Protection circuit module, method for manufacturing same, and secondary battery

Abstract

The invention discloses a protection circuit module, a manufacturing method thereof, and a secondary battery. The protection circuit module includes: a substrate electrically connected to the battery cells; a component in a deployment area on the substrate; a first insulating layer on the substrate in a region other than the deployment region; a second insulating layer on the first insulating layer and separated from the feature; and a coating layer on the first insulating layer and surrounding the feature.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a protection circuit module, a method of manufacturing a protection circuit module, and a secondary battery including the protection circuit module. BACKGROUND

[0002] Unlike primary batteries designed not to be (re)charged, secondary (or rechargeable) batteries are batteries designed to be discharged and recharged. Low-capacity secondary batteries are used for portable small electronic devices such as smartphones, feature phones, notebook computers, digital cameras, and camcorders, and high-capacity secondary batteries are widely used as power sources to drive electric motors in hybrid and electric vehicles and for storing electric power (e.g., home and / or utility-scale power storage). A secondary battery generally includes an electrode assembly including a positive electrode and a negative electrode, a case accommodating the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] Generally, a protection circuit module (PCM) is provided in a secondary battery in order to prevent overcharging, overdischarging, or overcurrent of the battery. Accordingly, a secondary battery is used in the form of a battery pack in which the protection circuit module is coupled with a battery cell.

[0004] A number of components are provided on a substrate of the protection circuit module. A coating solution is applied to insulate the components on the protection circuit module and to protect the components from external impacts, etc. However, in the process of applying the coating solution, there is a problem that the coating solution can flow to adjacent configurations other than the area that needs to be coated.

[0005] As electronic devices become smaller and smaller, it is desirable to manufacture the substrate of the protection circuit module to be thin so that the battery pack is smaller. However, when the substrate of the protection circuit module is made thin, there is a problem that the substrate is easily damaged by external impacts, etc.

[0006] The above-described information disclosed in this BACKGROUND section is to enhance an understanding of the background of the present disclosure, and therefore it can include information that does not constitute the related (prior) art. SUMMARY

[0007] The present disclosure relates to various embodiments of a protection circuit module and a method of manufacturing a protection circuit module for solving the above-described problems, and a secondary battery including the protection circuit module.

[0008] However, the technical problems to be solved by the present disclosure are not limited to the above-mentioned problems, and those skilled in the art will clearly understand other problems not mentioned herein and aspects and features of the present disclosure that solve the problems from the following description of the present disclosure.

[0009] According to embodiments of the present disclosure for solving the above-described technical problems, a protection circuit module includes a substrate electrically connected to a battery cell; a plurality of components disposed in a deployment area on the substrate; a first insulating layer on the substrate in an area other than the deployment area; a second insulating layer on the first insulating layer and separated from the plurality of components; and a coating layer on the first insulating layer and surrounding the plurality of components.

[0010] According to one or more embodiments, the second insulating layer can extend along edges of the first insulating layer.

[0011] According to one or more embodiments, the first insulating layer can be in all areas on the substrate other than the deployment area, and the second insulating layer can be at a position corresponding to an edge of the substrate.

[0012] According to one or more embodiments, the second insulating layer can have a closed contour, and the plurality of components can be positioned within the closed contour.

[0013] According to one or more embodiments, the coating layer can be within the closed contour and in an area other than the deployment area.

[0014] According to one or more embodiments, the second insulating layer can be thicker than the first insulating layer.

[0015] According to one or more embodiments, a height of the second insulating layer can be lower than a highest height among a plurality of heights of the plurality of components.

[0016] According to one or more embodiments, a height of the second insulating layer can be lower than a lowest height among the plurality of heights of the plurality of components.

[0017] According to one or more embodiments, a height of the coating layer can be lower than a height of the second insulating layer.

[0018] According to one or more embodiments, a height of the coating layer can be lower than a height of each of the plurality of components.

[0019] According to one or more embodiments, the first insulating layer and the second insulating layer can each include a photo solder resist (PSR) ink.

[0020] According to one or more embodiments, the coating layer can include an underfill coating material.

[0021] According to some embodiments of the present disclosure, a method of manufacturing a protection circuit module includes forming a first insulating layer on a substrate in an area other than a deployment area in which components are located; forming a second insulating layer on the first insulating layer and extending along edges of the first insulating layer; forming a plurality of components in the deployment area; and forming a coating layer on the first insulating layer and surrounding the plurality of components.

[0022] According to one or more embodiments, forming a first insulating layer may include forming a first insulating layer on a substrate in all regions except the deployment area, and forming a second insulating layer may include forming a second insulating layer at a location corresponding to an edge of the substrate.

[0023] According to one or more embodiments, forming the second insulating layer may include forming the second insulating layer with a closed profile, and forming the coating may include forming the coating positioned within the closed profile and in areas other than the deployment area.

[0024] According to one or more embodiments, forming the second insulating layer may include forming the second insulating layer as thicker than the first insulating layer.

[0025] According to one or more embodiments, forming the second insulating layer may include forming the height of the second insulating layer to be lower than the lowest of a plurality of heights of a plurality of components.

[0026] According to one or more embodiments, forming the coating may include forming the height of the coating to be lower than the height of the second insulating layer.

[0027] According to some embodiments of this disclosure, a secondary battery includes: an electrode assembly; a housing for receiving the electrode assembly; and a protection circuit module connected to the electrode assembly. The protection circuit module includes: a substrate electrically connected to the electrode assembly; a plurality of components in a deployment area on the substrate; a first insulating layer on the substrate in areas other than the deployment area; a second insulating layer on the first insulating layer and separate from the plurality of components; and a coating on the first insulating layer and surrounding the plurality of components.

[0028] According to one or more embodiments, the second insulating layer may extend along the edge of the first insulating layer.

[0029] According to some embodiments of this disclosure, the insulating layer may extend along the edge of the first insulating layer (i.e., the edge of the substrate) and above the height of the coating thereon, and thus may prevent (or at least mitigate) leakage of the coating from the substrate of the protective circuit module.

[0030] According to some embodiments of this disclosure, deployment strength can be improved by forming a single coating around all the multiple components on a substrate of the protection circuit module.

[0031] However, the aspects and features of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the detailed description below that other aspects and features not mentioned will be apparent. Attached Figure Description

[0032] The accompanying drawings illustrate embodiments of the present disclosure, and together with the detailed description thereof, further describe aspects and features of the present disclosure. Therefore, this disclosure should not be construed as limited to the drawings.

[0033] Figure 1 This is an exploded perspective view of an electrode assembly and housing according to one embodiment of the present disclosure.

[0034] Figure 2 This is a diagram illustrating a battery cell according to one embodiment of the present disclosure.

[0035] Figure 3 This is a diagram illustrating a battery cell and a protection circuit module according to one embodiment of the present disclosure.

[0036] Figure 4 This is a diagram illustrating the upper surface of a protection circuit module according to one embodiment of the present disclosure.

[0037] Figure 5 The diagram is along Figure 4 A diagram of the cross section intercepted by line A-A'.

[0038] Figure 6 This is a diagram illustrating another implementation of the protection circuit module.

[0039] Figures 7 to 15 This is a diagram depicting the manufacturing process of a protection circuit module according to one embodiment of the present disclosure.

[0040] Figure 16 This is a flowchart illustrating the manufacturing process of a protection circuit module according to one embodiment of the present disclosure. Detailed Implementation

[0041] In the following, embodiments of this disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be construed as having a general or dictionary meaning, but should be interpreted in a meaning and concept consistent with the technical spirit of this disclosure, based on the principle that the inventor is capable of properly defining the concepts of the terms to best describe his / her invention as his / her own lexicographer.

[0042] The embodiments described in this specification and the constructions shown in the accompanying drawings are only some of the embodiments of this disclosure and do not represent all the technical spirit, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalents and modifications are possible at the time of filing this application, which can replace or modify the embodiments described herein.

[0043] It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "attached to" another element or layer, the element or layer may be directly on, connected to, or attached to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly attached to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "attached" or "connected" to a second element, the first element may be directly attached to or connected to the second element, or the first element may be indirectly attached to or connected to the second element via one or more intermediary elements.

[0044] In the accompanying drawings, the dimensions of various elements, layers, etc., may be exaggerated for clarity of illustration. The same reference numerals denote the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the items listed. Furthermore, when describing embodiments of this disclosure, the use of "may" means "one or more embodiments of this disclosure." Expressions such as "at least one of" and "any one of" modify the entire list of elements without modifying individual elements in the list when placed after the list of elements. When phrases such as "at least one of A, B, and C," "at least one of A, B, or C," "at least one selected from the group of A, B, and C," or "at least one selected from A, B, and C" are used to specify a list of elements A, B, and C, the phrase may refer to any and all suitable combinations or subsets of A, B, C, A and B, A and C, B and C, or A and B and C, A, B, and C. As used herein, the term "use" and its variations may be considered synonymous with the term "utilize" and its variations, respectively. As used herein, the terms “substantially,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to describe the inherent biases of measurements or calculations that would be recognized by one of ordinary skill in the art.

[0045] It will be understood that although the terms "first," "second," "third," etc., can be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or portion discussed below may be referred to as the second element, component, region, layer, or portion.

[0046] In this document, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” are used to describe the relationship between one element or feature as shown in the figures and another (or several) other elements or features. It will be understood that, in addition to the orientation shown in the figures, spatial relative terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features will be oriented “above” or “directly above” other elements or features. Thus, the term “below” can include both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0047] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are intended to include the plural forms as well. It will be further understood that, when used in this specification, the term “comprising” designates the presence of stated features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0048] Furthermore, any numerical range disclosed and / or enumerated herein is intended to include all subranges with the same numerical precision within the enumerated range. For example, the range “1.0 to 10.0” is intended to include, for example, 2.4 to 7.6, all subranges between the stated minimum value of 1.0 and the stated maximum value of 10.0 (inclusive), i.e., all subranges with a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0. Any maximum numerical limit described herein is intended to include all smaller numerical limits, and any minimum numerical limit described in this specification is intended to include all larger numerical limits. Therefore, the applicant reserves the right to amend this specification (including the claims) to explicitly detail any subranges included within the scope expressly described herein.

[0049] Referring to two compared elements, features, etc., as "identical" can mean that they are "substantially identical." Therefore, the phrase "substantially identical" can include cases with deviations considered low in the art (e.g., deviations below 5%). Additionally, when a parameter is stated to be consistent in a given region, this can mean that it is consistent in terms of average value.

[0050] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0051] Placing any element "above (or below)" or "above (below)" another element can mean that the arbitrary element can contact the upper (or lower) surface of the element, and that another element can also be located between the element and the arbitrary element disposed on (or below) the element.

[0052] Additionally, it will be understood that when a component is referred to as “connected,” “linked,” or “attached” to another component, these components can be directly “connected,” “linked,” or “attached” to each other, or another component can be “between” these components.

[0053] Throughout this specification, unless otherwise stated, when “A and / or B” is mentioned, it means A, B, or A and B. That is, “and / or” includes any or all combinations of the enumerated items. Unless otherwise stated, when “C to D” is mentioned, it means C and below D.

[0054] Figure 1 This is an exploded perspective view of an electrode assembly and housing according to one embodiment of the present disclosure, illustrating the connection structure of the electrode assembly and housing according to one embodiment of the present disclosure. Figure 2 This is a diagram illustrating a battery cell according to one embodiment of the present disclosure. Figure 3 This is a diagram illustrating a battery cell and a protection circuit module according to one embodiment of the present disclosure.

[0055] According to one embodiment of the present disclosure, the secondary battery 1 is not limited to... Figures 1 to 3 The illustration shows a pouch-type battery. However, for ease of description, the following description focuses on pouch-type batteries.

[0056] See Figures 1 to 3 According to one embodiment of the present disclosure, the secondary battery 1 may include an electrode assembly 110, a housing 120, and a protection circuit module 200.

[0057] According to one embodiment, the electrode assembly 110 may include a first electrode plate 111, a second electrode plate 112, and a diaphragm 113 between the first electrode plate 111 and the second electrode plate 112. The first electrode plate 111 may be a negative electrode plate, and the second electrode plate 112 may be a positive electrode plate. In other embodiments, the first electrode plate 111 may be a positive electrode plate, and the second electrode plate 112 may be a negative electrode plate.

[0058] According to one embodiment, the electrode assembly 110 can be formed by winding or stacking a first electrode plate 111, a diaphragm 113, and a second electrode plate 112, each of which is formed in a plate shape or a thin film shape. When the electrode assembly 110 is a wound stack, the winding axis can be parallel to (or substantially parallel to) the main axis direction of the housing 120. The electrode assembly 110 can be a stack type rather than a wound type, and the shape of the electrode assembly 110 is not limited in this disclosure.

[0059] According to one embodiment, the first electrode plate 111 can be formed by applying an active material such as graphite or carbon to a current collector plate made of a metal foil such as copper, a copper alloy, nickel, or a nickel alloy. The first electrode plate 111 may include a first uncoated portion, which is a region where no active material is applied. The first uncoated portion may be connected to a separately formed first electrode terminal piece 111a, or a portion of the first uncoated portion may be punched off to form the first electrode terminal piece 111a.

[0060] According to one embodiment, the second electrode plate 112 can be formed by applying an active material, such as a transition metal oxide, to a current collector plate made of a metal foil such as aluminum or an aluminum alloy. The second electrode plate 112 may include a second uncoated portion, which is a region where no active material is applied. The second uncoated portion may be connected to a separately formed second electrode tab 112a, or a portion of the second uncoated portion may be punched off to form the second electrode tab 112a.

[0061] According to one embodiment, a separator 113 may be positioned between a first electrode plate 111 and a second electrode plate 112. The separator 113 can insulate the first electrode plate 111 and the second electrode plate 112, and can allow lithium ions to exchange between the first electrode plate 111 and the second electrode plate 112. Even if the electrode assembly 110 contracts or expands during the charging and discharging process of the secondary battery 1, the separator 113 may have sufficient length to completely (or substantially completely) insulate the first electrode plate 111 and the second electrode plate 112.

[0062] According to one embodiment, a first electrode contact 111a and a second electrode contact 112a may be provided on one side of the electrode assembly 110. The first electrode contact 111a and the second electrode contact 112a may correspond to the first electrode plate 111 and the second electrode plate 112, respectively, and may protrude from one side of each of the first electrode plate 111 and the second electrode plate 112. The first electrode contact 111a may be electrically connected to a first terminal, and the second electrode contact 112a may be electrically connected to a second terminal.

[0063] According to one embodiment, a membrane portion 115 may be provided on the first electrode terminal 111a and the second electrode terminal 112a, respectively. The membrane portion 115 may be provided on one surface of each of the first electrode terminal 111a and the second electrode terminal 112a, or may be wound around both surfaces of the first electrode terminal 111a and the second electrode terminal 112a. The membrane portion 115 is configured to prevent (or at least mitigate) short circuits that may occur when the first electrode terminal 111a and the second electrode terminal 112a come into contact with a metal layer exposed at a portion of the sealing portion 122 of the housing 120. The membrane portion 115 may be thermally fused to the sealing portion 122 to securely connect the first electrode terminal 111a and the second electrode terminal 112a to the sealing portion 122.

[0064] According to one embodiment, the housing 120 can form the appearance of the secondary battery 1. The housing 120 may have, but is not limited to, the following features: Figures 1 to 3 The rectangle shape shown in the diagram.

[0065] According to one embodiment, housing 120 may include container 121 and sealing portion 122.

[0066] According to one embodiment, container 121 may have an internal space that is larger than the size of electrode assembly 110 and can accommodate electrode assembly 110 and electrolyte. With electrode assembly 110 contained in container 121, the lid of housing 120 can be closed to seal electrode assembly 110.

[0067] According to one embodiment, the sealing portion 122 may be along the edge of the housing 120. The sealing portion 122 on the edge of the housing 120 may contact another portion of the housing 120 and may be sealed while the electrode assembly 110 is housed within the housing 120. In one embodiment, a portion of the first electrode tab 111a and the second electrode tab 112a may be exposed outside the housing 120, and the membrane portion 115 may be positioned between the upper and lower portions of the housing 120 corresponding to the sealing portion 122.

[0068] According to one embodiment, the sealing portion 122 may be made of a hot-melt material and may have a structure that achieves sealing by bonding the hot-melt layers together. For example, because hot-melt materials typically have weak adhesion to metals, the film portion 115 may be attached in the form of a thin film to the first electrode terminal piece 111a and the second electrode terminal piece 112a and may be fused to the housing 120 along the sealing portion 122.

[0069] According to one embodiment, the protection circuit module 200 can be configured to protect the individual cells of the secondary battery 1 from overcharging, over-discharging and overcurrent.

[0070] According to one embodiment, the protection circuit module 200 may be electrically connected to the electrode assembly 110. The protection circuit module 200 may be connected (e.g., electrically connected) to the electrode assembly 110 housed in the housing 120. Figure 3 As shown, the protection circuit module 200 can be connected to the first electrode terminal 111a and the second electrode terminal 112a exposed to the outside of the housing 120.

[0071] The following will be referred to Figures 4 to 6 The construction of a protection circuit module 200 according to one embodiment of the present disclosure is described.

[0072] Figure 4 This is a diagram showing the upper surface of a protection circuit module 200 according to one embodiment of the present disclosure. Figure 5 The diagram is along Figure 4 A diagram of the cross section intercepted by line A-A'. Figure 6 This is a diagram illustrating another embodiment of the protection circuit module 200.

[0073] See Figures 4 to 6 The protection circuit module 200 may include a substrate 210, a plurality of components 220 on the substrate 210, a first insulating layer 230, a second insulating layer 240, and a coating 250.

[0074] In one embodiment, substrate 210 may be electrically connected to a battery cell. Substrate 210 may support the construction of protection circuit module 200. Various circuits and components configured to control the operation of electrode assembly 110 may be on substrate 210. Components on substrate 210 may be configured to communicate with an external control device via wired or wireless means. Substrate 210 may be a printed circuit board (PCB) substrate 210. Substrate 210 may be made of one or more of FR-1, FR-4, CEM-1, CEM-3, Teflon, ceramic, and metal. Substrate 210 may be a flexible circuit board. Substrate 210 may include a metal layer 210a configured to allow electrical signals to flow between components. For example, metal layer 210a may be a copper layer containing copper, but is not limited thereto. Metal layer 210a is illustrated as being formed over the entire substrate, but this disclosure is not limited thereto. Metal layer 210a may be a construction for electrical connections for component operation and may be formed only in a portion of the substrate.

[0075] According to one embodiment, multiple components 220 may be deployed in implementation regions 222 on substrate 210 (see [link]). Figure 5and Figure 7 In the substrate 210, each of the plurality of components 220 can be configured to transmit and / or receive electrical signals through the metal layer 210a. The plurality of components 220 can be located in a deployment region 222 on the substrate 210, which is in an area where the first insulating layer 230 is not formed. The plurality of components 220 can be located in the deployment region 222 and can be surrounded by a coating 250. The deployment regions 222 formed on the substrate 210 can be separated from each other, and the plurality of components 220 formed in the deployment regions 222 can be separated from each other.

[0076] In one embodiment, a plurality of components 220 may contact the first insulating layer 230 at a lower end adjacent to the substrate 210. The plurality of components 220 may be within (e.g., surrounded by) the closed contour of a second insulating layer 240 formed along the edge of the first insulating layer 230. The plurality of components 220 may be within the closed contour of the second insulating layer 240 and may be surrounded by a coating 250 formed on the first insulating layer 230.

[0077] According to one embodiment, the plurality of components 220 may include any one of a battery protection element, a charging and discharging switch element, an electrode identification element, and a plurality of passive elements. The plurality of components 220 may include connection terminals (e.g., a first connection terminal and a second connection terminal) connected to a first electrode terminal 111a and a second electrode terminal 112a, as well as external terminals connected to an external load.

[0078] like Figure 6 As shown, according to one embodiment, the plurality of components 220 on the substrate 210 may have different heights. Depending on the specifications of the components 220, the plurality of components 220 on the substrate 210 may have different heights. For example, in one or more embodiments, the height h1 of the charging and discharging switching element 220a may be higher than the height h2 of the connection terminal 220b connected to the second electrode tab 112a.

[0079] According to one embodiment, the first insulating layer 230 may be formed on the substrate 210 in areas other than the deployment area 222. For example, the first insulating layer 230 may be formed on the substrate 210 in all areas of the substrate 210 except for the deployment area 222.

[0080] In one embodiment, the first insulating layer 230 may be configured to insulate the plurality of components 220 from the exterior of the substrate 210. The first insulating layer 230 may be made of an insulating member or an insulating material. The first insulating layer 230 may include, but is not limited to, photoresist (PSR) ink. For example, the first insulating layer 230 may be formed by printing and drying an insulating member comprising PSR ink.

[0081] According to one embodiment, the second insulating layer 240 may be formed on the first insulating layer 230 and may be separated from (e.g., spaced apart from) the plurality of components 220. The second insulating layer 240 may be formed along the edge of the first insulating layer 230. The second insulating layer 240 may be formed as a closed profile along the edge of the first insulating layer 230.

[0082] According to one embodiment, the second insulating layer 240 may be located at a position corresponding to the edge (e.g., periphery) of the substrate 210. Alternatively, the second insulating layer 240 may be located on the first insulating layer 230 at a position corresponding to the edge of the substrate 210.

[0083] According to one embodiment, the second insulating layer 240 may extend on and along the edge of the first insulating layer 230 (i.e., the edge of the substrate 210), and the coating 250 may be inside or surrounded by the second insulating layer 240. In the step or process of applying the coating 250, the second insulating layer 240 may prevent (or at least mitigate) the coating 250 from flowing out of the substrate 210.

[0084] According to one embodiment, the thickness t2 of the second insulating layer 240 may be thicker than the thickness t1 of the first insulating layer 230. The second insulating layer 240 may be formed thick enough to prevent (or at least mitigate) the coating 250 from flowing out of the substrate 210.

[0085] like Figure 6 As shown, according to one embodiment, the height h3 of the second insulating layer 240 (e.g., the height h3 of the second insulating layer 240 relative to the substrate 210) may be higher than the height h4 of the coating 250. The second insulating layer 240 is higher than the coating 250, and therefore, the coating 250 can be prevented (or at least mitigated) from flowing out of the substrate 210.

[0086] According to one embodiment, the height h3 of the second insulating layer 240 may be lower than the height h1 of the tallest component 220a among the plurality of components 220, which is configured to prevent the total thickness of the protection circuit module 200 from becoming thicker due to the second insulating layer 240.

[0087] According to one embodiment, the height h3 of the second insulating layer 240 may be lower than the height h2 of the lowest (shortest) component 220b among the plurality of components 220. This is configured to prevent the second insulating layer 240 surrounding the edge of the substrate 210 from acting as a barrier or obstruction (e.g., an obstacle) in the process of connecting the connection terminals of the first electrode tab 111a and the second electrode tab 112a to the protection circuit module 200.

[0088] According to one embodiment, the second insulating layer 240 may be made of an insulating member or an insulating material. The second insulating layer 240 may include, but is not limited to, photoresist (PSR) ink. For example, the second insulating layer 240 can be formed by printing and drying an insulating member comprising PSR ink.

[0089] According to one embodiment, coating 250 may be applied to a first insulating layer 230. Coating 250 may surround a plurality of components 220 on the first insulating layer 230. Coating 250 may be a single layer surrounding the outer surfaces of the plurality of components 220.

[0090] In one embodiment, the coating 250 may be within the closed contour of the second insulating layer 240 (e.g., surrounded by the second insulating layer 240). Within the closed contour of the second insulating layer 240, a plurality of components 220 may be in the deployment area 222, and the coating 250 may be in an area other than the deployment area 222.

[0091] According to one embodiment, the coating 250 may be lower than the second insulating layer 240. The height h4 of the coating 250 relative to the substrate 210 may be lower than the height h3 of the second insulating layer 240 relative to the substrate 210. As described above, in order to prevent (or at least mitigate) the coating 250 from flowing out of the substrate 210, the coating 250 may be lower than the second insulating layer 240.

[0092] In one embodiment, the coating 250 may be lower than each of the plurality of components 220. The height h4 of the coating 250 relative to the substrate 210 may be lower than the height h1 of the tallest component 220a among the plurality of components 220, which is configured to prevent the total thickness of the protection circuit module 200 from becoming thicker due to the coating 250.

[0093] According to one embodiment, coating 250 may include an underfill coating material. The coating member on which coating 250 is applied may be an underfill coating material. The underfill coating material may be an insulating resin. Coating 250 including an underfill coating material has high ductility (e.g., relatively low viscosity), and therefore, the thickness of coating 250 applied to the first insulating layer 230 can be formed uniformly (or substantially uniformly).

[0094] Figures 7 to 15 This is a diagram depicting the manufacturing process of a protection circuit module 200 according to one embodiment of the present disclosure. Figure 16 This is a flowchart illustrating the manufacturing process of a protection circuit module 200 according to one embodiment of the present disclosure.

[0095] See below. Figures 7 to 15 The steps of a method for manufacturing a protection circuit module 200 according to one embodiment of the present disclosure are described in detail.

[0096] According to one implementation, in Figure 16 In step S1100, deployment area 222 may be formed on substrate 210. Substrate 210 may be electrically connected to the battery cell. Substrate 210 may support the construction of protection circuit module 200. Substrate 210 may be a printed circuit board (PCB) substrate 210. Substrate 210 may be made of one or more of FR-1, FR-4, CEM-1, CEM-3, Teflon, ceramic, and metal. Substrate 210 may include a metal layer 210a configured to allow electrical signals to flow between components.

[0097] According to one embodiment, circuitry capable of protecting individual battery cells can be deployed on substrate 210 to define deployment area 222. Multiple components 220 can be formed (e.g., positioned) in deployment area 222. The multiple components 220 may include any of the following: battery protection elements, charging and discharging switching elements, electrode identification elements, and multiple passive components. The multiple components 220 may include connection terminals connected to the first electrode terminal block 111a and the second electrode terminal block 112a, as well as external terminals connected to an external load.

[0098] According to one implementation, in Figure 16 In step S1200, the first insulating layer 230 may be formed on the substrate 210 in areas other than the deployment area 222 (for example, the first insulating layer 230 may be formed on the substrate 210 in all areas other than the deployment area 222).

[0099] See Figure 7 and Figure 8 According to one embodiment, a first insulating mask 232 may be positioned in a deployment area 222 on a substrate 210. The first insulating mask 232 may be exposed only on the substrate 210 in areas other than the deployment area 222. A first insulating layer 230 may be formed by applying a first insulating material to all areas of the substrate 210 exposed by the first insulating mask 232 (e.g., not covered by the first insulating mask 232). The first insulating mask 232 is configured to prevent (or at least mitigate) the application of the first insulating material to the deployment area 222. The first insulating layer 230 may be formed on the substrate 210 over all areas except the deployment area 222. After the first insulating layer 230 is formed, the first insulating mask 232 may be removed.

[0100] According to one embodiment, the first insulating material forming the first insulating layer 230 may include, but is not limited to, photoresist (PSR) ink.

[0101] For example, the first insulating layer 230 can be formed by printing and drying a first insulating member comprising PSR ink. During a first printing operation, the first insulating member comprising PSR ink can be deposited on the substrate 210 with a thickness of about 10 μm to about 15 μm. After the first printing and drying process, during a second printing operation, the first insulating member can be deposited on the substrate 210 with a thickness of about 20 μm to about 30 μm. Through this process, the first insulating layer 230 can be formed. The above-described method for forming the first insulating layer 230 is merely an example, and this disclosure is not limited thereto.

[0102] According to one implementation, in Figure 16 In step S1300, the second insulating layer 240 may be formed on the first insulating layer 230 along the edge of the first insulating layer 230.

[0103] See Figures 9 to 12 According to one embodiment, a second insulating mask 242 may be positioned on the first insulating layer 230. The second insulating mask 242 may expose only the region on the first insulating layer 230 corresponding to the edge of the substrate 210. A second insulating material may then be applied, and thus the second insulating layer 240 may be formed at the location corresponding to the edge of the substrate 210 (e.g., the second insulating material may be deposited in the region of the first insulating layer 230 not covered by or exposed by the second insulating mask 242). The second insulating layer 240 may be formed at the location corresponding to the edge of the substrate 210 and may have a closed profile shape. After the second insulating layer 240 is formed, the second insulating mask 242 may be removed. The second insulating layer 240 may be formed as a closed profile along the edge of the first insulating layer 230.

[0104] According to one embodiment, the thickness t2 of the second insulating layer 240 formed in step S1300 may be thicker than the thickness t1 of the first insulating layer 230 formed in step S1200. The second insulating layer 240 is formed to be thick enough to prevent (or at least mitigate) the coating 250 from flowing out of the substrate 210.

[0105] According to one embodiment, the second insulating material forming the second insulating layer 240 may include, but is not limited to, photoresist (PSR) ink.

[0106] For example, in one or more embodiments, the second insulating layer 240 can be formed by printing and drying a second insulating member comprising PSR ink. During a first printing operation, the second insulating material comprising PSR ink can be deposited on the first insulating layer 230 with a thickness of about 10 μm to about 15 μm. After the drying step, the printing can be repeated. The printing steps can be repeated to form the second insulating layer 240 such that the second insulating layer 240 has a thickness of about 50 μm or more. The methods for forming the second insulating layer 240 described above are merely examples, and this disclosure is not limited thereto.

[0107] According to one implementation, in Figure 16 In step 1400, multiple components 220 may be formed or positioned in deployment area 222.

[0108] See Figure 13 and Figure 14 According to one embodiment, a plurality of components 220 may be formed or positioned in a deployment region 222 on a substrate 210. Each of the plurality of components 220 may be configured to transmit or receive electrical signals through a metal layer 210a. The plurality of components 220 may be formed or positioned in a deployment region 222 on the substrate 210 where a first insulating layer 230 is not formed. The deployment regions 222 on the substrate 210 may be separated from each other, and the plurality of components 220 located in the deployment regions 222 may be separated from each other.

[0109] In one embodiment, a plurality of components 220 may contact the first insulating layer 230 at a lower end adjacent to the substrate 210. The plurality of components 220 may be positioned within (e.g., surrounded by) a closed profile of a second insulating layer 240 formed along the edge of the first insulating layer 230. The plurality of components 220 may be located within the closed profile of the second insulating layer 240.

[0110] According to one embodiment, multiple components 220 may have different heights on the substrate 210. Depending on the specifications of the components 220, multiple components 220 may be located on the substrate 210 at different heights.

[0111] exist Figure 16 In step S1500, according to one embodiment, coating 250 may be formed on first insulating layer 230 to surround plurality of components 220.

[0112] See Figure 15 According to one embodiment, coating 250 may be formed on first insulating layer 230. Coating 250 may be formed to surround a plurality of components 220 on first insulating layer 230. Coating 250 may be formed as a single layer to surround the outer surfaces of the plurality of components 220.

[0113] In one embodiment, the coating 250 may be formed within the closed contour of the second insulating layer 240 (e.g., surrounded by the second insulating layer 240). Within the closed contour of the second insulating layer 240, a plurality of components 220 may be positioned in the deployment area 222, and the coating 250 may be positioned in areas other than the deployment area 222.

[0114] According to one embodiment, the coating 250 may be lower than (shorter than) the second insulating layer 240. The height h4 formed by the coating 250 may be lower than (shorter than) the height h3 formed by the second insulating layer 240. As described above, in order to prevent (or at least reduce) the coating 250 from flowing out of the substrate 210, the coating 250 may be formed lower than the second insulating layer 240.

[0115] According to one embodiment, coating 250 may include an underfill coating material. The coating member on which coating 250 is applied may be an underfill coating material. The underfill coating material may be an insulating resin. Coating 250 including underfill coating material has high ductility (e.g., low viscosity), and therefore, the thickness of coating 250 applied to the first insulating layer 230 can be formed uniformly (or substantially uniformly).

[0116] The coating 250 formed in this way can be surrounded by the second insulating layer 240, will not flow to (or at least substantially will not flow to) the outside of the substrate 210, and can surround multiple components 220. The coating 250 can be a single coating. As a result, the deployment strength of the components can be improved.

[0117] Although this disclosure has been described above with respect to its embodiments, it is not limited thereto. Those skilled in the art will be able to make various modifications and variations thereto within the spirit of this disclosure and within the equivalents of the appended claims.

[0118] <Explanation of reference numerals in the attached figures>

[0119] 1: Secondary battery 110: Electrode assembly

[0120] 111a: First electrode connector; 112a: Second electrode connector

[0121] 115: Membrane section; 120: Housing

[0122] 200: Protection circuit module; 210: Baseboard

[0123] 220: Multiple components 230: First insulating layer

[0124] 240: Second insulating layer; 250: Coating.

Claims

1. A protection circuit module, comprising: The substrate is electrically connected to the battery cell; Multiple components are located in the deployment area of ​​the substrate; A first insulating layer is provided on the substrate in a region of the substrate other than the deployment area; A second insulating layer is formed on top of the first insulating layer, and the second insulating layer is separated from the plurality of components; as well as A coating is applied to the first insulating layer and surrounds the plurality of components.

2. The protection circuit module according to claim 1, wherein, The second insulating layer extends along the edge of the first insulating layer.

3. The protection circuit module according to claim 2, in, The first insulating layer is present on the substrate in all areas except the deployment area, and The second insulating layer is located at a position corresponding to the edge of the substrate.

4. The protection circuit module according to claim 3, in, The second insulating layer has a closed profile, and The plurality of components are located within the closed contour.

5. The protection circuit module according to claim 4, wherein, The coating is within the closed contour of the second insulating layer and in the area of ​​the substrate other than the deployment area.

6. The protection circuit module according to any one of claims 1 to 5, wherein, The second insulating layer is thicker than the first insulating layer.

7. The protection circuit module according to any one of claims 1 to 5, wherein, The height of the second insulating layer is lower than the highest of the plurality of heights of the plurality of components.

8. The protection circuit module according to any one of claims 1 to 5, wherein, The height of the second insulating layer is lower than the lowest of the plurality of heights of the plurality of components.

9. The protection circuit module according to any one of claims 1 to 5, wherein, The height of the coating is lower than the height of the second insulating layer.

10. The protection circuit module according to any one of claims 1 to 5, wherein, The coating is lower in height than the individual height of each of the plurality of components.

11. The protection circuit module according to any one of claims 1 to 5, wherein, The first insulating layer and the second insulating layer each comprise photoresist soldering ink (PSR ink).

12. The protection circuit module according to any one of claims 1 to 5, wherein, The coating includes an underfill coating material.

13. A method for manufacturing a protection circuit module, the method comprising: A first insulating layer is formed on the substrate in a region of the substrate other than the deployment region, the deployment region being the region on the substrate where the component is located; A second insulating layer is formed on the first insulating layer, and the second insulating layer extends along the edge of the first insulating layer; Multiple components are formed in the deployment area; as well as A coating is formed on the first insulating layer, the coating surrounding the plurality of components.

14. The method for manufacturing a protection circuit module according to claim 13, in, The formation of the first insulating layer includes forming the first insulating layer on the substrate in all regions except the deployment area, and The formation of the second insulating layer includes forming the second insulating layer at a position corresponding to the edge of the substrate.

15. The method for manufacturing a protection circuit module according to claim 14, in, The formation of the second insulating layer includes forming the second insulating layer to have a closed profile, and The formation of the coating includes forming the coating to be positioned within the closed contour and in the area other than the deployment area.

16. The method of manufacturing a protection circuit module according to any one of claims 13 to 15, wherein, The formation of the second insulating layer includes forming the second insulating layer to be thicker than the first insulating layer.

17. The method of manufacturing a protection circuit module according to any one of claims 13 to 15, wherein, The formation of the second insulating layer includes forming the height of the second insulating layer to be lower than the lowest of a plurality of heights of the plurality of components.

18. The method of manufacturing a protection circuit module according to any one of claims 13 to 15, wherein, The formation of the coating includes forming the height of the coating to be lower than the height of the second insulating layer.

19. A secondary battery, comprising: Electrode assembly; Housing that houses the electrode assembly; as well as The protection circuit module is connected to the electrode assembly. The protection circuit module includes: The substrate is electrically connected to the electrode assembly; Multiple components are deployed in the area on the substrate; A first insulating layer is provided on the substrate in areas other than the deployment area. A second insulating layer, on top of the first insulating layer and separate from the plurality of components; and A coating is applied to the first insulating layer and surrounds the plurality of components.

20. The secondary battery according to claim 19, wherein, The second insulating layer extends along the edge of the first insulating layer.

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