Hardware-in-loop simulation method and device for RTP equipment, equipment and medium

Abstract

The invention discloses a hardware-in-loop simulation method, device and equipment for RTP equipment and a medium, and belongs to the technical field of RTP equipment simulation, and the hardware-in-loop simulation method comprises the following steps: S1, obtaining a voltage signal of a temperature controller of the RTP equipment; s2, inputting the voltage signal into a preset bulb power model to obtain a power signal; s3, inputting the power signal into a preset heating model to obtain a temperature signal; and S4, the temperature signal and a preset target temperature are input into an RTP equipment temperature controller, and a control voltage signal is generated in the temperature controller through calculation. According to the method, real controller hardware is combined with a high-precision virtual model, the whole RTP equipment temperature control process is accurately reproduced, and safe and low-cost early verification of a control algorithm is realized; the problems that traditional HIL simulation depends on a special industrial personal computer, the system is complex and the cost is high are solved, a high-fidelity test scheme which is simple in connection and flexible in deployment is provided, and the research and development risk and the equipment loss are remarkably reduced.

Description

Technical Field

[0001] This invention belongs to the field of rapid thermal processing equipment simulation technology, and particularly relates to a hardware-in-the-loop simulation method, apparatus, equipment and medium for RTP equipment. Background Technology

[0002] Rapid Thermal Processing (RTP) is an advanced monolithic heat treatment process. Compared to traditional batch heat treatment processes, RTP is more suitable for miniaturizing the feature size of integrated circuits and is an indispensable process in advanced semiconductor manufacturing. RTP equipment is one of the key pieces of equipment in the chip industry, and temperature control of monolithic wafers is a core technology of paramount importance. A typical RTP heating system is the most important functional component of this equipment, mainly including a heating chamber, a magnetic levitation device, halogen tungsten lamps, and a reflector. The measurement and control system mainly performs closed-loop temperature control, cooling gas control, and other auxiliary system control functions, and also has the function of communicating with a host computer. It includes functional units such as a halogen tungsten lamp control power amplifier unit, a temperature control board, a temperature sensor, and its signal conditioning transmitter.

[0003] In system applications, most processes have strict requirements on the temperature profile of the wafer, thus necessitating not only rapid heating but also rapid cooling. Cooling can be achieved simply and effectively by introducing low-temperature or room-temperature gases, and the type of gas introduced may vary depending on the specific process requirements. Furthermore, for safety reasons, the heating chamber walls are cooled by circulating cooling water.

[0004] Hardware-in-the-loop (HIL) simulation is a methodology for developing and testing embedded systems. It involves connecting the actual input and output (I / O) interfaces of the controller hardware to a virtual environment used to simulate the physical system. HIL testing is used to verify hardware-software integration and is part of the certification process in aerospace, automotive, and other industries. A key advantage of HIL simulation is its ability to support early testing of control algorithms on the hardware. By allowing engineers to evaluate scenarios and test I / O connections before all physical components are available, it reduces risk and accelerates development, confirming system robustness without jeopardizing expensive equipment.

[0005] Hardware-in-the-loop (HIL) simulation works by interfacing the real controller hardware with the simulated physical system (called the controlled object). The connection between the real controller and the simulated controlled object consists of real analog and digital I / O. These typically include communication protocols such as UDP, TCP, CAN, and other industry-specific standards. The communication interface and its actual setup, timing, and wiring are a critical component of HIL testing. These aspects cannot be accurately reproduced in Model-in-the-Loop (MIL) or Software-in-the-Loop (SIL) simulations. Existing systems for rapid thermal processing equipment are complex, require specialized industrial PCs, and are costly. Summary of the Invention

[0006] Based on the technical problems existing in the prior art, the present invention provides a hardware-in-the-loop simulation method, apparatus, device and medium for RTP devices.

[0007] According to a first aspect of the technical solution of the present invention, a hardware-in-the-loop simulation method for an RTP device is provided, comprising the following steps: Step S1: Obtain the voltage signal from the temperature controller of the RTP device; Step S2: Input the voltage signal into a preset bulb power model to obtain a power signal; Step S3: Input the power signal into the preset heating model to obtain the temperature signal; Step S4: Generate a control voltage signal based on the temperature signal and the preset target temperature. The voltage signal is used to control the temperature controller of the RTP device.

[0008] A further improvement of the present invention is that, in step S1, the voltage signal is acquired via serial communication.

[0009] A further improvement of the present invention is that, in step S2, the bulb power model is a mathematical model based on the voltage-power correspondence, which is used to simulate the actual output power of the halogen tungsten lamp array to obtain the power signal according to the input voltage signal.

[0010] A further improvement of the present invention is that, in step S3, the heating model is established according to the blackbody radiation law, and the heating model is used to simulate the dynamic temperature change process of the wafer in the reaction cavity based on the input power signal to obtain the temperature signal.

[0011] A further improvement of the present invention is that, in step S4, when the temperature signal is less than the target temperature, the control voltage signal is used to increase the voltage of the RTP device temperature controller; When the temperature signal is greater than the target temperature, the control voltage signal is used to reduce the voltage of the RTP device temperature controller; When the temperature signal is equal to the target temperature, the control voltage signal is used to control the voltage of the RTP device temperature controller to remain constant.

[0012] A further improvement of the present invention is that it also includes step S5: generating a graphical temperature curve based on the temperature signal and a preset target temperature.

[0013] According to a second aspect of the technical solution of the present invention, a hardware-in-the-loop simulation apparatus for an RTP device is provided, which is based on the above-described hardware-in-the-loop simulation method for an RTP device, comprising: The data acquisition module is used to acquire the voltage signal from the temperature controller of the RTP device; The power simulation module is used to input the voltage signal into a preset bulb power model to obtain a power signal; The temperature simulation module is used to input the power signal into a preset heating model to obtain a temperature signal; The control module is used to generate a control voltage signal based on the temperature signal and the preset target temperature; RTP device temperature controller: used to generate a control voltage signal based on the temperature signal and the preset target temperature.

[0014] A further improvement of the present invention is that it also includes a display screen for adjusting the parameters of the RTP device temperature controller.

[0015] According to a third aspect of the technical solution of the present invention, an electronic device based on optical fiber data is provided, comprising: One or more processors; Storage device for storing one or more computer programs. When the one or more computer programs are executed by the one or more processors, the one or more processors implement a hardware-in-the-loop emulation method for an RTP device as described above.

[0016] According to a fourth aspect of the present invention, a computer-readable storage medium is provided, on which a computer program is stored, wherein when the computer program is executed by a processor, it implements the hardware-in-the-loop simulation method for an RTP device as described above.

[0017] Compared with the prior art, the above-mentioned technical solution of the present invention has the following beneficial technical effects: 1. This invention constructs a complete hardware-in-the-loop simulation process, from real controller voltage signal acquisition, bulb power model conversion, and heating model simulation to closed-loop control. This method combines real controller hardware with a high-precision virtual model to accurately reproduce the entire temperature control process of an RTP device in a digital environment, enabling safe and low-cost early verification of the control algorithm. It solves the problems of traditional HIL simulation relying on dedicated industrial control computers, system complexity, and high costs, providing a high-fidelity testing solution that is simple to connect and flexible to deploy, significantly reducing R&D risks and equipment wear and tear.

[0018] 2. This invention acquires voltage signals through serial communication and utilizes standardized industrial protocols to achieve plug-and-play connection between the simulation system and the temperature controller. This method replaces expensive dedicated acquisition hardware with universal serial cables, significantly simplifying system setup and reducing costs and barriers to entry. The digital anti-interference characteristics of serial communication ensure accurate signal transmission, and its speed fully meets the timing requirements of temperature control. This method solves the problems of high interface customization and poor compatibility in HIL simulation, enabling general-purpose computers to quickly build test environments, significantly improving development efficiency and system portability.

[0019] 3. This invention uses a mathematical model based on the voltage-power correspondence as the bulb power model to accurately simulate the nonlinear input-output characteristics of a halogen tungsten lamp array. This model maps controller voltage commands to thermal power signals with high fidelity, ensuring that the behavior of the "heat source" in the simulation closely approximates physical reality. It solves the error accumulation problem caused by the simplification of power device characteristics in traditional simulations, providing an accurate and physically meaningful input foundation for subsequent temperature simulations, and enhancing the reliability of the entire simulation loop and the effectiveness of control algorithm verification.

[0020] 4. This invention establishes a heating model based on the blackbody radiation law and converts the power signal into a dynamic wafer temperature signal based on the principles of heat transfer. This model accurately reproduces the radiation-driven thermal process of the RTP process in digital space, and the output temperature signal reflects the true nonlinear dynamic characteristics. Compared to models that rely on experimental data or complex numerical calculations, this physical model has a clear structure and well-defined parameters, reducing modeling costs and complexity while ensuring real-time performance. It solves the problem of balancing simulation fidelity and computational efficiency, providing a highly realistic testing environment for the controller algorithm.

[0021] 5. This invention specifically defines a closed-loop logic for generating a control voltage signal based on temperature difference: the sign of the temperature difference determines the increase or decrease of the output voltage, while a zero temperature difference maintains the current output voltage. This logic fully replicates the feedback regulation essence of a real temperature control system, forming a "decision-response-evaluation" closed loop equivalent to actual operation. This allows the controller's dynamic performance (such as stability, response speed, and steady-state accuracy) to be fully tested in a virtual environment. This method overcomes the limitation of difficulty in verifying the controller's closed-loop performance when separated from real equipment, providing a safe and efficient platform for algorithm parameter tuning, limit testing, and robustness verification.

[0022] 6. This invention adds a step to generate graphical temperature curves, visualizing the time-series data (such as real-time temperature and target temperature) in simulation as curves. This function provides testers with an intuitive analysis and diagnostic tool, facilitating rapid evaluation of control performance and identification of problems (such as overshoot and oscillation). It supports real-time monitoring and post-event backtesting, significantly improving the efficiency of recording, comparing, and reporting test data. This method solves the problems of unintuitive data observation and low analysis efficiency in HIL simulation, enhances the human-computer interaction experience, and makes the simulation process an interactive and optimizable design phase. Attached Figure Description

[0023] The accompanying drawings are provided to better understand the invention and are not intended to unduly limit the scope of the invention. Wherein: Figure 1 This is a flowchart of a hardware-in-the-loop simulation method for RTP devices according to the present invention; Figure 2 This is a structural block diagram of a hardware-in-the-loop simulation device for RTP equipment according to the present invention; Figure 3 This is a physical connection diagram of a hardware-in-the-loop simulation device for RTP equipment according to the present invention; Figure 4 This is a schematic diagram of the computer system structure for a hardware-in-the-loop simulation method for RTP devices according to the present invention. Detailed Implementation

[0024] The following description, in conjunction with the accompanying drawings, illustrates exemplary embodiments of the present invention, including various details to aid understanding. These details should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0025] Example 1 like Figure 1 As shown, a hardware-in-the-loop simulation method for RTP devices is provided, which includes the following steps: Step S1: Obtain the voltage signal from the temperature controller of the RTP device; Step S2: Input the voltage signal into a preset bulb power model to obtain a power signal; Step S3: Input the power signal into the preset heating model to obtain the temperature signal; Step S4: Input the temperature signal and the preset target temperature into the RTP device temperature controller, and the temperature controller generates a control voltage signal through calculation.

[0026] Step S1 captures the actual control commands (voltage signals) output by the temperature controller according to its internal algorithm in real time, thus introducing the dynamic behavior of the real controller into the simulation loop. This ensures that the simulation is based on the operating logic of the real controller hardware, avoiding issues such as hardware timing, interface compatibility, and signal integrity that pure software simulation may overlook, greatly improving the reliability of the test results and the accuracy of predicting the behavior of the final product. Step S2 completes the first physical conversion from electrical signal to thermal power. The voltage command output by the controller is converted into the thermal power that the heating system (halogen tungsten lamp array) should generate in actual operation. Through the built-in mathematical model based on the actual characteristics of the bulb, the nonlinear response characteristics of the heating element are accurately simulated, making the behavior of the "heat source" in the simulation environment highly realistic, laying an accurate input foundation for subsequent temperature simulation. Step S3 realizes the simulation of the core physical process from thermal power to temperature. Using a mathematical model built based on heat transfer theory, the dynamic change process of the wafer temperature field in the reaction chamber under a given heating power is simulated. The core thermal processes of the RTP device are reproduced in a virtual environment, enabling the calculation of real-time temperature changes at various points on the wafer under different power inputs. This generates a high-fidelity simulated temperature signal for feedback, replacing the expensive and difficult-to-reproduce high-temperature measurements in actual production. Step S4 closes the entire simulation loop and demonstrates proactive testing. Its function is to feed back the temperature signal generated in step S3 as a sensor measurement value to the real temperature controller; simultaneously, it injects a preset target temperature curve according to testing needs. The controller's algorithm calculates and outputs a new control voltage accordingly. This method allows direct communication with the temperature controller, enabling hardware-in-the-loop simulation without an industrial control computer. This solves the problems of high cost and system complexity in previous hardware-in-the-loop simulation systems, providing a simple and easy-to-operate hardware-in-the-loop simulation method for rapid thermal processing equipment. These four steps constitute a complete hardware-in-the-loop (HIL) simulation loop, starting from the real controller, transforming through a virtual controlled object (bulb and reaction chamber) model, and returning to the real controller. It makes full use of real controller hardware to ensure the authenticity of the test, and replaces the expensive physical heating and temperature measurement process with a high-fidelity mathematical model. Thus, while ensuring the reliability of the verification, it significantly reduces the cost, complexity and difficulty of operation of the simulation system.

[0027] Specifically, in step S1, the voltage signal is acquired via serial communication. Step S1 establishes a standardized, low-cost hardware interface, replacing the expensive and complex industrial control computer equipment used in traditional HIL simulations. Utilizing a common industrial serial communication protocol, plug-and-play connection with the RTP temperature controller is achieved, eliminating the need for customized dedicated acquisition hardware. Digital signal transmission ensures the accuracy and anti-interference capability of control commands. Dedicated signal conditioning boards and high-speed acquisition equipment are eliminated; only ordinary serial cables are required for signal interaction. The hardware connection is extremely simple, making the simulation system easy to build, port, and maintain. The serial communication rate fully meets the response cycle requirements of RTP temperature control. A test environment can be quickly deployed using a general-purpose computer, significantly improving development efficiency.

[0028] Specifically, in step S2, the bulb power model is a mathematical model based on the voltage-power correspondence, used to simulate the actual output power of the halogen tungsten lamp array to obtain the power signal based on the input voltage signal. The voltage-power correspondence is often expressed using a table with linear interpolation, as shown in Table 1. The bulb power model simulates the power characteristics of the bulb, with voltage as the input and power as the output.

[0029] Table 1 Voltage-Power Correspondence Table

[0030] Specifically, in step S3, the heating model is established based on the blackbody radiation law. This model is used to simulate the dynamic temperature change of the wafer within the reaction chamber based on the input power signal, obtaining a temperature signal. The input of the heating model is power, and the output is temperature. It is used to accurately reproduce the real thermal process dominated by radiation heat transfer in the RTP process in digital space. This ensures the physical credibility of the simulation, allowing the temperature signal fed back to the controller to accurately reflect the nonlinear dynamic characteristics of the wafer under radiation heating, providing a highly realistic testing environment for verifying the control algorithm. The heating model is based on universal physical principles, possessing excellent extrapolation and adaptability. It only requires adjusting key parameters such as emissivity and heat capacity to adapt to different equipment structures, greatly enhancing the versatility and application range of the simulation platform. Furthermore, compared to modeling methods that rely on massive experimental data or complex finite element calculations, the heating model has a clear structure and well-defined physical meanings for its parameters, significantly reducing the complexity and cost of modeling and maintenance while ensuring real-time simulation efficiency. Furthermore, the high-precision physical model makes it possible to safely and thoroughly verify the extreme performance and robustness of advanced control algorithms in a virtual environment, effectively avoiding the process and hardware losses caused by high-risk debugging on real equipment.

[0031] Specifically, in step S4, the temperature signal and the preset target temperature are input to the temperature controller of the RTP device, and the temperature controller generates a control voltage signal through calculation. When the temperature signal is greater than the target temperature, the control voltage signal is used to reduce the voltage of the RTP device temperature controller; When the temperature signal equals the target temperature, the control voltage signal is used to keep the voltage of the RTP device temperature controller constant. By comparing the simulated temperature signal with the preset target temperature in real time, and generating a corresponding control voltage signal based on the temperature difference, the closed-loop control logic and core verification mechanism of the entire hardware-in-the-loop simulation are constituted. The basic rule is as follows: when the simulated temperature signal is lower than the target temperature, the generated control voltage signal instructs the RTP device temperature controller to increase its output voltage, thereby driving the heating model to increase the simulated power input to catch up with the target temperature; conversely, when the temperature signal is higher than the target temperature, the control voltage signal instructs the controller to decrease the output voltage to reduce the heating power and cause the simulated temperature to drop back to the set value; when the two are equal, the control voltage signal maintains its current value, keeping the system stable in an equilibrium state. The dynamic adjustment process and feedback nature of the real temperature control system are completely reproduced in the virtual environment. Through this closed loop, every control decision of the controller (what voltage to output) will immediately generate a corresponding temperature response in the simulation model. This response is then fed back to the controller as the basis for its next decision. This cycle repeats, forming a "decision-response-evaluation" closed loop that is completely equivalent to actual operation.

[0032] Specifically, it also includes step S5: generating a graphical temperature curve based on the temperature signal and the preset target temperature. By acquiring the temperature signal and the target temperature over a period of time, a temperature curve is generated, which can be viewed during or after the simulation to show the data changing over time.

[0033] Example 2 like Figure 2 As shown, a hardware-in-the-loop simulation apparatus for RTP devices is provided, which is based on a hardware-in-the-loop simulation method for RTP devices described in Embodiment 1, and includes the following process modules: The data acquisition module is used to acquire the voltage signal from the temperature controller of the RTP device; The power simulation module is used to input the voltage signal into a preset bulb power model to obtain a power signal; The temperature simulation module is used to input the power signal into a preset heating model to obtain a temperature signal; The control module is used to generate a control voltage signal based on the temperature signal and the preset target temperature; The RTP device temperature controller is used to generate a control voltage signal based on the temperature signal and the preset target temperature.

[0034] Specifically, it also includes a display screen used to adjust the parameters of the RTP device temperature controller.

[0035] Specifically, the data acquisition module, power simulation module, temperature simulation module, and control module are all integrated into the computer. In practical use, for example... Figure 3 As shown, a small touchscreen is used as the display. The RTP device temperature controller is the controller used on the product equipment to control the wafer temperature and is powered by a 24V power supply. The temperature controller is connected to the small touchscreen via a 485 serial communication line, and the touchscreen is used to set the parameters in the temperature controller. The temperature controller is connected to a computer via another 485 serial communication line. The computer can be a general-purpose computer, such as a laptop or desktop. Matlab simulation software is installed on the computer to perform real-time simulation of the cavity model. The running speed of the Matlab software is adjusted to achieve the effect of real-time operation. In Matlab software, a model file can be created. Clicking the run button in the model file will start the model running. This process is also called simulation. The simulation ends after the running time is set on the model, thus completing one simulation. Each simulation involves a model file in Matlab, which contains a data acquisition module, a power simulation module, a temperature simulation module, and a control module. The simulation speed must be the same as the real time. Matlab software has a simulation speed adjustment option to adjust the simulation speed. Adjusting it to the real-time speed is sufficient.

[0036] The data acquisition module is used for data exchange with external systems. It receives voltage signals from the temperature controller and sends temperature, temperature settings, and rate settings to the temperature controller. Implementation method: By adding a communication module (Host Serial Setup) to the model and setting the general communication parameters, the serial communication configuration parameters can be set, enabling the reception of serial data transmitted from outside the computer. On the hardware side, data exchange with the temperature controller is performed via serial communication; therefore, one end of the 485 serial communication cable is connected to the serial communication interface on the temperature controller, and the other end is connected to the serial communication interface on the computer.

[0037] The power simulation module and temperature simulation module simulate the power characteristics of the bulb and use relevant heat transfer theories to simulate the dynamic changes in wafer temperature. Therefore, the input of these models is voltage, and the output is temperature value, which is a simulation of the actual machine temperature measurement value. The bulb power model and the heating model are two separate models, and the simulation is performed in a specific order. The bulb power model is calculated first, with voltage as the input and power as the output; then the heating model is calculated, with power as the input and temperature as the output. The bulb power model is generally provided by the bulb supplier. The heating model models the wafer temperature changes based on the radiation heat transfer content in heat transfer textbooks.

[0038] The preset target temperature is the same as the setting in the actual machine recipe, providing the control target to the temperature controller. After installing the Matlab software, the Signal Builder module can be used directly. The Signal Builder module can plot temperature setpoint curves and temperature rate setpoint curves over time.

[0039] Data acquisition and display are built-in functions of the Matlab software. All variables existing within Matlab can be displayed as curves and numerical values ​​for recording simulation results and data analysis. Implementation method: After installing Matlab, the Scope software module can be used directly. Data signals from any model can be connected to the Scope module to view the curves of data changes over time during or after the simulation.

[0040] This invention also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements any of the hardware-in-the-loop emulation methods for RTP devices described above.

[0041] The present invention also provides an electronic device. The electronic device of an embodiment of the present invention includes: one or more processors; and a storage device for storing one or more computer programs, which, when executed by the one or more processors, cause the one or more processors to implement a hardware-in-the-loop emulation method for an RTP device provided by the present invention. References are made below. Figure 4 It shows a schematic diagram of the structure of a computer system 800 suitable for implementing embodiments of the present invention. For example... Figure 4As shown, the computer system 800 includes a central processing unit (CPU) 801, which can perform various appropriate actions and processes based on a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage section 808 into a random access memory (RAM) 803. The RAM 803 also stores various computer programs and data required for the operation of the computer system 800. The CPU 801, ROM 802, and RAM 803 are interconnected via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0042] The following components are connected to I / O interface 805: an input section 806 including a keyboard, mouse, etc.; an output section 807 including a cathode ray tube (CRT), liquid crystal display (LCD), etc., and speakers, etc.; a storage section 808 including a hard disk, etc.; and a communication section 809 including a network interface card such as a LAN card, modem, etc. The communication section 809 performs communication processing via a network such as the Internet. A drive 810 is also connected to I / O interface 805 as needed. A removable medium 811, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., is installed on drive 810 as needed so that computer programs read from it can be installed into storage section 808 as needed.

[0043] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can occur depending on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A hardware-in-the-loop simulation method for RTP devices, characterized in that, Includes the following steps: Step S1: Obtain the voltage signal from the temperature controller of the RTP device; Step S2: Input the voltage signal into a preset bulb power model to obtain a power signal; Step S3: Input the power signal into the preset heating model to obtain the temperature signal; Step S4: Input the temperature signal and the preset target temperature into the RTP device temperature controller, and the temperature controller generates a control voltage signal through calculation.

2. The hardware-in-the-loop simulation method for RTP devices according to claim 1, characterized in that, In step S1, the voltage signal is acquired via serial communication.

3. The hardware-in-the-loop simulation method for RTP devices according to claim 1, characterized in that, In step S2, the bulb power model is a mathematical model based on the voltage-power correspondence, used to simulate the actual output power of the halogen tungsten lamp array to obtain the power signal according to the input voltage signal.

4. The hardware-in-the-loop simulation method for RTP devices according to claim 1, characterized in that, In step S3, the heating model is established based on the blackbody radiation law. The heating model is used to simulate the dynamic temperature change process of the wafer in the reaction cavity based on the input power signal to obtain the temperature signal.

5. A hardware-in-the-loop simulation method for RTP devices according to claim 1, characterized in that, In step S4, when the temperature signal is less than the target temperature, the control voltage signal is used to increase the voltage of the RTP device temperature controller. When the temperature signal is greater than the target temperature, the control voltage signal is used to reduce the voltage of the RTP device temperature controller; When the temperature signal is equal to the target temperature, the control voltage signal is used to control the voltage of the RTP device temperature controller to remain constant.

6. The hardware-in-the-loop simulation method for RTP devices according to claim 1, characterized in that, It also includes step S5: generating a graphical temperature curve based on the temperature signal and the preset target temperature.

7. A hardware-in-the-loop simulation apparatus for an RTP device, based on the hardware-in-the-loop simulation method for an RTP device according to any one of claims 1-6, characterized in that, include: The data acquisition module is used to acquire the voltage signal from the temperature controller of the RTP device; The power simulation module is used to input the voltage signal into a preset bulb power model to obtain a power signal; The temperature simulation module is used to input the power signal into a preset heating model to obtain a temperature signal; The RTP device temperature controller is used to generate a control voltage signal based on the temperature signal and the preset target temperature.

8. A hardware-in-the-loop emulation device for RTP equipment according to claim 7, characterized in that, It also includes a display screen for adjusting the parameters of the RTP device temperature controller.

9. An electronic device based on fiber optic data, characterized in that, include: One or more processors; Storage device for storing one or more computer programs. When the one or more computer programs are executed by the one or more processors, the one or more processors implement a hardware-in-the-loop emulation method for an RTP device as described in any one of claims 1-4, 6.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements a hardware-in-the-loop simulation method for an RTP device as described in any one of claims 1-4, 6.

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