Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device. The display panel comprises an array substrate, an isolation structure, a first light-emitting element, a second light-emitting element, a first packaging part and a second packaging part, the second packaging part further extends in the direction close to the first isolation opening, a first containing groove is formed in the end, close to the first packaging part, of the second packaging part, and the first packaging part further extends in the direction close to the second packaging part and is located in the first containing groove. According to the display panel, the first accommodating groove is formed in one end of the second packaging part, so that the first packaging part extends towards the direction close to the second packaging part and is positioned in the first accommodating groove, and the stability of the morphology between the first packaging part and the second packaging part is improved; the sealing performance between the first packaging part and the second packaging part is improved as much as possible, the occurrence rate of stripping of a film layer in the display panel can be reduced, and therefore the product yield of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) have attracted widespread attention due to their characteristics such as self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low power consumption. As a new generation of display technology, they have begun to gradually replace traditional LCDs and are widely used in mobile phone screens, computer monitors, full-color TVs, and more.

[0003] However, the yield rate of OLED display panels currently needs to be improved. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel, its manufacturing method, and a display device to address the aforementioned technical problems, which can improve the product yield of the display panel.

[0005] In a first aspect, embodiments of this application provide a display panel, including:

[0006] Array substrate;

[0007] An isolation structure is disposed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening;

[0008] A first light-emitting element, at least a portion of which is disposed within a first isolation opening;

[0009] The second light-emitting element is at least partially disposed within the second isolation opening; the first light-emitting element and the second light-emitting element are respectively used to emit light of different colors;

[0010] The first packaging section is located on the side of the first light-emitting element away from the array substrate;

[0011] The second packaging section is located on the side of the second light-emitting element away from the array substrate;

[0012] The first packaging section is connected to the second packaging section.

[0013] In one embodiment, at least a portion of the surface of the first package portion near the array substrate is connected to at least a portion of the surface of the second package portion away from the array substrate.

[0014] In one embodiment, the second encapsulation portion includes a first main portion and a first sub-portion, a second sub-portion, and a third sub-portion disposed on the side of the isolation structure away from the array substrate; the first main portion covers the surface of the second light-emitting element away from the array substrate and at least a portion of the surface of the second isolation opening;

[0015] One end of the first sub-part is connected to the first main part, and the other end extends in a direction away from the second isolation opening; the ends of the second sub-part and the third sub-part near the second isolation opening are connected to the ends of the first sub-part near the first isolation opening; the second encapsulation part also extends in a direction near the first isolation opening, and the end of the second encapsulation part near the first encapsulation part is provided with a first receiving groove, and the first encapsulation part also extends in a direction near the second encapsulation part and is located in the first receiving groove; the second sub-part and the third sub-part together form the first receiving groove;

[0016] Optionally, the first encapsulation portion includes a second main portion and a fourth sub-portion disposed on the side of the isolation structure away from the array substrate; the second main portion covers the surface of the first light-emitting element away from the array substrate and at least a portion of the surface of the first isolation opening; one end of the fourth sub-portion is connected to the second main portion, the other end extends in a direction away from the first isolation opening, and the other end is located in the first receiving groove.

[0017] Optionally, the orthographic projection of the second sub-part on the array substrate is located within the orthographic projection of the third sub-part on the array substrate;

[0018] Optionally, the surfaces of the second and fourth sub-parts near the array substrate are spaced apart from the surfaces of the corresponding isolation structures away from the array substrate, and the surfaces of the second and fourth sub-parts away from the array substrate are spaced apart from the surfaces of the third sub-parts near the array substrate.

[0019] Optionally, at least a portion of the surface of the second sub-part away from the array substrate is connected to at least a portion of the surface of the fourth sub-part closer to the array substrate.

[0020] Optionally, the first distance between the surface of the second sub-part closer to the array substrate and the surface of the isolation structure farther from the array substrate is smaller than the second distance between the surface of the fourth sub-part closer to the array substrate and the surface of the isolation structure farther from the array substrate.

[0021] Optionally, the distance between the surface of the third sub-part closer to the array substrate and the surface of the isolation structure farther from the array substrate is greater than the second distance.

[0022] In one embodiment, the thickness of the first light-emitting element is greater than the thickness of the second light-emitting element;

[0023] Optionally, the thickness of the second sub-part is less than the thickness of the fourth sub-part.

[0024] In one embodiment, the fourth sub-part includes a first extension connected to the second main part and a first connecting part connected to the first extension; the first connecting part is located within the first receiving groove;

[0025] Optionally, at least a portion of the surface of the second sub-part away from the array substrate is connected to at least a portion of the surface of the first connecting part near the array substrate.

[0026] Optionally, the thickness of the second sub-part is less than the thickness of the first connecting part, the thickness of the first connecting part is less than the thickness of the second sub-part, and the thickness of the fourth sub-part is less than the thickness of the second sub-part.

[0027] Optionally, the distance between the side surface of the first extension closest to the array substrate and the side surface of the isolation structure furthest from the array substrate is the same as the second distance;

[0028] Optionally, the distance between the side surface of the first connection portion near the array substrate and the side surface of the isolation structure away from the array substrate is greater than the second distance and the first distance;

[0029] Optionally, the distance between the surface of the first connecting portion near the array substrate and the surface of the isolation structure away from the array substrate is less than the distance between at least a portion of the surface of the third sub-part near the first isolation opening and the surface of the first connecting portion away from the array substrate.

[0030] In one embodiment, the isolation structure is provided with a third isolation opening; the display panel further includes a third light-emitting element and a third encapsulation portion, at least a portion of the third light-emitting element is disposed within the third isolation opening, the third light-emitting element is used to emit light of other colors, and the third encapsulation portion is disposed on the side of the third light-emitting element away from the array substrate.

[0031] The third encapsulation portion extends toward the direction of the third isolation opening, and the end of the third encapsulation portion near the first encapsulation portion or the second encapsulation portion is provided with a second receiving groove. The first encapsulation portion or the second encapsulation portion extends toward the direction of the third encapsulation portion and is located in the second receiving groove.

[0032] Optionally, the fourth sub-part in the first encapsulation part is located in the second receiving groove, and the fourth sub-part is connected to the second receiving groove.

[0033] In one embodiment, the second packaging portion further includes a fifth sub-portion disposed on the side of the isolation structure away from the array substrate; one end of the fifth sub-portion is connected to the first main portion, the other end extends in a direction away from the second isolation opening, and the other end is located in the second receiving groove;

[0034] Optionally, the fifth sub-section is located within the second receiving groove;

[0035] Optionally, the thickness of the fifth sub-part is less than the thickness of the seventh sub-part.

[0036] In one embodiment, the third encapsulation portion includes a third main portion and a sixth, seventh, and eighth sub-parts disposed on the side of the isolation structure away from the array substrate; the third main portion covers at least a portion of the surface of the third light-emitting element away from the array substrate and the surface of the third isolation opening.

[0037] One end of the sixth sub-part is connected to the third main part, and the other end extends in a direction away from the third isolation opening; the seventh and eighth sub-parts are both connected to the end of the sixth sub-part near the third isolation opening, and the seventh and eighth sub-parts together form the second receiving groove.

[0038] Optionally, the orthographic projection of the eighth sub-part on the array substrate is located within the orthographic projection of the seventh sub-part on the array substrate;

[0039] Optionally, the surfaces of the seventh sub-part and the fifth sub-part that are close to the array substrate are spaced apart from the surfaces of the corresponding isolation structures that are away from the array substrate, and the surfaces of the seventh sub-part and the fifth sub-part that are away from the array substrate are spaced apart from the surfaces of the eighth sub-part that are close to the array substrate.

[0040] Optionally, at least a portion of the surface of the seventh sub-part away from the array substrate is connected to at least a portion of the surface of the fifth sub-part closer to the array substrate.

[0041] Optionally, the surface of the seventh sub-part away from the array substrate is not connected to the surface of the fourth sub-part close to the array substrate.

[0042] Optionally, the thickness of the seventh sub-part is less than the thickness of the fourth sub-part;

[0043] Optionally, the third distance between the surface of the seventh sub-part closest to the array substrate and the surface of the isolation structure furthest from the array substrate is smaller than the fourth distance between the surface of the fifth sub-part closest to the array substrate and the surface of the isolation structure furthest from the array substrate.

[0044] Optionally, the distance between the surface of the eighth sub-part closer to the array substrate and the surface of the isolation structure farther from the array substrate is greater than the fourth distance;

[0045] Optionally, organic material and / or cathode material may be present between the side of the sixth and seventh sub-sections closest to the array substrate and the side of the isolation structure furthest from the array substrate.

[0046] In one embodiment, the fifth sub-part includes a second extension connected to the first main part and a second connecting part connected to the second extension; the second connecting part is located within the second receiving groove.

[0047] Optionally, at least a portion of the surface of the seventh sub-part away from the array substrate is connected to at least a portion of the surface of the second connecting part near the array substrate;

[0048] Optionally, the thickness of the second connecting part is greater than the thickness of the seventh sub-part;

[0049] Optionally, the surface of the seventh sub-part away from the array substrate is not connected to the surface of the fifth sub-part close to the array substrate.

[0050] Optionally, the distance between the side surface of the second extension closest to the array substrate and the side surface of the isolation structure furthest from the array substrate is the same as the fourth distance;

[0051] Optionally, the distance between the side surface of the second connection portion near the array substrate and the side surface of the isolation structure away from the array substrate is greater than the fourth distance and the third distance;

[0052] Optionally, the orthographic projection of the second extension on the array substrate is adjacent to the orthographic projection of the second connection on the array substrate.

[0053] In one embodiment, the fifth sub-part includes a third extension, a third connecting part, and a fourth extension provided on the side of the isolation structure away from the array substrate; one end of the third extension is connected to the first main part, and the third connecting part and the fourth extension are both connected to the end of the third extension near the second isolation opening, and the third connecting part and the fourth extension together form a third receiving groove.

[0054] Optionally, the fourth sub-part in the first encapsulation part is located in the third receiving groove;

[0055] Optionally, the distance between the surface of the third extension closest to the array substrate and the surface of the isolation structure furthest from the array substrate is the same as the fourth distance;

[0056] Optionally, the distance between the surface of the third connection portion near the array substrate and the surface of the isolation structure away from the array substrate is the same as the fourth distance;

[0057] Optionally, the distance between the side surface of the fourth extension closest to the array substrate and the side surface of the isolation structure furthest from the array substrate is greater than the fourth distance.

[0058] Optionally, the thickness of the third connecting part is less than the thickness of the fourth sub-part;

[0059] Optionally, at least a portion of the surface of the fourth extension near the second isolation opening is spaced apart from at least a portion of the surface of the third connection near the third isolation opening;

[0060] Optionally, the orthographic projection of the fourth extension on the array substrate is located at the orthographic projection of the third connection on the array substrate.

[0061] In one embodiment, the first light-emitting element, the second light-emitting element, and the third light-emitting element each include a first electrode, a light-emitting functional part, and a second electrode that are sequentially stacked away from the array substrate, and the second electrode is electrically connected to the isolation structure.

[0062] In one embodiment, the display panel further includes a pixel defining layer; the pixel defining layer is disposed between the isolation structure and the array substrate;

[0063] A pixel-defining layer encloses and forms multiple pixel openings; a first light-emitting element, a second light-emitting element, and a third light-emitting element are correspondingly disposed with respect to the multiple pixel openings, and at least a portion of the first light-emitting element, the second light-emitting element, and the third light-emitting element is disposed within the corresponding pixel opening;

[0064] Optionally, the first electrode is disposed between at least a portion of the pixel defining layer and at least a portion of the array substrate, and between at least a portion of the first light-emitting element, the second light-emitting element and the third light-emitting element and at least a portion of the array substrate.

[0065] Secondly, this application provides a display panel, the display panel comprising:

[0066] Array substrate;

[0067] An isolation structure is disposed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening;

[0068] A first light-emitting element, at least a portion of which is disposed within a first isolation opening;

[0069] The second light-emitting element is at least partially disposed within the second isolation opening; the first light-emitting element and the second light-emitting element are respectively used to emit light of different colors;

[0070] The first packaging section is located on the side of the first light-emitting element away from the array substrate;

[0071] The second packaging section is located on the side of the second light-emitting element away from the array substrate;

[0072] The second encapsulation portion extends toward the first isolation opening, and the end of the second encapsulation portion near the first encapsulation portion is provided with a first receiving groove. The first encapsulation portion extends toward the second encapsulation portion and is located in the first receiving groove.

[0073] Thirdly, this application provides a method for manufacturing a display panel, the method comprising:

[0074] Provide array substrate;

[0075] An isolation structure is formed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening;

[0076] A first light-emitting element is formed within the first isolation opening;

[0077] A first encapsulation portion is formed on the side of the first light-emitting element that is away from the array substrate;

[0078] A second light-emitting element is formed within the second isolation opening; the first and second light-emitting elements are respectively used to emit light of different colors.

[0079] A second encapsulation portion is formed on the side of the second light-emitting element that is away from the array substrate;

[0080] The second encapsulation portion extends toward the first isolation opening, and the end of the second encapsulation portion near the first encapsulation portion is provided with a first receiving groove. The first encapsulation portion extends toward the second encapsulation portion and is located in the first receiving groove.

[0081] In one embodiment, the second encapsulation portion includes a first main portion and a first sub-portion, a second sub-portion, and a third sub-portion disposed on the side of the isolation structure away from the array substrate; the second encapsulation portion is formed on the side of the second light-emitting element away from the array substrate, including:

[0082] A first main portion is formed on at least a portion of the surface of the second light-emitting element away from the array substrate and on the surface of the second isolation opening; one end of the first sub-part is connected to the first main portion, and the other end extends in a direction away from the second isolation opening;

[0083] A second sub-part and a third sub-part are formed at the end of the first sub-part near the first isolation opening; the second sub-part and the third sub-part together form a first receiving groove.

[0084] In one embodiment, the isolation structure further includes a third isolation opening; the method further includes:

[0085] A third light-emitting element is formed within the third isolation opening;

[0086] A third encapsulation portion is formed on the side of the third light-emitting element that is opposite to the array substrate; the third light-emitting element is used to emit light of other colors;

[0087] Optionally, the thickness of the first light-emitting element, the thickness of the second light-emitting element, and the thickness of the third light-emitting element in the first direction are different; the first direction is the thickness direction parallel to the display panel.

[0088] Optionally, the thickness of the third light-emitting element in the first direction is less than the thickness of the second light-emitting element in the first direction, and the thickness of the second light-emitting element in the first direction is less than the thickness of the first light-emitting element in the first direction;

[0089] Optionally, the thickness of the first light-emitting element in the first direction is greater than the thickness of the second light-emitting element and the thickness of the first light-emitting element in the first direction.

[0090] In one embodiment, before forming the first light-emitting element within the first isolation opening, the method further includes:

[0091] A first sacrificial layer is formed on at least a portion of the surface of the isolation structure away from the array substrate to increase the distance between the surface of the first package portion close to the array substrate and the surface of the isolation structure away from the array substrate.

[0092] Optionally, before forming the second light-emitting element within the second isolation opening, the above method further includes:

[0093] A second sacrificial layer is formed on at least a portion of the surface of the isolation structure away from the array substrate to increase the distance between the surface of the second package portion near the array substrate and the surface of the isolation structure away from the array substrate.

[0094] Fourthly, this application provides a display device, which includes a display panel according to any one of the first and second aspects described above.

[0095] The aforementioned display panel and its manufacturing method, as well as the display device, include: an array substrate, an isolation structure, a first light-emitting element, a second light-emitting element, a first encapsulation portion, and a second encapsulation portion; the isolation structure is disposed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening; at least a portion of the first light-emitting element is disposed within the first isolation opening; at least a portion of the second light-emitting element is disposed within the second isolation opening; the first light-emitting element and the second light-emitting element are respectively used to emit light of different colors; the first encapsulation portion is disposed on the side of the first light-emitting element away from the array substrate; the second encapsulation portion is disposed on the side of the second light-emitting element away from the array substrate; wherein, the second encapsulation portion further extends toward the first isolation opening, and a first receiving groove is provided at one end of the second encapsulation portion near the first encapsulation portion, and the first encapsulation portion further extends toward the second encapsulation portion and is located in the first receiving groove. The aforementioned display panel improves the stability of the morphology between the first and second encapsulation parts by providing a first receiving groove at one end of the second encapsulation part, thereby maximizing the sealing between the first and second encapsulation parts, reducing the occurrence rate of film peeling in the display panel, and thus improving the product yield of the display panel. Attached Figure Description

[0096] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0097] Figure 1 A cross-sectional structural diagram of a display panel provided in one embodiment;

[0098] Figure 2 A cross-sectional structural schematic diagram of a display panel provided for another embodiment;

[0099] Figure 3 A cross-sectional structural schematic diagram of a display panel provided for another embodiment;

[0100] Figure 4 A cross-sectional structural schematic diagram of a display panel provided for another embodiment;

[0101] Figure 5 for Figure 3 A top view of the display panel in the embodiment;

[0102] Figure 6 A partially enlarged cross-sectional structural diagram of a display panel provided for another embodiment;

[0103] Figure 7 A cross-sectional structural schematic diagram of a display panel provided for another embodiment;

[0104] Figure 8 for Figure 7 A diagram showing the arrangement of three pixels on the display panel in this embodiment;

[0105] Figure 9 A cross-sectional structural schematic diagram of a display panel provided for another embodiment;

[0106] Figure 10 for Figure 9 A top view of the display panel in the embodiment;

[0107] Figure 11 This is a schematic flowchart of the steps in a method for manufacturing a display panel in one embodiment;

[0108] Figure 12 This is a flowchart illustrating the steps of a method for manufacturing a display panel in another embodiment;

[0109] Figure 13 This is a flowchart illustrating the steps of a method for manufacturing a display panel in another embodiment.

[0110] Explanation of reference numerals in the attached figures:

[0111] 1. First encapsulation layer; 2. Second encapsulation layer; 10. Display panel; 11a. First electrode; 11b. Light-emitting functional part; 11c. Second electrode; 11. Array substrate; 12. Isolation structure; 121. First isolation opening; 122. Second isolation opening; 123. Third isolation opening; 124. First isolation layer; 125. Second isolation layer; 13. First light-emitting element; 14. Second light-emitting element; 15. First encapsulation part; 151. Second main part; 152. Fourth sub-part; 16. Second encapsulation part; 16a. First receiving groove; 161. First main part; 162. First sub-part; 163. Second sub-section; 164. Third sub-section; 165. Fifth sub-section; 165a. Second extension; 165b. Second connecting section; 152a. First extension; 152b. First connecting section; 17. Third light-emitting element; 18. Third encapsulation section; 18a. Second receiving groove; 181. Third main section; 182. Sixth sub-section; 183. Seventh sub-section; 184. Eighth sub-section; 165c. Third extension; 165d. Third connecting section; 165e. Fourth extension; 1651. Third receiving groove; 19. Pixel limiting layer; 191. Pixel opening; 20. Planarization layer. Detailed Implementation

[0112] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0113] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0114] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more light-emitting units present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more light-emitting units present.

[0115] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0116] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0117] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0118] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0119] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0120] Organic light-emitting diode (OLED) display panels have been identified as a highly promising display technology due to their advantages such as thinness, light weight, wide viewing angle, active light emission, continuously adjustable emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple manufacturing process, high luminous efficiency, and flexible display capability.

[0121] In OLED display technologies, display panels fabricated using pixel-level packaging offer advantages such as high image quality, thinness, and good heat dissipation, leading to their increasing adoption. To design pixel-level packaging display panels, related technologies include... Figure 1 As shown, the display panel includes a substrate and a first encapsulation layer 1 and a second encapsulation layer 2 covering any two adjacent different light-emitting elements. The side of the first encapsulation layer 1 closest to the second encapsulation layer 2 is spaced apart from the side of the second encapsulation layer 2 closest to the first encapsulation layer 1. However, this type of display panel is prone to film peeling between the encapsulation layers of adjacent light-emitting elements, affecting the product yield of the display panel.

[0122] The applicant discovered through research that the above-mentioned problem is caused by the fact that the encapsulation layers of adjacent light-emitting elements are suspended at the overlap of their encapsulation layers, which is called a "small wing". This structural morphology is unstable, and the encapsulation layer is prone to peeling during processes such as film peeling and washing after removing the encapsulation layer and the light-emitting layer.

[0123] In view of the above, embodiments of this application provide a display panel and a method for manufacturing the same, as well as a display device. The display panel includes an array substrate; an isolation structure disposed on one side of the array substrate, the isolation structure having a first isolation opening and a second isolation opening; a first light-emitting element, at least a portion of which is disposed within the first isolation opening; a second light-emitting element, at least a portion of which is disposed within the second isolation opening; the first light-emitting element and the second light-emitting element are respectively used to emit light of different colors; and a first encapsulation portion disposed on the side of the first light-emitting element facing away from the array substrate.

[0124] The second encapsulation portion is disposed on the side of the second light-emitting element facing away from the array substrate. The second encapsulation portion extends towards the first isolation opening, and a first receiving groove is provided at one end of the second encapsulation portion near the first encapsulation portion. The first encapsulation portion also extends towards the second encapsulation portion and is located within the first receiving groove. In the display panel provided by this application, the second encapsulation portion extends towards the first isolation opening, and a first receiving groove is provided at one end of the second encapsulation portion near the first encapsulation portion. The first encapsulation portion also extends towards the second encapsulation portion and is located within the first receiving groove. This stabilizes the structural morphology of the display panel at the film layer overlap, reducing the incidence of film layer peeling in the display panel during processes such as stripping and washing after removing the encapsulation layer and light-emitting layer, thereby improving the product yield of the display panel.

[0125] Based on the aforementioned technical problems, this application provides a display panel and its manufacturing method, as well as a display device, to reduce the incidence of film peeling in the display panel. The composition and manufacturing process of the isolation structure mentioned below are specified in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072. Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0126] This application provides a display panel 10, which may be an organic light-emitting diode display panel 10 (OLED) or a quantum dot light-emitting diode display panel 10 (QLED).

[0127] Specifically, please see Figure 2 The aforementioned display panel 10 includes: an array substrate 11, an isolation structure 12, a first light-emitting element 13, a second light-emitting element 14, a first encapsulation portion 15, and a second encapsulation portion 16. Specifically, the isolation structure 12 is disposed on one side of the array substrate 11, and the isolation structure 12 has a first isolation opening 121 and a second isolation opening 122; at least a portion of the first light-emitting element 13 is disposed within the first isolation opening 121; at least a portion of the second light-emitting element 14 is disposed within the second isolation opening 122; the first light-emitting element 13 and the second light-emitting element 14 are respectively used to emit light of different colors; the first encapsulation portion 15 is disposed on the side of the first light-emitting element 13 facing away from the array substrate 11; the second encapsulation portion 16 is disposed on the side of the second light-emitting element 14 facing away from the array substrate 11; wherein, the first encapsulation portion 15 and the second encapsulation portion 16 are connected. In one embodiment, at least a portion of the surface of the first encapsulation portion 15 near the array substrate 11 is connected to at least a portion of the surface of the second encapsulation portion 16 away from the array substrate 11.

[0128] The array substrate 11 may include a substrate and a driving circuit layer (not shown) disposed near the touch electrode. The driving circuit layer includes a pixel driving circuit, which includes a thin-film transistor. The substrate may be a rigid substrate or a flexible substrate. When the substrate is rigid, the substrate material may be glass or silicon wafer, etc.; when the substrate is flexible, the substrate material may be polyimide.

[0129] The isolation structure 12 refers to a functional layer that can isolate and insulate any adjacent light-emitting elements in the display panel 10. This isolation structure 12 can be understood as a porous structure. Simultaneously, the isolation structure 12 is used to connect to a fixed potential. It is understood that the isolation structure 12 can transmit cathode signals. The isolation structure 12 is made of conductive materials so that the cathodes in different light-emitting elements are electrically connected to themselves, reducing the cathode resistance and thus reducing the power consumption of the display panel 10.

[0130] Meanwhile, continue to see Figure 2The isolation structure 12 includes a first isolation layer 124 and a second isolation layer 125, which can be integrated into a single structure. The orthographic projection of the first isolation layer 124 onto the array substrate 11 lies within the orthographic projection of the second isolation layer 125 onto the array substrate 11. In practical applications, the first isolation layer 124 and the second isolation layer 125 in the isolation structure 12 can form an undercut structure with a larger top and smaller bottom. This allows adjacent light-emitting elements to be isolated during the vapor deposition process, preventing crosstalk between light-emitting elements of different colors and thus improving the display effect of the display panel 10.

[0131] In practical applications, both the first light-emitting element 13 and the second light-emitting element 14 can emit red, green, or blue light. However, the first light-emitting element 13 and the second light-emitting element 14 are used to emit light of different colors.

[0132] In this way, adjacent film layers in the display panel 10 are connected to reduce the incidence of film peeling or film breakage at the overlap between adjacent film layers, thereby improving the product yield of the display panel 10.

[0133] In one embodiment, see continue to see Figure 2 The second encapsulation portion 16 in the display panel 10 includes a first main portion 161 and a first sub-portion 162, a second sub-portion 163 and a third sub-portion 164 disposed on the side of the isolation structure 12 away from the array substrate 11; the first main portion 161 covers the surface of the second light-emitting element 14 away from the array substrate 11 and at least a portion of the surface of the second isolation opening 122.

[0134] Specifically, one end of the first sub-part 162 is connected to the first main part 161, and the other end extends in a direction away from the second isolation opening 122; the ends of the second sub-part 163 and the third sub-part 164 near the second isolation opening 122 are connected to the ends of the first sub-part 162 near the first isolation opening 121; the second encapsulation part 16 also extends in a direction near the first isolation opening 121, and the end of the second encapsulation part 16 near the first encapsulation part 15 is provided with a first receiving groove 16a, and the first encapsulation part 15 also extends in a direction near the second encapsulation part 16 and is located in the first receiving groove 16a; the second sub-part 163 and the third sub-part 164 together form the first receiving groove 16a.

[0135] The distance between the surface of the first sub-part 162 near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11 can be equal to the distance between the surface of the second sub-part 163 near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11, or equal to the thickness of the second light-emitting element 14.

[0136] It should be noted that the thickness of different light-emitting elements in the display panel 10 can be determined by the requirements of light-emitting element luminous efficiency, luminous brightness, light-emitting material characteristics, manufacturing process and optical characteristics; the thickness of light-emitting elements of different colors is different.

[0137] Optionally, the dimension of the first sub-part 162 in the thickness direction of the display panel 10 may be greater than the dimension of the second sub-part 163 in the thickness direction of the display panel 10. The dimension of the first sub-part 162 in the thickness direction of the display panel 10 is the same as the thickness of the first sub-part 162, and the dimension of the second sub-part 163 in the thickness direction of the display panel 10 is the same as the thickness of the second sub-part 163.

[0138] Additionally, at least a portion of the surface of the second isolation opening 122 may include at least a portion of the surface of the second isolation opening 122 near the first light-emitting element 13 and at least a portion of the surface of the second isolation opening 122 near the third light-emitting element 17. Figure 3 The at least part of the surface of the second isolation opening 122 near the third light-emitting element 17 is not shown in the diagram. In practical applications, the at least part of the surface of the second isolation opening 122 may include at least part of the sidewall of the second isolation opening 122, at least part of the surface of the second isolation layer 125 near the array substrate 11, and at least part of the surface of the second isolation layer 125 away from the array substrate 11.

[0139] It should be noted that the morphology of the first receiving groove 16a is related to the manufacturing process of the second encapsulation portion 16. The second sub-part 163 in the first receiving groove 16a is formed by the encapsulation material deposited on the surface of the first encapsulation portion 15 near the array substrate 11 during the manufacturing process of the second encapsulation portion 16. Thus, by extending the first encapsulation portion 15 towards the second encapsulation portion 16 into the first receiving groove 16a, the overlapping area of ​​the first encapsulation portion 15 and the second encapsulation portion 16 is connected, ensuring the sealing between the first encapsulation portion 15 and the second encapsulation portion 16, improving the reliability of the film encapsulation, and reducing the incidence of film peeling in the display panel 10.

[0140] Optionally, the thickness of the second sub-part 163 may be equal to the difference between the distance between the lower surface of the first encapsulation part 15 near the second isolation opening 122 and the surface of the isolation structure 12 away from the array substrate 11, and the thickness of the second light-emitting element 14; the lower surface refers to the surface near the array substrate 11. The distance between the lower surface of the first encapsulation part 15 near the second isolation opening 122 and the surface of the isolation structure 12 away from the array substrate 11 includes at least the thickness of the first light-emitting element 13.

[0141] Meanwhile, organic material can be filled between the first sub-part 162 and the first isolation layer 124 in the isolation structure 12. This helps to increase the contact area between the second encapsulation part 16 and other film layers in the display panel 10, further improving the connection stability of the second encapsulation part 16.

[0142] In one embodiment, see further. Figure 2 The first encapsulation portion 15 in the display panel 10 includes a second main portion 151 and a fourth sub-portion 152 disposed on the side of the isolation structure 12 away from the array substrate 11; the second main portion 151 covers the surface of the first light-emitting element 13 away from the array substrate 11 and at least a portion of the surface of the first isolation opening 121; one end of the fourth sub-portion 152 is connected to the second main portion 151, the other end extends in a direction away from the first isolation opening 121, and the other end is located in the first receiving groove 16a.

[0143] Optionally, the first receiving groove 16a is a concave groove, which can be a U-shaped structure, a semi-elliptical structure, or a semi-I-shaped structure. The first encapsulation portion 15 extends towards the second encapsulation portion 16, and one end of the first encapsulation portion 15 near the second encapsulation portion 16 is located within the groove of the first receiving groove 16a and connected to the first receiving groove 16a. This prevents the overlapping areas of adjacent film layers from being suspended, improves the morphological stability between the first encapsulation portion 15 and the second encapsulation portion 16, and achieves a sealing effect between the first encapsulation portion 15 and the second encapsulation portion 16, thereby reducing the incidence of film peeling in the display panel 10.

[0144] It should be noted that the connection between the first encapsulation portion 15 and the first receiving groove 16a can be such that the end of the first encapsulation portion 15 closer to the second encapsulation portion 16 is connected to the end of the first receiving groove 16a away from the first encapsulation portion 15. In the embodiments of this application, the film layer refers to the encapsulation layer or encapsulation portion.

[0145] The second isolation opening 122 may include at least a portion of the sidewall of the first isolation opening 121, at least a portion of the surface of the second isolation layer 125 on the side close to the array substrate 11, and at least a portion of the surface of the second isolation layer 125 on the side away from the array substrate 11.

[0146] It should be noted that the fourth sub-part 152 can be understood as the overlapping and connecting part between the first encapsulation part 15 and the second encapsulation part 16 or the third encapsulation part 18, and can be called a small wing.

[0147] In practical applications, the distance between the lower surface of the fourth sub-part 152 near the second isolation opening 122 and the surface of the isolation structure 12 away from the array substrate 11 includes at least the thickness of the first light-emitting element 13. One end of the fourth sub-part 152 is connected to the second main part 151, and the other end extends in a direction away from the first isolation opening 121, with the other end located within the first receiving groove 16a.

[0148] Thus, by connecting the fourth sub-part 152 and the second sub-part 163, the overlapping areas of the film layers of the first encapsulation part 15 and the second encapsulation part 16 are connected, thereby improving the sealing between the first encapsulation part 15 and the second encapsulation part 16 and reducing the occurrence rate of film layer peeling in the display panel 10.

[0149] In one embodiment, the orthographic projection of the third sub-part 164 on the array substrate 11 lies within the orthographic projection of the second sub-part 163 on the array substrate 11. This allows the second sub-part 163 and the third sub-part 164 to form an intersecting structure, together enclosing the first receiving groove 16a, thereby achieving a tight connection between adjacent overlapping film layers.

[0150] In one embodiment, the surfaces of the second sub-part 163 and the fourth sub-part 152 near the array substrate 11 are spaced apart from the surfaces of the corresponding isolation structure 12 away from the array substrate 11, and the surfaces of the second sub-part 163 and the fourth sub-part 152 away from the array substrate 11 are spaced apart from the surfaces of the third sub-part 164 near the array substrate 11.

[0151] In one embodiment, at least a portion of the surface of the second sub-part 163 away from the array substrate 11 is connected to at least a portion of the surface of the fourth sub-part 152 near the array substrate 11. This avoids the problem of film peeling caused by unstable morphology between the first and second encapsulation portions in subsequent processes when the third sub-part 164 and the fourth sub-part 152 are suspended. The connection between the third sub-part 164 and the fourth sub-part 152 improves the tightness of the connection between the first and second encapsulation portions, enhances the reliability of the film encapsulation, and reduces the incidence of film peeling in the display panel 10.

[0152] In one embodiment, the first distance 'a' between the surface of the second sub-part 163 near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11 is less than the second distance between the surface of the fourth sub-part 152 near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11. Figure 3 In the embodiment, the second distance between the side surface of the fourth sub-part 152 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is b.

[0153] In this design, the upper surface of the second sub-part 163 near the fourth sub-part 152 is spaced apart from the lower surface of the fourth sub-part 152 near the second sub-part 163. Thus, during the fabrication of the second encapsulation portion 16, a portion of the encapsulation material can be deposited onto the lower surface of the fourth sub-part 152 near the array substrate 11 to form the second sub-part 163, thereby connecting the second sub-part 163 and the fourth sub-part 152 and ensuring a tight connection between the first encapsulation portion 15 and the second encapsulation portion 16.

[0154] It should be noted that the aforementioned upper surface refers to the surface away from the array substrate 11. Optionally, the aforementioned first distance a may include the thickness of the second light-emitting element 14, and the second distance may at least include the thickness of the first light-emitting element 13.

[0155] In one embodiment, the distance between the side surface of the third sub-part 164 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is greater than the second distance.

[0156] In practical applications, the distance between the surface of the third sub-part 164 closest to the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11 can be greater than the distance between the surface of the fourth sub-part 152 furthest from the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11. Specifically, the distance between the surface of the fourth sub-part 152 furthest from the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11 is equal to the sum of the thickness of the first light-emitting element 13 and the thickness of the fourth sub-part 152.

[0157] In one embodiment, the thickness of the first light-emitting element 13 is greater than the thickness of the second light-emitting element 14. Thus, after removing the light-emitting material and cathode material from the side of the isolation structure 12 away from the array substrate 11 during the fabrication of the display panel 10, the distance between the side of the first encapsulation portion 15 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11 is greater than the distance between the side of the second encapsulation portion 16 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11. That is, the first distance 'a' between the side of the second sub-part 163 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11 is less than the second distance between the side of the fourth sub-part 152 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11.

[0158] In one embodiment, the thickness of the second sub-part 163 is less than the thickness of the fourth sub-part 152.

[0159] In one embodiment, such as Figure 3 and Figure 4As shown, the fourth sub-part 152 in the first encapsulation part 15 includes a first extension 152a connected to the second main part 151 and a first connecting part 152b connected to the first extension 152a; the first connecting part 152b is located in the first receiving groove 16a.

[0160] In one embodiment, at least a portion of the surface of the second sub-part 163 away from the array substrate 11 is connected to at least a portion of the surface of the first connecting part 152b near the array substrate 11. Thus, the second sub-part 163 and the first connecting part 152b ensure a tight connection between the first encapsulation part 15 and the second encapsulation part 16, improving the reliability of the film encapsulation, reducing the incidence of film peeling or cracking, and increasing the product yield of the display panel 10.

[0161] In one embodiment, the thickness of the second sub-part 163 is less than the thickness of the first connecting part 152b, the thickness of the first connecting part 152b is less than the thickness of the second sub-part 163, and the thickness of the fourth sub-part 152 is less than the thickness of the second sub-part 163.

[0162] In one embodiment, the distance between the side surface of the first extension 152a near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is the same as the second distance.

[0163] In one embodiment, the distance between the side surface of the first connection portion 152b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is greater than the second distance and the first distance a.

[0164] It should be noted here that, Figure 4 In the embodiment, the distance between the side surface of the first extension 152a near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is d, and the distance between the side surface of the first connection 152b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is e, where e is greater than d and d is greater than a.

[0165] In practical applications, for any two light-emitting elements (any two of the first light-emitting element 13, the second light-emitting element 14, and the third light-emitting element 17) in the display panel 10, before the fabrication of the first light-emitting element, a sacrificial layer can be fabricated on the side of the isolation structure 12 closest to the next light-emitting element to be fabricated. The sacrificial layer covers the surface of the isolation structure 12 on the side closest to the next light-emitting element to be fabricated. In this way, the sacrificial layer can raise the film height at the overlap of the encapsulation portion of the first light-emitting element and the encapsulation portion of the next light-emitting element to be fabricated, so that there is sufficient gap on the lower surface of the overlap of the encapsulation portion of the first light-emitting element. This allows some encapsulation material to be deposited on the lower surface of the overlap of the encapsulation portion of the first light-emitting element during the fabrication of the next light-emitting element to be fabricated, forming a receiving groove structure, which facilitates the subsequent connection of the film layer overlap. In this embodiment, the order in which the different light-emitting elements are fabricated is not limited during the fabrication of the display panel 10.

[0166] Taking a scenario where one light-emitting element is the first light-emitting element 13 and the next light-emitting element to be manufactured is the second light-emitting element 14 as an example, before manufacturing the first light-emitting element 13, a sacrificial layer can be formed on the side of the isolation structure 12 near the second light-emitting element 14. The sacrificial layer covers the surface of the isolation structure 12 on the side near the second light-emitting element 14. The purpose of forming the sacrificial layer is to raise at least a portion of the fourth sub-part 152, so that there is sufficient gap on at least a portion of the lower surface of the fourth sub-part 152 on the side near the second light-emitting element 14, allowing a portion of the encapsulation material to be deposited on the lower surface of the fourth sub-part 152 near the array substrate 11 during the manufacturing of the second encapsulation part 16 to form the second sub-part 163. In this embodiment, the thickness of the first light-emitting element 13 is greater than the thickness of the second light-emitting element 14.

[0167] Meanwhile, the distance between the side surface of the first connecting portion 152b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 can be equal to the sum of the thickness of the first light-emitting element 13 and the dimension of the sacrificial layer in the thickness direction of the display panel 10. The second distance can be less than the distance between the side surface of the first connecting portion 152b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11, and greater than the first distance a.

[0168] It should be noted that the sacrificial layer is used to raise the distance between the side surface of the first connection portion 152b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11, so that at least part of the lower surface of the first connection portion 152b near the first light-emitting element 13 has sufficient gap, so that a portion of the encapsulation material can be deposited on the lower surface of the first connection portion 152b near the array substrate 11 during the fabrication of the second encapsulation portion 16 to form the second sub-part 163.

[0169] It should be noted that in the subsequent process of removing the light-emitting material from the previous light-emitting element, the sacrificial layer can be removed simultaneously to ensure that sufficient gaps remain on the lower surface of the overlapping area of ​​the encapsulation portion of the previous light-emitting element. Specifically, before fabricating the sacrificial layer, the following process must be performed: a pixel defining layer 19 and an isolation structure 12 are sequentially stacked on one side of the array substrate 11; simultaneously, after the sacrificial layer is fabricated, the corresponding light-emitting element is fabricated.

[0170] In one embodiment, the distance between the side surface of the first connecting portion 152b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is less than the distance between at least a portion of the surface of the third sub-portion 164 near the first isolation opening 121 and the side surface of the first connecting portion 152b away from the array substrate 11.

[0171] Furthermore, the distance between the surface of the first connecting portion 152b near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11 can also be equal to the distance between at least a portion of the surface of the third sub-portion 164 near the first isolation opening 121 and the surface of the first connecting portion 152b away from the array substrate 11. In this way, the surface of the third sub-portion 164 near the array substrate 11 is connected to the surface of the first connecting portion 152b away from the array substrate 11, improving the stable connection between the first packaging portion 15 and the second packaging portion 16.

[0172] In one embodiment, see further. Figure 3 and Figure 4 The isolation structure 12 is provided with a third isolation opening 123; the display panel 10 also includes a third light-emitting element 17 and a third encapsulation part 18. At least a portion of the third light-emitting element 17 is disposed in the third isolation opening 123. The third light-emitting element 17 is used to emit light of other colors. The third encapsulation part 18 is disposed on the side of the third light-emitting element 17 away from the array substrate 11.

[0173] Specifically, the third encapsulation portion 18 extends toward the direction of the third isolation opening 123, and the third encapsulation portion 18 is provided with a second receiving groove 18a at one end near the first encapsulation portion 15 or the second encapsulation portion 16. The first encapsulation portion 15 or the second encapsulation portion 16 extends toward the direction of the third encapsulation portion 18 and is located in the second receiving groove 18a.

[0174] In practical applications, the third light-emitting element 17 can also emit red, green or blue light. However, the third light-emitting element 17, the first light-emitting element 13 and the second light-emitting element 14 are used to emit different colors of light.

[0175] The fact that the third encapsulation part 18 is provided with a second receiving groove 18a at one end near the first encapsulation part 15 or the second encapsulation part 16 can be understood as the second encapsulation part 16 being provided with a second receiving groove 18a at one end near the first isolation opening 121 or the second isolation opening 122.

[0176] Optionally, the second receiving groove 18a can be a U-shaped structure, a semi-elliptical structure, or a semi-I-shaped structure, and its shape can be consistent with that of the first receiving groove 16a. The first encapsulation portion 15 extends towards the third encapsulation portion 18, and one end of the first encapsulation portion 15 near the third encapsulation portion 18 can be located within the groove of the second receiving groove 18a and connected to it. This improves the tightness of the connection between adjacent film layers in the display panel 10, enhances the reliability of film layer encapsulation, and prevents problems such as film layer peeling or cracking at the film layer overlap from affecting the product yield of the display panel 10.

[0177] In addition, the second encapsulation portion 16 extends toward the third encapsulation portion 18, and one end of the second encapsulation portion 16 near the third encapsulation portion 18 can be located in the groove of the second receiving groove 18a and connected to the second receiving groove 18a. This can improve the tightness of the connection between adjacent film layers, improve the reliability of film layer encapsulation, and prevent problems such as film layer peeling or film layer rupture from film layer overlap from affecting the product yield of the display panel 10.

[0178] In this embodiment of the application, the third encapsulation portion 18 of the display panel 10 extends toward the third isolation opening 123, and a second receiving groove 18a is provided at one end of the third encapsulation portion 18 near the first encapsulation portion 15 or the second encapsulation portion 16. The first encapsulation portion 15 or the second encapsulation portion 16 extends toward the third encapsulation portion 18 and is located in the second receiving groove 18a. This design can improve the tight connection between adjacent film layers in the display panel 10, avoid the problem of film peeling or film breakage, thereby reducing the incidence of film peeling or film breakage and improving the product yield of the display panel 10.

[0179] In one embodiment, see further. Figure 3 and Figure 4 The second encapsulation portion 16 in the display panel 10 also includes a fifth sub-portion 165 disposed on the side of the isolation structure 12 away from the array substrate 11; one end of the fifth sub-portion 165 is connected to the first main portion 161, the other end extends in a direction away from the second isolation opening 122, and the other end is located in the second receiving groove 18a.

[0180] In practical applications, if the thickness of the first light-emitting element 13 in the first direction is greater than the thickness of the second light-emitting element 14 and the first light-emitting element 13 in the first direction, then following the process of first fabricating the thicker light-emitting element and then the thinner light-emitting element, the first encapsulation portion 15 of the first light-emitting element 13 and the second encapsulation portion 16 of the second light-emitting element 14 are overlapped and connected, and the second encapsulation portion 16 of the second light-emitting element 14 and the third encapsulation portion 18 of the third light-emitting element 17 are overlapped and connected. This results in an overlapping structure of adjacent film layers between the first encapsulation portion 15, the second encapsulation portion 16, and the third encapsulation portion 18, as detailed below. Figure 3 As shown, Figure 5 for Figure 3 The diagram shows the orthographic projection of the display panel 10 onto the array substrate 11.

[0181] in, Figure 5 There is no connection between the first packaging section 15 and the third packaging section 18, meaning there is an isolation gap. Furthermore, Figure 5 Cross-sectional view along the AA direction as shown Figure 3 As shown. Figure 6 As shown Figure 5 A partially enlarged cross-sectional view of the central display panel 10 shows the first sub-part 162, the second sub-part 163, and the third sub-part 164 in the second encapsulation portion 16.

[0182] In one embodiment, see further. Figure 3 and Figure 4 The fifth sub-part 165 is located within the second receiving groove 18a.

[0183] The distance between the lower surface of the fifth sub-part 165 near the second isolation opening 122 and the surface of the isolation structure 12 away from the array substrate 11 includes at least the thickness of the second light-emitting element 14. One end of the fifth sub-part 165 is connected to the first main part 161, and the other end extends in a direction away from the second isolation opening 122 and is located in the second receiving groove 18a.

[0184] Thus, by connecting the overlapping areas of the second encapsulation portion 16 and the third encapsulation portion 18 through the fifth sub-part 165, the sealing between the second encapsulation portion 16 and the third encapsulation portion 18 is ensured, the reliability of the encapsulation is improved, and the occurrence rate of film peeling in the display panel 10 is reduced.

[0185] In one embodiment, see further. Figure 4The third encapsulation portion 18 in the display panel 10 includes a third main portion 181 and a sixth sub-portion 182, a seventh sub-portion 183, and an eighth sub-portion 184 disposed on the side of the isolation structure 12 away from the array substrate 11. The third main portion 181 covers at least a portion of the surface of the third light-emitting element 17 away from the array substrate 11 and the surface of the third isolation opening 123. The thickness of the fifth sub-portion 165 is less than the thickness of the seventh sub-portion 184.

[0186] Specifically, one end of the sixth sub-part 182 is connected to the third main part 181, and the other end extends in a direction away from the third isolation opening 123; the seventh sub-part 183 and the eighth sub-part 184 are both connected to the end of the sixth sub-part 182 near the third isolation opening 123, and the seventh sub-part 183 and the eighth sub-part 184 together form the second receiving groove 18a.

[0187] The distance between the surface of the sixth sub-part 182 closest to the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11 can be equal to the distance between the surface of the seventh sub-part 183 closest to the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11, or equal to the thickness of the third light-emitting element 17. Optionally, the dimension of the sixth sub-part 182 in the thickness direction of the display panel 10 can be greater than the dimension of the seventh sub-part 183 in the thickness direction of the display panel 10. The dimension of the sixth sub-part 182 in the thickness direction of the display panel 10 is the same as the thickness of the sixth sub-part 182, and the dimension of the seventh sub-part 183 in the thickness direction of the display panel 10 is the same as the thickness of the seventh sub-part 183.

[0188] In addition, at least a portion of the surface of the third isolation opening 123 may include at least a portion of the sidewall of the third isolation opening 123, at least a portion of the surface of the second isolation layer 125 on the side close to the array substrate 11, and at least a portion of the surface of the second isolation layer 125 on the side away from the array substrate 11.

[0189] It should be noted that the morphology of the second receiving groove 18a is related to the manufacturing process of the third encapsulation part 18. The seventh sub-part 183 in the second receiving groove 18a is formed by the encapsulation material deposited on the surface of the second encapsulation part 16 near the array substrate 11 during the manufacturing process of the third encapsulation part 18. In this way, the second encapsulation part 16 extends into the second receiving groove 18a in a direction close to the third encapsulation part 18, so that the overlapping area of ​​the film layers of the second encapsulation part 16 and the third encapsulation part 18 is connected, ensuring the sealing between the second encapsulation part 16 and the third encapsulation part 18, improving the reliability of the film layer encapsulation, and reducing the occurrence rate of film layer peeling in the display panel 10.

[0190] Optionally, the thickness of the seventh sub-part 183 may be equal to the difference between the distance between the lower surface of the second encapsulation part 16 near the third isolation opening 123 and the surface of the isolation structure 12 away from the array substrate 11, and the thickness of the third light-emitting element 17. The distance between the lower surface of the second encapsulation part 16 near the third isolation opening 123 and the surface of the isolation structure 12 away from the array substrate 11 includes at least the thickness of the second light-emitting element 14.

[0191] Meanwhile, organic material can be filled between the sixth sub-part 182 and the first isolation layer 124 in the isolation structure 12. This helps to increase the contact area between the third encapsulation part 18 and other film layers in the display panel 10, further improving the connection stability of the third encapsulation part 18.

[0192] In this embodiment, the fourth sub-part 152 may also be located within the second receiving groove 18a and connected to the seventh sub-part 183 in the second receiving groove 18a. Thus, the fourth sub-part 152 and the seventh sub-part 183 enable a tight connection between the first encapsulation part 15 and the third encapsulation part 18, ensuring the sealing between adjacent film layers of the first encapsulation part 15 and the third encapsulation part 18.

[0193] In one embodiment, the fourth sub-part 152 of the first encapsulation part 15 is located in the second receiving groove 18a, and the fourth sub-part 152 is connected to the second receiving groove 18a.

[0194] In practical applications, the surface of the first connecting portion 152b in the fourth sub-part 152 near the array substrate 11 is connected to the surface of the seventh sub-part 183 in the second receiving groove 18a away from the array substrate 11, and at least a portion of the surface of the first connecting portion 152b near the second isolation opening 122 is connected to at least a portion of the surface of the seventh sub-part 183 near the first exit opening 121. This allows the second receiving groove 18a and the fourth sub-part 152 to overlap and connect.

[0195] In this embodiment of the application, in the manufacturing process of the display panel 10, after the first light-emitting element 13 and the second light-emitting element 14 (the thickness of the first light-emitting element 13 is greater than the thickness of the second light-emitting element 14) are fabricated, the first encapsulation portion 15 covering the first light-emitting element 13 and the second encapsulation portion 16 covering the second light-emitting element 14 are formed as follows: Figure 2 The structure shown is further processed by fabricating a third light-emitting element 17 (the thickness of the second light-emitting element 14 is greater than the thickness of the third light-emitting element 17), and during the fabrication of the third light-emitting element 17, the second receiving groove 18a in the third encapsulation portion 18 covering the third light-emitting element 17 is overlapped and connected with the fourth sub-part 152 in the first encapsulation portion 15 (as shown). Figure 7 (As shown).

[0196] In this embodiment, the connection structure between the first encapsulation portion 15 and the second encapsulation portion 16 formed from one viewpoint is similar. Figure 3 The connection structure between the first encapsulation part 15 and the second encapsulation part 16, after the third light-emitting element 17 is manufactured, forms a cross-sectional structure from another perspective as follows: Figure 7 As shown. Among them, Figure 8 The first packaging section 15 and the third packaging section 18 are connected, meaning there is no isolation gap.

[0197] In this way, the first encapsulation part 15, the second encapsulation part 16, and the third encapsulation part 18 achieve full overlapping connection from different perspectives. Figure 8 for Figure 7 The pixel arrangement diagram of the display panel 10 on the array substrate 11 shows that each light-emitting element in the display panel 10 is surrounded by a closed connecting film layer. This can prevent moisture from the light-emitting element from entering the light-emitting element, reduce the incidence of film peeling or film cracking, improve the reliability of film encapsulation in the display panel 10, and thus improve the product yield of the display panel 10.

[0198] In one embodiment, the orthographic projection of the eighth sub-part 184 onto the array substrate 11 lies within the orthographic projection of the seventh sub-part 183 onto the array substrate 11. This allows the seventh sub-part 183 and the eighth sub-part 184 to form an intersecting structure, together enclosing the second receiving groove 18a, thereby achieving a tight connection between adjacent film layers.

[0199] In one embodiment, the surfaces of the seventh sub-part 183 and the fifth sub-part 165 near the array substrate 11 are spaced apart from the surfaces of the corresponding isolation structure 12 away from the array substrate 11, and the surfaces of the seventh sub-part 183 and the fifth sub-part 165 away from the array substrate 11 are spaced apart from the surfaces of the eighth sub-part 184 near the array substrate 11.

[0200] In one embodiment, at least a portion of the surface of the seventh sub-part 183 on the side away from the array substrate 11 is connected to at least a portion of the surface of the fifth sub-part 165 on the side close to the array substrate 11. This improves the tightness of the connection at the overlap of adjacent film layers, reduces the incidence of film peeling or cracking, and increases the product yield of the display panel 10.

[0201] In one embodiment, the surface of the seventh sub-part 183 away from the array substrate 11 is not connected to the surface of the fourth sub-part 152 near the array substrate 11. This ensures connection between adjacent encapsulation portions in the display panel 10, improves the tightness of the overlap between adjacent film layers, reduces the incidence of film peeling or cracking, and improves the product yield of the display panel 10.

[0202] In one embodiment, the thickness of the seventh sub-part 183 is less than the thickness of the fourth sub-part 152.

[0203] In one embodiment, the third distance between the side surface of the seventh sub-part 183 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is less than the fourth distance between the side surface of the fifth sub-part 165 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11.

[0204] In this design, the upper surface of the seventh sub-part 183 near the fourth sub-part 152 is spaced apart from the lower surface of the fifth sub-part 165 near the seventh sub-part 183. Thus, during the fabrication of the third encapsulation part 18, a portion of the encapsulation material can be deposited onto the lower surface of the fifth sub-part 165 near the array substrate 11 to form the seventh sub-part 183, thereby connecting the seventh sub-part 183 and the fifth sub-part 165 and ensuring a tight connection between the third encapsulation part 18 and the second encapsulation part 16. Alternatively, a portion of the encapsulation material can be deposited onto the lower surface of the fourth sub-part 152 near the array substrate 11 to form the seventh sub-part 183, thereby connecting the seventh sub-part 183 and the fourth sub-part 152 and ensuring a tight connection between the third encapsulation part 18 and the first encapsulation part 15, improving the reliability of the film encapsulation.

[0205] In one embodiment, the distance between the side surface of the eighth sub-part 184 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is greater than the fourth distance.

[0206] In practical applications, the distance between the surface of the eighth sub-part 184 closest to the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11 can be greater than the distance between the surface of the fifth sub-part 165 furthest from the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11. Specifically, the distance between the surface of the fifth sub-part 165 furthest from the array substrate 11 and the surface of the isolation structure 12 furthest from the array substrate 11 is equal to the sum of the thickness of the second light-emitting element 14 and the thickness of the fifth sub-part 165.

[0207] In one embodiment, organic material and / or cathode material are present between the side of the sixth sub-section 182 and the seventh sub-section 183 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11.

[0208] During the fabrication of the display panel 11, when the first encapsulation portion 15, the second encapsulation portion 16, and the third encapsulation portion 18 are fully overlapped from different viewing angles, when removing the organic material and cathode material between the side of the third encapsulation portion 18 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11, due to the overlap between the third encapsulation portion 18 and the first encapsulation portion 15, the organic material and cathode material between the side of the sixth sub-part 182 and the seventh sub-part 183 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11 may not be completely removed. Naturally, organic material and / or cathode material may exist between the side of the sixth sub-part 182 and the seventh sub-part 183 near the array substrate 11 and the side of the isolation structure 12 away from the array substrate 11. Optionally, the cathode material can be an organic material or an inorganic material.

[0209] In some scenarios, in one embodiment, see also... Figure 4 The fifth sub-part 165 in the second encapsulation part 16 includes a second extension 165a connected to the first main part 161 and a second connecting part 165b connected to the second extension 165a; the second connecting part 165b is located in the second receiving groove 18a.

[0210] exist Figure 4 In this embodiment, the distance between the side surface of the second extension 165a near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is f, and the distance between the side surface of the second connection 165b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is g. The distance between the side surface of the sixth sub-part 182 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is c. g is greater than f, f is greater than the fourth distance c, and f is equal to c.

[0211] It should be noted that the fifth sub-part 165 can be understood as the overlapping and connecting part between the second encapsulation part 16 and the third encapsulation part 18 or the first encapsulation part 15, and can be called a small wing.

[0212] Prior to the fabrication of the first light-emitting element 13, a sacrificial layer is formed on the isolation structure 12 on the side near the second light-emitting element 14. Naturally, the sacrificial layer can raise at least a portion of the fifth sub-part 165, leaving sufficient gaps on at least a portion of the lower surface of the fifth sub-part 165 near the third light-emitting element 17. This allows a portion of the encapsulation material to be deposited onto the lower surface of the fifth sub-part 165 near the array substrate 11 during the subsequent fabrication of the third encapsulation part 18, forming the seventh sub-part 183. In this embodiment, the thickness of the second light-emitting element 14 is different from that of the first light-emitting element 13, and both are less than the thickness of the first light-emitting element 13.

[0213] In this embodiment, the distance between the side surface of the second connecting portion 165b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 can be equal to the sum of the thickness of the second light-emitting device and the dimension of the sacrificial layer in the thickness direction of the display panel 10.

[0214] In one embodiment, at least a portion of the surface of the seventh sub-part 183 on the side away from the array substrate 11 is connected to at least a portion of the surface of the second connecting part 165b on the side near the array substrate 11. Thus, the seventh sub-part 183 and the second connecting part 165b ensure a tight connection between the second encapsulation part 16 and the third encapsulation part 18, reducing the incidence of film peeling or film breakage and improving the product yield of the display panel 10.

[0215] In one embodiment, the thickness of the second connecting portion 165b is greater than the thickness of the seventh sub-portion 183; the surface of the seventh sub-portion 183 away from the array substrate 11 is not connected to the surface of the fifth sub-portion 165 near the array substrate 11. This ensures a tight connection between the third encapsulation portion 18 and the first encapsulation portion 15, allowing the first encapsulation portion 15, the second encapsulation portion 16, and the third encapsulation portion 18 to achieve full overlapping connection from different perspectives.

[0216] In one embodiment, the distance between the side surface of the second extension 165a near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is the same as the fourth distance.

[0217] The distance between the side surface of the second extension 165a near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 can be smaller than the distance between the side surface of the second extension 165a near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11, and larger than the distance between the side surface of the seventh sub-part 183 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11.

[0218] Thus, after the second encapsulation part 16 is manufactured, there can be enough gaps on the lower surface of the second connecting part 165b in the second encapsulation part 16 for depositing the encapsulation material corresponding to the third encapsulation part 18 to form the seventh sub-part 183. This ensures a tight connection between the second encapsulation part 16 and the third encapsulation part 18 through the seventh sub-part 183 and the second connecting part 165b, thereby improving the reliability of the film encapsulation, reducing the incidence of film peeling or film breakage, and improving the product yield of the display panel 10.

[0219] In one embodiment, the distance between the side surface of the second connection portion 165b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is greater than the fourth distance and the third distance.

[0220] In addition, the distance between the side surface of the second connecting portion 165b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 can be equal to the sum of the thickness of the seventh sub-part 183 and the thickness of the third light-emitting element 17.

[0221] It should be noted that the sacrificial layer is used to raise the distance between the side surface of the second connection portion 165b near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11, so that at least part of the lower surface of the second connection portion 165b near the second light-emitting element 14 has sufficient gap, so that a portion of the encapsulation material can be deposited on the lower surface of the second connection portion 165b near the array substrate 11 during the fabrication of the third encapsulation portion 18 to form the seventh sub-part 183.

[0222] In one embodiment, the orthographic projection of the second extension 165a on the array substrate 11 is adjacent to the orthographic projection of the second connection portion 165b on the array substrate 11.

[0223] In practical applications, the orthographic projection of the second extension 165a on the array substrate 11 and the orthographic projection of the second connecting portion 165b on the array substrate 11 are adjacent. This can be understood as the orthographic projection of the second extension 165a on the array substrate 11 being continuous with the orthographic projection of the second connecting portion 165b on the array substrate 11, or there being no gap between the orthographic projection of the second extension 165a on the array substrate 11 and the orthographic projection of the second connecting portion 165b on the array substrate 11.

[0224] In other scenarios, in one embodiment, such as Figure 9 As shown, the fifth sub-part 165 in the second packaging part 16 includes a third extension 165c, a third connecting part 165d, and a fourth extension 165e disposed on the side of the isolation structure 12 away from the array substrate 11; one end of the third extension 165c is connected to the first main part 161, the third connecting part 165d and the fourth extension 165e are both connected to the end of the third extension 165c near the second isolation opening 122, and the third connecting part 165d and the fourth extension 165e together form a third receiving groove 1651.

[0225] The distance between the surface of the third extension 165c near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11 can be equal to the distance between the surface of the third connecting portion 165d near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11, or equal to the thickness of the second light-emitting element 14. Optionally, the dimension of the third extension 165c in the thickness direction of the display panel 10 can be greater than the dimension of the third connecting portion 165d in the thickness direction of the display panel 10. The dimension of the third extension 165c in the thickness direction of the display panel 10 is the same as the thickness of the third extension 165c, and the dimension of the third connecting portion 165d in the thickness direction of the display panel 10 is the same as the thickness of the third connecting portion 165d.

[0226] exist Figure 9 In the embodiment, the distance between the side surface of the first sub-part 162 or the third connecting part 165d near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is a, the distance between the side surface of the seventh sub-part 183 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is c, and the distance between the side surface of the fourth sub-part 152 near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is b. In the embodiment of this application, a equals c, and b is greater than a.

[0227] It should be noted that the morphology of the third receiving groove 1651 is related to the manufacturing processes of the second encapsulation portion 16 and the first encapsulation portion 15. With the first encapsulation portion 15 covering the isolation structure 12, the third connecting portion 165d in the third receiving groove 1651 is formed by the encapsulation material deposited on the surface of the first encapsulation portion 15 near the array substrate 11 during the manufacturing process of the second encapsulation portion 16. Thus, by extending the first encapsulation portion 15 towards the second encapsulation portion 16 into the third receiving groove 1651, the overlapping area of ​​the film layers of the first encapsulation portion 15 and the second encapsulation portion 16 is connected, ensuring the sealing between the first encapsulation portion 15 and the second encapsulation portion 16, improving the reliability of the film encapsulation, and reducing the incidence of film peeling in the display panel 10.

[0228] Optionally, the thickness of the third connecting portion 165d can be equal to the difference between the distance between the lower surface of the fourth sub-portion 152 near the second isolation opening 122 and the surface of the isolation structure 12 away from the array substrate 11, and the thickness of the second light-emitting element 14. Specifically, the distance between the lower surface of the third connecting portion 165d away from the second isolation opening 122 and the surface of the isolation structure 12 away from the array substrate 11 can be equal to the sum of the thickness of the second light-emitting element 14 and the thickness of the sacrificial layer.

[0229] In one embodiment, see further. Figure 9 The fourth sub-part 152 in the first encapsulation part 15 is located within the third receiving groove 1651. Figure 10 for Figure 9 A structural diagram of the display panel 10 projected onto the array substrate 11; Figure 10 Cross-sectional view along the BB direction as follows Figure 9 As shown.

[0230] It should be noted that the fourth sub-part 152 being located within the third receiving groove 1651 ensures that the fourth sub-part 152 is connected to the third receiving groove 1651. This allows the first encapsulation part 15 to overlap and connect with both the first encapsulation part 16 and the third encapsulation part 18, i.e., an enclosed overlapping connection. This reduces the incidence of film peeling or film breakage, and the connected film layers form a closed structure, improving the reliability of the film encapsulation in the display panel 10, thereby increasing the product yield of the display panel 10.

[0231] In other scenarios, the fourth sub-part 152 may also be located in the third receiving groove 1651, with the side surface of the fourth sub-part 152 near the array substrate 11 connected to the side surface of the seventh sub-part 183 away from the array substrate 11, and the side of the fourth sub-part 152 near the seventh sub-part 183 connected to the side of the seventh sub-part 183 near the fourth sub-part 152.

[0232] In one embodiment, the distance between the side surface of the third extension 165c near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is the same as the fourth distance.

[0233] Optionally, the distance between the side surface of the third extension 165c near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 can be equal to the distance between the side surface of the third connection 165d near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11, or the thickness of the second light-emitting element 14.

[0234] In one embodiment, the thickness of the third connecting portion 165d is less than the thickness of the fourth sub-portion 152.

[0235] In one embodiment, the distance between the side surface of the fourth extension 165e near the array substrate 11 and the side surface of the isolation structure 12 away from the array substrate 11 is greater than the fourth distance.

[0236] In practical applications, the distance between the surface of the fourth extension 165e near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11 can be greater than the distance between the surface of the third connecting portion 165d away from the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11. This allows at least a portion of the surface of the first encapsulation portion 15 near the second light-emitting element 14 to be covered, thereby increasing the tightness of the connection between the first encapsulation portion 15 and the second encapsulation portion 16.

[0237] In one embodiment, at least a portion of the surface of the fourth extension 165e near the second isolation opening 122 is spaced from at least a portion of the surface of the third connection 165d near the third isolation opening 123.

[0238] The distance between at least a portion of the surface of the fourth extension 165e near the second isolation opening 122 and at least a portion of the surface of the third connection 165d near the third isolation opening 123 can be equal to the thickness of the second light-emitting element 14.

[0239] In one embodiment, the orthographic projection of the fourth extension 165e on the array substrate 11 is located at the orthographic projection of the third connection 165d on the array substrate 11.

[0240] In one embodiment, see further. Figure 2-4 and Figure 9 The first light-emitting element 13, the second light-emitting element 14 and the third light-emitting element 17 each include a first electrode 11a, a light-emitting functional part 11b and a second electrode 11c arranged sequentially along the distance from the array substrate 11. The second electrode 11c is electrically connected to the isolation structure 12.

[0241] The first electrode 11a can be an anode, and the second electrode 11c can be a cathode. It is understood that the light-emitting functional unit 11b includes at least an emission layer (EML), and may also include a functional layer, which may include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron block layer (EBL). It is understood that the light-emitting functional unit 11b may also include at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole block layer (HBL). Alternatively, the light-emitting functional unit 11b may be a stacked light-emitting layer, that is, it includes at least two light-emitting layers and a charge generation layer (CGL) located between each adjacent light-emitting layer.

[0242] In this embodiment, adjacent light-emitting functional parts 11b in adjacent light-emitting elements can be separated by the isolation structure 12. Simultaneously, the light-emitting functional parts 11b can be fabricated using patterned photolithography, thus eliminating the need for an f-mmm unit (FMM) and enabling the provision of pixel aperture ratio.

[0243] In one embodiment, see further. Figure 2-4 The display panel 10 also includes a pixel defining layer 19; the pixel defining layer 19 is disposed between the isolation structure 12 and the array substrate 11; the pixel defining layer 19 encloses and forms a plurality of pixel openings 191; the first light-emitting element 13, the second light-emitting element 14 and the third light-emitting element 17 are correspondingly disposed with respect to the plurality of pixel openings 191, and at least a portion of the first light-emitting element 13, the second light-emitting element 14 and the third light-emitting element 17 are disposed within the corresponding pixel openings 191.

[0244] In this array substrate 11, the pixel defining layer 19 has multiple pixel openings 191. A first isolation opening 121, a second isolation opening 122, and a third isolation opening 123 are correspondingly and permeable to the multiple pixel openings 191. Furthermore, a first light-emitting element 13, a second light-emitting element 14, and a third light-emitting element 17 are all correspondingly disposed to the multiple pixel openings 191, with each of the first light-emitting element 13, second light-emitting element 14, and third light-emitting element 17 corresponding one-to-one with a pixel opening 191. See also... Figure 2-4 6 and 9, the display panel 10 also includes a planarization layer 20, which is disposed between the array substrate 11 and the pixel defining layer 19.

[0245] In one embodiment, the first electrode 11a is disposed between at least a portion of the pixel defining layer 19 and at least a portion of the array substrate 11, and between at least a portion of the first light-emitting element 13, the second light-emitting element 14 and the third light-emitting element 17 and at least a portion of the array substrate 11.

[0246] One embodiment provides a display panel 10, please continue to see Figure 2 The display panel 10 includes: an array substrate 11, an isolation structure 12, a first light-emitting element 13, a second light-emitting element 14, a first encapsulation portion 15, and a second encapsulation portion 16. The isolation structure 12 is disposed on one side of the array substrate 11, and has a first isolation opening 121 and a second isolation opening 122. At least a portion of the first light-emitting element 13 is disposed within the first isolation opening 121; at least a portion of the second light-emitting element 14 is disposed within the second isolation opening 122; the first light-emitting element 13 and the second light-emitting element 14 are respectively used to emit light of different colors; the first encapsulation portion 15 is disposed on the side of the first light-emitting element 13 facing away from the array substrate 11; the second encapsulation portion 16 is disposed on the side of the second light-emitting element 14 facing away from the array substrate 11.

[0247] The second encapsulation part 16 extends toward the first isolation opening 121, and the end of the second encapsulation part 16 near the first encapsulation part 15 is provided with a first receiving groove 16a, and the end of the first encapsulation part 15 near the second isolation opening 122 is located in the first receiving groove 16a.

[0248] It should be noted that the second encapsulation portion 16 extends towards the first isolation opening 121, which can be understood as the second encapsulation portion 16 extending away from the second isolation opening 122; the second encapsulation portion 16 having a first receiving groove 16a at one end near the first encapsulation portion 15 can be understood as the second encapsulation portion 16 having a first receiving groove 16a at one end near the first isolation opening 121 (see continue). Figure 3 (As shown).

[0249] Optionally, the first receiving groove 16a is a concave groove, which can be a U-shaped structure, a semi-elliptical structure, or a semi-I-shaped structure. The first encapsulation portion 15 extends towards the second encapsulation portion 16, and one end of the first encapsulation portion 15 near the second encapsulation portion 16 is located within the groove of the first receiving groove 16a and connected to the first receiving groove 16a. This prevents the overlapping areas of adjacent film layers from being suspended, improves the morphological stability between the first encapsulation portion 15 and the second encapsulation portion 16, and achieves a sealing effect between the first encapsulation portion 15 and the second encapsulation portion 16, thereby reducing the incidence of film peeling in the display panel 10.

[0250] It should be noted that the connection between the first encapsulation portion 15 and the first receiving groove 16a can be such that the end of the first encapsulation portion 15 closer to the second encapsulation portion 16 is connected to the end of the first receiving groove 16a away from the first encapsulation portion 15. In the embodiments of this application, the film layer refers to the encapsulation layer or encapsulation portion.

[0251] In the embodiment of this application, the second encapsulation portion 16 of the display panel 10 extends towards the first isolation opening 121, and a first receiving groove 16a is provided at one end of the second encapsulation portion 16 near the first encapsulation portion 15. The first encapsulation portion 15 also extends towards the second encapsulation portion 16 and is located within the first receiving groove 16a. By providing the first receiving groove 16a at one end of the second encapsulation portion 16, the first encapsulation portion 15 extends towards the second encapsulation portion 16 and is located within the first receiving groove 16a. This improves the stability of the structural morphology at the overlap between the first encapsulation portion 15 and the second encapsulation portion 16, ensures the sealing between the first encapsulation portion 15 and the second encapsulation portion 16, improves the reliability of the film encapsulation, reduces the incidence of film peeling in the display panel 10, and thus improves the product yield of the display panel 10.

[0252] Reference Figure 11 As shown, one embodiment of the manufacturing method of the display panel 10 of this application specifically includes the following steps:

[0253] S100, provides array substrate 11.

[0254] S200, An isolation structure 12 is formed on one side of the array substrate 11, and the isolation structure 12 is provided with a first isolation opening 121 and a second isolation opening 122.

[0255] S300, A first light-emitting element 13 is formed within the first isolation opening 121.

[0256] S400, A first encapsulation portion 15 is formed on the side of the first light-emitting element 13 away from the array substrate 11.

[0257] S500, a second light-emitting element 14 is formed in the second isolation opening 122; the first light-emitting element 13 and the second light-emitting element 14 are used to emit light of different colors respectively.

[0258] S600, A second encapsulation portion 16 is formed on the side of the second light-emitting element 14 that is away from the array substrate 11;

[0259] The second encapsulation portion 16 extends toward the first isolation opening 121, and the second encapsulation portion 16 is provided with a first receiving groove 16a at one end near the first encapsulation portion 15. The first encapsulation portion 15 extends toward the second encapsulation portion 16 and is located in the first receiving groove 16a.

[0260] The method for manufacturing a display panel 10 provided in this application embodiment improves the stability of the structural morphology between the first encapsulation portion 15 and the second encapsulation portion 16 by providing a first receiving groove 16a at one end of the second encapsulation portion 16, thereby ensuring the sealing between the first encapsulation portion 15 and the second encapsulation portion 16, improving the reliability of the film encapsulation, reducing the incidence of film peeling in the display panel 10, and thus improving the product yield of the display panel 10. At the same time, this manufacturing method can produce a display panel 10 with high film encapsulation reliability without adding additional manufacturing processes, improving the product yield of the display panel 10. Therefore, on this basis, the manufacturing cost of this type of display panel 10 can be reduced, and the manufacturing time of this type of display panel 10 can be avoided.

[0261] In one embodiment, the second packaging portion 16 includes a first main portion 161 and a first sub-portion 162, a second sub-portion 163, and a third sub-portion 164 disposed on the side of the isolation structure 12 away from the array substrate 11; as Figure 12 As shown, in the above S600, a second encapsulation portion 16 is formed on the side of the second light-emitting element 14 facing away from the array substrate 11, specifically including the following steps:

[0262] S610, a first main portion 161 is formed on at least a portion of the surface of the second light-emitting element 14 away from the array substrate 11 and the surface of the second isolation opening 122; one end of the first sub-portion 162 is connected to the first main portion 161, and the other end extends in a direction away from the second isolation opening 122.

[0263] S620, a second sub-part 163 and a third sub-part 164 are formed at one end of the first sub-part 162 near the first isolation opening 121; the second sub-part 163 and the third sub-part 164 together form the first receiving groove 16a.

[0264] This effectively completes the fabrication of the second encapsulation section 16. Consequently, the side of the first encapsulation section 15 facing away from the first isolation opening 121 is positioned within the first receiving groove 16a of the second encapsulation section 16, allowing the first encapsulation section 15 and the second encapsulation section 16 to connect. This prevents film peeling or cracking due to a suspended state at the overlap of the first and second encapsulation sections 15 and 16, improving the reliability of the film encapsulation, reducing the incidence of film peeling or cracking, and thus increasing the product yield of the display panel 10.

[0265] In one embodiment, the isolation structure 12 further includes a third isolation opening 123; after the second encapsulation portion 16 is formed, as Figure 13 As shown, proceed with the following steps:

[0266] S700, a third light-emitting element 17 is formed within the third isolation opening 123.

[0267] S800, a third encapsulation portion 18 is formed on the side of the third light-emitting element 17 facing away from the array substrate 11; the third light-emitting element 17 is used to emit light of other colors.

[0268] The thicknesses of the first light-emitting element 13, the second light-emitting element 14, and the third light-emitting element 17 in the first direction are different; the first direction is parallel to the thickness direction of the display panel 10.

[0269] In one embodiment, the thickness of the third light-emitting element 17 in the first direction is less than the thickness of the second light-emitting element 14 in the first direction, and the thickness of the second light-emitting element 14 in the first direction is less than the thickness of the first light-emitting element 13 in the first direction.

[0270] It should be noted that if the thickness of the third light-emitting element 17 in the first direction is less than the thickness of the second light-emitting element 14 in the first direction, and the thickness of the second light-emitting element 14 in the first direction is less than the thickness of the first light-emitting element 13 in the first direction, then the display panel 10 is fabricated by following the order of fabricating the thicker light-emitting element first and then the thinner light-emitting element. A cross-sectional view of the resulting panel can be found here. Figure 3 As shown.

[0271] This ensures that there is sufficient gap on the lower surface of the previous encapsulation part near the next encapsulation part, so that when the next encapsulation part is made, the encapsulation material can be deposited on the lower surface of the previous encapsulation part near the next encapsulation layer, and the end of the next encapsulation part near the previous encapsulation part forms a receiving groove for connecting the side of the previous encapsulation part near the next encapsulation part.

[0272] In one embodiment, the thickness of the first light-emitting element 13 in the first direction is greater than the thickness of the second light-emitting element 14 and the thickness of the first light-emitting element 13 in the first direction.

[0273] If the thickness of the first light-emitting element 13 in the first direction is greater than the thickness of the second light-emitting element 14 and the first light-emitting element 13 in the first direction, then the first light-emitting element 13 is manufactured with the greater thickness as a priority. This ensures that at least a portion of the first encapsulation portion 15 covers the side surface of the isolation structure 12 away from the array substrate 11. This guarantees that when any other light-emitting element (the second light-emitting element 14) with a smaller thickness is subsequently manufactured, sufficient gaps are left on the lower surface of the first encapsulation portion 15 near the second isolation opening 122 and on the side of the second isolation opening 122, so that... When manufacturing other light-emitting elements, the encapsulation material can be deposited on the lower surface of the first encapsulation part 15 near the second isolation opening 122 and the side of the second isolation opening 122, ensuring that the second encapsulation part 16 and the third encapsulation part 18 form receiving grooves on the side near or away from the first encapsulation part 15, so that at least a part of the first encapsulation part 15 is located in the receiving groove, so that the second encapsulation part 16 and the third encapsulation part 18 are connected to the first encapsulation part 15, ensuring the tight connection between the film layers, improving the reliability of the film layer encapsulation, thereby reducing the occurrence rate of film layer peeling or film layer breakage, and improving the product yield of the display panel 10.

[0274] In one embodiment, before the first light-emitting element 13 is formed in the first isolation opening 121 in S300, the above method may further include the following steps: forming a first sacrificial layer on at least a portion of the surface of the isolation structure 12 away from the array substrate 11 to increase the distance between the surface of the first package portion 15 close to the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11.

[0275] In one embodiment, before forming the second light-emitting element 14 in the second isolation opening 121, the above method may further include the following steps: forming a second sacrificial layer on at least a portion of the surface of the isolation structure 12 away from the array substrate 11 to increase the distance between the surface of the second encapsulation portion 16 near the array substrate 11 and the surface of the isolation structure 12 away from the array substrate 11.

[0276] The dimensions of the first sacrificial layer and the second sacrificial layer in the thickness direction of the display panel 10 may be equal or unequal. In practical applications, the first sacrificial layer is used to increase the distance between the surface of the fourth sub-part 152 in the first encapsulation portion 15 that is close to the array substrate 11 and the surface of the isolation structure 12 that is far away from the array substrate 11; the second sacrificial layer is used to increase the distance between the surface of the fifth sub-part 165 in the second encapsulation portion 16 that is close to the array substrate 11 and the surface of the isolation structure 12 that is far away from the array substrate 11.

[0277] Correspondingly, the thickness of the first sacrificial layer and the second sacrificial layer is such that, after the fourth sub-part 152 in the first encapsulation part 15 is located in the first receiving groove 16a, at least a portion of the lower surface of the fourth sub-part 152 near the second light-emitting element 14 has sufficient gap, so that during the fabrication of the second encapsulation part 16, a portion of the encapsulation material is deposited onto the lower surface of the fourth sub-part 152 near the array substrate 11 to form the second sub-part 163 in the second encapsulation part 16, and after the fifth sub-part 165 in the second encapsulation part 16 is located in the second receiving groove 18a, at least a portion of the lower surface of the fifth sub-part 165 near the third light-emitting element 17 has sufficient gap, so that during the subsequent fabrication of the third encapsulation part 18, a portion of the encapsulation material is deposited onto the lower surface of the fifth sub-part 165 near the array substrate 11 to form the seventh sub-part 183 in the third encapsulation part 18.

[0278] This application also provides a display device, including the display panel 10 in any of the above embodiments.

[0279] The display device can be a laptop computer, mobile phone, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, TV monitor, flat panel display, computer monitor, car display (e.g., odometer display), navigator, cockpit controller and / or display, camera view display (e.g., display of a rearview camera in a vehicle), electronic photograph, electronic billboard or sign, projector, etc.

[0280] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Array substrate; An isolation structure is disposed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening; A first light-emitting element, at least a portion of which is disposed within a first isolation opening; A second light-emitting element, at least a portion of which is disposed within a second isolation opening; The first light-emitting element and the second light-emitting element are used to emit light of different colors, respectively; The first packaging portion is disposed on the side of the first light-emitting element away from the array substrate; The second packaging section is disposed on the side of the second light-emitting element away from the array substrate; The first packaging part is connected to the second packaging part.

2. The display panel according to claim 1, characterized in that, At least a portion of the surface of the first package portion near the array substrate is connected to at least a portion of the surface of the second package portion away from the array substrate; Optionally, the second encapsulation portion includes a first main portion and a first sub-portion, a second sub-portion, and a third sub-portion disposed on the side of the isolation structure away from the array substrate; the first main portion covers the surface of the second light-emitting element away from the array substrate and at least a portion of the surface of the second isolation opening; One end of the first sub-part is connected to the first main part, and the other end extends in a direction away from the second isolation opening; the ends of the second sub-part and the third sub-part near the second isolation opening are connected to the end of the first sub-part near the first isolation opening; the second encapsulation part also extends in a direction near the first isolation opening, and the end of the second encapsulation part near the first encapsulation part is provided with a first receiving groove, and the first encapsulation part also extends in a direction near the second encapsulation part and is located in the first receiving groove; the second sub-part and the third sub-part together form the first receiving groove; Optionally, the first encapsulation portion includes a second main portion and a fourth sub-portion disposed on the side of the isolation structure away from the array substrate; the second main portion covers the surface of the first light-emitting element away from the array substrate and at least a portion of the surface of the first isolation opening; one end of the fourth sub-portion is connected to the second main portion, the other end extends in a direction away from the first isolation opening, and the other end is located in the first receiving groove. Optionally, the orthographic projection of the second sub-part on the array substrate is located within the orthographic projection of the third sub-part on the array substrate; Optionally, the surfaces of the second sub-part and the fourth sub-part that are close to the array substrate are spaced apart from the surfaces of the corresponding isolation structures that are away from the array substrate, and the surfaces of the second sub-part and the fourth sub-part that are away from the array substrate are spaced apart from the surfaces of the third sub-part that are close to the array substrate. Optionally, at least a portion of the surface of the second sub-part away from the array substrate is connected to at least a portion of the surface of the fourth sub-part near the array substrate; Optionally, the first distance between the side surface of the second sub-part near the array substrate and the side surface of the isolation structure away from the array substrate is smaller than the second distance between the side surface of the fourth sub-part near the array substrate and the side surface of the isolation structure away from the array substrate. Optionally, the distance between the surface of the third sub-part closer to the array substrate and the surface of the isolation structure farther from the array substrate is greater than the second distance.

3. The display panel according to claim 2, characterized in that, The thickness of the first light-emitting element is greater than the thickness of the second light-emitting element; Optionally, the thickness of the second sub-part is less than the thickness of the fourth sub-part.

4. The display panel according to claim 2, characterized in that, The fourth sub-part includes a first extension connected to the second main part and a first connecting part connected to the first extension; the first connecting part is located within the first receiving groove. Optionally, at least a portion of the surface of the second sub-part away from the array substrate is connected to at least a portion of the surface of the first connecting part near the array substrate; Optionally, the thickness of the second sub-part is less than the thickness of the first connecting part, the thickness of the first connecting part is less than the thickness of the second sub-part, and the thickness of the fourth sub-part is less than the thickness of the second sub-part; Optionally, the distance between the side surface of the first extension near the array substrate and the side surface of the isolation structure away from the array substrate is the same as the second distance; Optionally, the distance between the side surface of the first connection portion near the array substrate and the side surface of the isolation structure away from the array substrate is greater than the second distance and the first distance; Optionally, the distance between the side surface of the first connecting portion near the array substrate and the side surface of the isolation structure away from the array substrate is less than the distance between at least a portion of the surface of the third sub-part near the first isolation opening and the side surface of the first connecting portion away from the array substrate.

5. The display panel according to any one of claims 1-4, characterized in that, The isolation structure is provided with a third isolation opening; the display panel further includes a third light-emitting element and a third encapsulation part, at least a portion of the third light-emitting element is disposed in the third isolation opening, the third light-emitting element is used to emit light of other colors, and the third encapsulation part is disposed on the side of the third light-emitting element away from the array substrate; The third encapsulation portion extends toward the direction of the third isolation opening, and the third encapsulation portion is provided with a second receiving groove at one end near the first encapsulation portion or the second encapsulation portion. The first encapsulation portion or the second encapsulation portion extends toward the direction of the third encapsulation portion and is located in the second receiving groove. Optionally, the fourth sub-part in the first encapsulation portion is located within the second receiving groove, and the fourth sub-part is connected to the second receiving groove.

6. The display panel according to claim 5, characterized in that, The second packaging portion further includes a fifth sub-portion disposed on the side of the isolation structure away from the array substrate; one end of the fifth sub-portion is connected to the first main portion in the second packaging portion, the other end extends in a direction away from the second isolation opening, and the other end is located in the second receiving groove; Optionally, the fifth sub-part is located within the second receiving groove.

7. The display panel according to claim 5, characterized in that, The third encapsulation portion includes a third main portion and a sixth, seventh, and eighth sub-parts disposed on the side of the isolation structure away from the array substrate; the third main portion covers the surface of the third light-emitting element away from the array substrate and at least a portion of the surface of the third isolation opening; One end of the sixth sub-part is connected to the third main part, and the other end extends in a direction away from the third isolation opening; the seventh sub-part and the eighth sub-part are both connected to the end of the sixth sub-part near the third isolation opening, and the seventh sub-part and the eighth sub-part together form the second receiving groove; Optionally, the orthographic projection of the eighth sub-part on the array substrate is located within the orthographic projection of the seventh sub-part on the array substrate; Optionally, the surfaces of the seventh sub-part and the fifth sub-part in the second packaging part that are close to the array substrate are respectively spaced apart from the surfaces of the corresponding isolation structure that are away from the array substrate, and the surfaces of the seventh sub-part and the fifth sub-part that are away from the array substrate are respectively spaced apart from the surfaces of the eighth sub-part that are close to the array substrate. Optionally, at least a portion of the surface of the seventh sub-part away from the array substrate is connected to at least a portion of the surface of the fifth sub-part closer to the array substrate; Optionally, the surface of the seventh sub-part away from the array substrate is not connected to the surface of the fourth sub-part close to the array substrate; Optionally, the thickness of the seventh sub-part is less than the thickness of the fourth sub-part; Optionally, the thickness of the fifth sub-part is less than the thickness of the seventh sub-part; Optionally, the third distance between the side surface of the seventh sub-part near the array substrate and the side surface of the isolation structure away from the array substrate is smaller than the fourth distance between the side surface of the fifth sub-part near the array substrate and the side surface of the isolation structure away from the array substrate. Optionally, the distance between the surface of the eighth sub-part closest to the array substrate and the surface of the isolation structure furthest from the array substrate is greater than the fourth distance; Optionally, organic material and / or cathode material may be present between the side of the sixth sub-section and the seventh sub-section near the array substrate and the side of the isolation structure away from the array substrate.

8. The display panel according to claim 7, characterized in that, The fifth sub-part includes a second extension connected to the first main part in the second encapsulation part and a second connecting part connected to the second extension part; the second connecting part is located within the second receiving groove; Optionally, at least a portion of the surface of the seventh sub-part away from the array substrate is connected to at least a portion of the surface of the second connecting part near the array substrate; Optionally, the thickness of the second connecting portion is greater than the thickness of the seventh sub-part; Optionally, the surface of the seventh sub-part away from the array substrate is not connected to the surface of the fifth sub-part close to the array substrate; Optionally, the distance between the side surface of the second extension near the array substrate and the side surface of the isolation structure away from the array substrate is the same as the fourth distance; Optionally, the distance between the side surface of the second connection portion near the array substrate and the side surface of the isolation structure away from the array substrate is greater than the fourth distance and the third distance; Optionally, the orthographic projection of the second extension on the array substrate is adjacent to the orthographic projection of the second connection portion on the array substrate.

9. The display panel according to claim 7, characterized in that, The fifth sub-part includes a third extension, a third connecting part, and a fourth extension provided on the side of the isolation structure away from the array substrate; one end of the third extension is connected to the first main part in the second encapsulation part, and the third connecting part and the fourth extension are both connected to the end of the third extension near the second isolation opening, and the third connecting part and the fourth extension together form a third receiving groove. Optionally, the fourth sub-part in the first encapsulation portion is located within the third receiving groove; Optionally, the distance between the surface of the third extension near the array substrate and the surface of the isolation structure away from the array substrate is the same as the fourth distance; Optionally, the distance between the surface of the third connection portion near the array substrate and the surface of the isolation structure away from the array substrate is the same as the fourth distance; Optionally, the thickness of the third connecting portion is less than the thickness of the fourth sub-part; Optionally, the distance between the side surface of the fourth extension closest to the array substrate and the side surface of the isolation structure furthest from the array substrate is greater than the fourth distance; Optionally, at least a portion of the surface of the fourth extension near the second isolation opening is spaced apart from at least a portion of the surface of the third connection near the third isolation opening; Optionally, the orthographic projection of the fourth extension on the array substrate is located at the orthographic projection of the third connection on the array substrate.

10. The display panel according to any one of claims 1-4, characterized in that, The first light-emitting element, the second light-emitting element, and the third light-emitting element in the display panel all include a first electrode, a light-emitting functional part, and a second electrode that are sequentially stacked away from the array substrate, and the second electrode is electrically connected to the isolation structure; Optionally, the display panel further includes a pixel defining layer; the pixel defining layer is disposed between the isolation structure and the array substrate; The pixel-defining layer encloses and forms multiple pixel openings; The first light-emitting element, the second light-emitting element, and the third light-emitting element are correspondingly disposed with respect to the plurality of pixel openings, and at least a portion of the first light-emitting element, the second light-emitting element, and the third light-emitting element are disposed within the corresponding pixel openings; Optionally, the first electrode is disposed between the pixel defining layer and the array substrate.

11. A display panel, characterized in that, include: Array substrate; An isolation structure is disposed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening; A first light-emitting element, at least a portion of which is disposed within the first isolation opening; A second light-emitting element, at least a portion of which is disposed within the second isolation opening; the first light-emitting element and the second light-emitting element are respectively used to emit light of different colors; The first packaging portion is disposed on the side of the first light-emitting element away from the array substrate; The second packaging section is disposed on the side of the second light-emitting element away from the array substrate; The second encapsulation portion extends toward the first isolation opening, and the end of the second encapsulation portion near the first encapsulation portion is provided with a first receiving groove, and the end of the first encapsulation portion near the second isolation opening is located in the first receiving groove.

12. A method for manufacturing a display panel, characterized in that, include: Provide array substrate; An isolation structure is formed on one side of the array substrate, and the isolation structure is provided with a first isolation opening and a second isolation opening; A first light-emitting element is formed within the first isolation opening; A first encapsulation portion is formed on the side of the first light-emitting element that is away from the array substrate; A second light-emitting element is formed within the second isolation opening; the first light-emitting element and the second light-emitting element are respectively used to emit light of different colors; A second encapsulation portion is formed on the side of the second light-emitting element that is away from the array substrate; The second encapsulation portion extends toward the first isolation opening, and the second encapsulation portion has a first receiving groove at one end near the first encapsulation portion. The first encapsulation portion also extends toward the second encapsulation portion and is located in the first receiving groove.

13. The preparation method according to claim 12, characterized in that, The second encapsulation portion includes a first main portion and a first sub-portion, a second sub-portion, and a third sub-portion disposed on the side of the isolation structure away from the array substrate; the second encapsulation portion formed on the side of the second light-emitting element away from the array substrate includes: The first main portion is formed on the side surface of the second light-emitting element away from the array substrate and at least a portion of the surface surface of the second isolation opening; one end of the first sub-portion is connected to the first main portion, and the other end extends in a direction away from the second isolation opening; A second sub-part and a third sub-part are formed at the end of the first sub-part near the first isolation opening; the second sub-part and the third sub-part together form the first receiving groove.

14. The preparation method according to claim 12, characterized in that, The isolation structure further includes a third isolation opening; the method further includes: A third light-emitting element is formed within the third isolation opening; A third encapsulation portion is formed on the side of the third light-emitting element that is opposite to the array substrate; the third light-emitting element is used to emit light of other colors; Optionally, the thickness of the first light-emitting element in the first direction, the thickness of the second light-emitting element in the first direction, and the thickness of the third light-emitting element in the first direction are different; the first direction is parallel to the thickness direction of the display panel; Optionally, the thickness of the third light-emitting element in the first direction is less than the thickness of the second light-emitting element in the first direction, and the thickness of the second light-emitting element in the first direction is less than the thickness of the first light-emitting element in the first direction; Optionally, the thickness of the first light-emitting element in the first direction is greater than the thickness of the second light-emitting element and the thickness of the first light-emitting element in the first direction.

15. The preparation method according to claim 12, characterized in that, Before forming the first light-emitting element within the first isolation opening, the method further includes: A first sacrificial layer is formed on at least a portion of the surface of the isolation structure away from the array substrate to increase the distance between the surface of the first package portion near the array substrate and the surface of the isolation structure away from the array substrate. Optionally, before forming at least a portion of the second light-emitting element within the second isolation opening, the method further includes: A second sacrificial layer is formed on at least a portion of the surface of the isolation structure away from the array substrate to increase the distance between the surface of the second package portion near the array substrate and the surface of the isolation structure away from the array substrate.

16. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.

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