging resistance is described as "residue-free", and damp heat aging resistance is described as "no residue-free". This means that after the SMT high-temperature resistant tape used in Comparative Example 5 was peeled off from the copper plate at high temperatures, residue-free residue remained on the surface.

[0141] The peel strength at 180°C is 32 gf / inch, indicating that Comparative Example 5, used for SMT high-temperature resistant tape, can provide stable and reliable adhesion at room temperature.

[0142] The peel force at 180°C and 190°C is 55 gf / inch. This means that the adhesive strength of the SMT high-temperature tape used in Comparative Example 5 is greatly enhanced at high temperatures, but peeling will be more difficult after the high-temperature process, and residual adhesive will be left on the peeled surface.

[0143] As can be seen from Comparative Example 5, the use of borneol acrylate resulted in enhanced peel strength at high temperatures, but peeling became more difficult after the high-temperature stage, leaving residue on the peeled surface. This is because the acrylic copolymer synthesis formulation failed to provide sufficient crosslinking sites, limiting the modification effect of the curing agent and failing to significantly enhance the cohesive strength of the colloid, resulting in residue still appearing in the high-temperature test. This also demonstrates that the acrylate monomers used in this invention play a crucial role, and borneol acrylates other than those used in this invention are not acceptable.

[0144] Figure 1 This is a summary table of performance tests for SMT high-temperature resistant tapes in various embodiments and comparative examples of the present invention:

[0145] (1) Adhesion performance test: The peel strength test at room temperature and high temperature (190°C) was conducted in accordance with GB / T 2792-2014 standard.

[0146] (2) High temperature aging resistance test: The tape was attached to the copper plate and placed in an oven at 100°C for 8 hours. After being taken out, it was naturally cooled to room temperature. After peeling, it was observed whether there was any residual adhesive or precipitation on the peeled surface of the copper plate.

[0147] (3) Moist heat aging resistance test: The tape is attached to the copper plate and placed in a constant temperature and humidity chamber at 80℃ and 90%RH for 100 hours. After being taken out, it is naturally cooled to room temperature. After peeling, observe whether there is any residual adhesive or precipitation on the surface of the copper plate.

[0148] (4) Room temperature or ambient temperature refers to a temperature of 21-25℃. gf / inch is a unit, where gf is grams of force, which is a unit of force that represents the gravitational force on 1 gram of a substance. gf / inch is the peeling force in grams of a protective film with a unit width of 1 inch.

[0149] From the various embodiments, comparative examples and Figure 1 The data can be used to draw conclusions;

[0150] First, the adhesive tapes prepared in Examples 1 and 2 of this invention both exhibit excellent comprehensive properties, including good adhesion, high temperature resistance, and aging resistance. After being made into tapes, no adhesive residue was observed when peeled off under high temperature and humid heat aging conditions, demonstrating excellent environmental stability. Specifically, because the soft monomer content in the formulation of Example 1 is higher than that of Example 2, it exhibits higher peel strength at room temperature.

[0151] Secondly, in contrast, Comparative Examples 1 and 2, which used only a single curing agent system, showed only slightly higher room-temperature peel strength than Examples 1 and 2, but significantly lower high-temperature resistance and resistance to humid heat aging. This is mainly attributed to the lack of synergistic reinforcing effect of a single curing agent, resulting in insufficient cohesion in the colloid and easy formation of residue under heat and moisture. Further comparison revealed that Comparative Example 1, which used a short-chain polyetheramine curing agent, exhibited a more pronounced deterioration in aging performance than Comparative Example 2. The mechanism lies in the fact that the short-chain curing agent has a small molecular weight and short chain segments, forming a three-dimensional network with high crosslinking density but short chain length after crosslinking with acrylic resin. This structure has a low modulus and strong chain segment mobility at room temperature, which is beneficial for stress dispersion and interface wetting, thereby improving room-temperature peel strength. However, under high-temperature or long-term aging conditions, the thermal motion of the short chain intensifies, leading to a sharp decrease in modulus and a decline in heat resistance. At the same time, the high concentration of end groups and dense crosslinking points also provide more reaction sites for oxidation and water degradation, making the network structure more susceptible to damage, thus reducing aging resistance and resulting in a significant increase in adhesion at high temperatures.

[0152] Third, in Comparative Examples 3 and 4, commercial curing agents were used instead of the modified curing agent of the present invention. The resulting colloids showed residual adhesive in both high temperature and damp heat aging tests, indicating that the introduction of the modified curing agent of the present invention plays a key role in improving multiple properties of the pressure-sensitive adhesive.

[0153] Fourth, although Comparative Example 5 used the same modified curing agent of the present invention, specifically borneol acrylate, its acrylic copolymer synthesis formulation failed to provide sufficient crosslinking sites, resulting in limited modification effect of the curing agent and no significant enhancement of the cohesive strength of the colloid. Residual adhesive still appeared in the high-temperature test. This result further illustrates that the modified curing agent needs to be synergistically designed with a suitable adhesive formulation to achieve optimal performance.

[0154] Based on the above analysis, the high-temperature resistant adhesive tape of this invention for SMT exhibits excellent high-temperature resistance. At high temperatures, its tackiness is significantly reduced, resulting in tapes prepared with this adhesive that maintain high peel strength at room temperature (180° tensile test). It provides stable and reliable adhesion at room temperature, while reducing tackiness at high temperatures, achieving a peel strength of less than 30 gf / inch. This allows for smooth peeling after high-temperature processing, maintaining a clean peel surface. It is particularly suitable for applications with stringent contact reliability requirements, such as automotive, electronic circuit boards, and military equipment. For example, when used in SMT, it will not damage the SMT.

[0155] The above-described embodiments are merely preferred embodiments of the present invention, and are described in a relatively specific and detailed manner. However, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements are all within the scope of protection of the present invention. Therefore, all equivalent transformations and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.

Claims

1. A high-temperature resistant adhesive for SMT tape, characterized in that: The adhesive for SMT high-temperature resistant tape is composed of an acrylic pressure-sensitive adhesive copolymer, a curing agent, and a first solvent. The acrylic pressure-sensitive adhesive copolymer is copolymerized from acrylate monomers and hydroxyl-containing or functional acrylic monomers through a free radical polymerization reaction in solution. The curing agent is modified and is composed of polyetheramine, bismaleimide, and a second solvent.

2. The SMT high-temperature resistant tape adhesive according to claim 1, characterized in that: The acrylate monomers are one or more of isooctyl acrylate, butyl acrylate, lauryl acrylate, and methyl acrylate.

3. The SMT high-temperature resistant tape adhesive according to claim 1, characterized in that: The hydroxyl-containing or functional acrylic monomer is one or more of acrylic acid, hydroxybutyl acrylate, and glycidyl methacrylate.

4. The SMT high-temperature resistant tape adhesive according to claim 1, characterized in that: The acrylate monomers account for 5-30% of the total weight of all added reactants, and the hydroxyl-containing or functional acrylic monomers account for 5-30% of the total weight of all added reactants.

5. The SMT high-temperature resistant tape adhesive according to claim 1, characterized in that: The mass ratio of the acrylic pressure-sensitive adhesive copolymer, the curing agent, and the first solvent is 100: (0.5-15): (20-40).

6. The SMT high-temperature resistant tape adhesive according to claim 1, characterized in that: The polyetheramine has a linear structure with both ends capped with primary amines.

7. The SMT high-temperature resistant tape adhesive according to claim 1, characterized in that: The polyetheramine is polyetheramine of type D230; the bismaleimide is bismaleimide of type BMI5100; the second solvent includes one or more of ethyl acetate, toluene, and isopropanol.

8. A method for preparing a high-temperature resistant adhesive for SMT tape, namely, the method for preparing the high-temperature resistant adhesive for SMT tape according to any one of claims 1 to 7, characterized in that, Includes the following steps: Step A, Preparation of acrylic pressure-sensitive adhesive copolymer: Step A1: A certain amount of acrylic monomers, a certain amount of hydroxyl-containing or functional acrylic monomers, and a certain amount of a third solvent are placed in a reaction vessel and mixed evenly to form a first mixed solution; Step A2: Add a certain amount of initiator to an Erlenmeyer flask and add a certain amount of a third solvent to dissolve it, thus preparing an initiator solution of a specific concentration; divide the initiator solution into 5 to 15 portions and place them into drop containers respectively; Step A3: Under nitrogen atmosphere protection, heat the first mixture to 90-100℃. When the first mixture in the reactor shows reflux and foaming, add the first part of the initiator solution. Then add the initiator solution every 28-32 minutes to carry out the segmented free radical polymerization reaction in the solution until only three parts of initiator solution remain, and obtain a polyacrylate solution with a wide molecular weight distribution. Step A4: After the dropwise addition is completed, adjust the newly formed polyacrylate solution in step A3 to 80-90°C and carry out the first heat preservation reaction for 0.5-2 hours; Step A5: Then add the remaining three portions of initiator solution in three more portions. After each addition of initiator solution, maintain the temperature range for 0.5 to 2 hours. The holding time after the last addition of initiator solution is 0.5 to 3 hours. Step A6: Finally, cool the newly formed third mixed solution in step A5 to below 40°C, then add a certain amount of third solvent to dilute it so that its solid content reaches a certain value. After stirring and filtering, the acrylic pressure-sensitive adhesive copolymer is obtained. Step B: Prepare a curing agent, the curing agent comprising polyetheramine, bismaleimide, and a second solvent, the second solvent comprising ethyl acetate and isopropanol, the curing agent being modified by the following steps: Step B1: Add a certain amount of polyetheramine to a four-necked flask, add a certain amount of ethyl acetate to dissolve it, and stir in a water bath at a certain temperature of 50-100℃ for a period of time to obtain the ninth mixed solution. Step B2: Add a certain amount of bismaleimide to a beaker, add a certain amount of ethyl acetate to dissolve it, stir and react for a period of time to obtain the eighth mixed solution; Step B3: Next, add the eighth mixed solution obtained in step B2 to the ninth mixed solution in step B1, and continue to add and stir under the temperature conditions of step B1 until the eighth mixed solution is completely added to obtain the seventh mixed solution. Step B4: Rinse the beaker used in step B3 with a certain amount of isopropanol. Add the rinse solution to the seventh mixed solution in step B3. Continue to stir and react for another period of time under the temperature conditions in step B1 above to obtain the curing agent. After bottling, seal and refrigerate. Step C, preparing the adhesive for SMT high-temperature resistant tape: Step C1: First, weigh out a certain amount of the acrylic pressure-sensitive adhesive copolymer from step A, a certain amount of the curing agent from step B, and a certain amount of the first solvent; Step C2: Add the acrylic pressure-sensitive adhesive copolymer to the reaction vessel, then add the first solvent to dilute it, and stir until homogeneous; Step C3: Next, add the curing agent and continue stirring for a period of time to ensure that the system is fully dispersed, and you will get the adhesive for SMT high-temperature resistant tape.

9. The method for preparing the SMT high-temperature resistant tape adhesive according to claim 8, characterized in that: In step B1, the mass ratio of the polyetheramine to ethyl acetate is 100:(60-70); in step B2, the mass ratio of the bismaleimide to polyetheramine is (0.5-15):100, and the mass ratio of the ethyl acetate to polyetheramine is (30-40):100; in step B4, the mass ratio of the isopropanol to polyetheramine is (40-50):

100.

10. A method for preparing high-temperature resistant tape for SMT, characterized in that, The method for preparing SMT high-temperature resistant tape adhesive according to claim 8 or 9 further includes the following steps: Step D: Apply the SMT high-temperature resistant tape adhesive prepared in step C3 to any surface of a PI film of a certain thickness to form an adhesive layer with a thickness of 10-30 micrometers. Add a release film of a certain thickness on the adhesive layer, with the release surface of the release film facing the adhesive surface of the adhesive layer, to obtain a semi-finished product of SMT high-temperature resistant tape. Place the semi-finished product of SMT high-temperature resistant tape in an oven and cure it at a certain temperature for a period of time. Then take it out and cool it to room temperature to obtain the SMT high-temperature resistant tape.

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