Display panel, display device and preparation method of display panel
By incorporating openings and isolation components in the isolation structure, the problem of liquid formulations entering the light-emitting unit is solved, thereby improving the lifespan of the light-emitting unit and the reliability of the display panel.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2026-03-27
AI Technical Summary
During the manufacturing process of the display panel, liquid preparations can easily enter the light-emitting unit through the encapsulation layer, leading to a reduction in the lifespan of the light-emitting unit and display abnormalities.
A first opening is provided in the isolation structure so that moisture in the first planarization layer can be discharged outward through the first opening, and the first planarization layer and the encapsulation layer are isolated by the orthogonal projection of the isolation element on the substrate, thus preventing the absorption of liquid formulation and the entry of moisture.
It improves the lifespan of the light-emitting units, reduces the occurrence of display abnormalities, and enhances the distribution density of the light-emitting units in the display area.
Smart Images

Figure CN121751901A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of display device, in particular to a display panel, a display device and a preparation method of the display panel. BACKGROUND
[0002] Organic light emitting diode (OLED) and display panel based on light emitting diode (LED) technology are widely used in mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display devices.
[0003] In the process of preparing the display panel, part of the display panel is prone to absorb the liquid preparation used in the preparation process, and part of the liquid preparation can enter the light emitting unit of the display panel through the encapsulation layer of the display panel, resulting in reduced service life of the light emitting unit and display abnormalities. SUMMARY
[0004] Embodiments of the present application provide a display panel, a display device and a preparation method of the display panel, aiming to optimize the technical problem of the display panel absorbing the preparation used in the preparation process, resulting in reduced service life of the light emitting unit and display abnormalities.
[0005] Embodiments of the first aspect of the present application provide a display panel, the display panel having a display area and a non-display area, the non-display area being arranged around at least part of the display area; the display panel comprising:
[0006] a substrate;
[0007] a first planar layer arranged on one side of the substrate;
[0008] an isolation structure located on the side of the first planar layer away from the substrate, the isolation structure having a plurality of isolation openings and at least one first opening, the isolation openings being located in the display area, the first opening being located in the non-display area, at least part of the orthographic projection of the first opening on the substrate being located within the orthographic projection of the first planar layer on the substrate;
[0009] a light emitting device layer comprising a plurality of light emitting units located in the display area, at least part of the light emitting units being arranged in the isolation openings, the light emitting units comprising organic electroluminescent material;
[0010] an encapsulation layer located on the side of the isolation structure away from the substrate and covering at least part of the first opening;
[0011] an isolation member located in the non-display area, the isolation member spacing the first planar layer and the encapsulation layer, the orthographic projection of the isolation member on the substrate at least partially overlapping the orthographic projection of the first opening on the substrate.
[0012] According to any one of the preceding embodiments of the first aspect of the application, the spacer comprises an inorganic material.
[0013] According to any one of the preceding embodiments of the first aspect of the application, the display panel further comprises a first electrode layer, the first electrode layer comprising a plurality of first electrodes and at least one spacer electrode, the first electrodes being disposed on a side of the light emitting unit proximate to the substrate, the first electrodes being at least partially overlapped by the projection of the spacer opening on the substrate, the spacer electrode being multiplexed as the spacer.
[0014] According to any one of the preceding embodiments of the first aspect of the application, the display panel further comprises a pixel definition layer, the pixel definition layer being disposed between the substrate and the spacer structure, the pixel definition layer comprising a pixel opening and a second opening, the pixel opening being in communication with the spacer opening, the light emitting unit being at least partially disposed within the pixel opening, the second opening being in communication with the first opening.
[0015] According to any one of the preceding embodiments of the first aspect of the application, the projection of the second opening on the substrate is within the projection of the first opening on the substrate.
[0016] According to any one of the preceding embodiments of the first aspect of the application, the spacer comprises a first surface and a second surface disposed opposite to each other, and a side surface connected to the first surface, the first surface being disposed on a side of the second surface distal to the substrate, the pixel definition layer covering at least part of the side surface.
[0017] According to any one of the preceding embodiments of the first aspect of the application, the pixel definition layer covers part of the first surface.
[0018] According to any one of the preceding embodiments of the first aspect of the application, the plurality of first electrodes and the spacer electrode are spaced apart.
[0019] According to any one of the preceding embodiments of the first aspect of the application, part of the pixel definition layer is between adjacent first electrodes and the spacer electrode.
[0020] According to any one of the preceding embodiments of the first aspect of the application, the pixel definition layer surrounds the spacer electrode.
[0021] According to any one of the preceding embodiments of the first aspect of the application, the at least one spacer electrode is connected to the first electrode.
[0022] According to any one of the preceding embodiments of the first aspect of the application, the first electrode comprises a third surface in contact with the light emitting unit, part of the third surface being covered by the pixel definition layer, the first surface and the third surface being connected to form a plane.
[0023] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a touch layer located on the side of the encapsulation layer away from the substrate. The touch layer includes a plurality of touch units, and the orthographic projection of the touch units on the substrate at least partially overlaps with the orthographic projection of the isolation member on the substrate.
[0024] According to any of the foregoing embodiments of the first aspect of this application, the substrate includes a substrate and a driving circuit layer, the driving circuit layer is disposed between the substrate and the light-emitting device layer, the driving circuit layer includes a plurality of conductive structures, and the orthographic projection of some conductive structures on the substrate at least partially overlaps with the orthographic projection of the insulating member on the substrate.
[0025] According to any of the foregoing embodiments of the first aspect of this application, the isolation electrode is insulated from the driving circuit layer, and the first electrode is electrically connected to the driving circuit layer.
[0026] According to any of the foregoing embodiments of the first aspect of this application, a portion of the encapsulation layer fills the first opening and contacts the surface of the separator away from the substrate.
[0027] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation layer includes a first encapsulation sublayer, the first encapsulation sublayer covering the side of the light-emitting device layer away from the substrate and the side of the isolation structure away from the substrate, and a portion of the first encapsulation sublayer fills the first opening and contacts the surface of the isolation member away from the substrate.
[0028] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation layer further includes a second encapsulation sublayer, which is disposed in the display area and located between the first encapsulation sublayer and the light-emitting unit.
[0029] According to any of the foregoing embodiments of the first aspect of this application, the second encapsulation sublayer includes a plurality of encapsulation portions spaced apart, wherein the orthographic projection of the encapsulation portions onto the substrate covers the orthographic projection of the light-emitting unit onto the substrate.
[0030] According to any of the foregoing embodiments of the first aspect of this application, the first encapsulation sublayer is an organic encapsulation layer, and the first planarization layer is an organic encapsulation layer.
[0031] According to any of the foregoing embodiments of the first aspect of this application, the second encapsulation sublayer is an inorganic material layer.
[0032] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a first conductive layer, the first conductive layer including a first signal line located in a non-display area, a first planarization layer having a third opening, and a portion of an isolation structure located within the third opening and electrically connected to the first signal line.
[0033] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the isolation member on the substrate is located in the orthographic projection of the first signal line on the substrate.
[0034] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the third opening on the substrate is spaced apart from the orthographic projection of the first opening on the substrate.
[0035] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second planarization layer, which is located on the side of the first conductive layer near the substrate.
[0036] According to any of the foregoing embodiments of the first aspect of this application, the first conductive layer further includes a fourth opening penetrating the first signal line, and the first planarization layer and the second planarization layer are in contact through the fourth opening.
[0037] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the first opening on the substrate and the orthographic projection of the fourth opening on the substrate are spaced apart.
[0038] According to any of the foregoing embodiments of the first aspect of this application, a plurality of first openings are alternately spaced along a first direction in the orthographic projection of the substrate and a plurality of third openings are alternately spaced along a first direction in the orthographic projection of the substrate; a plurality of third openings are alternately spaced along a first direction in the orthographic projection of the substrate and a plurality of fourth openings.
[0039] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second electrode layer, the second electrode layer includes a plurality of second electrodes, the second electrodes are disposed on the side of the light-emitting unit away from the substrate, the second electrodes overlap with the isolation structure, and the second electrodes are electrically connected to the isolation structure.
[0040] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first isolation layer and a second isolation layer stacked together, the first isolation layer being disposed on the side of the second isolation layer close to the substrate, and the orthographic projection of the first isolation layer on the substrate being located within the orthographic projection of the second isolation layer on the substrate.
[0041] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the isolation member on the substrate overlaps with the orthographic projection of the isolation structure on the substrate.
[0042] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the first isolation layer on the substrate surrounds and overlaps the orthographic projection of the isolation member on the substrate.
[0043] According to any of the foregoing embodiments of the first aspect of this application, the surface of the second isolation layer facing away from the substrate has a smaller projected area on the substrate than the surface of the second isolation layer facing towards the substrate.
[0044] According to any of the foregoing embodiments of the first aspect of this application, the surface of the first isolation layer facing away from the substrate has a smaller projected area on the substrate than the surface of the second isolation layer facing towards the substrate.
[0045] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second electrode layer located in the display area. The second electrode layer includes a plurality of second electrodes. The second electrodes are disposed on the side of the light-emitting unit away from the substrate. The second electrodes overlap and are electrically connected to the first isolation layer.
[0046] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third isolation layer, which is disposed on the side of the first isolation layer near the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the third isolation layer on the substrate.
[0047] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer, which is disposed between the first planarization layer and the isolation structure. The pixel definition layer includes a pixel opening, which is connected to the isolation opening. At least a portion of the light-emitting unit is disposed within the pixel opening, and a portion of the pixel definition layer is reused as an isolation element.
[0048] A second aspect of this application also provides a display panel having a display area and a non-display area, the non-display area being at least partially disposed around the display area; the display panel includes:
[0049] substrate;
[0050] The first planarization layer is disposed on one side of the substrate;
[0051] A pixel definition layer is located on the side of the first planarization layer away from the substrate. The pixel definition layer includes a plurality of pixel openings and at least one second opening. The pixel openings are located in the display area, the second openings are located in the non-display area, and at least a portion of the orthographic projection of the second opening onto the substrate is located within the orthographic projection of the first planarization layer onto the substrate.
[0052] The light-emitting device layer includes a plurality of light-emitting units located in the display area, at least a portion of which is disposed within a pixel opening, and the light-emitting unit includes an organic electroluminescent material;
[0053] An encapsulation layer is located on the side of the pixel definition layer opposite to the substrate and covers at least part of the second opening;
[0054] An isolator is located in the non-display area, the isolator is spaced between a first planarization layer and an encapsulation layer, and the orthographic projection of the isolator on the substrate at least partially overlaps with the orthographic projection of the second opening on the substrate.
[0055] An embodiment of the third aspect of this application also provides a method for manufacturing a display panel, the display panel having a display area and a non-display area, the non-display area being at least partially disposed around the display area; the manufacturing method includes:
[0056] A substrate is provided, and a first planarization layer is disposed on the substrate;
[0057] A first electrode layer is formed on a first planarization layer. The first electrode layer includes a plurality of first electrodes located in the display area and isolation electrodes located in the non-display area. The isolation electrodes are reused as isolation components.
[0058] An isolation structure is formed on the side of the first electrode layer away from the substrate. The isolation structure has a plurality of isolation openings and at least one first opening. The isolation openings are located in the display area, and the first opening is located in the non-display area. The orthographic projection of the first opening on the substrate at least partially overlaps with the orthographic projection of the isolation electrode on the substrate.
[0059] A light-emitting device layer is provided through an isolation structure. The light-emitting device layer includes a plurality of light-emitting units located in the display area, and at least a portion of the light-emitting units is disposed within the isolation opening.
[0060] An encapsulation layer is formed on the side of the isolation structure away from the substrate, and the isolation element separates the first planarization layer and the encapsulation layer.
[0061] According to any of the foregoing embodiments of the third aspect of this application, after forming the first electrode layer on the first planarization layer, the method includes:
[0062] The first electrode layer is annealed.
[0063] According to any of the foregoing embodiments of the third aspect of this application, in the annealing process, the annealing temperature is 200°C to 240°C and the annealing time is 30 min to 70 min.
[0064] An embodiment of the fourth aspect of this application also provides a display device, including a display panel of any of the embodiments of the first and second aspects described above, or a display panel prepared by any of the embodiments of the third aspect described above.
[0065] In the display panel, display device, and display panel manufacturing method provided in the embodiments of this application, by providing a first opening in the isolation structure, moisture in the first planarization layer can be discharged outward through the first opening during the manufacturing process of the display panel; providing the first opening in the non-display area is beneficial to increasing the distribution density of the light-emitting units in the display area; by providing that the orthographic projection of the isolation member on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate, and the isolation member separating the first planarization layer and the encapsulation layer, the isolation member can isolate the first planarization layer and the encapsulation layer, avoiding contact between the first planarization layer and the encapsulation layer, thereby avoiding or reducing the absorption of liquid preparation by the first planarization layer during the manufacturing process, avoiding or reducing the entry of moisture in the first planarization layer into the encapsulation layer through the first opening, improving the service life of the light-emitting unit, and avoiding or reducing display abnormalities of the light-emitting unit. Attached Figure Description
[0066] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0067] Figure 1 This is a schematic diagram of the planar structure of a display panel provided in some embodiments of this application;
[0068] Figure 2 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;
[0069] Figure 3 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;
[0070] Figure 4 This is a partial planar structural diagram of a display panel provided in some embodiments of this application;
[0071] Figure 5 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;
[0072] Figure 6 This is a partial planar structural diagram of a display panel provided in some embodiments of this application;
[0073] Figure 7 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;
[0074] Figure 8 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;
[0075] Figure 9 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application;
[0076] Figure 10 This is a partial cross-sectional structural diagram of a display panel provided in some embodiments of this application.
[0077] Explanation of reference numerals in the attached figures:
[0078] 100. Display panel; AA. Display area; NA. Non-display area;
[0079] 1. Substrate; 11. Substrate; 12. Driving circuit layer; 13. Transistor; 131. Source; 132. Drain; 133. Gate; 134. Active layer; 135. First electrode plate; 136. Second electrode plate; 14. Second planarization layer; 15. First signal line; 151. Fourth opening;
[0080] 2. Isolation structure; 21. First isolation layer; 22. Second isolation layer; 23. Isolation opening; 24. Third isolation layer;
[0081] 3. Light-emitting unit;
[0082] 4. Pixel definition layer; 41. Pixel opening; 42. Second opening; 44. Fifth opening;
[0083] 51. First leveling layer; 511. Third opening;
[0084] 6. First electrode layer; 61. First electrode; 611. Third surface; 62. Isolation electrode;
[0085] 7. Encapsulation layer; 71. First encapsulation sublayer; 72. Second encapsulation sublayer; 721. Encapsulation unit; 73. Third encapsulation sublayer;
[0086] 8. Touch layer; 81. Touch unit; 9. Second electrode;
[0087] 20. Spacer; 201. First surface; 202. Second surface; 203. Side surface;
[0088] X, third direction; Y, first direction; Z, second direction. Detailed Implementation
[0089] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.
[0090] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.
[0091] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.
[0092] During the fabrication of the display panel, moisture is discharged from the first planarization layer through a first opening in the isolation structure. In subsequent processes, some liquid formulations can enter the first planarization layer through the first opening. In the completed display panel, moisture in the first planarization layer can enter the encapsulation layer located on one side of the isolation structure through the first opening, thereby increasing the probability of moisture entering the light-emitting unit through the encapsulation layer, leading to a reduction in the display lifespan of the light-emitting unit and display malfunctions.
[0093] To address the aforementioned issues, this application provides a display panel, a display device, and a method for manufacturing the display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, display device, and method for manufacturing the display panel.
[0094] like Figure 1 and Figure 2 As shown, the first aspect of this application provides a display panel 100, which has a display area AA and a non-display area NA, with the non-display area NA disposed around at least a portion of the display area AA. The display panel 100 includes: a substrate 1, a first planarization layer 51, an isolation structure 2, a light-emitting device layer, an encapsulation layer 7, and an isolation member 20. The first planarization layer 51 is disposed on one side of the substrate 1. The isolation structure 2 is located on the side of the first planarization layer 51 facing away from the substrate 1. The isolation structure 2 has a plurality of isolation openings 23 and at least one first opening 25. The isolation openings 23 are located in the display area AA, and the first opening 25 is located in the non-display area NA. A. At least a portion of the orthographic projection of the first opening 25 on the substrate 1 is located within the orthographic projection of the first planarization layer 51 on the substrate 1; the light-emitting device layer includes a plurality of light-emitting units 3 located in the display area AA, the light-emitting units 3 are at least partially disposed in the isolation opening 23, and the light-emitting units 3 include organic electroluminescent materials; the encapsulation layer 7 is located on the side of the isolation structure 2 away from the substrate 1 and covers at least a portion of the first opening 25; the isolation member 20 is located in the non-display area NA, the orthographic projection of the isolation member 20 on the substrate 1 overlaps at least partially with the orthographic projection of the first opening 25 on the substrate 1, and the isolation member 20 separates the first planarization layer 51 and the encapsulation layer 7.
[0095] In the display panel 100 provided in the embodiments of this application, the display panel 100 can be a display panel 100 based on organic light-emitting diode (OLED) technology. The isolation structure 2 is described in patents CN118251982A, 202410864269.8, PT / N2024 / 09R407, PCT / CNP02A09R217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, CN117396039A, CN116669480A, CN116600606A, and CN117500332A, for reference.
[0096] The display area AA is equipped with multiple light-emitting units 3, enabling it to emit light and display information. The non-display area NA is not used for display and illumination, and therefore, no light-emitting units 3 are required in the non-display area NA. The signal lines used for electrically connecting the light-emitting units 3 can be distributed in the non-display area NA to reduce the space occupied by these signal lines in the display area AA, thereby increasing the distribution density of the light-emitting units 3 in the display area AA.
[0097] In the display panel 100 provided in this embodiment, the substrate 1 not only provides support for the isolation structure 2, but also provides electrical signals for the light-emitting device layer. The substrate 1 includes a substrate 11 and a driving circuit layer 12, which is disposed between the substrate 11 and the light-emitting device layer. The driving circuit layer 12 may include a pixel driving circuit. For example, the pixel driving circuit disposed on the driving circuit layer 12 includes a transistor 13 and a storage capacitor. The transistor 13 includes an active layer 134, a gate 133, a drain 132, and a source 131. The storage capacitor includes a first electrode 135 and a second electrode 136. A plurality of patterned conductive layers form the aforementioned transistor 13 and storage capacitor.
[0098] The first planarization layer 51 can be used to planarize the functional layer located on the side of it close to the substrate 1. The functional layer can be a conductive layer forming the aforementioned source 131 and drain 132, or a conductive layer used to connect with the vias of the source 131 and drain 132.
[0099] During the fabrication of the display panel 100, the isolation structure 2 is located on the side of the first planarization layer 51 facing away from the substrate 1. At least a portion of the orthographic projection of the first opening 25 onto the substrate 1 lies within the orthographic projection of the first planarization layer 51 onto the substrate 1. When the first planarization layer 51 is baked, moisture inside the first planarization layer 51 can be discharged outward through the first opening 25 to keep the first planarization layer 51 dry. The number of first openings 25 can be one or more, and the multiple first openings 25 can be arranged at intervals.
[0100] The isolation structure 2 forms multiple isolation openings 23, with adjacent isolation openings 23 spaced apart by the isolation structure 2. The number of isolation openings 23 can correspond one-to-one with the number of light-emitting units 3. The multiple light-emitting units 3 can be light-emitting units 3 capable of emitting light of different colors. For example, they can be red light-emitting units capable of emitting red light, green light-emitting units capable of emitting green light, and blue light-emitting units capable of emitting blue light.
[0101] The encapsulation layer 7 can be made of organic and / or inorganic materials. The encapsulation layer 7 helps to improve the water and oxygen isolation capability of the light-emitting device layer.
[0102] The encapsulation layer 7 extends from the display area AA to the non-display area NA. The encapsulation layer 7 is located on the side of the light-emitting device layer facing away from the substrate 1, and covers part or all of the first opening, thereby achieving full-area encapsulation of the display area AA and the non-display area NA. The encapsulation layer 7 located in the display area AA can encapsulate the side of the light-emitting device layer and the isolation structure 2 facing away from the substrate 1, preventing external water and oxygen from entering the light-emitting unit 3 from the side of the light-emitting device layer and the isolation structure 2 facing away from the substrate 1, thus affecting the display and light emission of the light-emitting unit 3. The encapsulation layer 7 located in the non-display area NA is stacked on the side of the isolation structure 2 facing away from the substrate 1, preventing external water and oxygen from entering the display area AA from the non-display area NA, thus affecting the display and light emission of the light-emitting unit 3.
[0103] The orthographic projection of the isolator 20 onto the substrate 1 at least partially overlaps with the orthographic projection of the first opening 25 onto the substrate 1. The isolator 20 may be entirely disposed within the first opening 25, partially disposed within the first opening 25, or located outside the first opening 25. The isolator 20 separates the first planarization layer 51 and the encapsulation layer 7, meaning that the first planarization layer 51 and the encapsulation layer 7 do not contact each other. This prevents moisture in the first planarization layer 51 from entering the encapsulation layer 7 through the first opening 25, and also prevents moisture in the encapsulation layer 7 from entering the first planarization layer 51 through the first opening 25. Unless otherwise specified, the orthographic projection on the substrate 1 in this application is a projection along a third direction X. The third direction X can be the thickness direction of the display panel 100 or a direction perpendicular to the substrate 1.
[0104] The display panel 100 provided in this application may further include a cover plate located on the side of the light-emitting device layer facing away from the substrate 1, a touch layer 8 located between the cover plate and the light-emitting device layer, and an optical adhesive layer located between the cover plate and the touch layer 8. The cover plate provides protection for the display panel 100, preventing scratches and damage from external forces. The touch layer 8 enables touch functionality. The optical adhesive layer bonds the cover plate and the touch layer 8.
[0105] In the display panel 100 provided in this application, by providing a first opening 25 in the isolation structure 2, moisture in the first planarization layer 51 can be discharged outward through the first opening 25 during the fabrication of the display panel 100. Providing the first opening 25 in the non-display area NA is beneficial for increasing the distribution density of the light-emitting units 3 in the display area AA. By setting the orthographic projection of the isolation member 20 on the substrate 1 to at least partially overlap with the orthographic projection of the first opening 25 on the substrate 1, and by separating the first planarization layer 51 and the encapsulation layer 7, the isolation member 20 can isolate the first planarization layer 51 and the encapsulation layer 7, preventing contact between them. This avoids or reduces the absorption of liquid preparations by the first planarization layer 51 during fabrication, and prevents or reduces the entry of moisture in the first planarization layer 51 into the encapsulation layer 7 through the first opening 25, thereby improving the lifespan of the light-emitting units 3 and avoiding or reducing display abnormalities of the light-emitting units 3.
[0106] In some embodiments, the spacer 20 comprises an inorganic material.
[0107] Inorganic materials have good water-repellent properties. The separator 20 includes inorganic materials, thereby improving the ability of the separator 20 to prevent or reduce water vapor in the first planarization layer 51 from entering the encapsulation layer 7 through the first opening 25.
[0108] In some embodiments, the isolator 20 is a conductive element, and the isolator 20 has the function of avoiding signals. For example, the isolator 20 can shield the mutual interference between the touch layer 8 located on its side away from the substrate 11 and the drive circuit layer 12 located on its side close to the substrate 11.
[0109] Please see Figure 3 and Figure 4 In some embodiments, the display panel 100 further includes a first electrode layer 6, which includes a plurality of first electrodes 61 and at least one isolation electrode 62. The first electrodes 61 are disposed on the side of the light-emitting unit 3 near the substrate 1. The orthographic projection of the first electrode 61 on the substrate 1 at least partially overlaps with the orthographic projection of the isolation opening 23 on the substrate 1. The isolation electrode 62 is reused as an isolation member 20.
[0110] The electrode material for fabricating the first electrode layer 6 can be laid entirely on one side of the substrate 1. The electrode material is then patterned to form multiple first electrodes 61 and isolation electrodes 62. The isolation electrode 62 is reused as an isolation element 20, that is, the isolation electrode 62 isolates the first planarization layer 51 and the encapsulation layer 7. The orthographic projection of the isolation electrode 62 on the substrate 1 overlaps with the orthographic projection of the first opening 25 on the substrate 1. The isolation electrode 62 has the ability to prevent moisture from flowing between the first planarization layer 51 and the encapsulation layer 7.
[0111] By reusing the isolation electrode 62 as the isolation element 20, the step of separately preparing the isolation element 20 is eliminated, simplifying the preparation process.
[0112] In some embodiments, the display panel 100 further includes a pixel definition layer 4, which is disposed between the substrate 1 and the isolation structure 2. The pixel definition layer 4 includes a pixel opening 41 and a second opening 42. The pixel opening 41 is connected to the isolation opening 23. The light-emitting unit 3 is at least partially disposed in the pixel opening 41. The second opening 42 is connected to the first opening 25.
[0113] A pixel definition layer 4 is disposed on the side of the first planarization layer 51 facing away from the substrate 1. The pixel definition layer 4 includes a pixel opening 41 located in the display area AA and a second opening 42 located in the non-display area NA. The pixel opening 41 defines the position, shape, and size of the light-emitting unit 3. The isolation structure 2 can be directly disposed on the side of the pixel definition layer 4 facing away from the substrate 1, and the pixel definition layer 4 supports the isolation structure 2. The isolation member 20 can be entirely located within the second opening 42, partially located within the second opening 42, or located outside the second opening 42.
[0114] In some embodiments, the orthographic projection of the second opening 42 on the substrate 1 is located within the orthographic projection of the first opening 25 on the substrate 1.
[0115] During the fabrication of the display panel, a pixel definition material layer and an isolation material layer can be sequentially disposed on one side of the first planarization layer 51. The first opening 25 and the second opening 42 are sequentially made by etching process. The opening size of the second opening 42, which is made later, is smaller than the size of the first opening 25, that is, the orthographic projection of the second opening 42 on the substrate 1 is located within the orthographic projection of the first opening 25 on the substrate 1.
[0116] In some embodiments, the isolator 20 includes a first surface 201 and a second surface 202 disposed opposite to each other, and a side surface 203 connected to the first surface 201. The first surface 201 is disposed on the side of the second surface 202 away from the substrate 1, and the pixel definition layer 4 covers at least part of the side surface 203.
[0117] The isolator 20 can be prepared first, and then the pixel definition layer 4 with the second opening 42 can be prepared. The pixel definition layer 4 can cover part of the isolator 20, for example, the pixel definition layer 4 can cover at least part of the side 203, so as to reduce the contact of the side 203 with the preparation agent in subsequent processes and avoid or reduce the damage of the preparation agent to the side 203.
[0118] In some embodiments, the pixel definition layer 4 covers a portion of the first surface 201.
[0119] The pixel definition layer 4 can extend from the side 203 to the edge of the first surface 201, thereby ensuring that the pixel definition layer 4 effectively covers the side 203.
[0120] In some embodiments, a plurality of first electrodes 61 and isolation electrodes 62 are arranged at intervals, such that the first electrodes 61 and isolation electrodes 62 can be used to transmit different electrical signals respectively.
[0121] In some embodiments, a portion of the pixel definition layer 4 is located between adjacent first electrode 61 and isolation electrode 62.
[0122] The pixel definition layer 4 can be made of insulating material. Part of the pixel definition layer 4 is located between the adjacent first electrode 61 and isolation electrode 62 to avoid crosstalk between the electrical signals transmitted by the first electrode 61 and isolation electrode 62.
[0123] In some embodiments, the pixel definition layer 4 surrounds the isolation electrode 62.
[0124] The periphery of the isolation electrode 62 is surrounded by the pixel definition layer 4. Optionally, the edges and side surfaces 203 of the first surface 201 are covered by the pixel definition layer 4.
[0125] Please refer to the following: Figure 5 In other embodiments, at least one isolation electrode 62 is connected to the first electrode 61.
[0126] In the display panel, some isolation electrodes 62 can be connected to the first electrode 61, and some isolation electrodes 62 and the first electrode 61 can be arranged at intervals; alternatively, all isolation electrodes 62 can be connected to different first electrodes 61. The connected isolation electrodes 62 and first electrodes 61 can transmit the same electrical signal together.
[0127] In some embodiments, the first electrode 61 includes a third surface 611 that contacts the light-emitting unit 3, the pixel definition layer 4 covers a portion of the third surface 611, and the first surface 201 and the third surface 611 are connected to form a plane.
[0128] The first electrode 61 and the isolation electrode 62 can be obtained by patterning the same electrode material layer. Both the first electrode 61 and the isolation electrode 62 are formed on the first planarization layer 51, so that the first surface 201 and the third surface 611 are connected to form a plane. The first electrode 61 and the isolation electrode 62 have the same thickness along the direction close to the substrate 1.
[0129] In some embodiments, the display panel 100 further includes a touch layer 8, which is located on the side of the encapsulation layer 7 away from the substrate 1. The touch layer 8 includes a plurality of touch units 81, and the orthographic projection of the touch units 81 on the substrate 1 at least partially overlaps with the orthographic projection of the isolation member 20 on the substrate 1.
[0130] The touch layer 8 enables touch operation on the display panel 100. To prevent the touch layer 8 from affecting the display of the light-emitting device layer, the touch layer 8 can be made of a light-transmitting material. The touch layer 8 is either a self-capacitive touch layer 8 or a mutual-capacitive touch layer 8.
[0131] The mutual capacitance touch layer 8 includes a first touch sublayer and a second touch sublayer. When a finger touches the display panel 100, the first touch unit in the first touch sublayer and the second touch unit in the second touch sublayer respectively form coupling capacitors, thereby achieving touch control through changes in capacitance. The orthographic projection of the isolator 20 on the substrate 1 at least partially overlaps with the orthographic projection of the first touch unit on the substrate 1, that is, the isolator 20 has a signal shielding effect for the first touch unit. The orthographic projection of the isolator 20 on the substrate 1 at least partially overlaps with the orthographic projection of the second touch unit on the substrate 1, that is, the isolator 20 has a signal shielding effect for the second touch unit.
[0132] The self-capacitive touch layer 8 includes touch units 81 with a grid structure. Multiple touch units 81 are touch lines arranged in an array, and mutual capacitance is formed between the arrayed touch lines. When a finger approaches or touches the display panel 100, the value of the mutual capacitance changes, and touch control is achieved through this change in mutual capacitance. The orthographic projection of the isolator 20 onto the substrate 1 at least partially overlaps with the orthographic projection of the touch line onto the substrate 1, meaning that the isolator 20 has a signal shielding effect on the touch line.
[0133] In some embodiments, the substrate 1 includes a substrate 11 and a driving circuit layer 12. The driving circuit layer 12 is disposed between the substrate 11 and the light-emitting device layer. The driving circuit layer 12 includes a plurality of conductive structures. The orthographic projection of some of the conductive structures onto the substrate 1 at least partially overlaps with the orthographic projection of the isolation member 20 onto the substrate 1.
[0134] The conductive structure can specifically be a signal line for user signal transmission in the driving circuit layer 12, a transistor 13 that drives the light-emitting unit 3 to emit light, etc. The orthographic projection of a portion of the conductive structure on the substrate 1 at least partially overlaps with the orthographic projection of the isolator 20 on the substrate 1, so that the isolator 20 has a signal shielding effect on that portion of the conductive structure.
[0135] In some embodiments, the isolation electrode 62 is insulated from the driving circuit layer 12, and the first electrode 61 is electrically connected to the driving circuit layer 12.
[0136] The first electrode 61 is electrically connected to the driving circuit layer 12, so that the first electrode 61 can provide an electrical signal to the light-emitting unit 3, driving the light-emitting unit 3 to emit light. The isolation electrode 62 is insulated from the driving circuit layer 12, thereby simplifying the circuit design in the display panel 100.
[0137] In some embodiments, a portion of the encapsulation layer 7 fills the first opening 25 and contacts the surface of the separator 20 away from the substrate 1.
[0138] The encapsulation layer 7 partially fills the first opening 25 to encapsulate and planarize the isolation structure 2, which is beneficial for setting other functional layers on the side of the encapsulation layer 7 away from the substrate 1.
[0139] In some embodiments, the encapsulation layer 7 includes a first encapsulation sublayer 71, which covers the side of the light-emitting device layer away from the substrate 1, the side of the isolation structure 2 away from the substrate 1, and the side of the isolation member 20 away from the substrate 1. A portion of the first encapsulation sublayer 71 fills the first opening 25 and contacts the surface of the isolation member 20 away from the substrate 1.
[0140] The first encapsulation sublayer 71 encapsulates the display area AA and the non-display area NA together, which helps to improve the display panel 100's resistance to water and oxygen.
[0141] In some embodiments, the display panel 100 further includes a second encapsulation sublayer 72, which is disposed in the display area AA and is located between the first encapsulation sublayer 71 and the light-emitting unit 3.
[0142] The second encapsulation sublayer 72 can be made of organic or inorganic materials. The first encapsulation sublayer 71 and the second encapsulation sublayer 72 can be made of the same or different materials. Using different materials for the first encapsulation sublayer 71 and the second encapsulation sublayer 72 allows them to have different properties, thereby improving the water and oxygen resistance of the display panel 100.
[0143] In some embodiments, the second encapsulation sublayer 72 includes a plurality of encapsulation portions 721 spaced apart, the orthographic projection of the encapsulation portions 721 onto the substrate 1 covering the orthographic projection of the light-emitting unit 3 onto the substrate 1.
[0144] The encapsulation part 721 and the light-emitting unit 3 can be arranged in a one-to-one correspondence, that is, one encapsulation part 721 is used to encapsulate one light-emitting unit 3. The encapsulation part 721 can be completely disposed inside the isolation opening 23, or it can extend partially to the outside of the isolation opening 23. The edge of the encapsulation part 721 overlaps with the isolation structure 2 to avoid or reduce the formation of a gap between the encapsulation part 721 and the isolation structure 2 that allows water and oxygen to pass through.
[0145] Compared to the second encapsulation sublayer 72 which is distributed in the display area AA, the first encapsulation sublayer 71 is distributed in the display area AA and the non-display area NA.
[0146] In some embodiments, the first encapsulation sublayer 71 is an organic material layer, and the first planarization layer 51 is an organic material layer.
[0147] Compared to inorganic material layers, organic material layers have better flexibility, enabling the first encapsulation sublayer 71 and the first planarization layer 51 to achieve planarization. The first encapsulation sublayer 71 and the first planarization layer 51 also absorb moisture more easily, so a separator 20 is provided between the first encapsulation sublayer 71 and the first planarization layer 51 to reduce the flow of moisture between them.
[0148] In some embodiments, the second encapsulation sublayer 72 is an inorganic material layer.
[0149] Compared to organic material layers, inorganic material layers have a better ability to block water and oxygen. Conversely, organic material layers have better flexibility and film-forming properties. By encapsulating the light-emitting device layer with both organic and inorganic material layers, the overall water and oxygen resistance of the display panel is improved.
[0150] In some embodiments, the encapsulation layer 7 further includes a third encapsulation sublayer 73, which is disposed on the side of the first encapsulation sublayer 71 away from the substrate 1.
[0151] The third encapsulation sublayer 73 can be made of organic or inorganic materials. The first encapsulation sublayer 71, the second encapsulation sublayer 72, and the third encapsulation sublayer 73 can be made of the same or different materials. The third encapsulation sublayer 73 helps to improve the water and oxygen isolation capability of the display panel 100 from the light-emitting device layer. The third encapsulation sublayer 73 and the first encapsulation sublayer 71 are made of different materials, so that the third encapsulation sublayer 73 and the first encapsulation sublayer 71 can have different properties, thereby improving the water and oxygen resistance capability of the display panel 100.
[0152] In some embodiments, the third encapsulation sublayer 73 is an inorganic material layer.
[0153] The material of the third encapsulation sublayer 73 can be the same as that of the first encapsulation sublayer 71 to simplify the manufacturing process.
[0154] In some embodiments, the display panel 100 further includes a first conductive layer, the first conductive layer including a first signal line 15 located in the non-display area NA, a first planarization layer 51 having a third opening 511, and a portion of the isolation structure 2 located within the third opening 511 and electrically connected to the first signal line 15.
[0155] The first signal line 15 can be arranged around the display area AA. The first signal line 15, the first planarization layer 51, and the isolator 20 can be formed sequentially. The isolation material used to prepare the isolation structure 2 falls into the third opening 511, and this part of the isolation material is based on the first signal line 15 exposed from the third opening 511, thereby realizing the electrical connection between the isolation structure 2 and the first signal line 15, so that the isolation structure 2 can be used to transmit electrical signals.
[0156] In some embodiments, the orthographic projection of the isolator 20 onto the substrate 1 is located in the orthographic projection of the first signal line 15 onto the substrate 1, so that the isolator 20 can shield the electrical signal of the first signal line 15, thereby reducing the interference between the first signal line 15 and the electrical signal transmission structure located on the side of the isolator 20 away from the substrate 1. The electrical signal transmission structure located on the side of the isolator 20 away from the substrate 1 can be a touch signal line 82 (trace) electrically connected to the touch unit 81.
[0157] Please refer to the following: Figure 5 , Figure 6 and Figure 7 In some embodiments, the orthographic projection of the third opening 511 onto the substrate 1 is spaced apart from the orthographic projection of the first opening 25 onto the substrate 1.
[0158] The pixel definition layer 4 extends into the third opening 511. The pixel definition layer 4 has a fifth opening 44 located within the third opening 511, through which the first signal line 15 is exposed. The pixel definition layer 4 extends along the wall of the third opening 511, preventing moisture in the first planarization layer 51 from escaping through the third opening 511. A second opening 42 is provided on the pixel definition layer 4, allowing moisture in the first planarization layer 51 to escape through the second opening 42. The third opening 511 and the second opening 42 are spaced apart. The third opening 511 and the fifth opening 44 can be coaxially arranged.
[0159] In some embodiments, the display panel 100 further includes a second planarization layer 14, which is located on the side of the first conductive layer near the substrate 1.
[0160] A second planarization layer 14 can be prepared first, and the functional layer located on the side of the second planarization layer 14 near the substrate 11 can be planarized, which is beneficial to the preparation of the first conductive layer on the second planarization layer 14.
[0161] In some embodiments, the first conductive layer further includes a fourth opening 151 extending through the first signal line 15, through which the first planarization layer 51 and the second planarization layer 14 are in contact.
[0162] Water vapor in the second planarization layer 14 can be discharged outward through the fourth opening 151, and can also move into the first planarization layer 51 through the fourth opening 151, and then be discharged through the second opening 42.
[0163] In some embodiments, the orthographic projection of the second opening 42 onto the substrate 1 and the orthographic projection of the fourth opening 151 onto the substrate 1 are spaced apart, thereby avoiding interference between the conductive structure located on the side of the fourth opening 151 near the substrate 11 and the electrical signal transmission structure located on the side of the second opening 42 away from the substrate 11.
[0164] In some embodiments, the projections of a plurality of second openings 42 onto the substrate 1 and the projections of a plurality of third openings 511 onto the substrate 1 are alternately spaced along the first direction Y; the projections of a plurality of third openings 511 onto the substrate 1 and the projections of a plurality of fourth openings 151 are alternately spaced along the first direction Y.
[0165] The arrangement of multiple second openings 42 and multiple third openings 511 facilitates the discharge of water vapor from the first flattening layer 51 and the second flattening layer 14. The regular arrangement of the multiple second openings 42 and multiple third openings 511 avoids or reduces the accumulation of water vapor in certain areas of the first flattening layer 51 and the second flattening layer 14, preventing effective discharge. Optionally, the multiple second openings 42 and multiple third openings 511 arranged in a row, and the multiple fourth openings 151 and multiple third openings 511 arranged in a row, can be spaced apart along the second direction Z, with the first direction Y perpendicular to the second direction Z.
[0166] In some embodiments, the display panel 100 further includes a second electrode layer, which includes a plurality of second electrodes 9. The second electrodes 9 are disposed on the side of the light-emitting unit 3 away from the substrate 1, and the second electrodes 9 overlap with the isolation structure 2.
[0167] One of the first electrode 61 and the second electrode 9 can be a cathode and the other can be an anode. The first electrode 61 and the second electrode 9 are respectively connected to the light-emitting unit 3 and used to drive the light-emitting unit 3 to emit light. The encapsulation part 721 can cover the side of the second electrode 9 away from the substrate 1. The encapsulation part 721 can reduce or prevent water and oxygen from entering the light-emitting unit 3 and improve the service life of the light-emitting unit 3. Optionally, the first electrode 61 is an anode and the second electrode 9 is a cathode.
[0168] In some embodiments, the second electrode 9 is electrically connected to the isolation structure 2.
[0169] The edge of the second electrode 9 overlaps with the first isolation layer 21, so that the first isolation layer 21 can supply power to the second electrode 9 and also enable the adjacent second electrode 9 to conduct electricity, thereby forming a surface electrode that conducts electricity across the entire surface.
[0170] Please see Figure 8 In some embodiments, the display panel 100 further includes a pixel definition layer 4, which is disposed between the first planarization layer 51 and the isolation structure 2. The pixel definition layer 4 includes a pixel opening 41, which is connected to the isolation opening 23. The light-emitting unit 3 is at least partially disposed in the pixel opening 41, and part of the pixel definition layer 4 is reused as an isolation element.
[0171] The pixel definition layer 4, which extends to the non-display area NA, is reused as an isolator 20 to separate the first planarization layer 51 and the encapsulation layer 7, thereby preventing the formulation used in the process after the pixel definition layer 4 is fabricated from entering the first planarization layer 51.
[0172] Please see Figure 5 and Figure 9 In some embodiments, the isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 stacked together. The first isolation layer 21 is disposed on the side of the second isolation layer 22 close to the substrate 1, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1.
[0173] The isolation structure 2 encloses and forms an isolation opening 23 to define the area where the light-emitting device layer is disposed. The isolation structure 2 includes a first isolation layer 21 and a second isolation layer 22 stacked together. The orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the second isolation layer 22 on the substrate 1, such that the cross-sectional area of the isolation structure 2 at the end away from the substrate 1 is larger, and the cross-sectional area of the isolation structure 2 at the end closer to the substrate 1 is smaller. Along the direction from the isolation structure 2 to the substrate 1, the second isolation layer 22 completely blocks the first isolation layer 21.
[0174] When fabricating the light-emitting unit 3, the light-emitting material A used to fabricate the light-emitting unit 3 can be deposited onto the isolation structure 2 using vapor deposition technology. Because the second isolation layer 22 blocks the first isolation layer 21, the light-emitting material A used to fabricate the light-emitting unit 3 experiences a significant drop at the edge of the second isolation layer 22. The light-emitting material A falling into the isolation opening 23 and the light-emitting material A falling onto the second isolation layer 22 are difficult to connect, resulting in breakage and the formation of light-emitting materials A spaced apart within adjacent isolation openings 23. Compared to the related technology of fabricating the light-emitting device layer using a mask vapor deposition, this application, by setting the first isolation layer 21 and the second isolation layer 22, allows the light-emitting unit 3 located within the isolation opening 23 to be fabricated without a metal mask, thus saving the cost of fabricating a metal mask. Compared to fabricating the light-emitting device layer using a high-precision metal mask vapor deposition, directly fabricating the high-precision isolation structure 2 is easier to achieve, making the structure of the display panel 100 provided by this application less demanding on the fabrication process, and resulting in good consistency of the fabricated display panel 100. The light-emitting material A can be an indium-containing complex.
[0175] In some embodiments, the orthographic projection of the isolation member 20 onto the substrate 1 overlaps with the orthographic projection of the isolation structure 2 onto the substrate 1.
[0176] Both the isolator 20 and the first isolation layer 21 have the function of shielding signals on both sides. The orthographic projection of the isolator 20 on the substrate 1 overlaps with the orthographic projection of the first isolation layer 21 on the substrate 1 to increase the area that can be shielded by both together.
[0177] In some embodiments, the orthographic projection of the first isolation layer 21 on the substrate 1 surrounds and overlaps the orthographic projection of the isolation member 20 on the substrate 1, thereby making there a gap between the orthographic projection of the first isolation layer 21 on the substrate 1 and the orthographic projection of the isolation member 20 on the substrate 1, forming a full-area projection, increasing the area that can shield signals together.
[0178] In some embodiments, the surface of the second isolation layer 22 facing away from the substrate 1 has a smaller projected area on the substrate 1 than the surface of the second isolation layer 22 facing away from the substrate 1.
[0179] The second isolation layer 22 extends outward by a predetermined distance relative to the first isolation layer 21. That is, the surface of the second isolation layer 22 facing away from the substrate 1 has a smaller orthogonal projection area on the substrate 1 than the surface of the second isolation layer 22 facing the substrate 1. This results in the second isolation layer 22 having an inclined ramp structure, so as to define the pattern of the light-emitting unit 3 through the second isolation layer 22.
[0180] In some embodiments, the cross-sectional area of the second isolation layer 22 gradually decreases in the direction away from the substrate 1.
[0181] Optionally, the cross-section of the second isolation layer 22 is a trapezoid with the bottom edge facing the substrate 1, so that the second isolation layer 22 has a sloping surface, which is beneficial for the preparation material to be broken at the edge of the partition, forming a state in which part of the preparation material is located on the second isolation layer 22 and part of the preparation material is located in the isolation opening.
[0182] In some embodiments, the surface of the first isolation layer 21 facing away from the substrate 1 has a smaller projected area on the substrate 1 than the surface of the second isolation layer 22 facing away from the substrate 1.
[0183] That is, the second isolation layer 22 extends outward relative to the first isolation layer 21 to restrict the pattern of the light-emitting unit 3. The area of the second isolation layer 22 is larger than that of the first isolation layer 21, and it is completely covered by the first isolation layer 21. At this time, the first isolation layer 21 is recessed relative to the second isolation layer 22 in a direction away from the isolation opening. When the light-emitting unit 3 is fabricated, at least part of the material used to fabricate the light-emitting unit 3 has a large drop at the edge of the isolation structure 2, and the first isolation layer 21 is recessed. The material used to fabricate the light-emitting unit 3 is difficult to connect on the outside of the isolation structure 2, resulting in breakage and forming mutually isolated light-emitting units 3.
[0184] Optionally, the isolation structure 2 is in the form of a grid, and the isolation openings are arranged in an array to improve the light emission uniformity of the light-emitting units 3.
[0185] Please see Figure 5 and Figure 10 In some embodiments, the isolation structure 2 further includes a third isolation layer 24, which is disposed on the side of the first isolation layer 21 near the substrate 1, and the orthographic projection of the first isolation layer 21 on the substrate 1 is located within the orthographic projection of the third isolation layer 24 on the substrate 1.
[0186] Within the display area AA, the cross-section of the isolation structure 2 can be I-shaped. Optionally, the projected area of the first isolation layer 21 on the substrate 1 is smaller than the projected area of the third isolation layer 24 on the substrate 1.
[0187] The cross-section of the first isolation layer 21 can be trapezoidal, increasing the size of the isolation opening 23. The cross-sectional shape of the first isolation layer 21 can be a regular trapezoid, which on the one hand provides stable support for the second isolation layer 22, and on the other hand reduces the contact area between the first isolation layer 21 and the second isolation layer 22. The orthographic projection of the first isolation layer 21 on the substrate 1 lies within the orthographic projection of the third isolation layer 24 on the substrate 1, allowing the third isolation layer 24 to stably support the first isolation layer 21. This enables the first isolation layer 21 to be recessed relative to the second isolation layer 22 in a direction away from the central axis of the isolation opening 23, facilitating the disconnection of the light-emitting device layer at the isolation structure 2. Etching waste generated from etching the first isolation layer 21 falls onto the third isolation layer 24, making cleaning easier.
[0188] In other embodiments, the second electrode 9 is electrically connected to the third isolation layer 24. The third isolation layer 24 is made of molybdenum metal; and / or the first isolation layer 21 is made of aluminum metal; and / or the second isolation layer 22 is made of titanium metal.
[0189] In some embodiments, the orthographic projection of the pixel opening 41 on the substrate 1 is located within the orthographic projection range of the isolation opening 23 on the substrate 1.
[0190] The area of the isolation opening 23 is larger than the area of the pixel opening 41, which can reduce the impact of the isolation structure 2 on the viewing angle of the light emitted by the light-emitting device.
[0191] Optionally, there may be multiple pixel openings 41, which are spaced apart. The isolation structure 2 may be disposed on at least a portion of the pixel defining portion between two adjacent pixel openings 41. Optionally, the isolation structure 2 may be disposed around at least a portion of the pixel openings 41.
[0192] An embodiment of the second aspect of this application also provides a display panel 100, which has a display area AA and a non-display area NA, with the non-display area NA disposed around at least a portion of the display area AA. The display panel 100 includes: a substrate 1, a first planarization layer 51, a pixel definition layer 4, a light-emitting device layer, an encapsulation layer 7, and a spacer 20. The first planarization layer 51 is disposed on one side of the substrate 1. The pixel definition layer 4 is located on the side of the first planarization layer 51 facing away from the substrate 1, and the pixel definition layer 4 has a plurality of pixel openings 41 and at least one second opening 42. The pixel openings 41 are located in the display area AA, and the second openings 42 are located in the non-display area AA. The second opening 42 in the display area NA has at least a portion of its orthographic projection on the substrate 1 located within the orthographic projection of the first planarization layer 51 on the substrate 1. The light-emitting device layer includes a plurality of light-emitting units 3 located in the display area AA, and the light-emitting units 3 are at least partially disposed within the pixel opening 41. The light-emitting units 3 include organic electroluminescent materials. The encapsulation layer 7 is located on the side of the pixel definition layer 4 away from the substrate 1 and covers at least a portion of the second opening 42. The isolator 20 is located in the non-display area NA, and the orthographic projection of the isolator 20 on the substrate 1 at least partially overlaps with the orthographic projection of the second opening 42 on the substrate 1. The isolator 20 separates the first planarization layer 51 and the encapsulation layer 7.
[0193] In the display panel 100 provided in this application, by providing a second opening 42 in the pixel definition layer 4, moisture in the first planarization layer 51 can be discharged outward through the second opening 42 during the fabrication of the display panel 100. Providing the second opening 42 in the non-display area NA is beneficial for increasing the distribution density of the light-emitting units 3 in the display area AA. By providing that the orthographic projection of the isolator 20 on the substrate 1 at least partially overlaps with the orthographic projection of the second opening 42 on the substrate 1, and by separating the first planarization layer 51 and the encapsulation layer 7 by the isolator 20, the isolator 20 can isolate the first planarization layer 51 and the encapsulation layer 7, preventing contact between them. This avoids or reduces the absorption of liquid preparations by the first planarization layer 51 during fabrication, and prevents or reduces the entry of moisture in the first planarization layer 51 into the encapsulation layer 7 through the second opening 42, thereby improving the lifespan of the light-emitting units 3 and avoiding or reducing display abnormalities of the light-emitting units 3.
[0194] An embodiment of the third aspect of this application also provides a method for manufacturing a display panel, the display panel 100 having a display area AA and a non-display area NA, the non-display area NA being disposed around at least a portion of the display area AA; the manufacturing method includes:
[0195] S100, a substrate 1 is provided, and a first planarization layer 51 is formed on the substrate 1;
[0196] S200, a first electrode layer 6 is formed on the first planarization layer 51. The first electrode layer 6 includes a plurality of first electrodes 61 located in the display area AA and isolation electrodes 62 located in the non-display area NA. The isolation electrodes 62 are reused as isolation elements 20.
[0197] S300, an isolation structure 2 is formed on the side of the first electrode layer 6 away from the substrate 1. The isolation structure 2 has a plurality of isolation openings 23 and at least one first opening 25. The isolation openings 23 are located in the display area AA, and the first opening 25 is located in the non-display area NA. The orthographic projection of the first opening 25 on the substrate 1 at least partially overlaps with the orthographic projection of the isolation electrode 62 on the substrate 1.
[0198] S500, a portion of the light-emitting device layer is provided through the isolation structure 2. The light-emitting device layer includes a plurality of light-emitting units 3 located in the display area AA. The light-emitting units 3 are at least partially disposed within the isolation opening 23.
[0199] S600, an encapsulation layer 7 is formed on the side of the isolation structure 2 away from the substrate 1, and the isolation member 20 spacers the first planarization layer 51 and the encapsulation layer 7.
[0200] The S300 may also include:
[0201] A pixel definition material layer and an isolation material layer are disposed on the first flat layer 51. The pixel definition material layer covers the first electrode 61. The pixel definition material layer and the isolation material layer are patterned to obtain a second opening 42 located in the non-display area NA and a pixel opening 41 located in the display area AA. The isolation opening 23 is connected to the pixel opening 41, and the second opening 42 is connected to the first opening 25.
[0202] A pixel-defining material layer is used to fabricate pixel-defining layer 4. The isolation material layer and pixel-defining material layer can be patterned using wet or dry etching processes to obtain the desired isolation structure 2 and pixel-defining layer 4. After S200, the process may further include drying the first planarization layer 51 to allow moisture in the first planarization layer 51 to escape through the second opening 42. Alternatively, the first planarization layer 51 may be dried using the ambient high temperature required for fabricating the first electrode layer 6.
[0203] The etching solution used in the formation of the isolation structure 2, the preparation of excess light-emitting material used in the preparation of the light-emitting unit 3, and the photoresist are all blocked by the isolation component 20, thereby preventing the preparation from entering the first planarization layer 51. This prevents or reduces the entry of moisture from the first planarization layer 51 into the encapsulation layer 7 and the light-emitting unit 3 in the prepared display panel 100, thus improving the service life of the light-emitting unit 3.
[0204] In S500, the light-emitting unit 3, excluding the first electrode 61, is prepared in steps, and light-emitting units 3 of different colors can be prepared in stages. For example: a first light-emitting material is deposited by vapor deposition, and the light-emitting material located in the first isolation opening 23 is retained to form a first light-emitting unit 3 for emitting light of the first color. The light-emitting material in the other isolation openings 23 is removed. Then, a second light-emitting material is deposited by vapor deposition, and the light-emitting material located in the second isolation opening 23 is retained to form a first light-emitting unit 3 for emitting light of the second color. The light-emitting material in the other isolation openings 23 is removed. This process is repeated until the desired type of light-emitting unit 3 is obtained.
[0205] In some embodiments, S200 includes:
[0206] A first electrode material layer is disposed on the first planarization layer 51;
[0207] The first conductive material layer is etched using a first mask to form the first electrode 61 and the isolation electrode 62.
[0208] The first electrode 61 and the isolation electrode 62 are obtained together through the same etching step.
[0209] In some embodiments, after S200, the following is included:
[0210] S201, the first electrode layer 6 is annealed.
[0211] Annealing the first electrode layer 6 improves the corrosion resistance of the surfaces of the first electrode 61 and the isolation electrode 62, thus enhancing the material properties. During annealing, the high temperature also allows moisture in the first planarization layer 51 to escape through the second opening 42, facilitating the drying of the first planarization layer 51. The first planarization layer 51 is then dried using the ambient high temperature required for processing the first electrode layer 6.
[0212] The etching solution used in the formation of the isolation structure 2, the preparation of excess light-emitting material used in the preparation of the light-emitting unit 3, and the photoresist are all blocked by the isolation component 20, thereby preventing the preparation from entering the first planarization layer 51. This prevents or reduces the entry of moisture from the first planarization layer 51 into the encapsulation layer 7 and the light-emitting unit 3 in the prepared display panel 100, thus improving the service life of the light-emitting unit 3.
[0213] In some embodiments, the annealing temperature is 200℃~240℃ and the annealing time is 30min~70min. Optionally, the annealing temperature is 200℃, 210℃, 220℃, 230℃, etc., and the annealing time is 30min, 40min, 50min, 60min, 70min.
[0214] An embodiment of the fourth aspect of this application also provides a display device; please refer to [link to relevant documentation]. Figure 1 and Figure 2 The display device includes the display panel 100 of any of the first or second embodiments described above, or the display panel 100 prepared according to any of the third embodiments described above. Since the display device provided in the fourth embodiment of this application includes the display panel 100 of any of the first or second embodiments described above, or the display panel 100 prepared according to any of the third embodiments described above, the display device provided in the fourth embodiment of this application has the beneficial effects of the display panel 100 of any of the first or second embodiments described above, or the display panel 100 prepared according to any of the third embodiments described above, which will not be elaborated further here.
[0215] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.
[0216] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.
Claims
1. A display panel, characterized in that, The display panel has a display area and a non-display area, the non-display area being disposed around at least a portion of the display area; the display panel includes: substrate; A first planarization layer is disposed on one side of the substrate; An isolation structure is located on the side of the first planarization layer opposite to the substrate. The isolation structure has a plurality of isolation openings and at least one first opening. The isolation openings are located in the display area, and the first opening is located in the non-display area. At least a portion of the orthographic projection of the first opening on the substrate is located within the orthographic projection of the first planarization layer on the substrate. The light-emitting device layer includes a plurality of light-emitting units located in the display area, at least a portion of the light-emitting units being disposed within the isolation opening, and the light-emitting units comprising organic electroluminescent materials; An encapsulation layer is located on the side of the isolation structure opposite to the substrate and covers at least a portion of the first opening; An isolator is located in the non-display area, the isolator isolating the first planarization layer and the encapsulation layer, and the orthographic projection of the isolator on the substrate at least partially overlaps with the orthographic projection of the first opening on the substrate.
2. The display panel according to claim 1, characterized in that, The insulating component comprises inorganic materials; Preferably, the display panel further includes a first electrode layer, the first electrode layer including a plurality of first electrodes and at least one isolation electrode, the first electrodes being disposed on the side of the light-emitting unit close to the substrate, the orthographic projection of the first electrode on the substrate at least partially overlapping the orthographic projection of the isolation opening on the substrate, and the isolation electrode being reused as the isolation element; Preferably, the display panel further includes a pixel definition layer, which is disposed between the substrate and the isolation structure. The pixel definition layer includes a pixel opening and a second opening, which communicates with the isolation opening. The light-emitting unit is at least partially disposed within the pixel opening, and the second opening communicates with the first opening. Preferably, the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first opening on the substrate; Preferably, the isolator includes a first surface and a second surface disposed opposite to each other, and a side surface connected to the first surface, wherein the first surface is disposed on the side of the second surface facing away from the substrate, and the pixel definition layer covers at least a portion of the side surface; Preferably, the pixel definition layer covers a portion of the first surface.
3. The display panel according to claim 2, characterized in that, Multiple first electrodes and isolation electrodes are arranged at intervals; Preferably, a portion of the pixel definition layer is located between adjacent first electrodes and isolation electrodes; Preferably, the pixel definition layer surrounds the isolation electrode.
4. The display panel according to claim 2, characterized in that, At least one of the isolation electrodes is connected to the first electrode; Preferably, the first electrode includes a third surface that contacts the light-emitting unit, the pixel definition layer covers a portion of the third surface, and the first surface and the third surface are connected to form a plane.
5. The display panel according to claim 2, characterized in that, The display panel further includes a touch layer located on the side of the encapsulation layer opposite to the substrate. The touch layer includes a plurality of touch units, and the orthographic projection of the touch units on the substrate at least partially overlaps with the orthographic projection of the isolator on the substrate. Preferably, the substrate includes a substrate and a driving circuit layer, the driving circuit layer is disposed between the substrate and the light-emitting device layer, the driving circuit layer includes a plurality of conductive structures, and the orthographic projection of some of the conductive structures on the substrate at least partially overlaps with the orthographic projection of the insulating member on the substrate; Preferably, the isolation electrode is insulated from the driving circuit layer, and the first electrode is electrically connected to the driving circuit layer.
6. The display panel according to claim 1, characterized in that, The encapsulation layer partially fills the first opening and contacts the surface of the isolator opposite to the substrate. Preferably, the encapsulation layer includes a first encapsulation sub-layer, which covers the side of the light-emitting device layer away from the substrate and the side of the isolation structure away from the substrate, and a portion of the first encapsulation sub-layer fills the first opening and contacts the surface of the isolation member away from the substrate. Preferably, the encapsulation layer further includes a second encapsulation sub-layer, which is disposed in the display area and located between the first encapsulation sub-layer and the light-emitting unit; Preferably, the second encapsulation sublayer includes a plurality of encapsulation portions spaced apart, wherein the orthographic projection of the encapsulation portions on the substrate covers the orthographic projection of the light-emitting unit on the substrate; Preferably, the first encapsulation sublayer is an organic encapsulation layer, and the first planarization layer is an organic encapsulation layer; Preferably, the second encapsulation sublayer is an inorganic material layer.
7. The display panel according to claim 1, characterized in that, The display panel further includes a first conductive layer, the first conductive layer including a first signal line located in the non-display area, the first planarization layer having a third opening, and a portion of the isolation structure located within the third opening and electrically connected to the first signal line. Preferably, the orthographic projection of the isolator on the substrate is located in the orthographic projection of the first signal line on the substrate; Preferably, the third opening is positioned at an interval from the orthographic projection of the first opening onto the substrate.
8. The display panel according to claim 7, characterized in that, The display panel further includes a second planarization layer, which is located on the side of the first conductive layer near the substrate; Preferably, the first conductive layer further includes a fourth opening penetrating the first signal line, and the first planarization layer and the second planarization layer are in contact through the fourth opening; Preferably, the first opening and the fourth opening are spaced apart in the orthographic projection of the substrate. Preferably, the plurality of first openings and the plurality of third openings are alternately spaced along a first direction in their orthographic projections onto the substrate. The plurality of third openings are alternately spaced along the first direction in the orthographic projection of the substrate and the plurality of fourth openings.
9. The display panel according to claim 7, characterized in that, The display panel further includes a second electrode layer, which includes a plurality of second electrodes. The second electrodes are disposed on the side of the light-emitting unit away from the substrate. The second electrodes overlap with the isolation structure and are electrically connected to the isolation structure.
10. The display panel according to claim 1, characterized in that, The isolation structure includes a first isolation layer and a second isolation layer stacked together. The first isolation layer is disposed on the side of the second isolation layer close to the substrate, and the orthographic projection of the first isolation layer on the substrate is located within the orthographic projection of the second isolation layer on the substrate. Preferably, the orthographic projection of the isolation member onto the substrate overlaps with the orthographic projection portion of the isolation structure onto the substrate.
11. The display panel according to claim 10, characterized in that, The projected area of the surface of the second isolation layer facing away from the substrate on the substrate is smaller than the projected area of the surface of the second isolation layer facing away from the substrate on the substrate. Preferably, the projected area of the surface of the first isolation layer facing away from the substrate on the substrate is smaller than the projected area of the surface of the second isolation layer facing away from the substrate on the substrate. Preferably, the display panel further includes a second electrode layer located in the display area. The second electrode layer includes a plurality of second electrodes. The second electrodes are disposed on the side of the light-emitting unit away from the substrate. The second electrodes overlap and are electrically connected to the first isolation layer.
12. A display panel, characterized in that, The display panel has a display area and a non-display area, the non-display area being disposed around at least a portion of the display area; the display panel includes: substrate; A first planarization layer is disposed on one side of the substrate; A pixel definition layer is located on the side of the first planarization layer opposite to the substrate. The pixel definition layer includes a plurality of pixel openings and at least one second opening. The pixel openings are located in the display area, and the second opening is located in the non-display area. At least a portion of the orthographic projection of the second opening on the substrate is located within the orthographic projection of the first planarization layer on the substrate. The light-emitting device layer includes a plurality of light-emitting units located in the display area, at least a portion of the light-emitting units being disposed within the pixel opening, and the light-emitting units comprising organic electroluminescent materials; An encapsulation layer is located on the side of the pixel definition layer opposite to the substrate and covers at least a portion of the second opening; An isolator is located in the non-display area, the isolator isolating the first planarization layer and the encapsulation layer, and the orthographic projection of the isolator on the substrate at least partially overlaps with the orthographic projection of the second opening on the substrate.
13. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area, wherein the non-display area is disposed around at least a portion of the display area; the manufacturing method includes: A substrate is provided, on which a first planarization layer is disposed; A first electrode layer is formed on the first planarization layer. The first electrode layer includes a plurality of first electrodes located in the display area and isolation electrodes located in the non-display area. The isolation electrodes are multiplexed as isolation elements. An isolation structure is formed on the side of the first electrode layer away from the substrate. The isolation structure has a plurality of isolation openings and at least one first opening. The isolation openings are located in the display area, and the first opening is located in the non-display area. The orthographic projection of the first opening on the substrate at least partially overlaps with the orthographic projection of the isolation electrode on the substrate. A light-emitting device layer is provided through the isolation structure, the light-emitting device layer including a plurality of light-emitting units located in the display area, at least a portion of the light-emitting units being disposed within the isolation opening; An encapsulation layer is formed on the side of the isolation structure opposite to the substrate, and the isolation member spacers the first planarization layer and the encapsulation layer.
14. The method for manufacturing a display panel according to claim 13, characterized in that, After forming the first electrode layer on the first planarization layer, the process includes: The first electrode layer is annealed. Preferably, in the annealing process, the annealing temperature is 200℃~240℃ and the annealing time is 30min~70min.
15. A display device, characterized in that, It includes a display panel as described in any one of claims 1 to 12, or a display panel prepared by the preparation method as described in any one of claims 13 to 14.
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