Display panel, preparation method thereof and display device

Abstract

The embodiment of the invention provides a display panel, a preparation method thereof and a display device, the display panel is provided with a display area and a non-display area, and the display panel further comprises a substrate, a wiring layer and a planarization layer. The wiring layer comprises a first wiring sub-layer and a second wiring sub-layer which are stacked, the first wiring sub-layer comprises a plurality of first wiring sub-parts, the second wiring sub-layer comprises a plurality of second wiring sub-parts, each first wiring sub-part is in lap joint with two adjacent second wiring sub-parts, and each second wiring sub-part is in lap joint with two adjacent first wiring sub-parts. The planarization layer comprises a planarization part and at least one retaining wall part, the retaining wall part is arranged around the planarization part, and the wiring layer is arranged in the mode that the planarization part penetrates through the retaining wall part in the direction from the display area to the non-display area. According to the display panel provided by the embodiment of the first aspect, the first wiring sub-parts and the second wiring sub-parts are in alternate lap joint, a water and oxygen transverse diffusion path is blocked through the physical isolation effect of the retaining wall parts, and the problem of device failure caused by water and oxygen permeation in the display panel is solved.

Description

Technical Field

[0001] This application relates to the field of display device technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is widely used in the field of smart terminals due to its advantages of self-illumination, wide color gamut and thinness.

[0003] However, its organic materials and metal electrodes are highly sensitive to water and oxygen, and irreversible chemical reactions can easily occur after contact, leading to a decrease in luminous efficiency or even device failure.

[0004] Encapsulation technology is crucial to ensuring the long-term stability of OLEDs. In existing processes, titanium-aluminum-titanium stacked metal traces are often set in the encapsulation area to transmit power signals. However, the aluminum layer is prone to lateral depressions during etching, which causes the subsequently coated organic adhesive material to remain in the depressions, forming a continuous penetration path.

[0005] Continuous pathways provide a channel for water and oxygen to invade, allowing them to diffuse along the organic adhesive-metal interface into the active area (AA area), causing pixel failure or dark spot diffusion. Although existing technologies block water and oxygen by depositing inorganic layers, there are still problems such as increased cost, and they cannot completely block the continuity of the residual organic adhesive pathway. Summary of the Invention

[0006] This application provides a display panel and its manufacturing method, as well as a display device, which can effectively reduce the probability of water vapor intrusion along the path of the wiring side.

[0007] According to an embodiment of this application, a display panel is provided, having a display area and a non-display area surrounding the display area. The display panel includes: a substrate; a wiring layer located on one side of the substrate, the wiring layer including a first wiring sublayer and a second wiring sublayer stacked in a direction away from the substrate, the first wiring sublayer including a plurality of first wiring sub-parts, the second wiring sublayer including a plurality of second wiring sub-parts, each first wiring sub-part overlapping with two adjacent second wiring sub-parts, and each second wiring sub-part overlapping with two adjacent first wiring sub-parts; a planarization layer located on the side of the wiring layer away from the substrate, the planarization layer including a planarization portion and at least one barrier portion, the planarization portion being at least partially located in the display area, the barrier portion being at least partially located in the non-display area and surrounding the planarization portion, and the wiring layer being disposed through the planarization portion and the barrier portion at least in the direction from the display area to the non-display area.

[0008] The display panel provided in the first aspect of this application, through the layered wiring structure of the first wiring sub-part and the second wiring sub-part and the design of the barrier part, the wiring layer is composed of the first wiring sub-layer and the second wiring sub-layer overlapping alternately. The first wiring sub-part and the second wiring sub-part nest and cover each other in the horizontal direction to form a multi-layer blocking structure that blocks the path of water and oxygen intrusion along the edge of the wiring. At the same time, the physical isolation effect of the barrier part further blocks the lateral diffusion path of water and oxygen from the non-display area to the display area, thus solving the problem of device failure caused by water and oxygen infiltration in the display panel.

[0009] Secondly, according to embodiments of this application, a method for manufacturing a display panel is provided, comprising: Multiple spaced first wiring sub-sections are fabricated on one side of the substrate to form a first wiring sub-layer; Multiple second wiring sub-sections are prepared on the side of the first wiring sub-layer away from the substrate and a second wiring sub-layer is formed. Each first wiring sub-section overlaps with two adjacent second wiring sub-sections, and each second wiring sub-section overlaps with two adjacent first wiring sub-sections. The first wiring sub-layer and the second wiring sub-layer form a wiring layer. A planarization portion is prepared on the side of the wiring layer away from the substrate corresponding to the display area, and a barrier portion is prepared on the side of the wiring layer away from the substrate corresponding to the non-display area. The barrier portion surrounds the planarization portion, and the wiring layer is provided from the planarization portion and through the barrier portion at least along the direction from the display area to the non-display area. The barrier portion and the planarization portion form a planarization layer.

[0010] Thirdly, according to the embodiments of this application, a display device is provided, including a display panel provided in any embodiment of the first aspect of this application, or a display panel formed by the method for preparing a display panel provided in any embodiment of the second aspect of this application. Attached Figure Description

[0011] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0012] Figure 1 This is a schematic diagram of the edge structure of a display panel provided by related technologies; Figure 2 This is a schematic diagram of the overall structure of a display panel provided in the first aspect embodiment of this application; Figure 3 yes Figure 2 A magnified structural diagram of region A in the middle; Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure along the BB direction; Figure 5 yes Figure 2 Another enlarged structural diagram of region A in the middle; Figure 6 yes Figure 5 A schematic diagram of a cross-sectional structure along the BB direction; Figure 7 yes Figure 3 A schematic diagram of a cross-sectional structure along the CC direction; Figure 8 yes Figure 5 A schematic diagram of a cross-sectional structure along the CC direction; Figure 9 This is a flowchart illustrating a method for manufacturing a display panel according to a second aspect embodiment of this application; Figure 10 This is a flowchart illustrating another method for manufacturing a display panel according to a second aspect embodiment of this application; Figures 11a to 11d This is a process flow diagram of a method for manufacturing a display panel according to a second aspect embodiment of this application; Figure 12 This is a flowchart illustrating another method for manufacturing a display panel according to a second aspect embodiment of this application; Figures 13a to 13c This is a process flow diagram of a method for manufacturing a display panel according to a second aspect embodiment of this application; Figure 14 This is a schematic diagram of the overall structure of a display device provided in the third aspect of this application.

[0013] in: 100 - Display panel; AA - Display area; NA - Non-display area; 10-Substrate; 20 - Wiring layer; 21-First routing sublayer; 21'-First routing material layer; 210-First routing subsection; 22-Second wiring sublayer; 22'-Second wiring material layer; 220-Second wiring section; 220a-Overlap section; 220b-Extension section; 30 - Planarization layer; 31 - Planarization section; 32 - Retaining wall section; 40 - Insulation layer; 40' - Insulation material layer; 41 - Via; 50 - Dielectric layer; 200 - Display device; X - First direction; Y - Second direction.

[0014] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0015] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0016] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the display panel and display module of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0017] Organic light-emitting diode (OLED) display technology has been widely used in smartphones, tablets, automotive displays and other fields due to its self-emissive properties, wide color gamut, high contrast and thinness, and is gradually developing towards large-size flexible displays.

[0018] However, OLED devices are extremely sensitive to moisture and oxygen in the environment. Once their organic materials and metal electrodes come into contact with water and oxygen, an irreversible chemical reaction will occur, leading to a decrease in luminous efficiency or even device failure.

[0019] Figure 1 The diagram illustrates a structure for the edge of a display panel provided by related technologies.

[0020] Therefore, packaging technology has become a core component in ensuring the long-term stable operation of OLEDs. Please refer to [link / reference]. Figure 1 In related technologies, in existing processes, the packaging area is usually provided with metal layer traces to transmit power signals such as positive power supply voltage and negative power supply voltage control signals.

[0021] Metal layer traces often employ a Ti / Al / Ti (titanium / aluminum / titanium) stacked structure to balance conductivity and adhesion. However, in actual manufacturing, the aluminum layer is prone to lateral etching during the etching process, forming localized depressions. This results in residual organic adhesive material being applied laterally at these depressions, creating continuous organic adhesive residue paths.

[0022] The residual path of the organic adhesive provides a channel for moisture to permeate, allowing water and oxygen outside the encapsulation area to invade the active area (AA area) of the display through the residual path of the organic adhesive, ultimately causing pixel failure or dark spot diffusion, threatening the reliability and lifespan of the device.

[0023] To address this issue, existing technologies typically deposit an inorganic protective layer above the metal layer traces to physically block the water vapor permeation path.

[0024] However, the protection scheme of depositing inorganic protective layers has defects. On the one hand, the additional inorganic layer deposition requires an additional photomask process, which increases the manufacturing cost. On the other hand, although the inorganic layer can cover the metal sidewall, if the residual path of organic glue is not completely cut off, it may still form a penetrating channel.

[0025] In order to solve the above-mentioned technical problems and for technical considerations, this application provides a display panel and its preparation method and display device, which can effectively reduce the probability of water vapor intrusion along the path of the wiring side.

[0026] The following will combine Figures 2 to 14 The display panel, its manufacturing method, and the display device provided in the embodiments of this application will be further described.

[0027] Figure 2 This illustration shows the overall structure of a display panel 100 provided in a first aspect embodiment of this application. Figure 3 It shows Figure 2 An enlarged structure in region A of the middle.

[0028] Please see Figures 2 to 3 In a first aspect, embodiments of this application provide a display panel 100 having a display area AA and a non-display area NA disposed around the display area AA. The display panel 100 includes a substrate 10, a wiring layer 20, and a planarization layer 30.

[0029] The wiring layer 20 is located on one side of the substrate 10. The wiring layer 20 includes a first wiring sub-layer 21 and a second wiring sub-layer 22 stacked in a direction away from the substrate 10. The first wiring sub-layer 21 includes a plurality of first wiring sub-sections 210, and the second wiring sub-layer 22 includes a plurality of second wiring sub-sections 220. Each first wiring sub-section 210 overlaps with two adjacent second wiring sub-sections 220, and each second wiring sub-section 220 overlaps with two adjacent first wiring sub-sections 210.

[0030] The planarization layer 30 is located on the side of the wiring layer 20 away from the substrate 10. The planarization layer 30 includes a planarization portion 31 and at least one barrier portion 32. The planarization portion 31 is at least partially located in the display area AA, and the barrier portion 32 is at least partially located in the non-display area NA and is disposed around the planarization portion 31. The wiring layer 20 is disposed by passing through the barrier portion 32 from the planarization portion 31 at least along the direction from the display area AA to the non-display area NA.

[0031] The display panel 100 provided in the first aspect of this application, through the layered wiring structure of the first wiring sub-section 210 and the second wiring sub-section 220 and the design of the barrier section 32, the wiring layer 20 is composed of the alternating overlapping of the first wiring sub-section 21 and the second wiring sub-section 22. The first wiring sub-section 210 and the second wiring sub-section 220 are nested and covered by each other in the horizontal direction to form a multi-layer blocking structure that blocks the path of water and oxygen intrusion along the edge of the wiring. At the same time, the physical isolation effect of the barrier section 32 further blocks the lateral diffusion path of water and oxygen from the non-display area NA to the display area AA, thus solving the device failure problem caused by water and oxygen infiltration in the display panel 100.

[0032] The alternating overlap design of the first wiring sub-section 210 and the second wiring sub-section 220 interrupts the originally continuously distributed organic adhesive residue path by the overlap area of ​​the first wiring sub-section 210 and the second wiring sub-section 220, which are distributed in layers of the first wiring sub-layer 21 and the second wiring sub-layer 22, thereby reducing the possibility of moisture penetration along the metal sidewall.

[0033] Meanwhile, the baffle portion 32 of the planarization layer 30 is set around the display area AA, and the physical isolation effect of the baffle portion 32 further blocks the lateral diffusion path of water and oxygen from the non-display area NA to the display area AA.

[0034] Furthermore, the display panel 100 provided in the first aspect embodiment of this application does not require the additional preparation of an inorganic protective layer covering the first wiring sub-section 210 and the second wiring sub-section 220 on the wiring layer 20, thus avoiding the increased complexity and cost due to additional masking processes.

[0035] The substrate 10 serves as the structural support for the display panel 100 and provides basic support.

[0036] The device in the display area AA within the substrate 10 undertakes the functions of driving the light-emitting device and displaying light. The driving signal for controlling the light emission needs to be transmitted from the first trace sub-section 210 and the second trace sub-section 220 of the trace layer 20 located in the non-display area NA through the barrier section 32 to the display area AA. Therefore, a possible water and oxygen intrusion path is formed on the barrier section 32 that laterally blocks water and oxygen.

[0037] On one side of the substrate 10, the wiring layer 20 passes through the barrier portion 32 to ensure the stability of power signal transmission. The signal passes through the display area AA and the non-display area NA. The control signals of the flexible circuit board and control chip outside the display panel 100 can be output from the non-display area NA to the display area AA via the first wiring sub-part 210 and the second wiring sub-part 220 of the wiring layer 20.

[0038] The routing layer 20 is formed by stacking a first routing sublayer 21 and a second routing sublayer 22 along the direction away from the substrate 10. The first routing sublayer 21 includes a plurality of first routing sub-sections 210, and the second routing sublayer 22 includes a plurality of second routing sub-sections 220. Each first routing sub-section 210 overlaps with two adjacent second routing sub-sections 220, and each second routing sub-section 220 also overlaps with two adjacent first routing sub-sections 210, forming a layered routing structure that nests and covers each other in the horizontal direction.

[0039] The alternating overlap of the first wiring sub-section 210 and the second wiring sub-section 220 interrupts the possible water and oxygen intrusion path. This causes the originally continuous distribution of the metal sidewalls to be interrupted by the overlapping area of ​​the layered wiring sub-sections, thereby blocking the continuity of the organic adhesive residue path.

[0040] When organic adhesive material is partially retained in subsequent processes due to the depression of the metal sidewall, the distribution of organic adhesive material is divided into discontinuous segments by the alternating overlapping structure of the first wiring sub-section 210 and the second wiring sub-section 220, making it impossible to form a water and oxygen permeation channel that runs through the inside and outside of the encapsulation area.

[0041] The planarization layer 30 includes a planarization portion 31 located in the display area AA and a barrier portion 32 disposed around the planarization portion 31. The barrier portion 32 is at least partially located in the non-display area NA and disposed around the planarization portion 31, and can further block the lateral diffusion path of water and oxygen from the non-display area NA to the display area AA through physical isolation.

[0042] By combining the first wiring sub-section 210 and the second wiring sub-section 220 with the barrier section 32, the display panel 100 provided in the first aspect embodiment of this application can achieve dual protection without the need for additional deposition of an inorganic protective layer, which not only improves the reliability of the packaging, but also simplifies the manufacturing process and reduces the production cost.

[0043] For example, the first wiring sub-section 210 overlaps with two adjacent second wiring sub-sections 220, and the second wiring sub-section 220 overlaps with two adjacent first wiring sub-sections 210; therefore, the signal wiring used to transmit control signals and formed by the overlap of the first wiring sub-sections 210 and the second wiring sub-sections 220 is changed more than or equal to 2 times between the first wiring sub-layer 21 and the second wiring sub-layer 22, thereby achieving better blocking of water and oxygen intrusion paths.

[0044] For example, both the first trace sub-section 210 and the second trace sub-section 220 are three-layer stacked trace structures, including three Ti / Al / Ti (titanium / aluminum / titanium) layers. In the etching process, the middle aluminum layer is selectively etched compared to the titanium layer, forming a recessed structure on both sides.

[0045] Please see Figure 3 In some embodiments, the minimum spacing between two adjacent first wiring sub-sections 210 is not less than 10 micrometers, or the minimum spacing between two adjacent second wiring sub-sections 220 is not less than 10 micrometers.

[0046] In these embodiments, the design that the gap between adjacent first trace sub-sections 210 or adjacent second trace sub-sections 220 is greater than 10 micrometers ensures that the inorganic layer located between the first trace sub-layer 21 and the second trace sub-layer 22, or the inorganic layer on the side of the second trace sub-layer 22 facing away from the substrate 10, avoids stacking stress concentration and cracking at the gap between adjacent first trace sub-sections 210 or adjacent second trace sub-sections 220.

[0047] The design of setting a sufficient interval between adjacent first wiring sub-sections 210 or adjacent second wiring sub-sections 220 can effectively improve the stress distribution of the inorganic layer above the first wiring sub-sections 210 and the second wiring sub-sections 220 and enhance the structural stability.

[0048] In a layered wiring structure formed by alternating overlap of the first wiring sub-layer 21 and the second wiring sub-layer 22, if the spacing between adjacent first wiring sub-sections 210 or adjacent second wiring sub-sections 220 is too small, the inorganic layer on top will experience stress concentration in the overlapping area due to the difference in thermal expansion coefficients, which may lead to cracks or even delamination.

[0049] By controlling the spacing between adjacent first wiring sub-sections 210 or adjacent second wiring sub-sections 220 to more than 10 micrometers, the inorganic layer can maintain a uniform film morphology when covering the gap between adjacent first wiring sub-sections 210 or adjacent second wiring sub-sections 220, thus avoiding local stress accumulation.

[0050] In addition, the spacing design of adjacent first wiring sub-sections 210 or adjacent second wiring sub-sections 220 makes the inorganic layer film formed on the cover smooth, providing process tolerance space for the subsequent formation of planarization layer 30, ensuring that the barrier section 32 can completely cover the boundary of the non-display area NA, and further enhancing the water and oxygen isolation effect.

[0051] For example, since the inorganic layer covering the first wiring sub-section 210 or the second wiring sub-section 220 has a flat morphology, the structure in the wiring layer 20 where the first wiring sub-section 210 and the second wiring sub-section 220 alternately overlap does not need to avoid the barrier section 32.

[0052] The alternating overlap of the first wiring sub-section 210 and the second wiring sub-section 220, combined with spacing control, not only blocks and suppresses the penetration channels caused by organic adhesive residue through physical path blocking, but also improves the overall reliability of the packaging structure by optimizing the stress distribution of the inorganic layer.

[0053] Figure 4 It shows Figure 3 A cross-sectional structure along the BB direction.

[0054] Please see Figures 3 to 4 In some embodiments, the display panel 100 further includes an insulating layer 40 located between the first wiring sub-layer 21 and the second wiring sub-layer 22. The insulating layer 40 includes a via 41, the orthographic projection of which overlaps with two adjacent first wiring sub-sections 210 on the substrate 10.

[0055] In these embodiments, the first wiring sub-section 210 and the second wiring sub-section 220 are connected by a via 41. The size of the via 41 affects the overlap area and morphology of the first wiring sub-section 210 and the second wiring sub-section 220, which will be further explained in subsequent embodiments of the first aspect of this application.

[0056] The insulating layer 40 serves as a physical isolation medium, ensuring interlayer insulation between the first wiring sub-section 210 and the second wiring sub-section 220, while also controlling the overlap shape of the two through the size design of the via 41.

[0057] For example, the insulating layer 40 is disposed between the first trace sub-section 210 and the second trace sub-section 220. The width dimension of the via 41 is compared with the width dimension of the first trace sub-section 210, which means whether the edge of the first trace sub-section 210 can be covered by the insulating layer 40, thereby achieving an additional layer of protection against water and oxygen.

[0058] For example, the insulating layer 40 is disposed between the first wiring sub-section 210 and the second wiring sub-section 220. The length dimension of the via 41 is compared with the length dimension of the first wiring sub-section 210, which means whether the edge of the first wiring sub-section 210 can be covered by the insulating layer 40, thereby achieving an additional layer of protection against water and oxygen.

[0059] For example, the insulating layer 40 is disposed between the first trace sub-section 210 and the second trace sub-section 220. The width dimension of the via 41 is compared with the width dimension of the second trace sub-section 220, which means whether the edge of the second trace sub-section 220 is raised, and determines the actual overlap area between the first trace sub-section 210 and the second trace sub-section 220. The overlap area is designed according to the specific operating current.

[0060] For example, the insulating layer 40 is disposed between the first trace sub-section 210 and the second trace sub-section 220. The length dimension of the via 41 is compared with the length dimension of the second trace sub-section 220, which means whether the edge of the second trace sub-section 220 is raised, and determines the actual overlap area between the first trace sub-section 210 and the second trace sub-section 220. The overlap area is designed according to the specific operating current.

[0061] Please continue reading. Figures 3 to 4 In some embodiments, a plurality of first trace sub-parts 210 are arranged at intervals along a first direction X, a plurality of second trace sub-parts 220 are arranged at intervals along the first direction X, and the width of the via 41 along the second direction Y is smaller than the width of the first trace sub-parts 210 along the second direction Y, and the first direction X intersects the second direction Y.

[0062] In these embodiments, in the second direction Y, the width of the via 41 is smaller than the width of the first trace sub-section 210, so that the insulating layer 40 can cover the edge of the first trace, providing an additional layer of protection against water and oxygen for the first trace sub-section 210.

[0063] The first trace sub-section 210 and the second trace sub-section 220, which are arranged at intervals along the first direction X, are combined with the design of the via 41, which is smaller in size than the width of the first trace sub-section 210 in the second direction Y, so that the insulating layer 40 can cover and protect the edge of the first trace sub-section 210.

[0064] When the width of the via 41 along the second direction Y is less than the corresponding width of the first trace portion 210, the insulating layer 40 can extend to the edge region of the first trace portion 210 to form an additional physical barrier to block the path of water and oxygen to penetrate along the metal sidewall.

[0065] The via 41 is designed to be smaller than the width of the first trace sub-section 210 in the second direction Y. By adjusting the size relationship between the via 41 and the trace sub-section, the insulating layer 40 can cover the edge area of ​​the first trace sub-section 210, providing an additional layer of protection against water and oxygen.

[0066] Please continue reading. Figures 3 to 4 In some embodiments, the width of the second trace sub-section 220 along the second direction Y is less than or equal to the width of the via 41 along the second direction Y.

[0067] In these embodiments, in the second direction Y, the second trace sub-section 220 is completely overlapped with the first trace sub-section 210, and the overlap size of the first trace sub-section 210 and the second trace sub-section 220 in the second direction Y depends on the width of the second trace sub-section 220 in the second direction Y.

[0068] For example, the display panel 100 provided in this embodiment, the first wiring sub-section 210 and the second wiring sub-section 220 are used to transmit working signals with large operating current.

[0069] The width of the second trace sub-section 220 along the second direction Y is set to be less than or equal to the width of the via 41 along the second direction Y, so that the second trace sub-section 220 can be completely located within the edge area of ​​the first trace sub-section 210, thereby achieving a stable overlap between the first trace sub-section 210 and the second trace sub-section 220.

[0070] When the width of the second trace sub-section 220 is limited to the width of the via 41, the overlap area between the second trace sub-section 220 and the first trace sub-section 210 in the second direction Y is directly determined by the width of the second trace sub-section 220. This ensures the continuity of the current transmission path and avoids the problem of overlap misalignment caused by the via 41 being too wide.

[0071] Meanwhile, the insulation layer 40 further constructs an additional water and oxygen barrier by covering the edge area of ​​the first wiring sub-section 210 that is not overlapped by the second wiring sub-section 220, effectively suppressing the continuity of the organic adhesive residual path.

[0072] Furthermore, the matching relationship between the width of the second trace sub-section 220 and the size of the via 41 optimizes the stress distribution between metal layers. The smaller width of the second trace sub-section 220 can reduce the risk of deformation caused by local thermal expansion differences.

[0073] For example, the width of the second trace sub-section 220 along the second direction Y is smaller than the width of the first trace sub-section 210 along the second direction Y.

[0074] Figure 5 It shows Figure 2 Another enlarged structure of region A in the middle, Figure 6 It shows Figure 5 A profile mechanism in the BB direction.

[0075] Please see Figures 5 to 6 In some embodiments, the width of the second trace sub-section 220 along the second direction Y is greater than the width of the via 41 along the second direction Y. The second trace sub-section 220 includes an overlap portion 220a and an extension portion 220b. The overlap portion 220a overlaps with the first trace sub-section 210, and the extension portion 220b is located on the side of the insulating layer 40 away from the substrate 10 and is located on at least one side of the overlap portion 220a along the second direction Y.

[0076] In these embodiments, in the second direction Y, the second trace sub-part 220 and the first trace sub-part 210 overlap through the via 41 and the overlap portion 220a, and also include extension portions 220b on both sides of the insulating layer 40 away from the substrate 10, which present a shape with raised sides in the second direction Y, further improving the bonding effect between the second trace sub-part 220 and the insulating layer 40 and the first trace sub-part 210, making the overlap effect more solid and preventing subsequent processes from damaging the second trace sub-part 220.

[0077] The second trace sub-section 220 is configured with a width greater than the width of the via 41 along the second direction Y, forming a segmented design including an overlap portion 220a and an extension portion 220b. The overlap portion 220a is electrically connected to the first trace sub-section 210 through the via 41, while the extension portion 220b extends to the side of the insulating layer 40 away from the substrate 10 and presents a raised shape on both sides of the overlap portion 220a.

[0078] The physical extension of the extension portion 220b enhances the mechanical bonding force between the second trace portion 220 and the insulating layer 40. At the same time, the raised structure can effectively disperse the lateral stress that may be applied in subsequent process steps, reducing the risk of fracture of the metal layer of the second trace portion 220 due to stress concentration.

[0079] The overlap portion 220a ensures a stable electrical connection between the first wiring sub-part 210 and the second wiring sub-part 220, while the extension portion 220b, by covering the surface of the insulating layer 40 and forming a local protrusion, not only strengthens the adhesion between the metal layer and the insulating layer 40, but also further blocks the vertical penetration path of water and oxygen along the junction of the insulating layer 40 and the second wiring sub-part 220.

[0080] In addition, the raised shape of the extension portion 220b can also serve as a buffer structure to absorb the slight deformation caused by the difference in thermal expansion coefficients, thereby improving the overall stability of the layered wiring structure of the first wiring sub-part 210 and the second wiring sub-part 220.

[0081] For example, the display panel 100 provided in this embodiment, the first wiring sub-section 210 and the second wiring sub-section 220 are used to transmit operating signals with a small operating current.

[0082] Please continue reading. Figures 5 to 6 In some embodiments, the width of the second trace sub-section 220 along the second direction Y is greater than the width of the first trace sub-section 210 along the second direction Y.

[0083] In these embodiments, the second wiring sub-section 220 extends beyond the first wiring sub-section 210 in the second direction Y, which can also achieve the function of interrupting the water and oxygen permeation path and blocking water and oxygen intrusion.

[0084] The width of the second wiring sub-section 220 along the second direction Y is greater than the corresponding width of the first wiring sub-section 210, and the second wiring sub-section 220 extends beyond the first wiring sub-section 210 in the second direction Y, further enhancing the ability to block the water and oxygen permeation path.

[0085] The extended design of the second wiring sub-section 220 allows it to cover a wider area in the horizontal direction, thereby increasing the distance between the edges of the first wiring sub-section 210 and interrupting the penetration path that may be formed by etching depressions or organic glue residue. It also interrupts the continuous water and oxygen diffusion channel through physical overlap.

[0086] Meanwhile, the extended portion of the second wiring sub-section 220 forms a tighter interface contact with the insulation layer 40, and by utilizing the synergistic effect of the metal layer and the insulation layer 40, an additional water and oxygen barrier is also constructed in the vertical direction.

[0087] In addition, by increasing the lateral coverage of the second wiring sub-section 220, the risk of insufficient overlap due to local process deviations is reduced, and the stability of the electrical connection between metal layers is improved.

[0088] Figure 7 It shows Figure 3 A cross-sectional structure along the CC direction.

[0089] Please see Figure 3 and Figure 7 In some embodiments, the length of the second trace sub-section 220 along the first direction X is less than or equal to the length of the via 41 along the first direction X.

[0090] In these embodiments, in the first direction X, the second trace sub-section 220 is completely overlapped with the first trace sub-section 210, and the overlap size of the first trace sub-section 210 and the second trace sub-section 220 in the first direction X depends on the length of the second trace sub-section 220 in the first direction X.

[0091] For example, the display panel 100 provided in this embodiment, the first wiring sub-section 210 and the second wiring sub-section 220 are used to transmit working signals with large operating current.

[0092] The length of the second trace sub-section 220 along the first direction X is set to be less than or equal to the length of the via 41 along the first direction X, so that the second trace sub-section 220 can be completely located within the edge area of ​​the first trace sub-section 210, thereby achieving a stable overlap between the first trace sub-section 210 and the second trace sub-section 220.

[0093] When the width of the second trace sub-section 220 is limited to the width of the via 41, the overlap area between the second trace sub-section 220 and the first trace sub-section 210 in the second direction Y is directly determined by the width of the second trace sub-section 220. This ensures the continuity of the current transmission path and avoids the problem of overlap misalignment caused by the via 41 being too wide.

[0094] Meanwhile, the insulation layer 40 further constructs an additional water and oxygen barrier by covering the edge area of ​​the first wiring sub-section 210 that is not overlapped by the second wiring sub-section 220, effectively suppressing the continuity of the organic adhesive residual path.

[0095] Furthermore, the matching relationship between the length of the second trace sub-section 220 and the size of the via 41 optimizes the stress distribution between metal layers, and the smaller length of the second trace sub-section 220 can reduce the risk of deformation caused by local thermal expansion differences.

[0096] Figure 8 It shows Figure 3 Another cross-sectional structure along the CC direction.

[0097] Please see Figure 5 and Figure 8 In some embodiments, the length of the second trace sub-section 220 along the first direction X is greater than the length of the via 41 along the first direction X. The second trace sub-section 220 includes an overlap portion 220a and an extension portion 220b. The overlap portion 220a overlaps with the first trace sub-section 210, and the extension portion 220b is located on the side of the insulating layer 40 away from the substrate 10 and is located on at least one side of the overlap portion 220a along the first direction X.

[0098] In these embodiments, in the first direction X, while the second trace sub-part 220 and the first trace sub-part 210 overlap through the via 41 and the overlap portion 220a, it also includes extension portions 220b on both sides of the insulating layer 40 away from the substrate 10, which present a shape with raised sides in the first direction X, further improving the bonding effect between the second trace sub-part 220 and the insulating layer 40 and the first trace sub-part 210, making the overlap effect more solid and preventing subsequent processes from damaging the second trace sub-part 220.

[0099] The second trace sub-section 220 is configured with a length greater than that of the via 41 along the first direction X, forming a segmented design including an overlap portion 220a and an extension portion 220b. The overlap portion 220a is electrically connected to the first trace sub-section 210 through the via 41, while the extension portion 220b extends to the side of the insulating layer 40 away from the substrate 10 and presents a raised shape on both sides of the overlap portion 220a.

[0100] The physical extension of the extension portion 220b enhances the mechanical bonding force between the second trace portion 220 and the insulating layer 40. At the same time, the raised structure can effectively disperse the lateral stress that may be applied in subsequent process steps, reducing the risk of fracture of the metal layer of the second trace portion 220 due to stress concentration.

[0101] The overlap portion 220a ensures a stable electrical connection between the first wiring sub-part 210 and the second wiring sub-part 220, while the extension portion 220b, by covering the surface of the insulating layer 40 and forming a local protrusion, not only strengthens the adhesion between the metal layer and the insulating layer 40, but also further blocks the vertical penetration path of water and oxygen along the junction of the insulating layer 40 and the second wiring sub-part 220.

[0102] In addition, the raised shape of the extension portion 220b can also serve as a buffer structure to absorb the slight deformation caused by the difference in thermal expansion coefficients, thereby improving the overall stability of the layered wiring structure of the first wiring sub-part 210 and the second wiring sub-part 220.

[0103] For example, the display panel 100 provided in this embodiment, the first wiring sub-section 210 and the second wiring sub-section 220 are used to transmit operating signals with a small operating current.

[0104] Figure 9 The flowchart illustrates the steps of a method for manufacturing a display panel according to a second aspect embodiment of this application.

[0105] Please see Figure 9 Secondly, embodiments of this application provide a method for manufacturing a display panel, comprising: Step S10: Prepare multiple spaced first wiring sub-parts on one side of the substrate and form a first wiring sub-layer; Step S20: A plurality of second wiring sub-parts are prepared on the side of the first wiring sub-layer away from the substrate and a second wiring sub-layer is formed. Each first wiring sub-part overlaps with two adjacent second wiring sub-parts, and each second wiring sub-part overlaps with two adjacent first wiring sub-parts. The first wiring sub-layer and the second wiring sub-layer form a wiring layer. Step S30: A planarization portion is prepared on the side of the wiring layer away from the substrate corresponding to the display area, and a barrier portion is prepared on the side of the wiring layer away from the substrate corresponding to the non-display area. The barrier portion surrounds the planarization portion, and the wiring layer is provided from the planarization portion and through the barrier portion at least along the direction from the display area to the non-display area. The barrier portion and the planarization portion form a planarization layer.

[0106] The method for preparing a display panel provided in the second aspect of this application is used to prepare the display panel provided in any of the first aspects of this application, and therefore has the beneficial effects of the display panel provided in any of the first aspects of this application, which will not be described in detail here.

[0107] Figure 10 The flowchart illustrates the steps of another method for manufacturing a display panel according to an embodiment of the second aspect of this application. Figures 11a to 11d This is a process flow of a method for manufacturing a display panel provided in the second aspect of this application.

[0108] Please see Figure 10 and Figures 11a to 11d In some embodiments, step S10 further includes: Step S11: Prepare a first wiring material layer 21' on one side of the substrate 10; Step S12: The first trace material layer 21' is patterned to form multiple spaced first trace sub-parts 210, and the minimum spacing between two adjacent first trace sub-parts 210 is not less than 10 micrometers. Step S13: Prepare an insulating material layer 40' on the side of the first trace sub-section 210 away from the substrate 10; Step S14: Pattern the insulating material layer 40' to form an insulating layer 40. The insulating layer 40 includes a via 41. The orthographic projection of the via 41 on the substrate 10 overlaps with two adjacent first trace sub-parts 210.

[0109] In these embodiments, when the first trace material layer 21' is patterned, by controlling the spacing between adjacent first trace sub-parts 210 to be more than 10 micrometers, the insulating layer 40 can maintain a uniform film morphology when covering the gap between adjacent first trace sub-parts 210, thus avoiding local stress accumulation.

[0110] In addition, the spacing design between adjacent first wiring sub-sections 210 makes the insulation layer 40 on top of it form a smooth film, providing process tolerance space for the formation of the subsequent planarization layer, ensuring that the barrier can completely cover the boundary of the non-display area, and further enhancing the water and oxygen isolation effect.

[0111] For example, the process of patterning the first trace material layer 21' includes photolithography.

[0112] Figure 12 The flowchart illustrates the steps of another method for manufacturing a display panel according to an embodiment of the second aspect of this application. Figures 13a to 13c This is a process flow of a method for manufacturing a display panel provided in the second aspect of this application.

[0113] Please see Figure 12 and Figures 13a to 13c In some embodiments, step S20 further includes: Step S21: Prepare a second wiring material layer 22' on the side of the first wiring sublayer 21 facing away from the substrate; Step S22: The second wiring material layer 22' is patterned to form multiple spaced second wiring sub-parts 220, and the minimum spacing between two adjacent second wiring sub-parts 220 is not less than 10 micrometers; Step S23: Prepare a dielectric layer 50 on the side of the second wiring sub-section 220 away from the substrate 10.

[0114] In these embodiments, when patterning the second trace material layer 22', by controlling the spacing between adjacent second trace sub-parts 220 to be 10 micrometers or more, the dielectric layer 50 can maintain a uniform film morphology when covering the gap between adjacent second trace sub-parts 220, thus avoiding local stress accumulation.

[0115] In addition, the spacing design of the adjacent second wiring sub-sections 220 makes the dielectric layer 50 on top of it form a smooth film, providing process tolerance space for the formation of the subsequent planarization layer, ensuring that the barrier can completely cover the boundary of the non-display area, and further enhancing the water and oxygen isolation effect.

[0116] For example, the process of patterning the second trace material layer 22' includes photolithography.

[0117] Figure 14 The overall structure of a display device 200 provided in a third aspect embodiment of this application is shown.

[0118] Please see Figure 14 Thirdly, embodiments of this application provide a display device 200, which includes a display panel 100 prepared by a method for preparing a display panel 100 provided in any embodiment of the first aspect of this application or a display panel 100 prepared by a method for preparing a display panel provided in any embodiment of the second aspect of this application.

[0119] The display device 200 provided in the second aspect of this application includes the display panel 100 provided in any of the first aspect of this application or the display panel 100 prepared by the preparation method of the display panel provided in any of the second aspect of this application. Therefore, it has the beneficial effects of the display panel 100 provided in any of the first aspect of this application or the display panel 100 prepared by the preparation method of the display panel provided in any of the second aspect of this application, which will not be described in detail here.

[0120] The display device 200 in this application embodiment includes, but is not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0121] The display device 200 can be any device with a display function, such as mobile devices such as mobile phones, tablets, laptops, handheld computers, in-vehicle electronic devices, wearable devices, ultra-mobile personal computers (UMPCs), netbooks, or personal digital assistants (PDAs), or non-mobile devices such as personal computers (PCs), televisions (TVs), ATMs, or self-service machines.

[0122] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area surrounding the display area. substrate; A wiring layer is located on one side of the substrate. The wiring layer includes a first wiring sublayer and a second wiring sublayer stacked in a direction away from the substrate. The first wiring sublayer includes a plurality of first wiring sub-sections, and the second wiring sublayer includes a plurality of second wiring sub-sections. Each first wiring sub-section overlaps with two adjacent second wiring sub-sections, and each second wiring sub-section overlaps with two adjacent first wiring sub-sections. A planarization layer is located on the side of the trace layer away from the substrate. The planarization layer includes a planarization portion and at least one barrier portion. The planarization portion is at least partially located in the display area, and the barrier portion is at least partially located in the non-display area and is disposed around the planarization portion. The trace layer is disposed through the planarization portion and the barrier portion at least along the direction from the display area to the non-display area.

2. The display panel according to claim 1, characterized in that, The minimum spacing between two adjacent first trace sub-sections is not less than 10 micrometers, or... The minimum spacing between two adjacent second wiring sub-sections shall not be less than 10 micrometers.

3. The display panel according to claim 2, characterized in that, The display panel further includes an insulating layer located between the first wiring sub-layer and the second wiring sub-layer. The insulating layer includes vias, and the vias, when projected onto the substrate, overlap with two adjacent first wiring sub-sections.

4. The display panel according to claim 3, characterized in that, Multiple first trace sub-parts are arranged at intervals along a first direction, and multiple second trace sub-parts are arranged at intervals along the first direction. The width of the via along the second direction is smaller than the width of the first trace sub-part along the second direction. The first direction intersects the second direction.

5. The display panel according to claim 4, characterized in that, The width dimension of the second trace sub-part along the second direction is less than or equal to the width dimension of the via along the second direction.

6. The display panel according to claim 4, characterized in that, The width dimension of the second trace sub-part along the second direction is greater than the width dimension of the via along the second direction. The second trace sub-part includes an overlap portion and an extension portion. The overlap portion overlaps with the first trace sub-part. The extension portion is located on the side of the insulating layer away from the substrate and is located on at least one side of the overlap portion along the second direction.

7. The display panel according to claim 6, characterized in that, The width of the second trace sub-part along the second direction is greater than the width of the first trace sub-part along the second direction.

8. The display panel according to claim 4, characterized in that, The length of the second trace sub-section along the first direction is less than or equal to the length of the via along the first direction.

9. The display panel according to claim 4, characterized in that, The length of the second trace sub-part along the first direction is greater than the length of the via along the first direction. The second trace sub-part includes an overlap portion and an extension portion. The overlap portion overlaps with the first trace sub-part. The extension portion is located on the side of the insulating layer away from the substrate and is located on at least one side of the overlap portion along the first direction.

10. A method for manufacturing a display panel, characterized in that, include: Multiple spaced first wiring sub-sections are fabricated on one side of the substrate to form a first wiring sub-layer; A plurality of second wiring sub-parts are prepared on the side of the first wiring sub-layer away from the substrate and a second wiring sub-layer is formed. Each first wiring sub-part overlaps with two adjacent second wiring sub-parts, and each second wiring sub-part overlaps with two adjacent first wiring sub-parts. The first wiring sub-layer and the second wiring sub-layer form a wiring layer. A planarization portion is prepared on the side of the trace layer opposite to the substrate corresponding to the display area, and a barrier portion is prepared on the side of the trace layer opposite to the substrate corresponding to the non-display area. The barrier portion is disposed around the planarization portion, and the trace layer is disposed from the planarization portion and through the barrier portion at least along the direction from the display area to the non-display area. The barrier portion and the planarization portion form a planarization layer.

11. The method for manufacturing a display panel according to claim 10, characterized in that, The step of preparing a plurality of spaced first wiring sub-parts on one side of the substrate and forming a first wiring sub-layer further includes: A first wiring material layer is prepared on one side of the substrate; The first trace material layer is patterned to form multiple spaced first trace sub-parts, and the minimum spacing between two adjacent first trace sub-parts is not less than 10 micrometers. An insulating material layer is prepared on the side of the first trace portion away from the substrate; The insulating material layer is patterned to form an insulating layer, the insulating layer including vias, the vias overlapping two adjacent first trace sub-parts in their orthogonal projection on the substrate.

12. The method for manufacturing a display panel according to claim 10, characterized in that, The step of preparing a plurality of spaced second wiring sub-parts on the side of the first wiring sub-layer away from the substrate and forming the second wiring sub-layer further includes: A second wiring material layer is prepared on the side of the first wiring sublayer facing away from the substrate; The second trace material layer is patterned to form multiple spaced second trace sub-parts, and the minimum spacing between two adjacent second trace sub-parts is not less than 10 micrometers. A dielectric layer is prepared on the side of the second trace that is away from the substrate.

13. A display device, characterized in that, The display panel includes any one of claims 1 to 9 or a display panel formed by the method of making the display panel according to any one of claims 10 to 12.

Images