Signal switch equipment for optical fiber communication
By using a dynamically adjusted heat dissipation structure and dustproof mesh design, the problem of heat accumulation and dust erosion in fiber optic communication signal switches is solved, achieving efficient thermal management and stability, and making it suitable for industrial and outdoor fiber optic communication scenarios.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-02
- Publication Date
- 2026-03-27
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The heat dissipation design of existing fiber optic communication signal switches cannot be dynamically adjusted, resulting in heat accumulation and failing to meet the requirements of high-density integration and long-term operational stability, especially in industrial or outdoor scenarios where the heat dissipation effect is poor.
It adopts a dynamically adjustable heat dissipation structure, including a sliding heat sink and fan system, combined with a dust filter design. The heat sink fins and fan are driven by a ball screw motor to enhance the heat dissipation effect, and a dust filter is installed at the heat dissipation window to prevent dust from entering.
It achieves efficient thermal management and dust prevention functions, ensuring long-term stable operation of the switch in a high-density integration environment and preventing the formation of thermal islands and dust corrosion.
Smart Images
Figure CN121751031A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of signal switching equipment for optical fiber communication, specifically to a signal switching device for optical fiber communication. Background Technology
[0002] With the continuous growth in bandwidth demands from scenarios such as data centers, 5G bearer networks, and supercomputing interconnects, signal switches in fiber optic communication systems are rapidly evolving towards higher integration and higher throughput. To achieve low-latency, high-density data exchange, modern fiber optic switches generally adopt a multi-channel parallel processing architecture and integrate a large number of high-speed optical modules (such as QSFP-DD and OSFP packages) and high-power switching chips (such as the Tomahawk series). The power consumption of a single chip has exceeded 500W, and the heat flux density is close to 130 W / cm².
[0003] However, most existing switches use a heat dissipation structure with side wall openings and fan exhaust, which has a fixed airflow path and cannot be dynamically adjusted according to power consumption distribution. This causes heat to accumulate on the back of the chip or near the optical module slot, forming thermal islands. In industrial or outdoor fiber optic communication scenarios, switches need to be dustproof and moisture-proof, but the sealed structure further hinders natural convection and air cooling efficiency, causing internal temperature rise to intensify and accelerating component aging.
[0004] In summary, the existing heat dissipation design of fiber optic communication signal switches is no longer able to meet their ever-increasing power consumption density and reliability requirements. There is an urgent need for a new heat dissipation architecture that can balance high-density integration, efficient thermal management, and long-term operational stability. Summary of the Invention
[0005] The purpose of this invention is to provide a signal switching device for optical fiber communication to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a switch housing, on both sides of the top center of the switch housing, a circuit board is fixed on the support plate by screws, a heat sink is fixedly installed on the bottom of the support plate of the switch housing, a heat sink has multiple sets of heat sink fins at the bottom of the heat sink, a lead screw is inserted into the center of the bottom of the heat sink fin, a sliding plate is slidably connected on the lead screw, and a plurality of cooling fans are installed on the sliding plate; The bottom of the switch housing has a heat dissipation window, and a dustproof mesh is installed in the heat dissipation window.
[0007] Preferably, the top surface of the heat sink is in close contact with the bottom surface of the circuit board, and the heat dissipation fins at the bottom of the heat sink are evenly distributed. The heat sink can absorb the heat emitted by the circuit board and the electronic components on the circuit board, and increase the heat dissipation area through the heat dissipation fins at the bottom to cool the circuit board.
[0008] Preferably, a lead screw motor is provided in the middle of one side of the switch housing. The lead screw motor is located in a motor cover provided on one side of the switch housing. One end of the lead screw provided inside the switch housing is inserted into the inner end of the lead screw motor, and the lead screw motor can drive the lead screw to rotate.
[0009] Preferably, the sliding plate slidably connected to the lead screw is located directly below the heat dissipation fins at the bottom of the heat sink. The cooling fan on the sliding plate accelerates air convection by rotating, carrying away the heat dissipated between the multiple sets of heat dissipation fins.
[0010] Preferably, both ends of the lead screw are slidably connected to limiting rods, and both ends of the limiting rods are fixed to both sides of the inside of the switch housing. The limiting rods can limit the sliding plate and prevent the lead screw from tilting.
[0011] Preferably, the switch housing has telescopic grooves on both sides of the heat dissipation window, and springs are installed in the telescopic grooves. The bottom of the springs is connected to the bottom inner wall of the telescopic grooves, and the top of the springs is connected to the dustproof mesh frame. The springs can drive the lifting plate to extend and retract, so that the lifting plate drives the dustproof mesh frame to extend and retract synchronously.
[0012] Preferably, a dustproof net is fixedly connected to the inner side of the dustproof net frame. The dustproof net is set in the heat dissipation window opened at the bottom of the switch housing. The dustproof net can prevent dust from entering the interior of the switch housing.
[0013] Preferably, the top of the dustproof net frame is provided with multiple sets of protrusions, the two sides of the protrusions are arc-shaped, and the bottom sides of the sliding plate are provided with extrusion blocks, the two sides of the extrusion blocks are also arc-shaped, the protrusions and extrusion blocks are parallel, and the extrusion blocks can extrude the protrusions.
[0014] Preferably, the bottom of the switch housing is provided with support feet around its perimeter, which lift the switch housing and suspend it in the air for a certain distance.
[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention proposes a signal switch device for fiber optic communication. When the switch is in operation, a heat sink at the bottom of the circuit board absorbs the heat emitted by the circuit board and the electronic components at the top of the circuit board. The heat sink fins at the bottom further increase the heat dissipation area. Then, a lead screw motor located in the motor housing is activated. The lead screw motor drives a lead screw inserted at its end to rotate, causing a sliding plate slidably connected to the lead screw to slide along the lead screw. This activates a cooling fan on the sliding plate, which, by rotating, increases airflow and rapidly cools the heat sink and heat sink fins, absorbing the emitted heat. Simultaneously, a dust filter in the ventilation window at the bottom of the switch housing prevents dust from entering the interior of the switch housing and thus prevents dust from entering the switch. Inside the casing, the electronic components on the circuit board are eroded. Further, as the sliding plate slides, it uses pressing blocks on both sides of the bottom to press against the protrusions on the top of the dustproof mesh frame. This forces the lifting plate connected to the dustproof mesh frame into the telescopic groove a certain distance. At this point, the dustproof mesh frame moves the dustproof mesh synchronously downwards and outwards. When the pressing blocks disengage from the protrusions, the spring in the telescopic groove rebounds the lifting plate, causing the dustproof mesh frame to rise and shake, preventing dust from adhering to the mesh and affecting its breathability. Further, limiting rods are slidably connected to both sides of the sliding plate, limiting its movement and preventing tilting, which would prevent the pressing blocks at the bottom of the sliding plate from properly pressing against the protrusions. Attached Figure Description
[0016] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of another cross-sectional view of the present invention; Figure 4 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle; Figure 5 This is a schematic diagram of the dustproof net frame and the three-dimensional structure of the dustproof net of the present invention; Figure 6 This is a schematic diagram of the three-dimensional structure of the sliding block of the present invention.
[0017] In the diagram: 1. Switch housing; 2. Support foot; 3. Motor cover; 4. Support plate; 5. Circuit board; 6. Heat sink; 7. Heat sink fins; 8. Lead screw motor; 9. Lead screw; 10. Sliding plate; 11. Heat dissipation window; 12. Telescopic groove; 13. Spring; 14. Lifting plate; 15. Dustproof mesh frame; 16. Dustproof mesh; 17. Protrusion block; 18. Extrusion block; 19. Limiting rod; 20. Cooling fan. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0019] Please see Figures 1 to 6 This invention provides a technical solution: a switch housing 1, with support plates 4 on both sides of the top center of the switch housing 1, and circuit boards 5 fixed to the support plates 4 by screws; a heat sink 6 is fixedly installed at the bottom of the support plates 4, with multiple sets of heat sink fins 7 at the bottom of the heat sink 6, and a lead screw 9 inserted into the center of the bottom of the heat sink fins 7, with a sliding plate 10 slidably connected to the lead screw 9, and multiple sets of cooling fans 20 installed on the sliding plate 10; a heat dissipation window 11 is opened at the bottom of the switch housing 1, and a dustproof mesh 16 is installed in the heat dissipation window 11; the dustproof mesh 16 in the heat dissipation window 11 at the bottom of the switch housing 1 prevents dust from entering the interior of the switch housing 1 and preventing dust from entering the switch housing 1 and corroding the electronic components on the circuit board 5.
[0020] The top surface of the heat sink 6 is in close contact with the bottom surface of the circuit board 5. The heat sink fins 7 at the bottom of the heat sink 6 are evenly distributed. The heat sink 6 can absorb the heat emitted by the circuit board 5 and the electronic components on the circuit board 5, and increase the heat dissipation area through the heat sink fins 7 at the bottom to cool the circuit board 5. A lead screw motor 8 is provided in the middle of one side of the switch housing 1. The lead screw motor 8 is located in the motor cover 3 provided on one side of the switch housing 1. One end of the lead screw 9 provided inside the switch housing 1 is inserted into the inner end of the lead screw motor 8. The lead screw motor 8 can drive the lead screw 9 to rotate. The lead screw motor 8 drives the lead screw 9 inserted at the end to rotate, so that the sliding plate 10 slidably connected on the lead screw 9 begins to slide on the lead screw 9.
[0021] The sliding plate 10, which is slidably connected to the lead screw 9, is located directly below the heat dissipation fins 7 at the bottom of the heat sink 6. The cooling fan 20 on the sliding plate 10 accelerates air convection by rotating, carrying away the heat dissipated between the multiple heat dissipation fins 7. The two ends of the lead screw 9 are simultaneously slidably connected to the limiting rods 19. The two ends of the limiting rods 19 are fixed to both sides of the inside of the switch housing 1. The limiting rods 19 can limit the sliding plate 10 to prevent the lead screw 9 from tilting. The limiting rods 19 limit the sliding plate 10 to prevent the sliding plate 10 from tilting, which would prevent the pressing block 18 at the bottom of the sliding plate 10 from properly pressing the protrusion 17.
[0022] The switch housing 1 has telescopic grooves 12 on both sides of the heat dissipation window 11. Springs 13 are installed in the telescopic grooves 12. The bottom of the springs 13 is connected to the bottom inner wall of the telescopic groove 12, and the top of the springs 13 is connected to the dustproof mesh frame 15. The springs 13 can drive the lifting plate 14 to extend and retract, so that the lifting plate 14 drives the dustproof mesh frame 15 to extend and retract synchronously. The dustproof mesh 16 is fixedly connected to the inner side of the dustproof mesh frame 15. The dustproof mesh 16 is set in the heat dissipation window 11 at the bottom of the switch housing 1. The dustproof mesh 16 can prevent dust from entering the interior of the switch housing 1. The dustproof mesh frame 15 drives the dustproof mesh 16 to extend, retract and descend synchronously. When the pressing block 18 disengages from the protrusion 17, the springs 13 in the telescopic grooves 12 rebound the lifting plate 14 through elasticity. The dustproof mesh frame 15 drives the dustproof mesh 16 to rise, so that the dustproof mesh 16 shakes up and down, preventing dust from adhering to the dustproof mesh 16 and affecting the air permeability of the dustproof mesh 16.
[0023] The top of the dustproof mesh frame 15 is provided with multiple sets of protrusions 17, the two sides of the protrusions 17 are arc surfaces, the bottom sides of the sliding plate 10 are provided with pressing blocks 18, the two sides of the pressing blocks 18 are also arc surfaces, the protrusions 17 and the pressing blocks 18 are parallel, and the pressing blocks 18 can press the protrusions 17; the bottom of the switch housing 1 is provided with support feet 2 around the perimeter, the support feet 2 lift the switch housing 1 and suspend it in the air for a distance.
[0024] In actual use, when the switch is running, the heat sink 6 at the bottom of the circuit board 5 absorbs the heat emitted by the circuit board 5 and the electronic components at the top of the circuit board 5, and the heat dissipation area is increased by the heat dissipation fins 7 at the bottom. Then, the lead screw motor 8 set in the motor cover 3 is started. The lead screw motor 8 drives the lead screw 9 inserted at the end to rotate, causing the sliding plate 10 slidably connected to the lead screw 9 to start sliding on the lead screw 9. The cooling fan 20 on the sliding plate 10 is started. The cooling fan 20 increases the airflow by rotating, which quickly drives the heat sink 6 and the heat dissipation fins 7 to absorb the emitted heat and quickly cool down the heat sink 6 and the heat dissipation fins 7. At the same time, the dustproof mesh 16 in the heat dissipation window 11 at the bottom of the switch housing 1 prevents dust from entering the interior of the switch housing 1 and preventing dust from entering the switch housing 1 and corroding the electronic components on the circuit board 5. Furthermore, as the sliding plate 10 slides, the pressing blocks 18 on both sides of the bottom begin to press the protrusions 17 on the top of the dustproof net frame 15, squeezing the lifting plate 14 connected to the dustproof net frame 15 into the telescopic groove 12 a certain distance. At this time, the dustproof net frame 15 drives the dustproof net 16 to extend and descend synchronously. When the pressing blocks 18 disengage from the protrusions 17, the spring 13 in the telescopic groove 12 rebounds the lifting plate 14 through elastic force, and the dustproof net frame 15 drives the dustproof net 16 to rise, causing the dustproof net 16 to shake up and down, preventing dust from adhering to the dustproof net 16 and affecting its breathability. Furthermore, the two sides of the sliding plate 10 are slidably connected to the limiting rods 19, which limit the sliding plate 10 to prevent the sliding plate 10 from tilting, which would prevent the pressing blocks 18 at the bottom of the sliding plate 10 from properly pressing the protrusions 17.
[0025] Although the illustrative specific embodiments of this application have been described above to enable those skilled in the art to understand this application, this application is not limited to the scope of the specific embodiments. For those skilled in the art, all applications utilizing the concept of this application are protected as long as various variations are within the spirit and scope of this application as defined and determined by the appended claims.
Claims
1. A signal switching device for optical fiber communication, characterized in that: include: The switch housing (1) has a support plate (4) on both sides of the top center of the switch housing (1). A circuit board (5) is fixed on the support plate (4) by screws. A heat sink (6) is fixed on the bottom of the support plate (4) of the switch housing (1). There are multiple heat sink fins (7) at the bottom of the heat sink (6). A screw rod (9) is inserted into the middle of the bottom of the heat sink fin (7). A sliding plate (10) is slidably connected to the screw rod (9). Multiple cooling fans (20) are provided on the sliding plate (10). The bottom of the switch housing (1) is provided with a heat dissipation window (11), and a dustproof mesh (16) is provided in the heat dissipation window (11).
2. The signal switching device for optical fiber communication according to claim 1, characterized in that: The top surface of the heat sink (6) is in close contact with the bottom surface of the circuit board (5). The heat sink fins (7) at the bottom of the heat sink (6) are evenly distributed. The heat sink (6) can absorb the heat emitted by the circuit board (5) and the electronic components on the circuit board (5), and increase the heat dissipation area through the heat sink fins (7) at the bottom to cool down the circuit board (5).
3. A signal switching device for optical fiber communication according to claim 2, characterized in that: A lead screw motor (8) is provided in the middle of one side of the switch housing (1). The lead screw motor (8) is located in the motor cover (3) provided on one side of the switch housing (1). One end of the lead screw (9) provided inside the switch housing (1) is inserted into the inner end of the lead screw motor (8). The lead screw motor (8) can drive the lead screw (9) to rotate.
4. A signal switching device for optical fiber communication according to claim 3, characterized in that: The sliding plate (10) slidably connected to the lead screw (9) is located directly below the heat dissipation fins (7) at the bottom of the heat dissipation plate (6). The cooling fan (20) on the sliding plate (10) accelerates air convection by rotating, carrying away the heat dissipated between the multiple heat dissipation fins (7).
5. A signal switching device for optical fiber communication according to claim 4, characterized in that: The two ends of the lead screw (9) are simultaneously slidably connected to the limiting rod (19). The two ends of the limiting rod (19) are fixed to both sides of the inside of the switch housing (1). The limiting rod (19) can limit the sliding plate (10) and prevent the lead screw (9) from tilting.
6. A signal switching device for optical fiber communication according to claim 5, characterized in that: The switch housing (1) has telescopic grooves (12) on both sides of the heat dissipation window (11). A spring (13) is installed in the telescopic groove (12). The bottom of the spring (13) is connected to the bottom inner wall of the telescopic groove (12), and the top of the spring (13) is connected to the dustproof mesh frame (15). The spring (13) can drive the lifting plate (14) to extend and retract, so that the lifting plate (14) drives the dustproof mesh frame (15) to extend and retract synchronously.
7. A signal switching device for optical fiber communication according to claim 6, characterized in that: The dustproof net frame (15) is fixedly connected to the inside of the dustproof net (16). The dustproof net (16) is set in the heat dissipation window (11) opened at the bottom of the switch housing (1). The dustproof net (16) can prevent dust from entering the interior of the switch housing (1).
8. A signal switching device for optical fiber communication according to claim 7, characterized in that: The top of the dustproof net frame (15) is provided with multiple sets of protrusions (17), the two sides of the protrusions (17) are arc surfaces, and the bottom sides of the sliding plate (10) are provided with extrusion blocks (18), the two sides of the extrusion blocks (18) are arc surfaces, the protrusions (17) and the extrusion blocks (18) are parallel, and the extrusion blocks (18) can extrude the protrusions (17).
9. A signal switching device for optical fiber communication according to claim 8, characterized in that: The bottom of the switch housing (1) is provided with support feet (2) around its perimeter, which lift the switch housing (1) and suspend it in the air for a certain distance.