LED module and manufacturing method thereof
By forming a grid-like raised structure on the LED module substrate, the problem of collapse in the suspended area in the middle of the LED module is solved, the substrate's resistance to deformation is enhanced, and product scrap is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-18
- Publication Date
- 2026-03-27
AI Technical Summary
In the production process of existing LED modules, the increased weight above the copper plate causes the suspended area in the middle to collapse, resulting in product scrap.
A first and second grid-like protrusion are formed on the substrate, with the protrusions pointing at a preset angle and forming a mounting position between them. The protrusions serve as reinforcing ribs to distribute concentrated loads and enhance the substrate's resistance to deformation.
It effectively prevents the substrate from collapsing in the suspended position, reduces product scrap, and improves the substrate's resistance to deformation and its service life.
Smart Images
Figure CN121751860A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of LED packaging, in particular to an LED module and a manufacturing method thereof. BACKGROUND
[0002] In the existing LED module, a plurality of LEDs are arranged side by side on a planar frame copper plate to realize the integration of the LED module, so as to facilitate the loading of the LED module by a material box or the conveying of the LED module on a track. The support table of the material box or the support table of the conveying track is supported on the left and right frame portions of the LED module, so that the middle region of the LED module is suspended to prevent the copper plate from being deformed due to heat.
[0003] However, in the production process of the LED module, the weight above the copper plate gradually increases, which easily causes the collapse of the suspended middle region of the LED module, resulting in product scrap. SUMMARY
[0004] The present application provides an LED module and a manufacturing method thereof to solve the defects of the prior art, which can enhance the anti-deformation ability of the substrate and the LED module, effectively avoid the collapse of the suspended position of the substrate, and further reduce the product scrap problem.
[0005] To solve the above technical problems, the present application provides an LED module, comprising a substrate and a plurality of light emitting elements, the substrate is formed with a plurality of first protrusions and a plurality of second protrusions, the first protrusions extend along a first direction, the second protrusions extend along a second direction, and the first direction forms a preset angle with the second direction. Any two adjacent first protrusions and any two adjacent second protrusions form a mounting position, and each light emitting element is arranged in one of the mounting positions.
[0006] As an improvement of the above-mentioned scheme, the first protrusion is formed with a first arched segment and first support segments on both sides of the arched segment, the first arched segment arches outwardly to one side of the substrate, the bottom surface of the mounting position is a plane, and the first arched segment is connected with the plane through the first support segments. The second protrusion is formed with a second arched segment and second support segments on both sides of the second arched segment, the second arched segment arches outwardly to one side of the substrate, and the second arched segment is connected with the plane through the second support segments.
[0007] As an improvement of the above-mentioned scheme, the height of the first protrusion is a preset arching height, the height of the second protrusion is a preset arching height, the height of the light emitting element is a preset mounting height, and the preset arching height is 1 / 3-1 / 2 of the preset mounting height.
[0008] As the improvement of the above-mentioned scheme, the width of the first protrusion is a first preset width, the width of the second protrusion is the first preset width, and the width of the mounting position is a second preset width, which is 1.5-3 times of the first preset width.
[0009] As the improvement of the above-mentioned scheme, the light-emitting element comprises an LED chip and a reflecting piece, the LED chip is electrically connected with the substrate, the mounting position surrounds the reflecting piece, and the LED chip is located in the reflecting piece; a connecting hole is formed in the bottom wall of the mounting position, and a connecting section is formed on the side of the reflecting piece facing the substrate, and the connecting section is installed in the connecting hole.
[0010] As the improvement of the above-mentioned scheme, the connecting hole is located between two adjacent first protrusions, a first spacing is formed between the connecting hole and one of the first protrusions, and a second spacing is formed between the connecting hole and the other first protrusion, and the first spacing is greater than the second spacing.
[0011] Correspondingly, the application also provides a manufacturing method of the LED module, which is used for manufacturing the LED module, and comprises the following steps: Substrate forming: dividing an initial substrate into a protrusion area and a mounting area, and stamping the initial substrate on one side of the protrusion area to form a first protrusion and a second protrusion in the protrusion area, so as to obtain a deformation-resistant substrate; wherein the first protrusion extends along a first direction, the second protrusion extends along a second direction, and the first direction and the second direction form a preset angle. LED light-emitting element packaging: arranging a group of light-emitting elements in each mounting area, and electrically connecting the light-emitting elements with the deformation-resistant substrate to manufacture an LED module.
[0012] As the improvement of the above-mentioned scheme, the substrate forming step comprises the following steps: The protrusion area is divided into a support section and an arched section. A first punch is used to stamp one side of the initial substrate to form the support section, and a second punch is used to stamp the other side of the initial substrate to form the arched section.
[0013] As the improvement of the above-mentioned scheme, the LED light-emitting element packaging step comprises the following steps: The deformation-resistant substrate is wrapped with a first mold and a second mold, wherein the shape of the first mold is matched with the shape of the upper surface of the deformation-resistant substrate, and the shape of the second mold is matched with the shape of the lower surface of the deformation-resistant substrate. An injection molding operation is performed between the first mold and the upper surface of the anti-deformation substrate to form a reflective cup on the upper surface of the anti-deformation substrate; An LED chip is fixed inside the reflective cup and electrically connected to the anti-deformation substrate; The LED module is fabricated by filling the reflective cup with a light-transmitting element.
[0014] As an improvement to the above solution, after the substrate forming step, the following step is further included: The anti-deformation substrate is electroplated to form a protective layer on its surface.
[0015] Implementing this invention has the following beneficial effects: In this embodiment, by forming a first protrusion and a second protrusion on the substrate, and setting a preset angle between the extending directions of the first protrusion and the second protrusion, a grid-like protrusion structure can be formed on the substrate. Simultaneously, light-emitting elements are arranged using mounting positions formed between any two adjacent first and second protrusions, thereby integrating the substrate and multiple light-emitting elements into an LED module.
[0016] Furthermore, when placing or transferring LED modules using the left and right side frame support and the middle suspended, the first and second protrusions can serve as reinforcing ribs of the substrate to transmit and distribute the concentrated load locally borne by the substrate to the entire substrate, thereby enhancing the deformation resistance of the substrate and LED module, effectively preventing the substrate from collapsing in the suspended position, and thus reducing product scrap issues. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the LED module structure in this invention; Figure 2 yes Figure 1 A three-dimensional structural diagram of location A in the middle; Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure formed along the CC section line; Figure 4 yes Figure 3 Enlarged structural diagram at point B; Figure 5 This is a schematic diagram of the manufacturing process of the LED module in this invention; Figure 6 This is a schematic diagram showing the relative position of the punch and the first protrusion (or the second protrusion) in this invention; Figure 7 yes Figure 6 Enlarged structural diagram at point D; Figure 8This is a schematic diagram showing the relative positions of the mold and the substrate in this invention; Figure 9 This is a schematic diagram showing the relative positions of the LED chip and the light-emitting element on the substrate in this invention; Figure 10 This is a flowchart of the LED module manufacturing method in this invention. Detailed Implementation
[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. It is hereby declared that the directional terms such as up, down, left, right, front, back, inside, and outside used in this text are based solely on the accompanying drawings and are not intended to specifically limit the invention.
[0019] The first aspect of the present invention provides an LED module, such as... Figures 1 to 4 As shown, the LED module includes a substrate 1 and multiple light-emitting elements 2. The substrate 1 has multiple first protrusions 11 and multiple second protrusions 12 formed thereon. The first protrusions 11 are along a first direction (e.g., ...). Figure 1 The second protrusion 12 extends along the second direction (as shown in the X-axis direction), and extends along the second direction (as shown in the X-axis direction). Figure 2 Extending along the Y-axis (as shown), the first direction and the second direction form a preset angle. Any two adjacent first protrusions 11 and any two adjacent second protrusions 12 form a mounting position 13, and each light-emitting element 2 is correspondingly disposed in one of the mounting positions 13.
[0020] In this embodiment, by forming a first protrusion 11 and a second protrusion 12 on the substrate 1, and setting a preset angle between the extending direction of the first protrusion 11 and the extending direction of the second protrusion 12, a grid-like protrusion structure can be formed on the substrate 1. Simultaneously, light-emitting elements 2 are arranged using mounting positions 13 formed between any two adjacent first protrusions 11 and second protrusions 12, thereby integrating the substrate 1 and multiple light-emitting elements 2 into an LED module.
[0021] Furthermore, when placing or transferring the LED module using the left and right side frame support and the middle suspended, the first protrusion 11 and the second protrusion 12 can serve as reinforcing ribs of the substrate 1 to transmit and distribute the concentrated load locally borne by the substrate 1 to the entire substrate 1, thereby enhancing the deformation resistance of the substrate 1 and the LED module, effectively avoiding the problem of collapse in the suspended position of the substrate 1, and thus reducing product scrap issues.
[0022] In one specific example, such as Figure 1 and Figure 2As shown, when the substrate 1 is a rectangular square board, the preset angle between the first direction of the first protrusion 11 and the second direction of the second protrusion 12 is 90°, so that the first protrusion 11 and the second protrusion 12 form a cross-shaped protrusion structure at the intersection position to form a plurality of bending-resistant nodes on the substrate 1. When the LED module in a suspended position has a downward deflection trend, the first protrusion 11, the second protrusion 12, and the cross-shaped protrusion can simultaneously resist the downward deflection trend of the substrate 1, effectively offset the downward deflection displacement of the substrate 1, and ensure the bending resistance of the substrate 1.
[0023] Of course, in other embodiments, the preset angle can also be 45° or 60° or other angles, which can be selectively adjusted according to the specific shape of the substrate 1 and the required arrangement of the plurality of light emitting elements 2.
[0024] As a specific embodiment, as shown in Figure 3 and Figure 4 , the first protrusion 11 is formed with a first arched segment 14 and first support segments 15 located on both sides of the first arched segment 14, the first arched segment 14 is outwardly arched to one side of the substrate 1, the bottom surface of the mounting position 13 is a plane 16, and the first arched segment 14 is connected to the plane 16 through the first support segments 15; the second protrusion is formed with a second arched segment and second support segments located on both sides of the second arched segment, the second arched segment is outwardly arched to one side of the substrate, and the second arched segment is connected to the plane through the second support segments. Further, the first arched segment 14 and the second arched segment can be used as a force-bearing structure, the first support segments 15 can be used as a conduction structure between the first arched segment 14 and the substrate 1, and the second support segments can be used as a conduction structure between the second arched segment and the substrate 1, so as to disperse and conduct the concentrated load on the substrate 1 to the entire substrate 1, thereby enhancing the overall deformation resistance of the substrate 1 and the LED module; at the same time, the first support segments 15 can be used as a connecting structure between the first arched segment 14 and the substrate 1, and the second support segments can be used as a connecting structure between the second arched segment and the substrate 1, so as to ensure the connection stability between the first arched segment 14, the second arched segment, and the substrate 1.
[0025] Preferably, as shown in Figure 4 , the first support segments 15 are arranged downwardly curved relative to the plane 16, and the relative angle between the first support segments 15 and the plane 16 is 1°-5°, so that when the first arched segment 14 bears the concentrated load, the downwardly curved first support segments 15 can reduce or avoid stress concentration at the connecting position between the first arched segment 14 and the substrate 1, thereby avoiding the rupture of the protrusion structure from the substrate 1 when the first arched segment 14 bears the concentrated load, and further ensuring that the LED module is not damaged.
[0026] The relative angle between the second support segments and the second arched segment is also 1°-5°.
[0027] It should be noted that the first protrusion 11 and the second protrusion 12 can be integrally formed on the substrate 1 by stamping. Specifically, after confirming the specific positions of the first protrusion 11 and the second protrusion 12 on the substrate 1, a first punch 31 can be arranged on the front surface of the substrate 1, and a second punch 32 can be arranged on the back surface of the substrate 1, so as to stamp the substrate 1 by using the first punch 31 to form the first support section 15 and the second support section, and stamp the back surface of the substrate 1 by using the second punch 32 to form the first arched section 14 and the second arched section, thereby completing the formation of the first protrusion 11 and the second protrusion 12 on the substrate 1.
[0028] As a further improvement of the above embodiment, as shown in Figure 4 the height of the first protrusion 11 is a preset arch height H1, the height of the second protrusion 12 is also the preset arch height H1, and the height of the light emitting element 2 is a preset installation height H2, wherein the preset installation height H2 is the height of the light emitting element 2 itself, and the preset arch height H1 is 1 / 3-1 / 2 of the preset installation height H1. Further, while the first arched section 14 enhances the overall bending strength of the substrate 1, the first protrusion 11 and the second protrusion 12 do not hinder the heat dissipation of the light emitting element 2, so that the heat generated by the light emitting element 2 during operation can be effectively dissipated to the outside of the substrate 1, avoiding the accumulation of heat in the mounting position 13 and increasing the thermal stress on the substrate 1, thereby avoiding the bending and deformation of the substrate 1 due to excessive thermal stress, and ensuring the service life of the substrate 1. Preferably, the preset installation height H2 is 2 times the preset arch height H1.
[0029] As a further improvement of the above embodiment, as shown in Figure 4 the width of the first protrusion 11 is a first preset width W1, the width of the second protrusion 12 is also the first preset width W1, and the width of the mounting position 13 is a second preset width W2, and the second preset width W2 is 1.5-3 times the first preset width W1, so that a certain distance can be maintained between the first protrusion 11 or the second protrusion 12 and the light emitting element 2, thereby providing sufficient assembly space for the light emitting element 2 in the mounting position 13, effectively avoiding the problem of the light emitting element 2 being bumped by the first protrusion 11 and / or the second protrusion 12 during assembly, and improving the assembly convenience of the LED module. At the same time, a larger heat dissipation space is provided for the light emitting element 2, further avoiding the accumulation of heat in the mounting position 13. Preferably, the second preset width W2 is 2 times the first preset width W1.
[0030] It should be further noted that the surface of the substrate 1 is provided with a protective layer, which can be a nickel layer and / or a silver layer, so as to protect the surface of the substrate 1 by oxidation, further improving the service life of the substrate 1.
[0031] In this embodiment, as Figure 4As shown, the light emitting element 2 comprises the LED chip 21 and the reflector 22, the LED chip 21 is electrically connected with the substrate 1, the mounting position 13 surrounds the reflector 22, and the LED chip 21 is located in the reflector 22, so as to realize the basic lighting function of the LED module by cooperation of the LED chip 21, the substrate 1 and the reflector 22. The LED chip 21 can be arranged in the mounting position 13 by means of mounting or packaging, so as to fix the LED chip 21 and complete the conductive connection by welding the wire. The reflector 22 can be made of LED plastic, after the first protrusion 11 and the second protrusion 12 are punched on the substrate 1, the substrate 1 can be wrapped by the upper die matched with the upper surface of the substrate 1 and the lower die matched with the lower surface of the substrate 1, and then the LED plastic is injection molded between the substrate 1 and the upper die and the lower die, so as to form the bowl cup-shaped reflector 22 structure.
[0032] It should be noted that after the reflector 22 is formed and the LED chip 21 is fixed, the fluorescent glue can be filled in the bowl cup-shaped reflector 22 by means of dispensing, and the fluorescent glue is baked and cured, so as to ensure the installation stability of the reflector 22 on the substrate 1, and ensure that the output white light of the LED module is more consistent with natural light or meets the specific application requirements.
[0033] Further, as shown in Figure 4 , Figure 6 and Figure 7 , the bottom wall of the mounting position 13 is formed with the connecting hole 23, and the side of the reflector 22 facing the substrate 1 is formed with the connecting section 24, the connecting section 24 is installed in the connecting hole 23, so as to mechanically anchor the reflector 22 on the substrate 1 by cooperation of the connecting hole 23 and the connecting section 24, prevent the reflector 22 from being separated from the substrate 1, and further ensure the stability of the reflector 22 when being installed on the substrate 1. Specifically, the connecting hole 23 can be punched on the back surface of the substrate 1 by means of a cutter, and the connecting hole 23 extends along the second direction, so as to ensure the installation stability of the reflector 22 while dividing one mounting position 13 into the positive and negative poles of the LED pad, and facilitate the electrical connection of the LED chip 21.
[0034] More specifically, as shown in Figure 7As shown, the connecting hole 23 is located between two adjacent first protrusions 11, a first interval D1 is formed between the connecting hole 23 and one of the first protrusions 11, and a second interval D2 is formed between the connecting hole 23 and the other first protrusion 11. The first interval D1 is greater than the second interval D2, that is, the connecting hole 23 is arranged offset between the two adjacent first protrusions 11. When the LED plastic is injected into the connecting hole 23 and the mounting position 13 to form the reflector 22, the LED plastic will first fill the area between the connecting hole 23 and the other first protrusion 11, and then fill the area between the connecting hole 23 and one of the first protrusions 11, thereby realizing sequential filling on both sides, avoiding the injected LED plastic impacting the roots of the two first protrusions 11 at the same time, reducing the injection pressure on the roots of the first protrusions 11, and thereby ensuring the structural integrity of the first protrusions 11.
[0035] Correspondingly, the second aspect of the present application provides a manufacturing method of an LED module, wherein the manufacturing method of the LED module is used to manufacture the LED module described in any one of the above. Figures 5 to 10 As shown, the manufacturing method of the LED module comprises the following steps: S1, substrate forming: dividing an initial substrate 51 into a protrusion area and a mounting area, and stamping one side of the initial substrate 51 to form first protrusions 11 and second protrusions 12 in the protrusion area, thereby obtaining a deformation-resistant substrate 52. The first protrusions 11 extend along a first direction, and the second protrusions 12 extend along a second direction. The first direction forms a preset angle with the second direction. The first protrusions 11 and the second protrusions 12 can be used as a reinforcing rib structure of the initial substrate 51. By utilizing the characteristics of strong bending resistance of the protrusion structure, the overall deformation resistance of the substrate 1 is enhanced, thereby solving the problem of LED module collapse.
[0036] As one of the embodiments, as shown in Figure 5 and Figure 6 As shown, the specific process of substrate forming comprises the following steps: S11, dividing the protrusion area into a support section and an arch section.
[0037] S12, using a first punch 31 to stamp one side of the initial substrate 51 to form the support section, and using a second punch 32 to stamp the other side of the initial substrate 51 to form the arch section. The arch section is used as a force-bearing structure, and the support section is used as a conduction structure between the arch section and the substrate 1. The concentrated load on the substrate 1 is dispersed and conducted to the entire substrate 1, thereby enhancing the deformation resistance of the substrate 1 and the LED module by using the protrusion area.
[0038] As shown in Figure 6As shown, in the stamping process of the first punch 31, the first punch 31 stamps from one side of the initial substrate 51 to the other side of the initial substrate 51; in the stamping process of the second punch 32, the second punch 32 stamps from the other side of the initial substrate 51 to the one side of the initial substrate 51. For example, when the initial substrate 51 is placed horizontally, the one side of the initial substrate 51 is the upper side of the initial substrate 51, and the other side of the initial substrate 51 is the lower side of the initial substrate 51, the first punch 31 stamps from top to bottom, and the second punch 32 stamps from bottom to top.
[0039] In addition, in the process of the downward stamping of the first punch 31, the support section can be stamped to be bent downward relative to the substrate 1 and maintain a relative angle of 1°-5° to avoid the problem of stress concentration of the support section when the arch section bears concentrated load, thereby ensuring that the LED module is not damaged.
[0040] In the process of upward stamping of the second punch 32, it is necessary to ensure that the preset arch height H1 of the arch section is 1 / 3-1 / 2 of the preset installation height H2 of the light emitting element 2, so that the first protrusion 11 and the second protrusion 12 do not hinder the heat dissipation of the light emitting element 2 when the arch section enhances the overall bending strength of the substrate 1, so that the heat generated by the light emitting element 2 during operation can be effectively dissipated to the outside of the substrate 1, thereby avoiding the accumulation of heat in the mounting area to increase the thermal stress on the substrate 1, thereby avoiding the bending deformation of the substrate 1 due to excessive thermal stress, and ensuring the service life of the substrate 1.
[0041] S2, LED light emitting element packaging: a group of light emitting elements 2 is arranged in each mounting area, and the light emitting elements 2 are electrically connected with the anti-deformation substrate 52 to make an LED module, so that the light emitting elements 2 cooperate with the anti-deformation substrate 52 to realize the basic light emitting function of the LED module.
[0042] As one of the embodiments, as shown in Figure 5 , Figure 8 and Figure 9 , the specific process of packaging the LED light emitting element 2 includes the following steps: S21, the anti-deformation substrate 52 is wrapped with a first mold 41 and a second mold 42, wherein the shape of the first mold 41 matches the shape of the upper surface of the anti-deformation substrate 52, and the shape of the second mold 42 matches the shape of the lower surface of the anti-deformation substrate 52.
[0043] S22, injection molding is performed between the first mold 41 and the anti-deformation substrate 52 to form a light reflecting bowl cup 221 on the upper surface of the anti-deformation substrate 52.
[0044] S23, fix the LED chip 21 inside the reflective bowl cup 221, and electrically connect the LED chip 21 with the anti-deformation substrate 52. Wherein the LED chip 21 can be arranged in the reflective bowl cup 221 by means of mounting, etc., to complete the fixation of the LED chip 21. Then, the conductive wire is welded on the anti-deformation substrate 52, and the conductive wire is connected with the LED chip 21, to complete the electrical connection operation of the LED chip 21 and the anti-deformation substrate 52.
[0045] S24, fill the reflective bowl cup 221 with the light-transmitting element 222, to complete the production of the LED module. Wherein the light-transmitting element 222 is preferably fluorescent glue, which is filled in the reflective bowl cup 221 by means of dispensing, and is baked and cured after the filling is completed, to ensure the installation stability of the reflective bowl cup 221 on the substrate 1, and to ensure that the output white light of the LED module meets the natural light or meets the specific application requirements.
[0046] In this embodiment, by forming the first protrusion 11 and the second protrusion 12 in the protrusion area of the initial substrate 51, and forming the extension direction of the first protrusion 11 and the extension direction of the second protrusion 12 at a preset angle, it is ensured that the protrusion area can form a grid-shaped protrusion structure on the initial substrate 51, and the LED chip 21 is packaged in the grid-shaped mounting position 13 surrounded by the protrusion structure. When the LED module is placed or transferred in the mode of being supported by the left and right frames and being suspended in the middle, the first protrusion 11 and the second protrusion 12 can be used as the reinforcing rib structure of the substrate 1, to conduct and disperse the concentrated load received by the substrate 1 to the entire substrate 1, effectively enhance the anti-deformation ability of the substrate 1 and the LED module, avoid the collapse of the suspended position of the substrate 1, and reduce the product scrap problem.
[0047] Preferably, the preset angle between the first direction and the second direction is 90°.
[0048] Wherein, taking the LED as the light-emitting element 2, the LEDs with the same height are arranged on the substrates with the same size, the preset arch height H1 of different substrates is different, then the substrates after arranging the LEDs are placed on the base which is supported by the left and right frames and is suspended in the middle, and subsequent packaging is performed, to make a difference comparison.
[0049] Embodiment 1: The preset installation height H2 of the LED is 0.65 mm, the preset arch height H1 of the substrate is 0.22 mm, that is, the ratio of the preset arch height H1 to the preset installation height H2 is 1 / 3; Embodiment 2: The preset installation height H2 of the LED is 0.65 mm, the preset arch height H1 of the substrate is 0.26 mm, that is, the ratio of the preset arch height H1 to the preset installation height H2 is 2 / 5; Embodiment 3: The preset installation height H2 of the LED is 0.65 mm, the preset arch height H1 of the substrate is 0.33 mm, that is, the ratio of the preset arch height H1 to the preset installation height H2 is 1 / 2; Comparative Example 1: The preset installation height H2 of the LED is 0.65 mm, the preset arch height H1 of the substrate is 0 mm, that is, the ratio of the preset arch height H1 to the preset installation height H2 is 0; Comparative Example 2: The preset installation height H2 of the LED is 0.65 mm, the preset arch height H1 of the substrate is 0.43 mm, that is, the ratio of the preset arch height H1 to the preset installation height H2 is 2 / 3; Under the condition of keeping the test conditions unchanged, the warping conditions and the LED injection molding packaging yield of the LED modules of the above examples and comparative examples are measured as follows:
[0050] Therefore, under the condition of comprehensively considering the anti-deformation ability of the LED module and the LED injection molding packaging efficiency, the preset arch height H1 of the arch-shaped section is preferably 1 / 3-1 / 2 of the preset installation height H2 of the light emitting element 2.
[0051] As one of the embodiments, after the substrate is formed, the manufacturing method of the LED module further includes the following steps: S13, electroplating treatment is performed on the anti-deformation substrate 52 to form a protective layer on the surface of the anti-deformation substrate 52, the protective layer can be a nickel layer and / or a silver layer, the protective layer is used to protect the surface of the substrate 1 from oxidation, and the service life of the substrate 1 is further improved.
[0052] The above is the preferred embodiment of the present application, it should be noted that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, these improvements and refinements are also considered to be within the scope of protection of the present application.
Claims
1. An LED module, characterized in that, The LED module comprises a substrate and a plurality of light-emitting elements, the substrate is formed with a plurality of first protrusions and a plurality of second protrusions, the first protrusions extend along a first direction, the second protrusions extend along a second direction, and the first direction forms a preset angle with the second direction; Any two adjacent first protrusions and any two adjacent second protrusions form a mounting position, and each light-emitting element is arranged in one of the mounting positions.
2. The LED module of claim 1, wherein, The first protrusion is formed with a first arched segment and first support segments on both sides of the first arched segment, the first arched segment arches outwardly to one side of the substrate, the bottom surface of the mounting position is a plane, and the first arched segment is connected to the plane through the first support segments. The second protrusion is formed with a second arched segment and second support segments on both sides of the second arched segment, the second arched segment arches outwardly to one side of the substrate, and the second arched segment is connected to the plane through the second support segments.
3. The LED module of claim 2, wherein, The height of the first protrusion is a preset arching height, the height of the second protrusion is a preset arching height, the height of the light-emitting element is a preset mounting height, and the preset arching height is 1 / 3-1 / 2 of the preset mounting height.
4. The LED module of claim 2, wherein, The width of the first protrusion is a first preset width, the width of the second protrusion is a first preset width, the width of the mounting position is a second preset width, and the second preset width is 1.5-3 times the first preset width.
5. The LED module of claim 1, wherein, The light-emitting element comprises an LED chip and a reflector, the LED chip is electrically connected to the substrate, the mounting position surrounds the reflector, and the LED chip is located in the reflector; the bottom wall of the mounting position is formed with a connecting hole, and one side of the reflector facing the substrate is formed with a connecting segment, and the connecting segment is installed in the connecting hole.
6. The LED module of claim 5, wherein, The connecting hole is located between two adjacent first protrusions, a first spacing is formed between the connecting hole and one of the first protrusions, a second spacing is formed between the connecting hole and the other first protrusion, and the first spacing is greater than the second spacing.
7. A method of manufacturing an LED module, characterized by, The manufacturing method of the LED module is used for manufacturing the LED module of any one of claims 1-6, and comprises the following steps: Substrate forming: dividing an initial substrate into a protrusion area and a mounting area, and stamping the initial substrate on one side of the protrusion area to form first protrusions and second protrusions in the protrusion area, thereby obtaining a deformation-resistant substrate; wherein the first protrusions extend along a first direction, the second protrusions extend along a second direction, and the first direction forms a preset angle with the second direction; LED light-emitting element packaging: arranging a group of light-emitting elements in each mounting area, and electrically connecting the light-emitting elements to the deformation-resistant substrate to manufacture an LED module.
8. The method of manufacturing an LED module according to claim 7, wherein The substrate forming step comprises the following steps: Dividing the protrusion area into support segments and arched segments; Using a first punch to stamp one side of the initial substrate to form the support segments, and using a second punch to stamp the other side of the initial substrate to form the arched segments.
9. The method for manufacturing an LED module as described in claim 7, characterized in that, The LED light-emitting element packaging step comprises the following steps: The anti-deformation substrate is wrapped with a first mold and a second mold, wherein the shape of the first mold is matched with the shape of the upper surface of the anti-deformation substrate, and the shape of the second mold is matched with the shape of the lower surface of the anti-deformation substrate; An injection molding operation is performed between the first mold and the upper surface of the anti-deformation substrate to form a light-reflecting bowl cup on the upper surface of the anti-deformation substrate; An LED chip is fixed inside the light-reflecting bowl cup, and the LED chip is electrically connected with the anti-deformation substrate; A light-transmitting element is used to fill the light-reflecting bowl cup, and the manufacturing of the LED module is completed.
10. The method for manufacturing an LED module as described in claim 7, characterized in that, After the step of forming the substrate, the following steps are further included: The anti-deformation substrate is subjected to an electroplating treatment to form a protective layer on the surface of the anti-deformation substrate.