Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof, and a display device. The display panel comprises a substrate, and an isolation structure, a first packaging layer, a filling layer and a plurality of light emitting devices which are located on the substrate. The isolation structure encloses a plurality of isolation openings, at least parts of the light emitting devices are located in the isolation openings, the first packaging layer is located on the sides, away from the substrate, of the light emitting devices and comprises a plurality of packaging units, and the packaging units respectively cover the light emitting devices and extend to the sides, away from the substrate, of the isolation structures; the part, located on the side, away from the substrate, of the isolation structure, of the packaging unit is a suspended part, the suspended part and the isolation structure are spaced, and the filling layer is located between at least one suspended part and the isolation structure. In the display panel, the filling layer can support the suspension part, so that the risk that the edge of the prepared packaging unit is damaged in the subsequent preparation process is reduced, and the packaging quality of the display panel is improved.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as simple fabrication process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display capability.

[0003] However, current electronic display products are limited by their structural design, making it difficult to achieve high packaging quality while maintaining a high pixel density (PPI). Summary of the Invention

[0004] This disclosure provides a display panel including a substrate, an isolation structure, a first encapsulation layer, a fill layer, and a plurality of light-emitting devices located on the substrate. The isolation structure encloses a plurality of isolation openings, at least a portion of the light-emitting devices is located in the isolation openings, the first encapsulation layer is located on the side of the light-emitting devices away from the substrate and includes a plurality of encapsulation units, each encapsulation unit covering the light-emitting devices and extending to the side of the isolation structure away from the substrate, the portion of the encapsulation unit on the side of the isolation structure away from the substrate being a suspended portion, the suspended portion being spaced from the isolation structure, and the fill layer being located between at least one suspended portion and the isolation structure.

[0005] In the above scheme, the light-emitting devices are fabricated in batches based on the isolation structure. During this process, the packaging units are also fabricated in batches. In the fabrication process of the light-emitting devices and the first packaging layer, the filling layer can support the suspended part, thereby reducing the risk that the edges of the already fabricated packaging units will be damaged in subsequent fabrication processes, thereby improving the packaging quality of the display panel.

[0006] In one specific embodiment of the first aspect of this disclosure, the filling layer includes a light-emitting material layer and a conductive material layer, with the light-emitting material layer located between the conductive material layer and the isolation structure. It should be noted that, in the etching process of the first encapsulation layer, the conductive material layer can provide a strong barrier effect against the etching material, preventing the etching material from intruding into the interface between the encapsulation unit and the isolation structure (the area of ​​low strength in the encapsulation unit).

[0007] Optionally, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked on a substrate. The light-emitting material layer is on the same layer and made of the same material as the light-emitting functional layer, and the conductive material layer is on the same layer and made of the same material as the second electrode. In this way, the filling layer can be prepared simultaneously during the preparation of the light-emitting device, thereby simplifying the manufacturing process of the display panel and reducing manufacturing costs.

[0008] In one specific embodiment of the first aspect of this disclosure, the filling layer includes a plurality of filling units, each corresponding to at least a portion of the encapsulation units. The orthographic projection of a filling unit on the substrate lies within the orthographic projection of the corresponding encapsulation unit on the substrate. An etching process is required in the fabrication process of the light-emitting device and the first encapsulation layer. This etching process etches the filling units between the encapsulation units and the isolation structure, thereby reducing the size of the filling units. Correspondingly, the filling units can act as sacrificial layers to block the intrusion of etching material, thus protecting the interface (low strength) between the encapsulation units and the isolation structure to ensure the quality of the encapsulation units.

[0009] In one specific embodiment of the first aspect of this disclosure, the isolation structure includes a support portion and a crown portion, the support portion being located between the crown portion and a substrate, the side surface and the surface of the crown portion facing away from the substrate being spaced apart from the suspended portion, and the filling unit being located at least between the side surface of the crown portion and the gap between the suspended portion.

[0010] Optionally, at the location of the filling unit, the filling unit covers the entire side surface of the crown.

[0011] Optionally, a portion of the filling unit covers the side surface of the crown, and another portion extends to the surface of the crown on the side opposite to the substrate and into the gap of the suspended portion.

[0012] In one specific embodiment of the first aspect of this disclosure, a filling unit is provided between each suspended portion and the crown portion. This reduces the risk of edge damage to all encapsulation units throughout the entire manufacturing process of the display panel, thereby ensuring the encapsulation quality of the display panel.

[0013] In another specific embodiment of the first aspect of this disclosure, a plurality of light-emitting devices are classified into a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device that emits light of different colors. A filling unit is provided between the encapsulation unit and the crown corresponding to the first type of light-emitting device.

[0014] In one specific embodiment of the first aspect of this disclosure, the filling unit is disposed only between the encapsulation unit and the crown corresponding to the first type of light-emitting device. The first type of light-emitting device is the first batch of light-emitting devices manufactured. Accordingly, the encapsulation unit corresponding to the first type of light-emitting device undergoes more etching processes, thus posing a greater risk of damage. This solution can solve this problem.

[0015] Optionally, the distance between the orthographic projection of the edge of the encapsulation unit onto the substrate and the orthographic projection of the edge of the crown onto the substrate is a first distance. The first distance at the location of the first type of light-emitting device is greater than the first distance at the location of the second type of light-emitting device, and also greater than the first distance at the location of the third type of light-emitting device. The larger the first distance, the longer the gap between the suspended portion of the encapsulation unit and the isolation structure, thereby allowing the filler unit to have a larger width to increase its resistance to etching. Correspondingly, after the first encapsulation layer and all the light-emitting devices are formed, the filler unit is also easier to retain to support the encapsulation unit.

[0016] Optionally, the first distance between the location of the second type of light-emitting device and the location of the third type of light-emitting device is equal.

[0017] In another specific embodiment of the first aspect of this disclosure, the filling unit is only disposed between the encapsulation unit and the crown corresponding to the first type of light-emitting device and the second type of light-emitting device, respectively. The first type of light-emitting device and the second type of light-emitting device are formed before the third type of light-emitting device. Therefore, in the fabrication process of the light-emitting device and the first encapsulation layer, only the encapsulation unit corresponding to the first type of light-emitting device and the second type of light-emitting device is at risk of over-etching. This solution can completely solve this problem.

[0018] Optionally, the distance between the orthographic projection of the edge of the encapsulation unit onto the substrate and the orthographic projection of the edge of the crown onto the substrate is a first distance. The first distance at the location of the first type of light-emitting device is greater than the first distance at the location of the third type of light-emitting device, and the first distance at the location of the second type of light-emitting device is greater than the first distance at the location of the third type of light-emitting device. The larger the first distance, the longer the gap between the suspended portion of the encapsulation unit and the isolation structure, thereby allowing the filler unit to have a larger width to increase the filler unit's resistance to etching. Correspondingly, after the first encapsulation layer and all the light-emitting devices are formed, the filler unit is also easier to retain to support the encapsulation unit.

[0019] Optionally, the first distance between the location of the first type of light-emitting device and the location of the second type of light-emitting device is greater than the first distance between the location of the second type of light-emitting device, or the first distance between the location of the first type of light-emitting device and the location of the second type of light-emitting device are equal.

[0020] In one specific embodiment of the first aspect of this disclosure, the distance between the orthographic projection of the edge of the packaging unit onto the substrate and the orthographic projection of the edge of the crown onto the substrate is a first distance, and in the region where the filling unit is disposed, the first distance is greater than or equal to 2 micrometers. Under this numerical range, the filling unit can be easily placed in the gap between the suspended portion and the isolation structure to support the edge portion of the packaging unit.

[0021] Optionally, in the area where the filler unit is provided, the first distance is greater than or equal to 6 micrometers. Under this numerical range, it can be ensured that the filler unit has sufficient strength to eliminate the risk of breakage of the suspended portion.

[0022] In one specific embodiment of the first aspect of this disclosure, the orthographic projection of the surface of the crown facing away from the substrate onto the substrate lies within the orthographic projection of the surface of the crown facing the substrate onto the substrate, and the angle between the side surface of the crown and the surface of the substrate is less than or equal to 45 degrees. Under these numerical conditions, during the fabrication of the first encapsulation layer (film deposition process), a relatively large thickness can be achieved at the junction of the encapsulation unit and the crown to enhance the structural strength at the junction of the encapsulation unit and the crown.

[0023] In one specific embodiment of the first aspect of this disclosure, on the side of the crown facing the isolation opening and along a direction parallel to the surface of the substrate, the distance from the gap between the suspended portion and the crown to the farthest part of the crown, and the junction of the side surface of the crown and the surface away from the substrate, is less than or equal to 0.2 micrometers. For example, on the side of the crown facing the isolation opening, the orthographic projection of the gap between the suspended portion and the crown to the farthest part of the crown onto the substrate coincides with the edge of the orthographic projection of the gap between the suspended portion and the crown onto the substrate. Under conditions within this numerical range, during the fabrication of the first encapsulation layer (film deposition process), a relatively large thickness can be achieved at the junction of the encapsulation unit and the crown to enhance the structural strength of the junction between the encapsulation unit and the crown.

[0024] In one specific embodiment of the first aspect of this disclosure, the thickness of the crown is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms. Under these numerical ranges, during the fabrication of the first encapsulation layer (film deposition process), the deposition thickness of the encapsulation unit at the side surface of the crown can be ensured to enhance the structural strength at the junction of the encapsulation unit and the crown, while avoiding excessive length of the portion of the suspended portion corresponding to the side surface of the crown (the greater the length, the smaller the structural strength at the junction of the encapsulation unit and the crown).

[0025] In one specific embodiment of the first aspect of this disclosure, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on a substrate, wherein at least a portion of the light-emitting functional layer and the second electrode of each light-emitting device is located in a corresponding isolation opening.

[0026] Optionally, the second electrode is electrically connected to the isolation structure.

[0027] Optionally, the support portion is a conductive structure, and the second electrode is electrically connected to the sidewall of the support portion. The support portion does not need to consider light transmission, thus allowing for a larger design thickness (greater than the second electrode). That is, the sheet resistance of the support portion is less than the sheet resistance of the second electrode. In this design, the support portion can be connected to the second electrode of the light-emitting device to achieve a common potential, thereby reducing the voltage drop generated on the second electrode.

[0028] Optionally, the orthographic projection of the surface of the support portion away from the substrate onto the substrate lies within the orthographic projection of the crown portion onto the substrate. In this way, the width of the crown portion is greater than the width of the support portion, thereby improving the partitioning effect of the isolation structure.

[0029] In one specific embodiment of the first aspect of this disclosure, the isolation structure further includes a bottom located between the support and the substrate, wherein the orthographic projection of the support on the substrate is located within the orthographic projection of the bottom on the substrate.

[0030] Optionally, the bottom is a conductive structure, and the second electrode makes electrical contact with the portion of the bottom surface facing away from the substrate that is not covered by the support portion. Compared to the sidewall of the support portion, the second electrode is more easily deposited on the surface area of ​​the bottom facing away from the substrate, thereby reducing the impedance at the connection between the second electrode and the isolation structure.

[0031] Optionally, the orthographic projection of the bottom on the substrate lies within the orthographic projection of the crown on the substrate.

[0032] In one specific embodiment of the first aspect of this disclosure, the display panel further includes a pixel defining layer located on a substrate and including a plurality of pixel openings. The pixel openings communicate with corresponding isolation openings. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located within the pixel openings, and the pixel openings expose at least a portion of the first electrode. The pixel defining layer can space the conductive isolation structure and the first electrode of the light-emitting device, thereby allowing the gap between the light-emitting devices to have a smaller design size, thereby increasing the pixel density (PPI) of the display panel.

[0033] Optionally, the first electrode is located between the pixel defining layer and the substrate, and the pixel defining layer covers the edge of the first electrode.

[0034] Optionally, the isolation structure is located on the side of the pixel defining layer away from the substrate, or the pixel defining layer is provided with a clearance opening, and the isolation structure is located in the clearance opening.

[0035] Optionally, the pixel defining layer is an inorganic film layer. In the process of fabricating light-emitting devices based on the isolation structure, the pixel defining layer does not need to be thick enough to accommodate the light-emitting device, which is beneficial for the thinner and lighter design of the display panel. In addition, as an inorganic film layer, the pixel defining layer can have a high bonding strength with the isolation structure and the first electrode, thereby reducing the risk of the isolation structure and the first electrode falling off. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel.

[0036] A second aspect of this disclosure provides a display panel including a substrate, an isolation structure, a first encapsulation layer, and a plurality of light-emitting devices located on the substrate. The isolation structure encloses a plurality of isolation openings and includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate. At least a portion of the light-emitting devices is located within the isolation openings. The first encapsulation layer is located on the side of the light-emitting devices facing away from the substrate and includes a plurality of encapsulation units. Each encapsulation unit covers the light-emitting device and extends to the side of the isolation structure facing away from the substrate. The portion of each encapsulation unit on the side of the isolation structure facing away from the substrate is a suspended portion. The side surface of the crown portion and the surface facing away from the substrate are spaced apart from the suspended portion. On the side of the crown portion facing the isolation openings and along a direction parallel to the surface of the substrate, the gap between the suspended portion and the crown portion, extending to the farthest part of the crown portion, and the distance at the junction of the side surface of the crown portion and the surface facing away from the substrate portion, is less than or equal to 0.2 micrometers.

[0037] In the above scheme, the light-emitting devices are fabricated in batches based on the isolation structure. During this process, the packaging units are also fabricated in batches. In the fabrication process of the light-emitting devices and the first packaging layer, by limiting the structural relationship between the packaging unit and the crown of the first packaging layer within this numerical range, a relatively large thickness can be achieved at the junction of the packaging unit and the crown. This enhances the structural strength at the junction of the packaging unit and the crown, thereby reducing the risk of the edges of the already fabricated packaging units being damaged in subsequent fabrication processes, and improving the packaging quality of the display panel.

[0038] In one specific embodiment of the second aspect of this disclosure, the distance between the orthographic projection of the edge of the packaging unit onto the substrate and the orthographic projection of the edge of the crown onto the substrate is a first distance, which is greater than or equal to 2 micrometers at the location of at least one packaging unit. Optionally, the first distance is greater than or equal to 6 micrometers at the location of at least one packaging unit. Under this numerical range, it can be ensured that a residual film layer (e.g., the filling unit described above) remains at the gap between the packaging unit and the crown to support the suspended portion, thereby eliminating the risk of breakage of the suspended portion.

[0039] In one specific embodiment of the second aspect of this disclosure, the orthographic projection of the surface of the crown away from the substrate onto the substrate is located within the orthographic projection of the surface of the crown facing the substrate onto the substrate, and the angle between the side surface of the crown and the surface of the substrate is less than or equal to 45 degrees.

[0040] In one specific embodiment of the second aspect of this disclosure, the thickness of the crown is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms.

[0041] This disclosure provides a method for fabricating a display panel, the method comprising: providing a substrate and forming a plurality of spaced-apart first electrodes on the substrate; forming an isolation structure on the substrate on which the first electrodes are formed, the isolation structure including a support portion and a crown portion, the support portion being located between the crown portion and the substrate, and the support portion and the crown portion enclosing a plurality of isolation openings, the isolation openings corresponding to the first electrodes respectively; depositing a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation openings, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation openings respectively form a light-emitting functional layer and a second electrode, the first electrodes, the light-emitting functional layer and the second electrode stacked on each other constitute a light-emitting device, and the portions of the light-emitting material thin film and the conductive material thin film located on the isolation structure form a light-emitting functional layer and a second electrode respectively, the first electrodes, the light-emitting functional layer and the second electrode stacked on each other constitute a light-emitting device, and the portions of the light-emitting material thin film and the conductive material thin film located on the isolation structure form a light-emitting functional layer and a second electrode respectively. The process involves: filling a thin film; depositing an encapsulation material film to cover the light-emitting device and the filler film; forming a photoresist layer on the encapsulation material film and patterning the photoresist layer to form a photoresist pattern, which covers a portion of the isolation opening; etching the encapsulation material film, the filler film, and the light-emitting device based on the photoresist pattern, wherein the remaining portion of the encapsulation material film forms an encapsulation unit, the edge of the encapsulation unit is located on the side of the isolation structure away from the substrate to form a suspended portion, the filler film is formed as a filler unit located between the suspended portion and the isolation structure, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched; repeating the above process to form the light-emitting device and the encapsulation unit at the isolation opening where no light-emitting device is formed, all the encapsulation units constitute the first encapsulation layer, and all the filler units form a filler layer. In the display panel obtained by this fabrication method, the light-emitting device is fabricated in batches based on the isolation structure, and the encapsulation units are also fabricated in batches during this process. During the fabrication of the light-emitting device and the first encapsulation layer, the filler layer can support the suspended portion, thereby reducing the risk of the edges of the already fabricated encapsulation units being damaged in subsequent fabrication processes, thereby improving the encapsulation quality of the display panel.

[0042] In one specific embodiment of the third aspect of this disclosure, a plurality of light-emitting devices are classified into a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device that emits light of different colors. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are formed sequentially from first to last. A filling unit is formed between the encapsulation unit and the crown corresponding to the first type of light-emitting device.

[0043] In one specific embodiment of the third aspect of this disclosure, the distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. The preparation method includes: making the first distance between the location of the first type of light-emitting device greater than the first distance between the location of the second type of light-emitting device and the first distance between the location of the third type of light-emitting device, so that in the etching process of preparing the packaging unit corresponding to the second type of light-emitting device and the packaging unit corresponding to the third type of light-emitting device, the portion of the filling film located between the packaging unit corresponding to the second type of light-emitting device and the crown is removed, and the portion of the filling film located between the packaging unit corresponding to the third type of light-emitting device and the crown is also removed.

[0044] In one specific embodiment of the third aspect of this disclosure, the distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. The preparation method includes: making the first distance between the location of the first type of light-emitting device greater than the first distance between the location of the third type of light-emitting device, and the first distance between the location of the second type of light-emitting device greater than the first distance between the location of the third type of light-emitting device, so as to remove the portion of the filling film located between the packaging unit corresponding to the third type of light-emitting device and the crown in the etching process of preparing the packaging unit corresponding to the third type of light-emitting device.

[0045] The fourth aspect of this disclosure is a display device, which includes the display panel described in the first or second aspect above, or a display panel obtained by the preparation method described in the third aspect above. Attached Figure Description

[0046] Figure 1 This is a schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0047] Figure 2 for Figure 1 The image shows an enlarged view of area S1 of the display panel in one design.

[0048] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the display panel along MN.

[0049] Figure 4 for Figure 3 The diagram shows a partial enlarged view of the display panel structure, where filling units are not shown.

[0050] Figure 5 for Figure 2 The diagram shows a cross-sectional view of the display panel along MN in another design.

[0051] Figure 6 for Figure 2The diagram shows a cross-sectional view of the display panel along MN in another design.

[0052] Figure 7 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present disclosure.

[0053] Figures 8A to 8H An embodiment of this disclosure provides a method for forming such Figure 3 The diagram shows a process diagram of one method for manufacturing a display panel.

[0054] Figure 9 This is a schematic diagram showing the positional relationship between a portion of a film layer in a display panel and the vapor deposition source during vapor deposition, according to an embodiment of this disclosure.

[0055] Explanation of reference numerals in the attached figures:

[0056] 10-Display panel; 11-Display area; 12-Border area; 100-Substrate; 200-Light-emitting device; 210-First electrode; 220-Light-emitting functional layer; 221-First functional layer; 222-Light-emitting layer; 223-Second functional layer; 230-Second electrode; 300-Isolation structure; 301-Isolation opening; 302-Pixel opening; 310-Support portion; 310a-First material layer; 320-Crown portion; 320a-Second material layer; 330-Pixel defining layer; 330a-Pixel defining material layer; 340-Bottom; 400-Encapsulation structure; 410-First encapsulation layer; 410a-Encapsulation material film layer; 411-Encapsulation unit; 4111-Suspension portion; 420-Second encapsulation layer; 430-Third encapsulation layer; 500-Filling layer; 500a-Filling film; 510-Filling unit; 600-Photoresist pattern. Detailed Implementation

[0057] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this specification.

[0058] In some scenarios, functional films in light-emitting devices are formed by vapor deposition. Each light-emitting device has multiple functional films, and the material composition of some functional films (such as the light-emitting layer) in light-emitting devices that emit different light is different. Therefore, when vapor deposition of these functional films using a mask (such as a fine mask), multiple alignments are required. To solve the positional offset problem caused by alignment accuracy errors, sufficient space (a safety margin related to alignment errors) needs to be reserved between different light-emitting devices to ensure that the actual light-emitting area of ​​the light-emitting device can have a certain overlap with the designed position (design area). This is equivalent to compressing the designed area of ​​the light-emitting area of ​​the light-emitting device, which not only limits the light-emitting area of ​​the light-emitting device, but also prevents the arrangement density of the light-emitting devices from being further increased, thus making it difficult to further improve the PPI (pixel density) of the display panel.

[0059] In the embodiments of this disclosure, by providing an isolation structure at the gap between the light-emitting devices, the functional film layers of adjacent light-emitting devices are separated. Thus, in the evaporation process of the functional film layers, only the entire display panel needs to be evaporated, without the need to individually prepare the functional film layer for each light-emitting device using a mask. This process does not require consideration of alignment accuracy during evaporation, thereby allowing the gaps between the light-emitting devices to be designed to be smaller, increasing the PPI (the principle of which can be found in the following...). Figures 8A to 8H (Related descriptions in the relevant embodiments).

[0060] It should be noted that when fabricating the light-emitting device based on the above isolation structure, the corresponding packaging unit will be fabricated simultaneously. However, the edge of the packaging unit will be spaced from the isolation structure (the principle can be found in [reference needed]). Figures 8A to 8H (See the relevant descriptions in the related embodiments). Thus, during the manufacturing process of the display panel, the edges of the encapsulation unit are easily damaged.

[0061] At least one embodiment of this disclosure provides a display panel, a method for manufacturing the same, and a display device, to at least solve the aforementioned technical problems. The display panel includes a substrate, an isolation structure, a first encapsulation layer, a filler layer, and multiple light-emitting devices located on the substrate. The isolation structure encloses multiple isolation openings, with at least a portion of the light-emitting devices located within these openings. The first encapsulation layer is located on the side of the light-emitting devices facing away from the substrate and includes multiple encapsulation units. Each encapsulation unit covers the light-emitting devices and extends to the side of the isolation structure facing away from the substrate. A portion of each encapsulation unit on the side of the isolation structure facing away from the substrate is a suspended portion, spaced from the isolation structure. The filler layer is located between at least one suspended portion and the isolation structure. In this display panel, the light-emitting devices are manufactured in batches based on the isolation structure. During this process, the encapsulation units are also manufactured in batches. During the manufacturing of the light-emitting devices and the first encapsulation layer, the filler layer can support the suspended portions, thereby reducing the risk of damage to the edges of the already manufactured encapsulation units in subsequent manufacturing processes, thus improving the encapsulation quality of the display panel.

[0062] The structure of a display panel according to at least one embodiment of the present disclosure will now be described in detail with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the plane of the substrate, and the Z-axis is perpendicular to the plane of the substrate.

[0063] like Figures 1 to 4 As shown, the planar area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (also called sub-pixels, etc.) can be arranged in the display area 11, such as P1, P2, P3 sub-pixels. The physical structure of the sub-pixel can be the light-emitting device in the following embodiment. Adjacent sub-pixels with different emitted light colors constitute a pixel (also called a pixel unit, large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI.

[0064] The physical structure of the display panel 10 may include a substrate 100 and an isolation structure 300, a first encapsulation layer 410, a filler layer 500, and a plurality of light-emitting devices 200 located on the substrate 100. The isolation structure 300 encloses a plurality of isolation openings 301, at least a portion of the light-emitting devices 200 is located in the isolation openings 301. The first encapsulation layer 410 is located on the side of the light-emitting devices 200 away from the substrate 100 and includes a plurality of encapsulation units 411. The encapsulation units 411 respectively cover the light-emitting devices 200 and extend to the side of the isolation structure 300 away from the substrate 100. The portion of the encapsulation unit 411 located on the side of the isolation structure 300 away from the substrate 100 is a suspended portion 4111. The suspended portion 4111 is spaced apart from the isolation structure 300. The filler layer 500 is located between at least one suspended portion 4111 and the isolation structure 300.

[0065] In cases where the light-emitting device 200 is divided into multiple types that emit different colors of light, the light-emitting devices 200 that emit different colors of light are manufactured independently. However, the film layer (evaporated film layer, such as the light-emitting functional layer, etc.) in each light-emitting device 200 is vapor-deposited on the entire display panel during the vapor deposition process. For example, the light-emitting device 200 is classified into a first type of light-emitting device (P1), a second type of light-emitting device (P2), and a third type of light-emitting device (P3) that emit different colors of light. During the manufacturing process, light-emitting devices P1, P2, and P3 are prepared sequentially. When preparing light-emitting device P1, a light-emitting device P1 is formed in each isolation opening 301. A first encapsulation layer 410 is prepared on the display panel to cover the light-emitting device P2. Then, the first encapsulation layer 410, as well as the second electrode and light-emitting functional layer of the light-emitting device P1, are removed from some of the isolation openings 301 (used to form light-emitting devices P2 and P3 in the final product) to obtain an encapsulation unit 411. In this process, the encapsulation unit 411 is used to protect the light-emitting devices P1 in other isolation openings 301. Based on this method, light-emitting devices P2 and P3 are then prepared sequentially, ultimately forming a display panel as shown in the image. Figure 3 The first encapsulation layer 410 shown, that is, the first encapsulation layer 410 on the entire display panel, is obtained by multiple processes. This process can be found below. Figures 8A to 8H The relevant descriptions in the embodiments are not repeated here.

[0066] For example, the first type of light-emitting device (P1), the second type of light-emitting device (P2), and the third type of light-emitting device (P3) can emit red light, green light, and blue light respectively (in no particular order).

[0067] It should be noted that in the above process, because the film layers used to form the structure of the light-emitting device 200 are separated by the isolation structure 300, these film layers are deposited on the display panel in their entirety. That is, these film layers cover the isolation structure 300. In the etching process for forming the encapsulation unit 411, the etching material etches the portion of the film layer covering the isolation structure 300, thereby making the edge portion of the encapsulation unit 411 suspended, thus forming the suspended portion 4111. When preparing the light-emitting devices P2 and P3 and their corresponding encapsulation units 411, the encapsulation unit 411 corresponding to the light-emitting device P1 is repeatedly etched, which leads to a decrease in the structural strength of the encapsulation unit 411. At the initial suspended position of the suspended portion 4111 of the encapsulation unit 411 (the position where it intersects with the isolation structure 300), the film formation conditions of the encapsulation unit 411 are poor, resulting in weak structural strength. Under the above-mentioned repeated etching, the risk of breakage of the suspended portion 4111 increases. In the above-described solution of this disclosure, by providing a filling layer 500 between the suspended portion 4111 and the isolation structure 300 to support the suspended portion 4111, the etching material is prevented from eroding the junction of the suspended portion 4111 and the isolation structure 300 from the gap between the suspended portion 4111 and the isolation structure 300, and the suspended portion 4111 can be supported, thereby reducing the risk of breakage of the suspended portion 4111.

[0068] It should be noted that the composition and preparation of the isolation structure 300 (which may be referred to as a partition structure or isolation column) can also be found in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN20 The relevant explanations in 24 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A will not be repeated here.

[0069] In at least one embodiment of this disclosure, the filling layer 500 includes a light-emitting material layer and a conductive material layer, with the light-emitting material layer located between the conductive material layer and the isolation structure 300. This allows the filling layer to be fabricated using materials already used in the existing manufacturing process of the display panel, thereby reducing the manufacturing cost of the display panel. It should be noted that in the etching process of the first encapsulation layer 410, the conductive material layer can provide a strong barrier effect against the etching material, preventing the etching material from penetrating the interface between the encapsulation unit 411 and the isolation structure 300 (the area of ​​low strength in the encapsulation unit 411).

[0070] For example, the light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 sequentially stacked on a substrate 100. The light-emitting material layer and the light-emitting functional layer 220 are co-layered and made of the same material, and the conductive material layer and the second electrode 230 are co-layered and made of the same material. It should be noted that "co-layered" here means that the light-emitting material layer and the light-emitting functional layer are formed from the same film layer, and the conductive material layer and the second electrode are formed from the same film layer. For example, furthermore, the light-emitting material layer and the light-emitting functional layer 220 can be formed in the same fabrication process, and the conductive material layer and the second electrode 230 can be formed in the same fabrication process. In this way, the filling layer 500 can be fabricated simultaneously during the preparation of the light-emitting device 200, thereby simplifying the fabrication process of the display panel and reducing manufacturing costs.

[0071] For example, the light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223, which are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since charge carriers (holes and electrons) mainly crosstalk between adjacent light-emitting devices 200 through the first functional layer 221, the isolation structure 300 needs to ensure that the first functional layers 221 of each light-emitting device 200 are electrically disconnected from each other.

[0072] For example, in at least one embodiment of this disclosure, the first electrode 210 may be configured as an anode and the second electrode 230 may be configured as a cathode.

[0073] For example, for the filling unit 510 and the light-emitting device 200 corresponding to the same packaging unit 411, the light-emitting material layer and the light-emitting functional layer are on the same layer and made of the same material, and the conductive material layer and the second electrode are on the same layer and made of the same material. This setting is related to the process method of fabricating the light-emitting device 200 based on the isolation structure 300, which can be seen in the following details. Figures 8A to 8H The relevant descriptions in the embodiments are not repeated here.

[0074] In at least one embodiment of this disclosure, such as Figure 3As shown, the filling layer 500 includes a plurality of filling units 510, each corresponding to at least a portion of the encapsulation units 411. The orthographic projection of the filling unit 510 on the substrate 100 lies within the orthographic projection of the corresponding encapsulation unit 411 on the substrate 100. An etching process is required in the fabrication process of the light-emitting device 200 and the first encapsulation layer 410. This etching process etches the filling units 510 between the encapsulation unit 411 and the isolation structure 300, thereby reducing the size of the filling units 510. Correspondingly, the filling units 510 can act as a sacrificial layer to block the intrusion of etching material, thus protecting the junction (low strength) between the encapsulation unit 411 and the isolation structure 300 to ensure the quality of the encapsulation unit 411. This process can be seen below. Figures 8A to 8H The relevant descriptions in the embodiments are not repeated here.

[0075] In at least one embodiment of this disclosure, such as Figure 3 and Figure 4 As shown, the isolation structure 300 includes a support portion 310 and a crown portion 320. For example, the orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. That is, the isolation structure 300 is generally wider at the top and narrower at the bottom. Therefore, when some film layers (such as the light-emitting functional layer 220) in the light-emitting device 200 are deposited, these film layers will be broken at the edge of the isolation structure 300 to reduce the risk of crosstalk between adjacent light-emitting devices 200.

[0076] In at least one embodiment of this disclosure, such as Figure 3 and Figure 4 As shown, the support portion 310 is located between the crown portion 320 and the substrate 100. The side surface of the crown portion 320 and the surface facing away from the substrate 100 are spaced apart from the suspended portion 4111. The filling unit 510 is located at least between the side surface of the crown portion 320 and the gap between the suspended portion 4111.

[0077] For example, such as Figure 3 As shown, at the location of the filling unit 510, the filling unit 510 covers the entire side surface of the crown 320.

[0078] For example, such as Figure 3 As shown, a portion of the filling unit 510 covers the side surface of the crown 320, and another portion extends to the surface of the crown 320 facing away from the substrate 100 and into the gap of the suspended portion 4111.

[0079] The aforementioned positional relationship between the crown 320 and the filling unit 510 is related to the fabrication process of the light-emitting device 200 based on the isolation structure 300, as detailed below. Figures 8A to 8H The relevant descriptions in the embodiments are not repeated here.

[0080] In the embodiments of this disclosure, the risk of the encapsulation unit 411 being etched and damaged mainly comes from the etching process of the subsequent batch of light-emitting devices 200 and other encapsulation units 411. Correspondingly, the earlier the encapsulation unit 411 is formed, the more times it is subjected to the etching process, and thus the more likely the suspended portion 4111 will break. Therefore, based on the risk of breakage of the suspended portion 4111 of different batches of encapsulation units 411, the filling unit 510 can be set below the suspended portion 4111 of the encapsulation unit 411 in which batch.

[0081] In some embodiments of this disclosure, such as Figure 3 As shown, a filling unit 510 is provided between each suspended portion 4111 and the crown portion 320. In this way, the risk of damage to the edges of all encapsulation units 411 can be reduced throughout the entire manufacturing process of the display panel, thereby ensuring the encapsulation quality of the display panel.

[0082] In other embodiments of this disclosure, a plurality of light-emitting devices 200 are classified into a first type of light-emitting device P1, a second type of light-emitting device P2 and a third type of light-emitting device P3 that emit light of different colors, and at least a filling unit 510 is provided between the encapsulation unit 411 and the crown 320 corresponding to the first type of light-emitting device P1.

[0083] For example, in some examples of this disclosure, the filling unit 510 is only disposed between the encapsulation unit 411 corresponding to the first type of light-emitting device P1 and the crown 320. The first type of light-emitting device P1 is the first batch of light-emitting devices 200 prepared. Accordingly, the encapsulation unit 411 corresponding to the first type of light-emitting device P1 has to undergo more etching processes, thus posing a greater risk of damage. This solution can solve this problem.

[0084] For example, when the filling unit 510 is only disposed between the encapsulation unit 411 corresponding to the first type of light-emitting device P1 and the crown 320, the distance between the orthographic projection of the edge of the encapsulation unit 411 on the substrate 100 and the orthographic projection of the edge of the crown 320 on the substrate 100 is a first distance L1. The first distance L1 at the location of the first type of light-emitting device P1 is greater than the first distance L1 at the location of the second type of light-emitting device P2, and is also greater than the first distance L1 at the location of the third type of light-emitting device P3. The larger the first distance L1 is, the longer the gap between the suspended portion 4111 of the encapsulation unit 411 and the isolation structure 300 is, thereby allowing the filling unit 510 to have a larger width to increase the filling unit 510's resistance to etching. Correspondingly, after the first encapsulation layer 410 and all the light-emitting devices 200 are formed, the filling unit 510 is also easier to remain to support the encapsulation unit 411.

[0085] For example, when the filling unit 510 is only disposed between the encapsulation unit 411 and the crown 320 corresponding to the first type of light-emitting device P1, the first distance L1 at the location of the second type of light-emitting device P2 is equal to the first distance L1 at the location of the third type of light-emitting device P3.

[0086] For example, in other examples of this disclosure, the filling unit 510 is only disposed between the encapsulation unit 411 corresponding to the first type of light-emitting device P1 and the second type of light-emitting device P2, respectively, and the crown 320. The first type of light-emitting device P1 and the second type of light-emitting device P2 are formed before the third type of light-emitting device P3. Therefore, in the fabrication process of the light-emitting device 200 and the first encapsulation layer 410, only the encapsulation unit 411 corresponding to the first type of light-emitting device P1 and the second type of light-emitting device is at risk of over-etching. This solution can completely solve this problem.

[0087] For example, when the filling unit 510 is only disposed between the encapsulation unit 411 and the crown 320 corresponding to the first type of light-emitting device P1 and the second type of light-emitting device P2, the distance between the orthographic projection of the edge of the encapsulation unit 411 on the substrate 100 and the orthographic projection of the edge of the crown 320 on the substrate 100 is a first distance L1. The first distance L1 at the location of the first type of light-emitting device P1 is greater than the first distance L1 at the location of the third type of light-emitting device P3, and the first distance L1 at the location of the second type of light-emitting device P2 is greater than the first distance L1 at the location of the third type of light-emitting device P3. The larger the first distance L1 is, the longer the gap between the suspended portion 4111 of the encapsulation unit 411 and the isolation structure 300 is, thereby allowing the filling unit 510 to have a larger width to increase the filling unit 510's resistance to etching. Correspondingly, after the first encapsulation layer 410 and all the light-emitting devices 200 are formed, the filling unit 510 is also easier to remain to support the encapsulation unit 411.

[0088] For example, when the filling unit 510 is only disposed between the encapsulation unit 411 and the crown 320 corresponding to the first type of light-emitting device P1 and the second type of light-emitting device P2 respectively, the first distance L1 at the location of the first type of light-emitting device P1 is greater than the first distance L1 at the location of the second type of light-emitting device P2, or the first distance L1 at the location of the first type of light-emitting device P1 is equal to the first distance L1 at the location of the second type of light-emitting device P2.

[0089] In the embodiments of this disclosure, the size of the remaining filling unit 510 and the structural strength of the suspended portion 4111 can be controlled by setting the structural parameters between the suspended portion 4111 and the crown portion 320. These structural parameters will now be described by way of example.

[0090] In at least one embodiment of this disclosure, such as Figure 4As shown, the distance between the orthographic projection of the edge of the packaging unit 411 onto the substrate 100 and the orthographic projection of the edge of the crown 320 onto the substrate 100 is a first distance L1. In the area where the filling unit 510 is provided, the first distance L1 is greater than or equal to 2 micrometers. Under this numerical range, the filling unit 510 can be easily placed in the gap between the suspended portion 4111 and the isolation structure 300 to support the edge portion of the packaging unit 411.

[0091] For example, in the area where the filling unit 510 is provided, the first distance L1 is greater than or equal to 6 micrometers. Under this numerical range, it can be ensured that the filling unit 510 has sufficient strength to eliminate the risk of breakage of the suspended portion 4111.

[0092] In at least one embodiment of this disclosure, such as Figure 4 As shown, the orthographic projection of the surface of the crown 320 facing away from the substrate 100 onto the substrate 100 lies within the orthographic projection of the surface of the crown 320 facing the substrate 100 onto the substrate 100, and the angle Q between the side surface of the crown 320 and the surface of the substrate 100 is less than or equal to 45 degrees. Under these conditions, during the fabrication of the first encapsulation layer 410 (film deposition process), a relatively large thickness can be achieved at the junction of the encapsulation unit 411 and the crown 320 to enhance the structural strength at the junction of the encapsulation unit 411 and the crown 320.

[0093] In at least one embodiment of this disclosure, such as Figure 4 As shown, on the side of the crown 320 facing the isolation opening 301 and along a direction parallel to the surface of the substrate 100, the distance L2 between the gap between the suspended portion 4111 and the crown 320 up to the farthest part of the crown 320 (actually the inflection point of the suspended portion 4111, where the structural strength is low), and the junction of the side surface of the crown 320 and the surface away from the substrate 100, is less than or equal to 0.2 micrometers. It should be noted that on the side of the crown 320 facing the isolation opening, the orthographic projection of the gap between the suspended portion 4111 and the crown 320 up to the farthest part of the crown 320 onto the substrate 100 coincides with the edge of the orthographic projection of the gap between the suspended portion 4111 and the crown 320 onto the substrate 100. Under these numerical conditions, during the preparation of the first encapsulation layer 410 (film formation process), a relatively large thickness can be achieved at the junction of the encapsulation unit 411 and the crown 320 to enhance the structural strength of the junction between the encapsulation unit 411 and the crown 320.

[0094] In at least one embodiment of this disclosure, such as Figure 4As shown, the thickness H of the crown 320 is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms. Under these numerical conditions, during the fabrication of the first encapsulation layer 410 (film deposition process), the deposition thickness of the encapsulation unit 411 at the side surface of the crown 320 can be ensured to enhance the structural strength at the junction of the encapsulation unit 411 and the crown 320, and to avoid the length of the portion of the suspended portion 4111 corresponding to the side surface of the crown 320 being too large (the larger the length, the smaller the structural strength at the junction of the encapsulation unit 411 and the crown 320).

[0095] The specific design of the isolation structure and the arrangement relationship between the isolation structure and the light-emitting device will be explained through different embodiments below.

[0096] See again for at least one embodiment of this disclosure. Figure 3 The light-emitting device 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 stacked sequentially on a substrate 100. At least a portion of the light-emitting functional layer 220 and the second electrode 230 of each light-emitting device 200 are located in a corresponding isolation opening 301.

[0097] For example, the second electrode 230 is electrically connected to the isolation structure 300. In this way, the second electrodes 230 of multiple light-emitting devices 200 are electrically connected through the isolation structure 300 to form a common electrode, thereby alleviating the voltage drop problem generated when driving the second electrode 230.

[0098] For example, the support portion 310 is a conductive structure, and the second electrode 230 is electrically connected to the sidewall of the support portion 310. The support portion 310 is designed without considering light transmission, thus allowing for a larger design thickness (greater than the second electrode 230). That is, the sheet resistance of the support portion 310 is less than the sheet resistance of the second electrode 230. In this design, the support portion 310 can be connected to the second electrode 230 of the light-emitting device 200 to achieve a common potential, thereby reducing the voltage drop across the second electrode 230.

[0099] For example, the orthographic projection of the surface of the support portion 310 away from the substrate 100 onto the substrate 100 lies within the orthographic projection of the crown portion 320 onto the substrate 100. Thus, the width of the crown portion 320 is greater than the width of the support portion 310, thereby improving the partitioning effect of the isolation structure 300.

[0100] In at least one embodiment of this disclosure, such as Figure 5 As shown, the isolation structure 300 also includes a bottom 340, which is located between the support portion 310 and the substrate 100. The orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the bottom 340 on the substrate 100.

[0101] For example, the bottom 340 is a conductive structure, and the second electrode 230 is in electrical contact with the portion of the bottom 340's surface facing away from the substrate 100 that is not covered by the support portion 310. The second electrode 230 is more easily deposited on the surface area of ​​the bottom 340 facing away from the substrate 100 compared to the sidewall of the support portion 310, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0102] For example, the orthographic projection of the bottom 340 onto the substrate 100 lies within the orthographic projection of the crown 320 onto the substrate 100. In this way, the blocking effect of the isolation structure 300 on the light-emitting functional layer 220 can be increased.

[0103] For example, the materials for the bottom 340, the support 310, and the crown 320 can be molybdenum, aluminum, and titanium, respectively, with the corrosion resistance of aluminum, molybdenum, and titanium increasing in that order. During etching, the film formed by these materials can form a film such as... Figure 5 The isolation structure 300 is shown.

[0104] In embodiments of this disclosure, the isolation structure is used to connect the second electrode. To avoid the isolation structure from being connected to the first electrode, the size of the first electrode can be reduced to be spaced apart from the isolation structure, or an insulating layer can be provided between the first electrode and the isolation structure.

[0105] In at least one embodiment of this disclosure, such as Figure 5 As shown, the display panel also includes a pixel defining layer 330, which is located on the substrate 100 and includes a plurality of pixel openings 302. Each pixel opening 302 communicates with a corresponding isolation opening 301. At least a portion of the light-emitting functional layer 220 and at least a portion of the second electrode 230 are located within the pixel openings 302, and the pixel openings 302 expose at least a portion of the first electrode 210. The pixel defining layer 330 can space the conductive isolation structure 300 and the first electrode 210 of the light-emitting device 200, thereby allowing the gap between the light-emitting devices 200 to have a smaller design size, thus increasing the pixel density (PPI) of the display panel.

[0106] For example, the first electrode 210 is located between the pixel defining layer 330 and the substrate 100, and the pixel defining layer 330 covers the edge of the first electrode 210. When the pixel defining layer 330 is provided in the display panel, the first electrode 210 of the light-emitting device 200 can be designed to have a larger area to avoid positional misalignment (error caused by process precision) between the first electrode 210 and the isolation structure 300 during actual manufacturing, which would make it difficult to guarantee the actual light-emitting area of ​​the light-emitting device, thereby improving the aperture ratio (related to the light-emitting area of ​​the light-emitting device) and brightness of the displayed image of the display panel. For example, without the pixel defining layer 330, to avoid connection between the first electrode 210 and the isolation structure 300, the design area of ​​the first electrode 210 is limited. If the position of the first electrode 210 is misaligned, the light-emitting area of ​​the light-emitting device may be smaller than the designed area (the light-emitting area expected during design), resulting in a decrease in the brightness of the light-emitting device.

[0107] For example, the isolation structure 300 is located on the side of the pixel defining layer 330 facing away from the substrate 100, specifically as follows: Figure 5 As shown; or, the pixel defining layer 330 is provided with a clearance opening, and the isolation structure 300 is located in the clearance opening. In this way, the overall height of the isolation structure 300 (the distance from its surface away from the substrate to the substrate) can be reduced, so as to increase the viewing angle of the display panel and facilitate the thinner and lighter design of the display panel.

[0108] For example, the pixel defining layer 330 is an inorganic film layer. In the process of fabricating the light-emitting device 200 based on the isolation structure 300, the pixel defining layer 330 does not need to be thick enough to accommodate the light-emitting device 200, which is beneficial for the thinner and lighter design of the display panel. In addition, as an inorganic film layer, the pixel defining layer 330 can have a high bonding strength with the isolation structure 300 and the first electrode 210, thereby reducing the risk of the isolation structure 300 and the first electrode 210 falling off. Furthermore, the high density of the inorganic film layer can more effectively block the intrusion of water, oxygen, etc., thereby improving the encapsulation effect of the display panel. Moreover, when the pixel defining layer 330 is an inorganic layer, it can have a smaller thickness, thereby reducing the discontinuity at the edge of the pixel opening 302, improving the film continuity of the second electrode 230 at that location, reducing the impedance of the second electrode 230, and thus ensuring the display effect of the display panel.

[0109] In at least one embodiment of this disclosure, such as Figure 6 As shown, the display panel also includes a second encapsulation layer 420 located on the side of the first encapsulation layer 410 away from the substrate 100.

[0110] In at least one embodiment of this disclosure, the display panel further includes a second encapsulation layer 420 and a third encapsulation layer 430 covering the first encapsulation layer 410. The second encapsulation layer 420 is located between the first encapsulation layer 410 and the third encapsulation layer 430, and the third encapsulation layer 430 is located on the side of the second encapsulation layer 420 facing away from the substrate 100. The first encapsulation layer 410, the second encapsulation layer 420, and the third encapsulation layer 430 constitute an encapsulation structure 400. Optionally, the second encapsulation layer 420 is a planarization layer. Optionally, the second encapsulation layer 420 is an organic film layer, and the third encapsulation layer 430 is an inorganic film layer. Optionally, the second encapsulation layer 420 and the third encapsulation layer 430 are continuous film layers. The second encapsulation layer 420 can improve the flatness of the display panel surface, so as to facilitate the placement of other components on the encapsulation layer. In addition, the second encapsulation layer 420 can have a certain degree of flexibility to relieve the stress of the first encapsulation layer 410 and the third encapsulation layer 430, thereby improving the reliability of the display panel and making it more suitable for application in the field of flexible displays. Furthermore, the third encapsulation layer 430 has high density and a high barrier effect against water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so as to facilitate the fabrication of other components (such as touch-related structures, optical films, etc.) on it.

[0111] In at least one embodiment of this disclosure, such as Figure 6 As shown, the display panel may include a substrate and a driving circuit layer located on the substrate. The driving circuit layer includes multiple pixel driving circuits located in the display area, and the display functional layer is located on the side of the driving circuit layer away from the substrate. For example, the pixel driving circuit may include multiple transistors (TFTs), capacitors, etc., and may be formed in various forms such as 2T1C (i.e., 2 transistors (TFTs) and 1 capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting device 200 in the display functional layer to control the switching state and brightness of the light-emitting device 200.

[0112] At least one embodiment of this disclosure provides a display panel including a substrate, an isolation structure, a first encapsulation layer, and a plurality of light-emitting devices located on the substrate. The isolation structure encloses a plurality of isolation openings and includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate. At least a portion of the light-emitting devices is located within the isolation openings. The first encapsulation layer is located on the side of the light-emitting devices facing away from the substrate and includes a plurality of encapsulation units. Each encapsulation unit covers the light-emitting device and extends to the side of the isolation structure facing away from the substrate. The portion of the encapsulation unit on the side of the isolation structure facing away from the substrate is a suspended portion. The side surface of the crown portion and the surface facing away from the substrate are spaced apart from the suspended portion. On the side of the crown portion facing the isolation openings and along a direction parallel to the surface of the substrate, the gap between the suspended portion and the crown portion, extending to the farthest part of the crown portion, and the distance at the junction of the side surface of the crown portion and the surface facing away from the substrate portion, is less than or equal to 0.2 micrometers. In this display panel, the light-emitting devices are fabricated in batches based on an isolation structure. During this process, encapsulation units are also fabricated in batches. During the fabrication of the light-emitting devices and the first encapsulation layer, by limiting the structural relationship between the encapsulation units and the crown within a specific numerical range, a relatively large thickness can be achieved at the interface between the encapsulation unit and the crown. This enhances the structural strength at the interface, reducing the risk of damage to the edges of the fabricated encapsulation units in subsequent fabrication processes, thereby improving the encapsulation quality of the display panel. The structure of this display panel, the problems it solves, and potential further designs can be found at least in the foregoing. Figure 4 The relevant descriptions in the related embodiments will not be repeated here.

[0113] In at least one embodiment of this disclosure, the distance between the orthographic projection of the edge of the encapsulation unit onto the substrate and the orthographic projection of the edge of the crown onto the substrate is a first distance, which is greater than or equal to 2 micrometers at the location of at least one encapsulation unit. Optionally, the first distance is greater than or equal to 6 micrometers at the location of at least one encapsulation unit. Under this numerical range, it can be ensured that a residual film layer (e.g., the aforementioned filling unit) remains at the gap between the encapsulation unit and the crown to support the suspended portion, thereby eliminating the risk of breakage of the suspended portion. It should be noted that the "at least one encapsulation unit" must at least correspond to a light-emitting device not manufactured in the last batch, such as the first type of light-emitting device and / or the second type of light-emitting device mentioned in the foregoing embodiments. For example, the "at least one encapsulation unit" refers to all encapsulation units, thereby corresponding to all types of light-emitting devices; or, the "at least one encapsulation unit" refers only to the light-emitting unit corresponding to the first type of light-emitting device and / or the second type of light-emitting device. It should be noted that the structure of the display panel, the problems solved, and further designs can be found at least in the foregoing. Figure 4 The relevant descriptions in the related embodiments will not be repeated here.

[0114] At least one embodiment of this disclosure provides a method for manufacturing the above-described display panel, the method including, for example, Figure 7 Steps S100 to S700 are as follows.

[0115] S100 provides a substrate and forms a plurality of first electrodes spaced apart from each other on the substrate.

[0116] S200, an isolation structure is formed on a substrate on which a first electrode is formed. The isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate, and the support portion and the crown portion enclose a plurality of isolation openings, which correspond to the first electrode respectively.

[0117] S300, depositing a light-emitting material thin film and a conductive material thin film, the light-emitting material thin film and the conductive material thin film covering the isolation structure and the isolation opening, wherein the portions of the light-emitting material thin film and the conductive material thin film located in the isolation opening respectively form a light-emitting functional layer and a second electrode, the first electrode, the light-emitting functional layer and the second electrode stacked on each other constitute a light-emitting device, and the portions of the light-emitting material thin film and the conductive material thin film located on the isolation structure form a filling film.

[0118] S400 involves depositing encapsulation material layers to cover the light-emitting device and fill the thin film.

[0119] S500 forms a photoresist layer on the packaging material film layer and performs a patterning process on the photoresist layer to form a photoresist pattern, which covers part of the isolation opening.

[0120] S600 is based on photoresist pattern etching of encapsulation material film, filling film and light-emitting device, wherein the remaining part of the encapsulation material film is formed as encapsulation unit, the edge part of the encapsulation unit is located on the side of the isolation structure away from the substrate to form a suspended part, the filling film is formed as a filling unit located between the suspended part and the isolation structure, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched.

[0121] S700, repeat the above process to form a light-emitting device and a packaging unit at the isolation opening where no light-emitting device is formed, all the packaging units constitute the first packaging layer, and all the filling units form a filling layer.

[0122] In the display panel obtained in steps S100 to S700 above, the light-emitting devices are fabricated in batches based on an isolation structure. During this process, encapsulation units are also fabricated in batches. During the fabrication of the light-emitting devices and the first encapsulation layer, the filler layer can support the suspended portions, thereby reducing the risk of damage to the edges of the already fabricated encapsulation units in subsequent fabrication processes, thus improving the encapsulation quality of the display panel. The specific structure of the display panel obtained by this fabrication method, the technical problems it solves, and the corresponding technical effects can be found in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0123] For example, in the preparation method of steps S100 to S700 above, multiple light-emitting devices are classified into a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device that emits light of different colors. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are formed sequentially from first to last. A filling unit is formed between the encapsulation unit and the crown corresponding to the first type of light-emitting device. The structure of the display panel under this structure can be referred to the relevant description in the foregoing embodiments, and will not be repeated here.

[0124] For example, in the preparation method of steps S100 to S700 above, the distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. The preparation method may further include: making the first distance of the location of the first type of light-emitting device greater than the first distance of the location of the second type of light-emitting device and greater than the first distance of the location of the third type of light-emitting device, so as to remove the portion of the filling film located between the packaging unit corresponding to the second type of light-emitting device and the crown, and remove the portion of the filling film located between the packaging unit corresponding to the third type of light-emitting device and the crown in the etching process of preparing the packaging unit corresponding to the second type of light-emitting device and the packaging unit corresponding to the third type of light-emitting device.

[0125] For example, in the preparation method of steps S100 to S700 above, the distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. The preparation method may further include: making the first distance of the location of the first type of light-emitting device greater than the first distance of the location of the third type of light-emitting device, and the first distance of the location of the second type of light-emitting device greater than the first distance of the location of the third type of light-emitting device, so as to remove the portion of the filling film located between the packaging unit corresponding to the third type of light-emitting device and the crown in the etching process of preparing the packaging unit corresponding to the third type of light-emitting device.

[0126] Below, as follows Figure 3 Taking the display panel shown as an example, the method for manufacturing the display panel will be explained by way of example.

[0127] like Figure 8AAs shown, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100.

[0128] like Figure 8B As shown, a pixel defining material layer 330a is formed on a substrate 100 on which the first electrode 210 is formed.

[0129] like Figure 8C As shown, a first material layer 310a and a second material layer 320a are formed on the pixel defining material layer 330a.

[0130] For example, the material of the first material layer 310a can be aluminum, and the material of the second material layer 320a can be titanium.

[0131] like Figure 8D As shown, the first material layer 310a and the second material layer 320a are patterned such that the first material layer 310a is formed as a support portion 310 and the second material layer 320a is formed as a crown portion 320. The support portion 310 and the crown portion 320 define the isolation opening 301 and constitute at least a portion of the isolation structure 300.

[0132] In embodiments of this disclosure, the patterning process can be a photolithographic patterning process, which may include, for example, coating a structural layer to be patterned with photoresist, exposing the photoresist using a photomask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern described below) includes photoresist, the structural layer can be directly exposed using a photomask to form the desired pattern.

[0133] It should be noted that if the corrosion resistance of the second material layer 320a (e.g., titanium) is greater than that of the first material layer 310a (e.g., aluminum), the etching rate of the first material layer 310a will be greater than that of the second material layer 320a. This will result in the width of the crown 320 being greater than the width of the support portion 310, thus forming a structure as described above. Figure 8D The structure shown.

[0134] like Figure 8E As shown, a patterning process is performed on the pixel defining material layer 330a based on the isolation structure 300 to form a pixel defining layer 330. The pixel defining layer 330 covers the gap between adjacent first electrodes 210, so that the planar shape of the pixel defining layer 330 is a grid.

[0135] like Figure 8FAs shown, a light-emitting material thin film and a conductive material thin film are vapor-deposited on the substrate 100 to form a light-emitting functional layer 220 and a second electrode 230 in each isolation opening 301 of the isolation structure 300. The first electrode 210, the light-emitting functional layer 220 and the second electrode 230 stacked on each other at the isolation opening 301 form a light-emitting device 200. No mask is used in the vapor deposition process, so the vapor-deposited material will also be deposited on the crown 320. It should be noted that in the actual process, the vapor-deposited material will be deposited on the upper surface of the crown 320 away from the substrate 100 and on the sidewalls (not shown in the figure) to form a filling film 500a. Then, an encapsulation material film layer 410a is deposited to cover the light-emitting device 200 and the isolation structure 300.

[0136] For example, the light-emitting layer in the vapor-deposited light-emitting functional layer 220 can be light of the color corresponding to the first type of light-emitting device P1. That is, in this stage, the first type of light-emitting device P1 is formed in each isolation opening 301 of the isolation structure 300.

[0137] like Figure 8G As shown, a photoresist is formed (e.g., coated) on a substrate 100 on which an encapsulation material film layer 410a is formed, and then a patterning process is performed on it to form a photoresist pattern 600, which only covers a portion of the isolation opening 301 of the isolation structure 300.

[0138] like Figure 8H As shown, the surface of the display panel is etched using the photoresist pattern 600 as a mask to remove the encapsulation material film layer 410a, the filling film 500a, the second electrode 230 and the light-emitting functional layer 220 that are not covered by the photoresist pattern 600. The remaining part of the encapsulation material film layer 410a forms the encapsulation unit of the first encapsulation layer 410, and the remaining part of the filling film 500a forms the filling unit 510. Then, the residual photoresist pattern 600 is removed.

[0139] Repeat the above Figures 8F to 8H The steps are as follows: to form a second type of light-emitting device P2 and a third type of light-emitting device P3 in other isolation openings 301 respectively, and to form as shown in the figure. Figure 3 The display panel shown. The process of forming the second type of light-emitting device P2 and the third type of light-emitting device P3 differs from that of forming the first type of light-emitting device P2 and the third type of light-emitting device P3 in that the isolation opening 301 covered by the photoresist pattern 600 is different.

[0140] like Figure 9As shown, when depositing the light-emitting functional layer (e.g., the first functional layer), if the deposition source P moves to face the isolation structure 300, the boundary of its deposition angle corresponds to lines A1 and A2 on the display panel. That is, the area between lines A1 and A2 will not be deposited in this case. However, the area on the side of lines A1 and A2 away from the isolation structure 300 will be deposited regardless of the position of the deposition source P. In other words, starting from the area of ​​line A1 or line A2, the closer to the isolation structure 300, the smaller the thickness of the light-emitting functional layer.

[0141] At least one embodiment of this disclosure provides a display device, which may include the display panel in the above embodiments or a display panel obtained by the manufacturing method in the above embodiments. For example, the display device may include a touch structure, an optical film (e.g., a microlens, a polarizer), a cover plate, or other structures disposed on the light-emitting side of the display panel.

[0142] For example, the display device can be any product or component with a display function, such as a television, digital camera, mobile phone, watch, tablet computer, laptop computer, or navigator.

[0143] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0144] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

[0145] The above description is merely a preferred embodiment of this specification and is not intended to limit this specification. Any modifications or equivalent substitutions made within the spirit and principles of this specification should be included within the scope of protection of this specification.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings; Multiple light-emitting devices are located on the substrate, and at least a portion of the light-emitting devices are located in the isolation opening; A first encapsulation layer is located on the side of the light-emitting device away from the substrate and includes a plurality of encapsulation units, wherein the encapsulation units respectively cover the light-emitting device and extend to the side of the isolation structure away from the substrate, and the portion of the encapsulation unit located on the side of the isolation structure away from the substrate is a suspended portion, and the suspended portion is spaced apart from the isolation structure. A filling layer is located between at least one of the suspended portions and the isolation structure.

2. The display panel according to claim 1, characterized in that, The filling layer includes a light-emitting material layer and a conductive material layer, wherein the light-emitting material layer is located between the conductive material layer and the isolation structure; Preferably, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate, wherein the light-emitting material layer is in the same layer and made of the same material as the light-emitting functional layer, and the conductive material layer is in the same layer and made of the same material as the second electrode.

3. The display panel according to claim 1 or 2, characterized in that, The filling layer includes a plurality of filling units, each filling unit corresponding to at least a portion of the encapsulation units, and The orthographic projection of the filling unit on the substrate is located within the orthographic projection of the corresponding packaging unit on the substrate.

4. The display panel according to claim 3, characterized in that, The isolation structure includes a support portion and a crown portion, the support portion being located between the crown portion and the substrate, and The side surface of the crown and the surface facing away from the substrate are both spaced from the suspended portion, and the filling unit is located at least between the side surface of the crown and the gap of the suspended portion; Preferably, at the location of the filling unit, the filling unit covers the entire side surface of the crown; More preferably, a portion of the filling unit covers the side surface of the crown, and another portion extends to the surface of the crown facing away from the substrate and into the gap between the suspended portion.

5. The display panel according to claim 4, characterized in that, The filling unit is provided between each of the suspended portions and the crown portion.

6. The display panel according to claim 4, characterized in that, The multiple light-emitting devices are classified into three categories: a first category of light-emitting devices, a second category of light-emitting devices, and a third category of light-emitting devices that emit different colors of light. The filling unit is provided between the encapsulation unit and the crown corresponding to the first type of light-emitting device.

7. The display panel according to claim 6, characterized in that, The filling unit is disposed only between the encapsulation unit and the crown corresponding to the first type of light-emitting device; Preferably, the distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance, and the first distance at the location of the first type of light-emitting device is greater than the first distance at the location of the second type of light-emitting device, and is also greater than the first distance at the location of the third type of light-emitting device. More preferably, the first distance between the location of the second type of light-emitting device and the location of the third type of light-emitting device is equal.

8. The display panel according to claim 6, characterized in that, The filling unit is disposed only between the encapsulation unit and the crown corresponding to the first type of light-emitting device and the second type of light-emitting device, respectively; Preferably, the distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance, the first distance at the location of the first type of light-emitting device is greater than the first distance at the location of the third type of light-emitting device, and the first distance at the location of the second type of light-emitting device is greater than the first distance at the location of the third type of light-emitting device. More preferably, the first distance between the location of the first type of light-emitting device and the location of the second type of light-emitting device is greater than the first distance between the location of the second type of light-emitting device, or the first distance between the location of the first type of light-emitting device and the location of the second type of light-emitting device are equal.

9. The display panel according to claim 4, characterized in that, The distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance, and In the region where the filling unit is provided, the first distance is greater than or equal to 2 micrometers; Preferably, in the region where the filling unit is provided, the first distance is greater than or equal to 6 micrometers.

10. The display panel according to claim 4, characterized in that, The orthographic projection of the surface of the crown away from the substrate onto the substrate is located within the orthographic projection of the surface of the crown facing the substrate onto the substrate, and the angle between the side surface of the crown and the surface of the substrate is less than or equal to 45 degrees.

11. The display panel according to claim 4, characterized in that, On the side of the crown facing the isolation opening and along a direction parallel to the surface of the substrate, the gap between the suspended portion and the crown, up to the farthest part of the crown, and the distance between the suspended portion and the junction of the side surface of the crown and the surface away from the substrate is less than or equal to 0.2 micrometers. Preferably, on the side of the crown facing the isolation opening, the orthographic projection of the gap between the suspended portion and the crown to the farthest part of the crown on the substrate coincides with the edge of the orthographic projection of the gap between the suspended portion and the crown on the substrate.

12. The display panel according to claim 4, characterized in that, The thickness of the crown is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms.

13. The display panel according to claim 4, characterized in that, The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode stacked sequentially on the substrate, wherein at least a portion of the light-emitting functional layer and the second electrode of each light-emitting device are located in the corresponding isolation opening; Preferably, the second electrode is electrically connected to the isolation structure; Preferably, the support portion is a conductive structure, and the second electrode is electrically connected to the side wall of the support portion; Preferably, the orthographic projection of the surface of the support portion away from the substrate onto the substrate is located within the orthographic projection of the crown portion onto the substrate.

14. The display panel according to claim 13, characterized in that, The isolation structure also includes a bottom, which is located between the support and the substrate, and the orthographic projection of the support on the substrate is located within the orthographic projection of the bottom on the substrate. Preferably, the bottom is a conductive structure, and the second electrode is in electrical contact with the portion of the bottom surface facing away from the substrate that is not covered by the support portion; Preferably, the orthographic projection of the bottom on the substrate lies within the orthographic projection of the crown on the substrate.

15. The display panel according to claim 13, characterized in that, The display panel further includes a pixel defining layer, which is located on a substrate and includes a plurality of pixel openings. The pixel openings are in communication with the corresponding isolation openings. At least a portion of the light-emitting functional layer and at least a portion of the second electrode are located in the pixel openings, and the pixel openings expose at least a portion of the first electrode. Preferably, the first electrode is located between the pixel defining layer and the substrate, and the pixel defining layer covers the edge of the first electrode; Preferably, the isolation structure is located on the side of the pixel defining layer opposite to the substrate, or the pixel defining layer is provided with a clearance opening, and the isolation structure is located in the clearance opening; Preferably, the pixel defining layer is an inorganic film layer.

16. A display panel, characterized in that, include: substrate; An isolation structure is located on the substrate and encloses a plurality of isolation openings, wherein the isolation structure includes a support portion and a crown portion, and the support portion is located between the crown portion and the substrate; Multiple light-emitting devices are located on the substrate, and at least a portion of the light-emitting devices are located in the isolation opening; The first encapsulation layer is located on the side of the light-emitting device away from the substrate and includes a plurality of encapsulation units, wherein the encapsulation units respectively cover the light-emitting device and extend to the side of the isolation structure away from the substrate, and the portion of the encapsulation unit located on the side of the isolation structure away from the substrate is a suspended portion, and the side surface of the crown and the surface away from the substrate are spaced apart from the suspended portion. Wherein, on the side of the crown facing the isolation opening and along a direction parallel to the surface of the substrate, the gap between the suspended portion and the crown, up to the farthest part of the crown, and the distance between the crown's side surface and the surface away from the substrate at the junction is less than or equal to 0.2 micrometers.

17. The display panel according to claim 16, characterized in that, The distance between the orthographic projection of the edge of the packaging unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. At the location of at least one of the packaging units, this first distance is greater than or equal to 2 micrometers; preferably, at the location of at least one of the packaging units, this first distance is greater than or equal to 6 micrometers; and / or The orthographic projection of the surface of the crown facing away from the substrate onto the substrate lies within the orthographic projection of the surface of the crown facing the substrate onto the substrate, and the angle between the plane containing the side surface of the crown and the plane containing the substrate is less than or equal to 45 degrees; and / or The thickness of the crown is greater than or equal to 500 angstroms and less than or equal to 1500 angstroms.

18. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, and a plurality of first electrodes spaced apart from each other are formed on the substrate; An isolation structure is formed on the substrate on which the first electrode is formed. The isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate. The support portion and the crown portion enclose a plurality of isolation openings. The isolation openings correspond to the first electrode respectively. A light-emitting material film and a conductive material film are deposited, wherein the light-emitting material film and the conductive material film cover the isolation structure and the isolation opening, wherein the portions of the light-emitting material film and the conductive material film located in the isolation opening respectively form a light-emitting functional layer and a second electrode, the first electrode, the light-emitting functional layer and the second electrode stacked on each other constitute a light-emitting device, and the portions of the light-emitting material film and the conductive material film located on the isolation structure form a filling film; A film of encapsulating material is deposited to cover the light-emitting device and the filler film; A photoresist layer is formed on the encapsulation material film, and the photoresist layer is patterned to form a photoresist pattern, the photoresist pattern covering a portion of the isolation opening; The encapsulation material film, the filling film, and the light-emitting device are etched based on the photoresist pattern, wherein the remaining portion of the encapsulation material film is formed as an encapsulation unit, the edge portion of the encapsulation unit is located on the side of the isolation structure away from the substrate to form a suspended portion, the filling film is formed as a filling unit located between the suspended portion and the isolation structure, and the light-emitting functional layer and the second electrode not covered by the encapsulation unit are etched; and The above process is repeated to form the light-emitting device and the encapsulation unit at the isolation opening where the light-emitting device is not formed, all of the encapsulation units constitute the first encapsulation layer, and all of the filling units form the filling layer.

19. The preparation method according to claim 18, characterized in that, The plurality of light-emitting devices are classified into a first type of light-emitting device, a second type of light-emitting device, and a third type of light-emitting device that emits light of different colors. The first type of light-emitting device, the second type of light-emitting device, and the third type of light-emitting device are formed in sequence from first to last. The filling unit is formed between the encapsulation unit and the crown corresponding to the first type of light-emitting device. Preferably, The distance between the orthographic projection of the edge of the encapsulation unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. The fabrication method includes: making the first distance at the location of the first type of light-emitting device greater than the first distance at the location of the second type of light-emitting device and greater than the first distance at the location of the third type of light-emitting device, so that in the etching process for fabricating the encapsulation unit corresponding to the second type of light-emitting device and the encapsulation unit corresponding to the third type of light-emitting device, the portion of the filling film located between the encapsulation unit corresponding to the second type of light-emitting device and the crown is removed, and the portion of the filling film located between the encapsulation unit corresponding to the third type of light-emitting device and the crown is removed. or, The distance between the orthographic projection of the edge of the encapsulation unit on the substrate and the orthographic projection of the edge of the crown on the substrate is a first distance. The fabrication method includes: making the first distance at the location of the first type of light-emitting device greater than the first distance at the location of the third type of light-emitting device, and the first distance at the location of the second type of light-emitting device greater than the first distance at the location of the third type of light-emitting device, so as to remove the portion of the filling film located between the encapsulation unit corresponding to the third type of light-emitting device and the crown in the etching process of fabricating the encapsulation unit corresponding to the third type of light-emitting device.

20. A display device, characterized in that, The display panel includes any one of claims 1 to 17 or a display panel obtained by the preparation method described in claim 18 or 19.

Images