Wafer spiral line laser processing control system and control method thereof

Abstract

The invention relates to a wafer helix laser processing control system and a control method. An industrial computer is connected with an ACS master station; the ACS master station is connected with the UDMxa driving module, and the UDMxa driving module is connected with the six-axis PEG laser control module; the UDMxa driving module is connected with the X-axis motion unit and the Y-axis motion unit; an X-axis grating ruler reading head is connected with an X-axis grating ruler signal input interface, and an X-axis grating ruler signal output interface is connected with an X-axis grating feedback interface; a Y-axis grating ruler reading head is connected with a Y-axis grating ruler signal input interface, and a Y-axis grating ruler signal output interface is connected with a Y-axis grating feedback interface; a signal input interface of the X-axis grating ruler and a signal input interface of the Y-axis grating ruler are respectively connected with a differential-to-unipolar circuit, the differential-to-unipolar circuit is connected to an FPGA (Field Programmable Gate Array), the FPGA is connected with a CPU (Central Processing Unit), and the CPU is connected with an EtherCAT. Spiral machining is achieved, and X-Y axis interpolation motion is adopted.

Description

Technical Field

[0001] This invention relates to a control system and control method for wafer spiral laser processing. Background Technology

[0002] Micro-LED is considered a core direction for next-generation display technology due to its advantages such as high brightness, low power consumption, and long lifespan. However, during the manufacturing process, Micro-LED chips need to be peeled off from the sapphire substrate and transferred to a temporary substrate. The UV bonding adhesive used in the current process has a high absorption rate of ultraviolet laser, which leads to damage to the adhesive material during laser peeling, affecting chip quality and subsequent mass transfer efficiency.

[0003] During laser exfoliation, the thermal decomposition and volatilization caused by laser energy, the release of pre-stored gas inside the adhesive layer, the interface delamination caused by thermal stress, and the coupling effect of material absorption lead to the generation of bubbles. These bubbles will affect the stability of the exfoliation process, the integrity of the device structure, and may cause problems such as local chip microcracks.

[0004] The spiral processing method helps to assist in the exhaust of gas by centrifugal force. Centrifugal force is applied during the peeling process, and inertial force is used to throw the gas to the edge. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a wafer spiral laser processing control system and its control method.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] The wafer spiral laser processing control system is characterized by:

[0008] The industrial computer is connected to the ACS master station;

[0009] The ACS master station is connected to the UDMxa driver module;

[0010] The UDMxa drive module is connected to the six-axis PEG laser control module;

[0011] The UDMxa drive module is connected to the X-axis motion unit and Y-axis motion unit of the XY-axis machining platform;

[0012] The X-axis motion unit is equipped with an X-axis grating ruler reading head, which is connected to the X-axis grating ruler signal input interface of the six-axis PEG laser control module. The X-axis grating ruler signal output interface of the six-axis PEG laser control module is connected to the X-axis grating feedback interface of the UDMxa drive module.

[0013] The Y-axis motion unit is equipped with a Y-axis grating ruler reading head, which is connected to the Y-axis grating ruler signal input interface of the six-axis PEG laser control module. The Y-axis grating ruler signal output interface of the six-axis PEG laser control module is connected to the Y-axis grating feedback interface of the UDMxa drive module.

[0014] The X-axis grating ruler signal input interface is connected to the second differential-to-unipolar circuit, and the Y-axis grating ruler signal input interface is connected to the first differential-to-unipolar circuit. The second differential-to-unipolar circuit and the first differential-to-unipolar circuit are connected to the FPGA. The FPGA is connected to the CPU, and the CPU is connected to the EtherCAT circuit.

[0015] Furthermore, in the aforementioned wafer spiral laser processing control system, the industrial computer communicates with the ACS master station via the TCP / IP protocol.

[0016] Furthermore, in the aforementioned wafer spiral laser processing control system, the ACS master station communicates with the UDMxa driver module via the EtherCAT bus protocol.

[0017] Furthermore, in the aforementioned wafer spiral laser processing control system, the UDMxa drive module communicates with the six-axis PEG laser control module via the EtherCAT bus protocol.

[0018] Furthermore, in the aforementioned wafer spiral laser processing control system, the UDMxa drive module is connected to the X-axis motion unit of the XY-axis processing platform via its X-axis motor drive interface.

[0019] Furthermore, in the aforementioned wafer spiral laser processing control system, the UDMxa drive module is connected to the Y-axis motion unit of the XY-axis processing platform via its Y-axis motor drive interface.

[0020] Furthermore, in the aforementioned wafer spiral laser processing control system, the UDMxa drive module is an ACS motion control servo system driver used to control the movement of the X-axis motion unit and the Y-axis motion unit of the XY-axis processing platform. The X-axis grating ruler feedback interface and the Y-axis grating ruler feedback interface of the UDMxa drive module acquire the position signals of the grating ruler reading heads of the X-axis motion unit and the Y-axis motion unit in real time, and perform full closed-loop control of the XY-axis processing platform.

[0021] Furthermore, in the aforementioned wafer spiral laser processing control system, the six-axis PEG laser control module includes six grating ruler signal interfaces for receiving axis grating ruler signals, six differential-to-unipolar signal circuits, an FPGA, a CPU, and an ETHERCAT circuit. Each grating ruler signal interface is connected to the FPGA via a differential-to-unipolar circuit. The FPGA and CPU are connected via an SPI bus, and the CPU and ETHERCAT circuit are connected via an SPI bus. The laser control signal SMA interface is connected to the FPGA output interface.

[0022] The present invention provides a method for controlling laser processing of wafer spirals, comprising the following steps:

[0023] 1) The industrial computer controls the X-axis and Y-axis motion units of the XY-axis machining platform via the ACS master station. The X-axis and Y-axis grating ruler reading heads output incremental ABZ phase signals to the X-axis and Y-axis grating feedback interfaces of the UDMxa drive module, forming a fully closed-loop motion control system. This system controls the trajectory movement of the motion units and monitors and acquires the positions of each motion axis in real time. The six-axis PEG laser control module has six grating ruler signal channels, namely the X / Y / Z / W / E / F axis grating ruler signal channels. Utilizing the six-axis PEG laser control module... The X / Y axis grating ruler signal channels consist of a complete acquisition channel formed by the X-axis grating ruler signal input and output interfaces of the six-axis PEG laser control module, connected in series between the X-axis grating ruler reading head and the servo X-axis grating feedback interface of the UDMxa drive module. The Y-axis grating ruler signal input and output interfaces of the six-axis PEG laser control module form an independent acquisition channel, connected in series between the Y-axis grating ruler reading head and the Y-axis grating feedback interface of the UDMxa drive module. Through this series-connected position signal acquisition channel, the position coordinates of the XY-axis machining platform are obtained in real time.

[0024] 2) The industrial computer sends the original start and end point data of the straight-line cutting to the ACS master station motion control card;

[0025] 3) The motion control card of the ACS master station sends the start and end point data of the straight line cutting and the point spacing of the laser landing point to the six-axis PEG laser control module through the EtherCAT protocol. The EtherCAT circuit of the six-axis PEG laser control module receives the instruction data from the ACS master station and transmits it to the CPU. After the CPU parses the instruction, it sends the specific control parameters to the FPGA through the SPI bus to generate the point coordinates of each spiral line cutting, that is, the position coordinates of each chip. The cutting is carried out from the outermost circle of the wafer inward towards the center of the wafer.

[0026] 4) The motion control card of the ACS master station obtains the position coordinate data of the fitted spiral machining trajectory from the FPGA of the six-axis PEG laser control module, which are the X-axis and Y-axis trajectory coordinates respectively; and realizes the movement of the spiral trajectory through the motion control Line interpolation motion command of the ACS master station.

[0027] 5) The six-axis PEG laser control module monitors the trajectory coordinates ABZ phase signals of the XY axis machining platform in real time through the X-axis grating ruler signal input interface and the Y-axis grating ruler signal input interface. The ABZ phase signals of the XY axis machining platform are converted into TTL single-ended signals through differential-to-unipolar circuit one and differential-to-unipolar circuit two and transmitted to the FPGA. The FPGA generates a trigger TTL signal by comparing the position and controls the switching light of the laser to realize the spiral processing of the wafer.

[0028] Furthermore, in the aforementioned wafer spiral laser processing control method, the motion control card of the ACS master station controls the XY-axis processing platform to control the trajectory path movement of the wafer spiral processing; the six-axis PEG laser control module monitors the movement position of the XY-axis processing platform in real time through the FPGA, compares it with the wafer die position planned by the FPGA in real time, and generates a trigger TTL signal through the position triggering, which controls the switching light of the laser to realize the wafer spiral processing.

[0029] Compared with the prior art, the present invention has significant advantages and beneficial effects, specifically reflected in the following aspects:

[0030] ①This invention achieves spiral processing of wafer chips through a UDMxa drive module, a six-axis PEG laser control module, and an XY-axis processing platform. The ACS master station is connected to the UDMxa drive module, which is connected to the motion units of the two XY-axis processing platforms. Each motion unit is equipped with a grating ruler reading head. The industrial control computer controls the motion units to perform interpolation motion through the ACS master station. The incremental AB phase signals output by the grating ruler reading heads form a closed loop to control the trajectory motion of each motion unit, and to control and acquire the position of each axis in real time. The X / Y axis grating ruler signal input / output interface of the six-axis PEG laser control module is connected in series with the reading head and the UDMxa control loop to capture the platform motion coordinates in real time.

[0031] ② The industrial control computer sends the start and end point data of the straight line cutting and the point spacing of the laser landing point to the six-axis PEG laser control module through the ACS master station. The six-axis PEG laser control module transmits the data to the FPGA for data processing, generating the point coordinates of each spiral cutting circle, that is, the position coordinates of each chip. The cutting is carried out from the outermost circle of the wafer towards the center of the wafer.

[0032] ③ The spiral laser processing method helps to assist in the exhaust of gas by centrifugal force; the spiral processing method applies centrifugal force during the peeling process and uses inertial force to throw the gas to the edge, thereby improving the yield of the laser peeling process.

[0033] ④ The spiral processing method of this invention uses XY axis interpolation motion. The spiral processing path is the arrangement path of the wafer chips. It does not require acceleration or deceleration motion. Processing is carried out from the outer circle to the inner circle, which significantly improves production efficiency.

[0034] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing specific embodiments of the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0035] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 : A schematic diagram of the system architecture of this invention. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this invention, directional and ordinal terms are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0039] like Figure 1As shown, the wafer spiral laser processing control system includes a UDMxa drive module 102 and a six-axis PEG laser control module 107. The six-axis PEG laser control module 107 includes an EtherCAT circuit 108, a CPU 109, an FPGA 110, a differential-to-unipolar circuit one 111, and a differential-to-unipolar circuit two 112.

[0040] Industrial computer 100 communicates with ACS master station 101 via TCP / IP protocol;

[0041] The ACS master station 101 communicates with the UDMxa drive module 102 via the EtherCAT protocol, and the UDMxa drive module 102 communicates with the six-axis PEG laser control module 107 via the EtherCAT protocol; the UDMxa drive module 102 is the driver of the ACS motion control servo system.

[0042] UDMxa drive module 102 is connected to the X-axis motion unit 115 of the XY-axis machining platform through its X-axis motor drive interface 103; UDMxa drive module 102 is connected to the Y-axis motion unit 117 of the XY-axis machining platform through its Y-axis motor drive interface 104.

[0043] An X-axis grating ruler reading head 116 is installed on the X-axis motion unit 115. The X-axis grating ruler reading head 116 is connected to the X-axis grating ruler signal input interface 113 of the six-axis PEG laser control module 107. The X-axis grating ruler signal output interface 120 of the six-axis PEG laser control module 107 is connected to the X-axis grating feedback interface 105 of the UDMxa drive module 102.

[0044] The Y-axis motion unit 117 is equipped with a Y-axis grating ruler reading head 118, which is connected to the Y-axis grating ruler signal input interface 114 of the six-axis PEG laser control module 107. The Y-axis grating ruler signal output interface 119 of the six-axis PEG laser control module 107 is connected to the Y-axis grating feedback interface 106 of the UDMxa drive module 102.

[0045] The X-axis grating ruler signal input interface 113 is connected to the differential-to-unipolar circuit 112, and the Y-axis grating ruler signal input interface 114 is connected to the differential-to-unipolar circuit 111. The differential-to-unipolar circuit 112 and the differential-to-unipolar circuit 111 are connected to the FPGA 110. The FPGA 110 is connected to the CPU 109, and the CPU 109 is connected to the EtherCAT circuit 108 via the SPI bus.

[0046] Among them, the UDMxa drive module 102 is an ACS motion control servo system driver, model: UDMxa2B00NYNNNN. This drive module controls the movement of the X-axis motion unit 115 and the Y-axis motion unit 117 of the XY-axis machining platform, and collects the position signals of the X-axis motion unit 115 and the Y-axis motion unit 117 in real time, and performs full closed-loop control of the XY-axis machining platform.

[0047] The six-axis PEG laser control module 107 includes six grating ruler signal interfaces for receiving axis grating ruler signals, six differential-to-unipolar signal circuits, an FPGA 110, a CPU 109, and an ETHERCAT circuit 108. Each grating ruler signal interface is connected to the FPGA via a differential-to-unipolar circuit. The FPGA and CPU are connected via an SPI bus, and the CPU and ETHERCAT circuit are connected via an SPI bus. The laser control signal SMA interface 121 is connected to the output interface of the FPGA 110. The six-axis PEG laser control module, based on the preset X / Y axis laser landing point coordinates of the wafer chip, compares the X / Y axis position coordinates in real time during movement. It then triggers laser control pulse control signals through the PEG position to precisely control the laser's landing point on the wafer, thus achieving wafer processing.

[0048] The present invention provides a method for controlling laser processing of wafer spirals, comprising the following steps:

[0049] 1) The industrial computer 100 controls the X-axis motion unit 115 and Y-axis motion unit 117 of the XY-axis machining platform through the ACS master station 101. The X-axis grating ruler reading head 116 and the Y-axis grating ruler reading head 118 output incremental ABZ phase signals to the X-axis grating feedback interface 105 and Y-axis grating feedback interface 106 of the UDMxa drive module 102 to form a fully closed-loop motion control system, controlling the trajectory movement of the motion units and controlling and acquiring the position of each motion axis in real time; the six-axis PEG laser control module 107 has six grating ruler signal channels, namely the X / Y / Z / W / E / F axis grating ruler signal channels. This invention uses the six-axis PEG laser control module 107. The X / Y axis grating ruler signal channels of the 7-axis PEG laser control module 107 consist of an X-axis grating ruler signal input interface 113 and an X-axis grating ruler signal output interface 120, which form a complete acquisition channel and are connected in series between the X-axis grating ruler reading head 116 and the UDMxa drive module servo X-axis grating feedback interface 105. The Y-axis grating ruler signal input interface (114) and the Y-axis grating ruler signal output interface 119 of the six-axis PEG laser control module 107 form an independent acquisition channel and are connected in series between the Y-axis grating ruler reading head 118 and the UDMxa drive module Y-axis grating feedback interface 106. Through the series position signal acquisition channel, the position coordinates of the XY axis machining platform are obtained in real time.

[0050] 2) The industrial computer 100 sends the original start and end point data of the linear cutting to the motion control card of the ACS master station 101 via the TCP / IP protocol;

[0051] 3) The motion control card of the ACS master station 101 sends the data of the start and end points of the straight line cutting and the point spacing of the laser landing point to the six-axis PEG laser control module 107 through the EtherCAT protocol. The six-axis PEG laser control module 107 transmits the data to the FPGA 110 for data processing through the SPI bus protocol, generating the point coordinates of each spiral line cutting, i.e. the position of each chip, and cutting from the outermost circle of the wafer inward towards the center of the wafer.

[0052] 4) The motion control card of the ACS master station 101 obtains the position coordinate data of the fitted spiral processing trajectory from the FPGA110 of the six-axis PEG laser control module (107) via the EtherCAT protocol, which are the X-axis / Y-axis trajectory coordinates respectively; and realizes the movement of the spiral trajectory by the motion control Line interpolation motion command of the ACS master station 101.

[0053] 5) The six-axis PEG laser control module 107 monitors the trajectory coordinate ABZ phase signal of the XY axis machining platform in real time through the X-axis grating ruler signal input interface 113 and the Y-axis grating ruler signal input interface 114. It converts the XY axis machining platform ABZ phase signal into TTL single-ended signal through differential to unipolar circuit one 111 and differential to unipolar circuit two 112 and transmits it to FPGA 110. FPGA 110 generates a 5V trigger TTL signal through position comparison to control the switching of the laser beam.

[0054] The motion control card of the ACS master station 101 controls the XY axis machining platform and controls the trajectory path movement of the wafer spiral machining. The six-axis PEG laser control module 107 monitors the movement position of the XY axis machining platform in real time through FPGA 110 and compares it with the wafer die position planned by FPGA circuit 110 in real time. Through position triggering, the laser control signal interface 121 generates a trigger 5V TTL signal to control the switching light of the laser and realize the wafer spiral machining.

[0055] In summary, this invention achieves helical wafer chip processing through a UDMxa drive module, a six-axis PEG laser control module, and an XY-axis machining platform. The ACS motion master controller (ACS master station) is connected to the UDMxa drive module, which in turn is connected to the motion units of the two XY-axis machining platforms. Each motion unit is equipped with a grating ruler reading head, which is connected to its corresponding UDMxa drive module. The six-axis PEG laser control module is connected to the ACS motion controller via an ETHERCAT bus. The industrial control computer controls the motion units to perform interpolation motion through the ACS master station. The incremental AB phase signals output by the grating ruler reading heads form a closed loop, controlling the trajectory motion of each motion unit and real-time control and acquisition of the position of each axis. The X / Y-axis grating ruler signal input / output interface of the six-axis PEG laser control module is connected in series with the reading head and the UDMxa control loop to capture the platform motion coordinates in real time. The industrial control computer sends the start and end point data of the straight line cutting and the point spacing of the laser landing point to the six-axis PEG laser control module through the ACS master station. The six-axis PEG laser control module transmits the data to the FPGA for data processing, generating the point coordinates of each spiral cutting circle, that is, the position coordinates of each chip. The cutting is carried out from the outermost circle of the wafer towards the center of the wafer.

[0056] Because existing laser lift-off processes cannot avoid the problem of air bubbles being generated inside the adhesive layer due to laser energy, the formation of air bubbles can affect the stability of the lift-off process, the integrity of the device structure, and cause localized microcracks in the chip. A spiral laser processing method helps to assistedly expel air using centrifugal force. The spiral processing method applies centrifugal force during the lift-off process, using inertial force to throw the gas towards the edge, thereby improving the yield of the laser lift-off process.

[0057] Existing processing methods are linear, requiring laser light to be emitted during the uniform speed phase of the axis. Each linear motion involves acceleration and deceleration time, resulting in a cumulative loss of all acceleration and deceleration time when processing an entire wafer. The spiral processing method of this invention uses XY axis interpolation motion, and the spiral processing path is the arrangement path of the wafer chips. It does not require acceleration and deceleration motion and processes from the outer circle to the inner circle, significantly improving production efficiency.

[0058] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the invention should be included within the scope of protection of the invention. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0059] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

[0060] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A wafer spiral laser processing control system, characterized in that: The industrial computer (100) is connected to the ACS master station (101); The ACS master station (101) is connected to the UDMxa driver module (102); The UDMxa drive module (102) is connected to the six-axis PEG laser control module (107); The UDMxa drive module (102) is connected to the X-axis motion unit (115) and Y-axis motion unit (117) of the XY-axis machining platform; An X-axis grating ruler reading head (116) is installed on the X-axis motion unit (115). The X-axis grating ruler reading head (116) is connected to the X-axis grating ruler signal input interface (113) of the six-axis PEG laser control module (107). The X-axis grating ruler signal output interface (120) of the six-axis PEG laser control module (107) is connected to the X-axis grating feedback interface (105) of the UDMxa drive module (102). The Y-axis motion unit (117) is equipped with a Y-axis grating ruler reading head (118). The Y-axis grating ruler reading head (118) is connected to the Y-axis grating ruler signal input interface (114) of the six-axis PEG laser control module (107). The Y-axis grating ruler signal output interface (119) of the six-axis PEG laser control module (107) is connected to the Y-axis grating feedback interface (106) of the UDMxa drive module (102). The X-axis grating ruler signal input interface (113) is connected to the differential-to-unipolar circuit two (112), the Y-axis grating ruler signal input interface (114) is connected to the differential-to-unipolar circuit one (111), the differential-to-unipolar circuit two (112) and the differential-to-unipolar circuit one (111) are connected to the FPGA (110), the FPGA (110) is connected to the CPU (109), and the CPU (109) is connected to the EtherCAT circuit (108).

2. The wafer spiral laser processing control system according to claim 1, characterized in that: The industrial computer (100) communicates with the ACS master station (101) via TCP / IP protocol.

3. The wafer spiral laser processing control system according to claim 1, characterized in that: The ACS master station (101) communicates with the UDMxa driver module (102) via the EtherCAT bus protocol.

4. The wafer spiral laser processing control system according to claim 1, characterized in that: The UDMxa drive module (102) communicates with the six-axis PEG laser control module (107) via the EtherCAT bus protocol.

5. The wafer spiral laser processing control system according to claim 1, characterized in that: The UDMxa drive module (102) is connected to the X-axis motion unit (115) of the XY-axis machining platform via its X-axis motor drive interface (103).

6. The wafer spiral laser processing control system according to claim 1, characterized in that: The UDMxa drive module (102) is connected to the Y-axis motion unit (117) of the XY-axis machining platform via its Y-axis motor drive interface (104).

7. The wafer spiral laser processing control system according to claim 1, characterized in that: The UDMxa drive module (102) is an ACS motion control servo system driver used to control the movement of the X-axis motion unit (115) and Y-axis motion unit (117) of the XY-axis machining platform. The X-axis grating ruler feedback interface (105) and Y-axis grating ruler feedback interface (106) of the UDMxa drive module (102) collect the position signals of the grating ruler reading heads of the X-axis motion unit and Y-axis motion unit in real time, and perform full closed-loop control of the XY-axis machining platform.

8. The wafer spiral laser processing control system according to claim 1, characterized in that: The six-axis PEG laser control module (107) includes six grating ruler signal interfaces for receiving axis grating ruler signals, six differential-to-unipolar signal circuits, an FPGA, a CPU, and an ETHERCAT circuit. Each grating ruler signal interface is connected to the FPGA via a differential-to-unipolar circuit. The FPGA and CPU are connected via an SPI bus, and the CPU and ETHERCAT circuit are connected via an SPI bus. The laser control signal SMA interface is connected to the FPGA output interface.

9. A method for controlling laser processing of wafer spirals, characterized in that: Includes the following steps: 1) The industrial computer (100) controls the X-axis motion unit (115) and Y-axis motion unit (117) of the XY-axis machining platform through the ACS master station (101). The X-axis grating ruler reading head (116) and the Y-axis grating ruler reading head (118) output incremental ABZ phase signals to the X-axis grating feedback interface (105) and Y-axis grating feedback interface (106) of the UDMxa drive module (102) to form a fully closed-loop motion control system, which controls the trajectory movement of the motion unit and controls and collects the position of each motion axis in real time; the six-axis PEG laser control module (107) has six grating ruler signal channels, namely the X / Y / Z / W / E / F axis grating ruler signal channels. The six-axis PEG laser control module (107) is used to control the X-axis motion unit (115) and Y-axis motion unit (117) of the XY-axis machining platform through the ACS master station (101). The X / Y axis grating ruler signal channel of the six-axis PEG laser control module (107) consists of the X-axis grating ruler signal input interface (113) and the X-axis grating ruler signal output interface (120), which are connected in series between the X-axis grating ruler reading head (116) and the UDMxa drive module servo X-axis grating feedback interface (105); the Y-axis grating ruler signal input interface (114) and the Y-axis grating ruler signal output interface (119) of the six-axis PEG laser control module (107) consist of an independent acquisition channel, which is connected in series between the Y-axis grating ruler reading head (118) and the UDMxa drive module Y-axis grating feedback interface (106). Through the series position signal acquisition channel, the position coordinates of the XY axis machining platform are obtained in real time. 2) The industrial computer (100) sends the original start and end point data of the straight line cutting to the motion control card of the ACS master station (101); 3) The motion control card of the ACS master station (101) sends the data of the start and end points of the straight line cutting and the point spacing of the laser landing point to the six-axis PEG laser control module (107) through the EtherCAT protocol. The EtherCAT circuit (108) of the six-axis PEG laser control module (107) receives the instruction data from the ACS master station (101) and transmits it to the CPU (109). After the CPU parses the instruction, it sends the specific control parameters to the FPGA (110) through the SPI bus to generate the point coordinates of each spiral line cutting, that is, the position coordinates of each chip. The cutting is carried out from the outermost circle of the wafer to the center of the wafer. 4) The motion control card of the ACS master station (101) obtains the position coordinate data of the fitted spiral processing trajectory from the FPGA (110) of the six-axis PEG laser control module (107), which are the X-axis / Y-axis trajectory coordinates respectively; the motion of the spiral trajectory is realized by the motion control Line interpolation motion command of the ACS master station (101); 5) The six-axis PEG laser control module (107) monitors the trajectory coordinate ABZ phase signal of the XY axis machining platform in real time through the X-axis grating ruler signal input interface (113) and the Y-axis grating ruler signal input interface (114). The ABZ phase signal of the XY axis machining platform is converted into a TTL single-ended signal through differential to unipolar circuit one (111) and differential to unipolar circuit two (112) and transmitted to the FPGA (110). The FPGA (110) generates a trigger TTL signal through position comparison and controls the switching light of the laser to realize the spiral processing of the wafer.

10. The wafer spiral laser processing control method according to claim 9, characterized in that: The motion control card of the ACS master station (101) controls the XY axis processing platform and controls the trajectory path movement of the wafer spiral processing; the six-axis PEG laser control module (107) monitors the movement position of the XY axis processing platform in real time through the FPGA (110) and compares it with the wafer die position planned by the FPGA (110) in real time. Through position triggering, the laser control signal SMA interface (121) generates a trigger TTL signal to control the switching light of the laser and realize the spiral processing of the wafer.

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