Display panel and display device

Abstract

The invention provides a display panel and a display device, relates to the technical field of display, and is used for solving the technical problems of poor strength of a packaging structure of the display panel and poor light emitting effect of the display panel, and the display panel comprises a driving backboard, a light emitting layer, the packaging structure and a reflecting layer, the light-emitting layer is arranged on the driving backboard and electrically connected with the driving backboard, the light-emitting layer comprises a plurality of pixel units arranged in an array, and each pixel unit comprises at least three sub-pixels; the packaging structure is arranged on one side, deviating from the driving backboard, of the light-emitting layer; the packaging structure comprises a glass substrate and an isolation layer, the isolation layer is arranged on the side, facing the light-emitting layer, of the glass substrate, the isolation layer is provided with a plurality of openings arranged in an array mode, and one opening is at least opposite to one sub-pixel and exposes the corresponding sub-pixel; the reflecting layer is arranged on the side wall of the opening. The light emitting effect of the display panel is improved while the strength of the packaging structure is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] Mini-LED (Mini-Light Emitting Diode) is an array display technology composed of micron-sized semiconductor light-emitting units. It has significant advantages over LCD and OLED displays in terms of brightness, resolution, contrast, energy consumption, lifespan, response speed, and stability.

[0003] In related technologies, the display panel includes a driving backplane, Mini / Micro-LEDs, anisotropic conductive film (ACF film), and an encapsulation structure. The ACF film contains conductive particles. Mini / Micro-LEDs typically use a stamp transfer method and an ACF film layer to achieve signal conduction between the electrodes in the Mini / Micro-LED and the driving backplane. The encapsulation structure is placed on the driving backplane after the Mini / Micro-LED has been transferred to protect the structure of the Mini / Micro-LED, such as blocking moisture and dust, and protecting the light-emitting Mini / Micro-LED device and the driving backplane.

[0004] However, in related technologies, the packaging structure has poor strength and the display panel has poor light emission performance. Summary of the Invention

[0005] In view of the above problems, embodiments of this application provide a display panel and a display device to improve the light emission effect of the display panel while increasing the strength of the packaging structure.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] The first aspect of this application provides a display panel, including:

[0008] Drive backplane;

[0009] A light-emitting layer is disposed on the driving backplane and electrically connected to the driving backplane. The light-emitting layer includes a plurality of pixel units arranged in an array, and the pixel unit includes at least three sub-pixels.

[0010] An encapsulation structure is disposed on the side of the light-emitting layer away from the driving backplate; the encapsulation structure includes a glass substrate and an isolation layer, the isolation layer is disposed on the side of the glass substrate facing the light-emitting layer, the isolation layer has a plurality of openings arranged in an array, each opening is disposed opposite to at least one sub-pixel and exposes the corresponding sub-pixel;

[0011] A reflective layer is disposed on the sidewall of the opening.

[0012] In some embodiments, one of the openings is disposed opposite to one of the pixel units, and the opening exposes the pixel unit.

[0013] In some embodiments, one of the openings is disposed opposite to one of the sub-pixels, the openings expose the sub-pixels, and an isolation portion is disposed between adjacent openings.

[0014] In some embodiments, the cross-sectional dimension of the opening on the side near the drive backplate is smaller than the cross-sectional dimension of the opening on the side near the glass substrate.

[0015] In some embodiments, the cross-sectional size of the opening gradually increases along the direction from the drive backplate to the packaging structure.

[0016] In some embodiments, the angle between the extension direction of the opening sidewall and the first direction is 30° to 60°, wherein the first direction is consistent with the thickness direction of the glass substrate.

[0017] In some embodiments, the surface profile of the reflective layer along the extending direction of the opening sidewall is at least one of stepped or wavy.

[0018] In some embodiments, the profile shape of the opening sidewall matches the profile shape of the reflective layer.

[0019] In some embodiments, the reflective layer includes at least one of an aluminum reflective layer, a gold reflective layer, and a silver reflective layer.

[0020] In some embodiments, the encapsulation structure further includes an anti-glare layer disposed on the side of the glass substrate opposite to the isolation layer.

[0021] In some embodiments, the encapsulation structure further includes an anti-reflection layer disposed on the side of the glass substrate opposite to the isolation layer.

[0022] In some embodiments, the encapsulation structure further includes a protective layer disposed on the surface of the isolation layer.

[0023] A second aspect of this application provides a display device, including a display panel as described in the above embodiments.

[0024] In the display panel and display device provided in this application embodiment, an encapsulation structure is provided on the side of the light-emitting layer away from the driving backplate to protect the light-emitting layer. The encapsulation structure includes a glass substrate and an isolation layer. The glass substrate has good strength and flatness, which can improve the structural strength of the encapsulation structure and improve the surface flatness and appearance consistency of the display panel after encapsulation. In addition, by providing an isolation layer on the side of the glass substrate facing the light-emitting layer and providing an opening in the isolation layer, the light emitted by each sub-pixel in the pixel unit can pass through the opening, improving the light emission effect of the pixel unit. The isolation layer blocks light between adjacent pixel units to improve the display contrast of the display panel, avoid the phenomenon of light leakage and color mixing when adjacent pixel units emit light, and reduce the reflection of external light to prevent external light from irradiating the light-emitting layer and increasing the leakage current of the device. A reflective layer is provided on the sidewall of the opening, which can reflect and collect the lateral light emitted by the pixel unit when it emits light through the emission layer to improve the loss of lateral light emission and thus improve the extraction rate of the light emitted by the light-emitting layer.

[0025] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that the display panel and display device provided by the embodiments of this application can solve, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A cross-sectional structural diagram of a first structure of a display panel provided in an embodiment of this application;

[0028] Figure 2 for Figure 1 A top view of the light-emitting layer after it has been transferred to the driving backplane;

[0029] Figure 3 This is a cross-sectional schematic diagram of a second structure of a display panel provided in an embodiment of this application;

[0030] Figure 4This is a top view schematic diagram of a structure of a display panel provided in an embodiment of this application;

[0031] Figure 5 for Figure 4 A schematic diagram of the cross-sectional structure of the isolation layer after being cut at point AA along the middle edge;

[0032] Figure 6 A top view schematic diagram of a third structure of a display panel provided in an embodiment of this application;

[0033] Figure 7 for Figure 6 A schematic diagram of the cross-sectional structure of the isolation layer after being cut at point BB along the middle section;

[0034] Figure 8 A cross-sectional schematic diagram of a fourth structure of a display panel provided in an embodiment of this application;

[0035] Figure 9 A cross-sectional schematic diagram of a fifth structure of a display panel provided in an embodiment of this application;

[0036] Figure 10 for Figure 9 A magnified view of a portion of point C.

[0037] Figure label:

[0038] 100 - Display panel;

[0039] 110 - Drive backplane; 111 - Backplane electrode;

[0040] 120 - Emitting layer; 121 - Pixel unit; 1211 - Sub-pixel; 122 - N electrode; 123 - P electrode;

[0041] 130 - Packaging structure; 131 - Glass substrate; 132 - Isolation layer; 1321 - Opening; 1322 - Isolation section;

[0042] 133 - Reflective layer;

[0043] 134 - Anti-glare layer; 135 - Anti-reflection layer;

[0044] 140 - Conductive adhesive film; 141 - Conductive particles. Detailed Implementation

[0045] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0046] Figure 1 A cross-sectional structural diagram of a first structure of a display panel provided in an embodiment of this application; Figure 2 for Figure 1 A top-view schematic diagram showing the intermediate light-emitting layer after it has been transferred to the driving backplane. Please refer to... Figure 1 and Figure 2 As shown, this application embodiment provides a display panel 100, which includes a driving backplate 110 and a light-emitting layer 120. For example, the light-emitting layer 120 may be a Mini / Micro-LED layer. The Mini / Micro-LED can be integrated onto the driving backplate 110 through a stamp transfer process and electrically connected to the driving backplate 110. The light-emitting layer 120 includes a plurality of pixel units 121 arranged in an array. Each pixel unit 121 includes at least three sub-pixels 1211. For example, each pixel unit 121 includes three sub-pixels 1211, and the three sub-pixels 1211 respectively include red light, green light and blue light. The three sub-pixels 1211 can be represented by R, G and B, respectively, where R represents red light, G represents green light and B represents blue light.

[0047] In some embodiments, such as Figure 1 As shown, the Mini / Micro-LED layer can be bonded to the driving backplate 110 via the conductive adhesive film 140. In addition, the conductive adhesive film 140 contains conductive particles 141. The Mini / Micro-LED layer has an N-type N electrode 122 and a P-type P electrode 123. The driving backplate 110 is provided with a backplate electrode 111. In this way, the N electrode 122 and the P electrode 123 are connected by electrical signals through the conductive particles 141 and their corresponding backplate electrodes 111 on the driving backplate 110, thereby realizing the electrical connection between the Mini / Micro-LED layer and the driving backplate 110.

[0048] The conductive film 140 includes, but is not limited to, anisotropic conductive film (ACF).

[0049] Alternatively, the N electrode 122 and P electrode 123 in the Mini / Micro-LED layer can also be electrically connected to the backplate electrode 111 on the driving backplate 110 through a mechanical structure; the electrical connection between the Mini / Micro-LED layer and the driving backplate 110 includes, but is not limited to, the above two methods. Any method that can achieve the electrical connection between the Mini / Micro-LED layer and the driving backplate 110 is within the protection scope of the embodiments of this application, and will not be exhaustively listed here.

[0050] Please continue to refer to Figure 1 As shown, the display panel 100 also includes an encapsulation structure 130, which is disposed on the side of the light-emitting layer 120 away from the driving backplate 110. The encapsulation structure 130 protects the structure of the light-emitting layer 120 (Mini / Micro-LED layer), for example, to block moisture and dust, protect the light-emitting LED devices and the driving backplate 110, etc. At the same time, the encapsulation structure 130 can also improve the light-emitting viewing angle, brightness, color, etc. of the display panel 100 in the lit state, and can also improve the dark appearance performance in the non-lit state.

[0051] In some embodiments, the encapsulation structure 130 includes a flexible encapsulation film attached to the side of the light-emitting layer 120 facing away from the driving backplate 110 to achieve optical and physical protection. The flexible encapsulation film includes, but is not limited to, a polyethylene terephthalate (PET) substrate or an epoxy resin encapsulation film, wherein the flexible encapsulation film is doped with blackening materials such as carbon black.

[0052] However, the flexible encapsulation film has poor structural strength and limited protection for the driver backplane 110 and the Mini / Micro-LED layer. At the same time, due to the manufacturing process of the flexible encapsulation film, its thickness uniformity and surface flatness are relatively poor, which will affect the dark appearance of the product in the non-lit state, such as surface reflection, color difference and other visual discomfort. For the bright state display, the relatively uniform transmittance of the flexible encapsulation film also affects the light extraction efficiency of LED light emission.

[0053] Based on the above issues, please refer to Figure 3As shown in the embodiment of this application, the display panel 100 includes an encapsulation structure 130 disposed on the side of the light-emitting layer 120 away from the driving backplate 110. The encapsulation structure 130 includes a glass substrate 131 disposed on the side of the light-emitting layer 120 away from the driving backplate 110 to encapsulate the driving backplate 110 and the light-emitting layer 120. Since the glass substrate 131 is a rigid material, the strength of the encapsulation structure 130 can be increased. In addition, the rigid material glass substrate 131 has better flatness, which can improve the flatness and appearance consistency of the surface of the encapsulated display panel 100.

[0054] Please refer to Figures 3 to 5 As shown, the encapsulation structure 130 also includes an isolation layer 132. The isolation layer 132 is disposed on the side of the glass substrate 131 facing the light-emitting layer 120. The isolation layer 132 has a plurality of openings 1321 arranged in an array. Each pixel unit 121 is disposed opposite to at least one opening 1321, such that each opening 1321 exposes at least one sub-pixel 1211 of its corresponding pixel unit 121. That is, on the side of the light-emitting layer 120 and the driving backplate 110 facing the isolation layer 132, only each pixel unit 121 is disposed opposite to at least one opening 1321, and the others are not. An isolation layer 132 is evenly distributed at the location of the pixel unit 121 to block light, so as to at least prevent the problem of color mixing between adjacent pixel units 121 when they emit light. The opening 1321 exposes the corresponding pixel unit 121, which can improve the light emission effect of each sub-pixel 1211, improve the extraction rate of the light emitted by the LED after packaging, and improve the brightness and high contrast of the Mini / Micro-LED layer when it emits light. It can also reduce external light reflection and prevent external light from shining on the Mini / Micro-LED and increasing leakage current.

[0055] The isolation layer 132 can be a black isolation layer. For example, the isolation layer 132 includes, but is not limited to, a black matrix pattern (BM) film layer to ensure the light-blocking effect between adjacent pixel units 121.

[0056] In some embodiments, please refer to Figure 4 and Figure 5 As shown, an opening 1321 is disposed opposite to a pixel unit 121, that is, an opening 1321 exposes its corresponding pixel unit 121. An isolation layer 132 is disposed between adjacent pixel units 121 to isolate the light emission of adjacent pixel units 121 through the isolation layer 132, so as to avoid the phenomenon of light emission color mixing between adjacent pixel units 121.

[0057] In other embodiments, please refer to Figure 6 and Figure 7 As shown, an opening 1321 is disposed opposite to a sub-pixel 1211 in a pixel unit 121, that is, each sub-pixel 1211 in each pixel unit 121 has an opening 1321 that exposes it, and an isolation portion 1322 is provided between adjacent openings 1321. In this way, the isolation portion 1322 can block light between adjacent sub-pixels 1211, which can effectively block the phenomenon of color mixing caused by light leakage between adjacent sub-pixels 1211, thereby improving the color contrast of the display screen. In addition, it can further reduce the reflection of external light to prevent the phenomenon of increased transistor leakage current caused by external light.

[0058] In some embodiments, please refer to Figure 8 As shown, each sidewall of the isolation layer 132 that forms an opening 1321 has a reflective layer 133. The reflective layer 133 can be used to reflect and collect the light emitted laterally from each sub-pixel 1211 in the pixel unit 121, thereby reducing the loss of light emission from the sidewall of the sub-pixel 1211. In this way, the light emission effect of the pixel unit 121 can be further improved, the extraction rate of the light emitted by the LED can be increased, and the display effect of the display panel 100 can be improved.

[0059] In some embodiments, the cross-sectional dimension of the opening 1321 near the driving back plate 110 is smaller than the cross-sectional dimension of the opening 1321 near the glass substrate 131. The reflective layer 133 is disposed on the sidewall of the opening 1321 and matches the sidewall of the opening 1321. In this way, the light emitted from the sidewall of the sub-pixel 1211 can be reflected and collected by the reflective layer 133 to improve the light extraction rate.

[0060] For example, such as Figure 8 As shown, along the direction from the drive backplate 110 to the package structure 130, the cross-sectional size of the opening 1321 gradually increases. Correspondingly, the reflective layer 133 is attached to the sidewall of the opening 1321 and matches the sidewall of the opening 1321 so as to reflect and collect the light emitted from the sidewall of the sub-pixel 1211 through the reflective layer 133, thereby improving the light extraction rate.

[0061] In some embodiments, please continue to refer to Figure 8 As shown, the extension direction of the sidewall of the opening 1321 has an inclined angle with the first direction, which is 30° to 60°. The first direction is consistent with the thickness direction of the glass substrate 131. For example, the angle between the extension direction of the sidewall of the opening 1321 and the first direction is 30°, 40°, 45°, 50°, 60°, etc. The specific design can be adapted according to actual needs, as long as it can reflect and collect the light emitted by the sidewall of the sub-pixel 1211 well. There are no restrictions here.

[0062] Along the extension direction of the sidewall of the opening 1321, the surface contour of the reflective layer 133 can be at least one of a straight line, a step, a wavy line, or an arc shape, as long as it can further reflect and collect the light emitted from the sidewall of the sub-pixel 1211, so as to improve the light emission effect and the light extraction efficiency, thereby improving the display effect of the display panel 100.

[0063] It should be noted that the reflective layer 133 matches the contour structure of the sidewall of the opening 1321, so that the reflective layer 133 can be deposited on the sidewall of the opening 1321 by a deposition process.

[0064] For example, such as Figure 9 and Figure 10 As shown, the contour shape of the sidewall of the opening 1321 is stepped, and correspondingly, the contour shape of the reflective layer 133 is stepped, which matches the contour shape of the sidewall of the opening 1321. In this way, the reflective layer 133 of the sidewall of the opening 1321 can perform multi-level reflection, thereby further improving the effect of reflecting and collecting light.

[0065] In some embodiments, the material of the reflective layer 133 includes, but is not limited to, metallic materials with reflective properties such as aluminum, silver, and gold.

[0066] In some embodiments, please refer to Figure 3 , Figure 8 and Figure 9 As shown, the encapsulation structure 130 also includes an anti-glare layer 134, which is disposed on the side of the glass substrate 131 away from the isolation layer 132, so as to prevent glare during display and improve the viewing experience of the display screen.

[0067] Among them, the anti-glare layer 134 can be an anti-glare film layer (AG) to avoid glare and improve the viewing experience of the display screen in light.

[0068] In some embodiments, please continue to refer to Figure 3 , Figure 8 and Figure 9 As shown, the encapsulation structure 130 also includes a reflection prevention layer 135, which is disposed on the side of the glass substrate 131 away from the isolation layer 132. The reflection prevention layer 135 can be an anti-reflection film (AR), which is mainly used to prevent the reflection of light on the display screen, thereby improving the viewing experience of the display screen in terms of external light.

[0069] For example, the encapsulation structure 130 includes an anti-glare layer 134 and an anti-reflection layer 135. The anti-glare layer 134 is disposed on the side of the glass substrate 131 away from the isolation layer 132, and the anti-reflection layer 135 is disposed on the side of the anti-glare layer 134 away from the glass substrate 131. The anti-glare layer 134 prevents glare during display, and the anti-reflection layer 135 prevents light reflection on the display screen, thereby further improving the viewing experience of the display screen.

[0070] In addition, the encapsulation structure 130 also includes a protective layer, which is disposed on the surface of the isolation layer 132. The protective layer can be PR adhesive, which serves as a protective layer for the isolation layer 132 to prevent the isolation layer 132 from being crushed or scratched by foreign objects.

[0071] Therefore, in the display panel 100 provided in this application embodiment, an encapsulation structure 130 is provided on the side of the light-emitting layer 120 away from the driving backplate 110 to protect the light-emitting layer 120. The encapsulation structure 130 includes a glass substrate 131 and an isolation layer 132. The glass substrate 131 has good strength and flatness, which can improve the structural strength of the encapsulation structure 130 and improve the flatness and appearance consistency of the surface of the display panel 100 after encapsulation. In addition, by providing an isolation layer 132 on the side of the glass substrate 131 facing the light-emitting layer 120, and providing an opening 1321 on the isolation layer 132, the pixel unit... The light emitted by each sub-pixel 1211 in 121 can pass through the opening 1321, improving the light emission effect of the pixel unit 121. The adjacent pixel units 121 are shielded by the isolation layer 132 to improve the display contrast of the display panel 100, avoid the phenomenon of light leakage and color mixing when adjacent pixels emit light, and reduce the reflection of external light to prevent external light from shining on the light-emitting layer 120 and increasing the leakage current of the device. A reflective layer 133 is provided on the side wall of the opening 1321, which can reflect and collect the lateral light emitted by the pixel unit 121 when it emits light, thereby improving the loss of lateral light emission and improving the extraction rate of the light emitted by the light-emitting layer 120.

[0072] The manufacturing process of the display panel 100 will be described below.

[0073] In this embodiment, a driving backplate 110 is first provided. The light-emitting layer 120 (e.g., Mini / Micro-LED) is transferred onto the driving backplate 110 by a stamp transfer process or a laser transfer process. Electrical signal conduction between the light-emitting layer 120 and the driving backplate 110 is achieved by a conductive adhesive film 140 or other means.

[0074] Subsequently, based on the arrangement size and dimensions of the pixel units 121 on the driving backplane 110, a matching encapsulation structure 130 is fabricated. For example, the fabrication method of the encapsulation structure 130 includes the following steps:

[0075] First, a glass substrate 131 is provided, and an isolation layer 132 is formed on one side of the glass substrate 131. The isolation layer 132 can be a BM film layer. In specific implementation, the initial isolation layer 132 can be formed on one side of the glass substrate 131 by a deposition process. Then, a mask layer is prepared on the initial isolation layer 132 and patterned. Using the patterned mask layer as a mask, the initial isolation layer 132 is etched to form a plurality of arrayed openings 1321 on the initial isolation layer 132, such that one opening 1321 corresponds one-to-one with one pixel unit 121; or one opening 1321 corresponds one-to-one with one sub-pixel 1211 in one pixel unit 121. The isolation layer 132 is made to a size that matches the size of the light-emitting layer 120. For example, in Figure 4 and Figure 5 In the middle, the opening 1321 formed on the isolation layer 132 corresponds to a pixel unit 121, and its size matches that of a pixel unit 121; while Figure 6 and Figure 7 In the middle, the opening 1321 formed on the isolation layer 132 matches the size of a sub-pixel 1211, that is, each sub-pixel 1211 has an independent opening 1321.

[0076] After that, please combine Figure 8 As shown, a reflective layer 133 is formed on the sidewall of each opening 1321 of the isolation layer 132. The reflective layer 133 can be formed by physical vapor deposition (PVD) or metal sputtering.

[0077] In addition, after the isolation layer 132 is formed, a protective layer can be coated on the surface of the isolation layer 132. The protective layer includes, but is not limited to, PR adhesive, to protect the isolation layer 132 in subsequent manufacturing processes and prevent the surface of the isolation layer 132 from being crushed or scratched by foreign objects when working on the other side of the glass substrate 131.

[0078] Subsequently, an anti-glare layer 134 can be formed on the side of the glass substrate 131 away from the isolation layer 132 to achieve optical effects and anti-glare, and improve the light sensitivity effect of the appearance; wherein, the anti-glare layer 134 can be formed by vacuum sputtering, vacuum evaporation, or coating.

[0079] After the anti-glare layer 134 is formed on the glass substrate 131, a reflection prevention layer 135 can be formed on the side of the anti-glare layer 134 away from the glass substrate 131 to meet the anti-reflection requirements. The reflection prevention layer 135 can be formed by vacuum evaporation, vacuum sputtering, or coating.

[0080] After the glass substrate 131 is formed, the driving backplate 110 with Mini / Micro-LEDs transferred on it is bonded to the packaging structure 130. Specifically, the driving backplate 110 and the packaging structure 130 can be sealed and bonded by a vacuum bonding device. The sealing method can be photosensitive adhesive for curing and sealing; or, the packaging structure 130 and the driving backplate 110 can be bonded by a solid optical clear adhesive film (OCA).

[0081] It should be noted that OCA is a substrate-free, optically transparent special double-sided adhesive, belonging to the category of pressure-sensitive adhesives. It is colorless and transparent with a light transmittance of over 90%, exhibits good bonding strength, and can cure at room temperature or medium temperature, with minimal curing shrinkage. Using OCA for bonding is relatively low-cost, and OCA can completely fill the gap between the 132 opening and 1321 area of ​​the isolation layer and the Mini / Micro-LED. After curing, it provides excellent sealing against water and oxygen, and boasts high reliability.

[0082] This application also provides a display device, which includes the display panel provided in the above embodiments.

[0083] The display devices include, but are not limited to, Mini / Micro-LED displays, televisions, commercial displays, watches, automotive displays, wearable devices, etc.

[0084] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0085] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, include: Drive backplane (110); A light-emitting layer (120) is disposed on the driving backplate (110) and electrically connected to the driving backplate (110). The light-emitting layer (120) includes a plurality of pixel units (121) arranged in an array, and the pixel unit (121) includes at least three sub-pixels (1211). An encapsulation structure (130) is disposed on the side of the light-emitting layer (120) facing away from the driving backplate (110); the encapsulation structure (130) includes a glass substrate (131) and an isolation layer (132), the isolation layer (132) is disposed on the side of the glass substrate (131) facing the light-emitting layer (120), the isolation layer (132) has a plurality of openings (1321) arranged in an array, each opening (1321) is disposed opposite to at least one sub-pixel (1211) and exposes the corresponding sub-pixel (1211); A reflective layer (133) is disposed on the sidewall of the opening (1321).

2. The display panel according to claim 1, characterized in that, An opening (1321) is disposed opposite to a pixel unit (121), the opening (1321) exposing the pixel unit (121).

3. The display panel according to claim 1, characterized in that, An opening (1321) is disposed opposite to a sub-pixel (1211), the opening (1321) exposes the sub-pixel (1211), and an isolation portion (1322) is disposed between adjacent openings (1321).

4. The display panel according to any one of claims 1-3, characterized in that, The cross-sectional dimension of the opening (1321) on the side near the drive back plate (110) is smaller than the cross-sectional dimension of the opening (1321) on the side near the glass substrate (131).

5. The display panel according to claim 4, characterized in that, Along the direction from the drive backplate (110) to the packaging structure (130), the cross-sectional size of the opening (1321) gradually increases.

6. The display panel according to claim 5, characterized in that, The angle between the extension direction of the sidewall of the opening (1321) and the first direction is 30° to 60°, wherein the first direction is consistent with the thickness direction of the glass substrate (131).

7. The display panel according to claim 6, characterized in that, Along the extension direction of the sidewall of the opening (1321), the surface profile of the reflective layer (133) is at least one of stepped or wavy.

8. The display panel according to claim 7, characterized in that, The profile shape of the sidewall of the opening (1321) matches the profile shape of the reflective layer (133).

9. The display panel according to any one of claims 1-3, characterized in that, Includes at least one of the following: The reflective layer (133) includes at least one of an aluminum reflective layer (133), a gold reflective layer (133), and a silver reflective layer (133); The encapsulation structure (130) further includes an anti-glare layer (134), which is disposed on the side of the glass substrate (131) away from the isolation layer (132); The encapsulation structure (130) further includes a reflection prevention layer (135), which is disposed on the side of the glass substrate (131) opposite to the isolation layer (132); The encapsulation structure (130) further includes a protective layer disposed on the surface of the isolation layer (132).

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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