Display panel and display device

Abstract

The invention provides a display panel and a display device. The display panel comprises a display area and a non-display area connected with the display area. The display panel further comprises a substrate covering the display area and the non-display area, the substrate is provided with a driving layer, and the driving layer comprises a first metal layer which is arranged on one side of the substrate and extends from the display area to the non-display area, and a second metal layer which is arranged on the other side of the substrate and extends from the non-display area to the display area. The second metal layer is arranged on the side, away from the substrate, of the first metal layer and extends to the non-display area from the display area; in the non-display area, at least part of the edge of the orthographic projection of the second metal layer on the substrate is located in the orthographic projection range of the first metal layer on the substrate, so that the problem of display picture abnormity caused by short circuit between the supporting layer and the metal lamination layer is solved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are organic thin-film electroluminescent devices. They have attracted great attention and are widely used in electronic display products due to their advantages such as low power consumption, high brightness, wide viewing angle, high contrast, and the ability to realize flexible displays.

[0003] However, current display panels often experience display abnormalities during use. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel and display device to solve the problem of display abnormalities occurring when the current display panel is in use.

[0005] To achieve the above objectives, the present invention provides a display panel, the display panel including a display area and a non-display area connected to the display area;

[0006] The display panel also includes:

[0007] A substrate covering the display area and the non-display area, the substrate being provided with a driving layer.

[0008] The driving layer includes:

[0009] A first metal layer is disposed on one side of the substrate and extends from the display area to the non-display area;

[0010] A second metal layer is disposed on the side of the first metal layer opposite to the substrate and extends from the display area to the non-display area;

[0011] In the non-display area, at least a portion of the edge of the orthographic projection of the second metal layer onto the substrate lies within the orthographic projection range of the first metal layer onto the substrate.

[0012] Furthermore,

[0013] In the non-display area,

[0014] The first metal layer and the second metal layer extend in the same direction;

[0015] Preferably, the orthographic projection of the second metal layer on the substrate along the width direction is located within the orthographic projection range of the first metal layer on the substrate along the width direction;

[0016] Preferably, the orthographic projection of the second metal layer on the substrate along its length is located within the orthographic projection range of the first metal layer on the substrate along its length.

[0017] Preferably, the horizontal distance between the edge of the first metal layer and the edge of the second metal layer in a direction parallel to the surface of the substrate is greater than 0, and the surface of the substrate includes the length direction or width direction of the first metal layer and the second metal layer.

[0018] Further, in the non-display area, the second metal layer includes:

[0019] The bottom surface is in contact with the first metal layer;

[0020] The side surface intersects with the bottom surface;

[0021] The angle between the bottom surface and the side surface is less than or equal to 45°.

[0022] Furthermore, the display panel also includes a protective layer located in the non-display area. The protective layer is located on the side of the second metal layer away from the substrate, and the projection of the protective layer on the substrate covers the projection of the second metal layer on the substrate.

[0023] Preferably, the protective layer is located on the surface of the second metal layer away from the substrate;

[0024] Preferably, the protective layer includes an insulating layer;

[0025] Preferably, the display panel further includes a pixel defining layer located in the display area, and the insulating layer is disposed in the same layer as the pixel defining layer and integrally formed;

[0026] Preferably, the protective layer further includes a metal layer located on the surface of the insulating layer away from the substrate;

[0027] Preferably, the display panel further includes an isolation structure and an isolation opening located in the display area, the light-emitting layer of the display panel is located in the isolation opening, and the metal layer is disposed in the same layer as at least a portion of the film layer of the isolation structure and integrally formed.

[0028] Furthermore, the display panel also includes

[0029] An isolation structure is provided on the side of the pixel limiting layer of the display area facing away from the substrate;

[0030] An isolation opening extends through the isolation structure and is located within the display area;

[0031] A light-emitting layer is disposed in the isolation opening;

[0032] The first electrode is disposed on the side of the light-emitting layer close to the substrate;

[0033] The second electrode is disposed in an isolation opening on the side of the light-emitting layer opposite to the substrate.

[0034] Furthermore, the isolation structure includes:

[0035] A support layer is disposed on the side of the pixel defining layer opposite to the substrate;

[0036] A barrier layer is disposed on the side of the support layer opposite to the substrate;

[0037] Preferably, the support layer extends from the display area to the non-display area, and in the non-display area, the orthographic projection of the support layer on the substrate covers the orthographic projections of the first metal layer and the second metal layer on the substrate, and the support layer is reused as the protective layer;

[0038] Preferably, the material of the support layer includes a conductive material, and the material of the barrier layer includes a metallic material;

[0039] Preferably, the second electrode is electrically connected to the support layer.

[0040] Furthermore,

[0041] An encapsulation layer is disposed on the side of the isolation structure and the second electrode of the display area away from the substrate;

[0042] Preferably, the material of the encapsulation layer includes at least one of inorganic and organic materials.

[0043] Furthermore, the display panel also includes a planarization layer located in the non-display area and overlapping the end of the first metal layer away from the display area;

[0044] Preferably, the planarization layer has an opening that exposes at least a portion of the first metal layer or the second metal layer.

[0045] Preferably, the orthographic projection of the planarization layer on the substrate does not overlap with the orthographic projection of the second metal layer on the substrate.

[0046] Preferably, the planarization layer and its orthographic projection on the substrate at least partially overlap with the orthographic projection of the first metal layer on the substrate.

[0047] Furthermore, the second metal layer is exposed from the opening to form a bonding pad.

[0048] The present invention also provides a display device, the display device comprising a display panel and a flexible circuit board as described above, wherein the flexible circuit board and the display panel are electrically connected as described above;

[0049] Preferably, the flexible circuit board and the display panel are electrically connected through pads formed by the first metal layer and the second metal layer.

[0050] The advantages of this invention are: the display panel and display device proposed in this invention, by optimizing the layout of the non-display area, reduce the thickness at the edge of the metal stack (the first metal layer and the second metal layer are stacked), improve the continuity of the insulating layer / pixel limiting layer at the edge of the metal stack, avoid the film discontinuity and film breakage (partial metal stack exposure) caused by the step difference at the edge of the metal stack, and avoid the problem of short circuit between the metal layer / support layer and the exposed metal stack, which would cause abnormal display. Attached Figure Description

[0051] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0052] Figure 1 This is a schematic diagram of the partitioning of the display panel in an embodiment of the present invention;

[0053] Figure 2 This is a schematic diagram of the layered structure of the display panel in the display area in an embodiment of the present invention;

[0054] Figure 3 This is a schematic diagram of the layered structure of the display panel in the bonding area in an embodiment of the present invention;

[0055] Figure 4 This is a schematic diagram of the layered structure of the display panel in the bonding area in another embodiment of the present invention.

[0056] The components in the diagram are shown below:

[0057] Display panel 1; Display area AA;

[0058] Non-display area NA; Border area NA1;

[0059] Bonding area NA2; Substrate 10;

[0060] First metal layer 20; Second metal layer 30;

[0061] Bottom surface 31; Side surface 32;

[0062] Pixel confinement layer 40; Pixel aperture 41;

[0063] Isolation structure 50; Support layer 51;

[0064] Barrier layer 52; Isolation opening 53;

[0065] First electrode 60; Light-emitting layer 70;

[0066] Second electrode 80; Encapsulation layer 90;

[0067] Flattening layer 100. Detailed Implementation

[0068] The following description, with reference to the accompanying drawings, illustrates preferred embodiments of the present invention, demonstrating its implementability. These embodiments provide a complete overview of the invention for those skilled in the art, making its technical content clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein.

[0069] In the accompanying drawings, components with the same structure are indicated by the same numerical designation, and components with similar structures or functions are indicated by similar numerical designations. The dimensions and thicknesses of each component shown in the drawings are arbitrary, and the present invention does not limit the dimensions and thicknesses of each component. To make the illustrations clearer, the thickness of components is appropriately exaggerated in some places in the drawings.

[0070] Furthermore, the following descriptions of the embodiments of the invention are made with reference to the accompanying illustrations, illustrating specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," and "side," are merely directional references to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of the invention, and does not indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation; therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0071] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "installed to" or "connected to" another component, both can be understood as being directly "installed" or "connected" to, or as being indirectly "installed to" or "connected to" another component via an intermediate component.

[0072] In related display technologies, to achieve high resolution and color in OLED (Organic Light-Emitting Diode) and to better address issues such as low film resolution and low device yield, an isolation structure is introduced. This involves creating an isolation structure on the driving layer before depositing the organic thin film and metal cathode, instead of using a metal mask during device fabrication. This isolation structure separates different pixels, and then the pixel array (e.g., blue, green, and red-blue pixel arrays; the order of blue / green / red-blue pixel arrays is not limited in other implementations) is fabricated through full-area evaporation and etching. This process requires multiple etching steps. Bonding areas (e.g., COP pads, FOP pads) are placed in the non-display areas of the display panel. These bonding areas require metal pads for subsequent bonding operations. During pixel fabrication, multiple etching steps are used. To prevent the metal pads from being etched / over-etched, a pixel defining layer and a conductive film layer (VSS film layer) are covered on top. After pixel fabrication, the pixel defining layer and conductive film layer covering the bonding area are etched away. The inventors discovered in actual production that the metal pad uses a metal stacking method, such as an M4 metal film layer covering an M3 metal film layer underneath it, with the M3 metal film layer stacked on a dielectric layer. There is a certain distance between the pixel defining layer and the edge of the metal stack, resulting in a large step difference. This causes discontinuity in the formation of the pixel defining layer, leading to film breakage and discontinuity at the edge of the metal stack (where the M4 metal film layer covers the M3 metal film layer underneath). There is exposed metal at the edge, which comes into contact with the metal layer / conductive film layer (VSS film layer) above it, causing a short circuit between the metal layer / conductive film layer (VSS film layer) and the metal stack, resulting in abnormal display of the display panel.

[0073] Based on the technical problems discovered in the aforementioned related display technologies.

[0074] This invention provides a display panel 1, such as... Figure 1 As shown.

[0075] The display panel 1 has a display area AA and a non-display area NA connected to the display area AA.

[0076] The display area AA is used to present the display screen. It has multiple light-emitting sub-pixels, and each light-emitting sub-pixel can be lit by control (such as by a pixel driving circuit, which can be equivalent to a 7T1C circuit, 7T2C circuit, 8T1C circuit, 8T2C circuit, etc., which are not limited here).

[0077] The non-display area NA includes a bezel area NA1 and a bonding area NA2. The bezel area NA1 surrounds the display area AA, and multiple signal traces are arranged within it to transmit driving signals to each light-emitting sub-pixel in the display area AA. The bonding area NA2 is located on the side of the bezel area NA1 furthest from the display area AA, and is used for electrical connection with the bonding component. Multiple spaced pads can be disposed in the bonding area NA2 for electrical connection with the bonding component, and the spaces between adjacent pads are filled with an insulating material (preferably a planarization layer). In this embodiment, the bonding component can be a flexible printed circuit board (FPC). This flexible circuit board can be connected to the bonding area NA2 of the display panel 1 via FOP (FPC On Panel) technology and can be bent to the back of the display area AA, thereby reducing the bezel of the display panel 1 and achieving a narrow bezel effect.

[0078] The display panel 1 includes a substrate 10, a light-emitting layer 70, an isolation structure 50, and an encapsulation layer 90. For example... Figure 2 As shown, the isolation structure 50 and the light-emitting layer 70 are both disposed on the same side of the substrate 10, and the encapsulation layer 90 is disposed on the side of the light-emitting layer 70 and the isolation structure 50 facing away from the substrate 10. For the display panel 1, see [reference needed] in the width direction. Figure 1 For the x-direction and length direction, see [reference]. Figure 1 Middle y direction.

[0079] A driving layer, comprising a first metal layer 20 and a second metal layer 30, is disposed on one side of the substrate 10. Multiple arrayed thin-film transistors (not shown) are disposed in the corresponding display area of ​​the substrate 10, forming a pixel driving circuit for controlling the emission of corresponding sub-pixels. The first metal layer 20 is disposed on one side of the substrate 10 and extends from the display area AA to the bonding area NA2. The second metal layer 30 is disposed on the side of the first metal layer 20 facing away from the substrate 10 and also extends from the display area AA to the bonding area NA2. Both the first metal layer 20 and the second metal layer 30 may include multiple signal traces, such as data signal lines, reset signal lines, and power signal lines. One end of these signal traces is located in the display area AA and electrically connected to the thin-film transistors located in the display area AA; the other end of the signal traces extends from the display area AA to the border area NA1 and extends along the border area NA1 to the bonding area NA2, where it is electrically connected to the bonding components located in the bonding area NA2. The signal traces in the first metal layer 20 and the second metal layer 30 are used to transmit the signals output by the bonding component to the corresponding thin film transistors. The thin film transistors conduct the corresponding pixel driving circuits according to the received signals, thereby lighting up the corresponding light-emitting devices / sub-pixels in the light-emitting layer 70, realizing the display and switching of the image.

[0080] The substrate 10 also includes a first electrode 60 in the area corresponding to the display area AA. The first electrode 60 is disposed on the side of the light-emitting layer near the substrate, that is, the first electrode 60 is disposed on the side of the second metal layer 30 away from the first metal layer 20. In one embodiment, a first planarization layer is disposed on the second metal layer 30, and the first electrode 60 is disposed on the side of the first planarization layer away from the second metal layer 30.

[0081] The substrate 10 also includes a pixel defining layer 40 in the area corresponding to the display area AA, which is disposed on the side of the first electrode 60 facing away from the second metal layer 30. This pixel defining layer is located between the isolation structure and the layer containing the first electrode to cover the gap between adjacent first electrodes. The pixel defining layer 40 extends from the display area AA to the bonding area NA2 and has multiple pixel openings 41. The pixel openings 41 are located in the display area AA and penetrate the pixel defining layer 40, thus exposing part of the top surface of the first electrode 60 in the pixel openings 41. Each light-emitting sub-pixel has a corresponding pixel opening 41. The pixel defining layer 40 and the pixel openings 41 are used to define the size and position of each light-emitting sub-pixel in the display panel 1, and to control the size of each light-emitting sub-pixel.

[0082] The substrate 10 also includes an isolation structure 50 in the region corresponding to the display area AA. This isolation structure 50 is disposed on the side of the pixel defining layer 40 facing away from the substrate 10. It includes a support layer 51 and a barrier layer 52. The support layer 51 is disposed on the surface of the pixel defining layer 40 facing away from the substrate 10, and the barrier layer 52 is disposed on the surface of the support layer 51 facing away from the substrate 10. The support layer 51 is made of conductive materials, such as highly conductive metals like copper, aluminum, and silver. The barrier layer 52 is made of insulating materials such as silicon oxide and oxynitride, or metallic materials such as titanium.

[0083] A light-emitting layer 70 is disposed in the pixel opening 41 and covers the exposed surface of the first electrode 60 in the pixel opening 41. A second electrode 80 is disposed on the side of the light-emitting layer 70 facing away from the substrate 10 and extends from the surface of the light-emitting layer 70 facing away from the substrate 10 to the sidewall of the support layer 51, thereby electrically connecting with the support layer 51. After the first electrode 60 and the second electrode 80 are turned on, electrons and holes are respectively transferred into the light-emitting layer 70. Electrons and holes combine in the light-emitting layer 70 to form excitons, thereby converting electrical energy into light energy and causing the light-emitting layer 70 to emit light. Preferably, the first electrode is also called the anode, and the second electrode is also called the cathode.

[0084] Specifically, the isolation structure 50 has multiple isolation openings 53 located in the display area AA, with one isolation opening 53 corresponding to each sub-pixel. The isolation opening 53 penetrates both the barrier layer 52 and the support layer 51 and communicates with the pixel opening 41. The diameter of the pixel opening 41 is smaller than the diameter of the isolation opening 53, thus preventing the isolation structure 50 from blocking the exposed first electrode 60 in the pixel opening 41 and ensuring that the light-emitting material in the light-emitting layer 70 can be deposited and cover the exposed surface of the first electrode 60 in the pixel opening 41. Furthermore, the width of the support layer 51 located between two adjacent sub-pixels is smaller than the width of the barrier layer, thus ensuring that the barrier layer can interrupt the light-emitting layer 70 and the second electrode 80 in two adjacent light-emitting sub-pixels, while also ensuring that the light-emitting layer 70 is not electrically connected to the conductive support layer 51. When fabricating the light-emitting layer 70 and the second electrode 80, the deposition angle of the deposition head can be adjusted to ensure that the deposition area of ​​the second electrode 80 is larger than that of the light-emitting layer 70, thereby ensuring that the second electrode 80 can connect with the support layer 51 while covering the light-emitting layer 70. When fabricating the isolation structure 50, a metal layer (also called a VSS film layer, which may include different metal materials such as molybdenum, aluminum, and titanium) is deposited / deposited across the entire surface of a substrate (such as the insulating layer / pixel defining layer of the substrate). Then, the metal layer in the display area is patterned to fabricate the isolation structure, which defines / encloses the isolation opening. Preferably, the metal layer of the isolation structure in the display area is on the same layer and integrally formed.

[0085] An encapsulation layer 90 is disposed on the side of the second electrode 80 facing away from the substrate 10, and extends from the surface of the second electrode 80 facing away from the substrate 10 to the surface of the barrier layer 52 facing away from the substrate 10. It is used to prevent water and oxygen intrusion and protect the light-emitting layer 70. The encapsulation layer 90 can be made of the same material as the barrier layer 52 to improve the encapsulation effect. Preferably, the encapsulation layer 90 can be made of inorganic materials, such as silicon oxide or silicon nitride.

[0086] like Figure 3As shown, the substrate also includes a planarization layer 100 disposed in a non-display area, such as the bonding area NA2. The planarization layer 100 extends from the side of the bonding area NA2 away from the display area AA towards the side of the bonding area NA2 closer to the display area AA, and covers the edge of the first metal layer 20. A gap exists between the second metal layer 30 and the planarization layer 100 (i.e., the second metal layer 30 does not contact the planarization layer 100). Specifically, the orthographic projection of the planarization layer 100 on the substrate 10 at least partially overlaps with the orthographic projection of the first metal layer 20 on the substrate 10, but does not overlap with the orthographic projection of the second metal layer 30 on the substrate 10. Preferably, the thickness of the planarization layer 100 is greater than the sum of the thicknesses of the first metal layer 20 and the second metal layer 30. The planarization layer has an opening that exposes at least a portion of the first or second metal layer. The planarization layer 100 is used to planarize the bonding area NA2 for subsequent processing.

[0087] In the bonding region NA2, a first metal layer 20 and a second metal layer 30 are sequentially stacked on the substrate 10. A pixel defining layer 40 covers the first metal layer 20 and the second metal layer 30 and extends from the surface of the second metal layer 30 away from the substrate 10 to the surface of the planarization layer 100 away from the substrate 10. Preferably, the metal stack (i.e., the second metal layer 30 is stacked on top of the first metal layer 20) and the planarization layer are spaced apart, and the pixel defining layer has a discontinuity at the interval. The pixel defining layer continuously covers the sidewalls of the metal stack and the planarization layer, without exposing the first metal layer 20 and the second metal layer 30. That is, the pixel defining layer directly covers the upper surface and at least one sidewall of the second metal layer 30, and the upper surface of the first metal layer 20 extends to the upper surface and part of the sidewall of the planarization layer.

[0088] The support layer 51 in the bonding region NA2 covers the surface of the pixel defining layer 40 facing away from the substrate 10, causing the orthographic projection of the support layer 51 on the substrate 10 to overlap the orthographic projections of the first metal layer 20 and the second metal layer 30 on the substrate 10, and the orthographic projection of the support layer 51 on the substrate 10 also at least partially overlaps with the orthographic projection of the planarization layer 100 on the substrate 10. The first metal layer and the second metal layer extend in the same direction. The orthographic projection of the second metal layer along the width direction on the driving layer is located at the first metal layer along the width direction (see...). Figure 3 The orthogonal projection of the second metal layer along its length onto the driving layer falls within the orthogonal projection range of the first metal layer along its length onto the driving layer.

[0089] The support layer 51 (also called the VSS film layer) protects the underlying film layer during the etching process (the support layer and the pixel defining layer below it serve as protective layers for the metal stack). After pixel fabrication is completed, the support layer 51 in the bonding area NA2 is etched away, and at least part of the pixel defining layer below it is etched away. Preferably, after pixel fabrication is completed, the support layer 51 in the area of ​​the bonding area NA2 where metal needs to be exposed, together with the pixel defining layer below it, is etched to expose the metal 30. At this time, the exposed portion is equivalent to a pad, which is used for subsequent bonding operations. Bonding is sometimes also called bonding. The support layer 51 (also called the VSS film layer) above the planarization layer 100 between two adjacent pads is etched away, and the pixel defining layer is retained. In this embodiment, the pixel defining layer is also called an insulating layer when it is in the non-display area, and when it is in the display area, it is located between the isolation structure and the layer where the first electrode is located, to insulate the isolation structure from the first electrode.

[0090] Specifically, the orthographic projection of the second metal layer 30 on the substrate 10 is within the orthographic projection range of the first metal layer 20 on the substrate 10, and the horizontal distance d1 between the edge of the first metal layer 20 and the edge of the second metal layer 30 in the direction parallel to the surface of the substrate 10 is greater than 0. This causes the edge of the second metal layer 30 to be misaligned with the edge of the first metal layer 20, and the edge of the second metal layer 30 to be recessed within the edge of the first metal layer 20, forming a stepped structure. This reduces the thickness at the edge of the metal stack, reduces the film formation step of the pixel limiting layer 40 at the edge of the metal stack, thereby reducing the risk of film breakage or film discontinuity of the pixel limiting layer 40 at the edge of the metal stack, preventing short circuits between the support layer 51 and the first metal layer 20 and the second metal layer 30, and thus solving the problem of abnormal display caused by short circuits between the support layer 51 and the metal stack.

[0091] Furthermore, such as Figure 4 As shown, in the bonding area, the second metal layer 30 has a bottom surface 32 and a side surface 31. The bottom surface 32 is the surface where the second metal layer 30 contacts the first metal layer 20, and the side surface 31 intersects with the bottom surface 32. In another embodiment of the present invention, the included angle α between the bottom surface 31 and the side surface 32 of the second metal layer 30 is less than or equal to 45°, reducing the slope at the edge of the second metal layer 30 and reducing the difficulty for the pixel limiting layer 40 to climb the slope at the edge of the metal stack, thereby maximizing the film continuity of the pixel limiting layer 40 at the edge of the metal stack (avoiding film breakage) and achieving optimal results.

[0092] In embodiments of the present invention and other embodiments thereof, the metal stack structure described above can be formed by adjusting film deposition process parameters such as the evaporation area, evaporation flow rate, etching area, and etching time of the first metal layer 20 and the second metal layer 30 during preparation. The connection between the first metal layer 20 and the second metal layer 30 located in the display area and the thin-film transistor is not limited to enable signal transmission through them; the thin-film transistor can drive the corresponding sub-pixel according to the received signal.

[0093] This invention also provides a display device, which can be an OLED display device, comprising a display panel 1 as described above and a flexible circuit board (not shown), wherein the flexible circuit board and the display panel are electrically connected. Preferably, the flexible circuit board and the display panel are electrically connected through pads formed by a first metal layer and a second metal layer. This display device can be any display device with display functionality, such as a mobile phone, laptop computer, tablet computer, etc.

[0094] In the display panels provided in the embodiments of the present invention and other embodiments, by reducing the thickness and slope at the edge of the metal stack, the film formation step difference of the pixel limiting layer at the edge of the metal stack is reduced, thereby reducing the difficulty of the pixel limiting layer climbing the slope at the edge of the metal stack, improving the film formation continuity of the pixel limiting layer at the edge of the metal stack, preventing short circuits between the support layer and the first metal layer and the second metal layer, and solving the problem of abnormal display images caused by short circuits between the support layer and the metal stack.

[0095] While the invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood that different dependent claims and features described herein can be combined in ways different from those described in the original claims. It is also understood that features described in conjunction with individual embodiments can be used in other described embodiments.

Claims

1. A display panel, characterized by, The display panel comprises: a display area and a non-display area connected with the display area; the display panel further comprises: a substrate covering the display area and the non-display area, one side of the substrate being provided with a driving layer, the driving layer comprising: a first metal layer provided on one side of the substrate and extending from the display area to the non-display area; a second metal layer provided on the side of the first metal layer away from the substrate and extending from the display area to the non-display area; in the non-display area, at least part of the edges of the orthographic projection of the second metal layer on the substrate is within the orthographic projection range of the first metal layer on the substrate.

2. The display panel of claim 1, wherein, in the non-display area, the extension directions of the first metal layer and the second metal layer are consistent; preferably, the width of the second metal layer in the extension direction is within the orthographic projection range of the width of the first metal layer in the extension direction on the substrate; preferably, the length of the second metal layer in the extension direction is within the orthographic projection range of the length of the first metal layer in the extension direction on the substrate; preferably, the horizontal distance between the edges of the first metal layer and the second metal layer in the direction parallel to the surface of the substrate on which the first metal layer and the second metal layer extend is greater than 0, the surface of the substrate including the length direction or the width direction in which the first metal layer and the second metal layer extend.

3. The display panel of claim 1, wherein, in the non-display area, the second metal layer comprises: a bottom surface in contact with the first metal layer; a side surface intersecting the bottom surface; the included angle between the bottom surface and the side surface is less than or equal to 45°.

4. The display panel of claim 1, wherein the display panel further comprises a protective layer located in the non-display area, the protective layer being located on the side of the second metal layer away from the substrate, and the projection of the protective layer on the substrate covering the projection of the second metal layer on the substrate; preferably, the protective layer is located on the surface of the second metal layer away from the substrate; preferably, the protective layer comprises an insulating layer; preferably, the display panel further comprises a pixel definition layer located in the display area, and the insulating layer is provided in the same layer as the pixel definition layer and is integrally formed; preferably, the protective layer further comprises a metal layer located on the surface of the insulating layer away from the substrate; preferably, the display panel further comprises an isolation structure and an isolation opening located in the display area, the light-emitting layer of the display panel being located in the isolation opening, and the metal layer being provided in the same layer as at least part of the film layers of the isolation structure and being integrally formed.

5. The display panel of claim 1, wherein, further comprising: an isolation structure provided on the side of the pixel definition layer away from the substrate in the display area; an isolation opening penetrating through the isolation structure and located in the display area; a light-emitting layer provided in the isolation opening; a first electrode provided on the side of the light-emitting layer close to the substrate; a second electrode provided in the isolation opening on the side of the light-emitting layer away from the substrate.

6. The display panel of claim 5, wherein, the isolation structure comprising: a support layer provided on the side of the pixel definition layer away from the substrate; a barrier layer provided on the side of the support layer away from the substrate; Preferably, the support layer extends from the display area to the non-display area, in the non-display area, the orthographic projection of the support layer on the substrate covers the orthographic projection of the first metal layer and the second metal layer on the substrate, and the support layer is multiplexed as the protection layer. Preferably, the material of the support layer comprises conductive material, and the material of the barrier layer comprises metal material. Preferably, the second electrode is electrically connected with the support layer.

7. The display panel of claim 6, wherein, Further comprising: an encapsulation layer arranged on the side of the isolation structure and the second electrode in the display area away from the substrate; Preferably, the material of the encapsulation layer comprises at least one of inorganic material and organic material.

8. The display panel of claim 1, wherein, Further comprising: a planar layer arranged in the non-display area and overlapping with the end of the first metal layer away from the display area; Preferably, the planar layer is provided with an opening, and the opening exposes at least part of the first metal layer or the second metal layer; Preferably, the orthographic projection of the planar layer on the substrate does not overlap with the orthographic projection of the second metal layer on the substrate; Preferably, the orthographic projection of the planar layer on the substrate at least partially overlaps with the orthographic projection of the first metal layer on the substrate.

9. The display panel of claim 8, wherein, The second metal layer is exposed from the opening to form a bonding pad.

10. A display device, characterized by comprising: The display panel and a flexible circuit board are provided, the flexible circuit board is electrically connected with the display panel; Preferably, the flexible circuit board and the display panel are electrically connected through the bonding pad formed by the first metal layer and the second metal layer.

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