Display panel, processing method thereof and display device

Abstract

The invention provides a display panel, a processing method thereof and a display device. The display panel comprises a substrate, an isolation structure, a display function layer and a packaging layer. The isolation structure is arranged on one side of the substrate in the thickness direction, and a plurality of first isolation openings are defined by the isolation structure; the display function layer is arranged on one side of the substrate in the thickness direction, the display function layer is located on the side where the isolation structure is located, the display function layer comprises a plurality of first light-emitting units, and the first light-emitting units and the first isolation openings are correspondingly arranged; the packaging layer is located on the side, away from the substrate, of the display function layer, and the packaging layer comprises a plurality of first packaging parts; wherein the orthographic projection of the first light-emitting unit on the substrate is located in the orthographic projection of the corresponding first packaging part on the substrate, and at least two adjacent first packaging parts are connected in at least part of the plurality of first packaging parts. According to the display panel provided by the invention, the use performance of the display device can be improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel, its processing method, and a display device. Background Technology

[0002] Display devices using organic light-emitting diode (OLED) technology have advantages such as good display effect, good heat dissipation, low cost, and small thickness.

[0003] However, the performance of OLED display devices needs further improvement. Summary of the Invention

[0004] The purpose of this application is to provide a display panel, a processing method thereof, and a display device to improve the performance of the display device.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0006] In a first aspect, this application provides a display panel, including a substrate, an isolation structure, a display functional layer, and an encapsulation layer. The isolation structure is disposed on one side of the substrate in the thickness direction and defines a plurality of first isolation openings; the display functional layer is disposed on one side of the substrate in the thickness direction and is located on the side where the isolation structure is located. The display functional layer includes a plurality of first light-emitting units, and the first light-emitting units are correspondingly disposed with respect to the first isolation openings; the encapsulation layer is located on the side of the display functional layer away from the substrate, and the encapsulation layer includes a plurality of first encapsulation portions; wherein the orthographic projection of the first light-emitting unit on the substrate is located within the orthographic projection of the corresponding first encapsulation portion on the substrate, and at least two adjacent first encapsulation portions are connected in at least a portion of the plurality of first encapsulation portions.

[0007] By employing the above technical solution, in at least a portion of the plurality of first packaging portions, at least two adjacent first packaging portions are connected, which can improve the structural strength of the first packaging portions, increase the difficulty of the first packaging portions being damaged, and increase reliability, thereby improving the performance of the display panel.

[0008] Therefore, the display panel provided in this application can improve the performance of the display device.

[0009] In some embodiments, the isolation structure further defines a plurality of second isolation openings, the display functional layer further includes a plurality of second light-emitting units, the second light-emitting units are correspondingly disposed with respect to the second isolation openings, and the encapsulation layer further includes a plurality of second encapsulation portions; wherein, the orthographic projection of the second light-emitting unit on the substrate is located within the orthographic projection of the corresponding second encapsulation portion on the substrate; the first encapsulation portion includes a first edging edge, the first edging edge is located on the side of the isolation structure away from the substrate, and the orthographic projection of the first edging edge on the substrate is located within the orthographic projection of the isolation structure on the substrate; the second encapsulation portion includes a second edging edge, the second edging edge is located on the side of the isolation structure away from the substrate, and the orthographic projection of the second edging edge on the substrate is located within the orthographic projection of the isolation structure on the substrate; the first edging edge and the second edging edge overlap in the thickness direction of the substrate.

[0010] In this way, the overlapping portion between the first and second packaging sections can improve the reliability of both the first and second packaging sections, thereby further enhancing the performance of the display device.

[0011] In some embodiments, the first edge includes a first overlapping portion, the second edge includes a second overlapping portion, the orthographic projection of the first overlapping portion on the substrate coincides with the orthographic projection of the second overlapping portion on the substrate, and the first overlapping portion and the second overlapping portion are spaced apart in the thickness direction of the substrate.

[0012] In this way, the first overlapping part can overlap with the second overlapping part, and the first edge can protect the second edge, or the second edge can protect the first edge.

[0013] In some embodiments, the first overlapping portion is located on the side of the second overlapping portion away from the substrate, or the first overlapping portion is located on the side of the second overlapping portion facing the substrate.

[0014] In this way, the second edge can be formed before the first edge, meaning the second encapsulation portion can be formed before the first encapsulation portion. The first encapsulation portion can then protect the second encapsulation portion, thereby improving the reliability of the second encapsulation portion. Alternatively, the first edge can be formed before the second edge, meaning the first encapsulation portion can be formed before the second encapsulation portion. The second encapsulation portion can then protect the first encapsulation portion, thereby improving the reliability of the first encapsulation portion.

[0015] Optionally, the first isolation opening and the second isolation opening are spaced apart. In the direction of the spacing between the first isolation opening and the second isolation opening, the size of the first overlapping portion and / or the second overlapping portion is a, and the value of a is in the range of: a > 0.5 μm.

[0016] This results in a more reliable display panel as provided in this application.

[0017] In some embodiments, the isolation structure further defines a plurality of second isolation openings, and the display functional layer further includes a plurality of second light-emitting units, which are disposed corresponding to the second isolation openings, and at least a portion of the plurality of first encapsulation portions are disposed around the second isolation openings.

[0018] In this way, the first encapsulation part helps to improve the overall strength of the encapsulation layer.

[0019] Optionally, in at least a portion of the first encapsulation portion surrounding the second isolation opening, at least two adjacent first encapsulation portions are connected.

[0020] This further increases the structural strength of the first encapsulation section, which is beneficial for further improving the overall strength of the encapsulation layer.

[0021] In some embodiments, the isolation structure further defines a plurality of third isolation openings, the display functional layer further includes a plurality of third light-emitting units, the third light-emitting units are correspondingly disposed with respect to the third isolation openings, and the encapsulation layer further includes a plurality of third encapsulation portions; wherein, the orthographic projection of the third light-emitting unit on the substrate is located within the orthographic projection of the corresponding third encapsulation portion on the substrate; the first encapsulation portion includes a first edging edge, the first edging edge is located on the side of the isolation structure away from the substrate, the orthographic projection of the first edging edge on the substrate is located within the orthographic projection of the isolation structure on the substrate, the third encapsulation portion includes a third edging edge, the third edging edge is located on the side of the isolation structure away from the substrate, the orthographic projection of the third edging edge on the substrate is located within the orthographic projection of the isolation structure on the substrate, and the first edging edge and the third edging edge overlap in the thickness direction of the substrate.

[0022] In this way, the overlapping portion between the first and third packaging sections can improve the reliability of both the first and third packaging sections, thereby further enhancing the performance of the display device.

[0023] In some embodiments, the first edge also includes a third overlapping portion, the third edge includes a fourth overlapping portion, the orthographic projection of the third overlapping portion on the substrate coincides with the orthographic projection of the fourth overlapping portion on the substrate, and the third overlapping portion and the fourth overlapping portion are spaced apart in the thickness direction of the substrate.

[0024] In this way, the third overlapping part can overlap with the fourth overlapping part, and the first edge can protect the third edge, or the third edge can protect the first edge.

[0025] In some embodiments, the third overlapping portion is located on the side of the fourth overlapping portion facing the substrate, or the third overlapping portion is located on the side of the fourth overlapping portion away from the substrate.

[0026] In this way, the first edge banding can be formed before the third edge banding, meaning the first encapsulation portion can be formed before the third encapsulation portion. The third encapsulation portion can protect the first encapsulation portion, thereby improving the reliability of the first encapsulation portion. Alternatively, the third edge banding can be formed before the first edge banding, meaning the third encapsulation portion can be formed before the first encapsulation portion. The first encapsulation portion can protect the third encapsulation portion, thereby improving the reliability of the third encapsulation portion.

[0027] Optionally, the first isolation opening and the third isolation opening are spaced apart. In the direction of the spacing between the first isolation opening and the third isolation opening, the size of the third overlapping portion and / or the fourth overlapping portion is b, and the value of b is in the range of: b > 0.5 μm.

[0028] This results in a more reliable display panel as provided in this application.

[0029] In some embodiments, the isolation structure further defines a plurality of third isolation openings, and the display functional layer further includes a plurality of third light-emitting units, which are disposed corresponding to the third isolation openings, and at least a portion of the plurality of first encapsulation portions are disposed around the third isolation openings.

[0030] In this way, the first encapsulation part helps to improve the overall strength of the encapsulation layer.

[0031] In some embodiments, at least two adjacent first encapsulation portions are connected in at least a portion of the first encapsulation portion surrounding the third isolation opening.

[0032] This further increases the structural strength of the first encapsulation section, which is beneficial for further improving the overall strength of the encapsulation layer.

[0033] Multiple first package portions are arranged in an array in a plane perpendicular to the thickness direction of the substrate. A first direction and a second direction are defined to be perpendicular to each other, and the first direction and the second direction are respectively perpendicular to the thickness direction of the substrate. The multiple first package portions are arranged along the first direction and the second direction.

[0034] In this way, the first encapsulation part can be arranged in different ways, which makes it highly adaptable. Furthermore, the first light-emitting unit can also be arranged according to the arrangement of the first encapsulation part.

[0035] Optionally, at least two adjacent first package portions are connected along a first direction, and / or at least two adjacent first package portions are connected along a second direction.

[0036] In this way, the first encapsulation part helps to improve the overall strength of the encapsulation layer.

[0037] Secondly, this application also provides a display panel, including a substrate, an isolation structure, a display functional layer, and an encapsulation layer. The isolation structure is disposed on one side of the substrate in the thickness direction and defines a plurality of first isolation openings; the display functional layer is disposed on one side of the substrate in the thickness direction and is located on the side where the isolation structure is located. The display functional layer includes a plurality of first light-emitting units, and the first light-emitting units are disposed corresponding to the first isolation openings; the encapsulation layer is located on the side of the display functional layer away from the substrate, and the encapsulation layer includes a plurality of first encapsulation portions; wherein, the orthographic projections of at least two first light-emitting units on the substrate are located within the orthographic projection of the same first encapsulation portion on the substrate.

[0038] With the above technical solution, the orthographic projection of at least two first light-emitting units on the substrate is located within the orthographic projection of the same first packaging part on the substrate. That is, the same first packaging part can cover at least two first light-emitting units. The increased area of ​​the first packaging part can improve the structural strength of the first packaging part, increase the difficulty of the first packaging part being damaged, and increase reliability, thereby improving the performance of the display panel.

[0039] Therefore, the display panel provided in this application can improve the performance of the display device.

[0040] Thirdly, this application also provides a method for processing a display panel, the method comprising:

[0041] Provide substrate;

[0042] An isolation structure is formed on the substrate, the isolation structure defining a plurality of first isolation openings;

[0043] A first encapsulation layer is formed on a substrate, and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion. The first encapsulation area includes at least one closed area, and at least two first isolation openings are located within the same closed area in the orthographic projection of the substrate.

[0044] In this way, the display panel processed by the processing method provided in this application can cover at least two first light-emitting units corresponding to the first isolation openings by using the first encapsulation part connected as one piece. The increased area of ​​the first encapsulation part can improve the structural strength of the first encapsulation part, increase the difficulty of the first encapsulation part being damaged, and increase reliability, thereby improving the performance of the display panel.

[0045] In some embodiments, before or after the formation of the first encapsulation layer on the substrate, the processing method provided in this application further includes:

[0046] A second encapsulation layer is formed on a substrate, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion, wherein the orthographic projection of the first encapsulation area on the substrate coincides with the orthographic projection of the second encapsulation area on the substrate.

[0047] In this way, the processing method provided by this application can make the processed second packaging part overlap with the first packaging part, and the first packaging part can protect the second packaging part, or the second packaging part can protect the first packaging part.

[0048] In some embodiments, before or after the formation of the first encapsulation layer on the substrate, the processing method provided in this application further includes:

[0049] A third encapsulation layer is formed on the substrate, and the portion of the third encapsulation layer outside the third encapsulation area is removed to form a third encapsulation portion, wherein the orthographic projection of the first encapsulation area on the substrate coincides with the orthographic projection of the third encapsulation area on the substrate.

[0050] In this way, the processing method provided by this application can make the processed third packaging part overlap with the first packaging part, and the first packaging part can protect the third packaging part, or the third packaging part can protect the first packaging part.

[0051] Fourthly, this application provides a display device including the display panel of the above embodiments. The display device provided by this application has the same technical effects as the above-described display panel, and will not be repeated here. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a cross-sectional view of the display panel provided in an embodiment of this application;

[0054] Figure 2 This is a schematic diagram of the planar structure of the display panel provided in an embodiment of this application;

[0055] Figure 3 This is one of the planar structural schematic diagrams of the first light-emitting unit and the first encapsulation part provided in the embodiments of this application;

[0056] Figure 4 A second schematic diagram of the planar structure of the first light-emitting unit and the first encapsulation part provided in the embodiments of this application;

[0057] Figure 5 A third schematic diagram of the planar structure of the first light-emitting unit and the first encapsulation part provided in the embodiments of this application;

[0058] Figure 6 For along Figure 2 One of the cross-sectional structural diagrams of the middle AA line;

[0059] Figure 7 For along Figure 2 Sectional view of the middle AA line, part two;

[0060] Figure 8 For along Figure 2 Sectional view of line AA, Part 3;

[0061] Figure 9 For along Figure 2 Sectional view of the middle AA line, Part 4;

[0062] Figure 10 For along Figure 2 Fifth sectional view of the AA line;

[0063] Figure 11 For along Figure 2 Sectional view of the middle AA line, Part 6;

[0064] Figure 12 For along Figure 2 Sectional view of the middle AA line, Part 7;

[0065] Figure 13 For along Figure 2 Sectional view of the middle AA line, Part 8;

[0066] Figure 14 One of the flowcharts of the processing method provided in the embodiments of this application;

[0067] Figure 15 A second schematic flowchart illustrating the processing method provided in this application embodiment;

[0068] Figure 16 The third schematic flowchart of the processing method provided in the embodiments of this application;

[0069] Figure 17 The fourth schematic flowchart of the processing method provided in the embodiments of this application;

[0070] Figure 18 Fifth schematic flowchart of the processing method provided in the embodiments of this application;

[0071] Figure 19 A flowchart illustrating the processing method provided in this application embodiment is shown in Figure 6.

[0072] Figure 20 Seventh schematic flowchart of the processing method provided in the embodiments of this application;

[0073] Figure 21Eighth schematic flowchart of the processing method provided in the embodiments of this application;

[0074] Figure 22 This is the ninth flowchart illustrating the processing method provided in the embodiments of this application.

[0075] The following are the labeling elements in the figure:

[0076] 100-substrate;

[0077] 200-Driven Device Layer;

[0078] 300 - Isolation structure; 310 - First isolation opening; 320 - Second isolation opening; 330 - Third isolation opening;

[0079] 400 - Light-emitting unit; 410 - First light-emitting unit; 420 - Second light-emitting unit; 430 - Third light-emitting unit;

[0080] 500 - Encapsulation layer; 510 - First encapsulation part; 511 - First edge; 5111 - First overlapping part; 5112 - Third overlapping part; 520 - Second encapsulation part; 521 - Second edge; 5211 - Second overlapping part; 530 - Third encapsulation part; 531 - Third edge; 5311 - Fourth overlapping part. Detailed Implementation

[0081] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0082] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0083] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0084] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0085] This application provides a display panel, which can be an organic light-emitting diode (OLED) display panel, a micro light-emitting diode (Micro LED / μLED) display panel, or a liquid crystal display (LCD) display panel.

[0086] For example, the display panel of the display device in the present application embodiment can be an OLED display panel, which includes a display substrate and a functional film layer located on the display substrate. The present application does not limit the functional film layer.

[0087] Please see Figure 1 This application provides a display panel, which includes a substrate 100, wherein the substrate 100 has a thickness direction (e.g., Figure 1 A driving device layer 200, an isolation structure 300, a display function layer, and an encapsulation layer 500 are disposed on one side of the driving device layer 200 (in the Z direction). The isolation structure 300 is disposed on the side of the driving device layer 200 facing away from the substrate 100, and the isolation structure 300 defines a plurality of first isolation openings 310.

[0088] The composition and preparation of the isolation structure 300 are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and C. Further descriptions are provided in N117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0089] The display functional layer is disposed on one side of the substrate 100 in the thickness direction, and is located on the side where the isolation structure 300 is located. The display functional layer is also disposed on the side of the driving device layer 200 facing away from the substrate 100. The display functional layer includes a plurality of light-emitting units 400, which may include a first light-emitting unit 410, a second light-emitting unit 420, and a third light-emitting unit 430. The first light-emitting unit 410 is correspondingly disposed with respect to the first isolation opening 310. Among the plurality of light-emitting units 400, a portion is the first light-emitting unit 410, a portion is the second light-emitting unit 420, and the remainder is the third light-emitting unit 430.

[0090] Optionally, the first light-emitting unit 410 can emit green light, the second light-emitting unit 420 can emit blue light, and the third light-emitting unit 430 can emit red light.

[0091] Optionally, the first light-emitting unit 410 can emit red light, the second light-emitting unit 420 can emit green light, and the third light-emitting unit 430 can emit blue light.

[0092] Optionally, the first light-emitting unit 410 can emit blue light, the second light-emitting unit 420 can emit red light, and the third light-emitting unit 430 can emit green light.

[0093] It is understood that the driving device layer 200 can be electrically connected to the light-emitting unit 400 to provide signals to the light-emitting unit 400. The light-emitting unit 400 includes a first electrode, a light-emitting layer, and a second electrode arranged sequentially. The first electrode can be an anode, and the second electrode can be a cathode. The light-emitting layer is formed on the pixel define layer (PDL), and the first electrode is located between the pixel define layer and the driving device layer 200.

[0094] The driving device layer 200 includes multiple insulating film layers and multiple stacked and mutually insulated first metal layer (M1), second metal layer (M2), metal oxide layer (GATO), third metal layer (M3), and fourth metal layer (M4). The first metal layer, second metal layer, metal oxide layer, third metal layer, and fourth metal layer are sequentially disposed in a direction away from the substrate 100. The multiple insulating film layers are, respectively, a first gate dielectric layer (Gate Insulator 1, GL1), a capacitor dielectric layer (CI), a buffer layer, a second gate dielectric layer (Gate Insulator 1, GL2), an interlayer dielectric layer (ILD), a first planarization layer (Planarization 1, PLN1), and a second planarization layer (Planarization 2, PLN2) sequentially disposed in a direction away from the substrate 100.

[0095] The first metal layer is disposed between the first gate dielectric layer and the capacitor dielectric layer, the second metal layer is disposed between the capacitor dielectric layer and the buffer layer, the metal oxide layer is disposed between the second gate dielectric layer and the interlayer dielectric layer, the third metal layer is disposed between the interlayer dielectric layer and the first planarization layer, and the fourth metal layer is disposed between the first planarization layer and the second planarization layer.

[0096] The driving device layer 200 has a multilayer structure, and further includes polysilicon (PSI) and indium gallium zinc oxide (IGZO). The polysilicon is disposed between the substrate 100 and the first gate dielectric layer, the IGZO is disposed between the buffer layer and the second gate dielectric layer, and the first electrode is disposed between the second planarization layer and the pixel definition layer. Furthermore, the substrate 100 has a bottom light-shielding layer opposite to the polysilicon.

[0097] It should be noted that the internal structure of the driving device layer 200 is not shown in the figure.

[0098] The inventors discovered that the encapsulation layer 500 is typically used to encapsulate the light-emitting unit 400 after its formation. After encapsulating the light-emitting unit 400, the encapsulation layer 500 has an edge. This edge is located on the side of the isolation structure 300 opposite to the substrate 100, and the orthographic projection of the edge on the substrate 100 lies within the orthographic projection of the isolation structure 300 on the substrate 100. There is an open gap between the edge and the isolation structure 300. In subsequent processes, the edge is easily damaged, reducing reliability.

[0099] Please refer to the following: Figure 2 , Figure 3 , Figure 4 and Figure 5 To address the aforementioned technical problems, in some embodiments, the encapsulation layer 500 of this application is located on the side of the display functional layer facing away from the substrate 100, and the encapsulation layer 500 includes a plurality of first encapsulation portions 510. The orthographic projection of the first light-emitting unit 410 on the substrate 100 lies within the orthographic projection of the corresponding first encapsulation portion 510 on the substrate 100. At least two adjacent first encapsulation portions 510 are connected in at least a portion of the plurality of first encapsulation portions 510. This can improve the structural strength of the first encapsulation portion 510, increase the difficulty of the first encapsulation portion 510 being damaged, increase reliability, and thus improve the performance of the display panel.

[0100] Therefore, the display panel provided in this application embodiment can improve the performance of the display device.

[0101] In other embodiments, the orthographic projections of at least two first light-emitting units 410 on the substrate 100 lie within the orthographic projection of the same first encapsulation portion 510 on the substrate 100. That is, the same first encapsulation portion can cover at least two first light-emitting units 410. This increases the area of ​​the first encapsulation portion 510, improving its structural strength and making it more difficult to damage, thus increasing reliability and ultimately improving the performance of the display panel.

[0102] Optionally, a plurality of first light-emitting units 410 are arranged in an array in a plane perpendicular to the thickness direction of the substrate 100. For example, the first light-emitting units 410 are arranged along a first direction (e.g., Figure 3 (in the X direction) and the second direction (e.g.) Figure 3 The first direction and the second direction are arranged in the Y direction. The first direction and the second direction are perpendicular to each other and perpendicular to the thickness direction of the substrate 100.

[0103] Correspondingly, multiple first encapsulation portions 510 are arranged in an array in a plane perpendicular to the thickness direction of the substrate 100, wherein the first encapsulation portions 510 are arranged along a first direction and / or a second direction. This allows the first encapsulation portions 510 to have different arrangement methods, providing good applicability. Furthermore, the first light-emitting unit 410 can also be arranged according to the arrangement method of the first encapsulation portions 510.

[0104] Please see Figure 3 For example, in the first direction, at least two adjacent first package portions 510 are connected. Alternatively, in the first direction, every two adjacent first package portions 510 are connected.

[0105] Please see Figure 4 For example, in the second direction, at least two adjacent first package portions 510 are connected. Alternatively, in the second direction, every two adjacent first package portions 510 are connected.

[0106] Please see Figure 5 For example, at least two adjacent first package portions 510 are connected in both the first and second directions. Alternatively, every two adjacent first package portions 510 are connected in both the first and second directions.

[0107] In this way, connecting the different first packaging parts 510 together helps to improve the overall strength of the packaging layer 500.

[0108] For example, at least two adjacent first package portions 510 are integrally connected in at least a portion of the plurality of first package portions 510.

[0109] In other words, the first package portion 510 is integrally formed, which can make the structural strength of the first package portion 510 higher, thereby further increasing reliability.

[0110] Please refer to the following: Figure 1 , Figure 2 , Figure 6 and Figure 7 In some embodiments, the isolation structure 300 defines a plurality of second isolation openings 320, the display functional layer further includes a plurality of second light-emitting units 420, and the encapsulation layer 500 further includes a plurality of second encapsulation portions 520. The second light-emitting units 420 are correspondingly disposed with respect to the second isolation openings 320, and the orthographic projection of the second light-emitting unit 420 on the substrate 100 lies within the orthographic projection of the corresponding second encapsulation portion 520 on the substrate 100.

[0111] The first packaging portion 510 includes a first edge 511, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the first edge 511 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The second packaging portion 520 includes a second edge 521, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the second edge 521 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The first edge 511 and the second edge 521 overlap in the thickness direction of the substrate 100.

[0112] In this way, the first packaging part 510 and the second packaging part 520 have overlapping portions, which can improve the reliability of the first packaging part 510 and the second packaging part 520, thereby further improving the performance of the display device.

[0113] Optionally, the first edge 511 includes a first overlapping portion 5111, and the second edge 521 includes a second overlapping portion 5211. The orthographic projection of the first overlapping portion 5111 on the substrate 100 coincides with the orthographic projection of the second overlapping portion 5211 on the substrate 100. The first overlapping portion 5111 and the second overlapping portion 5211 are spaced apart in the thickness direction of the substrate.

[0114] In this way, the first overlapping portion 5111 can overlap with the second overlapping portion 5211, and the first edge 511 can protect the second edge 521, or the second edge 521 can protect the first edge 511.

[0115] For example, please refer to Figure 6 The first overlapping portion 5111 may be located on the side of the second overlapping portion 5211 facing the substrate 100.

[0116] For example, please refer to Figure 7The first overlapping portion 5111 may also be located on the side of the second overlapping portion 5211 away from the substrate 100.

[0117] It is understood that during the processing of the display panel provided in this application embodiment, the second electrode of the second light-emitting unit 420, the light-emitting layer of the second light-emitting unit 420 and the second encapsulation part 520 are first formed in the second isolation opening 320, and then the second electrode of the first light-emitting unit 410, the light-emitting layer of the first light-emitting unit 410 and the first encapsulation part 510 are formed in the first isolation opening 310.

[0118] In this way, the second edge 521 can be formed before the first edge 511, that is, the second encapsulation part 520 can be formed before the first encapsulation part 510. The first encapsulation part 510 can protect the second encapsulation part 520 to improve the reliability of the second encapsulation part 520.

[0119] Of course, the first edge banding 511 can be formed before the second edge banding 521, that is, the first encapsulation part 510 can be formed before the second encapsulation part 520. The second encapsulation part 520 can protect the first encapsulation part 510 to improve the reliability of the first encapsulation part 510.

[0120] For example, the first isolation opening 310 and the second isolation opening 320 are spaced apart. In the spaced direction of the first isolation opening 310 and the second isolation opening 320, the size of the first overlapping portion 5111 and / or the second overlapping portion 5211 is a, and the value of a is in the range of a > 0.5um.

[0121] It is understandable that the overlap area of ​​the first edge 511 and the second edge 521 is positively correlated with the dimension a. The larger the value of a, the larger the overlap area of ​​the first edge 511 and the second edge 521, thereby improving the reliability of the first encapsulation part 510 or the second encapsulation part 520, and thus improving the reliability of the display panel and the display device.

[0122] For example, the value of 'a' can be: 0.55um, 0.60um, 0.65um, 0.70um, 0.75um, 0.80um, 0.85um, 0.90um, 0.95um, 1.0um, etc.

[0123] Please continue reading. Figure 2 , Figure 6 and Figure 7 In some embodiments, at least a portion of the plurality of first encapsulation portions 510 are disposed around the second isolation opening 320. It is understood that disposing at least a portion of the plurality of first encapsulation portions 510 around the second isolation opening 320 can increase the arrangement area of ​​the first encapsulation portions 510, which is beneficial to improving the overall strength of the encapsulation layer 500.

[0124] Optionally, at least two adjacent first encapsulation portions 510 are connected in at least a portion of the first encapsulation portions 510 surrounding the second isolation opening 320.

[0125] For example, in at least a portion of the first encapsulation portion 510 disposed around the second isolation opening 320, every two adjacent first encapsulation portions 510 are connected.

[0126] For example, a plurality of first edgings 511 of at least a portion of the first encapsulation portion 510 surrounding the second isolation opening 320 can be connected to form an annular body. Optionally, this annular body can overlap with the second encapsulation portion 520. In this way, the structural strength of the first encapsulation portion 510 is further increased, and the overlap area between the first encapsulation portion 510 and the second encapsulation portion 520 can also be increased, thereby further increasing the reliability of the first encapsulation portion 510 or the second encapsulation portion 520.

[0127] Please refer to the following: Figure 1 , Figure 2 , Figure 8 and Figure 9 In some embodiments, the isolation structure 300 further defines a plurality of third isolation openings 330, the display functional layer further includes a plurality of third light-emitting units 430, and the encapsulation layer 500 further includes a plurality of third encapsulation portions 530. The third light-emitting units 430 are correspondingly disposed with respect to the third isolation openings 330, and the orthographic projection of the third light-emitting unit 430 on the substrate 100 lies within the orthographic projection of the corresponding third encapsulation portion 530 on the substrate 100.

[0128] The first packaging portion 510 includes a first edge 511, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the first edge 511 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The third packaging portion 530 includes a third edge 531, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the third edge 531 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The first edge 511 and the third edge 531 overlap in the thickness direction of the substrate 100.

[0129] In this way, the first packaging section 510 and the third packaging section 530 have overlapping portions, which can improve the reliability of the first packaging section 510 and the third packaging section 530, thereby further improving the performance of the display device.

[0130] Optionally, the first edge 511 further includes a third overlapping portion 5112, and the third edge 531 includes a fourth overlapping portion 5311. The orthographic projection of the third overlapping portion 5112 on the substrate 100 coincides with the orthographic projection of the fourth overlapping portion 5311 on the substrate 100. The third overlapping portion 5112 and the fourth overlapping portion 5311 are spaced apart in the thickness direction of the substrate 100.

[0131] In this way, the third overlapping portion 5112 can overlap with the fourth overlapping portion 5311, and the first edge 511 can protect the third edge 531, or the third edge 531 can protect the first edge 511.

[0132] For example, please refer to Figure 8 The third overlapping portion 5112 may be located on the side of the fourth overlapping portion 5311 away from the substrate 100.

[0133] For example, please refer to Figure 9 The third overlapping portion 5112 may also be located on the side of the fourth overlapping portion 5311 facing the substrate 100.

[0134] It is understandable that during the substrate processing of substrate 100, the second electrode of the first light-emitting unit 410, the light-emitting layer of the first light-emitting unit 410 and the first encapsulation part 510 are first formed in the first isolation opening 310, and then the second electrode of the third light-emitting unit 430, the light-emitting layer of the third light-emitting unit 430 and the third encapsulation part 530 are formed in the third isolation opening 330.

[0135] In this way, the first edge 511 can be formed before the third edge 531, that is, the first encapsulation part 510 can be formed before the third encapsulation part 530. The third encapsulation part 530 can protect the first encapsulation part 510 to improve the reliability of the first encapsulation part 510.

[0136] Of course, the third edge 531 can be formed before the first edge 511, that is, the third encapsulation part 530 can be formed before the first encapsulation part 510. The first encapsulation part 510 can protect the third encapsulation part 530 to improve the reliability of the third encapsulation part 530.

[0137] For example, the first isolation opening 310 and the third isolation opening 330 are spaced apart. In the spaced direction of the first isolation opening 310 and the third isolation opening 330, the size of the third overlapping portion 5112 and / or the fourth overlapping portion 5311 is b, and the value of b is in the range of: b > 0.5um.

[0138] For example, the value of b can be: 0.55um, 0.60um, 0.65um, 0.70um, 0.75um, 0.80um, 0.85um, 0.90um, 0.95um, 1.0um, etc.

[0139] It is understandable that the overlap area of ​​the first edge 511 and the third edge 531 is positively correlated with the dimension b. The larger the value of b, the larger the overlap area of ​​the first edge 511 and the third edge 531, thereby improving the reliability of the first encapsulation part 510, and thus improving the reliability of the display panel and the display device.

[0140] Please continue reading. Figure 2 , Figure 8 and Figure 9 In some embodiments, at least a portion of the plurality of first encapsulation portions 510 are disposed around the third isolation opening 330. It is understood that disposing at least a portion of the plurality of first encapsulation portions 510 around the third isolation opening 330 can increase the arrangement area of ​​the first encapsulation portions 510, which is beneficial to improving the overall strength of the encapsulation layer 500.

[0141] Optionally, at least two adjacent first package portions 510 are connected in at least a portion of the first package portions 510 disposed around the third isolation opening 330.

[0142] For example, in at least a portion of the first encapsulation portion 510 disposed around the third isolation opening 330, every two adjacent first encapsulation portions 510 are connected.

[0143] For example, a plurality of first edgings 511 of at least a portion of the first encapsulation portion 510 surrounding the third isolation opening 330 can be connected to form an annular body. Optionally, this annular body overlaps with the third encapsulation portion 530. In this way, the structural strength of the first encapsulation portion 510 is further increased, and the overlap area between the first encapsulation portion 510 and the third encapsulation portion 530 can also be increased, thereby further increasing the reliability of the first encapsulation portion 510 or the third encapsulation portion 530.

[0144] Please refer to the following: Figure 1 , Figure 2 , Figure 10 , Figure 11 , Figure 12 ,and Figure 13In some embodiments, the isolation structure 300 defines a plurality of first isolation openings 310, a plurality of second isolation openings 320, and a plurality of third isolation openings 330. The display functional layer also includes a plurality of first light-emitting units 410, a plurality of second light-emitting units 420, and a plurality of third light-emitting units 430. The first light-emitting units 410 are correspondingly disposed with the first isolation openings 310, the second light-emitting units 420 are correspondingly disposed with the second isolation openings 320, and the third light-emitting units 430 are correspondingly disposed with the third isolation openings 330.

[0145] The encapsulation layer 500 also includes a plurality of first encapsulation portions 510, a plurality of second encapsulation portions 520, and a plurality of third encapsulation portions 530. The orthographic projection of the first light-emitting unit 410 on the substrate 100 is located within the orthographic projection of the corresponding first encapsulation portion 510 on the substrate 100. The orthographic projection of the second light-emitting unit 420 on the substrate 100 is located within the orthographic projection of the corresponding second encapsulation portion 520 on the substrate 100. The orthographic projection of the third light-emitting unit 430 on the substrate 100 is located within the orthographic projection of the corresponding third encapsulation portion 530 on the substrate 100.

[0146] The first packaging portion 510 includes a first edge 511, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the first edge 511 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The second packaging portion 520 includes a second edge 521, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the second edge 521 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The first edge 511 and the second edge 521 overlap in the thickness direction of the substrate 100.

[0147] In addition, the third packaging part 530 includes a third edge 531, which is located on the side of the isolation structure 300 away from the substrate 100. The orthographic projection of the third edge 531 on the substrate 100 is located within the orthographic projection of the isolation structure 300 on the substrate 100. The first edge 511 and the third edge 531 overlap in the thickness direction of the substrate 100.

[0148] In this way, the first packaging section 510 and the second packaging section 520 have overlapping portions, and the first packaging section 510 and the third packaging section 530 also have overlapping portions, which can improve the reliability of the first packaging section 510, the second packaging section 520 and the third packaging section 530, thereby further improving the performance of the display device.

[0149] The first edge 511 includes a first overlapping portion 5111 and a third overlapping portion 5112, the second edge 521 includes a second overlapping portion 5211 that overlaps with the first overlapping portion 5111, and the third edge 531 includes a fourth overlapping portion 5311 that overlaps with the third overlapping portion 5112.

[0150] For example, please refer to Figure 10 The first overlapping portion 5111 is located on the side of the second overlapping portion 5211 away from the substrate 100, and the third overlapping portion 5112 is located on the side of the fourth overlapping portion 5311 facing the substrate.

[0151] For example, please refer to Figure 11 The first overlapping portion 5111 is located on the side of the second overlapping portion 5211 facing the substrate 100, and the third overlapping portion 5112 is located on the side of the fourth overlapping portion 5311 away from the substrate.

[0152] For example, please refer to Figure 12 The first overlapping portion 5111 is located on the side of the second overlapping portion 5211 away from the substrate 100, and the third overlapping portion 5112 is located on the side of the fourth overlapping portion 5311 away from the substrate.

[0153] For example, please refer to Figure 13 The first overlapping portion 5111 is located on the side of the second overlapping portion 5211 facing the substrate 100, and the third overlapping portion 5112 is located on the side of the fourth overlapping portion 5311 facing the substrate.

[0154] Please see Figure 14 In some embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0155] S1 provides a substrate 100.

[0156] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0157] S3, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion 510. The first encapsulation area includes at least one closed area, and at least two first isolation openings 310 are located in the same closed area in the orthographic projection of the substrate.

[0158] In this way, the display panel processed by the processing method provided in this application can cover at least two first light-emitting units 410 corresponding to the first isolation openings 310 by using the first encapsulation part 510 connected as one piece. The increased area of ​​the first encapsulation part 510 can improve the structural strength of the first encapsulation part 510, increase the difficulty of the first encapsulation part 510 being damaged, and increase reliability, thereby improving the performance of the display panel.

[0159] In some embodiments, before or after the formation of the first encapsulation layer on the substrate 100, the processing method provided in this application further includes:

[0160] A second encapsulation layer is formed on the substrate 100. The portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. The orthographic projection of the first encapsulation area on the substrate and the orthographic projection of the second encapsulation area on the substrate partially coincide. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0161] In this way, the processing method provided in this application embodiment can make the processed second packaging part 520 overlap with the first packaging part 510, and the first packaging part 510 can protect the second packaging part 520, or the second packaging part 520 can protect the first packaging part 510.

[0162] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 3 , Figure 4 ,or Figure 5 The display panel shown.

[0163] For example, please refer to Figure 15 In other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0164] S1 provides a substrate 100.

[0165] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0166] S3, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation region is removed to form a first encapsulation portion 510. The first encapsulation region includes at least one closed region, and at least two first isolation openings 310 are located within the same closed region in the orthographic projection of the substrate.

[0167] S4, a second encapsulation layer is formed on the substrate 100, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. The orthographic projection of the first encapsulation area on the substrate 100 coincides with the orthographic projection of the second encapsulation area on the substrate 100. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0168] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 6 The display panel shown.

[0169] For example, please refer to Figure 16 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0170] S1 provides a substrate 100.

[0171] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0172] S3, a second encapsulation layer is formed on the substrate 100, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0173] S4, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion 510. The orthographic projection of the first encapsulation area on the substrate 100 partially overlaps with the orthographic projection of the second encapsulation area on the substrate 100. The first encapsulation area includes at least one closed area, and at least two first isolation openings 310 are located within the same closed area in the orthographic projection of the substrate.

[0174] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 7 The display panel shown.

[0175] In some embodiments, before or after the formation of the first encapsulation layer on the substrate 100, the processing method provided in this application further includes:

[0176] A third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation region is removed to form a third encapsulation portion 530. The orthographic projection of the first encapsulation region on the substrate 100 coincides with the orthographic projection of the third encapsulation region on the substrate 100. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation region.

[0177] In this way, the processing method provided by this application can make the processed third packaging part 530 overlap with the first packaging part 510, and the first packaging part 510 can protect the third packaging part 530, or the third packaging part 530 can protect the first packaging part 510.

[0178] For example, please refer to Figure 17 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0179] S1 provides a substrate 100.

[0180] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0181] S3, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation region is removed to form a first encapsulation portion 510. The first encapsulation region includes at least one closed region, and at least two first isolation openings 310 are located within the same closed region in the orthographic projection of the substrate.

[0182] S4, a third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation region is removed to form a third encapsulation portion 530. The orthographic projection of the first encapsulation region on the substrate 100 coincides with the orthographic projection of the third encapsulation region on the substrate 100. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation region.

[0183] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 9 The display panel shown.

[0184] For example, please refer to Figure 18 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0185] S1 provides a substrate 100.

[0186] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0187] S3, a third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation area is removed to form a third encapsulation portion 530. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation area.

[0188] S4, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion 510. The orthographic projection of the first encapsulation area on the substrate 100 partially overlaps with the orthographic projection of the third encapsulation area on the substrate 100. The first encapsulation area includes at least one closed area, and at least two first isolation openings 310 are located within the same closed area in the orthographic projection of the substrate.

[0189] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 8 The display panel shown.

[0190] For example, please refer to Figure 19 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0191] S1 provides a substrate 100.

[0192] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0193] S3, a second encapsulation layer is formed on the substrate 100, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0194] S4, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion 510. The orthographic projection of the first encapsulation area on the substrate 100 partially overlaps with the orthographic projection of the second encapsulation area on the substrate 100. The first encapsulation area includes at least one closed area, and at least two first isolation openings 310 are located within the same closed area in the orthographic projection of the substrate.

[0195] S5, a third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation region is removed to form a third encapsulation portion 530. The orthographic projection of the first encapsulation region on the substrate 100 coincides with the orthographic projection of the third encapsulation region on the substrate 100. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation region.

[0196] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 10 The display panel shown.

[0197] For example, please refer to Figure 20 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0198] S1 provides a substrate 100.

[0199] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0200] S3, a third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation area is removed to form a third encapsulation portion 530. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation area.

[0201] S4, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion 510. The orthographic projection of the first encapsulation area on the substrate 100 partially overlaps with the orthographic projection of the third encapsulation area on the substrate 100. The first encapsulation area includes at least one closed area, and at least two first isolation openings 310 are located within the same closed area in the orthographic projection of the substrate.

[0202] S5, a second encapsulation layer is formed on the substrate 100, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. The orthographic projection of the first encapsulation area on the substrate 100 and the orthographic projection of the second encapsulation area on the substrate 100 partially coincide. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0203] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 11 The display panel shown.

[0204] For example, please refer to Figure 21 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0205] S1 provides a substrate 100.

[0206] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0207] S3, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation region is removed to form a first encapsulation portion 510. The first encapsulation region includes at least one closed region, and at least two first isolation openings 310 are located within the same closed region in the orthographic projection of the substrate.

[0208] S4, a second encapsulation layer is formed on the substrate 100, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. The orthographic projection of the first encapsulation area on the substrate 100 coincides with the orthographic projection of the second encapsulation area on the substrate 100. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0209] S5, a third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation region is removed to form a third encapsulation portion 530. The orthographic projection of the first encapsulation region on the substrate 100 coincides with the orthographic projection of the third encapsulation region on the substrate 100. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation region.

[0210] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 13 The display panel shown. Furthermore, the order of steps S4 and S5 in the processing method provided in this application embodiment can be interchanged.

[0211] For example, please refer to Figure 22 In some other embodiments, embodiments of this application also provide a method for processing a display panel, the method comprising the following steps:

[0212] S1 provides a substrate 100.

[0213] S2, an isolation structure 300 is formed on the substrate 100, the isolation structure 300 defining a plurality of first isolation openings 310.

[0214] S3, a second encapsulation layer is formed on the substrate 100, and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion 520. Optionally, the orthographic projection of the second isolation opening 320 on the substrate 100 is located within the corresponding second encapsulation area.

[0215] S4, a third encapsulation layer is formed on the substrate 100, and the portion of the third encapsulation layer outside the third encapsulation area is removed to form a third encapsulation portion 530. Optionally, the orthographic projection of the third isolation opening 330 on the substrate 100 is located within the corresponding third encapsulation area.

[0216] S5, a first encapsulation layer is formed on the substrate 100, and the portion of the first encapsulation layer outside the first encapsulation region is removed to form a first encapsulation portion 510. The orthographic projection of the first encapsulation region on the substrate 100 partially overlaps with the orthographic projection of the second encapsulation region on the substrate 100, and the orthographic projection of the first encapsulation region on the substrate 100 partially overlaps with the orthographic projection of the third encapsulation region on the substrate 100. The first encapsulation region includes at least one closed region, and at least two first isolation openings 310 are located within the same closed region in their orthographic projections on the substrate.

[0217] It is understood that the processing method provided in the embodiments of this application produces products such as... Figure 12 The display panel shown. Furthermore, the order of steps S3 and S4 in the processing method provided in this application embodiment can be interchanged.

[0218] The processing methods provided in the above embodiments of this application can integrally form the first packaging part 510 connected together, which can increase the structural strength of the first packaging part 510 and thus further increase its reliability.

[0219] It should be noted that the processing methods provided in the above embodiments of this application can remove the first encapsulation layer, the second encapsulation layer, or the third encapsulation layer by means of patterning, developing, exposure, and etching. Of course, the processing methods provided in the above embodiments of this application can also remove the first encapsulation layer, the second encapsulation layer, or the third encapsulation layer by other processes.

[0220] Optionally, the display panel provided in this application embodiment can be manufactured using the processing method described in the above embodiments.

[0221] This application also provides a display device, which can be a mobile phone, television, tablet computer, laptop computer, desktop computer, vehicle display terminal, wearable device, advertising display device, etc. Optionally, the display device provided in this application includes the display panel of any of the above embodiments. The display device provided in this application has the same or similar technical effects as the display panel of any of the above embodiments, and will not be described again here.

[0222] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate(100); An isolation structure (300) is disposed on one side of the substrate (100) in the thickness direction and defines a plurality of first isolation openings (310); The display functional layer is disposed on one side of the substrate (100) in the thickness direction and on the side where the isolation structure (300) is located. The display functional layer includes a plurality of first light-emitting units (410), and the first light-emitting units (410) are correspondingly disposed with the first isolation opening (310). An encapsulation layer (500) is located on the side of the display functional layer opposite to the substrate (100), and the encapsulation layer (500) includes a plurality of first encapsulation portions (510). Wherein, the orthographic projection of the first light-emitting unit (410) on the substrate (100) is located within the orthographic projection of the corresponding first encapsulation part (510) on the substrate (100), and at least two adjacent first encapsulation parts (510) are connected in at least a portion of the plurality of first encapsulation parts (510).

2. The display panel as described in claim 1, characterized in that, The isolation structure (300) further defines a plurality of second isolation openings (320), the display function layer further includes a plurality of second light-emitting units (420), the second light-emitting units (420) are correspondingly arranged with the second isolation openings (320), and the encapsulation layer (500) further includes a plurality of second encapsulation portions (520); Wherein, the orthographic projection of the second light-emitting unit (420) on the substrate (100) is located within the orthographic projection of the corresponding second encapsulation part (520) on the substrate (100); The first encapsulation portion (510) includes a first edge (511), which is located on the side of the isolation structure (300) away from the substrate (100). The orthographic projection of the first edge (511) on the substrate (100) is located within the orthographic projection of the isolation structure (300) on the substrate (100). The second encapsulation portion (520) includes a second edge (521), which is located on the side of the isolation structure (300) away from the substrate (100). The orthographic projection of the second edge (521) on the substrate (100) is located within the orthographic projection of the isolation structure (300) on the substrate (100). The first edge (511) and the second edge (521) overlap in the thickness direction of the substrate (100).

3. The display panel as described in claim 2, characterized in that, The first edge (511) includes a first overlapping portion (5111), and the second edge (521) includes a second overlapping portion (5211). The orthographic projection of the first overlapping portion (5111) on the substrate (100) coincides with the orthographic projection of the second overlapping portion (5211) on the substrate (100). The first overlapping portion (5111) and the second overlapping portion (5211) are spaced apart in the thickness direction of the substrate (100).

4. The display panel as described in claim 3, characterized in that, The first overlapping portion (5111) is located on the side of the second overlapping portion (5211) away from the substrate (100); or, the first overlapping portion (5111) is located on the side of the second overlapping portion (5211) facing the substrate (100).

5. The display panel as described in claim 3, characterized in that, The first isolation opening (310) and the second isolation opening (320) are spaced apart. Along the length of the line connecting the centers of the first isolation opening (310) and the second isolation opening (320), the size of the first overlapping portion (5111) and / or the second overlapping portion (5211) is a, and the value of a is in the range of: a > 0.5 μm.

6. The display panel as described in claim 1, characterized in that, The isolation structure (300) further defines a plurality of second isolation openings (320), and the display functional layer further includes a plurality of second light-emitting units (420), the second light-emitting units (420) being disposed corresponding to the second isolation openings (320), and at least a portion of the plurality of first encapsulation portions (510) being disposed around the second isolation openings (320).

7. The display panel as described in claim 6, characterized in that, In at least a portion of the first encapsulation portion (510) disposed around the second isolation opening (320), at least two adjacent first encapsulation portions (510) are connected.

8. The display panel as described in any one of claims 1 to 7, characterized in that, The isolation structure (300) further defines a plurality of third isolation openings (330), the display function layer further includes a plurality of third light-emitting units (430), the third light-emitting units (430) are correspondingly arranged with the third isolation openings (330), and the encapsulation layer (500) further includes a plurality of third encapsulation parts (530); Wherein, the orthographic projection of the third light-emitting unit (430) on the substrate (100) is located within the orthographic projection of the corresponding third encapsulation part (530) on the substrate (100); The first encapsulation portion (510) includes a first edge (511), which is located on the side of the isolation structure (300) away from the substrate (100). The orthographic projection of the first edge (511) on the substrate (100) is located within the orthographic projection of the isolation structure (300) on the substrate (100). The third encapsulation portion (530) includes a third edge (531), which is located on the side of the isolation structure (300) away from the substrate (100). The orthographic projection of the third edge (531) on the substrate (100) is located within the orthographic projection of the isolation structure (300) on the substrate (100). The first edge (511) and the third edge (531) overlap in the thickness direction of the substrate (100).

9. The display panel as described in claim 8, characterized in that, The first edge banding (511) further includes a third overlapping portion (5112), and the third edge banding (531) includes a fourth overlapping portion (5311). The orthographic projection of the third overlapping portion (5112) on the substrate (100) coincides with the orthographic projection of the fourth overlapping portion (5311) on the substrate (100). The third overlapping portion (5112) and the fourth overlapping portion (5311) are spaced apart in the thickness direction of the substrate (100).

10. The display panel as claimed in claim 9, characterized in that, The third overlapping portion (5112) is located on the side of the fourth overlapping portion (5311) facing the substrate (100); or, the third overlapping portion (5112) is located on the side of the fourth overlapping portion (5311) away from the substrate (100).

11. The display panel as claimed in claim 9, characterized in that, The first isolation opening (310) and the third isolation opening (330) are spaced apart. Along the length of the line connecting the centers of the first isolation opening (310) and the third isolation opening (330), the size of the third overlapping portion (5112) and / or the fourth overlapping portion (5311) is b, and the value of b is in the range of: b > 0.5 μm.

12. The display panel as claimed in claim 1, characterized in that, The isolation structure (300) further defines a plurality of third isolation openings (330), and the display functional layer further includes a plurality of third light-emitting units (430), the third light-emitting units (430) being disposed corresponding to the third isolation openings (330), and at least a portion of the plurality of first encapsulation portions (510) being disposed around the third isolation openings (330).

13. The display panel as claimed in claim 12, characterized in that, At least two adjacent first encapsulation portions (510) are connected in at least a portion of the first encapsulation portions (510) spaced around the third isolation opening (330).

14. The display panel as claimed in claim 1, characterized in that, The plurality of first packaging portions (510) are arranged in an array in a plane perpendicular to the thickness direction of the substrate (100), and the plurality of first packaging portions (510) are arranged along a first direction and a second direction, wherein the first direction and the second direction are perpendicular to each other, and the first direction and the second direction are respectively perpendicular to the thickness direction of the substrate (100). Preferably, at least two adjacent first encapsulation portions (510) are connected along the first direction, and / or at least two adjacent first encapsulation portions (510) are connected along the second direction.

15. A display panel, characterized in that, include: substrate(100); An isolation structure (300) is disposed on one side of the substrate (100) in the thickness direction and defines a plurality of first isolation openings (310); The display functional layer is disposed on one side of the substrate (100) in the thickness direction and on the side where the isolation structure (300) is located. The display functional layer includes a plurality of first light-emitting units (410), and the first light-emitting units (410) are correspondingly disposed with the first isolation opening (310). An encapsulation layer (500) is located on the side of the display functional layer opposite to the substrate (100), and the encapsulation layer (500) includes a plurality of first encapsulation portions (510). In this case, the orthographic projections of at least two of the first light-emitting units (410) on the substrate (100) are located within the orthographic projection of the same first encapsulation part (510) on the substrate (100).

16. A method for processing a display panel, characterized in that, include: Provide a substrate (100); An isolation structure (300) is formed on the substrate (100), the isolation structure (300) defining a plurality of first isolation openings (310); A first encapsulation layer is formed on the substrate (100), and the portion of the first encapsulation layer outside the first encapsulation area is removed to form a first encapsulation portion (510). The first encapsulation area includes at least one closed area, and at least two first isolation openings (310) are located within the same closed area when projected onto the substrate (100).

17. The processing method as described in claim 16, characterized in that, Before or after the formation of the first encapsulation layer on the substrate (100), the processing method further includes: A second encapsulation layer is formed on the substrate (100), and the portion of the second encapsulation layer outside the second encapsulation area is removed to form a second encapsulation portion (520), wherein the orthographic projection of the first encapsulation area on the substrate (100) coincides with the orthographic projection portion of the second encapsulation area on the substrate (100).

18. The processing method as described in claim 16 or 17, characterized in that, Before or after the formation of the first encapsulation layer on the substrate (100), the processing method further includes: A third encapsulation layer is formed on the substrate (100), and the portion of the third encapsulation layer outside the third encapsulation region is removed to form a third encapsulation portion (530), wherein the orthographic projection of the first encapsulation region on the substrate (100) coincides with the orthographic projection portion of the third encapsulation region on the substrate (100).

19. A display device, characterized in that, Includes the display panel as claimed in any one of claims 1 to 15.

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