Flexible circuit board and electronic equipment

Abstract

The invention discloses a flexible circuit board and electronic equipment, and relates to the technical field of flexible circuit boards. The flexible circuit board comprises a base layer, a first shielding layer, a second shielding layer, a first metal part, a second metal part and a connecting part, the first shielding layer and the second shielding layer are located on the two sides of the base layer in the first direction respectively, the first metal part is located between the first shielding layer and the base layer, the second metal part is located between the second shielding layer and the base layer, and the base layer is provided with a through hole. The connecting part penetrates through the through hole to be connected with the first metal part and the second metal part, so that the second shielding layer and the first shielding layer are electrically connected through the first metal part, the connecting part and the second metal part, the first shielding layer is used for making contact with one of the metal support and the metal middle frame, and the first shielding layer and the second shielding layer are both grounded; the first shielding layer and the second shielding layer have good shielding effects, so that normal work of the flexible circuit board is ensured.

Description

Technical Field

[0001] This application relates to the field of flexible circuit board technology, and in particular to a flexible circuit board and an electronic device. Background Technology

[0002] The use of flexible circuit boards in electronic devices enables more compact structural designs and miniaturization. However, electronic devices themselves are prone to generating interference signals that radiate, leading to electromagnetic interference (EMI) problems. Flexible circuit boards and other circuit devices are generally more sensitive to EMI, and when the structure of an electronic device is compact, the flexible circuit board is more susceptible to its effects.

[0003] Mobile phones and other electronic devices typically consist of a screen and a metal frame. The metal frame supports and connects to the screen to ensure its positional stability. A flexible circuit board is electrically connected to the screen, and touch traces are installed on the flexible circuit board to enable touch signal input when the user touches the screen. At least part of the flexible circuit board is located between the metal support and the metal frame, with the metal support and the metal frame spaced apart, forming a capacitor. When the user touches the screen, the metal frame is subjected to external force, causing the distance between the metal support and the metal frame to change. This changes the capacitance value of the capacitor formed by the metal support and the metal frame, generating electromagnetic interference on the flexible circuit board located between the metal support and the metal frame, affecting the normal operation of the flexible circuit board. Summary of the Invention

[0004] This application provides a flexible circuit board and an electronic device. By setting a first shielding layer and a second shielding layer on opposite sides of the flexible circuit board, and making the first shielding layer contact one of the metal bracket and the metal frame, and then setting a first metal part, a connecting part and a second metal part to realize the electrical conduction of the first shielding layer and the second shielding layer, so that both the first shielding layer and the second shielding layer are grounded, the first shielding layer and the second shielding layer have a good shielding effect, thereby ensuring the normal operation of the flexible circuit board.

[0005] In a first aspect, this application provides a flexible circuit board, including a base layer, a first shielding layer, and a second shielding layer. The first shielding layer and the second shielding layer are respectively located on both sides of the base layer in a first direction. The first shielding layer is used to contact one of a metal bracket and a metal frame. The flexible circuit board further includes a first metal part, a second metal part, and a connecting part. The first metal part is located between the first shielding layer and the base layer, and the second metal part is located between the second shielding layer and the base layer. The base layer has a through hole, and the connecting part passes through the through hole and is connected to both the first metal part and the second metal part.

[0006] This application provides a flexible circuit board, which includes a base layer, a first shielding layer, and a second shielding layer. The first shielding layer and the second shielding layer are respectively located on both sides of the base layer in a first direction, so that the first shielding layer and the second shielding layer respectively achieve electromagnetic shielding on both sides of the base layer in the first direction. This increases the distribution range of the first shielding layer and the second shielding layer, ensures the coverage area of ​​the first shielding layer and the second shielding layer on the base layer, and helps to ensure the shielding capability of the first shielding layer and the second shielding layer against electromagnetic interference from the outside of the flexible circuit board.

[0007] The flexible circuit board also includes a first metal part, a second metal part, and a connecting part. The first metal part is located between the first shielding layer and the base layer, and the second metal part is located between the second shielding layer and the base layer. The base layer has through holes, and the connecting part passes through the through holes and connects to both the first and second metal parts, allowing electrical conduction between the first and second metal parts through the connecting part. Furthermore, since the first metal part is in contact with the first shielding layer, and the second metal part is in contact with the second shielding layer, electrical conduction is also possible between the first and second shielding layers. The first shielding layer is used to contact one of the metal support or the metal frame, allowing the first shielding layer to be grounded through the metal support or the metal frame. The second shielding layer is grounded through the first shielding layer. The fact that both the first and second shielding layers are grounded prevents the induced current formed at the first and second shielding layers from affecting the normal operation of the flexible circuit board, further improving the electromagnetic interference shielding performance of the first and second shielding layers and ensuring the normal operation of the flexible circuit board.

[0008] In one possible implementation, the connecting portion and the through hole are arranged in a one-to-one correspondence, and the number of through holes is at least two, with the at least two through holes spaced apart on the base layer. By arranging the connecting portion and the through hole in a one-to-one correspondence, the number and position of the connecting portion correspond to the through hole, and the number of through holes is at least two, with the at least two through holes spaced apart on the base layer. This increases the connection area between the connecting portion and the first metal portion and the second metal portion, as well as the distribution range of the connecting portion. This is beneficial for improving the current transmission efficiency between the connecting portion and the first metal portion, and between the connecting portion and the second metal portion, thereby improving the current transmission efficiency between the first metal portion and the second metal portion.

[0009] In one possible implementation, the flexible circuit board includes a connected main body and an extension, the extension extending from one side of the main body. The thickness of the main body in the first direction is greater than the thickness of the extension in the first direction. Both the main body and the extension include the base layer, the first shielding layer, and the second shielding layer. The through-hole is located in the extension. By dividing the flexible circuit board into a main body and an extension, with the thickness of the main body in the first direction being greater than the thickness of the extension in the first direction, the flexible circuit board has a smaller thickness at the extension. The through-hole being located in the extension simplifies the through-hole placement. Simultaneously, the through-hole avoids occupying space in the main body for wiring, ensuring the mechanical strength of the main body and thus guaranteeing sufficient overall mechanical strength of the flexible circuit board.

[0010] In one possible implementation, both the first metal portion and the second metal portion are located within the extension portion. By placing both the first and second metal portions within the extension portion, their positions are close to those of the connecting portion, simplifying the connection between the connecting portion and the first and second metal portions. Simultaneously, the thickness of the extension portion in the first direction is less than the thickness of the main body portion in the first direction. By placing both the first and second metal portions within the extension portion, the space within the extension portion in the first direction is utilized efficiently, preventing the main body portion from becoming excessively thick in the first direction and thus reducing the maximum thickness of the flexible circuit board in the first direction.

[0011] In one possible implementation, the base layer includes a first main board and a first secondary board connected together. The first main board is located in the main body, and the first secondary board is located in the extension. Both the first main board and the first secondary board are provided with touch-sensitive traces. By making the base layer include a first main board and a first secondary board connected together, with the first main board located in the main body and the first secondary board located in the extension, and both the first main board and the first secondary board being provided with touch-sensitive traces, the touch function of the flexible circuit board is realized, providing sufficient space for the touch-sensitive traces.

[0012] In one possible implementation, both the first motherboard and the first circuit board are made of rolled copper. By using rolled copper as the material for both the first motherboard and the first circuit board, the fact that rolled copper has good ductility, bending resistance, and conductivity avoids the possibility of cracks easily occurring after bending the first circuit board, which helps to improve the service life of the first circuit board and thus improve the service life of the flexible circuit board.

[0013] In one possible implementation, the main body further includes a second motherboard and a third motherboard, which are respectively located on opposite sides of the first motherboard in the first direction. The second motherboard is situated between the first shielding layer and the first motherboard, and it has a device area. The third motherboard has power traces. By including a second motherboard and a third motherboard in the main body, with the second and third motherboards located on opposite sides of the first motherboard in the first direction, the second motherboard situated between the first shielding layer and the first motherboard, the second motherboard having a device area, and the third motherboard having power traces, the second motherboard provides sufficient space for the device area, test points, and board-to-board traces, while the third motherboard further provides space for the power traces. This helps reduce the burden of power trace placement on the first motherboard and the first board. Simultaneously, the thickness of the main body in the first direction is the sum of the thicknesses of the second, first, and third motherboards in the first direction, resulting in a smaller thickness of the flexible circuit board in the first direction, which is beneficial for achieving thinner and lighter flexible circuit boards and electronic devices.

[0014] In one possible implementation, the second motherboard is made of electrolytic copper. Using electrolytic copper as the material for the second motherboard helps ensure good conductivity of the flexible circuit board and sufficient mechanical strength of the main body. Simultaneously, by combining electrolytic copper and rolled copper, the excellent properties of both materials are fully utilized, which helps ensure the normal operation and long service life of the flexible circuit board.

[0015] In one possible implementation, the main body further includes a fourth motherboard located on the side of the third motherboard away from the first motherboard in the first direction, and the fourth motherboard is provided with input traces. By including a fourth motherboard in the main body, with the fourth motherboard located on the side of the third motherboard away from the first motherboard in the first direction, and the fourth motherboard being provided with input traces, the signal input function is realized, and sufficient space is provided on the fourth motherboard for the arrangement of the input traces.

[0016] In one possible implementation, the fourth main board is made of electrolytic copper. Using electrolytic copper as the material for the fourth main board helps ensure good conductivity of the flexible circuit board and sufficient mechanical strength of the main body. Simultaneously, by combining electrolytic copper and rolled copper, the excellent properties of both materials are fully utilized, which helps ensure the normal operation and long service life of the flexible circuit board.

[0017] In one possible implementation, the first board is located on one side of the first motherboard in a direction perpendicular to the first direction, and a portion of the fourth motherboard protrudes from the first motherboard in a direction perpendicular to the first direction, with the portion of the fourth motherboard and the first board being staggered. By positioning the first board on one side of the first motherboard in a direction perpendicular to the first direction, and having a portion of the fourth motherboard protrude from the first motherboard in a direction perpendicular to the first direction, and staggering the portion of the fourth motherboard and the first board, interference from the fourth motherboard to the bending of the extension is avoided, and the area of ​​the fourth motherboard is appropriately increased, which is beneficial for providing more space for wiring on the fourth motherboard.

[0018] In one possible implementation, the extension further includes a second board, which is connected to the third main board. By including a second board in the extension, which is connected to the third main board, the second board provides further space for power routing, thus reducing the burden of power routing on the first main board and the first motherboard.

[0019] In one possible implementation, both the third main board and the second board are made of rolled copper. By using rolled copper for both the third main board and the second board, the second board has better bending resistance, which helps to improve its service life and thus the service life of the flexible circuit board. The connection between the third main board and the second board, made of rolled copper for the third main board, helps to ensure the stability of the connection and simplifies the setup of the third main board and the second board.

[0020] In one possible implementation, at least a portion of the second plate and the first plate are arranged opposite each other. By arranging at least a portion of the second plate and the first plate opposite each other, the through hole can penetrate both the first plate and the second plate simultaneously, which simplifies the arrangement of the through hole. When the extension bends to other areas according to the actual structure, the first plate and the second plate can be bent synchronously, which simplifies the bending process of the extension.

[0021] Secondly, this application also provides an electronic device, including a metal bracket, a metal frame, and a flexible circuit board as described in any embodiment of the first aspect, wherein a first shielding layer of the flexible circuit board is in contact with one of the metal bracket and the metal frame. The beneficial effects of this embodiment are similar to those of the above embodiments, and will not be repeated here.

[0022] In one possible implementation, the first shielding layer is in contact with the metal support, and the second shielding layer of the flexible circuit board is in contact with the metal frame. By making the first shielding layer in contact with the metal support and the second shielding layer in contact with the metal frame, the flexible circuit board achieves grounding on both sides in the first direction. This helps improve the transmission efficiency of induced current at the first and second shielding layers, ensures the grounding structure of the first and second shielding layers enhances their shielding performance, and guarantees the normal operation of the flexible circuit board.

[0023] In one possible implementation, at least a portion of the flexible circuit board is bent. By bending at least a portion of the flexible circuit board, the internal structure of the electronic device becomes more compact, the integration level of the electronic device is higher, and miniaturization of the electronic device is facilitated. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0025] Figure 2 yes Figure 1 The illustrated embodiment shows a cross-sectional view of the electronic device at point AA;

[0026] Figure 3 This is a cross-sectional view of the flexible circuit board provided in an embodiment of this application;

[0027] Figure 4 This is a top view of the base layer provided in the embodiments of this application;

[0028] Figure 5 yes Figure 4 The illustrated embodiment shows a cross-sectional view of the base layer at point BB;

[0029] Figure 6 This is a cross-sectional view of the flexible circuit board corresponding to the first metal part and at least two connecting parts provided in the embodiments of this application;

[0030] Figure 7 This is a cross-sectional view of a flexible circuit board provided in an embodiment of this application, where the first metal part and the connecting part correspond one-to-one.

[0031] Figure 8 This is a cross-sectional view of a flexible circuit board provided in an embodiment of this application, where both the main body and the extension have a first metal portion.

[0032] Figure 9 This is a cross-sectional view of a flexible circuit board including a second board provided in an embodiment of this application;

[0033] Figure 10This is a top view of the base layer and the second plate provided in the embodiment of this application, in which the first plate and the second plate are arranged alternately.

[0034] Figure 11 This is a cross-sectional view of a flexible circuit board including a fourth motherboard provided in an embodiment of this application;

[0035] Figure 12 This is a cross-sectional view of a flexible circuit board with the fourth main board and the extension having opposite protrusion directions, as provided in the embodiments of this application. Detailed Implementation

[0036] The embodiments of this application are described below with reference to the accompanying drawings.

[0037] For ease of understanding, the English abbreviations and related technical terms used in the embodiments of this application will be explained and described below.

[0038] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0039] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0040] It should be understood that the term "and / or" used in this document is merely a description of the same field in the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0041] Depending on the context, the word "if" as used herein can be interpreted as "when," "when," "in response to determination," or "in response to detection." Similarly, depending on the context, the phrase "if determination" or "if detection (of the stated condition or event)" can be interpreted as "when determination," "in response to determination," "when detection (of the stated condition or event)," or "in response to detection (of the stated condition or event)."

[0042] It should be understood that the terms "first," "second," etc., used in this application are for distinguishing purposes only and should not be construed as indicating or implying relative importance or order.

[0043] In the description of this application, the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] In the description of this application, it should be noted that due to manufacturing or assembly errors, there may be slight angular deviations in the design that should be perpendicular or parallel. For example, a deviation within 15 degrees is also considered perpendicular or parallel as described in this embodiment.

[0045] The phrase "within the range" used in this application, unless otherwise specified, includes both endpoints of the range by default. For example, in the range of 1 to 5, it includes the values ​​1 and 5.

[0046] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can be fixed connections, detachable connections, mating connections or integral connections; those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0047] It should be understood that in this application, "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit signals, such as copper foil or wires on a printed circuit board (PCB). "Connection" and "connected" can both refer to a mechanical or physical connection relationship. For example, A and B being connected or A and B being connected can mean that there are fastening components (such as screws, bolts, rivets, etc.) between A and B, or that A and B are in contact with each other and are difficult to separate.

[0048] In this application, "length" can be understood as the physical length of an object or as electrical length. Electrical length can be expressed as the ratio of the physical length (i.e., mechanical or geometric length) multiplied by the transmission time of an electrical or electromagnetic signal in a medium to the time required for that signal to travel a distance in free space equal to the physical length of the medium. Electrical length can satisfy the following formula:

[0049]

[0050] Where L is the physical length, a is the transmission time of the electrical or electromagnetic signal in the medium, and b is the transmission time in free space.

[0051] Alternatively, electrical length can also refer to the ratio of physical length (i.e., mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave, and electrical length can satisfy the following formula:

[0052]

[0053] Where L is the physical length and λ is the wavelength of the electromagnetic wave.

[0054] Using a flexible circuit board 100 in electronic device 200 enables a more compact structural design and miniaturization of the electronic device 200. However, there are electromagnetic interference sources inside electronic device 200. The interference signals generated by these sources can be transmitted and radiated within electronic device 200, causing electromagnetic interference problems. Circuit devices such as flexible circuit boards 100 are generally sensitive to electromagnetic interference. When the structure of electronic device 200 is compact, flexible circuit boards 100 are more susceptible to electromagnetic interference.

[0055] Electronic device 200 includes, but is not limited to, mobile phones, tablets, personal computers, laptops, wearable devices, and other electronic products. In this embodiment, a mobile phone is used as an example for illustration.

[0056] Please see Figure 1 , Figure 1 A schematic diagram of the structure of an electronic device 200 provided in an embodiment of this application is shown. The electronic device 200 typically includes a display screen, a metal frame 220, and a flexible circuit board 100. The display screen is located on the metal frame 220 in a first direction (e.g., ...). Figure 1 On one side of the Z direction (as shown), the metal frame 220 supports and connects to the display screen to ensure the stability of the display screen position. The flexible circuit board 100 is electrically connected to the display screen. Touch traces are provided on the flexible circuit board 100 so that the user can input touch signals after touching the display screen.

[0057] The electronic device 200 also includes a metal bracket 210 for supporting the flexible circuit board 100. At least a portion of the flexible circuit board 100 is disposed between the metal bracket 210 and the metal frame 220, such that the metal bracket 210 and the metal frame 220 are spaced apart. An electrostatic field can be formed between the spaced-apart metal bracket 210 and metal frame 220, thereby forming a capacitor. When a user touches the display screen, the metal frame 220 is subjected to external force, causing a change in the distance between the metal bracket 210 and the metal frame 220. This changes the capacitance value of the capacitor formed by the metal bracket 210 and the metal frame 220, and generates electromagnetic interference to the flexible circuit board 100 located between the metal bracket 210 and the metal frame 220, affecting the normal operation of the flexible circuit board 100.

[0058] This application provides a flexible circuit board 100, please refer to... Figure 1 and Figure 2 , Figure 2 It shows Figure 1 The illustrated embodiment shows a cross-sectional view of the electronic device 200 at point AA. The flexible circuit board 100 includes a base layer 10, a first shielding layer 20, and a second shielding layer 30. The first shielding layer 20 and the second shielding layer 30 are respectively located on the base layer 10 in a first direction (e.g., ...). Figure 1 and Figure 2 On opposite sides in the Z direction (as shown), the base layer 10 is used to support the first shielding layer 20 and the second shielding layer 30. The base layer 10 and the first shielding layer 20 can be directly connected or indirectly connected. Similarly, the base layer 10 and the second shielding layer 30 can be directly connected or indirectly connected.

[0059] Both the first shielding layer 20 and the second shielding layer 30 are used to shield the flexible circuit board 100 from electromagnetic interference from the outside, ensuring the normal operation of the flexible circuit board 100 between the first shielding layer 20 and the second shielding layer 30. The materials of both the first shielding layer 20 and the second shielding layer 30 are electromagnetic interference (EMI) materials. These materials include, but are not limited to, at least one of the elemental metals copper, nickel, chromium, aluminum, silver, gold, iron, and tin, or any alloy composed of the aforementioned elemental metals, such as stainless steel. The materials of the first shielding layer 20 and the second shielding layer 30 can be the same or different.

[0060] The first shielding layer 20 and the second shielding layer 30 are respectively located on opposite sides of the base layer 10 in the first direction, such that the base layer 10 is situated between the first shielding layer 20 and the second shielding layer 30. The first shielding layer 20 and the second shielding layer 30 respectively provide electromagnetic shielding on both sides of the base layer 10 in the first direction, increasing the distribution range of the first shielding layer 20 and the second shielding layer 30. Simultaneously, both the first shielding layer 20 and the second shielding layer 30 have a large area, ensuring the coverage area of ​​the first shielding layer 20 and the second shielding layer 30 over the base layer 10, thus increasing the shielding range of the first shielding layer 20 and the second shielding layer 30. The first shielding layer 20 and the second shielding layer 30 have a large distribution range and shielding range relative to the substrate, which is beneficial for ensuring the shielding capability of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference.

[0061] Please see Figure 1 and Figure 2At least a portion of the flexible circuit board 100 is located between the metal support 210 and the metal frame 220. The metal support 210 and the metal frame 220 form a capacitor. When the distance between the metal support 210 and the metal frame 220 changes, the capacitance value of the capacitor formed by the metal support 210 and the metal frame 220 changes, generating electromagnetic interference to the flexible circuit board 100 located between the metal support 210 and the metal frame 220. Although the first shielding layer 20 and the second shielding layer 30 can shield most of the electromagnetic interference outside the flexible circuit board 100, electrostatic magnetic fields can still easily exist at the first shielding layer 20 and the second shielding layer 30, and induced currents can be formed at the first shielding layer 20 and the second shielding layer 30, affecting the normal operation of the flexible circuit board 100.

[0062] The first shielding layer 20 is used to contact either the metal support 210 or the metal frame 220. Specifically, the first shielding layer 20 can contact the metal support 210, allowing current to flow from the first shielding layer 20 to the metal support 210, and the first shielding layer 20 is grounded through the metal support 210. Alternatively, the first shielding layer 20 can contact the metal frame 220, allowing current to flow from the first shielding layer 20 to the metal frame 220, and the first shielding layer 20 is grounded through the metal frame 220. Grounding the first shielding layer 20 through either the metal support 210 or the metal frame 220 prevents the induced current at the first shielding layer 20 from affecting the flexible circuit board 100, thus ensuring the normal operation of the flexible circuit board 100.

[0063] Please see Figure 2 and Figure 3 , Figure 3A cross-sectional view of a flexible circuit board 100 provided in an embodiment of this application is shown. The flexible circuit board 100 further includes a first metal portion 11, a second metal portion 12, and a connecting portion 13. The materials of the first metal portion 11, the second metal portion 12, and the connecting portion 13 include, but are not limited to, elemental copper or copper alloys, such that the first shielding layer 20, the second shielding layer 30, the first metal portion 11, the second metal portion 12, and the connecting portion 13 are all conductive materials. The first metal portion 11 is located between the first shielding layer 20 and the base layer 10, and the first metal portion 11 is in contact with the first shielding layer 20, allowing current to be transmitted between the first shielding layer 20 and the first metal portion 11, thus achieving electrical conduction between the first shielding layer 20 and the first metal portion 11. The second metal portion 12 is located between the second shielding layer 30 and the base layer 10, and the second metal portion 12 is in contact with the second shielding layer 30, allowing current to be transmitted between the second shielding layer 30 and the second metal portion 12, thus achieving electrical conduction between the second shielding layer 30 and the second metal portion 12. The base layer 10 is spaced apart by a first metal part 11 and a second metal part 12. The base layer 10 has a through hole 14. A connecting part 13 is located in the through hole 14 and passes through the through hole 14 to connect with both the first metal part 11 and the second metal part 12. This allows the spaced first metal part 11 and the second metal part 12 to be indirectly connected through the connecting part 13. Current can be transmitted between the first metal part 11 and the second metal part 12 through the connecting part 13, thus realizing electrical conduction between the first metal part 11 and the second metal part 12.

[0064] Please see Figure 2 When an induced current is generated at the second shielding layer 30, this induced current passes sequentially through the second metal part 12, the connecting part 13, and the first metal part 11, and is finally transmitted from the first metal part 11 to the first shielding layer 20. The first shielding layer 20 is grounded through the metal bracket 210 or the metal frame 220, so that the second shielding layer 30 is grounded through the first shielding layer 20. This avoids the induced current at the second shielding layer 30 from affecting the flexible circuit board 100, which helps ensure the normal operation of the flexible circuit board 100. By setting the first metal part 11, the connecting part 13, and the second metal part 12 connected in sequence, both the first shielding layer 20 and the second shielding layer 30 are grounded, avoiding the induced current generated at the first shielding layer 20 and the second shielding layer 30 from affecting the normal operation of the flexible circuit board 100. This further improves the shielding performance of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference, ensuring the normal operation of the flexible circuit board 100.

[0065] In one embodiment, please refer to Figure 1 and Figure 2 A portion of the flexible circuit board 100 is located between the metal support 210 and the metal frame 220, such that the metal support 210 and the metal frame 220 are positioned in a first direction (e.g., Figure 1 and Figure 2 The shielding layers are spaced apart along the Z-direction (as shown). The first shielding layer 20 contacts the metal support 210, allowing the first shielding layer 20 to be grounded through the metal support 210, thus preventing the induced current at the first shielding layer 20 from affecting the flexible circuit board 100. The second shielding layer 30 contacts the metal frame 220, allowing the second shielding layer 30 to be grounded through the metal frame 220, thus preventing the induced current at the second shielding layer 30 from affecting the flexible circuit board 100. Both of these factors contribute to ensuring the normal operation of the flexible circuit board 100. Simultaneously, since the first shielding layer 20 and the metal support 210 are in direct contact, and the second shielding layer 30 and the metal frame 220 are in direct contact, the second shielding layer 30 does not need to be grounded through the first shielding layer 20. The flexible circuit board 100 achieves grounding on both sides in the first direction, which helps improve the transmission efficiency of the induced current at the first shielding layer 20 and the second shielding layer 30, ensuring the improved shielding performance of the first shielding layer 20 and the second shielding layer 30, and guaranteeing the normal operation of the flexible circuit board 100.

[0066] This application provides a flexible circuit board 100, which includes a base layer 10, a first shielding layer 20, and a second shielding layer 30. The first shielding layer 20 and the second shielding layer 30 are respectively located on both sides of the base layer 10 in a first direction, so that the first shielding layer 20 and the second shielding layer 30 respectively achieve electromagnetic shielding on both sides of the base layer 10 in the first direction. This increases the distribution range of the first shielding layer 20 and the second shielding layer 30, ensures the coverage area of ​​the first shielding layer 20 and the second shielding layer 30 on the base layer 10, and helps to ensure the shielding capability of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference from the outside of the flexible circuit board 100.

[0067] The first shielding layer 20 is used to contact one of the metal support 210 and the metal frame 220, so that the first shielding layer 20 is grounded through the metal support 210 or the metal frame 220. The flexible circuit board 100 also includes a first metal part 11, a second metal part 12 and a connecting part 13. The first metal part 11 is located between the first shielding layer 20 and the base layer 10, and the second metal part 12 is located between the second shielding layer 30 and the base layer 10. The base layer 10 has a through hole 14, and the connecting part 13 passes through the through hole 14 and is connected to both the first metal part 11 and the second metal part 12, so that the first metal part 11 and the second metal part 12 achieve electrical conduction through the connecting part 13. Since the first metal part 11 is in contact with the first shielding layer 20, and the second metal part 12 is in contact with the second shielding layer 30, electrical conduction can be achieved between the first shielding layer 20 and the second shielding layer 30. The induced current at the second shielding layer 30 can sequentially pass through the second metal part 12, the connecting part 13, and the first metal part 11, and finally be transmitted from the first metal part 11 to the first shielding layer 20, so that the second shielding layer 30 is grounded through the first shielding layer 20. Since both the first shielding layer 20 and the second shielding layer 30 are grounded, the induced current formed at the first shielding layer 20 and the second shielding layer 30 is prevented from affecting the normal operation of the flexible circuit board 100. This further improves the shielding performance of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference, ensuring the normal operation of the flexible circuit board 100.

[0068] For one possible implementation, please refer to Figure 4 and Figure 5 , Figure 4 A top view of the base layer 10 provided in an embodiment of this application is shown. Figure 5 It shows Figure 4 The illustrated embodiment shows a cross-sectional view of the base layer 10 at point BB. The base layer 10 has through holes 14, with at least two through holes 14. Connecting portions 13 are provided in a one-to-one correspondence with the through holes 14, such that the number of connecting portions 13 and through holes 14 is equal. There are at least two connecting portions 13, and both connecting portions 13 are connected to the first metal portion 11 and the second metal portion 12. This increases the connection area between the connecting portions 13 and the first metal portion 11 and the second metal portion 12, which is beneficial for improving the current transmission efficiency between the connecting portions 13 and the first metal portion 11, and also improves the current transmission efficiency between the connecting portions 13 and the second metal portion 12, thereby improving the current transmission efficiency between the first metal portion 11 and the second metal portion 12.

[0069] The connecting portion 13 and the through hole 14 are arranged in a one-to-one correspondence, so that the setting position of the connecting portion 13 corresponds to the setting position of the through hole 14. At least two through holes 14 are arranged at intervals on the base layer 10, so that at least two connecting portions 13 are arranged at intervals. The distribution range of the at least two connecting portions 13 is larger than that of the first metal portion 11 and the second metal portion 12, which is beneficial to improving the current transmission efficiency between the connecting portion 13 and the first metal portion 11, and between the connecting portion 13 and the second metal portion 12, thereby improving the current transmission efficiency between the first metal portion 11 and the second metal portion 12.

[0070] The number, size, and spacing of the through holes 14 can be configured according to actual needs. This ensures that the base layer 10 has sufficient mechanical strength at the locations of the through holes 14, which is beneficial for ensuring the stability and service life of the flexible circuit board 100 structure. Simultaneously, it provides sufficient connection area between the connecting portion 13 and the first metal portion 11 and the second metal portion 12, guaranteeing efficient current transmission between them. The connecting portion 13 can fill the through holes 14 to enhance the mechanical strength of the base layer 10 at the locations of the through holes 14, and to provide a large connection area between the connecting portion 13 and both the first metal portion 11 and the second metal portion 12, thereby improving the efficiency of current transmission between them.

[0071] When the number of connecting parts 13 is at least two, the first metal part 11 can be provided corresponding to at least two connecting parts 13, or the first metal part 11 and the connecting parts 13 can be provided in a one-to-one correspondence; similarly, the second metal part 12 can be provided corresponding to at least two connecting parts 13, or the second metal part 12 and the connecting parts 13 can be provided in a one-to-one correspondence. The following will combine... Figure 6 and Figure 7 The illustrated embodiment provides a detailed description of the correspondence between the first metal part 11, the second metal part 12, and the connecting part 13.

[0072] In one embodiment, please refer to Figure 6 , Figure 6A cross-sectional view of a flexible circuit board 100 corresponding to a first metal portion 11 and at least two connecting portions 13 provided in an embodiment of this application is shown. The flexible circuit board 100 has a single first metal portion 11, and at least two connecting portions 13 are connected to the single first metal portion 11. Since the at least two connecting portions 13 are spaced apart, the distribution range of the first metal portion 11 is large, and the first metal portion 11 has a large area, which is beneficial to simplifying the connection arrangement of the first metal portion 11 and the connecting portions 13, and to giving the first metal portion 11 and the first shielding layer 20 a large contact area, which is also beneficial to improving the current transmission efficiency between the first metal portion 11 and the first shielding layer 20. Similarly, the flexible circuit board 100 has a single second metal portion 12, and at least two connecting portions 13 are connected to the single second metal portion 12, which is beneficial to simplifying the connection arrangement of the second metal portion 12 and the connecting portions 13, and to improving the current transmission efficiency between the second metal portion 12 and the second shielding layer 30.

[0073] In one embodiment, please refer to Figure 7 , Figure 7 This illustration shows a cross-sectional view of a flexible circuit board 100 according to an embodiment of this application, where the first metal portions 11 and connecting portions 13 correspond one-to-one. The flexible circuit board 100 includes at least two connecting portions 13, and the first metal portions 11 and connecting portions 13 are arranged in a one-to-one correspondence such that the number of first metal portions 11 and the number of connecting portions 13 are equal, with at least two first metal portions 11. The first metal portions 11 and connecting portions 13 are arranged in a first direction (e.g., ...). Figure 7 The first metal parts 11 are arranged opposite each other in the Z direction (as shown), which reduces the area of ​​each individual first metal part 11, thus reducing the total mass of at least two first metal parts 11 and consequently reducing the mass of the flexible circuit board 100. Similarly, the second metal parts 12 and the connecting parts 13 are arranged in a one-to-one correspondence, with at least two second metal parts 12. The second metal parts 12 and the connecting parts 13 are opposite each other in the first direction, which reduces the area of ​​each individual second metal part 12, thus reducing the total mass of at least two second metal parts 12 and consequently reducing the mass of the flexible circuit board 100.

[0074] For one possible implementation, please refer to Figure 3 The flexible circuit board 100 includes a main body 110 and an extension 120. The extension 120 extends from one side of the main body 110 and is connected to the main body 110. The main body 110 is in a first direction (e.g., Figure 3The thickness of the main body 110 in the Z direction (as shown) is greater than the thickness of the extension 120 in the first direction. Let the thickness of the main body 110 in the first direction be H1 and the thickness of the extension 120 in the first direction be H2. The main body 110 and the extension 120 satisfy the relationship: H1 > H2. By making the main body 110 and the extension 120 satisfy the above relationship, the thickness of the main body 110 in the first direction and the thickness of the extension 120 in the first direction are reasonably configured. The main body 110 has a larger thickness, which is beneficial to ensure that the flexible circuit board 100 has better mechanical strength. The extension 120 has a smaller thickness, which allows the extension 120 to be bent according to actual needs. The flexible circuit board 100 is more flexibly installed in the electronic device 200.

[0075] The extension 120 serves as an extension of the main body 110, expanding the space of the main body 110. This allows some of the traces of the flexible circuit board 100 to be placed at the extension 120, reducing the number of traces at the main body 110. This helps to reduce the volume of the main body 110, especially the thickness of the main body 110 in the first direction, resulting in a smaller overall thickness of the flexible circuit board 100 and thus achieving a thinner and lighter electronic device 200.

[0076] Meanwhile, the thickness of the extension 120 in the first direction is less than the thickness of the main body 110 in the first direction, resulting in a smaller thickness for the extension 120, making it easier to bend compared to the main body 110. When the flexible circuit board 100 is disposed in the electronic device 200, the extension 120 can be bent to other areas of space according to the actual structure, making full use of the internal space of the electronic device 200 and realizing the folding of the flexible circuit board 100 structure, making the internal structure of the electronic device 200 more compact, the integration degree of the electronic device 200 higher, and facilitating the miniaturization of the electronic device 200.

[0077] Please see Figure 3 Both the main body 110 and the extension 120 include a base layer 10, a first shielding layer 20 and a second shielding layer 30, that is, a portion of the base layer 10 is located in the main body 110 and another portion of the base layer 10 is located in the extension 120; similarly, a portion of the first shielding layer 20 and a portion of the second shielding layer 30 are located in the main body 110 and another portion of the first shielding layer 20 and another portion of the second shielding layer 30 are located in the extension 120.

[0078] In one embodiment, please refer to Figure 3 and Figure 4The base layer 10 located at the main body 110 and the base layer 10 located at the extension 120 are integral structures, which simplifies the fabrication of the flexible circuit board 100. Similarly, the first shielding layer 20 located at the main body 110 and the first shielding layer 20 located at the extension 120 can be integral structures, and the second shielding layer 30 located at the main body 110 and the second shielding layer 30 located at the extension 120 can be integral structures, which simplifies the arrangement of the first shielding layer 20 and the second shielding layer 30.

[0079] Both the main body 110 and the extension 120 include a base layer 10, which has a through hole 14. The through hole 14 can be located in either the main body 110 or the extension 120. A connecting part 13 passes through the through hole 14, such that the position of the connecting part 13 corresponds to the position of the through hole 14. That is, the connecting part 13 can be located in either the main body 110 or the extension 120, ensuring that the first shielding layer 20 and the second shielding layer 30 can achieve electrical conduction through the first metal part 11, the second metal part 12, and the connecting part 13.

[0080] In one embodiment, please refer to Figure 3 The through-hole 14 is located in the extension 120. Since the thickness of the extension 120 in the first direction is less than the thickness of the main body 110 in the first direction, the flexible circuit board 100 has a smaller thickness at the extension 120, which simplifies the setting of the through-hole 14. The through-hole 14 is located in the extension 120, which reduces the mechanical strength of the extension 120 and allows the extension 120 to be bent according to actual needs, making the setting of the flexible circuit board 100 in the electronic device 200 more flexible. At the same time, the through-hole 14 is set away from the main body 110, which avoids the through-hole 14 occupying the space of the main body 110 used for wiring, and ensures the mechanical strength of the main body 110, thereby ensuring that the flexible circuit board 100 as a whole has sufficient mechanical strength.

[0081] The first metal part 11 is located between the first shielding layer 20 and the base layer 10. Both the main body 110 and the extension 120 include the base layer 10 and the first shielding layer 20. That is, the first metal part 11 can be disposed at the main body 110 or at the extension 120. The second metal part 12 is located between the second shielding layer 30 and the base layer 10. Both the main body 110 and the extension 120 include the second shielding layer 30. Similarly, the second metal part 12 can be disposed at the main body 110 or at the extension 120. The following will be combined with... Figure 6 and Figure 8 The embodiments shown will provide a detailed description of the positions of the first metal part 11 and the second metal part 12.

[0082] In one embodiment, please refer to Figure 6 The through hole 14 is located in the extension 120, so that the connecting part 13 is located in the extension 120. The first metal part 11 and the second metal part 12 are both located in the extension 120. The positions of the first metal part 11 and the second metal part 12 are close to the connecting part 13, which helps to simplify the connection between the connecting part 13 and the first metal part 11 and the second metal part 12. At the same time, the extension 120 in the first direction (e.g. Figure 6 The thickness in the Z direction (as shown) is less than the thickness of the main body 110 in the first direction. By placing both the first metal part 11 and the second metal part 12 in the extension 120, it is beneficial to make reasonable use of the space of the extension 120 in the first direction, avoid the thickness of the main body 110 in the first direction being too large, and reduce the maximum thickness of the flexible circuit board 100 in the first direction.

[0083] In one embodiment, please refer to Figure 8 , Figure 8 A cross-sectional view of a flexible circuit board 100, provided in an embodiment of this application, is shown, in which both the main body 110 and the extension 120 have a first metal part 11. A through hole 14 is located in the extension 120, such that the connecting part 13 is located in the extension 120. Part of the first metal part 11 and part of the second metal part 12 are located in the extension 120, such that the positions of the first metal part 11 and the second metal part 12 are close to those of the connecting part 13, which is beneficial to simplifying the connection between the connecting part 13 and the first metal part 11 and the second metal part 12. Another part of the first metal part 11 and another part of the second metal part 12 are located in the main body part 110. The distribution range of the first metal part 11 and the second metal part 12 is increased, which is beneficial to increase the contact area between the first metal part 11 and the first shielding layer 20, improve the current transmission efficiency between the first metal part 11 and the first shielding layer 20, increase the contact area between the second metal part 12 and the second shielding layer 30, improve the current transmission efficiency between the second metal part 12 and the second shielding layer 30, further improve the shielding performance of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference, and ensure the normal operation of the flexible circuit board 100.

[0084] For one possible implementation, please refer to Figure 3 and Figure 4 The base layer 10 includes a first motherboard 111 and a first primary board 121. The first motherboard 111 is located in the main body 110, and the first primary board 121 is located in the extension 120. The first motherboard 111 and the first primary board 121 can be an integral structure to simplify the setup of the base layer 10 and ensure the stability of the connection between the first motherboard 111 and the first primary board 121. The first primary board 121 is used to expand the space of the first motherboard 111. Both the first motherboard 111 and the first primary board 121 can be used to set up wiring, so that the first primary board 121 relieves the wiring setup pressure at the first motherboard 111.

[0085] Please see Figure 3 and Figure 4 The first motherboard 111 and the first board 121 are connected, and the first board 121 is located in the second direction of the first motherboard 111 (e.g., Figure 3 and Figure 4 On one side of the X direction (as shown), the second direction is perpendicular to the first direction (e.g., the X direction). Figure 3 As shown in the Z direction, the first board 121 extends from one side of the first main board 111 in the second direction to make full use of the space of the first main board 111 perpendicular to the first direction, avoiding the need to increase the thickness of the main body 110 in the first direction, which is conducive to achieving a thinner and lighter flexible circuit board 100 and electronic device 200. If the first board 121 is not provided, since the size of the first main board 111 is fixed, the space available for the first main board 111 to set up wiring is limited. It is necessary to set up an additional board on at least one side of the first main board 111 in the first direction, and use the space of the additional board to set up extra wiring. The thickness of the first main board 111 and the additional board in the first direction is large, which is not conducive to achieving a thinner and lighter flexible circuit board 100 and electronic device 200.

[0086] Third direction (e.g.) Figure 4 The Y direction shown is perpendicular to both the first and second directions. The lengths of the first motherboard 111 and the first board 121 in the third direction can be set according to actual needs so that the first motherboard 111 and the first board 121 provide sufficient space for the wiring of the flexible circuit board 100.

[0087] Various types of traces can be configured on the first motherboard 111 and the first board 121 to construct different functional modules, and to provide sufficient space for these traces. The traces configured on the first motherboard 111 and the first board 121 include, but are not limited to, touch traces, power traces, and board-to-board traces.

[0088] In one embodiment, both the first motherboard 111 and the first substrate 121 are provided with touch traces. The touch traces are used to realize the touch function of the flexible circuit board 100. The first motherboard 111 and the first substrate 121 provide sufficient space for the touch traces, which is conducive to the reasonable arrangement of the touch traces. The base layer 10 includes the first motherboard 111 and the first substrate 121. The base layer 10 is located between the first shielding layer 20 and the second shielding layer 30, so that the first motherboard 111 and the first substrate 121 are located between the first shielding layer 20 and the second shielding layer 30, that is, the touch traces are located between the first shielding layer 20 and the second shielding layer 30. This avoids electromagnetic interference affecting the normal operation of the touch traces, such as avoiding the electromagnetic interference caused by the change in the spacing between the metal frame 220 and the metal bracket 210, thus ensuring the normal operation of the flexible circuit board 100.

[0089] The first plate 121 is located in the extension 120. The extension 120 can be bent to other areas according to the actual structure, making full use of the internal space of the electronic device 200 and realizing the miniaturization of the electronic device 200. Therefore, the first plate 121 can be made of a material with good bending resistance to improve the service life of the first plate 121 and avoid the problem that the first plate 121 is prone to cracks after bending, which would cause the first plate 121 to break easily after bending.

[0090] In one embodiment, the material of the first board 121 is rolled copper. Rolled copper has good ductility, bending resistance, and conductivity, which helps to improve the service life of the first board 121, thereby improving the service life of the flexible circuit board 100. The first main board 111 and the first board 121 are both located on the base layer 10. The first main board 111 and the first board 121 are an integral structure, so that the material of the first main board 111 is the same as that of the first board 121. This helps to simplify the setting of the base layer 10 and ensure the stability of the connection between the first main board 111 and the first board 121. That is, the material of the first main board 111 is also rolled copper.

[0091] For one possible implementation, please refer to Figure 3 The main body 110 includes a first motherboard 111, a second motherboard 112, and a third motherboard 113, and the extension 120 includes a first board 121. The second motherboard 112 and the third motherboard 113 are respectively located on both sides of the first motherboard 111 in a first direction, that is, the third motherboard 113, the first motherboard 111, and the second motherboard 112 are arranged sequentially in the first direction. The first board 121 is connected to the first motherboard 111, and the first board 121 is located on one side of the first motherboard 111 in a second direction, such that the first board 121 is located on one side of the second motherboard 112 and the third motherboard 113 in the second direction.

[0092] The extension 120 extends from one side of the main body 110, that is, the first plate 121 extends from one side of the first main plate 111, the second main plate 112, and the third main plate 113. The first plate 121 protrudes from the first main plate 111, the second main plate 112, and the third main plate 113 in the second direction, which facilitates the subsequent bending of the first plate 121 and avoids the arrangement of the second main plate 112 and the third main plate 113 interfering with the bending of the first plate 121. The edge of at least one of the second main plate 112 and the third main plate 113 is flush with the edge where the first main plate 111 and the first plate 121 connect. That is, on a plane perpendicular to the first direction, the orthographic projection of at least one of the second main plate 112 and the third main plate 113 is connected to the orthographic projection of the first plate 121, so as to ensure that the thickness of the main body 110 is greater than the thickness of the extension 120 and to limit the bending range of the extension 120.

[0093] In one embodiment, please refer to Figure 3 The third motherboard 113, the first motherboard 111, and the second motherboard 112 are stacked in the first direction. In the second direction, the edges of the second motherboard 112 and the third motherboard 113 near the first motherboard 121 are flush with the edge of the first motherboard 111 near the first motherboard 121. This simplifies the arrangement of the first motherboard 111, the second motherboard 112, and the third motherboard 113, and allows for a reasonable configuration of the size of the main body 110 and the extension 120. This reasonable configuration of the size of the main body 110 and the extension 120 ensures that both the second motherboard 112 and the third motherboard 113 have a large connection area with the first motherboard 111, guaranteeing the stability of the main body 110 structure. Simultaneously, the extension 120 has sufficient size for wiring or bending, facilitating the spatial expansion of the main body 110 by the extension 120 and fully utilizing the internal space of the electronic device 200.

[0094] Please see Figure 3 Both the main body 110 and the extension 120 include a first shielding layer 20 and a second shielding layer 30. The second motherboard 112 is located between the first shielding layer 20 and the first motherboard 111, and the third motherboard 113 is located between the second shielding layer 30 and the first motherboard 111. This arrangement ensures the normal operation of the first motherboard 111, second motherboard 112, and third motherboard 113, all situated between the first shielding layer 20 and the second shielding layer 30. Similarly, the first board 121 is located between the first shielding layer 20 and the second shielding layer 30, which also ensures its normal operation.

[0095] In one embodiment, please refer to Figure 3The through hole 14 penetrates the first plate 121, so that the connecting part 13 is located at the first plate 121. The first metal part 11 and the second metal part 12 are respectively located on opposite sides of the first plate 121 in the first direction. The first metal part 11, the connecting part 13, the first plate 121 and the second metal part 12 are all located between the first shielding layer 20 and the second shielding layer 30, so that the first shielding layer 20 and the second shielding layer 30 can achieve electrical conduction through the first metal part 11, the connecting part 13 and the second metal part 12, which is beneficial to improving the shielding performance of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference.

[0096] Various types of traces can be configured on the second motherboard 112 and the third motherboard 113 to construct different functional modules and provide sufficient space for these traces. The second motherboard 112 can be configured with, but is not limited to, device areas, test points, and board-to-board traces, while the third motherboard 113 can be configured with, but is not limited to, power traces and board-to-board traces.

[0097] In one embodiment, the second motherboard 112 is provided with a device area, test points, and board-to-board traces. The device area provides space for the devices to be placed on the second motherboard 112 and realizes the electrical connection between the devices and the second motherboard 112. The test points are used to realize the electrical connection between the test instruments and the second motherboard 112. The board-to-board traces are distributed on two opposite surfaces of the second motherboard 112 in a first direction and are used to realize the electrical connection between the second motherboard 112 and its adjacent boards in the first direction. The first motherboard 111 and the first board 121 are both provided with touch traces, power traces, and board-to-board traces. The touch traces are used to realize the touch function of the flexible circuit board 100, the power traces are used to realize the power supply of the flexible circuit board 100, and the board-to-board traces are distributed on two opposite surfaces of the first motherboard 111 and the first board 121 in a first direction. The board-to-board traces at the first motherboard 111 are used to realize the electrical connection between the first motherboard 111 and its adjacent boards in the first direction, and the board-to-board traces at the first board 121 are used to realize the electrical connection between the first board 121 and its adjacent boards in the first direction. The third motherboard 113 has power supply traces, which are used to power the flexible circuit board 100.

[0098] By ensuring that the second motherboard 112, the first motherboard 111, the first board 121, and the third motherboard 113 meet the routing configuration described in the above embodiments, the routing configuration of the flexible circuit board 100 is made more reasonable, which is beneficial to ensuring the basic functions of the flexible circuit board 100. The second motherboard 112 provides sufficient space for the device area, test points, and board-to-board routing. The first motherboard 111 and the first board 121 provide sufficient space for touch routing, power routing, and board-to-board routing. The third motherboard 113 further provides space for power routing, which helps to reduce the burden of power routing on the first motherboard 111 and the first board 121. At the same time, the thickness of the main body 110 in the first direction is the sum of the thicknesses of the second motherboard 112, the first motherboard 111, and the third motherboard 113 in the first direction, and the thickness of the extension 120 in the first direction is the same as the thickness of the first board 121 in the first direction, making the thickness of the flexible circuit board 100 in the first direction smaller, which is beneficial to achieving the thinning and lightening of the flexible circuit board 100 and the electronic device 200.

[0099] The materials of the first motherboard 111, the first board 121, the second motherboard 112, and the third motherboard 113 can be set according to their actual functions and requirements to ensure the normal operation of the flexible circuit board 100 and to ensure that the flexible circuit board 100 has a good service life.

[0100] In one embodiment, the second main board 112 is made of electrolytic copper, the first main board 111 and the first primary board 121 are both made of rolled copper, and the third main board 113 is made of, but is not limited to, electrolytic copper or rolled copper. Electrolytic copper has stronger conductivity and hardness than rolled copper. By using electrolytic copper as the material for the second main board 112, it is beneficial to ensure that the flexible circuit board 100 has better conductivity and that the main body 110 has sufficient mechanical strength. Rolled copper has better bending resistance than electrolytic copper. By using rolled copper as the material for the first primary board 121, it is easier for the first primary board 121 to be bent to other areas according to the actual structure. The better bending resistance of the first primary board 121 is beneficial to improving the service life of the first primary board 121, thereby improving the service life of the flexible circuit board 100. The first motherboard 111 and the first primary board 121 are integrated into a single structure. By using rolled copper as the material for the first motherboard 111, the stability of the connection between the first motherboard 111 and the first primary board 121 is ensured, and the setup of the first motherboard 111 and the first primary board 121 is simplified. At the same time, the main body 110 is composed of both electrolytic copper and rolled copper, which helps ensure that the main body 110 has sufficient mechanical strength and can withstand bending. The flexible circuit board 100 is composed of both electrolytic copper and rolled copper, making full use of the excellent properties of the two materials, which helps ensure the normal operation and long service life of the flexible circuit board 100.

[0101] For example, please refer to Figure 3 The first board 121 is bent along the first direction toward the side closer to the third board 113, so that the bending stress at the connection between the first board 111 and the first board 121 is close to the third board 113. The material of the third board 113 is rolled copper, so that the material of the first board 111 and the third board 113 are the same. The third board 113 has better bending resistance. The third board 113 can deform to disperse the bending stress generated by the bending of the first board 121, reduce the bending stress at the first board 121, and improve the service life of the flexible circuit board 100.

[0102] For one possible implementation, please refer to Figure 9 , Figure 9 This illustration shows a cross-sectional view of a flexible circuit board 100 including a second board 122 according to an embodiment of this application. The main body 110 includes a first main board 111, a second main board 112, and a third main board 113, and the extension 120 includes a first board 121 and a second board 122. The second main board 112 and the third main board 113 are respectively located on the first main board 111 in a first direction (e.g., ...). Figure 9 The third motherboard 113, the first motherboard 111, and the second motherboard 112 are sequentially arranged on both sides of the first motherboard 111 in the Z direction (as shown). The first motherboard 121 is connected to the first motherboard 111, and the first motherboard 121 is located on the first motherboard 111 in the second direction (as shown). Figure 9 On one side of the X direction (as shown), the second board 122 and the third board 113 are connected. The second board 122 is located on one side of the third board 113 in the second direction. The second board 122 and the third board 113 can be an integrated structure to simplify the setup process of the second board 122 and the third board 113.

[0103] The extension 120 extends from one side of the main body 110. Specifically, the first plate 121 and the second plate 122 both extend from one side of the first main plate 111, the second main plate 112, and the third main plate 113. Both the first plate 121 and the second plate 122 protrude from the first main plate 111, the second main plate 112, and the third main plate 113 in a second direction, facilitating subsequent bending of the first plate 121 and the second plate 122. The edge of the second main plate 112 is flush with the edges of the first plate 121 and the second plate 122. That is, on a plane perpendicular to the first direction, the orthographic projection of the second main plate 112 is connected to the orthographic projection of the first plate 121 and the second plate 122, ensuring that the thickness of the main body 110 is greater than the thickness of the extension 120 and limiting the bending range of the extension 120.

[0104] The extension 120 includes a first plate 121 and a second plate 122. At least a portion of the second plate 122 can be disposed opposite to the first plate 121 in a first direction, or the first plate 121 and the second plate 122 can be disposed alternately. The following will describe... Figure 9 and Figure 10 The embodiment shown provides a detailed description of the relative positions of the first plate 121 and the second plate 122.

[0105] In one embodiment, please refer to Figure 9 At least a portion of the second plate 122 and the first plate 121 are arranged opposite each other in the first direction, that is, in a plane perpendicular to the first direction, at least a portion of the orthographic projection of the second plate 122 coincides with the orthographic projection of the first plate 121. The extension 120 has a through hole 14, which can simultaneously penetrate the first plate 121 and the second plate 122, which helps to simplify the arrangement of the through hole 14. When the extension 120 is bent to other areas according to the actual structure, the first plate 121 and the second plate 122 can be bent synchronously, which helps to simplify the bending process of the extension 120.

[0106] In one embodiment, please refer to Figure 10 , Figure 10 The diagram shows a top view of the base layer 10 and the second plate 122, which are arranged in an alternating manner according to an embodiment of this application. The first plate 121 and the second plate 122 are arranged in an alternating manner, meaning that on a plane perpendicular to the first direction, the orthographic projection of the second plate 122 and the orthographic projection of the first plate 121 are spaced apart. The extension 120 has a through hole 14, and both the first plate 121 and the second plate 122 have through holes 14, so that both the first plate 121 and the second plate 122 have connecting portions 13. The distribution range of the through holes 14 and the connecting portions 13 is relatively large, which is beneficial to improving the current transmission efficiency between the first metal portion 11 and the second metal portion 12. When the extension 120 is bent to other areas according to the actual structure, the first plate 121 and the second plate 122 can be bent simultaneously to simplify the bending process of the extension 120; or the first plate 121 and the second plate 122 can be bent independently according to the actual situation, and the bending degree of the first plate 121 and the bending degree of the second plate 122 can be different, so that the extension 120 can be used in more applications.

[0107] Please see Figure 9Both the main body 110 and the extension 120 include a first shielding layer 20 and a second shielding layer 30. The second motherboard 112 is located between the first shielding layer 20 and the first motherboard 111, and the third motherboard 113 is located between the second shielding layer 30 and the first motherboard 111. This arrangement ensures the normal operation of the first motherboard 111, the second motherboard 112, and the third motherboard 113. Similarly, the first board 121 and the second board 122 are both located between the first shielding layer 20 and the second shielding layer 30, which also ensures their normal operation.

[0108] In one embodiment, please refer to Figure 9 The first plate 121 and the second plate 122 are arranged opposite to each other in the first direction. The through hole 14 passes through both the first plate 121 and the second plate 122. The first metal part 11 is located between the first shielding layer 20 and the first plate 121. The second metal part 12 is located between the second plate 122 and the second shielding layer 30. The connecting part 13 passes through the first plate 121 and the second plate 122 and is connected to both the first metal part 11 and the second metal part 12. This allows the first shielding layer 20 and the second shielding layer 30 to conduct electricity through the first metal part 11, the connecting part 13 and the second metal part 12, which helps to improve the shielding performance of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference.

[0109] The second board 122 is used to expand the space of the third motherboard 113. Both the third motherboard 113 and the second board 122 can be used for routing, thus relieving the routing pressure on the third motherboard 113. Various types of routing can be configured on the third motherboard 113 and the second board 122 to build different functional modules, providing sufficient space for these routings. The routing on the third motherboard 113 and the second board 122 includes, but is not limited to, power supply routing and board-to-board routing.

[0110] In one embodiment, the second motherboard 112 has a device area and test points. The first motherboard 111 and the first board 121 both have touch traces, power traces, and board-to-board traces. The third motherboard 113 and the second board 122 both have power traces and board-to-board traces. The power traces of the third motherboard 113 and the second board 122 are used to power the flexible circuit board 100. The board-to-board traces at the third motherboard 113 are used to establish electrical connections between the third motherboard 113 and its adjacent boards in the first direction. The board-to-board traces at the second board 122 are used to establish electrical connections between the second board 122 and its adjacent boards in the first direction.

[0111] By ensuring that the second motherboard 112, the first motherboard 111, the first board 121, the third motherboard 113, and the second board 122 meet the routing requirements of the above embodiments, the routing of the flexible circuit board 100 is made more reasonable, which helps to ensure the basic functions of the flexible circuit board 100. The second motherboard 112 provides sufficient space for the device area and test points, the first motherboard 111 and the first board 121 provide sufficient space for touch traces, power traces, and board-to-board traces, and the third motherboard 113 and the second board 122 further provide space for power traces, which helps to reduce the burden of power traces on the first motherboard 111 and the first board 121. Meanwhile, the thickness of the main body 110 in the first direction is the sum of the thicknesses of the second main board 112, the first main board 111, and the third main board 113 in the first direction, the thickness of the extension 120 in the first direction is the sum of the thicknesses of the first board 121 and the second board 122 in the first direction, and the maximum thickness of the flexible circuit board 100 is the thickness of the main body 110. The relatively small thickness of the main body 110 in the first direction is beneficial to achieving the thinning and lightening of the flexible circuit board 100 and the electronic device 200.

[0112] The materials of the first main board 111, the first board 121, the second main board 112, the third main board 113, and the second board 122 can be set according to their actual functions and requirements to ensure the normal operation of the flexible circuit board 100 and to ensure that the flexible circuit board 100 has a good service life.

[0113] In one embodiment, the second main board 112 is made of electrolytic copper, the first main board 111 and the first board 121 are both made of rolled copper, and the third main board 113 and the second board 122 are both made of rolled copper. By using rolled copper as the material for the second board 122, it is easier for the second board 122 to be bent to other areas according to the actual structure. The second board 122 has better bending resistance, which helps to improve the service life of the second board 122, thereby improving the service life of the flexible circuit board 100. The second board 122 and the first board 121 are made of the same material, which facilitates the synchronous bending of the second board 122 and the first board 121, simplifying the bending process of the extension 120. The third main board 113 and the second board 122 are integrated into one structure. By using rolled copper as the material for the third main board 113, it is beneficial to ensure the stability of the connection between the third main board 113 and the second board 122 and simplify the setup of the third main board 113 and the second board 122. At the same time, the main body 110 is composed of both electrolytic copper and rolled copper, making full use of the excellent properties of the two materials, which is beneficial to ensure the normal operation and good service life of the flexible circuit board 100.

[0114] For one possible implementation, please refer to Figure 11 , Figure 11This illustration shows a cross-sectional view of a flexible circuit board 100 including a fourth mainboard 114 according to an embodiment of this application. The main body 110 includes a first mainboard 111, a second mainboard 112, a third mainboard 113, and a fourth mainboard 114. The extension 120 includes a first board 121 and a second board 122. The second mainboard 112 and the third mainboard 113 are respectively located on the first mainboard 111 in a first direction (e.g., ...). Figure 11 On both sides of the third motherboard 113 in the Z direction (as shown), the fourth motherboard 114 is located on the side of the third motherboard 113 away from the first motherboard 111 in the first direction, that is, the fourth motherboard 114, the third motherboard 113, the first motherboard 111, and the second motherboard 112 are arranged sequentially in the first direction. The first board 121 is connected to the first motherboard 111, and the first board 121 is located on the side of the first motherboard 111 in the second direction (as shown). Figure 11 On one side of the X direction (as shown), the second board 122 and the third main board 113 are connected, with the second board 122 located on one side of the third main board 113 in the second direction.

[0115] The extension 120 extends from one side of the main body 110. Specifically, both the first plate 121 and the second plate 122 extend from one side of the first main plate 111, the second main plate 112, the third main plate 113, and the fourth main plate 114. Both the first plate 121 and the second plate 122 protrude from the first main plate 111, the second main plate 112, the third main plate 113, and the fourth main plate 114 in a second direction, facilitating subsequent bending of the first plate 121 and the second plate 122. At least one of the second main plate 112 and the fourth main plate 114 has an edge flush with the edges of the first plate 121 and the second plate 122. That is, on a plane perpendicular to the first direction, the orthographic projection of at least one of the second main plate 112 and the fourth main plate 114 is in contact with the orthographic projection of the first plate 121 and the second plate 122, ensuring that the thickness of the main body 110 is greater than the thickness of the extension 120 and limiting the bending range of the extension 120.

[0116] In one embodiment, please refer to Figure 11 The fourth motherboard 114, the third motherboard 113, the first motherboard 111, and the second motherboard 112 are stacked in the first direction. In the second direction, the edge of the second motherboard 112 near the first board 121 and the edge of the fourth motherboard 114 near the first board 121 are flush with the edge of the first motherboard 111 near the first board 121. The edge of the fourth motherboard 114 near the first board 121 is flush with the edge of the third motherboard 113 near the second board 122. This simplifies the arrangement of the first motherboard 111, the second motherboard 112, the third motherboard 113, and the fourth motherboard 114, and allows for a reasonable configuration of the size of the main body 110 and the extension 120.

[0117] Please see Figure 11Both the main body 110 and the extension 120 include a first shielding layer 20 and a second shielding layer 30. The second motherboard 112 is located between the first shielding layer 20 and the first motherboard 111, and the fourth motherboard 114 is located between the second shielding layer 30 and the third motherboard 113. This arrangement ensures the normal operation of the first motherboard 111, the second motherboard 112, the third motherboard 113, and the fourth motherboard 114. The first board 121 and the second board 122 are located between the first shielding layer 20 and the second shielding layer 30, which also ensures their normal operation.

[0118] In one embodiment, please refer to Figure 9 The first plate 121 and the second plate 122 are in the first direction (e.g. Figure 9 The plates are arranged opposite each other in the Z direction (as shown). The through hole 14 passes through both the first plate 121 and the second plate 122. The first metal part 11 is located between the first shielding layer 20 and the first plate 121. The second metal part 12 is located between the second plate 122 and the second shielding layer 30. The connecting part 13 passes through the first plate 121 and the second plate 122 and is connected to both the first metal part 11 and the second metal part 12. This allows the first shielding layer 20 and the second shielding layer 30 to conduct electricity through the first metal part 11, the connecting part 13 and the second metal part 12, which helps to improve the shielding performance of the first shielding layer 20 and the second shielding layer 30 against electromagnetic interference.

[0119] In the second direction, the length by which the second plate 122 protrudes from the main body 110 can be the same as or different from the length by which the first plate 121 protrudes from the main body 110. (See also...) Figure 12 , Figure 12 A cross-sectional view of a flexible circuit board 100 with the fourth main board 114 and the extension 120 protruding in opposite directions, provided in an embodiment of this application, is shown. When the length of the second board 122 protruding from the main body 110 is different from the length of the first board 121 protruding from the main body 110, the through hole 14 can be located in the overlapping area of ​​the first board 121 and the second board 122, so that the through hole 14 passes through both the first board 121 and the second board 122 at the same time, thereby simplifying the setting of the through hole 14.

[0120] At least one of the first motherboard 111, the second motherboard 112, the third motherboard 113, and the fourth motherboard 114 can protrude from the entire main body 110 to appropriately increase its area and provide more space for the wiring of the flexible circuit board 100. The portion of the first motherboard 111, the second motherboard 112, the third motherboard 113, and the fourth motherboard 114 that protrudes from the entire main body 110 is called the protrusion. The protrusion is located on one side of the entire main body 110 perpendicular to the first direction. Since the extension 120 protrudes from the main body 110 in a second direction perpendicular to the first direction, the direction in which the protrusion protrudes from the main body 110 should form an angle with the direction in which the extension 120 protrudes from the main body 110, so that the protrusion and the extension 120 are staggered, avoiding interference of the protrusion with the bending process of the extension 120.

[0121] In one embodiment, please refer to Figure 12 The first motherboard 111 and the first board 121 are in the second direction (e.g.) Figure 12 The fourth motherboard 114 is arranged sequentially in the X direction (as shown), such that the first board 121 protrudes from the first motherboard 111 in the second direction, and a portion of the fourth motherboard 114 protrudes from the first motherboard 111 in the opposite direction of the second direction. This arrangement of the portion of the fourth motherboard 114 protruding from the first motherboard 111 and the first board 121 is staggered, which avoids interference from the bending of the extension 120 caused by the fourth motherboard 114 and appropriately increases the area of ​​the fourth motherboard 114, which is beneficial for providing more space for the wiring of the fourth motherboard 114.

[0122] The fourth motherboard 114 can be configured with various types of traces to build different functional modules and provides sufficient space for these traces. The fourth motherboard 114 can be configured with, but is not limited to, input traces, power traces, and touch traces.

[0123] In one embodiment, the second motherboard 112 has a device area and test points; the first motherboard 111 and the first board 121 both have touch traces, power traces, and board-to-board traces; the third motherboard 113 and the second board 122 both have power traces and board-to-board traces; and the fourth motherboard 114 has input traces, power traces, and touch traces. The input traces on the fourth motherboard 114 are used to input signals; the power traces on the fourth motherboard 114 are used to supply power to the flexible circuit board 100; and the touch traces on the fourth motherboard 114 are used to implement the touch function of the flexible circuit board 100.

[0124] By ensuring that the second motherboard 112, the first motherboard 111, the first board 121, the third motherboard 113, the second board 122, and the fourth motherboard 114 meet the routing settings described in the above embodiments, the routing of the flexible circuit board 100 is made more reasonable, which is beneficial to ensuring the basic functions of the flexible circuit board 100. The second motherboard 112 provides sufficient space for the device area and test points. The first motherboard 111 and the first board 121 provide sufficient space for the touch routing, power routing, and board-to-board routing. The third motherboard 113, the second board 122, and the fourth motherboard 114 all provide further space for the power routing. The fourth motherboard 114 also provides further space for the touch routing. The fourth motherboard 114 also has input routing, which provides sufficient space for the input routing. Meanwhile, the thickness of the main body 110 in the first direction is the sum of the thicknesses of the second main board 112, the first main board 111, the third main board 113, and the fourth main board 114 in the first direction, and the thickness of the extension 120 in the first direction is the sum of the thicknesses of the first board 121 and the second board 122 in the first direction, so that the thickness of the flexible circuit board 100 in the first direction is small, which is conducive to realizing the thinning of the flexible circuit board 100 and the electronic device 200.

[0125] The materials of the first motherboard 111, the first board 121, the second motherboard 112, the third motherboard 113, the second board 122, and the fourth motherboard 114 can be set according to their actual functions and requirements to ensure the normal operation of the flexible circuit board 100 and to ensure that the flexible circuit board 100 has a good service life.

[0126] In one embodiment, the second main board 112 is made of electrolytic copper, the first main board 111 and the first primary board 121 are both made of rolled copper, the third main board 113 and the second primary board 122 are both made of rolled copper, and the fourth main board 114 is made of electrolytic copper. By using electrolytic copper as the material for the fourth main board 114, it is beneficial to ensure that the flexible circuit board 100 has good conductivity and that the main body 110 has sufficient mechanical strength. Meanwhile, the second main board 112 and the fourth main board 114 located at both ends of the main body 110 in the first direction are both made of electrolytic copper, so that the second main board 112 and the fourth main board 114 respectively support and protect the structure of the main body 110 at both ends in the first direction, which helps to ensure the mechanical strength of the main body 110; the first main board 111 and the third main board 113 located in the middle area of ​​the main body 110 in the first direction are both made of rolled copper, so that the middle area of ​​the flexible circuit board 100 is a material with good bending resistance. The flexible circuit board 100 is composed of two materials, electrolytic copper and rolled copper, which makes full use of the excellent properties of the two materials, which helps to ensure the normal operation and good service life of the flexible circuit board 100.

[0127] This application also provides an electronic device 200, please refer to... Figure 1 and Figure 2 The electronic device 200 includes a metal bracket 210, a metal frame 220, and a flexible circuit board 100 as described in any of the above embodiments. The first shielding layer 20 of the flexible circuit board 100 is in contact with one of the metal bracket 210 and the metal frame 220.

[0128] In one embodiment, please refer to Figure 1 and Figure 2 The flexible circuit board 100 includes a first shielding layer 20 and a second shielding layer 30. The first shielding layer 20 is in contact with a metal support 210, allowing the first shielding layer 20 to be grounded through the metal support 210, thus preventing the induced current at the first shielding layer 20 from affecting the flexible circuit board 100. The second shielding layer 30 is in contact with a metal frame 220, allowing the second shielding layer 30 to be grounded through the metal frame 220, thus preventing the induced current at the second shielding layer 30 from affecting the flexible circuit board 100. Both of these factors contribute to ensuring the normal operation of the flexible circuit board 100. Furthermore, since the first shielding layer 20 is in direct contact with the metal support 210 and the second shielding layer 30 is in direct contact with the metal frame 220, the second shielding layer 30 does not need to be grounded through the first shielding layer 20. This allows the flexible circuit board 100 to achieve grounding in the first direction (e.g., ...). Figure 1 and Figure 2 Grounding on both sides (as shown in the Z direction) helps improve the transmission efficiency of induced current at the first shielding layer 20 and the second shielding layer 30, ensures the grounding structure of the first shielding layer 20 and the second shielding layer 30 improves the shielding performance of the first shielding layer 20 and the second shielding layer 30, and ensures the normal operation of the flexible circuit board 100.

[0129] In one embodiment, please refer to Figure 1 and Figure 2 At least a portion of the flexible circuit board 100 is bent, allowing it to be bent into other areas of the electronic device 200 according to its actual structure. This fully utilizes the internal space of the electronic device 200 and enables the flexible circuit board 100 to be folded, resulting in a more compact internal structure and higher integration of the electronic device 200, which is beneficial for miniaturization. For example, the flexible circuit board 100 includes a main body 110 and an extension 120. The thickness of the main body 110 in the first direction is greater than the thickness of the extension 120 in the first direction. The extension 120, with its smaller thickness, is bent, which simplifies the bending process of the flexible circuit board 100.

[0130] It is understood that the electronic device 200 in this embodiment has the flexible circuit board 100 in the above embodiments. Therefore, the electronic device 200 in this embodiment has all the technical effects of the flexible circuit board 100 in the above embodiments. Since the technical effects of the flexible circuit board 100 have been fully explained in the above embodiments, they will not be repeated here.

[0131] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A flexible circuit board, characterized in that, It includes a base layer, a first shielding layer and a second shielding layer, the first shielding layer and the second shielding layer are respectively located on both sides of the base layer in a first direction, and the first shielding layer is used to contact one of the metal bracket and the metal frame; The flexible circuit board further includes a first metal part, a second metal part, and a connecting part. The first metal part is located between the first shielding layer and the base layer, and the second metal part is located between the second shielding layer and the base layer. The base layer has a through hole, and the connecting part passes through the through hole and is connected to both the first metal part and the second metal part.

2. The flexible circuit board according to claim 1, characterized in that, The connecting part and the through hole are provided in a one-to-one correspondence, and the number of the through holes is at least two, with the at least two through holes being spaced apart on the base layer.

3. The flexible circuit board according to claim 1 or 2, characterized in that, The flexible circuit board includes a main body and an extension connected together. The extension extends from one side of the main body. The thickness of the main body in the first direction is greater than the thickness of the extension in the first direction. Both the main body and the extension include the base layer, the first shielding layer and the second shielding layer. The through hole is located in the extension.

4. The flexible circuit board according to claim 3, characterized in that, Both the first metal portion and the second metal portion are located in the extension portion.

5. The flexible circuit board according to claim 3 or 4, characterized in that, The base layer includes a first motherboard and a first board connected together. The first motherboard is located in the main body and the first board is located in the extension. Both the first motherboard and the first board are provided with touch control traces.

6. The flexible circuit board according to claim 5, characterized in that, Both the first motherboard and the first board are made of rolled copper.

7. The flexible circuit board according to claim 5 or 6, characterized in that, The main body also includes a second motherboard and a third motherboard, which are located on opposite sides of the first motherboard in the first direction. The second motherboard is located between the first shielding layer and the first motherboard. The second motherboard has a device area, and the third motherboard has power traces.

8. The flexible circuit board according to claim 7, characterized in that, The material of the second motherboard is electrolytic copper.

9. The flexible circuit board according to claim 7 or 8, characterized in that, The main body also includes a fourth motherboard, which is located on the side of the third motherboard away from the first motherboard in the first direction, and the fourth motherboard is provided with input traces.

10. The flexible circuit board according to claim 9, characterized in that, The material of the fourth motherboard is electrolytic copper.

11. The flexible circuit board according to claim 9 or 10, characterized in that, The first board is located on one side of the first main board in a direction perpendicular to the first direction, and a portion of the fourth main board protrudes from the first main board in a direction perpendicular to the first direction. The portion of the fourth main board and the first board are staggered.

12. The flexible circuit board according to any one of claims 7 to 11, characterized in that, The extension also includes a second board, which is connected to the third main board.

13. The flexible circuit board according to claim 12, characterized in that, Both the third main board and the second board are made of rolled copper.

14. The flexible circuit board according to claim 12 or 13, characterized in that, At least part of the second plate is arranged opposite to the first plate.

15. An electronic device, characterized in that, It includes a metal support, a metal frame, and a flexible circuit board as described in any one of claims 1 to 14, wherein a first shielding layer of the flexible circuit board is in contact with one of the metal support and the metal frame.

16. The flexible circuit board according to claim 15, characterized in that, The first shielding layer is in contact with the metal support, and the second shielding layer of the flexible circuit board is in contact with the metal frame.

17. The flexible circuit board according to claim 15 or 16, characterized in that, At least a portion of the flexible circuit board is bent.

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