Driving chip, display device and driving method of driving chip

Abstract

The invention discloses a driving chip, a display device and a driving method of the driving chip. And the driving chip is used for driving the display panel. The display panel comprises a plurality of grid lines, a plurality of data lines and a plurality of sub-pixels, wherein the grid lines and the data lines are arranged in different layers in a crossed mode, and the sub-pixels are electrically connected with the grid lines and the data lines respectively. The driving chip comprises a temperature detection module, and the temperature detection module is configured to obtain the current temperature of the plurality of sub-pixels based on the overlapping area of the plurality of grid lines and the plurality of data lines. The temperature detection module in the driving chip can obtain the temperature value of the sub-pixel based on the overlapping area of the grid line and the data line in the display panel, a temperature sensor does not need to be additionally arranged to detect the temperature of each sub-pixel of the display panel, and the manufacturing process and manufacturing cost of the display panel are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a driving chip, a display device and a driving method of the driving chip. BACKGROUND

[0002] Organic Light-Emitting Diode (OLED) display technology has the advantages of self-emission, low driving voltage, high luminous efficiency, short response time, high contrast ratio, and is widely used in various display devices.

[0003] With the continuous improvement of the refresh frequency of the display screen, the power consumption and temperature of the whole machine also rise. The increase in temperature will affect the performance stability of the backplane circuit. The low temperature poly-silicon (LTPS), low temperature poly-silicon oxide (LTPO) and full oxide thin film transistor used in the driving backplane are extremely sensitive to temperature changes, which can easily lead to a decrease in the uniformity of screen display. Therefore, the temperature of the OLED panel needs to be detected, and the potential signal of each sub-pixel is adjusted according to the detected temperature to achieve temperature compensation.

[0004] Currently, OLED displays with temperature compensation function mainly use an additional temperature sensor in the display panel to detect the temperature and then compensate the temperature of the panel. However, the additional independent temperature sensor increases the manufacturing process and manufacturing cost of the display panel. SUMMARY

[0005] The embodiments of the present application provide a driving chip for driving a display panel to solve the problem that the display panel needs to be provided with an additional temperature sensor in the prior art, which leads to a complex manufacturing process and increased manufacturing cost.

[0006] In a first aspect, the embodiments of the present application provide a driving chip for driving a display panel, wherein the display panel comprises: a plurality of gate lines and a plurality of data lines which are arranged in different layers and cross each other, and a plurality of sub-pixels which are electrically connected to the plurality of gate lines and the plurality of data lines, respectively. The driving chip comprises a temperature detection module configured to obtain the current temperature of the plurality of sub-pixels based on the overlapping area of the plurality of gate lines and the plurality of data lines.

[0007] In some embodiments, the temperature detection module comprises an analog front end and a data back end; wherein, The analog front end is electrically connected with the data line, and is configured to collect a current of the data line, and generate an analog signal representing a current temperature of the sub-pixel according to the current and a corresponding relationship between temperature and current; The data back end is electrically connected with the analog front end, and is configured to convert the analog signal into a digital signal corresponding to the current temperature of the sub-pixel; In some embodiments, a temperature compensation module is further included, which is electrically connected with the temperature detection module, and is configured to determine a driving voltage of the sub-pixel according to the current temperature of the sub-pixel and a feature data table, so as to realize temperature compensation, wherein the feature data table includes brightness of the sub-pixel at different temperatures and driving voltages corresponding to different brightness.

[0008] In some embodiments, an acquisition module is further included, which is configured to collect currents corresponding to different temperatures and the feature data table, and feed back the currents corresponding to different temperatures to the temperature detection module for pre-storing, and feed back the feature data table to the temperature compensation module for pre-storing.

[0009] In a second aspect, the embodiments of the present application provide a display device, comprising a display panel and a driving chip which are electrically connected, wherein the driving chip is any one of the driving chips described above.

[0010] In some embodiments, the display panel comprises gate lines, data lines, sub-pixels, a first transfer electrode and a second transfer electrode, wherein the sub-pixel comprises a pixel circuit, the pixel circuit comprises a driving transistor and a capacitor, and a gate of the driving transistor is arranged in a layer different from that of the capacitor. The gate line is arranged in a same layer as at least one of two electrode plates of the capacitor and a gate of the driving transistor, and the data line is arranged in a same layer as at least one of a source / drain of the driving transistor, the first transfer electrode and the second transfer electrode.

[0011] In a third aspect, the embodiments of the present application provide a driving method of any one of the driving chips described above, comprising: In a temperature detection phase of a frame, a scanning signal is loaded on the gate lines of the display panel row by row, and a data signal with constant potential is loaded on the data lines; Based on a current variation amount of an overlapping area of the gate lines and the data lines caused by temperature influence, a current temperature of the sub-pixels is obtained.

[0012] In some embodiments, based on a current variation amount of an overlapping area of the gate lines and the data lines caused by temperature influence, a current temperature of the sub-pixels is obtained, specifically comprising: acquire a current temperature of the plurality of sub-pixels based on the overlapping region of the plurality of gate lines and the plurality of data lines. convert the analog signal into a digital signal corresponding to the current temperature of the sub-pixel; determine the current temperature of the sub-pixel based on the digital signal and an initial temperature of the sub-pixel.

[0013] In some embodiments, after acquiring the current temperatures of the plurality of sub-pixels, the method further comprises: loading a scanning signal to the plurality of gate lines row by row in a display time period of a frame, and determining a driving voltage loaded to the sub-pixel through the plurality of data lines based on the current temperature of the sub-pixel and a characteristic data table, wherein the characteristic data table comprises a brightness corresponding to the sub-pixel at different temperatures and a driving voltage corresponding to different brightness.

[0014] In some embodiments, the method further comprises storing currents corresponding to different temperatures before first temperature detection, and storing the characteristic data table before first temperature detection or temperature compensation.

[0015] The present application has the following advantages: The present application provides a driving chip, a display device and a driving method of the driving chip. The driving chip is used for driving a display panel. The display panel comprises a plurality of gate lines and a plurality of data lines arranged in different layers and crossing each other, and a plurality of sub-pixels electrically connected with the plurality of gate lines and the plurality of data lines respectively. The driving chip comprises a temperature detection module configured to acquire current temperatures of the plurality of sub-pixels based on an overlapping region of the plurality of gate lines and the plurality of data lines. The temperature detection module in the driving chip can acquire the temperature value of the sub-pixel based on the overlapping region of the gate line and the data line in the display panel, without the need of an additional temperature sensor to detect the temperature of each sub-pixel of the display panel, thereby reducing the manufacturing process and manufacturing cost of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. Obviously, the drawings introduced below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0017] Figure 1 a temperature and brightness sensitivity relationship diagram of a display panel provided by the embodiments of the present application; Figure 2 a display device structure schematic diagram provided by the embodiments of the present application; Figure 3A temperature detection module structure schematic diagram provided for an embodiment of the present application; Figure 4 A driving chip structure schematic diagram provided for an embodiment of the present application; Figure 5 A display panel structure schematic diagram provided for an embodiment of the present application; Figure 6 One of driving method flowcharts of a driving chip provided for an embodiment of the present application; Figure 7 A temperature compensation timing diagram provided for an embodiment of the present application; Figure 8 The second driving method flowchart of a driving chip provided for an embodiment of the present application. DETAILED DESCRIPTION

[0018] In order to make the above objectives, features and advantages of the present application more apparent, comprehensible and easier to understand, the present application will be further described below with reference to the accompanying drawings and embodiments. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present application more comprehensive and complete, and to fully convey the ideas of the example embodiments to those skilled in the art. The same reference numerals in the drawings represent the same or similar structures, and thus repeated descriptions thereof will be omitted. The expressions of position and direction described in the present application are described with reference to the drawings, but can be changed as needed, and the changes made are included in the scope of protection of the present application. The drawings of the present application are only used to illustrate the relative positional relationship and do not represent the true proportions.

[0019] Organic Light-Emitting Diode (OLED) display technology has the advantages of self-emission, low driving voltage, high emission efficiency, short response time, high contrast ratio, etc., and is widely used in various display devices, and gradually becomes the mainstream of display technology.

[0020] However, as the refresh frequency of the display screen continues to increase, the overall power consumption and temperature also rise. The increase in temperature affects the performance stability of the backplane circuit. The low temperature poly-silicon (LTPS), low temperature poly-silicon oxide (LTPO) and full oxide thin film transistor used in the driving backplane are extremely sensitive to temperature changes, which easily leads to a decrease in the uniformity of screen display.

[0021] Taking a pixel circuit employing an all-oxide thin-film transistor as an example, its driving transistor is made of oxide. In this pixel circuit, the source of the driving transistor is structurally close to the electroluminescent device, and oxide itself is quite sensitive to temperature changes, thus affecting its performance in terms of temperature compensation stability and temperature lifetime stability. On the one hand, the source of the driving transistor is directly connected to the voltage application terminal of the electroluminescent device. When the temperature rises, the driving voltage of the electroluminescent device itself decreases, resulting in a larger voltage change at the source of the driving transistor than at the gate, thus increasing the gate-source voltage difference and ultimately increasing the current flowing through the device. On the other hand, as the temperature increases, the carrier mobility within the oxide semiconductor material increases, and its threshold voltage shifts negatively, leading to an increase in the conduction current of the driving transistor.

[0022] Figure 1 This diagram illustrates the relationship between temperature and brightness sensitivity of a display panel. Temperature sensitivity refers to the characteristic of a display panel's brightness changing with temperature. This characteristic is caused by the change in carrier migration rate within the device with temperature, directly affecting the driving current and the device's luminous efficiency. Specifically, for example... Figure 1 As shown, within a temperature range of -10℃ to 50℃, the distribution of the normalized ratio of the actual brightness at each temperature to the brightness at room temperature of 25℃ is shown when the panel brightness is set to 0.01 nit, 0.05 nit, and 0.13 nit, respectively. Figure 1 It is known that the display panel is highly sensitive to temperature. The brightness difference between a display panel at 10℃ and 25℃ is 100% to 200%. This difference in brightness is easily perceived by the human eye when using the screen, thus affecting display quality. Therefore, it is necessary to detect the panel temperature and adjust the potential signals of each sub-pixel based on the detected temperature to achieve temperature compensation.

[0023] Currently, displays with temperature compensation primarily achieve this by adding an external temperature sensor to the display panel. This sensor detects the temperature and then compensates for it. However, this method of adding a separate temperature sensor increases the manufacturing process and cost of the display panel.

[0024] In view of this, embodiments of this application provide a driver chip for driving a display panel. The driver chip obtains the temperature value of the sub-pixels based on the overlapping area of ​​the gate lines and data lines in the display panel, eliminating the need for an additional temperature sensor to detect the temperature of the display panel, thus reducing the manufacturing process and cost of the display panel.

[0025] like Figures 2 to 4As shown, the embodiment of the present application provides a driving chip 200 for driving a display panel 100. The display panel 100 includes a plurality of gate lines 101 and a plurality of data lines 102 arranged in different layers and crossing each other, and a plurality of sub-pixels 103 electrically connected to the plurality of gate lines 101 and the plurality of data lines 102 respectively. The driving chip 200 includes a temperature detection module 201. The temperature detection module 201 can obtain the current temperature of the plurality of sub-pixels 103 based on an overlapping area M of the plurality of gate lines 101 and the plurality of data lines 102. When the temperature of the sub-pixel 103 changes, the gate line 101 and the data line 102 will expand or shrink, the area of the overlapping area M of the gate line 101 and the data line 102 will change, and then the resistance and capacitance value of the overlapping area M will change. When the resistance and capacitance value of the overlapping area M changes, the current value transmitted to the driving chip 200 through the data line 102 changes. The data line 102 conducts the current to the driving chip 200, and the driving chip 200 can determine the current temperature corresponding to the current based on the current and the corresponding relationship between the temperature and the current, thereby realizing the function of real-time temperature detection.

[0026] Optionally, the corresponding relationship between the temperature and the current can be pre-stored in a storage area of the temperature detection module 201. The number of temperatures and currents stored in the temperature detection module 201 is related to the accuracy of temperature detection of the driving chip 200. The more the sampling points of the temperature and the current, the higher the accuracy of temperature detection of the driving chip 200. In actual application, the number of temperatures and currents stored in the temperature detection module 201 can be determined according to the performance requirements of the display panel 100. For example, the currents corresponding to the temperatures of the sub-pixel at t1, t2, t3 and t4 can be stored. In specific implementation, assuming that the temperature t1 corresponds to the current i1, the temperature t2 corresponds to the current i2, the current detected in real time is i, i is greater than i1 and less than i2, and i corresponds to the current temperature t, then the value of t can be obtained according to It can also be understood that the present disclosure fits the current-temperature curve by using t1, t2, t3, t4 and their corresponding different currents, and when the current i is detected, the corresponding current temperature can be found on the current-temperature curve.

[0027] The driving chip 200 in the present application can obtain the real-time temperature of the sub-pixel in different areas based on the overlapping area M of the gate line 101 and the data line 102 in the display panel 100, without the need to additionally set a temperature sensor to detect the real-time temperature of each sub-pixel of the display panel 100, thereby reducing the manufacturing process and manufacturing cost of the display panel 100.

[0028] In some embodiments, as Figure 3As shown, the temperature detection module 201 includes an analog front-end 2011 and a data back-end 2012. The analog front-end 2011 is electrically connected to the data line 102. When the switching transistor T1 is a P-type transistor, the first gate G1 is low-level and open; when the switching transistor T1 is an N-type transistor, the first gate G1 is high-level and open. Taking the N-type transistor T1 as an example, the potential of the first source S1 of the switching transistor T1 is constant. When the first gate G1 is high-level, a conduction loop is formed. When the temperature of the sub-pixel 103 changes, the current value collected by the analog front-end 2011 also changes, and the amount of current change is proportional to the change in resistance and capacitance of the overlapping area M of the gate line 101 and the data line 102. The analog front-end 2011 collects the current of the data line 102 in real time and can generate an analog signal characterizing the current temperature of the sub-pixel 103 based on the current current and the correspondence between temperature and current. The data backend 2012 is electrically connected to the analog frontend 2011. The data backend 2012 is configured to convert the analog signal into a digital signal corresponding to the current temperature of the sub-pixel 103.

[0029] The temperature detection module 201 in this application utilizes the characteristic that the resistance and capacitance parameters of the overlapping area M of the gate line 101 and the data line 102 change with temperature. By collecting the current value of the data line 102 and determining the current temperature of the sub-pixel 103 based on the current current and the correspondence between temperature and current, this application eliminates the need for an additional temperature sensor on the display panel 100, thereby reducing the manufacturing process and cost of the display panel 100.

[0030] In some embodiments, such as Figure 4 As shown, the driver chip 200 also includes a temperature compensation module 202. The temperature compensation module 202 is electrically connected to the temperature detection module 201. The temperature compensation module 202 is configured to determine the driving voltage of the sub-pixel 103 based on the current temperature of the sub-pixel 103 and a feature data table, thereby achieving real-time temperature compensation. The feature data table includes the brightness of the sub-pixel 103 at different temperatures and the driving voltage corresponding to different brightness levels. Optionally, the feature data table can be pre-stored in the storage area of ​​the temperature compensation module 202.

[0031] In some embodiments, the number of temperatures sampled in the feature data table is related to the accuracy of temperature compensation by the driver chip 200. The more temperature sampling points, the higher the accuracy of temperature compensation by the driver chip 200. In practical applications, the number of temperature samples in the feature data table can be determined according to the performance requirements of the display panel 100. For example, the feature data table can collect the driving voltage values ​​required for sub-pixels to achieve different brightness levels at temperatures t1, t2, t3, and t4.

[0032] In a specific implementation, assuming that the temperature t1 corresponds to the brightness n1, the temperature t2 corresponds to the brightness n2, the brightness n1 corresponds to the voltage d1, and the brightness n2 corresponds to the voltage d2, the current temperature is t, t is greater than t1 and less than t2, the required brightness of t is n, and the required driving voltage of t is d, then the value of n can be obtained according to , and the value of d can be obtained according to . It can also be understood that the present disclosure fits the t1, t2, t3, t4 and their corresponding different brightnesses to obtain a brightness-temperature curve, and fits the different brightnesses and their corresponding driving voltages to obtain a driving voltage-brightness curve; when the current temperature t is detected, the corresponding current brightness can be found on the brightness-temperature curve first, and then the corresponding driving voltage can be found on the driving voltage-brightness curve.

[0033] Specifically, when the initial temperature is t1, the driving voltage required for the sub-pixel to reach the target brightness is V1. When the temperature of the sub-pixel rises to t2, if the driving voltage V1 is still applied, the actual brightness of the sub-pixel is different from the target brightness. Therefore, the temperature compensation module queries the brightness corresponding to the sub-pixel 103 at different temperatures in the feature data table according to the current temperature t2, obtains the brightness corresponding to the current temperature t2, and then obtains the driving voltage V2 corresponding to the current temperature t2 by querying the driving voltage corresponding to the different brightnesses in the feature data table. The temperature compensation module 202 adjusts the driving voltage on the data line 102 from V1 to V2, thereby realizing temperature compensation. In the present application, the temperature of the sub-pixel 103 is detected and compensated by the driving chip 200, without the need for an additional temperature sensor, thereby reducing the manufacturing process and manufacturing cost of the display panel 100 and improving the display quality.

[0034] In some embodiments, as shown in Figure 4 , the driving chip 200 further includes a collection module 203 configured to collect the currents corresponding to different temperatures and the feature data table, and feed back the currents corresponding to different temperatures to the temperature detection module 201 for pre-storing, and feed back the feature data table to the temperature compensation module 202 for pre-storing. Optionally, the collection module 203 includes a central processing unit (CPU). The collection module 203 can feed back the feature data table to the temperature compensation module 202 for pre-storing before the first temperature detection or temperature compensation, so that the temperature compensation module 202 can determine the driving voltage of the sub-pixel 103 according to the current temperature of the sub-pixel 103 and the feature data table, and realize temperature compensation. By pre-storing the currents corresponding to different temperatures and the feature data table, the temperature detection and compensation can be called in time, thereby improving the temperature detection and compensation efficiency.

[0035] Based on the same inventive concept, the present application also provides a display device, as shown in Figure 2As shown, the display panel 100 and the driving chip 200 are electrically connected, wherein the driving chip 200 is any one of the driving chips 200 described above. In the present application, the driving chip 200 obtains the real-time temperature value of the sub-pixel 103 based on the overlapping area M of the gate line 101 and the data line 102 in the display panel 100, without the need to additionally set a temperature sensor to detect the temperature of the display panel 100, thereby reducing the manufacturing process and manufacturing cost of the display panel 100.

[0036] In some embodiments, as shown in Figure 2 and Figure 5 As shown, the display panel 100 includes a gate line 101, a data line 102, a sub-pixel 103, a first transfer electrode 104, a second transfer electrode 105, and a substrate 106.

[0037] The substrate 106 can be a flexible substrate or a rigid substrate, wherein the rigid substrate can be, but is not limited to, glass, etc.; the flexible substrate can be, but is not limited to, polyethylene terephthalate, ethylene terephthalate, polyimide, etc.

[0038] The sub-pixel 103 includes a pixel circuit, which includes a switching transistor T1, a driving transistor T2, and a capacitor C; wherein the switching transistor T1 is located on the substrate 106; the switching transistor T1 includes a first gate G1, a first source S1, and a first drain D1. The driving transistor T2 is located on the substrate 106; the driving transistor T2 includes a second gate G2, a second source S2, and a second drain D2. The second gate G2 is located on the side of the first gate G1 away from the substrate 106, and the first source S1, the first drain D1, the second source S2, and the second drain D2 are arranged in the same layer on the side of the second gate G2 away from the substrate 106. The first electrode plate C1 of the capacitor C is arranged in the same layer as the first gate G1, and the second electrode plate C2 is located between the layer where the first gate G1 is located and the layer where the second gate G2 is located.

[0039] Optionally, the gate line 101 is arranged in the same layer and of the same material as at least one of the first electrode plate C1, the second electrode plate C2, and the second gate G2, and the data line 102 is arranged in the same layer and of the same material as at least one of the first source S1, the first transfer electrode 104, and the second transfer electrode 105.

[0040] As shown in Figure 5 The display panel 100 can further include a bottom light shielding layer 107, which can shield the back of the switching transistor T1 and the driving transistor T2, and eliminate the influence of free ions in the substrate 106 on the characteristics of the transistors.

[0041] The first barrier layer 1081 and the second barrier layer 1082 are arranged on the substrate 106 in a stack, and can isolate water vapor and block diffusion of metal ions or impurities in the substrate 106 to the first active layer 116 and the second active layer 117.

[0042] The first insulating layer 1091 and the second insulating layer 1092 are arranged on the second barrier layer 1082 in a stack. The first insulating layer 1091 is located between the first gate G1 and the first active layer 116 of the switching transistor T1, and forms an insulating medium layer between the first gate G1 and the semiconductor channel, so that the voltage of the first gate G1 can control the concentration of carriers in the channel through the electric field effect, thereby realizing the opening, closing and current regulation of the switching transistor T1. The second insulating layer 1092 is located between the first electrode plate C1 and the second electrode plate C2, preventing short circuit between the upper and lower electrode plates. The third insulating layer 1093 is located between the second active layer 117 of the driving transistor T2 and the second gate G2, and forms an insulating medium layer between the second gate G2 and the semiconductor channel, realizing the electric field control of the channel by the second gate G2.

[0043] The first active layer 116 and the second active layer 117 are channel layers of the switching transistor T1 and the driving transistor T2, and the material thereof includes but is not limited to amorphous silicon (a-Si), low temperature poly-silicon (LTPS) or indium gallium zinc oxide (IGZO).

[0044] The first passivation layer 1101 is located on the side of the second insulating layer 1092 away from the substrate 106. The first passivation layer 1101 can be used as an isolation layer of the first gate G1 and the source-drain electrode of the switching transistor T1, or can be provided with a connecting hole to make the first source S1 and the first drain D1 conductive with the first active layer 116. The second passivation layer 1102 is located between the layer where the second gate G2 of the driving transistor T2 is located and the layer where the second source S2 and the second drain D2 are located. The second passivation layer 1102 can be used as an isolation layer of the second gate G2 and the source-drain electrode of the driving transistor T2, or can be provided with a connecting hole to make the second source S2 and the second drain D2 conductive with the second active layer 117.

[0045] The first intermediate layer 1111 and the second intermediate layer 1112 are arranged in a stack between the first passivation layer 1101 and the third insulating layer 1093. The first intermediate layer 1111 and the second intermediate layer 1112 are used to isolate the lower switching transistor T1 and the upper driving transistor T2.

[0046] The first planarization layer 1121, the second planarization layer 1122, and the third planarization layer 1123 are stacked on top of the second passivation layer 1102. The planarization layers can achieve the function of planarization between layers.

[0047] Sub-pixel 103 also includes a light-emitting device, with an anode layer 113 forming the anode of the light-emitting device; a pixel definition layer 114 defines the evaporation area of ​​each pixel and also serves to flatten it in preparation for evaporation; and a support layer 115 provides support.

[0048] Based on the same inventive concept, embodiments of this application also provide a driving method for a driving chip, such as... Figure 6 As shown, it includes: S601. During the temperature detection phase of a frame, a scan signal is applied line by line to multiple grid lines of the display panel, and a data signal with a constant potential is applied to multiple data lines. S602. Based on the current change caused by temperature in the overlapping area of ​​multiple gate lines and multiple data lines, obtain the current temperature of multiple sub-pixels.

[0049] The driving method of the driving chip 200 in this application can obtain the temperature value of the sub-pixel 103 based on the overlapping area M of the gate line 101 and the data line 102 in the display panel 100. It eliminates the need to set up an additional temperature sensor to detect the temperature of each sub-pixel of the display panel 100, thereby reducing the manufacturing process and cost of the display panel 100.

[0050] Specifically, in step S601, as Figure 7 As shown, during the temperature detection phase s1 of a frame, a data signal with a constant potential is applied to multiple data lines 102 of the display panel 100, making the potential of the first source S1 of the switching transistor T1 constant. A scan signal is applied line by line to multiple gate lines 101 of the display panel 100, causing the first gate G1 of the switching transistor T1 to turn on, forming a conduction circuit.

[0051] In step S602, based on the current change caused by temperature in the overlapping area of ​​multiple gate lines and multiple data lines, the current temperature of multiple sub-pixels is obtained, such as... Figure 8 As shown, it specifically includes: S6021. Collect the current current of the data line, and generate an analog signal representing the current temperature of the sub-pixel based on the current current and the correspondence between temperature and current. S6022. Convert the analog signal into a digital signal corresponding to the current temperature of the sub-pixel.

[0052] Specifically, in step S6021, when the temperature of the sub-pixel 103 changes, the gate line 101 and the data line 102 will expand or shrink, the area of the overlapping region M of the gate line 101 and the data line 102 will change, and the resistance-capacitance value of the overlapping region M will change. When the resistance-capacitance value of the overlapping region M changes, the current value transmitted to the driving chip 200 through the data line 102 changes. The data line 102 transmits the current value to the analog front end 2011 in the driving chip 200, and the analog front end 2011 generates an analog signal representing the current temperature of the sub-pixel 103 based on the current value and the corresponding relationship between temperature and current.

[0053] In step S6022, the data backend 2012 in the driving chip 200 is connected with the analog front end 2011, and the data backend 2012 is configured to convert the analog signal into a digital signal corresponding to the current temperature of the sub-pixel 103.

[0054] The driving method of the driving chip 200 in the present application can obtain the temperature value of the sub-pixel 103 based on the overlapping region M of the gate line 101 and the data line 102 in the display panel 100, without the need to additionally set a temperature sensor to detect the temperature of each sub-pixel 103 in the display panel 100, thereby reducing the manufacturing process and manufacturing cost of the display panel 100.

[0055] In some embodiments, after obtaining the current temperatures of the plurality of sub-pixels 103, the following steps can be further performed: Figure 7 As shown in FIG. 6B, in the display time period s2 of a frame, the scanning signal is loaded to the plurality of gate lines 101 row by row, and the driving voltage loaded to the sub-pixel 103 through the plurality of data lines 102 is determined according to the current temperature of the sub-pixel 103 and the characteristic data table, wherein the characteristic data table includes the brightness of the sub-pixel 103 corresponding to different temperatures and the driving voltage corresponding to different brightness. Specifically, the number of temperatures collected in the characteristic data table is related to the accuracy of temperature compensation of the driving chip 200. The more the sampling points of temperature, the higher the accuracy of temperature compensation of the driving chip 200. In actual application, the number of temperature sampling in the characteristic data table can be determined according to the performance requirements of the display panel 100. For example, the characteristic data table includes the driving voltage values required by the sub-pixel to reach different brightness at temperatures t1, t2, t3 and t4.

[0056] The temperature compensation module 202 can determine the driving voltage of the sub-pixel according to the current temperature of the sub-pixel 103 and the characteristic data table, and realize temperature compensation. Specifically, when the initial temperature is t1, the driving voltage required for the sub-pixel 103 to reach the target brightness is V1. When the temperature of the sub-pixel rises to t2, if the driving voltage V1 is still applied, the actual brightness of the sub-pixel 103 is different from the target brightness. Therefore, the temperature compensation module queries the corresponding brightness of the sub-pixel at different temperatures in the characteristic data table according to the current temperature t2, can obtain the corresponding brightness at the current temperature t2, and then queries the driving voltage corresponding to different brightness in the characteristic data table to obtain the driving voltage V2 corresponding to the current temperature t2. The temperature compensation module 202 adjusts the driving voltage from V1 to V2, thereby realizing temperature compensation. In this application, the temperature of the sub-pixel 103 is detected and compensated by the driving chip 200, without the need for additional temperature sensors, thereby reducing the manufacturing process and manufacturing cost of the display panel 100.

[0057] In some embodiments, the driving method further comprises: storing the currents corresponding to different temperatures before the first temperature detection, and storing the characteristic data table before the first temperature detection or temperature compensation. By pre-storing the currents corresponding to different temperatures and the characteristic data table, the temperature detection and compensation can be called in time when needed, thereby improving the temperature detection and compensation efficiency.

[0058] In summary, the above-mentioned driving chip 200 provided by the embodiments of the present application is used to drive the display panel 100. The temperature detection module in the driving chip 200 can obtain the current temperature of the plurality of sub-pixels 103 based on the overlapping area M of the plurality of gate lines 101 and the plurality of data lines 102. When the temperature of the sub-pixel 103 changes, the gate line 101 and the data line 102 will expand or shrink, the area of the overlapping area M of the gate line 101 and the data line 102 will change, and then the resistance and capacitance value of the overlapping area M will change. When the resistance and capacitance value of the overlapping area M changes, the current value transmitted to the driving chip 200 through the data line 102 changes. The data line 102 conducts the current value to the driving chip 200, and the driving chip 200 can realize the temperature detection function based on the current and the corresponding relationship between the temperature and the current. The driving chip 200 in the present application can obtain the temperature value of the sub-pixel 103 based on the overlapping area M of the gate line 101 and the data line 102 in the display panel 100, without the need for additional temperature sensors to detect the temperature of each sub-pixel of the display panel 100, thereby reducing the manufacturing process and manufacturing cost of the display panel 100. Moreover, the temperature compensation module 202 of the present disclosure can also realize temperature compensation, thereby improving the display effect.

[0059] While the preferred embodiments of the application have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they have the benefit of the present disclosure without departing from the spirit and scope of the application. Accordingly, it is intended that such additions and modifications be included within the scope of the application. It is the following claims, including any amendments thereto, which define the scope of the application.

[0060] Obviously, numerous modifications and variations of the present application are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A driver chip for driving a display panel, characterized in that: The display panel includes: multiple gate lines and multiple data lines arranged in a cross-layer configuration, and multiple sub-pixels electrically connected to the multiple gate lines and the multiple data lines respectively; The driving chip includes a temperature detection module, which is configured to obtain the current temperature of the multiple sub-pixels based on the overlapping area of ​​the multiple gate lines and the multiple data lines.

2. The driver chip as described in claim 1, characterized in that, The temperature detection module includes an analog front-end and a data back-end; wherein... The analog front end is electrically connected to the data line. The analog front end is configured to collect the current current of the data line and generate an analog signal characterizing the current temperature of the sub-pixel based on the current current and the correspondence between temperature and current. The data backend is electrically connected to the analog frontend, and the data backend is configured to convert the analog signal into a digital signal corresponding to the current temperature of the sub-pixel.

3. The driver chip as described in claim 1 or 2, characterized in that, It also includes a temperature compensation module, which is electrically connected to the temperature detection module. The temperature compensation module is configured to determine the driving voltage of the sub-pixel based on the current temperature of the sub-pixel and a feature data table to achieve temperature compensation. The feature data table includes the brightness of the sub-pixel at different temperatures and the driving voltage corresponding to different brightness levels.

4. The driver chip as described in claim 3, characterized in that, It also includes a data acquisition module, which is configured to acquire the current corresponding to different temperatures and the feature data table, and feed back the current corresponding to different temperatures to the temperature detection module for pre-storage, and feed back the feature data table to the temperature compensation module for pre-storage.

5. A display device, characterized in that, The device includes a display panel and a driver chip that are electrically connected, wherein the driver chip is the driver chip as described in any one of claims 1 to 4.

6. The display device as claimed in claim 5, characterized in that, The display panel includes gate lines, data lines, sub-pixels, a first transition electrode, and a second transition electrode. The sub-pixel includes a pixel circuit, which includes a driving transistor and a capacitor. The gate of the driving transistor and the capacitor are disposed on different layers. The gate line is disposed on the same layer as at least one of the two electrode plates of the capacitor and the gate of the driving transistor, and the data line is disposed on the same layer as at least one of the source and drain of the driving transistor, the first transition electrode, and the second transition electrode.

7. A driving method for a driving chip as described in any one of claims 1 to 4, characterized in that, include: During the temperature detection phase of one frame, scanning signals are applied line by line to multiple grid lines of the display panel, and data signals with constant potential are applied to multiple data lines. The current temperature of multiple sub-pixels is obtained based on the current change caused by temperature in the overlapping area of ​​the multiple gate lines and multiple data lines.

8. The driving method as described in claim 7, characterized in that, Based on the current change caused by temperature in the overlapping area of ​​the multiple gate lines and multiple data lines, the current temperature of multiple sub-pixels is obtained, specifically including: The current current of the data line is collected, and an analog signal representing the current temperature of the sub-pixel is generated based on the current current and the correspondence between temperature and current. The analog signal is converted into a digital signal corresponding to the current temperature of the sub-pixel.

9. The driving method as described in claim 7 or 8, characterized in that, After obtaining the current temperature of multiple sub-pixels, the following is also included: During the display period of one frame, scanning signals are applied line by line to the multiple grid lines, and the driving voltage applied to the sub-pixel through the multiple data lines is determined according to the current temperature of the sub-pixel and the feature data table. The feature data table includes the brightness of the sub-pixel at different temperatures and the driving voltage corresponding to different brightness levels.

10. The driving method as described in claim 9, characterized in that, Also includes: The current corresponding to different temperatures is stored before the first temperature detection, and the feature data table is stored before the first temperature detection or temperature compensation.

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