Liquid cooling processing system with replaceable modules

Abstract

The invention relates to a liquid cooling processing system with replaceable modules. A modular processing system is provided. In one aspect, a modular processing system includes a first electronic module including a first printed circuit board (PCB) and a first electronic component on the first PCB; a second electronic module including a second PCB and a second electronic component on the second PCB; and a cold plate disposed between the first electronic module and the second electronic module. The cold plate is configured to circulate a coolant to cool the first PCB and the second PCB. At least a portion of the cold plate is included in the first electronic module. The first electronic module is removably secured to the second electronic module.

Description

Technical Field

[0001] This disclosure generally relates to processing systems, and more specifically, to processing systems with a modular design. Background Technology

[0002] A processing system may include multiple components, such as a system-on-a-chip (SoC) or an application-specific integrated circuit (ASIC). These components generate heat during operation, so cooling them can improve their performance and / or enable them to operate without failure in high-temperature environments. When a processing system fails, the ability to service the processing system can be expected to extend its lifespan. Summary of the Invention

[0003] In some aspects, a modular processing system is provided, comprising: a first electronic module including a first printed circuit board (PCB) and first electronic components on the first PCB; a second electronic module including second electronic components on a second PCB and a second PCB; and a cold plate disposed between the first electronic module and the second electronic module, the cold plate being configured to circulate coolant to cool the first PCB and the second PCB, wherein at least a portion of the cold plate is included in the first electronic module, and wherein the first electronic module is removably attached to the second electronic module.

[0004] In some embodiments, a cold plate is attached to a first PCB via one or more thermal interface materials (TIMs) to form a thermal path between the cold plate and a first electronic component on the first PCB, and the second electronic module further includes an internal plug-in attached to the second PCB, wherein the internal plug-in is thermally coupled to the first cold plate.

[0005] In some embodiments, the modular processing system further includes one or more thermal gap pads that couple a second electronic module to a cold plate, the one or more thermal gap pads being configured to provide a thermal interface between the second electronic component on the second PCB and the cold plate.

[0006] In some embodiments, the inner insert is in direct contact with the cold plate, and the inner insert is clamped to the cold plate.

[0007] In some embodiments, the insert defines a cutout and a thermal path between a second electronic component on a second PCB and a cold plate via the cutout.

[0008] In some embodiments, the inner plug-in is coupled to a cold plate via one or more spacers, and the modular processing system further includes a heat sink thermally coupled to the inner plug-in, the heat sink having a higher thermal conductivity than the inner plug-in, and configured to transfer heat from a second electronic component on a second PCB to one or more spacers.

[0009] In some embodiments, the modular processing system further includes a second cold plate, wherein the first electronic module includes a cold plate and the second electronic module includes a second cold plate.

[0010] In some embodiments, the cold plate includes a first port, and the second cold plate includes a second port, the first port being configured to be connected to the second port to provide a coolant path for coolant to flow from the cold plate to the second cold plate.

[0011] In some embodiments, the modular processing system further includes: a cold plate including a first opening and a second cold plate including a second opening, a first PCB including a convex plate-to-plate connector and a second PCB including a concave plate-to-plate connector, and the convex plate-to-plate connector and the concave plate-to-plate connector being configured to provide an electrical connection between the first PCB and the second PCB.

[0012] In some embodiments, the first electronic module and the second electronic module are directly coupled to the cold plate.

[0013] In some embodiments, the cold plate includes a first frame and a second frame configured to be attached to each other to form a coolant path through which the coolant flows.

[0014] In some embodiments, a first electronic component on a first PCB includes a system-on-a-chip configured to perform at least a portion of calculations associated with autonomous vehicle functions, and a second electronic component on a second PCB is configured to perform at least a portion of calculations associated with infotainment.

[0015] In other aspects, a method for replacing a module of a modular processing system is provided, the method comprising: removing a first electronic module from a second electronic module, wherein the first electronic module includes a first printed circuit board (PCB) and the second electronic module includes a second PCB, wherein the first electronic module was secured to the second electronic module prior to the removal, and wherein the modular processing system includes a cold plate configured to cool the first PCB and the second PCB; and attaching a new first electronic module to the second electronic module using one or more fasteners.

[0016] In some embodiments, the method further includes: identifying that the first electronic module has malfunctioned before attachment.

[0017] In some embodiments, the method further includes removing the modulator processing system from the vehicle prior to the disassembly.

[0018] In some embodiments, the modulator processing system is installed in the vehicle prior to the disassembly.

[0019] In some embodiments, a cold plate is arranged between the first electronic module and the second electronic module.

[0020] In some embodiments, the method further includes applying one or more gap pads to the inner plug of the modulator processing system prior to the attachment.

[0021] In some embodiments, the modular processing system further includes a second cold plate included in the first electronic module and the second cold plate included in the second electronic module, and the attachment includes mounting the first electronic module onto the second electronic module.

[0022] In other aspects, a modular processing system is provided, comprising: a first electronic module including a first PCB and first electronic components on the first PCB; a second electronic module including second electronic components on a second PCB and a second PCB; and a cold plate configured to circulate coolant to cool the first PCB and the second PCB, wherein the cold plate includes a portion of the first electronic module and a portion of the second electronic module, and wherein the first electronic module is removably attached to at least one of the second electronic module or the cold plate by one or more fasteners. Attached Figure Description

[0023] Figure 1A and Figure 1B A schematic exploded view of the processing system is provided.

[0024] Figure 2A and Figure 2B Schematic views of a modular processing system according to various aspects of this disclosure are provided.

[0025] Figures 3A to 3C A schematic cross-sectional view of a modular processing system according to different embodiments of the present disclosure is provided.

[0026] Figure 4A and Figure 4B A schematic view of another modular processing system according to various aspects of this disclosure is provided.

[0027] Figure 5 A schematic cross-sectional view of a modular processing system according to embodiments of the present disclosure is provided.

[0028] Figure 6A and Figure 6B A schematic cross-sectional view of a modular processing system according to another embodiment of the present disclosure is provided.

[0029] Figure 7 A schematic cross-sectional view of another modular processing system according to various aspects of this disclosure is provided.

[0030] Figure 8 A schematic cross-sectional view of yet another modular processing system according to various aspects of this disclosure is provided.

[0031] Figure 9 Provided with Figure 8 A schematic cross-sectional view of an alternative embodiment of the modular processing system compared to the modular processing system.

[0032] Figure 10 This is a flowchart of a method for replacing modules of a modular processing system according to various aspects of this disclosure. Detailed Implementation

[0033] The following detailed description of certain embodiments presents various descriptions of particular embodiments. However, the innovations described herein can be implemented in many different ways, such as those defined and covered by the claims. Reference is made in this specification to the accompanying drawings, wherein the same reference numerals and / or terms may indicate the same or functionally similar elements. It should be understood that the elements shown in the drawings are not necessarily drawn to scale. Furthermore, it should be understood that some embodiments may include more elements than shown in the drawings and / or a subset of the elements shown in the drawings. Additionally, some embodiments may combine any suitable combination of features from two or more drawings.

[0034] Processing systems can include multiple components, such as SoCs and ASICs. These components generate heat during operation, making cooling components crucial for improving performance and / or preventing failures when operating in high-temperature environments. These types of processing systems enable a variety of capabilities, including Advanced Driver Assistance Systems (ADAS) and autonomous vehicles, which involve relatively robust processing. In the event of a processing system failure, the ability to service the processing system to extend its lifespan is expected. This is an increasingly relevant issue that needs to be addressed in current industry trends. Furthermore, the ability to upgrade one or more individual components of the processing system is also expected.

[0035] A key design consideration for processing systems (e.g., high-performance computing systems, multi-chip modules, integrated circuit assemblies, etc.) is the cooling of electronic components located on one or more printed circuit boards (PCBs). Electronic components operate most efficiently within a given temperature range. Therefore, the heat generated by these components can raise their temperatures above their optimal operating range, causing performance degradation and / or shutdown. Cooling is typically required to maintain the temperature of the electronic components within or closer to the desired temperature range, thereby improving the performance of the processing system.

[0036] A computing system (also referred to as a “processing system”) may include two or more printed circuit board assemblies (PCBAs). As used herein, a PCBA generally refers to a printed circuit board (PCB) on which one or more electronic components are mounted. The two or more PCBAs of a processing system can be cooled via a shared cooling plate. Curable or other thermal interface materials (TIMs) can be used to couple the PCBAs to the cold plate to provide a thermal path that allows excess heat generated in the electronic components and / or the PCB to flow into the cold plate. While such processing systems can provide sufficient cooling for the two PCBs and the electronic components mounted on them, one drawback of this design is that replacing faulty components in the processing system can be expensive. For example, replacing a curable TIM may involve the use of automated dispensing equipment, which is typically not available outside of a manufacturing environment. Furthermore, removing one PCB from the cold plate exposes the PCB(s) to stresses that can damage the electronics mounted on it. Therefore, replacing any part of a processing system at a service center may be impossible, as service centers typically do not have the specialized equipment for applying curable TIMs and / or may not be able to reduce the stress of removing the PCB from the cold plate.

[0037] This disclosure relates to a modular computing system comprising two modules, either of which can be individually replaced. A first electronic module includes a first PCB and first electronic components on the first PCB. A second electronic module includes second electronic components on a second PCB and a second PCB. The second electronic module can be stacked and vertically overlapped with the first electronic module. A cold plate can be disposed between the first and second electronic modules, and coolant can circulate to cool the first and second PCBs, as well as the electronic components mounted on the first and second PCBs. The cold plate can be included in the first and / or second electronic modules. The first electronic module can be removably secured to the second electronic module using one or more fasteners.

[0038] Figure 1A and Figure 1B A schematic exploded view of the processing system 100 is provided. Specifically, Figure 1A A schematic exploded view of the processing system 100 is provided, while Figure 1B A schematic exploded view of a portion of the processing system 100 is provided.

[0039] refer to Figure 1A and Figure 1BThe processing system 100 includes a first cover 102, a first PCB 104, a cold plate 106, a second PCB 108, a second cover 110, a hose assembly 112, and a mounting bracket 114. The first cover 102 is configured to cover and protect the first PCB 104, and the second cover 110 is configured to cover and protect the second PCB 108.

[0040] The cold plate 106 may be implemented as an integral cold plate (e.g., as a single component) that defines a coolant path between the inlet 116 and the outlet 118 of the cold plate 106. The cold plate 106 is configured to allow coolant to circulate through the coolant path to cool the first PCB 104 and the second PCB 108.

[0041] Hose assembly 112 is used to supply coolant to inlet 116 of cold plate 106 and receive coolant from outlet 118 of cold plate 106. Hose assembly 112 may be coupled to a heat exchanger (not shown) configured to cool the coolant received from cold plate 106 before recirculating it back to cold plate 106.

[0042] Mounting bracket 114 can be directly or indirectly coupled to first cover 102, first PCB 104, cold plate 106, second PCB 108, and second cover 110. Mounting bracket 114 provides a structure that allows the processing system 100 to be installed in place during use.

[0043] The processing system 100 also includes a plurality of curable TIMs 120 disposed between the cold plate 106 and each of the first PCB 104 and the second PCB 108. The curable TIMs 120 provide a relatively high thermal conductivity path between the electronic components formed on each of the first PCB 104 and the second PCB 108 and the cold plate 106. These thermal paths allow excess heat generated in the electronic components formed on the first PCB 104 and the second PCB 108 to flow into the cold plate 106. The curable TIMs 120 can be bonded to the cold plate 106 and the first PCB 104 and the second PCB 108 using an automated dispensing device.

[0044] Figure 1A and Figure 1B The processing system 100 can be used in applications requiring two different processing systems. For example, an automotive application may have one processing system for infotainment and another for assisted and / or autonomous driving. These processing systems generate excessive heat, making active cooling of the processing system beneficial for performance. Instead of using two separate processing systems, each with its own independent cooling system, Figure 1A and Figure 1BThe processing system 100 shown can be used to reduce the cost, weight and packaging involved in providing two processing systems.

[0045] Dispensable curable TIM 120 is a reliable choice for automotive electronics because multiple curable TIMs 120 can apply minimal strain (e.g., less than a threshold strain) to the first PCB 104 and the second PCB 108 and the electronic components formed thereon, while also providing good thermal properties (e.g., up to 10-15 W / mK). However, one drawback of using curable TIM 120 is that it is typically applied using automated dispensing equipment. Without automated dispensing, the curable TIM 120 may not be applied with sufficient consistency, which can result in insufficient cooling of the electronic components formed on the first PCB 104 and the second PCB 108, potentially leading to malfunctions.

[0046] In the event of a failure in either the first PCB 104 or the second PCB 108, it is not possible to replace only the faulty PCB 104 or the second PCB 108 at a service center, as the service center may not be equipped with an automated dispensing device for the curable TIM 120. Furthermore, service technicians may not be qualified to use such equipment. Another risk is that service technicians may mishandle the first PCB 104 and the second PCB 108, causing damage to electronic components. Without an automated TIM dispensing device, manually replacing the faulty PCB 104 or the second PCB 108 at a service center may be infeasible and / or impossible. Removing residue from the curable TIM 120 can also be messy and time-consuming. Therefore, even if one of the first PCB 104 or the second PCB 108 is still fully functional, the entire processing system 100 may be replaced.

[0047] However, due to the cost of the individual first PCB 104 and second PCB 108, it is desirable to be able to manually replace one of the faulty PCBs in the first PCB 104 and second PCB 108, rather than replacing the entire processing system 100. This disclosure relates to a modular processing system that enables reliable and efficient manual replacement of one of the faulty PCBs in the first PCB 104 and second PCB 108.

[0048] This disclosure relates to systems and methods for enabling the individual replacement of two modules in a processing system comprising a first electronic module or a second electronic module. Embodiments of this disclosure relate to a modular processing system having: i) a single cold plate having separable electronic modules, or ii) two electronic modules having two connected, independent cold plates. Other aspects of this disclosure provide an alternative process-oriented technique for reworking bonded, curable TIMs to reduce hardware and service costs.

[0049] Figure 2A and Figure 2B A view of a modular processing system 200 according to this disclosure is provided. Specifically, Figure 2A An isometric view of the modular processing system 200 is provided, while Figure 2B A view of the processing system 200, in which two modules are separated, is provided.

[0050] refer to Figure 2A and Figure 2B The modular processing system 200 includes a first electronic module 202 and a second electronic module 204. The first electronic module 202 includes a cold plate 206, a first PCB 208, and a first cover 210. The second electronic module 204 includes an internal component 212, a second PCB 214, and a second cover 216.

[0051] The first PCB 208 is disposed between the first cover 210 and the cold plate 206, such that the first cover 210 and the cold plate 206 can protect the first PCB 208. Similarly, the second PCB 214 is disposed between the inner plug-in 212 and the second cover 216, such that the inner plug-in 212 and the second cover 216 can protect the second PCB 214.

[0052] In some embodiments, the inner insert 212 is configured to be removably secured to the cold plate 206 using one or more fasteners (e.g., screws, bolts, deformable eyelets, etc.) such that the first electronic module 202 can be detached from the second electronic module 204 to facilitate replacement of either the first electronic module 202 or the second electronic module 204. The inner insert 212 is also configured to protect the second PCB 214 when the second electronic module 204 is detached from the first electronic module 202 (e.g., during replacement).

[0053] The modular processing system 200 also includes one or more spacer pads 218 configured to provide a thermal path between electronic components (e.g., SOCs) formed on the second PCB 214 and the cold plate 206. An inner insert 212 provides a rigid backing for the one or more spacer pads 218 to allow pressure preloading of the spacer pads 218 (e.g., during installation of the one or more spacer pads 218) and increases the reliability of the electronic components on the second PCB 214. In some embodiments, the one or more spacer pads 218 may be adhesive and / or bonding layers, and the one or more spacer pads 218 may be pre-applied to the first electronic module 202 or the second electronic module 204 being replaced. In such embodiments, service technicians can avoid the risks of handling the spacer pads 218 and contamination.

[0054] In some embodiments, the first PCB 208 may have higher-power electronic components compared to the second PCB 214. Therefore, it is desirable to provide more cooling for the electronic components formed on the first PCB 208 compared to those formed on the second PCB 214. To provide additional cooling, a cold plate 206 may be included within the first electronic module 202. This can reduce the distance between the electronic components formed on the first PCB 208 and the cold plate 206, and the number of thermal layers, to provide a higher level of cooling for the electronic components formed on the first PCB 208.

[0055] In some applications, the electronic components on the first PCB 208 include a higher-power processor (e.g., an autonomous driving (AP) processor) configured to perform at least a portion of calculations associated with driver assistance, AP driving, other autonomous vehicle functions, and / or the vehicle's advanced driver assistance system (ADAS) functions. In some embodiments, the electronic components on the second PCB 214 include a lower-power processor (e.g., a media control unit (MCU) processor) configured to perform at least a portion of calculations associated with the vehicle's infotainment system and / or media control. Higher-power processors may generate more heat compared to lower-power processors.

[0056] Figures 3A to 3C Cross-sectional views of a modular processing system 300 according to different embodiments of the present disclosure are provided.

[0057] Figure 3AA cross-sectional view of one embodiment of a modular processing system 300 is provided, wherein an inner insert 312 includes one or more bases 302. The one or more bases 302 may be thermally coupled to one or more electronic components 304 formed on a second PCB 313 via one or more curable TIMs 306. The second PCB 313 may also include a processor 308 that can generate more heat than the one or more electronic components 304. The processor 308 may be thermally coupled to the inner insert 312 via the curable TIM 306 and a floating cover 310. In some applications, the floating cover 310 may include copper.

[0058] The first PCB 307 may have one or more electronic components 314 and one or more processors 316 disposed thereon. The one or more electronic components 314 may be connected to one or more bases 318 on the cold plate 305 via one or more curable TIMs 306. Each of the one or more processors 316 may be coupled to the cold plate 305 via a curable TIM 306, a floating cover 320 and another curable TIM 306.

[0059] Figure 3A The embodiments described herein can be used to simplify the assembly of the modular processing system 300. For example, the inner insert 312 can be in direct contact with the cold plate 305. A relatively low thermal resistance interface can be achieved without a spacer pad by means of relatively high pressure (e.g., pressure above a threshold, such as 100 psi or higher) between the inner insert 312 and the cold plate 305. Since the inner insert 312 and the cold plate 305 can be formed of metal, they can be manufactured rigidly enough to be clamped under pressure above the threshold. The force involved in achieving the pressure above the threshold ensures that the electronics (e.g., one or more electronic components 304 and / or processor 308) are not significantly affected, as the force can be provided by the clamping load at the interface between the inner insert 312 and the cold plate 305.

[0060] Figure 3B A cross-sectional view of an embodiment of the modular processing system 300 is provided, wherein the inner insert 312 has a cutout 322. Because some components of the modular processing system 300 are similar to... Figure 3A Those components, therefore in Figure 3B Not all similar components have reference numerals. (Combined) Figure 3A The provided discussion of these components is applicable to Figure 3B These components.

[0061] Because the internal insert material node is located between the floating cover 310 and the cold plate 305. Figure 3BThis embodiment can provide a higher level of cooling for the processor 308. The floating cover 310 can be configured to function as a floating head distributor, and the spacer pad 317 can be directly connected to both the floating cover 310 and the cold plate 305. This configuration can reduce the thermal resistance between the processor 308 and the cold plate 305. This can be achieved, for example, by changing the composition of the layers and / or reducing the number of layers between the processor 308 and the cold plate 305. One or more spacer pads 317 can also be disposed between the inner insert 312 and the cold plate 305, which is aligned with one or more electronic components 304 to cool those components 304. In some other applications (not shown), two or more cutouts can be included in the inner insert 312.

[0062] Figure 3C A cross-sectional view of one embodiment of a modular processing system 300 is provided, wherein the inner plug-in 312 has one or more heat sinks 326. Because some components of the modular processing system 300 are similar to… Figure 3A and / or Figure 3B Those components, therefore in Figure 3C Not all similar parts have reference numerals. (Combined) Figure 3A and Figure 3B The provided discussion of these components is applicable to Figure 3C These components.

[0063] One or more heat sinks 326 are configured to transfer heat from a localized heat source (e.g., one or more electronic components 304) to the location of one or more spacer pads 317. One or more heat sinks 326 can transfer heat more efficiently than a single internal insert 312, for example, by having a higher thermal conductivity compared to the internal insert 312. In some embodiments, one or more heat sinks 326 may include a conductive plate (e.g., a copper plate), heat pipes, or a vapor chamber. Because one or more spacer pads 317 are coupled to a cold plate 305, heat transferred to the location of one or more spacer pads 317 can be removed more efficiently via the combination of one or more heat sinks 326 and one or more spacer pads 317. In some embodiments, the number of one or more spacer pads 317 can be reduced by properly positioning one or more heat sinks 326, thereby reducing costs and decreasing the stress applied to the internal insert 312.

[0064] One or more heat sinks 326 may include structures that are more thermally conductive than the inner plug 312. In some embodiments, the inner plug 312 may include aluminum (e.g., having a thermal conductivity in the range of 90 W / mK to 200 W / mK). In some embodiments, one or more heat sinks 326 may include a copper block (e.g., having a thermal conductivity of about 390 W / mK), heat pipes, and / or a vapor chamber (e.g., having a thermal conductivity of about 2000 W / mK or greater). Embodiments of one or more heat sinks 326 may include: one or more heat sinks 326 being soldered and / or press-fitted into the inner plug 312; one or more heat sinks 326 being spring-loaded to a corresponding electronic component in one or more electronic components 304; and being thermally coupled to the inner plug 312 via one of a curable TIM 306 and / or a spacer pad 317; one or more heat sinks 326 being via a cutout 322 in the inner plug 312 (e.g., see...). Figure 3B The cut 322) can be directly butted to the cold plate 305 via the curable TIM 306, and / or any suitable combination thereof.

[0065] Figure 4A and Figure 4B A view of another modular processing system 400 according to various aspects of this disclosure is provided. In particular, Figure 4A An isometric view of the modular processing system 400 is provided, while Figure 4B A view of the processing system 400, in which two modules are separated, is provided.

[0066] refer to Figure 4A and Figure 4B The modular processing system 400 includes a first electronic module 402, a second electronic module 404, and a frame 406. The first electronic module 402 includes a first cold plate 408, a first PCB 410, and a first cover 412. The second electronic module 404 includes a second cold plate 414, a second PCB 416, and a second cover 418. The first electronic module 402 can be removably secured to the second electronic module 404 using fasteners, wherein the frame 406 is disposed between the first electronic module 402 and the second electronic module 404.

[0067] A first PCB 410 is disposed between a first cold plate 408 and a first cover 412, such that the first cold plate 408 and the first cover 412 can protect the first PCB 410. Similarly, a second PCB 416 is disposed between a second cold plate 414 and a second cover 418, such that the second cold plate 414 and the second cover 418 can protect the second PCB 416. As shown in the figure, the second cold plate 414 is positioned between the first PCB 410 and the second PCB 416.

[0068] The first cold plate 408 includes an inlet 420 configured to receive coolant from a heat exchanger (not shown). The second cold plate 414 includes an outlet 422 configured to return coolant to the heat exchanger. The first cold plate 408 includes a first port 424, and the second cold plate 414 includes a second port 426. The first port 424 is configured to be connected to the second port 426 to form a connection that provides a coolant path for coolant to flow from the first cold plate 408 to the second cold plate 414. The first port 424 can be sealed to the second port 426 to prevent coolant leakage. In some embodiments, the first port 424 and the second port 426 are configured to form a seal (e.g., a push-sealed connection) when the first electronic module 402 is mounted to the second electronic module 404.

[0069] The coolant design of the modular processing system 400 simplifies coolant connections by allowing a single inlet 420 and a single outlet 422 to cool electronic components formed on the first PCB 410 and the second PCB 416. For example, in a series configuration, coolant can flow from the first cold plate 408 to the second cold plate 414.

[0070] Figure 4A and Figure 4B The modular processing system 400 eliminates the need for replacement modules using curable TIM, and therefore, replacement of the first electronic module 402 or the second electronic module 404 can be performed at a service center. The modular approach of the modular processing system 400 is designed to prevent leakage via connections at the first port 424 and the second port 426, which have O-ring seals.

[0071] although Figure 4A and Figure 4B Two modules are shown in the modular processing system 400, but the design can be modified to stack one or more additional modules in series. Ports (e.g., similar to the first port 424 and the second port 426) can be provided between the cold plates of each adjacent module, allowing coolant to flow in series through all the cold plates in the stack. Thus, a single inlet 420 and a single outlet 422 can be used to supply coolant to the cold plates throughout the stack. Advantageously, since the first cold plate 408 faces outward, the first PCB 410 can be protected without a separate cover.

[0072] Figure 5 A cross-sectional view of a modular processing system 500 according to an embodiment of the present disclosure is provided. Similar to the modular processing system 400 of FIG4, Figure 5The modular processing system 500 includes a first electronic module 502, a second electronic module 504, and a frame 506. The first electronic module 502 includes a first cold plate 508, a first PCB 510, and a first cover 512. The second electronic module 504 includes a second cold plate 514, a second PCB 516, and a second cover 518. The first electronic module 502 can be removably secured to the second electronic module 504 using fasteners, wherein the frame 506 is disposed between the first electronic module 502 and the second electronic module 504.

[0073] Compared to the modular processing system 400 in Figure 4, in Figure 5 In the modular processing system 500, the first cold plate 508 of the first electronic module 502 and the second cold plate 514 of the second electronic module 504 are arranged adjacent to each other. Furthermore, compared to the modular processing system 400 of FIG. 4, the first port 524 of the first cold plate 508 and the second port 526 of the second cold plate 514 can be located on opposite sides of the first cold plate 408 and the second cold plate 414 relative to a single inlet 420 and a single outlet 422. This arrangement allows the first cold plate 508 to be coupled to the second cold plate 514 via a press-sealed connection between the first port 524 and the second port 526. This is achieved through... Figure 5 In the embodiment, the first cold plate 508 and the second cold plate 514 are arranged adjacent to each other, and the modular processing system 500 better isolates the electronic components from the fluid connections (e.g., the first port 524 and the second port 526), ​​so that any coolant drips due to seal failure will not come into contact with the electronic components arranged on the first PCB 510 or the second PCB 516.

[0074] Despite Figure 5 The modular processing system 500 shows two modules, but this design can be modified to have one or more additional modules stacked in series. Ports (e.g., similar to the first port 524 and the second port 526) can be provided between the cold plates of each adjacent module, allowing coolant to flow in series through all the cold plates in the stack. Thus, a single inlet 520 and a single outlet 522 can be used to supply coolant to the cold plates throughout the stack.

[0075] Figure 6A and Figure 6B A cross-sectional view of a modular processing system 600 according to another embodiment of this disclosure is provided. In particular, Figure 6A A cross-sectional view of the modular processing system 600 as seen from the side is provided, while Figure 6B A cross-sectional view is provided, taken from above the modular processing system 600.

[0076] Figure 6A and Figure 6BThe modulator processing system 600 is similar to Figure 5 The modulator processing system 500 includes additional features. Similar to... Figure 5 Modular processing system 500, Figure 6A and Figure 6B The modular processing system 600 includes a first electronic module 602, a second electronic module 604, and a frame 606. The first electronic module 602 includes a first cold plate 608, a first PCB 610, and a first cover 612. The second electronic module 604 includes a second cold plate 614, a second PCB 616, and a second cover 618. Similar to... Figure 5 The first cold plate 608 includes a first port 624 and a second port 626, which is configured to seal to the second port 626 of the second cold plate 614. The first electronic module 602 can be removably secured to the second electronic module 604 using fasteners, and a frame 606 is disposed between the first electronic module 602 and the second electronic module 604. In some embodiments, the fasteners can be snapped into place, which facilitates alignment of the first electronic module 602 and the second electronic module 604.

[0077] like Figure 6A and Figure 6B As shown, the modular processing system 600 also includes a convex board-to-board connector 632 disposed on a first PCB 610 and a concave board-to-board connector 634 disposed on a second PCB 616. A first cold plate 608 includes a first opening 636, and a second cold plate 614 includes a second opening 638. The first opening 636 and the second opening 638 allow the convex board-to-board connector 632 and the concave board-to-board connector 634 to be connected to each other via the first cold plate 608 and the second cold plate 614. The convex board-to-board connector 632 and the concave board-to-board connector 634 provide electrical connection between the first PCB 610 and the second PCB 616, allowing power and / or communication between them. The convex board-to-board connector 632 and the concave board-to-board connector 634 and / or the first port 624 and the second port 626 can be arranged in a self-aligned manner to facilitate coupling of the first electronic module 602 and the second electronic module 604. In some embodiments, the alignment of the convex plate connector 632 and the concave plate connector 634 and / or the first port 624 and the second port 626 can work in conjunction with the fasteners that are snapped in place to align the first electronic module 602 and the second electronic module 604.

[0078] Despite Figure 6AThe modular processing system 600 shows two modules, but this design can be modified to have one or more additional modules stacked in series. Ports (e.g., similar to the first port 624 and the second port 626) can be provided between the cold plates of each adjacent module, allowing coolant to flow in series through all the cold plates in the stack. Thus, a single inlet 620 and a single outlet 622 can be used to supply coolant to the cold plates throughout the stack.

[0079] Figure 7 A cross-sectional view of another modular processing system 700 according to various aspects of this disclosure is provided. (See figure) Figure 7 As shown, the modular processing system 700 includes a first electronic module 702, a second electronic module 704, and a cold plate frame 706.

[0080] The first electronic module 702 includes a first cover 708, a first PCB 710, a first processor 712 disposed on the first PCB 710, a first curable TIM 714, and a first housing 716. The first housing 716, together with the first cover 708, is configured to enclose the first PCB 710. The first housing 716 includes one or more bases and a plurality of heat sinks 718. The heat sinks 718 are configured to increase heat transfer from the first processor 712 to the coolant. The first processor 712 is thermally coupled to the first housing 716 via the first curable TIM 714. In some embodiments, the first processor 712, the first curable TIM 714, and the plurality of heat sinks 718 are vertically aligned (e.g., vertically overlapped) to increase heat transfer to the coolant. The first electronic module 702 is configured to be removably attached to a cold plate frame 706 via one or more fasteners 720. A first O-ring 722 may be used to seal the first electronic module 702 to the cold plate frame 706.

[0081] The second electronic module 704 includes a second cover 724, a second PCB 726, a second processor 728 disposed on the second PCB 726, a second curable TIM 730, and a second housing 732. The second housing 732, together with the second cover 724, is configured to enclose the second PCB 726. The second housing 732 includes one or more bases and a plurality of heat sinks 734. The heat sinks 734 are configured to increase heat transfer from the second processor 728 to the coolant. The second processor 728 is thermally coupled to the second housing 732 via the second curable TIM 730. In some embodiments, the second processor 728, the second curable TIM 730, and the plurality of heat sinks 734 are vertically aligned (e.g., vertically overlapped) to increase heat transfer to the coolant. The second electronic module 704 is configured to be removably attached to a cold plate frame 706 via one or more fasteners 720. A second O-ring 736 may be used to seal the second electronic module 704 to the cold plate frame 706.

[0082] The cold plate frame 706 is configured to provide a coolant path, allowing coolant to flow through and remove heat from the cold plate frame 706. A thermal path formed between components on the first electronic module 702 and the second electronic module 704 enables the cold plate frame 706 to cool the first electronic module 702 and the second electronic module 704. The coolant path is formed between the cold plate frame 706, the first housing 716 of the first electronic module 702, and the second housing 732 of the second electronic module 704. The cold plate frame 706 includes an inlet 738 and an outlet (in...). Figure 7 The outlet (which is obscured behind the inlet 738) is configured to receive coolant from the heat exchanger and return the coolant to the heat exchanger. A coolant plug 740 may be provided at one end of the cold plate frame 706, which can be used to drain coolant during maintenance of the modular processing system 700.

[0083] Each of the first electronic module 702 and the second electronic module 704 can be removably attached to the cold plate frame 706, allowing any one or more of the first electronic module 702, the second electronic module 704, and the cold plate frame 706 to be replaced at a service center. Because coolant discharge is a typical task performed at a service center, the servicing of the modular handling system 700 can be performed by service technicians without requiring specialized equipment typically used for manufacturing.

[0084] Since each electronic module in the first electronic module 702 and the second electronic module 704 is directly coupled to a single cold plate frame 706, therefore Figure 7 The embodiments can provide with Figure 1A and Figure 1B The processing system 100 has essentially the same cooling level.

[0085] Figure 8 A cross-sectional view of yet another modular processing system 800 according to various aspects of this disclosure is provided. For example... Figure 8 As shown, the modular processing system 800 includes a first electronic module 802 and a second electronic module 804.

[0086] The first electronic module 802 includes a first cover 806, a first PCB 808, a first processor 810, a first curable TIM 812, a first base 814, and a first frame 816. The second electronic module 804 includes a second cover 806, a second PCB 824, a second processor 826, a second curable TIM 828, a second base 830, and a second frame 832. A plurality of fasteners 820 can be used to fasten the first PCB 808 to the first frame 816, the second PCB 824 to the second frame 832, and the first frame 816 to the second frame 832.

[0087] The first frame 816 and the second frame 832 are configured as modular frames that, when coupled together, form a coolant path. The first frame 816 and the second frame 832 can close the coolant channel 834 that defines the coolant path. The modular processing system 800 allows the coolant to directly contact the first frame 816 and the second frame 832, thereby providing a higher level of cooling.

[0088] Figure 9 Provided with Figure 8 A cross-sectional view of an alternative embodiment of a modular processing system 900 compared to a modular processing system 800. The modular processing system 900 may have the same... Figure 8 Similar to certain components in the modular processing system 800, therefore, the description of these components can also be applied to... Figure 9 The modular processing system 900.

[0089] like Figure 9 As shown, the first frame 816 includes a plurality of first heat sinks 902, and the second frame 832 includes a plurality of second heat sinks 904. When the first frame 816 and the second frame 832 are assembled, the first frame 816 and the second frame 832 can form a cold plate. Because a separate cold plate is not included in this embodiment, a portion can be eliminated from the modular processing system 900, thereby reducing manufacturing costs.

[0090] exist Figure 8 and Figure 9 In one embodiment, mounting the first PCB 808 and the second PCB 824 on the first frame 816 and the second frame 832, and using the first base 814 and the second base 830 together, can help control the z-height and flatness.

[0091] Figure 10A method 1000 for replacing a module of a modular processing system according to aspects of this disclosure is illustrated. In block 1010, method 1000 involves identifying one of a first electronic module and a second electronic module of the modular processing system as faulty. The first electronic module includes a first printed circuit board (PCB), and the second electronic module includes a second PCB. The first electronic module is attached to the second electronic module. The modular processing system also includes a first cold plate configured to cool the first PCB and the second PCB.

[0092] In block 1020, method 1000 includes removing the first electronic module from the second electronic module.

[0093] In block 1030, method 1000 involves replacing one of the identified components in the first electronic module from the second electronic module.

[0094] At block 1040, method 1000 involves using fasteners to attach an electronic module that has been replaced in the first electronic module from the second electronic module to another electronic module in the first electronic module from the second electronic module.

[0095] In some embodiments, a first cold plate is disposed between a first electronic module and a second electronic module. The first cold plate may be included in the first electronic module and / or the second electronic module.

[0096] In some embodiments, the method further includes applying one or more gap pads to the inner insert of the second electronic module before attaching an electronic module that has been replaced from the first electronic module of the second electronic module to another electronic module from the first electronic module of the second electronic module using fasteners. In some embodiments, the method may also include removing residue from the gap pads of the electronic module that has been replaced from the first electronic module of the second electronic module using an alcohol wipe.

[0097] In some embodiments, fasteners are used to attach an electronic module that has been replaced in the first electronic module from the second electronic module to another electronic module in the first electronic module from the second electronic module, including clamping the inner plug of the second electronic module to the first cold plate at a pressure above a threshold pressure.

[0098] In some embodiments, the modular processing system further includes a second cold plate. The first cold plate may be included in the first electronic module, and the second cold plate is included in the second electronic module. Attaching an electronic module that has been replaced in the first electronic module from the second electronic module to another electronic module from the first electronic module from the second electronic module using fasteners may include mounting the first electronic module to the second electronic module.

[0099] In some embodiments, the first cold plate includes a first port, and the second cold plate includes a second port. The first port can be configured to be connected to the second port to form a connection that provides a coolant path for coolant to flow from the first cold plate to the second cold plate. Mounting a first electronic module to the second electronic module can form a seal between the first port and the second port.

[0100] In some embodiments, the method further includes coupling a convex board-to-board connector of the first PCB to a concave board-to-board connector of the second PCB to provide an electrical connection between the first PCB and the second PCB. in conclusion

[0101] The foregoing disclosure is not intended to limit this disclosure to the precise form or particular field of use disclosed. Therefore, it is conceivable that various alternative embodiments and / or modifications to this disclosure, whether expressly described or implied herein, are possible. Embodiments of this disclosure have been thus described, and those skilled in the art will recognize that changes in form and detail may be made without departing from the scope of this disclosure. Therefore, this disclosure is limited only by the claims.

[0102] In the foregoing specification, this disclosure has been described with reference to specific embodiments. However, as those skilled in the art will recognize, various embodiments disclosed herein may be modified or implemented in various other ways without departing from the spirit and scope of this disclosure. Therefore, this description is to be considered illustrative and intended to teach those skilled in the art how to manufacture and use various embodiments of the disclosed vent assembly. It should be understood that the forms of disclosure shown and described herein are to be considered representative embodiments. Equivalent elements, materials, processes, or steps may be substituted for those representatively illustrated and described herein. Furthermore, certain features of this disclosure may be utilized independently of the use of other features, all of which will be apparent to those skilled in the art who benefit from the description of this disclosure. Expressions such as “comprising,” “including,” “incorporated,” “consisting of,” “having,” and “is” used to describe and claim the contents of this disclosure are intended to be interpreted in a non-exclusive manner, allowing for the presence of items, parts, or elements not explicitly described. References to the singular should also be interpreted as relating to the plural.

[0103] Furthermore, the various embodiments disclosed herein should be considered illustrative and explanatory, and should not be construed as limiting the scope of this disclosure. All joint references (e.g., attachment, pasting, coupling, connection, etc.) are used only to aid the reader in understanding this disclosure and do not impose limitations, particularly regarding the location, orientation, or use of the systems and / or methods disclosed herein. Therefore, joint references should be interpreted broadly, if applicable. Moreover, such joint references do not necessarily imply that two elements are directly connected to each other. Furthermore, all numerical terms, such as, but not limited to, “first,” “second,” “third,” “primary,” “secondary,” “main,” or any other common and / or numerical terms, should also be considered merely as identifiers to aid the reader in understanding the various elements, embodiments, variations, and / or modifications of this disclosure, and should not impose any limitations, particularly regarding the order or preference of any element, embodiment, variation, and / or modification relative to or exceeding another element, embodiment, variation, and / or modification.

[0104] It should also be understood that one or more of the elements depicted in the accompanying drawings may also be implemented in a more separate or integrated manner, or even removed or rendered inoperable in some cases, which may be useful depending on the specific application.

Claims

1. A modular processing system, comprising: A first electronic module, the first electronic module including a first printed circuit board (PCB) and a first electronic component on the first PCB; The second electronic module includes a second PCB and second electronic components on the second PCB; as well as A cold plate is disposed between the first electronic module and the second electronic module, and the cold plate is configured to circulate coolant to cool the first PCB and the second PCB. At least a portion of the cold plate is included in the first electronic module, and The first electronic module can be removably fixed to the second electronic module.

2. The modular processing system according to claim 1, wherein: The cold plate is attached to the first PCB using one or more thermal interface materials (TIM) to form a thermal path between the cold plate and the first electronic component on the first PCB, and The second electronic module also includes an internal component attached to the second PCB, wherein the internal component is thermally coupled to the first cold plate.

3. The modular processing system according to claim 2 further includes: One or more thermal gap pads couple the second electronic module to the cold plate, and the one or more thermal gap pads are configured to provide a thermal interface between the second electronic component on the second PCB and the cold plate.

4. The modular processing system according to claim 2, wherein the inner insert is in direct contact with the cold plate, and the inner insert is clamped to the cold plate.

5. The modular processing system of claim 2, wherein the inner plug defines a cutout and a thermal path between the second electronic component on the second PCB and the cold plate via the cutout.

6. The modular processing system of claim 2, wherein the inner insert is coupled to the cold plate via one or more spacers, and wherein the modular processing system further comprises: A heat sink, thermally coupled to the inner plug-in, having a higher thermal conductivity than the inner plug-in, and configured to transfer heat from the second electronic component on the second PCB to the one or more spacer pads.

7. The modular processing system according to claim 1, further comprising: The second cold plate, The first electronic module includes a cold plate, and the second electronic module includes the second cold plate.

8. The modular processing system of claim 7, wherein the cold plate includes a first port and the second cold plate includes a second port, the first port being configured to be connected to the second port to provide a coolant path for the coolant to flow from the cold plate to the second cold plate.

9. The modular processing system according to claim 7, wherein: The cold plate includes a first opening, and the second cold plate includes a second opening. The first PCB includes a convex board-to-board connector, and the second PCB includes a concave board-to-board connector. The convex plate-to-plate connector and the concave plate-to-plate connector are configured to provide an electrical connection between the first PCB and the second PCB.

10. The modular processing system according to claim 1, wherein the first electronic module and the second electronic module are directly coupled to the cold plate.

11. The modular processing system of claim 1, wherein the cold plate comprises a first frame and a second frame, the first frame and the second frame being configured to be attached to each other to form a coolant path through which the coolant flows.

12. The modular processing system of claim 1, wherein the first electronic component on the first PCB includes a system-on-a-chip configured to perform at least a portion of calculations associated with autonomous vehicle functions, and wherein the second electronic component on the second PCB is configured to perform at least a portion of calculations associated with infotainment.

13. A method for replacing a module in a modular processing system, the method comprising: The first electronic module is detached from the second electronic module, wherein the first electronic module includes a first printed circuit board (PCB) and the second electronic module includes a second PCB, wherein the first electronic module is secured to the second electronic module prior to the detachment, and wherein the modular processing system includes a cold plate configured to cool the first PCB and the second PCB. as well as The new first electronic module is attached to the second electronic module using one or more fasteners.

14. The method of claim 13, further comprising identifying that the first electronic module has malfunctioned prior to the attachment.

15. The method of claim 13, further comprising removing the modulator processing system from the vehicle prior to the disassembly.

16. The method of claim 13, wherein the modulator processing system is installed in the vehicle prior to the disassembly.

17. The method of claim 13, wherein the cold plate is disposed between the first electronic module and the second electronic module.

18. The method of claim 13, further comprising applying one or more gap pads to the inner plug of the modulator processing system prior to the attachment.

19. The method of claim 13, wherein: The modular processing system also includes a second cold plate. The cold plate is included in the first electronic module, and the second cold plate is included in the second electronic module. The attachment includes installing the first electronic module onto the second electronic module.

20. A modular processing system, comprising: A first electronic module, the first electronic module including a first PCB and a first electronic component on the first PCB; The second electronic module includes a second PCB and second electronic components on the second PCB; as well as A cold plate, configured to circulate coolant to cool the first PCB and the second PCB, The cold plate includes a portion of the first electronic module and a portion of the second electronic module, and The first electronic module can be removably attached to at least one of the second electronic module or the cold plate by one or more fasteners.

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